Image processing apparatus

Abstract

The present application provides an image processing device, which is not easily affected by sharp temperature rise accompanying image processing, and can ensure stable communication quality. The image processing device has a light receiving element, a light emitting element, a battery, a power supply circuit electrically connected with the battery, a wireless communication module, a first substrate provided with the light receiving element, a second substrate provided with the light emitting element, a third substrate provided with the power supply circuit, a fourth substrate provided with the wireless communication module, and a housing accommodating the first substrate, the second substrate, the third substrate and the fourth substrate, and the battery is located between the first substrate, the second substrate, the third substrate and the fourth substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to an image processing apparatus. BACKGROUND

[0002] In recent years, an image processing apparatus equipped with a battery and capable of being carried and operated as a single body has been widely spread. For example, Patent Literature 1 describes an image processing apparatus equipped with a calibration data setting section and an image correction section, the calibration data setting section sets, as calibration data, color chart image data at a temperature closer to a temperature at which a subject is photographed, from among color chart image data obtained by photographing color charts before and after photographing a subject, based on a temperature of a camera at the time of photographing the subject, a temperature of the camera at the time of photographing the color charts before and after photographing the subject, and the color chart image data obtained by photographing the color charts before and after photographing the subject; and the image correction section corrects image data of the subject obtained by photographing the subject using the calibration data set in the calibration data setting section. According to the image processing apparatus described in Patent Literature 1, even in a case where a photographing condition or the like has changed during photographing, image data of the subject can be corrected with high precision.

[0003] Patent Literature 1: Japanese Patent Application Publication No. 2010-81057

[0004] However, in an image processing apparatus equipped with a battery and capable of being carried and operated as a single body, in order to facilitate arrangement of various constituent elements in a small housing, a sharp temperature change caused by heat of a light emitting element, a light receiving element, and a power supply circuit can have an influence on a wireless communication module, resulting in a communication stability being hindered, and there is still room for improvement in terms of technology. SUMMARY

[0005] One embodiment of an image processing apparatus according to the present application includes:

[0006] a light receiving element;

[0007] a light emitting element;

[0008] a battery;

[0009] a power supply circuit electrically connected to the battery;

[0010] a wireless communication module;

[0011] a first substrate on which the light receiving element is provided;

[0012] a second substrate on which the light emitting element is provided;

[0013] a third substrate on which the power supply circuit is provided;

[0014] a fourth substrate provided with the wireless communication module; and

[0015] a housing that accommodates the first substrate, the second substrate, the third substrate, and the fourth substrate,

[0016] The battery is located between the first substrate, the second substrate, the third substrate, and the fourth substrate. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view of an image processing apparatus of the present embodiment.

[0018] Figure 2 is a view showing an example of information displayed in a display module.

[0019] Figure 3 is a block diagram showing a functional configuration of an image processing apparatus.

[0020] Figure 4 is a view of the inside of a housing of an image processing apparatus as viewed from the positive direction of an X axis.

[0021] Figure 5 is a view of the inside of a housing of an image processing apparatus as viewed from the positive direction of a Y axis.

[0022] Figure 6 is a view of the inside of a housing of an image processing apparatus as viewed from the positive direction of a Z axis.

[0023] Figure 7 is a view of a first substrate as viewed from the positive direction of a Z axis.

[0024] Figure 8 is a cross-sectional view of the first substrate taken along the A-A line of Figure 7

[0025] Figure 9 is a view of a sub substrate as viewed from the positive direction of a Z axis.

[0026] Figure 10 is a view of an interval substrate as viewed from the positive direction of a Z axis.

[0027] Figure 11 is a view of a main substrate as viewed from the positive direction of a Z axis.

[0028] Figure 12 is a view of a second substrate as viewed from the positive direction of a Z axis.

[0029] Figure 13 is a view of a third substrate as viewed from the positive direction of a Z axis.

[0030] Figure 14 is a view of a fourth substrate as viewed from the positive direction of a Z axis. ​

[0031] Figure 15 FIG. 1 is a view of a part of the image processing apparatus as viewed from the positive direction of the Z axis.

[0032] Explanation of Reference Numerals

[0033] 1... image processing apparatus; 10... light emitting element; 11... light emitting element drive circuit; 20... wavelength variable filter; 21... light receiving element; 22... photoelectric conversion circuit; 23... amplification circuit; 24... C / V conversion circuit; 25... amplification circuit; 26... step-up conversion circuit; 30... first processor; 31... wireless communication module; 32... operation section; 33... light emitting module; 34... buzzer; 40... second processor; 41... power supply circuit; 42... switching circuit; 43... charging circuit; 50... display module; 51... electric cable; 60... connector; 70... battery; 71, 72... connector; 81, 82, 83, 84, 85, 86, 87... connector; 91, 92... flexible flat cable; 93... electric cable; 100... housing; 101... first substrate; 101a, 101b, 101c, 101d... side of first substrate; 101F, 101R... face of first substrate; 102... second substrate; 102a, 102b, 102c, 102d... side of second substrate; 102F, 102R... face of second substrate; 103... third substrate; 103a, 103b, 103c, 103d... side of third substrate; 103F, 103R... face of third substrate; 104... fourth substrate; 104a, 104b, 104c, 104d... side of fourth substrate; 104F, 104R... face of fourth substrate; 111... main substrate; 111a, 111b, 111c, 111d... side of main substrate; 111F, 111R... face of main substrate; 112... spacer substrate; 113... sub substrate; 113F, 113R... face of sub substrate; 120... opening section; 121, 122, 123, 124, 125... screw hole; 131, 132... screw; 140... opening section. DETAILED DESCRIPTION

[0034] Hereinafter, a preferred embodiment of the present application will be described in detail using the drawings. The drawings used here are explanatory drawings for convenience of explanation. Furthermore, the embodiment described hereinafter is not an improper limitation of the content of the present application recited in the claims. In addition, not all of the configurations described hereinafter are essential components of the present application.

[0035] Hereinafter, in the present embodiment, a color measurement apparatus will be described as an example of the image processing apparatus to which the present application is applied.

[0036] 1. Outline of image processing apparatus

[0037] 1... image processing apparatus; 10... light emitting element; 11... light emitting element drive circuit; 20... wavelength variable filter; 21... light receiving element; 22... photoelectric conversion circuit; 23... amplification circuit; 24... C / V conversion circuit; 25... amplification circuit; 26... step-up conversion circuit; 30... first processor; 31... wireless communication module; 32... operation section; 33... light emitting module; 34... buzzer; 40... second processor; 41... power supply circuit; 42... switching circuit; 43... charging circuit; 50... display module; 51... electric cable; 60... connector; 70... battery; 71, 72... connector; 81, 82, 83, 84, 85, 86, 87... connector; 91, 92... flexible flat cable; 93... electric cable; 100... housing; 101... first substrate; 101a, 101b, 101c, 101d... side of first substrate; 101F, 101R... face of first substrate; 102... second substrate; 102a, 102b, 102c, 102d... side of second substrate; 102F, 102R... face of second substrate; 103... third substrate; 103a, 103b, 103c, 103d... side of third substrate; 103F, 103R... face of third substrate; 104... fourth substrate; 104a, 104b, 104c, 104d... side of fourth substrate; 104F, 104R... face of fourth substrate; 111... main substrate; 111a, 111b, 111c, 111d... side of main substrate; 111F, 111R... face of main substrate; 112... spacer substrate; 113... sub substrate; 113F, 113R... face of sub substrate; 120... opening section; 121, 122, 123, 124, 125... screw hole; 131, 132... screw; 140... opening section. DETAILED DESCRIPTION

[0034] Hereinafter, a preferred embodiment of the present application will be described in detail using the drawings. The drawings used here are explanatory drawings for convenience of explanation. Furthermore, the embodiment described hereinafter is not an improper limitation of the content of the present application recited in the claims. In addition, not all of the configurations described hereinafter are essential components of the present application.

[0035] Hereinafter, in the present embodiment, a color measurement apparatus will be described as an example of the image processing apparatus to which the present application is applied.

[0036] 1. Outline of image processing apparatus

[0037] Figure 1 This is a perspective view of the image processing apparatus 1 of this embodiment. Figure 1 As shown, the image processing apparatus 1 of this embodiment performs colorimetric processing to determine the color of an image IMG as image processing. Specifically, when the user moves the image processing apparatus 1 above the image IMG formed on the medium M and presses the operation unit 32 disposed on the upper surface of the image processing apparatus 1, the image processing apparatus 1 emits light from a portion of the bottom surface opposite the image IMG and determines the color of the image IMG based on the wavelength of the light reflected by the image IMG. That is, the operation unit 32 functions as a measurement start button. For example, the medium M is paper or cloth, etc., and the image IMG is a monochrome image. Figure 1 As shown, a colorimetric chart containing multiple images with different colors can also be formed on the medium M. The user moves the image processing device 1 over each image and presses the operation unit 32, thereby allowing the image processing device 1 to measure the color of each image. Alternatively, the image processing device 1 can also measure the color of the medium M.

[0038] The image processing device 1 can also calculate the difference between the measured color value and the target color value, i.e., the color difference. The image processing device 1 displays the calculated color value and color difference on a display module 50 that the user can visually confirm from the outside of the housing 100. Figure 1 In this example, the display module 50 is positioned so that the user can visually confirm the image processing device 1 from the surface where the operation unit 32 is located. Figure 2 This diagram illustrates an example of the colorimetric values ​​and color differences displayed in display module 50. Figure 2 In the example, the color values ​​L, a, b, and color difference ΔE displayed in display module 50 are values ​​in the L*a*b* color space. Furthermore, the color values ​​and color difference can also be values ​​in various color spaces other than the L*a*b* color space, such as RGB, YCC, CMYK, and L*C*h.

[0039] like Figure 1 and Figure 2 As shown, the image processing device 1 may also have a light-emitting module 33 that can be visually confirmed by the user from the outside of the housing 100. Figure 1 and Figure 2 In this example, the light-emitting module 33 is configured to surround the operating section 32. For instance, the light-emitting module 33 has a tubular light guide and an LED mounted at the front end of the light guide, the light emitted by the LED being guided by the light guide. LED is an abbreviation for Light Emitting Diode. Figure 1 and Figure 2In the example of FIG. 1, the user can visually confirm the light guide of the light emitting module 33. The light emitting module 33 is a module for displaying a state, and the light emitting state differs depending on the operation of the operation section 32 by the user. For example, the image processing apparatus 1 can also cause the light emitting module 33 to emit light when it is recognized that the user has pressed the operation section 32.

[0040] The image processing apparatus 1 is in the shape of a cuboid close to a size that the user can hold and operate with one hand, and thus can be carried. In addition, the image processing apparatus 1 is built-in with the battery 70 described later, and operates by the user pressing the operation section 32, and thus can operate as a single body without being instructed from another apparatus. Therefore, the user of the image processing apparatus 1 is highly convenient.

[0041] Further, as shown in Figure 1 and Figure 2 , the directions along the three edges of the housing 100 of the image processing apparatus 1 that intersect each other are set as an X axis, a Y axis, and a Z axis, and thereafter, the orientation of the image processing apparatus 1 is the same as that of the X axis, the Y axis, and the Z axis except for Figure 3 Figure 1 and Figure 2 .

[0042] 2. Functional Configuration of Image Processing Apparatus

[0043] Figure 3 is a block diagram showing the functional configuration of the image processing apparatus 1. As shown in Figure 3 , the image processing apparatus 1 includes a plurality of light emitting elements 10 and a light emitting element drive circuit 11. In addition, the image processing apparatus 1 includes a wavelength variable filter 20, a light receiving element 21, a photoelectric conversion circuit 22, an amplification circuit 23, a C / V conversion circuit 24, an amplification circuit 25, and a step-up conversion circuit 26. In addition, the image processing apparatus 1 includes a first processor 30, a wireless communication module 31, an operation section 32, a light emitting module 33, a buzzer 34, and a display module 50. In addition, the image processing apparatus 1 includes a second processor 40, a power supply circuit 41, a switching circuit 42, a charging circuit 43, a connector 60, and a battery 70.

[0044] The plurality of light emitting elements 10 are respectively arranged on the bottom surface portion of the image processing apparatus 1, and are lit or extinguished in accordance with a drive signal output from the light emitting element drive circuit 11. When each light emitting element 10 is lit, light is emitted from the bottom surface of the image processing apparatus 1. Each light emitting element 10 is, for example, an LED. For example, a part of the plurality of light emitting elements 10 can emit white light, and another part of the plurality of light emitting elements 10 can emit ultraviolet light.

[0045] The light emitting element drive circuit 11 outputs a plurality of drive signals that respectively drive the plurality of light emitting elements 10 in accordance with a control signal from the first processor 30. ​

[0046] The wavelength variable filter 20 transmits light of a prescribed range of wavelengths from light incident from the bottom surface of the image processing apparatus 1. The wavelength variable filter 20 has an electrostatic actuator not shown, and a voltage output from the amplification circuit 25 is applied to the electrostatic actuator. The capacitance value of the electrostatic actuator changes according to the applied voltage, and the wavelength of light transmitted through the wavelength variable filter 20 changes according to the capacitance value of the electrostatic actuator. Therefore, the wavelength of light transmitted through the wavelength variable filter 20 changes according to the voltage output from the amplification circuit 25. The wavelength variable filter 20 can also be a etalon element, for example.

[0047] The amplification circuit 25 outputs a voltage of several tens of V for driving the wavelength variable filter 20. The output voltage of the amplification circuit 25 changes according to a control signal from the first processor 30.

[0048] The step-up conversion circuit 26 steps up a voltage VI of several V output from the power supply circuit 41 to a voltage V4 of several tens of V, and outputs to the amplification circuit 25. The voltage V4 stepped up by the step-up conversion circuit 26 becomes the power supply voltage of the amplification circuit 25. The step-up conversion circuit 26 can also be a step-up type DC-DC converter, for example.

[0049] The C / V conversion circuit 24 converts the electric charge accumulated in the electrostatic actuator to a voltage, and outputs to the first processor 30. The first processor 30 controls the output voltage of the amplification circuit 25 according to a digital value obtained by A / D converting the output voltage of the C / V conversion circuit 24, so that the wavelength variable filter 20 transmits light of a desired wavelength. That is, the wavelength of light transmitted through the wavelength variable filter 20 is controlled by the first processor 30.

[0050] The light receiving element 21 receives light transmitted through the wavelength variable filter 20, and outputs an electric charge of a size corresponding to the amount of light. The light receiving element 21 can also be a photodiode, for example.

[0051] The photoelectric conversion circuit 22 converts the amount of light received by the light receiving element 21 to an electric signal, and outputs to the amplification circuit 23. The photoelectric conversion circuit 22 can also be a C / V conversion circuit that converts the electric charge output from the light receiving element 21 to a voltage, for example.

[0052] The amplification circuit 23 amplifies the voltage output from the photoelectric conversion circuit 22, and outputs to the first processor 30.

[0053] The first processor 30 is a processor that performs image processing, generates a digital value indicating the amount of light received by the light-receiving element 21 by performing A / D conversion on the output voltage of the photoelectric conversion circuit 22, and stores the amount of light in correspondence with the wavelength of the light. The first processor 30 may, for example, also be an MCU or an MPU. MCU is an abbreviation for Micro Control Unit, and MPU is an abbreviation for Micro-processing unit. The first processor 30 scans the wavelength of the light transmitted through the wavelength variable filter 20, and stores the amount of light received by the light-receiving element 21 in correspondence with each wavelength. Further, the first processor 30 calculates a color measurement value from the amount of light corresponding to each wavelength. The first processor 30 calculates a color difference, which is the difference between the color measurement value and a target color value, in a case where the target color value is known in advance.

[0054] The wireless communication module 31 has a wireless communication circuit and an antenna, which are not shown. The wireless communication circuit acquires a wireless signal received from an external device via the antenna and demodulates data, and transmits to the first processor 30. In addition, the wireless communication circuit acquires data from the first processor 30 and modulates a high-frequency signal, and transmits a wireless signal to the external device via the antenna. For example, the wireless communication module 31 may also acquire the color measurement value and the color difference calculated by the first processor 30, and transmit to the external device. The wireless communication circuit may also have a temperature sensor, which is not shown, and have a function of temperature compensating the color measurement value based on a signal output from the temperature sensor. The wireless communication module 31 may, for example, also be a module that transmits and receives a wireless signal corresponding to a wireless communication standard such as Bluetooth (registered trademark), Wi-Fi, or the like.

[0055] The operation section 32 outputs an operation signal based on a user operation to the first processor 30. In the present embodiment, the operation section 32 functions as a measurement start button, and outputs an operation signal indicating that the operation section 32 is pressed to the first processor 30 when the user presses the operation section 32. The first processor 30 starts processing for color measurement in accordance with the operation signal from the operation section 32.

[0056] The light-emitting module 33 is a module for state display, and emits light in accordance with a control signal from the first processor 30. For example, the first processor 30 outputs a control signal for causing the light-emitting module 33 to emit light when it is detected that the user has pressed the operation section 32.

[0057] The buzzer 34 notifies the user of various information by generating a prescribed sound in accordance with a control signal from the first processor 30. For example, when the user presses the operation section 32 in order to start the measurement, the light axis of the light receiving element 21 is greatly shifted or shaken, and it is possible that the color measurement cannot be performed normally. Therefore, when the user's operation of the operation section 32 is not good, the first processor 30 outputs a prescribed control signal to the buzzer 34, and the buzzer 34 emits a sound.

[0058] The display module 50 displays various information in accordance with a display signal output from the first processor 30. In the present embodiment, the light emitting module 33 includes a display panel as shown in FIG. 6 and a display driver not shown. The display panel can also be a liquid crystal panel, for example. The display driver generates a drive signal corresponding to the display signal output from the first processor 30, and outputs the drive signal to the display panel. For example, as shown in FIG. 7, the display panel displays a colorimetric value, a color difference, and the like. Figure 2 Figure 2

[0059] The battery 70 is a secondary battery such as a lithium ion battery, a lithium polymer battery, or the like, for example. A voltage VB corresponding to the charge remaining amount is output from the battery 70 by the user pressing a power button not shown.

[0060] The power supply circuit 41 generates and outputs voltages VI, V2 in accordance with the output voltage VB of the battery 70. The power supply circuit 41 can also include a step-up DC-DC converter and a step-down DC-DC converter not shown, the step-up DC-DC converter generating the voltage VI by stepping up the output voltage VB of the battery 70, and the step-down DC-DC converter generating the voltage V2 by stepping down the voltage VI. The voltage VI is supplied to the step-up conversion circuit 26, and the voltage V2 is supplied to the second processor 40 as a power supply voltage. In addition, the voltage V2 is input to the switching circuit 42.

[0061] The switching circuit 42 becomes in an on state or an off state in accordance with a control signal from the second processor 40. The switching circuit 42 outputs a voltage V3 approximately equal to the voltage V2 when in the on state. The voltage V3 is supplied to the circuits surrounded by a broken line in FIG. 5 as a power supply voltage. In addition, when the switching circuit 42 is in the off state, the voltage V3 is not supplied to the circuits. That is, the second processor 40 is a power supply control processor. Figure 3

[0062] The connector 60 is a connector that connects a cable, and can also be a USB connector, for example. USB is an abbreviation for Universal Serial Bus. The connector 60 is electrically connected to an external device such as a personal computer via a USB cable, for example. The second processor 40 can perform data communication with the external device via the connector 60.

[0063] ​​​The charging circuit 43 uses the power supply voltage VC supplied when the connector 60 is electrically connected to an external device to charge the battery 70.

[0064] In addition, the second processor 40 communicates with the first processor 30. The second processor 40 can also be started by being supplied with voltage V2 from the power supply circuit 41 and notify the first processor 30 of this start-up status. Alternatively, the first processor 30 can notify the second processor 40 of the transition to sleep mode after colorimetric processing is complete. Upon receiving this notification, the second processor 40 de-energizes the switching circuit 42, stopping the supply of voltage V3 to the first processor 30.

[0065] 3. Structure of the image processing device

[0066] Next, use Figures 4 to 15 The internal structure of the image processing device 1 will be described in detail. Figure 4 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive X-axis direction. Additionally,

[0067] Figure 5 This is a view of the interior of the housing 100 of the image processing device 1, viewed from the positive Y-axis direction. Additionally, Figure 6 This is a view of the interior of the housing 100 of the image processing device 1 as seen from the positive Z-axis direction.

[0068] like Figure 4 and Figure 5 As shown, the image processing apparatus 1 has a cuboid-shaped housing 100, a first substrate 101, a second substrate 102, a third substrate 103, and a fourth substrate 104. The housing 100 houses the first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104. The first substrate 101, the second substrate 102, the third substrate 103, and the fourth substrate 104 are fixed to the housing 100 by screws or the like. The second substrate 102 is located closest to the bottom surface of the housing 100. The first substrate 101 is located between the second substrate 102 and the third substrate 103, and the third substrate 103 is located between the first substrate 101 and the fourth substrate 104. The fourth substrate 104 is located closest to the upper surface of the housing 100.

[0069] Figure 3 The wavelength-variable filter 20, light-receiving element 21, photoelectric conversion circuit 22, amplification circuit 23, C / V conversion circuit 24, amplification circuit 25, boost conversion circuit 26, and first processor 30 shown are disposed on the first substrate 101. Furthermore, Figure 3The plurality of light emitting elements 10 and the light emitting element drive circuit 11 shown are provided on the second substrate 102. In addition, Figure 3 The second processor 40, the power supply circuit 41, the switching circuit 42, the charging circuit 43, and the connector 60 shown are provided on the third substrate 103. In addition, Figure 3 The wireless communication module 31, the operation section 32, the light emitting module 33, and the buzzer 34 shown are provided on the fourth substrate 104.

[0070] As shown in Figure 4 , Figure 5 and Figure 6 , Figure 3 The display module 50 shown is positioned between the fourth substrate 104 and the upper surface of the case 100 and is visually confirmed from the upper surface of the case 100. One end of a cable 51 connected to a not-shown display driver built in the display module 50 is connected to a connector 86 provided on the fourth substrate 104.

[0071] As shown in Figure 4 and Figure 5 , both ends of a flexible flat cable 91 are connected to a connector 81 provided on the first substrate 101 and a connector 87 provided on the fourth substrate 104, respectively. Signals input and output between the first processor 30 provided on the first substrate 101 and the wireless communication module 31, the operation section 32, the light emitting module 33, and the buzzer 34 provided on the fourth substrate 104 are transmitted in the flexible flat cable 91.

[0072] In addition, a signal for display output from the first processor 30 provided on the first substrate 101 is transmitted in the flexible flat cable 91 and reaches the fourth substrate 104, and further transmitted in the cable 51 and reaches the display module 50. Thus, the fourth substrate 104 functions as a relay substrate that relays the signal for display to the display module 50.

[0073] Both ends of a flexible flat cable 92 are connected to a connector 84 provided on the first substrate 101 and a connector 85 provided on the third substrate 103, respectively. The first processor 30 provided on the first substrate 101 and the second processor 40 provided on the third substrate 103 perform data communication via the flexible flat cable 92. In addition, a voltage V3 based on a voltage V2 generated by the power supply circuit 41 provided on the third substrate 103 is transmitted in the flexible flat cable 92 and reaches the first substrate 101, and further transmitted in the flexible flat cable 91 and reaches the fourth substrate 104. That is, the wiring path from the third substrate 103 to the first substrate 101 is shorter than the wiring path from the third substrate 103 to the fourth substrate 104. Thus, the amount of decrease in the voltage V3 supplied from the power supply circuit 41 to the first substrate 101 is small, and a stable voltage is supplied to the light receiving element 21 disposed on the first substrate 101.

[0074] The both ends of the cable 93 are connected to the connector 82 provided on the first substrate 101 and the connector 83 provided on the second substrate 102, respectively. The control signal output from the first processor 30 provided on the first substrate 101 is transmitted in the cable 93 and reaches the second substrate 102, and is input to the light emitting element drive circuit 11 provided on the second substrate 102.

[0075] As Figure 4 and Figure 5 illustrated, Figure 3 The battery 70 illustrated in is located between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104. More specifically, the battery 70 is provided between the third substrate 103 and the fourth substrate 104. In addition, the third substrate 103 is provided between the battery 70 and the first substrate 101. Also, the battery 70 overlaps the third substrate 103 in the Z-axis direction orthogonal to the face 101F of the first substrate 101. Therefore, in a plan view observed from the positive direction of the Z-axis, the first substrate 101, the second substrate 102, the third substrate 103, the fourth substrate 104, and the battery 70 overlap, and the arrangement space of the first substrate 101, the second substrate 102, and the third substrate 103 is separated from the arrangement space of the fourth substrate 104 by the battery 70.

[0076] Figure 4 In addition, as Figure 5 illustrated, in a plan view observed from the positive direction of the Y-axis, the portion of the battery 70 facing the fourth substrate 104 has a semicircular shape, and the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 has a trapezoidal shape with the upper base longer than the lower base. Therefore, the closer the portion of the battery 70 facing the first substrate 101, the second substrate 102, and the third substrate 103 is to the first substrate 101, the second substrate 102, and the third substrate 103, the smaller the cross-sectional area is. Therefore, a gap is generated in the X-axis direction between the battery 70 and the third substrate 103, and the connectors 71, 72 are provided on the third substrate 103 using the gap. The connectors 71, 72 are connected to the battery 70 by wiring not shown. Figure 3 The power supply circuit 41 and the charging circuit 43 illustrated in

[0077] Figure 7 is a view of the first substrate 101 observed from the positive direction of the Z-axis, Figure 8 is a cross-sectional view of the first substrate 101 taken along the A-A line in Figure 7 As Figure 7As shown, in a top view taken from the positive direction of the Z-axis, the first substrate 101 has a rectangular shape having a side 101a, a side 101b longer than the side 101a, a side 101c opposite to the side 101a, and a side 101d opposite to the side 101b.

[0078] like Figure 7 and Figure 8 As shown, the first substrate 101 has a surface 101F facing the positive Z-axis direction and a surface 101R facing the negative Z-axis direction. Furthermore, the first substrate 101 is disposed between the third substrate 103 and the second substrate 102 in the Z-axis direction. A light-receiving element 21 is disposed on surface 101R of the first substrate 101.

[0079] like Figure 7 As shown, the first substrate 101 is constructed by fixing the main substrate 111 and the sub-substrate 113 onto the spacer substrate 112 using screws 131 and 132.

[0080] Figure 9 This is a view of the sub-substrate 113 viewed from the positive Z-axis direction. Additionally, Figure 10 This is a view of the spacer substrate 112 taken from the positive Z-axis direction. Additionally, Figure 11 This is a view of the main substrate 111 viewed from the positive Z-axis direction. Furthermore, in... Figure 9 , Figure 10 as well as Figure 11 In the diagram, solid lines represent constituent elements disposed on the surface of each substrate facing the positive Z-axis, and dashed lines represent constituent elements disposed on the surface of each substrate facing the negative Z-axis.

[0081] like Figure 7 , Figure 9 , Figure 10 as well as Figure 11 As shown, screws 131 are inserted into threaded holes 121 on the main substrate 111, threaded holes 123 on the spacer substrate 112, and threaded holes 124 on the sub-substrate 113; and screws 132 are inserted into threaded holes 122 on the main substrate 111 and threaded holes 125 on the sub-substrate 113.

[0082] like Figure 9 As shown, the sub-substrate 113 has a surface 113F facing the positive Z-axis and a surface 113R facing the negative Z-axis. Surfaces 101F and 101R of the first substrate 101 are surfaces 113F and 113R of the sub-substrate 113, respectively. Figure 8 and Figure 9 As shown, a light-receiving element 21 and an amplifier circuit 23 are disposed on the surface 113R of the sub-substrate 113.

[0083] like Figure 7 and Figure 11As shown, in a top view taken from the positive direction of the Z-axis, the shape of the first substrate 101 is consistent with the shape of the main substrate 111. The edges 101a, 101b, 101c and 101d of the first substrate 101 are the edges 111a, 111b, 111c and 111d of the main substrate 111, respectively.

[0084] like Figure 11 As shown, the main substrate 111 has a surface 111F facing the positive Z-axis and a surface 111R facing the negative Z-axis. A photoelectric conversion circuit 22, an amplifier circuit 25, a boost converter circuit 26, a first processor 30, and a connector 84 are disposed on surface 111F of the main substrate 111. Additionally, a wavelength variable filter 20, a C / V conversion circuit 24, a connector 81, and a connector 82 are disposed on surface 111R of the main substrate 111. Figure 8 and Figure 11 As shown, the main substrate 111 has a rectangular opening 120, and in a top view viewed from the positive direction of the Z-axis, the wavelength variable filter 20 overlaps with the opening 120.

[0085] In addition, in this embodiment, the first substrate 101 is composed of three substrates: a main substrate 111, a spacer substrate 112, and a sub-substrate 113, but it may also be composed of one or two substrates.

[0086] Figure 12 This is a view of the second substrate 102 viewed from the positive Z-axis direction. Furthermore, in... Figure 12 In the diagram, solid lines represent constituent elements disposed on the surface 102F of the second substrate 102 facing the positive Z-axis direction, and dashed lines represent constituent elements disposed on the surface 102R of the second substrate 102 facing the negative Z-axis direction.

[0087] like Figure 12 As shown, in a top view taken from the positive Z-axis direction, the second substrate 102 has a rectangular shape having a side 102a, a side 102b longer than side 102a, a side 102c opposite to side 102a, and a side 102d opposite to side 102b. A connector 83 is provided on surface 102F of the second substrate 102. Surface 102F of the second substrate 102 is opposite to surface 101R of the first substrate 101.

[0088] A plurality of light-emitting elements 10 and a light-emitting element driving circuit 11 are disposed on surface 102R of the second substrate 102. The second substrate 102 has a circular opening 140. In a top view taken from the positive direction of the Z-axis, the plurality of light-emitting elements 10 are disposed on surface 102R of the second substrate 102 in a manner that surrounds the opening 140. Surface 102R of the second substrate 102 faces the inner wall of the housing 100.

[0089] Figure 13is a view of the third substrate 103 as viewed in the positive direction of the Z axis. Furthermore, in Figure 13 the solid line indicates a component provided on the surface 103F of the third substrate 103 facing the positive direction of the Z axis, and the broken line indicates a component provided on the surface 103R of the third substrate 103 facing the negative direction of the Z axis.

[0090] As shown in Figure 13 , in a plan view as viewed in the positive direction of the Z axis, the third substrate 103 has a rectangular shape having a side 103a, a side 103b longer than the side 103a, a side 103c opposite to the side 103a, and a side 103d opposite to the side 103b. The second processor 40, the power supply circuit 41, the switching circuit 42, the charging circuit 43, the connector 60, the connector 71, and the connector 72 are provided on the surface 103F of the third substrate 103. The surface 103F of the third substrate 103 faces the battery 70.

[0091] The connector 85 is provided on the surface 103R of the third substrate 103. The surface 103R of the third substrate 103 faces the surface 101F of the first substrate 101.

[0092] Figure 14 is a view of the fourth substrate 104 as viewed in the positive direction of the Z axis. Furthermore, in Figure 14 the solid line indicates a component provided on the surface 104F of the fourth substrate 104 facing the positive direction of the Z axis, and the broken line indicates a component provided on the surface 104R of the fourth substrate 104 facing the negative direction of the Z axis.

[0093] As shown in Figure 14 , in a plan view as viewed in the positive direction of the Z axis, the fourth substrate 104 has a rectangular shape having a side 104a, a side 104b longer than the side 104a, a side 104c opposite to the side 104a, and a side 104d opposite to the side 104b. Furthermore, the side 104a is an example of the "first side", the side 104b is an example of the "second side", the side 104c is an example of the "third side", and the side 104d is an example of the "fourth side".

[0094] The operation section 32, the light emitting module 33, the buzzer 34, and the connector 86 are provided on the surface 104F of the fourth substrate 104. The operation section 32 is provided on the surface 104F of the fourth substrate 104 at a position overlapping with a virtual line VL having the same distance from the side 104b and the side 104d. That is, the operation section 32 is arranged at a central portion in the short side direction of the fourth substrate 104. The operation section 32 is, for example, a button which is physically displaced by being pressed by a user. Alternatively, the operation section 32 can be a static capacitance type button.

[0095] The surface 104F of the fourth substrate 104 faces the inner wall surface of the housing 100 and the display module 50.

[0096] A wireless communication module 31 and a connector 87 are disposed on surface 104R of the fourth substrate 104. The wireless communication module 31 is disposed in the end region of surface 104R of the fourth substrate 104. This end region is the region closest to edge 104a when the entire area of ​​surface 104R of the fourth substrate 104 is divided into three regions of equal area by two line segments parallel to edge 104a. Surface 104R of the fourth substrate 104 faces the battery 70.

[0097] Figure 15 This is a diagram showing multiple light-emitting elements 10, wavelength-variable filter 20, light-receiving element 21, opening 140, first processor 30, wireless communication module 31, operation unit 32, power supply circuit 41, display module 50, and fourth substrate 104 viewed from the positive direction of the Z-axis.

[0098] like Figure 15 As shown, in the Z-axis direction, the opening 140 of the second substrate 102, the wavelength-variable filter 20, and the light-receiving element 21 overlap, and a plurality of light-emitting elements 10 are arranged to surround the opening 140. That is, the opening 140 and the wavelength-variable filter 20 overlap on the optical axis of the light-receiving element 21, and the plurality of light-emitting elements 10 are arranged to surround the optical axis of the light-receiving element 21. Therefore, light emitted from the plurality of light-emitting elements 10 is reflected by the image IMG, and the reflected light enters the wavelength-variable filter 20 through the opening 140. Then, light of a predetermined wavelength that has passed through the wavelength-variable filter 20 enters the light-receiving element 21. In this way, by arranging the components of the optical system in an overlapping manner in the Z-axis direction, the space required for the optical system is reduced, and the housing 100 can be miniaturized.

[0099] In addition, such as Figure 15 As shown, the operation unit 32 and the region A1, which is configured with a plurality of light-emitting elements 10, are positioned overlapping each other on the optical axis of the light-receiving element 21. Therefore, when the user operates the operation unit 32, a force is applied directly to the optical axis of the light-receiving element 21, thus the optical axis of the light-receiving element 21 is less prone to wobbling or shifting relative to the image IMG. Furthermore, in this embodiment, the plurality of light-emitting elements 10 are disposed on the surface 102R of the second substrate 102 in a manner that surrounds the opening 140; therefore, region A1 is the region containing the smallest circle of each configuration area of ​​the plurality of light-emitting elements 10.

[0100] In addition, such as Figure 15 As shown, in the Z-axis direction orthogonal to the plane 104R of the fourth substrate 104 where the wireless communication module 31 is located, the display module 50 and the wireless communication module 31 do not overlap. Therefore, the possibility of the display module 50 causing a decrease in the receiving sensitivity of the wireless communication module 31 is reduced.

[0101] In addition, such asFigure 15 As shown, in the Z-axis direction, the first processor 30 and the light-receiving element 21 do not overlap with the power supply circuit 41. Therefore, the possibility that the characteristics of the light-receiving element 21 change due to heat emitted by the power supply circuit 41 is reduced, and the heat dissipation of the power supply circuit 41, the first processor 30, and the light-receiving element 21, each of which is a heat source, is improved.

[0102] 4. Effects

[0103] The image processing apparatus 1 of the present embodiment has been researched in various ways in terms of the arrangement of each component in order to solve at least one of various problems that arise due to the fact that it is equipped with the battery 70 and can be carried and operated as a single body.

[0104] One of the problems is to reduce the possibility that a malfunction occurs due to heat generated in the narrow space inside the small housing 100. In the image processing apparatus 1 of the present embodiment, the light-receiving element 21, the first processor 30, which operate during image processing and can be heat sources, are arranged on the first substrate 101. In addition, the plurality of light-emitting elements 10, the light-emitting element drive circuit 11, which operate during image processing and can be heat sources, are arranged on the second substrate 102. In addition, the power supply circuit 41, the second processor 40, which operate during image processing and can be heat sources, are arranged on the third substrate 103. In this way, in the image processing apparatus 1 of the present embodiment, each component that can be a heat source is dispersedly arranged on the first substrate 101, the second substrate 102, and the third substrate 103, and thus the heat influence of each component on the others is reduced, and the operation is stabilized.

[0105] Further, since the power supply circuit 41 does not overlap with the light-receiving element 21 in the Z-axis direction, the possibility that the characteristics of the light-receiving element 21 change due to heat emitted by the power supply circuit 41 is reduced, and the heat dissipation of the power supply circuit 41 and the light-receiving element 21, each of which is a heat source, is improved. Therefore, according to the image processing apparatus 1, the possibility that the accuracy of image processing performed in accordance with the amount of light received by the light-receiving element 21 is reduced is reduced, and the operation can be performed for a long time while ensuring a certain quality.

[0106] In addition, according to the image processing apparatus 1, the first processor 30, which can be a heat source, does not overlap with the power supply circuit 41 in the Z-axis direction, and thus the heat dissipation of the first processor 30 and the power supply circuit 41, each of which is a heat source, is improved.

[0107] Further, in the image processing apparatus 1, the wireless communication module 31 is provided on the fourth substrate 104 different from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light-receiving element 21, the plurality of light-emitting elements 10, and the power supply circuit 41 that can be heat sources are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31, which requires stable operation, is less likely to cause a malfunction due to the influence of heat.

[0108] Further, in the image processing apparatus 1, the battery 70 between the first substrate 101, the second substrate 102, and the third substrate 103 and the fourth substrate 104 functions as a thermal barrier, and heat generation of the first substrate 101, the second substrate 102, and the third substrate 103 is less likely to be transmitted to the fourth substrate 104. Therefore, according to the image processing apparatus 1, the wireless communication module 31 provided on the fourth substrate 104 is less likely to be affected by the temperature of the first substrate 101, the second substrate 102, and the third substrate 103 that sharply rises along with image processing, and stable communication quality can be ensured.

[0109] Further, as shown in FIG. 1, in the image processing apparatus 1, the battery 70 is provided on the fourth substrate 104 different from the first substrate 101, the second substrate 102, and the third substrate 103 on which the light-receiving element 21, the plurality of light-emitting elements 10, and the power supply circuit 41 that can be heat sources are respectively provided. Therefore, according to the image processing apparatus 1, the wireless communication module 31 is less likely to be affected by the temperature of the first substrate 101, the second substrate 102, and the third substrate 103 that sharply rises along with image processing, and stable communication quality can be ensured. Figure 5

[0110] ​Further, the wireless communication module 31 and the light emitting module 33, which act only for a short period of time when necessary and thus generate a small amount of heat, the operation section 32 and the buzzer 34, which generate almost no heat, are arranged on the fourth substrate 104 as necessary. Thus, the fourth substrate 104 generates heat for relaying a signal for display to the display module 50 during image processing, but at least one of the first substrate 101, the second substrate 102, and the third substrate 103 generates a larger amount of heat than the fourth substrate 104. In fact, the first substrate 101, the second substrate 102, and the third substrate 103 generate a larger amount of heat than the fourth substrate 104 as long as no special situation in which wireless communication or the like is frequently performed occurs. In this way, in the image processing device 1, the components that generate a relatively large amount of heat are arranged on the first substrate 101, the second substrate 102, and the third substrate 103, which have high heat dissipation properties, and the components that generate a relatively small amount of heat are arranged on the fourth substrate 104, which is less likely to be affected by heat. Thus, according to the image processing device 1, it is possible to improve heat dissipation properties while securing the capacity of the battery 70, and thus it is possible to perform work for a long time continuously while ensuring a certain quality.

[0111] Further, according to the image processing device 1, since the first processor 30, which can be a heat source, is arranged on the first substrate 101, which has high heat dissipation properties, it is possible to perform work for a long time continuously while ensuring a certain quality.

[0112] Further, according to the image processing device 1, since the second processor 40, which can be a heat source, is arranged on the third substrate 103, which has high heat dissipation properties, it is possible to perform work for a long time continuously while ensuring a certain quality.

[0113] It is also a subject to achieve good noise resistance and responsiveness. In the image processing device 1 of the present embodiment, since the first processor 30, which performs image processing, is arranged on the first substrate 101 on which the light receiving element 21 is arranged, a signal output from the light receiving element 21 is transmitted to the first processor 30 without passing through the second substrate 102, the third substrate 103, and the fourth substrate 104. Thus, according to the image processing device 1, it is possible to achieve good noise resistance and responsiveness.

[0114] Further, in the image processing device 1, the second processor 40, which performs power control, is arranged on the third substrate 103 on which the power supply circuit 41 is arranged, and thus a signal output from the second processor 40 is transmitted to the power supply circuit 41 without passing through other substrates. Thus, according to the image processing device 1, it is possible to achieve good noise resistance and responsiveness.

[0115] Further, according to the image processing device 1, the wireless communication module 31 is arranged in the fourth substrate 104 at an end region in the long side direction at a small distance from the inner wall surface of the housing 100, and thus is less likely to be affected by noise and it is possible to improve communication sensitivity.

[0116] Further, according to the image processing apparatus 1, the light-receiving element 21, the plurality of light-emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32 are respectively provided on different substrates, and thus, mutual interference of heat, vibration, signals, and the like is reduced, and the operation can be stabilized. Thus, according to the image processing apparatus 1, the possibility of a decrease in the accuracy of image processing due to mutual interference of heat, vibration, signals, and the like between the plurality of constituent elements is reduced, and the operation can be performed continuously for a long time while ensuring a certain quality.

[0117] Further, in the image processing apparatus 1, the wiring path from the third substrate 103 to the first substrate 101 is short, and thus, the amount of decrease in the voltage V3 supplied from the power supply circuit 41 provided on the third substrate 103 to the first substrate 101 is small. Thus, according to the image processing apparatus 1, a stable voltage can be supplied to the light-receiving element 21 provided on the first substrate 101, and thus, the possibility of a decrease in the accuracy of image processing is reduced.

[0118] Further, according to the image processing apparatus 1, the wiring path between the light-receiving element 21 and the photoelectric conversion circuit 22 is shortened, and the influence of noise on a small signal is reduced, and thus, the possibility of a decrease in the accuracy of image processing is reduced.

[0119] Further, according to the image processing apparatus 1, the wireless communication module 31 does not overlap the display module 50 in the direction orthogonal to the fourth substrate 104, and thus, the possibility of a decrease in reception sensitivity due to the display module 50 is reduced.

[0120] Improving the operability and convenience for the user is also one of the problems. In the image processing apparatus 1 of the present embodiment, the first substrate 101 is provided between the third substrate 103 and the second substrate 102 in the Z-axis direction, the third substrate 103 is provided between the battery 70 and the first substrate 101, the battery 70 is located between the third substrate 103 and the fourth substrate 104, and the battery 70 overlaps the third substrate 103. Thus, according to the image processing apparatus 1, the second substrate 102, the first substrate 101, the third substrate 103, the battery 70, and the fourth substrate 104 are sequentially overlapped and arranged, and thus, the width of the housing 100 in the X-axis direction and the Y-axis direction can be made smaller than the height in the Z-axis direction. Thus, the user can easily recognize the position of the light-receiving element 21, and the operability of the image processing apparatus 1 is improved.

[0121] Further, according to the image processing apparatus 1, in the Z-axis direction, the opening portion 140 of the second substrate 102, the wavelength variable filter 20, and the light-receiving element 21 overlap, and the plurality of light-emitting elements 10 are arranged so as to surround the opening portion 140, and thus, the space required for the arrangement of the optical system is reduced, and thus, the housing 100 can be downsized.

[0122] Further, in the image processing apparatus 1, the operation section 32, the buzzer 34, and the light emitting module 33 which generate little heat hardly affect the communication quality, and thus, by disposing the operation section 32, the buzzer 34, and the light emitting module 33 on the fourth substrate 104 on which the wireless communication module 31 is disposed, the area of the fourth substrate 104 is effectively utilized. Further, the display module 50 which generates less heat than the first substrate 101, the second substrate 102, and the third substrate 103 has less influence on the communication quality, and thus, the fourth substrate 104 on which the wireless communication module 31 is disposed is also effectively used as a relay substrate which relays a signal for display to the display module 50. Therefore, according to the image processing apparatus 1, the housing 100 can be downsized, and the operability of the user can be improved.

[0123] Further, in the image processing apparatus 1, the operation section 32 disposed on the fourth substrate 104, the area Al of the second substrate 102 on which the plurality of light emitting elements 10 are disposed, and the light receiving element 21 overlap on the optical axis of the light receiving element 21, and thus, when the user operates the operation section 32, a force is directly applied to the optical axis of the light receiving element 21. Therefore, according to the image processing apparatus 1, when the user operates the operation section 32, the optical axis of the light receiving element 21 is less likely to shake or shift with respect to the image IMG of the processing target, and the probability of obtaining normal data can be improved.

[0124] For example, when the operation section 32 is a physically displaced button, the operation section 32 is physically displaced by the user's operation, and thus, it can be reliably recognized that the user has operated, and on the other hand, although a large force is applied by the user's operation, the optical axis of the light receiving element 21 is less likely to shake or shift.

[0125] Further, for example, when the operation section 32 is an electrostatic capacitance type button, the operation is detected by the user touching the operation section 32, and thus, the force applied by the user's operation is small, and the optical axis of the light receiving element 21 is even less likely to shake or shift.

[0126] Further, according to the image processing apparatus 1, since the operation section 32 is disposed at the central portion in the short side direction of the fourth substrate 104, the user easily operates, and the operability is improved. Further, since the operability is improved, when the user operates the operation section 32, the optical axis of the light receiving element 21 is even less likely to shake or shift with respect to the image IMG of the processing target.

[0127] Further, according to the image processing apparatus 1, the user can recognize that the operation section 32 has been operated according to the light emission state of the light emitting module 33 even without applying a large force required or more, and thus, the amount of shaking or shifting of the optical axis of the light receiving element 21 is reduced, and the probability of obtaining normal data can be improved.

[0128] Further, according to the image processing apparatus 1, the user can recognize that the operation failure has occurred through the buzzer sound, and quickly re-performs the operation of the operation section 32, so that the convenience of the user is improved.

[0129] Further, according to the image processing apparatus 1, the user can recognize that the operation failure has occurred through the buzzer sound, and quickly re-performs the operation of the operation section 32, so that the convenience of the user is improved.

[0130] Improvement of maintainability is also one of the problems. In the image processing apparatus 1 of the present embodiment, the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32 are respectively provided on different substrates. Therefore, according to the image processing apparatus 1 of the present embodiment, when a failure occurs in any one of the light receiving element 21, the plurality of light emitting elements 10, the power supply circuit 41, the wireless communication module 31, and the operation section 32, only one substrate needs to be replaced, and the other three substrates do not need to be replaced, so that the maintainability is good.

[0131] Further, according to the image processing apparatus 1, since the light emitting element driving circuit 11 and the plurality of light emitting elements 10 are provided on the second substrate 102, when a failure occurs in at least one of them, the second substrate 102 can be replaced with a substrate in which another light emitting element driving circuit and another light emitting element are combined and the characteristics are checked, so that the maintainability is good.

[0132] Further, according to the image processing apparatus 1, since the light receiving element 21 and the photoelectric conversion circuit 22 are provided on the sub-substrate 113 of the first substrate 101, when a failure occurs in at least one of them, the sub-substrate 113 of the first substrate 101 can be replaced with a substrate in which another light receiving element and another photoelectric conversion circuit are combined and the characteristics are checked, so that the maintainability is good.

[0133] As described above, according to the image processing apparatus 1 of the present embodiment, at least one of various problems that are easily caused since the battery 70 is provided and the image processing apparatus 1 can be carried or act as a single body can be solved.

[0134] The present application is not limited to the present embodiment, and various modifications can be made within the scope of the gist of the present application.

[0135] For example, as the image processing apparatus to which the present application is applied, a color measurement apparatus is exemplified in the above-described embodiment, but the present application can be applied to various image processing apparatuses having a function of processing an image, in addition to the color measurement apparatus. As an example of the image processing apparatus to which the present application can be applied, for example, a mobile terminal such as a smartphone, a portable printer, a portable scanner, a portable display apparatus, a digital camera, and the like can be exemplified.

[0136] The above describes the present embodiment or the modified example, but the present application is not limited to these present embodiment or the modified example, and can be implemented in various ways without departing from the gist thereof. For example, each of the above-described embodiments and the modified examples can be appropriately combined.

[0137] The present application includes a configuration substantially the same as the configuration described in the embodiments, for example, a configuration having the same function, method, and result, or a configuration having the same purpose and effect. In addition, the present application includes a configuration in which a non-essential part of the configuration described in the embodiments is replaced. In addition, the present application includes a configuration that can achieve the same effect as the configuration described in the embodiments or a configuration that can achieve the same purpose. In addition, the present application includes a configuration in which a publicly known technology is added to the configuration described in the embodiments.

[0138] The following can be derived from the above-described embodiments and the modified examples.

[0139] One embodiment of an image processing apparatus has:

[0140] a light-receiving element;

[0141] a light-emitting element;

[0142] a battery;

[0143] a power supply circuit electrically connected to the battery;

[0144] a wireless communication module;

[0145] a first substrate provided with the light-receiving element;

[0146] a second substrate provided with the light-emitting element;

[0147] a third substrate provided with the power supply circuit;

[0148] a fourth substrate provided with the wireless communication module; and

[0149] a housing that accommodates the first substrate, the second substrate, the third substrate, and the fourth substrate,

[0150] the battery is located between the first substrate, the second substrate, the third substrate, and the fourth substrate.

[0151] In the image processing apparatus, the wireless communication module is provided on a fourth substrate that is separate from first, second, and third substrates on which light-receiving elements, light-emitting elements, and power supply circuits that can be heat sources are respectively provided. In addition, a battery that is located between the first, second, and third substrates and the fourth substrate functions as a thermal barrier, and heat generation of the first, second, and third substrates is less likely to be transmitted to the fourth substrate. Therefore, according to the image processing apparatus, the wireless communication module provided on the fourth substrate is less likely to be affected by a temperature rise of the first, second, and third substrates accompanying image processing, and the possibility of causing a malfunction is reduced, and thus stable communication quality can be ensured.

[0152] In one embodiment of the image processing apparatus, it can be that:

[0153] The image processing apparatus has an operation section,

[0154] The operation section is provided on the fourth substrate.

[0155] In the image processing apparatus, the operation section that generates little heat does not affect the communication quality, and thus, by providing the operation section on the fourth substrate on which the wireless communication module is provided, an area of the fourth substrate is effectively used. Therefore, according to the image processing apparatus, downsizing of the housing can be achieved, and operability for a user can be improved.

[0156] In one embodiment of the image processing apparatus, it can be that:

[0157] The fourth substrate has a first side, a second side that is longer than the first side, a third side that is opposite to the first side, and a fourth side that is opposite to the second side,

[0158] The operation section is provided at a position that overlaps a virtual line that is equidistant from the second side and the fourth side.

[0159] According to the image processing apparatus, since the operation section is provided at a central portion in a short side direction of the fourth substrate, a user is likely to operate, and operability is improved.

[0160] In one embodiment of the image processing apparatus, it can be that:

[0161] The fourth substrate has a first side, a second side that is longer than the first side, a third side that is opposite to the first side, and a fourth side that is opposite to the second side,

[0162] The wireless communication module is provided in an end portion region that is closer to the first side than to the third side.

[0163] According to the image processing apparatus, the wireless communication module is disposed in the fourth substrate in an end region of the long side direction at a small distance from the wall surface of the housing, so the wireless communication module is less likely to be affected by noise, and the communication sensitivity can be improved.

[0164] In one embodiment of the image processing apparatus, the image processing apparatus can also include:

[0165] The image processing apparatus includes a buzzer,

[0166] The buzzer is disposed in the fourth substrate.

[0167] In the image processing apparatus, the buzzer, which generates little heat, has little effect on the communication quality, so the fourth substrate, in which the wireless communication module is disposed, is effectively used. Thus, according to the image processing apparatus, the housing can be made smaller, and the operability of the user can be improved.

[0168] In one embodiment of the image processing apparatus, the image processing apparatus can also include:

[0169] The image processing apparatus includes a display module,

[0170] The fourth substrate functions as a relay substrate that relays a signal for display to the display module.

[0171] In the image processing apparatus, the display module, which generates less heat than the first substrate, the second substrate, and the third substrate, has little effect on the communication quality, so the fourth substrate, in which the wireless communication module is disposed, is effectively used as a relay substrate. Thus, according to the image processing apparatus, the housing can be made smaller, and the operability of the user can be improved.

[0172] In one embodiment of the image processing apparatus, the image processing apparatus can also include:

[0173] The image processing apparatus includes a light-emitting module for status display,

[0174] The light-emitting module is disposed in the fourth substrate.

[0175] In the image processing apparatus, the light-emitting module for status display, which generates little heat, has little effect on the communication quality, so the fourth substrate, in which the wireless communication module is disposed, is effectively used. Thus, according to the image processing apparatus, the housing can be made smaller, and the operability of the user can be improved.

Claims

1. An image processing apparatus characterized by comprising: A light-receiving element; A light-emitting element; A battery; A power supply circuit electrically connected to the battery; A wireless communication module; A first substrate provided with the light-receiving element; A second substrate provided with the light-emitting element; A third substrate provided with the power supply circuit; A fourth substrate provided with the wireless communication module; and A housing that accommodates the first substrate, the second substrate, the third substrate, and the fourth substrate, The battery is located between the first substrate, the second substrate, and the third substrate and the fourth substrate, The closer the portion of the battery opposite the fourth substrate is to the fourth substrate, the smaller the cross-sectional area, The fourth substrate is disposed at a position closest to the upper surface of the housing.

2. The image processing apparatus according to claim 1, wherein The image processing apparatus has an operation section, The operation section is disposed on the fourth substrate.

3. The image processing apparatus according to claim 2, wherein The fourth substrate has a first side, a second side longer than the first side, a third side opposite the first side, and a fourth side opposite the second side, The operation section is disposed at a position overlapping a virtual line equidistant from the second side and the fourth side.

4. The image processing apparatus according to claim 1 or 2, wherein The fourth substrate has a first side, a second side longer than the first side, a third side opposite the first side, and a fourth side opposite the second side, The wireless communication module is disposed in an end region closer to the first side than to the third side.

5. The image processing apparatus according to claim 1, wherein The image processing apparatus has a buzzer, The buzzer is disposed on the fourth substrate.

6. The image processing apparatus according to claim 1, wherein The image processing apparatus has a display module, The fourth substrate functions as a relay substrate that relays a signal for display to the display module.

7. The image processing apparatus according to claim 1, wherein The image processing apparatus has a light-emitting module for status display, The light-emitting module is disposed on the fourth substrate. ​ ​

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