Substrate, substrate transfer, display panel, manufacturing method thereof, and display device

Abstract

The present invention discloses a substrate, a transfer substrate, a display panel, a manufacturing method thereof and a display device, relating to the field of display technologies. The substrate includes: a substrate body, and at least one groove is provided on one side of the substrate body; the groove includes a first groove and a second groove that are in communication with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane where the substrate is located; in the direction perpendicular to the plane where the substrate is located, the groove does not penetrate the substrate body, and the depth of the first groove in the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove in the direction perpendicular to the plane where the substrate is located. The present invention is beneficial to placing micro-devices.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and more particularly, to a substrate, a transfer substrate, a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] A light emitting diode (LED) is a photoelectric semiconductor component that can convert current into a specific wavelength range. Its light emitting principle is the energy difference of electrons moving between an n-type semiconductor and a p-type semiconductor, and the energy is released in the form of light. Therefore, the light emitting diode is called a cold light source, which has the advantages of low power consumption, small size, high brightness, easy matching with integrated circuits, high reliability, etc., and is widely used as a light source. Moreover, with the maturity of LED technology, the technology of directly using LEDs as self-emitting display point pixels in Mini LED (sub-millimeter level LED) displays or Micro LED (i.e., micro LED) displays has also been gradually widely used.

[0003] Among them, in the manufacturing process of a Micro LED display screen, it is necessary to transfer Micro LED devices from the initial growth substrate to a circuit substrate. Currently, the transportation and transfer problems of Micro-LED devices are the most painful points restricting industrialization.

[0004] In the prior art, during the transportation and transfer of Micro-LED devices, in order to fix the Micro-LED devices, it is necessary to bond the Micro-LED devices and the inorganic layer on the substrate. Correspondingly, it is necessary to break the connection between the Micro-LED devices and the inorganic layer multiple times, which will damage the Micro-LED devices and affect the performance of the Micro-LED devices. Summary of the Invention

[0005] In view of this, the present invention provides a substrate, a transfer substrate, a display panel, a manufacturing method thereof, and a display device, which are beneficial to placing micro devices.

[0006] The present invention provides a substrate, including: a substrate main body, and at least one groove is provided on one side of the substrate main body; the groove includes a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane where the substrate is located; along the direction perpendicular to the plane where the substrate is located, the groove does not penetrate the substrate main body, and the depth of the first groove along the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove along the direction perpendicular to the plane where the substrate is located.

[0007] Based on the same concept, the present invention also provides a transfer substrate, comprising: a substrate and an auxiliary fixing part which are attached to each other, wherein the substrate is the above-mentioned substrate provided by the present invention. In a direction perpendicular to the plane where the substrate is located, the auxiliary fixing part is located on one side of the groove formed in the substrate; the auxiliary fixing part includes a plurality of hollow parts, and in a direction perpendicular to the plane where the substrate is located, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; the auxiliary fixing part further includes a plurality of shielding parts, and in a direction perpendicular to the plane where the substrate is located, the shielding parts and the second groove at least partially overlap.

[0008] Based on the same concept, the present invention also provides a display panel, comprising the above-mentioned substrate provided by the present invention; the substrate includes a substrate, a circuit layer and a defining layer, the circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; in a direction perpendicular to the plane where the substrate is located, the second groove penetrates through the defining layer to expose a part of the circuit layer, and the first groove does not penetrate through the defining layer; the display panel further includes a plurality of micro-devices, the micro-devices are located in the second groove, and the micro-devices are electrically connected to the circuit layer.

[0009] Based on the same concept, the present invention also provides a method for manufacturing a display panel, comprising: providing a substrate, wherein the substrate is the above-mentioned substrate provided by the present invention, and the substrate further includes a substrate, a circuit layer and a defining layer, the circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; in a direction perpendicular to the plane where the substrate is located, the second groove penetrates through the defining layer to expose a part of the circuit layer, and the first groove does not penetrate through the defining layer; attaching an auxiliary fixing part to one side of the substrate close to the groove, the auxiliary fixing part includes a plurality of hollow parts, and in a direction perpendicular to the plane where the substrate is located, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; the auxiliary fixing part further includes a plurality of shielding parts, and in a direction perpendicular to the plane where the substrate is located, the shielding parts and the second groove at least partially overlap; placing the micro-devices into the second groove through a picking device, and the micro-devices are electrically connected to the circuit layer; removing the auxiliary fixing part.

[0010] Based on the same concept, the present invention also provides a display device, and the display device includes the above-mentioned display panel.

[0011] Compared with the prior art, the substrate, transfer substrate, display panel, method for manufacturing the same and display device provided by the present invention at least achieve the following beneficial effects:

[0012] The substrate provided by the present invention includes a substrate body, and at least one groove is provided on one side of the substrate body. The groove includes a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane where the substrate is located. The communicating first groove and second groove are conducive to the entry of micro-devices. And along the direction perpendicular to the plane where the substrate is located, the depth of the first groove along the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove along the direction perpendicular to the plane where the substrate is located. The second groove is conducive to placing micro-devices, and after the micro-devices enter the groove, they can be embedded in the second groove, effectively reducing the risk of the micro-devices detaching from the groove.

[0013] Of course, it is not necessary for any product implementing the present invention to simultaneously achieve all the above-described technical effects.

[0014] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings incorporated in and constituting a part of this specification illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0016] Figure 1 is a schematic plan view of a substrate provided by the present invention;

[0017] Figure 2 is Figure 1 a schematic structural view of the substrate described above;

[0018] Figure 3 is a schematic plan view of a transfer substrate provided by the present invention;

[0019] Figure 4 is Figure 3 a schematic structural view of the transfer substrate described above;

[0020] Figure 5 is a schematic structural view of another transfer substrate provided by the present invention;

[0021] Figure 6 is a schematic plan view of yet another transfer substrate provided by the present invention;

[0022] Figure 7 is a schematic structural view of yet another transfer substrate provided by the present invention;

[0023] Figure 8 is a schematic structural view of a display panel provided by the present invention;

[0024] Figure 9It is a schematic structural diagram of another display panel provided by the present invention;

[0025] Figure 10 It is a schematic structural diagram of yet another display panel provided by the present invention;

[0026] Figure 11 It is Figure 10 Another schematic structural diagram of the described display panel;

[0027] Figure 12 It is a schematic structural diagram of yet another display panel provided by the present invention;

[0028] Figure 13 It is a flowchart of a manufacturing method of a display panel provided by the present invention;

[0029] Figures 14 - 17 It is a schematic diagram of the manufacturing process of a display panel manufacturing method provided by the present invention;

[0030] Figure 18 It is another schematic diagram of the manufacturing process of a display panel manufacturing method provided by the present invention;

[0031] Figure 19 It is a plan view of a display device provided by the present invention. Detailed implementation manners

[0032] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0033] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0034] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the specification.

[0035] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0036] It should be noted that: like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0037] Figure 1 It is a plan view of a substrate provided by the present invention, Figure 2Yes Figure 1 A schematic structural diagram of the substrate described above, refer to Figure 1 and Figure 2 , this embodiment provides a substrate, the substrate includes a substrate body 10, at least one groove 20 is provided on one side of the substrate body 10, along the direction perpendicular to the plane where the substrate is located, the groove 20 is recessed towards the inside of the substrate body 10, and the groove 20 does not penetrate the substrate body 10. It should be noted that Figure 1 exemplarily shows that four grooves 20 are provided on one side of the substrate body 10. In other embodiments of the present invention, other numbers of grooves 20 can also be provided on one side of the substrate body 10 according to actual production requirements, and the present invention does not limit this.

[0038] The groove 20 includes a first groove 21 and a second groove 22 that are in communication with each other. In the same groove 20, the first groove 21 and the second groove 22 are arranged along the first direction X, and the first direction X is parallel to the direction of the plane where the substrate is located. The communicating first groove 21 and second groove 22 are beneficial for the entry of the micro-device 30. And along the direction perpendicular to the plane where the substrate is located, the depth of the first groove 21 along the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove 22 along the direction perpendicular to the plane where the substrate is located. The second groove 22 is beneficial for placing the micro-device 30. After the micro-device 30 enters the groove 20, it can be embedded in the second groove 22, effectively reducing the risk of the micro-device 30 detaching from the groove 20.

[0039] In some alternative embodiments, the micro-device 30 is a light-emitting element. Optionally, the micro-device 30 is a Micro LED or a Mini LED, but the present invention does not limit this. In other embodiments of the present invention, the micro-device 30 can also be other components, and the present invention will not elaborate on them one by one here.

[0040] Continue to refer to Figure 1 and Figure 2 , in some alternative embodiments, the second groove 22 is used to place the micro-device 30.

[0041] The length of the micro-device 30 along the first direction X is W, the width of the micro-device 30 along the second direction Y is L, and the height of the micro-device 30 along the direction perpendicular to the plane where the substrate is located is H, where the first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular to each other.

[0042] The width of the groove 20 in the second direction Y is a1, the length of the second groove 22 in the first direction X is b1, and the depth of the first groove 21 in the direction perpendicular to the plane of the substrate is h1. Wherein, a1≥L, h1≥H, b1≥W. The width of the groove 20 in the second direction Y is greater than or equal to the width of the micro-device 30 in the second direction Y, so that the width of the second groove 22 in the second direction Y is greater than or equal to the width of the micro-device 30 in the second direction Y, the length of the second groove 22 in the first direction X is greater than or equal to the length of the micro-device 30 in the first direction X, the depth of the first groove 21 in the direction perpendicular to the plane of the substrate is greater than or equal to the height of the micro-device 30 in the direction perpendicular to the plane of the substrate. In the direction perpendicular to the plane of the substrate, the depth of the first groove 21 in the direction perpendicular to the plane of the substrate is less than the depth of the second groove 22 in the direction perpendicular to the plane of the substrate, so that the depth of the second groove 22 in the direction perpendicular to the plane of the substrate is greater than the height of the micro-device 30 in the direction perpendicular to the plane of the substrate, and the micro-device 30 can be placed in the second groove 22.

[0043] The length of the groove 20 in the first direction X is greater than the length of the micro-device 30 in the first direction X, and the length of the second groove 22 in the first direction X is greater than or equal to the length of the micro-device 30 in the first direction X. Thus, the length of the groove 20 in the first direction X is greater than the length of the micro-device 30 in the first direction X, and the depth of the first groove 21 in the direction perpendicular to the plane of the substrate is greater than or equal to the height of the micro-device 30 in the direction perpendicular to the plane of the substrate, enabling the micro-device 30 to enter the groove 20.

[0044] Optionally, Figure 1 It is exemplarily shown that the vertical projection of the micro-device 30 on the plane of the substrate is rectangular. Correspondingly, the vertical projections of the first groove 21 and the second groove 22 on the plane of the substrate are also rectangular. Of course, in other embodiments of the present invention, the vertical projection of the micro-device 30 on the plane of the substrate may also be other shapes, and the vertical projections of the first groove 21 and the second groove 22 on the plane of the substrate may also be other shapes, which will not be elaborated one by one herein.

[0045] Figure 3 is a schematic plan view of a transfer substrate provided by the present invention, Figure 4 is Figure 3 a schematic structural view of Figure 3 the Figure 4 transfer substrate. Referring to

[0046] In a direction perpendicular to the plane where the substrate 100 is located, the auxiliary fixing portion 200 is located on one side of the groove 20 formed in the substrate 100.

[0047] The auxiliary fixing portion 200 includes a plurality of hollow portions 210. In a direction perpendicular to the plane where the substrate 100 is located, the hollow portions 210 penetrate through the auxiliary fixing portion 200, and the hollow portions 210 expose the groove 20, so that the micro-device 30 can enter the groove 20 through the hollow portions 210. It should be noted that Figure 3 it is exemplarily shown in the figure that the hollow portions 210 and the grooves 20 correspond one by one, and the hollow portions 210 expose the grooves 20 corresponding to them. Of course, in other embodiments of the present invention, one hollow portion 210 may also correspond to two or more grooves 20, and the hollow portion 210 exposes the grooves 20 corresponding to it. The present invention will not elaborate on this one by one here.

[0048] The auxiliary fixing portion 200 further includes a plurality of shielding portions 220. In a direction perpendicular to the plane where the substrate 100 is located, the shielding portions 220 and the second groove 22 overlap at least partially. When transporting the micro-device 30 through the transfer substrate, after the micro-device 30 enters the groove 20 through the hollow portion 210 and is placed in the second groove 22, in a direction perpendicular to the plane where the substrate 100 is located, the shielding portions 220 and the second groove 22 overlap at least partially, that is, the shielding portions 220 at least partially cover the second groove 22, which can play a role in shielding the micro-device 30 located in the second groove 22, avoiding the micro-device 30 placed in the second groove 22 from detaching from the groove 20, and is beneficial to the transfer substrate to transport the micro-device 30. And there is no need to provide an inorganic layer for bonding the micro-device 30 on the substrate 100. After the transportation is completed, the micro-device 30 can be directly taken out without separating the micro-device 30 from the inorganic layer, which can avoid damaging the micro-device 30 when separating the micro-device 30.

[0049] Optionally, the auxiliary fixing portion 200 is an integral plate-like structure, which is beneficial for the auxiliary fixing portion 200 to adhere to one side of the groove 20 formed in the substrate 100. Of course, in other embodiments of the present invention, each shielding portion in the auxiliary fixing portion 200 may also be an independent and separated structure. The present invention will not elaborate on this one by one here.

[0050] Continuing to refer to Figure 3 , in some alternative embodiments, the second groove 22 is used to place the micro-device 30, and the width of the micro-device 30 along the second direction Y is L, where the first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular to each other.

[0051] The second groove 22 includes a first sidewall 41 which is located on one side of the second groove 22 along the second direction Y. The shielding portion 220 includes a retaining bar 221, and the distance between the retaining bar 221 and the first sidewall 41 along the second direction Y is a2, where a2 < L. When the micro-device 30 is located within the second groove 22, since the distance between the retaining bar 221 and the first sidewall 41 along the second direction Y is less than the width of the micro-device 30, it effectively prevents the micro-device 30 from exiting between the retaining bar 221 and the first sidewall 41 and thus detaching from the second groove 22.

[0052] Figure 5 is a schematic structural view of another transfer substrate provided by the present invention. Refer to Figure 5 , in some alternative embodiments, it further includes a picking device 300 that matches the transfer substrate.

[0053] The picking device 300 includes a fixed substrate 310 and a picking head 320 disposed on one side of the fixed substrate 310. The picking head 320 is used to pick up the micro-device 30. Optionally, the picking head 320 can pick up the micro-device 30 by means such as adhesion or adsorption.

[0054] The width of the picking head 320 along the second direction Y is d, where d ≤ a2. The distance between the retaining bar 221 and the first sidewall 41 along the second direction Y is greater than the width of the picking head 320 along the second direction Y, so that the picking head 320 can move between the retaining bar 221 and the first sidewall 41, and thus the micro-device 30 can be driven by the picking head 320 into the second groove 22, enabling subsequent transfer of the micro-device 30 by the transfer substrate. When it is necessary to take out the micro-device 30 from the transfer substrate for transfer, the picking head 320 can pick up the micro-device 30 located within the second groove 22 and take it out of the groove 20.

[0055] With the matching picking device 300, the mutually attached substrate 100 and the auxiliary fixing portion 200 in the transfer substrate do not need to be separated, so that the transfer substrate can be reused, effectively reducing the production cost.

[0056] Optionally, refer to Figure 5, when the shielding portion 220 includes a bar 221, the second groove 22 may have two first side walls 41. Along the second direction Y, the distance between the first side wall 41 and the bar 221 is greater than the width of the pickup head 320 along the second direction Y. Thus, a micro device 30 can be picked up by two pickup heads 320 and enter the second groove 22, and a micro device 30 can be picked up by two pickup heads 320 and taken out from the second groove 22, which is beneficial to improving the stability of picking up. Of course, in other embodiments of the present invention, when the shielding portion 220 includes a bar 221, the second groove 22 may also have only one first side wall 41. A micro device 30 can be picked up by one pickup head 320 and enter the second groove 22, and a micro device 30 can be picked up by one pickup head 320 and taken out from the second groove 22, and the present invention will not elaborate herein.

[0057] Figure 6 is another schematic plan view of a transfer substrate provided by the present invention, Figure 6 The schematic structural view of the transfer substrate described above can be referred to Figure 4 , referring to Figure 4 and Figure 6 , in some alternative embodiments, the second groove 22 is used to place the micro device 30. The width of the micro device 30 along the second direction Y is L, wherein the first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular to each other.

[0058] The shielding portion 220 includes at least two bars 221 arranged along the second direction Y. Along the second direction Y, the distance between two adjacent bars 221 is a3, wherein a3 < L. When the micro device 30 is located in the second groove 22, since the distance between two adjacent bars 221 along the second direction Y is less than the width of the micro device 30, it effectively prevents the micro device 30 from going out between two adjacent bars 221 and thus detaching from the second groove 22.

[0059] It should be noted that, Figure 6 exemplarily shows that the shielding portion 220 includes two bars 221. In other embodiments of the present invention, the shielding portion 220 may also include other numbers of bars 221, and the present invention will not elaborate herein one by one.

[0060] In some alternative embodiments, when the shielding portion 220 includes at least two bars 221, the distance between the side wall on one side of the second groove 22 along the second direction Y and the shielding portion 220 is less than the width of the micro device 30 along the second direction Y, or, in the direction perpendicular to the plane of the substrate 100, the side wall on one side of the second groove 22 along the second direction Y at least partially overlaps with a bar 221.

[0061] Figure 7This is another schematic structural diagram of the transfer substrate provided by the present invention. Refer to Figure 7 , in some alternative embodiments, it further includes a pickup device 300 that matches the transfer substrate.

[0062] The pickup device 300 includes a fixed substrate 310 and a pickup head 320 disposed on one side of the fixed substrate 310. The pickup head 320 is used to pick up the micro-device 30.

[0063] The width of the pickup head 320 along the second direction Y is d, where d ≤ a3. Along the second direction Y, the spacing between two adjacent ribs 221 is greater than the width of the pickup head 320 along the second direction Y, so that the pickup head 320 can move between two adjacent ribs 221. Thus, the micro-device 30 can be driven into the second groove 22 by the pickup head 320, enabling the subsequent transfer of the micro-device 30 by the transfer substrate. When it is necessary to take out the micro-device 30 from the transfer substrate for transfer, the micro-device 30 located in the second groove 22 can be picked up by the pickup head 320 and taken out of the groove 20.

[0064] With the matching pickup device 300, the mutually attached substrate 100 and the auxiliary fixing part 200 in the transfer substrate do not need to be separated, so that the transfer substrate can be reused, effectively reducing the production cost.

[0065] Continue to refer to Figure 3 and Figure 4 , in some alternative embodiments, the second groove 22 is used to place the micro-device 30. Since the micro-device 30 enters from the first groove 21 and then moves to the second groove 22, the hollow part 210 does not need to completely expose the second groove 22, that is, along the direction perpendicular to the plane where the substrate 100 is located, the hollow part 210 and the second groove 22 at least partially overlap.

[0066] The vertical projection of the first groove 21 on the plane where the substrate 100 is located is located within the vertical projection of the hollow part 210 on the plane where the substrate 100 is located, that is, the hollow part 210 completely exposes the first groove 21. Since the width of the groove 20 along the second direction Y is greater than or equal to the width of the micro-device 30 along the second direction Y, the width of the hollow part 210 along the second direction Y is greater than or equal to the width of the micro-device 30 along the second direction Y. Optionally, the vertical projection of the first groove 21 on the plane where the substrate 100 is located coincides with the vertical projection of the hollow part 210 on the plane where the substrate 100 is located.

[0067] The length of the micro-device 30 in the first direction X is W. The first groove 21 includes a second sidewall 42, and in the first direction X, the second sidewall 42 is located on the side of the first groove 21 away from the second groove 22. In the first direction X, the distance between the shielding portion 220 and the second sidewall 42 is c, where c≥W. In the first direction X, the distance between the shielding portion 220 and the second sidewall 42 is greater than the length of the micro-device 30 in the first direction X, and the hollow portion 210 completely exposes the first groove 21. The width of the hollow portion 210 in the second direction Y is greater than or equal to the width of the micro-device 30 in the second direction Y. Therefore, the micro-device 30 can enter the first groove 21 through the hollow portion 210.

[0068] Figure 8 is a schematic structural diagram of a display panel provided by the present invention. Refer to Figure 8 In this embodiment, a display panel is provided, including a substrate 100, where the substrate 100 is the substrate provided in the above embodiment of the present invention.

[0069] The substrate 100 includes a substrate 110, a circuit layer 120, and a defining layer 130. The circuit layer 120 is located on one side of the substrate 11. The circuit layer 120 includes structures such as thin-film transistors T. The defining layer 130 is located on the side of the circuit layer 120 away from the substrate 11. Optionally, the defining layer 130 can be an organic layer.

[0070] The display panel further includes a plurality of micro-devices 30. In some alternative embodiments, the micro-devices 30 are light-emitting elements. Optionally, the micro-devices 30 are Micro LEDs or Mini LEDs, but the present invention does not limit this. In other embodiments of the present invention, the micro-devices 30 can also be other light-emitting elements, which will not be elaborated one by one here.

[0071] The micro-devices 30 are located in the second groove 22. Since the second groove 22 penetrates the defining layer 130 in the direction perpendicular to the plane of the substrate 100, and the first groove 21 does not penetrate the defining layer 130, the micro-devices 30 can be embedded in the second groove 22, effectively reducing the risk of the micro-devices 30 detaching from the groove 20. And since the second groove 22 penetrates the defining layer 130 in the direction perpendicular to the plane of the substrate 100 to expose a part of the circuit layer 120, and the micro-devices 30 are embedded in the second groove 22, electrical connection between the micro-devices 30 and the circuit layer 120 can be achieved. At the same time, the reliability of the electrical connection between the micro-devices 30 and the circuit layer 120 is improved.

[0072] Figure 9 is a schematic structural diagram of another display panel provided by the present invention. Refer to Figure 9, in some alternative embodiments, the second groove 22 includes a first sub-groove 51 and a second sub-groove 52 that communicate with each other. In a direction perpendicular to the plane of the substrate 100, the second sub-groove 52 is located between the first sub-groove 51 and the circuit layer 120, and the second sub-groove 52 exposes a part of the circuit layer 120.

[0073] The micro-device 30 includes a pin 31. The pin 31 is located on the side of the micro-device 30 close to the substrate 110. At least part of the pin 31 is located in the second sub-groove 52, and the pin 31 is electrically connected to the circuit layer 120. At least part of the pin 31 is embedded in the second sub-groove 52, effectively improving the reliability of the electrical connection between the pin 31 and the circuit layer 120 in the micro-device 30.

[0074] Figure 10 is a schematic structural diagram of another display panel provided by the present invention. Figure 11 is Figure 10 another schematic structural diagram of the display panel described above. Refer to Figure 10 and Figure 11 , in some alternative embodiments, the length of the pin 31 in the first direction X is the same as the length of the second sub-groove 52 in the first direction X, and the width of the pin 31 in the second direction Y is the same as the width of the second sub-groove 52 in the second direction Y, where the first direction X and the second direction Y intersect. The structures of the pin 31 and the second sub-groove 52 match, enabling the pin 31 to be better embedded in the second sub-groove 52, further improving the reliability of the electrical connection between the pin 31 and the circuit layer 120 in the micro-device 30.

[0075] It should be noted that the fact that the length of the pin 31 in the first direction X is the same as the length of the second sub-groove 52 in the first direction X in this embodiment means that within a reasonable process error range, the length of the pin 31 in the first direction X tends to be the same as the length of the second sub-groove 52 in the first direction X. Similarly, the fact that the width of the pin 31 in the second direction Y is the same as the width of the second sub-groove 52 in the second direction Y means that within a reasonable process error range, the width of the pin 31 in the second direction Y tends to be the same as the width of the second sub-groove 52 in the second direction Y.

[0076] In some alternative embodiments, a micro-device 30 includes two pins 31. Since the length of the pin 31 in the first direction X is the same as the length of the second sub-groove 52 in the first direction X, and the width of the pin 31 in the second direction Y is the same as the width of the second sub-groove 52 in the second direction Y, therefore, a part of the defining layer 13 is located between the two pins 31 in the same micro-device 30, which can isolate between the two pins 31 and reduce the risk of short circuit between the two pins 31 in the same micro-device 30.

[0077] Continue to refer toFigure 10 and Figure 11 In some alternative embodiments, the height of pin 31 in a direction perpendicular to the plane of substrate 100 is greater than or equal to the depth of the second sub-groove 52 in a direction perpendicular to the plane of substrate 100, so as to electrically connect pin 31 in micro-device 30 to circuit layer 120.

[0078] Continue to refer to Figure 9 In some alternative embodiments, the depth of the first groove 21 in a direction perpendicular to the plane of substrate 100 is less than the depth of the first sub-groove 51 in a direction perpendicular to the plane of substrate 100, such that parts of micro-device 30 other than pin 31 are embedded in the first sub-groove 51, preventing micro-device 30 from detaching from the second groove 22 and improving the reliability of the electrical connection between micro-device 30 and circuit layer 120.

[0079] Figure 12 is a schematic structural diagram of another display panel provided by the present invention. Refer to Figure 12 In some alternative embodiments, a reflective layer 60 is provided on the sidewall of groove 20. Micro-device 30 is located in the second groove 22. After part of the light emitted by micro-device 30 is incident on the reflective layer 60, it will be reflected on the reflective layer 60 and then emitted from the light-emitting surface of the display panel, which is beneficial to increasing the amount of light emitted from the light-emitting surface of the display panel and effectively improving the display effect of the display panel.

[0080] Figure 13 is a flowchart of a manufacturing method of a display panel provided by the present invention. Figures 14 - 17 is a schematic diagram of the manufacturing process of the manufacturing method of the display panel provided by the present invention. Refer to Figures 13 - 17 In this embodiment, a manufacturing method of a display panel is provided, including:

[0081] S1. Provide a substrate, where the substrate is the substrate provided in the above embodiments of the present invention, and the substrate further includes a substrate, a circuit layer, and a defining layer. The circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; in a direction perpendicular to the plane of the substrate, the second groove penetrates through the defining layer to expose part of the circuit layer, and the first groove does not penetrate through the defining layer.

[0082] Refer to Figure 14, the substrate 100 includes a substrate body 10. At least one groove 20 is provided on one side of the substrate body 10. The groove 20 includes a first groove 21 and a second groove 22 that communicate with each other. In the same groove 20, the first groove 21 and the second groove 22 are arranged along a first direction X, and the first direction X is parallel to the direction of the plane where the substrate is located. The substrate 100 further includes a substrate 110, a circuit layer 120, and a defining layer 130. The circuit layer 120 is located on one side of the substrate 11. The circuit layer 120 includes structures such as thin film transistors T. The defining layer 130 is located on the side of the circuit layer 120 away from the substrate 11. Optionally, the defining layer 130 can be an organic layer. In the direction perpendicular to the plane where the substrate 100 is located, the second groove 22 penetrates through the defining layer 130 to expose a part of the circuit layer 120, and the first groove 21 does not penetrate through the defining layer 130.

[0083] S2. Attach an auxiliary fixing part to the side of the substrate close to the groove. The auxiliary fixing part includes a plurality of hollow parts. In the direction perpendicular to the plane where the substrate is located, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; the auxiliary fixing part further includes a plurality of shielding parts. In the direction perpendicular to the plane where the substrate is located, the shielding part and the second groove at least partially overlap.

[0084] Reference Figure 15 and Figure 16 , an auxiliary fixing part 200 is attached to the side of the substrate 100 close to the groove 20. The auxiliary fixing part 200 includes a plurality of hollow parts 210. In the direction perpendicular to the plane where the substrate 100 is located, the hollow parts 210 penetrate through the auxiliary fixing part 200, and the hollow parts 210 expose the groove 20, so that the micro-device 30 can enter the groove 20 through the hollow parts 210. It should be noted that Figure 15 exemplarily shows that the hollow parts 210 and the grooves 20 correspond one by one, and the hollow parts 210 expose the grooves 20 corresponding to them. Of course, in other embodiments of the present invention, one hollow part 210 can also correspond to two or more grooves 20, and the hollow parts 210 expose the grooves 20 corresponding to them. The present invention will not elaborate on this one by one here.

[0085] The auxiliary fixing part 200 further includes a plurality of shielding parts 220. In the direction perpendicular to the plane where the substrate 100 is located, the shielding part 220 and the second groove 22 at least partially overlap.

[0086] Optionally, the auxiliary fixing part 200 is an integral plate-like structure, which is beneficial for the auxiliary fixing part 200 to be attached to the side of the substrate 100 where the groove 20 is opened. Of course, in other embodiments of the present invention, each shielding part in the auxiliary fixing part 200 can also be an independent and separated structure. The present invention will not elaborate on this one by one here.

[0087] S3. Place the micro-device in the second groove through a picking device, and the micro-device is electrically connected to the circuit layer.

[0088] Reference Figure 17 , the pick-up device 300 picks up the micro-device 30 and drives the micro-device 30 into the second groove, so as to place the micro-device 30 in the second groove 22, enabling the micro-device 30 to be electrically connected to the circuit layer 120.

[0089] S4. Remove the auxiliary fixing part.

[0090] Reference Figure 8 , after the micro-device 30 is placed in the second groove 22, the auxiliary fixing part is removed to avoid the auxiliary fixing part affecting the subsequent film layer setting and the light emission of the display panel. In the display panel manufactured by the manufacturing method of the display panel provided in this embodiment, the micro-device 30 is located in the second groove 22. Since the second groove 22 penetrates the defining layer 130 and the first groove 21 does not penetrate the defining layer 130 in the direction perpendicular to the plane of the substrate 100, the micro-device 30 can be embedded in the second groove 22, effectively reducing the risk of the micro-device 30 detaching from the groove 20. And since the second groove 22 penetrates the defining layer 130 to expose a part of the circuit layer 120 in the direction perpendicular to the plane of the substrate 100 and the micro-device 30 is embedded in the second groove 22, the micro-device 30 can be electrically connected to the circuit layer 120, and at the same time, the reliability of the electrical connection between the micro-device 30 and the circuit layer 120 is improved.

[0091] Figure 18 is another schematic diagram of the manufacturing process of the display panel manufacturing method provided by the present invention. Reference Figure 15 and Figure 18 , in some alternative embodiments, the width of the micro-device 30 along the second direction Y is L, where the first direction X and the second direction Y intersect.

[0092] The shielding part 220 includes at least two bars 221 arranged along the second direction Y, and the distance between two adjacent bars 221 along the second direction Y is a3.

[0093] The pick-up device 300 includes a fixed substrate 310 and a pick-up head 320 disposed on one side of the fixed substrate 310. The width of the pick-up head 320 along the second direction Y is d, where d ≤ a3 < L.

[0094] Placing the micro-device 30 in the second groove 22 through the pick-up device 300 is specifically as follows:

[0095] The micro-device 30 is picked up by the pick-up head 320. Optionally, the pick-up head 320 can pick up the micro-device 30 by means of adhesion, adsorption, etc. Then, the pick-up head 320 drives the micro-device 30 to be embedded in the first groove 21, and the pick-up head 320 drives the micro-device 30 to be embedded in the first groove 21 through the hollow portion 210. Since, along the second direction Y, the distance between two adjacent stop bars 221 is greater than the width of the pick-up head 320 along the second direction Y, the pick-up head 320 can move between two adjacent stop bars 221. After the pick-up head 320 drives the micro-device 30 to be embedded in the first groove 21, the pick-up device 300 is moved so that the pick-up head 320 moves between two adjacent stop bars 221, thereby moving the micro-device 30 into the second groove 22. After the pick-up device 300 moves the micro-device 30 into the second groove 22, the micro-device 30 is separated from the pick-up head 320, so that the micro-device 30 is placed in the second groove 22 and the micro-device 30 is electrically connected to the circuit layer 120. That is, the setting of the shielding portion 220 does not affect the transfer of the micro-device 30 to the second groove 22 by the pick-up device 300.

[0096] Continue to refer to Figure 18 , in some alternative embodiments, after the micro-device 30 is moved into the second groove 22, in a direction perpendicular to the plane of the substrate 100, the pick-up device 300 is moved in a direction away from the substrate 100. When the pick-up device 300 drives the micro-device 30 to move in a direction away from the substrate 100 until it contacts the stop bar 221 in the shielding portion 220, since, along the second direction Y, the distance between two adjacent stop bars 221 is less than the width of the micro-device 30 along the second direction Y, the stop bar 221 in the shielding portion 220 will limit the micro-device 30 from continuing to move in a direction away from the substrate 100. When the pick-up device 300 continues to move in a direction away from the substrate 100, the shielding portion 220 can separate the micro-device 30 from the pick-up head 320. The shielding portion 220 can separate the micro-device 30 from the pick-up head 320, so that the micro-device 30 is placed in the second groove 22, and there is no need to set other ways to separate the micro-device 30 from the pick-up head 320, effectively simplifying the production process and reducing the production cost.

[0097] In some alternative embodiments, please refer to Figure 19 , Figure 19 is a schematic plan view of a display device provided by the present invention. The display device 1000 provided in this embodiment includes the display panel provided in the above embodiment of the present invention. Figure 19The embodiments are described by taking a mobile phone as an example for the display device 1000. It can be understood that the display device 1000 provided by the embodiments of the present invention can also be other display devices 1000 with a display function, such as a computer, a television, a vehicle-mounted display device, etc. The present invention does not make specific limitations thereto. The display device 1000 provided by the embodiments of the present invention has the beneficial effects of the display panel provided by the embodiments of the present invention. For specific descriptions of the display panel, reference can be made to the above embodiments, and details are not repeated herein.

[0098] As can be seen from the above embodiments, the substrate, the transfer substrate, the display panel, their manufacturing methods, and the display device provided by the present invention achieve at least the following beneficial effects:

[0099] The substrate provided by the present invention includes a substrate body, and at least one groove is provided on one side of the substrate body. The groove includes a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane where the substrate is located. The communicating first groove and second groove are beneficial for the entry of micro-devices. And in the direction perpendicular to the plane where the substrate is located, the depth of the first groove in the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove in the direction perpendicular to the plane where the substrate is located. The second groove is beneficial for placing micro-devices, and after the micro-devices enter the groove, they can be embedded in the second groove, effectively reducing the risk of the micro-devices detaching from the groove.

[0100] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A transfer device, characterized in that, Comprising: A substrate and an auxiliary fixing part that are fitted together, wherein, The substrate includes: A substrate body, on one side of the substrate body there are provided at least one groove, the grooves are arranged along a first direction and a second direction, and the first direction intersects with the second direction; The groove includes a first groove and a second groove that are in communication with each other. In the same groove, the first groove and the second groove are arranged along the first direction, and the first direction is parallel to the direction of the plane where the substrate is located; In the direction perpendicular to the plane where the substrate is located, the groove does not penetrate through the substrate body, and the depth of the first groove in the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove in the direction perpendicular to the plane where the substrate is located; In the direction perpendicular to the plane where the substrate is located, the auxiliary fixing part is located on the side of the substrate where the groove is provided; The auxiliary fixing part includes a plurality of hollow parts. In the direction perpendicular to the plane where the substrate is located, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; The auxiliary fixing part further includes a plurality of shielding parts. In the direction perpendicular to the plane where the substrate is located, the shielding parts and the second groove at least partially overlap.

2. A transfer device, characterized in that, Comprising: A substrate and an auxiliary fixing part that are fitted together, wherein, The substrate includes: A substrate body, on one side of the substrate body there is provided at least one groove; The groove includes a first groove and a second groove that are in communication with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane where the substrate is located; In the direction perpendicular to the plane where the substrate is located, the groove does not penetrate through the substrate body, and the depth of the first groove in the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove in the direction perpendicular to the plane where the substrate is located; The second groove is used for placing a micro-device; The length of the micro-device along the first direction is W, the width of the micro-device along the second direction is L, and the height of the micro-device along the direction perpendicular to the plane where the substrate is located is H, wherein the first direction and the second direction intersect; The width of the groove along the second direction is a1; The depth of the first groove in the direction perpendicular to the plane where the substrate is located is h1; The length of the second groove along the first direction is b1; Wherein, a1≥L, h1≥H, b1≥W; In the direction perpendicular to the plane where the substrate is located, the auxiliary fixing part is located on the side of the substrate where the groove is provided; The auxiliary fixing part includes a plurality of hollow parts. In the direction perpendicular to the plane where the substrate is located, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; The auxiliary fixing part further includes a plurality of shielding parts. In the direction perpendicular to the plane where the substrate is located, the shielding parts and the second groove at least partially overlap.

3. The transfer device according to claim 1 or 2, wherein, The second groove is used for placing a micro-device, and the width of the micro-device along the second direction is L; The second groove includes a first side wall, and along the second direction, the first side wall is located on one side of the second groove; The shielding portion includes a bar, and along the second direction, the distance between the bar and the first side wall is a2, where a2 < L.

4. The transfer device according to claim 3, wherein It further includes a picking device; The picking device includes a fixed substrate and a picking head disposed on one side of the fixed substrate, and the picking head is used for picking up the micro-device; The width of the picking head along the second direction is d, where d ≤ a2.

5. The transfer device according to claim 1 or 2, wherein The second groove is used for placing a micro-device, and the width of the micro-device along the second direction is L; The shielding portion includes at least two bars arranged along the second direction, and along the second direction, the distance between two adjacent bars is a3, where a3 < L.

6. The transfer device according to claim 5, characterized in that It further includes a picking device; The picking device includes a fixed substrate and a picking head disposed on one side of the fixed substrate, and the picking head is used for picking up the micro-device; The width of the picking head along the second direction is d, where d ≤ a3.

7. The transfer device according to claim 1 or 2, wherein The perpendicular projection of the first groove on the plane where the substrate is located is located within the perpendicular projection of the hollow portion on the plane where the substrate is located, and along the direction perpendicular to the plane where the substrate is located, the hollow portion and the second groove at least partially overlap; the second groove is used for placing a micro-device, and the length of the micro-device along the first direction is W; The first groove includes a second side wall, and along the first direction, the second side wall is located on the side of the first groove away from the second groove; Along the first direction, the distance between the shielding portion and the second side wall is c, where c ≥ W.

8. A display panel, characterized in that, It includes: A substrate, the substrate includes: A substrate body, and at least one groove is provided on one side of the substrate body, and the groove is arranged along a first direction and a second direction, and the first direction intersects with the second direction; The groove includes a first groove and a second groove that are communicated with each other. In the same groove, the first groove and the second groove are arranged along the first direction, and the first direction is parallel to the direction of the plane where the substrate is located; Along the direction perpendicular to the plane where the substrate is located, the groove does not penetrate the substrate body, and the depth of the first groove along the direction perpendicular to the plane where the substrate is located is less than the depth of the second groove along the direction perpendicular to the plane where the substrate is located; the substrate includes a substrate, a circuit layer, and a defining layer, the circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; Along the direction perpendicular to the plane where the substrate is located, the second groove penetrates the defining layer to expose a part of the circuit layer, and the first groove does not penetrate the defining layer; The display panel further includes a plurality of micro-devices, the micro-devices are located in the second groove, and the micro-devices are electrically connected to the circuit layer; The second groove includes a first sub-groove and a second sub-groove that communicate with each other. In a direction perpendicular to the plane of the substrate, the second sub-groove is located between the first sub-groove and the circuit layer, and the second sub-groove exposes a part of the circuit layer; The micro-device includes pins, the pins are located on a side of the micro-device close to the substrate, at least part of the pins are located in the second sub-groove, and the pins are electrically connected to the circuit layer; The length of the pins in the first direction is the same as the length of the second sub-groove in the first direction, and the width of the pins in the second direction is the same as the width of the second sub-groove in the second direction.

9. A display panel, characterized in that, Comprising: A substrate, the substrate includes: A substrate body, at least one groove is provided on one side of the substrate body; The groove includes a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged in a first direction, and the first direction is parallel to the direction of the plane of the substrate; In a direction perpendicular to the plane of the substrate, the groove does not penetrate the substrate body, and the depth of the first groove in the direction perpendicular to the plane of the substrate is less than the depth of the second groove in the direction perpendicular to the plane of the substrate; The second groove is used for placing micro-devices; The length of the micro-device in the first direction is W, the width of the micro-device in the second direction is L, and the height of the micro-device in the direction perpendicular to the plane of the substrate is H, wherein the first direction and the second direction intersect; The width of the groove in the second direction is a1; The depth of the first groove in the direction perpendicular to the plane of the substrate is h1; The length of the second groove in the first direction is b1; Wherein, a1≥L, h1≥H, b1≥W; The substrate includes a substrate, a circuit layer, and a defining layer. The circuit layer is located on one side of the substrate, and the defining layer is located on a side of the circuit layer away from the substrate; In a direction perpendicular to the plane of the substrate, the second groove penetrates the defining layer to expose a part of the circuit layer, and the first groove does not penetrate the defining layer; The display panel further includes a plurality of micro-devices, the micro-devices are located in the second groove, and the micro-devices are electrically connected to the circuit layer; The second groove includes a first sub-groove and a second sub-groove that communicate with each other. In a direction perpendicular to the plane of the substrate, the second sub-groove is located between the first sub-groove and the circuit layer, and the second sub-groove exposes a part of the circuit layer; The micro-device includes pins, the pins are located on a side of the micro-device close to the substrate, at least part of the pins are located in the second sub-groove, and the pins are electrically connected to the circuit layer; The length of the pins in the first direction is the same as the length of the second sub-groove in the first direction, and the width of the pins in the second direction is the same as the width of the second sub-groove in the second direction.

10. The display panel according to claim 8 or 9, wherein The height of the pin in the direction perpendicular to the plane of the substrate is greater than or equal to the depth of the second sub-groove in the direction perpendicular to the plane of the substrate.

11. The display panel according to claim 8 or 9, wherein The depth of the first groove in the direction perpendicular to the plane of the substrate is less than the depth of the first sub-groove in the direction perpendicular to the plane of the substrate.

12. The display panel according to claim 8 or 9, wherein A reflective layer is provided on the side wall of the groove.

13. A method for manufacturing a display panel, characterized in that, Comprising: Providing a substrate, wherein the substrate comprises: A substrate body, on one side of the substrate body, there is at least one groove, the grooves are arranged along a first direction and a second direction, and the first direction intersects with the second direction; The groove comprises a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged along the first direction, and the first direction is parallel to the direction of the plane of the substrate; In the direction perpendicular to the plane of the substrate, the groove does not penetrate the substrate body, and the depth of the first groove in the direction perpendicular to the plane of the substrate is less than the depth of the second groove in the direction perpendicular to the plane of the substrate; And the substrate further comprises a substrate, a circuit layer and a defining layer. The circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; in the direction perpendicular to the plane of the substrate, the second groove penetrates the defining layer to expose a part of the circuit layer, and the first groove does not penetrate the defining layer; An auxiliary fixing part is attached to the side of the substrate close to the groove. The auxiliary fixing part comprises a plurality of hollow parts. In the direction perpendicular to the plane of the substrate, the hollow parts penetrate the auxiliary fixing part, and the hollow parts expose the groove; the auxiliary fixing part further comprises a plurality of shielding parts. In the direction perpendicular to the plane of the substrate, the shielding parts and the second groove at least partially overlap; Placing the micro-device in the second groove through a picking device, and the micro-device is electrically connected to the circuit layer; Removing the auxiliary fixing part.

14. A manufacturing method of a display panel, characterized in that, Comprising: Providing a substrate, wherein the substrate comprises: A substrate body, on one side of the substrate body, there is at least one groove; The groove comprises a first groove and a second groove that communicate with each other. In the same groove, the first groove and the second groove are arranged along a first direction, and the first direction is parallel to the direction of the plane of the substrate; In the direction perpendicular to the plane of the substrate, the groove does not penetrate the substrate body, and the depth of the first groove in the direction perpendicular to the plane of the substrate is less than the depth of the second groove in the direction perpendicular to the plane of the substrate; The second groove is used for placing the micro-device; The length of the micro-device in the first direction is W, the width of the micro-device in the second direction is L, and the height of the micro-device in the direction perpendicular to the plane of the substrate is H, wherein the first direction and the second direction intersect; The width of the groove in the second direction is a1; The depth of the first groove in the direction perpendicular to the plane of the substrate is h1; The length of the second groove in the first direction is b1; wherein, a1≥L, h1≥H, b1≥W; And the substrate further includes a substrate, a circuit layer, and a defining layer. The circuit layer is located on one side of the substrate, and the defining layer is located on the side of the circuit layer away from the substrate; in the direction perpendicular to the plane of the substrate, the second groove penetrates through the defining layer to expose a part of the circuit layer, and the first groove does not penetrate through the defining layer; An auxiliary fixing part is attached to the side of the substrate close to the groove. The auxiliary fixing part includes a plurality of hollow parts. In the direction perpendicular to the plane of the substrate, the hollow parts penetrate through the auxiliary fixing part, and the hollow parts expose the groove; the auxiliary fixing part further includes a plurality of shielding parts. In the direction perpendicular to the plane of the substrate, the shielding parts and the second groove at least partially overlap; A micro-device is placed in the second groove through a picking device, and the micro-device is electrically connected to the circuit layer; Remove the auxiliary fixing part.

15. The manufacturing method of the display panel according to claim 13 or 14, wherein The width of the micro-device in the second direction is L, wherein the first direction and the second direction intersect; The shielding part includes at least two bars arranged in the second direction, and the distance between two adjacent bars in the second direction is a3; The picking device includes a fixed substrate and a picking head arranged on one side of the fixed substrate. The width of the picking head in the second direction is d, wherein d≤a3<L; Pick up the micro-device through the picking head; The picking head drives the micro-device to be embedded in the first groove; Move the picking device so that the picking head moves between two adjacent bars, and move the micro-device into the second groove; The micro-device is separated from the picking head, so that the micro-device is placed in the second groove.

16. The manufacturing method of the display panel according to claim 15, wherein After the micro-device is moved into the second groove, in the direction perpendicular to the plane of the substrate, move the picking device in a direction away from the substrate; Separate the micro-device from the picking head through the shielding part.

17. A display device, characterized in that, The display device includes the display panel according to any one of claims 8-12.

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