Display module and preparation method thereof

Abstract

The display module comprises a cover plate, a circuit board assembly and a display panel located between the cover plate and the circuit board assembly; a COF (Chip On Film) film, a first end of the COF film being attached to the display panel, a second end of the COF film being attached to the circuit board assembly, a first bending area being located between the first end of the COF film and the second end of the COF film; a shielding film, a first end of the shielding film being attached to the cover plate, a second end of the shielding film covering the second end of the COF film, a second bending area being located between the first end of the shielding film and the second end of the shielding film; after the shielding film is bent, the second bending area covers the first bending area, and the first bending area and the second bending area correspond to the end of the display panel. The display module can realize electromagnetic shielding and signal anti-interference, improve process operability, has mass productivity, and ensures production yield and efficiency.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular, to a display module and a preparation method thereof. BACKGROUND

[0002] In recent years, with the rapid development of the organic light-emitting diode (OLED) display industry, new types of medium and large-sized display devices have gradually entered the market, such as vehicle-mounted central control displays, instrument panel displays, notebook computer displays, etc. Compared with consumer-grade display products, vehicle-grade display products have higher reliability requirements. Therefore, it is urgent to improve the reliability of vehicle-mounted display modules.

[0003] At present, due to its large size, high resolution and high brightness, the current of the circuit board and the parts such as the chip on film (COF) of the flexible OLED vehicle-mounted display screen is large when in use, which will generate a high-strength electromagnetic field, seriously affecting the normal use of nearby electronic devices, and under the action of external electromagnetic field, the display screen will also be greatly affected, which will bring serious consequences in vehicle driving. SUMMARY

[0004] Therefore, the purpose of the present disclosure is to provide a display module and a preparation method thereof, which not only can avoid the interference of electromagnetic signals, but also can achieve the purpose of mass production in process, improve the process operability, and ensure the production yield and efficiency.

[0005] In a first aspect, the present disclosure provides a display module, comprising:

[0006] a cover plate;

[0007] a circuit board assembly;

[0008] a display panel, wherein the display panel is located between the cover plate and the circuit board assembly;

[0009] a chip on film (COF), the COF comprising a first end portion, a second end portion and a first bending region, the first end portion of the COF being attached to the display panel, the second end portion of the COF being attached to the circuit board assembly, and the first bending region being located between the first end portion of the COF and the second end portion of the COF;

[0010] a shielding film, the shielding film comprising a first end portion, a second end portion and a second bending region, the first end portion of the shielding film being attached to the cover plate, the second end portion of the shielding film covering the second end portion of the COF, and the second bending region being located between the first end portion of the shielding film and the second end portion of the shielding film;

[0011] After the shielding film is bent, the second bending region covers the first bending region, and the first bending region and the second bending region correspond to the end of the display panel.

[0012] In a possible implementation, the display module further includes:

[0013] A touch layer is located between the cover plate and the circuit board assembly, the first end of the shielding film is located between the touch layer and the cover plate, and the first end of the shielding film is attached to the touch layer or the cover plate.

[0014] In a possible implementation, the second end of the shielding film covers the circuit board assembly.

[0015] In a possible implementation, the display module further includes:

[0016] A second shielding film connected to the second end of the shielding film covers the circuit board assembly.

[0017] In a possible implementation, the display module further includes:

[0018] A support layer is arranged between the display panel and the circuit board assembly.

[0019] An area for grounding is arranged on the shielding film and attached to the support layer.

[0020] In a possible implementation, the shielding film includes an insulating layer, and the insulating layer at the area for grounding on the shielding film is hollowed out.

[0021] In a possible implementation, the area for grounding is attached to the area for grounding on the support layer.

[0022] In a possible implementation, the plurality of CCOs are provided, a through hole is arranged on the shielding film, and the through hole corresponds to a gap between adjacent CCOs.

[0023] In a second aspect, the display module is prepared by the following method.

[0024] The CCO, the display panel, and the circuit board assembly are provided, the first end of the CCO is attached to the display panel, and the second end of the CCO is attached to the circuit board assembly.

[0025] The shielding film and the cover plate for bearing the display panel are provided, the first end of the shielding film is attached to the cover plate, and the second end of the shielding film covers the second end of the CCO.

[0026] bending the shielding film so that a second bending area between a first end of the shielding film and a second end of the shielding film covers a first bending area between a first end of the COF and a second end of the COF, the first bending area and the second bending area corresponding to the end of the display panel.

[0027] In a possible implementation, the method further includes:

[0028] controlling the second end of the shielding film to cover the circuit board assembly at the same time.

[0029] In a possible implementation, the method further includes:

[0030] providing a support layer, and disposing the support layer between the display panel and the circuit board assembly;

[0031] disposing the support layer and a grounding area disposed on the shielding film in a manner of being attached to each other.

[0032] In a possible implementation, the method further includes:

[0033] hollowing out an insulating layer at the grounding area of the shielding film.

[0034] The embodiments of the present disclosure achieve the purpose of completely covering the COF by disposing the first end of the shielding film on the cover plate and disposing the second end of the shielding film to cover the second end of the COF, and the second bending area of the shielding film covers the first bending area of the COF, thereby shielding the electromagnetic interference generated by the COF on the display screen, achieving the purposes of electromagnetic shielding and signal anti-interference; and the first end of the shielding film is disposed on the cover plate, and the second end is bent to the second end of the COF, which improves the process operability, achieves the purpose of mass production, and ensures the production yield and efficiency at the same time.

[0035] In order to make the above objectives, characteristics and advantages of the present disclosure more apparent, clear and easy to understand, the following will describe preferred embodiments in detail, and the accompanying drawings will be described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments described in the present disclosure, and for those skilled in the art, other drawings can also be obtained without creative labor under the premise of these drawings.

[0037] Figure 1 FIG. 1 shows a structural schematic diagram of a display module provided by an embodiment of the present disclosure.

[0038] Figure 2 A cross-sectional schematic view of a display module is shown according to an embodiment of the present disclosure;

[0039] Figure 3 A cross-sectional schematic view of a display module is shown according to an embodiment of the present disclosure; Figure 2 An enlarged view of a region A in the middle is shown according to an embodiment of the present disclosure;

[0040] Figure 4 A structure schematic view of a first end of a shielding film and a cover plate when the shielding film is in a raw material state is shown according to an embodiment of the present disclosure;

[0041] Figure 5 A structure schematic view of a cover plate 1, a shielding film 2 and a COF 4 during a manufacturing process is shown according to an embodiment of the present disclosure;

[0042] Figure 6 A structure schematic view of a second end of a shielding film in a display module is shown according to an embodiment of the present disclosure;

[0043] Figure 7 A structure schematic view of a shielding film when the shielding film and a second shielding film are two independent film layers in a display module is shown according to an embodiment of the present disclosure;

[0044] Figure 8 A cross-sectional schematic view of another display module is shown according to an embodiment of the present disclosure;

[0045] Figure 9 A schematic view of a first end of a shielding film and a touch layer after the first end of the shielding film is integrated with the touch layer when the shielding film is in a raw material state is shown according to an embodiment of the present disclosure;

[0046] Figure 10 A schematic view after a COF is bent is shown according to an embodiment of the present disclosure;

[0047] Figure 11 A schematic view of a second end of a bent shielding film is shown according to an embodiment of the present disclosure;

[0048] Figure 12 Another cross-sectional schematic view of a display module is shown according to an embodiment of the present disclosure;

[0049] Figure 13 A structure schematic view of a shielding film in a display module is shown according to an embodiment of the present disclosure.

[0050] Reference signs:

[0051] 1 - cover plate; 2 - shielding film; 21 - first end of the shielding film; 22 - second end of the shielding film; 23 - second bending area; 3 - circuit board assembly; 4 - chip on film; 41 - first end of the chip on film; 42 - second end of the chip on film; 43 - first bending area; 5 - support layer; 211 - land area; 212 - via hole; 6 - touch layer; 7 - display panel. DETAILED DESCRIPTION

[0052] In order to make the objectives, technical solutions and advantages of the present disclosure clearer, the technical solutions of the present disclosure will be described clearly and completely below with reference to the drawings of the present disclosure. Obviously, the described embodiments are part of, rather than all of, the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any inventive effort fall within the protective scope of the present disclosure.

[0053] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall be understood as the usual meanings understood by a person having ordinary skills in the art to which the present disclosure belongs. The terms “first”, “second” and similar terms used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different components. The terms “include” or “contain” and similar terms mean that the elements or objects before the terms cover the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. The terms “connect” or “connected” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper”, “lower”, “left”, “right” and the like only represent relative positional relationships, which can change accordingly when the absolute positions of the described objects change.

[0054] In order to keep the following description of the present disclosure clear and brief, the present disclosure omits the detailed description of known functions and known components.

[0055] The first aspect of the present disclosure provides a display module, Figure 1 The structure of the display module is shown, wherein the cover plate 1, the circuit board assembly 3, the display panel (not shown in the Figure 1 , wherein the display panel is located between the cover plate 1 and the circuit board assembly 3; further, the cross-sectional view of the display module shown in Figure 2 and the Figure 3 shown in Figure 2The local enlarged view of the middle A region shows that the display module further includes a chip on film 4, the chip on film 4 includes a first end portion 41 of the chip on film, a second end portion 42 of the chip on film and a first bending region 43, the first end portion 41 of the chip on film is attached on the display panel 7, the second end portion 42 of the chip on film is attached on the circuit board assembly 3, and the first bending region 43 is located between the first end portion 41 of the chip on film and the second end portion 42 of the chip on film. Figures 1 to 3 It can be seen that the display module further includes a shielding film 2. With reference to the detailed description Figure 3 The local enlarged view shows that the shielding film 2 includes a first end portion 21 of the shielding film, a second end portion 22 of the shielding film and a second bending region 23, the first end portion 21 of the shielding film is attached on the cover plate 1 by double-sided adhesive, as an example, the first end portion of the shielding film 2 is attached on the ink area of the cover plate 1, and the attachment width is 1.5-2.5mm, the second end portion 22 of the shielding film covers the second end portion 42 of the chip on film, and the second bending region 23 is located between the first end portion 21 of the shielding film and the second end portion 22 of the shielding film; after the shielding film 2 is bent, the second bending region 23 covers the first bending region 43, and the first bending region 43 and the second bending region 23 correspond to the end portion of the display panel 7, thereby shielding the electromagnetic interference generated by the chip on film 4 to the display screen, achieving the purpose of electromagnetic shielding and signal anti-interference.

[0056] Further, the first end portion 21 of the shielding film is integrated with the cover plate 1 in the embodiment of the present disclosure, as shown in the structural schematic diagram. Figure 4 Then, the support layer 5 is attached on the cover plate 1, and the chip on film 4 is bent to obtain the structural schematic diagram shown in Figure 5 The structural schematic diagram of the cover plate 1, the shielding film 2 and the chip on film 4 in a preparation process; and Figure 2 and Figure 3 It can be seen that the support layer 5 is arranged between the display panel 7 and the circuit board assembly 3, and it is worth noting that Figure 5 The display panel (located between the support layer 5 and the cover plate 1), the circuit board assembly 3 and other devices are also shown in the middle, but here we can only focus on the cover plate 1, the shielding film 2 and the chip on film 4. Then, the second end portion 22 of the shielding film is bent to the second end portion 42 of the chip on film to achieve the purpose of completely covering the chip on film 4, thereby obtaining the structural schematic diagram shown in Figure 1 Specifically, the second bending region 23 of the shielding film 2 covers the first bending region 43 of the chip on film 4. That is, the purpose of completely covering the chip on film 4 by the shielding film 2 can be achieved without manual attachment in the embodiment of the present disclosure, which improves the process operability, achieves the purpose of mass production, and at the same time ensures the production yield and efficiency.

[0057] In a specific implementation, the shielding film 2 can also cover the circuit board assembly 3, and specifically, the second end portion 22 of the shielding film covers the circuit board assembly 3 without any gap therebetween, where reference is made to Figure 6 a structure diagram of the second end portion 22 of the shielding film shown in the figure is elongated, and the shielding film 2 is used to Figure 6 In the process of preparing the display module using the shielding film 2 shown in the figure, the elongated second end portion 22 is bent to cover the CCL 4, and the shielding film 2 is attached to the ink area of the cover plate 1 using double-sided adhesive, so that Figure 6 The display module prepared using the shielding film 2 shown in the figure can also effectively achieve electromagnetic signal anti-interference.

[0058] In one of the embodiments, the display module further comprises a second shielding film connected to the second end portion 22 of the shielding film, and the second shielding film covers the circuit board assembly 3, that is, the shielding film 2 and the second shielding film are spliced to cover the CCL 4 and the circuit board assembly 3. Alternatively, the second shielding film is a film layer originally attached to the circuit board assembly 3, and the shielding film 2 is a long film layer independent of the second shielding film, and the second bending area 23 is formed using the shielding film 2 to cover the first bending area 43 of the CCL 4, so as to achieve electromagnetic signal anti-interference.

[0059] It is worth noting that although the shielding film 2 and the second shielding film are two independent film layers, the shielding film 2 and the second shielding film are made of the same material.

[0060] Further, since the shielding film 2 is a film layer independent of the second shielding film, a grounding area needs to be provided for the shielding film 2 to achieve grounding processing, where reference is made to Figure 7 a structure diagram of the shielding film 2 when the shielding film 2 and the second shielding film are two independent film layers, and the shielding film 2 is provided with a grounding area 211, as shown in Figure 7 As shown, the grounding area 211 is located at both ends of the shielding film 2, and the size of the grounding area 211 can be set to 6mm x 14mm, of course, the size of the grounding area 211 can be adjusted according to the size of the display module, as long as the grounding processing can be achieved, and in a specific preparation process, it can be set to (6±2)mm x (14±4)mm. Moreover, the grounding area 211 is attached to the support layer 5, and specifically, the grounding area 211 is attached to the grounding area on the support layer 5, so as to achieve grounding processing. The grounding area 211 does not need to be provided independently of the shielding film 2, since the shielding film 2 includes an insulating layer, and the insulating layer at the grounding area of the shielding film 2 is simply hollowed out to reserve the conductive cloth to form the grounding area 211.

[0061] In view of the fact that multiple COFs 4 can be arranged in the display module, there is a certain gap between adjacent COFs 4, which causes the second end portion 22 of the shielding film to generate a bubble wrinkle after wrapping the COF 4. Therefore, in the case where there are multiple COFs 4, the shielding film 2 of the embodiment of the present disclosure is provided with a through hole 212 corresponding to the gap between adjacent COFs 4. For details, please refer to Figure 1 , Figure 4 and Figure 5 . Through the through hole 212, the problem of affecting reliability caused by the gap between adjacent COFs 4 due to the attachment gap can be effectively avoided.

[0062] Further, the display module of the embodiment of the present disclosure further includes a touch layer 6 between the cover plate 1 and the circuit board assembly 3, and the first end portion 21 of the shielding film is located between the touch layer 6 and the cover plate 1, and the first end portion 21 of the shielding film is attached to the touch layer 6 or the cover plate 1. Wherein, Figure 8 shows another cross-sectional view of a display module, which Figure 8 the first end portion 21 of the shielding film is attached to the touch layer 6.

[0063] Further, Figure 9 shows a schematic view of the first end portion 21 of the shielding film being integrated with the touch layer 6 after being attached, the first end portion 21 of the shielding film is attached to the first region 61 of the touch layer 6, and the flexible circuit board is attached to the second region 62 of the touch layer 6, and the first region 61 and the second region 62 do not overlap.

[0064] Referring to Figure 10 shows a schematic view of the COF 4 after being bent, then the second end portion 22 of the shielding film is bent to obtain Figure 11 shows a schematic view, and then the flexible circuit board is bent to obtain a display module, wherein, Figure 12 shows another cross-sectional view of the display module.

[0065] The first end portion 21 of the shielding film of the embodiment of the present disclosure is attached to the touch layer 6, and the second end portion 22 of the shielding film is attached to the circuit board assembly 3 and realizes grounding, which can completely wrap the COF 4, thereby improving the electromagnetic compatibility and electrostatic discharge performance, and the shielding film 2 will not exceed the edge of the flexible circuit board, thereby making the display module have a smaller bottom frame and improving the quality of the display module.

[0066] In a second aspect, the embodiment of the present disclosure provides a preparation method of a display module, Figure 13 shows a flowchart of the preparation method of the display module, wherein the specific steps include S1301 and S1302.

[0067] S1301, providing a chip on film, a display panel and a circuit board assembly, adhering a first end of the chip on film on the display panel, and adhering a second end of the chip on film on the circuit board assembly;

[0068] S1302, providing a shielding film and a cover plate for carrying the display panel, adhering a first end of the shielding film on the cover plate, and covering a second end of the shielding film on the second end of the chip on film, a connecting area of the first end of the shielding film and the second end of the shielding film forms a first bending area of the chip on film, a connecting area of the first end of the chip on film and the second end of the chip on film forms a second bending area of the shielding film, and the first bending area covers the second bending area.

[0069] In one of the embodiments, the second end of the shielding film is extended to cover the circuit board assembly.

[0070] In one of the embodiments, the method further comprises:

[0071] providing a support layer, and disposing the support layer between the display panel and the circuit board assembly.

[0072] adhering the support layer and a grounding area disposed on the shielding film.

[0073] In one of the embodiments, the method further comprises:

[0074] hollowing out an insulating layer at the grounding area of the shielding film.

[0075] The above description is merely preferred embodiments of the present disclosure and a description of the principles of the technology applied. It should be understood by those skilled in the art that the disclosed range of the present disclosure is not limited to the technical solutions formed by the specific combinations of the above technical features, and should also cover other technical solutions formed by any combinations of the above technical features or their equivalent features without departing from the disclosed concept. For example, the above features are replaced with the technical features disclosed in the present disclosure (but not limited to) having similar functions to form technical solutions.

[0076] Moreover, while operations are depicted in a particular order, this should not be understood as requiring such an order unless otherwise specifically stated. In certain circumstances, multitasking and parallel processing can be advantageous. Likewise, while a number of specific implementation details have been illustrated, these should not be taken as limiting. Certain features that are, for clarity, described above in the context of separate embodiments can also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described above in the context of a single embodiment can also be provided separately or in any suitable subcombination. All of the above patents, patent applications, and other references are incorporated herein by reference.

[0077] Although the subject matter has been described in language specific to structural features and / or methodological acts, it is to be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

[0078] The above detailed description has shown, described, and pointed out novel features of the various embodiments of the application. The foregoing can be implemented in hardware, software, or a combination thereof. The various embodiments of the present application can be implemented in many ways, and the application should not be construed or interpreted as limited to the particular embodiments discussed above. Embodiments of the present application can be implemented in hardware, software, or a combination thereof. The various embodiments of the present application can be implemented in many ways, and the application should not be construed or interpreted as limited to the particular embodiments discussed above.

Claims

1. A display module, characterized in that, include: Cover plate; Circuit board assembly; The display panel is located between the cover plate and the circuit board assembly; A flip-chip film, comprising a first end, a second end, and a first bending region, wherein the first end of the flip-chip film is attached to the display panel, the second end of the flip-chip film is attached to the circuit board assembly, and the first bending region is located between the first end of the flip-chip film and the second end of the flip-chip film; A shielding film includes a first end, a second end, and a second bending region. The first end of the shielding film is attached to the ink area of ​​the cover plate, and the attachment width of the first end of the shielding film in the ink area of ​​the cover plate is 1.5 to 2.5 mm. The second end of the shielding film covers the second end of the flip-chip film, and the second bending region is located between the first end of the shielding film and the second end of the shielding film. After the shielding film is bent, the second bending region covers the first bending region, and the first bending region and the second bending region correspond to the ends of the display panel; A second shielding film is connected to the second end covered by the shielding film, the second shielding film covers the circuit board assembly, and the shielding film is spliced ​​with the second shielding film to cover the flip-chip film and cover the circuit board assembly.

2. The display module according to claim 1, characterized in that, Also includes: A touch layer is located between the cover plate and the circuit board assembly, and the first end of the shielding film is located between the touch layer and the cover plate, and the first end of the shielding film is attached to the touch layer or the cover plate.

3. The display module according to claim 1, characterized in that, The second end of the shielding film also covers the circuit board assembly.

4. The display module according to claim 1, characterized in that, Also includes: A support layer is disposed between the display panel and the circuit board assembly; The shielding film has a grounding area, which is attached to the support layer.

5. The display module according to claim 4, characterized in that, The shielding film includes an insulating layer, and the insulating layer at the grounding area on the shielding film is perforated.

6. The display module according to claim 4, characterized in that, The grounding area is fitted to the grounding area on the support layer.

7. The display module according to claim 1, characterized in that, There are multiple flip-chip films, and the shielding film is provided with through holes, with each through hole corresponding to a gap between adjacent flip-chip films.

8. A method for manufacturing a display module, characterized in that, include: A flip-chip film, a display panel, and a circuit board assembly are provided, wherein a first end of the flip-chip film is attached to the display panel, and a second end of the flip-chip film is attached to the circuit board assembly; A shielding film, a second shielding film, and a cover plate for supporting the display panel are provided. A first end of the shielding film is attached to the ink area of ​​the cover plate, and the attachment width of the first end of the shielding film in the ink area of ​​the cover plate is 1.5 to 2.5 mm. A second end of the shielding film is covered over a second end of the flip-chip film, and the second shielding film is covered over the circuit board assembly, so as to realize that the shielding film and the second shielding film are spliced ​​together to cover the flip-chip film and the circuit board assembly. The shielding film is bent such that a second bending region between the first end and the second end of the shielding film covers a first bending region between the first end and the second end of the flip-chip film, wherein the first bending region and the second bending region correspond to the ends of the display panel.

9. The preparation method according to claim 8, characterized in that, Also includes: The second end of the shielding film is controlled to simultaneously cover the circuit board assembly.

10. The preparation method according to claim 8, characterized in that, Also includes: A support layer is provided and disposed between the display panel and the circuit board assembly; The support layer is attached to the grounding area provided on the shielding film.

11. The preparation method according to claim 10, characterized in that, Also includes: The insulating layer at the grounding area of ​​the shielding film is perforated.

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