Integral temperature pressure sensor

Abstract

The application discloses an integrated temperature pressure sensor and belongs to the technical field of sensors.The integrated temperature pressure sensor comprises a shell, a flexible circuit board and a temperature pressure detection mechanism, and the flexible circuit board is installed in the shell.The temperature pressure detection mechanism comprises a wrapping piece, a pressure sensing element, a temperature sensing element and a lead wire.The wrapping piece is provided with a pressure detection end and a temperature detection end, the pressure detection end is installed in the shell, the temperature detection end is located outside the shell, and the pressure detection end is located between the flexible circuit board and the temperature detection end.The pressure sensing element is installed in the pressure detection end, the pressure sensing element comprises a pressure sensing area and a plurality of PIN pins, the plurality of PIN pins are connected with the flexible circuit board, and the pressure sensing element further comprises a semicircular groove which is located between the pressure sensing area and the plurality of PIN pins.The temperature sensing element is installed in the temperature detection end.One end of the lead wire is connected with the temperature sensing element, and the other end of the lead wire penetrates through the semicircular groove and is connected with the flexible circuit board.The application achieves the technical effects of simplifying the structure and reducing the cost.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of sensors, and particularly relates to an integrated temperature and pressure sensor. BACKGROUND

[0002] Sensor technology is one of the important technologies of modern measurement and automation systems, and sensors are widely used in process control in production to modern scientific and technological life. When temperature and pressure need to be measured in multiple places, temperature sensors and pressure sensors are often used together.

[0003] At present, in the existing sensor technology, the temperature sensor and the pressure sensor are usually in a split structure, and the temperature sensor and the pressure sensor are used respectively for measurement. The temperature is measured through a conductive extension part in a flexible circuit board connected with the temperature sensor, so as to realize data collection of the temperature. The pressure is measured through another conductive extension part in the flexible circuit board connected with the pressure sensor, so as to realize data collection of the pressure. However, the separate use of the temperature sensor and the pressure sensor will complicate the structure of the flexible circuit board. In order to meet the requirements of simultaneously transmitting temperature signals and pressure signals, more components are needed, which increases the manufacturing difficulty and the production cost.

[0004] In summary, in the existing sensor technology, there are technical problems of complex structure and high cost. SUMMARY

[0005] The technical problem to be solved by the application is the technical problem of complex structure and high cost.

[0006] To solve the above technical problems, the application provides an integrated temperature and pressure sensor, which comprises a shell, a flexible circuit board and a temperature and pressure detection mechanism. The flexible circuit board is installed in the shell. The temperature and pressure detection mechanism comprises a wrapping piece, a pressure sensing element, a temperature sensing element and a lead. The wrapping piece is provided with a pressure detection end and a temperature detection end. The pressure detection end is installed in the shell, and the temperature detection end is located outside the shell. The pressure detection end is located between the flexible circuit board and the temperature detection end. The pressure sensing element is installed in the pressure detection end. The pressure sensing element comprises a pressure sensing area and a plurality of PIN pins. The plurality of PIN pins are connected with the flexible circuit board. The pressure sensing element further comprises a semicircular groove, which is located between the pressure sensing area and the plurality of PIN pins. The temperature sensing element is installed in the temperature detection end. One end of the lead is connected with the temperature sensing element, and the other end of the lead penetrates through the semicircular groove and is connected with the flexible circuit board.

[0007] Further, the shell comprises an open end, a connecting end and a through hole; the flexible circuit board is installed in the open end; the pressure detection end is located in the open end, and the other end of the lead wire penetrates the connecting end, the semicircular groove and the flexible circuit board in sequence.

[0008] Further, the package is further provided with a medium hole, the medium hole is connected with the pressure sensing area, and the medium hole is located in the open end; the shell comprises a through hole, one end of the through hole penetrates the connecting end, and the other end of the through hole is communicated with the medium hole.

[0009] Further, the package is further provided with a medium hole, the medium hole is connected with the pressure sensing area, and the medium hole is located in the open end; the shell comprises a through hole, one end of the through hole penetrates the connecting end, and the other end of the through hole is communicated with the medium hole.

[0010] Further, the pressure detection end is provided with a positioning groove outside.

[0011] Further, the package is further provided with a medium hole, the medium hole is connected with the pressure sensing area, and the medium hole is located in the open end; the shell comprises a through hole, one end of the through hole penetrates the connecting end, and the other end of the through hole is communicated with the medium hole.

[0012] Further, the pressure sensing element is circular, and the axis of the sealing element is the same as the axis of the pressure sensing element.

[0013] Further, the sealing element is an O-shaped sealing ring.

[0014] Further, the temperature sensing element is a thermistor.

[0015] Further, the package is made of high-temperature-resistant and heat-conducting material.

[0016] Beneficial effects:

[0017] The application provides a one-piece temperature pressure sensor, which is installed in the inside of a shell through a flexible circuit board, a pressure detection end of a wrapping piece in a temperature pressure detection mechanism is installed in the inside of the shell, a temperature detection end of the wrapping piece is located outside the shell, the pressure detection end is located between the flexible circuit board and the temperature detection end, a pressure sensing element in the temperature pressure detection mechanism is installed in the inside of the pressure detection end of the wrapping piece, a plurality of PIN pins of the pressure sensing element are connected with the flexible circuit board, a semicircular groove of the pressure sensing element is located between a pressure sensing area and the plurality of PIN pins, a temperature sensing element in the temperature pressure detection mechanism is installed in the inside of the temperature detection end, one end of a lead wire in the temperature pressure detection mechanism is connected with the temperature sensing element, and the other end of the lead wire penetrates through the semicircular groove and is connected with the flexible circuit board. In this way, the wrapping piece, the pressure sensing element, the temperature sensing element and the lead wire in the temperature pressure detection mechanism are combined into one piece, the pressure signal measured by the pressure sensing area in the pressure sensing element is transmitted to the flexible circuit board through the plurality of PIN pins, and the temperature signal measured by the temperature sensing element is transmitted to the flexible circuit board through the lead wire, which is beneficial to simplifying the structure of the flexible circuit board, reducing parts, making the structure compact, and reducing the cost. Therefore, the technical effects of simplifying the structure and reducing the cost are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0019] Figure 1 The schematic diagram of the one-piece temperature pressure sensor provided by the embodiment of the present application Figure 1

[0020] Figure 2 The schematic diagram of the one-piece temperature pressure sensor provided by the embodiment of the present application Figure 2

[0021] Figure 3 The schematic diagram of the one-piece temperature pressure sensor provided by the embodiment of the present application Figure 3

[0022] Figure 4 The schematic diagram of the one-piece temperature pressure sensor provided by the embodiment of the present application Figure 4

[0023] Figure 5 The schematic diagram of the one-piece temperature pressure sensor provided by the embodiment of the present application Figure 5 . DETAILED DESCRIPTION

[0024] ​​​​​The application discloses an integrated temperature and pressure sensor, which is internally installed in a shell 1 through a flexible circuit board 4, a pressure detection end of a wrapping piece 304 in a temperature and pressure detection mechanism 3 is internally installed in the shell 1, a temperature detection end of the wrapping piece 304 is externally located in the shell 1, the pressure detection end is located between the flexible circuit board 4 and the temperature detection end, a pressure sensing element 303 in the temperature and pressure detection mechanism 3 is internally installed in the pressure detection end of the wrapping piece 304, a plurality of PIN pins 303c of the pressure sensing element 303 are connected with the flexible circuit board 4, a semicircular groove 303b of the pressure sensing element 303 is located between a pressure sensing area 303a and the plurality of PIN pins 303c, a temperature sensing element 301 in the temperature and pressure detection mechanism 3 is internally installed in the temperature detection end, one end of a lead wire 302 in the temperature and pressure detection mechanism 3 is connected with the temperature sensing element 301, and the other end of the lead wire 302 penetrates through the semicircular groove 303b and is connected with the flexible circuit board 4. In this way, the wrapping piece 304, the pressure sensing element 303, the temperature sensing element 301 and the lead wire 302 in the temperature and pressure detection mechanism 3 are combined to form an integrated whole, the pressure signal measured by the pressure sensing area 303a in the pressure sensing element 303 is transmitted to the flexible circuit board 4 through the plurality of PIN pins 303c, and the temperature signal measured by the temperature sensing element 301 is transmitted to the flexible circuit board 4 through the lead wire 302, which is beneficial to simplifying the structure of the flexible circuit board 4, reducing parts, making the structure compact and being beneficial to reducing the cost. Thus, the technical effects of simplifying the structure and reducing the cost are achieved.

[0025] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art belong to the protection scope of the application; wherein the keyword "and / or" involved in the embodiments of the application represents two cases of and or, in other words, A and / or B mentioned in the embodiments of the application represents two cases of A and B, A or B, and describes three states of A and B, such as A and / or B, which means only including A and not including B, only including B and not including A, and including A and B.

[0026] It should be understood that, although the terms "first", "second" or the like can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "beneath", "below", "lower", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0027] Meanwhile, when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element or layer is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. Like numbers refer to like elements throughout. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0028] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 , Figure 1 is a schematic diagram of an integrated temperature pressure sensor according to an embodiment of the present application Figure 1 , Figure 2 is a schematic diagram of an integrated temperature pressure sensor according to an embodiment of the present application Figure 2 , Figure 3 is a schematic diagram of an integrated temperature pressure sensor according to an embodiment of the present application Figure 3 , Figure 4 is a schematic diagram of an integrated temperature pressure sensor according to an embodiment of the present application Figure 4 , Figure 5 is a schematic diagram of an integrated temperature pressure sensor according to an embodiment of the present application Figure 5The integrated temperature and pressure sensor provided by the embodiment of the present application comprises a shell 1, a flexible circuit board 4 and a temperature and pressure detection mechanism 3. The shell 1, the flexible circuit board 4 and the temperature and pressure detection mechanism 3 are described in detail as follows:

[0029] For the shell 1 and the flexible circuit board 4:

[0030] The shell 1 comprises an open end 102, a connecting end 101 and a through hole 103. The shell 1 comprises the through hole 103, one end of the through hole 103 penetrates the connecting end 101, and the other end of the through hole 103 and the medium hole 304a are in communication with each other. The flexible circuit board 4 is installed in the shell 1; and the flexible circuit board 4 is installed inside the open end 102.

[0031] Specifically, the shell 1 is made of metal material, the open end 102 and the connecting end 101 are two opposite ends of the shell 1, the open end 102 has a space for accommodating the flexible circuit board 4, the wrapping piece 304, the pressure sensing element 303, the sealing piece 2 and the electrical connector 5, the through hole 103 is arranged in the shell 1, the medium hole 304a is in communication with the outside through the through hole 103, so that the pressure sensing area 303a of the pressure sensing element 303 is connected with the outside. The connecting end 101 has a threaded structure, the connecting end 101 and the open end 102 are in communication to form a space matched with the wrapping piece 304 in the temperature and pressure detection mechanism 3, so that after the wrapping piece 304 is embedded in the space, the pressure detection end of the wrapping piece 304 is located in the space, and the temperature detection end of the wrapping piece 304 is located outside the space. The flexible circuit board 4 can be installed inside the open end 102 of the shell 1, one end of the flexible circuit board 4 is installed on the pressure sensing element 303 and is coupled with the temperature sensing element 301 and the pressure sensing element 303 respectively, so as to simultaneously process the temperature signal and the pressure signal, process and convert the temperature signal and the pressure signal, the other end of the flexible circuit board 4 is coupled with the electrical connector 5, so as to output the temperature signal and the pressure signal.

[0032] For the temperature and pressure detection mechanism 3:

[0033] The temperature and pressure detection mechanism 3 comprises a wrapping piece 304, a pressure sensing element 303, a temperature sensing element 301 and a lead wire 302. The wrapping piece 304 is provided with a pressure detection end and a temperature detection end. The pressure detection end is installed in the shell 1, and the temperature detection end is located outside the shell 1. The pressure detection end is located between the flexible circuit board 4 and the temperature detection end. The wrapping piece 304 is also provided with a medium hole 304a, which is connected with the pressure sensing area 303a. The wrapping piece 304 is provided with a positioning groove 304b outside the pressure detection end. The wrapping piece 304 is made of high-temperature resistant and heat-conducting material. The pressure sensing element 303 is installed inside the pressure detection end. The pressure sensing element 303 comprises a pressure sensing area 303a and a plurality of PIN pins 303c. The plurality of PIN pins 303c are connected with the flexible circuit board 4. The pressure sensing element 303 further comprises a semicircular groove 303b, which is located between the pressure sensing area 303a and the plurality of PIN pins 303c. The temperature sensing element 301 is installed in the temperature detection end. The temperature sensing element 301 is a thermistor. One end of the lead wire 302 is connected with the temperature sensing element 301, and the other end of the lead wire 302 penetrates the semicircular groove 303b and is connected with the flexible circuit board 4. The pressure detection end is located in the opening end 102, and the other end of the lead wire 302 penetrates the connecting end 101 and the semicircular groove 303b and is connected with the flexible circuit board 4.

[0034] Specifically, the temperature sensing element 301, the pressure sensing element 303 and the lead wire 302 can be shaped into an integrated structure by the wrapping piece 304, the integrated structure can be in a "T" shape, the pressure detection end and the temperature detection end are opposite ends of the wrapping piece 304, the pressure detection end can be located inside the opening end 102 to sense the pressure signal, and the temperature detection end extends out of the connecting end 101 to sense the medium temperature signal. A positioning groove 304b is opened on the side wall of the pressure detection end inside the opening end 102, which can play a positioning role during assembly, facilitating assembly. The pressure sensing element 303 has a space for accommodating the pressure sensing element 303 inside the pressure detection end, and the medium hole 304a is located in the pressure detection end, so that the medium pressure can be transmitted to the pressure sensing area 303a of the pressure sensing element 303 through the medium hole 304a. The pressure sensing element 303 in the temperature and pressure detection mechanism 3 can be in a "convex" shape, the smaller end of the pressure sensing element 303 is the pressure sensing area 303a, which can sense the medium pressure, and the larger end of the pressure sensing element 303 extends out of three PIN pins 303c, which are coupled with the flexible circuit board 4, so as to convert the pressure signal into an electric signal. The lead wire 302 can be in a "Z" shape, one end of the lead wire 302 is connected with the temperature sensing element 301, the other end of the lead wire 302 passes through the semicircular groove 303b on the side wall of the pressure sensing element 303, the cross section of the semicircular groove 303b can be in a semicircular shape, and the other end of the lead wire 302 extends out of the pressure detection end of the wrapping piece 304 and is coupled with the flexible circuit board 4, so as to convert the temperature signal into an electric signal.

[0035] The integrated temperature and pressure sensor provided by the embodiment of the present application further comprises an electrical connector 5 and a sealing member 2, the electrical connector 5 is connected with the flexible circuit board 4. The sealing member 2 is installed in the opening end 102, and the sealing member 2 is located between the opening end 102 and the pressure sensing element 303. The pressure sensing element 303 is in a circular shape, and the axis of the sealing member 2 is the same as the axis of the pressure sensing element 303. The sealing member 2 is an O-shaped sealing ring.

[0036] Specifically, a groove matched with the sealing member 2 can be arranged in the inside of the opening end 102 of the shell 1, the sealing member 2 can be embedded in the groove, the axis (such as the central axis in the vertical direction) of the sealing member 2 is the same as the axis of the pressure sensing element 303. Figure 2 Figure 2 ​The sealing member 2 can be located between the open end 102 and the pressure sensing element 303, so that a closed space is formed between the inner end surface of the open end 102 and the pressure detection end of the wrapping member 304, thereby preventing the medium from diffusing inside the sensor, and improving the use accuracy and service life.

[0037] Please refer to Figure 1 and Figure 2 The lower end of the shell 1 is in the form of a threaded connection end 101, which is connected to the outside. A through hole 103 is arranged inside the threaded connection end 101, and the medium can enter the inside of the shell 1 from the through hole 103 inside the threaded connection end 101. The upper end of the shell 1 is in the form of an open cavity structure, and the flexible circuit board 4, the wrapping member 304, the pressure sensing element 303, the sealing member 2 and the electrical connector 5 can be placed inside the open cavity. The temperature and pressure detection mechanism 3 is in the form of an integrated structure of the temperature sensing element 301 and the pressure sensing element 303. The temperature and pressure detection mechanism 3 can be located outside the connection end 101 as a whole, or part of the temperature and pressure detection mechanism 3 can extend to the outside of the connection end 101, and the other part can be located inside the open end 102. The sealing member 2 is arranged inside the open end 102, so that a separate medium channel is formed between the shell 1 and the wrapping member 304, preventing external medium from interfering with the electrical connection and affecting the accuracy. The sealing member 2 can be an O-shaped sealing ring, and the material for manufacturing the sealing member 2 can be hydrogenated butyronitrile rubber or other materials resistant to high and low temperature and corrosion. A medium hole 304a can be arranged in the temperature and pressure detection mechanism 3, so that the pressure sensing area 303a of the pressure sensing element 303 can be in communication with the outside, thereby sensing the pressure signal. The temperature and pressure detection mechanism 3 and the flexible circuit board 4 are coupled, thereby transmitting the temperature signal sensed by the temperature sensing element 301 and the pressure signal sensed by the pressure sensing element 303. The flexible circuit board 4 is made of PI material, and has the advantages of high reliability, good flexibility, high wiring density, light weight, thin thickness and good bending. One end of the flexible circuit board 4 is coupled with the temperature sensing element 301 and the pressure sensing element 303, thereby processing and converting the temperature signal and the pressure signal. The other end of the flexible circuit board 4 is coupled with the electrical connector 5, thereby outputting the temperature signal and the pressure signal. The flexible circuit board 4 and the temperature and pressure detection mechanism 3 can be coupled by welding.

[0038] Please refer to Figure 3 and Figure 4, the temperature sensing element 301 and the pressure sensing element 303 can be integrated by injection molding, so that the overall structure is more compact and simple, and easy to assemble and save cost. The material of the wrapping member 304 can be a high-temperature-resistant and heat-conductive material, which means a material with high-temperature resistance and high heat conductivity. The temperature detection end of the wrapping member 304 can transmit the temperature signal to the temperature sensing element 301, and at the same time, it can protect the temperature sensing element 301 in a corrosive medium environment. The lead wire 302 passes through the semicircular groove 303b of the pressure sensing element 303 and is exposed outside the wrapping member 304 and coupled with the flexible circuit board 4 to realize the transmission of the temperature signal. The temperature sensing element 301 can be a thermistor or other temperature-sensitive sensitive component.

[0039] Please refer to Figure 5 The smaller end of the pressure sensing element 303 is the pressure sensing area 303a, which can be used to sense the medium pressure transmitted from the medium hole 304a in the temperature and pressure detection mechanism 3. The three PIN pins 303c protruding from the larger end of the pressure sensing element 303 are coupled with the flexible circuit board 4, which can convert the pressure signal into an electrical signal. The overall pressure sensing element 303 can be a "convex" type ceramic capacitor sensor element, and the material of the pressure sensing element 303 includes ceramic, metal and other materials.

[0040] The application provides a one-piece temperature pressure sensor, which is installed in the inside of the shell 1 through a flexible circuit board 4, the pressure detection end of a wrapping piece 304 in a temperature pressure detection mechanism 3 is installed in the inside of the shell 1, the temperature detection end of the wrapping piece 304 is located outside the shell 1, the pressure detection end is located between the flexible circuit board 4 and the temperature detection end, a pressure sensing element 303 in the temperature pressure detection mechanism 3 is installed in the inside of the pressure detection end of the wrapping piece 304, a plurality of PIN needles 303c of the pressure sensing element 303 are connected with the flexible circuit board 4, a semicircular groove 303b of the pressure sensing element 303 is located between a pressure sensing area 303a and the plurality of PIN needles 303c, a temperature sensing element 301 in the temperature pressure detection mechanism 3 is installed in the inside of the temperature detection end, one end of a lead wire 302 in the temperature pressure detection mechanism 3 is connected with the temperature sensing element 301, the other end of the lead wire 302 penetrates through the semicircular groove 303b and is connected with the flexible circuit board 4. In this way, the wrapping piece 304, the pressure sensing element 303, the temperature sensing element 301 and the lead wire 302 in the temperature pressure detection mechanism 3 are combined to form a whole, the pressure signal measured by the pressure sensing area 303a in the pressure sensing element 303 is transmitted to the flexible circuit board 4 through the plurality of PIN needles 303c, the temperature signal measured by the temperature sensing element 301 is transmitted to the flexible circuit board 4 through the lead wire 302, which is beneficial to simplify the structure of the flexible circuit board 4, reduce parts and make the structure compact, and is beneficial to reduce the cost. Thus, the technical effects of simplifying the structure and reducing the cost are achieved.

[0041] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the application rather than limit the application. Although the application has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the application can be modified or replaced equivalently without departing from the spirit and scope of the application, and all of them should be covered in the scope of the claims of the application.

Claims

1. An integrated temperature pressure sensor characterized by, The application relates to a temperature and pressure sensor. The temperature and pressure sensor comprises a shell, a flexible circuit board and a temperature and pressure detecting mechanism. The temperature and pressure detecting mechanism comprises a wrapping piece, a pressure sensing element, a temperature sensing element and a lead wire. The wrapping piece is provided with a pressure detecting end and a temperature detecting end. The pressure detecting end is arranged in the shell. The temperature detecting end is arranged outside the shell. The pressure detecting end is arranged between the flexible circuit board and the temperature detecting end. The pressure sensing element is arranged in the pressure detecting end. The pressure sensing element comprises a pressure sensing area and a plurality of PIN pins. The PIN pins are connected with the flexible circuit board.

4. The integrated temperature and pressure sensor of claim 1, wherein, The pressure sensing element further comprises a semicircular groove. The semicircular groove is arranged between the pressure sensing area and the PIN pins. The temperature sensing element is arranged in the temperature detecting end. One end of the lead wire is connected with the temperature sensing element.

6. The integrated temperature and pressure sensor of claim 2, wherein, The other end of the lead wire penetrates through the semicircular groove and is connected with the flexible circuit board. The pressure sensing area protrudes from the pressure sensing element. The diameter of the pressure sensing area is smaller than the diameter of the pressure sensing element. There is a certain interval between the semicircular groove and the pressure sensing area. The pressure sensing element is supported on the pressure detecting end and avoids the pressure sensing area. The temperature sensing element, the pressure sensing element and the lead wire are integrally formed by being molded.

2. The temperature and pressure sensor according to claim 1, wherein: The shell comprises an open end, a connecting end and a through hole. The flexible circuit board is arranged in the open end. The pressure detecting end is arranged in the open end. The other end of the lead wire penetrates through the connecting end, the semicircular groove and is connected with the flexible circuit board.

3. The temperature and pressure sensor according to claim 2, wherein: The wrapping piece is further provided with a medium hole. The medium hole is connected with the pressure sensing area. The medium hole is arranged in the open end. The shell comprises a through hole. One end of the through hole penetrates through the connecting end. The other end of the through hole is communicated with the medium hole.

4. The temperature and pressure sensor according to claim 1, further comprising: An electrical connector.

5. The temperature and pressure sensor according to claim 1, wherein: A positioning groove is arranged outside the pressure detecting end.

6. The temperature and pressure sensor according to claim 1, further comprising: A sealing piece. The sealing piece is arranged in the open end. The sealing piece is arranged between the open end and the pressure sensing element.

7. The temperature and pressure sensor according to claim 6, wherein: The pressure sensing element is circular. The shaft center of the sealing piece is the same as the shaft center of the pressure sensing element.

8. The temperature and pressure sensor according to claim 6, wherein: The sealing piece is an O-shaped sealing ring.

9. The temperature and pressure sensor according to claim 1, wherein: The temperature sensing element is a thermistor.

10. The integrated temperature and pressure sensor of claim 1, wherein: The packaging member is made of a high-temperature resistant and heat-conductive material.

Images