Foreign object detection device and foreign object detection method

Abstract

This foreign matter detection device comprises an acquisition unit and a determination unit. When a substrate work machine performs prescribed work on a substrate, the acquisition unit captures images of an inspection region of at least a portion of the substrate as the work on the substrate progresses, and acquires multiple pieces of image data resulting from capturing of images of the same inspection region. The determination unit determines the presence / absence of foreign matter adhered to the inspection region, on the basis of inspection region characteristic-amount differences, obtained by image processing: reference image data, which is a one piece of image data of said multiple pieces of image data; and inspection image data, which is image data to be inspected and acquired after the reference image data. Furthermore, if the work on the substrate stops after the acquisition of the reference image data but before the acquisition of the inspection image data, the acquisition unit acquires an image of the inspection region at the point in time when the work on the substrate stopped, to obtain image data, which is first image data.

Description

Technical Field

[0001] This specification discloses a technology related to a foreign object detection device and a foreign object detection method.

Background Art

[0002] The mounting line described in Patent Document 1 includes first camera means, second camera means, and image processing means. The first camera means is a camera means capable of including at least a part of a printed circuit board in its field of view, and is provided so as to be able to image the printed circuit board before the operation of mounting an electronic component in any mounting machine. The second camera means is a camera means capable of including a similar range as the first camera means in its field of view, and is provided so as to be able to image the printed circuit board after the operation of mounting an electronic component by any mounting machine or a mounting machine in a subsequent process than the said mounting machine.

[0003] The image processing means performs image processing by comparing the image data captured by the second camera means with the image data captured by the first camera means. Thereby, the mounting line described in Patent Document 1 attempts to detect an abnormality in solder printing when solder is printed on a printed circuit board, or an abnormality in mounting an electronic component when an electronic component is mounted on a printed circuit board.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] If foreign matter is present at the mounting location of a component, it may result in faulty component mounting. Therefore, it is necessary to determine whether or not foreign matter is present on the circuit board. In this case, it is envisioned that multiple image data captured from the same inspection area of ​​at least a portion of the circuit board will be compared, and the presence or absence of foreign matter will be determined based on the differences in the feature quantities of the image data.

[0006] However, there is a possibility that the board-to-board work performed by the board-to-board work machine may stop between the acquisition of the reference image data and the acquisition of the image data to be compared with that reference data. If the board-to-board work remains stopped, the state of the board may change, and there is a need to acquire the state of the board at the time the board-to-board work stopped.

[0007] In view of these circumstances, this specification discloses a foreign object detection device and a foreign object detection method capable of acquiring image data at the time when substrate processing is stopped. [Means for solving the problem]

[0008] This specification discloses a foreign object detection device comprising an acquisition unit and a determination unit. The acquisition unit images at least a portion of the inspection area of ​​a substrate as the substrate-to-substrate work progresses by a substrate-to-substrate work machine that performs a predetermined substrate-to-substrate work on the substrate, and acquires a plurality of image data of the same inspection area. The determination unit processes a reference image data, which is one of the plurality of image data, and an inspection image data, which is an image of the object to be inspected acquired after the reference image data, and determines the presence or absence of foreign objects adhering to the inspection area based on the difference in the feature quantities of the inspection area obtained by image processing. Furthermore, if the substrate-to-substrate work stops between the acquisition of the reference image data and the acquisition of the inspection image data, the acquisition unit images the inspection area and acquires a first image data, which is the image data at the time the substrate-to-substrate work stopped.

[0009] This specification also discloses a foreign object detection method comprising an acquisition step and a determination step. The acquisition step involves imaging at least a portion of the inspection area of ​​a substrate as the substrate work progresses using a substrate work machine that performs a predetermined substrate work on the substrate, thereby acquiring a plurality of image data of the same inspection area. The determination step involves image processing of a reference image data, which is one of the plurality of image data, and an inspection image data, which is the image data of the object to be inspected acquired after the reference image data, to determine the presence or absence of foreign objects adhering to the inspection area based on the difference in the feature quantities of the inspection area acquired. Furthermore, if the substrate work stops between the acquisition of the reference image data and the acquisition of the inspection image data, the acquisition step images the inspection area and acquires first image data, which is the image data at the time the substrate work stopped.

[0010] Furthermore, this specification discloses a technical concept in which, in claim 6 of the claims initially attached to the application (hereinafter referred to as the initial claims), "the foreign object detection device described in claim 1" is changed to "the foreign object detection device described in any one of claims 1 to 5". Also, this specification discloses a technical concept in which, in claim 9 of the initial claims, "the foreign object detection device described in claim 1" is changed to "the foreign object detection device described in any one of claims 1 to 8". Furthermore, this specification discloses a technical concept in which, in claim 11 of the initial claims, "the foreign object detection device described in claim 1" is changed to "the foreign object detection device described in any one of claims 1 to 10". Also, this specification discloses a technical concept in which, in claim 12 of the initial claims, "the foreign object detection device described in claim 1" is changed to "the foreign object detection device described in any one of claims 1 to 10". Furthermore, this specification discloses a technical idea in which, in claim 13 as described in the original claims, "the foreign object detection device described in claim 1" is changed to "the foreign object detection device described in any one of claims 1 to 10 and claim 12". [Effects of the Invention]

[0011] According to the foreign object detection device described above, it is possible to obtain the first image data, which is the image data at the point when the substrate work is stopped. The same applies to the foreign object detection method as described above regarding the foreign object detection device. [Brief explanation of the drawing]

[0012] [Figure 1] This is a diagram showing an example of a circuit board work line configuration. [Figure 2] This is a plan view showing an example configuration of a parts mounting machine. [Figure 3] This is a block diagram showing an example of a control block for a foreign object detection device. [Figure 4] This flowchart shows an example of a control procedure using a foreign object detection device. [Figure 5] This is a schematic diagram showing an example of reference image data. [Figure 6] This is a schematic diagram showing an example of inspection image data. [Figure 7] This is a schematic diagram showing an example of the state of a circuit board before the circuit board work is stopped. [Figure 8] This is a schematic diagram showing an example of the condition of a circuit board after work on the board has resumed. [Modes for carrying out the invention]

[0013] 1. Embodiment 1-1. Example configuration of the PCB work line WL0 In the substrate processing line WL0, a substrate processing machine WM0 performs predetermined substrate processing on the substrate 90. The type and number of substrate processing machines WM0 constituting the substrate processing line WL0 are not limited. As shown in Figure 1, the substrate processing line WL0 of this embodiment is equipped with multiple substrate processing machines WM0, including a printing press WM1, a printing inspection machine WM2, a component mounting machine WM3, a reflow oven WM4, and a visual inspection machine WM5, and the substrate 90 is transported in the above order by a substrate transport device.

[0014] The printing machine WM1 prints solder at the mounting positions of a plurality of components 91 on the substrate 90. The printing inspection machine WM2 inspects the printing state of the solder printed by the printing machine WM1. As shown in FIG. 2, the component mounting machine WM3 mounts a plurality of components 91 on the substrate 90 on which solder has been printed by the printing machine WM1. The component mounting machine WM3 may be one or a plurality. When a plurality of component mounting machines WM3 are provided, the plurality of component mounting machines WM3 can share the mounting of the plurality of components 91.

[0015] The reflow furnace WM4 heats the substrate 90 on which a plurality of components 91 have been mounted by the component mounting machine WM3, melts the solder, and performs soldering. The appearance inspection machine WM5 inspects the mounting state and the like of the plurality of components 91 mounted by the component mounting machine WM3. Thus, the substrate processing line WL0 can produce the substrate product 900 by sequentially conveying the substrate 90 using a plurality of substrate processing machines WM0 and executing production processing including inspection processing. Note that the substrate processing line WL0 may be provided with substrate processing machines WM0 such as a function inspection machine, a buffer device, a substrate supply device, a substrate inversion device, a shield mounting device, an adhesive application device, an ultraviolet irradiation device, etc., as necessary.

[0016] The plurality of substrate processing machines WM0 and the line management device LC0 constituting the substrate processing line WL0 are communicably connected by a communication unit. Also, the line management device LC0 and the management device HC0 are communicably connected by a communication unit. The communication unit can communicably connect these by wire or wirelessly, and the communication method can take various methods.

[0017] In an embodiment, a local area network (LAN) of in-plant information communication network is configured by a plurality of substrate processing machines WM0, a line management device LC0, and a management device HC0. Therefore, the plurality of substrate processing machines WM0 can communicate with each other via a communication unit. Also, the plurality of substrate processing machines WM0 can communicate with the line management device LC0 via the communication unit. Further, the line management device LC0 and the management device HC0 can communicate with each other via the communication unit.

[0018] The line management device LC0 controls a plurality of substrate processing machines WM0 that constitute the substrate processing line WL0, and monitors the operating status of the substrate processing line WL0. Various control data for controlling the plurality of substrate processing machines WM0 are stored in the line management device LC0. The line management device LC0 transmits the control data to each of the plurality of substrate processing machines WM0. Also, each of the plurality of substrate processing machines WM0 transmits the operating status and production status to the line management device LC0.

[0019] The management device HC0 manages at least one line management device LC0. For example, the operating status and production status of the substrate processing machine WM0 acquired by the line management device LC0 are transmitted to the management device HC0 as necessary. A storage device is provided in the management device HC0. The storage device can store various acquired data acquired by the substrate processing machine WM0. For example, various image data captured by the substrate processing machine WM0 are included in the acquired data. Records (log data) of the operating status acquired by the substrate processing machine WM0 and the like are included in the acquired data. Also, the storage device can store various production information related to the production of the substrate product 900.

[0020] The substrate processing line WL0 includes an input / output device 80. A known input / output device can be used as the input / output device 80. The input / output device 80 includes a display unit that visibly displays various data. Also, the display unit is configured by a touch panel and also functions as an input device that accepts various operations by an operator.

[0021] 1-2. Example configuration of the WM3 component mounting machine The component mounting machine WM3 mounts multiple components 91 onto the substrate 90. As shown in Figure 2, the component mounting machine WM3 includes a substrate transport device 11, a component supply device 12, a component transfer device 13, a component camera 14, a substrate camera 15, and a control device 16.

[0022] The substrate transport device 11 is composed of, for example, a belt conveyor and transports the substrate 90 in the transport direction (X-axis direction). The substrate 90 is a circuit board on which electronic circuits, electrical circuits, magnetic circuits, etc., are formed. The substrate transport device 11 carries the substrate 90 into the component mounting machine WM3 and positions the substrate 90 at a predetermined position inside the machine. After the component mounting machine WM3 has finished mounting multiple components 91, the substrate transport device 11 transports the substrate 90 out of the component mounting machine WM3.

[0023] The component supply device 12 supplies multiple components 91 to be mounted on the substrate 90. The component supply device 12 is equipped with multiple feeders 12a that are provided along the transport direction (X-axis direction) of the substrate 90. Each of the multiple feeders 12a is equipped with a reel. A carrier tape containing multiple components 91 is wound around the reel. The feeders 12a feed the carrier tape in a pitch, supplying the components 91 in a pickable manner at the supply position located at the tip of the feeder 12a. The component supply device 12 can also supply relatively large electronic components (for example, leaded components) compared to chip components, etc., in a state where they are arranged on a tray.

[0024] The component transfer device 13 comprises a head drive device 13a and a mobile table 13b. The head drive device 13a is configured to move the mobile table 13b in the X-axis direction and the Y-axis direction (directions perpendicular to the X-axis direction in the horizontal plane) by a linear motion mechanism. A mounting head 20 is detachably (replaceable) attached to the mobile table 13b by a clamping member. The mounting head 20 uses at least one holding member 30 to pick up and hold the component 91 supplied by the component supply device 12 and mount the component 91 onto the substrate 90 positioned by the substrate transport device 11. The holding member 30 can be, for example, a suction nozzle, a chuck, or the like.

[0025] The component camera 14 and the substrate camera 15 can use known imaging devices. The component camera 14 is fixed to the base of the component mounting machine WM3 so that its optical axis is upward in the vertical direction (Z-axis direction perpendicular to the X-axis and Y-axis directions). The component camera 14 can image the component 91 held by the holding member 30 from below. The substrate camera 15 is mounted on the movable table 13b of the component transfer device 13 so that its optical axis is downward in the vertical direction (Z-axis direction). The substrate camera 15 can image the substrate 90 from above. The component camera 14 and the substrate camera 15 perform imaging based on control signals sent from the control device 16. Image data of the images captured by the component camera 14 and the substrate camera 15 is transmitted to the control device 16.

[0026] The control device 16 is equipped with a known arithmetic unit and memory device, and constitutes a control circuit. The control device 16 receives information such as data output from various sensors provided on the component mounting machine WM3. The control device 16 sends control signals to each device based on a control program and predetermined mounting conditions set in advance.

[0027] For example, the control device 16 causes the substrate camera 15 to image the substrate 90 positioned by the substrate transport device 11. The control device 16 processes the image captured by the substrate camera 15 to recognize the positioning state of the substrate 90. The control device 16 also causes the holding member 30 to pick up and hold the component 91 supplied by the component supply device 12, and causes the component camera 14 to image the component 91 held by the holding member 30. The control device 16 processes the image captured by the component camera 14 to recognize the holding posture of the component 91.

[0028] The control device 16 moves the holding member 30 upwards towards the planned mounting position, which is predetermined by a control program or the like. The control device 16 also corrects the planned mounting position based on the positioning state of the substrate 90, the holding posture of the component 91, etc., to set the actual mounting position for the component 91. The planned mounting position and the mounting position include rotation angles in addition to position (X-axis coordinates and Y-axis coordinates).

[0029] The control device 16 corrects the target position (X-axis coordinates and Y-axis coordinates) and rotation angle of the holding member 30 to match the mounting position. The control device 16 lowers the holding member 30 at the corrected rotation angle at the corrected target position and mounts the component 91 onto the substrate 90. The control device 16 repeats the above pick-and-place cycle to perform a mounting process in which multiple components 91 are mounted onto the substrate 90.

[0030] 1-3. Example of the configuration of the foreign object detection device 70 As shown in Figure 2, if foreign matter 92 (e.g., other parts 91, dust, etc.) is attached to the mounting position of part 91, there is a possibility that the mounting of part 91 will be defective (e.g., not mounted, floating, tilted, etc.), and it is necessary to determine whether or not foreign matter 92 is attached to the substrate 90. In this case, it is assumed that multiple image data PD0s, each capturing at least a portion of the same inspection area CA0 of the substrate 90, will be compared, and the presence or absence of foreign matter 92 will be determined based on the differences in the feature quantities (e.g., pixel brightness, etc.) of the image data PD0s.

[0031] However, there is a possibility that the substrate work performed by the substrate work machine WM0 may stop between the acquisition of the reference image data PD0 and the acquisition of the image data PD0 to be compared with the reference image data PD0. If the substrate work remains stopped, the state of the substrate 90 may change, and there is a need to acquire the state of the substrate 90 at the time the substrate work stopped. Therefore, the substrate work line WL0 of the embodiment is equipped with a foreign object detection device 70 capable of acquiring image data at the time the substrate work stopped.

[0032] When considered as a control block, the foreign object detection device 70 comprises an acquisition unit 71 and a determination unit 72. The foreign object detection device 70 may also include an estimation unit 73. The foreign object detection device 70 may also include a guide unit 74. As shown in Figure 3, the foreign object detection device 70 of the embodiment comprises an acquisition unit 71, a determination unit 72, an estimation unit 73, and a guide unit 74.

[0033] The foreign object detection device 70 can be installed in various control devices. For example, the foreign object detection device 70 can be installed in the control device 16 of the component mounting machine WM3, the line management device LC0, the management device HC0, etc. The foreign object detection device 70 can also be formed on the cloud. As shown in Figure 3, in the foreign object detection device 70 of this embodiment, the acquisition unit 71, the judgment unit 72, the estimation unit 73, and the guidance unit 74 are installed in the control device 16 of the component mounting machine WM3.

[0034] Furthermore, the foreign object detection device 70 of the embodiment performs control according to the flowchart shown in Figure 4. The acquisition unit 71 performs the processes shown in steps S11, S12, S16, and S17. The determination unit 72 performs part of step S13 and the processes shown in step S18. The estimation unit 73 performs part of step S13. The guidance unit 74 performs the processes shown in steps S14, S15, S19, and S20.

[0035] 1-3-1. Example of control when board-side work is performed normally The acquisition unit 71 images at least a portion of the inspection area CA0 of the substrate 90 as the substrate work progresses by the substrate work machine WM0, which performs predetermined substrate work on the substrate 90, and acquires multiple image data PD0 of the same inspection area CA0.

[0036] The acquisition unit 71 may image the entire mounting area of ​​the substrate 90 as the inspection area CA0, or it may image only a portion of the mounting area of ​​the substrate 90. When the acquisition unit 71 images only a portion of the mounting area of ​​the substrate 90, it can, for example, image the mounting area of ​​components 91 that have a larger number of electrodes than chip components and are more susceptible to the effects of foreign matter 92 (for example, components 91 of a BGA (Ball Grid Array)). Furthermore, based on past mounting records, the acquisition unit 71 can identify mounting areas where mounting defects of components 91 have occurred due to foreign matter 92, mounting areas where foreign matter 92 is likely to adhere, etc., and image these mounting areas as the inspection area CA0.

[0037] The acquisition unit 71 can also designate an area specified by the operator of the component mounting machine WM3, which mounts components 91 onto the substrate 90, as the inspection area CA0. The substrate work line WL0 of this embodiment is equipped with an input / output device 80. The operator can, for example, use the input / output device 80 to designate any area (the entire mounting area of ​​the substrate 90 or a portion of the mounting area of ​​the substrate 90) as the inspection area CA0. In this case, the acquisition unit 71 can schematically display the mounting areas of the components 91 on the substrate 90 on the display unit of the input / output device 80, allowing the operator to select any mounting area.

[0038] The acquisition unit 71 can acquire image data PD0 using an imaging device capable of imaging the inspection area CA0. The imaging device is not limited to any device that can image the inspection area CA0. For example, a substrate camera 15 capable of imaging a portion of the mounting area of ​​the substrate 90 from above the substrate 90, and a ceiling camera capable of imaging the entire mounting area of ​​the substrate 90 from above the substrate 90 are included in the imaging device. In this embodiment, the substrate camera 15 is used, and the acquisition unit 71 designates the area specified by the operator of the component mounting machine WM3 as the inspection area CA0. The acquisition unit 71 then sets the imaging conditions (e.g., exposure time, aperture, illumination time, etc.) that can be set by the imaging device to be the same, and images the same inspection area CA0 multiple times to acquire multiple image data PD0.

[0039] The determination unit 72 determines the presence or absence of foreign matter 92 adhering to the inspection area CA0 based on the difference in the feature quantities of the inspection area CA0 obtained by image processing the reference image data SD0 and the inspection image data CD0, respectively. The reference image data SD0 refers to one of the multiple image data PD0s acquired by the acquisition unit 71. The inspection image data CD0 refers to the image data PD0 of the object to be inspected, which is acquired by the acquisition unit 71 after the reference image data SD0.

[0040] The determination unit 72 only needs to be able to determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 based on the difference in the feature quantities of the inspection area CA0, and can take various forms. For example, the determination unit 72 determines that there is foreign matter 92 in the inspection area CA0 if the difference in the feature quantities of the inspection area CA0 obtained from two image data PD0 (in this case, reference image data SD0 and inspection image data CD0) exceeds a predetermined threshold. The determination unit 72 determines that there is no foreign matter 92 in the inspection area CA0 if the difference in the feature quantities is less than or equal to the predetermined threshold.

[0041] The features can be anything obtainable by image processing of the image data PD0, and are not limited to those features. The brightness, saturation, and lightness of each pixel of the two image data PD0 (reference image data SD0 and inspection image data CD0) are included as features. In addition, the area of ​​a closed region and the length of the perimeter of a closed region obtained by image processing (e.g., binarization) of each of the two image data PD0 (reference image data SD0 and inspection image data CD0) are also included as features. In this embodiment, the features are the brightness of each pixel of the two image data PD0 (reference image data SD0 and inspection image data CD0).

[0042] The predetermined threshold is set to be greater than the feature quantity (e.g., pixel brightness) when no foreign object 92 is attached to the inspection area CA0, and less than the feature quantity when foreign object 92 is attached to the inspection area CA0. The predetermined threshold is acquired in advance, for example, through simulation or verification using an actual device.

[0043] Figures 5 and 6 schematically show an example of multiple (two) image data PD0 acquired by the acquisition unit 71. Figure 5 shows the reference image data SD0, and Figure 6 shows the inspection image data CD0. For ease of explanation, multiple pixels arranged in a grid are shown together in Figures 5 and 6. Furthermore, the region AR0 shown in Figures 5 and 6 represents the same region (a set of the same multiple pixels) within the inspection region CA0.

[0044] If foreign matter 92 is present in region AR0, the difference between the brightness of the pixels in region AR0 shown in Figure 5 and the brightness of the pixels in region AR0 shown in Figure 6 exceeds a predetermined threshold. Conversely, if foreign matter 92 is not present in region AR0, the difference between the brightness of the pixels in region AR0 shown in Figure 5 and the brightness of the pixels in region AR0 shown in Figure 6 is less than or equal to the predetermined threshold.

[0045] Therefore, the determination unit 72 determines that there is a foreign object 92 in the inspection area CA0 when the difference between the brightness of a pixel in area AR0 shown in Figure 5 and the brightness of a pixel in area AR0 shown in Figure 6 exceeds a predetermined threshold. The determination unit 72 determines that there is no foreign object 92 in the inspection area CA0 when the difference between the brightness of a pixel in area AR0 shown in Figure 5 and the brightness of a pixel in area AR0 shown in Figure 6 is less than or equal to a predetermined threshold. Note that the brightness comparison is performed for each corresponding pixel.

[0046] The acquisition unit 71 can acquire reference image data SD0 and inspection image data CD0 at predetermined timings. As shown in Figure 1, the substrate 90 is sequentially transported to a plurality of component mounting machines WM3, which are substrate work machines WM0 (three in the figure), and a plurality of components 91 are mounted. For the sake of explanation, the upstream component mounting machine WM3 of the plurality (three) component mounting machines WM3 will be referred to as component mounting machine M1. The next component mounting machine WM3 downstream of component mounting machine M1 will be referred to as component mounting machine M2. Furthermore, the next component mounting machine WM3 downstream of component mounting machine M2 will be referred to as component mounting machine M3.

[0047] In the above-mentioned board-to-board work line WL0, for example, the acquisition unit 71 acquires reference image data SD0 at the upstream component mounting machine WM3 (component mounting machine M1) among the multiple (three) component mounting machines WM3. More specifically, the acquisition unit 71 acquires reference image data SD0 by imaging the inspection area CA0 before the component mounting process of component 91 is started at component mounting machine M1.

[0048] Furthermore, the acquisition unit 71 acquires inspection image data CD0 in the component mounting machine WM3 (for example, component mounting machine M3) that mounts the component 91 in the inspection area CA0. More specifically, the acquisition unit 71 acquires inspection image data CD0 by imaging the inspection area CA0 in the component mounting machine M3 before mounting the component 91 that is to be mounted in the inspection area CA0. In this case, the determination unit 72 can determine whether or not foreign matter 92 adheres to the inspection area CA0 while the substrate 90 is transported across multiple (three) component mounting machines WM3. In this specification, the above embodiment is referred to as the first embodiment.

[0049] The acquisition unit 71 can also acquire reference image data SD0 and inspection image data CD0 in each of the multiple (three) component mounting machines WM3. The acquisition unit 71 acquires reference image data SD0 by imaging the inspection area CA0 in each of at least one component mounting machine WM3 (component mounting machine M1 and component mounting machine M2) located upstream of the component mounting machine WM3 (e.g., component mounting machine M3) that mounts the component 91 in the inspection area CA0, before starting the mounting process for the component 91. The acquisition unit 71 acquires inspection image data CD0 by imaging the inspection area CA0 in each of the above component mounting machines WM3 (component mounting machine M1 and component mounting machine M2) after the mounting process for the component 91 has been completed.

[0050] Furthermore, the acquisition unit 71 acquires reference image data SD0 by imaging the inspection area CA0 in the component mounting machine WM3 (for example, component mounting machine M3) that mounts the component 91 to the inspection area CA0 before starting the mounting process of the component 91. The acquisition unit 71 acquires inspection image data CD0 by imaging the inspection area CA0 in the above-mentioned component mounting machine WM3 (component mounting machine M3) before mounting the component 91 that is to be mounted to the inspection area CA0. In these cases, the determination unit 72 can determine whether or not there is foreign matter 92 adhering to the inspection area CA0 in each of the multiple (three) component mounting machines WM3. In this specification, the above embodiment is referred to as the second embodiment.

[0051] The acquisition unit 71 can also acquire reference image data SD0 and inspection image data CD0 between adjacent component mounting machines WM3. The acquisition unit 71 acquires reference image data SD0 in one of the multiple (three) component mounting machines WM3. More specifically, the acquisition unit 71 captures the inspection area CA0 and acquires reference image data SD0 after the component mounting process 91 has been completed in the component mounting machine WM3 and before the substrate 90 is discharged.

[0052] Furthermore, the acquisition unit 71 acquires inspection image data CD0 at the next component mounting machine WM3 downstream from the component mounting machine WM3. More specifically, the acquisition unit 71 captures the inspection area CA0 and acquires inspection image data CD0 after the substrate 90 has been loaded into the component mounting machine WM3 and before the component mounting process 91 is started in the component mounting machine WM3. In these cases, the determination unit 72 can determine whether or not foreign matter 92 adheres to the inspection area CA0 when the substrate 90 is transported between adjacent component mounting machines WM3. In this specification, the above configuration is referred to as the third configuration.

[0053] 1-3-2. Example of control when board-side work stops For example, the board-to-board work machine WM0 may stop board-to-board work if the image processing result of the image data PD0 acquired by the imaging device (for example, component camera 14 and board camera 15 in the component mounting machine WM3) is unsatisfactory. Furthermore, the board-to-board work machine WM0 may stop board-to-board work if a situation arises that prevents it from continuing (for example, a shortage of components 91 to be mounted in the component mounting machine WM3). Additionally, an operator may stop board-to-board work by the board-to-board work machine WM0 by pressing the stop button.

[0054] The acquisition unit 71 acquires first image data PD1 by imaging the inspection area CA0 if the substrate inspection process stops between acquiring the reference image data SD0 and acquiring the inspection image data CD0 (in the case of Yes in step S11 and step S12 shown in Figure 4). The first image data PD1 refers to the image data PD0 at the time the substrate inspection process stops. The acquisition unit 71 can acquire the first image data PD1 by imaging the inspection area CA0 at the time the substrate inspection process stops, in the same manner as when the substrate inspection process is being performed normally. As a result, the foreign object detection device 70 can acquire the image data PD0 at the time the substrate inspection process stops, and can understand the state of the substrate 90 at the time the substrate inspection process stops.

[0055] Furthermore, the determination unit 72 can determine the presence or absence of foreign matter 92 based on the difference in feature quantities of the inspection area CA0 obtained by image processing the reference image data SD0 and the first image data PD1, respectively (step S13 shown in Figure 4). The determination unit 72 can determine the presence or absence of foreign matter 92 in the same manner as when the substrate inspection is performed normally.

[0056] Specifically, the determination unit 72 determines that there is a foreign object 92 in the inspection area CA0 if the difference in feature quantities of the inspection area CA0 obtained from two image data PD0 (in this case, reference image data SD0 and first image data PD1) exceeds a predetermined threshold. The determination unit 72 determines that there is no foreign object 92 in the inspection area CA0 if the difference in the above feature quantities is less than or equal to the predetermined threshold. As previously described, the feature quantities are not limited. In this embodiment, the feature quantities are the brightness of each pixel of the two image data PD0 (reference image data SD0 and first image data PD1).

[0057] Figure 7 shows an example of the state of the substrate 90 until the substrate work is stopped. In this figure, using the first configuration as an example, the state of the substrate 90 until the substrate work is stopped in the component mounting machine M2 is schematically shown using image data PD0. Specifically, in the upstream component mounting machine M1 of the multiple (three) component mounting machines WM3, the acquisition unit 71 acquires reference image data SD0.

[0058] Then, the substrate 90 is transported to the next component mounting machine M2, which is downstream from component mounting machine M1, and it is assumed that the substrate processing has stopped at component mounting machine M2. The acquisition unit 71, at the moment the substrate processing has stopped at component mounting machine M2, captures an image of the inspection area CA0 and acquires the first image data PD1. The reference image data SD0 and the first image data PD1 shown in the figure show little difference in the feature quantities of the inspection area CA0 (the difference in feature quantities is below a predetermined threshold), and the judgment unit 72 determines that there is no foreign matter 92 in the inspection area CA0. Note that in the figure, the target substrate 90 has not yet been transported to the next component mounting machine M3, which is downstream from component mounting machine M2, and the image data PD0 is shown as blank.

[0059] Thus, the determination unit 72 can unconditionally determine the presence or absence of foreign matter 92 when the first image data PD1 is acquired by the acquisition unit 71. This allows the determination unit 72 to determine the presence or absence of foreign matter 92 adhering to the inspection area CA0 from the time the reference image data SD0 is acquired by the acquisition unit 71 until the substrate inspection is stopped. Furthermore, as shown below, the determination unit 72 can also determine the presence or absence of foreign matter 92 when predetermined conditions are met. For example, the feature quantities of the inspection area CA0 acquired by image processing of the image data PD0 may change over time due to changes in the bonding member 93 that joins the substrate 90 and the component 91, which is applied to the inspection area CA0 of the substrate 90.

[0060] The joining member 93 can be any member that joins the substrate 90 and the component 91, and is not limited to any other member. For example, solder, adhesive, etc. are included in the joining member 93. In this embodiment, the joining member 93 is solder. Solder changes color from silver to gray as the flux it contains dries. Therefore, the characteristic quantities of the inspection area CA0 may change due to the change in solder over time, and the judgment unit 72 may mistakenly identify the solder as a foreign object 92.

[0061] Here, the time from when the substrate-to-substrate operation is stopped until it is restarted is defined as the stop time Q0. Furthermore, the allowable time T0 is defined as the stop time Q0 during which the bonding member 93, which joins the substrate 90 and component 91 applied to the inspection area CA0, does not misidentify the bonding member 93 as a foreign object 92 even if the characteristic quantities of the inspection area CA0 change due to changes in the bonding member 93 over time. The shorter the stop time Q0 is than the allowable time T0, the less the component mounting machine M3 is affected by changes in the bonding member 93 over time when determining the presence or absence of a foreign object 92, and the need to determine the presence or absence of a foreign object 92 in the component mounting machine M2 when the substrate-to-substrate operation is stopped decreases.

[0062] Conversely, if the stop time Q0 becomes longer than the allowable time T0, the component mounting machine M3 becomes more susceptible to the effects of changes in the bonding member 93 over time when determining the presence or absence of foreign matter 92, and the determination unit 72 is more likely to misidentify the bonding member 93 as foreign matter 92. Therefore, it becomes more important to determine the presence or absence of foreign matter 92 in the component mounting machine M2 when the substrate work is stopped. Accordingly, the estimation unit 73 estimates the stop time Q0 from when the substrate work is stopped until it is restarted (step S13 shown in Figure 4).

[0063] The estimation unit 73 only needs to be able to estimate the stop time Q0, and can take various forms. For example, the estimation unit 73 can estimate the stop time Q0 based on the reason why the substrate processing stopped (for example, a defective result when image processing the image data PD0). In this case, the estimation unit 73 stores in advance, in association with the reason why the substrate processing stopped and the stop time Q0 from when the substrate processing stopped until it resumed, each time the substrate product 900 is produced. The stop time Q0 can be expressed, for example, by the average value, median value, etc.

[0064] If the substrate processing operation stops during the production of the substrate product 900, the estimation unit 73 outputs the stop time Q0 (for example, the average or median) stored in association with the cause of the stop time to the determination unit 72. The determination unit 72 can then determine the presence or absence of foreign matter 92 if the estimation unit 73 estimates a stop time Q0 that is longer than the allowable time T0 (step S13 shown in Figure 4).

[0065] Furthermore, for example, if an operator takes action when the substrate work stops, the actual stop time Q0 may be longer than the stop time Q0 estimated by the estimation unit 73. Therefore, the determination unit 72 can also determine the presence or absence of foreign matter 92 if, after the estimation unit 73 has estimated a stop time Q0 within the allowable time T0, a stop time Q0 longer than the allowable time T0 is expected.

[0066] The allowable time T0 can be obtained in advance, for example, through simulation or verification using an actual machine. Furthermore, the allowable time T0 may differ depending on the type of joining member 93, and the judgment unit 72 can also use the allowable time T0 corresponding to the type of joining member 93. For example, the judgment unit 72 can use the allowable time T0 corresponding to the type of solder. Alternatively, the judgment unit 72 can use the allowable time T0 corresponding to the type of adhesive.

[0067] Furthermore, the higher the temperature inside the component mounting machine WM3, the faster the flux contained in the solder tends to dry. Also, the lower the humidity inside the component mounting machine WM3, the faster the flux contained in the solder tends to dry. Therefore, the determination unit 72 can also use an allowable time T0 that corresponds to at least one of the temperature and humidity inside the component mounting machine WM3 when mounting the components 91 onto the substrate 90.

[0068] The guidance unit 74 informs the operator of the presence of foreign matter 92 in the inspection area CA0 when the determination unit 72 determines that foreign matter 92 is present (in the case of Yes in step S14 and step S15 shown in Figure 4). The guidance unit 74 only needs to be able to inform the operator of the presence of foreign matter 92 and can take various forms. For example, the substrate work line WL0 in this embodiment is equipped with an input / output device 80. The guidance unit 74 can use the input / output device 80 to inform the operator of the presence of foreign matter 92 (for example, by display, voice guidance, etc.).

[0069] Specifically, the guide unit 74 can provide information about the presence of a substrate 90 with foreign matter 92 attached, the location of the foreign matter 92 on the substrate 90, and the substrate handling machine WM0 where the substrate 90 is located. This allows the worker to identify the substrate 90 with foreign matter 92 attached and take appropriate action (for example, removing the substrate 90). The guide unit 74 can also provide similar information about the presence of foreign matter 92 to the worker using a portable terminal device owned by the worker (for example, display, voice guidance, vibration, etc.).

[0070] The acquisition unit 71, when the substrate inspection work is resumed, images the inspection area CA0 to acquire the second image data PD2 and updates the reference image data SD0 with the second image data PD2 (in the case of Yes in step S16 and step S17 shown in Figure 4). The second image data PD2 refers to the image data PD0 at the time the substrate inspection work is resumed. The acquisition unit 71 can acquire the second image data PD2 by imaging the inspection area CA0 at the time the substrate inspection work is resumed, in the same manner as when the substrate inspection work is being performed normally. As a result, the foreign object detection device 70 can acquire the image data PD0 at the time the substrate inspection work is resumed.

[0071] As previously described, if the stop time Q0 from the time the substrate work is stopped until it is restarted is longer than the allowable time T0, the component mounting machine M3 becomes more susceptible to the effects of changes in the bonding member 93 over time when determining the presence or absence of foreign matter 92, and the determination unit 72 is more likely to misidentify the bonding member 93 as foreign matter 92. Therefore, the acquisition unit 71 can update the reference image data SD0 with the second image data PD2 when the stop time Q0 is longer than the allowable time T0.

[0072] Furthermore, even if the stop time Q0 between the cessation and resumption of substrate work is within the allowable time T0, the bonding member 93 changes over time. Therefore, regardless of the stop time Q0, the acquisition unit 71 can also capture an image of the inspection area CA0 and acquire a second image data PD2 when substrate work is resumed, and update the reference image data SD0 with the second image data PD2.

[0073] The determination unit 72 determines the presence or absence of foreign matter 92 based on the difference in the feature quantities of the inspection area CA0 obtained by image processing the updated reference image data SD0 and the inspection image data CD0, respectively (step S18 shown in Figure 4). The determination unit 72 can determine the presence or absence of foreign matter 92 in the same way as when the substrate inspection is performed normally.

[0074] Specifically, the determination unit 72 determines that there is a foreign object 92 in the inspection area CA0 if the difference in feature quantities of the inspection area CA0 obtained from the two image data PD0 (in this case, the updated reference image data SD0 and the inspection image data CD0) exceeds a predetermined threshold. The determination unit 72 determines that there is no foreign object 92 in the inspection area CA0 if the difference in the above feature quantities is less than or equal to the predetermined threshold. As previously described, the feature quantities are not limited. In this embodiment, the feature quantities are the brightness of each pixel in the two image data PD0 (the updated reference image data SD0 and the inspection image data CD0).

[0075] Figure 8 shows an example of the state of the substrate 90 after board-to-board work has resumed. In this figure, using the first embodiment as an example, the state of the substrate 90 after board-to-board work has resumed in the component mounting machine M2 is schematically shown using image data PD0. Specifically, in the component mounting machine M2 where board-to-board work has resumed, the acquisition unit 71 images the inspection area CA0 at the time the board-to-board work resumes to acquire second image data PD2, and updates the reference image data SD0 with the second image data PD2.

[0076] In the figure, the bonding member 93 is shown in black for illustrative purposes, schematically illustrating how the bonding member 93 changes over time while the substrate processing is stopped. The substrate 90 is then transported to the next component mounting machine M3, which is downstream from the component mounting machine M2. At the component mounting machine M3, the acquisition unit 71 acquires the inspection image data CD0. If the reference image data SD0 is not updated by the second image data PD2, the determination unit 72 will determine the presence or absence of foreign matter 92 based on the difference in the feature quantities of the inspection area CA0 acquired by image processing the reference image data SD0 shown in Figure 7 and the inspection image data CD0 shown in Figure 8, respectively.

[0077] In this case, the feature quantities of the inspection area CA0 obtained by image processing the reference image data SD0 shown in Figure 7 (joining member 93 is white) and the feature quantities of the inspection area CA0 obtained by image processing the inspection image data CD0 shown in Figure 8 (joining member 93 is black) differ significantly, and the difference in feature quantities exceeds a predetermined threshold. Therefore, the judgment unit 72 incorrectly determines that there is a foreign object 92 in the inspection area CA0. In contrast, when the reference image data SD0 is updated by the second image data PD2, the judgment unit 72 determines the presence or absence of a foreign object 92 based on the difference in the feature quantities of the inspection area CA0 obtained by image processing the reference image data SD0 and the inspection image data CD0 shown in Figure 8, respectively.

[0078] In this case, the feature quantities of the inspection area CA0 obtained by image processing the reference image data SD0 shown in Figure 8 (joining member 93 is black) and the feature quantities of the inspection area CA0 obtained by image processing the inspection image data CD0 shown in Figure 8 (joining member 93 is black) show little difference, and the difference in feature quantities is below a predetermined threshold. Therefore, the judgment unit 72 determines that there is no foreign matter 92 in the inspection area CA0. In other words, misjudgment of foreign matter 92 due to changes in the joining member 93 over time is suppressed. Note that Figure 8 shows the state of the substrate 90 after the substrate work has resumed, and the image data PD0 of the component mounting machine M1 upstream of the component mounting machine M2 is shown as blank.

[0079] The guide unit 74 informs the operator of the presence of foreign matter 92 in the inspection area CA0 when the determination unit 72 determines that foreign matter 92 is present (in the case of Yes in step S19 and step S20 shown in Figure 4). The guide unit 74 can also inform the operator of the presence of foreign matter 92 in the same manner as when informing the operator of the presence of foreign matter 92 immediately after the substrate work has stopped. Then, the control by the foreign matter detection device 70 is terminated.

[0080] If the result is No in steps S11 and S19 shown in Figure 4, the control by the foreign object detection device 70 is terminated. Also, if the result is No in step S14, the control by the foreign object detection device 70 proceeds to the control shown in step S16. Furthermore, if the result is No in step S16, the control by the foreign object detection device 70 returns to the control shown in step S16 and waits until the substrate work is resumed.

[0081] Furthermore, the matters described herein can be combined and selected as appropriate. For example, although this specification describes the first form as an example, the matters described herein can also be applied to the second or third form. Furthermore, the matters described herein can also be applied to a form that combines the second and third forms. In the third form, since the substrate work stops when the substrate 90 is transported between adjacent component mounting machines WM3, an imaging device capable of acquiring the first image data PD1 and the second image data PD2 is provided between adjacent component mounting machines WM3. In addition, in the first, second, and third forms, a configuration can be selected in which, when the substrate work is performed normally without stopping, the time required from when the reference image data SD0 is acquired by the acquisition unit 71 until the inspection image data CD0 is acquired is shorter than the previously described allowable time T0.

[0082] 2. Method for detecting foreign objects The same applies to the foreign object detection method as to the foreign object detection device 70. Specifically, the foreign object detection method comprises an acquisition step and a judgment step. The acquisition step corresponds to the control performed by the acquisition unit 71. The judgment step corresponds to the control performed by the judgment unit 72. The foreign object detection method may also include an estimation step. The estimation step corresponds to the control performed by the estimation unit 73. The foreign object detection method may also include a guidance step. The guidance step corresponds to the control performed by the guidance unit 74.

[0083] 3. An example of the effects of the embodiment According to the foreign object detection device 70, the first image data PD1, which is image data PD0 at the time the substrate work is stopped, can be obtained. The same applies to the foreign object detection method as described above for the foreign object detection device 70. [Explanation of symbols]

[0084] 70: Foreign object detection device, 71: Acquisition unit, 72: Judgment unit, 73: Estimation unit, 74: Guide part, 90: Circuit board, 91: Component, 92: Foreign object, 93: Joining member, CA0: Examination area, PD0: Image data, SD0: Reference image data, CD0: Inspection image data, PD1: Primary image data, PD2: Second image data, Q0: Stop time, T0: Allowable time, WM0: PCB work machine, WM3: Component mounting machine.

Claims

1. An acquisition unit that, as a substrate-to-substrate work machine performs a predetermined substrate-to-substrate work on the substrate, images at least a portion of the inspection area of ​​the substrate as the work progresses, and acquires multiple image data of the same inspection area, A determination unit determines the presence or absence of foreign matter attached to the inspection area based on the difference in the feature quantities of the inspection area obtained by image processing of a reference image data, which is one of the plurality of image data, and inspection image data, which is image data of the object to be inspected, which is acquired after the reference image data. Equipped with, The acquisition unit is a foreign object detection device that, if the substrate-to-substrate operation is stopped between the acquisition of the reference image data and the acquisition of the inspection image data, images the inspection area and acquires first image data, which is image data at the time the substrate-to-substrate operation was stopped.

2. The foreign object detection device according to claim 1, wherein the determination unit determines the presence or absence of a foreign object based on the difference in the feature quantities of the inspection area obtained by image processing the reference image data and the first image data, respectively.

3. The foreign object detection device includes an estimation unit that estimates the downtime from when the substrate work is stopped until it is restarted. The foreign object detection device according to claim 2, wherein the determination unit determines the presence or absence of a foreign object when the estimated stop time is longer than the allowable time during which the bonding member that joins the substrate and the component, which is applied to the inspection area, does not misidentify as a foreign object even if the characteristic quantity of the inspection area changes due to changes over time in the bonding member that joins the substrate and the component, the determination unit determines the presence or absence of a foreign object.

4. The foreign object detection device includes an estimation unit that estimates the downtime from when the substrate work is stopped until it is restarted. The foreign object detection device according to claim 2, wherein the determination unit determines the presence or absence of a foreign object when, after estimating the stop time within an allowable time in which the joining member that joins the substrate and the component applied to the inspection area changes over time, the stop time is expected to be longer than the allowable time.

5. The foreign object detection device according to any one of claims 1 to 4, further comprising a guide unit that guides an operator to the presence of the foreign object when the determination unit determines that the foreign object is present in the inspection area.

6. The foreign object detection device according to claim 1, wherein the acquisition unit, when the substrate work is resumed, images the inspection area to acquire second image data which is image data at the time the substrate work is resumed, and updates the reference image data with the second image data.

7. The foreign object detection device according to claim 6, wherein the acquisition unit updates the reference image data with the second image data when the stop time from when the substrate work is stopped until it is restarted is longer than the allowable time during which the feature quantity of the inspection area does not change due to changes over time in the bonding member that bonds the substrate and the component applied to the inspection area, and the stop time from when the substrate work is stopped until it is restarted.

8. The foreign object detection device according to claim 6 or 7, wherein the determination unit determines the presence or absence of a foreign object based on the difference in the feature quantities of the inspection area obtained by image processing the updated reference image data and the inspection image data, respectively.

9. The foreign object detection device according to claim 1, wherein the determination unit determines that there is a foreign object in the inspection area when the difference in the feature quantities of the inspection area obtained from two image data exceeds a predetermined threshold, and determines that there is no foreign object in the inspection area when the difference in the feature quantities is less than or equal to a predetermined threshold.

10. The foreign object detection device according to claim 9, wherein the aforementioned feature quantity is the brightness of each pixel of two image data.

11. The substrate is sequentially transported to a plurality of component mounting machines, which are substrate mounting machines, and a plurality of components are mounted thereon. The acquisition unit acquires the reference image data at the upstream component mounting machine among the plurality of component mounting machines, and acquires the inspection image data at the component mounting machine that mounts the component in the inspection area. The foreign matter detection device according to claim 1, wherein the determination unit determines whether or not the foreign matter adheres to the inspection area while the substrate is transported across the plurality of component mounting machines.

12. The substrate is sequentially transported to a plurality of component mounting machines, which are substrate mounting machines, and a plurality of components are mounted thereon. The acquisition unit acquires the reference image data and the inspection image data in each of the plurality of component mounting machines. The foreign matter detection device according to claim 1, wherein the determination unit determines whether or not there is a foreign matter adhering to the inspection area inside each of the plurality of component mounting machines.

13. The substrate is sequentially transported to a plurality of component mounting machines, which are substrate mounting machines, and a plurality of components are mounted thereon. The acquisition unit acquires the reference image data at one of the plurality of component mounting machines, and acquires the inspection image data at the next component mounting machine downstream of that component mounting machine. The foreign matter detection device according to claim 1, wherein the determination unit determines whether or not the foreign matter adheres to the inspection area when the substrate is transported between adjacent component mounting machines.

14. An acquisition step in which a substrate inspection machine performs a predetermined substrate inspection on a substrate, and as the substrate inspection work progresses, images of at least a portion of the inspection area of ​​the substrate are captured, and multiple image data of the same inspection area are acquired; A determination step in which the presence or absence of foreign matter attached to the inspection area is determined based on the difference in the feature quantities of the inspection area obtained by image processing of a reference image data which is one of the plurality of image data and inspection image data which is image data of the object to be inspected acquired after the reference image data, Equipped with, The acquisition step is a foreign object detection method in which, if the substrate-to-substrate work is stopped between the acquisition of the reference image data and the acquisition of the inspection image data, the inspection area is imaged and a first image data is acquired, which is the image data at the time the substrate-to-substrate work was stopped.

Images