Damper, assembly and electronic controller

By introducing a combination of metal wire mesh buffer components and adhesive material protective components into the damper, the problem of damper deterioration caused by foreign matter adhesion is solved, achieving reliable stress relaxation and stability of the electronic controller, and supporting the installation of high-density electronic components.

CN114542634BActive Publication Date: 2026-02-06DENSO CORP
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Patent Information

Application Number
CN202111360997.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2020-11-19
Filing Date
2021-11-17
Publication Date
2026-02-06
Estimated Expiration
2041-11-17

AI Technical Summary

Technical Problem

Existing dampers suffer from foreign matter adhesion problems, leading to their deterioration, and cannot effectively limit the impact of stress on the electronic controller.

Method used

A damper was designed, comprising a buffer member and a protective member. The buffer member is made of a metal wire mesh, and the protective member is made of an adhesive material and is disposed on the side surface of the buffer member to limit the adhesion of foreign objects. It is electrically connected to the support member through a conductive connection member to achieve reliable stress relaxation.

Benefits of technology

It effectively prevents foreign matter adhesion, limits damper deterioration, ensures reliable stress relaxation in electronic controllers, reduces electronic component failures, and supports high-density installation of electronic components.

✦ Generated by Eureka AI based on patent content.

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Abstract

A damper is arranged in at least one of a space between a supported member (1, 2a) and a support element (2b, 2c, 201, 202) or a space between the supported member and a support member (3a, 3b). The damper includes a cushioning member (611) and a protection member (612a, 612b, 612c, 612d). The cushioning member is configured to relax a stress applied to the supported member supported by the support member together with the support element. The cushioning member includes a facing portion (S1) facing the supported member, an opposite portion (S2) opposite to the facing portion, and a side surface portion (S3) between the facing portion and the opposite portion. The protection member is arranged on the side surface portion to cover the cushioning member from the outside of the cushioning member.
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Description

TECHNICAL FIELD

[0001] The present disclosure relates to a damper, an assembly, and an electronic controller. BACKGROUND

[0002] As an example of a damper, there is a vibration-proof bushing disclosed in JP 2014-095441 A. The vibration-proof bushing has an inner tube body made of metal, an outer tube body made of rubber, and a washer. The outer tube body is fixed to an outer surface of the inner tube body. The washer is fixed to a surface of the outer tube body that faces a screw head. SUMMARY

[0003] Since foreign matter can adhere to the outer tube body made of rubber, it is necessary to further improve the vibration-proof bushing.

[0004] A first object of the present disclosure is to provide an improved damper, assembly, and electronic controller. Another object of the present disclosure is to provide a damper that limits deterioration of the damper. Another object of the present disclosure is to provide an assembly that can reliably relax stress. Another object of the present disclosure is to provide an electronic controller that can limit stress applied to the electronic controller.

[0005] A damper disclosed herein is disposed in at least one of a space between a supported member and a support element or a space between supported members. The damper includes a cushioning member and a protection member. The cushioning member is configured to relax stress applied to a supported member that is supported by a support member together with the support element. The cushioning member includes a facing portion that faces the supported member, an opposite portion that is opposite the facing portion, and a side surface portion between the facing portion and the opposite portion. The protection member is disposed on the side surface portion to cover the cushioning member from an outside of the cushioning member.

[0006] According to the damper disclosed herein, the protection member is disposed on the side surface portion of the cushioning member. Therefore, the damper can limit foreign matter from adhering to the cushioning member, thereby limiting deterioration of the damper.

[0007] According to another aspect of the present disclosure, a damper is disposed in at least one of a space between a supported member and a support element or a space between supported members. The damper includes a cushioning member, a first cover, and a second cover. The cushioning member is configured to relax stress applied to a supported member that is supported by a support member together with the support element. The cushioning member includes a facing portion that faces the supported member, an opposite portion that is opposite the facing portion, and a side surface portion between the facing portion and the opposite portion. The first cover includes a first wall that covers the opposite portion of the cushioning member and a first side wall that protrudes from the first wall to face the side surface portion. The second cover includes a second wall that covers the facing portion of the cushioning member and a second side wall that protrudes from the second wall to face the side surface portion and the first side wall.

[0008] According to the damper disclosed herein, the first side wall and the second side wall are provided to face the side surface portion of the cushioning member. Therefore, the damper can limit foreign matter from adhering to the cushioning member, thereby limiting deterioration of the damper.

[0009] The assembly disclosed herein includes a damper, a supported member, and an electrically conductive connection member connecting the damper to the supported member. The second cover of the damper has electrical conductivity. An electrically conductive mounting pattern is mounted on a surface of the supported member. The electrically conductive connection member connects the second cover of the damper to the electrically conductive pattern of the supported member, so that the damper is mounted on the surface of the supported member.

[0010] According to the assembly disclosed herein, since the damper is provided, stress applied to the supported member can be reliably relaxed. Further, since the damper is mounted on the surface of the supported member, displacement of the damper can be limited.

[0011] The electronic controller disclosed herein includes a damper, a supported member, a support member, and a support element. The supported member is a circuit board in which electronic components and electrically conductive wiring are provided on an insulating substrate having electrical insulation. The damper is provided in at least one of a space between the circuit board and the support element or a space between the circuit board and the support member. The circuit board is supported by the support member.

[0012] According to the electronic controller disclosed herein, the damper is provided in at least one of a space between the circuit board and the support element or a space between the circuit board and the support member, so that stress to the supported member is reliably relaxed. Therefore, the electronic controller can limit stress from being applied to the electronic components or a connection portion located between the electronic components and the insulating substrate.

[0013] The aspects disclosed in this specification employ different technical solutions from each other in order to achieve the respective objects. The objects, features, and advantages of the aspects disclosed in this specification will become apparent by making reference to the following detailed description and the attached drawings. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is an exploded perspective view showing a schematic configuration of an electronic controller of a first embodiment.

[0015] Figure 2 is a cross-sectional view showing a schematic configuration of the electronic controller of the first embodiment.

[0016] Figure 3 is a plan view showing a schematic configuration of a damper of the first embodiment.

[0017] Figure 4 is an enlarged view of the damper, the circuit board, and the base of the first embodiment.

[0018] Figure 5is Figure 4 Enlarged view of a portion V.

[0019] Figure 6 is a cross-sectional view showing a schematic configuration of an impact absorbing member of a first embodiment.

[0020] Figure 7 is a cross-sectional view showing a schematic configuration of a damper of a first modification example.

[0021] Figure 8 is a cross-sectional view showing a schematic configuration of a damper of a second modification example.

[0022] Figure 9 is a cross-sectional view showing a schematic configuration of a damper of a third modification example.

[0023] Figure 10 is a cross-sectional view showing a schematic configuration of a damper of a fourth modification example.

[0024] Figure 11 is a cross-sectional view showing a schematic configuration of a damper of a fifth modification example.

[0025] Figure 12 is a cross-sectional view showing a schematic configuration of a damper of a sixth modification example.

[0026] Figure 13 is a cross-sectional view showing a schematic configuration of a damper of a seventh modification example.

[0027] Figure 14 is a cross-sectional view showing a schematic configuration of a damper of a second embodiment.

[0028] Figure 15 is a cross-sectional view showing a schematic configuration of a damper of an eighth modification example.

[0029] Figure 16 is a cross-sectional view showing a schematic configuration of a damper of a ninth modification example.

[0030] Figure 17 is a plan view showing a schematic configuration of a damper of a third embodiment.

[0031] Figure 18 is a cross-sectional view taken along Figure 17 line XVIII-XVIII in FIG. 18.

[0032] Figure 19 is a cross-sectional view showing a schematic configuration of a damper of a fourth embodiment.

[0033] Figure 20 is a cross-sectional view showing a schematic configuration of a damper of a tenth modification example.

[0034] Figure 21 is a cross-sectional view showing a schematic configuration of a damper of a ninth modification example.

[0035] Figure 22 is a cross-sectional view showing a schematic configuration of a damper according to a fifth embodiment. DETAILED DESCRIPTION

[0036] Hereinafter, a plurality of embodiments of the present disclosure will be described with reference to the drawings. In each embodiment, portions corresponding to those described in the foregoing embodiments are denoted by the same reference numerals, and redundant description will be omitted in some cases. In each embodiment, when only a part of the configuration is explained, other parts of the embodiment can be referred to and applied to the other embodiments explained before.

[0037] (First Embodiment)

[0038] Referring to Figures 1 to 6 The electronic controller 100 of the present embodiment and the damper 6a provided in the electronic controller 100 will be described.

[0039] <Electronic Controller>

[0040] First, referring to Figure 1 and Figure 2 The electronic controller 100 will be described. The electronic controller 100 includes a circuit board 1, a cover 2a, a base 3a, a damper 6a, and the like. The electronic controller 100 is configured to be mounted in a vehicle, for example. Therefore, the electronic controller 100 can be applied to a controller that controls a vehicle-mounted device. In Figure 1 and 2 In the electronic controller 100, the illustration of the damper 6a is simplified.

[0041] The circuit board 1 corresponds to a supported member. The circuit board 1 includes an insulating substrate 4a, circuit elements 51 and 52, a connector 53, and the like. The insulating substrate 4a is a substrate of resin or ceramic or the like having electrical insulation. The insulating substrate 4a defines a second insertion hole 41 that passes through the insulating substrate 4a in the thickness direction. The second insertion hole 41 is a hole into which a second screw 202 is inserted. The second insertion hole 41 is defined at four corner portions of the insulating substrate 4a, for example. In the present embodiment, a circuit board 1 provided with the connector 53 is adopted as an example. However, the present disclosure can be adopted even in a circuit board 1 without the connector 53.

[0042] The insulating substrate 4a is provided with a wiring pattern 42 that is a part of an electrically conductive wiring. The wiring pattern 42 is provided on the surface or inside of the insulating substrate 4a. The circuit board 1 can be a multilayer board in which the wiring pattern 42 and the insulating substrate 4a are alternately stacked with each other, a single-layer board in which a single-layer wiring pattern 42 is provided on the insulating substrate 4a, or the like.

[0043] Each of the circuit elements 51 and 52 and the connector 53 corresponds to an electronic component. The circuit elements 51, 52 and the connector 53 are mounted on the insulating substrate 4a.

[0044] Each of the circuit elements 51 and 52 is, for example, a semiconductor switching element, a resistive element, a capacitor, or the like. The circuit element 51 is mounted on a first surface of the insulating substrate 4a. On the other hand, the circuit element 52 is mounted on a second surface of the insulating substrate 4a opposite to the first surface. More specifically, the circuit elements 51 and 52 are mounted on the insulating substrate 4a with electrically conductive connection members. In addition, the circuit elements 51, 52 are electrically connected to the wiring pattern 42 through the connection members.

[0045] The number of the circuit elements 51 and 52 is not limited to Figure 1 the number shown. Further, in the present embodiment, solder is adopted as an example of the electrically conductive connection member. However, the electrically conductive connection member is not limited to solder, and other members such as silver paste or the like can be used. The solder and the wiring pattern 42 can be considered as a connection portion between an electronic component and the insulating substrate 4a.

[0046] The connector 53 includes a connector housing that accommodates a terminal 531. The connector 53 is mounted on the insulating substrate 4a so that the terminal 531 and a wiring are electrically connected to each other by solder. The connector 53 is provided for electrical connection between the electronic controller 100 and an external device provided outside the electronic controller 100. The external device is another electronic controller, a device to be controlled, or the like. Further, the connector 53 can be, for example, an interface for connecting to a communication line of an in-vehicle network. That is, in the present embodiment, the connector 53 is adopted as an example of an interface.

[0047] As Figure 2 shown, the circuit board 1 is supported by the base 3a with the second screws 202. More specifically, the circuit board 1 is supported by the base 3a with the second screws 202 via the dampers 6a. Further, the circuit board 1 is supported by the base 3a with a plurality of the second screws 202. In the present embodiment, as an example, four second screws 202 are used to support the circuit board 1 on the base 3a. The dampers 6a are respectively provided between the second screws 202 and the circuit board 1.

[0048] Each of the second screws 202 corresponds to a support element. The second screw 202 can contain metal as a main component. The second screw 202 has a columnar portion provided with a male thread and a screw head at an end portion of the columnar portion. As Figure 2 shown, the columnar portion of the second screw 202 is inserted into the second insertion hole 41 and the cap opening portion 65 of the damper 6a, and a portion of the columnar portion is screwed into a second screw hole 32 (a female thread) defined in the base 3a.

[0049] In this way, the male screw of the second screw 202 and the female screw of the second screw hole 32 engage with each other, thereby supporting the circuit board 1 on the base 3a. In other words, the circuit board 1 is screwed to the base 3a by the second screw 202. In this state, the screw head of the second screw 202 is pressed against the damper 6a. The damper 6a will be described later in detail.

[0050] The lid 2a and the base 3a constitute a housing of the circuit board 1. The lid 2a and the base 3a are assembled to each other to define an accommodation space for the circuit board 1. The lid 2a and the base 3a are mainly composed of a metal such as aluminum. Thus, the lid 2a and the base 3a have electric conductivity.

[0051] However, the housing is not limited to this. For example, the lid 2a and the base 3a can be mainly composed of a resin or the like. Further, only one of the lid 2a and the base 3a can be composed of a metal as a main component.

[0052] The lid 2a is, for example, a plate-like member. The lid 2a defines a first insertion hole 21 that passes through the lid in a thickness direction. The first insertion hole 21 is defined at, for example, four corner portions of the lid 2a. The first insertion hole 21 is a hole into which the first screw 201 is inserted.

[0053] The base 3a corresponds to a support member. The base 3a is, for example, a box-like member having a recessed portion. The base 3a defines a first screw hole 31, a second screw hole 32, and a connector hole 33. The first screw hole 31 is a female screw like the second screw hole 32. The first screw hole 31 is defined at, for example, four corner portions of the base 3a. Further, the first screw hole 31 is defined in, for example, a flange of the base 3a. Further, when the lid 2a and the base 3a are disposed to face each other, the first screw hole 31 is defined at a position facing the first insertion hole 21.

[0054] The second screw hole 32 is defined in a disposed portion of the base 3a on which the circuit board 1 is disposed. For example, the second screw hole 32 is defined to face four corner portions of the circuit board 1. More specifically, when the circuit board 1 is disposed on the disposed portion, the second screw hole 32 is defined at a position facing the second insertion hole 41.

[0055] The connector hole 33 is a through hole defined in a bottom portion of the base 3a. The connector hole 33 has an opening shape corresponding to an external shape of the connector 53. In a state where the circuit board 1 is disposed on the disposed portion, the connector 53 is inserted into the connector hole 33. The connector hole 33 is not necessarily defined in the base 3a.

[0056] The first screw 201 has the same configuration as the second screw 202. As Figure 2As shown, the cylindrical portion of the first screw 201 is inserted into the first insertion hole 21 and a portion of the cylindrical portion is screwed into the first screw hole 31 defined in the base 3a. That is, the lid 2a is fixed to the base 3a by engaging the male screw of the first screw 201 with the female screw of the first screw hole 31. Further, in other words, the lid 2a and the base 3a are fixed to each other with the first screw 201.

[0057] <damper>

[0058] Next, the damper 6a will be described with reference to Figures 2 to 6

[0059] The damper 6a is a member for relieving stress (external force) to the circuit board 1. For example, the damper 6a absorbs an impact applied to the circuit board 1. The damper 6a protects the circuit board 1 from stress such as assembly strain, thermal shock, and vibration. That is, the damper 6a is provided for limiting a crack in solder, a wiring pattern 42, or the like, due to an impact applied to the circuit board 1, and for limiting a failure of an electronic component due to the impact.

[0060] As shown in Figure 2 , the damper 6a is disposed between the circuit board 1 and the screw head of the second screw 202, and the circuit board 1 is supported by the base 3a with the second screw 202. However, the position of the damper 6a is not limited thereto. The damper 6a can be disposed in at least one of the space between the circuit board 1 and the second screw 202 (screw head) and the space between the circuit board 1 and the base 3a. Thus, the damper 6a can be disposed only in the space between the circuit board 1 and the base 3a. Further, the damper 6a can be disposed in both the space between the circuit board 1 and the second screw 202 and the space between the circuit board 1 and the base 3a.

[0061] As described above, the damper 6a is arranged between the circuit board 1 and the screw head of the second screw 202. Thus, when the second screw 202 is screwed into the base 3a, the circuit board 1 itself is not fixed to the base 3a. That is, when the second screw 202 is screwed into the base 3a, the movement (displacement) of the circuit board 1 in the up-down direction is not completely restricted. The circuit board 1 is supported by the base 3a so that the circuit board 1 can move by an amount of elastic deformation of the damper 6a. The up-down direction is the same as the thickness direction.

[0062] As shown in Figure 3 , 4 , 5, and 6, the damper 6a includes an impact absorbing member 611, a protection member 612a, a first lid 62a, a second lid 63a, and a height adjustment member 64. The impact absorbing member 611 corresponds to a cushioning member. The impact absorbing member 611 and the protection member 612a constitute an absorbing structure 61. That is, the absorbing structure 61 includes the impact absorbing member 611 and the protection member 612a.​Figure 4 It is along Figure 3 The cross-sectional view of damper 6a taken from line IV-IV in the diagram.

[0063] like Figure 5 and 6 As shown, in this embodiment, a wire mesh is used as an example of the impact-absorbing member 611. The wire mesh is a woven metal wire that defines spaces within it. The wire mesh is not limited to a wire mesh in which the metal wires are regularly woven. The wire mesh can be formed by complexly weaving the metal wires so that the wires become entangled with each other. Furthermore, the wire mesh can be described as a continuous porous body in which the metal wires are entangled. In other words, the wire mesh is formed by compressing the entangled metal wires. The wire mesh can be described as a metal buffer member. For example, stainless steel can be used as the metal wire. However, the metal wire is not limited to stainless steel. The metal wire can be aluminum, iron, etc.

[0064] The shock-absorbing member 611 is configured to elastically deform in response to stress. The shock-absorbing member 611 can be any object, as long as it elastically deforms when an external force is applied to it, at least in the vertical direction, when it is positioned between the screw heads of the circuit board 1 and the second screw 202. In the damper 6a, the shock-absorbing member 611 primarily functions to relieve stress. The shock-absorbing member 611 can also be referred to as a stress-relieving member.

[0065] like Figure 4 As shown, the impact-absorbing member 611 has a facing portion S1 facing the circuit board 1, an opposing portion S2 opposite to the facing portion S1, and a side surface portion S3 disposed between the facing portion S1 and the opposing portion S2. The facing portion S1 is the surface of the impact-absorbing member 611 facing the circuit board 1. Therefore, the facing portion S1 is also referred to as the facing surface S1. Furthermore, the opposing portion S2 is also referred to as the opposing surface S2 of the impact-absorbing member 611 opposite to the facing surface S1. The side surface portion S3 is also referred to as the side surface S3 of the impact-absorbing member 611. The distance between the facing surface S1 and the opposing surface S2 is the same as the thickness of the impact-absorbing member 611.

[0066] The facing surface S1 and the opposite surface S2 are, for example, flat surfaces parallel to each other. When the damper 6a is disposed on the circuit board 1, the facing surface S1 and the opposite surface S2 are parallel to the insulating substrate 4a. However, this disclosure is not limited thereto. The facing surface S1 and the opposite surface S2 do not necessarily have to be flat. Furthermore, the facing surface S1 and the opposite surface S2 do not necessarily have to be parallel to the insulating substrate 4a.

[0067] The side surface S3 is a surface that connects both the facing surface S1 and the opposite surface S2. Furthermore, the side surface S3 extends along an imaginary plane intersecting both the facing surface S1 and the opposite surface S2. For example, the side surface S3 is perpendicular to both the facing surface S1 and the opposite surface S2. Moreover, the side surface S3 is circumferentially disposed on the outer periphery of the impact-absorbing member 611. Therefore, the side surface S3 is different from the surface defining the absorption member hole 613, which will be described later. The side surface S3 is also referred to as the outer peripheral surface of the impact-absorbing member 611. On the other hand, the surface defining the absorption member hole 613 is also referred to as the inner peripheral surface.

[0068] In this disclosure, a surface is considered a flat surface even if it has unevenness due to the wire or the protective member 612a (described later). It goes without saying that surfaces without unevenness caused by the wire or the protective member 612a (described later) are also included among flat surfaces.

[0069] like Figure 4 and 6 As shown, the impact-absorbing member 611 defines an impact-absorbing member hole 613. The impact-absorbing member hole 613 corresponds to a through hole. The impact-absorbing member hole 613 is a hole extending between the facing surface S1 and the opposite surface S2. Therefore, it can be said that the impact-absorbing member 611 has a tubular shape. A portion of the height adjusting member 64 and a portion of the second screw 202 are inserted into the impact-absorbing member hole 613.

[0070] The protective member 612a is configured to protect the shock-absorbing member 611 from deterioration of its function. That is, the protective member 612a restricts foreign matter from adhering to the shock-absorbing member 611 to suppress the deterioration of the function of the shock-absorbing member 611. In addition, the protective member 612a also restricts scrap metal and the like from falling out of the shock-absorbing member 611.

[0071] The protective member 612a is disposed on the side surface S3 of the impact absorbing member 611. Further, as... Figure 5 As shown, in this embodiment, the protective member 612a is not only arranged on the side surface S3 of the impact-absorbing member 611, but also within the space of the impact-absorbing member 611. Furthermore, the protective member 612a is configured to completely cover the side surface S3. The protective member 612a separates the impact-absorbing member 611 from its external environment. Moreover, it can be said that the protective member 612a at least covers the side surface S3 of the impact-absorbing member 611. The external environment of the impact-absorbing member 611 can be referred to as the vicinity of the impact-absorbing member 611 or the external environment of the impact-absorbing member 611.

[0072] The protective member 612a is made of an adhesive material. In other words, the protective member 612a is mainly composed of an organic substance with viscoelasticity. Alternatively, silicone resin or similar materials can be used as the protective member 612a. The viscosity of the protective member 612a is changed by UV curing or the like.

[0073] The protective member 612a is immersed in the shock-absorbing member 611, thereby arranging the protective member 612a on the side surface S3 and in the space within the shock-absorbing member 611. Then, the viscosity of the protective member 612a can be adjusted by irradiating the shock-absorbing member 611 with the protective member 612a arranged in the space using ultraviolet light. At this time, adjusting the viscosity causes the characteristics of the damper 6a to have a desired value. Furthermore, in other words, the compressibility of the absorbing structure 61 is adjusted to a desired value by adjusting the viscosity of the protective member 612a.

[0074] like Figure 4 As shown, the absorption structure 61 is partially covered by a first cover 62a and a second cover 63a. That is, the absorption structure 61 is held between the first cover 62a and the second cover 63a. Specifically, the first cover 62a and the second cover 63a are arranged to face each other across the absorption structure 61. Furthermore, due to the elastic deformation of the absorption structure 61, the first cover 62a and the second cover 63a move closer to or further away from each other.

[0075] The first cover 62a includes a first cover facing wall 621a and a first cover sidewall 622. The first cover 62a is an annular member that at least covers the opposite surface S2 of the impact-absorbing member 611. That is, the first cover 62a includes an annular first cover facing wall 621a and an annular first cover sidewall 622. For example, the first cover facing wall 621a and the first cover sidewall 622 are integrally formed. The first cover facing wall 621a corresponds to the first wall. The first cover sidewall 622 corresponds to the first sidewall.

[0076] The first cover facing the opposite surface 621a is a portion configured to face the opposite surface S2 of the impact-absorbing member 611. The first cover facing the opposite surface 621a is attached to the impact-absorbing member 611 to contact the opposite surface S2. The first cover facing the opposite surface 621a of the first cover 62a covers the opposite surface S2. Furthermore, it is preferable that the first cover facing the opposite surface 621a completely covers the opposite surface S2. In this embodiment, the first cover facing the opposite surface 621a is the portion that contacts the screw head of the second screw 202.

[0077] For example, the first cover sidewall 622 protrudes from the end of the first cover facing the sidewall 621a. The first cover sidewall 622 is a portion that faces at least a portion of the side surface S3 of the impact absorbing member 611. In this embodiment, as an example, the first cover sidewall 622 is a portion of the side surface S3 of the impact absorbing member 611 in the thickness direction of the impact absorbing member 611.

[0078] The second cover 63a includes a second cover facing wall 631a and a second cover side wall 632. The second cover 63a is a ring-shaped member that covers at least the facing surface S1 of the impact absorbing member 611. That is, the second cover 63a includes a ring-shaped second cover facing wall 631a and a ring-shaped second cover side wall 632. For example, the second cover facing wall 631a is formed integrally with the second cover side wall 632. The second cover facing wall 631a corresponds to the second wall. The second cover side wall 632 corresponds to the second side wall.

[0079] The second cover facing wall 631a is a portion provided to face the facing surface S1 of the impact absorbing member 611. Therefore, the facing surface S1 of the impact absorbing member 611 faces the circuit board 1 across the second cover facing wall 631a. The second cover facing wall 631a is attached to the impact absorbing member 611 to be in contact with the facing surface S1. The second cover facing wall 631a of the second cover 63a covers the facing surface S1. Further, it is preferable that the second cover facing wall 631a completely covers the facing surface S1. The second cover facing wall 631a of the present embodiment is a portion in contact with the circuit board 1.

[0080] For example, the second cover side wall 632 protrudes from an end portion of the second cover facing wall 631a. The second cover side wall 632 is a portion provided to face at least a portion of the side surface S3 of the impact absorbing member 611. In the present embodiment, as an example, the second cover side wall 632 is provided to face a portion of the side surface S3 of the impact absorbing member 611 in the thickness direction of the impact absorbing member 611.

[0081] As shown in FIG. 6, the first cover 62a and the second cover 63a are connected by a height adjustment member 64 described later. The first cover 62a and the second cover 63a are not connected to each other other than the height adjustment member 64. Figure 4 As shown in FIG. 6, a certain distance is present between the first cover side wall 622 and the second cover side wall 632 so that the damper 6a can be elastically deformed in the thickness direction of the impact absorbing member 611. That is, a gap is present between the first cover side wall 622 and the second cover side wall 632 when the first cover 62a and the second cover 63a are attached to the absorbing structure 61. The first cover 62a and the second cover 63a are connected by the height adjustment member 64 described later. The first cover 62a and the second cover 63a are not connected to each other other than the height adjustment member 64.

[0082] Only one of the first cover side wall 622 and the second cover side wall 632 can be provided in the damper 6a. This can be appropriately applied to other embodiments and modified examples.

[0083] The height adjustment member 64 corresponds to an adjustment member. The height adjustment member 64 is, for example, a tubular member. The height adjustment member 64 defines a lid opening portion 65. The height adjustment member 64 is disposed between the first lid 62a and the base 3a. More specifically, the height adjustment member 64 is in contact with the opening end of the first lid facing wall 621a and the base 3a. The opening end is an end portion at which the first lid side wall 622 is not provided. In this embodiment, the base 3a is adopted as an example of a height reference portion.

[0084] The height adjustment member 64 is a member that adjusts the distance between the first lid 62a and the base 3a. In other words, the height adjustment member 64 is provided to set the compressibility of the damper 6a to a desired value. That is, since the damper 6a includes the height adjustment member 64, it is possible to limit the damper 6a from being compressed more than necessary by the second screw 202 and to limit the function of losing the relaxation stress to the circuit board 1.

[0085] As described above, the damper 6a includes the height adjustment member 64. Therefore, in the damper 6a, the second lid 63a moves in the up-down direction as the displacement of the circuit board 1 caused by the deformation or stress of the circuit board 1. That is, the first lid 62a and the second lid 63a move closer to or away from each other.

[0086] However, in the present disclosure, the height adjustment member 64 can not be provided. In this case, the compressibility of the damper 6a can be adjusted by the thickness of the impact absorbing member 611 (absorbing structure 61) and the viscosity of the protection member 612a. The height adjustment member 64 can define a slit in the up-down direction.

[0087] In the present embodiment, the first lid 62a, the second lid 63a, and the height adjustment member 64 are mainly composed of metal. Therefore, the first lid 62a, the second lid 63a, and the height adjustment member 64 have electrical conductivity. That is, the first lid 62a and the second lid 63a are electrically connected to each other by the height adjustment member 64. However, the present disclosure is not limited thereto and can be mainly composed of resin or the like.

[0088] The damper 6a can be disposed so that the second lid facing wall 631a faces a ground wiring that is a part of the wiring. In this case, the circuit board 1 is screwed into the base 3a with the second screw 202 and the damper 6a can be electrically connected to the circuit board 1 and the base 3a. Therefore, the electronic controller 100 can electrically connect the ground wiring of the circuit board 1 and the base 3a through the damper 6a. That is, the damper 6a functions as an electrical connection member in addition to a stress reliever.

[0089] <Effects>

[0090] As described above, in the damper 6a, the protection member 612a is provided at the side surface S3 of the impact absorbing member 611. Therefore, the damper 6a can prevent foreign matter from adhering to the impact absorbing member 611. Therefore, deterioration of the damper 6a can be suppressed.

[0091] Further, in the damper 6a, the protection member 612a is also provided in the space in the impact absorbing member 611. Therefore, the damper 6a can restrict foreign matter from entering the space in the impact absorbing member 611 and from coming out of the damper 6a through the space in the impact absorbing member 611. Therefore, the damper 6a can restrict foreign matter from falling onto the circuit board 1. The foreign matter adhering to or entering the damper 6a is a substance containing water, salt, oil, or the like. Further, the foreign matter coming out of the space in the impact absorbing member 611 is a scrap metal or the like.

[0092] Further, since the damper 6a can restrict foreign matter from falling from the damper 6a, it is possible to restrict a failure of the circuit board 1 caused by the falling foreign matter. Therefore, the damper 6a can suppress adverse effects on the electrical characteristics of the circuit board 1.

[0093] The electronic controller 100 includes the damper 6a. The damper 6a has the above-described effects. Therefore, the electronic controller 100 can reliably relax stress on the circuit board 1. Therefore, the electronic controller 100 can restrict stress from being applied to the electronic components or to a connecting portion between the electronic components and the insulating substrate. Further, the electronic controller 100 can suppress adverse effects on the electrical characteristics of the circuit board 1.

[0094] More specifically, the circuit board 1 is supported by the base 3a with the second screw 202. However, the circuit board 1 is supported by the base 3a with the damper 6a. Therefore, when the circuit board 1 itself is deformed or an external force is applied to the circuit board 1, the damper 6a elastically deforms and the circuit board 1 itself is displaced. Therefore, in the circuit board 1, it is possible to restrict breakage of solder, a wiring pattern 42, or the like or to restrict a failure of the electronic components.

[0095] Further, in the electronic controller 100, it is possible to reduce effects caused by assembly deformation by adjusting the mounting position of the electronic components. That is, in the electronic controller 100, the electronic components are mounted at positions away from the screwing position so as not to be affected by assembly deformation. In this case, in the electronic controller 100, the distance between the screwing position and the electronic components can be a factor that hinders high-density mounting. However, in the present embodiment, the damper 6a mitigates the effects of assembly deformation. Therefore, in the electronic controller 100, it is possible to mount the electronic components at high density.

[0096] In the present embodiment, a wire mesh is adopted as an example of the impact absorbing member 611. Therefore, compared to a case where rubber is used as the impact absorbing member 611, it is possible to limit the deterioration of the damper 6a over time. However, the present disclosure is not limited to this. The impact absorbing member 611 can be made of rubber or a spring.

[0097] When the impact absorbing member 611 is made of rubber, the protection member 612a can be the protection member 612b that will be described later. When the impact absorbing member 611 is a spring, the protection member 612a can be provided by coating the surface of the spring as the impact absorbing member 611.

[0098] In the present embodiment, the second screw 202 is adopted as an example of the support member. However, in the present disclosure, a member that uses elastic deformation such as snap fit can be adopted as the support member. Furthermore, in the present embodiment, the circuit board 1 is adopted as an example of the supported member. However, in the present disclosure, the base 3a can be the supported member. In this case, the support member can be a vehicle frame or the like. Furthermore, in the present disclosure, the cover 2a can be the supported member. In this case, the base 3a can be the support member. The first screw 201 can be adopted as the support member.

[0099] The circuit board 1 can be supported by the base 3a with the first screw 201 instead of the second screw 202. In this case, the first screw 201 corresponds to the support member. Next, referring to Figures 7 to 13 The first to seventh modified examples of the first embodiment will be described.

[0100] (First Modified Example)

[0101] As shown in the first modified example in Figure 7 The damper 6a can be provided to pinch the circuit board 1 as shown in the first modified example in the first embodiment. In the electronic controller 100 of this modified example, the damper 6a is not only arranged in the space between the circuit board 1 and the second screw 202, but also provided in the space between the circuit board 1 and the base 3a. That is, in the electronic controller 100, two dampers 6a are provided for a single second screw 202.

[0102] In this case, the two dampers 6a are connected by the height adjustment member 64 as the connection portion 66. The height adjustment member 64 is provided between the first cover 62a of one of the dampers 6a and the first cover 62a of the other of the dampers 6a. More specifically, the height adjustment member 64 is in contact with the open end of the first cover facing wall 621a of both dampers 6a. In this modified example, the first cover facing wall 621a is used as an example of a height reference portion. When stress is applied to the circuit board 1, the circuit board 1 can be displaced in the up-down direction between the two dampers 6a. The first modified example makes it possible to exhibit an effect similar to that of the first embodiment.

[0103] (Second Modification Example)

[0104] As shown in the second modification example in FIG. 6, the damper 6a can be mounted on the circuit board 1 with solder 54. The damper 6a is mounted on the mounting pattern 43 with the solder 54. In the damper 6a, the second cover 63a and the mounting pattern 43 are connected by the solder 54. As a result, the damper 6a is surface-mounted on the circuit board 1. Figure 8

[0105] The mounting pattern 43 has electrical conductivity. The mounting pattern 43 is provided on the surface of the insulating base 4a of the circuit board 1. The mounting pattern 43 can be a part of the wiring pattern 42, or can be separate from the wiring pattern 42. The solder 54 corresponds to the connecting member.

[0106] The structure in which the damper 6a is surface-mounted on the circuit board 1 with the solder 54 corresponds to an assembly. That is, in other words, the assembly includes the circuit board 1, the damper 6a, and the solder 54.

[0107] The second modification example makes it possible to exhibit an effect similar to that of the first embodiment. Since the assembly includes the damper 6a, it is possible to reliably relax stress on the circuit board 1. Since the damper 6a is surface-mounted on the circuit board 1 in the assembly, it is possible to restrict displacement of the damper 6a. That is, even if the damper 6a is not fixed with a screw, the damper 6a is restricted from moving along the mounting surface of the circuit board 1. Therefore, by assembly, the damper 6a can be disposed at an appropriate position on the mounting surface of the circuit board 1.

[0108] (Third Modification Example)

[0109] As shown in FIG. 7, the damper 6b of the third modification example does not define the absorbing member hole 613 and the cover opening portion 65. The damper 6b differs from the damper 6a at these points. The damper 6b includes the absorbing structure 61, the first cover 62b having the flat plate-shaped first cover facing wall 621b, and the second cover 63b having the flat plate-shaped second cover facing wall 631b. Figure 9 The damper 6b is supported by the cover 2b, rather than by the second screw 202. That is, the damper 6b is pressed and supported on the circuit board 1 by the cover 2b. The cover 2b corresponds to the supporting element.

[0110] Therefore, the base 3b does not define the second screw hole 32. Similarly, the insulating base 4b does not define the second insertion hole 41. The base 3b and the insulating base 4b differ from the base 3a and the insulating base 4a at these points.

[0111]

[0112] ​​The third modification achieves effects similar to those of the first embodiment. Furthermore, compared to damper 6a, the size of damper 6b can reduce the area used for the absorption member hole 613 and the cover opening 65. In the electronic controller 100, because the size of damper 6b can be reduced, electronic components can be mounted at a higher density. Damper 6b does not require solder 54 for mounting.

[0113] (Fourth Amendment Example)

[0114] like Figure 10 As shown, the difference in the damper 6c of the fourth modification is that the damper 6c does not include the height adjustment member 64. The fourth modification can achieve effects similar to those of the first embodiment.

[0115] (Fifth Amendment)

[0116] like Figure 11 As shown, in the fifth modification, the damper 6a is integrally formed with the second screw 202. The fifth modification can achieve effects similar to those of the first embodiment.

[0117] (Sixth Amendment)

[0118] like Figure 12 As shown, the damper 6a in the sixth modification differs from the damper in the first embodiment in the construction of the height adjustment member 64a. In this modification, for convenience, the reference numerals for the damper are the same as those in the above embodiments.

[0119] The height adjustment member 64a corresponds to the adjustment member. The height adjustment member 64a is, for example, a tubular member. The height adjustment member 64a defines a cover opening 65. The height adjustment member 64a is disposed between the first cover 62a and the second cover 63a. In this embodiment, the second cover 63a is used as an example of the height reference portion. Similar to the height adjustment member 64, the height adjustment member 64a may define a slit in the vertical direction.

[0120] More specifically, the height adjustment member 64a is disposed between the open end of the first cover facing the wall 621a and the open end of the second cover facing the wall 631a. Furthermore, the height adjustment member 64a is shorter than the distance between the first cover facing the wall 621a and the second cover facing the wall 631a. Therefore, the height adjustment member 64a contacts only one of the first cover facing the wall 621a and the second cover facing the wall 631a. Additionally, when the damper 6a is fixed by the second screw 202 and the circuit board 1 is not displaced in the vertical direction, the height adjustment member 64a is configured to contact only one of the first cover facing the wall 621a and the second cover facing the wall 631a. In this modified example, as an example, the height adjustment member 64a contacts only the second cover facing the wall 631a and defines a space between the first cover facing the wall 621a and the height adjustment member 64a. The distance between the first cover facing the wall 621a and the height adjustment member 64a is the movable distance of the damper 6a when the first cover 62a and the second cover 63a move relative to each other.

[0121] The height adjustment member 64a has the same function as the height adjustment member 64. Furthermore, when the circuit board 1 shifts in the vertical direction, the height adjustment member 64a can limit the distance between the first cover 62a and the second cover 63a. That is, in the damper 6a, the height adjustment member 64a limits the distance at which the first cover 62a is closest to the second cover 63a as the circuit board 1 shifts. The sixth modification can achieve effects similar to those of the first embodiment.

[0122] (Seventh Amendment)

[0123] like Figure 13 As shown, the damper 6b in the seventh modification differs from that in the sixth modification in the construction of the height adjustment member. Specifically, the height adjustment member 64b differs from the height adjustment member 64a in that the height adjustment member 64b is integrally formed with the first cover 62a and the second cover 63b.

[0124] A height adjustment member 64b is located at each of the open ends of the first cover facing the wall 621a and the second cover facing the wall 631a. The first cover 62a includes a height adjustment member 64b protruding from its open end towards the second cover facing the wall 631a. The second cover 63a includes a height adjustment member 64b protruding from its open end towards the first cover facing the wall 621a. The two height adjustment members 64b are arranged at a certain interval. The distance between the height adjustment members 64b of the first cover 62a and the second cover 63a is less than the distance between the side walls 622 and 632 of the first cover. The height adjustment member 64b has the same function as the height adjustment member 64a. The seventh modification can achieve effects similar to those of the sixth embodiment.

[0125] The preferred embodiments of the present disclosure have been described above. However, the present disclosure is not in any way limited to the above-described embodiments, and various modified examples can be made without departing from the spirit of the present disclosure. Hereinafter, a second to fifth embodiment and modified examples thereof will be described as other embodiments of the present disclosure. The above-described embodiments, the second to fifth embodiments, and the modified examples can be appropriately executed independently or in combination. The present disclosure is not limited to the combination shown in the embodiments, but can be implemented by various combinations. In the drawings related to the following embodiments, some reference numerals can be omitted from the drawings for the sake of simplification of the drawings.

[0126] (Second Embodiment)

[0127] Reference Figure 14 A damper 6d of the second embodiment will be described. The damper 6d differs from the dampers of the first embodiment and the first to seventh modified examples in the configuration of the protection member.

[0128] The damper 6d includes the impact absorbing member 611 and a protection member 612b. The protection member 612b is positioned to cover the entire circumference of the impact absorbing member 611. In addition, the protection member 612b is located on only a part of the side surface S3 of the impact absorbing member 611 in the thickness direction of the impact absorbing member 611. The protection member 612b is arranged to face the gap between the first cover side wall 622 and the second cover side wall 632. Unlike the protection member 612a, the protection member 612b is not provided in the space in the impact absorbing member 611.

[0129] The protection member 612b is provided in contact with the side surface S3 of the impact absorbing member 611. The protection member 612b can be made of a viscous material. The protection member 612b is, for example, a gel or a rubber. The protection member 612b can be an annular member. The protection member 612b is attached to the impact absorbing member 611 with a shrinkage force or the like of the protection member 612b. The protection member 612b can be attached to the impact absorbing member 611 with an adhesive or the like. In addition, the protection member 612b can be attached to the impact absorbing member 611 by coating or the like.

[0130] The present disclosure is not limited thereto, and the protection member 612b can be composed of a plurality of members. In addition, the protection member 612b is not limited thereto, and can be any object as long as the elastic deformation of the impact absorbing member 611 is not impaired.

[0131] The damper 6b can exhibit an effect similar to that of the damper 6a. The protection member 612b of the damper 6d can be more easily attached to the impact absorbing member 611 than the protection member of the damper 6a. In addition, the electronic controller including the damper 6d can exhibit an effect similar to that of the electronic controller 100.

[0132] The damper 6d can also be implemented in combination with each of the first to seventh modified examples. The damper 6d can be provided on both sides of the circuit board 1 as in the first modified example. The damper 6d can be surface-mounted as in the second modified example. The damper 6d can not define the absorbing member hole 613 and the cover opening portion 65 as in the third modified example. The damper 6d can not include the height adjustment member 64 as in the fourth modified example. The damper 6d can be formed integrally with the second screw 202 as in the fifth modified example. The damper 6d can include the height adjustment members 64a and 64b similar to those in the sixth and seventh modified examples.

[0133] Similar to the damper 6a, the damper 6d can include the protection members 612a located in the space in the impact absorbing member 611. That is, the damper 6d can include the protection members 612a and 612b. As a result, the damper 6d can further suppress adhesion of foreign matter to the impact absorbing member 611 and falling from the impact absorbing member 611 compared to the damper 6a and the like. This configuration can also be employed in other embodiments and modified examples.

[0134] Here, reference will be made to Figure 15 and 16 An eighth modified example and a ninth modified example modified from the second embodiment will be described.

[0135] (Eighth Modified Example)

[0136] As shown in Figure 15 , the damper 6e differs from the damper 6d in the position of the protection member. The damper 6e includes the impact absorbing member 611 and the protection member 612c. The protection member 612c is provided to completely cover the circumference of the impact absorbing member 611. In addition, the protection member 612c is provided to completely cover the side surface S3 of the impact absorbing member 611 in the thickness direction of the impact absorbing member. That is, the protection member 612c completely covers the side surface S3 of the impact absorbing member 611.

[0137] The damper 6e can exhibit effects similar to those of the damper 6d. In addition, the electronic controller including the damper 6e can exhibit effects similar to those of the electronic controller 100. Furthermore, the eighth modified example can be implemented in combination with each of the first to seventh modified examples as in the second embodiment.

[0138] (Ninth Modified Example)

[0139] As shown in Figure 16As shown, damper 6f differs from damper 6e in the configuration of the first cover and the second cover. Damper 6f includes a first cover 62c and a second cover 63c. First cover 62c includes a first cover facing wall 621a. First cover 62c differs from first cover 62a in that first cover 62c does not include a first cover side wall 622. Second cover 63c includes a second cover facing wall 631a. Second cover 63c differs from second cover 63a in that second cover 63c does not include a second cover side wall 632.

[0140] Damper 6f can exhibit effects similar to those of damper 6e. Furthermore, an electronic controller including damper 6f can exhibit effects similar to those of electronic controller 100. Moreover, the ninth modification example can be implemented in combination with the second embodiment and each of the first to seventh modification examples.

[0141] (Third Embodiment)

[0142] Referring to Figure 17 and 18 Damper 6g of the third embodiment will be described. Damper 6g differs from the above-described embodiments and modification examples in the configuration of the protection member.

[0143] Protection member 612d of damper 6g is disposed annularly. Protection member 612d has viscoelasticity. Protection member 612d is composed of one or a plurality of members. In the present embodiment, as an example, an O-ring is used as protection member 612d. Protection member 612d is arranged in the gap between first cover side wall 622 and second cover side wall 632. In other words, protection member 612d is wrapped around first cover 62a and second cover 63a.

[0144] Protection member 612d is not limited thereto, and can be any object as long as the elastic deformation of impact absorbing member 611 is not impaired. Protection member 612d can be configured as a plurality of members disposed annularly.

[0145] Damper 6g can exhibit effects similar to those of damper 6a. Furthermore, an electronic controller including damper 6g can exhibit effects similar to those of electronic controller 100.

[0146] (Fourth Embodiment)

[0147] Referring to Figure 19 Damper 6h of the fourth embodiment will be described. Damper 6h differs from the second embodiment in that damper 6h does not include first cover 62a and second cover 63a.

[0148] The damper 6h includes the shock absorbing member 611 and the protection member 612c. The damper 6h is identical in configuration to the damper 6e of the eighth modification example with the first cover 62a and the second cover 63a removed.

[0149] However, when the damper 6h is fixed with the second screw 202, the facing surface S1 of the damper 6h is covered by the circuit board 1 and the opposite surface S2 of the damper 6h is covered by the screw head of the second screw 202. Thus, the second screw 202 has a function as the first cover 62a. On the other hand, the circuit board 1 has a function as the second cover 63a.

[0150] In this embodiment, the second screw 202 is located within the facing region of the damper 6h. The facing region is a region overlapping the shock absorbing member 611 in the thickness direction. That is, the outer diameter of the second screw 202 is located inside the damper 6h.

[0151] When supported by the circuit board 1 with the second screw 202, the damper 6h can exhibit an effect similar to that of the damper 6d. The electronic controller including the damper 6g can exhibit an effect similar to that of the electronic controller 100.

[0152] In this embodiment, an example including the height adjustment member 64 is adopted. However, in the present disclosure, the height adjustment member 64 can be omitted.

[0153] Here, with reference to Figure 20 and 21 a tenth modification example and an eleventh modification example modified from the fourth embodiment will be described.

[0154] (Tenth Modification Example)

[0155] As shown in Figure 20 , the damper 6i of the tenth modification example differs from the damper 6h in the size of the second screw 202. The outer diameter of the second screw 202 is located outside the damper 6i. The damper 6i is located within the facing region of the screw head of the second screw 202. The facing region is a region overlapping the screw head in the thickness direction of the shock absorbing member 611.

[0156] The damper 6i can exhibit an effect similar to that of the damper 6h. Further, the electronic controller including the damper 6i can exhibit an effect similar to that of the electronic controller 100.

[0157] (Eleventh Modification Example)

[0158] As shown in Figure 21As shown, the damper 6i of the eleventh modification differs from the tenth modification in that the damper 6i is supported by the cover 2c instead of the second screw 202. The cover 2c differs from the cover 2b in that the cover 2c includes the protrusion 22. That is, the electronic controller 100 of the eleventh modification differs from the electronic controller 100 of the third modification in that the cover 2c is included. Thus, the cover 2c corresponds to the support element.

[0159] The cover 2c includes the protrusion 22. The cover 2c supports the damper 6i with the protrusion 22 inserted into the cover opening 65. As a result, in the electronic controller 100 of the eleventh modification, displacement of the damper 6i can be restricted.

[0160] The electronic controller of the eleventh modification can exhibit effects similar to those of the electronic controller 100. The electronic controller of the eleventh modification can exhibit effects similar to those of the electronic controller of the third modification. The insulating substrate 4b can define a through-hole that inserts only the height adjustment member 64, or can define the second insertion hole 41.

[0161] (Fifth Embodiment)

[0162] Reference Figure 22 The damper 6j of the fifth embodiment will be described. The damper 6j differs from the first embodiment and the first to seventh modifications in that the damper 6j does not include the protection member 612a and includes the covers 62d and 63d having a different configuration from those of the above-described embodiments and modifications.

[0163] Like the first cover 62a, the first cover 62d includes the first cover facing wall 621a and the first cover side wall 622. Like the second cover 63a, the second cover 63d includes the second cover facing wall 631a and the second cover side wall 632.

[0164] The first cover 62d and the second cover 63d are disposed such that the first cover side wall 622 and the second cover side wall 632 face each other. The second cover side wall 632 is disposed in the facing region of the side surface S3 of the impact absorbing member 611 and the first cover side wall 622. Further, the first cover side wall 622 and the second cover side wall 632 are disposed to face each other in a direction perpendicular to the thickness direction of the impact absorbing member 611. In other words, the first cover side wall 622 of the first cover 62d and the second cover side wall 632 of the second cover 63d form a labyrinth structure.

[0165] As a result, the damper 6j defines an opening between the first cover side wall 622 and the second cover side wall 632. The opening is open on the second cover 63d side and extends toward the first cover 62d. Further, in other words, there is a gap between the first cover side wall 622 and the second cover side wall 632, and the gap extends in the thickness direction of the impact absorbing member 611.

[0166] Therefore, when the damper 6j is disposed on the circuit board 1, the damper 6j defines an opening portion facing the circuit board 1. In other words, when the damper 6j is disposed on the circuit board 1, the damper 6j defines the opening in the direction of gravity.

[0167] Further, the first lid side wall 622 is disposed outside the second lid side wall 632. That is, the second lid side wall 632 is disposed closer to the impact absorbing member 611 than the first lid side wall 622 with respect to the impact absorbing member. That is, the second lid side wall 632 is positioned between the first lid side wall 622 and the impact absorbing member 611.

[0168] The damper 6j can exhibit an effect similar to that of the damper 6a. The electronic controller including the damper 6j can exhibit an effect similar to that of the electronic controller 100.

[0169] Further, the damper 6j defines an opening portion at a position facing the circuit board 1. Therefore, accumulation of foreign matter coming out from the space in the impact absorbing member 611 inside the lids 62d and 63d is restricted.

[0170] However, the present disclosure is not limited thereto. The second lid side wall 632 can be disposed outside the first lid side wall 622. In this case, when the damper 6j is disposed on the circuit board 1, the region of the damper 6j facing the circuit board 1 is closed. That is, when the damper 6j is disposed on the circuit board 1, the opening portion is disposed at a position not facing the circuit board 1.

[0171] This also allows the damper 6j to have an effect similar to that of the damper 6a. Then, the electronic controller including the damper 6j can exhibit an effect similar to that of the electronic controller 100. Further, since the damper 6j does not define an opening portion at a position facing the circuit board 1, it is possible to restrict foreign matter coming out from the space of the impact absorbing member 611 from falling on the circuit board 1. Therefore, the damper 6j can suppress malfunction of the circuit board 1. In particular, preferably, the damper 6j is disposed on the circuit board 1 so that the opening portion opens in a direction opposite to the direction of gravity.

[0172] Although the present disclosure has been described in accordance with the embodiments, it should be understood that the present disclosure is not limited to such embodiments or constructions. Various modifications and changes can be made thereto without departing from the spirit and scope of the present disclosure. In addition, while the various elements of the disclosed embodiments are shown in various combinations and configurations, which are exemplary, other combinations and configurations, including more, less or only a single element, are also within the spirit and scope of the disclosure.

Claims

1. A damper disposed in at least one of a space between a supported member (1, 2a) and a support element (2b, 2c, 201, 202) or a space between the supported member and the support element (3a, 3b), the damper comprising: A buffer member (611) is configured to relax the stress applied to the supported member which is supported by the support member and the support element together. The buffer member includes a facing portion (S1) facing the supported member, an opposite portion (S2) opposite to the facing portion, and a side surface portion (S3) located between the facing portion and the opposite portion. as well as Protective members (612a, 612b, 612c, 612d) are arranged on the side surface portion to cover the buffer member from the outside, wherein... The buffer member is formed by braiding metal wires, thereby defining multiple spaces within the buffer member, and The protective member (612a) is arranged in the plurality of spaces in the buffer member.

2. The damper according to claim 1, wherein The protective member is arranged to completely cover the side surface portion.

3. The damper according to claim 1, wherein The protective component is made of an adhesive material.

4. The damper according to claim 1 or 2, wherein The protective member has a ring shape made of a viscoelastic material.

5. The damper according to any one of claims 1 to 3, wherein The buffer member defines a through hole (613), into which a portion of the support element is inserted.

6. The damper according to any one of claims 1 to 3, further comprising: The first cover (62a, 62b, 62c) contacts the opposite portion of the buffer member; The second cover (63a, 63b, 63c) contacts the face portion of the buffer member; as well as Adjustment members (64, 64a, 64b) are arranged between the first cover and the height reference portion and are configured to adjust the distance between the first cover and the height reference portion.

7. The damper according to any one of claims 1 to 3, further comprising: The first cover (62d) includes: The first wall (621a) contacts the opposite portion of the buffer member; and A first sidewall (622) protrudes from the first wall to face the side surface portion; and The second cover (63d) includes; The second wall (631a) contacts the facing portion of the buffer member; and A second sidewall (632) protrudes from the second wall to face the side surface portion and the first sidewall.

8. The damper according to claim 7, wherein The first sidewall is farther away from the side surface portion than the second sidewall is from the side surface portion.

9. A component comprising: The damper and the supported member according to any one of claims 6 to 8; as well as Conductive connector (54) that connects the damper to the supported member, wherein The second cover of the damper is conductive. Conductive mounting pattern (43) is mounted on the surface of the supported member, and The conductive connector connects the second cover of the damper to the conductive mounting pattern of the supported member, such that the damper is mounted on the surface of the supported member.

10. An electronic controller, comprising: The damper, the supported member, the supporting member, and the supporting element according to any one of claims 1 to 8, wherein The supported component is a circuit board in which electronic components (51, 52, 53) and conductive wiring (42) are disposed on an insulating substrate (4a, 4b) having electrical insulating properties. The damper is disposed in at least one of the space between the circuit board and the support element or the space between the circuit board and the support member, and The circuit board is supported by the support member.

Citation Information

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