Wafer pre-inspection method, device, control system, and computer readable medium

Abstract

The application discloses a wafer pre-inspection method, device, control system and computer readable medium. The wafer pre-inspection method comprises the following steps: obtaining a signal of wafer reaching a detected position, obtaining a pressure difference of the back surface of the wafer, obtaining a comparison value of the height difference of the back surface of the wafer corresponding to the pressure difference, comparing the comparison value with a preset value, and determining whether the wafer is qualified according to the comparison result. The wafer pre-inspection method can effectively detect whether there is foreign matter on the back surface of the wafer, thereby avoiding the adverse effect of the foreign matter on the photoetching of the wafer. In addition, the wafer is prevented from carrying the foreign matter to the wafer table, and the influence of the foreign matter on the wafer table is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer pre-inspection method, apparatus, control system, and computer-readable medium. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] In the semiconductor manufacturing process, photolithography is usually performed on wafers using exposure equipment. If there are foreign objects (dust or water droplets, etc.) on the back of the wafer, local focus abnormalities will occur during the photolithography process, affecting the manufacturing quality of the wafer.

[0004] In existing technologies, pre-cleaning or back-side processing is used to pre-treat wafers to prevent foreign objects from adversely affecting wafer manufacturing. However, foreign objects can appear on the back side of the wafer at any time during the manufacturing process, making it impossible to fundamentally eliminate their impact on wafer manufacturing. In addition, since foreign objects on the back side of the wafer can adhere to the wafer stage, cleaning them can wear down the wafer stage, leading to the need for its replacement. Summary of the Invention

[0005] A first aspect of the present invention provides a wafer pre-inspection method, the wafer pre-inspection method comprising the following steps:

[0006] Obtain the signal that the wafer has reached the detected position;

[0007] Obtain the pressure difference on the back side of the wafer;

[0008] Obtain a comparison value of the height difference on the back side of the wafer corresponding to the pressure difference;

[0009] Compare the comparison value with the preset value;

[0010] Based on the comparison results, it is determined whether the wafer is qualified.

[0011] A second aspect of the present invention provides a wafer pre-inspection apparatus for implementing the wafer pre-inspection method as described above, the wafer pre-inspection apparatus comprising:

[0012] A loading assembly that moves or removes a wafer to or from a detection location;

[0013] A pneumatic gauge is installed at the detection location to detect whether there are foreign objects on the back side of the wafer.

[0014] A third aspect of the present invention provides a wafer pre-inspection control system, the wafer pre-inspection control system comprising a memory, a processor, and a control program stored in the memory and executable on the processor, wherein the control program, when executed by the processor, implements the wafer pre-inspection method as described above.

[0015] A fourth aspect of the present invention provides a computer-readable medium having computer-readable instructions stored thereon, which can be executed by a processor to implement the wafer pre-inspection method as described above. Attached Figure Description

[0016] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0017] Figure 1 A schematic flowchart of a wafer pre-inspection method according to an embodiment of the present invention is shown.

[0018] Figure 2 A schematic diagram of the wafer pre-inspection apparatus according to an embodiment of the present invention in the first state is shown (where 2b is the front view and 2a is the top view);

[0019] Figure 3 A schematic diagram of the wafer pre-inspection apparatus according to an embodiment of the present invention in the second state is shown (where 3b is the front view and 3a is the top view);

[0020] Figure 4 A schematic diagram of the wafer pre-inspection apparatus according to an embodiment of the present invention in the third state is shown (where 4b is the front view and 4a is the top view);

[0021] Figure 5 for Figure 4 The diagram shows the structure of a pneumatic gauge when inspecting a wafer.

[0022] Figure 6 A schematic block diagram of a wafer pre-inspection control system according to an embodiment of the present invention is shown.

[0023] The attached figures are labeled as follows:

[0024] 100 is a wafer pre-inspection device;

[0025] 10 represents the loading component;

[0026] 11 is a transfer component, 12 is a clamping component, 121 is a first clamping part, and 122 is a second clamping part;

[0027] 20 is a pneumatic gauge, 21 is a differential pressure sensor, 22 is an air inlet pipe, 23 is a detection pipe, 24 is a reference pipe, 25 is the first branch pipe, 26 is the second branch pipe, 27 is a detection nozzle, and 28 is a reference nozzle.

[0028] 200 represents the wafer, and 201 represents the defect area;

[0029] 300 represents micro-dust;

[0030] 400 represents a water droplet;

[0031] 500 is a wafer pre-inspection control system;

[0032] 51 is the processor, and 52 is the memory. Detailed Implementation

[0033] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0034] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0035] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0036] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0037] like Figures 1 to 6 As shown, according to an embodiment of the present invention, the present invention provides a wafer pre-inspection method, which includes the following steps:

[0038] S10: Obtain the signal that the wafer 200 has reached the detection position; S20: Obtain the pressure difference on the back side of the wafer 200; S30: Obtain the comparison value of the height difference on the back side of the wafer 200 corresponding to the pressure difference; S40: Compare the comparison value with the preset value; S50: Determine whether the wafer 200 is qualified based on the comparison result.

[0039] Specifically, wafer 200 is transferred to the wafer stage via a front-opening unified pod (FOUP) for photolithography. Before entering the FOUP, wafer 200 needs to be inspected for foreign objects on its back side. A wafer pre-inspection device 100 is located at the front of the FOUP. Wafers 200 that pass inspection are fed into the FOUP, while those that fail are removed. The wafer pre-inspection device 100 includes a loading assembly 10, a pneumatic gauge 20, and a control system. Inspection positions are located within the wafer pre-inspection device 100.

[0040] When inspecting wafer 200, the control system activates the loading assembly 10, which moves wafer 200 to the inspection position and holds it there. The control system receives a signal that wafer 200 has reached the inspection position. Upon receiving this signal, the control system activates the pneumatic gauge 20, which blows air onto the back of wafer 200. If foreign matter (dust 300 or water droplets 400) is present on the back of wafer 200, the pneumatic gauge 20 generates a pressure difference. Based on this pressure difference, the pneumatic gauge 20 outputs a comparison value indicating the height difference on the back of wafer 200. The control system receives this comparison value. A preset value for comparison is stored within the control system; this preset value serves as the comparison standard. Upon receiving the comparison value from the pneumatic gauge 20, the control system compares the received value with the preset value. The control system compares the received comparison value with the preset value. Based on the comparison result, the control system determines whether the wafer 200 meets the requirements. When the wafer 200 meets the requirements, the loading component 10 moves it to the front-opening wafer transfer box. When the wafer 200 does not meet the requirements, the loading component 10 removes it.

[0041] The wafer pre-inspection method of this application can effectively detect whether there are foreign objects on the back side of the wafer 200, thereby avoiding the adverse effects of foreign objects on the photolithography of the wafer 200. In addition, it avoids the wafer 200 from bringing foreign objects onto the wafer stage, thus avoiding the impact of foreign objects on the wafer stage.

[0042] It should be noted that the pressure difference on the back side of the wafer is obtained by a pneumatic gauge, and a comparison value of the height difference on the back side of the wafer corresponding to the pressure difference is obtained by the pressure difference. The preset value is the preset value of the height difference on the back side of the wafer. The current height difference comparison value of the wafer is compared with the preset height difference value of the wafer, and the wafer is judged as qualified according to the comparison structure.

[0043] To further understand, the step of obtaining the pressure difference on the back side of wafer 200 also includes the following steps:

[0044] S201: Obtain the current pressure on the back side of wafer 200; S202: Obtain the reference pressure; S203: Calculate the difference between the current pressure and the reference pressure to obtain the pressure difference.

[0045] Specifically, after the pneumatic gauge 20 is activated, it blows gas toward the back side of the wafer 200. When there is a foreign object on the back side of the wafer 200, the foreign object will affect the pressure of the blown gas. The pneumatic gauge 20 detects the current pressure on the back side of the wafer 200 and calculates the pressure difference between the current pressure and the reference pressure. This method is simple and convenient, and can effectively ensure the accuracy of the pressure difference data, thereby improving the accuracy of determining whether there is a foreign object on the back side of the wafer 200.

[0046] It should be noted that when calculating the pressure difference, the current pressure is equal to the reference pressure when there are no foreign objects on the back side of wafer 200, and the current pressure is less than the reference pressure when there are foreign objects on the back side of wafer 200. Therefore, when calculating the pressure difference, the reference pressure is subtracted from the current pressure to ensure that the pressure difference is greater than or equal to zero, thereby reducing the difficulty of the calculation.

[0047] Furthermore, the preset value is 100nm. Specifically, the pneumatic gauge 20 detects the pressure difference on the back side of the wafer 200 by blowing air onto it. The pneumatic gauge 20 outputs a comparison value corresponding to the pressure difference, which is usually a length value. In this case, the preset value is set to 100nm. By comparing the length value with the preset value, it is possible to quickly determine whether there are foreign objects on the back side of the wafer 200, thereby improving the efficiency of the determination.

[0048] It should be noted that due to limitations in materials or manufacturing processes, defective regions 201 (protrusions or depressions) inevitably appear on the back side of wafer 200. These defective regions 201 are typically referred to as cold spots, while foreign objects on the back side are called hot spots. Wafers 200 with cold spots can proceed to the next stage of use, while those with hot spots must be excluded. By setting the preset value to 100nm, cold and hot spots on the back side of wafer 200 can be effectively distinguished, thereby improving the accuracy of wafer 200 identification.

[0049] Furthermore, the step of determining whether wafer 200 is qualified based on the comparison result also includes: S501: if the comparison value is less than a preset value, determine that wafer 200 is not contaminated; S502: if the comparison value is greater than a preset value, determine that wafer 200 is contaminated. Specifically, when wafer 200 is being inspected, the control system controls the loading assembly 10 to start, the loading assembly 10 moves wafer 200 so that wafer 200 enters the inspection position, and the loading assembly 10 holds wafer 200 in the inspection position. The control system receives a signal that the wafer 200 to be inspected has reached the inspection position. After the control system receives the signal that wafer 200 has reached the inspection position, the control system controls the pneumatic gauge 20 to start. After the pneumatic gauge 20 starts, it blows air onto the back of wafer 200. The pneumatic gauge 20 outputs a comparison value according to the pressure difference generated on the back of wafer 200. The control system compares the received comparison value with the preset value. The control system compares the received comparison value with the preset value. If the comparison value is less than the preset value, it is determined that the wafer 200 is not contaminated and the wafer 200 can continue to be used. If the comparison value is greater than the preset value, it is determined that the wafer 200 does not meet the requirements and the wafer 200 is excluded from the scope of subsequent use.

[0050] like Figures 1 to 6 As shown, the present invention also proposes a wafer pre-inspection device 100 for implementing the wafer pre-inspection method described above. The wafer pre-inspection device 100 includes a loading assembly 10 and a pneumatic gauge 20. The loading assembly 10 moves or removes the wafer 200 to the inspection position. The pneumatic gauge 20 is disposed at the inspection position and is used to detect whether there are foreign objects on the back side of the wafer 200. Specifically, the wafer pre-inspection device 100 is disposed at the front end of a front-opening wafer transport box, and the inspection position is provided within the wafer pre-inspection device 100. When inspecting the back side of wafer 200, the loading assembly 10 moves wafer 200 to the inspection position. The pneumatic gauge 20 approaches the back side of wafer 200 and is activated. The pneumatic gauge 20 detects the pressure difference generated on the back side of wafer 200 and outputs a comparison value corresponding to the pressure difference. By comparing the comparison value with a preset value, if the comparison value is greater than the preset value, it is determined that there is a foreign object on the back side of wafer 200, and wafer 200 cannot continue to be used, i.e., wafer 200 is deemed unqualified. The loading assembly 10 removes the unqualified wafer 200 from the wafer pre-inspection device 100. If the comparison value is less than the preset value, it is determined that there is no foreign object on the back side of wafer 200, and wafer 200 can continue to be used, i.e., wafer 200 is deemed qualified. The loading assembly 10 moves the qualified wafer 200 into the front-opening wafer transfer box.

[0051] The wafer pre-inspection device 100 described above can quickly and accurately remove wafers 200 with foreign objects on the back side, thereby effectively avoiding the adverse effects of foreign objects on the manufacturing of wafers 200, and also avoiding the adverse effects of foreign objects on the wafer stage.

[0052] It should be pointed out that, such as Figure 5 As shown, the pneumatic gauge 20 includes an inlet pipe 22, a detection pipe 23, a reference pipe 24, a first branch pipe 25, a second branch pipe 26, a differential pressure sensor 21, a detection nozzle 27, and a reference nozzle 28. The detection pipe 23, the first branch pipe 25, and the detection nozzle 27 form the detection end, and the reference pipe 24, the second branch pipe 26, and the reference nozzle 28 form the reference end. The detection pipe 23 and the reference pipe 24 are respectively connected to the inlet pipe 22, the detection nozzle 27 and the first branch pipe 25 are respectively connected to the detection pipe 23, the reference nozzle 28 and the second branch pipe 26 are respectively connected to the reference pipe 24, and the differential pressure sensor 21 is respectively connected to the first branch pipe 25 and the second branch pipe 26.

[0053] When the pneumatic gauge 20 is activated, the gas in the main gas pipe is divided into two paths. The first path flows through the detection pipe 23 to the detection nozzle and the first branch pipe 25. The gas is sprayed onto the back side of the wafer 200 through the detection nozzle. The second path, through the reference pipe 24, flows to the reference nozzle and the second branch pipe 26. The second branch pipe 26 is located on one side of the differential pressure sensor 21 and is in a stable pressure state. When there is a foreign object on the back side of the wafer 200, the pressure in the first branch pipe 25 will change. At this time, the pressure values ​​on both sides of the differential pressure sensor 21 will be different, thus generating a pressure difference. The comparison value corresponding to this pressure difference is obtained. The comparison value is then compared with the preset value to determine whether there is a foreign object on the back side of the wafer 200.

[0054] Furthermore, such as Figures 2 to 4 As shown, the loading assembly 10 includes a transfer member 11 and a clamping member 12. The transfer member 11 is used to feed the wafer 200 into the wafer pre-inspection device 100, and the clamping member 12 is used to move or remove the wafer 200 moved in by the transfer member 11 to the inspection position. Specifically, when wafer 200 needs to be inspected, the moving part moves wafer 200 from the storage area to the inside of the wafer pre-inspection device 100. The clamping part 12 clamps the wafer 200 on the moving part. The clamping part 12 moves so that the wafer 200 is sent to the inspection position. Under the action of the clamping part 12, the wafer 200 is held in the inspection position. The pneumatic gauge 20 inspects the wafer 200 located in the inspection position. When the wafer 200 passes the inspection, the clamping part 12 transfers the wafer 200 to the front-opening wafer transfer box. When the wafer 200 fails the inspection, the clamping part 12 transfers the wafer 200 to the temporary storage area (used to store the defective wafer 200).

[0055] Through the organic cooperation of the transfer member 11 and the clamping member 12, the position of the wafer 200 is changed, thereby meeting the requirements for wafer 200 inspection. Furthermore, by using the clamping member 12 to hold the wafer 200 in the measured position, when the pneumatic gauge 20 blows air onto the back of the wafer 200 for inspection, the airflow will not cause the wafer 200 to move, thus ensuring the stability of the wafer 200 and ensuring the smooth progress of wafer 200 inspection.

[0056] Furthermore, such as Figures 2 to 4 As shown, the clamping member 12 includes a first clamping part 121 and a second clamping part 122, which are respectively used to abut against opposite sides of the edge of the wafer 200. Specifically, the first clamping part 121 and the second clamping part 122 are arranged facing each other. When it is necessary to clamp the wafer 200, the first clamping part 121 and the second clamping part 122 are respectively located on opposite sides of the edge of the wafer 200, and the first clamping part 121 and the second clamping part 122 move towards each other. When the first clamping part 121 and the second clamping part 122 abut against the edge of the wafer 200, the clamping member 12 clamps the wafer 200. Through the synchronous movement of the first clamping part 121 and the second clamping part 122, the position of the wafer 200 is changed. By setting the first clamping part 121 and the second clamping part 122, and by setting the first clamping part 121 and the second clamping part 122, the clamping effect of the clamping member 12 on the wafer 200 is further improved, thereby ensuring the stability of the wafer 200 and effectively ensuring the smooth progress of wafer 200 testing.

[0057] Furthermore, the transfer component 11 is a first robotic arm. The first robotic arm has a simple structure and high flexibility, which can effectively meet the transfer requirements of the wafer 200, thereby effectively improving the detection efficiency of the wafer 200.

[0058] Specifically, the first clamping part 121 is a second robotic arm. The second robotic arm has good flexibility, which facilitates the clamping of the wafer 200. In addition, the second robotic arm has a first slot, which is used to engage with the edge of the wafer 200, further improving the stability of clamping the wafer 200.

[0059] Specifically, the second gripping part 122 is a third robotic arm. The first robotic arm has good flexibility, which facilitates the gripping of the wafer 200. In addition, the third robotic arm has a second slot, which is used to engage with the edge of the wafer 200, further improving the stability of gripping the wafer 200.

[0060] like Figure 5As shown, the present invention also proposes a wafer pre-inspection control system 500, which includes a memory 52, a processor 51, and a control program stored in the memory 52 and executable on the processor 51. When the control program is executed by the processor 51, it implements the wafer pre-inspection method as described above.

[0061] The memory 52 may include high-speed random access memory (RAM) 52, or it may also include non-volatile memory 52, such as at least one disk storage device 52. Communication between this system network element and at least one other network element is achieved through at least one communication interface (which can be wired or wireless), such as the Internet, wide area network, local area network, metropolitan area network, etc.

[0062] The processor 51 may be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method can be completed by the integrated logic circuitry in the hardware of the processor 51 or by instructions in software form. The processor 51 may be a general-purpose processor 51, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor 51 may be a microprocessor 51, or it may be any conventional processor 51. The steps of the methods disclosed in the embodiments of this application can be directly manifested as being executed by the hardware decoding processor 51, or being executed by a combination of hardware and software modules in the decoding processor 51. The software module can reside in a mature storage medium in the art, such as random access memory 52, flash memory, read-only memory 52, programmable read-only memory 52, electrically erasable programmable memory 52, or registers. This storage medium is located in memory 52, and the processor 51 reads the information in memory 52 and, in conjunction with its hardware, completes the steps of the above method.

[0063] The present invention further proposes a computer-readable medium having computer-readable instructions stored thereon, which can be executed by processor 51 to implement the wafer pre-inspection method as described above.

[0064] It should be noted that the computer-readable medium may include, but is not limited to, optical discs, variable memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical and magnetic storage media, which will not be described in detail here.

[0065] The computer-readable storage medium provided in this embodiment is based on the same inventive concept as the control method of the cooking appliance provided in the above embodiments, and has the same beneficial effects as the methods adopted, run or implemented by the application stored therein.

[0066] It should be noted that the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0067] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0068] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some communication interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0069] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0070] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0071] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0072] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application.

Claims

1. A wafer pre-inspection method, characterized in that, The wafer pre-inspection method includes the following steps: Obtain the signal that the wafer has reached the detected position; Obtain the pressure difference on the back side of the wafer; Obtain a comparison value of the height difference on the back side of the wafer corresponding to the pressure difference; The comparison value is compared with a preset value, where the preset value is 100nm; Based on the comparison results, it is determined whether the wafer is qualified; The step of obtaining the pressure difference on the back side of the wafer further includes the following steps: Obtain the current pressure on the back side of the wafer; Obtain reference pressure; Calculate the difference between the current pressure and the reference pressure to obtain the pressure difference; The step of determining whether the wafer is qualified based on the comparison results further includes: Based on the comparison value being less than the preset value, it is determined that the wafer is not contaminated; The wafer is determined to be contaminated based on the comparison value being greater than the preset value. The wafer pre-inspection method is applied to a wafer pre-inspection device, which includes a pneumatic gauge. The pneumatic gauge includes an inlet pipe, a detection pipe, a reference pipe, a first branch pipe, a second branch pipe, a differential pressure sensor, a detection nozzle, and a reference nozzle. The detection pipe, the first branch pipe, and the detection nozzle form a detection end, and the reference pipe, the second branch pipe, and the reference nozzle form a reference end. The detection pipe and the reference pipe are respectively connected to the inlet pipe, the detection nozzle and the first branch pipe are respectively connected to the detection pipe, and the reference nozzle and the second branch pipe are respectively connected to the reference pipe. The differential pressure sensor is respectively connected to the first branch pipe and the second branch pipe. When the pneumatic gauge is activated, gas is blown towards the back of the wafer. When there is a foreign object on the back of the wafer, the pressure in the first branch pipe will change. At this time, the pressure values ​​on both sides of the differential pressure sensor will be different, thus generating a pressure difference. The pneumatic gauge outputs a comparison value with the height difference of the back of the wafer corresponding to the pressure difference.

2. A wafer pre-inspection apparatus for implementing the wafer pre-inspection method according to claim 1, characterized in that, The wafer pre-inspection device includes: A loading assembly that moves or removes a wafer to or from a detection location; A pneumatic gauge is installed at the detection location to detect whether there are foreign objects on the back side of the wafer.

3. The wafer pre-inspection device according to claim 2, characterized in that, The loading component includes: A transfer device for feeding the wafer into the wafer pre-inspection device; A clamping member for moving or removing the wafer, into which the transfer member has been inserted, to the detection position.

4. The wafer pre-inspection device according to claim 3, characterized in that, The clamping member includes a first clamping part and a second clamping part, which are respectively used to abut against opposite sides of the edge of the wafer.

5. The wafer pre-inspection device according to claim 4, characterized in that, The transfer component is a first robotic arm; And / or the first gripping part is a second robotic arm; And / or the second gripping part is a third robotic arm.

6. A wafer pre-inspection control system, characterized in that, The wafer pre-inspection control system includes a memory, a processor, and a control program stored in the memory and executable on the processor. When the control program is executed by the processor, it implements the wafer pre-inspection method according to claim 1.

7. A computer-readable medium, characterized in that, It stores computer-readable instructions that can be executed by a processor to implement the wafer pre-inspection method according to claim 1.

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