Apparatus for processing a substrate

By combining batch and single-processing methods, the substrate processing apparatus solves the problems of pattern tilting and watermarking during substrate processing, achieving efficient and uniform substrate processing, especially for substrates with high aspect ratio patterns.

CN114582751BActive Publication Date: 2026-06-09SYSTEM ENGINEERING MEGA SOLUTION CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SYSTEM ENGINEERING MEGA SOLUTION CO LTD
Filing Date
2021-11-30
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing technologies have problems such as pattern tilting, watermarks, and uneven processing quality during substrate processing, especially when processing substrates with high aspect ratio patterns. Both batch processing and single processing methods have their shortcomings.

Method used

A substrate processing apparatus is designed that combines batch and single processing methods. Through the coordinated work of the first and second processing units, batch cleaning of multiple substrates and single drying of a single substrate are achieved. The attitude change component and transfer unit are used to optimize the attitude and position transfer of the substrate.

Benefits of technology

It improves the yield and uniformity of substrate processing quality, reduces the risk of pattern tilt and watermarks, and can effectively process substrates with high aspect ratio patterns.

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Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a first processing section that performs liquid processing on a plurality of substrates in a batch processing method, and a second processing section that processes the substrates that have been processed at the first processing section and performs liquid processing or dry processing on a single substrate in a single processing method.
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