Manufacturing Method of Encapsulated Circuit

Abstract

Embodiments of the present disclosure provide a method for manufacturing a packaged circuit, including: forming a circuit structure having a plurality of conductive pads; forming a liquid crystal layer on the circuit structure; performing a detection step, including determining the conduction status of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under an electric field; and removing the liquid crystal layer.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a method for manufacturing an electronic device, and more particularly to a method for manufacturing a packaged circuit. Background Art

[0002] With the continuous expansion of the application of electronic devices with packaged circuits, the requirements for the manufacturing yield quality of packaged circuits are getting higher and higher. Therefore, the manufacturing methods (including detection methods) of the packaged circuits of electronic devices must be continuously updated and adjusted. Summary of the Invention

[0003] According to an embodiment of the present disclosure, a method for manufacturing a packaged circuit includes the following steps. Form a circuit structure having a plurality of conductive pads. Form a liquid crystal layer on the circuit structure. Perform a detection step, including judging the conduction status of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under an electric field. And, remove the liquid crystal layer. Brief Description of the Drawings

[0004] Figure 1 A cross-sectional schematic diagram of a packaged circuit in a detection step according to an embodiment of the present disclosure;

[0005] Figure 2 A cross-sectional schematic diagram of a packaged circuit before cutting according to an embodiment of the present disclosure;

[0006] Figure 3 For Figure 2 A cross-sectional schematic diagram of the cross-section A-A' of the packaged circuit before cutting;

[0007] Figure 4 A cross-sectional schematic diagram of a packaged circuit in a detection step according to another embodiment of the present disclosure;

[0008] Figure 5 A cross-sectional schematic diagram of a packaged circuit in a detection step according to another embodiment of the present disclosure;

[0009] Figure 6 A cross-sectional schematic diagram of a packaged circuit in a detection step according to another embodiment of the present disclosure;

[0010] Figure 7 A flowchart of a method for manufacturing a packaged circuit according to another embodiment of the present disclosure;

[0011] Figure 8 A partial enlarged three-dimensional schematic diagram of a circuit structure according to another embodiment of the present disclosure;

[0012] Figure 9 A flowchart of a method for manufacturing a packaged circuit according to another embodiment of the present disclosure;

[0013] Figure 10A flowchart of a method for manufacturing a packaged circuit according to another embodiment of the present disclosure;

[0014] Figure 11 A flowchart of a method for manufacturing a packaged circuit according to still another embodiment of the present disclosure. Detailed implementation manners

[0015] The present disclosure can be understood by referring to the following detailed description and in conjunction with the accompanying drawings. It should be noted that, for the convenience of the reader's understanding and for the simplicity of the drawings, only a part of the electronic device is shown in the multiple drawings of the present disclosure, and the specific elements in the drawings are not drawn to actual scale. In addition, the number and size of each element in the drawings are only for illustration and are not used to limit the scope of the present disclosure.

[0016] Certain terms will be used throughout the specification and the appended claims to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may refer to the same element by different names. This document is not intended to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "comprising", "including", "having" are open-ended words, and thus should be interpreted as meaning "including but not limited to...". Therefore, when the description of the present disclosure uses the terms "comprising", "including" and / or "having", it specifies the presence of the corresponding features, regions, steps, operations and / or components, but does not exclude the presence of one or more corresponding features, regions, steps, operations and / or components.

[0017] The directional terms mentioned herein, such as: "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions in the drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. In the drawings, each drawing shows the general characteristics of the methods, structures and / or materials used in specific embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses and positions of each film layer, region and / or structure may be reduced or enlarged.

[0018] It should be understood that when a component or a film layer is referred to as "connected to" another component or film layer, it can be directly connected to this other component or film layer, or there are inserted components or film layers between the two. When a component is referred to as "directly connected to" another component or film layer, there are no inserted components or film layers between the two. Additionally, when a member is referred to as "coupled to another member (or its variant)", it can be directly connected to this other member or indirectly connected (e.g., electrically connected) to this other member through one or more members.

[0019] In this disclosure, the length and width can be measured by an optical microscope, and the thickness can be measured from a cross-sectional image in an electron microscope, but not limited thereto. Additionally, there may be a certain error between any two values or directions being compared.

[0020] The terms “about,” “equal to,” “equivalent to,” or “the same as,” “substantially,” or “substantially the same as” are generally interpreted to be within 20% of the given value or range, or within 10%, 5%, 3%, 2%, 1%, or 0.5% of the given value or range.

[0021] In this disclosure, when a structure (or layer, component, substrate) described herein is located on another structure (or layer, element, substrate), it may mean that the two structures are adjacent and directly connected, or it may mean that the two structures are adjacent but not directly connected. Not being directly connected means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate spacer) between the two structures. The lower surface of one structure is adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure is adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single-layer or multi-layer solid structure or non-solid structure, without limitation. In this disclosure, when a certain structure is disposed “on” other structures, it may mean that a certain structure is “directly” on other structures, or it may mean that a certain structure is “indirectly” on other structures, that is, there is at least one structure sandwiched between a certain structure and other structures.

[0022] “First,” “second,” etc. in the specification of this disclosure can be used herein to describe various elements, components, regions, layers, and / or parts, but these elements, components, regions, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, the “first element,” “component,” “region,” “layer,” or “part” discussed below is used to distinguish from the “second element,” “component,” “region,” “layer,” or “part,” rather than to limit the order or specific element, component, region, layer, and / or part.

[0023] In this disclosure, the thickness, length, and width can be measured by an optical microscope, and the thickness can be measured from a cross-sectional image in an electron microscope, but not limited thereto. Additionally, there may be a certain error between any two values or directions being compared. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction can be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.

[0024] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that such terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0025] It should be noted that the technical solutions provided in different embodiments hereinafter can be replaced, combined, or used in combination with each other to form another embodiment without violating the spirit of this disclosure.

[0026] An electronic device having the packaged circuit of the embodiments of this disclosure can achieve the effects of various applications. The electronic device can include a display device, an antenna device, a sensing device, a splicing device, or a transparent display device, but is not limited thereto. The electronic device can be a rollable, stretchable, bendable, or flexible electronic device. The electronic device can, for example, include liquid crystal, light emitting diode (LED), quantum dot (QD), fluorescence, phosphor, or other suitable materials, and their materials can be arranged and combined arbitrarily or other suitable display media, or a combination of the foregoing; the light emitting diode can, for example, include organic light emitting diode (OLED), mini LED, micro LED, or quantum dot light emitting diode (QD, which can be, for example, QLED, QDLED), but is not limited thereto. The antenna device can, for example, be a liquid crystal antenna, but is not limited thereto. The splicing device can, for example, be a display splicing device or an antenna splicing device, but is not limited thereto. It should be noted that the shape of the electronic device (including the packaged circuit) can be rectangular, circular, polygonal, a shape with curved edges, or other suitable shapes. The following will describe the content of this disclosure with reference to the packaged circuit, but this disclosure is not limited thereto.

[0027] In this disclosure, the various embodiments described below can be used in combination without departing from the spirit and scope of this disclosure. For example, some features of one embodiment can be combined with some features of another embodiment to form another embodiment.

[0028] Now, reference will be made in detail to the exemplary embodiments of this disclosure. Examples of the exemplary embodiments are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to represent the same or similar parts.

[0029] Figure 1The cross-sectional schematic diagram of the packaging circuit according to an embodiment of the present disclosure in the detection step. For the clarity and convenience of illustration of the drawings, Figure 1 several elements are omitted from showing. Please refer to Figure 1 , the packaging circuit 10 of the present disclosure includes a substrate 100 and a circuit structure RD. The circuit structure RD includes, for example, a redistribution layer structure (RDL). In the manufacturing method of the packaging circuit 10 in some embodiments, the redistribution layer structure can be electrically detected, for example, before performing the electronic component coupling process. The electronic components include, for example, integrated circuits (ICs), but are not limited thereto. The manufacturing method of the packaging circuit according to the embodiment of the present disclosure includes a detection step to reduce the coupling of electronic components (such as integrated circuits) to a circuit structure RD with poor conduction conditions. Thereby, the manufacturing method of the packaging circuit 10 has the effect of simplifying the process or reducing the cost. The steps of the manufacturing method of the packaging circuit 10 are briefly described below.

[0030] First, a substrate 100 is provided. The substrate 100 of the packaging circuit 10 can include a rigid substrate, a flexible substrate, or a combination of the foregoing. The material of the substrate 100 can include, for example, glass, quartz, ceramic, sapphire, plastic, polycarbonate (PC), polyimide (PI), polypropylene (PP), or polyethylene terephthalate (PET), other suitable materials, or a combination of the foregoing materials, but is not limited thereto. The light transmittance of the substrate 100 is not limited, and the substrate 100 can be a light-transmitting substrate, a semi-light-transmitting substrate, or an opaque substrate.

[0031] Next, in the normal direction Z of the surface of the substrate 100, a circuit structure RD is formed on the substrate 100. The circuit structure RD has a plurality of conductive pads. Specifically, the circuit structure RD includes an interconnection structure 120 disposed on the substrate 100 and a plurality of conductive pads 141, 142 disposed on the interconnection structure 120, but is not limited thereto. In some embodiments, the interconnection structure 120 is, for example, a lower circuit layer in the circuit structure RD. The interconnection structure 120 includes a stack (not shown) of a plurality of dielectric layers and a plurality of conductive layers stacked alternately, but is not limited thereto. The dielectric layer may include a single-layer or multi-layer structure, and its material may include an organic material, an inorganic material, or a combination of the foregoing, but is not limited thereto. The organic material may include polyethylene terephthalate (PET), polyethylene (PE), polyethersulfone (PES), polycarbonate (PC), polymethylmethacrylate (PMMA), polyimide (PI), photosensitive polyimide (PSPI), or a combination of the foregoing, and the inorganic material may include silicon nitride, silicon oxide, silicon oxynitride, or a combination of the foregoing, but is not limited thereto. The conductive layer may be a single-layer conductive material or a stack of multi-layer conductive materials. The material of the conductive layer may include molybdenum (Mo), nickel (Ni), chromium (Cr), tungsten (W), aluminum (Al), titanium (Ti), copper (Cu), tin (Sn), silver (Ag), gold (Au), other suitable metals, or alloys or combinations of the above materials. In some embodiments, the multi-layer conductive layers may be separated by a plurality of dielectric layers respectively, and the multi-layer conductive layers may be electrically connected to each other through a plurality of connection structures (not shown) penetrating the dielectric layers, but is not limited thereto.

[0032] In some embodiments, a plurality of conductive pads (such as conductive pads 141 and 142) are disposed on the interconnection structure 120. Specifically, an insulating layer 130 is disposed or formed on the interconnection structure 120. The insulating layer 130 may be patterned to have a plurality of openings (not labeled), and a plurality of conductive pads (such as conductive pads 141 and 142) may be respectively corresponding to and disposed in the openings of the insulating layer 130. The plurality of conductive pads (such as conductive pads 141 and 142) may be respectively coupled to the conductive layers in the interconnection structure 120, but is not limited thereto. Figure 1The number of the shown conductive pads does not limit the embodiments of the present disclosure, and the number of the conductive pads can be increased or decreased according to the needs of the user. In some embodiments, the conductive pads are, for example, conductive bumps of the circuit structure RD, and the conductive pads will be coupled to electronic components (such as integrated circuits) in subsequent processes.

[0033] In some embodiments, the material of the conductive pads can be similar to the conductive layer in the above-described interconnect structure 120, and for example, includes molybdenum, nickel, chromium, cobalt, zirconium, tungsten, aluminum, titanium, copper, tin, silver, gold, other suitable metals, or alloys or combinations of the above materials. The conductive pads (such as conductive pad 141 and conductive pad 142) can be a single-layer metal layer or a stacked structure of multiple metal layers, but are not limited thereto.

[0034] In some embodiments, the top surfaces of different conductive pads (such as conductive pad 141 and conductive pad 142) can be flush or non-flush. For example, as Figure 1 , the top surface of conductive pad 141 and the top surface of conductive pad 142 can be non-flush.

[0035] In some embodiments, the thickness T1 of conductive pad 141 can be the same as or different from the thickness T2 of conductive pad 142, but is not limited thereto. The thickness T1 and the thickness T2 can be defined as the maximum thickness of the conductive pad in the normal direction Z of the surface of the substrate 100.

[0036] In some embodiments, after the circuit structure RD is completed, the packaged circuit 10 can perform processes such as coupling of electronic components (such as integrated circuits) and be applied to the semiconductor field, the display field, or other electronic device fields. Before performing the above-described coupling process of the electronic components (such as integrated circuits), a detection step can be performed first to determine the electrical quality of the conductive pads (such as conductive pad 141 and conductive pad 142) to reduce the risk of setting the electronic components (such as integrated circuits) on the packaged circuit that does not meet the electrical quality requirements.

[0037] In the present embodiment, before performing the detection step, a liquid crystal layer LC is formed on the circuit structure RD. In some embodiments, the liquid crystal layer LC includes, for example, polymer-dispersed liquid crystal (PDLC), cholesteric liquid crystal, polymer liquid crystal, dye-doped liquid crystal, electrophoretic display medium, other suitable materials, or combinations of the above. In some embodiments, the liquid crystal molecules included in the liquid crystal layer LC include negative liquid crystals or positive liquid crystals.

[0038] In some embodiments, after the liquid crystal layer LC is disposed on the circuit structure RD, a curing process may be selectively performed according to the material characteristics of the liquid crystal layer LC to complete the setting of the liquid crystal layer LC. In some embodiments, the liquid crystal layer LC may entirely or partially cover the circuit structure RD (the conductive pads 141 and 142). The liquid crystal layer LC may have a thickness T3, which may be defined as the maximum thickness of the liquid crystal layer LC in the normal direction Z of the surface of the substrate 100. In some embodiments, the thickness T3 of the liquid crystal layer LC may be 2 micrometers to 50 micrometers (for example: 2 micrometers ≤ thickness T3 ≤ 50 micrometers) or 5 micrometers to 30 micrometers (5 micrometers ≤ thickness T3 ≤ 30 micrometers), but not limited thereto. In some embodiments, a plurality of spacers (not shown in the figure) may be disposed in the liquid crystal layer LC, and the spacers may be used to maintain the thickness of the liquid crystal layer, but not limited thereto.

[0039] Next, a transparent conductive layer 160 is formed on the liquid crystal layer LC. The material of the transparent conductive layer 160 includes indium tin oxide (ITO), indium oxide (In 2 O 3 ), tin oxide (SnO 2 ), zinc oxide (ZnO), other suitable materials, or a combination of the above, but not limited thereto.

[0040] Next, a detection device 200 is provided. The detection device 200 is, for example, a detector head. In some embodiments, the detection device 200 may include a sensor 202. The sensor 202 includes, for example, a photosensor, an image sensor, or other suitable sensors. In some embodiments, a photosensor, an image sensor, or other suitable sensors are used to detect the result of the rotation of the liquid crystal layer LC.

[0041] Next, a detection step is performed. The detection step includes, first, providing a power signal to apply a preset voltage to at least one of the plurality of conductive pads (including the conductive pad 141 or the conductive pad 142) and the transparent conductive layer 160 respectively to generate an electric field. Figure 1For example, by applying a preset voltage to different conductive pads respectively, a vertical electric field can be generated between these conductive pads and the transparent conductive layer 160. Then, when these conductive pads receive the preset voltage as expected and an electric field is generated, this electric field will change the arrangement of liquid crystal molecules (not labeled) in the liquid crystal layer LC. For example, the liquid crystal molecules can rotate according to the electric field according to their characteristics. Then, a directional light source 300 can be selectively used as the detection light for the detection circuit structure RD. In some embodiments, the light source 300 can also be a non-directional light source, such as including ambient light, but not limited thereto. Then, the user can judge the conduction status of a plurality of conductive pads (including the conductive pad 141 or the conductive pad 142) according to the result of the rotation of the liquid crystal molecules in the liquid crystal layer LC under the action of the electric field.

[0042] In the detection step of some embodiments, the conduction status or electrical quality of these conductive pads can be determined by detecting the degree of reflection of the detection light by a plurality of conductive pads (including conductive pad 141 or conductive pad 142). For example, taking the voltage value received by conductive pad 141 being close to the predetermined voltage value (i.e., the circuit connected to conductive pad 141 may be normally conductive), and the voltage value received by conductive pad 142 being lower than the predetermined voltage value (i.e., a short circuit may occur in the circuit connected to conductive pad 142 and the predetermined voltage value cannot be received) as an illustration, the liquid crystal layer LC between conductive pad 141 and the transparent conductive layer 160 will be rotated as expected by the electric field (such as a vertical electric field) generated between conductive pad 141 and the transparent conductive layer 160, enabling the detection light emitted by the light source 300 to pass through the liquid crystal layer LC and be reflected via conductive pad 141 (such as the surface of conductive pad 141). Additionally, since the voltage value received by conductive pad 142 is lower than the predetermined voltage value, an expected electric field (such as a vertical electric field) may not be generated between conductive pad 142 and the transparent conductive layer 160. Therefore, the liquid crystal layer LC located between conductive pad 142 and the transparent conductive layer 160 may not be rotated as expected (or the degree of rotation is not as expected), resulting in the amount of detection light passing through the liquid crystal layer LC between conductive pad 142 and the transparent conductive layer 160 being different from that of the liquid crystal layer LC between conductive pad 141 and the transparent conductive layer 160, and the amount of light reflected subsequently via conductive pad 142 (such as the surface of conductive pad 142) will also be different. The light reflected by the detection light on conductive pad 141 or conductive pad 142 can be detected and output by the sensor 202 of the detection device 200. The reflected light of conductive pad 141 or the reflected light of conductive pad 142 can be presented as an image or numerical text respectively, thereby determining the conduction status of different conductive pads and the circuits they are respectively connected to, to determine whether there is a short circuit problem. Specifically, since the voltage of conductive pad 141 is close to the predetermined voltage value, the liquid crystal molecules in the liquid crystal layer LC corresponding to (or located between) conductive pad 141 are rotated by the electric field, allowing more detection light to pass through and be reflected via conductive pad 141. These reflected lights are, for example, the first reflected lights. Since the voltage of conductive pad 142 is lower than the predetermined voltage value, the proportion of the liquid crystal molecules in the liquid crystal layer LC corresponding to (or located between) conductive pad 142 being rotated by the electric field is less, enabling less detection light to pass through and be reflected via conductive pad 142. These reflected lights are, for example, the second reflected lights. The image intensity (such as the brightness or darkness of the image light) or the numerical text generated by the first reflected light may be greater than that generated by the second reflected light. Compared with conductive pad 141, conductive pad 142 may display a darker image and be determined to not meet the expected standard. Therefore, the user can determine that the conduction status of the second conductive pad 142 is abnormal.The above description schematically explains the principle of judging the conduction status of these conductive pads in the detection step, and is not intended to limit the conduction status of the conductive pads 141 and 142 of the present disclosure.

[0043] In this way, the user can judge whether the conduction status of the conductive pad 141 or the conductive pad 142 meets the expected standard by the brightness or darkness of the above image or the magnitude of the value. If the judgment does not meet the expected standard, the conduction status of the conductive pad can be regarded as abnormal. In other embodiments, other methods of judging whether the conductive pad is conductive may be available depending on the stacking status of the packaging circuit or the choice of liquid crystal layer material.

[0044] It should be noted that the detection step of this case does not limit that different conductive pads (such as conductive pads 141 and 142) need to be applied with the same predetermined voltage (i.e., the same predetermined voltage value). In some embodiments, the predetermined voltage value of the conductive pad 141 and the predetermined voltage value of the conductive pad 142 can be different, and the conduction status of the conductive pad can be judged respectively according to the result of the brightness or darkness of the image or the magnitude of the value generated by each conductive pad in the detection step. In some embodiments, the detection step of this case does not limit that different conductive pads (such as conductive pads 141 and 142) need to be applied with a predetermined voltage at the same time point. Different conductive pads (such as conductive pads 141 and 142) can also be applied with a predetermined voltage at different time points respectively, and an electric field is generated between them and the transparent conductive layer 160 respectively, and the conduction status of the different conductive pads is judged respectively according to the result of the rotation of the corresponding liquid crystal layer LC under the electric field.

[0045] The manufacturing method of the packaging circuit 10 according to an embodiment of the present disclosure can form the liquid crystal layer LC on the circuit structure RD to be detected, and then judge the conduction status of the conductive pads 141 and 142 according to the result of the rotation of the liquid crystal molecules in the liquid crystal layer LC under the electric field. This detection method is a non-contact detection, which can reduce the risk of damage to the conductive pads (such as conductive pads 141 and 142) during detection. In addition, since the liquid crystal layer LC is disposed on the circuit structure RD, the detection distance H1 between the detection device 200 and the circuit structure RD can be unrestricted. The detection distance H1 is defined as the shortest distance between the detection surface of the detection device 200 and the top surface of the transparent conductive layer 160 (the surface adjacent to the detection device 200), but is not limited thereto. In some embodiments, the detection distance H1 between the detection device 200 and the circuit structure RD can be greater than 1 cm. In addition, since the manufacturing method of the packaging circuit 10 can perform the detection step during the manufacturing process, the probability of performing the electronic component coupling process on the packaging circuit that does not meet the specifications subsequently can be reduced, and the cost can be reduced or the quality can be improved.

[0046] In some embodiments, the method for manufacturing the encapsulated circuit 10 may optionally further include setting a polarizing element 210 on the liquid crystal layer LC (or the transparent conductive layer 160) before performing the detection step. For Figure 1 example, the polarizing element 210 is disposed between the liquid crystal layer LC and the detection device 200. In some embodiments, the polarizing element 210 is disposed between the transparent conductive layer 160 and the detection device 200. In some embodiments, the polarizing element 210 can be directly disposed on the transparent conductive layer 160, but not limited thereto. With the above settings of the polarizing element 210, the contrast between the bright and dark of the reflected light can be more significant, and the judgment sensitivity of the conduction state of the conductive pads in the detection step can be increased. In addition, in some embodiments (not shown), before the step of setting the liquid crystal layer LC, a liquid crystal alignment layer (not shown) can be selectively formed on the circuit structure RD according to the type of the liquid crystal layer LC, but not limited thereto.

[0047] Next, after the detection step is completed, the liquid crystal layer LC is removed. The method for removing the liquid crystal layer LC includes using acetone, alcohol or other suitable solvents to remove, but not limited thereto. In some embodiments, the method for removing the liquid crystal layer LC includes a physical tearing method, but not limited thereto. In some embodiments, the liquid crystal layer LC and / or the transparent conductive layer 160 can be disposed on a substrate, and then the substrate provided with the liquid crystal layer LC and / or the transparent conductive layer 160 (the substrate can be referred to the subsequent Figure 5 substrate 150) is disposed on the circuit structure RD, and the substrate (the substrate can be referred to the subsequent Figure 5 substrate 150) can be located between the circuit structure RD and the liquid crystal layer LC. After the detection step is completed as described above, the liquid crystal layer LC and the transparent conductive layer 160 can be removed together by tearing off the substrate (the substrate can be referred to the subsequent Figure 5 substrate 150), but not limited thereto. The above substrate may include a flexible substrate, such as a polyimide substrate or other suitable materials, but not limited thereto.

[0048] In some embodiments, the torn substrate (on which the liquid crystal layer LC and the transparent conductive layer 160 are provided) can be reused on other encapsulated circuits to be detected, thereby saving costs or omitting process procedures.

[0049] Other embodiments will be listed below for the description of the manufacturing method. It must be noted here that the following embodiments follow the component numbers and some contents of the foregoing embodiments, where the same numbers are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted part, reference can be made to the foregoing embodiments, and the following embodiments will not be repeated.

[0050] Figure 2 is a schematic cross-sectional view of the encapsulated circuit before cutting according to an embodiment of the present disclosure. Figure 3 isFigure 2 Schematic cross - sectional view of the cross - section line A - A' of the encapsulation circuit before cutting. For the clarity of the drawings and for convenience of description, Figure 2 and Figure 3 several elements are omitted from the illustration. The difference between the manufacturing method shown in this embodiment and the manufacturing method of the encapsulation circuit 10 of Figure 1 is that the manufacturing method of the encapsulation circuit further includes forming a frame adhesive 160 on the circuit structure RD, and the frame adhesive 160 can surround the liquid crystal layer LC.

[0051] The manufacturing method of the encapsulation circuit of this embodiment may include first forming a plurality of encapsulation circuits 20' before cutting on a substrate 100' (such as a mother board) before cutting, and then forming a plurality of single encapsulation circuits (such as Figure 1 the encapsulation circuit 10 shown) through a cutting process. Specifically, the manufacturing method of this embodiment includes: First, providing a substrate 100' (mother board) before cutting, which can be cut into multiple encapsulation components in subsequent processes, and these encapsulation components respectively have encapsulation circuits 20'.

[0052] Next, forming a plurality of circuit structures RD on the substrate 100'. Please refer to Figure 2 and Figure 3 simultaneously. The internal connection structure 120 is disposed on the substrate 100'. Then, conductive pads (such as conductive pad 141 and conductive pad 142) are disposed on the internal connection structure 120. In some embodiments, a plurality of encapsulation circuits 20' before cutting may be arranged successively on the X - axis and / or the Y - axis, but not limited thereto. The X - axis is substantially perpendicular to the Y - axis, and the X - axis or the Y - axis is perpendicular to the normal direction Z of the surface of the substrate 100. In some embodiments, a plurality of encapsulation circuits 20' before cutting may be arranged, for example, in an array or other ways. In some embodiments, a plurality of encapsulation circuits 20' before cutting may be arranged in multiple horizontal rows along the X - axis, or in multiple vertical columns along the Y - axis. For example, on the substrate 100' before cutting, there may be three horizontal rows and four vertical columns of encapsulation circuits 20' before cutting. It should be noted that Figure 2 the number and arrangement of the encapsulation circuits 20' before cutting shown are not used to limit this disclosure, and the number and arrangement of the encapsulation circuits that the mother board 100' can cut out can be adjusted according to the user's requirements.

[0053] Next, forming a frame adhesive 180 on the circuit structure RD, and the frame adhesive 180 can respectively surround at least one or more encapsulation circuits 20' before cutting. In some embodiments, the frame adhesive 180 can surround the conductive pads (such as conductive pad 141 and conductive pad 142) among the plurality of encapsulation circuits 20' before cutting. As Figure 2As shown, in the normal direction Z of the surface of the substrate 100, the outer shape of the sealant 180 may have a rectangular shape with arc angles, but is not limited thereto, and the sealant 180 may be designed with other outer shapes according to requirements. In some embodiments, the number of pre-cut encapsulation circuits 20' surrounded by the sealant 180 may also be more or less. The arrangement of the pre-cut encapsulation circuits 20' surrounded by the sealant 180 may include multiple horizontal rows or multiple multi-rows or a combination of the above, not limited to Figure 2 the number or arrangement shown. The material of the sealant 180 includes, for example, photosensitive photoresist, photosensitive resin, or thermosetting resin or other suitable materials, but is not limited thereto.

[0054] Next, a liquid crystal layer LC is formed on a plurality of conductive pads (such as conductive pad 141 and conductive pad 142), and the sealant 180 may surround the liquid crystal layer LC. In some embodiments, the height of the sealant 180 may be higher than that of the liquid crystal layer LC, so that the liquid crystal layer LC does not overflow outside the sealant 180.

[0055] Next, a transparent conductive layer 160 is formed on the liquid crystal layer LC. The transparent conductive layer 160 may be selectively disposed or not disposed on the sealant 180, but is not limited thereto.

[0056] Next, a polarizing element 210 may be selectively disposed on the liquid crystal layer LC. Then, a detection step is performed. As described above, a preset voltage is applied to the conductive pad 141 (and / or conductive pad 142) and the transparent conductive layer 160 respectively to generate an electric field (such as a vertical electric field) to rotate the liquid crystal molecules in the liquid crystal layer LC located between the conductive pad 141 (and / or conductive pad 142) and the transparent conductive layer 160. Then, the detection light of the light source 300 can partially pass through the polarizing element 210 and irradiate on the conductive pad 141 or the conductive pad 142 according to the rotation state of the liquid crystal molecules. Then, the above detection light reflects the light via the conductive pad 141 or the conductive pad 142, and these reflected lights can be detected by the sensor 202 of the detection device 200 and output an image or numerical text, but is not limited thereto. The user can judge whether the conduction state of the conductive pad 141 or the conductive pad 142 meets the expected standard by the brightness or darkness of the above image or the size of the numerical value.

[0057] Next, the user can perform a subsequent cutting step to separate a plurality of uncut encapsulation circuits 20' from each other, and can decide whether to couple an electronic component to the encapsulation circuit 20' according to the detection result of the foregoing conductive pad.

[0058] Figure 4 It is a cross-sectional schematic diagram of an encapsulation circuit in the detection step according to another embodiment of the present disclosure. For the clarity and convenience of illustration of the drawings, Figure 4 several elements are omitted from showing. The configuration of the encapsulation circuit 30 shown in this embodiment during the detection step is substantially similar to Figure 1The configuration of the encapsulation circuit 10 during the detection step is the same as that in the previous embodiment, so the same and similar components in the two embodiments will not be repeated here. The difference between this embodiment and the configuration for detecting the encapsulation circuit 10 mainly lies in that after the step of setting the liquid crystal layer LC (without setting the transparent conductive layer 160 on the liquid crystal layer LC), the detection device 200 is then provided and the detection step is performed.

[0059] The detection step of this embodiment includes, first, providing a power signal to apply a preset voltage to at least two adjacent ones of the plurality of conductive pads respectively to generate an electric field, and the voltages applied to at least two of the plurality of conductive pads can be different. At least two adjacent ones of the above-mentioned conductive pads are, for example, conductive pad 141 (adjacent to conductive pad 142) and conductive pad 142, or conductive pad 142 and conductive pad 143 (adjacent to conductive pad 142), but not limited thereto. For Figure 4 example, the user can apply a preset voltage to conductive pad 141 and conductive pad 142 respectively to generate an electric field (such as a horizontal electric field) between conductive pad 141 and conductive pad 142. The horizontal electric field is, for example, an electric field in the direction perpendicular to the normal direction Z of the surface of the substrate 100.

[0060] Next, the generated electric field (such as a horizontal electric field) will change the rotation of the liquid crystal molecules in the liquid crystal layer LC, for example, causing the liquid crystal molecules to rotate according to the direction of the electric field, but not limited thereto. Then, a directional light source 300 can be selectively used as the detection light. Next, similar to Figure 1 the embodiment of, the user can judge the conduction status of these conductive pads (including conductive pad 141, conductive structure 142 or conductive structure 143) according to the result of the rotation of the liquid crystal molecules in the liquid crystal layer LC under the electric field. The above-mentioned applying a preset voltage to conductive pad 141 and conductive pad 142 respectively, or applying a preset voltage to conductive pad 142 and conductive pad 143 (adjacent to conductive pad 142) respectively to generate an electric field can be, for example, tested at different time points by alternately detecting conductive pad 142 with different adjacent conductive pads (such as conductive pad 141 and conductive pad 143, but not limited thereto) respectively to obtain the conduction status of these conductive pads (including conductive pad 141, conductive structure 142 or conductive structure 143).

[0061] For example, it is described that the voltage value of the conductive pad 141 is lower than the predetermined voltage value, the voltage values of the conductive pad 142 and the adjacent conductive pad 143 are close to the predetermined voltage value, and the conductive pad 141 and the conductive pad 143 are respectively adjacent to the conductive pad 142 and located on opposite sides of the conductive pad 142. Since the rotation of the liquid crystal layer LC on the conductive pad 141 and the conductive pad 142 is less after being subjected to an electric field (horizontal electric field) (i.e., the liquid crystal molecules cannot reach the expected rotation degree), while the rotation of the liquid crystal layer LC on the conductive pad 142 and the conductive pad 143 is more after being subjected to the electric field (i.e., the liquid crystal molecules generally reach the expected rotation degree), the amount of the detection light passing through the liquid crystal layer LC above the conductive pad 141 and the conductive pad 142 is reduced. Therefore, the amount of the detection light reflected is lower than expected (i.e., the brightness detected by the detection device 200 is lower), and the amount of the detection light passing through the liquid crystal layer LC above the conductive pad 142 and the conductive pad 143 is more in line with expectations. Therefore, the amount of the detection light reflected can meet expectations (i.e., the brightness detected by the detection device 200 is more in line with expectations). Thus, the user can judge the conduction status of the conductive pads (including the conductive pad 141, the conductive structure 142, or the conductive structure 143) through the above-described alternating test comparison.

[0062] The manufacturing method of the above-described packaging circuit 30 is a non-contact detection technology, which reduces the risk of damage to the conductive pads during detection. The detection distance H1 between the detection device 200 and the circuit structure RD can be unrestricted. The manufacturing method of the packaging circuit 30 can achieve excellent technical effects similar to those of the above embodiments.

[0063] Figure 5 It is a cross-sectional schematic diagram of a packaging circuit in the detection step according to another embodiment of the present disclosure. For the clarity and convenience of the drawings, Figure 5 several elements are omitted from showing. The configuration of the packaging circuit 40 shown in this embodiment during the detection step is generally similar to Figure 1Configuration of the encapsulation circuit 10 during the detection step. Therefore, the same and similar components in the two embodiments will not be repeated here. The main difference between this embodiment and the configuration of the detection encapsulation circuit 10 lies in that the manufacturing method of the encapsulation circuit 40 may include disposing a substrate 150 between the circuit structure RD and the liquid crystal layer LC. For example, after the step of providing the circuit structure RD, the liquid crystal layer LC and / or the transparent conductive layer 160 are first formed on the substrate 150, and then the substrate 150 (on which the liquid crystal layer LC and / or the transparent conductive layer 160 have been formed) is disposed on the circuit structure RD, so that the substrate is disposed between the circuit structure RD and the liquid crystal layer LC and / or the transparent conductive layer 160. In some embodiments, the substrate 150 may include a flexible printed circuit board, such as polyimide (PI), polyethylene terephthalate (PET), other suitable materials, or a combination of the foregoing materials, but is not limited thereto. Under the above settings, after completing the detection step, the substrate 150 can be simply removed to remove the liquid crystal layer LC (and / or the transparent conductive layer 160). In some embodiments, the method of removing the substrate 150 includes physical tearing, but is not limited thereto. In this way, the stack structure of the substrate 150, the liquid crystal layer LC, and / or the transparent conductive layer 160 can be reused on other encapsulation circuits to be detected, thereby saving costs or omitting process procedures.

[0064] In some embodiments (not shown), an alignment layer (not shown in the figure) and a liquid crystal layer LC (and / or a transparent conductive layer 160) may be selectively formed on the substrate 150 first. The alignment layer may be located, for example, between the liquid crystal layer LC and the circuit structure RD, but is not limited thereto.

[0065] The manufacturing method of the above-mentioned encapsulation circuit 40 is a non-contact detection technology, which reduces the risk of damage to the conductive pads during detection. The detection distance H1 between the detection device 200 and the circuit structure RD is not limited. In addition, the manufacturing method of the encapsulation circuit 40 can also achieve excellent technical effects similar to those of the above embodiments.

[0066] Figure 6 It is a cross-sectional schematic view of the encapsulation circuit of another embodiment of the present disclosure during the detection step. For the clarity of the drawings and convenience of description, Figure 6 several elements are omitted from the illustration. The configuration of the encapsulation circuit 50 shown in this embodiment is generally similar to Figure 5 that of the encapsulation circuit 40. Therefore, the same and similar components in the two embodiments will not be repeated here. The main difference between this embodiment and the configuration of the encapsulation circuit 40 lies in that the manufacturing method of the encapsulation circuit 50 further includes disposing a substrate 170 on the transparent conductive layer 160 (and / or the liquid crystal layer LC).

[0067] For example, after the step of providing the circuit structure RD, first, the liquid crystal layer LC (and / or the transparent conductive layer 160) is formed on the substrate 150. The substrate 150 (on which the liquid crystal layer LC and / or the transparent conductive layer 160 has been formed) is disposed on the circuit structure RD. Then, the substrate 170 is formed on the liquid crystal layer LC and / or the transparent conductive layer 160, but not limited thereto.

[0068] In other embodiments, after the step of forming the circuit structure RD, first, the liquid crystal layer LC (and / or the transparent conductive layer 160) is formed on the substrate 170, and the substrate 170 (on which the liquid crystal layer LC and / or the transparent conductive layer 160 has been formed) is flipped so that the liquid crystal layer LC faces the circuit structure RD and is disposed on the circuit structure RD or the substrate 150 (the substrate 150 can be disposed on the circuit structure RD first after the formation of the circuit structure RD), such that the liquid crystal layer LC (and / or the transparent conductive layer 160) is disposed between the substrate 170 and the substrate 150, but not limited thereto. In this embodiment, the substrate 150 can be selectively not provided, that is, the substrate 150 may not be provided between the circuit structure RD and the liquid crystal layer LC.

[0069] In other embodiments, the liquid crystal layer LC and the transparent conductive layer 160 can also be formed on different substrates respectively first. For example, the liquid crystal layer LC is formed on the substrate 150, and the transparent conductive layer 160 is formed on the substrate 170. Subsequently, they can be disposed on the circuit structure RD according to the Figure 6 stacking sequence as follows.

[0070] In some embodiments, the materials of the substrate 150 and the substrate 170 can be the same or different. Under the above settings, after the detection step is completed, the substrate 150 and / or the substrate 170 can be simply removed to remove the liquid crystal layer LC and / or the transparent conductive layer 160 formed on the substrate 150 and / or the substrate 170.

[0071] Similarly, the method of removing the substrate 150 and / or the substrate 170 includes the way of physical tearing, but not limited thereto. In this way, the stack structure of the substrate 150, the liquid crystal layer LC, the transparent conductive layer 160, and / or the substrate 170 can be used on other packaged circuits to be detected. Thereby, it can be reused to simplify the process or save costs.

[0072] Under the above settings, the manufacturing method of the packaged circuit 50 can achieve the technology of non-contact detection, reducing the risk of damage to the conductive pads during detection. The detection distance H1 between the detection device 200 and the circuit structure RD can be unrestricted.

[0073] Hereinafter, the manufacturing process and the principle of the detection step will be simply described through Figure 7 and Figure 8 briefly.

[0074] Figure 7Flow chart of a manufacturing method of a packaged circuit according to another embodiment of the present disclosure. Figure 8 Partial enlarged perspective schematic diagram of a circuit structure according to another embodiment of the present disclosure. For clarity and convenience of illustration in the drawings, Figure 8 Several elements are omitted from the illustration. The manufacturing method 1100 of the circuit structure includes the following steps.

[0075] In step 1101, a substrate is provided.

[0076] In step 1102, a circuit structure is formed on the substrate, and the circuit structure has a plurality of conductive pads.

[0077] In step 1103, a liquid crystal layer is formed on the circuit structure.

[0078] Before performing step 1103, step 1104 can be selectively performed first. In step 1104, a sealant is formed on the circuit structure, and then step 1103 is performed to form a liquid crystal layer on the circuit structure, and the sealant surrounds the liquid crystal layer.

[0079] In step 1105, a transparent conductive layer is formed on the liquid crystal layer.

[0080] In step 1106, a preset voltage is applied to at least one of the plurality of conductive pads and the transparent conductive layer respectively to generate an electric field. In step 1106, the generated electric field is, for example, a vertical electric field, but is not limited thereto.

[0081] In step 1107, a detection step is performed, including judging the conduction state of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under the electric field.

[0082] Please refer to Figure 8 , a conductive pad 140 (which can be Figure 1 the conductive pad 141 or the conductive pad 142) is provided on the inner connection structure 120. Liquid crystal molecules LC' of the liquid crystal layer LC are formed on the inner connection structure 120 and / or the conductive structure 140. The transparent conductive layer 160 is provided on the liquid crystal molecules LC'. The conductive pad 140 and the transparent conductive layer 160 can be respectively coupled to the power supply device 400, and a preset voltage is applied to at least one of the plurality of conductive pads 140 and the transparent conductive layer 160 respectively via the power supply device 400. An electric field will be generated between the conductive pad 140 and the transparent conductive layer 160 that are subjected to the preset voltage, and the electric field will change the liquid crystal molecules LC' located between the conductive pad 140 and the transparent conductive layer 160, causing the liquid crystal molecules LC' to rotate according to the direction of the electric field. Subsequently, a directional light source 300 can be selectively used to emit a detection light, and the light beam L1 of the detection light can, for example, pass through the liquid crystal layer LC and be reflected by the conductive pad 140.

[0083] In some embodiments, for example, the liquid crystal layer includes dye liquid crystal molecules, and the rotation direction of the liquid crystal molecules LC’ can be in the direction parallel to the electric field. For example, when the conductive pad 140 is turned on to receive a preset voltage, an expected electric field (vertical electric field) can be generated between the conductive pad 140 and the transparent conductive layer 160. Therefore, the liquid crystal molecules LC’ located between the conductive pad 140 and the transparent conductive layer 160 can rotate approximately in the direction parallel to the electric field, and the rotation of the dye molecules can follow the direction of the liquid crystal molecules LC’. Thus, the light beam L1 of the detection light can penetrate the rotated liquid crystal molecules LC’ and / or dye molecules and be reflected by the conductive pad 140, and the reflected light L1’ reflected out can be detected by a detection device (such as Figure 1 as shown). In addition, other liquid crystal molecules LC’ and / or dye molecules not located between the conductive pad 140 and the transparent conductive layer 160 can rotate approximately not at all because they are farther away from the electric field. Therefore, the light beam L2 of the detection light passing through these regions of the liquid crystal molecules LC’ and / or dye molecules may be at least partially absorbed by the dye molecules, but not limited to this. Therefore, the user can judge the rotation result of the liquid crystal layer LC by observing the brightness of the reflected light L1’, and judge whether the conductive pad 140 is turned on to receive the preset voltage based on the rotation result of the liquid crystal layer LC. Through the above detection method, the probability of performing subsequent processes on non-conforming packaged circuits can be reduced. Thereby reducing costs or improving quality.

[0084] In step 1108, the liquid crystal layer is removed. In some embodiments, as described above, the removed liquid crystal layer and / or transparent conductive layer can be reused on other packaged circuits to be detected.

[0085] Figure 9 It is a flowchart of a manufacturing method of a packaged circuit according to another embodiment of the present disclosure. The manufacturing method 1200 of the circuit structure includes the following steps.

[0086] In step 1201, a substrate is provided.

[0087] In step 1202, a circuit structure is formed on the substrate, and the circuit structure has a plurality of conductive pads.

[0088] In step 1203, a liquid crystal layer is formed on the circuit structure.

[0089] Before performing step 1203, step 1204 can be selectively performed first. In step 1204, a sealing glue is formed on the circuit structure, and then step 1203 is performed to form a liquid crystal layer on the circuit structure, and the sealing glue surrounds the liquid crystal layer.

[0090] In step 1205, a preset voltage is applied to at least two adjacent ones of the plurality of conductive pads respectively to generate an electric field. In step 1205, the generated electric field is, for example, a horizontal electric field, but is not limited thereto.

[0091] In step 1206, a detection step is performed, including judging the conduction state of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under the action of the electric field.

[0092] In step 1207, the liquid crystal layer is removed. In some embodiments, the removed liquid crystal layer and the transparent conductive layer can be used on other packaging circuits to be detected. Thereby, the liquid crystal layer and / or the transparent conductive layer can be reused in the detection step, and thus the process can be simplified or the cost can be saved.

[0093] Figure 10 It is a flowchart of a manufacturing method of a packaging circuit according to another embodiment of the present disclosure. The manufacturing method 1300 of the circuit structure includes the following steps.

[0094] In step 1301, a substrate is provided.

[0095] In step 1302, a circuit structure is formed on the substrate, and the circuit structure has a plurality of conductive pads.

[0096] In step 1303, a liquid crystal layer (and / or a transparent conductive layer) is formed on a substrate, and the substrate (on which the liquid crystal layer and / or the transparent conductive layer has been formed) is then disposed on the circuit structure, so that the substrate is disposed between the circuit structure and the liquid crystal layer (and / or the transparent conductive layer).

[0097] In step 1304, a preset voltage is applied to at least one of the plurality of conductive pads and the transparent conductive layer respectively to generate an electric field (such as a vertical electric field). In step 1305, a detection step is performed, including judging the conduction state of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under the action of the electric field.

[0098] In step 1306, the liquid crystal layer is removed (or the substrate and the liquid crystal layer and / or the transparent conductive layer formed on the substrate are removed). In some embodiments, the removed liquid crystal layer and / or the transparent conductive layer can be reused on other packaging circuits to be detected. Thereby, the process is simplified or the cost is saved.

[0099] Figure 11 It is a flowchart of a manufacturing method of a packaging circuit according to still another embodiment of the present disclosure. The manufacturing method 1400 of the circuit structure includes the following steps.

[0100] In step 1401, a substrate is provided.

[0101] In step 1402, a circuit structure is formed on the substrate, and the circuit structure has a plurality of conductive pads.

[0102] In step 1403, the liquid crystal layer is first formed on the substrate, and then the substrate (on which the liquid crystal layer has been formed) is disposed on the circuit structure, such that the substrate is disposed between the circuit structure and the liquid crystal layer.

[0103] In step 1404, a preset voltage is applied to at least two adjacent ones of the plurality of conductive pads to generate an electric field (such as a horizontal electric field). In step 1405, a detection step is performed, including determining the conduction status of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under the action of the electric field.

[0104] In step 1406, the liquid crystal layer is removed (or the substrate and the liquid crystal layer formed on the substrate are removed). In some embodiments, the removed liquid crystal layer can be reused on other package circuits to be detected, thereby simplifying the process or saving costs.

[0105] In summary, in the manufacturing method of the package circuit according to an embodiment of the present disclosure, since the liquid crystal layer can be formed on the circuit structure to be detected, and then the conduction status of the conductive pads is determined according to the result of the rotation of the liquid crystal molecules in the liquid crystal layer under the action of the electric field, this detection method is a non-contact detection method, which can reduce the risk of damage to the conductive pads during detection. In addition, since the liquid crystal layer is disposed on the circuit structure, the distance between the detection device and the circuit structure is not limited. Furthermore, the detection step can be performed during the manufacturing process of the package circuit, which can reduce the probability of performing the electronic component coupling process on the package circuits that do not meet the specifications, reduce costs or improve quality.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing method of a packaged circuit, characterized in that, comprising: forming a circuit structure having a plurality of conductive pads, and the plurality of conductive pads are separated from each other and not in contact; forming a liquid crystal layer and a transparent conductive layer on a substrate, and disposing the substrate provided with the liquid crystal layer and the transparent conductive layer on the circuit structure, wherein the substrate is located between the circuit structure and the liquid crystal layer, and the liquid crystal layer is located between the transparent conductive layer and the circuit structure; performing a detection step, the detection step comprising: judging the conduction state of the plurality of conductive pads according to the result of the rotation of the liquid crystal layer under the action of an electric field; and after completing the detection step, removing the liquid crystal layer and the transparent conductive layer by tearing off the substrate.

2. The method according to claim 1, characterized in that, the transparent conductive layer is located on the liquid crystal layer.

3. The method according to claim 2, characterized in that, the detection step further comprises applying a preset voltage to at least one of the plurality of conductive pads and the transparent conductive layer respectively to generate the electric field.

4. The method according to claim 1, characterized in that, the detection step further comprises applying a preset voltage to at least two adjacent ones of the plurality of conductive pads respectively to generate the electric field.

5. The method according to claim 1, characterized in that, the method further comprises forming a frame adhesive on the circuit structure, and the frame adhesive surrounds the liquid crystal layer.

6. The method according to claim 1, characterized in that, the method further comprises disposing a polarizing element on the liquid crystal layer.

7. The method according to claim 1, characterized in that, the method further comprises using a directional light source as detection light in the detection step.

8. The method according to claim 1, characterized in that, the step of judging the conduction state of the plurality of conductive pads comprises detecting the result of the rotation of the liquid crystal layer with a photosensor.

9. The method according to claim 1, characterized in that, the liquid crystal layer comprises dye liquid crystal molecules.

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