A colorful LED lamp bead

Abstract

The present invention provides a multi-color LED lamp bead, which includes a lamp bead bracket, a lamp slot, pins, an LED chip and a solder paste hopper. The lamp slot, the pins, the LED chip and the solder paste hopper are all arranged on the lamp bead bracket. The LED chip is arranged in the lamp slot and is connected to the pins. The solder paste hopper is provided with a paste outlet and a pressing block. The position of the paste outlet corresponds to the pins. The pressing block is arranged at the top of the solder paste hopper, and the solder paste hopper is arranged at the bottom of the lamp bead bracket. The pins are arranged at the bottom of the lamp bead bracket. It can highly control the LED lamp bead, and the user can turn on the corresponding LED lamp bead according to the required lighting effect. The present invention also provides a method for tinning a multi-color LED lamp bead, which is applicable to manufacturing a multi-color LED lamp bead.

Description

Technical Field

[0001] The invention relates to the field of LED lamp beads, and in particular to a multi-colored LED lamp bead. Background Art

[0002] With the development of technology and the popularization of lamps, people's demand for lighting is no longer limited to emitting light. They also need brighter lights. Therefore, LED lamp beads that can emit various colors and have low energy consumption have become the first choice for lighting when holding events.

[0003] When installing LED lamp beads on a circuit board, you need to first lay a layer of patch on the circuit board. The holes on the patch correspond to the copper points on the circuit board. Then brush a layer of solder paste on the patch. The solder paste penetrates through the holes on the patch to the copper points. The large amount of solder paste left on the patch cannot be reused, resulting in a huge waste of solder paste. Summary of the invention

[0004] In order to overcome the technical problem of wasting solder paste during the current LED lamp bead installation process, the present invention provides a multi-colored LED lamp bead.

[0005] A colorful LED lamp bead comprises a lamp bead bracket, a lamp trough, a pin, an LED chip and a solder paste bucket, wherein the lamp trough, the pin, the LED chip and the solder paste bucket are all arranged on the lamp bead bracket; the LED chip is arranged in the lamp trough, and the LED chip is connected to the pin; the solder paste bucket is provided with a paste outlet and an extrusion block, the position of the paste outlet corresponds to the pin, the extrusion block is arranged at the top of the solder paste bucket, and the solder paste bucket is arranged at the bottom of the lamp bead bracket; the pin is arranged at the bottom of the lamp bead bracket.

[0006] Preferably, the pins are provided with eight in total, two of the pins are connected to the LED chips in the small lamp slot, and four of the pins are connected to the LED chips in the large lamp slot.

[0007] Preferably, the lamp trough includes a small lamp trough and a large lamp trough, the small lamp troughs have two, the large lamp troughs have one, and the small lamp troughs are arranged on both sides of the large lamp trough;

[0008] Three LED chips are arranged in the headlight slot, and the inner corners of the LED chips in the headlight slot are respectively connected to one pin, and the outer corners are connected to one pin;

[0009] An LED chip is arranged in the small lamp trough, and a pin is connected to a female corner of the LED chip in the small lamp trough, and a pin is connected to a male corner.

[0010] Preferably, the LED chips include red LED chips, green LED chips, and blue LED chips;

[0011] The red LED chip, the green LED chip, and the blue LED chip are disposed in the headlight groove;

[0012] The red LED chip, the green LED chip, or the blue LED chip is disposed in the small light groove.

[0013] Preferably, it includes a thin film, the paste outlet is provided with the thin film, and an insulating layer is provided between the pins.

[0014] Preferably, there is an accommodating space between the solder paste hopper and the lamp bead holder, and the extrusion block is disposed close to the accommodating space.

[0015] Preferably, the specific steps are as follows:

[0016] Step S1: The solder paste hopper discharges solder paste, and the solder paste is applied to the pins to obtain the pins with solder paste;

[0017] Step S2: The circuit board is close to the pins, and the pins are connected to the copper plating on the circuit board to obtain an LED lamp bead with solder paste;

[0018] Step S3: Remove the solder paste hopper from the lamp bead holder.

[0019] Preferably, by pressing the lamp bead holder, the lamp bead holder presses the extrusion block to extrude the solder paste from the paste outlet.

[0020] Preferably, step S1 specifically includes the following steps:

[0021] Step S11: An external force acts on the outside of the extrusion block to extrude the solder paste in the solder paste hopper towards the paste outlet;

[0022] Step S12: The paste outlet discharges solder paste towards the corresponding pins, and the solder paste is applied to the pins.

[0023] Preferably, after step S3, the following steps are further included:

[0024] Step S4: Heat the LED lamp bead with solder paste to cure the solder paste.

[0025] Compared with the prior art, a colorful LED lamp bead provided by the present invention has the following advantages:

[0026] 1. A colorful LED lamp bead is provided with two small lamp slots and one large lamp slot. One LED chip is arranged in the small lamp slot, and three LED chips are arranged in the large lamp slot. The three LED chips are a red LED chip, a green LED chip, and a blue LED chip respectively. The three primary colors of red, green, and blue (RGB) can be mixed in pairs to form various colors of light. The four pins of the three LED chips in the large lamp slot are connected. The cathode pins of the three LEDs are each connected to one pin, and the anode pins are commonly connected to one pin. The cathode and anode pins of the LED chip in the small lamp slot are each connected to one. Further, the LED lamp bead can be highly controlled. Users can turn on the corresponding LED lamp beads according to the required lighting effects.

[0027] 2. The solder paste outlet of the solder paste dispenser corresponds to the eight pins one by one. When the solder paste overflows from the outlet, it is directly connected to the corresponding pins. There is an insulating layer between the pins to prevent the pins from being interconnected during the soldering process. The solder paste dispenser is arranged at the bottom of the lamp bead bracket, and the extrusion block is arranged between the solder paste dispenser and the lamp bead bracket. Gently press the lamp bead bracket, and the lamp bead bracket touches the extrusion block to extrude the solder paste. The solder paste is applied to the pins, and then the pins with the applied solder paste are installed on the circuit board for soldering. The solder paste dispenser is made of a soft material to facilitate the extrusion of the solder paste. A thin film is provided at the outlet to prevent the solder paste from being extruded due to slight disturbance.

[0028] 3. A method for tinning a colorful LED lamp bead. By gently squeezing the lamp bead bracket, the extrusion block is squeezed, and the solder paste is extruded from the outlet. The position of the outlet corresponds to the pins, and the corresponding pins are coated with the solder paste. Then the solder paste dispenser is removed, and the pins with the solder paste are installed on the circuit board. The traditional soldering method is to stick the patch on the circuit board, then apply the solder paste on the patch, and the solder paste penetrates through the holes of the patch to be applied on the copper points on the circuit board. Then the patch is torn off, and the solder paste left on the patch will be wasted. Installing the solder paste dispenser avoids the waste of solder paste and simplifies the process of applying the solder paste on the pins. Description of the Drawings

[0029] Figure 1 is the first visual structure schematic diagram of a colorful LED lamp bead provided by the first embodiment of the present invention;

[0030] Figure 2 is the second perspective structure schematic diagram of a colorful LED lamp bead provided by the first embodiment of the present invention;

[0031] Figure 3 is the detail diagram of the solder paste dispenser of a colorful LED lamp bead provided by the first embodiment of the present invention;

[0032] Figure 4 is the LED chip circuit connection module diagram of a colorful LED lamp bead provided by the first embodiment of the present invention;

[0033] Figure 5It is a specific flowchart of a tin - coating method for a multi - colored LED lamp bead provided by the second embodiment of the present invention;

[0034] Figure 6 It is a specific flowchart of a tin - coating method for a multi - colored LED lamp bead of the present invention.

[0035] Description of the reference numerals:

[0036] Multi - colored LED lamp bead 1, lamp slot 11, pin 12, solder paste hopper 13, lamp bead bracket 14, insulating layer 15, LED chip 16, small lamp slot 111, large lamp slot 112, extrusion block 131, paste outlet 132, film 133, red LED chip 161, green LED chip 162, blue LED chip 163. Specific embodiments

[0037] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0039] Please refer to Figures 1-4, the first embodiment of the present invention provides a colorful LED lamp bead 1. The lamp slot 11 is installed on the lamp bead bracket 14, and the LED wafer 16 is arranged in the lamp slot 11. The lamp slot 11 includes two small lamp slots 111 and one large lamp slot 112. The two small lamp slots 111 are on both sides of the large lamp slot 112. The large lamp slot 112 installs the red LED wafer 161, the green LED wafer 162 and the blue LED wafer 163. The small lamp slot 111 installs the red LED wafer 161, the green LED wafer or the blue LED wafer 163. Eight pins 12 are provided, wherein the LED wafer 16 built in the large lamp slot 112 is connected to four pins 12, and the LED wafer 16 built in the small lamp slot 111 is connected to two pins 12; the cathodes of the red LED wafer 161, the green LED wafer 162 and the blue LED wafer in the large lamp slot 112 are each connected to one pin 12, and the anodes are commonly connected to one pin 12; the cathodes and anodes of the red LED wafer 161, the green LED wafer 162 or the blue LED wafer in the small lamp slot 111 are each connected to one pin 12; the top of the solder paste hopper 13 is connected to the bottom of the lamp bead bracket 14. A pressing block 131 is arranged at the top of the solder paste hopper 13. The solder paste hopper 13 is provided with a paste outlet 132. The position of the paste outlet 132 corresponds to the pin 12. There is a layer of film 133 at the paste outlet 132, and there is a layer of insulating layer 15 between the pins 12.

[0040] Specifically, the red LED wafer 161, the green LED wafer 162 and the blue LED wafer 163 in the large lamp slot 112 can emit red, green and blue (RGB) light. The cathodes and anodes of the LED wafer 16 in the small lamp slot 111 are respectively connected to one of the two pins 12. The cathodes of the red LED wafer 161, the green LED wafer 162 and the blue LED wafer in the large lamp slot 112 are each connected to one pin 12, and the anodes are commonly connected to one pin 12. Further, the circuit of the LED wafer 16 in the lamp slot 11 is relatively independent and its switch can be controlled separately. By turning on two of the color LED wafers 16, other colors can be obtained. Further, the LED wafers in the large lamp slot 112 form an RGB color system and can emit a variety of colors. Cooperating with the two small lamp slots 111 can make the colorful LED lamp bead 1 emit at most three colors of light.

[0041] Optionally, the LED wafer 16 in the small lamp slot emits light mixed with the phosphor by adding phosphor to obtain light of other colors.

[0042] Specifically, the cavity of the solder paste hopper 13 is filled with solder paste. The solder paste hopper 13 is located at the bottom of the lamp bead bracket 14. The top of the solder paste hopper 13 is provided with the extrusion block 131, and the extrusion block 131 contacts the lamp bead bracket 14. The solder paste hopper 13 is provided with the paste outlet 132. Further, by pressing the lamp bead bracket 14, the lamp bead bracket 14 contacts the extrusion block 131, and the extrusion block 131 is under pressure to extrude the solder paste. The solder paste is extruded from the paste outlet 132. The position of the paste outlet 132 corresponds to the pin 12, and the solder paste wraps the pin 12. There is the insulating layer 15 between the pins 12 to prevent the pins 12 from being connected by the solder paste during the soldering process, thus causing a short circuit. A layer of the thin film 133 is provided at the paste outlet 132 to prevent the solder paste from flowing out without being pressed by the extrusion block 131. Further, the solder paste hopper 13 optimizes the soldering of the LED lamp beads to the circuit board. At the same time, the phenomenon of serious waste of solder paste is avoided. The user only needs to gently press the lamp bead bracket 14, and the solder paste will adhere to the pin 12.

[0043] Refer to Figures 5-6 , the second embodiment of the present invention provides a method for applying solder to a colorful LED lamp bead, including the following steps:

[0044] Step S1: The solder paste hopper discharges the solder paste, and the solder paste is applied to the pins to obtain the pins with solder paste;

[0045] It can be understood that the solder paste hopper is extruded by an external force and discharges the solder paste toward the pins. At the same time, the solder paste spreads from the position of the pins close to the solder paste hopper to the position away from the solder paste hopper, that is, the solder paste overflows from the gap between the two pins.

[0046] Step S2: The circuit board is close to the pins, and the pins are connected to the copper plating on the circuit board to obtain a colorful LED lamp bead with solder paste;

[0047] It can be understood that the pins are connected to the copper plating on the circuit board, and the pins are electrically connected to the LED lamp beads. By bringing the circuit board close to the pins, the copper plating of the circuit board can be electrically connected to the pins, so that the LED lamp beads can obtain power supply.

[0048] Step S3: Remove the solder paste hopper from the lamp bead bracket to obtain a colorful LED lamp bead.

[0049] It can be understood that the solder paste hopper can be removed from the lamp bead bracket, which allows the solder paste hopper to be used multiple times. At the same time, the weight and occupied space of the manufactured colorful LED lamp beads are reduced, and the overall volume of the colorful LED lamp beads is reduced.

[0050] It can be understood that by gently pressing the lamp bead bracket, the extrusion block is extruded, and the extrusion block extrudes the solder paste from the paste outlet. The solder paste breaks through the thin film layer, and the solder paste is applied to the pins.

[0051] After step S3, the following steps are further included:

[0052] Step S4: Heat the colorful LED lamp beads to cure the solder paste.

[0053] It can be understood that by heating the colorful LED lamp beads, the solder paste is cured, and the connection stability between the colorful LED lamp beads and the circuit board is increased.

[0054] Step S1 specifically includes the following steps:

[0055] Step S11: An external force acts on the outside of the extrusion block, and the solder paste in the solder paste hopper is extruded towards the paste outlet.

[0056] Step S12: The paste outlet discharges solder paste towards the corresponding pin, and the solder paste is applied to the pin.

[0057] It can be understood that by applying pressure to the extrusion block, the paste outlet discharges solder paste towards the pin direction, and the solder paste overflows at the position between the pins. The solder paste adheres the pin and the copper plating of the circuit board. By extruding the solder paste from the position of the solder paste hopper, the usability of the solder paste hopper can be improved, and the convenience of tin coating can be increased.

Claims

1. A colorful LED lamp bead, characterized in that: It includes a lamp bead bracket, a lamp slot, pins, an LED chip and a solder paste hopper. The lamp slot, the pins, the LED chip and the solder paste hopper are all arranged on the lamp bead bracket; The LED chip is arranged in the lamp slot, and the LED chip is connected to the pins; The solder paste hopper is provided with a paste outlet and a pressing block. The position of the paste outlet corresponds to the pins. The pressing block is arranged at the top of the solder paste hopper, and the solder paste hopper is arranged at the bottom of the lamp bead bracket; The pins are arranged at the bottom of the lamp bead bracket.

2. The multicolored LED lamp bead according to claim 1, wherein: The lamp slot includes a small lamp slot and a large lamp slot. There are two small lamp slots and one large lamp slot. The small lamp slots are arranged on both sides of the large lamp slot; There are three LED chips in the large lamp slot. The negative corners of the LED chips in the large lamp slot are respectively connected to one pin, and the positive corners are commonly connected to one pin; There is one LED chip in the small lamp slot. The negative corner of the LED chip in the small lamp slot is connected to one pin, and the positive corner is connected to one pin.

3. The multi-color LED lamp bead according to claim 2, wherein: A total of eight pins are provided. Two pins are connected to the LED chips in the small lamp slot, and four pins are connected to the LED chips in the large lamp slot.

4. The multicolor LED lamp bead according to claim 2, wherein: The LED chips include red LED chips, green LED chips and blue LED chips; The red LED chip, the green LED chip and the blue LED chip are arranged in the large lamp slot; The red LED chip, the green LED chip or the blue LED chip is arranged in the small lamp slot.

5. The multi-color LED lamp bead according to claim 1, wherein: It includes a thin film and an insulating layer. The thin film is arranged at the paste outlet, and the insulating layer is arranged between the pins.

6. The multicolor LED lamp bead according to claim 1, wherein: A accommodating space is arranged between the solder paste hopper and the lamp bead bracket, and the pressing block is arranged close to the accommodating space.

7. A method for tin coating of a multi - colored LED lamp bead, which is applicable to manufacturing a multi - colored LED lamp bead described in any one of the above - mentioned claims 1 - 6, and is characterized in that, It includes the following steps: Step S1: The solder paste hopper discharges solder paste, and the solder paste is applied to the pins to obtain pins with solder paste; Step S2: The circuit board is close to the pins, and the pins are connected to the copper plating on the circuit board to obtain an LED lamp bead with solder paste; Step S3: Remove the solder paste hopper from the lamp bead bracket to obtain a colorful LED lamp bead.

8. The method for tin coating of a colorful LED lamp bead according to claim 7, wherein: Step S1 specifically includes the following steps: Step S11: An external force acts on the outside of the pressing block to extrude the solder paste in the solder paste hopper towards the paste outlet; Step S12: The paste outlet discharges solder paste towards the corresponding pins, and the solder paste is applied to the pins.

9. The tin coating method of a colorful LED lamp bead according to claim 7, characterized in that: After step S3, the following steps are further included: Step S4: Heat the colorful LED lamp beads to cure the solder paste.

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