Display device

Abstract

A display device is provided. The display device includes a base layer including a display area and a non-display area, a display device layer disposed on the base layer to overlap the display area, an encapsulation layer disposed on the display device layer, a touch sensor disposed on the encapsulation layer, a first pad disposed on the base layer to overlap the non-display area, and a second pad disposed on the first pad, wherein one of the first pad and the second pad is electrically connected to one of the display device layer and the touch sensor.

Description

[0001] This application is a divisional application of the invention patent application filed by the applicant on July 31, 2017 with the State Intellectual Property Office of China, with application number 201710638744.X and invention title "Organic Light Emitting Display Module". Technical Field

[0002] This disclosure relates to a display device, and more specifically, to a display device integrating a touch sensing unit. Background Technology

[0003] Various display devices are being developed for use in multimedia devices such as televisions, mobile phones, desktop computers, navigation devices, and game consoles. These display devices include keyboards or mice as input units. Additionally, in recent years, display devices have incorporated touch-sensing components as input units. Summary of the Invention

[0004] This disclosure provides a display device that removes the step portion between the pad unit of the display panel and the pad unit of the touch sensing component to reduce defects that may occur during the manufacturing process.

[0005] This disclosure also provides a display device with improved reliability when the boundary region between the active region and the pad region on the display panel is bent.

[0006] An embodiment of the inventive concept provides an organic light-emitting display module, comprising a substrate layer, a first circuit layer, a device layer, an encapsulation layer, a plurality of touch electrodes, a second circuit layer, and a boundary layer. The substrate layer includes an active region, a pad region, and a boundary region between the active region and the pad region. The first circuit layer is disposed on the active region of the substrate layer and includes a plurality of inorganic layers and a first conductive pattern. The device layer is disposed on the first circuit layer and includes an organic light-emitting device configured to generate light using an electrical signal provided from the first conductive pattern. The encapsulation layer is disposed on the device layer. The plurality of touch electrodes are disposed on the encapsulation layer. The second circuit layer is disposed on the pad region of the substrate layer and includes a plurality of inorganic layers and a second conductive pattern. The boundary layer is disposed on the boundary region of the substrate layer and includes an organic layer and a third conductive pattern configured to electrically connect the first conductive pattern to the second conductive pattern. The boundary layer may not include the inorganic layers disposed on the substrate layer.

[0007] In an embodiment, the plurality of inorganic layers of the first circuit layer may include a first functional layer that contacts the substrate layer, and the plurality of inorganic layers of the second circuit layer may include a second functional layer that directly contacts the substrate layer.

[0008] In an embodiment, the second conductive pattern may include display panel pads and touch sensing component pads. The display panel pads may be disposed on the second functional layer and electrically connected to the first conductive pattern. The touch sensing component pads may be disposed adjacent to the display panel pads on the second functional layer, electrically connected to the plurality of touch electrodes, and insulated from the first conductive pattern.

[0009] In an embodiment, the display panel pad may include: a lower display panel pad; and an upper display panel pad disposed on the lower display panel pad and electrically connected to the lower display panel pad.

[0010] In an embodiment, the touch sensing component pad may include: a lower touch sensing component pad; and an upper touch sensing component pad disposed on the lower touch sensing component pad.

[0011] In an embodiment, the first conductive pattern may include a transistor, which includes a control electrode, an input electrode, and an output electrode. The input electrode, the output electrode, the lower display panel pad, and the lower touch sensing component pad may be disposed on the same layer.

[0012] In an embodiment, the second conductive pattern may further include a dummy electrode disposed on the same layer as the control electrode.

[0013] In an embodiment, the organic light-emitting display module may further include a touch signal line extending from at least one of the plurality of touch electrodes to contact the touch sensing component pads.

[0014] In an embodiment, the second circuit layer may further include a plurality of insulating layers disposed between the upper display panel pads and the lower display panel pads, wherein the plurality of insulating layers may be disposed between the upper touch sensing component pads and the lower touch sensing component pads.

[0015] In one embodiment, the lower touch sensing component pad may be electrically insulated from the upper touch sensing component pad.

[0016] In one embodiment, the lower touch sensing component pad may be electrically connected to the upper touch sensing component pad.

[0017] In this embodiment, the upper display panel pad can contact the lower display panel pad, and the upper touch sensing component pad can contact the lower touch sensing component pad.

[0018] In an embodiment, the first functional layer and the second functional layer may respectively include a blocking layer and a buffer layer.

[0019] In an embodiment, the organic light-emitting display module may further include a driving circuit that is superimposed on the pad area and configured to control the flow of electrical signals between the display panel pads and the first conductive pattern.

[0020] In an embodiment, the first circuit layer may further include an organic layer disposed on the first conductive pattern, and the boundary layer may further include an organic layer disposed on the third conductive pattern.

[0021] In this embodiment, the boundary region of the matrix layer and the boundary layer may be flexible.

[0022] In an embodiment of the inventive concept, the organic light-emitting display device includes an organic light-emitting display panel and a touch-sensing component disposed on the organic light-emitting display panel.

[0023] In an embodiment, the organic light-emitting display panel may include a substrate layer, a conductive pattern, a device layer, and an encapsulation layer. The substrate layer may include an active region, a pad region, and a boundary region between the active region and the pad region. The conductive pattern may be superimposed on the active region, disposed on the substrate layer, formed using a low-temperature polycrystalline silicon (LTPS) process, and includes display panel pads and touch-sensing component pads disposed adjacent to the display panel pads, wherein the touch-sensing component pads and the display panel pads can receive electrical signals from the outside. The device layer may be disposed on the conductive pattern and includes an organic light-emitting device configured to generate light using electrical signals provided from the conductive pattern. The encapsulation layer may be disposed on the device layer.

[0024] In one embodiment, the touch sensing component may include a plurality of touch electrodes and a plurality of touch signal lines. The plurality of touch electrodes may be disposed on an encapsulation layer. The plurality of touch signal lines may extend from the plurality of touch electrodes and be electrically connected to a conductive pattern, wherein a portion of the touch signal lines overlapping with the boundary region may be disposed between two organic layers.

[0025] In an embodiment, the organic light-emitting display device may further include a printed circuit board electrically connected to the touch sensing component pads and the display panel pads, wherein the portions of the organic light-emitting display panel and the touch sensing component that overlap with the boundary region can be bent.

[0026] In embodiments of the inventive concept, the organic light-emitting display module includes a substrate layer, a first functional layer, a plurality of transistors, a device layer, an encapsulation layer, a plurality of touch electrodes, a second functional layer, a first display panel pad, a first touch sensing component pad, a second display panel pad, a second touch sensing component pad, and a boundary layer.

[0027] In an embodiment, the substrate layer may include an active region, a pad region, and a boundary region between the active region and the pad region. A first functional layer may be disposed on the active region of the substrate layer and includes inorganic material. The plurality of transistors may be disposed on the first functional layer. The device layer may include an organic light-emitting device configured to generate light by using an electrical signal provided from at least one of the plurality of transistors. An encapsulation layer may be disposed on the device layer and includes organic and inorganic materials. The plurality of touch electrodes may be disposed on the encapsulation layer. A second functional layer may be disposed on the pad region of the substrate layer and includes inorganic material. A first display panel pad may be disposed on the second functional layer and electrically connected to at least one of the plurality of transistors. A first touch sensing component pad may be configured to be adjacent to the first display panel pad on the second functional layer and insulated from the plurality of transistors. A second display panel pad may be disposed on the first display panel pad and electrically connected to the first display panel pad. A second touch sensing component pad may be disposed on the first touch sensing component pad and electrically connected to at least one of the plurality of touch electrodes. A boundary layer may be disposed on the boundary region of the substrate layer and includes organic material. The boundary layer does not include the inorganic layer set on the matrix layer. Attached Figure Description

[0028] The accompanying drawings are included to provide a further understanding of the inventive concept, and are incorporated in and form a part of this specification. The drawings illustrate exemplary embodiments of the inventive concept and, together with the description, serve to explain the principles of the inventive concept. In the drawings:

[0029] Figure 1A This is a perspective view showing a first operating mode of a display device according to an embodiment of the inventive concept;

[0030] Figure 1B This is a perspective view showing a second operating mode of a display device according to an embodiment of the inventive concept;

[0031] Figure 1C This is a perspective view showing a third operating mode of a display device according to an embodiment of the inventive concept;

[0032] Figure 2A This is a perspective view showing a first operating mode of a display device according to an embodiment of the inventive concept;

[0033] Figure 2B This is a perspective view showing a second operating mode of a display device according to an embodiment of the inventive concept;

[0034] Figure 3 This is a cross-sectional view of a display device according to an embodiment of the inventive concept;

[0035] Figure 4This is a cross-sectional view of a display module according to an embodiment of the inventive concept;

[0036] Figure 5 This is a plan view of an organic light-emitting display panel according to an embodiment of the inventive concept;

[0037] Figure 6 It is an equivalent circuit diagram of a pixel according to an embodiment of the inventive concept;

[0038] Figure 7 and Figure 8 This is a partial cross-sectional view of an organic light-emitting display panel according to an embodiment of the inventive concept;

[0039] Figure 9 This is a plan view of a touch sensing component according to an embodiment of the inventive concept;

[0040] Figure 10 Yes Figure 9 A magnified view of part of AA;

[0041] Figure 11 It is along Figure 10 A sectional view taken by line I-I';

[0042] Figure 12 yes Figure 5 and Figure 9 A view of the display panel pads and touch sensing component pads;

[0043] Figure 13A It is along Figure 12 A sectional view taken from line II-II';

[0044] Figure 13B It is along Figure 12 A sectional view taken from line III-III';

[0045] Figure 13C It is along Figure 12 A sectional view taken by line IV-IV';

[0046] Figure 14A It is along Figure 12 A sectional view taken from line II-II';

[0047] Figure 14B It is along Figure 12 A sectional view taken from line III-III';

[0048] Figure 14C and Figure 14D It is along Figure 12 A sectional view taken by line IV-IV';

[0049] Figure 15A It is along Figure 12A sectional view taken from line II-II';

[0050] Figure 15B It is along Figure 12 A sectional view taken from line III-III';

[0051] Figure 15C It is along Figure 12 A sectional view taken by line IV-IV';

[0052] Figure 16A It is along Figure 12 A sectional view taken from line II-II';

[0053] Figure 16B It is along Figure 12 A sectional view taken from line III-III';

[0054] Figure 16C It is along Figure 12 A sectional view taken by line IV-IV';

[0055] Figure 17A It is along Figure 12 A sectional view taken from line II-II';

[0056] Figure 17B It is along Figure 12 A sectional view taken from line III-III';

[0057] Figure 17C and Figure 17D It is along Figure 12 A sectional view taken by line IV-IV';

[0058] Figure 18A It is along Figure 12 A sectional view taken from line II-II';

[0059] Figure 18B It is along Figure 12 A sectional view taken from line III-III';

[0060] Figure 18C It is along Figure 12 A sectional view taken by line IV-IV';

[0061] Figure 19A It is along Figure 12 A sectional view taken from line II-II';

[0062] Figure 19B It is along Figure 12 A sectional view taken from line III-III';

[0063] Figure 19C It is along Figure 12A sectional view taken by line IV-IV';

[0064] Figure 20A It is along Figure 12 A sectional view taken from line II-II';

[0065] Figure 20B It is along Figure 12 A sectional view taken from line III-III';

[0066] Figure 20C It is along Figure 12 A sectional view taken by line IV-IV';

[0067] Figure 21A It is along Figure 12 A sectional view taken from line II-II';

[0068] Figure 21B It is along Figure 12 A sectional view taken from line III-III';

[0069] Figure 21C It is along Figure 12 A sectional view taken by line IV-IV';

[0070] Figure 22 and Figure 23 This is a plan view of the display module and printed circuit board according to an embodiment of the inventive concept; and

[0071] Figure 24 This is a view showing the curved shape of a display module according to an embodiment of the inventive concept. Detailed Implementation

[0072] In the following description, embodiments of the inventive concept will be described with reference to the accompanying drawings. It will also be understood in this specification that when a component (or region, layer, portion) is referred to as being "on" another component, "connected to" or "integrated into" another component, the component may be directly disposed on / directly connected to / integrated into said other component, or there may be an intermediate third component.

[0073] The same reference numerals always denote the same elements. Additionally, in the drawings, for clarity, the thickness, proportions, and dimensions of components are exaggerated. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0074] It will be understood that although terms such as “first” and “second” are used herein to describe various elements, these elements should not be limited by these terms. Terms are used only to distinguish one component from others. For example, an element referred to as a first element in one embodiment may be referred to as a second element in another embodiment without departing from the scope of the appended claims. Unless otherwise indicated, singular terms may include plural forms.

[0075] Additionally, to explain the relationships between components shown in the accompanying drawings, terms such as "below," "under," "above," and "over" are used. These terms can be relative concepts and are described based on the directions expressed in the accompanying drawings.

[0076] The meaning of "includes" or "contains" indicates a property, a fixed quantity, a step, an operation, an element, a component, or a combination thereof, but does not exclude other properties, fixed quantities, steps, operations, elements, components, or combinations thereof.

[0077] Figure 1A This is a perspective view showing a first operating mode of a display device DD according to an embodiment of the inventive concept. Figure 1B This is a perspective view showing a second operating mode of the display device DD according to an embodiment of the inventive concept. Figure 1C This is a perspective view showing a third operating mode of a display device DD according to an embodiment of the inventive concept.

[0078] like Figure 1A As shown, in the first operating mode, the display surface IS on which the image IM is displayed is parallel to the surface defined by the first direction axis DR1 and the second direction axis DR2. The normal direction of the display surface IS (i.e., the thickness direction of the display device DD) is indicated by the third direction axis DR3. The front surface (or top surface) and rear surface (or bottom surface) of each component are distinguished by the third direction axis DR3. However, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 can be relative concepts and therefore can become different directions. In the following, the first direction to the third direction can be the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3, respectively, and can be indicated by the same reference numerals. Although a flexible display device is shown in the present embodiment, embodiments of the inventive concept are not limited thereto. The display device DD according to the present embodiment can be a rigid display device.

[0079] Figures 1A to 1C An example of a foldable display device as a flexible display device DD is shown. Figure 2A and Figure 2BAn example of a foldable display device as a flexible display device DD is shown. Alternatively, the display device DD may be a rollable flexible display device, but is not specifically limited thereto. The flexible display device DD according to embodiments of the inventive concept can be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, desktop PCs, navigation units for vehicles, game consoles, and smartwatches.

[0080] like Figure 1A As shown, the display surface IS of the flexible display device DD may include multiple regions. The flexible display device DD includes a display region DD-DA on which an image IM is displayed and a non-display region DD-NDA adjacent to the display region DD-DA. The non-display region DD-NDA may be a region on which no image is displayed. Figure 1A An example of an image IM is shown, depicting a vase. For example, the display area DD-DA can have a rectangular shape. The non-display area DD-NDA can surround the display area DD-DA. However, embodiments of the inventive concept are not limited to this. For example, the shapes of the display area DD-DA and the non-display area DD-NDA can be designed relative to each other.

[0081] The flexible display device DD may include a housing HS. The housing HS may be disposed outside the flexible display device DD to house internal components. In the following description, for ease of description, the housing HS may be shown separately or not described.

[0082] like Figures 1A to 1C As shown, the display device DD may include multiple regions defined according to the form of operation. The display device DD may include a curved region BA that is curved with respect to the bending axis BX, a first non-curved region NBA1 that is not curved, and a second non-curved region NBA2 that is not curved. For example... Figure 1B As shown, the display device DD can be bent inward so that the display surface IS of the first non-bent region NBA1 and the display surface IS of the second non-bent region NBA2 face each other. Figure 1C As shown, the display device DD can be bent outwards to expose the display surface IS to the outside.

[0083] In embodiments of the inventive concept, the display device DD may include a plurality of curved regions BA. Furthermore, the curved regions BA may be configured to correspond to operations performed by a user for manipulating the display device DD. For example, with... Figure 1B and Figure 1C Unlike other methods, the curved region BA can be formed parallel to the first direction axis DR1 or formed diagonally. The curved region BA can have a variable surface area determined by its radius of curvature. In embodiments of the inventive concept, the display device DD can have only repeating... Figure 1A and Figure 1B The shape of the operation mode.

[0084] Figure 2A This is a perspective view showing a first operating mode of a display device according to an embodiment of the inventive concept. Figure 2B This is a perspective view showing a second operating mode of a display device according to an embodiment of the inventive concept. Figure 2A and Figure 2B A display device with a folded non-display area DD-NDA is shown as an example of a foldable display device DD. As described above, the display device DD according to the embodiment of the inventive concept does not limit the number of curved areas BA and non-curved areas NBA, nor the position of the curved areas.

[0085] Figure 3 This is a cross-sectional view of a display device DD according to an embodiment of the inventive concept. Figure 4 This is a cross-sectional view of a display module DM according to an embodiment of the inventive concept. Figure 3 A sectional view is shown, defined by the second directional axis DR2 and the third directional axis DR3. Figure 4 A cross-sectional view is shown, defined by the first directional axis DR1 and the third directional axis DR3.

[0086] like Figure 3 As shown, the display device DD includes a protective film PM, a window WM, a display module DM, a first adhesive member AM1, and a second adhesive member AM2. The display module DM is disposed between the protective film PM and the window WM. The first adhesive member AM1 is bonded to the display module DM and the protective film PM, and the second adhesive member AM2 is bonded to the display module DM and the window WM. In embodiments of the inventive concept, the first adhesive member AM1 and the second adhesive member AM2 can be omitted. The protective film PM and the window WM can be continuously manufactured by a coating process.

[0087] The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface AS1 bonded to the first adhesive member AM1. The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external impacts.

[0088] The protective film PM may include a plastic film. The protective film PM may include one selected from the group consisting of polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl compounds, polyimide (PI), polycarbonate (PC), poly(aryl ether sulfone), and combinations thereof.

[0089] The materials used to form the protective film PM are not limited to plastic resins. For example, the protective film PM may include organic / inorganic composite materials. The protective film PM may include a porous organic layer and an inorganic material filling the pores of the porous organic layer. The protective film PM may also include a functional layer disposed on the plastic film. The functional layer may include a resin layer. The functional layer can be formed by a coating process.

[0090] The window WM protects the display module DM from external impacts and provides an input surface for the user. The window WM provides a second external surface OS-U exposed to the outside and an adhesive surface AS2 bonded to the second adhesive member AM2. Figures 1A to 1C The display surface IS can be the second outer surface OS-U.

[0091] exist Figure 2A and Figure 2B In the display device DD, the window WM may not be located on the curved region BA. However, embodiments of the inventive concept are not limited to this. For example, in another embodiment of the inventive concept, the window WM may also be located on the curved region BA.

[0092] The display module DM includes an organic light-emitting display panel DP and a touch sensing unit TS, which are integrally formed through a continuous process. The organic light-emitting display panel DP generates an image corresponding to the input image data (see...). Figure 1A (Referring to the reference numeral IM in the attached figure). The organic light-emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing each other in the thickness direction DR3.

[0093] The touch sensing unit TS acquires coordinate information from external input. The touch sensing unit TS can be directly disposed on the surface BS1-U of the second display panel. In the current embodiment, the touch sensing unit TS can be manufactured together with the organic light-emitting display panel DP through a continuous process.

[0094] Although not shown separately, the display module DM according to embodiments of the inventive concept may also include an anti-reflective layer. The anti-reflective layer may include a color filter, a stacked structure of conductive / dielectric / conductive layers, or an optical component. The anti-reflective layer may absorb, destructively interfere with, or polarize externally incident light to reduce the reflectivity of external light.

[0095] Each of the first adhesive member AM1 and the second adhesive member AM2 may be an optically transparent adhesive film (OCA), an optically transparent resin (OCR), or a pressure-sensitive adhesive film (PSA). Each of the first adhesive member AM1 and the second adhesive member AM2 may include a photocurable adhesive material or a thermocurable adhesive material. However, embodiments of the inventive concept are not specifically limited thereto.

[0096] Although not specifically shown, the display device DD may also include a frame structure supporting the functional layers to maintain... Figures 1A to 2B The state is shown in the diagram. The frame structure may include a hinged structure or a hinged chain structure.

[0097] like Figure 4 As shown, the organic light-emitting display panel DP includes a substrate layer SUB, a first circuit layer CL1 disposed on the substrate layer SUB, a light-emitting device layer ELL, and a thin film encapsulation layer TFE. The substrate layer SUB may include at least one plastic film. The substrate layer SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite substrate as a flexible substrate.

[0098] The first circuit layer CL1 may include multiple insulating layers, multiple conductive layers, and a semiconductor layer. The multiple conductive layers of the first circuit layer CL1 may constitute signal lines or circuit portions of a pixel. The light-emitting device layer ELL may include an organic light-emitting diode (OLED). A thin-film encapsulation layer TFE seals the light-emitting device layer ELL. The thin-film encapsulation layer TFE may include at least two inorganic thin films and an organic thin film disposed between the at least two inorganic thin films. The thin-film encapsulation layer TFE can protect the light-emitting device layer ELL from external substances such as moisture and dust particles.

[0099] In the current embodiment of the inventive concept, the touch sensing unit TS can be a single-layer type. That is, the touch sensing unit TS can include a single conductive layer. Here, a single conductive layer means that "the conductive layer is not divided by an insulating layer". The stacked structure of the first metal layer / second metal layer / metal oxide layer can correspond to a single conductive layer because the first metal layer and the second metal layer are not insulated by the metal oxide layer, while the stacked structure of the first metal layer / insulating layer / metal oxide layer can correspond to a double conductive layer.

[0100] A single conductive layer can be patterned to form multiple touch electrodes and multiple touch signal lines. That is, the sensor of the touch sensing unit TS can be disposed on the same layer. The sensor can be directly disposed on the thin-film encapsulation layer TFE. Additionally, a portion of each touch signal line can be disposed on the same layer as the sensor. A portion of each touch signal line can be disposed on the first circuit layer CL1. The structure of the touch sensing unit TS will be described in detail later.

[0101] Each of the touch signal lines and sensors may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. Each of the touch signal lines and sensors may include a metal layer such as molybdenum, silver, titanium, copper, aluminum, and alloys thereof. The touch signal lines and sensors may be made of the same material or different materials from each other.

[0102] Compared to the structure of a display module DM that includes multi-layered touch sensing components, the display module DM according to embodiments of the inventive concept may include single-layered touch sensing components to simplify its structure. Although the display module DM is bent... Figure 1B and Figure 1C As shown in the figure, however, because the touch sensing unit TS is slender, the stress generated in the touch sensing unit TS can be reduced.

[0103] Figure 5 This is a plan view of an organic light-emitting display panel DP according to an embodiment of the inventive concept. Figure 6 This is an equivalent circuit diagram of a pixel PX according to an embodiment of the inventive concept. Figure 7 and Figure 8 This is a partial cross-sectional view of an organic light-emitting display panel DP according to an embodiment of the inventive concept.

[0104] like Figure 5 As shown, the organic light-emitting display panel DP includes a display area DA and a non-display area NDA. The display area DA and non-display area NDA of the organic light-emitting display panel DP may correspond to the display area DD-DA and non-display area DD-NDA of the display device DD, respectively. However, the display area DA and non-display area NDA of the organic light-emitting display panel DP do not necessarily need to correspond to the display area DD-DA and non-display area DD-NDA of the display device DD, respectively. For example, the display area DA and non-display area NDA of the organic light-emitting display panel DP can vary depending on the structure / design of the organic light-emitting display panel DP.

[0105] An organic light-emitting display panel (DP) may include multiple signal lines (SGL) and multiple pixels (PX). The area on which the multiple pixels (PX) are disposed can be defined as the display area (DA). In the current embodiment, the non-display area (NDA) may be defined as along the edge of the display area (DA) and surrounding the display area (DA).

[0106] The multiple signal lines SGL include gate line GL, data line DL, power line PL, and control signal line CSL. Gate line GL is connected to a corresponding pixel among the multiple pixels PX, and data lines DL are also connected to corresponding pixels PX. Power line PL is connected to the multiple pixels PX. The gate drive circuit DCV, connected to gate line GL, can be located on the non-display area NDA side. The control signal line CSL provides control signals to the gate drive circuit DCV.

[0107] A portion of the gate line GL, data line DL, power line PL, and control signal line CSL can be located on the same layer, while other portions can be located on different layers. When a signal line located on one layer is defined as a first signal line, a signal line located on a different layer can be defined as a second signal line. A signal line located on yet another layer can be defined as a third signal line.

[0108] Each of the gate line GL, data line DL, power line PL, and control signal line CSL may include a signal line unit and a lower pad PD-D connected to the end of the signal line unit. A signal line unit can be defined as the portion other than the lower pad PD-D of each of the gate line GL, data line DL, power line PL, and control signal line CSL.

[0109] In embodiments of the inventive concept, the lower pad PD-D may include a lower display panel pad PD-DPD and a lower touch sensing component pad PD-TSD. The lower pad PD-D can be formed using the same process as the transistor used to drive the pixel PX. For example, the transistor for driving the pixel PX and the lower pad PD-D can be formed using the same low-temperature polysilicon (LTPS) process or low-temperature polysilicon oxide (LTPO) process.

[0110] In embodiments of the inventive concept, the lower display panel pads PD-DPD may include a control pad CSL-P, a data pad DL-P, and a power pad PL-P. Although the gate pad unit is not shown, it may be stacked with and connected to the gate drive circuit DCV. Although not specifically shown, the portion of the non-display area NDA on which the control pad CSL-P, data pad DL-P, and power pad PL-P are aligned is defined as the pad region. As described below, the pads of the touch sensing unit TS may be configured to be adjacent to the pads of the organic light-emitting display panel DP described above.

[0111] Figure 6 An example of a pixel PX connected to a gate line GL, a data line DL, and a power line PL is shown. However, embodiments of the inventive concept are not limited to the construction of the pixel PX. For example, the pixel PX can have various constructions.

[0112] A pixel (PX) includes an organic light-emitting diode (OLED) as a display device. The OLED can be a top-emitting diode or a bottom-emitting diode. The PX includes a first transistor (TFT1, or a switching transistor), a second transistor (TFT2, or a driving transistor), and a capacitor (CP) as circuit units for driving the OLED. The OLED generates light in response to electrical signals supplied from transistors TFT1 and TFT2. The cathode of the OLED is connected to a second power supply voltage (ELVSS).

[0113] The gate line GL can be used to receive the first power supply voltage (ELVDD). The first transistor TFT1 outputs a data signal applied to the data line DL in response to the scan signal applied to the gate line GL. The capacitor CP is charged with a voltage corresponding to the data signal received from the first transistor TFT1.

[0114] The second transistor TFT2 is connected to the organic light-emitting diode (OLED). TFT2 controls the driving current flowing through the OLED to correspond to the amount of charge stored in the capacitor CP. The OLED emits light during the conduction period of the second transistor TFT2.

[0115] Figure 7 Is with Figure 6 A cross-sectional view of the portion corresponding to the first transistor TFT1 and the capacitor CP in the equivalent circuit. Figure 8 Is with Figure 6 A cross-sectional view of the equivalent circuit of the second transistor TFT2 and the corresponding part of the organic light-emitting diode OLED.

[0116] like Figure 7 and Figure 8 As shown, a first circuit layer CL1 is disposed on a substrate layer SUB. A semiconductor pattern AL1 of a first transistor TFT1 (hereinafter referred to as the first semiconductor pattern) and a semiconductor pattern AL2 of a second transistor TFT2 (hereinafter referred to as the second semiconductor pattern) are disposed on the substrate layer SUB. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be selected from amorphous silicon, polycrystalline silicon, and metal-oxide-semiconductor. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed from the same material. Alternatively, the first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be formed from different materials.

[0117] The first circuit layer CL1 includes a first conductive pattern (see...). Figure 12 The attached diagram is labeled CDP1) and includes organic / inorganic layers BR, BF, 12, 14, and 16. The first conductive pattern (see attached diagram) Figure 12The reference numeral CDP1 may include a first transistor TFT1, a second transistor TFT2, and electrodes E1 and E2. The organic / inorganic layers BR, BF, 12, 14, and 16 may include first functional layers BR and BF, a first insulating layer 12, a second insulating layer 14, and a third insulating layer 16.

[0118] The first functional layers BR and BF can be disposed on one surface of the substrate layer SUB. The first functional layers BR and BF can include at least one of a barrier layer BR and a buffer layer BF. The first semiconductor pattern AL1 and the second semiconductor pattern AL2 can be disposed on the barrier layer BR or the buffer layer BF.

[0119] A first insulating layer 12 covering a first semiconductor pattern AL1 and a second semiconductor pattern AL2 is disposed on a substrate layer SUB. The first insulating layer 12 includes an organic layer and / or an inorganic layer. Specifically, the first insulating layer 12 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0120] The control electrode GE1 (hereinafter referred to as the first control electrode) of the first transistor TFT1 and the control electrode GE2 (hereinafter referred to as the second control electrode) of the second transistor TFT2 are disposed on the first insulating layer 12. The first electrode E1 of the capacitor CP is disposed on the first insulating layer 12. It can be connected to the gate line GL (see...) Figure 5 The first control electrode GE1, the second control electrode GE2, and the first electrode E1 are manufactured using the same photolithography process as the gate line GL. That is, the first control electrode GE1, the second control electrode GE2, and the first electrode E1 can be formed from the same material as the gate line GL, have the same stacked structure as the gate line GL, and are disposed on the same layer as the gate line GL.

[0121] A second insulating layer 14 covering the first control electrode GE1, the second control electrode GE2, and the first electrode E1 is disposed on the first insulating layer 12. The second insulating layer 14 includes an organic layer and / or an inorganic layer. Specifically, the second insulating layer 14 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer and a silicon oxide layer.

[0122] Data cable DL (see) Figure 5The input electrode SE1 (hereinafter referred to as the first input electrode) and output electrode DE1 (hereinafter referred to as the first output electrode) of the first transistor TFT1 are disposed on the second insulating layer 14. The input electrode SE2 (hereinafter referred to as the second input electrode) and output electrode DE2 (hereinafter referred to as the second output electrode) of the second transistor TFT2 are disposed on the second insulating layer 14. The first input electrode SE1 branches from the corresponding data line of the data line DL. The power line PL (see...) Figure 5 It can be placed on the same layer as the data line DL. The second input electrode SE2 can be branched from the power line PL.

[0123] The second electrode E2 of the capacitor CP is disposed on the second insulating layer 14. The second electrode E2 can be manufactured using the same photolithography process as that used for each of the data lines DL and PL. Furthermore, the second electrode E2 can be formed of the same material as each of the data lines DL and PL, have the same structure as each of the data lines DL and PL, and be disposed on the same layer as each of the data lines DL and PL.

[0124] The first input electrode SE1 and the first output electrode DE1 are connected to the first semiconductor pattern AL1 via a first via CH1 and a second via CH2 passing through the first insulating layer 12 and the second insulating layer 14, respectively. The first output electrode DE1 can be electrically connected to the first electrode E1. For example, the first output electrode DE1 can be connected to the first electrode E1 via a via (not shown) passing through the second insulating layer 14. The second input electrode SE2 and the second output electrode DE2 are connected to the second semiconductor pattern AL2 via a third via CH3 and a fourth via CH4 passing through the first insulating layer 12 and the second insulating layer 14, respectively. According to another embodiment of the inventive concept, each of the first transistor TFT1 and the second transistor TFT2 can have a bottom gate structure.

[0125] A third insulating layer 16 covering the first input electrode SE1, the first output electrode DE1, the second input electrode SE2, and the second output electrode DE2 is disposed on the second insulating layer 14. The third insulating layer 16 includes an organic layer and / or an inorganic layer. Specifically, the third insulating layer 16 may include an organic material to provide a flat surface.

[0126] One of the first insulating layer 12, the second insulating layer 14, and the third insulating layer 16 can be omitted depending on the pixel's circuit structure. Each of the second insulating layer 14 and the third insulating layer 16 can be defined as an interlayer dielectric layer. The interlayer dielectric layer can be disposed between the lower conductive pattern and the upper conductive pattern to insulate the conductive patterns from each other, with the lower conductive pattern disposed below the interlayer dielectric layer and the upper conductive pattern disposed above the interlayer dielectric layer.

[0127] The first circuit layer CL1 includes a dummy conductive pattern. The dummy conductive pattern is disposed on the same layer as the semiconductor patterns AL1 and AL2, control electrodes GE1 and GE2, or output electrodes DE1 and DE2. The dummy conductive pattern can be disposed in the non-display area NDA (see...). Figure 5 The dummy conductive pattern will then be described in detail.

[0128] A light-emitting device layer ELL is disposed on a third insulating layer 16. A pixel-defining layer PXL and an organic light-emitting diode (OLED) are disposed on the third insulating layer 16. An anode AE ​​is disposed on the third insulating layer 16. The anode AE ​​is connected to a second output electrode DE2 through a fifth via CH5 passing through the third insulating layer 16. An opening OP is defined in the pixel-defining layer PXL. The opening OP of the pixel-defining layer PXL exposes at least a portion of the anode AE.

[0129] The light-emitting device layer ELL may include an emitting region PXA and a non-emitting region NPXA adjacent to the emitting region PXA. The non-emitting region NPXA may surround the emitting region PXA. In the current embodiment, the emitting region PXA is defined as corresponding to the anode AE. However, embodiments of the inventive concept are not limited to the emitting region PXA described above. That is, if light is emitted from a region, that region may be defined as the emitting region PXA. The emitting region PXA may be defined as corresponding to a portion of the anode AE ​​exposed through the opening OP.

[0130] A hole control layer (HCL) can be commonly disposed on the emitter region PXA and the non-emitter region NPXA. Although not specifically shown, a common layer such as the hole control layer HCL can be commonly disposed on multiple pixels PX (see [link to relevant documentation]). Figure 5 )superior.

[0131] An organic light-emitting layer (EML) is disposed on a hole control layer (HCL). The EML can be configured to cover openings (OP). Adjacent EMLs are electrically isolated from each other.

[0132] The electronic control layer (ECL) is disposed on the organic light-emitting layer (EML). The cathode (CE) is disposed on the electronic control layer (ECL). The cathode (CE) is commonly disposed on multiple pixels (PX).

[0133] Although a patterned organic light-emitting layer (EML) is shown as an example in the current embodiment, the EML can be commonly disposed on multiple pixels (PX). Here, the EML can emit white light. Furthermore, the EML can have a multi-layer structure.

[0134] In the current embodiment, the thin-film encapsulation layer TFE directly covers the cathode CE. In the current embodiment, a coating layer covering the cathode CE may also be provided. Here, the thin-film encapsulation layer TFE directly covers the coating layer. The thin-film encapsulation layer TFE may include an organic layer containing organic materials and an inorganic layer containing inorganic materials.

[0135] Figure 9 This is a plan view of a touch sensing unit TS according to an embodiment of the inventive concept.

[0136] In the current embodiment, a single-layer capacitive touch sensing component TS is shown as an example. The single-layer capacitive touch sensing component TS can be driven in a self-capacitance manner or a mutual capacitance manner. However, embodiments of the inventive concept are not limited to the driving method used to acquire coordinate information. In addition, the touch sensing component TS is not limited to a single-layer structure. For example, the touch sensing component TS can have a two-layer structure.

[0137] The touch sensing component TS may include a first touch pattern TE1-1 to TE-3, a first touch signal line SL1, a second touch pattern TE2-1 to TE2-3, a second touch signal line SL2, and a pad PD-U on the touch sensing component pad.

[0138] The first touch patterns TE1-1 to TE1-3 extend in the first direction DR1 and are arranged in the second direction DR2. Each of the first touch patterns TE1-1 to TE1-3 may have a grid shape that defines a plurality of touch openings OP-TC.

[0139] Each of the first touch patterns TE1-1 to TE1-3 includes a plurality of first sensing patterns SP1 and a plurality of first connecting patterns CP1. The first sensing patterns SP1 are arranged on a first direction DR1. Each of the first connecting patterns CP1 connects two adjacent first sensing patterns SP1 arranged along the first direction DR1.

[0140] Each of the first touch signal lines SL1 can be connected to one end of the first touch patterns TE1-1 to TE1-3 and to a pad in the pad area. The first touch signal lines SL1 can have the same layer structure as the first touch patterns TE1-1 to TE1-3.

[0141] The second touch patterns TE2-1 to TE2-3 are insulated from and intersect with the first touch patterns TE1-1 to TE1-3. The second touch patterns TE2-1 to TE2-3 are insulated from the first touch patterns TE1-1 to TE1-3 by an insulating pattern IL-P. The insulating pattern IL-P may comprise inorganic or organic materials. Inorganic materials may comprise silicon oxide or silicon nitride. Organic materials may comprise at least one of acrylic resins, methacrylic resins, polyisoprene resins, vinyl resins, epoxy resins, polyurethane resins, cellulose resins, and perylene resins.

[0142] Each of the second touch patterns TE2-1 to TE2-3 may have a grid shape that defines multiple touch openings OP-TC.

[0143] Each of the second touch patterns TE2-1 to TE2-3 includes a plurality of second sensing patterns SP2 and a plurality of second connecting patterns CP2. The second sensing patterns SP2 are arranged on the second direction DR2. Each of the second connecting patterns CP2 connects two adjacent second sensing patterns SP2 arranged along the second direction DR2.

[0144] Each of the second connection patterns CP2 can have a bridging function. The insulating pattern IL-P is disposed on the first connection pattern CP1, and the second connection pattern CP2 is disposed on the insulating pattern IL-P.

[0145] Each of the second touch signal lines SL2 can also be connected to one end of the second touch patterns TE2-1 to TE2-3 and to a pad in the pad area. The second touch signal lines SL2 can have the same layer structure as the second touch patterns TE2-1 to TE2-3.

[0146] The first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are capacitively coupled to each other. Since the touch sensing signal is applied to the first touch patterns TE1-1 to TE1-3, a capacitor is placed between the first sensing pattern SP1 and the second sensing pattern SP2.

[0147] The shapes of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 are merely examples, and therefore, embodiments of the inventive concept are not limited thereto. For example, connecting patterns CP1 and CP2 may be defined as the portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 intersect each other, and sensing patterns SP1 and SP2 may be defined as the portions where the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 do not overlap each other. For example, each of the first touch patterns TE1-1 to TE1-3 and the second touch patterns TE2-1 to TE2-3 may have a strip shape with a predetermined width.

[0148] The touch sensor component pad PD-U can be disposed at the ends of the first touch signal line SL1 and the second touch signal line SL2. The touch sensor component pad PD-U can include the upper display panel pad PD-PDU and the upper touch sensor component pad PD-TSU. The touch sensor component pad PD-U can be formed using the same process as the first touch patterns TE1-1 to TE-3, the first touch signal line SL1, the second touch patterns TE2-1 to TE2-3, and the second touch signal line SL2.

[0149] Figure 10 yes Figure 9 A magnified view of part AA. Figure 11 It is along Figure 10 A sectional view taken from line I-I'.

[0150] The display area DA includes multiple emitting areas PXA and non-emitting areas NPXA surrounding the multiple emitting areas PXA. The first sensing pattern SP1 may have a grid shape superimposed on the non-emitting areas NPXA. Although not specifically shown, the second sensing pattern SP2 and the touch signal lines SL1 and SL2 may also have a grid shape superimposed on the non-emitting areas NPXA.

[0151] The first sensing pattern SP1 includes a plurality of vertical portions SP1-C extending in a first direction DR1 and a plurality of horizontal portions SP1-L extending in a second direction DR2. The plurality of vertical portions SP1-C and the plurality of horizontal portions SP1-L can be defined as grid lines. The grid lines can have a linewidth of a few micrometers.

[0152] Multiple vertical portions SP1-C and multiple horizontal portions SP1-L can be connected to each other to define multiple touch openings TS-OP. Although a structure is shown where a touch opening TS-OP corresponds one-to-one with an emission area PXA, embodiments of the inventive concept are not limited thereto. One touch opening TS-OP may correspond to two or more emission areas PXA. Although Figure 10 and Figure 11 The image shows the exposed grid lines, but the display module DM (see...) Figure 4 It may also include an insulating layer disposed on the thin film encapsulation layer TFE to cover the grid lines.

[0153] Figure 12 yes Figure 5 and Figure 9 The image shows a view of the display panel pad PD-DP and the touch sensing component pad PD-TS. The display module DM may include an active region AR-ACV, a pad region AR-PD, and a boundary region AR-BD disposed between the active region AR-ACV and the pad region AR-PD.

[0154] In the active region AR-ACV, the display module DM includes a first conductive pattern CDP1. In the pad region AR-PD, the display module DM includes a second conductive pattern CDP2. In the boundary region AR-BD, the display module DM includes a third conductive pattern CDP3. Each of the first conductive patterns CDP1 to the third conductive patterns CDP3 may include metal as a pattern for conducting electrical signals used to drive the display panel DP or the touch sensing component TS.

[0155] The display panel pads PD-DP and touch sensing component pads PD-TS can be arranged adjacent to each other. Alternatively, the display panel pads PD-DP and touch sensing component pads PD-TS can be arranged parallel to each other. However, embodiments of the inventive concept are not limited to this. For example, if necessary, the display panel pads PD-DP and touch sensing component pads PD-TS can be separated from each other, but not arranged parallel to each other.

[0156] Figure 13A It is along Figure 12 The sectional view taken from line II-II'. Figure 13B It is along Figure 12 The sectional view taken from line III-III'. Figure 13C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 13A to 13C An embodiment of the inventive concept is shown.

[0157] The reference shows the touch sensing component pads. Figure 13A The substrate layer SUB includes an active region AR-ACV, a pad region AR-PD, and a boundary region AR-BD located between the active region AR-ACV and the pad region AR-PD.

[0158] In the active region AR-ACV, pad region AR-PD, and boundary region AR-BD of the embodiment according to the inventive concept, the active region AR-ACV may be a region including the light-emitting device layer ELL, the pad region AR-PD may be a region including the display panel pad PD-DP and the touch sensing component pad PD-TS that apply signals from the printed circuit board to it, and the boundary region AR-BD may be the region between the active region AR-ACV and the pad region AR-PD.

[0159] Circuit layers CL1 and CL2 are disposed on the base layer SUB. Circuit layers CL1 and CL2 include a first circuit layer CL1 and a second circuit layer CL2. The first circuit layer CL1 is disposed on the active region AR-ACV of the base layer SUB. The second circuit layer CL2 is disposed on the pad region AR-PD of the base layer SUB.

[0160] The light-emitting device layer ELL and the thin-film encapsulation layer TFE are disposed on the first circuit layer CL1. The first circuit layer CL1 and the second circuit layer CL2 may each include a functional layer BR and a functional layer BF. For convenience, among the functional layers BR and BF, the functional layer of the first circuit layer CL1 can be referred to as the first functional layer, and the functional layer of the second circuit layer CL2 can be referred to as the second functional layer.

[0161] because Figure 7 and Figure 8 The diagram shows the first circuit layer CL1, the light-emitting device layer ELL, and the thin film encapsulation layer TFE, so a detailed description of them will be omitted.

[0162] A touch sensing component TS can be disposed on a thin-film encapsulation layer TFE. In cross-section, the touch sensing component TS includes a touch inorganic layer IL-T, an insulating pattern IL-P, multiple touch electrodes, and a touch protective layer PVX. Each of the touch inorganic layer IL-T and the insulating pattern IL-P may include an inorganic material. The touch protective layer PVX may include an organic material.

[0163] Reference Figure 9 Multiple touch electrodes can form a first touch pattern TE1-1 to TE1-3, a first touch signal line SL1, a second touch pattern TE2-1 to TE2-3, and a second touch signal line SL2.

[0164] The second circuit layer CL2 may include a second conductive pattern CDP2 (see...). Figure 12 The second conductive pattern CDP2 may include display panel pads PD-DP and touch sensing component pads PD-TS. The organic / inorganic layers BR, BF, 12, 14 and 16 may include second functional layers BR and BF, a first insulating layer 12, a second insulating layer 14 and a third insulating layer 16.

[0165] The display panel pad PD-DP can be disposed on the second functional layer and electrically connected to the first circuit layer CL1. At least one of the first insulating layer 12 and the second insulating layer 14 can be disposed between the display panel pad PD-DP and the second functional layer.

[0166] The display panel pad PD-DP may include a lower display panel pad PD-DPD and an upper display panel pad PD-DPU. The lower display panel pad PD-DPD is electrically connected to the first conductive pattern CDP1 via a third conductive pattern CDP3. The upper display panel pad PD-DPU is disposed on the lower display panel pad PD-DPD and electrically connected to it. Therefore, the electrical signal applied to the upper display panel pad PD-DPU is applied to the first conductive pattern CDP1 of the first circuit layer CL1 via the lower display panel pad PD-DPD.

[0167] A boundary layer (BDL) is disposed on the boundary region AR-BD of the substrate layer SUB. The boundary layer BDL may include an organic layer (OG) and a third conductive pattern (CDP3). The organic layer (OG) may contact the top surface of the substrate layer SUB and is disposed between the first circuit layer (CL1) and the second circuit layer (CL2). More specifically, the organic layer (OG) may be disposed between the first functional layer and the second functional layer.

[0168] Unlike the first circuit layer CL1 and the second circuit layer CL2, the boundary layer BDL may not include an inorganic layer containing inorganic materials. Therefore, the flexibility of the boundary layer BDL can be improved, allowing for easy bending of a portion of the display panel DP stacked with the boundary area AR-BD.

[0169] The organic layer OG can also be disposed on the third conductive pattern CDP3. The organic layer disposed on the third conductive pattern CDP3 can be formed by the same process as that used for the third insulating layer 16 or the pixel defining layer PXL.

[0170] The third conductive pattern CDP3 can be formed using the same process as that used for the lower display panel pads PD-DPD. However, embodiments of the inventive concept are not limited thereto. For example, the third conductive pattern CDP3 can be formed using a separate process to contact the lower display panel pads PD-DPD and then electrically connect to them.

[0171] Reference Figure 13BThe touch signal line SL2 of the touch sensing component TS is electrically connected to the third conductive pattern CDP3 on the active region AR-ACV. The third conductive pattern CDP3 is electrically connected to the upper touch sensing component pad PD-TSU on the pad region AR-PD. Here, the third conductive pattern CDP3 can be electrically insulated from the lower touch sensing component pad PD-TSD.

[0172] Reference Figure 9 and Figure 13B The touch sensing component TS includes a first touch pattern TE1-1 to TE1-3 and a second touch pattern TE2-1 to TE2-3 disposed on the active region AR-ACV, a touch sensing component pad PD-TS disposed on the pad region AR-PD, and touch signal lines SL1 and SL2 electrically connecting the touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 to the touch sensing component pad PD-TS.

[0173] The touch sensing component pad PD-TS may include a lower touch sensing component pad PD-TSD and an upper touch sensing component pad PD-TSU. The upper touch sensing component pad PD-TSU is electrically connected to touch patterns TE1-1 to TE1-3 and TE2-1 to TE2-3 via touch signal lines SL1 and SL2 and a third conductive pattern CDP3. That is, the upper touch sensing component pad PD-TSU is electrically connected to sensing patterns SP1 and SP2 via touch signal lines SL1 and SL2 and a third conductive pattern CDP3.

[0174] The lower touch sensing component pad PD-TSD can be electrically insulated from the upper touch sensing component pad PD-TSU. However, embodiments of the inventive concept are not limited thereto. According to another embodiment of the inventive concept, the lower touch sensing component pad PD-TSD can be electrically connected to the upper touch sensing component pad PD-TSU.

[0175] The upper touch sensor component pad PD-TSU is mounted on the lower touch sensor component pad PD-TSD. The upper touch sensor component pad PD-TSU can be mounted at a height that increases with the thickness of the lower touch sensor component pad PD-TSD.

[0176] exist Figure 13B In, with Figure 13A Unlike the first conductive pattern CDP1, the third conductive pattern CDP3 is not electrically connected to the first conductive pattern CDP1. However, embodiments of the inventive concept are not limited thereto. For example, if necessary, Figure 13B The third conductive pattern CDP3 and the first conductive pattern CDP1 can be electrically connected to each other.

[0177] exist Figure 13B In, because other components and Figure 13AThe components are basically the same, so descriptions of the other components will be omitted.

[0178] The measured length HH1 from the substrate layer SUB to the upper display panel pad PD-DPU is essentially the same as the measured length HH2 from the substrate layer SUB to the upper touch sensing component pad PD-TSU.

[0179] Although not shown, in another embodiment of the inventive concept, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the boundary region AR-BD. That is, in this case, at least one of the touch inorganic layer IL-T and the insulating pattern IL-P may be disposed on the entire surface of the active region AR-ACV, the pad region AR-PD, and the boundary region AR-BD.

[0180] Reference Figure 13C The upper display panel pad PD-DPU and the upper touch sensing component pad PD-TSU can be disposed on the same layer. The upper display panel pad PD-DPU can be electrically connected to the lower display panel pad PD-DPD through the sixth through-hole CH6. Although not shown, a dummy electrode can be disposed on the first insulating layer 12.

[0181] Therefore, in the process of attaching the printed circuit board to the display panel pads PD-DP and the touch sensing component pads PD-TS, since the display panel pads PD-DP and the touch sensing component pads PD-TS have the same height, the pressure applied to the pads PD-DP and PD-TS can be the same. This prevents defects that may occur during the printed circuit board attachment process. Furthermore, the durability against externally applied stress can be improved based on the manipulation operation of the flexible display device DD.

[0182] Figure 14A It is along Figure 12 The sectional view taken from line II-II'. Figure 14B It is along Figure 12 The sectional view taken from line III-III'. Figure 14C and Figure 14D They are along Figure 12 A sectional view taken from line IV-IV'. Figures 14A to 14C An embodiment of the inventive concept is shown.

[0183] Reference Figure 14A Description and reference Figure 13A The descriptions are essentially the same, so their descriptions will be omitted.

[0184] Reference Figure 14B and Figure 14CThe upper touch sensing component pad PD-TSU can be electrically connected to the lower touch sensing component pad PD-TSD through the seventh through hole CH7.

[0185] Figure 14D The diagram shows that each of the sixth through-hole CH6 and the seventh through-hole CH7 has a ratio of Figure 14C The width of each through hole is greater than the width of the state.

[0186] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0187] Figure 15A It is along Figure 12 The sectional view taken from line II-II'. Figure 15B It is along Figure 12 The sectional view taken from line III-III'. Figure 15C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 15A to 15C An embodiment of the inventive concept is shown.

[0188] Reference Figure 15A and Figure 15C The upper display panel pad PD-DPU contacts the lower display panel pad PD-DPD. (Refer to...) Figure 15B and Figure 15C The upper touch sensing component pad PD-TSU contacts the lower touch sensing component pad PD-TSD.

[0189] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0190] Figure 16A It is along Figure 12 The sectional view taken from line II-II'. Figure 16B It is along Figure 12 The sectional view taken from line III-III'. Figure 16C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 16A to 16C An embodiment of the inventive concept is shown.

[0191] Unlike the third conductive pattern CDP3 described above, Figure 16A and Figure 16B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 via electrode GE3, which is formed using the same process as the control electrodes GE1 and GE2.

[0192] about Figure 16A and Figure 16B Descriptions of other components and Figure 13A and Figure 13B The descriptions of the components are essentially the same, therefore their descriptions will be omitted. See also... Figure 16C Description and reference Figure 13C The descriptions are essentially the same, so their descriptions will be omitted.

[0193] Figure 17A It is along Figure 12 The sectional view taken from line II-II'. Figure 17B It is along Figure 12 The sectional view taken from line III-III'. Figure 17C and Figure 17D It is along Figure 12 A sectional view taken from line IV-IV'. Figures 17A to 17D An embodiment of the inventive concept is shown.

[0194] Figure 17A and Figure 17B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 via electrode GE3, which is formed using the same process as the control electrodes GE1 and GE2.

[0195] about Figure 17A and Figure 17B Descriptions of other components and Figure 14A and Figure 14B The descriptions of the components are essentially the same, therefore their descriptions will be omitted. See also... Figure 17C and Figure 17D Description and reference Figure 14C and 14D The descriptions are essentially the same, so their descriptions will be omitted.

[0196] Figure 18A It is along Figure 12 The sectional view taken from line II-II'. Figure 18B It is along Figure 12 The sectional view taken from line III-III'. Figure 18C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 18A to 18C An embodiment of the inventive concept is shown.

[0197] Figure 18A and Figure 18B The third conductive pattern CDP3 is electrically connected to the first conductive pattern CDP1 via electrode GE3, which is formed using the same process as the control electrodes GE1 and GE2.

[0198] about Figure 18A and Figure 18B Descriptions of other components and Figure 15A and Figure 15BThe descriptions of the components are essentially the same, therefore their descriptions will be omitted. Regarding Figure 18C Description and about Figure 15C The descriptions are essentially the same, so their descriptions will be omitted.

[0199] Figure 19A It is along Figure 12 The sectional view taken from line II-II'. Figure 19B It is along Figure 12 The sectional view taken from line III-III'. Figure 19C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 19A to 19C An embodiment of the inventive concept is shown.

[0200] Reference Figure 19A and Figure 19C The display panel pads (PD-DP) have a single-layer structure. (Refer to...) Figure 19B and 19C The touch sensing component pad PD-TS has a single-layer structure.

[0201] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0202] Figure 20A It is along Figure 12 The sectional view taken from line II-II'. Figure 20B It is along Figure 12 The sectional view taken from line III-III'. Figure 20C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 20A to 20C An embodiment of the inventive concept is shown.

[0203] Reference Figure 20A and Figure 20C The display panel pads (PD-DP) have a single-layer structure. (Refer to...) Figure 20B and Figure 20C The touch sensing component pad PD-TS has a single-layer structure.

[0204] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0205] As exemplified by the inventive concept Figures 19A to 19C and Figures 20A to 20C As shown, since the display panel pad PD-DP and the touch sensing component pad PD-TS are set at the same height and have a single-layer structure, defects that may occur in the manufacturing process can be reduced.

[0206] Figure 21A It is along Figure 12 The sectional view taken from line II-II'. Figure 21B It is along Figure 12 The sectional view taken from line III-III'. Figure 21C It is along Figure 12 A sectional view taken from line IV-IV'. Figures 21A to 21C An embodiment of the inventive concept is shown.

[0207] The second conductive pattern CDP2 may include a dummy electrode ET-D, a display panel pad PD-DP, and a touch sensing component pad PD-TS.

[0208] The dummy electrode ET-D may be made of the same material as the control electrode GE2 of the first circuit layer CL1. The dummy electrode ET-D can be formed using the same process as the control electrode GE2. The dummy electrode ET-D can be insulated from other electrodes and performs the function of adjusting the height of the display panel pad PD-DP on the pad area AR-PD.

[0209] Descriptions of other components and Figures 13A to 13C The descriptions of the components are basically the same, so their descriptions will be omitted.

[0210] Figure 22 and Figure 23 A display module DM, as well as printed circuit boards PCB and PCB-1, are shown according to an embodiment of the inventive concept.

[0211] Reference Figure 22 The pads PD-TS and PD-DP of the display module DM are electrically connected to the pad PD-PCB of the printed circuit board PCB. The integrated circuit DIC can be mounted on the printed circuit board PCB. The integrated circuit DIC can be formed using a flexible printed circuit on-chip (COF) method. The integrated circuit DIC can transmit data to / receive data from the display module DM via the pads PD-PCB, PD-TS, and PD-DP.

[0212] Reference Figure 23 The integrated circuit DIC-1 can be placed on the pad area AR-PD of the display module DM. Here, the integrated circuit DIC-1 can be formed using the chip-on-plastic (COP) method.

[0213] Although touch signal lines SL1 and SL2 are not connected Figure 23 The integrated circuit DIC-1 is used, but embodiments of the inventive concept are not limited thereto. In embodiments of the inventive concept, each of the touch signal lines SL1 and SL2 may have a structure connected to the integrated circuit DIC-1.

[0214] Figure 24A curved shape of a display module DM according to an embodiment of the inventive concept is shown. (Refer to...) Figure 24 The display module DM can be bent within the boundary region AR-BD. As described above, the boundary region AR-BD of the display module DM may not include an inorganic material layer, but only an organic material layer. Therefore, the boundary region AR-BD can have sufficient flexibility to bend.

[0215] According to an embodiment of the inventive concept, the pad units of the display panel and the pad units of the touch sensing component can be disposed at the same height.

[0216] According to embodiments of the inventive concept, the curved portion of the display panel can have improved flexibility.

[0217] It will be apparent to those skilled in the art that various modifications and alterations can be made to the inventive concept. Therefore, this disclosure is intended to cover modifications and alterations to the invention provided they fall within the scope of the appended claims and their equivalents. Thus, to the greatest extent permitted by law, the scope of the invention will be determined by the widest permissible interpretation of the claims and their equivalents, and is not bound or limited by the foregoing detailed description.

Claims

1. A display device, the display device comprising: The substrate layer includes the display area and the non-display area; A display device layer is disposed on the substrate layer and stacked with the display area; An encapsulation layer is disposed on the display device layer; A touch sensor is disposed on the encapsulation layer; A first pad, disposed on the substrate layer and stacked with the non-display area, and including a plurality of lower pads; and The second pad is disposed on the first pad and includes multiple upper pads of the same height. One of the lower pad and the upper pad is electrically connected to the display device layer, and the other of the lower pad and the upper pad is electrically connected to the touch sensor.

2. The display device according to claim 1, wherein, The touch sensor includes a touch insulating layer superimposed on the display area and the non-display area, and The touch insulating layer is disposed between the first pad and the second pad.

3. The display device according to claim 1, wherein, The display device layer includes pixels, and one of the lower pad and the upper pad is electrically connected to the pixel. The touch sensor includes a conductive pattern, and the other of the lower pad and the upper pad is electrically connected to the conductive pattern.

4. The display device according to claim 1, wherein, The other of the lower pad and the upper pad includes a floating dummy electrode.

5. The display device according to claim 1, wherein, One of the lower pad and the upper pad is disposed on the same layer as the display device layer, and the other is disposed on the same layer as the touch sensor.

6. The display device according to claim 1, wherein, The plurality of lower pads include a first lower pad and a second lower pad configured to be adjacent to the first lower pad, and the plurality of upper pads include a first upper pad and a second upper pad configured to be adjacent to the first upper pad, wherein the first upper pad is disposed on the first lower pad and the second upper pad is disposed on the second lower pad.

7. The display device according to claim 6, wherein, The first lower pad is connected to the display device layer, the second lower pad includes a floating dummy electrode, the first upper pad includes a floating dummy electrode, and the second upper pad is connected to the touch sensor.

8. The display device according to claim 6, wherein, The first upper pad is electrically connected to the first lower pad.

9. The display device according to claim 6, further comprising an insulating layer disposed between the first upper pad and the first lower pad. in, The first upper pad and the first lower pad are electrically connected to each other through contact holes passing through the insulating layer.

10. The display device according to claim 6, wherein, The second upper pad and the second lower pad constitute a sensing pad, and the first upper pad and the first lower pad constitute a display pad. The thickness of the sensing pad is the same as the thickness of the display pad.

11. The display device according to claim 10, wherein, The sensing pads include a first sensing pad and a second sensing pad spaced apart from each other in one direction in a plan view, and the display pad is disposed between the first sensing pad and the second sensing pad.

12. The display device according to claim 10, wherein, The sensing pads and the display pads have the same stacked structure.

13. The display device according to claim 1, wherein, The touch sensor is directly mounted on the encapsulation layer.

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