Optoelectronic transducer module and system for thermal imaging temperature measurement

Abstract

Examples of a photoelectric transducer module with integrated signal processing for thermal imaging temperature measurements are disclosed. The module includes a light source to provide excitation light, an optical element to couple light to an optical port, a connector configured to connect the photoelectric transducer module to a fiber optic sensor, a detector coupled to the optical port to detect emitted light from the fiber optic sensor and convert the detected emitted light to an electrical signal, a module processor coupled to the light source and the detector configured to convert the electrical signal to a set of digital results, a high-speed circuit in communication with an external processing unit for data aggregation, and a low-speed circuit in communication with the external processing unit for configuration and firmware upgrades in the module. Systems for thermal imaging temperature measurements are also disclosed.

Description

Technical Field

[0001] This disclosure relates generally to photoelectric transducer modules, and more specifically to photoelectric transducer modules with integrated signal processing for thermal imaging temperature measurement. Background Technology

[0002] Unless otherwise stated herein, the materials described in this section are not prior art of this application and cannot be recognized as prior art by virtue of their inclusion in this section.

[0003] Fiber optic temperature sensors, such as phosphor-based sensors, are fiber optic probes that transmit excitation light to a sensing material (e.g., a phosphor) and use the light emitted from the phosphor to determine the temperature of an object in contact with the sensing material. Typically, thermal imaging phosphors emit light in different wavelength ranges when excited by light within a specific wavelength range. Certain properties of the emitted light vary with temperature, including brightness, color, and afterglow duration. The response of the emitted light to temperature is monitored by various methods, such as analyzing changes in emission intensity within a single wavelength range or changes in the intensity ratio of two or more wavelength ranges, lifetime decay, or shifts in the emission wavelength peak. The phosphor used to measure the temperature of an object is either directly coated onto the object's surface or placed inside the probe and in contact with the surface, which is then illuminated by a light source, and the object's temperature is determined based on the response of the emitted light.

[0004] Standard fiber optic temperature measurement systems known in the prior art include fiber optic probes with active sensing material at their tips, which can be connected to optoelectronic devices that process the detection signal and also include calibration data. Typically, a single calibration curve is used to calibrate certain product lines of fiber optic sensors, which can reduce sensor accuracy. Using calibration curves individually matched to the sensing element is unattractive to users because the associated optoelectronic devices are not interchangeable, thus limiting the use of such sensors. Some known sensors, such as the one disclosed in WO2021051204, describe fiber optic temperature sensors with calibration data stored externally in the optoelectronic device housing (located in either the fiber optic probe or the connector), allowing the same (universal) optoelectronic device to be used with different calibration data. Failure of optoelectronic devices in fiber optic temperature sensors is often associated with significant downtime and manufacturing costs, especially in the semiconductor industry. Currently, in the fiber optic temperature sensing industry, there are no available replaceable (hot-swappable) optoelectronic conversion modules available during operation to avoid large downtime. Users cannot replace failed optoelectronic transducers during instrument operation, nor can they fill (configure) the channel count with unused optoelectronic modules.

[0005] The most common failure of a photoelectric transducer is the failure of the light source that excites the light (LED failure). When the LED fails, the manufacturing process must be stopped to replace the failed photoelectric transducer. Summary of the Invention

[0006] On one hand, a photoelectric independent transducer module with integrated signal processing for thermal imaging temperature measurement is provided. The module includes: a housing having a mounting device; a light source for providing excitation light; optical elements for coupling light to an optical port; a connector configured to connect the photoelectric transducer module to a fiber optic sensor; a detector coupled to the optical port to detect light emitted from the fiber optic sensor and convert the detected emitted light into an electrical signal; and a module processor coupled to the light source and detector, configured to convert the electrical signal into a set of digital results. The module processor includes non-volatile memory containing configuration and calibration data associated with the detector and fiber optic sensor, enabling the module processor to process thermal imaging temperature measurements using the fiber optic sensor. The module also includes: high-speed circuitry communicating with an external data processing and power supply and regulation system for data aggregation; and low-speed circuitry communicating with the external data processing and power supply and regulation system for configuration and firmware upgrades within the module. The independent photoelectric transducer module can be inserted into the receiving port of an external data processing and power supply and regulation system, so that the independent photoelectric transducer module is powered by the external data processing and power supply and regulation system.

[0007] On the other hand, a system for thermal imaging temperature measurement is provided. This system includes a data processing and power supply and regulation system, comprising: a housing having at least one receiving port; a data processing unit for data aggregation; a communication device for receiving and transmitting data; and a power supply and regulation unit. The system also includes an integrated signal processor and a photoelectric independent sensor module for thermal imaging temperature measurement, the photoelectric independent sensor module comprising: a housing having mounting means for insertion into at least one receiving port of the data processing and power supply and regulation system; a light source for providing excitation light; optical elements for coupling light to an optical port; a connector configured to connect the photoelectric transducer module to a fiber optic sensor; a detector coupled to the optical port to detect light emitted from the fiber optic sensor and convert the detected emitted light into an electrical signal; and a module processor coupled to the light source and detector, configured to convert the electrical signal into a set of digital results. The module processor includes non-volatile memory containing configuration data and calibration data associated with the detector and the fiber optic sensor, enabling the module processor to process thermal imaging temperature measurements using the fiber optic sensor. The system also includes: high-speed circuitry that communicates with the data processing and power supply and regulation system for data aggregation and low-speed circuitry that communicates with the data processing and power supply and regulation system for configuration and firmware upgrades within the modules, enabling independent photoelectric transducer modules to be inserted into the receiving port of the data processing and power supply and regulation system, and enabling the independent photoelectric transducer modules to be powered by the data processing and power supply and regulation system.

[0008] In addition to the aspects and embodiments described above, other aspects and embodiments will become apparent upon reference to the accompanying drawings and the following detailed description. Attached Figure Description

[0009] Throughout the accompanying drawings, reference numerals may be used repeatedly to indicate the correspondence between referenced elements. The drawings are provided to illustrate exemplary embodiments described herein and are not intended to limit the scope of this disclosure. The size and relative position of elements in the drawings are not necessarily drawn to scale. For example, angles and the shapes of various elements are not drawn to scale, and some of these elements have been arbitrarily enlarged and positioned to improve the readability of the drawings.

[0010] Figure 1 This is a schematic diagram of an example of the photoelectric transducer module of the present invention.

[0011] Figure 2 This is a schematic diagram of another example of the photoelectric transducer module of the present invention.

[0012] Figure 3 This is a schematic diagram of an example of a photoelectric platform with six channels, each channel being connected to a separate photoelectric transducer module.

[0013] Figure 4 This is a photographic example of an optoelectronic platform with multiple channels for optoelectronic transducer modules. Detailed Implementation

[0014] Typically, photoelectric transducers used in fiber optic temperature measurement systems have slower response times compared to their associated high-speed control loops. This is due to a combination of factors including the sensor's active materials, probe design, interrogation electronics speed, and data acquisition / conversion delays. Typically, photoelectric transducers used in fiber optic temperature measurement systems are designed with a single processor that performs multiple functions, such as sensor interrogation (analog-to-digital (AD) conversion and signal processing), communication with external digital systems, and conversion of digital signals to analog values ​​(4-20mA) for temperature control. The inherent sensitivity of optical measurement, AD conversion, and computation, combined with the uncertainty of digital interface communication, limits the response and communication efficiency of the single-processor design. The photoelectric transducer module of this invention is a standalone module with a dedicated processor for processing the luminous signals received from the fiber optic sensor and can be plugged into an external data processing, power supply, and regulation system. This standalone photoelectric transducer module is powered by an external data processing, power supply, and regulation system, allowing it to be easily replaced during operation from or in any suitable higher-level data processing system. This modular configuration of the photoelectric transducer allows for scalable, rapid measurement, data collection, and data transmission.

[0015] For the purposes of this application, "independent" means that the transducer module includes all necessary hardware, firmware, and calibration to be able to query the fiber optic temperature sensor connected to its optical port. This means that it is manufactured as a module and tested / calibrated as an independent unit, where functionality (e.g., measuring luminescence decay) is verified and calibrated, and therefore can be exchanged between different systems while still retaining all the functionality of thermal imaging temperature measurement with calibration data. For the purposes of this application, "pluggable" means that the independent optoelectronic module can be plugged into a higher-level data processing system by the user. Without the optoelectronic module plugged in, the higher-level data processing system cannot perform measurement functions. The optoelectronic module can be replaced (inserted / removed) by the user without tools. The optoelectronic module includes a predefined electrical / communication interface that must be attached to the external data processing system. After the optoelectronic module is plugged into the higher-level data processing system, it is powered on and begins its operation.

[0016] Figure 1An example of a standalone optoelectronic transducer module 10 is shown. Module 10 can be a miniaturized pluggable (xFOT) module. The modular design allows for the removal and replacement of a failed module 10 without halting the manufacturing process. This also allows users the flexibility to configure the system for specific applications. The module can be a standalone interrogator and includes excitation and detection optics and circuitry, as well as calibration and configuration data.

[0017] The photoelectric transducer module 10 is configured to integrate a signal processing device for thermal imaging temperature measurement. Module 10 includes a housing with mounting means, such as a plug for insertion into a channel of any suitable higher-level data processing system. The housing may include: a light source 14 providing excitation light; an optical element 16 for coupling the excitation light to an optical port; and a detector 15 coupled to the optical element 16 to detect light emitted from an active material coupled to the tip of the fiber optic probe 20. The light source may be an LED or a lamp that can provide, for example, UV light with wavelengths between 200-400 nm or light in the blue-to-green wavelength range (e.g., 400-600 nm). In one implementation, the light source 14 may be a cluster of multiple LEDs. In another implementation, the light source 14 may include two or more light sources (LEDs) that can be redundant excitation sources in the event of a primary LED failure. The optical element 16 may be a beam splitter coupling the excitation light to the optical port. A connector 13 communicates with the optical port and is configured to connect the photoelectric transducer module 10 to the fiber optic probe 20. In one embodiment, the light source 14 may be a flip-chip LED with multiple LEDs closely spaced to form a tight cluster, allowing coupling to the optical port using the same optics (e.g., beam splitters and / or any lenses) as when using a single LED. In another embodiment, redundant active elements (LEDs) are optically coupled in the same optical path using cold mirrors and lenses and focused into the same optical port.

[0018] In one implementation, detector 15 may be a photodiode capable of converting an optical signal (emitted light) into an electrical signal. Photons absorbed by the photodetector (e.g., photodiode) generate an electric current. In some embodiments, an amplifier (not shown) may be used to amplify the electrical signal. Module processor 17 is operatively coupled to light source 14 and detector 15 and configured to convert the electrical signal into a set of digital signals / results. In one embodiment, receiver and power monitor 11 may be used to monitor the intensity of the excitation light and provide data to module processor 17, which is configured to switch any redundant LEDs when a failure of the excitation light source is detected (e.g., if the light intensity level drops and reaches a preset value).

[0019] Optical element 16 may include a collimating lens and / or a cold mirror to separate the excitation light and the emitted light. In one embodiment, optical element 16 may be a fiber bundle separator to separate the excitation light from the emitted light. Figure 2 In the illustrated embodiment, the optical element 16 is replaced by a transmitter and a receiver, wherein the splitter is externally formed by an optical fiber bundle extension / splitter. It may include: an illumination connector 1014 for coupling the light source 14 to the optical fiber bundle 1114 and the optical fiber probe 1020; and a detection connector 1015 for coupling to the detector 15. Therefore, the optical fiber bundle 1114 includes a first bundle for transmitting excitation light to the active material and a second bundle for transmitting emitted light back to the detector 15.

[0020] Module processor 17 may include non-volatile memory 18 containing configuration and calibration data related to fiber optic probe 20 and active sensing material. Module 10 also includes high-speed circuitry 8 and low-speed circuitry 9, which communicate with the external data processing and power supply and regulation system 12 in the field via data buffer 19. High-speed circuitry 8 allows high-speed data transfer for data aggregation in the external data processing and power supply and regulation system 12, while low-speed circuitry 9 is configured for configuration and firmware upgrades within the module. This multi-processing architecture configuration for the fiber optic temperature measurement system provides independent optoelectronic transducer modules 10 that can be tightly coupled to the sensing medium for better sensing signal quality. Each optoelectronic transducer module 10 has a dedicated processor for each individual sensor (probe 20), enabling all optical measurements, calculations, and optical data-to-digital data conversion to be performed locally within module 10. Using a dedicated high-speed data transfer bus 19, module 10 communicates with the external (dedicated master) data processing and power supply and regulation system 12, where all data management, power supply, and user interface services are performed. Temperature values ​​can be collected autonomously, independently of the measurement, within an external data processing and power supply and regulation system 12. This external data processing and power supply and regulation system 12 can have a dedicated fast real-time operating system (RTOS) processor that can process data in real time without buffering delays and can provide: 1) interrogation of the xFOT sensor module 10; 2) provisioning of collected temperature measurements to digital interface devices (EtherCAT, RS-485) and analog interfaces (4-20mA); and 3) a system configuration interface for the photoelectric transducer module 10. The photoelectric transducer module 10, with integrated signal processing, can provide improved performance for fiber optic temperature measurement systems, including faster response times compared to photoelectric transducers with a single processor, and the parallel / distributed approach to computation, data collection, and interface processing improves the accuracy and response time for larger sensor networks used in measurements.

[0021] By moving the power supply, communication interface, and control equipment outside the photoelectric transducer module 10, it can be scaled down to a smaller size. Figure 3 An example of a measurement system with a housing 100 is shown, having at least one receiving port (channel) for connecting at least one photoelectric transducer module 10 to an external (main) data processing and power supply and regulation system 12. Figure 2 In the illustrative example shown, there are six channels, with six modules 10 connected to six individual fiber optic probes 20. All six modules 10 communicate with an external data processing and power supply and regulation system 12 using a dedicated high-speed data transmission bus 19. The external data processing and power supply and regulation system 12 may include digital interface devices 115, 116 (i.e., EtherCAT, RS-485) and an analog interface device 117 (4-20mA) for temperature measurement.

[0022] The data processing and power supply and regulation system 12 may be a proportional-integral-derivative (PID) controller, an industrial controller, a sensor network distributor, etc., so that module 10 can be integrated into the PID controller by a third party to minimize the control response time and latency; or it may be part of a distributed sensor network around semiconductor tools; or it may be integrated into a data aggregator for monitoring purposes.

[0023] Figure 4 A photographic example of a measurement system 1000 with a 6-channel housing 100 is shown, wherein six independent photoelectric transducer modules 10 can be hot-swapped through insertion ports. An external data processing and power supply and regulation system 12 includes one or more communication interface ports 118 coupled to the processing unit 12.

[0024] An optical fiber probe 20 with an active sensing material is connected to each module 10. The active material is located near the tip of the probe 20. The probe 20 is functionally coupled to the first end 112 of an optical fiber or fiber bundle 114. The second end 113 of the optical fiber or fiber bundle 114 is connected to the connector 13 of the photoelectric transducer module 10.

[0025] In one implementation, the active material is a thermal imaging phosphor that emits light with a wavelength different from the excitation light when irradiated with excitation light. For example, the excitation light could be UV light with wavelengths between 200-400 nm or light in the blue to green wavelength range (e.g., 400-600 nm). When the active material is irradiated with such excitation light, it emits fluorescence in the red wavelength range of 600-800 nm. The response of the emitted light to temperature is monitored by various methods, such as analyzing changes in emission intensity within a single wavelength range or changes in the intensity ratio of two or more wavelength ranges, lifetime decay, or shifts in the peak emission wavelength. An optical fiber or fiber bundle is configured to transmit the excitation light and the emitted light. In one embodiment, the optical fiber or fiber bundle may include an excitation light guide (not shown) for transmitting the excitation light to the active material and an emission light guide (not shown) for transmitting the light emitted from the active material.

[0026] The photoelectric transducer module 10 includes a housing, which may be made of molded plastic or any other suitable material and may have an internal cavity for accommodating the components of the photoelectric transducer module 10.

[0027] While specific elements, embodiments, and applications of this disclosure have been shown and described, it should be understood that the scope of this disclosure is not limited thereto, as modifications can be made by those skilled in the art without departing from the scope of this disclosure, particularly in accordance with the foregoing teachings. Therefore, for example, in any method or process disclosed herein, the actions or operations constituting the method / process can be performed in any suitable order and are not necessarily limited to any particular disclosed order. In various embodiments, elements and components can be configured or arranged, combined, and / or eliminated differently. The various features and processes described above can be used independently of each other or can be combined in various ways. All possible combinations and sub-combinations are intended to be included within the scope of this disclosure. Throughout this disclosure, references to “some embodiments,” “one embodiment,” etc., mean that a specific feature, structure, step, process, or characteristic described in connection with that embodiment is included in at least one embodiment. Therefore, the appearance of the phrases “some embodiments,” “one embodiment,” etc., throughout this disclosure does not necessarily refer to the same embodiment and may refer to one or more of the same or different embodiments.

[0028] Various aspects and advantages of the implementation methods have been described where appropriate. It should be understood that not all such aspects or advantages can necessarily be achieved according to any particular implementation method. Therefore, for example, it should be recognized that various implementation methods may be carried out in a manner that achieves or optimizes one or more advantages taught herein without necessarily achieving other aspects or advantages as taught or suggested herein.

[0029] The conditional language used herein, such as “can,” “may,” “perhaps,” “able,” “etc.”, unless otherwise specifically stated or otherwise understood in the context in which they are used, is generally intended to convey that certain features, elements, and / or steps are included in some embodiments but not in others. Therefore, such conditional language is not generally intended to imply that features, elements, and / or steps are necessary in any way for one or more embodiments, or that one or more embodiments necessarily include logic for determining whether such features, elements, and / or steps are included or will be performed in any particular embodiment, with or without operator input or prompting. No single feature or group of features is necessary or indispensable for any particular embodiment. The terms “comprising,” “including,” “having,” etc., are synonyms and are used inclusively in an open-ended manner, and do not exclude additional elements, features, actions, operations, etc. Furthermore, the term “or” is used in its inclusive sense (rather than its exclusive sense) such that when used, for example, to connect a list of elements, the term “or” indicates one, some, or all of the elements in the list.

[0030] The example calculations, simulations, results, graphs, values, and parameters of the embodiments described herein are intended to illustrate, and not limit, the disclosed embodiments. Other embodiments may have configurations and / or operations that differ from the illustrative examples described herein.

Claims

1. An independent photoelectric transducer module, which integrates signal processing for thermal imaging temperature measurement, the independent photoelectric transducer module comprising: a. A housing having mounting devices; b. A light source, which provides excitation light; c. Optical elements used to couple light to an optical port; d. A connector configured to connect a photoelectric transducer module to a fiber optic sensor; e. A detector coupled to the optical port to detect light emitted from the fiber optic sensor and to convert the detected emitted light into an electrical signal; f. A module processor coupled to the light source and the detector, configured to convert the electrical signal into a set of digital results, the module processor including non-volatile memory having configuration data and calibration data associated with the detector and the fiber optic sensor, the module processor processing thermal imaging temperature measurements using the fiber optic sensor; g. High-speed circuits that communicate with external data processing and power supply and regulation systems for data aggregation; as well as h. A low-speed circuit that communicates with the external data processing and power supply and regulation system for configuration and firmware upgrades within the module. The independent photoelectric transducer module can be inserted into the receiving port of the external data processing and power supply and regulation system, so that the independent photoelectric transducer module is powered by the external data processing and power supply and regulation system.

2. The photoelectric transducer module according to claim 1, wherein, The light source is a laser diode.

3. The photoelectric transducer module according to claim 1, wherein, The light source is a light-emitting diode (LED).

4. The photoelectric transducer module according to claim 1, wherein, The light source includes two or more redundant light sources.

5. The photoelectric transducer module according to claim 4, wherein, The light source is a cluster of multiple LEDs.

6. The photoelectric transducer module according to claim 4 further includes a light receiver and a power monitor, the light receiver and the power monitor being coupled to the light source and the module processor to monitor the intensity of the excitation light and provide data to the module processor to switch any redundant light source among the redundant light sources when a failure of the light source of the excitation light is detected.

7. The photoelectric transducer module according to claim 6 further includes an optical power sensor, the optical power sensor being operatively coupled to the light source to measure and monitor the power output of the light source, and when the power output of the light source reaches a predetermined value, the optical power sensor sends an input signal to the module processor to trigger at least one redundant light source.

8. The photoelectric transducer module according to claim 1 further includes a high-speed data transmission bus for communicating with an external processing unit.

9. The photoelectric transducer module according to claim 1 further includes a photoelectric housing having at least one insertion channel for removably inserting at least one photoelectric transducer module.

10. A system for thermal imaging temperature measurement, comprising: a. Data processing and power supply and regulation systems, including: i. A housing having at least one receiving port; ii. A data processing unit used to aggregate data; iii. A communication apparatus for receiving and transmitting data; and iv. Power supply and regulation unit; and b. An independent photoelectric transducer module, having an integrated signal processor for thermal imaging temperature measurement, the independent photoelectric transducer module comprising: i. A housing having mounting means for insertion into at least one receiving port of the data processing and power supply and regulation system; ii. A light source, which provides excitation light; iii. Optical elements used to couple light to an optical port; iv. A connector configured to connect a photoelectric transducer module to a fiber optic sensor; v. A detector coupled to the optical port to detect light emitted from the fiber optic sensor and to convert the detected emitted light into an electrical signal; vi. A module processor coupled to the light source and the detector, configured to convert the electrical signal into a set of digital results, the module processor including non-volatile memory having configuration data and calibration data associated with the detector and the fiber optic sensor, the module processor processing thermal imaging temperature measurements using the fiber optic sensor; vii. A high-speed circuit that communicates with the data processing and power supply and regulation system for data aggregation; and viii. A low-speed circuit that communicates with the data processing and power supply and regulation system for configuration and firmware upgrades within the module; The independent photoelectric transducer module can be inserted into the receiving port of the data processing and power supply and regulation system, so that the independent photoelectric transducer module is powered by the data processing and power supply and regulation system.

11. The system according to claim 10, wherein, The data processing, power supply and regulation system is an industrial controller.

12. The system according to claim 10, wherein, The data processing, power supply and regulation system is a proportional-integral-derivative (PID) controller.

13. The system according to claim 10, wherein, The data processing and power supply and regulation system is a sensor network distributor.

14. The system according to claim 10, wherein, The light source includes two or more redundant light sources.

15. The system according to claim 14, wherein, The light source is a cluster of multiple LEDs.

16. The system of claim 14, further comprising an optical receiver and a power monitor coupled to the light source and the module processor to monitor the intensity of the excitation light and to provide data to the module processor to switch any redundant light source among the redundant light sources when a failure of the excitation light source is detected.

17. The system of claim 16 further includes an optical power sensor operatively coupled to the light source to measure and monitor the power output of the light source, wherein when the power output of the light source reaches a predetermined value, the optical power sensor sends an input signal to the module processor to trigger at least one redundant light source.

Images