Busbar assembly and method of manufacturing the same

Abstract

The bus bar assembly of the present application has a first bus bar and a second bus bar which are arranged side by side with a gap in the same plane, and an insulating resin layer including a gap filling portion and an upper surface laminating portion, a first bus bar side upper surface opening which exposes a predetermined region across a boundary of the first bus bar and an upper surface of the gap filling portion, and a second bus bar side upper surface opening which exposes a predetermined region across a boundary of the second bus bar and an upper surface of the gap filling portion are provided in the upper surface laminating portion, and a portion of the upper surface laminating portion between the first bus bar side upper surface opening and the second bus bar side upper surface opening forms a partition wall.

Description

Technical Field

[0001] The present invention relates to a busbar assembly formed by mechanically connecting a first busbar and a second busbar in an electrically insulated state, and a method thereof for manufacturing the same. Background Technology

[0002] A busbar assembly comprising multiple busbars mechanically connected to each other in an electrically insulated state has been proposed and is being used in various fields.

[0003] For example, a stacked busbar assembly has been proposed, in which a flat busbar is stacked one on top of the other flat busbars in a parallel manner (see Patent Documents 1 and 2 below).

[0004] In the stacked busbar assembly, the opposing planes of one flat busbar are arranged opposite each other across an insulating resin layer, which makes it difficult to adequately ensure the reliability related to insulation.

[0005] In particular, if the thickness of the insulating resin layer between one flat busbar and the other flat busbars is reduced in order to achieve miniaturization in the vertical direction, leakage current may flow between the two busbars.

[0006] In order to solve the problem of the stacked busbar assembly, the applicant of this application has filed an application for a planar busbar assembly in which the first busbar and the second busbar of the conductive metal plate are arranged side by side in the same plane (see Patent Documents 3 and 4 below).

[0007] Figure 21 (a) A top view showing an example of the planar busbar assembly 500.

[0008] in addition, Figure 21 (b) shows along Figure 21 (a) is a sectional view of the XXI(b)-XXI(b) line.

[0009] like Figure 21 As shown in (a) and (b), the planar busbar assembly 500 includes: a first busbar 510(1) of a conductive metal plate; a second busbar 510(2) of a conductive metal plate, the second busbar 510(2) having a gap 515 between it and the first busbar 510(1) and being disposed in the same plane as the first busbar 510(1); and an insulating resin layer 520, the insulating resin layer 520 mechanically connecting the first and second busbars 510(1) and 510(2) in an electrically insulating state.

[0010] The insulating resin layer 520 has: a gap filling portion 525, which is filled in the gap 515; and a surface layer portion 530, which is stacked on the surface of a busbar connector formed by connecting the first and second busbars 510(1) and 510(2) using the gap filling portion 525.

[0011] The surface stack portion 530 includes: an upper surface stack portion 530 and a lower surface stack portion 540, the upper surface stack portion 530 and the lower surface stack portion 540 respectively covering the upper surface on one side of the thickness direction and the lower surface on the other side of the thickness direction of the busbar connector; and a side stack portion 550, the side stack portion 550 covering the outer side of the busbar connector and connecting the upper surface stack portion 530 and the lower surface stack portion 540.

[0012] The upper surface stacked portion 530 is provided with first and second openings 532(1) and 532(2) that expose predetermined portions of the upper surfaces of the first and second busbars 510(1) and 510(2) respectively to form first and second exposed areas.

[0013] Figure 21 (c) shows a longitudinal sectional view of a semiconductor module 600 formed by mounting semiconductor elements 110 such as LEDs on the busbar assembly 500.

[0014] like Figure 21 As shown in (c), in the semiconductor element 110, one of the first electrode layer (lower electrode layer) and the first and second exposed regions (in...) Figure 21 (c) The first exposed area is mechanically electrically connected, for example, via a plating layer (not shown), and the second electrode layer (upper electrode layer) is connected to the other of the first and second exposed areas (in Figure 21 (c) The second exposed area is electrically connected via wire bonding 120.

[0015] The planar busbar assembly 500 is useful in terms of its ability to be miniaturized in the vertical direction, but there is room for improvement in terms of the compact configuration (converged configuration) of the installed semiconductor elements 110.

[0016] That is, the limit of the compact arrangement of the semiconductor element 110 is the separation width L2 of the relative edges of the first and second openings 532(1), 532(2) (refer to...) Figure 21 (b) It is defined that, in the planar busbar assembly 500, L2 is greater than or equal to the width L1 of the gap between the first and second busbars 510(1) and 510(2).

[0017] In the planar busbar assembly 500 of this structure, in order to reduce the narrowness of L2, it is necessary to reduce the gap L1. However, from the viewpoint of ensuring the insulation between the first and second busbars 510(1) and 510(2), there is a limit to reducing the width L1 of the gap.

[0018] Existing technical documents

[0019] Patent documents

[0020] Patent Document 1: Japanese Patent No. 4432913

[0021] Patent Document 2: Japanese Patent No. 6487769

[0022] Patent Document 3: Japanese Patent Application Publication No. 2019-042678

[0023] Patent Document 4: Japanese Patent Application Publication No. 2019-050090 Summary of the Invention

[0024] The present invention was made in view of the above-mentioned prior art, and its first object is to provide a busbar assembly having a first busbar and a second busbar, the first busbar and the second busbar being arranged in the same plane with a gap between them and being connected in an insulating state by means of an insulating resin layer including a gap filler portion filled in the gap, the busbar assembly being able to maintain good insulation between the first busbar and the second busbar, and to perform compact configuration of semiconductor elements mounted on the first busbar and / or the second busbar.

[0025] Furthermore, a second objective of the present invention is to provide a manufacturing method capable of efficiently manufacturing the busbar assembly.

[0026] To achieve the first objective mentioned above, the present invention provides a busbar assembly comprising: a first busbar and a second busbar, the first busbar and the second busbar being formed from conductive flat plate members and disposed in the same plane with a gap between them; and an insulating resin layer comprising a gap filling portion and an upper surface stack portion filled in the gap, the upper surface stack portion being disposed on an upper surface of a busbar connector formed by connecting the first busbar and the second busbar in the thickness direction by means of the gap filling portion, the upper surface stack portion being provided with a first busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the first busbar and the gap filling portion across their boundary and a second busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the second busbar and the gap filling portion across their boundary, the portion of the upper surface stack portion located between the first busbar-side upper surface opening and the second busbar-side upper surface opening forming a partition wall.

[0027] According to the busbar assembly of the present invention, the insulation between the first busbar and the second busbar, which are arranged in the same plane with gaps between them, can be well maintained, and the semiconductor elements mounted on the first busbar and / or the second busbar can be compactly arranged.

[0028] Preferably, the openings on the upper surface of the first busbar and the second busbar are located at the center of the first busbar and the second busbar in the length direction of the gap.

[0029] In one embodiment, the insulating resin layer has: a lower surface laminate disposed on a lower surface on the opposite side of the thickness direction of the busbar connector; and a side surface laminate disposed on a side of the busbar connector and connecting the upper surface laminate and the lower surface laminate, wherein the lower surface laminate has a lower surface opening that exposes a predetermined area of ​​the lower surface of the first busbar and the second busbar.

[0030] The first and second busbars have: an upper surface; a lower surface on the other side in the thickness direction; a first side facing the gap; a second side facing the side opposite to the gap; a third side connecting the ends of the upper surface, the lower surface, the first side, and the second side in the length direction of the gap to each other; and a fourth side connecting the ends of the upper surface, the lower surface, the first side, and the second side in the length direction of the gap to each other.

[0031] In another embodiment, the first side has: an upper surface abutment portion extending from the upper surface to the other side in the thickness direction; a stepped portion extending from the end of the upper surface abutment portion on the other side in the thickness direction toward the second side; and a lower surface abutment portion extending from the end of the stepped portion on the side near the second side in the thickness direction toward the other side and reaching the lower surface. The second side has: an upper surface abutment portion extending from the upper surface to the other side in the thickness direction; a stepped portion extending from the end of the upper surface abutment portion on the other side in the thickness direction toward the first side; and a lower surface abutment portion extending from the end of the stepped portion on the side near the first side in the thickness direction toward the other side and reaching the lower surface.

[0032] In this case, the insulating resin layer has a side layer in addition to the upper surface layer. The side layer is integrally formed with the upper surface layer in such a way that the lower surfaces of the first busbar and the second busbar are exposed and cover the side surface of the busbar connector, and the lower surfaces of the first busbar and the second busbar are open.

[0033] The busbar assembly of the present invention may further include a frame having a frame body having a shape corresponding to the shape of the busbar connector when viewed from above and having a central hole of predetermined thickness at the center of the frame body that surrounds the openings on the upper surface of the first busbar side and the upper surface of the second busbar side, and an insulating resin layer covering the outer periphery of the frame body.

[0034] The frame is fixedly joined to the periphery of the upper surface of the busbar connector in such a way that it surrounds the openings on the upper surface of the first busbar side and the upper surface of the second busbar side when viewed from above.

[0035] In addition, to achieve the second objective mentioned above, the present invention provides a method for manufacturing a busbar assembly comprising: a first busbar and a second busbar, the first busbar and the second busbar being formed from conductive flat plate members and disposed in the same plane with gaps between them; and an insulating resin layer comprising a gap-filling portion and an upper surface laminated portion filled within the gaps, the upper surface laminated portion being disposed on the upper surface of a busbar connector formed by connecting the first busbar and the second busbar using the gap-filling portion in the thickness direction. The busbar assembly has an opening on its upper surface that exposes a predetermined area of ​​the upper surface of the first busbar and the gap filler, spanning the boundary between the two, and an opening on its upper surface that exposes a predetermined area of ​​the upper surface of the second busbar and the gap filler, spanning the boundary between the two. A partition wall is formed in the portion of the upper surface stack located between the openings on the first and second busbar sides. The manufacturing method of the busbar assembly includes: preparing a conductive metal plate for a busbar having a busbar assembly forming area for forming the first and second busbars; and in the busbar... The process includes: forming a gap between the upper surface on one side of the thickness direction and the lower surface on the other side of the thickness direction, with a width equal to the gap; defining the gap forming portions corresponding to the first and second busbars; applying an insulating resin layer material to the gap and the entire area of ​​the upper surface of the busbar assembly forming region; curing the insulating resin material to form the insulating resin layer having the gap filling portion and the upper surface laminate portion; and applying the upper surface laminate portion to the upper surface of the upper surface laminate portion on the side corresponding to the first busbar. The laser irradiation process comprises: irradiating a region corresponding to the surface opening and the upper surface opening on the second busbar side with a laser to form the upper surface opening on the first busbar side and the upper surface opening on the second busbar side; and a cutting process comprising cutting the busbar assembly forming region from the busbar with a conductive metal plate, wherein the laser irradiation process comprises repeatedly performing multiple large pulse width laser irradiation processes and small pulse width laser irradiation processes, wherein the large pulse width laser irradiation process irradiates the corresponding region with a large pulse width laser, and the small pulse width laser irradiation process irradiates the corresponding region with a small pulse width laser.

[0036] Furthermore, the method for manufacturing a busbar assembly according to the present invention can efficiently manufacture a busbar assembly that can maintain good insulation between a first busbar and a second busbar arranged in the same plane while having gaps between them, and can compactly arrange semiconductor elements mounted on the first busbar and / or the second busbar.

[0037] Preferably, the busbar is integrally formed with a conductive metal plate having a plurality of busbar assembly forming regions arranged in a row in a first direction along the length direction of the gap and a connecting region connecting adjacent busbar assembly forming regions.

[0038] In this case, in the gap formed in a busbar assembly forming region, one end in the length direction extends to a connection region connected to one side in the first direction of the busbar assembly forming region, and the other end in the length direction extends to a connection region connected to the other side in the first direction of the busbar assembly forming region.

[0039] The manufacturing method of the busbar assembly of the present invention may include: a step of preparing a conductive metal plate for a frame forming region having a shape corresponding to the forming region of the busbar assembly when viewed from above; a step of forming a frame body forming portion by forming a central hole in the frame forming region that surrounds the openings on the upper surface of the first busbar side and the upper surface of the second busbar side when viewed from above; a step of providing an insulating resin material on the outer peripheral surface of the frame body forming portion; a step of curing the insulating resin material to provide an insulating resin layer covering the outer periphery of the frame body forming portion; and a metal plate fixing and joining step of fixing the conductive metal plate for the frame and the metal plate for the busbar in an overlapping state.

[0040] In this case, the cutting process is performed after the metal plate fixing and joining process. Attached Figure Description

[0041] Figure 1 This is a perspective view of a busbar assembly according to one embodiment of the present invention.

[0042] Figure 2 This is a top view of the busbar assembly of the described embodiment.

[0043] Figure 3 This is a bottom view of the busbar assembly of the described embodiment.

[0044] Figure 4 It is along Figure 2 The longitudinal section front view of line IV-IV in the middle.

[0045] Figure 5 It is along Figure 2 A three-dimensional longitudinal section of line IV-IV.

[0046] Figure 6 yes Figure 4 Enlarged view of section VI.

[0047] Figure 7 (a) and (b) are longitudinal sectional views of one example and another example of a semiconductor module formed by mounting semiconductor elements on a busbar assembly in the embodiment described above.

[0048] Figure 8 This is a longitudinal sectional front view of the busbar assembly of a modified embodiment of the above-described embodiment.

[0049] Figure 9 This is a longitudinal sectional perspective view of the busbar assembly of the modified example.

[0050] Figure 10 This is a top view of a conductive metal plate for a busbar used in an example of a method for manufacturing a busbar assembly according to the described embodiment.

[0051] Figure 11 (a) is Figure 10 Enlarged view of part XI(a) in the image. Figure 11 (b) is along Figure 11 (a) is a cross-sectional view of the XI(b)-XI(b) line.

[0052] Figure 12 This is a top view of the conductive metal plate used for the busbar after the process of setting the insulating resin layer in the manufacturing method.

[0053] Figure 13 (a) is Figure 12 Enlarged view of part XIII(a) in the image. Figure 13 (b) is along Figure 13 (a) is a sectional view of line XIII(b)-XIII(b).

[0054] Figure 14 (a) and (b) are Figure 13 The enlarged view of section XIV in (a) shows the state after large pulse width laser irradiation and small pulse width laser irradiation in the laser irradiation process of the manufacturing method.

[0055] Figure 15 This is a top view of the conductive metal plate used for the busbar after the laser irradiation process and the laser irradiation process on the downward surface side.

[0056] Figure 16 (a) is Figure 15 Enlarged view of part XVI(a) in the image. Figure 16 (b) is along Figure 16 (a) is a cross-sectional view of the XVI(b)-XVI(b) line.

[0057] Figure 17This is a top view of the conductive metal plate for the frame used in the frame forming process of the manufacturing method.

[0058] Figure 18 (a) is Figure 17 Enlarged view of section XVII(a) in the image. Figure 18 (b) is along Figure 18 (a) is a cross-sectional view of the XVIII(b)-XVIII(b) line.

[0059] Figure 19 This is a top view of the state in which the conductive metal plate for the busbar and the conductive metal plate for the frame are fixedly joined during the fixed joining process, which is a step in the manufacturing method.

[0060] Figure 20 It is along Figure 19 A sectional view of the XX-XX line.

[0061] Figure 21 (a) is a top view of a conventional planar busbar assembly. Figure 21 (b) is along Figure 21 (a) is a cross-sectional view of line XXI(b)-XXI(b). Figure 21 (c) is a cross-sectional view of a semiconductor module formed by mounting semiconductor elements on the conventional planar busbar assembly. Detailed Implementation

[0062] Hereinafter, an embodiment of the busbar assembly of the present invention will be described with reference to the accompanying drawings.

[0063] Figures 1-3 A perspective view, a top view, and a bottom view of the busbar assembly 1 of this embodiment are shown respectively.

[0064] in addition, Figure 4 and Figure 5 Showing along Figure 2 The longitudinal section front view and longitudinal section perspective view of line IV-IV.

[0065] and, Figure 6 Show Figure 4 Enlarged view of section VI.

[0066] like Figures 1-6 As shown, the busbar assembly 1 has: a first and a second busbar 10(1) and 10(2), the first and the second busbar 10(1) and 10(2) being formed of conductive flat plate members and disposed in the same plane with a gap 19 between their opposing sides; and an insulating resin layer 30, the insulating resin layer 30 being fixedly bonded to the first and the second busbar 10(1) and 10(2).

[0067] Furthermore, the busbar assembly 1 of this embodiment has only two busbars, namely the first and second busbars 10(1) and 10(2). Of course, the busbar assembly of the present invention can also have three or more busbars, including the first and second busbars 10(1) and 10(2).

[0068] The first and second busbars 10(1) and 10(2) are formed of conductive metals such as Cu.

[0069] like Figures 4-6 As shown, the first and second busbars 10(1) and 10(2) have: an upper surface 11 on one side of the thickness direction; a lower surface 12 on the other side of the thickness direction; a first side surface 13a facing the gap 19; a second side surface 13b facing the side opposite to the gap 19; a third side surface 13c connecting the ends of the gap 19 on one side of the length direction among the upper surface 11, the lower surface 12, the first side surface 13a and the second side surface 13b; and a fourth side surface 13d connecting the ends of the gap 19 on the other side of the length direction among the upper surface 11, the lower surface 12, the first side surface 13a and the second side surface 13b.

[0070] like Figures 1-6 As shown, the insulating resin layer 30 has: a gap filling portion 31, which is filled in the gap 19 between the opposite sides 13a of the first and second busbars 10(1) and 10(2) and mechanically connects the first and second busbars 10(1) and 10(2) in an electrically insulating state; and an upper surface stacking portion 40, which is disposed on the upper surface of the busbar connector formed by connecting the first and second busbars 10(1) and 10(2) by means of the gap filling portion 31.

[0071] The insulating resin layer 30 is formed of an insulating resin material that has heat resistance and insulation properties.

[0072] As the insulating resin material, Insulide (registered trademark) is preferred, for example.

[0073] The upper surface stacked portion 40 is provided with openings 42(1) and 42(2) on the upper surface of the first and second busbars, respectively, which expose a portion of the upper surface 11 of the first and second busbars 10(1) and 10(2).

[0074] like Figures 1-2 and Figures 4-6As shown, the opening 42(1) on the upper surface of the first busbar is formed to expose a predetermined area of ​​the upper surface 11 of the first busbar 10(1) and the upper surface of the gap filling portion 31 that spans the boundary between the two.

[0075] The space formed by the opening 42(1) on the upper surface of the first busbar side serves as a space for the semiconductor element 110 (see below) Figure 7 (a) and (b)) the semiconductor element mounting space installed in the first bus 10 (1) or the electrical connection space for electrically connecting the first bus 10 (1) to other electrical connection components.

[0076] The second busbar side upper surface opening 42(2) is formed such that a portion of the upper surface stack 40 remains between the first busbar side upper surface opening 42(1), and a predetermined area of ​​the upper surface 11 of the second busbar 10(2) and the upper surface of the gap filling portion 31 across the boundary between them is exposed.

[0077] The opening 42(2) on the upper surface of the second busbar side serves as a means for allowing the semiconductor element 110 (see below) to be inserted. Figure 7 (a) and (b)) the semiconductor element mounting space installed in the second bus 10 (2) or the electrical connection space for electrically connecting the second bus 10 (2) to other electrical connection components.

[0078] Figure 7 (a) shows a longitudinal sectional view of an example 100A of a semiconductor module consisting of semiconductor elements 110 such as LEDs mounted on the busbar assembly 1.

[0079] In the semiconductor module 100A, the opening 42(1) on the upper surface of the first busbar side (see reference) is utilized. Figure 4 and Figure 5 The space formed by (etc.) serves as a semiconductor element mounting space for mounting semiconductor element 110, utilizing the opening 42(2) on the upper surface of the second busbar side (refer to) Figure 4 and Figure 5 The space formed by (etc.) serves as the electrical connection space.

[0080] In this case, one of the first and second busbars 10(1) and 10(2) functions as the positive electrode and the other functions as the negative electrode.

[0081] That is, such as Figure 7As shown in (a), the semiconductor element 110 has a first and a second electrode layer 111 and 112 on the lower surface on one side of the thickness direction and the upper surface on the other side of the thickness direction, respectively, and an element body 115 is provided between the first and the second electrode layers 111 and 112.

[0082] In the semiconductor module 100A, the semiconductor element 110 has a corresponding upper surface opening (in the illustrated example, the upper surface opening 42(1) on the first busbar side) in the upper surface 11 of the first electrode layer 111 and the busbar on one side (in the illustrated example, the first busbar side) (see reference). Figure 4 and Figure 5 With the exposed portion electrically connected, the corresponding upper surface opening (in the illustrated example, the upper surface opening 42(1) on the first busbar side) is utilized (see reference). Figure 4 and Figure 5 The space formed by the busbar (in the illustrated example, the first busbar 10(1)) is fixedly joined to the upper surface 11 of the busbar on that side.

[0083] Furthermore, the second electrode layer 112 of the semiconductor element 110 is electrically connected via wire bonding members or other electrical connection members 120 to the upper surface 11 of another busbar (in the illustrated example, the second busbar 10 (2)) through a corresponding upper surface opening (in the illustrated example, the upper surface opening 42 (2) on the second busbar side) (see reference 120). Figure 4 and Figure 5 Exposed electrical connections, etc.

[0084] Furthermore, it is preferable that a coating (not shown) is provided on the upper surface of the first and second busbars 10(1) and 10(2).

[0085] Figure 7 Reference numeral 130 in (a) is a sealing resin layer that is fixedly bonded to the first surface 11 of the busbar assembly 1 to protect the semiconductor element 110 and the electrical connection member 120 and other components mounted on the busbar assembly 1.

[0086] The sealing resin layer 130 is, for example, a transparent resin such as polyimide, polyamide, or epoxy.

[0087] The sealing resin layer 130 is disposed in the area defined by the frame 60.

[0088] That is, such as Figure 7 As shown in (a), the busbar assembly 1 of this embodiment also has a frame 60 that opens the center of the upper surface of the busbar connector and is fixedly joined to the periphery of the upper surface of the busbar connector.

[0089] The frame 60 functions as a barrier structure when the sealing resin layer 130 is installed.

[0090] That is, the sealing resin layer 130 is formed by applying the resin that forms the sealing resin layer 130 to the upper surface of the busbar assembly 1 in such a way as to surround the semiconductor element 110 and the electrical connection member 120 and other components, and then curing it. However, at this time, a blocking structure is required to prevent the resin from flowing out.

[0091] The frame 60 has a frame body 65 of predetermined thickness that has a shape corresponding to the shape of the busbar connector when viewed from above and has a central hole 61 that surrounds the openings 42(1) and 42(2) on the upper surface of the first and second busbars at the center when viewed from above, and an insulating resin layer 70 covering the outer periphery of the frame body 65.

[0092] The frame body 60 can be formed, for example, by using a metal plate having a thickness corresponding to the thickness of the frame body 60 and forming the central hole 61 on the metal plate by stamping.

[0093] The insulating resin layer 65 on the frame side is formed, for example, using insulating resin materials such as polyimide, polyamide, and epoxy.

[0094] The frame 60 is fixedly joined to the periphery of the upper surface of the busbar connector by means of adhesive or the like, in a manner that surrounds the openings 42(1) and 42(2) on the upper surface of the first and second busbars when viewed from above.

[0095] Figure 7 (b) A longitudinal sectional view of another example 100B of a semiconductor module consisting of semiconductor elements 110 such as LEDs mounted on the busbar assembly 1 is shown.

[0096] Furthermore, in the diagram, for... Figure 7 In (a), the same components are labeled with the same reference numerals.

[0097] In the semiconductor module 100B, the opening 42(1) on the upper surface of the first busbar side (see reference) is utilized. Figure 4 and Figure 5 The space formed by the second busbar and the opening 42(2) on the upper surface of the second busbar side (see reference) Figure 4 and Figure 5 The space formed by these two (etc.) serves as the semiconductor component mounting space for mounting semiconductor components 110.

[0098] In this case, the first and second semiconductor elements 110(1) and 110(2) installed on the first and second busbars 10(1) and 10(2) are connected in parallel.

[0099] That is, the first busbar 10(1) electrically connected to the first electrode layer 111 of the first semiconductor element 110(1) and the second busbar 10(2) electrically connected to the first electrode layer 111 of the second semiconductor element 110(2) both function as one of the positive electrode and the negative electrode (e.g., the positive electrode).

[0100] Furthermore, the second electrode layer 112 of the first and second semiconductor elements 110(1) and 110(2) is electrically connected to the other of the positive electrode and the negative electrode (e.g., the negative electrode, not shown) via an electrical connection member such as a wire bonding member.

[0101] According to the busbar assembly 1 of this embodiment, since the first and second busbars 10(1) and 10(2) are arranged in the same plane, miniaturization can be achieved as much as possible in the vertical direction (thickness direction).

[0102] Furthermore, the first and second busbars 10(1) and 10(2) are arranged opposite each other on the first side 13a. Therefore, compared with a stacked busbar assembly in which multiple busbars are stacked on top of each other, the area of ​​the first and second busbars 10(1) and 10(2) opposite each other can be minimized as much as possible. As a result, leakage current flowing between the first and second busbars 10(1) and 10(2) can be effectively prevented or reduced.

[0103] Furthermore, according to the busbar assembly 1 of this embodiment, such as Figure 4 and Figure 6 As shown, the separation width L2 of the relative edges of the openings 42(1) and 42(2) on the upper surface of the first and second busbars can be reduced in a way that does not unreasonably reduce the width L1 of the gap 19 between the first and second busbars 10(1) and 10(2).

[0104] Therefore, as Figure 7 As shown in (a) and (b), the insulation between the first and second busbars 10(1) and 10(2) can be well ensured, and the semiconductor elements 110 mounted on the first busbar 10(1) and / or the second busbar 10(2) can be configured as compactly as possible.

[0105] In addition, the portion of the upper surface stack 40 located between the openings 42(1) and 42(2) on the upper surface of the first and second busbars serves as a partition wall 43 between the exposed area of ​​the first busbar 10(1) exposed through the opening 42(1) on the upper surface of the first busbar (hereinafter referred to as the first busbar exposed area) and the exposed area of ​​the second busbar 10(2) exposed through the opening 42(2) on the upper surface of the second busbar (hereinafter referred to as the second busbar exposed area), thus effectively preventing short circuits between the exposed areas of the first and second busbars.

[0106] Furthermore, the partition wall 43 can also function as an alignment member when installing the semiconductor element 110, thereby improving the accuracy of the installation position of the semiconductor element 110.

[0107] Furthermore, in this embodiment, such as Figure 2 As shown, the openings 42(1) and 42(2) on the upper surface of the first and second busbars are disposed in the center of the first and second busbars 10(1) and 10(2) in the length direction of the gap 19.

[0108] like Figure 4 and Figure 5 As shown in the figure, in this embodiment, the insulating resin layer 30 further includes: a lower surface laminate portion 50, which is disposed on the lower surface of the busbar connector on the other side of the thickness direction; and a side surface laminate portion 55, which is disposed on the side of the busbar connector and connects the periphery of the upper surface laminate portion 40 and the lower surface laminate portion 50.

[0109] like Figures 3-6 As shown, in this embodiment, the lower surface stacked portion 50 is provided with lower surface openings 52(1) and 52(2) on the first and second busbar sides, respectively exposing predetermined areas of the lower surface 12 of the first and second busbars 10(1) and 10(2).

[0110] Alternatively, instead of the lower surface openings 52(1) and 52(2) on the side of the first and second busbars, a single lower surface opening can be formed that exposes a predetermined area of ​​the lower surface 12 of the first and second busbars 10(1) and 10(2) integrally.

[0111] Figure 8 and Figure 9 The front longitudinal view and perspective longitudinal view of the busbar assembly 1' of the modified embodiment are shown respectively.

[0112] Furthermore, in the figures, the same reference numerals are used to label the same components as in this embodiment.

[0113] Compared with this embodiment, the modified example 1' has a first and a second busbar 10'(1), 10'(2) replacing the first and second busbar 10(1), 10(2), and has an insulating resin layer 30' replacing the insulating resin layer 30.

[0114] The first and second busbars 10'(1) and 10'(2) have: an upper surface 11 and a lower surface 12; a first side 13a' facing the gap 19; a second side 13b' facing the side opposite to the gap 19; a third side (not shown) connecting the ends of the upper surface 11, the lower surface 12, the first side 13a' and the second side 13b' of the gap 19 along the length direction to each other; and a fourth side (not shown) connecting the ends of the upper surface 11, the lower surface 12, the first side 13a' and the second side 13b' of the gap 19 along the other length direction to each other.

[0115] The first side surface 13a' has: an upper surface abutment portion 13a'-1, which extends from the upper surface 11 to the other side in the thickness direction; a stepped portion 13a'-2, which extends from the end of the upper surface abutment portion 13a'-1 on the other side in the thickness direction toward the second side surface 13b'; and a lower surface abutment portion 13a'-3, which extends from the end of the stepped portion 13a'-2 on the side near the second side surface 13b' toward the other side in the thickness direction and reaches the lower surface 12.

[0116] Similarly, the second side 13b' has: an upper surface abutment portion 13b'-1, which extends from the upper surface 11 to the other side in the thickness direction; a step portion 13b'-2, which extends from the end of the upper surface abutment portion 13b'-1 on the other side in the thickness direction toward the first side 13a'; and a lower surface abutment portion 13b'-3, which extends from the end of the step portion 13b'-2 on the side near the first side 13a' toward the other side in the thickness direction and reaches the lower surface 12.

[0117] The insulating resin layer 30' has the gap filling portion 31 and the upper surface stacked portion 40, and also has a side stacked portion 55' integrally formed with the upper surface stacked portion 40 in such a way that the lower surface 12 of the first and second busbars 10'(1) and 10'(2) is exposed and covers the side of the busbar connector.

[0118] Next, the manufacturing method of the busbar assembly 1 will be described.

[0119] Figure 10 A top view of a conductive metal plate 200 for a busbar used in the manufacturing method is shown.

[0120] in addition, Figure 11 (a) shows Figure 10 Enlarged view of part XI(a) in the image. Figure 11 (b) shows along Figure 11 (a) is a cross-sectional view of the XI(b)-XI(b) line.

[0121] like Figure 10 and Figure 11 As shown, the manufacturing method includes: a step of preparing a conductive metal plate 200 for a busbar having a busbar assembly forming region 210 for forming the first and second busbars 10(1) and 10(2); and a gap forming step of forming a gap 215 in the busbar assembly forming region 210 between an upper surface 211 on one side of the thickness direction and a lower surface 212 on the other side of the thickness direction.

[0122] Figure 10 and Figure 11 This shows the state after the gap-forming process is completed.

[0123] The conductive metal plate 200 for the busbar has the same thickness as the first and second busbars 10(1) and 10(2), and the busbar assembly forming region 210 has the same shape as the busbar connector when viewed from above.

[0124] The gap 215 is configured to have the same width as the gap 19 and be the same as or longer than the gap 19, dividing the busbar assembly forming area 210 into first and second busbar forming portions 220(1) and 220(2) respectively corresponding to the first and second busbars 10(1) and 10(2).

[0125] Furthermore, in the case of manufacturing a busbar assembly having three or more busbars arranged in parallel, including other busbars besides the first and second busbars 10(1) and 10(2), gaps are formed in a number that is the number of busbars minus 1.

[0126] That is, for example, when manufacturing a busbar assembly consisting of three busbars arranged side by side, two gaps are formed.

[0127] like Figure 10 and Figure 11As shown, in this embodiment, the conductive metal plate 200 for the busbar has a busbar array 205, which includes a plurality of busbar assembly forming regions 210 arranged in a row along the X direction in the X-Y plane where the conductive metal plate 200 is located, and a connecting region 230 connecting adjacent busbar assembly forming regions 210 in the X direction, enabling simultaneous processing of the plurality of busbar assembly forming regions 210.

[0128] In this embodiment, the conductive metal plate 200 for the busbar also has a pair of holding pieces 207 that are respectively connected to one side and the other side of the busbar array 205 along the length direction (X direction), and the pair of holding pieces 207 are provided with alignment holes 208.

[0129] Alternatively, multiple busbars 205 can be arranged side-by-side in the Y direction, and the pair of gripping plates 207, 207 can be used to hold the multiple busbars 205 arranged side-by-side in the Y direction together.

[0130] Based on this modified structure, more busbar assemblies 1 can be manufactured simultaneously.

[0131] The X-direction length of the busbar assembly forming region 210 is the same as the length of the busbar assembly 1 along the length direction of the gap 19, and the Y-direction length is the same as the length of the busbar assembly 1 along the width direction of the gap 19.

[0132] The slit 215 forms the gap 19 in the busbar assembly 1 and is set to have the same width as the gap 19.

[0133] Furthermore, the width of the gap 19 is determined according to the specifications of the busbar assembly 1.

[0134] In this embodiment, in the gap 215 formed in a busbar assembly forming region 210, one side in the length direction (X direction) extends into a connecting region 230 connected to the one side in the length direction (X direction) of the busbar assembly forming region 210, and the other side in the length direction (X direction) extends into another connecting region 230 connected to the other side in the length direction (X direction) of the busbar assembly forming region 230.

[0135] In this case, after the gap forming process, the first and second busbar forming portions 220(1) and 220(2) that are opposite each other across the gap 215 formed in the busbar assembly forming region 210 are maintained in a state where they are connected to each other via the connecting region 230 and the other connecting regions 230.

[0136] Therefore, the gap 215 (the gap 19) can be formed with high precision.

[0137] The manufacturing method, after the gap forming process, includes the following step: applying an insulating resin material 240, which forms the insulating resin layer 30, to the gap 215 and the outer surface of the busbar forming region 210, and then curing it to form the insulating resin layer 30.

[0138] Figure 12 A top view of the conductive metal plate 200 for the busbar with the insulating resin layer 30 provided is shown.

[0139] in addition, Figure 13 (a) shows Figure 12 Enlarged view of part XIII(a) in the image. Figure 13 (b) shows along Figure 13 (a) is a sectional view of line XIII(b)-XIII(b).

[0140] The insulating resin material 240 is a heat-resistant and insulating resin such as polyimide, polyamide, or epoxy, preferably Insulide (registered trademark).

[0141] The insulating resin material 240 can be applied, for example, by electrodepositing a coating containing the insulating resin material 240.

[0142] Alternatively, the powder of the insulating resin material 240 can also be electrostatically powder coated.

[0143] Alternatively, if sufficient filling of the resin into the gap 215 can be ensured, the coating containing the insulating resin material 240 can also be sprayed.

[0144] The curing of the insulating resin material 240 is carried out, for example, by heat treatment of the insulating resin material 240 at a predetermined temperature and for a predetermined time.

[0145] The manufacturing method subsequently includes the following laser irradiation step: irradiating a region on the upper surface of the upper surface of the upper surface stack 40 corresponding to the openings 42(1) and 42(2) on the upper surface of the first and second busbar sides with a laser to form the openings 42(1) and 42(2) on the upper surface of the first and second busbar sides.

[0146] The laser irradiation process repeatedly performs large-pulse-width laser irradiation treatment on the entire corresponding area and small-pulse-width laser irradiation treatment on the entire corresponding area.

[0147] Figure 14 (a) and (b) show Figure 13 Enlarged view of section XIV in (a).

[0148] Figure 14 (a) and (b) show the state after the region corresponding to the opening 42(1) on the upper surface of the first busbar side is subjected to large pulse width laser irradiation and small pulse width laser irradiation, respectively.

[0149] Figure 14 In (a) and (b), reference numerals 245 and 246 represent the irradiation points of the large-pulse-width pulsed laser and the small-pulse-width pulsed laser, respectively.

[0150] Here, the laser in the laser irradiation process only needs to be able to melt the insulating resin layer 30, and can be set to various wavelengths, such as 1064nm.

[0151] Regarding the pulsed laser with a large pulse width, the peak output is weak. Conversely, the irradiation time on the upper surface stack 40 of the insulating resin layer 30, which becomes the irradiated object, is long. Therefore, the heat diffusion in the upper surface stack 40 is strong, and the irradiation spacing (the diameter of the perforation opened in the upper surface stack 40) is large.

[0152] On the other hand, regarding the pulsed laser with the small pulse width, the irradiation time of the upper surface stack 40 of the insulating resin layer 30 that becomes the irradiated object is short. Therefore, the heat diffusion in the upper surface stack 40 is weak and the irradiation spacing (the diameter of the perforation opened in the upper surface stack 40) is small. However, on the other hand, the peak output is strong, so it is possible to form sharp perforation edges.

[0153] Therefore, by repeatedly performing large pulse width laser irradiation and small pulse width laser irradiation, the openings 42(1) and 42(2) on the upper surface of the first and second busbars can be formed with a beautiful edge state.

[0154] Furthermore, as described above, the opening 42(1) on the upper surface of the first busbar side includes a predetermined region that spans the boundary of the first busbar 10(1) and the gap filling portion 31 when viewed from above, and the opening 42(2) on the upper surface of the second busbar side includes a predetermined region that spans the boundary of the second busbar 10(2) and the gap filling portion 31 when viewed from above.

[0155] That is, the gap filling portion 31 is located directly below a portion of the upper surface laminate 40 that has been melted by the laser irradiation process.

[0156] Here, the laser parameters in the laser irradiation process, including the large pulse width and small pulse width, repetition frequency, pulse energy, and peak output of the laser, are set to melt the upper surface stacked portion 40 located on the gap filling portion 31, but not to melt the gap filling portion 31.

[0157] The setting value of the laser parameters can be determined experimentally based on the type and thickness of the insulating resin layer 30, which is the irradiated object.

[0158] In addition, the manufacturing method includes a laser irradiation step for forming the openings 42(1) and 42(2) on the upper surface of the first and second busbars, and a lower surface laser irradiation step for forming the openings 52(1) and 52(2) on the lower surface of the lower surface stacked portion 50 by irradiating a predetermined area of ​​the lower surface stacked portion 50 with a laser.

[0159] Figure 15 A top view of the conductive metal plate 200 for the busbar after the laser irradiation process and the laser irradiation process on the lower surface side is shown.

[0160] in addition, Figure 16 (a) shows Figure 15 Enlarged view of part XVI(a) in the image. Figure 16 (b) shows along Figure 16 (a) is a cross-sectional view of the XVI(b)-XVI(b) line.

[0161] The manufacturing method is configured to perform a frame forming process for forming the frame 60 at any time between the step of preparing the conductive metal plate 200 for the busbar and the laser irradiation step, or before the step of preparing the conductive metal plate 200 for the busbar, or after the laser irradiation step.

[0162] Figure 17 A top view of the conductive metal plate 300 for the frame used in the frame forming process is shown.

[0163] and, Figure 18 (a) shows Figure 17 Enlarged view of section XVII(a) in the image. Figure 18 (b) shows along Figure 18 (a) is a cross-sectional view of the XVIII(b)-XVIII(b) line.

[0164] like Figure 17 and Figure 18As shown, the frame forming process includes: a step of preparing a conductive metal plate 300 for the frame, which has the same thickness as the frame body 65 and has a shape corresponding to the busbar assembly forming area 210 when viewed from above; a punching step of punching the center of the frame forming area 310 in such a way that the frame body forming portion 320 in the frame forming area 310 remains; and a step of coating the outer peripheral surface of the frame body forming portion 320 with an insulating resin material 270 to form an insulating resin layer 70 and then curing it to provide the insulating resin layer 70.

[0165] Figure 17 The image shows the state after the process of applying the insulating resin layer 70 to the outer peripheral surface of the frame body forming portion 320.

[0166] The frame is constructed with a conductive metal plate 300 such that when it overlaps with the busbar conductive metal plate 200, the frame forming region 310 is aligned with the busbar assembly forming region 210.

[0167] In detail, as described above, the conductive metal plate 200 for the busbar has a busbar array 205, which includes a plurality of busbar assembly forming regions 210 arranged in a row along the X direction and a connecting region 230 connecting adjacent busbar assembly forming regions 210 in the X direction.

[0168] Therefore, as Figure 17 As shown, the conductive metal plate 300 for the frame has a frame column 305, which includes a plurality of frame forming regions 310 arranged in a row in the X direction with the same spacing as the plurality of busbar assembly forming regions 210, and a connecting region 330 connecting adjacent frame forming regions 310 in the X direction.

[0169] Furthermore, as described above, the conductive metal plate 200 for the busbar has a pair of holding pieces 207 that are respectively connected to one side and the other side of the busbar array 205 in the length direction (X direction), and the pair of holding pieces 207 are provided with alignment holes 208.

[0170] Correspondingly, such as Figure 17 As shown, the conductive metal plate 300 of the frame is also provided with a pair of holding pieces 307 that are respectively connected to one side and the other side of the frame column 305 in the length direction (X direction). The pair of holding pieces 307 are provided with alignment holes 308 corresponding to the alignment holes 208.

[0171] In the blanking process, the central area to be blanked is set to the following size: when the frame forming area 310 coincides with the busbar assembly forming area 210, the frame body forming part 320 surrounds the first central opening 41a on the first side and the second central opening 41b on the first side.

[0172] The insulating resin material 270 can be applied to the frame body forming portion 320 by electrodeposition coating of a coating containing heat-resistant and insulating resins such as polyimide, polyamide, and epoxy.

[0173] Alternatively, the powder of the insulating resin material 270 can also be electrostatically powder coated.

[0174] Alternatively, the coating containing the insulating resin material 270 can be sprayed or applied.

[0175] Preferably, the process of applying insulating resin material 270 to the frame body forming portion 320 can be performed simultaneously with the process of applying insulating resin material 240 to the busbar forming region 210 using the same method.

[0176] That is, when the insulating resin material 240 is applied to the busbar forming region 210 by electrodeposition coating, the insulating resin material 270 can also be applied to the frame body forming region 320 by electrodeposition coating. When the insulating resin material 240 is applied to the busbar forming region 210 by electrostatic powder coating, the insulating resin material 270 can also be applied to the frame body forming region 320 by electrostatic powder coating.

[0177] This structure enables improvements in manufacturing efficiency.

[0178] The manufacturing method further includes the following steps: on the upper surface of the conductive metal plate 200 for the busbar where the insulating resin layer 30 is provided, the conductive metal plate 300 for the frame where the insulating resin layer 70 is provided is fixedly joined with an adhesive in such a way that it surrounds the openings 42(1) and 42(2) on the upper surface of the first and second busbar sides.

[0179] Figure 19 The diagram shows a top view of the conductive metal plate 200 for the busbar and the conductive metal plate 300 for the frame after the fixing and joining process.

[0180] Figure 20 Show along Figure 19 A sectional view of the XX-XX line.

[0181] Furthermore, the manufacturing method includes the following cutting step after the fixed joining step: the busbar conductive metal plate 200 and the frame conductive metal plate 300 in the overlapping state are cut using cutting lines C1 and C2 respectively along the edges of one side and the other side of the busbar assembly forming region 210 in the X direction, and the busbar assembly forming region 210 and the frame forming region 310 are removed.

[0182] According to the manufacturing method with this structure, the busbar assembly 1 of this embodiment can be manufactured efficiently.

[0183] Explanation of reference numerals in the attached figures

[0184] 1, 1' Busbar Assembly

[0185] 10(1), 10(2) First and second busbars

[0186] 11. Top surface

[0187] 12 Lower surface

[0188] 13a, 13a' First side view

[0189] 13a'-1 Upper surface adjacent part

[0190] 13a'-2 Stepped section

[0191] 13a'-3 Lower surface adjacent portion

[0192] 13b, 13b' Second side

[0193] 13b'-1 Upper surface adjacent portion

[0194] 13b'-2 Step section

[0195] 13ab-3 Lower surface adjacent part

[0196] 13c Third side

[0197] 13d Fourth Side View

[0198] 19 gaps

[0199] 30 Insulating resin layer

[0200] 31 Gap Filling Section

[0201] 40 Upper surface laminate

[0202] 42(1), 42(2) Openings on the upper surface of the first and second busbars

[0203] 43. Partition wall

[0204] 50 Lower surface laminate

[0205] 52(1), 52(2) Openings on the lower surface of the first and second busbars

[0206] 55 Side layered portion

[0207] 60 frame

[0208] 61 Central Hole

[0209] 65. Main frame

[0210] 70 Insulating resin layer

[0211] Conductive metal plate for 200 busbar

[0212] 210 Busbar assembly forming area

[0213] 215 gap

[0214] 220(1), 220(2) Formation locations of the first and second busbars

[0215] 230 Linked Areas

[0216] 240, 270 Insulating Resin Materials

[0217] 300 Conductive metal plate for frame

[0218] 310 Frame Formation Area

[0219] 320. The main body of the frame is formed at this location.

Claims

1. A busbar assembly, characterized in that, have: The first and second busbars are formed of conductive flat plate members and are arranged in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer including a gap-filling portion filled in the gaps and an upper surface laminated portion, the upper surface laminated portion being disposed on the upper surface of the busbar connector formed by connecting the first and second busbars by the gap-filling portion in the thickness direction. The insulating resin layer further comprises: a lower surface laminate portion disposed on the lower surface of the busbar connector on the other side of its thickness direction; and a side surface laminate portion disposed on the side surface of the busbar connector and connecting the upper surface laminate portion and the lower surface laminate portion. The upper surface laminate portion has a first busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the first busbar and the gap filler portion across their boundary, and a second busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the second busbar and the gap filler portion across their boundary. The portion of the upper surface stacked portion located between the opening on the upper surface of the first busbar side and the opening on the upper surface of the second busbar side forms a partition wall. The lower surface layer is provided with a lower surface opening that exposes a predetermined area of ​​the lower surface of the first busbar and the second busbar.

2. The busbar assembly according to claim 1, characterized in that, The openings on the upper surface of the first busbar and the second busbar are located at the center of the first and second busbars along the length of the gap.

3. The busbar assembly according to claim 1, characterized in that, The busbar assembly includes a frame having a shape that corresponds to the shape of the busbar connector when viewed from above, and a central hole of predetermined thickness having a central hole surrounding the openings on the upper surface of the first busbar and the upper surface of the second busbar, and an insulating resin layer covering the outer periphery of the frame body. The frame is fixedly joined to the periphery of the upper surface of the busbar connector in such a way that it surrounds the openings on the upper surface of the first busbar side and the upper surface of the second busbar side when viewed from above.

4. A busbar assembly, characterized in that, have: The first and second busbars are formed of conductive flat plate members and are arranged in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer including a gap-filling portion filled in the gaps and an upper surface laminated portion, the upper surface laminated portion being disposed on the upper surface of the busbar connector formed by connecting the first and second busbars by the gap-filling portion in the thickness direction. The upper surface stacked portion is provided with a first busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the first busbar and the gap filling portion that crosses the boundary between them, and a second busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the second busbar and the gap filling portion that crosses the boundary between them. The portion of the upper surface stacked portion located between the opening on the upper surface of the first busbar side and the opening on the upper surface of the second busbar side forms a partition wall. The first busbar and the second busbar have: the upper surface; The upper surface is a lower surface on the opposite side of the thickness direction; a first side surface facing the gap; a second side surface facing the side opposite to the gap; a third side surface connecting the ends of the upper surface, the lower surface, the first side surface, and the second side surface on one side of the length direction of the gap to each other; and a fourth side surface connecting the ends of the upper surface, the lower surface, the first side surface, and the second side surface on the opposite side of the length direction of the gap to each other. The first side has: an upper surface adjacent portion that extends from the upper surface to the other side in the thickness direction; and a stepped portion that extends from the end of the upper surface adjacent portion on the other side in the thickness direction toward the second side. And a lower surface abutment portion, the lower surface abutment portion extending from the end of the stepped portion near the second side surface towards the other side in the thickness direction and reaching the lower surface, The second side has: an upper surface abutment portion that extends from the upper surface to the other side in the thickness direction; and a stepped portion that extends from the end of the upper surface abutment portion on the other side in the thickness direction toward the first side. And a lower surface abutment portion, which extends from the end of the stepped portion near the first side surface towards the other side in the thickness direction and reaches the lower surface. The insulating resin layer also has a side laminate portion, which is integrally formed with the upper surface laminate portion in such a way that the lower surfaces of the first busbar and the second busbar are exposed and cover the sides of the busbar connector.

5. The busbar assembly according to claim 4, characterized in that, The openings on the upper surface of the first busbar and the second busbar are located at the center of the first and second busbars along the length of the gap.

6. The busbar assembly according to claim 4, characterized in that, The busbar assembly includes a frame having a shape that corresponds to the shape of the busbar connector when viewed from above, and a central hole of predetermined thickness having a central hole surrounding the openings on the upper surface of the first busbar and the upper surface of the second busbar, and an insulating resin layer covering the outer periphery of the frame body. The frame is fixedly joined to the periphery of the upper surface of the busbar connector in such a way that it surrounds the openings on the upper surface of the first busbar side and the upper surface of the second busbar side when viewed from above.

7. A method for manufacturing a busbar assembly, the busbar assembly comprising: a first busbar and a second busbar, the first busbar and the second busbar being formed from conductive flat plate members and disposed in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer comprising a gap-filling portion, an upper surface laminate, a lower surface laminate, and a side laminate filled in the gaps, the upper surface laminate being disposed on an upper surface on one side of the thickness direction of a busbar connector formed by connecting the first busbar and the second busbar using the gap-filling portion, the lower surface laminate being disposed on a lower surface on the other side of the thickness direction of the busbar connector, and the side laminate being disposed on... The upper and lower surface stacks are disposed on the side of the busbar connector and connect the peripheries of the upper surface stack. The upper surface stack has a first busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the first busbar and the gap filler that crosses their boundaries, and a second busbar-side upper surface opening that exposes a predetermined area of ​​the upper surface of the second busbar and the gap filler that crosses their boundaries. A partition wall is formed in the portion of the upper surface stack between the first and second busbar-side upper surface openings. The lower surface stack has a lower surface opening that exposes a predetermined area of ​​the lower surface of the first and second busbars. The method for manufacturing the busbar assembly is characterized by comprising: A process for preparing a conductive metal plate for a busbar having a busbar assembly forming region for forming the first busbar and the second busbar; A gap is formed in the busbar assembly forming area, which extends through the upper surface on one side of the thickness direction and the lower surface on the other side of the thickness direction and has the same width as the gap, and the gap forming process is used to define the first busbar forming part and the second busbar forming part corresponding to the first busbar and the second busbar. The process of applying an insulating resin layer material within the gap and over the entire area of ​​the upper surface of the busbar assembly forming region; The process of curing the insulating resin layer material to form the insulating resin layer having the gap filling portion and the upper surface laminate portion; A laser irradiation process is performed to irradiate a region in the upper surface stack that corresponds to the opening on the upper surface of the first busbar side and the opening on the upper surface of the second busbar side with a laser to form the opening on the upper surface of the first busbar side and the opening on the upper surface of the second busbar side. A lower surface side laser irradiation process for forming the lower surface opening by irradiating a region in the lower surface stack corresponding to the lower surface opening with a laser; and The cutting process of cutting the busbar assembly forming area from the busbar using a conductive metal plate. The laser irradiation process consists of repeatedly performing large-pulse-width laser irradiation and small-pulse-width laser irradiation processes. The large-pulse-width laser irradiation process irradiates the corresponding area with large-pulse-width pulsed laser light, while the small-pulse-width laser irradiation process irradiates the corresponding area with small-pulse-width pulsed laser light.

8. The method for manufacturing a busbar assembly according to claim 7, characterized in that, The busbar is integrally formed with a conductive metal plate having a plurality of busbar assembly forming regions arranged in a row in a first direction along the length of the gap, and a connecting region connecting adjacent busbar assembly forming regions. In the gap formed in a busbar assembly forming region, one end in the length direction extends to a connection region connected to one side in the first direction of the busbar assembly forming region, and the other end in the length direction extends to a connection region connected to the other side in the first direction of the busbar assembly forming region.

9. The method for manufacturing a busbar assembly according to claim 7 or 8, characterized in that, The method for manufacturing the busbar assembly includes: A process for preparing a conductive metal plate for a frame forming area that, when viewed from above, has a shape corresponding to the busbar assembly forming area; The process of forming a central hole in the frame forming area that surrounds the opening on the upper surface of the first busbar and the opening on the upper surface of the second busbar when viewed from above, thereby forming the frame body forming part; The process of applying an insulating resin layer material to the outer peripheral surface of the portion where the frame body is formed; The process of curing the insulating resin layer material to form an insulating resin layer covering the outer periphery of the frame body forming portion; and The metal plate fixing and joining process involves fixing the conductive metal plate of the frame to the conductive metal plate of the busbar in an overlapping state. The cutting process is performed after the metal plate fixing and joining process.

10. A busbar assembly, characterized in that, have: The first and second busbars are formed of conductive flat plate members and are arranged in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer including a gap-filling portion, an upper surface laminate, a lower surface laminate, and a side laminate filled in the gaps. The upper surface laminate is disposed on the upper surface of the busbar connector formed by connecting the first and second busbars using the gap-filling portion in the thickness direction. The lower surface laminate is disposed on the lower surface of the busbar connector in the other thickness direction. The side laminate is disposed on the side of the busbar connector and connects the periphery of the upper surface laminate and the lower surface laminate. The upper surface stacked portion is provided with an upper surface opening on the first busbar side and an upper surface opening on the second busbar side, respectively, which exposes a portion of the upper surface of the first busbar and the second busbar. The lower surface stacked portion is provided with a lower surface opening on the side of the first busbar and a lower surface opening on the side of the second busbar, which expose predetermined areas of the lower surfaces of the first busbar and the second busbar, respectively.

11. A busbar assembly, characterized in that, have: The first and second busbars are formed of conductive flat plate members and are arranged in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer including a gap-filling portion, an upper surface laminate, a lower surface laminate, and a side laminate filled in the gaps. The upper surface laminate is disposed on the upper surface of the busbar connector formed by connecting the first and second busbars using the gap-filling portion in the thickness direction. The lower surface laminate is disposed on the lower surface of the busbar connector in the other thickness direction. The side laminate is disposed on the side of the busbar connector and connects the periphery of the upper surface laminate and the lower surface laminate. The upper surface stacked portion is provided with an upper surface opening on the first busbar side and an upper surface opening on the second busbar side, respectively, which expose portions of the upper surfaces of the first busbar and the second busbar. The lower surface layer is provided with a single lower surface opening that exposes a predetermined area of ​​the lower surfaces of the first busbar and the second busbar together.

12. A busbar assembly, characterized in that, have: The first and second busbars are formed of conductive flat plate members and are arranged in the same plane with gaps between them; and an insulating resin layer, the insulating resin layer including a gap-filling portion filled in the gaps and an upper surface laminated portion, the upper surface laminated portion being disposed on the upper surface of the busbar connector formed by connecting the first and second busbars by the gap-filling portion in the thickness direction. The first busbar and the second busbar have: the upper surface on one side in the thickness direction; The upper surface is a lower surface on the opposite side of the thickness direction; a first side surface facing the gap; a second side surface facing the side opposite to the gap; a third side surface connecting the ends of the upper surface, the lower surface, the first side surface, and the second side surface on one side of the length direction of the gap to each other; and a fourth side surface connecting the ends of the upper surface, the lower surface, the first side surface, and the second side surface on the opposite side of the length direction of the gap to each other. The first side has: an upper surface adjacent portion that extends from the upper surface to the other side in the thickness direction; and a stepped portion that extends from the end of the upper surface adjacent portion on the other side in the thickness direction toward the second side. And a lower surface abutment portion, the lower surface abutment portion extending from the end of the stepped portion near the second side surface towards the other side in the thickness direction and reaching the lower surface, The second side has: an upper surface abutment portion that extends from the upper surface to the other side in the thickness direction; and a stepped portion that extends from the end of the upper surface abutment portion on the other side in the thickness direction toward the first side. And a lower surface abutment portion, which extends from the end of the stepped portion near the first side surface towards the other side in the thickness direction and reaches the lower surface. The upper surface stacked portion is provided with an upper surface opening on the first busbar side and an upper surface opening on the second busbar side, respectively, which expose portions of the upper surfaces of the first busbar and the second busbar. In addition to the gap filling portion and the upper surface laminate portion, the insulating resin layer also has a side laminate portion integrally formed with the upper surface laminate portion in such a way that the lower surfaces of the first busbar and the second busbar are exposed and cover the side surface of the busbar connector.

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