Display device

Abstract

A display device includes: an array substrate having a display area and a non-display area located outside the display area, and having a light-emitting array; and a sealing structure provided on the array substrate, wherein the sealing structure seals the light-emitting array and fixes a plate-shaped reinforcing substrate facing the sealing structure to the array substrate. In this regard, the sealing structure includes a first adhesive layer facing the array substrate, a second adhesive layer facing the reinforcing substrate, and a barrier layer provided between the first adhesive layer and the second adhesive layer. Therefore, the thickness of the sealing structure is greater than a critical thickness to avoid process defects in a single layer made of an adhesive material. Due to such a sealing structure, a decrease in the fixing reliability of the reinforcing substrate having a relatively large thickness is avoided. Therefore, the rigidity and heat dissipation effect caused by the reinforcing substrate are sufficient.

Description

Technical Field

[0001] The present disclosure relates to a display device including a sealing structure for sealing a light-emitting element. Background Art

[0002] Display devices are applied to various electronic devices such as televisions, mobile phones, laptop computers, and tablet computers. For this reason, research and development of thinner, lighter, and lower-power display devices is ongoing.

[0003] Examples of display devices include liquid crystal display devices (LCDs), plasma display devices (PDPs), field emission display devices (FEDs), electro-wetting display devices (EWDs), and electro-luminescent display devices (ELDDs), or organic light-emitting display devices (OLEDs), etc.

[0004] An organic light-emitting display device (OLED) includes a plurality of pixel regions disposed in a display area where an image is displayed, and a plurality of organic light-emitting elements respectively corresponding to the plurality of pixel regions. Each organic light-emitting element is a self-luminous element capable of emitting light. Therefore, compared with liquid crystal display devices, organic light-emitting display devices have a faster response speed, higher luminous efficiency and brightness, a larger viewing angle, and excellent contrast and color reproduction range.

[0005] Organic light-emitting elements include organic materials that may be easily deteriorated by moisture and oxygen. Therefore, in order to prevent the organic materials from being exposed to moisture, oxygen, etc., and to delay the deterioration of the organic materials, an organic light-emitting display device has a packaging film for sealing a plurality of organic light-emitting elements and a packaging substrate located on the packaging film.

[0006] Small-sized panels used in mobile and portable devices have a small panel area, so heat can be quickly dissipated from the device, and there is almost no adhesion problem. However, in large-sized panels used in monitors, tablet computers, and televisions, the panel area is large, so a packaging structure is required to achieve optimal heat dissipation and adhesion.

[0007] Figure 36 is a view of a display device according to the related art. As Figure 36As shown, a light-emitting array 420 is disposed on a transistor array 410, and a package substrate 423 is disposed on an array substrate 405 sealed with a sealing material 415. In addition, in order to compensate for the lack of rigidity, the display device 400 may further include a separate inner plate 430 disposed on the package substrate 423. The inner plate 430 may be attached to a bottom cover 460 through an adhesive member 435. In this case, it is necessary to ensure a space for receiving the separate inner plate 430 therein. Due to the weight of the inner plate 430, there are limitations in slimming down and reducing the weight of the display device 400. In addition, since an air gap generated between the package substrate 423 and the inner plate 430 (which is caused by the thickness of a tape 425 disposed to adhere the package substrate 423 and the inner plate 430 to each other) creates a first vertical interval region g1, heat dissipation performance is reduced.

[0008] In addition, since a printed circuit board 440, a flexible circuit board 445, and an integrated circuit chip 450 are attached to one side of the top surface of the package substrate 423, the inner plate 430 is disposed at a position spaced apart from the printed circuit board 440 by a predetermined distance. Therefore, the inner plate 430 is not attached to a part of the top surface of the package substrate 423 where the printed circuit board 440, the flexible circuit board 445, and the integrated circuit chip 450 are disposed. Therefore, there is a problem that in a horizontal interval region g3 and a second vertical interval region g2 where the inner plate 430 is not attached, heat is not dissipated as much as in a region where the printed circuit board 440, the flexible circuit board 445, and the integrated circuit chip 450 are disposed. Summary of the Invention

[0009] An object of the present disclosure is to provide a display device including a sealing structure that can allow suppression of process defects while having a thickness at which the sealing structure can fix a relatively thick reinforcement substrate without including a separate inner plate.

[0010] In addition, the present disclosure aims to improve rigidity and heat dissipation effects by introducing a sealing structure having a multilayer structure that can have a reinforcement substrate with a relatively large thickness disposed thereon.

[0011] In addition, the present disclosure aims to prevent defects from appearing on the front surface of the panel by suppressing the penetration of moisture in the lateral direction and the front direction of the array substrate.

[0012] In addition, the present disclosure aims to introduce a sealing structure having a multilayer structure to reduce the amount of warping of the display device when bent.

[0013] In addition, the present disclosure aims to provide a display device in which the internal structure of the display device can be simplified by introducing a sealing structure having a multilayer structure to ensure the rigidity of the display device and exclude the inner plate, making the display device thinner and lighter than existing display devices.

[0014] In addition, the present disclosure aims to achieve a narrowed border area in a non-display area while preventing damage to a flexible printed circuit board for driving a panel even when a sealing structure of a multi-layer structure is introduced.

[0015] The object according to the present disclosure is not limited to the above object. Other objects and advantages not mentioned according to the present disclosure can be understood based on the following description and can be more clearly understood based on the embodiments according to the present disclosure. In addition, it is easily understood that the objects and advantages according to the present disclosure can be achieved by using the devices and their combinations shown in the claims.

[0016] One example of the present disclosure provides a display device including: an array substrate having a display area and a non-display area positioned outside the display area, and having a light-emitting array including a plurality of light-emitting elements corresponding to a plurality of pixel areas on the display area; and a sealing structure disposed on the array substrate, wherein the sealing structure seals the light-emitting array and fixes a plate-shaped reinforcing substrate facing the sealing structure to the array substrate. In this regard, the sealing structure includes a first adhesive layer facing the array substrate, a second adhesive layer facing the reinforcing substrate, and a barrier layer disposed between the first adhesive layer and the second adhesive layer. That is, the sealing structure has a stacked structure formed by the first adhesive layer and the second adhesive layer spaced apart from each other by the barrier layer. In addition, the sealing structure may be configured to further include a protection structure facing the reinforcing substrate and disposed on the second adhesive layer.

[0017] Accordingly, the sealing structure may be provided with a thickness greater than a critical thickness to avoid process defects in a single layer made of an adhesive material. Due to this sealing structure, a reduction in the fixing reliability of the reinforcing substrate having a relatively large thickness can be prevented. Therefore, the rigidity and heat dissipation effect due to the reinforcing substrate can be sufficiently ensured.

[0018] Therefore, a separate inner plate can be excluded. This can be advantageous for slimming and lightening the display device. Deterioration of the heat dissipation effect due to the space between the package substrate and the inner plate can be prevented.

[0019] Since the first adhesive layer of the sealing structure is in contact with the array substrate, only the first adhesive layer may be made of a mixture including an inorganic filler. Therefore, the cost of preparing the sealing structure can be reduced. In addition, since the second adhesive layer does not include an inorganic filler, the content of the polymer material having adhesiveness included in the second adhesive layer can be increased. Therefore, the adhesiveness of the second adhesive layer can be relatively high. Therefore, the reinforcing substrate can be attached to the sealing structure more rigidly.

[0020] In addition, the second adhesive layer is made of a mixture containing a polymer material that does not contain carboxyl groups, thereby preventing corrosion of the barrier layer or deterioration of film uniformity, and thus preventing defects from occurring in the display device.

[0021] In addition, since the distance between the reinforcing substrate and the pads of the array substrate is farther than the distance between the sealing structure and the pads of the array substrate, the flexible circuit board connected to the pads of the array substrate can be prevented from contacting the reinforcing substrate. Therefore, damage to the flexible circuit board can be reduced or avoided.

[0022] Another example of the present disclosure provides a display device, including: an array substrate having a display area and a non-display area located outside the display area, and having a light-emitting array including a plurality of light-emitting elements corresponding to a plurality of pixel areas on the display area; and a sealing structure disposed on the array substrate, wherein the sealing structure seals the light-emitting array, has a multilayer structure, and fixes a plate-shaped reinforcing substrate facing the sealing structure to the array substrate. In this regard, the sealing structure includes a first adhesive layer facing the array substrate, a second adhesive layer facing the protective structure, a barrier layer disposed between the first adhesive layer and the second adhesive layer, and a protective structure disposed between the reinforcing substrate and the second adhesive layer.

[0023] In addition, the protective layer of the protective structure can have a certain thickness at which the protective layer can prevent damage caused by bending while blocking external impacts, thus further ensuring the rigidity of the display device.

[0024] In addition, another embodiment of the present disclosure provides a method for manufacturing a display device, the method including providing an array substrate having a light-emitting array including a plurality of light-emitting elements corresponding to a plurality of pixel areas respectively; providing a sealing structure, wherein the sealing structure includes a first adhesive layer and a second adhesive layer facing each other, and a barrier layer disposed between the first adhesive layer and the second adhesive layer; and disposing the sealing structure on the array substrate such that the light-emitting array is sealed by the first adhesive layer.

[0025] According to an embodiment of the present disclosure, the sealing structure for bonding the array substrate and the reinforcing substrate to each other and sealing the light-emitting array of the array substrate has a stacked structure formed by a first adhesive layer and a second adhesive layer separated by a barrier layer. Therefore, the sealing structure can be set to have a thickness approximately twice the critical value at which process defects in a single layer made of an adhesive material can be prevented. That is, the sealing structure can be prepared to have a relatively large thickness while preventing process defects.

[0026] Therefore, a relatively thick reinforcing substrate can be prepared. Thus, the rigidity and heat dissipation effect caused by the reinforcing substrate can be fully ensured.

[0027] Therefore, a separate inner plate for ensuring rigidity can be eliminated. This can be advantageous for slimming down and lightening the display device. The assembly process of the display device can be simplified. In addition, deterioration of the heat dissipation effect due to the space between the inner plate and the encapsulation substrate can be prevented.

[0028] In addition, the sealing structure may further include a protection structure for further ensuring the rigidity of the display device, thereby preventing damage to the light-emitting array of the array substrate even when an external impact is applied to the display device.

[0029] In addition, the protective layer of the protection structure may have a certain thickness at which the protective layer can prevent damage caused by bending while blocking external impacts to further ensure the rigidity of the display device. Therefore, even when an external impact is applied to the device during the attachment process, the protective layer can prevent damage to the sealing structure and further prevent damage to the light-emitting array of the array substrate.

[0030] In addition, implementing the sealing structure as a multi-layer structure can allow for a reduction in the amount of warping when the display device is bent.

[0031] In addition, by using a material with high thermal conductivity as the material of the reinforcing substrate, heat can be effectively dissipated, thereby reducing the appearance of afterimages on the panel and improving the lifespan of the light-emitting array.

[0032] In addition, controlling the thickness and width of the reinforcing substrate can prevent the flexible printed circuit board from contacting the sealing structure or the reinforcing substrate, thereby preventing damage to the flexible printed circuit board.

[0033] The effects of the present disclosure are not limited to the above effects, and those skilled in the art will clearly understand other effects not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 is an exploded perspective view of a display device according to a first embodiment of the present disclosure.

[0035] Figure 2 corresponds to Figure 1 a block diagram of the array substrate and the integrated circuit chip in.

[0036] Figure 3 is a diagram showing Figure 2 an example of an equivalent circuit of a pixel region corresponding to.

[0037] Figure 4 is a view showing Figure 3 an example of a driving thin film transistor and an organic light-emitting element of.

[0038] Figure 5 Shows in the form of an exploded view Figure 1 of the array substrate, the sealing structure, the reinforcing substrate, the flexible printed circuit board, and the printed circuit board.

[0039] Figure 6 Shows Figure 1 an example of the layout structure of the array substrate, the sealing structure, the reinforcing substrate, the flexible printed circuit board, and the printed circuit board.

[0040] Figure 7 Shows Figure 6 an example of the ab cross-section.

[0041] Figure 8 Shows Figure 6 an example of the cb cross-section.

[0042] Figure 9 Shows a display device according to a second embodiment of the present disclosure.

[0043] Figure 10 Shows a display device according to a third embodiment of the present disclosure.

[0044] Figure 11 Shows a display device according to a fourth embodiment of the present disclosure.

[0045] Figure 12 Shows Figure 11 an example of the ab cross-section.

[0046] Figure 13 Shows Figure 11 an example of the cb cross-section.

[0047] Figure 14 Is Figure 13 an enlarged view of part "I".

[0048] Figures 15a to 15d Shows views of various structures of the barrier layer.

[0049] Figure 16a , 16b , 17, and 18 are photos for showing whether defects occur according to the material type constituting the adhesive layer.

[0050] Figure 19 Is a table showing the maximum temperature measured in the panel and the afterimage reduction rate for each type of metal material.

[0051] Figure 20 Shows a display device according to a fifth embodiment of the present disclosure.

[0052] Figure 21 is a view showing an example of the cb cross-section Figure 20 of

[0053] Figure 22 is a table showing the results of the rigidity evaluation of a display device based on the thickness change of a protective layer

[0054] Figures 23a to 23f is a photograph showing dents on a reinforcing substrate and dark spots generated on a panel during the rigidity evaluation

[0055] Figure 24 is a table showing the amount of warping of a panel based on the thickness change of a protective layer

[0056] Figure 25 is a graph showing the change in the amount of warping of a panel based on the structure of a sealing structure

[0057] Figure 26 is a diagram schematically showing the change in the amount of warping of a panel

[0058] Figure 27 is a graph showing the change in the amount of warping based on the thickness change of a sealing structure at high temperature

[0059] Figure 28 is a graph showing the change in the amount of warping based on the thickness change of a sealing structure at room temperature

[0060] Figure 29 is a flowchart showing a method for manufacturing a display device according to an embodiment of the present disclosure

[0061] Figures 30 to 35 is a view showing Figure 29 the steps of the method in

[0062] Figure 36 is a view of a display device according to the related art Detailed Description

[0063] For simplicity and clarity of illustration, the elements in the figures are not necessarily drawn to scale. The same reference numerals in different figures represent the same or similar elements and thus perform similar functions. In addition, for simplicity of description, the description and details of well-known steps and elements are omitted. Further, in the following detailed description of the present disclosure, in order to provide a thorough understanding of the present disclosure, numerous specific details are set forth. However, it should be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, operations, components, and circuits are not described in detail so as not to unnecessarily obscure aspects of the present disclosure. Examples of various embodiments will be further illustrated and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. Instead, it is intended to cover alternatives, modifications, and equivalents that may be included within the spirit and scope of the present disclosure as defined by the appended claims.

[0064] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the figures for describing the embodiments of the present disclosure are exemplary, and the present disclosure is not limited thereto. The same reference numerals herein refer to the same elements. In addition, for simplicity of description, the description and details of well-known steps and elements are omitted. Further, in the following detailed description of the present disclosure, in order to provide a thorough understanding of the present disclosure, numerous specific details are set forth. However, it should be understood that the present disclosure may be practiced without these specific details. In other instances, well-known methods, operations, components, and circuits are not described in detail to avoid unnecessarily obscuring aspects of the present disclosure.

[0065] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should be further understood that the terms "comprises," "comprising," "includes," and "including" as used in this specification are meant to specify the presence of the stated features, integers, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one," when placed in front of a list of elements, can modify the entire list of elements, but not a single element in the list. When referring to "C to D," unless otherwise specified, this means from C (including C) to D (including D).

[0066] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, the first element, component, region, layer, or part described below may be referred to as the second element, component, region, layer, or part without departing from the spirit and scope of the present disclosure.

[0067] In addition, it should also be understood that when a first element or layer is referred to as being "on" or "under" a second element or layer, the first element may be disposed directly on or under the second element, or may be disposed indirectly on or under the second element, with a third element or layer disposed between the first element or layer and the second element or layer. It should be understood that when an element or layer is referred to as being "connected to" or "coupled to" another element or layer, it may be directly on, connected to, or coupled to the other element or layer, or there may be one or more intermediate elements or layers. In addition, it can also be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or there may also be one or more intermediate elements or layers.

[0068] In addition, as used herein, when a layer, film, region, plate, or the like is disposed "on" or "atop" another layer, film, region, plate, or the like, the former may directly contact the latter, or another layer, film, region, plate, or the like may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, or the like is directly disposed "on" or "atop" another layer, film, region, plate, or the like, the former directly contacts the latter, and there is no other layer, film, region, plate, or the like disposed between the former and the latter. In addition, as used herein, when a layer, film, region, plate, or the like is disposed "under" or "beneath" another layer, film, region, plate, or the like, the former may directly contact the latter, or another layer, film, region, plate, or the like may be disposed between the former and the latter. As used herein, when a layer, film, region, plate, or the like is directly disposed "under" or "beneath" another layer, film, region, plate, or the like, the former directly contacts the latter, and there is no other layer, film, region, plate, or the like disposed between the former and the latter.

[0069] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this inventive concept belongs. It should also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and should not be interpreted as idealized or overly formal, unless expressly so defined herein.

[0070] In one example, when a particular embodiment can be implemented in different ways, the functions or operations specified in a particular block may occur in an order different from that specified in the flowchart. For example, two consecutive blocks may actually be executed at the same time. Depending on the relevant functions or operations, these blocks may be executed in the reverse order.

[0071] In the description of time relationships, such as the temporal precedence relationship between two events, such as "after", "subsequent to", "before", etc., unless it is specified as "directly after", "directly subsequent to", or "directly before", another event may occur in between. The features of various embodiments of the present disclosure may be combined partially or wholly with each other and may be technically related or operable with each other. Each embodiment may be implemented independently of each other or may be implemented together in an associated relationship. For ease of explanation, spatially relative terms such as "below", "beneath", "lower", "under", "above", "upper", etc. may be used herein to describe the relationship of one element or feature to another element or feature, as shown in the figures. It should be understood that, in addition to the orientation shown in the figures, spatially relative terms are intended to include different orientations of the device during use or operation. For example, when the device in the drawings is flipped, an element described as "below" or "beneath" or "under" other elements or features will be oriented "above" the other elements or features. Thus, the example terms "below" and "beneath" can cover both upward and downward orientations. The device may be oriented in other ways, for example, rotated 90 degrees or in other orientations, and the spatially relative descriptors used herein should be interpreted accordingly.

[0072] In addition, the "a direction", "b direction", and "c direction" should not be interpreted merely as having a geometric relationship in which the a direction, b direction, and c direction are perpendicular to each other. The "a direction", "b direction", and "c direction" can be interpreted as having a broader range of directions within which the components in this article can function.

[0073] Next, a display device according to various embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0074] Figure 1 is an exploded perspective view of a display device according to a first embodiment of the present disclosure.

[0075] AsFigure 1 As shown, a display device according to a first embodiment of the present disclosure includes an array substrate 10 and a sealing structure 30 disposed on the array substrate 10.

[0076] The array substrate 10 includes pads disposed on at least one of its side edges. At least one flexible printed circuit board 22 on which an integrated circuit chip 21 for driving data lines ( Figure 2 DL) is mounted can be connected to the pads disposed on at least one of the side edges of the array substrate 10.

[0077] In addition, at least one flexible printed circuit board 22 is further connected to a printed circuit board 24 on which an integrated circuit chip 23 for controlling the operation timing of the array substrate 10 is mounted. That is, at least one flexible printed circuit board 22 is disposed between the array substrate 10 and the printed circuit board 24. It should be noted that in Figure 1 , at least one flexible printed circuit board 22 and the printed circuit board 24 are shown as being located on top of the array substrate 10 in order to clearly show these circuit boards, but in a real display device, at least one flexible printed circuit board 22 and the printed circuit board 24 are disposed on a reinforcing substrate 40, as shown in the following drawings.

[0078] The sealing structure 30 fixes the plate-shaped reinforcing substrate 40 facing the sealing structure 30 to the array substrate 10.

[0079] The sealing structure 30 includes a first adhesive layer 31 facing the array substrate 10, a second adhesive layer 32 facing the reinforcing substrate 40, and a barrier layer 33 disposed between the first adhesive layer 31 and the second adhesive layer 32, and so on. Each of the first adhesive layer 31 and the second adhesive layer 32 may include an adhesive material, such as a polymer material having adhesiveness. The barrier layer 33 is thinner than each of the first adhesive layer 31 and the second adhesive layer 32. That is, the sealing structure 30 includes the first adhesive layer 31 and the second adhesive layer 32 separated by the barrier layer 33 in the form of a thin film. Therefore, the sealing structure 30 can have a relatively large thickness while preventing process defects of the adhesive material (depending on its thickness). The thickness of the barrier layer 33 may vary relative to the thickness of the first adhesive layer 31 and the second adhesive layer 32. For example, the barrier layer 33 may have a thickness greater than the thickness of the first adhesive layer 31, the second adhesive layer 32, or both. Since the thickness of the barrier layer 33 can vary, the thickness of the barrier layer 33 may be greater than the thickness of the first adhesive layer 31 but less than the thickness of the second adhesive layer 32, or vice versa.

[0080] Specifically, when there is a relatively thick single adhesive material layer, process defects such as thickness non-uniformity due to foreign matter insertion into the layer and displacement of the layer may often and easily occur. Therefore, the single adhesive material layer needs to have a thickness less than the critical thickness to avoid process defects.

[0081] On the contrary, the sealing structure 30 of the display device according to the first embodiment of the present disclosure is not composed of a single layer made of an adhesive material, but is composed of a first adhesive layer 31 and a second adhesive layer 32 separated by a thin barrier layer 33. Therefore, the sealing structure 30 can have a thickness that is approximately twice the critical thickness of a single adhesive layer to prevent process defects, but alternatively can also have a thickness greater than the critical thickness of a single adhesive layer but less than twice the critical thickness. In some other embodiments, based on heat dissipation and rigidity requirements, the thickness of the sealing structure 30 can be greater than twice the critical thickness of a single adhesive layer.

[0082] In addition, as the thickness of the sealing structure 30 increases, the critical thickness of the reinforcing substrate 40 that can be fixed to the array substrate 10 through the sealing structure 30 can increase. Therefore, the rigidity and heat dissipation effects due to the reinforcing substrate 40 can be improved. Therefore, a separate inner plate may not be required, and slimming and weight reduction of the display device can be reliably achieved. In addition, deterioration of the heat dissipation effect can be prevented or effectively reduced.

[0083] In addition, the display device according to the first embodiment of the present disclosure may further include a reinforcing substrate 40 fixed on the array substrate 10 through the sealing structure 30.

[0084] In addition, the display device according to the first embodiment of the present disclosure may further include a bottom cover 50 that houses the array substrate 10, the sealing structure 30, and the reinforcing substrate 40.

[0085] The bottom cover 50 includes a bottom portion 51 facing the reinforcing substrate 40. Alternatively, the bottom cover 50 may further include a side portion 52 that extends vertically from the outer periphery of the bottom portion 51 toward the array substrate 10. An additional layer or structure capable of improving heat dissipation and / or rigidity may be included.

[0086] Figure 2 corresponds to Figure 1 a block diagram of the array substrate and the integrated circuit chip in Figure 3 is a diagram showing Figure 2 an example of an equivalent circuit of a pixel region corresponding to Figure 4 is a diagram showing Figure 3 an example view of a driving thin film transistor and an organic light emitting element of

[0087] As shown in Figure 2As shown, a display device according to a first embodiment of the present disclosure includes: an array substrate 10 including a display area AA (active area) on which an image is displayed; and drivers 61, 62, and 63 that supply signals to signal lines GL and DL of the array substrate 10, respectively. Some of the drivers 61, 62, and 63 may be implemented as integrated circuit chips 21 mounted on at least one flexible circuit board 22 connected to the array substrate 10, and integrated circuit chips 23 mounted on a printed circuit board 24 connected to the at least one flexible circuit board 22. In addition, some of the drivers 61, 62, and 63 may be embedded in the array substrate 10.

[0088] The array substrate 10 includes a plurality of pixel regions PA defined in the display area AA.

[0089] Each of the plurality of pixel regions PA is a region for emitting light corresponding to one color. Two or more pixel regions PA that are adjacent to each other and correspond to different colors among the plurality of pixel regions PA may constitute a unit pixel for emitting light of various colors. That is, a unit pixel can be implemented. The unit pixel can display various colors by combining light beams emitted from two or more adjacent pixel regions PA, respectively.

[0090] The array substrate 10 includes a gate line GL that provides a scan signal SCAN for selecting a horizontal line for writing a data signal VDATA, and a data line DL that provides the data signal VDATA. The horizontal line may be composed of pixel regions arranged in a line in the horizontal direction among the plurality of pixel regions PA.

[0091] In addition, the array substrate 10 may further include a first driving power line and a second driving power line ( Figure 3 VDDL and VSSL in) that supply a first driving power VDD and a second driving power VSS for the operation of the light-emitting element, respectively.

[0092] The driver includes a timing controller 61, a data driver 62 connected to the data line DL, and a gate driver 63 connected to the gate line GL.

[0093] The timing controller 61 rearranges digital video data RGB input from an external system based on the resolution of the array substrate 100 and supplies the rearranged digital video data RGB' to the data driver 62.

[0094] The timing controller 61 can generate and provide a data control signal DDC for controlling the operation timing of the data driver 62 and a gate control signal GDC for controlling the operation timing of the gate driver 63 based on timing signals such as a vertical synchronization signal Vsync, a horizontal synchronization signal Hsync, a dot clock signal DCLK, and a data enable signal DES.

[0095] The gate driver 63 sequentially provides a scan signal SCAN to a plurality of gate lines GL during one frame period to display an image based on the gate control signal GDC.

[0096] That is, the gate driver 63 provides the scan signal SCAN to each gate line GL during each horizontal period corresponding to each gate line GL during one frame period.

[0097] The data driver 62 converts the rearranged digital video data RGB' into an analog data voltage based on the data control signal DDC. The data driver 62 provides a data signal VDATA corresponding to each pixel area PA of the horizontal line (to which the scan signal SCAN is supplied during each horizontal period) to the data line DL based on the rearranged digital video data RGB'.

[0098] As Figure 3 shown, each pixel area PA includes an organic light-emitting element OLED and a pixel circuit for supplying a driving signal to the organic light-emitting element OLED.

[0099] In one example, the pixel circuit includes a driving transistor DT, a switching transistor ST, and a storage capacitor Cst. This is merely an example. Although not shown, each pixel area PA may further include a compensation circuit (not shown) for compensating for the degradation of at least one of the driving transistor DT and the light-emitting element OLED. The compensation circuit may include at least one transistor (not shown) for detecting the degradation amount or providing a reference power (not shown).

[0100] The organic light-emitting element OLED includes a first electrode and a second electrode, namely an anode and a cathode, and a light-emitting layer disposed between the first electrode and the second electrode. The light-emitting layer emits light based on a driving current between the first electrode and the second electrode. The organic light-emitting element OLED may have a multilayer stacked structure including two or more light-emitting layers.

[0101] The driving transistor DT may be connected in series to the light-emitting element OLED and may be disposed between a first driving power line VDDL supplying a first driving power VDD and a second driving power line VSSL supplying a second driving power VSS, and the second driving power VSS has a potential lower than that of the first driving power VDD.

[0102] The switching transistor ST is disposed between the first node ND1 and the data line DL that supplies the data signal VDATA to each pixel region PA. The first node ND1 is the contact point between the gate electrode of the driving transistor DT and the switching transistor ST. In addition, the gate electrode of the switching transistor ST is connected to the gate line GL.

[0103] The storage capacitor Cst is disposed between the first node ND1 and the second node ND2. The second node ND2 is the contact point between the driving transistor DT and the organic light-emitting element OLED.

[0104] The operation of this pixel circuit is as follows. The switching transistor ST is turned on based on the scan signal SCAN of the gate line GL. In this case, the data signal VDATA of the data line DL is supplied to the gate electrode of the driving transistor DT and the storage capacitor Cst via the turned-on switching transistor ST and the first node ND1.

[0105] The storage capacitor Cst is charged using the data signal VDATA provided to the first node ND1.

[0106] In addition, the driving transistor DT is turned on based on the data signal VDATA provided to the first node ND1 and the charging voltage of the storage capacitor Cst to generate a driving current corresponding to the data signal VDATA. Therefore, the driving current generated from the turned-on driving transistor DT can be supplied to the second node ND2, that is, supplied to the organic light-emitting element OLED.

[0107] As Figure 4 shown, the array substrate 10 includes: a transistor array 110 including a plurality of pixel circuits respectively corresponding to a plurality of pixel regions PA; and a light-emitting array 120 including a plurality of organic light-emitting elements OLED respectively corresponding to a plurality of pixel regions PA.

[0108] The transistor array 110 may include a base substrate 111 including a display area AA corresponding to a plurality of pixel regions PA, and driving thin-film transistors DT disposed on the base substrate 111 and corresponding to each pixel region PA. In addition, the transistor array 110 may further include a planarization film 115 that covers the driving thin-film transistors DT in a planarized manner.

[0109] The base substrate 111 may be made of an insulating material and may be flat. In one example, the base substrate 111 may be made of glass or plastic.

[0110] The driving thin film transistor DT includes an active layer ACT disposed on a buffer film 112 covering a base substrate 111, a gate insulating layer 113 disposed on the channel region of the active layer ACT, a gate electrode GE disposed on the gate insulating layer 113, an interlayer insulating film 114 covering the buffer film 112, the active layer ACT, and the gate electrode GE, a source electrode SE disposed on the interlayer insulating film 114 and connected to the source region of the active layer ACT, and a drain electrode DE disposed on the interlayer insulating film 114 and connected to the drain region of the active layer ACT.

[0111] The buffer film 112 may be made of an insulating material that can be easily adhered to the active layer ACT, such as silicon nitride SiN x and silicon oxide SiO 2 . The buffer film 112 can not only help fix the active layer ACT, but also prevent moisture or oxygen from invading through the base substrate 111, and avoid the transfer of defects of the base substrate 111 to the interlayer insulating film 114 and the planarization film 115 on the base substrate 111. However, depending on the material of the base substrate 111, the buffer film 112 can be omitted from the transistor array 110.

[0112] The active layer ACT can be made of a silicon semiconductor or an oxide semiconductor.

[0113] In addition, although not shown in Figure 4 , the transistor array 110 may further include a switching thin film transistor ( Figure 3 ST in Figure 3 ), a gate line connected to the gate electrode ( Figure 3 GL in

[0114] of the switching thin film transistor ST), and a data line connected to one of the source electrode and the drain electrode of the switching thin film transistor ST (

[0115] DL in

[0116] The interlayer insulating film 114 is disposed on the buffer film 112 and covers the active layer ACT and the gate electrode GE in a planarized manner. The interlayer insulating film 114 may have a structure in which layers made of at least one insulating material selected from organic insulating materials and inorganic insulating materials are vertically stacked. Examples of the inorganic insulating material include silicon nitride SiN x and silicon oxide SiO 2Examples of the organic insulating material include acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0117] Similar to the interlayer insulating film 114, the planarization film 115 may have a structure in which layers made of at least one insulating material selected from an organic insulating material and an inorganic insulating material are vertically stacked.

[0118] The light-emitting array 120 may be disposed on the planarization film 115 of the transistor array 110 and may include a plurality of organic light-emitting elements OLED respectively corresponding to a plurality of pixel regions PA.

[0119] Each organic light-emitting element OLED may include opposite first and second electrodes 121 and 122, and a light-emitting layer 123 disposed between the first and second electrodes 121 and 122.

[0120] The light-emitting array 120 may include a plurality of first electrodes 121 respectively corresponding to a plurality of pixel regions PA and disposed on the transistor array 110, a bank 124 disposed on the transistor array 110 and outside each pixel region PA and covering the edge of the first electrode 121, a light-emitting layer 123 disposed on the bank 124 and the first electrode 121, and a second electrode 122 disposed on the light-emitting layer 123 and corresponding to a plurality of pixel regions PA.

[0121] The sealing structure 30 is disposed on the array substrate 10 and covers the light-emitting array 120. The sealing structure 30 may have a structure in which films of different thicknesses and materials are stacked. A part of the sealing structure 30 may be made of an adhesive material.

[0122] The first adhesive layer 31 of the sealing structure 30 covers the light-emitting array 120 in a planarized manner and seals the light-emitting array 120.

[0123] Figure 5 is shown in an exploded view Figure 1 of the array substrate, the sealing structure, the reinforcing substrate, the flexible circuit board, and the printed circuit board.

[0124] As Figure 5 shown, a gate driver ( Figure 2 63 in

[0125] that supplies a scan signal SCAN to the gate line GL may be embedded in the array substrate 10. Figure 263) in can be set in a partial region GDA (gate driver area), which is set in a non-display area NA outside the display area AA and adjacent to a side edge of the display area AA. In this regard, the non-display area NA can also be referred to as a border area.

[0126] A data driver for supplying a data signal VDATA to a data line DL ( Figure 2 62) in can be implemented as an integrated circuit chip 21 mounted on a flexible printed circuit board 22.

[0127] The flexible printed circuit board 22 on which the integrated circuit chip 21 is mounted can be connected and set between a side edge of the array substrate 10 and a printed circuit board 24.

[0128] A timing controller ( Figure 2 61) of can be implemented as an integrated circuit chip 23 mounted on the printed circuit board 24.

[0129] The array substrate 10 may further include pads 10P disposed in the non-display area NA adjacent to an opposite edge of the display area AA.

[0130] The flexible printed circuit board 22 on which a data driver ( Figure 2 62) is mounted includes pads 22p disposed on one side thereof. When the pads 22p of the flexible printed circuit board 22 are joined to the pads 10p of the array substrate 10, the array substrate 10 and the flexible printed circuit board 22 can be electrically connected to each other.

[0131] Figure 6 is a display Figure 1 view of an example of an arrangement structure of an array substrate, a sealing structure, a reinforcing substrate, a flexible printed circuit board, and a printed circuit board. Figure 7 is a display Figure 6 view of an example of an ab cross-section. Figure 8 is a display Figure 6 view of an example of a cb cross-section.

[0132] As Figure 6 and Figure 7 shown, a display device according to a first embodiment of the present disclosure includes: an array substrate 10 having a light-emitting array ( Figure 4 120) of, the light-emitting array including a plurality of light-emitting elements ( Figure 4 corresponding to a plurality of pixel regions ( Figure 4 PA) in respectively; and a sealing structure 30 disposed on the array substrate 10, wherein the sealing structure seals the light-emitting array 120 and fixes a plate-shaped reinforcing substrate 40 facing the sealing structure 30 to the array substrate 10.

[0133] The sealing structure 30 includes a first adhesive layer 31 facing the array substrate 10, a second adhesive layer 32 facing the reinforcing substrate 40, and a barrier layer 33 disposed between the first adhesive layer 31 and the second adhesive layer 32.

[0134] Each of the first adhesive layer 31 and the second adhesive layer 32 is made of a polymer material having adhesiveness.

[0135] In one example, the first adhesive layer 31 may be made of a first polymer material 311 which is one of an olefin-based polymer, an epoxy-based polymer, and an acrylate-based polymer. In addition, the second adhesive layer 32 may be made of a second polymer material 321 which is one of an olefin-based polymer, an epoxy-based polymer, an acrylate-based polymer, an amine-based polymer, a phenol-based polymer, and an anhydride-based polymer, and each of them does not contain a carboxyl group. In particular, the second adhesive layer 32 is preferably made of the second polymer material 321 without a carboxyl group to achieve film uniformity to be described later and avoid corrosion of the barrier layer 33.

[0136] For heat dissipation of the array substrate 10, at least the first adhesive layer 31 of the first adhesive layer 31 and the second adhesive layer 32 may be made of a mixture including a first polymer material 311 having adhesiveness and first particles 312 made of a metal material. In one example, the first particles 312 made of a metal material may be powders made of Ni and other metals or materials.

[0137] That is, the first adhesive layer 31 in direct contact with the array substrate 10 may be made of a mixture including a first polymer material 311 having adhesiveness and the first particles 312, and thus may have a higher thermal conductivity than the adhesiveness polymer material among various materials.

[0138] Similarly, according to the first embodiment of the present disclosure, the second adhesive layer 32 may be made of a mixture including a second polymer material 321 having adhesiveness and second particles 322, and thus may have a higher thermal conductivity than the adhesiveness polymer material.

[0139] In this way, the rate of heat dissipation from the array substrate 10 through the sealing structure 30 can be improved, so that the heat dissipation effect from the array substrate 10 can be improved.

[0140] In addition, in order to prevent moisture from penetrating into the light-emitting array 120 of the array substrate 10, the first adhesive layer 31 may be composed of a mixture further including a hygroscopic inorganic filler 313. The hygroscopic inorganic filler 313 may be made of at least one of various materials such as CaO, MgO, and BaO.

[0141] Unlike the first adhesive layer 31, the second adhesive layer 32 does not contact the light-emitting array 120. Therefore, the second adhesive layer 32 does not need to include a hygroscopic inorganic filler for preventing moisture from penetrating into the light-emitting array 120. Thus, the second adhesive layer 32 does not include a hygroscopic inorganic filler, but only includes a second polymer material 321 having adhesiveness and second particles 322 made of a metallic material. In this way, the amount of the relatively expensive hygroscopic inorganic filler injected into the sealing structure 30 can be reduced, so that the cost of preparing the sealing structure 30 can be lowered. In addition, since the hygroscopic inorganic filler is not included in the second adhesive layer 32, the mixing percentage of the second polymer material included in the second adhesive layer 32 can be increased compared with that in the first adhesive layer 31. Therefore, the adhesiveness of the second adhesive layer 32 can be higher than that of the first adhesive layer 31. Therefore, there is an advantage that the reliability of fixing the reinforcing substrate 40 can be improved. Thus, since the reinforcing substrate 40 is more firmly fixed to the second adhesive layer 32, the reliability of the bonding force between the array substrate 10 and the reinforcing substrate 40 can be further improved. In addition, since a multilayer structure composed of the first adhesive layer 31 and the second adhesive layer 32 is formed, there is an advantage that the amount of warpage of the panel being bent can be reduced, thereby improving the reliability.

[0142] In this regard, the array substrate 10 may be referred to as a support substrate, the reinforcing substrate 40 may be referred to as a bonding substrate, and the sealing structure 30 may be referred to as a bonding structure. In addition, the first adhesive layer 31 may be referred to as a sealing adhesive layer, the barrier layer 33 may be referred to as a bonding reinforcing heat-conducting layer, and the second adhesive layer 32 may be referred to as a bonding reinforcing adhesive layer. Therefore, the bonding structure may be referred to as being composed of a sealing adhesive layer, a bonding reinforcing heat-conducting layer, and a bonding reinforcing adhesive layer on the support substrate.

[0143] Each of the thicknesses of the first adhesive layer 31 and the second adhesive layer 32 may be respectively limited to a value less than or equal to a critical value of a single adhesive layer at which process defects can be avoided. In addition, the sum of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 may be limited to a value greater than or equal to a critical value that can ensure the reliability of fixing the reinforcing substrate 40.

[0144] In one example, each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 may be in the range of 10 μm to 100 μm.

[0145] The barrier layer 33 may be made of any one of a metallic material and an inorganic insulating material. That is, the barrier layer 33 may include a metallic material such as Al, Cu, Sn, Ag, Fe, or Zn. In another example, the barrier layer 33 may be implemented as being made of, for example, SiOx and SiON x a thin film formed of an inorganic insulating material.

[0146] A barrier layer 33 may be introduced to enhance the adhesion to the first adhesive layer 31 and the second adhesive layer 32 and to achieve a stacked structure for reducing warping. Specifically, the first adhesive layer 31 and the second adhesive layer 32 may be configured to include adhesive polymer materials 311 and 321, respectively. Accordingly, the barrier layer 33 made of a relatively hard material is disposed between the first adhesive layer 31 and the second adhesive layer 32. Thus, since the first adhesive layer 31 and the second adhesive layer 32 are adhered to one surface and the other surface of the barrier layer 33, respectively, the adhesion is improved. Thus, the sealing structure 30 may be implemented as a stacked structure in which the first adhesive layer 31, the barrier layer 33, and the second adhesive layer 32 are joined to each other and stacked.

[0147] The thickness 33th of the barrier layer 33 may be limited to a value greater than or equal to a critical value at which defects related to pores can be avoided. Further, to minimize the increase in the thickness of the sealing structure 30 due to the barrier layer 33, the thickness 33th of the barrier layer 33 may be limited to a value less than the thickness of each of the first adhesive layer 31 and the second adhesive layer 32.

[0148] For example, the thickness 33th of the barrier layer 33 may be in a range greater than 10 μm and less than each of the thickness 31th of the first adhesive layer 31 and the 32th of the second adhesive layer 32.

[0149] Thus, the sealing structure 30 according to the first embodiment of the present disclosure may include the first adhesive layer 31 and the second adhesive layer 32 separated by a thin barrier layer 33, and thus may have a thickness approximately twice that of the thickness of a single-layer adhesive material while preventing process defects.

[0150] Accordingly, the reinforcing substrate 40 fixed to the array substrate 10 through the sealing structure 30 may have a relatively large thickness, such that rigidity can be increased and a heat dissipation effect can be easily achieved.

[0151] That is, when the thickness 30th of the sealing structure 30 is in the range of 30 μm to 300 μm, the thickness 40th of the reinforcing substrate 40 may be implemented as a thickness in the range of 0.1 mm to 1.5 mm.

[0152] In one example, the reinforcing substrate 40 may be made of a material selected from glass, metal, and plastic polymer. For example, the reinforcing substrate 40 may be made of a metal material including Al, Cu, Sn, Ag, Fe, or Zn.

[0153] In addition, the display device may further include a bottom cover 50 that houses the array substrate 10, the flexible circuit board 22, the printed circuit board 24, the sealing structure 30, and the reinforcement substrate 40.

[0154] The bottom cover 50 may be coupled to the reinforcement substrate 40 by at least one adhesive pattern 70 disposed between the reinforcement substrate 40 and the bottom cover 50.

[0155] As Figure 6 and Figure 8 shown, the display device further includes at least one flexible circuit board 22 connected to the array substrate 10, and a printed circuit board 24 connected to the at least one flexible circuit board 22.

[0156] On each flexible circuit board 22, an integrated circuit chip 21 corresponding to the data driver (62 in Figure 2 ) for driving the data lines DL of the array substrate 10 is mounted.

[0157] An integrated circuit chip 23 corresponding to the timing controller (61 in Figure 2 ) for controlling the operation timing of each of the data driver (62 in Figure 2 ) and the gate driver (63 in Figure 2 ) is mounted on the printed circuit board 24.

[0158] The printed circuit board 24 is disposed on one surface of the bottom portion 51 of the reinforcement substrate 40 facing the bottom cover 50.

[0159] One side of each flexible circuit board 22 is connected to the pad (10p of Figure 5 ) of the array substrate 10, while the opposite side of each flexible circuit board 22 is connected to a pad (not shown) of the printed circuit board 24.

[0160] The printed circuit board 24 is disposed on one surface of the bottom portion 51 of the reinforcement substrate 40 facing the bottom cover 50, and the reinforcement substrate 40 is fixed to the array substrate 10 through the sealing structure 30. Accordingly, the flexible circuit board 22 is disposed to straddle the sealing structure 30 and the reinforcement substrate 40.

[0161] In this regard, when the flexible circuit board 22 comes into contact with the edge of the reinforcement substrate 40 that may have a hard and somewhat rough surface, collisions between the flexible circuit board 22 and the reinforcement substrate 40 may occur repeatedly according to the movement of the flexible circuit board 22. Therefore, damage to the flexible circuit board 22 is inevitable.

[0162] Therefore, according to the first embodiment of the present disclosure, in order to prevent the flexible circuit board 22 from contacting the reinforcement substrate 40, the reinforcement substrate 40 may have a width smaller than the width of the sealing structure 30.

[0163] That is to say, one side edge of the sealing structure 30 adjacent to the pad 10p of the array substrate 10 can be spaced apart from the pad 10p of the array substrate 10 by a first pitch 30g. In this case, one side edge of the reinforcing substrate 40 adjacent to the pad 10p of the array substrate 10 can be spaced apart from the pad 10p of the array substrate 10 by a second pitch 40g greater than the first pitch 30g.

[0164] In other words, as Figure 8 shown, the side edge of the sealing structure 30 adjacent to the pad 10p of the array substrate 10 can be closer to the pad 10p than the side edge of the reinforcing substrate 40 adjacent to the pad 10p of the array substrate 10. Therefore, a part of the sealing structure 30 adjacent to the pad 10p of the array substrate 10 is not covered by the reinforcing substrate 40 and is thus exposed.

[0165] In addition, the integrated circuit chips 21 mounted on each flexible circuit board 22 can be arranged adjacent to the printed circuit board 24. In one example, the integrated circuit chips 21 mounted on each flexible circuit board 22 can be arranged in the overlapping area between the reinforcing substrate 40 and the flexible circuit board 22.

[0166] In this way, the flexible circuit board 22 can be spaced apart from the reinforcing substrate 40 by the integrated circuit chips 21. Therefore, the collision between the flexible circuit board 22 and the reinforcing substrate 40 can be reduced.

[0167] Accordingly, each flexible circuit board 22 can extend across the exposed portion of the sealing structure 30 and above the exposed portion of the sealing structure 30.

[0168] In this case, the contact and repeated collision between each flexible circuit board 22 and the sealing structure 30 are inevitable. However, since the sealing structure 30 is more flexible than the reinforcing substrate 40, the degree of damage to the flexible circuit board 22 due to its contact with the sealing structure 30 can be reduced compared to the degree of damage to the flexible circuit board 22 due to its collision with the reinforcing substrate 40. Therefore, the reduction in the reliability and lifespan of the display device can be prevented. In addition, setting the minimum spacing between the flexible circuit board 22 and the reinforcing substrate 40 can minimize the damage to the flexible circuit board 22, and a narrow border effect can be achieved, which can reduce the border width of the panel. In addition, reducing the area of the surface of the sealing structure 30 that is exposed can improve the bonding force and heat dissipation effect between the reinforcing substrate 40 and the array substrate 10.

[0169] In addition, since the flexible printed circuit board 22 is disposed on the sealing structure 30 and the reinforcing substrate 40 having a relatively thick stacked structure, heat generated from the flexible printed circuit board 22 can be prevented from being transferred to the array substrate 10. In other words, the flexible printed circuit board 22 is disposed on the top surface of the reinforcing substrate 40 having high thermal conductivity and at the outermost portion of the panel, so that the heat dissipation effect can be increased.

[0170] As described above, the display device according to the first embodiment of the present disclosure includes a sealing structure 30 including a first adhesive layer 31 and a second adhesive layer 32 stacked on top of each other, and a barrier layer 33 is interposed therebetween. The sealing structure 30 may have a stacked structure formed by the first adhesive layer 31 and the second adhesive layer 32, so that it can be larger than a single layer made of an adhesive material while preventing process defects.

[0171] Therefore, the reinforcing substrate 40 can be relatively thick, so that the rigidity and heat dissipation effect due to the reinforcing substrate 40 can be improved.

[0172] Therefore, the display device does not need to have a separate inner plate to ensure rigidity. This can be advantageous for slimming and lightening the display device. In addition, deterioration of the heat dissipation effect due to the space between the inner plate and the reinforcing substrate 40 can be prevented.

[0173] In addition, excluding the inner plate can simplify the assembly process of the display device.

[0174] Figure 9 is a view showing a display device according to a second embodiment of the present disclosure.

[0175] As Figure 9 shown, in the display device according to the second embodiment of the present disclosure, the second adhesive layer 32 of the sealing structure 30 may be made of only a second polymer material 321 having adhesiveness.

[0176] That is, different from the second adhesive layer 32 Figure 6 shown, Figure 6 the second metal particles 322 in

[0177] Figure 10 are not included in the second adhesive layer 32 of the sealing structure 30. Therefore, the mixing percentage of the polymer material included in the second adhesive layer 32 can be increased compared to that in the first adhesive layer 31. Therefore, the adhesiveness of the second adhesive layer 32 can be higher than that of the first adhesive layer 31, thereby improving the reliability of fixing the reinforcing substrate 40.

[0178] As Figure 10As shown, in the display device according to the third embodiment of the present disclosure, the sealing structure 30 may not only have a barrier layer 33 made of a metal material, but also have at least one of a first auxiliary barrier layer 34 disposed between the first adhesive layer 31 and the barrier layer 33 and a second auxiliary barrier layer 35 disposed between the second adhesive layer 32 and the barrier layer 33.

[0179] That is, the sealing structure 30 may further include one of the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35. Alternatively, the sealing structure 30 may further include both the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35.

[0180] Each of the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35 may be made of an inorganic insulating material such as SiO x or SiON x .

[0181] Thus, since the barrier layer 33 made of a metal material is disposed between the first adhesive layer 31 and the second adhesive layer 32, the thermal conductivity of the sealing structure 30 can be improved. In addition, the adhesion between each of the first adhesive layer 31 and the second adhesive layer 32 and the barrier layer 33 can be improved due to each of the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35. Therefore, the sealing force and rigidity of the sealing structure 30 can be improved. Further, since the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35 made of an inorganic insulating material are disposed on the top and bottom surfaces of the barrier layer 33 formed of a metal material, the pinholes that may be generated in the barrier layer 33 formed of a metal material can be filled by the first auxiliary barrier layer 34 and the second auxiliary barrier layer 35, and thus pinhole defects can be prevented.

[0182] Figure 11 is a view showing a display device according to a fourth embodiment of the present disclosure. Figure 12 is a view showing Figure 11 an example of an ab cross-section of Figure 13 is a view showing Figure 11 an example of a cb cross-section of Figure 14 is Figure 13 an enlarged view of part "I" of Figures 15a to 15d is a view showing various structures of the barrier layer. Here, components that are the same as or similar to Figures 5 to 10 will be briefly described.

[0183] Refer to Figures 11 to 13, a display device according to a fourth embodiment of the present disclosure may include a bottom cover 50 having a bottom portion 51 and side portions 52, an adhesive pattern 70, an array substrate 10 having a light-emitting array 120 including a plurality of light-emitting elements corresponding to a plurality of pixel regions, and a sealing structure 30 that is disposed on the array substrate and fixes a plate-shaped reinforcing substrate 40 facing the sealing structure 30 to the array substrate 10 while sealing the light-emitting array 120.

[0184] In this regard, the array substrate 10 may be referred to as a support substrate, the reinforcing substrate 40 may be referred to as a bonding substrate, and the sealing structure 30 may be referred to as a bonding structure. In addition, the first adhesive layer 31 may be referred to as a sealing adhesive layer, the barrier layer 33 may be referred to as a bonding-enhanced heat-conducting layer, and the second adhesive layer 32 may be referred to as a bonding-enhanced adhesive layer. Accordingly, the bonding structure may be referred to as being composed of a sealing adhesive layer, a bonding-enhanced heat-conducting layer, and a bonding-enhanced adhesive layer on the support substrate.

[0185] The array substrate 10 includes a transistor array 110 and a light-emitting array 120. The transistor array 110 is formed on a base substrate 111 made of transparent glass or plastic (see Figure 4 ). The light-emitting array 120 may include a plurality of organic light-emitting elements OLED corresponding to a plurality of pixel regions.

[0186] The array substrate 10 may include a display area AA (see Figure 2 ), and a non-display area NA surrounding the display area AA (see Figure 2 ). A plurality of pads 10p may be spaced apart from each other and may be disposed in a region of the non-display area NA adjacent to one side edge of the display area AA.

[0187] The light-emitting array 120 may be disposed on the display area AA of the array substrate 10, and a sealing structure 30 for sealing the front surface of the light-emitting array 120 may be provided. The sealing structure 30 may be spaced apart from one side edge ed3 of the array substrate 10 by a first distance a1 in one direction, and spaced apart from a relative side edge ed4 of the array substrate 10 opposite to the one side edge ed3 by a second distance a2. In this regard, the first distance a1 and the second distance a2 may be equal to each other. Alternatively, since a plurality of pads 10p are arranged on one side edge ed3 of the array substrate 10, the second distance a2 may have a minimum distance value for achieving a narrow bezel, and the first distance a1 may have a value greater than the second distance a2 to ensure a minimum space in which the plurality of pads 10p are arranged.

[0188] Since the sealing structure 30 is spaced apart from each of the side edges ed3 and ed4 of the array substrate 10 by a predetermined distance, a part of the top surface of the array substrate 10 may be exposed.

[0189] The sealing structure 30 may include a first adhesive layer 31 positioned to face the array substrate 10, a second adhesive layer 32 positioned to face the reinforcement substrate 40, and a barrier layer 33 disposed between the first adhesive layer 31 and the second adhesive layer 32.

[0190] The first adhesive layer 31 positioned to face the array substrate 10 may include a first polymer material 311 having adhesiveness. The first adhesive layer 31 may surround the entire surface of the array substrate 10 to inhibit the penetration of moisture in the lateral direction of the array substrate 10 and prevent damage to the light-emitting array 120 disposed on the array substrate 10 caused by the inflow of external gas and oxygen.

[0191] The first adhesive layer 31 is made of the first polymer material 311. For example, the first adhesive layer 31 may be made of any one of a polymer material selected from an olefin-based polymer, an epoxy-based polymer, and an acrylate-based polymer.

[0192] In one example, the first adhesive layer 31 may be composed of a mixture including the above-described first adhesive polymer material 311 and first particles 312 made of a metal material. The first particles 312 made of a metal material may include nickel (Ni). Since the first particles 312 made of a metal material are included in the first adhesive layer 31, the first adhesive layer 31 may have a relatively higher thermal conductivity than the first adhesive layer 31 made only of the adhesive polymer material. Therefore, its heat dissipation effect can be improved.

[0193] The first adhesive layer 31 may further include a hygroscopic inorganic filler 313. The hygroscopic inorganic filler 313 prevents moisture from penetrating into the light-emitting array 120 of the array substrate 10. The hygroscopic inorganic filler 313 may include at least one of CaO, MaO, and BaO.

[0194] The barrier layer 33 is disposed between the first adhesive layer 31 and the second adhesive layer 32 to prevent moisture from penetrating to the front surface of the array substrate 10. In addition, the barrier layer 33 strengthens the bonding between the first adhesive layer 31 and the second adhesive layer 32 and realizes its stacked structure, thereby ensuring the reliability of fixing and bonding even when the thickness of the reinforcement substrate 40 becomes larger. In addition, the presence of the barrier layer 33 in the sealing structure can increase the reduction amount of the warpage amount of the array substrate 10 and the reinforcement substrate 40.

[0195] To ensure the reliability of fixing the reinforcement substrate 40, the elongation rate of the material constituting the barrier layer 33 may be large, and its yield strength value may be small. In one example, the elongation rate of the material constituting the barrier layer 33 is 4% or more, and the yield strength value is 360 Mpa or less.

[0196] The barrier layer 33 may include at least one of a metal material and an inorganic insulating material. For example, the barrier layer 33 may include a metal material such as Al, Cu, Sn, Ag, Fe, or Zn, or an alloy of the above metal materials. In addition, the barrier layer 33 may include an inorganic insulating material such as silicon oxide SiO x or silicon oxynitride SiON x .

[0197] The barrier layer 33 may have a single-layer structure or a multi-layer structure. For example, referring to Figures 15a to 15d , the barrier layer 33 may be formed as a single-layer structure composed of a metal film 33a including a metal material ( Figure 15a ), or may be formed as a single-layer structure composed of an inorganic insulating film 33b including an inorganic insulating material ( Figure 15b ), or may be formed as a stacked structure in which a first metal film 33c and a second metal film 33d including different metal materials are stacked ( Figure 15c ), or may be formed as a stacked structure in which a first inorganic insulating film 33e and a second inorganic insulating film 33f including different inorganic insulating materials are stacked ( Figure 15d ).

[0198] In addition, although not shown in the figure, the barrier layer 33 may have a multi-layer structure in which a plurality of cycles are stacked, and one cycle has a structure in which the first metal film 33c and the second metal film 33d are stacked. Alternatively, the barrier layer 33 may have a multi-layer structure in which a plurality of cycles are stacked, and one cycle has a structure in which the first inorganic insulating film 33e and the second inorganic insulating film 33f are stacked. Alternatively, a thin film structure composed of a single-layer metal film 33a or an inorganic insulating film 33b may be repeatedly stacked to form the barrier layer 33.

[0199] When the barrier layer 33 is formed as a multi-layer structure including layers of different materials, the barrier performance of preventing moisture from penetrating toward the front surface of the array substrate 10 can be improved.

[0200] The second adhesive layer 32 is positioned to face the reinforcement substrate 40. The second adhesive layer 32 can be used to fix the reinforcement substrate 40 and may include a polymer material having adhesiveness.

[0201] The second adhesive layer 32 is made of a polymer material without a carboxyl group. For example, the second adhesive layer 32 may be made of any one of a polymer material selected from an olefin-based polymer, an epoxy-based polymer, an acrylate-based polymer, an amine-based polymer, a phenol-based polymer, and an acid anhydride-based polymer, and each of them does not contain a carboxyl group.

[0202] The second adhesive layer 32 is made of a polymer material without carboxyl groups, thereby preventing the barrier layer 33 from being damaged and preventing defects from occurring in the display device. Therefore, the reliability of the display device can be ensured.

[0203] Specifically, the adhesive layer may include a polymer material having adhesive properties that allow adhesion to an adhesion target. However, when carboxyl groups are included in the adhesive polymer material, the barrier layer 33 may be damaged, which may cause defects in the display device. Hereinafter, this will be described with reference to the drawings.

[0204] Figure 16a 、 16b 、17, and 18 are photographs for showing whether material defects occur in accordance with the composition of the adhesive layer.

[0205] For example, referring to Figure 16a , when the barrier layer 33 is made of a metal material such as aluminum and when the adhesive layer includes a polymer material containing carboxyl groups, a plurality of air bubbles BB are generated on the adhesive layer through a chemical reaction between the material constituting the barrier layer 33 and the adhesive layer (see Figure 16a ).

[0206] The plurality of air bubbles diffuse to the barrier layer 33 in contact with the adhesive layer, and thus a plurality of air bubbles are generated on the surface of the barrier layer 33. The air bubbles generated on the surface of the barrier layer 33 can serve as a permeation path for oxygen or moisture. Therefore, oxygen or moisture may cause corrosion of the barrier layer 33 made of a metal material. In addition, oxygen or moisture permeates again through the corroded portion of the barrier layer 33, thereby causing defects (DF) to occur on the front surface of the panel (see Figure 17 ).

[0207] In particular, as Figure 18 shows, when these air bubbles are generated on the edge E of the barrier layer 33, the moisture permeability of the holes of the air bubbles passing through the edge E increases, so that the corrosion (Cr) of the barrier layer 33 may be further accelerated.

[0208] In addition, when the barrier layer 33 includes an inorganic insulating material, when a polymer material containing carboxyl groups is used as the adhesive layer, the surface of the barrier layer 23 may be uneven. In other words, the film uniformity of the barrier layer 23 may deteriorate. When the film uniformity decreases, the adhesion ability is also reduced. When the barrier layer 23 is damaged, defects may occur in the panel.

[0209] On the contrary, when a polymer material without carboxyl groups constitutes the second adhesive layer 32 according to an embodiment of the present disclosure, as Figure 16bAs shown, the surface of the second adhesive layer 32 can be maintained as a smooth surface without air bubbles thereon, thereby preventing corrosion of the barrier layer 33 and achieving a high-quality panel. In addition, the film uniformity of the barrier layer 33 can be kept consistent, so that deterioration of the adhesion ability can be prevented.

[0210] Since the second adhesive layer 32 does not contact the light-emitting array 120, the second adhesive layer 32 does not include a hygroscopic inorganic filler, and only includes a second adhesive polymer material 321 and second metal particles 322 therein. Since the second particles 322 made of a metal material are included in the second adhesive layer 32, the heat dissipation effect of the second adhesive layer 32 can be improved because the second adhesive layer 32 can have a relatively higher thermal conductivity than the second adhesive layer 32 made only of the adhesive polymer material 321.

[0211] The reinforcing substrate 40 in the form of a flat plate can be disposed on the second adhesive layer 32. The reinforcing substrate 40 can be positioned on the other surface opposite to the surface of the second adhesive layer 32 facing the barrier layer 33.

[0212] The reinforcing substrate 40 can include a metal material to effectively dissipate heat from the light-emitting array 120 when the light-emitting array 120 emits light. For example, the reinforcing substrate 40 can be made of a metal material including Al, Cu, Sn, Ag, Fe, Zn, or an alloy thereof. In another example, the reinforcing substrate 40 can be made of a glass or polymer plastic material.

[0213] Invar (an alloy of iron and nickel) is one of the metal materials with a relatively high thermal conductivity, with a thermal conductivity of 16 W / K·m, while the thermal conductivity of stainless steel (SUS) is 23.9 W / K·m. In contrast, the thermal conductivity of aluminum (Al) is 193 W / K·m, which is about 10 times higher than the thermal conductivity of each of Invar and stainless steel (SUS). Therefore, aluminum (Al) can dissipate heat more effectively. Therefore, the reinforcing substrate 40 made of aluminum (Al) can ensure a higher heat dissipation effect than the reinforcing substrate made of Invar or SUS.

[0214] In particular, the thermal conductivity affects the temperature inside the panel related to heat dissipation of the display device, and thus is highly related to the afterimage and lifespan of the light-emitting array. For example, the higher the thermal conductivity, the lower the temperature inside the panel. Therefore, as the temperature decreases, the appearance of afterimages on the panel can be reduced, and the lifespan of the light-emitting array can be increased.

[0215] Figure 19 is a table showing the maximum temperature measured inside the panel and the afterimage reduction rate according to each metal material.

[0216] Reference Figure 19, when Invar is used as the material for forming the reinforcing substrate 40, the maximum temperature measured inside the panel is 40.3 degrees Celsius. On the contrary, when aluminum (Al) is used as the material for forming the reinforcing substrate 40, when the thickness of aluminum (Al) is 1.0 mm, the maximum temperature measured inside the panel is 34.6 degrees Celsius, and when the thickness of aluminum (Al) is 1.5 mm, the maximum temperature measured inside the panel is 34 degrees Celsius.

[0217] In other words, when aluminum (Al) is used for the reinforcing substrate 40, the maximum temperature measured inside the panel is 5.7 degrees Celsius and 6.3 degrees Celsius (ΔT) lower than the maximum temperature measured inside the panel when Invar is used for the reinforcing substrate 40. Therefore, it can be determined that due to the high thermal conductivity of aluminum, the temperature inside the panel is effectively reduced.

[0218] When the maximum temperature inside the panel is reduced by 1 degree Celsius, the reduction rate of the basic afterimage increases by approximately 4%. Therefore, when the thickness of aluminum (Al) is 1.0 mm, the afterimage is reduced by 22.8% compared to when Invar is used for the reinforcing substrate 40. When the thickness of aluminum (Al) is 1.5 mm, the afterimage is reduced by 25.2% compared to when Invar is used for the reinforcing substrate 40. That is to say, it can be determined that aluminum has a higher heat dissipation effect than Invar.

[0219] In addition, it can be determined that when the same aluminum (Al) material is used for the reinforcing substrate, the thermal conductivity of the reinforcing substrate 40 varies based on the thickness of aluminum. In other words, the greater the thickness of aluminum, the higher the thermal conductivity of the reinforcing substrate 40. Accordingly, the reinforcing substrate 40 can have a thickness in the range from 0.3 mm to 1.5 mm to effectively dissipate heat and improve the heat dissipation effect.

[0220] In addition, the density of aluminum (Al) is 2.68 g / cm 3 , so compared with Invar with a density of 8.2 g / cm 3 and stainless steel (SUS) with a density of 7.7 g / cm 3 , the density of aluminum is relatively low, so the weight of aluminum is lighter. Therefore, when Al, Invar, and SUS are used for the reinforcing substrate with the same thickness, when using Al, the panel weight can be reduced by one-half to one-third compared to when SUS or Invar is used for the reinforcing substrate, making the display device thinner and lighter.

[0221] The thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can each be limited to be greater than or equal to the thickness that can prevent the occurrence of defects. In this regard, the defects can be, for example, holes formed in each of the first adhesive layer 31 and the second adhesive layer 32, but it is not limited thereto.

[0222] In addition, each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can be limited to a value less than or equal to the critical thickness of a single adhesive layer, at which process defects can be prevented from occurring. In this regard, process defects can include a decrease in thickness uniformity due to the insertion of foreign matter or a sliding phenomenon. Further, when the thickness of the adhesive layer is greater than the critical thickness, the area exposed to the outside may increase, making it easy for moisture to penetrate, and thus defects may occur.

[0223] For example, each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can be in the range of 10 μm to 100 μm. When each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 is less than 10 μm, pore defects may occur. Therefore, it is preferable that each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 is greater than 10 μm. Further, when each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 is greater than 100 μm, process defects may occur.

[0224] In addition, the total thickness of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can be limited to a thickness that can ensure the reliability of fixing the reinforcement substrate 40 (having a thickness 40th). In this regard, the reliability of fixing the reinforcement substrate 40 can be understood as the ability to fix the reinforcement substrate 40 so that it does not peel off from the second adhesive layer 32 when the thickness of the reinforcement substrate 40 increases. For example, the total thickness of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can be greater than 20 μm.

[0225] The thickness of the barrier layer 33 can be greater than 10 μm and less than each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32. In this way, defects such as holes and / or pinholes in the barrier layer 33 can be prevented, and at the same time, the thickness (having a thickness 30th) of the sealing structure 30 can be prevented from being unnecessarily increased due to the barrier layer 33.

[0226] Therefore, the sealing structure 30 according to an embodiment of the present disclosure can be implemented as a stacked structure in which the first adhesive layer 31 and the second adhesive layer 32 are respectively disposed on the top surface and the bottom surface of the barrier layer 33. Therefore, compared with the case where the sealing structure 30 is made of a single adhesive layer, process defects can be reduced. Further, a sealing structure 30 having a larger thickness and thus a stable shape can be achieved.

[0227] In addition, since a relatively thick sealing structure 30 can be implemented, the reinforcing substrate 40 fixed by the sealing structure 30 can also be implemented to have a relatively large thickness. Further, since the sealing structure 30 is formed as a multi-layer structure, the array substrate 10 and the reinforcing substrate 40 can be stably joined to each other, and at the same time, even if the reinforcing substrate 40 is formed to have a relatively large thickness, defects such as slipping will not occur.

[0228] In addition, since the reinforcing substrate 40 can be formed to be relatively thick due to the sealing structure 30, the reinforcing substrate 40 can effectively dissipate the heat emitted from the light-emitting array 120, thereby improving heat dissipation. Accordingly, the amount of warping that may occur due to heat generation can be reduced.

[0229] In one example, referring again to Figures 11 to 14 , the display device further includes at least one flexible circuit board 22 connected to the array substrate 10 and a printed circuit board 24 connected to the flexible circuit board 22. Integrated circuit chips 21 corresponding to data drivers ( Figure 2 62 in Figure 2 ) are mounted on each flexible circuit board 22. In addition, integrated circuit chips 23 corresponding to a timing controller (

[0230] 61 in

[0231] ) are mounted on the printed circuit board 24.

[0232] The printed circuit board 24 is disposed on one surface of the reinforcing substrate 40. One side of each flexible circuit board 22 is connected to the pad 10p of the array substrate 10 through the pad 22p of each flexible circuit board 22, and the other side of the flexible circuit board 22 is connected to a pad (not shown) of the printed circuit board 24.

[0233] In addition, the reinforcing substrate 40 may be spaced apart from one side edge ed1 of the sealing structure 30 by a first spacing b1, and may be spaced apart from the other side edge ed2 by a second spacing b2. Accordingly, a part of the top surface of the second adhesive layer 32 of the sealing structure 30 is not covered by the reinforcing substrate 40 but is exposed.

[0234] In one example, adjusting the thickness of the reinforcing substrate 40 may allow the movement offset value C, which is the first spacing b1, to be adjusted. In this regard, the reinforcing substrate 40 is spaced apart from one side edge ed1 of the sealing structure 30 by a first spacing b1 and is disposed along the inner direction in which the light-emitting array 120 is provided. Controlling the shift offset value C can prevent the flexible circuit board 22 from contacting the reinforcing substrate 40 or the sealing structure 30, thereby preventing damage.

[0235] In addition, in order to achieve a narrow bezel of the display device, the flexible circuit board 22 and the sealing structure 30 may be spaced apart from one side edge ed3 of the array substrate 10 by minimum spacings S1 and S2 ( Figure 14 ). In addition, considering the shift offset value C, the reinforcing substrate 40 may be spaced apart from one side edge ed1 of the sealing structure 40 by a first spacing ( Figure 13 b1 in

[0236] That is, in order to maximize the implementation of the narrow bezel, the reinforcing substrate 40 is spaced apart from one side edge ed3 of the array substrate 10 by a minimum spacing and is disposed along the inner direction in which the light-emitting array 120 is provided. The reinforcing substrate 40 may overlap with the boundary between the display area AA and the non-display area NA of the array substrate 10.

[0237] The sealing structure 30 and the reinforcing substrate 40 may be sequentially stacked on the opposite surface opposite to the light-emitting surface of the array substrate 10, that is, on its non-light-emitting surface. Accordingly, the array substrate 10, the sealing structure 30, and the reinforcing substrate 40 are arranged to form a stepped shape. The lowermost layer of the stepped shape constitutes an area in which a part of the non-display area NA, which is the non-light-emitting surface of the array substrate 10, is exposed. The middle layer of the stepped shape constitutes an area in which a part of the top surface of the second adhesive layer 32 of the sealing structure 30 is exposed. The uppermost layer of the stepped shape constitutes an area in which the top surface of the reinforcing substrate 40 is exposed. In one example, when viewed toward each of the four side surfaces of the array substrate 10, the display device may have a stepped shape. In another example, when viewed toward at least one part of the array substrate 10 where a plurality of pads 10p, 22p are provided, the display device may have a stepped shape.

[0238] In a display device having such a stepped shape, the areas of the array substrate 10, the sealing structure 30, and the reinforcement substrate 40 in a plan view may have different sizes from each other. In one example, in the plan view, the array substrate 10 among the array substrate 10, the sealing structure 30, and the reinforcement substrate 40 may have the largest area, while the reinforcement substrate 40 among the array substrate 10, the sealing structure 30, and the reinforcement substrate 40 may have the smallest area. In addition, the area of the sealing structure 30 may be smaller than the area of the array substrate 10 and larger than the area of the reinforcement substrate 40. In another example, three of the four side portions of the sealing structure 30 overlap with those side portions of the reinforcement substrate 40, and the remaining side portion of the four side portions of the sealing structure 30 that does not overlap with the reinforcement substrate 40 is exposed to have a plurality of pads 10p, 22p thereon.

[0239] Reference will be made Figure 14 and the following [Formula 1] to describe the shift offset value C.

[0240] Formula 1

[0241]

[0242] C = shift offset value

[0243] B = thickness of the sealing structure + thickness of the reinforcement substrate

[0244] A = distance between the pad and the sealing structure

[0245] Reference Figure 14 and [Formula 1], the value by which the position of the reinforcement substrate 40 spaced inwardly from a side edge ed1 of the sealing structure 30 at a first distance is displaced can be defined as the shift offset value C. The tilt angle θ can be defined as the tilt angle of the flexible circuit board 22, one side of which is connected to the array substrate 10 and the other side of which is connected to the printed circuit board 24. In addition, the distance A between the pad and the sealing structure can be defined as the distance between the side edge of the sealing structure 30 and the side edge of the pad 10p provided on the side edge of the array substrate 10 facing the side edge of the sealing structure 30.

[0246] As the sum B of the thickness of the sealing structure 40 and the thickness of the reinforcement substrate 40 increases, the shift offset value C can have a larger value.

[0247] Due to the possible damage to the module, the position of pad 10p on the array substrate 10 is fixed, and the position of the sealing structure 30 is also fixed. Therefore, the value of the spacing A between the pad and the sealing structure is substantially fixed. In addition, the tilt angle θ of the flexible circuit board 22 can be in the range of 5 to 30 degrees, preferably about 11.3 degrees. The following embodiments will be described with the tilt angle θ of the flexible circuit board 22 maintained at about 11.3 degrees. Therefore, the shift offset value C can be determined according to the sum B of the thickness of the sealing structure 40 and the thickness of the reinforcement substrate 40. In particular, the shift offset value C can vary according to the thickness of the reinforcement substrate 40. The reinforcement substrate 40 can be displaced inward from one side edge ed1 of the sealing structure 30 and toward the display area of the array substrate 10. Hereinafter, the present disclosure will be described with reference to [Table 1].

[0248] [Table 1]

[0249]

[0250] [Table 1] shows the change in the shift offset value C when the thickness of the reinforcement substrate 40 changes and when each of the spacing A between the pad and the sealing structure, the thickness of the sealing structure 30, and the tilt angle θ of the flexible circuit board 22 is constant. Referring to Examples 1 to 7 in [Table 1], it can be determined that when the thickness of the reinforcement substrate 40 increases from 0.3 mm to 5.0 mm, the movement offset value C also increases from 2.0 mm to 25 mm.

[0251] In other words, when the thickness of the reinforcement substrate 40 increases from 0.3 mm to 5.0 mm, the reinforcement substrate 40 is displaced inward from one side edge ed1 of the sealing structure 30 and toward the display area of the array substrate 10 by 2.0 mm to 25 mm.

[0252] As the shift offset value C increases, and thus the amount by which the reinforcement substrate 40 is displaced increases, the damage to the flexible circuit board 22 in contact with the reinforced substrate 40 can be reduced. In addition, as the thickness of the reinforcement substrate 40 becomes larger, contact between the flexible circuit board 22 and the side edge of the sealing structure 30 can be prevented.

[0253] As described above, as the shift offset value C increases, damage to the flexible circuit board 22 can be prevented. However, when the shift offset value C exceeds the critical range, the heat dissipation effect of the reinforcement substrate 40 may be reduced, the bonding strength between the array substrate 10 and the reinforcement substrate 40 may be reduced, or the amount of warping of the panel when bent may increase. Therefore, it is desirable to limit the shift offset value C so as not to exceed the critical range. In one example, when the area of the reinforcement substrate 40 has the same size as the display area AA or the reinforcement substrate 40 is sized such that the reinforcement substrate 40 extends from the display area AA toward the non-display area NA so as to overlap with the non-display area NA, the heat dissipation effect can be maintained.

[0254] Specifically, when the reinforcing substrate 40 has a width or area smaller than that of the display area AA, a non-overlapping area where the array substrate 10 is not covered by the reinforcing substrate 40 appears in the display area AA on the array substrate 10. When the non-overlapping area appears, the heat dissipation performance of a part of the array substrate 0 in the non-overlapping area may be reduced, resulting in an afterimage in this area.

[0255] Therefore, it is preferable to limit the shift offset value C within a critical range to maintain the narrow border and thinness of the display device while ensuring the heat dissipation characteristics of the reinforced substrate 40. The critical range of the shift offset value C can be set within the width NAW of the non-display area NA. Hereinafter, the present disclosure will be described with reference to [Formula 2].

[0256] Formula 2

[0257]

[0258] In this regard, D can refer to the ratio (percentage) indicating how much of the width NAW of the non-display area NA overlaps with the reinforcing substrate 40. The width NAW of the non-display area NA can be defined as the distance between the edge of the array substrate and the display area AA. The pad margin width can be defined as the distance between the side edge of the array substrate 10 and the side edge of the sealing structure 30. In addition, since C can indicate the shift offset value, the width NAW of the non-display area NA can be fixed, and since the position of the sealing structure 30 can also be fixed, the pad margin width can be a fixed value.

[0259] Referring to [Formula 2], since the reinforcing substrate 40 can be set according to the change of the shift offset value C, the critical range of the shift offset value C can be determined according to the range of the ratio D.

[0260] For example, in Examples 1 to 7 of [Table 1], the total width of the non-display area NA is set to about 9 mm, and the pad margin width is set to about 2 mm. However, the total width of the non-display area NA and the pad margin width in Table 1 are described by way of example for the embodiments of this specification. The present disclosure is not limited thereto.

[0261] In this case, in Example 1, the ratio (percentage) D is 54%. In Example 5, the ratio (percentage) D is -35.9%. When the ratio (percentage) D of the overlapping portion of the reinforcing substrate 40 located in the non-display area NA with respect to the width NAW of the non-display area NA is -35.9%, the reinforcing substrate 40 is set to expose the entire width NAW of the non-display area NA and even a part of the display area AA. That is, the reinforcing substrate 40 is inwardly disposed in the direction of the display area AA at the boundary between the display area AA and the non-display area NA.

[0262] When the ratio (percentage) D has a negative (-) value, the reinforcing substrate 40 exposes the entire non-display area NA and also exposes a part of the display area AA. Therefore, the heat dissipation performance of the heat related to the operation generated from the array substrate 10 in the exposed area may deteriorate.

[0263] Accordingly, while ensuring the heat dissipation performance of the reinforcing substrate 40, the shift offset value C that maintains the narrow border and thinness of the display device can be set within a critical range where the ratio (percentage) D is greater than 10% and less than 55%. In addition, preferably, the reinforcing substrate 40 can be positioned to at least overlap the boundary between the display area AA and the non-display area NA.

[0264] Accordingly, as the thickness of the reinforcing substrate 40 increases, while satisfying the ratio (percentage) D within the range of 10% to 55%, the reinforcing substrate 240 can have a width smaller than the width of the sealing structure 30, thereby exposing a part of the uppermost surface of the sealing structure 30.

[0265] When the reinforcing substrate 40 is displaced such that the ratio (percentage) D exceeds the critical range, the heat dissipation performance deteriorates. Therefore, due to a large amount of heat generated on the array substrate 10, the area around the pad 10p has a higher temperature. Therefore, the warpage amount by which the panel is bent occurs in the area around the pad 10p. Therefore, the pad 10p of the array substrate 10 and the pad 22p of the flexible circuit board 22 can be removed from each other. In addition, when the thickness of the reinforcing substrate 40 is greater than the critical thickness such that the reinforcing substrate 40 is displaced and its shift offset value C exceeds the critical range of the shift offset value C, the non-display area NA of the array substrate 10, that is, the border area, will inevitably increase, and accordingly, a narrow border may not be achieved.

[0266] In contrast, according to an embodiment of the present disclosure, adjusting the thickness of the reinforcing substrate 40 such that the shift offset value C is within a critical range can allow preventing the flexible circuit board 22 from contacting the sealing structure 30 or the reinforcing substrate 40, and thus prevent damage by the sealing structure 30 or the reinforcing substrate 40. In addition, the vertical space between the array substrate, the sealing structure, and the reinforcing substrate can be eliminated, and the horizontal space between the flexible circuit board and the sealing structure or the reinforcing substrate can be minimized, thereby ensuring heat dissipation capacity and achieving a narrow bezel.

[0267] Figure 20 is a view showing a display device according to a fifth embodiment of the present disclosure. Figure 21 is a view showing Figure 20 an example of a cb cross-section of. In this regard, only the components different from the above-described embodiments will be described.

[0268] Reference Figure 20 Referring to, in the display device according to the fifth embodiment of the present disclosure, the sealing structure 30 may further include a protection structure 295. The protection structure 295 is disposed on the second adhesive layer 32 and includes one surface facing the reinforcing substrate 40 and another surface opposite to the one surface and facing the second adhesive layer 32. The protection structure 295 may constitute the topmost part of the sealing structure 30. The protection structure 295 includes a protective layer 280, an antistatic coating film 290, and an adhesive reinforcing film 285. The protective layer 280 of the protection structure 295 may be made of an insulating material including polyethylene terephthalate (hereinafter referred to as PET).

[0269] The protection structure 295 is disposed on the second adhesive layer 32 to further ensure the rigidity of the display device. Rigidity may refer to a property of an object, that is, the object resists deformation of shape or volume when a force is applied. When the protection structure 295 is further included in the sealing structure 30, when an impact is applied to the display device from the outside, the array substrate 10 having the light-emitting array 120 disposed thereunder can be prevented from being damaged. In addition, in view of joining the array substrate 10 and the reinforcing substrate 40 to each other and maintaining the joining therebetween, the amount of warpage of the display panel can be reduced due to the deformation compensation effect generated by the physical properties and inherent properties of the protective layer 280 of the protection structure 295. In this regard, the protective layer 280 may be referred to as a joining reinforcing rigidity layer.

[0270] The antistatic coating film 290 of the protection structure 295 formed by antistatic treatment may be disposed on one surface of the protective layer 280 facing the reinforcing substrate 40. The adhesive reinforcing film 285 formed by release treatment may be disposed on the other surface thereof facing the second adhesive layer 32.

[0271] The protective layer 280 is made of PET as an insulator, and PET has a ratio greater than 10 11A higher sheet resistance of Ω / sq, thus having a high electrostatic attraction. Therefore, when transferring the sealing structure including the protective layer 280, two or more sealing structures may not be removable from each other, or may fall off during the transfer process and cause damage. In addition, since PET has a high electrostatic attraction, static electricity may be generated, which may cause defects on the display device.

[0272] Therefore, the antistatic coating film 290 formed by applying an antistatic treatment of a conductive material on one surface of the protective layer 280 can reduce the amount of static electricity generated. When forming the antistatic coating film 290, the protective layer 280 can have a sheet resistance with static dissipation characteristics. For example, the protective layer 280 on which the antistatic coating film 290 is formed has a sheet resistance value in the range of 10 5 to 10 10 Ω / sq. The antistatic coating film 290 can be formed by applying an adhesive conductive material on the protective layer 280. In one embodiment, the antistatic coating film 290 can include a conductive adhesive.

[0273] In addition, the adhesive reinforcing film 285 formed on the other surface of the protective layer 280 can be composed of a silicone resin coating film. By configuring the second adhesive layer 32 to include a polymer material without carboxyl groups and by providing the adhesive reinforcing film 285 on the other surface of the protective layer 280, the adhesion between the protective structure 295 and the second adhesive layer 32 can be improved.

[0274] Since the second adhesive layer 32 includes a polymer material without carboxyl groups, the adhesion with the adhesive reinforcing film 285 formed on the other surface of the protective layer 280 can be improved. For example, when the adhesive reinforcing film 285 is removed from the protective layer 280 and the second adhesive layer 232 is made of an olefin-based polymer material without carboxyl groups, the adhesion between the protective layer 280 and the second adhesive layer 32 may be reduced. Accordingly, by providing the adhesive reinforcing film 285 between the protective layer 280 and the second adhesive layer 32, the adhesion between the protective layer 280 and the second adhesive layer 32 can be maintained.

[0275] To further ensure the rigidity of the display device, the thickness of the protective layer 280 is preferably greater than 30 μm and less than 100 μm.

[0276] That is, to improve the implementation of the narrow border, the reinforcement substrate 40 and one side edge ed3 of the array substrate 10 are spaced apart at a minimum distance toward the light-emitting array 120. The reinforcement substrate 40 can be arranged to overlap with the boundary between the display area AA and the non-display area NA.

[0277] In one example, the sealing structure 30 and the reinforcing substrate 40 can be stacked in sequence on the opposite surface opposite to the light-emitting surface of the array substrate 10, that is, on its non-light-emitting surface. Thus, the array substrate 10, the sealing structure 30 with the protective layer 280 having the protective structure 295, and the reinforcing substrate 40 are arranged in a stepped shape. The bottom layer of the stepped shape constitutes an area where a part of the non-display area NA (i.e., the non-light-emitting surface of the array substrate 10) is exposed. The middle layer constitutes an area where a part of the top surface of the protective layer 280 of the sealing structure 30 is exposed. The top layer thereof constitutes an area where the top surface of the reinforcing substrate 40 is exposed. In one example, when viewed towards each of the four side surfaces of the array substrate 10, the display device can have a stepped shape.

[0278] In one example, as the thickness of the protective layer 280 constituting the sealing structure 30 increases, the rigidity of the display device increases, thereby preventing damage to the panel. Hereinafter, this will be described with reference to the drawings.

[0279] Figure 22 It is a table showing the evaluation results of the rigidity of the display device based on the thickness change of the protective layer. Figures 23a to 23f It is a photograph showing the dent of the reinforcing substrate and the dark spots generated on the panel during the rigidity evaluation.

[0280] In the rigidity evaluation of the display device, a constant force, for example, a force in the range of 1 kgf to 5 kgf, is applied to the exposed surface of the reinforcing substrate 40 using a test device for rigidity evaluation for 30 seconds. Then, based on the identification result of whether dark spots have been generated on the panel, it is determined whether a defect has occurred. The test device for rigidity evaluation is a push-pull gauge device with a pointed tip.

[0281] In this regard, the comparative example uses Invar as the material of the reinforcing substrate and does not include a barrier layer, a second adhesive layer, and a protective layer. In the first to fifth experimental examples, aluminum (Al) is used as the material of the reinforcing substrate, and a structure in which the protective layer 280 is provided on the second adhesive layer 32 is evaluated. In this regard, in the first to third experimental examples, the thickness of the second adhesive layer 32 is changed while the thickness of the protective layer 280 is fixed. In the fourth and fifth experimental examples, the thickness of the second adhesive layer 32 is fixed while the thickness of the protective layer 280 is changed.

[0282] Specifically, in the first experimental example, the thickness of the second adhesive layer 32 is 50 μm, while the thickness of the protective layer 280 is 75 μm. In the second experimental example, the thickness of the second adhesive layer 32 is set to 30 μm, and the thickness of the protective layer 280 is set to 75 μm. In the third experimental example, the thickness of the second adhesive layer 32 is 15 μm, and the thickness of the protective layer 280 is 75 μm. In the fourth experimental example, the thickness of the second adhesive layer 32 is 50 μm, and the thickness of the protective layer 280 is 100 μm. In the fifth experimental example, the thickness of the second adhesive layer 32 is set to 50 μm, while the thickness of the protective layer 280 is set to 38 μm.

[0283] According to the results of the rigidity evaluation, as Figure 22 shown in the table, it can be determined that in the comparative example, when a force in the range of 1 kgf to 4 kgf is applied, no dark spots due to dents appear, but when a force of 5 kgf is applied to it, dark spots due to dents appear. This can be determined in Figure 23b which shows the dark spots generated on the panel. Referring to Figure 23a and Figure 23b , Figure 23a shows the surface of the reinforcement substrate when a force of 5 kgf is applied for rigidity evaluation in the comparative example, Figure 23b shows the pixels of the panel when a force of 5 kgf is applied for rigidity evaluation in the comparative example, and it can be determined that when a dent M1 appears on the surface of the reinforcement substrate, a dark spot defect D1 appears on the pixels of the panel.

[0284] On the contrary, in the first to fourth experimental examples, no defects appeared when a force in the entire range of 1 kgf to 5 kgf was applied. Specifically, referring to Figure 23c and Figure 23e , which respectively show the surface of the reinforcement substrate when forces of 4 kgf and 5 kgf are applied for rigidity evaluation in the third experimental example, and referring to Figure 23d and Figure 23f , which show the pixels of the panel when forces of 4 kgf and 5 kgf are applied for rigidity evaluation in the third experimental example, it can be determined that although dents M2 and M3 appeared on the surface of the reinforcement substrate, no dark spot defects appeared on the pixels of the panel.

[0285] In addition, in the fifth experimental example, the thickness of the second adhesive layer 32 is the same as that in the first experimental example, but the thickness of the protective layer 280 is relatively small, being 38 μm, and defects appeared.

[0286] From the above evaluation results, it can be determined that when the protective layer 280 is disposed on the second adhesive layer 32, the underlying structure can be protected from external impacts. In particular, it can be determined that as the thickness of the protective layer 280 increases, greater rigidity can be ensured. Therefore, in the case where the display device is subjected to an external impact, damage to the light-emitting array 120 on the array substrate 10 can be prevented.

[0287] In one example, it is preferable that the thickness of the protective layer 280 is relatively large to ensure the rigidity of the display device. However, when the thickness exceeds a critical thickness, the amount of warpage increases due to differences in the thermal expansion coefficients of the structures constituting the display device, thereby damaging the display device. Therefore, it is desirable that the thickness of the protective layer 280 does not exceed the critical thickness. Hereinafter, this will be described with reference to the drawings.

[0288] Figure 24 is a table showing the amount of warpage of the panel according to the change in the thickness of the protective layer.

[0289] To measure the amount of warpage of the panel, the temperature of the process chamber is raised to 70 degrees Celsius, and then the amount of warpage of the panel is measured at room temperature. The amount of warpage of the panel can be measured by placing the array substrate 10 of the panel so that the array substrate 10 faces the surface of the stone panel for inspection, and using a warpage measuring device to measure the amount of warpage at each of the four edges of the panel.

[0290] Reference Figure 24 , in the first to third experimental examples, the thickness of the second adhesive layer 32 is constant at 50 μm. In the first experimental example, the thickness of the protective layer 280 is 38 μm, in the second experimental example, the thickness of the protective layer 280 is 75 μm, and in the third experimental example, the thickness of the protective layer 280 is 100 μm. Under these conditions, the amount of warpage of the panel was measured.

[0291] Referring to the results of the first to third experimental examples, in the first to third experimental examples, the initial amount of warpage before being fed into the process chamber is zero.

[0292] On the contrary, based on the results of measuring the amount of warpage of the panel after raising the temperature of the process chamber to 70 degrees Celsius, it can be determined that in the first experimental example where the thickness of the protective layer 280 is relatively small, the amount of warpage is in the range of 2.5 mm to 6 mm, and as the thickness of the protective layer 280 increases, the amount of warpage increases (in the second experimental example), and in the third experimental example where the thickness of the protective layer 280 is relatively large, the panel is damaged.

[0293] Based on these measurement results, in order to ensure the rigidity of the display device, it is preferable that the thickness of the protective layer 280 is large. However, when the thickness exceeds the critical thickness, the panel may be damaged. Therefore, it is desirable to limit the thickness of the protective layer 280 so as not to exceed the critical thickness. In one example, the protective layer 280 is preferably formed to have a thickness of 38 μm to 75 μm as the critical thickness, at which the panel can be prevented from being bent and damaged while the rigidity of the display device can be ensured.

[0294] In addition, according to the display device of an embodiment of the present disclosure, the sealing structure 30 may be formed as a multi-layer structure, and the reinforcing substrate 40 may be disposed on the sealing structure 30 having the multi-layer structure. In this case, compared with the case where the sealing structure is formed as a single-layer structure and the reinforcing substrate is disposed on the sealing structure, the warpage amount by which the display device is bent can be reduced. Hereinafter, reference will be made to Figure 25 describe this. In this regard, as in the first embodiment, the reinforcing substrate 40 may be referred to as a bonding substrate, and the sealing structure 30 may be referred to as a bonding structure.

[0295] Figure 25 is a graph showing the change in the warpage amount of the panel based on the configuration of the sealing structure.

[0296] Reference Figure 25 , the curve of Comparative Example 1 CE1 is a curve showing the warpage amount of the display panel in which the adhesive layer and the reinforcing substrate 40 as a single layer are disposed on the array substrate 10 and the temperature of the process chamber is set to 85 degrees Celsius. The curve of Comparative Example 2 CE2 is a curve showing the warpage amount of the panel in which the adhesive layer and the reinforcing substrate 40 as a single layer are disposed on the array substrate 10 and the temperature of the process chamber is set to 60 degrees Celsius.

[0297] The curve of Example 1 EM1 is a curve showing the warpage amount of the panel in which the sealing structure 30 and the reinforcing substrate 40 composed of a multi-layer structure are disposed on the array substrate 10 and the temperature of the process chamber is set to 85 degrees Celsius. The curve of Example 2 EM2 is a curve showing the warpage amount of the panel in which the sealing structure 30 and the reinforcing substrate 40 composed of a multi-layer structure are disposed on the array substrate 10 and the temperature of the process chamber is set to 60 degrees Celsius. In this regard, the sealing structure 30 composed of a multi-layer structure may have a stacked structure in which the first adhesive layer 31, the barrier layer 33, and the second adhesive layer 32 are stacked. The protective layer 280 may be added thereto. Further, the barrier layer 33 may be made of an aluminum (Al)-based metal material, and the reinforcing substrate 40 may be made of an aluminum (Al)-based metal material.

[0298] The warpage amount of the panel can be measured by placing the array substrate 10 of the panel so that the array substrate 10 faces the surface of the stone panel for inspection and using a warpage amount measuring device to measure the warpage amount at each of the four edges of the panel.

[0299] Referring to Comparative Examples CE1 and CE2 and Examples EM1 and EM2, it can be determined that when the tests are conducted at the same temperature, the warpage amount of the panel in each of Examples EM1 and EM2 to which the sealing structure 30 composed of a multilayer structure is applied is smaller than the warpage amount of the panel in Comparative Examples CE1 and CE2 to which a single layer as an adhesive layer is applied.

[0300] In particular, it can be determined that when the temperature of the process chamber is reduced to 60 degrees Celsius which is lower than 85 degrees Celsius, the warpage amount is further reduced to the level of 58% of when the temperature of the process chamber is 85 degrees Celsius.

[0301] Furthermore, it can be determined that the warpage amount decreases as the thickness of the reinforcing substrate 40 becomes larger. For example, it can be determined that in Example 2 EM2, when the sealing structure 30 composed of a multilayer structure and the reinforcing substrate 40 are provided on the array substrate 10, and the thickness of the reinforcing substrate 40 is 0.1 mm, where the temperature of the process chamber is 60 degrees Celsius, the warpage amount is approximately 400 mm. It can be determined that in Example 2 EM2, when the sealing structure 30 composed of a multilayer structure and the reinforcing substrate 40 are provided on the array substrate 10, and the thickness of the reinforcing substrate 40 is 1 mm, where the temperature of the process chamber is 60 degrees Celsius, the warpage amount is less than 200 mm, and thus is reduced by 50% or more compared to when the thickness of the reinforcing substrate 40 is 0.1 mm.

[0302] Based on the curve of this experimental example, it can be determined that when the thickness of the reinforcing substrate 40 is larger and the sealing structure 30 is composed of a multilayer structure, the warpage amount by which the display device is bent is smaller than the warpage amount when the sealing structure is composed of a single layer and the thickness of the reinforcing substrate 40 is larger.

[0303] Furthermore, according to the display device according to an embodiment of the present disclosure, since the thickness of the sealing structure 30 is larger, when the thickness of the reinforcing substrate 40 is constant, the warpage amount by which the panel is bent can be reduced. Below, reference will be made to Figures 26 to 28 A description will be given thereof.

[0304] Figure 26 is a diagram schematically showing the change in the warpage amount of the panel. Figure 27 is a graph showing the change in the warpage amount based on the change in the thickness of the sealing structure at high temperature. Figure 28 is a graph showing the change in the warpage amount based on the change in the thickness of the sealing structure at room temperature.

[0305] Reference Figure 26, when the central portion of the array substrate protrudes prominently, the change in the warpage amount of the panel can be defined as having a negative (-) value. When the central portion of the array substrate is recessed and sunken, the change in the warpage amount can be defined as having a positive (+) value. In this regard, in order to measure the change in the warpage amount according to the thickness change of the sealing structure, a panel structure is adopted in which the sealing structure and a reinforcing substrate made of aluminum (Al) are provided on the array substrate. In one example, the sealing structure may be composed of a first adhesive layer, a barrier layer, and a second adhesive layer, or may be composed of a first adhesive layer, a barrier layer, a second adhesive layer, and a protective structure.

[0306] The change in the warpage amount is measured by placing the above structure in a process chamber, raising the temperature of the process chamber to a high temperature, for example, raising it to 60 degrees Celsius, measuring the warpage amount of the panel, then holding the panel until it becomes flat again, cooling the temperature of the process chamber to room temperature, and then measuring the warpage amount of the panel at room temperature.

[0307] The panel structure in which the sealing structure and the reinforcing substrate made of aluminum (Al) are provided on the array substrate includes: a first experimental example EX1 in which a reinforcing substrate with a thickness of 0.6 mm and a sealing structure with a thickness of 60 μm are provided on the array substrate; a second experimental example EX2 in which a sealing structure with a thickness of 480 μm and a reinforcing substrate with a thickness of 0.6 mm are provided on the array substrate; a third experimental example EX3 in which a sealing structure with a thickness of 60 μm and a reinforcing substrate with a thickness of 1.0 mm are provided on the array substrate; and a fourth experimental example EX4 in which a sealing structure with a thickness of 480 μm and a reinforcing substrate with a thickness of 1.0 mm are provided on the array substrate.

[0308] As Figure 27 shown, as a graph of the measurement results of the change in the warpage amount according to the thickness change of the sealing structure at high temperature using this measurement method, when comparing the first experimental example EX1 and the second experimental example EX2 with each other, it can be determined that when the reinforcing substrate has a constant thickness, the change in the warpage amount decreases in the second experimental example EX2 with a larger thickness of the sealing structure. In addition, it can be determined that in the third experimental example EX3 and the fourth experimental example EX4 in which the thickness of the reinforcing substrate is relatively large, the change in the warpage amount is smaller than that in the first experimental example EX1 and the second experimental example EX2.

[0309] In addition, referring to Figure 28, as a graph showing the measurement results of the change in warpage amount according to the change in the thickness of the sealing structure at room temperature, it can be determined that in the first experimental example EX1 and the second experimental example EX2, the change in warpage amount decreases in the negative (-) direction. In addition, it can be determined that when the reinforcing substrate has a constant thickness, in the second experimental example EX2 where the thickness of the sealing structure is larger, the change in warpage amount decreases. In addition, it can be determined that in the third experimental example EX3 and the fourth experimental example EX4 where the thickness of the reinforcing substrate is relatively large, the change in warpage amount is smaller than that in the first experimental example EX1 and the second experimental example EX2.

[0310] The fact that the high-temperature and room-temperature warpage amounts decrease in the negative (-) direction may be related to the following facts: as the thickness of the sealing structure becomes larger, the neutral plane is shifted and the high-temperature warpage amount decreases; and as the thickness of the sealing structure becomes larger, the stress relaxation effect of restoring to the original flat surface is larger, causing the room-temperature warpage amount to decrease in the negative direction.

[0311] The organic light-emitting display device according to an embodiment of the present disclosure may include a sealing structure composed of a multi-layer structure to fix a reinforcing substrate with a relatively large thickness made of a material having high thermal conductivity, thereby increasing rigidity and improving the heat dissipation effect. In addition, since a reinforcing substrate with a relatively large thickness can be fixed, the device can effectively dissipate heat, thereby reducing the appearance of afterimages on the panel and improving the lifespan of the display device. In addition, introducing a sealing structure composed of a multi-layer structure and placing the reinforcing substrate thereon can ensure the reliability of fixing the reinforcing substrate when the thickness of the reinforcing substrate is large, thereby improving the bonding force between the array substrate and the reinforcing substrate. In addition, introducing a barrier layer in the sealing structure having a multi-layer structure can improve the bonding force between the first adhesive layer and the second adhesive layer. In addition, introducing a sealing structure having a multi-layer structure can result in a reduction in the warpage amount of the display device being bent. In addition, controlling the thickness of the reinforcing substrate such that the shift offset value of the reinforcing substrate is within a critical range can allow for the realization of a narrow border while preventing the flexible circuit board from contacting the sealing structure or the reinforcing substrate, and thus preventing damage.

[0312] Figure 29 is a flowchart showing a method for manufacturing a display device according to an embodiment of the present disclosure. Figures 30 to 35 is a view showing Figure 29 the steps of the method in

[0313] As Figure 29As shown, a method for manufacturing a display device according to an embodiment of the present disclosure includes step S10: preparing an array substrate 10 having a light-emitting array 120, the light-emitting array 120 including a plurality of light-emitting elements OLED corresponding to a plurality of pixel regions PA; step S20: preparing a sealing structure 30 including a first adhesive layer 31 and a second adhesive layer 32 facing each other and a barrier layer 33 disposed between the first adhesive layer 31 and the second adhesive layer 32; and step S30: disposing the sealing structure 30 on the array substrate 10 such that the light-emitting array 120 is sealed by the first adhesive layer 31. In another example, the sealing structure 30 may further include a protection structure 295 on the second adhesive layer 32 (refer to Figure 20 ).

[0314] In addition, a method for manufacturing a display device according to an embodiment of the present disclosure may further include, after step S30 of disposing the sealing structure 30 on the array substrate 10, step S40 of preparing a plate-shaped reinforcement substrate 40, and step S50 of attaching the reinforcement substrate 40 to the second adhesive layer 32.

[0315] Specifically, as Figure 30 shown, an array substrate 10 having a light-emitting array 120 is prepared (S10).

[0316] As Figure 2 shown, the array substrate 10 includes a plurality of pixel regions PA defined in a display area AA, and gate lines GL and data lines DL for supplying drive signals to pixel circuits in each pixel region PA.

[0317] As Figure 4 shown, the array substrate 10 includes a transistor array 110 and a light-emitting array 120, the transistor array 110 including a plurality of pixel circuits respectively corresponding to a plurality of pixel regions PA, and the light-emitting array 120 including a plurality of organic light-emitting elements OLED respectively corresponding to a plurality of pixel regions PA.

[0318] In addition, as Figure 5 shown, the array substrate 10 further includes pads 10p disposed in a part of a non-display area NA outside the display area AA.

[0319] Then, a sealing structure 30 having a multilayer structure is prepared (S20).

[0320] The sealing structure 30 includes a structure in which a first adhesive layer 31, a barrier layer 33, and a second adhesive layer 32 are sequentially stacked. That is, the sealing structure 30 has a stacked structure formed by the first adhesive layer 31 and the second adhesive layer 32 separated by the barrier layer 33.

[0321] The thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32 can each be selected from the range of 10 μm to 100 μm. In this way, process defects such as foreign matter insertion into and displacement of each of the first adhesive layer 31 and the second adhesive layer 32 can be prevented. Therefore, the thickness 30th of the sealing structure 30 including the first adhesive layer 31 and the second adhesive layer 32 can be increased.

[0322] That is to say, the thickness 30th of the sealing structure 30 can be in the range of 30 μm to 300 μm.

[0323] The first adhesive layer 31 can be made of a polymer material 311 selected from olefin-based polymers, epoxy-based polymers, and acrylate-based polymers (see Figure 6 ). The second adhesive layer 32 can be made of any one of a polymer material 321 selected from olefin-based polymers, epoxy-based polymers, acrylate-based polymers, amine-based polymers, phenol-based polymers, and anhydride-based polymers (see Figure 6 ), and each of them does not contain a carboxyl group.

[0324] Each of the first adhesive layer 31 and the second adhesive layer 32 can be composed of a mixture including each of the polymer materials with adhesiveness (311 and 321 in Figure 6 ) and each of the particles made of a metal material (312 and 322 in Figure 6 ). In one example, each of the first particles 312 made of a metal material can be a powder made of Ni. In this way, the thermal conductivity of each of the first adhesive layer 31 and the second adhesive layer 32 can be improved, so that the heat dissipation effect due to the sealing structure 30 can be improved. In this regard, different from the first adhesive layer 31, the second adhesive layer 32 is made of a second adhesive polymer material 321 that does not contain a carboxyl group.

[0325] Alternatively, the first adhesive layer 31 in contact with the array substrate 10 is made of a mixture including a first polymer material 311 with adhesiveness and first particles 312 made of a metal material. The second adhesive layer ( Figure 9 32) can be made of a second polymer material 321 with adhesiveness and without a carboxyl group. In this way, the adhesiveness of the second adhesive layer 32 can be higher than that of the first adhesive layer 31, and the cost of preparing the sealing structure 30 can be reduced.

[0326] In addition, the first adhesive layer 31 may be composed of a mixture further containing a hygroscopic inorganic filler 313. The hygroscopic inorganic filler 313 may be made of at least one of CaO, MgO, or BaO. In this way, the moisture penetration prevention effect caused by the first adhesive layer 31 can be improved.

[0327] The barrier layer 33 is intended to separate the first adhesive layer 31 and the second adhesive layer 32 from each other, and may be implemented as a thin film made of one of a metallic material and an inorganic insulating material. In one example, the barrier layer 33 may be implemented as a thin film (foil) including a metallic material (such as Al, Cu, Sn, Ag, Fe, or Zn). Alternatively, the barrier layer 33 may be implemented as a thin film made of an inorganic insulating material (such as SiO x or SiON x ).

[0328] The thickness 33th of the barrier layer 33 may be in a range greater than 10 μm and respectively less than each of the thickness 31th of the first adhesive layer 31 and the thickness 32th of the second adhesive layer 32. In this way, hole-related defects of the barrier layer 33 can be prevented, and the thickness of the sealing structure 30 can be prevented from being unnecessarily increased due to the barrier layer 33.

[0329] Alternatively, as Figure 10 shown, the sealing structure 30 may further include at least one of a first auxiliary barrier layer 34 and a second auxiliary barrier layer 35 respectively provided on two opposite surfaces of the barrier layer 33 made of a metallic material.

[0330] In addition, in step S20 of preparing the sealing structure 30, the sealing structure 30 may be provided in a state where its two opposite surfaces are respectively covered by a first temporary covering layer 36 and a second temporary covering layer 37.

[0331] That is, in step S20 of preparing the sealing structure 30, the sealing structure 30 may be provided in a state where the first adhesive layer 31 of the sealing structure 30 may be covered by the first temporary covering layer 36, while the second adhesive layer 32 may be covered by the second temporary covering layer 37. Each of the first temporary covering layer 36 and the second temporary covering layer 37 may be a release film such as a silicone resin coating formed on one surface facing each of the first adhesive layer 31 and the second adhesive layer 32. The release film may allow each of the first temporary covering layer 36 and the second temporary covering layer 37 to be easily removed from the sealing structure 30 in a subsequent process. In addition, an antistatic coating film formed by an antistatic treatment may be formed on the opposite surface of each of the first temporary covering layer 36 and the second temporary covering layer 37.

[0332] In another example, when the protective layer 280 of the protection structure 295 (see Figure 20 ) is formed on the second adhesive layer 32 of the sealing structure 30, the adhesive reinforcing film 85 can be formed on one surface of the protective layer 280, while the antistatic coating film 290 (see Figure 20 ) can be formed on its opposite surface.

[0333] Subsequently, the step S30 of disposing the sealing structure 30 on the array substrate 10 may include removing the first temporary cover layer 36 from the first adhesive layer 31 of the sealing structure 30, and bringing the first adhesive layer 31 into close contact with the array substrate 10 using a roller.

[0334] That is, as Figure 31 shown, the first temporary cover layer 36 can be removed from the sealing structure 30, and thus the first adhesive layer 31 can be exposed.

[0335] Then, as Figure 32 shown, when the first adhesive layer 31 of the sealing structure 30 is aligned on the array substrate 10, a predetermined pressure is applied to the sealing structure 30 or the array substrate 10 using at least one roller 170. Accordingly, the first adhesive layer 31 of the sealing structure 30 is tightly adhered to the array substrate 10.

[0336] Next, as Figure 33 shown, a plate-shaped reinforcing substrate 40 (S40) is prepared, and then the reinforcing substrate 40 is attached to the sealing structure 30 (S50).

[0337] In addition, the step S50 of attaching the reinforcing substrate 40 to the sealing structure 30 may include removing the second temporary cover layer 37 from the second adhesive layer 32 of the sealing structure 30, and attaching the reinforcing substrate 40 to the second adhesive layer 32.

[0338] In the step S40 of preparing the plate-shaped reinforcing substrate 40, the reinforcing substrate 40 can be made of one material among glass, metal, and plastic polymer. According to the increased thickness of the sealing structure 30, the thickness 40th of the reinforcing substrate 40 can be in the range of 0.1 mm to 1.5 mm.

[0339] As Figure 33 shown, the second temporary cover layer 37 can be removed from the sealing structure 30 attached to the array substrate 10, and the second adhesive layer 32 can be exposed.

[0340] In another example, when the protection structure 295 (refer to Figure 20 ) is further disposed on the second adhesive layer 32 of the sealing structure 30, the top surface of the protection structure 295 can be exposed.

[0341] In addition, as Figure 34 shown, the reinforcement substrate 40 is attached to the second adhesive layer 32 of the sealing structure 30 (S50). Thus, the reinforcement substrate 40 is coupled to the array substrate 10 via the sealing structure 30.

[0342] According to an embodiment of the present disclosure, the rigidity achieved by the reinforcement substrate 40 can be ensured to a level that can maintain the shape of the array substrate. Thus, the intermediate process structure in a state where the array substrate 10 and the reinforcement substrate 40 are coupled to each other can be transferred to another location. Accordingly, a unit device that does not include the bottom cover 50 for accommodating the array substrate 10 and the reinforcement substrate 40 can be provided. Thus, the application range can be expanded.

[0343] Alternatively, a module device including the bottom cover 50 for accommodating the array substrate 10 and the reinforcement substrate 40 can be provided. The process of preparing the module device is as follows.

[0344] As Figure 35 shown, at least one flexible printed circuit board 22 is connected to the array substrate 10. A printed circuit board 24 connected to the at least one flexible printed circuit board 22 is disposed on the reinforcement substrate 40.

[0345] In this regard, the reinforcement substrate 40 is disposed farther from the pad 10p of the array substrate 10 than the sealing structure 30. Thus, each flexible printed circuit board 22 can extend over and across the sealing structure 30 rather than the reinforcement substrate 40.

[0346] In addition, the bottom cover 50 accommodates the array substrate 10, the sealing structure 30, the reinforcement substrate 40, the at least one flexible printed circuit board 22, and the printed circuit board 24 therein, and is joined to the reinforcement substrate 40 by at least one adhesive pattern 70 disposed on the reinforcement substrate 40.

[0347] As described above, the display device according to each embodiment of the present disclosure includes the sealing structure 30 having a stacked structure formed by the first adhesive layer 31 and the second adhesive layer 32, and the barrier layer 33 is interposed therebetween. Thus, due to the stacked structure formed by the first adhesive layer 31 and the second adhesive layer 32, the sealing structure 30 can have a relatively large thickness. That is, the thickness 30th of the sealing structure 30 can be about twice the critical thickness to avoid process defects in a single layer made of an adhesive material.

[0348] Therefore, the reinforcement substrate 40 that can be fixed to the array substrate 10 via the sealing structure 30 can have a relatively large thickness. Thus, the rigidity and heat dissipation effect due to the reinforcement substrate 40 can be sufficiently ensured, and the inner plate can be unnecessary. In other words, the inner plate can be removed. This can be advantageous for slimming and lightening the display device.

[0349] In addition, implementing a sealing structure having a multi-layer structure can result in a reduction in the amount of warpage of the display device when bent.

[0350] In addition, by using a material having a high thermal conductivity as the material for the reinforcing substrate, heat can be effectively dissipated. Accordingly, the appearance of afterimages on the panel can be reduced, and the lifespan of the light-emitting array can be improved.

[0351] In addition, adjusting the thickness of the reinforcing substrate to displace the position of the reinforcing substrate can prevent the flexible printed circuit board from contacting the sealing structure or the reinforcing substrate and prevent damage to the flexible printed circuit board. A preferred layout structure of the reinforcing substrate can maximize the narrow bezel of the display panel while increasing the heat dissipation effect of the pad region where the temperature is relatively high.

[0352] Exemplary embodiments of the present disclosure can also be described as follows.

[0353] According to one aspect of the present disclosure, there is provided a display device including: an array substrate having a display area and a non-display area disposed outside the display area, and having a light-emitting array including a plurality of light-emitting elements respectively corresponding to a plurality of pixel areas in the display area; and a sealing structure disposed on the array substrate to seal the light-emitting array and fix a plate-shaped reinforcing substrate facing the sealing structure to the array substrate, wherein the sealing structure includes: a first adhesive layer facing the array substrate; a second adhesive layer facing the reinforcing substrate; and a barrier layer disposed between the first adhesive layer and the second adhesive layer.

[0354] The display device further includes a reinforcing substrate, and the thickness of the reinforcing substrate is in the range of 0.1 mm to 1.5 mm, and the thickness of the sealing structure is in the range of 30 μm to 300 μm.

[0355] The thickness of each of the first adhesive layer and the second adhesive layer is in the range of 10 μm to 100 μm.

[0356] The first adhesive layer is made of a polymer material selected from the group including an olefin-based polymer, an epoxy-based polymer, and an acrylate-based polymer, and the second adhesive layer is made of a polymer material that does not contain a carboxyl group.

[0357] The second adhesive layer is made of a polymer material selected from the group including an olefin-based polymer, an epoxy-based polymer, an acrylate-based polymer, an amine-based polymer, a phenol-based polymer, and an acid anhydride-based polymer, and each of them does not contain a carboxyl group.

[0358] The first adhesive layer further includes particles made of a metal material and an inorganic filler made of at least one selected from CaO, MgO, and BaO.

[0359] The barrier layer is made of a metallic material having an elongation greater than 4% and a yield strength value less than 360 Mpa.

[0360] The metallic material includes a metallic material selected from Al, Cu, Sn, Ag, Fe, Zn, or an alloy thereof.

[0361] The barrier layer is made of an inorganic insulating material including silicon oxide (SiO x ) or silicon oxynitride (SiON x ).

[0362] The thickness of the barrier layer is greater than 10 μm and less than the thickness of each of the first adhesive layer and the second adhesive layer.

[0363] The sealing structure further includes a protection structure that faces the reinforcing substrate and is positioned between the second adhesive layer and the reinforcing substrate, wherein the protection structure includes a protective layer, an adhesive reinforcing film having one surface facing the second adhesive layer and the other surface facing the protective layer, and an antistatic coating film having one surface facing the other surface of the protective layer and the other surface facing the reinforcing substrate.

[0364] The protection structure constitutes the topmost layer of the sealing structure.

[0365] The protective layer is made of an insulating material including polyethylene terephthalate.

[0366] The antistatic coating film allows the sheet resistance of the protective layer to remain at 10 10 Ω / sq.

[0367] The thickness of the protective layer is greater than 30 μm and less than 100 μm to prevent an external impact from being applied to the array substrate and, at the same time, to prevent damage to the array substrate due to bending of the array substrate.

[0368] The sealing structure further includes at least one of the following: a first auxiliary barrier layer that is disposed between the first adhesive layer and the barrier layer and is made of an inorganic insulating material; and a second auxiliary barrier layer that is disposed between the second adhesive layer and the barrier layer and is made of an inorganic insulating material.

[0369] The barrier layer has a structure in which a first metal film and a second metal film including different metallic materials are sequentially stacked.

[0370] The barrier layer has a structure in which a first inorganic insulating film and a second inorganic insulating film including different inorganic insulating materials are sequentially stacked.

[0371] The reinforcing substrate is made of a metallic material selected from Al, Cu, Sn, Ag, Fe, Zn, or an alloy thereof.

[0372] The apparatus further includes: a printed circuit board disposed on a reinforcement substrate; at least one flexible circuit board, one side of which is connected to the printed circuit board and the other side of which is connected to pads disposed in a non-display area of the array substrate; and a bottom cover for accommodating therein the array substrate, the sealing structure, the reinforcement substrate, at least one flexible circuit board, and the printed circuit board, and being coupled to the reinforcement substrate, wherein the printed circuit board is disposed between the reinforcement substrate and the bottom cover.

[0373] One side edge of the sealing structure adjacent to the pads of the array substrate is spaced apart from the pads of the array substrate by a first spacing; one side edge of the reinforcement substrate adjacent to the pads of the array substrate is spaced apart from the pads of the array substrate by a second spacing greater than the first spacing, and the width of the reinforcement substrate is smaller than the width of the sealing structure, such that a part of the topmost surface of the sealing structure is exposed.

[0374] The area of the reinforcement substrate has at least the same size as the display area, or the reinforcement substrate extends from the display area to the non-display area such that the area of the reinforcement substrate has a size greater than the size of the display area.

[0375] When the thickness of the reinforcement substrate increases, the second spacing by which the reinforcement substrate is spaced apart from one side edge of the sealing structure increases, wherein the reinforcement substrate is disposed inwardly relative to one side edge of the sealing structure.

[0376] The reinforcement substrate has a width smaller than the width of the sealing structure such that when the thickness of the reinforcement substrate increases, the reinforcement substrate is displaced in a range of 10% to 55%, which range represents what portion of the width of the non-display area overlaps with the reinforcement substrate, such that a part of the topmost surface of the sealing structure is exposed.

[0377] The array substrate, the sealing structure, and the reinforcement substrate are sequentially stacked to form a stepped shape at at least one side of the stacked structure, wherein the stepped shape has: a lower portion that is an exposed portion of the non-display area of the array substrate; an intermediate portion that is an exposed portion of the top surface of the sealing structure; and an upper portion that is the exposed top surface of the reinforcement substrate.

[0378] The top surface of the sealing structure is the top surface of the second adhesive layer or the top surface of a protective structure disposed on the second adhesive layer of the sealing structure.

[0379] The bottom cover is coupled to the reinforcement substrate via at least one adhesive pattern disposed between the reinforcement substrate and the bottom cover.

[0380] According to another aspect of the present disclosure, a method for manufacturing a display device is provided, including the following steps: providing an array substrate having a light-emitting array including a plurality of light-emitting elements respectively corresponding to a plurality of pixel regions; providing a sealing structure, wherein the sealing structure includes a first adhesive layer and a second adhesive layer opposite to each other, and a barrier layer disposed between the first adhesive layer and the second adhesive layer; and disposing the sealing structure on the array substrate such that the light-emitting array is sealed by the first adhesive layer.

[0381] The method further includes preparing a plate-shaped reinforcing substrate; and attaching the reinforcing substrate to the second adhesive layer.

[0382] The sealing structure further includes a protection structure located on the second adhesive layer.

[0383] Although the embodiments of the present disclosure have been described in more detail with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments. Within the scope not departing from the technical idea of the present disclosure, the present disclosure can be implemented in various modified ways. Therefore, the embodiments disclosed in the present disclosure are not intended to limit the technical idea of the present disclosure, but to describe the present disclosure. The scope of the technical idea of the present disclosure is not limited by the embodiments. Therefore, it should be understood that the above embodiments are illustrative and non-limiting in all aspects. The protection scope of the present disclosure should be interpreted by the claims, and all technical ideas within the scope of the present disclosure should be interpreted as being included within the scope of the present disclosure.

Claims

1. A display device, comprising: an array substrate having a display area and a non-display area disposed outside the display area, and having a light-emitting array including a plurality of light-emitting elements respectively corresponding to a plurality of pixel areas in the display area, wherein the array substrate includes a first surface that emits light and a second surface opposite to the first surface; a reinforcement substrate facing the array substrate; and a sealing structure disposed on the second surface of the array substrate to seal the light-emitting array and fix the reinforcement substrate to the array substrate, wherein the sealing structure includes: a first adhesive layer facing the array substrate, disposed on the light-emitting array, and sealing the light-emitting array; a barrier layer disposed on the first adhesive layer; and a second adhesive layer facing the reinforcement substrate and disposed on the barrier layer, wherein the reinforcement substrate is disposed on the second adhesive layer, and wherein the thickness of the barrier layer is greater than 10 μm and less than the thickness of each of the first adhesive layer and the second adhesive layer.

2. The display device according to claim 1, wherein, the thickness of the reinforcement substrate is in the range of 0.1 mm to 1.5 mm, wherein the thickness of the sealing structure is in the range of 30 μm to 300 μm.

3. The display device according to claim 1, wherein, the thickness of each of the first adhesive layer and the second adhesive layer is in the range of 10 μm to 100 μm.

4. The display device according to claim 1, wherein, the first adhesive layer is made of a polymer material selected from the group consisting of olefin-based polymers, epoxy-based polymers, and acrylate-based polymers, wherein the second adhesive layer is made of a polymer material without carboxyl groups.

5. The display device according to claim 4, wherein, the second adhesive layer is made of a polymer material selected from the group consisting of olefin-based polymers, epoxy-based polymers, acrylate-based polymers, amine-based polymers, phenol-based polymers, and anhydride-based polymers, and each of them is without carboxyl groups.

6. The display device according to claim 4, wherein, the first adhesive layer further includes particles made of a metal material and an inorganic filler composed of at least one selected from CaO, MgO, and BaO.

7. The display device according to claim 1, wherein, the barrier layer is made of a metal material having an elongation rate greater than 4% and a yield strength value less than 360 Mpa.

8. The display device according to claim 7, wherein, the metal material includes a metal material selected from Al, Cu, Sn, Ag, Fe, Zn, or an alloy thereof.

9. The display device according to claim 1, wherein, The barrier layer is made of an inorganic insulating material, and the inorganic insulating material includes silicon oxide (SiO x ) or silicon oxynitride (SiON x ).

10. The display device according to claim 1, wherein, the sealing structure further includes a protection structure facing the reinforcement substrate and positioned between the second adhesive layer and the reinforcement substrate.

11. The display device according to claim 10, wherein, The protection structure includes a protective layer, an adhesive reinforcement film with one surface facing the second adhesive layer and the other surface facing one surface of the protective layer, and an antistatic coating film with one surface facing the other surface of the protective layer and the other surface facing the reinforcement substrate.

12. The display device according to claim 10, wherein, the protection structure forms the topmost layer of the sealing structure.

13. The display device according to claim 11, wherein, the protective layer is made of an insulating material including polyethylene terephthalate.

14. The display device according to claim 11, wherein, The antistatic coating film allows the sheet resistance of the protective layer to remain at 10 10 Ω / sq.

15. The display device according to claim 11, wherein, the thickness of the protective layer is greater than 30 μm and less than 100 μm to prevent external impact from being applied to the array substrate and at the same time prevent damage to the array substrate caused by bending of the array substrate.

16. The display device according to claim 1, wherein, the sealing structure further includes at least one of the following: a first auxiliary barrier layer, which is disposed between the first adhesive layer and the barrier layer and made of an inorganic insulating material; and a second auxiliary barrier layer, which is disposed between the second adhesive layer and the barrier layer and made of the inorganic insulating material.

17. The display device according to claim 1, wherein, the barrier layer has a structure in which a first metal film and a second metal film respectively including different metal materials are sequentially stacked.

18. The display device according to claim 1, wherein, the barrier layer has a structure in which a first inorganic insulating film and a second inorganic insulating film respectively including different inorganic insulating materials are sequentially stacked.

19. The display device according to claim 2, wherein, the reinforcement substrate is made of a metal material selected from Al, Cu, Sn, Ag, Fe, Zn or an alloy thereof.

20. The display device according to claim 1, wherein, the display device further includes: a printed circuit board positioned on the reinforcement substrate; at least one flexible circuit board, one side of which is connected to the printed circuit board and the other side of which is connected to a pad located in the non-display area of the array substrate; and a bottom cover coupled to the reinforcement substrate, wherein the printed circuit board is disposed between the reinforcement substrate and the bottom cover.

21. The display device according to claim 20, wherein, the flexible circuit board further includes: an integrated circuit chip mounted on the flexible circuit board and disposed in an overlapping area between the reinforcement substrate and the flexible circuit board such that the flexible circuit board is spaced apart from the reinforcement substrate.

22. The display device according to claim 20, wherein, one side edge of the sealing structure adjacent to the pad of the array substrate is spaced apart from the pad of the array substrate by a first distance, wherein one side edge of the reinforcement substrate adjacent to the pad of the array substrate is spaced apart from the pad of the array substrate by a second distance greater than the first distance. Wherein, the width of the reinforcing substrate is smaller than the width of the sealing structure, such that a part of the topmost surface of the sealing structure is exposed.

23. The display device according to claim 22, wherein, the area of the reinforcing substrate has at least the same size as the display area, or the reinforcing substrate extends from the display area to the non-display area, such that the area of the reinforcing substrate has a size larger than the size of the display area.

24. The display device according to claim 22, wherein, when the thickness of the reinforcing substrate increases, a second distance by which the reinforcing substrate is spaced apart from a side edge of the sealing structure increases, wherein the reinforcing substrate is disposed inwardly relative to a side edge of the sealing structure.

25. The display device according to claim 22, wherein, the width of the reinforcing substrate is smaller than the width of the sealing structure, such that when the thickness of the reinforcing substrate increases, the reinforcing substrate is displaced in a range of 10% to 55%, such that a part of the topmost surface of the sealing structure is exposed, and the range represents what portion of the width of the non-display area overlaps with the reinforcing substrate.

26. The display device according to claim 1, wherein, the array substrate, the sealing structure, and the reinforcing substrate are sequentially stacked to form a stepped shape at at least one side of the stacked structure, wherein the stepped shape has: a lower portion that is an exposed portion of the non-display area of the array substrate; an intermediate portion that is an exposed portion of the top surface of the sealing structure; and an upper portion that is the exposed top surface of the reinforcing substrate.

27. The display device according to claim 26, wherein, the top surface of the sealing structure is the top surface of the second adhesive layer or the top surface of a protective structure provided on the second adhesive layer of the sealing structure.

28. The display device according to claim 20, wherein, the bottom cover is coupled to the reinforcing substrate via at least one adhesive pattern provided between the reinforcing substrate and the bottom cover.

29. The display device according to claim 1, wherein, the reinforcing substrate is plate-shaped.

30. The display device according to claim 1, wherein, the array substrate has a light-emitting surface and a non-light-emitting surface opposite to the light-emitting surface, and the light-emitting array is provided on the non-light-emitting surface of the array substrate.

31. The display device according to claim 30, wherein, the thickness of the sealing structure is smaller than the thickness of the reinforcing substrate.

32. The display device according to claim 30, wherein, the thickness of the barrier layer is smaller than the thickness of the reinforcing substrate.

33. The display device according to claim 30, wherein, the sealing structure has an area size larger than the area size of the reinforcing substrate.

34. The display device according to claim 32, wherein, three of the four side portions of the sealing structure overlap with the side portions of the reinforcing substrate, while the remaining one of the four side portions of the sealing structure does not overlap with the reinforcing substrate.

35. The display device according to claim 33, wherein, the area size of the barrier layer is larger than the area size of the reinforcing substrate.

36. A method for manufacturing a display device, comprising the following steps: providing an array substrate having a light-emitting array including a plurality of light-emitting elements respectively corresponding to a plurality of pixel regions, wherein the array substrate includes a first light-emitting surface and a second surface opposite to the first surface; providing a sealing structure, wherein the sealing structure includes a first adhesive layer and a second adhesive layer opposite to each other, and a barrier layer disposed between the first adhesive layer and the second adhesive layer, and the first adhesive layer is disposed on the light-emitting array and seals the light-emitting array, the barrier layer is disposed on the first adhesive layer, and the second adhesive layer is disposed on the barrier layer; and disposing the sealing structure on the second surface of the array substrate such that the light-emitting array is sealed by the first adhesive layer; preparing a plate-shaped reinforcing substrate; and attaching the reinforcing substrate to the second adhesive layer, wherein the thickness of the barrier layer is greater than 10 μm and less than the thickness of each of the first adhesive layer and the second adhesive layer.

37. The method according to claim 36, wherein, the sealing structure further includes a protection structure disposed on the second adhesive layer.

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