Manufacturing method of high frequency package

Abstract

The present invention includes: connecting the end (114b) of the first lead (114) of the first lead frame (110) to the first signal pad (104); connecting the end (115b) of the second lead (115) to the second signal pad (105); and adjusting the distance between the straight portion of the first lead (114) and the straight portion of the second lead (115) using a lead shape changing fixture (122).

Description

Technical Field

[0001] The invention relates to a method for manufacturing a high-frequency package comprising a differential coplanar circuit. Background Art

[0002] Devices configured to handle high-speed differential signals, including digital coherent optical transmission, utilize high-frequency signal device packages that incorporate differential coplanar lines. In these lines, two ground lines are arranged to sandwich two adjacent signal lines. In these lines, it is crucial to implement appropriate high-frequency design, such as impedance matching, between the ground line and the signal line, or between two adjacent signal lines, from the printed circuit board to the semiconductor chip.

[0003] Related technical literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent No. 4934733.

[0006] Non-patent literature

[0007] Non-Patent Document 1: Implementation Agreement for Integrated Dual Polarization Intradyne Coherent Receivers, IA#OIF-DPC-RX-01.2, November 14, 2013 (November 14, 2013).

[0008] Non-patent literature 2: Chang Fei Yee, “Key high-speed connector layout techniques,” [retrieved July 10, 2020] (https: / / www.edn.com / key-high-speed-connector-layout-techniques / ). Summary of the Invention

[0009] Problems to be solved by the present invention

[0010] However, standardization organizations such as the "Optical Internetworking Forum" have determined the size and position of pins to be soldered and mounted, which should be satisfied by the high-frequency signal device package that holds the semiconductor chip and is mounted on the printed board. Therefore, it is impossible to freely determine the interval and shape of the pins. As described in Non-Patent Document 1, the shape of the high-frequency pins is defined (see Figure 5), and does not allow the spacing between the signal (+) / (-) leads, which is necessary to improve high-frequency characteristics, to be changed. As described above, due to the low degree of freedom in high-frequency design in high-speed signal transmission, it is impossible to appropriately set the electromagnetic coupling used as the differential transmission path between the two signal lines.

[0011] For example, Non-Patent Document 1 shows an optical receiving module 400 including a DC terminal 403 and an output terminal 404, and an optical circuit 401 is mounted on the optical receiving module 400. The optical circuit is configured to perform optical signal processing on optical signals input from two input ports 402a and 402b, as shown in FIG. Figure 6 As shown. In this technology, the details of the structure of the high-frequency pins that affect the high-frequency characteristics in the optical receiving module including a plurality of high-frequency pins are not disclosed. In addition, in non-patent document 2, the three-dimensional shape of the pins is shown (see Figure 11). It is assumed that the spacing between the metal pads on the printed board and the spacing between the pins are equal starting from the contact surface. Since the impedance becomes high in the part exposed to the air, it is preferable to make the two signal pins as close as possible even from the middle. However, such a structure is not shown in detail and is not mentioned at all.

[0012] Therefore, in high-frequency packages, the spacing between two signal pins connected to two signal lines gradually increases from the end connected to the signal line toward the end connected to the mounting substrate, thereby achieving a satisfactory high-frequency design. However, an effective package manufacturing method for achieving this pin configuration is still unclear.

[0013] The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide an efficient method for manufacturing a high-frequency package in which the interval between pins is changed.

[0014] Means of solving the problem

[0015] According to the present invention, a method for manufacturing a high-frequency package is provided, the method comprising: a first step of preparing a package body, the package body comprising: a substrate formed of alternately stacked insulating layers and conductive layers, a first differential coplanar line formed on a surface of the substrate, a second differential coplanar line formed on a back surface of the substrate on a side of a mounting surface of the substrate and connected to the first differential coplanar line, a first signal pad arranged on one side of the back surface of the substrate and connected to a first signal line of the second differential coplanar line, a second signal pad arranged on the one side of the back surface of the substrate and connected to a second signal line of the second differential coplanar line, and two ground pads arranged on the one side of the back surface of the substrate and connected to two ground lines of the second differential coplanar line; a second step of preparing a first lead frame, the first lead frame comprising a plate-shaped first frame, a first lead and a second lead, each of the first lead and the second lead comprising: a straight portion extending on a plane including the plane of the first frame, a bent portion bent in a direction separating from a plane including the plane of the first frame, and an end portion at an end of the bent portion, wherein the first lead frame comprises a first lead frame having ... The spacing between the end portion of the lead and the end portion of the second lead is the spacing between the first signal pad and the second signal pad; the third step: preparing a second lead frame, the second lead frame including a second frame and two third leads, each of the two third leads including: a straight portion extending on a plane including the plane of the second frame, a bent portion bent in a direction separated from the plane including the plane of the second frame, and an end portion at the end of the bent portion, wherein the spacing between the end portions of the two third leads is the spacing between the two ground pads; the fourth step: connecting the end portion of the first lead of the first lead frame to the first signal pad, connecting the end portion of the second lead to the second signal pad, and connecting the end portion of the third lead of the second lead frame to the ground pad; the fifth step: after the fourth step, separating the first frame from the first lead and the second lead, and separating the second frame from the third lead; the sixth step: after the fifth step, adjusting the spacing between the straight portion of the first lead and the straight portion of the second lead; and the seventh step: after the sixth step, making the lengths of the first lead, the second lead, and the third lead consistent.

[0016] Effects of the present invention

[0017] As described above, according to the present invention, after the distal end of the first lead of the first lead frame is connected to the first signal pad and the distal end of the second lead is connected to the second signal pad, the spacing between the straight portions of the first lead and the second lead is adjusted. Therefore, an efficient method for manufacturing a high-frequency package can be provided that varies the spacing between the leads. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1Ais a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0019] Figure 1B is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0020] Figure 1C is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0021] Figure 1D is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0022] Figure 1E is a side view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0023] Figure 1F is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0024] Figure 1G is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0025] Figure 1H is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0026] Figure 1I is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0027] Figure 1J is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0028] Figure 1K is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0029] Figure 1L is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0030] Figure 1M is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0031] Figure 1N is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0032] Figure 1O is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0033] Figure 1P is a perspective view showing a state of the high-frequency package in an intermediate step in order to explain the method of manufacturing the high-frequency package according to the first embodiment of the present invention;

[0034] Figure 2A is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a second embodiment of the present invention;

[0035] Figure 2B is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a second embodiment of the present invention;

[0036] Figure 2C is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a second embodiment of the present invention;

[0037] Figure 2D is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a second embodiment of the present invention;

[0038] Figure 3A is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a third embodiment of the present invention;

[0039] Figure 3B is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a third embodiment of the present invention;

[0040] Figure 3C is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a third embodiment of the present invention;

[0041] Figure 4Ais a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0042] Figure 4B is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0043] Figure 4C is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0044] Figure 4D is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0045] Figure 4E is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0046] Figure 4F is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0047] Figure 4G is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0048] Figure 4H is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0049] Figure 4I is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0050] Figure 4J is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0051] Figure 4K is a perspective view showing a state of a high-frequency package in an intermediate step in order to explain a method of manufacturing a high-frequency package according to a fourth embodiment of the present invention;

[0052] Figure 5 is an explanatory diagram showing the structure of a conventional high-frequency package;

[0053] Figure 6is a view showing the configuration of a conventional light receiving module; and

[0054] Figure 7 is a perspective view showing the configuration of a portion of a conventional high-frequency package. DETAILED DESCRIPTION

[0055] A method for manufacturing a high-frequency package according to an embodiment of the present invention will be described below.

[0056] [First embodiment]

[0057] Will first refer to Figures 1A to 1P A method for manufacturing a high-frequency package according to a first embodiment of the present invention will be described.

[0058] First, if Figure 1A and Figure 1B As shown, the package body 100 is prepared (first step). The package body 100 includes: a substrate 101 formed by alternately stacking insulating layers and conductive layers, a first differential coplanar line 102 formed on the surface of the substrate 101, and a second differential coplanar line 103 formed on the back side of the mounting surface of the substrate 101 and connected to the first differential coplanar line 102. Note that Figure 1B The figure shows one side of the mounting surface of the package body 100 (substrate 101). In addition, a spacer 107 is provided on the package body 100 (substrate 101) so as to keep a constant distance between a portion of the package body 100 and the mounting board to which they are mounted.

[0059] In addition, the package body 100 includes a first signal pad 104, a second signal pad 105, and two ground pads 106. The first signal pad 104 is arranged on one side of the back surface (mounting surface) of the substrate 101 and is connected to the first signal line of the second differential coplanar line 103. The second signal pad 105 is arranged on one side of the back surface of the substrate 101 and is connected to the second signal line of the second differential coplanar line 103. The first signal pad 104 and the second signal pad 105 have a spacing that gradually increases from the center side to the end side of the package body 100. The two ground pads 106 are arranged on one side of the back surface of the substrate 101 and are connected to the two ground lines of the second differential coplanar line 103.

[0060] Next, if Figure 1C 、 Figure 1D and Figure 1E As shown, the first lead frame 110 is prepared (second step), and the second lead frame 112 is prepared (third step).

[0061] First leadframe 110 includes a plate-shaped first frame 111, first leads 114, and second leads 115. First leads 114 and second leads 115 each include a straight portion extending in a plane including first frame 111, curved portions 114a and 115a that curve in a direction away from the plane including first frame 111, and terminal portions 114b and 115b at the ends of curved portions 114a and 115a. Furthermore, the distance between terminal portion 114b of first lead 114 and terminal portion 115b of second lead 115 corresponds to the distance between first signal pad 104 and second signal pad 105. Note that the distance between first signal pad 104 and second signal pad 105 is narrower than the distance between adjacent first signal pad 104 and ground pad 106, and the distance between adjacent second signal pad 105 and ground pad 106.

[0062] Furthermore, in the first embodiment, the first lead frame 110 has a shape in which the interval between the first lead 114 and the second lead 115 widens from the side of the end portions 114b and 115b toward the side of the first frame 111. Furthermore, thin portions 114c and 115c having a small thickness are provided in the middle of the straight portions of the first and second leads 114 and 115 to facilitate cutting in post-processing.

[0063] Second leadframe 112 includes a second frame 113 and two third leads 116. Each of the two third leads 116 includes a straight portion extending in a plane including the plane of second frame 113, a curved portion 116a that bends away from the plane including the plane of second frame 113, and a terminal portion 116b at the end of curved portion 116a. The distance between terminal portions 116b of the two third leads 116 is the same as the distance between the two ground pads 106. Note that in the first embodiment, second leadframe 112 has a shape in which the distance between the two third leads 116 is the same from one side of terminal portion 116b to the other side of second frame 113. Furthermore, each third lead 116 has a thin portion 116c located in the middle of the straight portion to facilitate cutting in post-processing.

[0064] First lead frame 110 and second lead frame 112 are arranged at predetermined positions and overlapped. At this time, the bottom surfaces of the leads are aligned in region 117, a straight portion of a predetermined length from the bend. Region 117 can be used as a reference surface in post-processing.

[0065] Next, if Figure 1F and Figure 1GAs shown, the tip 114b of the first lead 114 of the first lead frame 110 is connected to the first signal pad 104, the tip 115b of the second lead 115 is connected to the second signal pad 105, and the tip 116b of the third lead 116 of the second lead frame 112 is connected to the ground pad 106 (step 4). For example, the above connection can be made by soldering using silver solder or the like. Note that in the first embodiment, the spacing gradually decreases from the end toward the center of the package body 100. In the same manner as this state, the spacing between the first lead 114 and the second lead 115 gradually decreases toward the tip 114b and 115b.

[0066] After the fourth step, the first frame 111 is separated from the first lead 114 and the second lead 115, and the second frame 113 is separated from the third lead 116 (fifth step). Figure 1H As shown, the cutting blade 118 is used to simultaneously cut the thin portion of the straight portion of the lead wire so that each lead wire has a predetermined length. Figure 1I As shown, the finished shapes of the first lead 114 and the second lead 115 are different from the finished shape of the third lead 116. The interval between the first lead 114 and the second lead 115 is from Figure 1I The cut end indicated by the dotted ellipse gradually changes and decreases toward the bend.

[0067] Next, after the fifth step, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 is adjusted (the sixth step). Figure 1J As shown, the holding fixture 121 is fixed to one side of the mounting surface of the package body 100. Figure 1K 、 Figure 1L and Figure 1M As shown, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 is adjusted using the lead shape changing jig 122 .

[0068] The lead shape changing fixture 122 includes a base 122a and protrusions 122b and 122c provided on the base 122a. Each of the protrusions 122b and 122c has a strip shape extending in the same direction as the lead in a plan view. In addition, each of the protrusions 122b and 122c has a cross-sectional shape that gradually widens from the top to the bottom (one side of the base 122a). The width of each of the protrusions 122b and 122c gradually increases from the top to the bottom, so that the intervals between the protrusions gradually decrease. In addition, the protrusions 122b and 122c are evenly spaced at a predetermined portion on one side of the base 122a.

[0069] The first lead 114 and the second lead 115 are arranged between the protrusion 122b and the protrusion 122c, and the package body 100 to which the holding jig 121 is fixed is slid in the vertical direction to one side of the base 122a of the lead shape changing jig 122. Therefore, the first lead 114 and the second lead 115 are deformed along the gradually decreasing interval between the protrusion 122b and the protrusion 122c, and the interval between the first lead 114 and the second lead 115 is gradually changed (reduced).

[0070] When all the leads reach the upper surface of the base 122a, the intervals between the straight portions of the first leads 114 and the straight portions of the second leads 115 become equal over the entire area (the spacing becomes uniform). Furthermore, when all the leads reach the upper surface of the base 122a, this state is maintained, and the pressing jig 123 is pressed from above in this state. Then, all the jigs are removed. Figure 1N As shown, this makes it possible to align the height positions of the first lead 114 and the second lead 115 in the planar direction of the substrate 101 .

[0071] Next, the lengths of the first lead 114, the second lead 115, and the third lead 116 are made uniform (step 7). Figure 1O As shown, the leads are cut simultaneously using a cutting blade 118, so that the lengths of the first lead 114, the second lead 115, and the third lead 116 are consistent, as shown in FIG. Figure 1P shown.

[0072] Upon completion, a high-frequency package is obtained in which the spacing between the third lead 116, which serves as a ground pin, and the first and second leads 114, 115, which serve as signal pins, is made uniform. The manufacturing method according to the first embodiment described above allows the differential signal pins to have a wider spacing width than the narrow spacing of the differential signal lines in the package body. This allows for uniform spacing of all pins, contributing to improved productivity when mounting the package on a board.

[0073] [Second embodiment]

[0074] The following will refer to Figures 2A to 2D A method for manufacturing a high-frequency package according to a second embodiment of the present invention will be described.

[0075] First, as in the first embodiment, as in reference Figure 1A and Figure 1B As described above, prepare the package body 100 (first step). Next, as shown in FIG. Figure 1C 、 Figure 1D and Figure 1E As described, the first lead frame 110 is prepared (second step), and the second lead frame 112 is prepared (third step).

[0076] Next, as reference Figure 1F and Figure 1G As described, the end portion 114b of the first lead 114 of the first lead frame 110 is connected to the first signal pad 104, the end portion 115b of the second lead 115 is connected to the second signal pad 105, and the end portion 116b of the third lead 116 of the second lead frame 112 is connected to the ground pad 106 (fourth step).

[0077] After the fourth step, the first frame 111 is separated from the first lead 114 and the second lead 115 , and the second frame 113 is separated from the third lead 116 by the same method as in the first embodiment (fifth step).

[0078] Next, after the fifth step, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 is adjusted (the sixth step). Figure 2A As shown, a lead shape changing jig 131 is prepared. In the second embodiment, the package body 100 slides on the surface of the lead shape changing jig 131 in a predetermined direction, thereby adjusting the interval between the straight portions of the first lead 114 and the second lead 115.

[0079] The lead shape changing jig 131 includes a base 131a, guides 131b provided at both ends of the upper surface of the base 131a, and a plurality of protrusions 131c arranged on the upper surface of the base 131a. The interval between the two guides 131b is the same as the width between the outer sides of the two third leads 116 arranged on the outer sides.

[0080] In addition, each of the plurality of protrusions 131c has a rectangular shape in a plan view, the rectangular shape having a long side in the direction for sliding the package body 100 (the sliding direction). The interval between adjacent protrusions 131c is the same as the width of each lead. In addition, the width of each of the plurality of protrusions 131c in the arrangement direction is equal to the interval between the bent portions where the leads are arranged.

[0081] First, if Figure 2B As shown, package body 100 is mounted on the upper surface of base portion 131a, which is provided with a plurality of protrusions 131c. The pads arranged on the mounting surface of substrate 101 are arranged perpendicular to the sliding direction. Furthermore, at one end of each of the protrusions 131c, the bent portions of the leads fit between adjacent protrusions 131c.

[0082] When the package body 100 is mounted on the upper surface of the base 131a, as described above, the package body 100 slides in the sliding direction ( Figure 2C). By this sliding, the interval between the first lead 114 and the second lead 115 gradually changes (decreases). When the cut end of the lead moves upward to the center of the plurality of protrusions 131c, and then the lead shape changing jig 131 is removed, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 becomes equal (the spacing becomes uniform) over the entire area, as shown in FIG. Figure 2D shown.

[0083] Then, as in the first embodiment described above, the lengths of the first lead 114, the second lead 115, and the third lead 116 are made uniform (step 7). Upon completion, a high-frequency package is obtained in which the spacing between the third lead 116, which serves as a ground pin, and the first lead 114 and the second lead 115, which serve as signal pins, is made uniform. A unique feature of the second embodiment is the use of a sliding lead shape-changing jig to calibrate the spacing between the differential signal pins.

[0084] By using the manufacturing method according to the second embodiment, even if the pitch of the differential signal lines in the package body is narrow, the pitch width of the differential signal pins can be made wider than that. This can make the pitch of all pins uniform and help improve productivity when mounting the package on a board.

[0085] [Third embodiment]

[0086] The following will refer to Figures 3A to 3C A method for manufacturing a high-frequency package according to a third embodiment of the present invention will be described.

[0087] First, as in the first embodiment, as in reference Figure 1A and Figure 1B As described above, prepare the package body 100 (first step). Next, as shown in FIG. Figure 1C 、 Figure 1D and Figure 1E As described, the first lead frame 110 is prepared (second step), and the second lead frame 112 is prepared (third step).

[0088] Next, as reference Figure 1F and Figure 1G As described, the end portion 114b of the first lead 114 of the first lead frame 110 is connected to the first signal pad 104, the end portion 115b of the second lead 115 is connected to the second signal pad 105, and the end portion 116b of the third lead 116 of the second lead frame 112 is connected to the ground pad 106 (fourth step).

[0089] After the fourth step, the first frame 111 is separated from the first lead 114 and the second lead 115 , and the second frame 113 is separated from the third lead 116 by the same method as in the first embodiment (fifth step).

[0090] Next, after the fifth step, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 is adjusted (the sixth step). Figure 3A As shown, a rotary lead shape changing jig 141 is prepared. In the third embodiment, the lead shape changing jig 141 having a cylindrical shape is rotated about its axis with respect to the package body 100, thereby causing the package body 100 to slide relatively on the outer peripheral surface of the lead shape changing jig 141 in the rotation direction, and adjusting the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115.

[0091] The lead shape changing jig 141 includes a cylindrical body 141a and a plurality of grooves 141b formed in the outer circumference of the body 141a. The grooves 141b extend in the circumferential direction, and the groove width is the same as the width of each lead. In addition, the interval between adjacent grooves 141b is equal to the interval between the bends of the lead.

[0092] First, if Figure 3A As shown, package body 100 is mounted on the outer peripheral surface of lead shape changing jig 141, which has a plurality of grooves 141b formed therein. At this point, the pads arranged on the mounting surface of substrate 101 are arranged perpendicular to the circumferential direction (sliding direction) of the outer peripheral surface. Furthermore, the bent portion of each lead fits into a corresponding groove 141b.

[0093] When the package body 100 is mounted on the outer peripheral surface of the lead shape changing jig 141, as described above, the lead shape changing jig 141 (body 141a) rotates around the axis. By this rotation, the portion of the lead engaged in the groove 141b moves from the bent portion of the lead toward the cut end. As the engaged portion moves with the rotation, the interval between the first lead 114 and the second lead 115 gradually changes (decreases). Figure 3B As shown, when the cut end of each lead is fitted into a corresponding one of the grooves 141b and then the lead shape changing jig 141 is removed, the interval between the straight portion of the first lead 114 and the straight portion of the second lead 115 becomes equal over the entire area (the spacing becomes uniform), as shown in FIG. Figure 3C shown.

[0094] Then, as in the first embodiment described above, the lengths of the first lead 114, the second lead 115, and the third lead 116 are aligned (step 7). Upon completion, a high-frequency package is obtained in which the spacing between the third lead 116, which serves as a ground pin, and the first lead 114 and the second lead 115, which serve as signal pins, is aligned. A unique feature of the third embodiment is the use of a rotary lead shape-changing jig to calibrate the spacing between the differential signal pins.

[0095] By using the manufacturing method according to the third embodiment, even if the pitch of the differential signal lines in the package body is narrow, the pitch width of the differential signal pins can be made wider than that. This can make the pitch of all pins uniform and help improve productivity when mounting the package on a board.

[0096] [Fourth embodiment]

[0097] The following will refer to Figures 4A to 4K A method for manufacturing a high-frequency package according to a fourth embodiment of the present invention will be described.

[0098] First, if Figure 4A As shown, a package body 100a is prepared (first step). The package body 100a includes: a substrate 101 made of an insulator, a first differential coplanar line 102 formed on the surface of the substrate 101, and a second differential coplanar line 103 formed on the back side of the mounting surface of the substrate 101 and connected to the first differential coplanar line 102. Note that Figure 4A The figure shows one side of the mounting surface of the package body 100a (substrate 101). In addition, a spacer 107 is provided on the package body 100a (substrate 101) so as to keep a constant distance between a portion of the package body 100a and the mounting board to which they are mounted.

[0099] In addition, the package body 100a includes a first signal pad 204, a second signal pad 205, and two ground pads 106. The first signal pad 204 is arranged on one side of the back surface (mounting surface) of the substrate 101 and is connected to the first signal line of the second differential coplanar line 103. The second signal pad 205 is arranged on one side of the back surface of the substrate 101 and is connected to the second signal line of the second differential coplanar line 103. The first signal pad 204 and the second signal pad 205 are arranged at the same distance from the center side to the end side of the package body 100a. The two ground pads 106 are arranged on one side of the back surface of the substrate 101 and are connected to the two ground lines of the second differential coplanar line 103.

[0100] Next, if Figure 4B and Figure 4C As shown, the first lead frame 210 is prepared (second step), and the second lead frame 112 is prepared (third step). The second lead frame 112 is the same as that in the above-described first embodiment, and a detailed description thereof will be omitted.

[0101] First leadframe 210 includes a plate-shaped first frame 211, first leads 214, and second leads 215. First leads 214 and second leads 215 each include a straight portion extending in a plane including first frame 211, curved portions 214a and 215a that curve in a direction away from the plane including first frame 211, and terminal portions 214b and 215b at the ends of curved portions 214a and 215a. Furthermore, the distance between terminal portion 214b of first lead 214 and terminal portion 215b of second lead 215 corresponds to the distance between first signal pad 204 and second signal pad 205. Note that the distance between first signal pad 204 and second signal pad 205 is narrower than the distance between adjacent first signal pad 204 and ground pad 106, and the distance between adjacent second signal pad 205 and ground pad 106.

[0102] Furthermore, in the fourth embodiment, the first lead frame 210 has a shape in which the interval between the first lead 214 and the second lead 215 is the same from the end portions 214b and 215b to the first frame 211. Furthermore, thin portions 214c and 215c having a small thickness are provided in the middle of the straight portions of the first and second leads 214 and 215 to facilitate cutting in post-processing.

[0103] The first lead frame 210 and the second lead frame 112 are arranged at predetermined positions and overlap. Note that in the fourth embodiment, the bottom surfaces of the leads are aligned in the region of a straight portion of a predetermined length from the bend. This region can be used as a reference surface in post-processing.

[0104] Next, the end portion 214b of the first lead 214 of the first lead frame 210 is connected to the first signal pad 204, the end portion 215b of the second lead 215 is connected to the second signal pad 205, and the end portion 116b of the third lead 116 of the second lead frame 112 is connected to the ground pad 106 (fourth step). For example, the above connection can be performed by soldering using silver solder or the like. Figure 4D The lead frames are shown in a connected state.

[0105] After the fourth step, the first frame 211 is separated from the first lead 214 and the second lead 215, and the second frame 113 is separated from the third lead 116 (fifth step). Figure 4E As shown, the thin portion of the straight portion of the lead wire is cut simultaneously with the cutting blade 118 so that each lead wire has a predetermined length. After cutting, in the fourth embodiment, the finished shape of the first lead wire 214 and the second lead wire 215 is the same as the finished shape of the third lead wire 116.

[0106] Next, after the fifth step, the interval between the straight portion of the first lead 214 and the straight portion of the second lead 215 is adjusted (the sixth step). In this adjustment, the distance between the straight portion of the first lead 214 and the straight portion of the second lead 215 is adjusted using Figure 4F The base jig 201 and the correction jig 202 are shown. The base jig 201 includes a guide groove 201a configured to slide the correction jig 202, and a first guide rail 201b and a second guide rail 201c formed so as to interpose the area where the guide groove 201a is formed. In addition, the second guide rail 201c is provided with a groove 201d, and the third lead 116 is fitted into the groove 201d.

[0107] On the other hand, the correction jig 202 includes a sliding protrusion 202a fitted in the guide groove 201a and a projection 202b configured to increase the interval between the first lead 214 and the second lead 215. The width of the projection 202b decreases toward the distal end 202c.

[0108] First, if Figure 4G As shown, base fixture 201 is arranged on one side of the mounting surface of package body 100a, and first lead 214 and second lead 215 are arranged between first rail 201b and second rail 201c. Furthermore, first lead 214 and outer third lead 116 are arranged so as to sandwich first rail 201b. Central third lead 116 is embedded in groove 201d.

[0109] Next, the sliding protrusion 202a of the correction jig 202 is fitted into the guide groove 201a. In addition, the tip 202c of the protrusion 202b is inserted between the first guide rail 201b and the second guide rail 201c, and between the first lead 214 and the second lead 215. In this state, the state in which the sliding protrusion 202a is fitted into the guide groove 201a is maintained, and the correction jig 202 is slid from the cut end side of the lead to the side of the bent portion ( Figure 4H ).

[0110] By sliding the correction jig 202, the protrusion 202b inserted between the first lead 214 and the second lead 215 increases (adjusts) the interval between the first lead 214 and the second lead 215. When the sliding correction jig 202 reaches the package body 100a, the interval between the straight portion of the first lead 214 and the straight portion of the second lead 215 increases over the entire area, and the intervals between the leads become equal (the spacing becomes uniform).

[0111] In the fourth embodiment, when the intervals between the leads are made equal by the above-described process, the interval between the straight portions of the first lead 214 and the second lead 215 becomes wider than the interval between the first signal pad 204 and the second signal pad 205 ( Figure 4I ).

[0112] Next, the lengths of the first lead 214, the second lead 215, and the third lead 116 are made uniform (step 7). Figure 4J As shown, the cutting blade 118 is used to cut the leads simultaneously, so that the lengths of the first lead 214, the second lead 215 and the third lead 116 are consistent, as shown in FIG. Figure 4K shown.

[0113] Upon completion, a high-frequency package can be obtained in which the spacing between the third lead 116, which serves as a ground pin, and the first and second leads 214, 215, which serve as signal pins, is made uniform. The manufacturing method according to the fourth embodiment described above allows the differential signal pins to have a wider pitch width than the narrow pitch of the differential signal lines in the package body. This allows for uniform pitches across all pins, contributing to improved productivity when mounting the package on a board.

[0114] As described above, according to the present invention, after the distal end of the first lead of the first lead frame is connected to the first signal pad and the distal end of the second lead is connected to the second signal pad, the spacing between the straight portions of the first lead and the second lead is adjusted. Therefore, an efficient method for manufacturing a high-frequency package can be provided that varies the spacing between the leads.

[0115] Note that the present invention is not limited to the above-described embodiments, and it is apparent that those skilled in the art can make many modifications and combinations within the technical scope of the present invention.

[0116] Description of Reference Signs

[0117] 100…Package body, 101…Substrate, 102…First differential coplanar line, 103…Second differential coplanar line, 104…First signal pad, 105…Second signal pad, 106…Ground pad, 107…Spacer, 110…First lead frame, 111…First frame, 113…Second frame, 114…First lead, 114a…Bend, 114b…Tip, 114c…Thin portion , 115…second lead, 115a…bent portion, 115b…terminal portion, 115c…thin portion, 116…third lead, 116a…bent portion, 116b…terminal portion, 116c…thin portion, 117…region, 118…cutting blade, 121…holding jig, 122…lead shape changing jig, 122a…base, 122b…protrusion, 122c…protrusion, 123…pressing jig.

Claims

1. A method for manufacturing a high-frequency package, comprising: Step 1: Prepare a package body, which includes: The substrate is formed by alternately stacking insulating layers and conductive layers. A first differential coplanar circuit is formed on the first surface of the substrate, a second differential coplanar line formed on a second surface of the substrate on a side of the mounting surface of the substrate and connected to the first differential coplanar line; a first signal pad arranged on one side of the second surface of the substrate and connected to the first signal line of the second differential coplanar line; a second signal pad disposed on the side of the second surface of the substrate and connected to the second signal line of the second differential coplanar line, and two ground pads, arranged on the one side of the second surface of the substrate and connected to two ground lines of the second differential coplanar circuit; Step 2: Prepare a first lead frame, the first lead frame including a plate-shaped first frame, a first lead, and a second lead, each of the first lead and the second lead including: a straight portion extending on a plane including a plane of the first frame, a bent portion bent in a direction separating from the plane including the plane of the first frame, and At the terminal portion at the terminal end of the bent portion, wherein the distance between the end portion of the first lead and the end portion of the second lead is the distance between the first signal pad and the second signal pad; Step 3: Prepare a second lead frame, wherein the second lead frame includes a second frame and two third leads, each of the two third leads including: a straight portion extending on a plane including a plane of the second frame, a bent portion bent in a direction separating from the plane including the plane of the second frame, and At the terminal portion at the terminal end of the bent portion, wherein the distance between the end portions of the two third leads is the distance between the two ground pads; Step 4: Connecting the end portion of the first lead of the first lead frame to the first signal pad, connecting the end portion of the second lead to the second signal pad, and connecting the end portion of the third lead of the second lead frame to the ground pad; Step 5: After step 4, separating the first frame from the first lead and the second lead, and separating the second frame from the third lead; Step 6: After step 5, adjusting the distance between the straight portion of the first lead and the straight portion of the second lead; and Step 7: After step 6, the lengths of the first lead, the second lead, and the third lead are made consistent.

2. The method for manufacturing a high-frequency package according to claim 1, wherein The first lead frame has a shape in which the interval between the first lead and the second lead widens from the side of the terminal portion toward the side of the first frame, and The second lead frame has a shape in which an interval between the two third leads is the same interval from one side of the distal end portion to one side of the second frame.

3. The method for manufacturing a high-frequency package according to claim 2, wherein In the sixth step, the interval between the straight portion of the first lead and the straight portion of the second lead is reduced so that the intervals between the straight portions of the first lead, the second lead, and the third lead are equal.

4. The method for manufacturing a high-frequency package according to claim 1, wherein The first lead frame has a shape in which the interval between the first lead and the second lead is the same interval from the side of the tip portion to the side of the first frame, and The second lead frame has a shape in which an interval between the two third leads is the same interval from one side of the distal end portion to one side of the second frame.

5. The method for manufacturing a high frequency package according to claim 4, wherein In the sixth step, the interval between the straight portion of the first lead and the straight portion of the second lead is increased so that the intervals between the straight portions of the first lead, the second lead, and the third lead are equal.

6. The method for manufacturing a high-frequency package according to any one of claims 1 to 5, wherein The interval between the first signal pad and the second signal pad is narrower than the interval between the first signal pad and the ground pad adjacent to each other and the interval between the second signal pad and the ground pad adjacent to each other.

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