LED package structure and lighting or display device

Abstract

The application provides an LED packaging structure and a lighting or display device, wherein the LED chip and the packaging glue are covered by a lens, and a cavity is formed between the lens and the base; the cavity is sequentially provided with a salt mist prevention layer and a fluorescent powder layer from outside to inside, or the cavity is provided with the fluorescent powder layer and the surface of the LED chip is coated with the salt mist prevention layer, so that the corrosion of the LED chip by salt mist is inhibited; further, the salt mist prevention layer comprises a branched chain of a triazolophane compound combined to an epoxy resin to form a polymer film layer, so as to combine the chloride ions in the salt mist. In this way, by the triazolophane compound, on one hand, the chloride ions in the salt mist can be fixed and cannot move freely, and on the other hand, a double electric layer effect can be formed, the penetration of the chloride ions is shielded by electrostatic action, and finally the electrolyte concentration is reduced and the original cell effect cannot be formed.

Description

Technical Field

[0001] This invention relates to the field of light-emitting diodes, and more particularly to an LED packaging structure and a lighting or display device. Background Technology

[0002] Light-emitting diodes (LEDs) have advantages such as high luminous intensity, high efficiency, small size, and long lifespan, and are considered one of the most promising light sources today. In recent years, LEDs have been widely used in daily life, such as lighting, signal display, backlighting, automotive lights, and large-screen displays.

[0003] Under normal operating conditions, the metal on the LED chip electrodes does not migrate. However, as chip sizes become smaller, and factors such as humidity, temperature, and electrolyte depth cause changes in potential difference, a potential metal migration trend can form wherever this potential difference exists: between the P and N regions on the chip surface, between conductive lines on the PCB inside the lamp, between the external electrodes and lines, and between the electrodes or lines on the module PCB. Moreover, migration often begins at the weakest point (i.e., the closest point with the largest potential difference), causing leakage. For various RGB solutions, currently all that can be done is to extend the time from the initial formation of a migration trend to product failure due to migration.

[0004] The corrosion of metal materials by LED lamp beads due to salt spray is mainly caused by the conductive salt solution penetrating into the metal and causing an electrochemical reaction, forming a micro-battery system of "low-potential metal-electrolyte solution-high-potential impurities". Electron transfer occurs, and the metal acting as the anode dissolves, forming new compounds, i.e., corrosion products.

[0005] Chloride ions play a major role in the salt spray corrosion of LED chips. They possess strong penetrating power, easily penetrating the metal oxide layer and entering the metal's interior, thus disrupting its passivation. Simultaneously, chloride ions have very low hydration energy, making them easily adsorbed on the metal surface, replacing oxygen in the protective oxide layer and causing damage. If chloride ions can be fixed or isolated, corrosion of the metal layer can be reduced.

[0006] In view of this, the inventors have specifically designed an LED packaging structure and a lighting or display device, which leads to this invention. Summary of the Invention

[0007] The purpose of this invention is to provide an LED packaging structure and a lighting or display device to solve the technical problem of existing LED chips being damaged by salt spray.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0009] An LED packaging structure includes a base, an LED chip, encapsulating adhesive, a phosphor layer, an anti-salt spray layer, and a lens;

[0010] The base has a cup and bowl and conductive electrodes fixedly installed on both sides of the base. The LED chip is fixed to the cup and bowl by the encapsulating adhesive. The positive and negative electrodes of the LED chip are respectively led out by gold wires and connected to the conductive electrodes. The lens covers the LED chip and the encapsulating adhesive to form a cavity with the base. The cavity is provided with an anti-salt spray layer and a phosphor layer from the outside to the inside, or the phosphor layer is provided in the cavity and the surface of the LED chip is covered with an anti-salt spray layer.

[0011] Preferably, the anti-salt spray layer includes a triazolophane compound layer to bind chloride ions in the salt spray.

[0012] Preferably, the anti-salt spray layer comprises a polymer film layer formed by incorporating a triazolophane compound into the side chains of an epoxy resin to bind chloride ions in the salt spray.

[0013] Preferably, the anti-salt spray layer comprises a polymer film layer formed by incorporating a cavitary ether compound into the branched chain of an epoxy resin to achieve the binding of cations in the salt spray.

[0014] Preferably, the anti-salt spray layer comprises a polymer film layer formed by bonding triazolophane compound and cryptane compound to the branched chain of epoxy resin, respectively, to achieve the binding of salt spray.

[0015] Preferably, the cryptether compound includes cryptether C[2, 2, 1] to achieve binding of sodium ions in the salt spray.

[0016] Preferably, the cryptether compound includes cryptether C[2,2,2] to achieve binding of potassium ions in the salt spray.

[0017] Preferably, a heat sink for dissipating heat from the LED chip is provided at the bottom of the cup / bowl. The LED chip is fixed to the surface of the heat sink by die bond adhesive, and the gold wire is disposed away from the heat sink.

[0018] Preferably, the encapsulating adhesive comprises a resin colloid.

[0019] Preferably, the encapsulating adhesive includes silicone.

[0020] Preferably, the lens is hemispherical.

[0021] The present invention also provides a lighting or display device comprising the LED packaging structure described in any of the preceding claims.

[0022] As can be seen from the above technical solution, the LED packaging structure and lighting or display device provided by the present invention form a cavity by covering the LED chip and encapsulating adhesive with a lens and the base; the cavity is provided with an anti-salt spray layer and a phosphor layer from the outside to the inside, or a phosphor layer is provided in the cavity and the surface of the LED chip is covered with an anti-salt spray layer to inhibit the corrosion of the LED chip by salt spray; further, the anti-salt spray layer includes a polymer film layer formed by combining a triazolophane compound with the side chains of epoxy resin to achieve the binding of chloride ions in the salt spray; and / or, the anti-salt spray layer includes a polymer film layer formed by combining a cavitary ether compound with the side chains of epoxy resin to achieve the binding of cations in the salt spray. In this way, the triazolophane compound can fix chloride ions in the salt spray, preventing them from moving freely, and can form a double layer effect, using electrostatic action to shield the penetration of chloride ions, ultimately reducing the electrolyte concentration and preventing the formation of a galvanic cell effect; at the same time, the cavitary ether compound fixes the cations in the salt spray, reducing the salt concentration in the electrolyte. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the LED packaging structure provided in Embodiment 1 of the present invention;

[0025] Figure 2 This is a schematic diagram of the LED packaging structure provided in Embodiment 2 of the present invention;

[0026] Figure 3 This is a schematic diagram illustrating the principle of chloride ion absorption and binding of the triazolophane compound provided in the embodiments of the present invention.

[0027] Figure 4 The chemical formula for forming a polymer film by incorporating a triazolophane compound into the branched chain of an epoxy resin, as provided in the embodiments of the present invention;

[0028] Figure 5 The chemical formula for forming a polymer film by incorporating a crypt ether compound into the branched chain of an epoxy resin, as provided in the embodiments of the present invention;

[0029] Symbols in the diagram: 1. Base; 1a, 1b: Conductive electrodes; 2. Heat sink; 3. Die-attach adhesive; 4. LED chip; 5. Encapsulating adhesive; 6. Phosphor layer; 7. Anti-salt spray layer; 8. Lens. Detailed Implementation

[0030] To make the content of this invention clearer, the following description, in conjunction with the accompanying drawings, further illustrates the invention. This invention is not limited to this specific embodiment. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention.

[0031] Example 1

[0032] like Figure 1 As shown, an LED packaging structure includes a base 1, an LED chip 4, encapsulating adhesive 5, a phosphor layer 6, an anti-salt spray layer 7, and a lens 8.

[0033] The base 1 has a cup and bowl and conductive electrodes fixedly installed on both sides of the base 1. The LED chip 4 is fixed to the cup and bowl by the encapsulating glue 5. The positive and negative electrodes of the LED chip 4 are respectively led out by gold wires and connected to the conductive electrodes (1a, 1b). The lens 8 covers the LED chip 4 and the encapsulating glue 5 to form a cavity with the base 1. The cavity is provided with an anti-salt spray layer 7 and a phosphor layer 6 from the outside to the inside.

[0034] In this embodiment, the anti-salt spray layer includes a triazolophane compound layer to bind chloride ions in the salt spray.

[0035] It should be noted that Triazolophane was a compound discovered and synthesized in 2008 by Amar H. Flood's research group, who was then an assistant professor in the Department of Chemistry at Indiana University Bloomington.

[0036] like Figure 3 As shown, Triazolophane compounds can achieve high-strength binding to chloride ions (Cl–) using only eight C–H bonds as hydrogen bond donors, four of which are polarized by triazoles. It has been reported that Triazolophane compounds can achieve a binding efficiency of over 90% with Cl– ions of the same concentration.

[0037] In this embodiment, as Figure 4 As shown, the anti-salt spray layer 7 includes a polymer film layer formed by incorporating a triazolophane compound into the side chains of an epoxy resin to bind chloride ions in the salt spray.

[0038] In other embodiments of the invention, such as Figure 5 As shown, the anti-salt spray layer 7 further includes a polymer film layer formed by incorporating a cavitary ether compound into the side chains of the epoxy resin to achieve the binding of cations in the salt spray. Furthermore, the anti-salt spray layer 7 can also form a polymer film layer by incorporating a triazolophane compound and a cavitary ether compound into the side chains of the epoxy resin, respectively, to achieve the binding of salt spray.

[0039] In this embodiment, the cryptether compound includes cryptether C[2, 2, 1], that is, when Figure 5 When m=1, it is used to bind sodium ions in the salt spray.

[0040] In this embodiment, the cryptether compound includes cryptether C[2, 2, 2], that is, when Figure 5 When m=2, it is to achieve the binding of potassium ions in the salt spray.

[0041] In this embodiment, a heat sink 2 for heat dissipation of LED chip 4 is provided at the bottom of the cup and bowl. LED chip 4 is fixed to the surface of heat sink 2 by die bond 3, and gold wire is set away from heat sink 2.

[0042] In this embodiment, the encapsulating adhesive 5 includes a resin colloid.

[0043] In this embodiment, the encapsulating adhesive 5 includes silicone.

[0044] In this embodiment, lens 8 is hemispherical.

[0045] Embodiments of the present invention also provide a lighting or display device, including the LED packaging structure of any of the above.

[0046] As can be seen from the above technical solution, the LED packaging structure and lighting or display device provided by the present invention form a cavity by covering the LED chip 4 and the encapsulating adhesive 5 with the base 1 through the lens 8; the cavity is provided with an anti-salt spray layer 7 and a phosphor layer 6 from the outside to the inside to inhibit the corrosion of the LED chip 4 by salt spray; further, the anti-salt spray layer 7 includes a polymer film layer formed by combining a triazolophane compound with the side chains of epoxy resin to achieve the binding of chloride ions in the salt spray; and / or, the anti-salt spray layer 7 includes a polymer film layer formed by combining a cavitary ether compound with the side chains of epoxy resin to achieve the binding of cations in the salt spray. In this way, the triazolophane compound can fix chloride ions in the salt spray, preventing them from moving freely, and can form a double layer effect, using electrostatic action to shield the penetration of chloride ions, ultimately reducing the electrolyte concentration and preventing the formation of a galvanic cell effect; at the same time, the cavitary ether compound fixes the cations in the salt spray, reducing the salt concentration in the electrolyte.

[0047] Example 2

[0048] like Figure 2 As shown, an LED packaging structure includes a base 1, an LED chip 4, encapsulating adhesive 5, a phosphor layer 6, an anti-salt spray layer 7, and a lens 8.

[0049] The base 1 has a cup and bowl and conductive electrodes fixedly installed on both sides of the base 1. The LED chip 4 is fixed to the cup and bowl by encapsulating glue 5. The positive and negative electrodes of the LED chip 4 are respectively led out by gold wires and connected to the conductive electrodes (1a, 1b). The lens 8 covers the LED chip 4 and the encapsulating glue 5 to form a cavity with the base 1. A phosphor layer 6 is provided in the cavity and the surface of the LED chip 4 is covered with an anti-salt spray layer 7.

[0050] In this embodiment, the anti-salt spray layer includes a triazolophane compound layer to bind chloride ions in the salt spray.

[0051] It should be noted that Triazolophane was a compound discovered and synthesized in 2008 by Amar H. Flood's research group, who was then an assistant professor in the Department of Chemistry at Indiana University Bloomington.

[0052] like Figure 3 As shown, Triazolophane compounds can achieve high-strength binding to chloride ions (Cl–) using only eight C–H bonds as hydrogen bond donors, four of which are polarized by triazoles. It has been reported that Triazolophane compounds can achieve a binding efficiency of over 90% with Cl– ions of the same concentration.

[0053] In this embodiment, as Figure 3 As shown, the anti-salt spray layer 7 includes a polymer film layer formed by incorporating a triazolophane compound into the side chains of an epoxy resin to bind chloride ions in the salt spray.

[0054] In other embodiments of the invention, such as Figure 5 As shown, the anti-salt spray layer 7 further includes a polymer film layer formed by incorporating a cavitary ether compound into the side chains of the epoxy resin to achieve the binding of cations in the salt spray. Furthermore, the anti-salt spray layer 7 can also form a polymer film layer by incorporating a triazolophane compound and a cavitary ether compound into the side chains of the epoxy resin, respectively, to achieve the binding of salt spray.

[0055] In this embodiment, the cryptether compound includes cryptether C[2, 2, 1], that is, when Figure 5 When m=1, it is used to bind sodium ions in the salt spray.

[0056] In this embodiment, the cryptether compound includes cryptether C[2, 2, 2], that is, when Figure 5 When m=2, it is to achieve the binding of potassium ions in the salt spray.

[0057] In this embodiment, a heat sink 2 for heat dissipation of LED chip 4 is provided at the bottom of the cup and bowl. LED chip 4 is fixed to the surface of heat sink 2 by die bond 3, and gold wire is set away from heat sink 2.

[0058] In this embodiment, the encapsulating adhesive 5 includes a resin colloid.

[0059] In this embodiment, the encapsulating adhesive 5 includes silicone.

[0060] In this embodiment, lens 8 is hemispherical.

[0061] Embodiments of the present invention also provide a lighting or display device, including the LED packaging structure of any of the above.

[0062] As can be seen from the above technical solution, the LED packaging structure and lighting or display device provided by the present invention form a cavity by covering the LED chip 4 and the encapsulating adhesive 5 with the base 1 through the lens 8; a phosphor layer 6 is provided in the cavity and the surface of the LED chip 4 is coated with an anti-salt spray layer 7 to inhibit the corrosion of the LED chip 4 by salt spray; further, the anti-salt spray layer 7 includes a polymer film layer formed by combining a triazolophane compound with the side chains of epoxy resin to achieve the binding of chloride ions in the salt spray; and / or, the anti-salt spray layer 7 includes a polymer film layer formed by combining a cavitary ether compound with the side chains of epoxy resin to achieve the binding of cations in the salt spray. In this way, the triazolophane compound can fix chloride ions in the salt spray, preventing them from moving freely, and can form a double layer effect, using electrostatic action to shield the penetration of chloride ions, ultimately reducing the electrolyte concentration and preventing the formation of a galvanic cell effect; at the same time, the cavitary ether compound fixes the cations in the salt spray, reducing the salt concentration in the electrolyte.

[0063] The apparatus provided in this embodiment of the invention operates on the same principle and produces the same technical effects as the aforementioned method embodiments. For the sake of brevity, any parts not mentioned in the apparatus embodiments can be referred to the corresponding content in the aforementioned method embodiments. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, apparatuses, and units described above can all be referred to the corresponding processes in the aforementioned method embodiments, and will not be repeated here.

[0064] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0065] It should also be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0066] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An LED packaging structure, characterized in that, Includes base, LED chip, encapsulating adhesive, phosphor layer, anti-salt spray layer and lens; The base has a cup-shaped bowl and conductive electrodes fixedly installed on both sides of the base. The LED chip is fixed to the cup-shaped bowl by the encapsulating adhesive. The positive and negative terminals of the LED chip are respectively led out by gold wires and connected to the conductive electrodes. The lens covers the LED chip and the encapsulating adhesive to form a cavity with the base. The cavity is provided with an anti-salt spray layer and a phosphor layer from the outside to the inside, or the phosphor layer is provided in the cavity and the surface of the LED chip is covered with an anti-salt spray layer. The anti-salt spray layer comprises a polymer film layer formed by bonding triazolophane compound and cryptane compound to the branched chains of epoxy resin, respectively. The cryptether compound can bind to cations in the salt spray. The triazolophane compound can bind chloride ions in salt spray and form an electric double layer effect, using electrostatic interaction to shield chloride ion penetration.

2. The LED packaging structure according to claim 1, characterized in that, The crypt ether compound includes crypt ether C[2, 2, 1] to achieve binding of sodium ions in salt spray.

3. The LED packaging structure according to claim 1, characterized in that, The crypt ether compound includes crypt ether C[2,2,2] to achieve binding of potassium ions in salt spray.

4. The LED packaging structure according to claim 1, characterized in that, A heat sink for dissipating heat from the LED chip is provided at the bottom of the cup / bowl. The LED chip is fixed to the surface of the heat sink by die bond adhesive, and the gold wire is disposed away from the heat sink.

5. The LED packaging structure according to claim 1, characterized in that, The encapsulating adhesive includes a resin colloid.

6. A lighting or display device, characterized in that, Includes the LED packaging structure according to any one of claims 1 to 5.

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