A fully automatic high-speed patch device and patch method thereof

Abstract

The present invention provides a fully automatic high-speed patch device and a patch method thereof, which can quickly set and match the number and placement positions of the patches, making the patch fast, stable and reliable, and meeting the needs of high-speed production. A fully automatic high-speed patch device includes a wafer placement mechanism, a chip retrieval mechanism, a holder transfer mechanism, a patch module, and a patch workstation; the wafer placement mechanism is used to stably place the wafer; the holder transfer mechanism includes a closed-arrangement circular transport conveyor assembly, the conveyor assembly having corresponding chip support mechanisms evenly arranged along its circular trajectory, the chip support mechanisms being used to receive the chips; the chip retrieval mechanism is used to remove the chips from the wafer and place them one by one on the corresponding chip support mechanisms; the patch module includes a patch mechanism and a transfer mechanism; and the patch workstation is provided with a carrier plate, the upper surface of which is pre-prepared with an adhesive film.

Description

Technical Field

[0001] The present invention relates to the technical field of chip placement, in particular to a fully automatic high-speed chip placement device. The present invention also provides a corresponding chip placement method. Background Art

[0002] Chip placement, also known as surface mount technology (SMT), is one of the most popular technologies and processes in the electronics assembly industry. Fully automatic, high-speed placement equipment currently has broad market potential for development and application. However, existing SMT equipment on the market suffers from slow placement speeds, often failing to complete the required number of chips within the specified timeframe. This requires a long time, resulting in significant process waste and low production efficiency. Therefore, the market demands a fully automatic, high-speed SMT device that can achieve this within the specified timeframe. Summary of the Invention

[0003] In response to the above problems, the present invention provides a fully automatic high-speed patch device, which can quickly set and match according to the number and position of patches, so that the patches are fast, stable and reliable, meeting the high-speed production requirements.

[0004] A fully automatic high-speed patch device, characterized in that it comprises:

[0005] Wafer placement mechanism;

[0006] Chip retrieval mechanism;

[0007] Bearing transfer mechanism;

[0008] SMD module;

[0009] And patch workstation;

[0010] The wafer placement mechanism is used to stably place the wafer;

[0011] The holder transfer mechanism includes a closed arrangement of cyclic transport conveying components, and the conveying components are evenly arranged with corresponding chip support mechanisms along their cyclic trajectory, and the chip support mechanisms are used to receive chips;

[0012] The chip picking mechanism is used to take out the chips from the wafer and place them one by one on the corresponding chip supporting mechanism;

[0013] The chip placement module includes a chip placement mechanism and a transfer mechanism. The output end of the transfer mechanism is connected to the chip placement mechanism. The chip placement mechanism is used to hold a surface of a chip corresponding to an output station of a chip picking mechanism, and then transfer the chip to a carrier on a chip placement work station through the drive of the transfer mechanism.

[0014] A carrier plate is provided on the patch working position, and an adhesive film is pre-provided on the upper surface of the carrier plate.

[0015] It is further characterized by:

[0016] The chip picking mechanism is specifically a chip picking turntable, and a plurality of suction nozzles are evenly distributed on the outer circumference of the chip picking turntable. The suction nozzles are used to suck the chips. The chip picking turntable rotates, and the suction nozzles suck the chips from the wafer and then rotate to transfer the chips to the chip support mechanism on the conveyor assembly.

[0017] The chip picking mechanism specifically comprises a chip picking turntable and a chip flipping turntable. A plurality of suction nozzles are evenly distributed on the outer circumference of the chip picking turntable, and a plurality of suction nozzles are evenly distributed on the outer circumference of the chip flipping turntable. The suction nozzles of the chip picking turntable and the chip flipping turntable are both used to adsorb chips. The chip picking turntable rotates, and the chip flipping turntable rotates. The suction nozzles of the chip picking turntable adsorb chips from the wafer and then rotate, and then transfer the chips to the corresponding suction nozzles of the chip flipping turntable, flip the chips, and then the chip flipping turntable places the chips on the chip support mechanism on the conveying component.

[0018] The chip picking mechanism also includes a picking camera, which is used to capture the position of the chip; the wafer placement mechanism includes a fixed wafer mechanism, an XY dual-axis mobile platform, and an R-axis rotation mechanism. The output end of the XY dual-axis mobile platform is connected to the R-axis rotation mechanism, and the output end of the R-axis rotation mechanism is provided with a fixed wafer mechanism. The fixed wafer mechanism is arranged toward the feeding end of the chip picking mechanism. The picking camera captures the chip position of the wafer on the fixed wafer mechanism in real time, and then drives the XY dual-axis mobile platform and the R-axis rotation mechanism to move, so that the chip picking turntable accurately holds the chip;

[0019] The patch module includes an X-axis module, a correction camera, and a patch mechanism. The patch mechanism is specifically a patch work head, and the patch work head moves along the X-axis module; the patch work head includes a Z-axis module, an R-axis module, a patch nozzle, and a positioning camera. The Z-axis module and the R-axis module drive the position of the patch nozzle. After the patch work head takes the product, during the process of transporting it to the carrier for patching, the correction camera takes a picture of the product in front of the nozzle and records information; before patching, the positioning camera takes a picture of the position on the carrier where the patch needs to be placed, records information, and combines the information of the correction camera and the positioning camera, the X and Y axial positions, and the R-axis direction to adjust to ensure the accuracy of the patch position;

[0020] The patch workstation includes a positioning module and an XY biaxial module. The upper surface of the XY biaxial module is provided with a positioning module, and the positioning module is used to support the carrier board;

[0021] The support transfer mechanism is provided with a chip loading position and a chip output position. The chip loading position corresponds to the output end of the chip picking mechanism, and the chip output position corresponds to the chip loading position of the patch module.

[0022] A fully automatic high-speed patch method is characterized in that: a wafer with integrated chips is preset on a wafer placement mechanism, and the chip surface of the wafer is arranged toward the feeding position of the chip picking mechanism. The chip picking mechanism transfers the chips in the wafer one by one to the corresponding chip support mechanism on the support transfer mechanism below. The support transfer mechanism is driven by a power mechanism to circulate along a closed-loop transmission component, so that each chip is sequentially transported to the chip input position of the patch module. The patch module quickly transfers each chip to the patch working position and quickly aligns and mounts the chip on a carrier pre-set with an adhesive film.

[0023] It is further characterized by:

[0024] The patch workstation is provided with patch modules on both sides, and each patch module is provided with an independent support transfer mechanism, chip picking mechanism, and wafer placement mechanism, which makes the patch highly efficient.

[0025] The quantity of materials taken each time by the patch module is set according to the number of chips to be pasted, and the number of patch mechanisms of the patch module is set according to the set number of chips to be pasted.

[0026] After adopting the structure of the present invention, the wafer with integrated chips is preset on the wafer placement mechanism, and the chip surface of the wafer is arranged toward the feeding position of the chip picking mechanism. The chip picking mechanism transfers the chips in the wafer one by one to the corresponding chip support mechanism on the support transfer mechanism below. The support transfer mechanism is driven by the power mechanism to circulate along the closed-loop transmission component, so that each chip is sequentially transported to the chip input position of the patch module. The patch module quickly transfers each chip to the patch working position and quickly aligns and mounts the chip on a carrier pre-set with an adhesive film. The chip picking mechanism and the support transfer mechanism are both in a unidirectional circulating reflux mode to avoid reciprocating motion and waste of time, so as to achieve the purpose of improving production efficiency and realize fully automatic high-speed patch. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of a specific embodiment of the present invention;

[0028] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of a wafer placement mechanism;

[0029] Figure 3 for Figure 1 A three-dimensional diagram of the arrangement of the chip retrieving turntable;

[0030] Figure 4 for Figure 1 A three-dimensional diagram of a chip turning turntable;

[0031] Figure 5 for Figure 1 A three-dimensional diagram of the bearing transfer mechanism;

[0032] Figure 6 for Figure 1 A three-dimensional diagram of the patch module;

[0033] Figure 7 for Figure 1 A three-dimensional diagram of the patch work head;

[0034] Figure 8 for Figure 1 A three-dimensional diagram of the patch workstation;

[0035] Figure 9 It is a flowchart of the method of the present invention;

[0036] The names corresponding to the serial numbers in the figure are as follows:

[0037] Wafer placement mechanism 10, fixed wafer mechanism 11, XY dual-axis moving platform 12, R-axis rotation mechanism 13, chip picking mechanism 20, picking camera 21, support transfer mechanism 30, chip loading position 301, chip output position 302, transmission component 31, chip support mechanism 32, patch module 40, patch mechanism 41, Z-axis module 411, R-axis module 412, patch nozzle 413, positioning camera 414, transfer mechanism 42, correction camera 43, patch working position 50, positioning module 51, XY dual-axis module 52, carrier 60, chip picking turntable 70, chip flip turntable 80, wafer 100. DETAILED DESCRIPTION

[0038] A fully automatic high-speed patch device, see Figures 1-8 , which includes a wafer placement mechanism 10, a chip picking mechanism 20, a support transfer mechanism 30, a patch module 40, and a patch work station 50;

[0039] The wafer placement mechanism 10 is used to stably place the wafer 100;

[0040] The holder transfer mechanism 30 includes a closed arrangement of a circular transport conveyor assembly 31, and the conveyor assembly 31 is evenly arranged with corresponding chip support mechanisms 32 along its circular trajectory. The chip support mechanisms 32 are used to receive chips.

[0041] The chip picking mechanism 20 is used to take out the chips from the wafer 100 and place them one by one on the corresponding chip supporting mechanism 32;

[0042] The chip placement module 40 includes a chip placement mechanism 41 and a transfer mechanism 42. The output end of the transfer mechanism 42 is connected to the chip placement mechanism 41. The chip placement mechanism 41 is used to hold a surface of a chip corresponding to the output station of the chip picking mechanism 20, and then, driven by the transfer mechanism 42, transfers the chip to the carrier on the chip placement work station 50.

[0043] A carrier board 60 is provided on the patch work station 50 , and an adhesive film is pre-provided on the upper surface of the carrier board 60 .

[0044] A transfer robot is provided on the periphery of the patch work station 50. The transfer robot is used for the transfer operation of the carrier 60, transporting the carrier to be mounted with chips in and transporting the carrier with mounted chips out.

[0045] In specific implementation, embodiment one: the chip picking mechanism 20 is specifically a chip picking turntable 70, and a number of suction nozzles are evenly distributed on the outer circumference of the chip picking turntable 70. The suction nozzles are used to adsorb chips. The chip picking turntable 70 rotates, and the suction nozzles adsorb chips from the wafer and then rotate, and then transfer the chips to the chip support mechanism 32 on the conveying component 31.

[0046] Embodiment 2: The chip picking mechanism 20 is specifically a chip picking turntable 70 and a chip flipping turntable 80. Several suction nozzles are evenly distributed on the outer circumference of the chip picking turntable 70, and several suction nozzles are evenly distributed on the outer circumference of the chip flipping turntable 80. The suction nozzles of the chip picking turntable 70 and the chip flipping turntable 80 are both used to adsorb chips. The chip picking turntable 70 rotates and the chip flipping turntable 80 rotates. The suction nozzles of the chip picking turntable 70 adsorb the chip from the wafer and then rotate, and then transfer the chip to the corresponding suction nozzle of the chip flipping turntable 80, and flip the chip. Then, the chip flipping turntable 80 places the chip on the chip support mechanism 32 on the conveying component 31.

[0047] In a specific implementation, the chip picking mechanism 20 further includes a picking camera 21, which is used to capture the position of the chip;

[0048] The wafer placement mechanism 10 includes a fixed wafer mechanism 11, an XY dual-axis mobile platform 12, and an R-axis rotation mechanism 13. The output end of the XY dual-axis mobile platform 12 is connected to the R-axis rotation mechanism 13. The output end of the R-axis rotation mechanism 13 is provided with a fixed wafer mechanism 11. The fixed wafer mechanism 11 is arranged toward the feeding end of the chip picking mechanism 20. The picking camera 21 captures the chip position of the wafer on the fixed wafer mechanism 10 in real time, and then drives the XY dual-axis mobile platform 11 and the R-axis rotation mechanism 12 to operate, so that the chip picking turntable 70 accurately holds the chip;

[0049] The patch module 40 includes an X-axis module, a correction camera 43, and a patch mechanism 41. The X-axis module is the transfer mechanism 42. The patch mechanism 41 is specifically a patch working head, which moves along the X-axis module. The patch working head includes a Z-axis module 411, an R-axis module 412, a patch nozzle 413, and a positioning camera 414. The Z-axis module 411 and the R-axis module 412 drive the position of the patch nozzle 413.

[0050] After the patch work head picks up the product, during the process of transporting it to the carrier for patching, the correction camera 43 takes a picture of the product in front of the nozzle and records the information; before patching, the positioning camera 414 takes a picture of the position on the carrier where the patch needs to be placed and records the information. Combining the information from the correction camera 43 and the positioning camera 414, the X and Y axis positions, and the R axis direction are adjusted to ensure the accuracy of the patch position;

[0051] The Z-axis module 411 is responsible for the chip picking and patching actions, the R-axis module 412 is responsible for the chip angle correction action, the positioning camera 414 is responsible for collecting images of the carrier board patch position, and cooperating with the correction camera 43 to provide the chip error data in the X-axis, Y-axis and R-axis directions; during operation, the patch work head moves left and right on the X-axis module to take out the chip, and takes a picture of the taken chip at the position of the correction camera 43, and then the patch work head moves to the position where the carrier board needs to be patched, first uses the positioning camera 414 on the patch work head to take a picture of the carrier board where the chip needs to be patched, and comprehensively calculates the correction camera and positioning camera data, the X-axis module corrects the chip error in the X-axis direction, the R-axis module 412 corrects the chip angle error, and the XY dual-axis module 52 on the patch work position 50 corrects the chip error in the Y-axis direction. After the correction is completed, the Z-axis module 411 on the patch work head will stick the chip on the carrier.

[0052] The patch work station 50 includes a positioning module 51 and an XY dual-axis module 52. The positioning module 51 is provided on the upper surface of the XY dual-axis module 52, and the positioning module 51 is used to support the carrier 60; the XY dual-axis module 52 allows the carrier to move in the Y-axis direction and the X-axis direction, and cooperates with the patch module to perform correction actions during patching. The positioning module enables the carrier to be accurately positioned in this area.

[0053] The support transfer mechanism 30 is provided with a chip loading position 301 and a chip output position 302 . The chip loading position 301 corresponds to the output end of the chip picking mechanism 20 , and the chip output position 302 corresponds to the chip loading position of the patch module 40 .

[0054] Specific embodiments, see Figures 1-8It adopts a symmetrical feeding mode. As an example, the wafer placement mechanism 10, the chip picking mechanism 20, the support transfer mechanism 30, and the patch module 40 are all set to two. The chip picking mechanism 20 includes a chip picking turntable 70 and a chip flipping turntable 80, and the conveying component 31 is a closed transport line; the chip picking turntable 70, the chip flipping turntable 80, and the conveying component 31 are all in a unidirectional circulation reflux mode to avoid reciprocating motion and waste of time, so as to achieve the purpose of improving production efficiency and realizing fully automatic high-speed patch.

[0055] After the chip removal turntable 70 removes the chip from the wafer, it transfers it to the chip flipping turntable 80. This action is transmitted by a suction nozzle between two modules. After passing through this chip flipping turntable, the top and bottom surfaces of the chip are flipped, so that the initial top side faces down and the bottom side faces up, meeting the requirements for chip placement. After the chip is flipped, the chip flipping turntable 80 places the chip into the holder of the holder transfer mechanism 30, which is also the chip support mechanism 32.

[0056] The holders are distributed in the assembly line corresponding to the holder transfer track of the holder transfer mechanism 30. The assembly line is the output part of the transmission component 31. The power motor moves the holder on the holder transfer track through its internal mechanism. One side of the track is the chip loading position 301, and the other side is the chip output position 302. The two positions are distributed to meet the needs of fast receiving and fast material removal. In specific implementation, the holder can be one or more, and the number of chips received by a single holder can be one or more. It is specifically designed according to the number of patch heads on the patch mechanism. At the same time, according to actual needs, a holder transfer mechanism can feed one patch module or two or more patch modules at the same time.

[0057] The carrier 60 has any shape, and may be square or round; and may be wafer-level or board-level.

[0058] Fully automatic high-speed patch method: The wafer with integrated chips is preset on the wafer placement mechanism, and the chip surface of the wafer is arranged toward the feeding position of the chip picking mechanism. The chip picking mechanism transfers the chips in the wafer one by one to the corresponding chip support mechanism on the holder transfer mechanism below. The holder transfer mechanism is driven by the power mechanism to operate in a closed-loop transmission component cycle, so that each chip is sequentially transported to the chip input position of the patch module. The patch module quickly transfers each chip to the patch work position and quickly aligns and mounts the chip on a carrier pre-set with an adhesive film.

[0059] In a preferred embodiment, patch modules are provided on both sides of the patch workstation, and each patch module is provided with an independent support transfer mechanism, chip picking mechanism, and wafer placement mechanism, which makes the patch highly efficient.

[0060] The quantity of materials taken each time by the patch module is set according to the number of chips to be pasted, and the number of patch mechanisms of the patch module is set according to the set number of chips to be pasted.

[0061] In a specific embodiment, two sets of wafer placement mechanisms 10, chip material taking mechanisms 20, support transfer mechanisms 30, and patch modules 40 are respectively arranged on both sides of the X-axis of the patch work station. The patch mechanisms of the two patch modules share a set of X-axis module guide rails, but have different drive motors. They are divided into A and B modules for operation. During operation, the A module and the B module respectively take the material and stick it to different chip sticking positions on the carrier board on the patch work station, so that the chips at different positions are stuck in the same beat (see Figure 9 ), improving production efficiency.

[0062] It presets the wafer with integrated chips on the wafer placement mechanism, and the chip surface of the wafer is arranged toward the feeding position of the chip picking mechanism. The chip picking mechanism transfers the chips in the wafer one by one to the corresponding chip support mechanism on the holder transfer mechanism below. The holder transfer mechanism is driven by the power mechanism to circulate along the closed-loop transmission component, so that each chip is sequentially transported to the chip input position of the patch module. The patch module quickly transfers each chip to the patch working position and quickly aligns and mounts the chip on a carrier pre-set with an adhesive film. The chip picking mechanism and the holder transfer mechanism are both in a unidirectional circulating reflux mode to avoid reciprocating motion and waste of time, so as to achieve the purpose of improving production efficiency and realize fully automatic high-speed patch.

[0063] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0064] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. Fully automatic high-speed patch device, characterized by: It includes: Wafer placement mechanism; Chip retrieval mechanism; Bearing transfer mechanism; SMD module; And patch workstation; The wafer placement mechanism is used to stably place the wafer; The holder transfer mechanism includes a closed arrangement of cyclic transport conveying components, and the conveying components are evenly arranged with corresponding chip support mechanisms along their cyclic trajectory, and the chip support mechanisms are used to receive chips; The chip picking mechanism is used to take out the chips from the wafer and place them one by one on the corresponding chip supporting mechanism; The chip placement module includes a chip placement mechanism and a transfer mechanism. The output end of the transfer mechanism is connected to the chip placement mechanism. The chip placement mechanism is used to hold a surface of a chip corresponding to an output station of a chip picking mechanism, and then transfer the chip to a carrier on a chip placement work station through the drive of the transfer mechanism. A carrier plate is provided on the patch working position, and an adhesive film is pre-provided on the upper surface of the carrier plate.

2. The fully automatic high-speed placement device according to claim 1, characterized in that: The chip picking mechanism is specifically a chip picking turntable, and a number of suction nozzles are evenly distributed on the outer circumference of the chip picking turntable. The suction nozzles are used to adsorb chips. The chip picking turntable rotates, and the suction nozzles adsorb chips from the wafer and then rotate to transfer the chips to the chip support mechanism on the conveying component.

3. The fully automatic high-speed placement device according to claim 1, characterized in that: The chip picking mechanism is specifically a chip picking turntable and a chip flipping turntable. Several suction nozzles are evenly distributed on the outer circumference of the chip picking turntable, and several suction nozzles are evenly distributed on the outer circumference of the chip flipping turntable. The suction nozzles of the chip picking turntable and the chip flipping turntable are both used to adsorb chips. The chip picking turntable rotates and the chip flipping turntable rotates. The suction nozzles of the chip picking turntable adsorb chips from the wafer and then rotate, and then transfer the chips to the corresponding suction nozzles of the chip flipping turntable, flip the chips, and then the chip flipping turntable places the chips on the chip support mechanism on the conveying component.

4. The fully automatic high-speed patch device according to claim 2 or 3, characterized in that: The chip picking mechanism also includes a picking camera, which is used to capture the position of the chip; the wafer placement mechanism includes a fixed wafer mechanism, an XY dual-axis moving platform, and an R-axis rotation mechanism.

5. The fully automatic high-speed patch device according to claim 1, wherein: The patch module includes an X-axis module, a correction camera, and a patch mechanism. The patch mechanism is specifically a patch working head, and the patch working head moves along the X-axis module; the patch working head includes a Z-axis module, an R-axis module, a patch nozzle and a positioning camera. The Z-axis module and the R-axis module drive the position of the patch nozzle.

6. The fully automatic high-speed placement device according to claim 1, characterized in that: The patch workstation includes a positioning module and an XY dual-axis module. The upper surface of the XY dual-axis module is provided with a positioning module, and the positioning module is used to support the carrier board.

7. The fully automatic high-speed placement device according to claim 1, characterized in that: The support transfer mechanism is provided with a chip loading position and a chip output position. The chip loading position is arranged corresponding to the output end of the chip picking mechanism, and the chip output position is arranged corresponding to the chip loading position of the patch module.

8. Fully automatic high-speed placement method, characterized by: The wafer with integrated chips is preset on the wafer placement mechanism, and the chip surface of the wafer is arranged toward the feeding position of the chip picking mechanism. The chip picking mechanism transfers the chips in the wafer one by one to the corresponding chip supporting mechanism on the support transfer mechanism below. The support transfer mechanism is driven by the power mechanism to circulate along the closed-loop transmission component, so that each chip is sequentially transported to the chip input position of the patch module. The patch module quickly transfers each chip to the patch working position and quickly aligns and mounts the chip on a carrier pre-set with an adhesive film.

9. The fully automatic high-speed placement method according to claim 8, wherein: Patch modules are respectively provided on both sides of the patch work station, and each patch module is respectively provided with an independent support transfer mechanism, a chip picking mechanism, and a wafer placement mechanism, which makes the patch highly efficient.

10. The fully automatic high-speed placement method according to claim 8 or 9, characterized in that: The quantity of materials taken each time by the patch module is set according to the number of chips to be pasted, and the number of patch mechanisms of the patch module is set according to the set number of chips to be pasted.

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