Display panel, manufacturing method thereof, and display device

Abstract

The present invention discloses a display panel, a manufacturing method thereof, and a display device, relating to the field of display technologies. The display panel includes: an array substrate; at least one micro-device, the micro-device being located on one side of the array substrate, and at least one connecting portion being connected between the array substrate and the micro-device; at least one telescopic structure, the telescopic structure being located between the array substrate and the micro-device, and in a direction perpendicular to the plane where the array substrate is located, the telescopic structure does not overlap with the connecting portion; the telescopic structure can be telescoped in a direction perpendicular to the plane where the array substrate is located. The present invention is beneficial to realizing the connection between the micro-device and the array substrate after the transfer of the micro-device.

Description

Technical Field

[0001] The present invention relates to the field of display technologies, and more specifically, to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] Currently, the transfer problem of Micro-LED (micro light-emitting diode) devices is the most painful point restricting industrialization. After the Micro-LED devices are fabricated, it is necessary to transfer the Micro-LED devices on the heterogeneous sapphire substrate to the display backplane. The current mainstream transfer technologies basically include: wafer bonding technology, fluid self-assembly technology, stamp transfer, and laser transfer, etc. Currently, the mainstream of Micro-LED devices are fabricated by stamp transfer technology. The pick-and-place speed and placement accuracy of stamp transfer are very limited and cannot achieve the necessary mass production. Laser transfer is scalable and can adapt to the trend of smaller and smaller microLED devices. In addition, it has the advantages of high transfer efficiency, simple process flow, and high mass production potential, and is considered as the next-generation transfer technology. Currently, the connection after laser transfer of Micro-LED devices is the key process of the laser transfer solution.

[0003] Therefore, how to realize the connection between the Micro-LED device and the array substrate after transfer is an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the present invention provides a display panel, a manufacturing method thereof, and a display device, which are beneficial to realizing the connection between the micro device and the array substrate after transfer.

[0005] The present invention provides a display panel, including: an array substrate; at least one micro device, the micro device is located on one side of the array substrate, and at least one connecting portion is connected between the array substrate and the micro device; at least one telescopic structure, the telescopic structure is located between the array substrate and the micro device, and in a direction perpendicular to the plane where the array substrate is located, the telescopic structure does not overlap with the connecting portion; the telescopic structure can be telescoped in a direction perpendicular to the plane where the array substrate is located.

[0006] Based on the same concept, the present invention further provides a method for manufacturing a display panel, including: providing a carrier substrate, on one side of which a plurality of micro-devices are arranged in an array, and a first pad is provided on the side of the micro-device away from the carrier substrate; providing an array substrate, on one side of which a plurality of second pads are arranged in an array; providing a telescopic structure on the side of the micro-device away from the carrier substrate, or providing a telescopic structure on the side of the array substrate where the second pads are provided; transferring at least one micro-device to the array substrate, aligning one first pad with one second pad, and bonding the telescopic structure between the array substrate and the micro-device. In the direction perpendicular to the plane of the array substrate, the telescopic structure does not overlap with the first pad and the second pad; the telescopic structure contracts in the direction perpendicular to the plane of the array substrate, and the first pad and the second pad form a connection portion.

[0007] Based on the same concept, the present invention further provides a display device, which includes the above-mentioned display panel.

[0008] Compared with the prior art, the display panel, its manufacturing method, and the display device provided by the present invention at least achieve the following beneficial effects:

[0009] The display panel provided by the present invention includes at least one telescopic structure, which is located between the array substrate and the micro-device, and the connection portion is also located between the array substrate and the micro-device. Since in the direction perpendicular to the plane of the array substrate, the telescopic structure does not overlap with the connection portion, the setting of the telescopic structure between the array substrate and the micro-device does not affect the setting of the connection portion. When the micro-device is transferred to one side of the array substrate, the micro-device can be bonded to one side of the array substrate through the telescopic structure. The telescopic structure can expand and contract in the direction perpendicular to the plane of the array substrate, that is, the telescopic structure can contract in the direction perpendicular to the plane of the array substrate to provide a force beneficial to the connection between the first pad on one side of the micro-device and the second pad on one side of the array substrate to form a connection portion, which is beneficial to realizing the connection between the micro-device and the array substrate after the micro-device is transferred to the array substrate. At the same time, the telescopic structure located between the array substrate and the micro-device can also support the micro-device to prevent the micro-device from cracking, so as to more firmly bond the micro-device to the array substrate.

[0010] Of course, any product implementing the present invention does not necessarily need to achieve all the above-mentioned technical effects simultaneously.

[0011] Through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear. Description of the Drawings

[0012] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0013] Figure 1 is a schematic structural diagram of a display panel provided by the present invention;

[0014] Figure 2 is a schematic structural diagram of another display panel provided by the present invention;

[0015] Figure 3 is a schematic structural diagram of yet another display panel provided by the present invention;

[0016] Figure 4 is a schematic structural diagram of yet another display panel provided by the present invention;

[0017] Figure 5 is a schematic structural diagram of yet another display panel provided by the present invention;

[0018] Figure 6 is a schematic plan view of yet another display panel provided by the present invention;

[0019] Figure 7 is a schematic plan view of yet another display panel provided by the present invention;

[0020] Figure 8 is a schematic plan view of yet another display panel provided by the present invention;

[0021] Figure 9 is a schematic plan view of yet another display panel provided by the present invention;

[0022] Figure 10 is a schematic plan view of yet another display panel provided by the present invention;

[0023] Figure 11 is a flowchart of a manufacturing method of a display panel provided by the present invention;

[0024] Figures 12 - 15 is a schematic diagram of the manufacturing process of the manufacturing method of the display panel provided by the present invention;

[0025] Figure 16 is a schematic structural diagram of yet another display panel provided by the present invention;

[0026] Figure 17 is a flowchart of a manufacturing method of a retractable structure in the display panel provided by the present invention;

[0027] Figure 18 is a schematic diagram of the manufacturing process of the manufacturing method of the retractable structure provided by the present invention;

[0028] Figure 19 is a flowchart of a transfer method for the micro-device provided by the present invention;

[0029] Figure 20 and Figure 21 is a schematic diagram of the transfer process of the micro-device provided by the present invention;

[0030] Figure 22 is a schematic plan view of a display device provided by the present invention. Detailed Embodiments

[0031] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0033] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be regarded as part of the specification.

[0034] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof in subsequent drawings is not required.

[0036] Figure 1 is a schematic structural diagram of a display panel provided by the present invention. Referring to Figure 1 , this embodiment provides a display panel, including: an array substrate 10 and at least one micro-device 20. The micro-device 20 is located on one side of the array substrate 10, and at least one connection portion 30 is connected between the array substrate 10 and the micro-device 20. Optionally, a first pad is provided on one side of the micro-device 20, a second pad is provided on one side of the array substrate 10, and the first pad and the second pad are connected to form the connection portion 30.

[0037] In some alternative embodiments, the micro-device 20 is a light-emitting element. Optionally, the micro-device 20 is a Micro LED or a Mini LED, but the present invention is not limited thereto. In other embodiments of the present invention, the micro-device 20 may also be other light-emitting elements, which will not be elaborated herein one by one.

[0038] The display panel further includes at least one telescopic structure 40. The telescopic structure 40 is located between the array substrate 10 and the micro-device 20, and the connecting portion 30 is also located between the array substrate 10 and the micro-device 20. Since the telescopic structure 40 and the connecting portion 30 do not overlap in the direction perpendicular to the plane where the array substrate 10 is located, the setting of the telescopic structure 40 between the array substrate 10 and the micro-device 20 does not affect the setting of the connecting portion 30.

[0039] When the micro-device 20 is transferred to one side of the array substrate 10, the micro-device 20 can be bonded to one side of the array substrate 10 through the telescopic structure 40. The telescopic structure 40 can be telescoped in the direction perpendicular to the plane where the array substrate 10 is located, that is, the telescopic structure 40 can be contracted in the direction perpendicular to the plane where the array substrate 10 is located, providing a force beneficial to the connection between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 to form the connecting portion 30, which is beneficial to realizing the connection between the micro-device 20 and the array substrate 10 after the micro-device 20 is transferred to the array substrate 10.

[0040] Meanwhile, the telescopic structure 40 located between the array substrate 10 and the micro-device 20 can also support the micro-device 20 to prevent the micro-device 20 from cracking, so as to more firmly bond the micro-device 20 to the array substrate 10.

[0041] Moreover, when it is found that the micro-device 20a is damaged, the telescopic structure 40 located between the micro-device 20a and the array substrate 10 can be extended in the direction perpendicular to the plane where the array substrate 10 is located. At this time, the telescopic structure 40 extended in the direction perpendicular to the plane where the array substrate 10 is located provides a force beneficial to the separation between the micro-device 20a and the array substrate 10, which is beneficial to realizing the separation between the micro-device 20a and the array substrate 10.

[0042] It should be noted that Figure 1 exemplarily shows that two micro-devices 20 are provided on one side of the array substrate 10. The present invention does not limit the number of micro-devices 20 provided on one side of the array substrate 10. Specifically, the number of micro-devices 20 provided on one side of the array substrate 10 can be set according to actual production needs.

[0043] In some alternative embodiments, the material of the telescopic structure 40 can be a photoactive material, a thermoactive material, or an electroactive material. Optionally, the material of the telescopic structure 40 is a photoactive material, and the telescopic structure 40 is telescoped by changing the wavelength of the light irradiating the telescopic structure 40. Exemplarily, the material of the telescopic structure 40 can include nano-scale rod-shaped molecular crystals with photo-mechanical response. Through in-situ crystallization or self-assembly, the nano-sized molecular crystals have specific orientation and distribution, so that the macroscopic film obtains good photo-induced deformation characteristics, such as significant contraction under weak 365 nm ultraviolet light irradiation. Of course, in other embodiments of the present invention, the material of the telescopic structure 40 can also be other photoactive materials, which are not elaborated herein one by one.

[0044] It should be noted that the material of the telescopic structure 40 in the present invention can also be a thermoactive material, and the telescopic structure 40 is telescoped by changing the temperature of the telescopic structure 40. The material of the telescopic structure 40 in the present invention can also be an electroactive material, and the telescopic structure 40 is telescoped by changing the voltage transmitted to the telescopic structure 40. Of course, the material of the telescopic structure 40 in the present invention can also be other telescopic materials, which are not elaborated herein one by one.

[0045] In some alternative embodiments, the telescopic structure is at least in contact with the array substrate, or the telescopic structure is at least in contact with the micro-device.

[0046] Reference Figure 1 , the telescopic structure 40 is in contact with the array substrate 10, and the telescopic structure 40 is in contact with the micro-device 20.

[0047] Figure 2 is a schematic structural diagram of another display panel provided by the present invention. Reference Figure 2 , the telescopic structure 40 is in contact with the array substrate 10.

[0048] Figure 3 is a schematic structural diagram of yet another display panel provided by the present invention. Reference Figure 3 , the telescopic structure 40 is in contact with the micro-device 20.

[0049] In some alternative embodiments, in a direction perpendicular to the plane of the array substrate, the height of the connecting portion is P1, and the height of the telescopic structure is H1, where H1 ≤ P1.

[0050] Continue to refer to Figure 1, in a direction perpendicular to the plane where the array substrate 10 is located, the height of the connecting portion 30 is P1, and the height of the telescopic structure 40 is H1. Among them, H1 = P1, that is, the telescopic structure 40 is located between the array substrate 10 and the micro-device 20, and the telescopic structure 40 is in contact with both the array substrate 10 and the micro-device 20. The telescopic structure 40 can also support the micro-device 20 to prevent the micro-device 20 from cracking, so as to more firmly bond the micro-device 20 to the array substrate 10.

[0051] Continue to refer to Figure 2 and Figure 3 , in a direction perpendicular to the plane where the array substrate 10 is located, the height of the connecting portion 30 is P1, and the height of the telescopic structure 40 is H1. Among them, H1 < P1, the telescopic structure 40 is in contact with the array substrate 10, or the telescopic structure 40 is in contact with the micro-device 20. In a direction perpendicular to the plane where the array substrate 10 is located, the height of the telescopic structure 40 after contraction in the direction perpendicular to the plane where the array substrate 10 is located is less than the height of the connecting portion 30, which is more conducive to realizing the connection between the micro-device 20 and the array substrate 10 after the micro-device 20 is transferred to the array substrate 10.

[0052] Exemplarily, when the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 are bonded by eutectic reaction to form the connecting portion 30, in a direction perpendicular to the plane where the array substrate 10 is located, the height of the telescopic structure 40 after contraction in the direction perpendicular to the plane where the array substrate 10 is located is less than the height of the connecting portion 30, which is beneficial to realizing the complete eutectic reaction between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10. Of course, this embodiment only exemplarily shows a connection method for the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 to form the connecting portion 30. In other embodiments of the present invention, the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 may also adopt other connection methods to form the connecting portion 30. For example, the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 can be bonded to form the connecting portion 30, etc. The present invention will not elaborate here one by one.

[0053] Figure 4 is a schematic structural diagram of another display panel provided by the present invention. Refer to Figure 4, before the first pad 31 on one side of the micro-device 20 and the second pad 32 on one side of the array substrate 10 are bonded to form a connection part 30 through an eutectic reaction, in a direction perpendicular to the plane where the array substrate 10 is located, the first pad 31 includes a first metal layer 311, a second metal layer 312, and a third metal layer 313 arranged in sequence. The second metal layer 312 is located on the side of the first metal layer 311 close to the second pad 32, and the third metal layer 313 is located on the side of the second metal layer 312 close to the second pad 32. The second pad 32 includes a fourth metal layer 321, a fifth metal layer 322, and a sixth metal layer 323 arranged in sequence. The fifth metal layer 322 is located on the side of the fourth metal layer 321 close to the first pad 31, and the sixth metal layer 323 is located on the side of the fifth metal layer 322 close to the first pad 31. Exemplarily, the first metal layer 311 in the first pad 31 is a chromium layer, the second metal layer 312 is a platinum layer, and the third metal layer 313 is a gold layer. The fourth metal layer 321 in the second pad 32 is a titanium layer, the fifth metal layer 322 is a platinum layer, and the sixth metal layer 323 is an indium layer. The third metal layer 313 and the sixth metal layer 323 are arranged opposite to each other, and the third metal layer 313 and the sixth metal layer 323 can undergo an eutectic reaction, so that the first pad 31 and the second pad 32 are bonded to form a connection part.

[0054] Of course, this embodiment only exemplarily shows a structure of the first pad 31 on one side of the micro-device 20 and the second pad 32 on one side of the array substrate 10. In other embodiments of the present invention, the first pad 31 on one side of the micro-device 20 and the second pad 32 on one side of the array substrate 10 may also have other structures. The first pad 31 and the second pad 32 can be bonded to form a connection part through eutectic bonding, or can be connected to form a connection part by other means, which will not be elaborated one by one in the present invention.

[0055] Figure 5 is a schematic structural diagram of another display panel provided by the present invention. Refer to Figure 5 , in some alternative embodiments, the array substrate 10 includes a substrate 11, a circuit layer 12, and an organic layer 13. The circuit layer 12 is located on one side of the substrate 11. The circuit layer 12 includes structures such as thin-film transistors T. The organic layer 13 is located on the side of the circuit layer 12 away from the substrate 11, and the organic layer 13 can play a role in protecting the circuit layer 12.

[0056] The connecting portion 30 is located on the side of the circuit layer 12 away from the substrate 11, and the connecting portion 30 is electrically connected to the circuit layer 12 and the micro-device 20, so as to realize the electrical connection between the circuit layer 12 and the micro-device 20. Optionally, two connecting portions 30 are connected to one side of the micro-device 20, and the two connecting portions 30 are electrically connected to different signal lines in the circuit layer 12. An inorganic layer 21 is provided on the side of the micro-device 12 close to the array substrate 10, and the inorganic layer 21 can protect the micro-device 20. The telescopic structure 40 is located between the inorganic layer 21 and the organic layer 13 to prevent the telescopic structure 40 from damaging the circuit layer 12 and the micro-device 20.

[0057] Figure 6 is a schematic plan view of another display panel provided by the present invention. Refer to Figure 6 , in some alternative embodiments, two connecting portions 30 arranged along the first direction X are connected between at least one micro-device 20 and the array substrate 10, and the micro-device 20 is electrically connected to the array substrate 10 through the two connecting portions 30.

[0058] The telescopic structure 40 includes at least one first sub-portion 41. Optionally, the first sub-portion 41 can be a strip structure, a columnar structure or other structures.

[0059] One first sub-portion 41 is provided between the two connecting portions 30 connected to the same micro-device 20. The first sub-portion 41 effectively isolates the two connecting portions 30 connected to the same micro-device 20, preventing the two connecting portions 30 connected to the same micro-device 20 from deforming and overflowing to contact each other when the display panel is pressed, thereby avoiding a short circuit between the two connecting portions 30 connected to the same micro-device 20.

[0060] Optionally, the first sub-portion 41 is centrally disposed between the two connecting portions 30, that is, along the first direction X, the distances between the first sub-portion 41 and the two connecting portions 30 are equal. The forces provided to the two connecting portions 30 that are beneficial for forming the connecting portion 30 are equal, making the connection conditions of the two connecting portions 30 tend to be the same.

[0061] It should be noted that Figure 6 in order to clearly show the connecting portion 30 and the telescopic structure 40, therefore Figure 6 the micro-device 20 is not filled in. The corresponding illustration method is also applicable in other embodiments of the present invention, and the present invention will not elaborate one by one.

[0062] Figure 7 is a schematic plan view of another display panel provided by the present invention. Refer to Figure 7, in some alternative embodiments, along the first direction X, on each side of two connecting portions 30 connected to the same micro-device 20 away from each other, a first sub-portion 41 is provided, thereby increasing the setting area of the telescopic structure 40, and thus increasing the force conducive to the connection between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 to form the connecting portion 30, which is conducive to realizing the connection between the micro-device 20 and the array substrate 10 after the micro-device 20 is transferred to the array substrate 10.

[0063] Optionally, along the first direction X, the distances between the connecting portion 30 and two adjacent first sub-portions 41 are equal.

[0064] Figure 8 is a schematic plan view of another display panel provided by the present invention. Refer to Figure 8 , in some alternative embodiments, the telescopic structure 40 further includes at least one second sub-portion 42.

[0065] Along the second direction Y, at least one side of the connecting portion 30 is provided with a second sub-portion 42, wherein the first direction X and the second direction Y intersect. Optionally, the first direction X and the second direction Y are perpendicular to each other.

[0066] The first sub-portion 41 and the second sub-portion 42 are connected to form a cross-shaped structure, so that the telescopic structure 40 is partially disposed around the connecting portion 30, thereby increasing the setting area of the telescopic structure 40, and thus increasing the force conducive to the connection between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 to form the connecting portion 30, which is conducive to realizing the connection between the micro-device 20 and the array substrate 10 after the micro-device 20 is transferred to the array substrate 10. Optionally, in other embodiments of the present invention, the first sub-portion 41 and the second sub-portion 42 may also be connected to form a T-shaped structure or other structures, which will not be elaborated herein one by one.

[0067] Figure 9 is a schematic plan view of another display panel provided by the present invention. Refer to Figure 9 , in some alternative embodiments, the telescopic structure 40 surrounds the micro-device 20.

[0068] Figure 10 is a schematic plan view of another display panel provided by the present invention. Refer to Figure 10 , the telescopic structure 40 surrounds the connecting portion 30.

[0069] When the retractable structure 40 surrounds the micro-device 20 or the connection part 30, the set area of the retractable structure 40 is relatively large. When the retractable structure 40 contracts in the direction perpendicular to the plane where the array substrate 10 is located, the force provided to facilitate the connection between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 to form the connection part 30 is relatively large, which is beneficial to improving the connection effect after the micro-device 20 is transferred to the array substrate 10. And when the retractable structure 40 surrounds the micro-device 20 or the connection part 30, when the retractable structure 40 contracts in the direction perpendicular to the plane where the array substrate 10 is located, the force provided by the retractable structure 40 to each area of the micro-device 20 is relatively uniform, so that the forces on the micro-device 20 during removal and pressing are relatively uniform, avoiding the micro-device 20 from tilting and affecting the light-emitting effect of the micro-device 20.

[0070] It should be noted that Figures 6 - 10 Several structures of the retractable structure 40 are exemplarily shown. In other embodiments of the present invention, the retractable structure 40 can also adopt other structures according to actual production requirements, as long as it satisfies that in the direction perpendicular to the plane where the array substrate 10 is located, the retractable structure 40 does not overlap with the connection part 30. The present invention will not elaborate here.

[0071] Figure 11 is a flowchart of a manufacturing method of a display panel provided by the present invention, Figures 12 - 15 is a schematic diagram of the manufacturing process of the manufacturing method of the display panel provided by the present invention. Refer to Figures 11 - 15 , this embodiment provides a manufacturing method of a display panel, including:

[0072] S1. Provide a carrier substrate, on one side of which a plurality of micro-devices are arranged in an array, and a first pad is provided on the side of the micro-device away from the carrier substrate.

[0073] Refer to Figure 12 , on one side of the carrier substrate 50, a plurality of micro-devices 20 are provided, and a first pad 31 is provided on the side of the micro-device 20 away from the carrier substrate 50. It should be noted that Figure 12 exemplarily shows that two micro-devices 20 are provided on one side of the carrier substrate 50. In other embodiments of the present invention, other numbers of micro-devices 20 can be provided on one side of the carrier substrate 50, and the micro-devices 20 are arranged in an array. The present invention will not elaborate one by one here.

[0074] S2. Provide an array substrate, on one side of which a plurality of second pads are arranged in an array.

[0075] Refer to Figure 13 , on one side of the array substrate 10, a plurality of second pads 32 are provided.

[0076] S3. Provide a telescopic structure on the side of the micro-device away from the carrier substrate.

[0077] Reference Figure 14 , a telescopic structure 40 is provided on the side of the micro-device 20 away from the carrier substrate 50. It should be noted that this embodiment only exemplarily shows that a telescopic structure is provided on the side of the micro-device away from the carrier substrate. In other embodiments of the present invention, a telescopic structure may also be provided on the side of the array substrate where the second pad is provided, and the present invention will not elaborate further herein.

[0078] S4. Transfer at least one micro-device to the array substrate, align a first pad with a second pad, bond the telescopic structure between the array substrate and the micro-device, and in the direction perpendicular to the plane of the array substrate, the telescopic structure does not overlap with the first pad and the second pad.

[0079] Reference Figure 15 , transfer the micro-device 20 to the array substrate 10, align a first pad 31 with a second pad 32, bond the telescopic structure 40 between the array substrate 10 and the micro-device 20, and the micro-device 20 can be bonded to the side of the array substrate 10 where the second pad 32 is provided through the telescopic structure 40. In the direction perpendicular to the plane of the array substrate 10, the telescopic structure 40 does not overlap with the first pad 31 and the second pad 32, and the setting of the telescopic structure 40 does not affect the alignment of the first pad 31 and the second pad 32.

[0080] The laser transfer technology has high transfer efficiency, the theoretical transfer efficiency can be greater than 100 million pieces per hour, can achieve selective transfer, has high potential for large-scale mass production, and can correspond to micro-devices of different sizes. Therefore, in some alternative embodiments, the laser transfer technology can be used to transfer the micro-devices located on the carrier substrate to the array substrate. Of course, in other embodiments of the present invention, other transfer technologies can also be used to transfer the micro-devices located on the carrier substrate to the array substrate, and the present invention will not elaborate one by one herein.

[0081] S5. The telescopic structure contracts in the direction perpendicular to the plane of the array substrate, and the first pad and the second pad form a connection part.

[0082] Reference Figure 1 , the telescopic structure 40 expands and contracts in the direction perpendicular to the plane of the array substrate 10, and at the same time the first pad and the second pad are connected to form a connection part 30, that is, the telescopic structure 40 can contract in the direction perpendicular to the plane of the array substrate 10 to provide a force conducive to the connection of the first pad on the side of the micro-device 20 and the second pad on the side of the array substrate 10 to form a connection part 30, which is conducive to realizing the connection of the micro-device 20 to the array substrate 10 after being transferred to the array substrate 10.

[0083] Meanwhile, the telescopic structure 40 located between the array substrate 10 and the micro-device 20 can also support the micro-device 20 to prevent the micro-device 20 from cracking, so as to more firmly bond the micro-device 20 to the array substrate 10.

[0084] Continue to refer to Figure 15 , in some alternative embodiments, before the telescopic structure 40 contracts in the direction perpendicular to the plane of the array substrate 10, in the direction perpendicular to the plane of the array substrate 10, the height of the telescopic structure 40 is H2, the height of the first pad 31 is P2, and the height of the second pad 32 is P3, and P2 + P3 ≤ H2. Thus, when the micro-device 20 is transferred to the array substrate 10, the telescopic structure 40 can be bonded between the array substrate 10 and the micro-device 20, and the micro-device 20 can be bonded to the side of the array substrate 10 provided with the second pad 32 through the telescopic structure 40.

[0085] In some alternative embodiments, after the telescopic structure contracts in the direction perpendicular to the plane of the array substrate, in the direction perpendicular to the plane of the array substrate, the height of the telescopic structure is H1, and the height of the connecting portion is P1; wherein, H1 ≤ P1.

[0086] Continue to refer to Figure 1 , after the telescopic structure 40 contracts in the direction perpendicular to the plane of the array substrate 10, in the direction perpendicular to the plane of the array substrate 10, the height of the connecting portion 30 is P1, and the height of the telescopic structure 40 is H1, wherein, H1 = P1, that is, the telescopic structure 40 is located between the array substrate 10 and the micro-device 20, and the telescopic structure 40 is in contact with both the array substrate 10 and the micro-device 20. The telescopic structure 40 can also support the micro-device 20 to prevent the micro-device 20 from cracking, so as to more firmly bond the micro-device 20 to the array substrate 10.

[0087] Continue to refer to Figure 2 and Figure 3 , after the telescopic structure 40 contracts in the direction perpendicular to the plane of the array substrate 10, in the direction perpendicular to the plane of the array substrate 10, the height of the connecting portion 30 is P1, and the height of the telescopic structure 40 is H1, wherein, H1 < P1. The telescopic structure 40 is in contact with the array substrate 10, or the telescopic structure 40 is in contact with the micro-device 20. In the direction perpendicular to the plane of the array substrate 10, the height of the telescopic structure 40 after contracting in the direction perpendicular to the plane of the array substrate 10 is less than the height of the connecting portion 30, which is more conducive to realizing the connection between the micro-device 20 and the array substrate 10 after the micro-device 20 is transferred to the array substrate 10.

[0088] In some alternative embodiments, when the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 are bonded through a eutectic reaction to form a connection portion 30, in a direction perpendicular to the plane of the array substrate 10, the height of the connection portion 30 is less than the sum of the heights of the first pad and the second pad. At this time, in a direction perpendicular to the plane of the array substrate 10, the height of the retractable structure 40 after contracting in a direction perpendicular to the plane of the array substrate 10 is less than the height of the connection portion 30, which is conducive to the complete eutectic reaction between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10. Of course, this embodiment only exemplarily shows a connection method for forming the connection portion 30 between the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10. In other embodiments of the present invention, the first pad on one side of the micro-device 20 and the second pad on one side of the array substrate 10 may also adopt other connection methods to form the connection portion 30, which will not be elaborated herein one by one.

[0089] In some alternative embodiments, after the first pad and the second pad form a connection portion, the micro-devices transferred onto the array substrate are detected. After detecting damaged micro-devices, the retractable structure between the damaged micro-devices and the array substrate can be extended in a direction perpendicular to the plane of the array substrate, so that the damaged micro-devices and the array substrate are separated.

[0090] Specifically, referring to Figure 16 , Figure 16 is a schematic structural diagram of another display panel provided by the present invention. After detecting that the micro-device 20a is damaged, the retractable structure 40 between the micro-device 20a and the array substrate 10 can be extended in a direction perpendicular to the plane of the array substrate 10. At this time, the retractable structure 40 extended in a direction perpendicular to the plane of the array substrate 10 provides a force conducive to the separation of the micro-device 20a and the array substrate 10, which is conducive to the separation of the micro-device 20a and the array substrate 10.

[0091] Continuing to refer to Figure 16 , in some alternative embodiments, after the retractable structure 40 between the damaged micro-device 20a and the array substrate 10 is extended in a direction perpendicular to the plane of the array substrate 10, in a direction perpendicular to the plane of the array substrate 10, the height of the retractable structure 40 between the damaged micro-device 20a and the array substrate 10 is H4, and the height of the connection portion 30 is P1, where P1 < H4. Thus, the retractable structure 40 will provide a force conducive to the separation of the micro-device 20a and the array substrate 10 when extended in a direction perpendicular to the plane of the array substrate 10, so that the micro-device 20a and the array substrate 10 are separated.

[0092] Figure 17 It is a flowchart of a manufacturing method of a retractable structure in the display panel provided by the present invention. Figure 18 It is a schematic diagram of the manufacturing process of the retractable structure manufacturing method provided by the present invention. Refer to Figure 17 and Figure 18 , in some alternative embodiments, S3. A retractable structure is provided on the side of the micro-device away from the carrier substrate, including:

[0093] S31. A retractable material is coated on the side of the carrier substrate where the micro-device is provided to form a retractable layer, and the retractable layer covers the micro-device.

[0094] Refer to Figure 18 , a retractable material is coated on the side of the carrier substrate 50 where the micro-device 20 is provided to form a retractable layer 41, and the retractable layer 41 covers the micro-device 20.

[0095] S32. The retractable layer is patterned to form a retractable structure.

[0096] Refer to Figure 14 , the retractable layer is patterned to form a retractable structure, so as to realize the setting of the retractable structure 40 on the side of the micro-device 20 away from the carrier substrate 50.

[0097] It should be noted that when the retractable structure is provided on the side of the array substrate where the second pad is provided, the manufacturing method of the retractable structure in the above embodiment can be referred to, and the present invention will not be elaborated herein.

[0098] Figure 19 It is a flowchart of a transfer method of the micro-device provided by the present invention. Figure 20 and Figure 21 It is a schematic diagram of the transfer process of the micro-device provided by the present invention. Refer to Figures 19 - 21 , in some alternative embodiments, the method of transferring the micro-device to the carrier substrate includes:

[0099] S11. Provide a growth substrate, on one side of which a plurality of micro-devices are arranged in an array, and the first pad is located on the side of the micro-device away from the growth substrate.

[0100] S12. Provide a transfer substrate, on one side of which a first transfer layer is provided.

[0101] S13. Transfer the micro-devices on the growth substrate to the transfer substrate, and the side of the first pad away from the micro-device is attached to the side of the first transfer layer away from the transfer substrate.

[0102] Refer to Figure 20, a plurality of micro-devices 20 are grown on a growth substrate 60. A first pad 31 is located on the side of the micro-device 20 away from the growth substrate 60. The micro-devices 20 on the growth substrate 60 are transferred to a transfer substrate 70. A first transfer layer 71 is provided on one side of the transfer substrate 70. Thus, the side of the first pad 31 away from the micro-device 20 adheres to the side of the first transfer layer 71 away from the transfer substrate 70, thereby realizing the transfer of the micro-device 20 to the transfer substrate 70, and the first pad 31 is located on the side of the micro-device 20 close to the transfer substrate 70.

[0103] S14. Provide a carrier substrate, and a second transfer layer is provided on one side of the carrier substrate.

[0104] S15. Transfer the micro-devices on the transfer substrate to the carrier substrate, and the side of the micro-device away from the first pad adheres to the side of the second transfer layer away from the carrier substrate.

[0105] S16. Clean the residues on the first pad.

[0106] Reference Figure 21 , transfer the micro-devices 20 on the transfer substrate 70 to the carrier substrate 50. The side of the micro-device 20 away from the first pad 31 adheres to the side of the second transfer layer 51 away from the carrier substrate 50, thereby realizing the transfer of the micro-device 20 to the carrier substrate 50, and the first pad 31 is located on the side of the micro-device 20 away from the carrier substrate 50.

[0107] In some alternative embodiments, please refer to Figure 22 , Figure 22 is a schematic plan view of a display device provided by the present invention. The display device 1000 provided in this embodiment includes the display panel provided in the above embodiment of the present invention. Figure 22 The embodiment only takes a mobile phone as an example to illustrate the display device 1000. It can be understood that the display device 1000 provided in the embodiment of the present invention can also be other display devices 1000 with a display function such as a computer, a television, a vehicle-mounted display device, etc. The present invention does not make specific limitations thereto. The display device 1000 provided in the embodiment of the present invention has the beneficial effects of the display panel provided in the embodiment of the present invention. Specifically, reference can be made to the specific descriptions of the display panel in the above embodiments, and this embodiment will not be elaborated herein.

[0108] As can be seen from the above embodiments, the display panel, its manufacturing method, and the display device provided by the present invention at least achieve the following beneficial effects:

[0109] The display panel provided by the present invention includes at least one telescopic structure. The telescopic structure is located between the array substrate and the micro-device, and the connecting portion is also located between the array substrate and the micro-device. Since the telescopic structure and the connecting portion do not overlap in the direction perpendicular to the plane where the array substrate is located, the setting of the telescopic structure between the array substrate and the micro-device does not affect the setting of the connecting portion. When the micro-device is transferred to one side of the array substrate, the micro-device can be bonded to one side of the array substrate through the telescopic structure. The telescopic structure can be telescoped in the direction perpendicular to the plane where the array substrate is located, that is, it can be contracted in the direction perpendicular to the plane where the array substrate is located, providing a force beneficial to the connection between the first pad on one side of the micro-device and the second pad on one side of the array substrate to form a connecting portion, which is beneficial to realizing the connection between the micro-device and the array substrate after the micro-device is transferred to the array substrate. At the same time, the telescopic structure located between the array substrate and the micro-device can also support the micro-device to prevent the micro-device from cracking, so as to more firmly bond the micro-device to the array substrate.

[0110] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, Including: Providing a carrier substrate, on one side of which a plurality of micro-devices are arranged in an array, and on the side of the micro-device away from the carrier substrate, a first pad is provided; Providing an array substrate, on one side of which a plurality of second pads are arranged in an array; Providing a telescopic structure on the side of the micro-device away from the carrier substrate, or providing a telescopic structure on the side of the array substrate where the second pads are provided; Transferring at least one of the micro-devices to the array substrate, aligning one of the first pads with one of the second pads, bonding the telescopic structure between the array substrate and the micro-device, and in a direction perpendicular to the plane of the array substrate, the telescopic structure does not overlap with the first pad and the second pad; The telescopic structure contracts in a direction perpendicular to the plane of the array substrate, and the first pad and the second pad form a connection part.

2. The method for manufacturing a display panel according to claim 1, wherein Before the telescopic structure contracts in a direction perpendicular to the plane of the array substrate, in a direction perpendicular to the plane of the array substrate, the height of the telescopic structure is H2, the height of the first pad is P2, the height of the second pad is P3, and P2 + P3 ≤ H2.

3. The method for manufacturing a display panel according to claim 1, wherein After the telescopic structure contracts in a direction perpendicular to the plane of the array substrate, in a direction perpendicular to the plane of the array substrate, the height of the telescopic structure is H1, and the height of the connection part is P1; Wherein, H1 ≤ P1.

4. The method for manufacturing a display panel according to claim 1, wherein After the first pad and the second pad form the connection part, detecting the micro-device transferred to the array substrate; The telescopic structure between the damaged micro-device and the array substrate extends in a direction perpendicular to the plane of the array substrate, so that the damaged micro-device is separated from the array substrate.

5. The method for manufacturing a display panel according to claim 4, wherein After the telescopic structure between the damaged micro-device and the array substrate extends in a direction perpendicular to the plane of the array substrate, in a direction perpendicular to the plane of the array substrate, the height of the telescopic structure between the damaged micro-device and the array substrate is H4, and the height of the connection part is P1, wherein P1 < H4.

6. The method for manufacturing a display panel according to claim 1, wherein Transferring the micro-device located on the carrier substrate to the array substrate by laser transfer.

7. The method for manufacturing a display panel according to claim 1, wherein Providing the telescopic structure on the side of the micro-device away from the carrier substrate includes: On one side of the carrier substrate where the micro-devices are provided, a stretchable material is coated to form a stretchable layer, and the stretchable layer covers the micro-devices; The stretchable layer is patterned to form the stretchable structure.

8. The method for manufacturing a display panel according to claim 1, wherein: A growth substrate is provided, and a plurality of the micro-devices arranged in an array are grown on one side of the growth substrate, and the first pad is located on the side of the micro-devices away from the growth substrate; A transfer substrate is provided, and a first transfer layer is provided on one side of the transfer substrate; The micro-devices on the growth substrate are transferred to the transfer substrate, and the side of the first pad away from the micro-devices is attached to the side of the first transfer layer away from the transfer substrate; The carrier substrate is provided, and a second transfer layer is provided on one side of the carrier substrate; The micro-devices on the transfer substrate are transferred to the carrier substrate, and the side of the micro-devices away from the first pad is attached to the side of the second transfer layer away from the carrier substrate; The residues on the first pad are cleaned.

9. A display panel, characterized in that, Manufactured by the method for manufacturing a display panel according to any one of claims 1-8, including: An array substrate; At least one micro-device, the micro-device is located on one side of the array substrate, and at least one connecting portion is connected between the array substrate and the micro-device; At least one stretchable structure, the stretchable structure is located between the array substrate and the micro-device, and in a direction perpendicular to the plane where the array substrate is located, the stretchable structure does not overlap with the connecting portion; The stretchable structure can stretch in a direction perpendicular to the plane where the array substrate is located.

10. The display panel according to claim 9, wherein: The stretchable structure is at least in contact with the array substrate, or the stretchable structure is at least in contact with the micro-device.

11. The display panel according to claim 10, wherein: In a direction perpendicular to the plane where the array substrate is located, the height of the connecting portion is P1, and the height of the stretchable structure is H1, wherein H1≤P1.

12. The display panel according to claim 9, wherein: The material of the stretchable structure is a photo-induced stretchable material, a thermo-induced stretchable material or an electro-induced stretchable material.

13. The display panel according to claim 12, wherein: The material of the stretchable structure is a photo-induced stretchable material, and the stretchable structure is stretched by changing the wavelength of the light irradiated on the stretchable structure.

14. The display panel according to claim 9, wherein: The micro-device is a light-emitting element.

15. The display panel according to claim 9, wherein: The array substrate includes a substrate, a circuit layer and an organic layer, the circuit layer is located on one side of the substrate, and the organic layer is located on the side of the circuit layer away from the substrate; The connecting portion is located on a side of the circuit layer away from the substrate, and the connecting portion is electrically connected to the circuit layer and the micro-device; an inorganic layer is provided on a side of the micro-device close to the array substrate, and the telescopic structure is located between the inorganic layer and the organic layer.

16. The display panel according to claim 9, wherein two of the connecting portions arranged along a first direction are connected between at least one of the micro-devices and the array substrate; the telescopic structure includes at least one first sub-portion; one of the first sub-portions is provided between two of the connecting portions connected to the same micro-device.

17. The display panel according to claim 16, wherein one of the first sub-portions is provided on a side of each of two of the connecting portions connected to the same micro-device away from each other along the first direction.

18. The display panel according to claim 16, wherein the telescopic structure further includes at least one second sub-portion; one of the second sub-portions is provided on at least one side of the connecting portion along a second direction, wherein the first direction and the second direction intersect; the first sub-portion and the second sub-portion are connected to form a T-shaped structure or an I-shaped structure.

19. The display panel according to claim 9, wherein the telescopic structure surrounds the micro-device or the connecting portion.

20. A display device, characterized in that, The display device includes the display panel according to any one of claims 9-19.

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