Substrate processing apparatus and substrate processing method

Abstract

The present invention provides a technique that facilitates the reduction of foreign matter in the processing liquid discharged to the substrate. The substrate processing apparatus includes: a discharge section (30) having a nozzle for discharging processing liquid to the substrate; a delivery section (60) for delivering processing liquid to the discharge section; and a liquid source (51) serving as a supply source for supplying the processing liquid delivered to the discharge section (30) to the delivery section (60). The delivery section (60) includes: a conduit for the flow of processing liquid; and multiple filters disposed at different locations on the conduit, each having different capture characteristics for various types of foreign matter that may be contained in the processing liquid.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus and a substrate processing method. Background Technology

[0002] Patent document 1 discloses a structure in which a circulation pipe is provided for the supply pipe including the filter unit in a photoresist coating apparatus, so that the photoresist is circulated when the coating stops.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 10-172881 Summary of the Invention

[0006] The technical problem to be solved by the invention

[0007] This invention provides a technique for reducing foreign matter in the processing fluid discharged onto the substrate.

[0008] Technical solutions for solving the problem

[0009] One aspect of the substrate processing apparatus of the present invention includes: a discharge section having a nozzle for discharging a processing liquid to a substrate; a delivery section for conveying the processing liquid to the discharge section; and a supply source for supplying the processing liquid for conveying to the discharge section to the delivery section, the delivery section having: a conduit for the flow of the processing liquid; and a plurality of filters disposed at different locations on the conduit, each having different capture characteristics for a plurality of foreign matter that are envisioned to be contained in the processing liquid.

[0010] Invention Effects

[0011] According to the present invention, a technique useful for reducing foreign matter in the processing liquid discharged to the substrate can be provided. Attached Figure Description

[0012] Figure 1 This is a schematic diagram illustrating an example of the general structure of a substrate processing system.

[0013] Figure 2 This is a schematic diagram illustrating an example of the internal structure of a coating and developing apparatus.

[0014] Figure 3 This is a schematic diagram illustrating an example of the structure of a liquid processing unit.

[0015] Figure 4 This is a schematic diagram illustrating an example of a processing fluid supply unit.

[0016] Figure 5 It is a block diagram representing the functional structure of the control device.

[0017] Figure 6 This is a block diagram representing an example of the hardware structure of a control device.

[0018] Figure 7 This is a flowchart illustrating an example of a liquid processing sequence.

[0019] Figure 8 of (a), Figure 8 (b) Figure 8 (c) is a schematic diagram illustrating an example of the actions of each part in the liquid processing sequence.

[0020] Figure 9 This is a flowchart illustrating an example of the sequence in which instructions are changed based on foreign object detection results.

[0021] Figure 10 of (a), Figure 10 (b) Figure 10 (c) is a schematic diagram illustrating an example of changing the flow of the processing fluid in each delivery section.

[0022] Figure 11 of (a), Figure 11 (b) is a schematic diagram illustrating an example of changing the configuration of each filter. Detailed Implementation

[0023] The following describes the implementation methods of each example.

[0024] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes: a discharge section having a nozzle for discharging a processing liquid to a substrate; a delivery section for feeding the processing liquid to the discharge section; and a supply source for supplying the processing liquid fed to the discharge section to the delivery section, the delivery section having: a conduit for the flow of the processing liquid; and a plurality of filters disposed at different locations on the conduit, each having different capture characteristics for a plurality of foreign matter contemplated to be contained in the processing liquid.

[0025] In the aforementioned substrate processing apparatus, multiple filters are installed at different locations along the pipeline supplying the processing liquid, so that the processing liquid from the supply source is supplied to the nozzle through multiple filters. Furthermore, these filters have different capture characteristics for various types of foreign matter expected to be present in the processing liquid, thus allowing multiple types of foreign matter in the processing liquid to be captured by multiple filters. Therefore, it is possible to further reduce the amount of foreign matter in the processing liquid discharged to the substrate.

[0026] Alternatively, the plurality of filters may be included in the plurality of foreign matter, and the filters have high capture performance for foreign matter of the kind that occurs frequently after the subsequent liquid treatment of the substrate.

[0027] As described above, by employing a filter structure with high capture performance for foreign matter that frequently causes defects after the processing liquid passes through the substrate in subsequent liquid treatment, it is possible to remove foreign matter with high defect occurrence frequency from the processing liquid. Therefore, the occurrence of substrate defects can be suppressed.

[0028] Alternatively, the contact areas between the collection sections of the plurality of filters and the treatment liquid may be different from each other.

[0029] As described above, by using filters with collection sections having different contact areas with the treatment liquid, it is possible to make the collection characteristics for each type of foreign matter different. By using such filters, it is possible to select the appropriate filter based on the types of foreign matter contained in the treatment liquid.

[0030] Alternatively, the filter with the highest capture performance for foreign matter that is most frequently found in the subsequent liquid treatment of the substrate can be located at the downstream end of the pipeline.

[0031] As described above, by employing a downstream structure with a filter that has the highest capture performance for foreign matter that frequently causes defects after subsequent liquid treatment of the substrate, the downstream filter can appropriately remove foreign matter that frequently causes defects. Therefore, the occurrence of defects in the substrate can be suppressed.

[0032] Alternatively, the pipeline may include: a main pipeline connecting the supply source and the nozzle; and a bypass pipeline formed by connecting two branch points of the main pipeline. The liquid delivery unit also has a liquid delivery pump disposed in the bypass pipeline. Among the plurality of filters, a first filter is disposed between the two branch points of the main pipeline, at a position downstream of the filters different from the first filter. The first filter has the highest capture performance for foreign matter with a high frequency of defects that will occur after subsequent liquid treatment of the substrate. At least one of the filters different from the first filter is disposed in the bypass pipeline.

[0033] As described above, in a pipeline structure that includes a main pipeline and a bypass pipeline, if a first filter with the highest capture performance for foreign objects of the type with a high frequency of defect occurrence is installed in the main pipeline, then appropriate foreign objects can be removed using the first filter.

[0034] Alternatively, the filter in the bypass pipeline can be positioned upstream of the liquid delivery pump.

[0035] As described above, by positioning the filter upstream of the delivery pump in the bypass line, the process fluid discharged from the nozzle by the delivery pump will ultimately pass through the first filter. That is, the first filter can be positioned substantially downstream, so that foreign matter that frequently causes defects can be properly removed by the downstream filter.

[0036] Alternatively, the system may also include a control unit for controlling the liquid delivery unit, wherein the liquid delivery unit has a foreign matter detection unit for detecting foreign matter in the treatment liquid on the downstream side of the liquid delivery pump in the bypass pipeline, and the control unit controls the flow of the treatment liquid in the main pipeline and the bypass pipeline according to the detection result of the foreign matter detection unit.

[0037] As described above, by employing a control unit that modifies the flow structure of the treatment fluid in the main pipeline and bypass pipeline based on the detection results of the foreign matter detection unit, for example, the number of times the treatment fluid passes through the filter can be adjusted considering factors such as the residual level of foreign matter in the treatment fluid. In this way, control that can better remove foreign matter from the treatment fluid can be selected.

[0038] Alternatively, the system may also include a control unit for controlling the liquid delivery section, which controls the flow of the processing liquid in the main pipeline and the bypass pipeline by changing the filter through which the processing liquid last passes before reaching the nozzle, based on the occurrence of defects in the processed substrate.

[0039] As described above, by employing a control unit that alters the structure of the filter that last passes through the nozzle before reaching the nozzle based on the occurrence of defects in the processed substrate, for example, the processing liquid can be passed through the filter in a more suitable order according to the occurrence of defects on the processed substrate. Therefore, appropriate control measures can be determined to prevent defects from occurring on the processed substrate.

[0040] In one exemplary embodiment, a substrate processing method is provided. The substrate processing method discharges a processing liquid from a supply source through a conduit from a nozzle to a substrate, causing the processing liquid to pass through multiple filters located at different positions along the conduit, each having different capture characteristics for various types of foreign matter that are expected to be contained in the processing liquid.

[0041] In the aforementioned substrate processing method, the processing liquid is supplied to the nozzle through multiple filters installed at different locations along the pipeline through which the processing liquid flows. Furthermore, these filters have different capture characteristics for various types of foreign matter that are expected to be present in the processing liquid, thus enabling multiple processors to capture various types of foreign matter contained in the processing liquid. This further reduces the amount of foreign matter in the processing liquid discharged to the substrate.

[0042] Alternatively, the processing liquid can be passed through the filter among the plurality of filters that has the highest capture performance for foreign matter that is most frequently found to cause defects that may occur after the subsequent liquid treatment of the substrate.

[0043] As described above, by employing a filter structure that maximizes the capture performance of foreign matter that frequently causes defects after subsequent liquid treatment of the substrate, the processing liquid is passed last through a filter. This allows for the effective removal of foreign matter with high defect frequency by the most downstream filter. Therefore, the occurrence of defects in the substrate can be suppressed.

[0044] Alternatively, the pipeline may include: a main pipeline connecting the supply source and the nozzle; a bypass pipeline formed to connect two branch points of the main pipeline; and a liquid delivery pump disposed in the bypass pipeline. A first filter is disposed between the two branch points of the main pipeline, downstream of any filter other than the first filter. The first filter has the highest capture performance among the plurality of filters for foreign matter that has a high frequency of occurrence of defects that may occur after subsequent liquid treatment of the substrate. At least one filter other than the first filter is disposed in the bypass pipeline.

[0045] As described above, in a pipeline structure including a main pipeline and a bypass pipeline, by employing a first filter in the main pipeline that maximizes the capture performance of foreign objects of the type with a high frequency of defect occurrence, it is possible to properly remove foreign objects using the first filter.

[0046] Alternatively, a foreign matter detection unit can be provided downstream of the pump for delivering the liquid in the bypass pipeline to detect foreign matter in the treated liquid, and the flow of the treated liquid in the main pipeline and the bypass pipeline can be changed according to the detection result of the foreign matter detection unit.

[0047] As described above, by employing a structure that modifies the flow of the processing fluid in the main pipeline and bypass pipeline based on the detection results of the foreign matter detection unit, for example, the number of times the processing fluid passes through the filter can be varied, taking into account factors such as the residual level of foreign matter in the processing fluid. In this way, control that can better remove foreign matter from the processing fluid can be selected.

[0048] Alternatively, the flow of the treatment fluid in the main pipeline and the bypass pipeline can be altered by changing the filter through which the treatment fluid last passes before reaching the nozzle, depending on the occurrence of defects in the treated substrate.

[0049] As described above, by employing a control unit to modify the structure of the filter that last passes through the nozzle before reaching the nozzle based on the occurrence of defects in the processed substrate, for example, the processing liquid can be passed through the filter in a more suitable order according to the occurrence of defects on the processed substrate. Therefore, appropriate control measures can be determined to prevent defects from being generated in the processed substrate.

[0050] [Explanation of the illustrated implementation]

[0051] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. Furthermore, the same or corresponding parts are labeled with the same reference numerals in each drawing.

[0052] First, refer to Figures 1-6 This invention describes a substrate processing system according to one embodiment of the present invention.

[0053] [Substrate Processing System]

[0054] Figure 1 The substrate processing system 1 shown is a system for forming a photosensitive coating on a substrate, exposing the photosensitive coating, and developing the photosensitive coating. The photosensitive coating is, for example, a resist film.

[0055] The substrate processing system 1 includes a coating and developing apparatus 2 and an exposure apparatus 3. The coating and developing apparatus 2 is configured to form a resist film (photosensitive coating) on ​​the surface of a workpiece W. Furthermore, the coating and developing apparatus 2 is configured to perform a developing process on the resist film after the exposure process performed by the exposure apparatus. The exposure apparatus 3 is configured to transfer the workpiece W between itself and the coating and developing apparatus 2, and to perform an exposure process (pattern exposure) on the resist film formed on the surface of the workpiece W. The exposure apparatus 3 can selectively irradiate energy lines onto the exposed portion of the resist film using methods such as immersion exposure. The workpiece W, on which a resist film with a predetermined pattern has been formed on the surface by the coating and developing apparatus 2 and the exposure apparatus 3, is then supplied to an etching process. In the etching process, for example, dry etching using plasma is used to process the material in areas not covered by the resist film.

[0056] The workpiece W to be processed is, for example, a substrate, or a substrate that has been formed into a state with films or circuits by performing a prescribed process. As an example of a substrate included in workpiece W, a silicon wafer is an example. Workpiece W (substrate) can be formed in a circular shape or a plate shape other than a circle, such as a polygon. Workpiece W may also have a cut-out portion formed by slicing. The cut-out portion can be, for example, a groove (U-shaped, V-shaped, etc.) or a straight portion extending in a straight line (a so-called orientation flat). The workpiece W to be processed can be a glass substrate, a mask substrate, an FPD (Flat Panel Display), or an intermediate obtained by performing a prescribed process on these substrates. The diameter of workpiece W can be, for example, approximately 200 mm to 450 mm.

[0057] Energy lines can be ionizing radiation or non-ionizing radiation. Ionizing radiation has sufficient energy to ionize atoms or molecules. Examples of ionizing radiation include extreme ultraviolet (EUV), electron beams, ion beams, X-rays, alpha rays, beta rays, gamma rays, heavy particle rays, and proton rays. Non-ionizing radiation does not have sufficient energy to ionize atoms or molecules. Examples of non-ionizing radiation include gamma rays, i-rays, KrF stimulated excimer lasers, ArF stimulated excimer lasers, and F2 stimulated excimer lasers.

[0058] [Substrate Processing Device]

[0059] The structure of the coating and developing apparatus 2 will be described below as an example of a substrate processing apparatus. Figure 1 and Figure 2 As shown, the coating and developing apparatus 2 has a carrier block 4, a processing block 5, an interface block 6, and a control device 100.

[0060] The carrier block 4 handles the introduction of workpiece W into and removal of workpiece W from the coating and developing apparatus 2. For example, the carrier block 4 can support multiple carriers C for workpiece W and has a built-in transport device A1 containing a transfer arm. The carriers C, for example, hold multiple circular workpieces W. The transport device A1 removes workpiece W from the carriers C and transfers it to the processing block 5, whereby the workpiece W is received back into the carriers C.

[0061] Processing block 5 has multiple processing modules 11, 12, 13, and 14. Processing modules 11, 12, 13, and 14 have a built-in liquid processing unit U1, a heat treatment unit U2, and a conveying device A3 including a conveying arm for transporting workpieces W to these units.

[0062] Processing module 11 forms a lower film on the surface of workpiece W using liquid treatment unit U1 and heat treatment unit U2. Liquid treatment unit U1 of processing module 11 applies a processing liquid for forming the lower film onto workpiece W. Heat treatment unit U2 of processing module 11 performs various heat treatments accompanying the formation of the lower film.

[0063] Processing module 12 forms a resist film on the lower film using liquid processing unit U1 and heat treatment unit U2. Liquid processing unit U1 of processing module 12 applies a processing liquid for forming the resist film onto the lower film. Heat treatment unit U2 of processing module 12 performs various heat treatments accompanying the formation of the resist film.

[0064] Processing module 13 forms an upper film on the resist film using a liquid processing unit U1 and a heat treatment unit U2. The liquid processing unit U1 of processing module 13 applies a liquid for forming the upper film onto the resist film. The heat treatment unit U2 of processing module 13 performs various heat treatments accompanying the formation of the upper film.

[0065] Processing module 14 utilizes liquid processing unit U1 and heat treatment unit U2 to perform development treatment on the exposed resist film. Liquid processing unit U1 applies a developer to the surface of the exposed workpiece W. Furthermore, liquid processing unit U1 removes the applied developer with a cleaning solution. Heat treatment unit U2 performs various heat treatments accompanying the development process. Specific examples of heat treatment include pre-development heat treatment (PEB: Post Exposure Bake) and post-development heat treatment (PB: Post Bake).

[0066] A shelf assembly U10 is provided on the side of the carrier block 4 within the processing block 5. The shelf assembly U10 is divided into multiple units arranged side by side in the vertical direction. A conveying device A7, including a lifting arm, is provided near the shelf assembly U10. The conveying device A7 causes the workpiece W to move up and down between the units of the shelf assembly U10.

[0067] A shelf assembly U11 is provided on the interface block 6 side within processing block 5. The shelf assembly U11 is divided into multiple units arranged side by side in the vertical direction.

[0068] Interface block 6 facilitates the transfer of workpiece W between itself and exposure device 3. For example, interface block 6 may include a built-in transport device A8 with a transfer arm, which is connected to exposure device 3. Transport device A8 transfers workpiece W, which is positioned on shelf assembly U11, to exposure device 3. Transport device A8 then receives workpiece W from exposure device 3 and returns it to shelf assembly U11.

[0069] The control device 100 controls the coating and developing apparatus 2 in a manner that performs the coating and developing process in, for example, the following order. First, the control device 100 controls the transport device A1 to transport the workpiece W in the carrier C to the shelf assembly U10, and controls the transport device A7 to arrange the workpiece W in the unit for the processing module 11.

[0070] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf assembly U10 to the liquid treatment unit U1 and the heat treatment unit U2 within the processing module 11. Furthermore, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a lower film on the surface of the workpiece W. Afterward, the control device 100 controls the transport device A3 to return the workpiece W with the lower film formed to the shelf assembly U10, and controls the transport device A7 to place the workpiece W in the unit for the processing module 12.

[0071] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf assembly U10 to the liquid treatment unit U1 and the heat treatment unit U2 within the processing module 12. Furthermore, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form a resist film on the lower layer of the workpiece W. Afterward, the control device 100 controls the transport device A3 to return the workpiece W to the shelf assembly U10, and controls the transport device A7 to place the workpiece W in the unit for the processing module 13.

[0072] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf assembly U10 to the respective units within the processing module 13. Furthermore, the control device 100 controls the liquid treatment unit U1 and the heat treatment unit U2 to form an upper film on the resist film of the workpiece W. Afterward, the control device 100 controls the transport device A3 to transport the workpiece W to the shelf assembly U11.

[0073] Next, the control device 100 controls the transport device A8 to transport the workpiece W of the shelf assembly U11 to the exposure device 3. Then, the control device 100 controls the transport device A8 to receive the workpiece W that has undergone exposure treatment from the exposure device 3 and place it in the unit for processing module 14 of the shelf assembly U11.

[0074] Next, the control device 100 controls the transport device A3 to transport the workpiece W from the shelf assembly U11 to the respective units within the processing module 14, and controls the liquid treatment unit U1 and the heat treatment unit U2 to perform a developing process on the resist film of the workpiece W. Afterwards, the control device 100 controls the transport device A3 to return the workpiece W to the shelf assembly U10, and controls the transport devices A7 and A1 to return the workpiece W to the carrier C. The coating and developing process is thus completed through these processes.

[0075] Furthermore, the specific structure of the substrate processing apparatus is not limited to the structure of the coating and developing apparatus 2 illustrated above. The substrate processing apparatus may simply include a liquid processing unit that discharges processing liquid to the workpiece W for liquid processing and a control device capable of controlling the processing.

[0076] (Liquid processing unit)

[0077] Next, refer to Figure 3 and Figure 4 This section details an example of the liquid processing unit U1 in the processing module 12. The liquid processing unit U1 has a rotating holding part 20 and a processing liquid supply part 29.

[0078] The rotating holding unit 20 holds and rotates the workpiece W based on the operation instruction of the control device 100. The rotating holding unit 20 has a holding unit 21 and a driving unit 22. The holding unit 21 supports the center portion of the workpiece W, which is horizontally arranged with its surface Wa facing upwards, and holds the workpiece W by adsorption (e.g., vacuum adsorption). The driving unit 22 is a rotary actuator that uses an electric motor as a power source to rotate the holding unit 21 about a vertical rotation axis. Thus, the workpiece W rotates about the vertical rotation axis.

[0079] The processing fluid supply unit 29 supplies processing fluid to the workpiece W, which is rotated and held in the rotating holding unit 20. The processing fluid supply unit 29, as shown... Figure 3 and Figure 4 As shown, it has a discharge section 30, a liquid delivery section 60, a replenishment section 50, a first connecting section 81, and a second connecting section 83.

[0080] The discharge section 30 discharges treatment liquid onto the surface Wa of the workpiece W. The discharge section 30 has a nozzle 31 and a liquid delivery pipe 32. The nozzle 31 discharges treatment liquid onto the workpiece W. The nozzle 31, as shown... Figure 3 As shown, for example, it is positioned above the workpiece W, and the treatment liquid is discharged downwards. The liquid delivery pipe 32 guides the treatment liquid to the nozzle 31. The treatment liquid is discharged from the nozzle 31 to the workpiece W, thereby coating (supplying) the workpiece W with the treatment liquid.

[0081] like Figure 4As shown, the liquid delivery unit 60 conveys the treatment liquid to the discharge unit 30. Specifically, the liquid delivery unit 60 delivers the treatment liquid to the discharge unit 30 (nozzle 31) at a specified pressure. The liquid delivery unit 60 includes a liquid delivery pipe 61, a first filter 62, a second filter 63, a pressure delivery unit 64, branch pipes 65a and 65b, a first connecting valve 66, a second connecting valve 67, a pressure measuring unit 68, and a foreign matter detection unit 69. The liquid delivery pipe 61 and the branch pipes 65a and 65b constitute a pipeline for the flow of the treatment liquid. In addition, the liquid delivery pipe 61 and the branch pipes 65a and 65b also function as a circulation path for circulating the treatment liquid.

[0082] The liquid delivery pipe 61 is the main pipeline that guides the treatment liquid to the discharge section 30. Specifically, the liquid delivery pipe 61 is connected to the upstream end of the liquid delivery pipe 32 of the discharge section 30. A first filter 62 is provided in the liquid delivery pipe 61 to remove foreign matter contained in the treatment liquid. The first filter 62 traps foreign matter contained in the treatment liquid passing through the liquid delivery pipe 61.

[0083] The pressure delivery unit 64 receives the treatment liquid via the liquid delivery pipe 61, pressurizes the received treatment liquid, and delivers it to the discharge unit 30. The pressure delivery unit 64 includes, for example, a pump 71, a pump drive unit 72, a flow measurement unit 73, and a pressure measurement unit 74.

[0084] Pump 71 (liquid delivery pump) has a receiving chamber for receiving the treatment liquid and a contraction section for contracting the receiving chamber. Pump 71 uses the contraction section to expand the receiving chamber to receive the treatment liquid, and uses the contraction section to contract the receiving chamber to deliver the treatment liquid. As pump 71, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump can be used.

[0085] The pump drive unit 72 drives the pump 71 based on the operation instruction of the control device 100. Specifically, the pump drive unit 72 actuates the contraction section (drives it) by causing the receiving chamber of the pump 71 to contract. For example, the pump drive unit 72 is a pneumatic type drive unit that uses gas to actuate the contraction section. The pump drive unit 72 can cause the receiving chamber of the pump 71 to contract by adjusting the pressure of the gas (drive pressure).

[0086] The flow measurement unit 73 acquires information about the inflow and outflow of the processed liquid to the pump 71. The flow rate of the gas used to drive the pump 71 is related to the inflow and outflow of the processed liquid relative to the pump 71, and therefore is information about the inflow and outflow of the processed liquid relative to the pump 71. For example, the flow measurement unit 73 measures the flow rate of the gas flowing in the connecting pipe between the pump 71 and the pump drive unit 72. The flow measurement unit 73 outputs the measured value to the control device 100. The pressure measurement unit 74 acquires information about the pressure inside the pump 71. For example, the pressure measurement unit 74 measures the pressure in the connecting pipe between the pump 71 and the pump drive unit 72. The pressure measurement unit 74 outputs the measured value to the control device 100.

[0087] Branch pipe 65a branches off from branch point P1 upstream of the first filter 62 in the delivery pipe 61, connecting the delivery pipe 61 and the pump 71. Branch pipe 65b branches off from branch point P2 downstream of the first filter 62 in the delivery pipe 61, connecting the delivery pipe 61 and the pump 71. Branch pipes 65a and 65b form a bypass pipe connecting branch points P1 and P2 in the delivery pipe 61 (main line). A second filter 63 is installed in branch pipe 65a to remove foreign matter contained in the treated liquid. The second filter 63 traps foreign matter contained in the treated liquid passing through branch pipe 65a.

[0088] A first connecting valve 66 is provided on branch pipe 65a, and opens and closes the liquid delivery pipe 61 and the pressure delivery unit 64 based on the operation instruction of the control device 100. The first connecting valve 66 is, for example, a pneumatic valve. The aforementioned second filter 63 may also be provided upstream of the first connecting valve 66. A second connecting valve 67 is provided on branch pipe 65b, and opens and closes the liquid delivery pipe 61 and the pressure delivery unit 64 based on the operation instruction of the control device 100. The second connecting valve 67 is, for example, a pneumatic valve.

[0089] The pressure measuring unit 68 measures the pressure of the processing fluid flowing in the pipeline within the liquid delivery unit 60. For example, the pressure measuring unit 68 measures the pressure between the first filter 62 and the pressure delivery unit 64. Specifically, the pressure measuring unit 68 is provided in the branch pipe 65b and measures the pressure (hydraulic pressure) of the processing fluid within the branch pipe 65b. The pressure measuring unit 68 outputs the measured value to the control device 100.

[0090] The foreign object detection unit 69 detects foreign objects contained in the processing fluid flowing in the pipeline within the liquid delivery unit 60. For example, the foreign object detection unit 69 can be located between the second connecting valve 67 and the pressure measuring unit 68 in the branch pipe 65b. Furthermore, the foreign object detection unit 69 can analyze the scattered light emitted from the branch pipe 65b after irradiating it with measuring light, thereby measuring the quantity and characteristics (size, type) of foreign objects in the processing fluid. However, the method of foreign object detection performed by the foreign object detection unit 69 is not limited to the above. Furthermore, the location of the foreign object detection unit 69 can be appropriately changed. The foreign object detection unit 69 outputs the detection results to the control device 100.

[0091] The replenishment unit 50 replenishes the processing fluid intended for delivery to the discharge unit 30 to the delivery unit 60. The replenishment unit 50 includes a liquid source 51, a pressure delivery unit 53, and a delivery pipe 55.

[0092] Liquid source 51 is the supply source of the processing liquid that is replenished to the liquid delivery unit 60. Pressure delivery unit 53 delivers the processing liquid from liquid source 51 to liquid delivery unit 60. Pressure delivery unit 53 may, for example, temporarily store the processing liquid supplied from liquid source 51 and deliver it to liquid delivery unit 60 under pressure. Alternatively, pressure delivery unit 53 may, for example, receive processing liquid by drawing it into liquid source 51 and deliver the received processing liquid to liquid delivery unit 60. Pressure delivery unit 53 may, for example, include a pump 56, a pump drive unit 57, and a pressure measuring unit 54.

[0093] Pump 56 draws in the treatment liquid from liquid source 51 and delivers the drawn-in treatment liquid to discharge section 30. Pump 56 has, for example, a receiving chamber for receiving the treatment liquid and a contraction section for contracting the receiving chamber. Pump 56 uses the contraction section to expand the receiving chamber to receive the treatment liquid and uses the contraction section to contract the receiving chamber to deliver the treatment liquid. As pump 56, for example, a tubular diaphragm pump, a diaphragm pump, or a bellows pump can be used.

[0094] The pump drive unit 57 drives the pump 56 based on the operation instruction of the control device 100. Specifically, the pump drive unit 57 actuates the contraction section (drives it) by causing the receiving chamber of the pump 56 to contract. For example, the pump drive unit 57 is a pneumatic type drive unit that uses gas to actuate the contraction section. The pump drive unit 57 can contract the receiving chamber of the pump 56 by adjusting the pressure of the gas (hereinafter referred to as "drive pressure").

[0095] The pressure measuring unit 54 acquires information about the pressure inside the pump 56. For example, the pressure measuring unit 54 is connected to the connecting pipe between the pump 56 and the pump drive unit 57, and measures the pressure inside the connecting pipe. The pressure measuring unit 54 also measures, for example, the pressure of the gas used to drive the pump 56. The pressure measuring unit 54 outputs the measured value to the control device 100.

[0096] The delivery pipe 55 guides the treatment fluid from the pressure delivery unit 53 (pump 56) to the delivery unit 60. Specifically, the delivery pipe 55 is connected to the upstream end of the delivery pipe 61 of the delivery unit 60. That is, the delivery pipe 61 is connected between the replenishment unit 50 and the delivery unit 60 via the first filter 62. The first filter 62 removes foreign matter contained in the treatment fluid (the treatment fluid replenished from the replenishment unit 50 to the delivery unit 60) flowing in the flow path within the delivery pipe 61.

[0097] The first connecting part 81 connects the replenishment part 50 and the liquid delivery part 60. The first connecting part 81 includes, for example, a switching valve 82. The switching valve 82 opens and closes the connection between the replenishment part 50 and the liquid delivery part 60 based on the operation instruction of the control device 100. The switching valve 82 is located at the connection point between the delivery pipe 55 of the replenishment part 50 and the delivery pipe 61 of the liquid delivery part 60. The switching valve 82 is, for example, a pneumatic valve.

[0098] The switching valve 82 can open and close at a rate of change of opening smaller than that of at least one of the first connecting valve 66 and the second connecting valve 67. The rate of change of opening is the proportion of the valve's opening change per unit time. When the valve switches from a closed state to an open state, the rate of change of opening is the rate at which the valve's opening increases. When the valve switches from an open state to a closed state, the rate of change of opening is the rate at which the valve's opening decreases.

[0099] The second connecting part 83 connects the liquid delivery part 60 and the discharge part 30. The second connecting part 83 includes, for example, a discharge valve 84. The discharge valve 84 opens and closes between the liquid delivery part 60 and the discharge part 30 based on the operation command of the control device 100. The discharge valve 84 is located at the connection point between the liquid delivery pipe 61 of the liquid delivery part 60 and the liquid delivery pipe 32 of the discharge part 30. The discharge valve 84 is, for example, a pneumatic valve.

[0100] The relationship between the opening change rate of discharge valve 84 and the first connecting valve 66 (second connecting valve 67) can be the same as the relationship between the opening change rate of switching valve 82 and the first connecting valve 66 (second connecting valve 67). That is, discharge valve 84 can be opened and closed with an opening change rate smaller than that of at least one of the first connecting valve 66 and the second connecting valve 67.

[0101] In the processing fluid supply unit 29, as described above, two filters, a first filter 62 and a second filter 63, are provided. These two filters allow selection based on their different capture characteristics when capturing foreign matter contained in the processing fluid. "Foreign matter capture characteristics" refers to which type of foreign matter among the various types of foreign matter contained in the processing fluid exhibits high capture performance. Furthermore, "high capture performance" means that the capture performance for this particular foreign matter is higher than its capture performance for other foreign matter.

[0102] When the processing solution is a photoresist solution, foreign matter contained in the solution can be classified into two types based on their composition. Specifically, one type consists of foreign matter made of the same material as the processing solution, while the other type consists of foreign matter made of different materials. Foreign matter made of the same material includes, for example, polymers contained in the photoresist solution forming lumps, or foreign matter generated from residues of the photoresist solution within the apparatus. Foreign matter made of different materials includes, for example, foreign matter adhering to parts of the apparatus, such as piping, that come into contact with the processing solution. When these two types of foreign matter are supplied to the workpiece W, they may become defects on the workpiece W. In particular, foreign matter made of different materials can affect etching processes that utilize the chemical reaction between the material and the photoresist solution.

[0103] Furthermore, filters may exhibit different foreign matter collection characteristics due to variations in their shape, material, and other properties. For example, when the processing fluid is an anti-corrosion solution, a filter typically uses a hollow fiber membrane as the collection unit. In such a filter, the foreign matter collection characteristics vary depending on the surface area of ​​the filter membrane, i.e., the contact area between the filter membrane and the processing fluid. As an example, there are two types of filters with different surface areas of their filter membranes. In this case, regarding the collection performance of foreign matter made of the aforementioned different types of materials, the filter with the larger surface area has higher collection performance. On the other hand, regarding foreign matter made of the same material, it is easier for foreign matter to flow from the filter with the larger surface area to the next stage; therefore, the filter with the smaller surface area is considered to have higher collection performance. Thus, the foreign matter collection characteristics of filters vary depending on the type of filter. In addition, a large contact area between the treatment liquid and the collection section (filter membrane) can be achieved, for example, by making the flow path through which the treatment liquid flows long, or by making the area of ​​each part on the primary side and the secondary side large (i.e., by providing multiple small flow paths connecting the primary side to the secondary side in the collection section within the filter).

[0104] In this embodiment, the first filter 62 is a filter with high capture performance and large surface area for foreign matter made of different types of materials. Furthermore, the second filter 63 is a filter with high capture performance and small surface area for foreign matter made of the same type of material. Additionally, the selection and configuration of the filter type can be changed depending on the application of the device, the type of processing liquid, etc.

[0105] Furthermore, the "type of foreign matter" can be classified based on the "composition" of the foreign matter, but it can also be classified based on other perspectives. For example, it can be classified based on the "size" of the foreign matter. The classification criteria can be changed according to the type of processing fluid, the content of the processing of the workpiece W after the processing fluid is supplied, and the type of defect caused by the foreign matter present in the processing fluid. In addition, when the classification criteria are changed, the conditions used to improve the capture performance can be changed according to the type of foreign matter. Therefore, the factors that cause the capture characteristics of each type of foreign matter to change in the filter (e.g., material, contact area with the processing fluid, etc.) will change. In this way, the "foreign matter capture characteristics" of the filter vary depending on the classification method of the foreign matter.

[0106] (Control device)

[0107] Reference Figure 5 and Figure 6 The control device 100 is described in detail. For example... Figure 5As shown, the control device 100 includes an action command holding unit 102, a first pressure acquisition unit 103, a second pressure acquisition unit 104, a flow acquisition unit 105, a hydraulic pressure acquisition unit 106, a change control unit 107, and a processing fluid supply control unit 101, which are functional modules (hereinafter referred to as "functional modules").

[0108] The action command holding unit 102 holds action commands for specifying the liquid processing sequence executed in the liquid processing unit U1. These action commands may include target values ​​(set values) for the discharge pressure when the processed liquid is discharged from the nozzle 31, the execution time for discharging the processed liquid from the nozzle 31, target values ​​(set values) for the replenishment pressure and replenishment flow rate, and the execution time for replenishing the processed liquid from the replenishment unit 50 to the liquid delivery unit 60. Furthermore, the action commands may also include the content and time of a cycle processing procedure that recirculates the previously supplied processed liquid from the nozzle 31.

[0109] The first pressure acquisition unit 103 acquires a measurement value from the pressure measurement unit 54. Specifically, the first pressure acquisition unit 103 acquires a measurement value representing the pressure (driving pressure to the pump 56) in the connecting pipe between the pump 56 and the pump drive unit 57 in the replenishment unit 50. The first pressure acquisition unit 103 outputs the acquired measurement value to the processing fluid supply control unit 101.

[0110] The second pressure acquisition unit 104 acquires a measurement value from the pressure measurement unit 74. Specifically, the second pressure acquisition unit 104 acquires a measurement value representing the pressure (driving pressure to the pump 71) in the connecting pipe between the pump 71 and the pump drive unit 72 in the liquid delivery unit 60. The second pressure acquisition unit 104 outputs the acquired measurement value to the processing liquid supply control unit 101.

[0111] The flow acquisition unit 105 acquires a measurement value from the flow measurement unit 73. Specifically, the flow acquisition unit 105 acquires a measurement value indicating the flow rate of the gas used to drive the pump 71 in the connecting pipe between the pump 71 and the pump drive unit 72. The flow acquisition unit 105 outputs the acquired measurement value to the processing liquid supply control unit 101.

[0112] The hydraulic acquisition unit 106 acquires a measurement value from the pressure measurement unit 68. Specifically, the hydraulic acquisition unit 106 acquires a measurement value representing the pressure of the treatment fluid between the first filter 62 and the pressure delivery unit 64 (pump 71). The hydraulic acquisition unit 106 outputs the acquired measurement value to the treatment fluid supply control unit 101.

[0113] The change control unit 107 obtains the detection results of foreign objects from the foreign object detection unit 69. Specifically, the change control unit 107 obtains information such as the quantity and size of foreign objects contained in the processing fluid flowing in the branch pipe 65b. Furthermore, based on the foreign object detection results, the change control unit 107 determines whether to change the content of the action command executed by the processing fluid supply control unit 101. If the content of the action command is changed, the action command held in the action command holding unit 102 is updated. The change control performed by the change control unit 107 will be described in detail later. Alternatively, the change control unit 107 can be omitted when change control is not performed.

[0114] The processing fluid supply control unit 101 controls the processing fluid supply unit 29 to discharge processing fluid from the nozzle 31. The processing fluid supply control unit 101 has, for example, a replenishment preparation unit 111, a replenishment control unit 112, a circulation control unit 113, a discharge preparation unit 114, and a discharge control unit 115 as functional modules.

[0115] The replenishment preparation unit 111 is configured to prepare for replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60. Specifically, before replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60, the replenishment preparation unit 111 can reduce the pressure difference between the replenishment unit 50 and the delivery unit 60, and open the switching valve 82 when the pressure difference is reduced. For example, the replenishment preparation unit 111 can change the pressure in the replenishment unit 50 by reducing the pressure difference between the replenishment unit 50 and the delivery unit 60 while the switching valve 82 is closed. As another example of replenishment preparation, the replenishment preparation unit 111 can also control the pressure delivery unit 53 (pump drive unit 57) by reducing the pressure difference between the replenishment unit 50 and the delivery unit 60 while the switching valve 82 is closed.

[0116] The replenishment control unit 112 is configured to replenish the processing fluid from the replenishment unit 50 to the delivery unit 60. Specifically, after opening the switching valve 82, the replenishment control unit 112 begins replenishing the processing fluid from the replenishment unit 50 to the delivery unit 60. As an example, after opening the switching valve 82, the replenishment control unit 112 sequentially performs pressure adjustment in the replenishment unit 50, pressure adjustment in the delivery unit 60, and re-switching the switching valve 82 to the open state before starting to replenish the processing fluid to the delivery unit 60. The replenishment control unit 112 replenishes the processing fluid from the replenishment unit 50 to the delivery unit 60 when the pressure difference between the replenishment unit 50 and the delivery unit 60 is reduced by the replenishment preparation unit 111.

[0117] The supplementary control unit 112 controls either the pressure delivery unit 53 or the pressure delivery unit 64 in a manner that makes the pressure of the processed fluid delivered from the pressure delivery unit 53 to the pressure delivery unit 64 track the target value. While controlling the pressure of the processed fluid to track the target value, the supplementary control unit 112 can also control the other pressure delivery unit 53 (pump drive unit 57) or the pressure delivery unit 64 (pump drive unit 72) in a manner that makes the flow rate of the processed fluid per unit time track the target value.

[0118] The circulation control unit 113 is configured to circulate the processing fluid within the delivery unit 60. Specifically, when the processing fluid has been replenished by the replenishment control unit 112, the circulation control unit 113 controls the opening and closing of the pump drive unit 72, the first connecting valve 66, and the second connecting valve 67 while the switching valve 82 and the discharge valve 84 are closed. In this state, the circulation of the processing fluid between the delivery pipe 61 and the branch pipes 65a and 65b can be controlled by controlling the pressure delivery unit 64 (pump drive unit 72).

[0119] The discharge preparation unit 114 is configured to prepare for discharging the treatment fluid from the nozzle 31. Specifically, the discharge preparation unit 114 can adjust the pressure of the treatment fluid in the delivery unit 60 before the discharge of the treatment fluid from the nozzle 31 begins. The discharge preparation unit 114 can change the pressure in the delivery unit 60 by reducing the pressure difference between the delivery unit 60 and the discharge unit 30 while the discharge valve 84 is closed.

[0120] The discharge control unit 115 is configured to discharge the processing fluid from the nozzle 31 to the workpiece W. Specifically, the discharge control unit 115 opens the discharge valve 84, and with the discharge valve 84 open, the processing fluid is discharged from the nozzle 31 to the workpiece W. The discharge control unit 115 can control the pressure delivery unit 64 (pump drive unit 72) in a way that the pressure of the processing fluid delivered to the nozzle 31 tracks a target value. Furthermore, the discharge control unit 115 can also discharge the processing fluid from the nozzle 31 to the workpiece W at a substantially constant flow rate by maintaining the target value at a certain set value.

[0121] The control device 100 comprises one or more control computers. For example, the control device 100 has... Figure 6 The circuit 120 shown has one or more processors 121, memory 122, registers 123, input / output ports 124, and timers 125.

[0122] The storage device 123 may be a storage medium capable of being read by a computer, such as a hard disk. The storage medium records a program for causing the coating and developing apparatus 2 to perform the liquid processing procedure described later. The storage medium may also be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 122 temporarily stores the program loaded from the storage medium of the storage device 123 and the calculation results of the processor 121. The processor 121 cooperates with the memory 122 to execute the aforementioned program, thereby constituting the aforementioned functional modules. The input / output port 124 inputs and outputs electrical signals between itself and various parts of the coating and developing apparatus 2. The timer 125 measures elapsed time, for example, by counting reference pulses of a certain period.

[0123] Furthermore, the hardware structure of the control device 100 is not limited to the functional modules being composed of programs. For example, the functional modules of the control device 100 can also be composed of dedicated logic circuits or integrated ASICs (Application Specific Integrated Circuits).

[0124] [Processing fluid supply sequence]

[0125] Reference Figure 7 and Figure 8 As an example of a control method for a substrate processing apparatus (substrate processing method), a liquid processing flow executed by the control device 100 is described. Figure 7 This is a flowchart illustrating an example of a liquid handling process.

[0126] like Figure 7 As shown, the control device 100 sequentially executes steps S01 and S02. In step S01, for example, the replenishment preparation unit 111 prepares to replenish the processing fluid from the replenishment unit 50 to the delivery unit 60, controlling the processing fluid supply unit 29 to reduce the pressure difference between the replenishment unit 50 and the delivery unit 60. In step S02, for example, the replenishment control unit 116 controls the processing fluid supply unit 29 to replenish the processing fluid from the replenishment unit 50 to the delivery unit 60 when the pressure difference between the replenishment unit 50 and the delivery unit 60 has been reduced.

[0127] Next, the control device 100 sequentially executes step S03. In step S03, for example, the circulation control unit 113 controls the opening and closing of the pump drive unit 72, the first connecting valve 66, and the second connecting valve 67 when the switching valve 82 and the discharge valve 84 are closed. In this state, the pressure delivery unit 64 (pump drive unit 72) is controlled. Details of the circulation control will be described later.

[0128] Next, the control device 100 sequentially executes steps S04 and S05. In step S04, for example, the discharge preparation unit 114 prepares for the discharge of the processing liquid from the nozzle 31, controlling the processing liquid supply unit 29 to reduce the pressure difference between the supply unit 60 and the discharge unit 30. In step S05, for example, the discharge control unit 115 controls the processing liquid supply unit 29 to discharge the processing liquid from the nozzle 31 to the workpiece W when the pressure difference between the supply unit 60 and the discharge unit 30 has been reduced. Details of the discharge preparation and discharge processes will be described later. Through these processes, the series of liquid processing steps is completed.

[0129] Here, refer to Figure 8 This explains the replenishment, circulation, and discharge processes in the above series of processes.

[0130] In the replenishment control (step S02), the replenishment control unit 112 of the control device 100 switches the switching valve 82 from the closed state to the open state. Then, it adjusts the replenishment pressure and replenishment flow rate of the processing liquid supplied from the pressure delivery unit 53 of the replenishment unit 50 to the pressure delivery unit 64 of the liquid delivery unit 60. At this time, the replenishment control unit 112... Figure 8 As shown in (a), for example, the pressure delivery unit 53 (pump drive unit 57) can be controlled based on the measured value of the pressure measurement unit 74 to make the supplementary pressure track the target value. The supplementary control unit 112 can control the pressure delivery unit 64 (pump drive unit 72) based on the measured value of the flow measurement unit 65 to make the supplementary flow track the target value. Figure 8 In (a), pipelines with internal flow of processing fluid are represented by thick lines, valves in the open state are represented by blank lines, and valves in the closed state are represented by black lines. Figure 8 (The same applies to (b) and (c)).

[0131] In the circulation control (step S03), the discharge control unit 115 of the control device 100 switches the switching valve 82 from the open state to the closed state. Then, the circulation control unit 113 drives the pressure delivery unit 64 (pump drive unit 72) with the first connecting valve 66 open and the second connecting valve 67 closed, thereby moving the processed liquid through the second filter 63. Then, the pressure delivery unit 64 (pump drive unit 72) is driven with the first connecting valve 66 closed and the second connecting valve 67 open. By repeatedly performing this operation, the processed liquid is circulated in the order of passing through the second connecting valve 67, the pump 71, and the first connecting valve 66. During this time, the processed liquid alternately passes through the first filter 62 and the second filter 63.

[0132] In the discharge control (step S05), the discharge control unit 115 of the control device 100, with the switching valve 82 and the first connecting valve 66 closed, switches the discharge valve 84 from the closed state to the open state. Then, the discharge control unit 115 adjusts the discharge pressure of the treatment fluid supplied to the nozzle 31. Specifically, it starts controlling the pressure delivery unit 64 (the contraction section of the pump 71). Thus, the discharge control unit 115 begins the discharge of the treatment fluid from the nozzle 31 with the discharge valve 84 open. At this time, the discharge control unit 115 can adjust the pump drive unit 72 (the pressure applied to the treatment fluid by the pump 71) based on the measurement value from the pressure measuring unit 68. After a predetermined time, the discharge control unit 115 maintains the closed state of the switching valve 82 and the first connecting valve 66, and switches the second connecting valve 67 and the discharge valve 84 from the open state to the closed state, respectively. This ends the discharge process.

[0133] The aforementioned time is determined by the action command held by the action command holding unit 102, for example, it is preset according to the amount of processing liquid used in each liquid processing. During the discharge of the processing liquid, the control device 100 can control the rotation holding unit 20 to rotate the workpiece W, thereby forming a resist coating film on the surface Wa of the workpiece W.

[0134] [Regarding the change in the movement path of the treatment fluid]

[0135] The aforementioned substrate processing apparatus includes a foreign object detection unit 69. The change control unit 107 can determine, based on the foreign object detection result from the foreign object detection unit 69, whether to change the content of the operation command executed in the processing fluid supply control unit 101. (See reference...) Figure 9 and Figure 10 This describes the process for changing the handling of foreign object detection results.

[0136] like Figure 9 As shown, the control device 100 executes step S11. In step S11, for example, the change control unit 107 obtains the detection result of the foreign matter detection unit 69. The detection result of the foreign matter detection unit 69 may include, for example, information corresponding to the number of foreign matter contained in the processing liquid (the number of foreign matter per unit volume). In addition, the detection result may also include information indicating what kind of foreign matter is contained in the processing liquid (to what extent is it contained).

[0137] Next, the control device 100 executes step S12. In step S12, for example, the change control unit 107 determines whether to change the operation command based on the detection result of the foreign matter. Whether to change the operation command can be determined, for example, based on a threshold predetermined for the number of foreign matter in the processing fluid. For example, if the number of foreign matter in the processing fluid is below the threshold, the operation command can be changed to end the circulation of the processing fluid. Furthermore, if the number of foreign matter in the processing fluid is above the threshold, the operation command can be changed to repeatedly circulate the processing fluid (increasing the number of cycles).

[0138] If it is determined in step S12 that the content of the action command has been changed, the control device 100 executes step S13. In step S13, for example, the content recorded in the action command held in the action command holding unit 102 is changed. The changed content may be, for example, a change in the number of cycles of the processing fluid, or other content corresponding to the judgment criteria. Through the above processing, the series of processing flows regarding the change of command content is completed. When the command content is changed, the processing fluid supply control unit 101 can immediately reflect the change and perform processing based on the change.

[0139] Figure 10 (a) and Figure 10 In (b), the difference in the movement path of the treatment fluid due to the presence or absence of circulation is indicated. For example, Figure 10 In (a), it is shown that the processing fluid circulates in the order of delivery pipe 61, branch pipes 65b and 65a, and then reaches the discharge valve 84 of the subsequent stage via delivery pipe 61 and branch pipe 65b again. At this time, the processing fluid passes through the filters in the order of first filter 62, second filter 63, and first filter 62, and then reaches the nozzle of the subsequent stage via discharge valve 84. The operation command held by the operation command holding unit 102 specifies this process flow of the processing fluid.

[0140] on the other hand, Figure 10 In (b), it indicates that the processed liquid does not circulate but reaches the discharge valve 84 of the subsequent stage via the delivery pipe 61 and branch pipe 65b. In this case, the processed liquid, after passing only through the first filter 62, reaches the nozzle of the subsequent stage via the discharge valve 84. Figure 10 As shown in (b), when a foreign matter detection unit 69 is provided in the branch pipe 65b, foreign matter in the processing liquid can be evaluated during the stage when the processing liquid reaches the branch pipe 65b. Foreign matter evaluation can be performed at this stage, and the subsequent processing can be modified based on the results. For example, if it is determined that there are sufficiently few foreign matter in the processing liquid, such as... Figure 10 As shown in (b), the instruction can be modified to allow direct access to the nozzle via the discharge valve 84. Furthermore, if it is determined that the processing fluid contains a certain amount of foreign matter, such as... Figure 10As shown in (a), the flow of the processing fluid in the branch pipe 65a can be controlled according to the original instruction. The flow of the processing fluid can be controlled by changing the detection result of the foreign object detection unit 69. When the operation instruction is changed to alter the flow of the processing fluid, the control device 100 controls each valve and the pressure delivery unit 64 to achieve the changed flow of the processing fluid.

[0141] Furthermore, while the above description illustrates the flow of the processing fluid in the processing fluid supply unit 29, the opening and closing actions of the valves and the operation of the pressure delivery unit 64 are merely examples. By changing the actions of each part, various flow patterns of the processing fluid can be achieved. In other words, by changing the opening and closing actions of the valves and the operation of the pressure delivery unit 64, the flow of the processing fluid in the delivery pipe 61, branch pipes 65b, and 65a can be flexibly controlled. For example, in the processing fluid supply unit 29, the circulation direction of the processing fluid may not be from branch pipe 65b to branch pipe 65a, but rather... Figure 10 As shown in (c), control is performed in the reverse manner. Specifically, the first connecting valve 66 on branch pipe 65b (refer to...) is controlled in a reverse manner. Figure 4 The second connecting valve 67 on branch pipe 65b is in the open state (refer to...). Figure 4 With the switching valve 82 closed, when the pump 71 draws in the processing liquid, the processing liquid moves in the opposite direction. At this time, a circulating flow of the processing liquid is formed from the downstream side to the upstream side at the first filter 62. After this reverse circulation, the processing liquid flowing in the branch pipe 65a can be controlled to be discharged from the nozzle via the branch pipe 65b and the discharge valve 84 by switching the opening and closing states of the first connecting valve 66 and the second connecting valve 67 and by operating the pump 71. At this time, the processing liquid that has passed through the second filter 63 is discharged from the nozzle, thus the second filter 63 essentially becomes the downstream filter. In this way, according to the processing liquid supply unit 29 described above, by changing the instructions for controlling the flow of the processing liquid, the filter that is essentially the downstream filter can be changed.

[0142] Furthermore, as an opportunity to change the flow of the processing fluid, the results of subsequent processing of the workpiece W can be used instead of the detection results of the foreign matter detection unit 69. For example, if the workpiece W is etched in a subsequent stage, the flow of the processing fluid can be changed according to the after-etching inspection (AEI). For example, if the result of the after-etching inspection is that there are more defect residues caused by foreign matter with high trapping performance of the second filter 63, then by passing the processing fluid through the second filter 63 in a subsequent stage compared to the first filter 62, the foreign matter removal effect using the trapping performance of the second filter 63 is improved. Thus, by utilizing the aforementioned characteristic of the changeable flow of the processing fluid, a structure can be adopted to change the flow of the processing fluid by placing the second filter 63 in a subsequent stage (the most downstream).

[0143] [effect]

[0144] According to the aforementioned substrate processing apparatus (coating and developing apparatus 2) and substrate processing method, multiple filters (first filter 62 and second filter 63) are installed at different positions on the pipelines (liquid supply pipe 61 and branch pipes 65a, 65b) through which the processing liquid flows. Therefore, the processing liquid from the supply source (liquid source 51) is supplied to the nozzle 31 through multiple filters. Furthermore, these filters have different capture characteristics for various types of foreign matter anticipated to be contained in the processing liquid, allowing multiple types of foreign matter contained in the processing liquid to be captured by multiple filters. This further reduces the amount of foreign matter in the processing liquid discharged to the substrate.

[0145] When performing liquid processing on a substrate by draining the processing solution, there is a possibility that foreign matter contained in the processing solution may cause defects. Therefore, in order to remove foreign matter, a method of installing filters in the flow path and passing the processing solution through them has been studied. In the substrate processing apparatus and substrate processing method described in the above embodiments, attention is paid to the case where there are multiple types of foreign matter contained in the processing solution, and multiple filters with different foreign matter collection characteristics are installed in the pipeline. Therefore, foreign matter in the processing solution can be effectively removed by utilizing the different collection characteristics of multiple filters. In addition, depending on the filters, there is a possibility that components of the processing solution remaining from previous flow of the processing solution may flow out as foreign matter to subsequent stages. In such cases, for example, by installing a filter with high collection performance for this type of foreign matter in the subsequent stage, foreign matter can be removed from the processing solution before the substrate is drained. By adopting such a structure by installing multiple filters with different collection characteristics, foreign matter in the processing solution can be reduced before the substrate is drained.

[0146] Furthermore, the capture characteristics of filters vary depending on the type of filter, allowing for the selection of filters with high capture performance for foreign matter that frequently causes defects after liquid treatment of the substrate. By employing a filter structure that allows the treatment fluid to pass through, foreign matter with a high defect occurrence frequency can be removed from the treatment fluid. Therefore, the occurrence of defects in the substrate can be suppressed.

[0147] Furthermore, as multiple filters, filters with different contact areas with the processing liquid in the collecting section (e.g., hollow fiber membrane) can be selected. When applying filters of the same shape and material to a specific processing liquid, the collection characteristics for foreign matter can be altered by making the contact areas of the collecting section with the processing liquid different. Such filter characteristics can be used to construct multi-stage filters in a substrate processing apparatus.

[0148] Furthermore, when using multiple filters, the filter with the highest capture performance for foreign matter that frequently causes defects after the subsequent liquid treatment of the substrate can be placed at the very downstream end of the pipeline. Moreover, "very downstream" simply means the very last filter the treatment liquid passes through before exiting from nozzle 31. By adopting this structure, foreign matter with a high defect occurrence rate can be appropriately removed using the most downstream filter, thereby suppressing the occurrence of defects in the substrate.

[0149] The pipeline may include: a liquid delivery pipe 61 serving as a main pipeline connecting the supply source and the nozzle; and branch pipes 65a and 65b forming a bypass pipeline connecting two branch points of the main pipeline. The liquid delivery unit 60 may have a pump 71 serving as a liquid delivery pump installed in the bypass pipeline. Furthermore, among the multiple filters, a first filter (first filter 62) with the highest collection performance for foreign matter of the type with a high frequency of defect occurrence is installed between the two branch points P1 and P2 in the main pipeline. In this case, the first filter 62 can be installed downstream of the other filters. Furthermore, at least one of the filters different from the first filter can be installed in the bypass pipeline. By adopting such a structure, the first filter can be used to properly remove foreign matter related to defects.

[0150] Alternatively, a structure can be adopted in which the filter installed in the bypass pipeline is located upstream of the liquid delivery pump in the bypass pipeline. In this case, when the processing liquid is discharged from the nozzle 31 using the liquid delivery pump (pump 71), it can pass through the first filter last. That is, the first filter can be positioned at the substantially downstream position, so that foreign matter with a high frequency of defects can be properly removed using the downstream filter (first filter 62).

[0151] Furthermore, as described in the above embodiment, a control unit (control device 100) may also be included to control the liquid delivery unit 60. Additionally, the liquid delivery unit 60 may also include a foreign matter detection unit 69 for detecting foreign matter in the processed liquid, located downstream of the liquid delivery pump in the bypass pipeline. Furthermore, the control device 100 can control the flow of the processed liquid in the pipeline based on the detection results of the foreign matter detection unit 69. By employing a structure that changes the flow of the processed liquid in the main pipeline and the bypass pipeline based on the detection results of the foreign matter detection unit 69, for example, the number of times the processed liquid passes through the filter can be adjusted considering factors such as the residual level of foreign matter in the processed liquid. This allows for control that can better remove foreign matter from the processed liquid.

[0152] Furthermore, the flow control of the processing fluid in the main pipeline and bypass pipeline can be modified by changing the filter that the processing fluid last passes through before reaching nozzle 31, depending on the occurrence of defects on the processed substrate. In this case, for example, the processing fluid can be passed through the filters in a more suitable order based on the occurrence of defects on the processed substrate. Therefore, appropriate control measures can be determined to prevent defects from being generated in the processed substrate.

[0153] [Other Implementation Methods]

[0154] The above describes various illustrative implementation methods, but is not limited to the illustrative implementation methods described above. Various omissions, substitutions, and modifications can be made. Furthermore, elements of different implementation methods can be combined to form other implementation methods.

[0155] For example, the structure between the supply source (liquid source 51) and the nozzle 31, that is, the structure for supplying the treatment liquid to the nozzle 31 (discharge section 30), can be appropriately modified to include the pressure delivery section, pipelines, etc. The configuration of the supply pump (pump 71) in the pipeline can also be appropriately modified. Furthermore, the configuration of the filter can be appropriately modified according to the pipeline structure.

[0156] Figure 11 (a) and Figure 11 In (b), a variation of the filter configuration in the same piping configuration as in the above embodiment is shown. Figure 11 (a) indicates an example where the second filter 63 is configured on branch pipe 65b, downstream of pump 71, instead of on branch pipe 65a. With this configuration, it is compatible with... Figure 8The same operation shown in (c) supplies the processing fluid to the nozzle 31 via the discharge valve 84, with the processing fluid being supplied to the nozzle 31 after passing through the second filter 63. On the other hand, depending on the operation of the pump 71 and the valve, a structure can also be adopted in which the processing fluid is finally supplied to the nozzle 31 through the first filter 62. In this way, the filter can be configured either upstream or downstream of the pump 71.

[0157] also, Figure 11 (b) illustrates an example where the first filter 62 is positioned downstream of the branch point P2, which is downstream of the branch pipe 65b, which serves as a bypass line. In this case, the process fluid circulating in the circulation path including the bypass line or passing through the delivery pipe 61 must pass through the first filter 62 before being supplied to the nozzle 31 via the discharge valve 84. With this configuration, it is not possible to bypass the downstream first filter 62, but by changing the number of circulations of the upstream process fluid, it is possible to control, for example, to bypass the second filter 63. In this way, the filter configuration can be appropriately changed according to, for example, the characteristics of the process fluid, the characteristics of the foreign matter that the filter is removing, etc. Furthermore, the positional relationship between the valve and the filter can also be appropriately changed.

[0158] Furthermore, the number of filters can be changed appropriately. Additionally, when increasing the number of filters, some of the multiple filters can be of the same type with the same trapping characteristics.

[0159] Furthermore, the above embodiments describe the case where the treatment liquid is a photoresist solution, but the same structure can also be set up with a treatment liquid that is different from a photoresist solution.

[0160] Alternatively, the structure may not include the foreign object detection unit 69. Furthermore, the foreign object detection unit 69 may be located in other positions within the pipeline (different from the location of branch pipe 65b).

[0161] Based on the above description, various embodiments of the present invention have been described in this specification for illustrative purposes. However, it should be understood that various modifications can be made without departing from the scope and spirit of the present invention. Therefore, the various embodiments disclosed in this specification are not limiting, and the scope and spirit of the present invention are defined by the scope claimed.

[0162] Explanation of reference numerals in the attached figures

[0163] 1…Substrate processing system, 2…Coating and developing apparatus, 3…Exposure apparatus, 4…Carrier block, 5…Processing block, 6…Interface block, 20…Rotating holding unit, 21…Holding unit, 22…Drive unit, 29…Processing liquid supply unit, 30…Discharge unit, 31…Nozzle, 32…Liquid delivery pipe, 50…Replenishment unit, 51…Liquid source, 53…Pressure delivery unit, 54…Pressure measuring unit, 55…Outlet pipe, 56…Pump, 57…Pump drive unit, 60…Liquid delivery unit, 61…Liquid delivery pipe, 62…First filter, 63…Second filter, 64…Pressure delivery unit, 65…Flow measurement unit, 65a, 65b…Branch pipes, 66…First connecting valve, 67… …Second connecting valve, 68…Pressure measuring unit, 69…Foreign object detection unit, 71…Pump, 72…Pump drive unit, 73…Flow measuring unit, 74…Pressure measuring unit, 81…First connecting unit, 82…Switching valve, 83…Second connecting unit, 84…Discharge valve, 100…Control device, 101…Processing fluid supply control unit, 102…Action command holding unit, 103…First pressure acquisition unit, 104…Second pressure acquisition unit, 105…Flow acquisition unit, 106…Hydraulic pressure acquisition unit, 107…Change control unit, 111…Replenishment preparation unit, 112…Replenishment control unit, 113…Circulation control unit, 114…Discharge preparation unit, 115…Discharge control unit.

Claims

1. A substrate processing apparatus, characterized in that, include: A discharge section having a nozzle for discharging processing liquid to a substrate; A liquid delivery unit that delivers the treatment liquid to the discharge unit; and A supply source for supplying the treatment liquid, which is used to be sent to the discharge section, to the liquid delivery section; Control unit that controls the liquid delivery unit; A first valve that opens and closes between the supply source and the liquid delivery unit; and A second valve that opens and closes between the liquid delivery section and the discharge section; The liquid delivery unit has: Piping for the flow of the treatment fluid; and Multiple filters, positioned at different locations on the pipeline, have different capture characteristics for various types of foreign matter that are expected to be present in the treated liquid. The pipeline includes a main pipeline connecting the supply source and the nozzle; And a bypass pipeline formed by connecting the two branch points of the main pipeline. The liquid delivery unit also has: A liquid delivery pump installed in the bypass pipeline; One or more valves that open and close the bypass line; and A foreign matter detection unit that detects foreign matter in the treatment liquid on the downstream side of the liquid delivery pump in the bypass pipeline. Of the plurality of filters, the first filter is positioned downstream of the filters other than the two branch points in the main pipeline. The first filter exhibits the highest capture performance for foreign matter that frequently causes defects resulting from subsequent liquid treatment of the substrate. At least one filter, different from the first filter, is disposed in the bypass pipeline. The control unit controls the first valve, the second valve, one or more valves that open and close the bypass pipeline, and the liquid delivery pump based on the detection results of the foreign object detection unit, so as to change the flow of the processing liquid in the main pipeline and the bypass pipeline.

2. The substrate processing apparatus as described in claim 1, characterized in that: The plurality of filters include filters with high capture performance for foreign matter of the kinds that occur most frequently after liquid treatment of the substrate.

3. The substrate processing apparatus as described in claim 1 or 2, characterized in that: The contact areas between the collection sections of the plurality of filters and the treatment liquid are different from each other.

4. The substrate processing apparatus as described in claim 1, characterized in that: The filter installed in the bypass pipeline is located upstream of the liquid delivery pump in the bypass pipeline.

5. A substrate processing apparatus, characterized in that, include: A discharge section having a nozzle for discharging processing liquid to a substrate; A liquid delivery unit that delivers the treatment liquid to the discharge unit; A supply source for supplying the treatment liquid, which is used to be sent to the discharge section, to the liquid delivery section; Control unit that controls the liquid delivery unit; A first valve that controls the opening and closing of the supply source and the liquid delivery unit; A second valve that opens and closes between the liquid delivery section and the discharge section; The liquid delivery unit has: Piping for the flow of the treatment fluid; and Multiple filters, positioned at different locations on the pipeline, have different capture characteristics for various types of foreign matter that are expected to be present in the treated liquid. The pipeline includes a main pipeline connecting the supply source and the nozzle; And a bypass pipeline formed by connecting the two branch points of the main pipeline. The liquid delivery unit also has: A liquid delivery pump installed in the bypass pipeline; and One or more valves that open and close the bypass pipeline; Of the plurality of filters, the first filter is positioned downstream of the filters other than the two branch points in the main pipeline. The first filter exhibits the highest capture performance for foreign matter that frequently causes defects resulting from subsequent liquid treatment of the substrate. At least one filter, different from the first filter, is provided in the bypass pipeline. The control unit controls the first valve, the second valve, one or more valves that open and close the bypass pipeline, and the liquid delivery pump according to the occurrence of defects in the processed substrate, so as to change the last filter that the processed liquid passes through before reaching the nozzle.

6. The substrate processing apparatus as described in claim 5, characterized in that: The plurality of filters include filters with high capture performance for foreign matter of the kinds that occur most frequently after liquid treatment of the substrate.

7. The substrate processing apparatus as described in claim 5 or 6, characterized in that: The contact areas between the collection sections of the plurality of filters and the treatment liquid are different from each other.

8. The substrate processing apparatus as described in claim 7, characterized in that: The filter installed in the bypass pipeline is located upstream of the liquid delivery pump in the bypass pipeline.

9. A substrate processing method, wherein a processing liquid from a supply source is discharged from a nozzle to a substrate via a pipeline, the substrate processing method being characterized in that: The treatment fluid is passed through multiple filters located at different positions on the pipeline, each with different capture characteristics for various types of foreign matter that are expected to be present in the treatment fluid. The pipeline includes: The main pipeline connecting the supply source and the nozzle; A bypass pipeline formed by connecting two branch points located on the main pipeline; and a liquid delivery pump installed in the bypass pipeline, Of the plurality of filters, the first filter is positioned downstream of the filters other than the two branch points in the main pipeline. The first filter exhibits the highest capture performance for foreign matter that frequently causes defects resulting from subsequent liquid treatment of the substrate. At least one filter, different from the first filter, is disposed in the bypass pipeline. Based on the detection result of the foreign matter detection unit that detects foreign matter in the treatment fluid downstream of the liquid delivery pump in the bypass pipeline, the flow of the treatment fluid in the main pipeline and the bypass pipeline is controlled by a first valve that opens and closes between the supply source and the pipeline, a second valve that opens and closes between the pipeline and the nozzle, one or more valves that open and close the bypass pipeline, and the liquid delivery pump, so as to change the flow of the treatment fluid in the main pipeline and the bypass pipeline.

10. A substrate processing method, wherein a processing liquid from a supply source is discharged from a nozzle to a substrate via a pipeline, the substrate processing method being characterized in that: The treatment fluid is passed through multiple filters located at different positions on the pipeline, each with different capture characteristics for various types of foreign matter that are expected to be present in the treatment fluid. The pipeline includes: The main pipeline connecting the supply source and the nozzle; A bypass pipeline formed by connecting two branch points located on the main pipeline; and a liquid delivery pump installed in the bypass pipeline, Of the plurality of filters, the first filter is positioned downstream of the filters other than the two branch points in the main pipeline. The first filter exhibits the highest capture performance for foreign matter that frequently causes defects resulting from subsequent liquid treatment of the substrate. At least one filter, different from the first filter, is disposed in the bypass pipeline. Based on the occurrence of defects in the processed substrate, control is exercised over a first valve that opens and closes between the supply source and the pipeline, a second valve that opens and closes between the pipeline and the nozzle, one or more valves that open and close the bypass pipeline, and the liquid delivery pump, so as to change the filter through which the processed liquid last passes before reaching the nozzle.

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