Epoxy molding compound composition, preparation method and application

Abstract

The present invention provides an epoxy molding compound composition, a preparation method and an application thereof. The epoxy molding compound composition comprises the following components and their mass percentages: epoxy resin: 4-9wt%; curing agent: 4-9wt%; PN phenolic resin: 1-3wt%; curing accelerator: 0.02-0.5wt%; filler: 70-90wt%; coupling agent: 0.2-0.6wt%; and auxiliary additives: 1-2wt%. By adding PN phenolic resin to the epoxy resin system in the epoxy molding compound composition, reducing the mass percentage of the coupling agent, and removing the molding agent, the thermal deformation value of the molding compound composition can be effectively reduced, and the stability of the product after encapsulation can be improved.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic packaging materials, and in particular relates to an epoxy molding compound composition, a preparation method and an application thereof. Background Art

[0002] Epoxy resin is a thermosetting resin, which is widely used in the field of semiconductor packaging due to its good reliability and excellent workability. Among them, multifunctional epoxy resin and bisphenyl epoxy resin are used as the main resin components, supplemented by phenolic resin as a curing agent, silica microspheres as a filler, and other additives such as appropriate flame retardants, coupling agents, release agents, plasticizers, etc., which constitute the current mainstream plastic encapsulation material composition and are widely used in the packaging of various electronic products.

[0003] As the integration of chips increases, the requirements for the computing power of IC chips are also increasing. Although the technology of photolithography process is improving and the size of single IC chips is also increasing, this also requires the simultaneous improvement of packaging technology. For example, for QFN (Quad Flat No-leads Package) products, if the size of such products does not exceed 9x9 mm, the mainstream plastic encapsulation composition can meet its requirements for high reliability. However, the size of such products exceeds 9x9 mm, and the field habitually defines QFN packages with a size exceeding 9x9 mm as super-large QFN. For the packaging of super-large QFN, not only the reliability of the plastic encapsulation material must be considered, but also the temperature changes of the product during operation. Temperature changes will cause thermal deformation of super-large QFN products, and reliability issues such as delamination, warping, and solder joint failure caused by thermal deformation need to be avoided.

[0004] Research has confirmed that after the existing mainstream plastic encapsulation composition is used to encapsulate super-large QFN products, the maximum thermal deformation of the plastic encapsulation material exceeds 200μm during the temperature cycle from room temperature to 260°C, which can no longer meet the stable operation requirements of the product. Therefore, it is necessary to develop a plastic encapsulation material composition that is used for super-large QFN packaging and has low thermal deformation. Summary of the invention

[0005] The purpose of the present invention is to provide an epoxy molding compound composition, a preparation method and an application. The epoxy molding compound composition has small thermal deformation, especially when applied to QFN products with a size exceeding 9x9㎜, so that the packaged products have higher reliability.

[0006] In order to solve the above problems, the technical solution of the present invention provides an epoxy molding compound composition, wherein the epoxy molding compound composition comprises the following components and their mass percentages:

[0007] Epoxy resin: 4-9wt%;

[0008] Curing agent: 4-9wt%;

[0009] PN phenolic resin: 1-3wt%;

[0010] Curing accelerator: 0.02-0.5wt%;

[0011] Filler: 70-90wt%;

[0012] Coupling agent: 0.2-0.6wt%; and

[0013] Auxiliary additives: 1-2wt%.

[0014] As an optional technical solution, the epoxy molding compound composition does not include phthalate plasticizers.

[0015] As an optional technical solution, the epoxy resin is selected from any one or more of o-cresol epoxy resin, aliphatic glycidyl ether epoxy resin, polyphenol glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, and heterocyclic epoxy resin.

[0016] As an optional technical solution, the curing agent is selected from any one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthol phenolic resin, biphenyl phenolic resin, aralkylphenol epoxy resin and its derivatives.

[0017] As an optional technical solution, the curing accelerator is selected from imidazole compounds and salt compounds thereof.

[0018] As an optional technical solution, the filler is selected from any one or more of alumina micropowder, spherical silica micropowder, and angular silica micropowder.

[0019] As an optional technical solution, the coupling agent is selected from any one or more of epoxy silane coupling agents, amino silane coupling agents, and mercapto silane coupling agents.

[0020] As an optional technical solution, the auxiliary additives include a release agent, a colorant, a stress release agent, a flame retardant and an ion capture agent.

[0021] As an optional technical solution, the PN phenolic resin is 1-3wt%; the coupling agent is 0.2-0.4wt%.

[0022] The present invention also provides a method for preparing the above-mentioned epoxy molding compound composition, the preparation method comprising:

[0023] Step 1: mixing the epoxy resin, the curing agent and the PN phenolic resin to obtain a mixture 1;

[0024] Step 2: adding the curing accelerator, the filler, the coupling agent, and the auxiliary additive to the mixture 1 to obtain a mixture 2;

[0025] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make cakes to obtain the epoxy molding compound composition.

[0026] The present invention also provides the use of the epoxy molding compound composition in semiconductor component packaging.

[0027] Compared with the prior art, the present invention provides an epoxy molding compound composition, a preparation method and an application thereof, which can effectively reduce the thermal deformation value of the molding compound composition and improve the stability of the product after encapsulation by adding PN phenolic resin to the epoxy resin system in the epoxy molding compound composition, reducing the mass percentage of the coupling agent, and removing the molding agent.

[0028] The present invention is described in detail below with reference to specific embodiments, but is not intended to limit the present invention. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] One of the purposes of the present invention is to design an epoxy molding compound composition, which comprises the following components and their mass percentages: epoxy resin: 4-9wt%; curing agent: 4-9wt%; PN phenolic resin: 1-3wt%; curing accelerator: 0.02-0.5wt%; filler: 70-90wt%; coupling agent: 0.2-0.6wt%; and auxiliary additives: 1-2wt%.

[0031] The mass percentage is the ratio of the mass of each component to the total mass, with the total mass of the epoxy molding compound composition being 100.

[0032] In addition, the epoxy molding compound composition provided by the present invention does not include phthalate plasticizers. In other embodiments of the present application, the epoxy molding compound composition may also include 0.01-0.5wt% of non-phthalate plasticizers by mass percentage, and the non-phthalate plasticizers may be selected from any one or more of aliphatic dibasic acid esters, benzene polyesters, benzoates, polyol esters, chlorinated hydrocarbons, epoxies, citrates, and polyesters.

[0033] Each component will be described and explained in detail below.

[0034] The epoxy resin is selected from any one or more of o-cresol epoxy resin, aliphatic glycidyl ether epoxy resin, polyphenol glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, and heterocyclic epoxy resin.

[0035] In the above epoxy molding compound composition, preferably, a multifunctional epoxy resin or a bisphenol A epoxy resin is used.

[0036] PN phenolic resin refers to a linear phenolic resin with the following structure.

[0037]

[0038] Among them, epoxy resin and phenolic resin can be cross-linked and cured by the reaction between the hydroxyl group and the epoxy group in the phenolic structure. Due to the linear structure of PN phenolic resin, it has a low high-temperature modulus, and the cured product after cross-linking and curing with epoxy resin has a small thermal deformation at high temperature.

[0039] The curing agent is selected from any one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthyl phenolic resin, biphenyl phenolic resin, aralkyl phenol type epoxy resin and its derivatives.

[0040] The curing accelerator is selected from any one or more of imidazole compounds (imidazole compounds include: 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole) and their salt compounds (salt compounds include: triethylaminebenzyldimethylamine, α-methylbenzyldimethylamine, 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol).

[0041] The filler is selected from any one or more of alumina micropowder, spherical silica micropowder and angular silica micropowder.

[0042] The coupling agent is selected from any one or more of epoxy silane coupling agent, amino silane coupling agent and mercapto silane coupling agent. The coupling agent is used to coat fillers, especially inorganic fillers, to increase the mutual bonding between the epoxy resin system and the fillers. In addition, it has been verified by experiments that if the mass percentage of the coupling agent in the epoxy molding compound composition is too large, the deformation amplitude in the temperature cycle cooling stage will be too large.

[0043] In the above epoxy molding compound composition, preferably, a coupling agent is used in an amount of 0.2-0.6wt% by weight; more preferably, a coupling agent is used in an amount of 0.2-0.4wt% by weight, wherein the coupling agent is an epoxysilane coupling agent, γ-(2,3-epoxypropoxy)propyltrimethoxysilane (KH560).

[0044] Auxiliary additives include release agents, colorants, stress release agents, flame retardants and ion capture agents.

[0045] Wherein, the release agent is selected from any one or more of fatty acid, montanic acid, polyethylene wax, polypropylene wax, palm wax and Fischer-Tropsch wax.

[0046] The colorant is, for example, selected from carbon black.

[0047] The stress release agent is selected from any one or more of polysiloxane rubber powder, liquid silicone oil, and silicone-modified epoxy resin.

[0048] The flame retardant is selected from any one or more of metal hydroxides and phosphine-containing compounds. Preferably, the metal hydroxide is selected from aluminum hydroxide and magnesium hydroxide; the phosphine-containing compound is selected from ammonium polyphosphate organic flame retardants, esters of phosphoric acid and alcohol (for example: trimethyl phosphate, triethyl phosphate, triphenyl phosphate, trihydroxycresyl phosphate, trixyl phosphate, cresyl diphenyl phosphate), etc.

[0049] The ion capture agent is mainly one or more of bismuth trioxide trihydrate, zirconium hydrogen phosphate dihydrate and aluminum magnesium compound.

[0050] The preparation method of the above-mentioned epoxy molding compound of the present invention comprises:

[0051] Step 1: Mix epoxy resin, curing agent and PN phenolic resin to obtain mixture 1;

[0052] Step 2: Adding a curing accelerator, a filler, a coupling agent, and an auxiliary additive to the mixture 1 to obtain a mixture 2;

[0053] Step 3: Add mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make cakes to obtain a plastic sealing material composition.

[0054] Experimental verification shows that after the above-mentioned plastic encapsulation material composition is encapsulated and molded on semiconductor components, it is cured at 175°C for 4 hours. Compared with the existing plastic encapsulation material composition, the thermal deformation of the plastic encapsulation material in the temperature cycle from room temperature to 260°C is reduced by 50%-70%. It is particularly suitable for the encapsulation of ultra-large QFN products with high requirements for thermal deformation and multiple integration and a size exceeding 9x9㎜.

[0055] Example 1

[0056] Step 1: 2 wt % of bisphenol A type epoxy resin, 2 wt % of multifunctional epoxy resin, 2 wt % of biphenyl type phenolic resin and 2 wt % of phenol type phenolic resin are mixed to form a mixture 1;

[0057] Step 2: 0.6wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 90wt% spherical silica powder, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0058] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 1.

[0059] Example 2

[0060] Step 1: 3 wt % of bisphenol A type epoxy resin, 1 wt % of multifunctional epoxy resin, 3 wt % of biphenyl type phenolic resin and 1 wt % of phenol type phenolic resin are mixed to form a mixture 1;

[0061] Step 2: 0.6wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 90wt% spherical silica powder, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0062] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 2.

[0063] Example 3

[0064] Step 1: 2 wt % of bisphenol A type epoxy resin, 2 wt % of multifunctional epoxy resin, 1 wt % of biphenyl type phenolic resin and 3 wt % of phenol type phenolic resin are mixed to form a mixture 1;

[0065] Step 2: 0.6wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 90wt% spherical silica powder, 0.3wt% Mg6Al2(CO3)(OH) 164H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0066] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 3.

[0067] Example 4

[0068] Step 1: 2.5 wt% of bisphenol A epoxy resin, 2 wt% of multifunctional epoxy resin, 2 wt% of biphenyl phenolic resin and 2 wt% of phenol phenolic resin are mixed to form a mixture 1;

[0069] Step 2: 0.6wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 88.5wt% spherical silica powder, 1wt% magnesium hydroxide, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0070] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 4.

[0071] Example 5

[0072] Step 1: 3.2 wt% of bisphenol A epoxy resin, 1 wt% of multifunctional epoxy resin, 1 wt% of PN phenolic resin, 2 wt% of biphenyl phenolic resin and 1 wt% of phenolic resin are mixed to form a mixture 1;

[0073] Step 2: 0.4wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 90wt% spherical silica powder, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0074] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 5.

[0075] Example 6

[0076] Step 1: 3.4 wt % of bisphenol A type epoxy resin, 1 wt % of multifunctional epoxy resin, 3 wt % of biphenyl type phenolic resin and 1 wt % of phenol type phenolic resin are mixed to form a mixture 1;

[0077] Step 2: 0.2wt% coupling agent KH560, 0.1wt% diisobutyl phthalate (plasticizer), 90wt% spherical silica powder, 0.3wt% magnesium hydroxide, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0078] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 6.

[0079] Example 7

[0080] Step 1: 3.3 wt % of bisphenol A type epoxy resin, 1 wt % of multifunctional epoxy resin, 3 wt % of biphenyl type phenolic resin and 1 wt % of phenol type phenolic resin are mixed to form a mixture 1;

[0081] Step 2: 0.4wt% coupling agent KH560, 90wt% spherical silica powder, 0.3wt% magnesium hydroxide, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0082] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 7.

[0083] Example 8

[0084] Step 1: 3.3 wt% of bisphenol A epoxy resin, 1 wt% of multifunctional epoxy resin, 2 wt% of PN phenolic resin, 3 wt% of biphenyl phenolic resin and 1 wt% of phenolic resin are mixed to form a mixture 1;

[0085] Step 2: 0.4wt% coupling agent KH560, 90wt% spherical silica powder, 0.3wt% magnesium hydroxide, 0.3wt% Mg6Al2(CO3)(OH)16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0086] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 8.

[0087] Example 9

[0088] Step 1: 3.3 wt% of bisphenol A epoxy resin, 1 wt% of multifunctional epoxy resin, 3 wt% of PN phenolic resin, 3 wt% of biphenyl phenolic resin and 1 wt% of phenolic resin are mixed to form a mixture 1;

[0089] Step 2: 0.2wt% coupling agent KH560, 90wt% spherical silica powder, 0.3wt% magnesium hydroxide, 0.3wt% Mg6Al2(CO3)(OH) 16 4H2O, 0.5wt% carnauba wax, 0.2wt% silicone-modified epoxy resin, 0.2wt% 2-ethyl-4-methylimidazole, and 0.1wt% carbon black are added to mixture 1 to obtain mixture 2;

[0090] Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make a cake to obtain an epoxy molding compound composition 9.

[0091] The components and their mass percentages in Examples 1-9 are shown in Table 1.

[0092]

[0093]

[0094] The evaluation method of the epoxy molding compound compositions 1-9 prepared in Examples 1-9 is as follows, and the evaluation results are shown in Table 2.

[0095] Gelation time: hot plate method, heat a 5×5 cm electric hot plate to 175±1°C, take 0.3-0.5 g of sample powder (plastic composition 1-9) and place it on the hot plate in turn, press the powder back and forth with a 21 mm wide scraper, and the powder is converted from liquid to gel. The stopwatch records the time required.

[0096] Spiral flow length: 20±5g of sample powder (epoxy molding compound composition 1-9) is placed in the EMMI-1-66 spiral flow metal mold for measurement. The injection pressure is 70±2Kgf / cm 2, the injection speed is 22±3mm / s, and the mold temperature is 175±2℃.

[0097] Glass transition temperature and thermal expansion coefficient: The prepared sample powders (epoxy molding compound compositions 1-9) are placed in a thermal expansion coefficient analyzer in sequence, and the relationship between the thermal expansion value of the sample and the temperature is measured as the thermal expansion coefficient. The intersection of the two thermal expansion coefficients is the glass transition temperature.

[0098] Flexural modulus: The flexural strength test was conducted using the three-point loading method. A rectangular sample of powder (epoxy molding compound composition 1-9) was placed on two supports, and then a concentrated load was applied at the midpoint of the two supports to generate bending stress and deformation in the sample, and the relationship between bending stress and deformation was converted.

[0099] Maximum thermal deformation: A sample of 17×17 mm (formed from epoxy molding compound compositions 1-9) was placed in a temperature-controlled box, and the internal temperature was set to cycle from room temperature to 260° C., and the thermal deformation at the corresponding temperature points was measured.

[0100] Table 2 Evaluation results of epoxy molding compound compositions 1-9.

[0101]

[0102] The epoxy molding compound compositions 1-3 formed in Examples 1-3 and their test performance show that changing the content and type of each component in the mixture 1 composed of bisphenol A epoxy resin, multifunctional epoxy resin, biphenyl phenolic resin and phenolic phenolic resin has no significant effect on the thermal deformation properties of the molding compound compositions.

[0103] The epoxy molding compound compositions 1 and 4 formed in Examples 1 and 4 and their tested properties show that reducing the amount of silicon dioxide added alone has no significant effect on the thermal deformation properties of the molding compound compositions.

[0104] The epoxy molding compound compositions 2, 5 and 6 formed by Examples 2, 5 and 6 and their test performances show that when the mass percentage of the coupling agent is reduced and the addition amount is reduced, and when the content of the coupling agent is reduced to 0.4 in the resin system with the addition of PN phenolic resin, the maximum value of the thermal deformation can be maintained within 100um.

[0105] The epoxy molding compound compositions 6 and 7 formed in Examples 6 and 7 and their test performance show that the plasticizer is removed, the mass percentage of the coupling agent is reduced, the addition amount is reduced, and the thermal deformation performance of the molding compound composition can be lower. Among them, removing the phthalate plasticizer can avoid the thermal deformation caused by the dissolution of the phthalate plasticizer in the high temperature section of the temperature cycle from room temperature to 260°C; at the same time, reducing the mass percentage of the coupling agent within the range of 0.2-0.6wt%, can take into account the bonding of the filler and the epoxy resin system, and make the epoxy molding compound composition have lower thermal deformation performance in the cooling section of the temperature cycle from room temperature to 260°C.

[0106] The epoxy molding compound compositions 5, 7, 8 and 9 formed by Examples 5, 7, 8 and 9 and their test performances show that removing the molding agent from the molding compound composition and adding an appropriate PN phenolic resin can reduce the thermal deformation performance of the epoxy molding compound composition and slow down the curvature change. Since the PN phenolic resin has a low modulus at high temperature, when it is added to the existing epoxy resin system, the curvature change of the thermal deformation of the epoxy molding compound composition slows down in the high temperature section during the temperature cycle from room temperature to 260°C.

[0107] From the above-mentioned Examples 1-9 and their performance tests, it can be seen that reducing the coupling agent content is beneficial to reducing the maximum thermal deformation in the temperature cycle cooling stage; removing the plasticizer and adding the PN phenolic resin at the same time is also beneficial to reducing the maximum thermal deformation value of the epoxy molding compound composition at high temperature. However, adding the PN phenolic resin to the epoxy resin system, removing the plasticizer, and reducing the coupling agent content can obtain the best beneficial effect, effectively reduce the thermal deformation value of the epoxy molding compound composition, and ensure the stability of the epoxy molding compound composition after encapsulation.

[0108] The present invention also provides a use of the epoxy molding compound composition in semiconductor packaging.

[0109] In summary, the present invention provides an epoxy molding compound composition, a preparation method and an application thereof, which can effectively reduce the thermal deformation value of the molding compound composition and improve the stability of the product after encapsulation by adding PN phenolic resin to the epoxy resin system in the epoxy molding compound composition, removing the molding agent, and reducing the mass percentage of the coupling agent in the epoxy molding compound composition.

[0110] The present invention has been described by the above-mentioned relevant embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other. It must be pointed out that the present invention can also have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should all belong to the protection scope of the claims attached to the present invention.

Claims

1. An epoxy molding compound composition, characterized in that: The epoxy molding compound composition comprises the following components and their mass percentages: Epoxy resin: 4-9wt%; Curing agent: 4-9wt%; PN phenolic resin: 1-3wt%; Curing accelerator: 0.02-0.5wt%; Filler: 70-90wt%; Coupling agent: 0.2-0.4wt%; and Auxiliary additives: 1-2wt%; Among them, the structural formula of PN phenolic resin is: The epoxy molding compound composition does not include a phthalate plasticizer; The sum of the mass percentages of each component is 100%.

2. The epoxy molding compound composition according to claim 1, characterized in that: The epoxy resin is selected from any one or more of o-cresol epoxy resin, aliphatic glycidyl ether epoxy resin, polyphenol glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin, biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, and heterocyclic epoxy resin.

3. The epoxy molding compound composition according to claim 1, characterized in that: The curing agent is selected from any one or more of phenol linear phenolic resin and its derivatives, cresol linear phenolic resin and its derivatives, monohydroxy or dihydroxy naphthyl phenolic resin, biphenyl phenolic resin, aralkyl phenol epoxy resin and its derivatives.

4. The epoxy molding compound composition according to claim 1, characterized in that: The curing accelerator is selected from imidazole compounds and salt compounds thereof.

5. The epoxy molding compound composition according to claim 1, characterized in that: The filler is selected from any one or more of alumina micropowder, spherical silica micropowder, and angular silica micropowder.

6. The epoxy molding compound composition according to claim 1, characterized in that: The coupling agent is selected from any one or more of epoxy silane coupling agents, amino silane coupling agents, and mercapto silane coupling agents.

7. The epoxy molding compound composition according to claim 1, characterized in that: The auxiliary additives include a release agent, a colorant, a stress release agent, a flame retardant and an ion capture agent.

8. The method for preparing the epoxy molding compound composition according to any one of claims 1 to 7, characterized in that: The preparation method comprises: Step 1: mixing the epoxy resin, the curing agent and the PN phenolic resin to obtain a mixture 1; Step 2: adding the curing accelerator, the filler, the coupling agent, and the auxiliary additive to the mixture 1 to obtain a mixture 2; Step 3: Add the mixture 2 into a twin-screw extruder injection molding machine with a preset temperature of 150° C. After extrusion, cool with a fan, crush and make cakes to obtain the epoxy molding compound composition.

9. Use of the epoxy molding compound composition according to any one of claims 1 to 7 in semiconductor component packaging.

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