Apparatus for processing a substrate

Abstract

An apparatus for processing a substrate includes a processing container having an internal space; a support unit having a support plate configured to support and rotate the substrate in the internal space; a liquid supply unit configured to supply a processing liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the internal space, wherein the exhaust unit includes an air flow guide tube that guides a flow direction of an air flow flowing on the substrate toward an outer side of the substrate due to rotation of the substrate supported by the support unit, and the air flow guide tube has an inlet into which an air flow is introduced, the inlet being disposed at substantially the same level as the substrate supported by the support unit.

Description

BACKGROUND

[0001] Embodiments of the inventive concept described herein relate to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate by supplying a liquid onto a rotating substrate.

[0002] Various processes such as a photo-lithography process, an etching process, an ashing process, a thin film deposition process, and a deposition process are performed to manufacture a semiconductor device or a flat panel display panel. Among these processes, the photo-lithography process includes supplying a photo-resist to a semiconductor substrate to form a photo-resist film on a surface of the substrate, exposing the photo-resist film using a photo-mask, and then supplying a developing liquid to selectively remove portions of the photo-resist film. These processes are performed in a process chamber.

[0003] Figure 1 is a schematic view showing a substrate processing apparatus 1 for applying a photo-resist to a substrate. Referring to Figure 1 , the substrate processing apparatus 1 includes a processing vessel 10 having an inner space, a support unit 20 for supporting a substrate W in the inner space, and a nozzle 30 for supplying a processing liquid 82 onto the substrate W placed on the support unit 20. The processing vessel 10 has an outer cup 12 and an inner cup 14. Further, a fan filter unit (not shown) for supplying a downward air flow into the inner space is provided above the processing vessel 10, and a drain pipe 60 for draining the processing liquid and an exhaust pipe 70 for exhausting the atmosphere in the processing space are connected to a lower region of the inner space.

[0004] When the substrate processing apparatus 1 having the structure shown in Figure 1 processes a substrate W while supplying a processing liquid 82 on the rotating substrate W, an air flow 84 on a surface of the substrate W flows from a center of the substrate W toward an edge of the substrate W in a rotational direction of the substrate W by a centrifugal force, as shown in Figure 2 . Thereafter, as shown in Figure 3 , the air flow 84 flows downward after colliding with the outer cup 12 and is exhausted from the inner space to the outside via the exhaust pipe 70. At the time when the direction of the air flow 84 changes from a horizontal direction to a vertical direction, the air flow 84 collides with the outer cup 12, and a vortex flow is generated at a point where the air flow 84 collides with the outer cup 12. The air flow 84 stagnates at the point where the vortex flow is generated, and accordingly, the inner space cannot be smoothly exhausted. This problem is further exacerbated as the rotational speed of the substrate W increases.

[0005] When a film of the processing liquid 82 is formed on the substrate W, the vortex and the stagnant airflow at the collision point obstruct the airflow above the edge region of the substrate W. Therefore, the thickness of the thin film on the edge region of the substrate W is greater than the thickness of the thin film on the center region of the substrate W. In addition, due to the vortex at the collision point, a flow of contaminants such as smoke flows back to the substrate W and contaminates the substrate W. SUMMARY

[0006] Embodiments of the present inventive concept provide a substrate processing apparatus for improving efficiency of processing a substrate.

[0007] Embodiments of the present inventive concept provide a substrate processing apparatus for smoothly discharging an airflow in a processing space by supplying a processing liquid to a rotating substrate in the processing space when processing a substrate.

[0008] Embodiments of the present inventive concept provide a substrate processing apparatus for forming a liquid film having a uniform thickness over an entire region of a substrate by supplying a processing liquid to a rotating substrate.

[0009] Embodiments of the present inventive concept provide a substrate processing apparatus for preventing re-adsorption of contaminants by supplying a processing liquid to a rotating substrate when processing a substrate.

[0010] The technical problems to be solved by the present inventive concept are not limited to the problems mentioned above, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept pertains from the following description.

[0011] Embodiments of the present inventive concept provide a substrate processing apparatus.

[0012] The apparatus includes a processing container having an internal space, a support unit having a support plate configured to support and rotate the substrate in the internal space, a liquid supply unit configured to supply a processing liquid to the substrate supported by the support unit, and an exhaust unit configured to discharge an airflow in the internal space, wherein the exhaust unit includes an airflow guide pipe that guides a flow direction of an airflow flowing toward an outer side of the substrate on the substrate due to rotation of the substrate supported by the support unit, and the airflow guide pipe has an inlet into which an airflow is introduced, the inlet being disposed at substantially the same level as the substrate supported by the support unit.

[0013] In embodiments, the inlet disposed at the airflow guide pipe introduces an airflow in a tangential direction of a rotation direction of the substrate supported by the support unit.

[0014] In an embodiment, a plurality of air flow guide tubes are provided, which are disposed apart in a circumferential direction of the substrate supported by the support unit.

[0015] In an embodiment, the plurality of air flow guide tubes are disposed apart at regular intervals based on a center of the rotation of the substrate.

[0016] In an embodiment, the support unit includes a support plate that supports the substrate, a rotation shaft that rotates the substrate, and an actuator coupled to the rotation shaft and providing a rotational force to the rotation shaft, wherein the process container includes an outer cup that provides the internal space, and an inner cup that is placed in the internal space to be separate from the outer cup and surrounds the rotation shaft and the actuator, wherein the inner cup defines an exhaust space in an area below the support plate, and the exhaust unit further includes a separate exhaust tube for exhausting an air flow introduced into the exhaust space to the outside of the internal space.

[0017] In an embodiment, the exhaust unit is placed at the outside of the process container, and further includes an integrated exhaust tube having a pressure adjusting member mounted, to which the separate exhaust tube and the air flow guide tube are connected.

[0018] In an embodiment, the air flow guide tube includes an air flow introduction portion including an inlet for introducing an air flow into the internal space, an air flow discharge portion connected to the integrated exhaust tube, and a connection portion connecting the air flow introduction portion and the air flow discharge portion.

[0019] In an embodiment, a length of the air flow introduction portion is provided in parallel with a tangential direction of the substrate.

[0020] In an embodiment, a length of the connection portion is provided in a direction different from a direction of the length of the air flow introduction portion.

[0021] In an embodiment, the air flow discharge portion is placed below and in parallel with the air flow introduction portion.

[0022] In an embodiment, the air flow guide tube is placed at the outside of the process container, the air flow guide tube is formed to extend from the internal space to the outside of the process container, the air flow discharge portion includes an outlet connected to the integrated exhaust unit, the inlet of the air flow introduction portion is provided in the internal space, and the outlet of the air flow discharge portion is provided at the outside of the process container.

[0023] In an embodiment, the substrate processing apparatus further includes a liquid supply nozzle that supplies photoresist to the substrate supported by the support unit.

[0024] An embodiment of the inventive concept provides a substrate processing apparatus.

[0025] The apparatus includes a process container having an inner space, a support unit having a support plate configured to support and rotate the substrate in the inner space, and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an exhaust pipe for exhausting the air flow to an outside of the process container through a first path defined by a space between an inner wall of the process container and the substrate supported by the support plate and an exhaust space of the inner space that is below the support plate and communicates with the space, and an air flow guide pipe for guiding the air flow to a second path different from the first path.

[0026] In an embodiment, the second path is defined by a tangential direction of a rotational direction of the substrate supported by the support unit.

[0027] In an embodiment, the air flow guide pipe is placed at an outside of the process container.

[0028] In an embodiment, the process container includes an outer cup providing an inner space and an inner cup placed in the inner space, separated from the outer cup, and surrounding the support unit, wherein the inner cup defines an exhaust space below the support plate, and the exhaust unit further includes a separate exhaust unit configured to exhaust the air flow introduced into the exhaust unit to an outside of the inner space, the exhaust unit further includes an integrated exhaust pipe located outside of the process container and provided with a mounted pressure adjustment member, the inner cup defines the exhaust space in a space below the support plate, and the exhaust unit further includes a separate exhaust pipe for exhausting the air flow introduced into the exhaust unit to an outside of the inner space.

[0029] In an embodiment, the air flow guide pipe includes an air flow introduction portion including the inlet that introduces the air flow into the inner space, an air flow exhaust portion connected to the integrated exhaust pipe, and a connection unit connecting the air flow introduction portion and the air flow exhaust portion, wherein a length of the air flow introduction portion is set to be parallel to a tangential direction of the substrate.

[0030] An embodiment of the inventive concept provides a substrate processing apparatus.

[0031] The apparatus includes a process container having an internal space, a support unit having a support plate configured to support and rotate the substrate in the internal space, and an exhaust unit configured to exhaust an air flow in the internal space, wherein the exhaust unit includes an air flow guide tube guiding a direction of air flow flowing toward the outer side of the substrate due to rotation of the substrate supported by the support unit, and the air flow guide tube has an inlet provided at substantially the same level as the substrate supported by the support unit, the inlet of the air flow guide tube is provided to introduce an air flow in a tangential direction of the substrate supported by the support plate, the exhaust unit further includes an integrated exhaust unit located outside the process container and provided with a pressure adjusting member, the air flow guide tube includes an air flow introduction portion having the inlet introducing an air flow into the internal space, an air flow exhaust portion connected to the integrated exhaust tube, and a connection unit connecting the air flow introduction portion and the air flow exhaust portion, wherein the air flow introduction portion is provided such that a length thereof is parallel to the tangential direction of the substrate.

[0032] In an embodiment, a plurality of the air flow guide tubes are provided at regular intervals.

[0033] In an embodiment, the air flow guide tube is formed to extend from the internal space to the outside of the process container.

[0034] According to the present inventive concept, a process liquid is supplied to a substrate rotating in an internal space of a process container to smoothly exhaust an air flow in the internal space while processing the substrate.

[0035] According to another embodiment of the present inventive concept, when a process liquid is supplied to a rotating substrate to form a liquid film on the substrate, a thickness of the liquid film can be uniformly formed in an entire area of the substrate.

[0036] According to the present inventive concept, it is possible to prevent re-attachment of contaminants to a substrate while processing the substrate by supplying a process liquid to the rotating substrate.

[0037] Effects of the present inventive concept are not limited to the above-mentioned effects and a person skilled in the art will clearly understand effects not mentioned according to the present specification and the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0038] The above and other objects and features will become apparent from the following description of the embodiments given for the purposes of illustration taking in conjunction with the accompanying drawings, in which the same reference characters are used in the various drawings to designate the same or similar parts, and in which:

[0039] Figure 1 is a cross-sectional view showing a substrate processing apparatus having a general structure for liquid processing of a substrate while rotating the substrate;

[0040] Figure 2 is a plan view showing a direction of air flow on a surface of a substrate in the substrate processing apparatus of Figure 1

[0041] Figure 3 is a cross-sectional view showing air flow in the substrate processing apparatus of Figure 1

[0042] Figure 4 is a schematic perspective view showing a substrate processing apparatus according to an embodiment of the inventive concept;

[0043] Figure 5 is a cross-sectional view showing a coating block and a developing block of the substrate processing apparatus of Figure 4

[0044] Figure 6 is a plan view of the substrate processing apparatus of Figure 4

[0045] Figure 7 is a schematic plan view showing a transfer robot of Figure 6

[0046] Figure 8 is a schematic plan view showing one example of a heat treatment chamber of Figure 6

[0047] Figure 9 is a front view of the heat treatment chamber of Figure 8

[0048] Figure 10 is a schematic cross-sectional view showing a structure of a substrate processing apparatus for processing a substrate by supplying a liquid onto a rotating substrate according to an embodiment of the inventive concept;

[0049] Figure 11 is a perspective view of an exterior of the substrate processing apparatus of Figure 10

[0050] Figure 12 is a perspective view of a partially cut portion of the substrate processing apparatus;

[0051] Figure 13 and Figure 14 are cross-sectional views and a cross-sectional perspective view showing air flow and flow paths of a processing liquid when a substrate is subjected to liquid processing by the apparatus of Figure 10

[0052] Figure 15 ​​​​​​​​​is a schematic cross-sectional view showing a structure of a substrate processing apparatus for processing a substrate by supplying a liquid onto a rotating substrate according to a second embodiment of the present inventive concept;

[0053] Figure 16 is a cross-sectional perspective view showing a flow path of air flow and processing liquid when a substrate passing through Figure 15 the apparatus is subjected to liquid processing;

[0054] Figure 17 A and Figure 17 B are graphs depicting exhaust flow rates of a substrate processing apparatus having Figure 1 a conventional structure and a substrate processing apparatus equipped with an air flow guide tube as in embodiments of the present inventive concept; and

[0055] Figure 18 is a perspective view of a substrate processing apparatus according to another embodiment of the present inventive concept. DETAILED DESCRIPTION

[0056] The present inventive concept can be variously modified and can have various forms, and specific embodiments of the present inventive concept will be shown in the drawings and described in detail. However, embodiments according to the present inventive concept are not intended to limit the forms specifically disclosed, and it should be understood that the present inventive concept includes all modifications, replacements of equivalents included in the spirit and technical scope of the present inventive concept. In the description of the present inventive concept, detailed descriptions of related known technologies can be exaggerated or omitted when it makes the essence of the present inventive concept unclear.

[0057] The apparatus of this embodiment can be used to perform a photoresist process on a circular substrate. Specifically, the apparatus of this embodiment can be connected to an exposure apparatus and can be used to perform a coating process and a developing process on a substrate. However, the spirit and scope of the present inventive concept are not limited thereto, and the apparatus can be used to perform various types of processes that supply a processing liquid onto a substrate while the substrate is rotating. In the following description, a wafer will be exemplified as a substrate.

[0058] Hereinafter, embodiments of the present inventive concept will be described with reference to Figures 4 to 14 the accompanying drawings.

[0059] Figure 4 is a schematic perspective view showing a substrate processing apparatus according to an embodiment of the present inventive concept.

[0060] Figure 5 is a cross-sectional view of a substrate processing apparatus showing Figure 4 a coating block and a developing block. Figure 6 is a plan view of a substrate processing apparatus of Figure 4

[0061] Reference​Figures 4 to 6 The substrate processing apparatus 10 according to an embodiment of the present inventive concept includes a indexing module 100, a processing module 300, and an interface module 500. According to an embodiment, the indexing module 100, the processing module 300, and the interface module 500 are arranged in a row in order. Hereinafter, the arrangement direction of the indexing module 100, the processing module 300, and the interface module 500 will be referred to as a first direction 12, a direction perpendicular to the first direction 12 will be referred to as a second direction 14 when viewed from above, and a direction perpendicular to both the first direction 12 and the second direction 14 will be referred to as a third direction 16.

[0062] The indexing module 100 transfers the substrate W from a container F in which the substrate W is stored to the processing module 300, and obtains a processed substrate W from the processing module 300 to be stored in the container F. The indexing module 100 is provided so that its length extends along the second direction 14. The indexing module 100 has a load port 110 and an indexing frame 130. The indexing frame 130 is placed between the load port 110 and the processing module 300. The container F in which the substrate W is stored is placed at the load port 110. A plurality of load ports 110 can be provided, and the plurality of load ports 110 can be placed along the second direction 14.

[0063] For the container F, a closed type container such as a front opening unified pod (FOUP) can be used. The container F can be placed on the load port 110 by a transfer member (not shown) such as an overhead transfer device, an overhead conveyor, or an automated guided vehicle, or the container F can be placed on the load port 110 by an operator.

[0064] An indexing robot 132 is provided inside the indexing frame 130. In the indexing frame 130, a guide rail 136 is provided so that its length extends along the second direction 14, and the indexing robot 132 can be provided to be movable on the guide rail 136. The indexing robot 132 includes a hand on which the substrate W is placed, and the hand can be provided to be movable forward and backward, rotatable with the third direction as an axis, and movable along the third direction 16.

[0065] The processing module 300 performs a coating process and a development process on the substrate W. The processing module 300 can receive the substrate W housed in the container F and can perform a substrate processing process. The processing module 300 has a coating block 300a and a development block 300b. The coating block 300a performs a coating process on the substrate W, and the development block 300b performs a development process on the substrate W. A plurality of coating blocks 300a are stacked with each other. A plurality of development blocks 300b are provided, and the plurality of development blocks 300b are provided to be stacked with each other. According to an embodiment, the coating block 300a and the development block 300b are provided to be stacked with each other. Figure 4In an embodiment, two coating blocks 300a and two developing blocks 300b are provided. The coating blocks 300a can be provided below the developing blocks 300b. In an embodiment, the two coating blocks 300a can perform the same process, and can be provided in the same configuration. In addition, the two developing blocks 300b can perform the same process, and can have the same configuration.

[0066] Referring to Figure 6 , each of the coating blocks 300a includes a heat treatment chamber 320, a transfer chamber 350, a liquid treatment chamber 360, and buffer chambers 312 and 316. The heat treatment chamber 320 can be a chamber for performing a heat treatment process on the substrate W. The heat treatment process can include a cooling process and a heating process. The liquid treatment chamber 360 supplies a liquid onto the substrate W to form a liquid layer. The liquid layer can be a photoresist film or an anti-reflection film. The transfer chamber 350 transfers the substrate W between the heat treatment chamber 320 and the liquid treatment chamber 360 in the coating block 300a.

[0067] The transfer chamber 350 is provided such that its length extends in parallel with the first direction 12. A transfer robot 352 is provided in the transfer chamber 350. The transfer robot 352 transfers the substrate among the heat treatment chamber 320, the liquid treatment chamber 360, and the buffer chambers 312 and 316. In an embodiment, the transfer robot 352 has a hand on which the substrate W is placed, and the hand can be provided to be movable front and back, rotatable about the third direction 16 as an axis, and movable along the third direction 16. A guide rail 356 is provided in the transfer chamber 350 such that its length extends in parallel with the first direction 12, and the transfer robot 352 can be provided to be movable on the guide rail 356.

[0068] Figure 7 is a view showing one example of a hand of a transfer robot. Referring to Figure 7 , the hand 352 has a base 352a and protrusions 352b. The base 352b can have a ring shape in which a circumference of the ring shape is partially cut. The base 352a has an inner diameter that is larger than a diameter of the substrate W. The protrusions 352b extend inward from the base 352a. The protrusions 352 support an edge region of the substrate W. According to an embodiment, four protrusions 352 can be provided to be spaced apart at equal intervals.

[0069] A plurality of heat treatment chambers 320 are provided. The heat treatment chambers 320 are arranged along the first direction 12. The heat treatment chambers 320 are placed on one side of the transfer chamber 350.

[0070] Figure 8 is a schematic plan view showing one example of a heat treatment chamber of Figure 6 , and Figure 9 is a front view of the heat treatment chamber of Figure 8 .

[0071] Referring to Figure 8 and Figure 9 The heat treatment chamber 320 has a housing 321, a cooling unit 322, a heating unit 323, and a transfer plate 324.

[0072] The housing 321 is provided in a substantially rectangular parallelepiped shape. An entrance (not shown) through which the substrate W enters and exits is provided on a side wall of the housing 321. The entrance can be kept open. Alternatively, a door (not shown) can be provided to open and close the entrance. The cooling unit 322, the heating unit 323, and the transfer plate 324 are provided in the housing 321. The cooling unit 322 and the heating unit 323 are provided side by side along the second direction 14. In an embodiment, the cooling unit 322 can be placed closer to the transfer chamber 350 than to the heating unit 323.

[0073] The cooling unit 322 has a cooling plate 322a. The cooling plate 322a can have a substantially circular shape when viewed from above. A cooling member 322b is provided inside the cooling plate 322a. In an embodiment, the cooling member 322b is formed inside the cooling plate 322a and can be provided as a path through which a cooling fluid flows.

[0074] The heating unit 323 has a heating plate 323a, a cover 323c, and a heater 323b. The heating plate 323a has a substantially circular shape when viewed from above. The heating plate 323a has a larger diameter than the substrate W. The heater 323b is mounted inside the heating plate 323a. The heater 323b can be implemented with a resistance heating element to which an electric current is applied. The heating plate 323a is provided with a lifting pin 323e that can be vertically moved along the third direction 16. The lifting pin 323e receives the substrate W from a transfer member outside the heating unit 323 and places the substrate W down on the heating plate 323a, or lifts the substrate W off the heating plate 323a and transfers the substrate W to a transfer unit outside the heating unit 323. According to an embodiment, three lifting pins 323e can be provided. The cover 323c has a space therein that is open at the bottom. The cover 323c is located above the heating plate 323a and is vertically moved by an actuator 323d. The space formed by moving the cover 323c together with the heating plate 323a acts as a heating space in which the substrate W is heated.

[0075] The transfer plate 324 has a substantially circular plate shape, and has a diameter corresponding to the substrate W. A notch 324b is formed at the edge of the transfer plate 324. The notch 324 can have a shape corresponding to the protrusion 352b formed on the hand of the transfer robot 352. In addition, as many notches 324b as the protrusions 352b formed on the hand are formed at positions corresponding to the protrusions 352b. When the vertical positions of the hand and the transfer plate 324 aligned with each other in the upward / downward direction are changed, the substrate W is transferred between the hand and the transfer plate 324. The transfer plate 324 is mounted on a guide rail 324d and moved along the guide rail 324d by an actuator 324c. A plurality of guide grooves 324a of a slit shape are provided in the transfer plate 324. The guide grooves 324a extend inward from the edge of the transfer plate 324. The guide grooves 324a are provided so that their lengths extend along the second direction 14. When the substrate W is handed over between the transfer plate 324 and the heating unit 323, the guide grooves 324a prevent the transfer plate 324 and the lift pins 323e from interfering with each other.

[0076] The substrate W is cooled in a state in which the transfer plate 324 on which the substrate W is placed is in contact with the cooling plate 322a. In order to efficiently transfer heat between the cooling plate 322a and the substrate W, the transfer plate 324 is formed of a material having high thermal conductivity. In an embodiment, the transfer plate 324 can be formed of a metal material.

[0077] The heating unit 323 provided in some of the heat treatment chambers 320 can supply a gas to improve adhesion of the photoresist to the substrate W at the same time as heating the substrate W. According to an embodiment, the gas can be hexamethyldisilane (HMDS) gas.

[0078] A plurality of liquid treatment chambers 360 are provided. Some of the liquid treatment chambers 360 can be stacked with each other. The liquid treatment chambers 360 are located on one side of the transfer chamber 350. The liquid treatment chambers 360 are arranged side by side along the first direction 12. Some of the liquid treatment chambers 360 are positioned adjacent to the indexing module 100. Hereinafter, these liquid treatment chambers 360 are referred to as front liquid treatment chambers 362. Some other liquid treatment chambers 360 are positioned adjacent to the interface module 500. Hereinafter, these liquid treatment chambers 360 are referred to as rear liquid treatment chambers 364.

[0079] Each of the front liquid treatment chambers 362 applies a first liquid to the substrate W, and each of the rear liquid treatment chambers 364 applies a second liquid to the substrate W. The first liquid and the second liquid can be different types of liquids. In an embodiment, the first liquid can be a liquid for forming an anti-reflection layer, and the second liquid can be a liquid for forming a photoresist layer. The photoresist can be applied to the substrate W coated with the anti-reflection film. Alternatively, the first liquid can be a photoresist liquid, and the second liquid can be a liquid for forming an anti-reflection layer. In this case, the liquid for forming an anti-reflection layer can be applied to the substrate W coated with the photoresist layer. Alternatively, the first liquid and the second liquid can be the same kind of liquid, and both the first liquid and the second liquid can be a liquid for forming a photoresist layer.

[0080] The developing block 300b has the same structure as the coating block 300a, and the liquid treatment chambers provided in the developing block 300b supply a developing solution to the substrate.

[0081] The interface module 500 connects the process module 300 to the external exposure apparatus 700. The interface module 500 has an interface frame 510, an additional process chamber 520, an interface buffer 530, and an interface robot 550.

[0082] A fan filter unit that forms a descending air flow can be provided at the top end of the interface frame 510. The additional process chamber 520, the interface buffer 530, and the interface robot 550 are provided inside the interface frame 510. The additional process chamber 520 can perform a predetermined additional process, and then bring the substrate W on which the process is completed into the exposure apparatus 700 in the coating block 300a. Alternatively, the additional process chamber 520 can perform a predetermined additional process, and then bring the substrate W on which the process is completed from the exposure apparatus 700 into the developing block 300b. According to an embodiment, the additional process can be an edge exposure process that exposes an edge region of the substrate W, a top surface cleaning process that cleans a top surface of the substrate W, or a bottom surface cleaning process that cleans a bottom surface of the substrate W. A plurality of additional process chambers 520 can be provided, and they can be provided stacked one on another. All of the additional process chambers 520 can be provided to perform the same process. Alternatively, some of the additional process chambers 520 can be provided to perform different processes.

[0083] The interface buffer 530 provides a space in which the substrate W transferred between the coating block 300a, the additional process chamber 520, the exposure apparatus 700, and the developing block 300b temporarily stays during transportation. A plurality of interface buffers 530 can be provided, and the plurality of interface buffers 530 can be provided stacked one on another.

[0084] According to an embodiment, the additional process chamber 520 can be provided on one side and the interface buffer 530 can be provided on the other side, based on a line extending in the direction of the length of the transfer chamber 350.

[0085] The interface robot 550 transfers the substrate W between the coating block 300a, the additional process chamber 520, the exposure device 700, and the developing block 300b. The interface robot 550 can have a transfer hand for transferring the substrate W. The interface robot 550 can be provided as one or more robots. According to an embodiment, the interface robot 550 has a first robot 552 and a second robot 554. The first robot 552 can be provided to transfer the substrate W between the coating block 300a, the additional process chamber 520, and the interface buffer 530, and the second robot 554 can transfer the substrate W between the interface buffer 530 and the exposure device 700.

[0086] Each of the first robot 552 and the second robot 554 includes a transfer hand on which the substrate W is placed, and the hand can be provided to move forward and backward, to be rotatable with respect to an axis parallel to the third direction 16, and to be movable along the third direction 16.

[0087] Hereinafter, the structure of a substrate processing apparatus for processing a substrate by supplying a processing liquid to a rotating substrate in a substrate processing apparatus of the inventive concept will be described in detail. For example, the substrate processing apparatus is an apparatus for applying a photoresist. However, the substrate processing apparatus can be an apparatus for forming a film, such as a protective film or an anti-reflection film, on a rotating substrate W. Alternatively, the substrate processing apparatus can be an apparatus for supplying a processing liquid 82, such as a developing solution, to a substrate W.

[0088] Figure 10 is a cross-sectional view illustrating one embodiment of a substrate processing apparatus for processing a substrate by supplying a processing liquid to a rotating substrate, and Figure 11 is a perspective view illustrating the outside of the substrate processing apparatus of Figure 10 , and Figure 12 is Figure 10 a cross-sectional view of the substrate processing apparatus of

[0089] Referring to Figures 10 to 12 , the substrate processing apparatus includes a housing 1100, a processing container 1200, a substrate support unit 1400, a liquid supply unit 1600, and an exhaust unit 3900.

[0090] The housing 1100 can be provided in a rectangular container shape having an inner space 1120. An opening 1102 can be formed in a sidewall of the housing 1100. The opening 1102 can serve as an inlet / outlet opening through which the substrate W enters and exits the housing 1100. A door (not shown) can be provided on the sidewall of the housing 1100, which opens and closes the opening 1102.

[0091] A process container 1200 can be provided in the inner space 1120 of the housing. The process container 1200 has an inner space 1280. The inner space 1280 is open at a top portion.

[0092] A substrate support unit 1400 supports the substrate W in the inner space 1280 of the process container 1200. The substrate support unit 1400 has a support plate 1420, a rotation shaft 1440, and an actuator 1460. The support plate 1420 has a circular top surface. The support plate 1420 has a smaller diameter than the substrate W. The support plate 1420 supports the substrate W by vacuum pressure. Alternatively, the support plate 1420 can have a mechanical clamping structure that supports the substrate W. The rotation shaft 1440 is coupled to the center of the bottom surface of the support plate 1420, and the actuator 1460 that provides torque to the rotation shaft 1440 is coupled to the rotation shaft 1440. The actuator 1460 can be a motor.

[0093] A liquid supply unit 1600 can supply the process liquid 82 onto the substrate W. The process liquid 82 supplied to the substrate W by the liquid supply unit 1600 can be a coating solution such as a photoresist. The liquid supply unit 1600 has a nozzle 1620, a nozzle moving member 1640, and a liquid supply source (not shown). The nozzle 1620 can include one or more nozzles. The nozzle 1620 supplies the process liquid 82 onto the substrate W. The nozzle 1620 is supported on the nozzle moving member 1640. The nozzle moving member 1640 moves the nozzle 1620 between a process position and a standby position. In the process position, the nozzle 1620 supplies the process liquid 82 onto the substrate W placed on the support plate 1420. After the process liquid 82 is completely supplied, the nozzle 1620 stands by in the standby position. In the standby position, the nozzle 1620 stands by in a main port (not shown). The main port is located outside the process container 1200 in the housing 1100.

[0094] A fan filter unit 1260 is provided inside a top wall of the housing 1100 and supplies the downward air flow 84 into the inner space 1120. The fan filter unit 1260 has a fan that introduces outside air into the inner space 1120 and a filter that filters the outside air.

[0095] The exhaust pipe 1140 is connected to the housing 1100 so as to be located outside the process container 1200, and exhausts the air flow 84 supplied to the space between the process container 1200 and the housing 1100 to the outside.

[0096] The process container 1200 has an outer cup 1220 and an inner cup 1240.

[0097] The outer cup 1220 surrounds the substrate support unit 1400 and the substrate W supported on the substrate support unit 1400. The outer cup 1220 has a bottom wall 1222, a side wall 1224, and a top wall 1226. The inside of the outer cup 1220 is provided as the above-described internal space 1280. The internal space 1280 includes a process space in an upper space and an exhaust space 1248 at a position lower than the process space.

[0098] The bottom wall 1222 has a circular shape and has an opening in the center thereof. The side wall 1224 extends upward from the outer end of the bottom wall 1222. The side wall 1224 has an annular shape and is perpendicular to the bottom wall 1222. According to an embodiment, the side wall 1224 extends to a height equal to or slightly lower than the height of the top surface of the support plate 1420. The top wall 1226 has an annular shape and has an opening in the center thereof. The top wall 1226 extends obliquely from the top end of the side wall 1224 toward the central axis of the outer cup 1220.

[0099] The inner cup 1240 is positioned inside the outer cup 1220. The inner cup 1240 has an inner wall 1242, an outer wall 1244, and a top wall 1246. The inner wall 1242 has a through-hole formed through the inner wall 1242 in the upward / downward direction. The inner wall 1242 surrounds the actuator 1460. The inner wall 1242 minimizes exposure of the actuator 1460 to the air flow 84 in the processing space. The rotation shaft 1440 of the substrate support unit 1400 and / or the actuator 1460 extends through the through-hole in the upward / downward direction. A lower end of the inner wall 1242 can be positioned at a position corresponding to a position of the bottom wall 1222 of the outer cup 1220. The outer wall 1244 is spaced apart from the inner wall 1242 and surrounds the inner wall 1242. The outer wall 1244 is positioned to be spaced apart from the sidewall 1224 of the outer cup 1220. The inner wall 1242 is disposed to be spaced apart upward from the bottom wall 1222 of the outer cup 1220. The top wall 1246 connects a top end of the outer wall 1244 and a top end of the inner wall 1242. The top wall 1246 has a ring shape and is disposed to surround the support plate 1420. According to an embodiment, the top wall 1246 has an upwardly convex shape. The top wall 1246 has an outer top wall 1246a extending obliquely from the top end of the outer wall 1244 toward the rotation shaft 1440, and an inner top wall 1246b extending obliquely downward from the outer top wall 1246a to the top end of the inner wall 1242. The support plate 1420 can be positioned in a space surrounded by the inner top wall 1246b. According to an embodiment, a highest point of the top wall 1226 can be positioned outside the support plate 1420 and can be positioned inside an edge of the substrate W supported on the substrate support unit 1400.

[0100] A portion of the processing space below the support plate 1420 can be disposed as an exhaust space 1248. According to an embodiment, the exhaust space 1248 can be defined by the inner cup 1240. A space surrounded by the outer wall 1244, the top wall 1246, and the inner wall 1242 of the inner cup 1240 and / or a space below the same can be disposed as the exhaust space 1248.

[0101] The gas-liquid separator 1230 can be disposed in the inner space 1280 of the process container 1200. The gas-liquid separator 1230 can extend upward from the bottom wall 1222 of the outer cup 1220. The gas-liquid separator 1230 can have a ring shape. When viewed from above, the gas-liquid separator 1230 can be positioned between the sidewall 1244 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240. Optionally, when viewed from above, the gas-liquid separator 1230 can be positioned to overlap the outer wall 1244 of the inner cup 1240, or can be positioned inside the outer wall 1244 of the inner cup 1240. According to an embodiment, a top end of the gas-liquid separator 1230 can be positioned lower than a lower end of the outer wall 1244 of the inner cup 1240.

[0102] A discharge pipe 1250 for discharging the treatment liquid 82 is connected to the bottom wall 1222 of the outer cup 1220. The discharge pipe 1250 discharges the treatment liquid 82 introduced between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 to the outside of the process container. According to an embodiment, a space between the side wall 1224 of the outer cup 1220 and the gas-liquid separator 1230 is provided as a discharge space 1252 for discharging the treatment liquid 82, and the discharge pipe 1250 discharges the treatment liquid 82 from the discharge space 1252. The air flow 84 flowing into the space between the side wall 1224 of the outer cup 1220 and the outer wall 1244 of the inner cup 1240 is introduced into a space surrounded by the side wall 1224 and the bottom wall 1222 of the outer cup 1220 and the gas-liquid separator 1230, and is introduced into the exhaust space 1248. In this process, the treatment liquid 82 contained in the air flow 84 is discharged from the discharge space 1252 to the outside of the process container 1200 through the discharge pipe 1250, and the air flow 84 is introduced into the exhaust space 1248 of the process container 1200.

[0103] One or more discharge pipes 1250 can be provided. When a plurality of discharge pipes 1250 are provided, the discharge pipes 1250 can be arranged along the circumferential direction of the inner cup 1240.

[0104] Although not shown, a lift / lower actuator for adjusting the height of the outer cup 1220 with respect to the support plate 1420 can be provided. According to an embodiment, the lift / lower actuator can move the outer cup 1220 upward and downward. For example, the support plate 1420 is positioned higher than the top end of the outer cup 1220 to prevent interference between a transfer member for transferring the substrate W and the outer cup 1220 when the substrate W is loaded onto or unloaded from the support plate 1420. In addition, when a process is performed, the support plate 1420 is positioned lower than the top end of the outer cup 1110 so that the substrate W is positioned in the process space.

[0105] The exhaust unit 1900 has a separate exhaust pipe 3820, an air flow guide pipe 3700, and an integrated exhaust pipe 3840. Hereinafter, the exhaust unit 3900 according to the inventive concept will be described in greater detail.

[0106] Figures 10 to 12 is a view showing a substrate processing apparatus 3000 according to the inventive concept including an air flow guide pipe 3700.

[0107] Reference Figures 10 to 12 The exhaust unit 3900 discharges the air flow 84 in the process space. The exhaust unit 3900 has a separate exhaust pipe 3820, an air flow guide pipe 3700, and an integrated exhaust pipe 3840.

[0108] The individual exhaust pipe 3820 is connected with the exhaust space 1248 in the substrate processing apparatus 3000. One or more individual exhaust pipes 3820 can be provided. According to an embodiment, the individual exhaust pipe 3820 is connected to the bottom wall 1222 of the outer cup 1220, and the inlet of the individual exhaust pipe 3820 is positioned at a predetermined height spaced upward from the bottom wall 1222 of the outer cup 1220.

[0109] The air flow guide pipe 3700 guides the air flow 84 at a height equal to the height of the top surface of the substrate W supported on the substrate support unit 1400 or at a height adjacent to the top surface of the substrate W. When the substrate W is rotated, the downward air flow 84 supplied to the upper region of the substrate W flows from the central region of the substrate W toward the edge region of the substrate W by centrifugal force. Further, on the surface of the substrate W and in the region adjacent thereto, the air flow 84 flows toward the outside of the substrate W while bending in the same direction as the direction of rotation of the substrate W. When the air flow 84 deviates from the top surface of the substrate W, the direction of the air flow 84 is tangent to the direction of rotation of the substrate W.

[0110] The air flow guide pipe 3700 is provided so that the air flow 84 deviating from the top surface of the substrate W is introduced into the air flow guide pipe 3700 in a tangential direction with respect to the direction of rotation of the substrate W.

[0111] The air flow guide pipe 3700 is provided at the outside of the processing container 1200. The air flow guide pipe 3700 has an air flow introduction portion 3720, a connection portion 3740, and an air flow discharge portion 3760. The air flow introduction portion 3720 has an inlet 3722 through which the air flow 84 is introduced from the processing space. The inlet 3722 is provided at substantially the same level as the substrate W supported by the support unit 1400. The inlet 3722 is provided to introduce the air flow 84 in a direction parallel to the tangential direction of the substrate W supported by the support unit 1400. The air flow discharge portion 3760 can have an outlet 3762, and the air flow discharge portion 3760 can be connected to the integrated exhaust pipe 3840 described later. The connection portion 3740 connects the air flow introduction portion 3720 and the air flow discharge portion 3760.

[0112] The air flow guide pipe 3700 has a tubular shape. The direction of the length of the air flow introduction portion 3720 of the air flow guide pipe 3700 can be parallel to the tangential direction of the substrate W. In addition, the air flow discharge portion 3760 of the air flow guide pipe 3700 can be provided below the air flow introduction portion 3720 and can be provided parallel to the air flow introduction portion 3720 to face the air flow introduction portion 3720. The direction of the length of the connection portion 3740 can be provided perpendicular to the air flow introduction portion 3720 and the air flow discharge portion 3760.

[0113] One or more air flow guide pipes 3700 can be provided. According to an embodiment, two air flow guide pipes 3700 can be provided, and they can be provided at regular intervals based on the center of rotation of the substrate W. Alternatively, three or more air flow guide pipes 3700 can be provided.

[0114] The integrated air flow pipe 3840 is placed outside the outer cup 1220. According to an embodiment, the integrated air flow pipe 3840 can be placed outside the housing 1100. The integrated air flow pipe 3840 has an air flow introduction portion 3842 and an air flow discharge portion 3844.

[0115] According to an embodiment, the air flow introduction portion 3842 has a ring shape. The individual exhaust pipes 3820 and the air flow guide pipes 3700 are coupled to the air flow introduction portion 3842, and the gas flowing out from the individual exhaust pipes 3820 and the air flow guide pipes 3700 is introduced into the air flow introduction portion 3842 of the integrated exhaust pipe 3840. The air flow discharge portion 3844 is located in a space surrounded by the air flow introduction portion 3842, and a connection portion connects the air flow introduction portion 3842 and the air flow discharge portion 3844 so that the air flow introduced into the air flow introduction portion 3842 flows to the air flow discharge portion 3844. The individual exhaust pipes 3820 are connected to the air flow introduction portion 3842 at a position closer to the air flow discharge portion 3844 than to the air flow guide pipes 3700. A gas-liquid separator 3846 can be provided between the point at which the individual exhaust pipes 3820 are connected to the air flow introduction portion 3842 and the air flow discharge portion 3844. According to an embodiment, the gas-liquid separator 3846 can be provided in the air flow introduction portion 3842. The gas-liquid separator 3846 has an arc shape and protrudes upward from a bottom surface of the air flow introduction portion 3842. In addition, the gas-liquid separator 3846 is spaced apart from a top surface of the air flow introduction portion 3842.

[0116] In addition, a discharge pipe 3848 is provided on the opposite side of the air flow discharge portion 3844 with respect to the point at which the gas-liquid separator 3846 is installed in the air flow introduction portion 3842. The discharge pipe 3848 discharges liquid separated from the air flow 84 introduced into the air flow introduction portion 3842 to the outside of the integrated exhaust pipe 3840. According to an embodiment, the discharge pipe 3848 is provided at a position adjacent to the gas-liquid separator 3846.

[0117] Figure 13 and Figure 14 are cross-sectional views and cross-sectional perspective views showing flow paths of the air flow 84 and the processing liquid 82 when the substrate W is subjected to liquid processing by the apparatus of Figure 10 .

[0118] Referring to Figure 13 and Figure 14 In the coating process, the substrate W is supported on the support plate 1420 and rotated by the support plate 1420. At this time, the substrate support unit 1400 rotates the substrate W so that the air flow 84 generated by the rotation of the substrate W flows toward the inlet 3722 of the air flow guide pipe 3700. The outside air is supplied as the downward air flow 84 from the fan filter unit 1260 toward the substrate W. In addition, the process liquid 82 is supplied onto the substrate W from the nozzle 1620. Due to the rotation of the substrate W, the air flow 84 on the top surface of the substrate W flows toward the outside of the substrate W while being curved in the direction of rotation of the substrate W. When the air flow 84 flows toward the outside of the substrate W, a portion of the air flow 84 is introduced into the air flow guide pipe 3700 and thereafter discharged to the outside of the process container 1200. In addition, the remaining portion of the air flow 84 flows downward through the gap between the inner cup 1240 and the outer cup 1220. Thereafter, the remaining portion of the air flow 84 is introduced into the exhaust space 1248 in the process container 1200 and discharged to the outside of the process container 1200 through the separate exhaust pipe 3820. In addition, the process liquid 82 used to process the substrate W is introduced into the discharge space 1252 through the space between the inner cup 1240 and the outer cup 1220, and thereafter discharged to the outside of the process container 1200 through the discharge pipe 1250.

[0119] The air flow 84 discharged from the air flow guide pipe 3700 and the separate exhaust pipe 3820 is introduced into the air flow introduction portion 3842 of the integrated exhaust pipe 3840. Thereafter, the process liquid 82 is separated by the gas-liquid separator 3846, and the air flow 84 is discharged to the outside through the air flow discharge portion 3844.

[0120] According to Figure 10 embodiments, a portion of the air flow 84 is introduced into the air flow guide pipe 3700. At this time, the air flow 84 flowing toward the outside of the substrate W by the centrifugal force can be smoothly introduced into the air flow guide pipe 3700 without colliding or interfering with the process container 1200 or its components, as the air flow guide pipe 3700 is disposed so that the air flow 84 is introduced into the air flow guide pipe 3700 in the tangential direction of the direction of rotation of the substrate W.

[0121] In addition, a portion of the air flow 84 is introduced into the exhaust space 1248 in the process container 1200. However, the amount of the air flow 84 introduced into the exhaust space 1248 is extremely small compared to when the air flow guide pipe 3700 is not provided. Therefore, the air flow 84 can be smoothly discharged through the exhaust space 1248 without vortexes or great collisions.

[0122] Hereinafter, a substrate processing apparatus 4000 according to a second embodiment of the present inventive concept will be described in more detail with reference to the drawings.

[0123] Figure 15 is a cross-sectional view schematically showing a structure of a substrate processing apparatus for processing a substrate by supplying a liquid to a rotating substrate according to the second embodiment of the present inventive concept, and Figure 16 is a cross-sectional view showing a flow path of air flow and a processing liquid during liquid processing using Figure 15 the apparatus. In the first embodiment, it has been described that the air flow 84 supplied to the substrate W flows into a first path that introduces the air flow into the exhaust space 1248 located below the support plate 1420 in the processing container 1200 and a second path that introduces the air flow into the air flow guide pipe 3700. However, in the second embodiment, all of the air flow 84 supplied to the substrate W is disposed to flow through only the second path.

[0124] Specifically, the substrate processing apparatus 4000 according to the second embodiment is distinguished from the substrate processing apparatus 3000 according to the first embodiment in its exhaust unit 3700, while all other configurations are identical. Specifically, in the substrate processing apparatus 4000 according to the second embodiment, a separate exhaust pipe 3820 is deleted from the exhaust unit 3700 of the substrate processing apparatus 3000 according to the first embodiment, and is configured to have only the air flow guide pipe 3700 and the integrated exhaust pipe 3940 to exhaust the air flow 84 in the processing space. Hereinafter, the same reference numerals are assigned to the same configurations as the substrate processing apparatus 3000 according to the first embodiment, and the description thereof will be omitted.

[0125] Referring to Figure 15 , the substrate processing apparatus 4000 according to the second embodiment includes an exhaust unit 4900. The exhaust unit 4900 exhausts the air flow 84 in the processing space. The exhaust unit 4900 includes the air flow guide pipe 3700 and the integrated exhaust pipe 3840.

[0126] The air flow guide pipe 3700 guides the air flow 84 at a height equal to the height of the top surface of the substrate W supported on the substrate support unit 1400 or at a height adjacent to the top surface of the substrate W. When the substrate W rotates, the downward air flow 84 supplied to the upper region of the substrate W flows from the central region of the substrate W toward the edge region of the substrate W by the centrifugal force. Further, on the surface of the substrate W and in the region adjacent thereto, the air flow 84 flows toward the outside of the substrate W while bending in the same direction as the direction of rotation of the substrate W. When the air flow 84 deviates from the top surface of the substrate W, the direction of the air flow 84 is tangent to the direction of rotation of the substrate W.

[0127] The air flow guide pipe 3700 is provided so that the air flow 84 deviated from the top surface of the substrate W is introduced into the air flow guide pipe 3700 in a tangential direction of the rotation direction of the substrate W.

[0128] The air flow guide pipe 3700 is provided outside the processing container 1200. The air flow guide pipe 3700 has an air flow introduction portion 3720, a connection portion 3740, and an air flow discharge portion 3760. The air flow introduction portion 3720 has an inlet 3722 through which the air flow 84 flows from the processing space into the air flow introduction portion 3720. The inlet 3722 is provided at the same height as the substrate W supported on the substrate support unit 1400 or at a height adjacent to the substrate W. The inlet 3722 is provided so that the air flow 84 is introduced in a direction parallel to the tangential direction of the substrate W supported on the substrate support unit 1400. The air flow discharge portion 3760 has an outlet 3762 and can be connected to the integrated exhaust pipe 3840 to be described below. The connection portion 3740 connects the air flow introduction portion 3720 and the air flow discharge portion 3760.

[0129] The air flow guide pipe 3700 has a tubular shape. The air flow introduction portion 3720 of the air flow guide pipe 3700 is provided so that the direction of its length is parallel to the tangential direction of the substrate W. Further, the air flow discharge portion 3760 of the air flow guide pipe 3700 can be provided below the air flow introduction portion 3720 and can face the air flow introduction portion 3720 in parallel thereto. The connection portion 3740 can be provided so that the direction of its length is perpendicular to the air flow introduction portion 3720 and the air flow discharge portion 3760.

[0130] One or more air flow guide pipes 3700 can be provided. According to the embodiment, two air flow guide pipes 3700 can be provided. The two air flow guide pipes 3700 can be separated from each other at a regular interval with respect to the center of rotation of the substrate W. Alternatively, three or more air flow guide pipes 3700 can be provided.

[0131] The integrated exhaust pipe 3840 is provided outside the outer cup 1220. According to the embodiment, the integrated exhaust pipe 3840 can be provided outside the housing 1100. The integrated exhaust pipe 3840 has an air flow introduction portion 3842 and an air flow discharge portion 3844.

[0132] According to an embodiment, the air flow introduction portion 3842 has a ring shape. The air flow introduction portion 3842 is coupled to the air flow guide pipe 3700, and the gas discharged from the air flow guide pipe 3700 is introduced into the air flow introduction portion 3842 of the integrated exhaust pipe 3840. The air flow discharge portion 3844 is located in a space surrounded by the air flow introduction portion 3842, and a connection portion connects the air flow introduction portion 3842 and the air flow discharge portion 3844 to allow the gas introduced into the air flow introduction portion 3842 to flow toward the air flow discharge portion 3844. A gas-liquid separator 3846 can be disposed in the air flow introduction portion 3842. The gas-liquid separator 3846 has an arc shape and protrudes upward from a bottom surface of the air flow introduction portion 3842. Also, the gas-liquid separator 3846 is spaced apart from a top surface of the air flow introduction portion 3842. A space between the gas-liquid separator 3846 and the air flow introduction portion 3842 serves as a path via which the air flow 84 introduced into the air flow guide portion 3842 flows toward the air flow discharge portion 3844.

[0133] The discharge pipe 3250 is disposed to face the air flow discharge portion 3844 with respect to a point at which the gas-liquid separator 3840 is installed in the air flow introduction portion 3842. The discharge pipe 3250 discharges the liquid separated from the air flow 84 introduced into the air flow introduction portion 3842 to the outside of the integrated exhaust pipe 3840. According to an embodiment, the discharge pipe 3250 is disposed at a position adjacent to the gas-liquid separator 1230.

[0134] Referring to Figure 16 In the coating process, the substrate W is supported on the support plate 1420 and rotated by the support plate 1420. At this time, the substrate support unit 1400 rotates the substrate W so that the air flow 84 generated by the rotation of the substrate W flows toward the inlet 3722 of the air flow guide pipe 3700. The external air is supplied as the downward air flow 84 from the fan filter unit 1260 toward the substrate W. Also, the process liquid 82 is supplied onto the substrate W from the nozzle 1620. Due to the rotation of the substrate W, the air flow 84 on the top surface of the substrate W flows toward the outside of the substrate W while turning in the direction of rotation of the substrate W. When the air flow 84 flows toward the outside of the substrate W, most of the air flow 84 is introduced into the air flow guide pipe 3700 and thereafter discharged to the outside of the process container 1200. In addition, the processed substrate W is introduced into the space between the inner cup 1240 and the outer cup 1220, and discharged to the outside of the process container via the discharge pipe 1250.

[0135] Airflow 84 discharged from airflow guide duct 3700 is introduced into airflow inlet section 3842 of integrated exhaust duct 3840. Thereafter, the processed liquid 82 is separated by gas-liquid separator 3846, and airflow 84 is discharged to the outside through airflow outlet section 3844.

[0136] according to Figure 15 In this embodiment, airflow 84 is introduced into airflow guide tube 3700. At this time, airflow 84, which flows towards the outside of substrate W by centrifugal force, can be smoothly introduced into airflow guide tube 3700 without colliding with or interfering with processing container 1200 or its components, because airflow guide tube 3700 is configured such that airflow 84 is introduced into airflow guide tube 3700 in the tangential direction of rotation of substrate W.

[0137] Furthermore, a portion of the airflow 84 is introduced into the exhaust space 1248 within the processing container 1200. However, the amount of airflow 84 introduced into the exhaust space 1248 is extremely small compared to when the airflow guide duct 3700 is not provided. Therefore, the airflow 84 introduced into the exhaust space 1248 experiences very little impact or interference with external components, and thus can be discharged smoothly without turbulence or significant impact.

[0138] Figure 17 a and Figure 17 b is a description of having Figure 1 The diagram shows the exhaust flow rates of a conventional substrate processing apparatus and a substrate processing apparatus equipped with an airflow guide pipe as in an embodiment of the present invention. Figure 17 a is a graph depicting and comparing the exhaust flow rates of a conventional substrate processing apparatus and the substrate processing apparatus of the present invention when the substrate W rotates at a low speed. Figure 17 b is a diagram depicting the exhaust flow rate of a conventional substrate processing apparatus and the substrate processing apparatus of the present invention when the substrate W is rotating at high speed.

[0139] exist Figure 17 a and Figure 17 In section b, the substrate processing equipment of this invention is Figure 10 The substrate processing equipment shown. Figure 17 In step a, the substrate W rotates at 2500 rpm, and... Figure 17 In step b, the substrate W rotates at 5000 rpm.

[0140] refer to Figure 17 a. When the substrate W rotates at 2500 rpm Figure 1 The exhaust flow rate of substrate processing equipment A is 1257 lpm. However, the exhaust flow rate of substrate processing equipment B of the present invention is increased to 1418 lpm, an increase of 12%. (Reference) Figure 17b. when the substrate W is rotated at 5000 rpm, Figure 1 The exhaust flow rate of the substrate processing apparatus A of the related art is 1114 lpm. However, the exhaust flow rate of the substrate processing apparatus B of the inventive concept is increased to 1468 lpm, which is increased by 35%.

[0141] By Figure 17 a and Figure 17 b, it can be seen that the exhaust efficiency is increased by the air flow guide pipe which sucks the air flow 84 in the tangential direction of the rotation direction of the substrate W not only when the process is performed at a low rotation speed of the substrate W but also when the process is performed at a high rotation speed of the substrate W, and the exhaust efficiency is further increased as compared with the conventional structure as the rotation speed of the substrate W is increased.

[0142] Although it has been described that the process container includes the outer cup and the inner cup and the exhaust space in the internal space of the process container is defined by the inner cup, the process container can not include the inner cup and the exhaust space in the internal space of the process container can be defined as an area below the support plate which supports the substrate W.

[0143] In the above-described example, the air flow guide pipe introduces the air flow in the tangential direction of the rotation direction of the substrate W. However, unlike this, the air flow guide pipe can be disposed to introduce the air flow in a direction other than the tangential direction of the rotation direction of the substrate W. For example, as Figure 18 shown, the air flow guide pipe can be disposed such that its inlet is disposed at the same or adjacent height as the substrate and sucks the air flow in the radial direction of the substrate W.

[0144] The above-described examples illustrate the inventive concept. In addition, the above-mentioned contents describe examples of the inventive concept, and the inventive concept can be used in various other combinations, changes, and environments. That is, the inventive concept can be changed or modified without departing from the scope of the inventive concept disclosed in the present specification, the equivalent scope of written disclosure, and / or the range of techniques or knowledge of those skilled in the art. The written example describes the best state for implementing the technical spirit of the inventive concept, and various changes required for the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed example state. In addition, it should be understood that the appended claims include other examples.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit having a support plate configured to support and rotate the substrate within the internal space; A liquid supply unit configured to supply processing liquid to the substrate supported by the support unit; as well as An exhaust unit, configured to discharge airflow from the interior space, The support unit includes: A rotating shaft that causes the support plate to rotate; An actuator, which is coupled to the rotating shaft and provides rotational power to the rotating shaft, The processing container includes: Outer cup, the outer cup providing the internal space; An inner cup, placed within the internal space to be separate from the outer cup, and surrounding the axis of rotation. The inner cup defines an exhaust space in the area below the support plate. The exhaust unit includes: An airflow guide pipe guides the flow direction of airflow on the substrate towards the outside of the substrate due to the rotation of the substrate supported by the support unit, and the airflow guide pipe has an inlet into which the airflow is introduced. A separate exhaust pipe, the separate exhaust pipe being used to discharge the airflow introduced into the exhaust space to the outside of the interior space; An integrated exhaust pipe with an installed pressure regulating component, wherein the separate exhaust pipe and the airflow guide pipe are connected to the integrated exhaust pipe. The airflow guide pipe is placed on the outside of the processing container. One end of the airflow guide tube is connected to the outer cup, and the other end is connected to the integrated exhaust pipe. The airflow guide tube includes: An airflow introduction section, the airflow introduction section including an inlet for introducing airflow into the interior space; An airflow discharge section, the airflow discharge section being connected to the integrated exhaust pipe; and The connecting portion connects the airflow inlet portion and the airflow outlet portion. The airflow guide pipe is formed to extend from the interior space to the outside of the processing container, the airflow discharge section includes an outlet connected to the integrated exhaust pipe, the inlet of the airflow inlet section is located in the interior space, and the outlet of the airflow discharge section is located on the outside of the processing container.

2. The device of claim 1, wherein the inlet is located at the same level as the substrate supported by the support unit, and the inlet located at the airflow guide tube introduces airflow in a tangential direction to the rotational direction of the substrate supported by the support unit.

3. The device of claim 1, wherein a plurality of airflow guide pipes are provided, which are arranged separately in the circumferential direction of the substrate supported by the support unit.

4. The device of claim 3, wherein the plurality of airflow guide tubes are spaced apart at regular intervals based on the center of rotation of the substrate.

5. The device of claim 1, wherein the inner cup is configured about the rotation axis and the actuator.

6. The device of claim 1, wherein the length of the airflow introduction portion is configured to be parallel to the tangential direction of the substrate.

7. The device of claim 6, wherein the length of the connecting portion is arranged in a direction different from the direction of the length of the airflow introduction portion.

8. The device of claim 7, wherein the airflow discharge portion is positioned below and parallel to the airflow inlet portion.

9. The device of claim 1, further comprising a liquid supply nozzle that supplies photoresist to the substrate supported by the support unit.

10. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit having a support plate configured to support and rotate the substrate within the internal space; as well as An exhaust unit, configured to discharge airflow from the interior space, The support unit includes: A rotating shaft that causes the support plate to rotate; An actuator, which is coupled to the rotating shaft and provides rotational power to the rotating shaft, The processing container includes: Outer cup, the outer cup providing the internal space; An inner cup, placed within the internal space to be separate from the outer cup, and surrounding the axis of rotation. The inner cup defines an exhaust space in the area below the support plate. The exhaust unit includes: An exhaust pipe for discharging airflow through a first path to the outside of the processing container, the first path being defined by the space between the inner wall of the processing container and the substrate supported by the support plate, and an exhaust space within the interior space, the exhaust space being below the support plate and communicating with the space; and An airflow guide pipe, used to guide the airflow to a second path different from the first path. The exhaust unit includes: A separate exhaust pipe, the separate exhaust pipe being used to discharge the airflow introduced into the exhaust space to the outside of the interior space; and An integrated exhaust pipe with an installed pressure regulating component, wherein the separate exhaust pipe and the airflow guide pipe are connected to the integrated exhaust pipe. The airflow guide pipe is placed on the outside of the processing container. One end of the airflow guide tube is connected to the outer cup, and the other end is connected to the integrated exhaust pipe. The airflow guide tube includes: An airflow introduction section, the airflow introduction section including an inlet for introducing airflow into the interior space; An airflow discharge section, the airflow discharge section being connected to the integrated exhaust pipe; and The connecting portion connects the airflow inlet portion and the airflow outlet portion. The airflow guide pipe is formed to extend from the interior space to the outside of the processing container, the airflow discharge section includes an outlet connected to the integrated exhaust pipe, the inlet of the airflow inlet section is located in the interior space, and the outlet of the airflow discharge section is located on the outside of the processing container.

11. The device of claim 10, wherein the second path is defined by the tangential direction of the rotational direction of the substrate supported by the support unit.

12. The device of claim 10, wherein the inlet is located at the same level as the substrate supported by the support unit.

13. An apparatus for processing a substrate, the apparatus comprising: A processing container having an internal space; A support unit having a support plate configured to support and rotate the substrate within the internal space; as well as An exhaust unit, configured to discharge airflow from the interior space, The processing container includes: Outer cup, the outer cup providing the internal space; An inner cup, placed within the internal space to be separate from the outer cup. The inner cup defines an exhaust space in the area below the support plate. The exhaust unit includes: An airflow guide pipe guides the airflow direction that is directed to the outside of the substrate due to the rotation of the substrate supported by the support unit, and the airflow guide pipe has an inlet located at the same level as the substrate supported by the support unit. A separate exhaust pipe, the separate exhaust pipe being used to discharge the airflow introduced into the exhaust space to the outside of the interior space; and An integrated exhaust pipe is located outside the processing container and is equipped with a pressure regulating component. The airflow guiding unit's inlet is configured to introduce airflow in the tangential direction of the substrate supported by the support plate, and The airflow guide pipe is placed on the outside of the processing container. The airflow guide tube includes: An airflow introduction section having an inlet for introducing airflow into the interior space; An airflow discharge section, the airflow discharge section being connected to the integrated exhaust pipe; and A connecting unit connects the airflow inlet section and the airflow outlet section. The airflow introduction portion is configured such that its length is parallel to the tangential direction of the substrate. The airflow guide pipe is formed to extend from the interior space to the outside of the processing container, the airflow discharge section includes an outlet connected to the integrated exhaust pipe, the inlet of the airflow inlet section is located in the interior space, and the outlet of the airflow discharge section is located on the outside of the processing container.

14. The device of claim 13, wherein the plurality of the airflow guide tubes are placed apart at regular intervals.

Images