A display substrate, a manufacturing method thereof, and a display device

Abstract

The present disclosure provides a display substrate, a manufacturing method thereof, and a display device. The display substrate includes a substrate and a driving circuit layer located on the substrate. The display substrate has a display area and a fan-out area, and a crack arrest groove is provided on the driving circuit layer, and the crack arrest groove is located between the display area and the fan-out area. In the embodiment of the present disclosure, by providing the crack arrest groove between the display area and the fan-out area, in the case where a crack appears in the structure of the display area of the display substrate, through the isolation effect of the crack arrest groove, it is possible to prevent the crack from extending to the fan-out area, thereby reducing the possibility of damage to the structure of the fan-out area of the display panel, and contributing to improving the reliability of the display panel.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display substrate, a manufacturing method thereof, and a display device. Background Art

[0002] With the development of display technologies, the technology of OLED (organic light-emitting diode) display panels has become increasingly perfect. In related technologies, the screen-to-body ratio of a display device is usually increased based on the Pading Bending technology. Pading Bending refers to bending the Fanout area (fan-out area) where the pixel lead-out wire is externally connected to the circuit to the back of the display panel and connecting it to the bonding structure. However, due to material limitations of structures such as the substrate of the display substrate, cracks may occur in the structure during the bending process of the display panel, affecting the performance of the display panel. Summary of the Invention

[0003] Embodiments of the present disclosure provide a display substrate, a manufacturing method thereof, and a display device to solve the problem that cracks may occur in the structure during the bending process of the display panel.

[0004] In a first aspect, embodiments of the present disclosure provide a display substrate, including a substrate, and a driving circuit layer located on the substrate. The display substrate has a display area and a fan-out area, and a crack-stop groove is provided on the driving circuit layer, and the crack-stop groove is located between the display area and the fan-out area.

[0005] In some embodiments, the driving circuit layer includes an insulating layer, a signal line, a protective layer, and a planarization layer that are sequentially stacked in a direction away from the substrate, and at least a part of the crack-stop groove is located in the planarization layer.

[0006] In some embodiments, in a direction perpendicular to the substrate, the crack-stop groove penetrates through the planarization layer.

[0007] In some embodiments, the planarization layer includes a first planarization sub-layer and a second planarization sub-layer that are sequentially stacked in a direction away from the substrate. In a direction perpendicular to the substrate, the crack-stop groove penetrates through the first planarization layer and the second planarization layer.

[0008] In some embodiments, at least a part of the crack-stop groove is located in the protective layer.

[0009] In some embodiments, in a direction perpendicular to the substrate, the depth of the part of the crack-stop groove located in the protective layer is less than the thickness of the protective layer.

[0010] In some embodiments, in a direction perpendicular to the substrate, the depth of the part of the crack-stop groove located in the planarization layer is less than the thickness of the planarization layer.

[0011] In some embodiments, the flat layer includes a first flat sub-layer and a second flat sub-layer that are sequentially stacked in a direction away from the substrate, and the crack stop groove penetrates the second flat sub-layer in a direction perpendicular to the substrate.

[0012] In some embodiments, in a direction perpendicular to the substrate, the depth of the part of the crack stop groove located in the flat layer is equal to the thickness of the second flat sub-layer.

[0013] In some embodiments, in a direction perpendicular to the substrate, the depth of the part of the crack stop groove located in the flat layer is greater than the thickness of the second flat sub-layer.

[0014] In some embodiments, in a direction parallel to the substrate, the extending direction of the crack stop groove is parallel to the boundary between the display area and the fan-out area.

[0015] In a second aspect, an embodiment of the present disclosure provides a display device, including the display substrate according to any one of the first aspect.

[0016] In a third aspect, an embodiment of the present disclosure provides a method for manufacturing a display substrate, including:

[0017] Providing a substrate;

[0018] Fabricating a driving circuit layer on the substrate;

[0019] Opening a crack stop groove on the driving circuit layer, wherein the display substrate has a display area and a fan-out area, and the crack stop groove is located between the display area and the fan-out area.

[0020] By providing a crack stop groove located between the display area and the fan-out area, in the case where a crack appears in the structure of the display area of the display substrate, through the isolation effect of the crack stop groove, the crack can be prevented from extending to the fan-out area, thereby reducing the possibility of damage to the structure of the fan-out area of the display panel and helping to improve the reliability of the display panel. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings required for the description of the embodiments of the present disclosure. Obviously, the following drawings are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a structural diagram of a display substrate provided by an embodiment of the present disclosure;

[0023] Figure 2 It is a flowchart of a method for manufacturing a display substrate provided by an embodiment of the present disclosure;

[0024] Figure 3 It is another structural diagram of a display substrate provided by an embodiment of the present disclosure;

[0025] Figure 4 It is another structural diagram of a display substrate provided by an embodiment of the present disclosure;

[0026] Figure 5 It is another structural diagram of a display substrate provided by an embodiment of the present disclosure;

[0027] Figure 6 It is another structural diagram of a display substrate provided by an embodiment of the present disclosure. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0029] The present disclosure provides a display substrate.

[0030] As Figure 1 shown, in one embodiment, the display substrate includes a substrate and a driving circuit layer located on the substrate.

[0031] The technical solution of this embodiment can be applied to an OLED display substrate, especially a display substrate designed based on the Pad bending method.

[0032] The display substrate designed based on Pad bending has an active area (AA area) 101 and a fanout area 102. Various signal lines led out from the display substrate are bent to the back of the display substrate in the fanout area 102, thereby realizing a narrow bezel design and improving the screen-to-body ratio of the display substrate and the display panel applying the display substrate.

[0033] In the process of implementing the technical solution of the present application, the inventors of the present application found that due to the limitations of materials such as the substrate of the display substrate, there is a minimum bending radius in the fan-out region 102 of the display substrate. Obviously, the smaller the bending radius, the smaller the border size of the display substrate, but it will lead to a certain degree of mechanical unreliability. For example, cracks may be generated due to local stress concentration, and these cracks may further extend and spread. If the cracks extend to the fan-out region 102, it may affect the connection effect and cause abnormal display states such as bright lines on the display panel.

[0034] Please continue to refer to Figure 1 , in the embodiments of the present disclosure, a crack arrest groove 103 is further provided on the driving circuit layer, and the crack arrest groove 103 is located between the display region 101 and the fan-out region 102.

[0035] By providing the crack arrest groove 103, when a crack is generated in the structure on the driving circuit layer and extends to the crack arrest groove 103, due to the existence of the crack arrest groove 103, the stress can be released, so that the crack cannot cross the crack arrest groove 103 and extend to the fan-out region 102, ensuring the integrity and reliability of the structure of the fan-out region 102. During implementation, the border size of the display substrate can be further appropriately reduced, thereby further increasing the screen-to-body ratio of the display substrate.

[0036] In this way, in the embodiments of the present disclosure, by providing the crack arrest groove 103 located between the display region 101 and the fan-out region 102, in the case where a crack appears in the structure of the display region 101 of the display substrate, through the isolation effect of the crack arrest groove 103, the crack can be prevented from extending to the fan-out region 102, thereby reducing the possibility of damage to the structure of the fan-out region 102 of the display panel and helping to improve the reliability of the display panel.

[0037] The embodiments of the present disclosure also provide a method for manufacturing a display substrate.

[0038] In one embodiment, the method for manufacturing the display substrate includes the following steps:

[0039] Step 201: Provide a substrate.

[0040] Step 202: Fabricate a driving circuit layer on the substrate.

[0041] Step 203: Open a crack arrest groove on the driving circuit layer, wherein the display substrate has a display region and a fan-out region, and the crack arrest groove is located between the display region and the fan-out region.

[0042] In the technical solution of this embodiment, the steps of the substrate and fabricating the driving circuit layer can refer to related technologies to a certain extent. Further, a crack arrest groove is opened on the driving circuit layer.

[0043] It should be understood that the above step 203 can be specifically carried out after the entire driving circuit layer is fabricated, or can be interspersed during the fabrication of the driving circuit layer. For example, first fabricate some structures of the driving circuit layer, then form crack stopping grooves on the fabricated structures, and further continue to fabricate other structures of the driving circuit layer.

[0044] Since this embodiment can fabricate the display substrate in the above display substrate embodiment, it can at least achieve basically the same or similar technical effects, which will not be elaborated here. In some embodiments, the crack stopping grooves penetrate the planarization layer in a direction perpendicular to the substrate.

[0045] In some embodiments, the driving circuit layer includes an insulating layer, signal lines, a protective layer, and a planarization layer that are sequentially stacked in a direction away from the substrate, and at least a part of the crack stopping grooves is located in the planarization layer.

[0046] In the technical solution of this embodiment, at least a part of the crack stopping grooves is located in the planarization layer, that is to say, the crack stopping grooves may only be formed in the planarization layer, and a part of the crack stopping grooves may also extend to other structures, such as extending to the above-mentioned protective layer.

[0047] As Figure 3 shown, in this embodiment, during the fabrication process, first fabricate the prior film layer on the substrate 301, such as the barrier layer 302, the buffer layer 303, the gate metal layer (not shown in the figure), the gate insulating layers 304a, 304b, the source-drain metal layer, the insulating layer 305, the signal lines 306, and the protective layer 307, etc. Among them, the protective layer 306 is used to protect the signal lines 306, the insulating layer 305 is used to provide an insulating environment for the signal lines 306, and the material of the protective layer 306 is usually selected as an inorganic material.

[0048] After the protective layer 306 is fabricated, further fabricate the planarization layer 308.

[0049] During the fabrication of the planarization layer 308, first deposit the material of the planarization layer 308, and then complete the fabrication of the pattern of the planarization layer 308 through processes such as exposure, curing, and slag removal.

[0050] During the process of forming the pattern of the planarization layer 308, remove the material in the area corresponding to the crack stopping grooves 309 to form the crack stopping grooves 309.

[0051] In some embodiments, the planarization layer 308 includes a first planarization sub-layer 3081 and a second planarization sub-layer 3082 that are sequentially stacked in a direction away from the substrate 301, and the crack stopping grooves 309 penetrate the first planarization sub-layer 3081 and the second planarization sub-layer 3082 in a direction perpendicular to the substrate 301.

[0052] In this embodiment, the first planar sub-layer 3081 and the second planar sub-layer 3082 are stacked. Further, the source-drain metal layer of the display substrate includes a first source-drain electrode sub-layer (not shown in the figure) and a second source-drain electrode sub-layer 310. Among them, the first source-drain electrode sub-layer is fabricated before the first planar sub-layer.

[0053] In the embodiment of the present disclosure, during the fabrication process of the first planar sub-layer 3081, a plasma slag removal process can be further selected for fabrication. It should be understood that the planar layer 308 generally uses an organic material, and the adhesion between the organic material and the inorganic material or metal material is relatively poor. Therefore, in this embodiment, the plasma slag removal process is adopted to improve the connection effect between the first planar sub-layer 3081 and the second source-drain electrode sub-layer 310.

[0054] After completing the fabrication of the first planar sub-layer 3081, on the side of the first planar sub-layer 3081 away from the substrate 301, through processes such as exposure, development, etching, and stripping, the fabrication of the second source-drain electrode sub-layer 310 is completed.

[0055] After fabricating the second source-drain electrode sub-layer 310, the second planar sub-layer 3082 is further fabricated on the surface of the second source-drain electrode sub-layer 310 away from the substrate 301.

[0056] The fabrication process of the second planar sub-layer 3082 can refer to that of the first planar sub-layer 3081, which will not be elaborated here. After fabricating the second planar sub-layer 3082, the fabrication of the light-emitting unit (not shown in the figure) can be further carried out.

[0057] Generally speaking, the light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode that are stacked. During implementation, the fabrication of the first electrode can be completed through processes such as deposition, exposure, development, wet etching, ashing, and stripping.

[0058] Since the second planar sub-layer 3082 can also adopt the plasma slag removal process, the bonding effect between the second planar sub-layer 3082 and the first electrode can be improved.

[0059] In some embodiments, at least a part of the crack stop groove is located in the protective layer.

[0060] It should be understood that during the process of forming the pattern of the first planar sub-layer through the slag removal process, the material in the area corresponding to the crack stop groove will be removed. Due to process limitations and other factors, part of the material of the protective layer may also be removed, resulting in part of the crack stop groove being formed in the protective layer.

[0061] As Figure 4 shown, during the fabrication process, the crack stop groove 309 located on the protective layer 307 is formed simultaneously when the crack stop groove 309 is opened in the material of the first planar sub-layer 3081.

[0062] Please continue to refer to Figure 4 , in some embodiments, in a direction perpendicular to the substrate 301, the depth of the crack stopping groove 309 in the portion of the protective layer 307 is less than the thickness of the protective layer 307.

[0063] In this embodiment, the depth of the portion of the crack stopping groove 309 on the protective layer 307 should be as small as possible to avoid affecting the protection effect of the protective layer 307 on other structures such as the signal line 306 located between the protective layer 307 and the substrate 301.

[0064] As Figure 4 and Figure 5 shown, in some embodiments, in a direction perpendicular to the substrate 301, the depth of the portion of the crack stopping groove 309 in the planarization layer 308 is less than the thickness of the planarization layer 308.

[0065] In the technical solution of this embodiment, in order to reduce the possible adverse effects on structures such as the protective layer 307, it is further controlled that in a direction perpendicular to the substrate 301, the depth of the crack stopping groove 309 is less than the thickness of the planarization layer 308.

[0066] In other words, in the technical solution of this embodiment, the crack stopping groove 309 only extends to a portion of the planarization layer 308 and does not penetrate the planarization layer 308, thereby reducing the possible adverse effects on other structures such as the protective layer 307 during the process of fabricating the crack stopping groove 309.

[0067] As Figure 4 and Figure 5 shown, in some embodiments, the planarization layer 308 includes a first planarization sub-layer 3081 and a second planarization sub-layer 3082 stacked in sequence in a direction away from the substrate 301, and the crack stopping groove 309 penetrates the second planarization sub-layer 3082 in a direction perpendicular to the substrate.

[0068] Different from Figure 3 and Figure 4 the embodiments shown, in the technical solution of this embodiment, the crack stopping groove 309 only penetrates the second planarization sub-layer 3082 and does not penetrate the first planarization sub-layer 3081.

[0069] During the manufacturing process, first, the fabrication of some structures of the driving circuit layer is completed on the substrate 301, such as the fabrication of a first source-drain metal sub-layer (not shown in the figure), the insulating layer 305, the signal line 306, the protective layer 307 and other structures.

[0070] Next, the first planarization sub-layer 3081 is fabricated on the protective layer 307, and the process for fabricating the first planarization sub-layer 3081 can refer to Figure 3 and Figure 4The illustrated embodiment.

[0071] The main difference from Figure 3 and Figure 4 the illustrated embodiment is that in this embodiment, the material in the region of the first planar sub-layer 3081 corresponding to the crack stop groove 309 is not removed.

[0072] After the first planar sub-layer 3081 is fabricated, a second source / drain metal sub-layer 310 and a second planar sub-layer 3082 are further fabricated on the first planar sub-layer 3081.

[0073] The steps of fabricating the second source / drain metal sub-layer 310 and the second planar sub-layer 3082 can refer to Figure 3 and Figure 4 the illustrated embodiment.

[0074] During the process of fabricating the second planar sub-layer 3082, the material in the region of the second planar layer 3082 corresponding to the crack stop groove 309 is removed through a plasma residue removal process to form the crack stop groove 309.

[0075] In some embodiments, as Figure 5 illustrated, in the direction perpendicular to the substrate 301, the depth of the part of the crack stop groove 309 located in the planar layer 308 is equal to the thickness of the second planar sub-layer 3082. That is to say, the crack stop groove 103 is formed only on the second planar sub-layer 3082.

[0076] In some other embodiments, as Figure 6 illustrated, in the direction perpendicular to the substrate 301, the depth of the part of the crack stop groove 309 located in the planar layer 308 is greater than the thickness of the second planar sub-layer 3082.

[0077] As Figure 6 illustrated, in this embodiment, when the material in the region of the second planar sub-layer 3082 corresponding to the crack stop groove 309 is removed through the plasma residue removal process, due to process limitations and other factors, part of the material of the first planar sub-layer 3081 is also removed. In this way, the formed crack stop groove 309 penetrates through the second planar sub-layer 3082 and partially extends to the first planar sub-layer 3081, so as to avoid affecting other structures such as the protective layer 307.

[0078] In some embodiments, in the direction parallel to the substrate, the extending direction of the crack stop groove is parallel to the boundary between the display area and the fan-out area. By controlling the crack stop groove to extend along the direction parallel to the boundary between the display area and the fan-out area, the possibility of cracks generated in the display area extending to the fan-out area can be further reduced, which helps to improve the reliability of the display panel.

[0079] The embodiment of the present disclosure provides a display device, including the display substrate according to any one of the first aspects.

[0080] Since this embodiment includes all the technical solutions of the above display substrate embodiment, it can at least achieve all the above technical effects, which will not be elaborated here.

[0081] In the embodiment of the present disclosure, by providing a crack stop groove 103 located between the display area 101 and the fan-out area 102, in the case where a crack appears in the structure of the display area 101 of the display substrate, through the isolation effect of the crack stop groove 103, the crack can be prevented from extending to the fan-out area 102, thereby reducing the possibility of damage to the structure of the fan-out area 102 of the display panel and contributing to improving the reliability of the display panel.

[0082] The above is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display substrate, comprising a substrate substrate and a driving circuit layer located on the substrate substrate. The display substrate has a display area and a fan-out area, and a crack stop groove is provided on the driving circuit layer. The crack stop groove is located between the display area and the fan-out area; The driving circuit layer includes an insulating layer, a signal line, a protective layer, and a planarization layer that are sequentially stacked in a direction away from the substrate substrate; At least a part of the crack stop groove is located in the protective layer; in a direction perpendicular to the substrate substrate, the depth of the part of the crack stop groove located in the protective layer is less than the thickness of the protective layer.

2. The display substrate according to claim 1, wherein, At least a part of the crack stop groove is located in the planarization layer.

3. The display substrate according to claim 2, wherein, In a direction perpendicular to the substrate substrate, the crack stop groove penetrates through the planarization layer.

4. The display substrate according to claim 3, wherein, The planarization layer includes a first planarization sub-layer and a second planarization sub-layer that are sequentially stacked in a direction away from the substrate substrate. In a direction perpendicular to the substrate substrate, the crack stop groove penetrates through the first planarization sub-layer and the second planarization sub-layer.

5. The display substrate according to claim 2, wherein, In a direction perpendicular to the substrate substrate, the depth of the part of the crack stop groove located in the planarization layer is less than the thickness of the planarization layer.

6. The display substrate according to claim 5, wherein, The planarization layer includes a first planarization sub-layer and a second planarization sub-layer that are sequentially stacked in a direction away from the substrate substrate. The crack stop groove penetrates through the second planarization sub-layer in a direction perpendicular to the substrate substrate.

7. The display substrate according to claim 6, wherein, In a direction perpendicular to the substrate substrate, the depth of the part of the crack stop groove located in the planarization layer is equal to the thickness of the second planarization sub-layer.

8. The display substrate according to claim 6, wherein, In a direction perpendicular to the substrate substrate, the depth of the part of the crack stop groove located in the planarization layer is greater than the thickness of the second planarization sub-layer.

9. The display substrate according to claim 1, wherein, In a direction parallel to the substrate substrate, the extending direction of the crack stop groove is parallel to the boundary between the display area and the fan-out area.

10. A display device, comprising the display substrate according to any one of claims 1 to 9.

11. A method for manufacturing a display substrate, comprising: Providing a substrate substrate; Fabricating a driving circuit layer on the substrate substrate; Opening a crack stop groove on the driving circuit layer, wherein the display substrate has a display area and a fan-out area, and the crack stop groove is located between the display area and the fan-out area; The driving circuit layer includes an insulating layer, a signal line, a protective layer, and a planarization layer that are sequentially stacked in a direction away from the substrate substrate; At least a part of the crack stop groove is located in the protective layer; in a direction perpendicular to the substrate substrate, the depth of the part of the crack stop groove located in the protective layer is less than the thickness of the protective layer.

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