Vacuum test platform and warpage detection system for package unit testing

Abstract

The present disclosure provides a vacuum testing platform, comprising: a vacuum adapter having a hollow cavity with a plurality of openings on its top surface for supporting a packaged unit to be tested; a vacuum generator for generating a predetermined vacuum level in a sealed space connected to the gas flow between the vacuum adapter and the packaged unit to be tested; and a vacuum sensor for sensing the generated vacuum level. The present disclosure also provides a warpage detection system.

Description

Technical Field

[0001] The present disclosure relates generally to the field of semiconductor packaging, and more particularly, to a vacuum test platform and system for packaged unit testing. Background Art

[0002] During the integrated circuit packaging process, packaged units (e.g., CPUs, southbridge chips, northbridge chips, etc.) need to be transported to different devices. This is typically accomplished using a vacuum tower and a conveyor. When a packaged unit needs to be transported, the vacuum tower is aligned with the packaged unit and its chamber is evacuated to a vacuum state. This creates sufficient suction to hold the packaged unit in place, and atmospheric pressure holds the packaged unit securely in place. The conveyor then transports the packaged unit to the appropriate location.

[0003] During the transport of packaged units, damage to the units must be avoided. However, the suction generated by the vacuum tower can sometimes cause the units to warp. If the suction during transport causes excessive warping, the substrate and attached unit may lose connection during subsequent packaging, leading to electrical failure. Therefore, it is important to understand the impact of the use of vacuum towers on the warpage of packaged units during the packaging process.

[0004] In order to understand the effect of the use of a vacuum tower on the warpage of the packaging unit, it is necessary to test the effect of different vacuum conditions of the vacuum chamber of the vacuum tower on the warpage of the packaging unit. However, when packaging, each packaging unit is set on a corresponding vacuum tower and a vacuum is generated in the vacuum chamber of the vacuum tower by a vacuum generating device (for example, a vacuum pump) to generate suction to adsorb the corresponding packaging unit. In order to improve the packaging efficiency, a plurality of packaging units are usually arranged in an array form, for example, a plurality of packaging units are arranged in a 9x4 array form. If the effect of different vacuum conditions of the vacuum chamber of the vacuum tower on the warpage of the plurality of packaging units arranged in the array form is directly tested, a large vacuum testing platform is required, and during the test process, the leakage of the vacuum chamber of the vacuum tower that adsorbs a certain packaging unit in the array will also affect the vacuum degree of the vacuum chamber of the vacuum tower that adsorbs other packaging units in the array, so that the effect of the use of the vacuum tower on the warpage of the packaging units arranged in the array form cannot be tested.

[0005] Therefore, a vacuum testing platform and system for packaging unit testing is needed, which can simulate the actual production environment and accurately test the influence of different vacuum conditions of the vacuum chamber of the vacuum tower on the warpage of the packaging unit to be tested. Summary of the Invention

[0006] According to an embodiment of the present disclosure, a vacuum testing platform is provided, comprising: a vacuum adapter having a hollow cavity, a top surface of which has multiple openings and is used to carry a packaged unit to be tested; a vacuum generating device for generating a predetermined vacuum degree in a gas-connected enclosed space formed between the vacuum adapter and the packaged unit to be tested; and a vacuum sensor for sensing the generated vacuum degree.

[0007] In some embodiments, the vacuum testing platform further includes a controller connected to the vacuum generating device and the vacuum sensor, and configured to control the generated vacuum level by controlling the operation of the vacuum generating device.

[0008] In some embodiments, the shapes of the plurality of openings are the same.

[0009] In some embodiments, the shapes of the plurality of openings are different.

[0010] In some embodiments, the vacuum adapter is made of hard plastic or metal.

[0011] In some embodiments, the hard plastic is any one of epoxy resin, silicone resin or acrylic resin.

[0012] In some embodiments, the metal is any one of titanium, zirconium, nickel alloy, or aluminum alloy.

[0013] In some embodiments, the top surface of the adapter has any one of a rectangular, square, circular, or other shape.

[0014] In some embodiments, the length and width of the rectangle are 100 mm and 60 mm, respectively.

[0015] In some embodiments, the vacuum generating device is a vacuum pump.

[0016] In some embodiments, the vacuum generating device is a vacuum generator that uses compressed air to generate vacuum.

[0017] In some embodiments, the vacuum sensor is a piezoresistive vacuum sensor.

[0018] According to an embodiment of the present disclosure, a warpage detection system is provided, comprising: a vacuum testing platform according to any embodiment of the present disclosure; a vacuum tower, the vacuum tower having an opening extending from a first surface to an opposite second surface and being arranged between the vacuum adapter and the packaging unit to be tested, the packaging unit to be tested completely covering the opening of the vacuum tower at the first surface during testing, the second surface being airtightly coupled to the top surface of the vacuum adapter and the opening of the vacuum tower being connected to one of the multiple openings on the top surface of the adapter, thereby forming a gas-connected enclosed space between the vacuum adapter and the packaging unit to be tested; and a laser detection device for detecting the warpage of the packaging unit to be tested under different vacuum conditions.

[0019] In some embodiments, the laser detection device is a white light interferometer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated herein and form a part of the specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the present disclosure and to enable those skilled in the relevant art to make and use the present disclosure.

[0021] Figure 1 A structural block diagram of a vacuum testing platform for packaging unit testing according to an embodiment of the present disclosure is shown;

[0022] Figure 2 shows a perspective schematic diagram of a vacuum adapter according to an embodiment of the present disclosure;

[0023] Figure 3 shows a structural block diagram of a warpage detection system according to an embodiment of the present disclosure;

[0024] Figure 4 A perspective schematic diagram of a vacuum tower in a warpage detection system according to an embodiment of the present disclosure is shown; and

[0025] Figure 5 A schematic diagram showing the result of warpage detection on a package unit to be tested using a warpage detection system according to an embodiment of the present disclosure is shown.

[0026] Various embodiments will be described with reference to the accompanying drawings. DETAILED DESCRIPTION

[0027] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that discussing these embodiments is intended only to enable those skilled in the art to better understand and implement the subject matter described herein, and is not intended to limit the scope of protection, applicability, or examples set forth in the claims. The functions and arrangements of the elements discussed may be changed without departing from the scope of protection of this disclosure. Various examples may omit, replace, or add various processes or components as needed. For example, the described method may be performed in an order different from the described order, and various steps may be added, omitted, or combined. In addition, features described relative to some examples may also be combined in other examples.

[0028] It should be noted that references to "one embodiment," "an embodiment," "some embodiments," etc. in the specification indicate that the described embodiments may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes that particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when specific features, structures, or characteristics are described in conjunction with an embodiment, it is within the knowledge of persons skilled in the relevant art to implement such features, structures, or characteristics in conjunction with other embodiments, whether explicitly described or not.

[0029] The embodiments of the present invention may be described with reference to the accompanying drawings. Unless otherwise specified, the dimensions of the accompanying drawings are intended to simplify the illustrations and are not intended to be a description of relative dimensions. For example, the various lengths / widths / heights of elements in the drawings may not be drawn to scale unless otherwise indicated.

[0030] Embodiments of a vacuum testing platform and system for package unit testing according to the present disclosure will now be described with reference to the accompanying drawings.

[0031] Figure 1 FIG. 1 shows a block diagram of a vacuum testing platform 100 for packaging unit testing according to an embodiment of the present disclosure. Figure 1 As shown in , a vacuum testing platform 100 for packaging unit testing includes a vacuum adapter 110 , a vacuum generating device 120 , a vacuum sensor 130 and a controller 140 .

[0032] The vacuum adapter 110 is used to carry the package unit to be tested. For example, the package unit to be tested can be any one of a CPU, a south bridge chip, a north bridge chip, a ball grid array (BGA), etc.

[0033] Figure 2 FIG. 1 shows a perspective schematic diagram of a vacuum adapter 110 according to an embodiment of the present disclosure. Figure 2As shown in FIG, the vacuum adapter 110 is in the shape of a rectangular parallelepiped, having a hollow cavity and an opening on the side. The opening on the side can be connected to the vacuum generating device 120 through a conduit (not shown in full) to suck the air in the hollow cavity when the vacuum generating device 120 is in operation. Figure 2 As shown in FIG, the top surface of the vacuum adapter 110 has multiple openings (e.g., four), and the multiple openings have the same shape (e.g., circular). However, those skilled in the art will appreciate that the vacuum adapter 110 may be any cubic shape having a hollow cavity, and the multiple openings on the top surface of the vacuum adapter 110 may have different shapes to accommodate different vacuum towers. In one embodiment, the multiple openings are threaded holes.

[0034] like Figure 2 As shown in , the top surface of the vacuum adapter 110 is rectangular, for example, its length and width are 100 mm and 60 mm respectively. However, for those skilled in the art, the top surface of the vacuum adapter 110 can also be square, circular or any other shape.

[0035] The vacuum adapter 110 according to an embodiment of the present disclosure is made of a high-hardness material. For example, the vacuum adapter 110 can be made of either hard plastic or metal. In one embodiment, the hard plastic can be, but is not limited to, epoxy resin, silicone resin, or acrylic resin. In another embodiment, the metal used for the vacuum adapter 110 can be, but is not limited to, titanium, zirconium, a nickel alloy, or an aluminum alloy.

[0036] The vacuum generating device 120 is used to generate a predetermined vacuum level in the enclosed space connected to the gas flow between the vacuum adapter 110 and the packaged unit to be tested. In one embodiment, the vacuum generating device 120 may be a vacuum pump that creates a negative pressure at the suction port and directly vents to the atmosphere, resulting in a large pressure ratio between the two ends. In another embodiment, the vacuum generating device 120 may be a vacuum generator that generates a vacuum level by utilizing the flow of compressed air based on the Venturi effect.

[0037] The vacuum sensor 130 is used to sense the predetermined vacuum level generated by the vacuum generating device 120 in the enclosed, gas-connected space between the vacuum adapter 110 and the packaged unit to be tested. The operating principle of the vacuum sensor 130 is that gas pressure directly acts on the sensor's diaphragm, causing it to undergo a micro-displacement proportional to the gas pressure, thereby changing the sensor's resistance. This change is detected and converted into a signal corresponding to the gas pressure, thereby determining the vacuum level generated in the gas-connected, gas-connected, enclosed space. In one embodiment, the vacuum sensor 130 is a piezoresistive vacuum sensor.

[0038] like Figure 1 As shown in FIG, the control unit 140 is connected to the vacuum generating device 120 and the vacuum sensor 130, and is configured to control a predetermined vacuum level generated in the gas-connected, sealed space formed between the vacuum adapter 110 and the packaged unit to be tested by controlling the operation of the vacuum generating device 120. For example, the control unit 140 can generate different vacuum levels in the gas-connected, sealed space formed between the vacuum adapter 110 and the packaged unit to be tested by controlling the operation time of the vacuum generating device 120.

[0039] Figure 3 FIG. 3 shows a structural block diagram of a warpage detection system 300 according to an embodiment of the present disclosure. Figure 3 As shown in FIG, the warpage detection system 300 includes a vacuum test platform 310 according to an embodiment of the present disclosure, a vacuum tower 320 corresponding to a packaging unit 330 to be tested, and a laser detection device 340. Figure 1 As shown in , the vacuum testing platform 310 according to an embodiment of the present disclosure includes a vacuum adapter, a vacuum generating device, a vacuum sensor, and a controller.

[0040] In semiconductor packaging, a vacuum tower is aligned with the packaging unit and the vacuum chamber of the vacuum tower is evacuated to a vacuum state, so that the vacuum tower generates sufficient suction to hold the packaging unit and keep the packaging unit fixed on the vacuum tower under the action of atmospheric pressure. In order to simulate the actual production environment and accurately test the effect of different vacuum conditions of the vacuum chamber of the vacuum tower on the warpage of the packaging unit, the warpage detection system 300 according to the embodiment of the present disclosure includes a vacuum tower 320. Figure 3 As shown in FIG, the vacuum tower 320 is disposed between the vacuum adapter 310 and the package unit to be tested 330. As is well known in the art, the vacuum tower corresponds to the package unit to be tested. That is, different vacuum towers can be selected for package units of different sizes.

[0041] Figure 4 FIG. 3 shows a schematic perspective view of a vacuum tower 320 in a warpage detection system 300 according to an embodiment of the present disclosure. Figure 4 As shown in FIG, the vacuum tower 320 has an opening 323 extending from a first surface 321 to an opposite second surface 322. Figure 3 When the warpage detection system 300 shown in FIG. 1 is performing a warpage detection on a package unit 330 to be tested, the package unit 330 to be tested completely covers the opening 323 of the vacuum tower 320 at the first surface 321, and the second surface 322 is aligned with the opening 323 of the vacuum tower 320. Figure 3The top surface of the vacuum adapter of the vacuum test platform 310 shown in the figure is airtightly coupled with multiple openings, and the opening 323 of the vacuum tower 320 is connected to one of the multiple openings on the top surface of the vacuum adapter at the second surface 322, thereby forming a gas-connected closed space between the vacuum adapter and the packaging unit 330 to be tested. Here, "airtightly coupled" means that the second surface 322 and the top surface of the vacuum adapter are flat, and there is no gap between the two surfaces for gas circulation after coupling. Figure 4 In the vacuum tower 320 shown, the opening 323 is circular and the diameter of the opening 323 gradually decreases from the first surface 321 to the second surface 322 and then remains constant. In other words, the diameter of the opening at the second surface 322 is the smallest. In one embodiment, the diameter of the opening at the second surface 322 is equal to the diameter of one of the selected openings. For those skilled in the art, Figure 4 The vacuum tower 320 shown is only exemplary, and the shape of the opening 323 is not limited thereto, as long as the second surface 322 can be Figure 3 The top surface of the vacuum adapter of the vacuum test platform 310 shown in the figure is airtightly coupled with multiple openings, and the opening 323 of the vacuum tower 320 can be connected to one of the multiple openings on the top surface of the vacuum adapter at the second surface 322.

[0042] In use Figure 3 When the warpage detection system 300 shown in FIG. 1 performs a warpage detection on the package unit 330 to be tested, the second surface 322 and the second surface 322 are aligned with each other. Figure 3 The top surface of the vacuum adapter of the vacuum test platform 310 shown in the figure is airtightly coupled with a plurality of openings, and the opening 323 of the vacuum tower 320 is connected to one of the plurality of openings on the top surface of the vacuum adapter at the second surface 322. At this time, the plurality of openings on the top surface of the vacuum adapter, except for the one opening, can be sealed with a sealing material (e.g., plasticine). At the same time, the packaging unit 330 to be tested completely covers the opening 323 of the vacuum tower 320 at the first surface 321, thereby forming a gas-connected enclosed space between the vacuum adapter and the packaging unit 330 to be tested. Subsequently, as Figure 3The vacuum generating device in the vacuum testing platform 310 shown in FIG is operated to generate a predetermined vacuum level in the hollow cavity of the vacuum adapter and in the airtight space formed between the vacuum adapter and the package unit 330 to be tested. A laser detection device 340 is then used to measure the warpage of the package unit 330 at different generated vacuum levels. In one embodiment, the laser detection device 340 is a white light interferometer (e.g., a ZYGO interferometer). However, those skilled in the art will not be limited to this.

[0043] Figure 5 FIG. 3 is a schematic diagram showing the result of warpage detection of a packaging unit 330 to be tested using the warpage detection system 300 according to an embodiment of the present disclosure. Figure 5 As shown in, when the vacuum generating device of the vacuum testing platform 310 is not in operation, the maximum warpage of the packaging unit 330 to be tested is measured to be 265μm; when the vacuum degree generated in the gas-connected enclosed space formed between the vacuum adapter and the packaging unit 330 to be tested is -20kPa (that is, the pressure difference with the atmospheric pressure is negative pressure), the maximum warpage of the packaging unit 330 to be tested is measured to be 362μm; and when the vacuum degree generated in the gas-connected enclosed space formed between the vacuum adapter and the packaging unit 330 to be tested is -30kPa, the maximum warpage of the packaging unit 330 to be tested is measured to be 412μm.

[0044] The vacuum testing platform and system for packaging unit testing according to the embodiments of the present disclosure can fully simulate the actual production environment because, as in the actual packaging process, the vacuum tower is positioned between the vacuum adapter and the packaging unit to be tested. Furthermore, since the effect of different vacuum conditions in the vacuum chamber of a single vacuum tower on the warpage of a single packaging unit to be tested can be measured, the effect of the suction force generated by each vacuum tower on the warpage of multiple packaging units arranged in an array during the actual packaging process can be determined. Therefore, the vacuum testing platform and system according to the embodiments of the present disclosure can significantly save space and cost.

[0045] In addition, during the packaging process, the suction force generated by the vacuum tower is required to transport the packaging unit. After the packaging is completed, the corresponding force needs to be applied to remove the packaging unit. Figure 3 By replacing the laser detection device 340 in the warpage detection system 300 shown in FIG. 3 with a dynamometer, the force required to remove the packaging unit under different vacuum conditions of the vacuum chamber of the vacuum tower can be measured.

[0046] Control unit has been described in conjunction with various devices and methods.Described control unit can use electronic hardware, computer software or its arbitrary combination to implement.Described control unit is to be implemented as hardware or software and will depend on specific application and the overall design constraint imposed on system.As an example, the control unit provided in the present disclosure, any part of control unit or any combination of control unit can be implemented as microprocessor, microcontroller, digital signal processor (DSP), field programmable gate array (FPGA), programmable logic device (PLD), state machine, gate logic, discrete hardware circuit and be configured for carrying out other suitable processing unit of the various functions described in the present disclosure.The function of the control unit provided in the present disclosure, any part of control unit or any combination of control unit can be implemented as the software performed by microprocessor, microcontroller, DSP or other suitable platform.

[0047] It should be noted that not all steps and units in the above processes and system structure diagrams are required, and certain steps or units can be omitted according to actual needs. The execution order of each step is not fixed and can be determined as needed. The device structure described in the above embodiments can be a physical structure or a logical structure, that is, some units may be implemented by the same physical entity, or some units may be implemented by multiple physical entities, or may be implemented by certain components in multiple independent devices.

[0048] The foregoing description of the present disclosure is provided to enable any person skilled in the art to implement or use the present disclosure. Various modifications to the present disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the scope of the present disclosure. Therefore, the present disclosure is not limited to the examples and designs described herein, but is intended to be consistent with the widest range of principles and novel features disclosed herein.

Claims

1. A warpage detection system, comprising: a vacuum adapter having a hollow cavity with a top surface having a plurality of openings and configured to carry a packaged unit to be tested; a vacuum generating device for generating a predetermined vacuum degree in a gas-connected enclosed space formed between the vacuum adapter and the package unit to be tested via an opening extending through one side of the vacuum adapter and communicating with the hollow cavity; a vacuum sensor for sensing the generated vacuum level; a vacuum tower having an opening extending from a first surface to an opposite second surface and disposed between the vacuum adapter and the package unit to be tested, wherein the package unit to be tested completely covers the opening of the vacuum tower at the first surface during testing, the second surface being airtightly coupled to the top surface of the vacuum adapter and the opening of the vacuum tower being in communication with one of the plurality of openings on the top surface of the adapter, thereby forming a gas-communicated enclosed space between the vacuum adapter and the package unit to be tested; as well as The laser detection device is used to detect the warpage of the packaging unit to be tested under different vacuum conditions. 2 . The warpage detection system according to claim 1 , further comprising a controller connected to the vacuum generating device and the vacuum sensor and configured to control the generated vacuum degree by controlling the operation of the vacuum generating device.

3. The warpage detection system according to claim 1, wherein: The shapes of the plurality of openings are the same.

4. The warpage detection system according to claim 1, wherein: The shapes of the plurality of openings are different.

5. The warpage detection system according to claim 1, wherein: The vacuum adapter is made of hard plastic or metal.

6. The warpage detection system according to claim 5, wherein: The hard plastic is any one of epoxy resin, silicone resin or acrylic resin.

7. The warpage detection system according to claim 5, wherein: The metal is any one of titanium, zirconium, nickel alloy or aluminum alloy.

8. The warpage detection system according to claim 1, wherein: The top surface of the adapter has any one of rectangular, square, circular or other shapes.

9. The warpage detection system according to claim 8, wherein: The length and width of the rectangle are 100 mm and 60 mm respectively.

10. The warpage detection system according to claim 1, wherein: The vacuum generating device is a vacuum pump.

11. The warpage detection system according to claim 1, wherein: The vacuum generating device is a vacuum generator that uses compressed air to generate vacuum.

12. The warpage detection system according to claim 1, wherein: The vacuum sensor is a piezoresistive vacuum sensor.

13. The warpage detection system according to claim 1, wherein: The laser detection device is a white light interferometer.

Images