Transfer equipment and transfer method

Abstract

A transfer device and a transfer method, the transfer device comprising a carrier, a bonding head, a sensor and a control unit. A substrate is suitable for being placed on the carrier and has a bonding surface. The bonding head is suitable for connecting a carrier, and a bearing surface of the carrier carries at least one electronic component. The sensor is suitable for measuring the distance between the bonding surface and the sensor and the distance between the bearing surface and the sensor to obtain an error value. The control unit is suitable for controlling the bonding head to adjust the angle of the bearing surface according to the error value, and is suitable for controlling the bonding head to bond the electronic component to the bonding surface.

Description

Technical Field

[0001] The present invention relates to a transfer device and a transfer method, and in particular to a transfer device and a transfer method for transferring electronic components. Background Art

[0002] Light Emitting Diode (LED) is a light-emitting element. It is suitable for constructing the pixel structure of LED display panels due to its low power consumption, high brightness, high resolution and high color saturation. The technology of transferring / joining a large number of micro-LED chips to a substrate with pixel circuits is called mass transfer.

[0003] In existing bonding equipment, before the bonding operation is performed, the coplanarity of the bonding head and the carrier of the equipment itself is generally measured and corrected by a capacitive sensor or an inductive sensor, and then the actual bonding operation is performed. Alternatively, an airbag or similar buffer material is added to the bonding head to compensate for the coplanarity error between the bonding head and the carrier in a semi-active manner. However, in terms of mass transfer, the number of LED chips to be transferred is huge and the area of ​​the substrate is large. A slight error will result in poor bonding quality. The existing correction / compensation methods cannot meet the requirements of mass transfer for bonding accuracy. Summary of the invention

[0004] The invention provides a transfer device and a transfer method, which can improve the joining quality of electronic components.

[0005] The transfer device of the present invention comprises a carrier, a bonding head, a sensor and a control unit. A substrate is suitable for being placed on the carrier and has a bonding surface. The bonding head is suitable for connecting a carrier, and a bearing surface of the carrier carries at least one electronic component. The sensor is suitable for measuring the distance between the bonding surface and the sensor and the distance between the bearing surface and the sensor to obtain an error value. The control unit is suitable for controlling the bonding head to adjust the angle of the bearing surface according to the error value, and is suitable for controlling the bonding head to bond the electronic component to the bonding surface.

[0006] In one embodiment of the present invention, the sensor is an optical sensor.

[0007] In one embodiment of the present invention, the above-mentioned transfer device includes a heat insulation structure, wherein the heat insulation structure covers the sensor.

[0008] In one embodiment of the present invention, the thermal insulation structure includes a main body and a thermal insulation layer. The main body has a hollow portion, the hollow portion accommodates the sensor, and the thermal insulation layer is disposed on the inner wall of the hollow portion.

[0009] In one embodiment of the present invention, the above-mentioned bonding head includes a body, a connecting portion and at least one adjustment unit, wherein the connecting portion is movably connected to the body and is suitable for connecting to the carrier, and the adjustment unit is configured on the body and is suitable for being controlled by the control unit to adjust the angle of the connecting portion relative to the body.

[0010] In one embodiment of the present invention, the transfer device comprises a calculation unit, wherein the calculation unit calculates the error value at least according to the distance between the bonding surface and the sensor and the distance between the supporting surface and the sensor.

[0011] In one embodiment of the present invention, the calculation unit further calculates the error value according to an operating temperature of at least one of the carrier and the substrate.

[0012] The transfer method of the present invention comprises the following steps. A substrate is placed on a carrier, wherein the substrate has a bonding surface. A carrier is connected to a bonding head, wherein a bearing surface of the carrier carries at least one electronic component. An error value is obtained by measuring the distance between an area of ​​the bonding surface and the sensor and the distance between the bearing surface and the sensor by a sensor. A control unit controls the bonding head to adjust the angle of the bearing surface according to the error value. The control unit controls the bonding head to bond the electronic component to the area of ​​the bonding surface.

[0013] In one embodiment of the present invention, the step of measuring the distance between the bonding surface and the sensor and the distance between the carrying surface and the sensor includes: optically sensing the substrate and the carrier by the sensor.

[0014] In one embodiment of the present invention, the transfer method includes: covering the sensor with a heat insulation structure.

[0015] In one embodiment of the present invention, the above-mentioned bonding head includes a body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the body and is suitable for connecting the carrier, and the adjustment unit is configured on the body. The step of adjusting the angle of the carrying surface includes: controlling the adjustment unit to adjust the angle of the connecting portion relative to the body through the control unit.

[0016] In one embodiment of the present invention, the above-mentioned transfer method further includes the following steps. After the bonding head bonds the electronic component to the area of ​​the bonding surface, at least another electronic component is carried by the carrying surface. Another error value is obtained by sensing the distance between another area of ​​the bonding surface and the sensor and the distance between the carrying surface and the sensor by the sensor. The control unit controls the bonding head to adjust the angle of the carrying surface according to the other error value. The control unit controls the bonding head to bond at least another electronic component to another area of ​​the bonding surface.

[0017] In an embodiment of the present invention, the step of obtaining the error value includes: calculating the error value according to the distance between the bonding surface and the sensor and the distance between the supporting surface and the sensor by a calculation unit.

[0018] In one embodiment of the present invention, the calculation unit further calculates the error value according to an operating temperature of at least one of the carrier and the substrate.

[0019] Based on the above, in the transfer device and transfer method of the present invention, the sensor directly measures the carrier and the substrate, and can obtain the error value related to the actual position and angle of the carrier and the substrate. Therefore, compared with the existing calibration method that only indirectly measures the carrier and the bonding head of the device itself before the actual operation, the error value obtained by the present invention is more accurate, and can be used to accurately adjust the tilt angle of the carrier surface relative to the bonding surface of the substrate in each axial direction, thereby improving the bonding quality of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of some components of a transfer device according to an embodiment of the present invention.

[0021] Figure 2 yes Figure 1 Block diagram of some components of the transfer equipment.

[0022] Figure 3 is corresponding to Figure 1 A flow chart of a transfer method of a transfer device.

[0023] Figure 4 yes Figure 1 Schematic diagram of the thermal insulation structure and sensors.

[0024] Figure 5 yes Figure 1 Schematic diagram of a part of the bonding head and the carrier.

[0025] Figure 6 FIG. 4 is a schematic diagram of a part of a bonding head and a carrier according to another embodiment of the present invention.

[0026] 7A to 7H Show Figure 1 The operating procedures of the transfer equipment.

[0027] Description of reference numerals:

[0028] 50, 50': Electronic components

[0029] 60: Substrate

[0030] 60a: joint surface

[0031] 70: Carrier

[0032] 70a: bearing surface

[0033] 100: Transfer device

[0034] 110: Carrier

[0035] 120: Joint head

[0036] 122: Ontology

[0037] 124: Connection

[0038] 126: Adjustment unit

[0039] 130: Sensor

[0040] 140: Control unit

[0041] 150: Thermal insulation structure

[0042] 150a: Open

[0043] 152: Main body

[0044] 154: Insulation layer

[0045] 160: Computing unit

[0046] A1, A2: Area

[0047] C: Hollow part

[0048] L: Sense light

[0049] X, Y, Z: Axis DETAILED DESCRIPTION

[0050] Figure 1 It is a schematic diagram of some components of a transfer device according to an embodiment of the present invention. Figure 2 yes Figure 1 Refer to the block diagram of some components of the transfer equipment. Figure 1 and Figure 2 The transfer device 100 of this embodiment is, for example, a mass transfer device, which is used to transfer a plurality of micro-LED dies that have been manufactured to a substrate 60. The transfer device 100 includes a carrier 110, a bonding head 120, a sensor 130, and a control unit 140. The substrate 60 is suitable for being placed on the carrier 110 and has a bonding surface 60a. The bonding head 120 is suitable for connecting a carrier 70, and a bearing surface 70a of the carrier 70 carries a plurality of electronic components 50 (for example, the above-mentioned micro-LED dies) so as to bond the electronic components 50 to the substrate 60 by stamping.

[0051] Factors such as manufacturing and assembly errors of the components of the transfer device 100, installation and size errors of the substrate 60 and the carrier 70, and thermal expansion and contraction caused by the operating temperature may cause an error value in the coplanarity between the bonding surface 60a of the substrate 60 and the bearing surface 70a of the bonding head 120, resulting in poor bonding quality. As mentioned above, the sensor 130 of the present embodiment is used to measure the distance between the bonding surface 60a of the substrate 60 and the sensor 130 and the distance between the bearing surface 70a of the bonding head 120 and the sensor 130, and to make an estimate to obtain the above error value. The control unit 140 can be a control circuit integrated in the device body of the transfer device 100 or an external computer device, and the present invention is not limited to this. The control unit 140 is coupled to the bonding head 120 and is suitable for controlling the bonding head 120 to adjust the angle of the bearing surface 70a according to the above error value to compensate for the above error value, and then controlling the bonding head 120 to bond the electronic component 50 to the bonding surface 60a of the substrate 60.

[0052] Figure 3 is corresponding to Figure 1 Flow chart of the transfer method of the transfer device. Please refer to Figure 3 The transfer method of this embodiment includes the following steps. Place a substrate 60 on a carrier 110, wherein the substrate 60 has a bonding surface 60a (step S1). Connect a carrier 70 to a bonding head 120, wherein a carrying surface 70a of the carrier 70 carries an electronic component 50 (step S2). The distance between an area A1 of the bonding surface 60a and the sensor 130 and the distance between the carrying surface 70a and the sensor 130 are measured by the sensor 130 to obtain an error value (step S3). The control unit 140 controls the bonding head 120 to adjust the angle of the carrying surface 70a according to the error value (step S4). The control unit 140 controls the bonding head 120 to bond the electronic component 50 to the area A1 of the bonding surface 60a (step S5).

[0053] Under the above configuration and operation mode, the sensor 130 directly measures the carrier 70 and the substrate 60, and can obtain the error value related to the actual position and angle of the carrier 70 and the substrate 60. Therefore, compared with the existing calibration method that only indirectly measures the stage and the bonding head of the equipment itself before the actual operation, the error value obtained by this embodiment is more accurate, and can be used to accurately adjust the tilt angle of the carrier surface 70a of the carrier 70 relative to the bonding surface 60a of the substrate 60 in each axial direction, thereby improving the bonding quality of the electronic component 50.

[0054] In the present embodiment, the sensor 130 is, for example, an optical sensor, which uses laser, infrared, white light or other types of light to measure the distance between the bonding surface 60a of the substrate 60 and the carrying surface 70a of the carrier 70. Compared with the existing bonding equipment that uses a capacitive sensor or an inductive sensor to measure the distance, the sensor 130 of the present embodiment senses the bonding surface 60a of the substrate 60 and the carrying surface 70a of the carrier 70 in an optical manner, and has better sensing accuracy.

[0055] The transfer device 100 of this embodiment heats the bonding head 120 and the carrier 110 during the transfer operation to facilitate the bonding of the electronic component 50. As mentioned above, since high temperature may affect the sensing of the optical sensor (sensor 130), the transfer device 100 of this embodiment may further include a heat insulation structure 150, which is used to cover the sensor 130 to avoid the sensing of the high temperature sensor 130.

[0056] Figure 4 yes Figure 1 Schematic diagram of the thermal insulation structure and sensors. Figure 4 Specifically, the heat insulation structure 150 of the present embodiment includes a main body 152 and a heat insulation layer 154. The main body 150 has a hollow portion C, and the hollow portion C accommodates the sensor 130. The heat insulation layer 154 is arranged on the inner wall of the hollow portion C to provide a heat insulation effect. The sensing light L of the sensor 130 is emitted to the bonding surface 60a of the substrate 60 and the supporting surface 70a of the carrier 70 through the opening 150a of the heat insulation structure 150. In the present embodiment, the material of the main body 152 is, for example, aluminum, and the material of the heat insulation layer 154 is, for example, glass fiber, foam material, aluminum foil heat insulation coil or other heat insulation materials, and the present invention is not limited to this. As described above, the heat insulation layer 154 is arranged on the inner wall of the hollow portion C without being exposed, so as to avoid wear of the heat insulation layer 154.

[0057] The relative arrangement relationship between the bonding head and the carrier of this embodiment is described in detail below. Figure 5 yes Figure 1 Schematic diagram of a part of the bonding head and the carrier. Please refer to Figure 1 and Figure 5 The bonding head 120 of this embodiment includes a body 122 , a connecting portion 124 , and a plurality of adjustment units 126 (four adjustment units 126 are shown). Figure 5 The connecting portion 124 shown is movably connected to Figure 1 The main body 122 is shown in FIG. 1 , and the connecting portion 124 is suitable for connecting the carrier 70 by vacuum adsorption or other appropriate means. The adjustment unit 126 is configured on the main body 122 and connected to the connecting portion 124, so as to be suitable for being controlled by the control unit 140 (shown in FIG. 1 ). Figure 2) to adjust the angle of the connecting portion 124 relative to the body 122. The adjusting units 126 are, for example, linear motors, which can respectively change the positions of different parts of the connecting portion 124 in the axial direction Z, so that the connecting portion 124 generates a rotation amount with at least one of the axial directions X, Y, and Z as the rotation axis, thereby adjusting the inclination angle of the connecting portion 124 in each axial direction. Figure 6 FIG. 4 is a schematic diagram of a part of a bonding head and a carrier according to another embodiment of the present invention. Figure 6 The embodiment shown and Figure 5 The embodiment shown differs in that Figure 6 The number of the adjustment units 126 in the illustrated embodiment is three. In other embodiments, the number of the adjustment units 126 may be changed according to design requirements, and the present invention is not limited thereto.

[0058] The following is a detailed description of how to obtain the error value according to the distance between the bonding surface 60a of the substrate 60 and the sensor 130 and the distance between the bearing surface 70a of the bonding head 120 and the sensor 130 in this embodiment. Figure 1 The transfer device 100 of this embodiment includes a calculation unit 160. The calculation unit 160 is, for example, a calculation circuit, which can be integrated into the aforementioned control circuit or integrated into an external computer device, and is coupled to the control unit 140 and the sensor 130. The calculation unit calculates the error value based on at least the distance between the bonding surface 60a of the substrate 60 and the sensor 130 and the distance between the bearing surface 70a of the carrier 70 and the sensor 130. In more detail, the sensor 130 measures the distance between multiple positions in the area A1 of the bonding surface 60a of the substrate 60 and the sensor 130 in the axial direction Z, and measures the distance between multiple positions on the bearing surface 70a of the carrier 70 and the sensor 130 in the axial direction Z, and estimates the error between the actual coplanarity and the ideal coplanarity of the bonding surface 60a and the bearing surface 70a, that is, the error value. The ideal coplanarity, for example, refers to the state in which the bonding surface 60a and the bearing surface 70a are completely parallel.

[0059] In other embodiments, the error value may be other error parameters related to the distance between the bonding surface 60a and the sensor 130 and the distance between the bearing surface 70a and the sensor 130, and the present invention is not limited thereto. In addition, when the transfer device 100 heats the bonding head 120 and the carrier 110 as described above, the carrier 110, the bonding head 120, the carrier 70 and the substrate 60 may expand due to the temperature rise, thereby affecting the position and angle of the bonding surface 60a and the bearing surface 70a. Therefore, in addition to calculating the error value based on the distance between the bonding surface 60a and the sensor 130 and the distance between the bearing surface 70a and the sensor 130 as described above, the calculation unit 160 may also calculate the error value based on the operating temperature of at least one of the carrier 70 and the substrate 60. For example, the offset of the size caused by the temperature difference may be estimated based on the operating temperature and the corresponding parameters such as the material and size of the component, and regarded as part of the error.

[0060] The operation flow of the transfer device of this embodiment is described in detail below with reference to the accompanying drawings. 7A to 7H Show Figure 1 The operation process of the transfer equipment. First, Fig. 7A As shown, the sensor 130 together with the heat insulation structure 150 is moved between the substrate 60 and the carrier 70, so that the sensor 130 can sense the distance between the sensor 130 and the area A1 of the bonding surface 60a of the substrate 60 and the distance between the sensor 130 and the bearing surface 70a of the carrier 70 to obtain the error value, wherein the calculation of the error value can be as described above, and no further description is given here. The sensor 130 and the heat insulation structure 150 can be moved by a driving and moving device such as a robot arm, a motor, a cylinder, etc., and the present invention is not limited to this. Next, as Figure 7B As shown, the sensor 130 together with the heat insulation structure 150 is moved away from between the substrate 60 and the carrier 70, and the tilt angle of the carrier surface 70a of the carrier 70 is adjusted according to the sensing result of the sensor 130 and the error value of the operating temperature of the carrier 70 and the substrate 60 to compensate for the error value, wherein the adjustment of the carrier surface 70a of the carrier 70 can be as described above, which will not be repeated here. Then, as FIG. 7C to FIG. 7D As shown, the carrier 70 and the electronic component 50 thereon are bonded to the region A1 of the bonding surface 110 of the substrate 60 using the bonding head 120. Thus, the bonding operation of the region A1 of the bonding surface 110 of the substrate 110 is completed.

[0061] As described above, after the bonding head 120 bonds the electronic component 50 to the area A1 of the bonding surface 110, as shown in FIG. Fig. 7EAs shown, another electronic component 50' (shown as a plurality of electronic components 50') is carried by the carrying surface 70a of the carrier 70, and the bonding head 120 together with the carrier 70 is moved to a position corresponding to another area A2 of the bonding surface 110a of the substrate 110, and the sensor 130 together with the heat insulation structure 150 is moved between the substrate 60 and the carrier 70, so as to use the sensor 130 to sense the distance between the sensor 130 and the area A2 of the bonding surface 60a of the substrate 60 and the distance between the sensor 130 and the carrying surface 70a of the carrier 70 to obtain another error value, wherein the calculation of the error value can be as described above, and no further description is given here. Next, as Figure 7F As shown, the sensor 130 together with the heat insulation structure 150 is moved away from between the substrate 60 and the carrier 70, and the tilt angle of the carrier surface 70a of the carrier 70 is adjusted according to the sensing result of the sensor 130 and the other error value of the operating temperature of the carrier 70 and the substrate 60 to compensate for the other error value, wherein the adjustment of the carrier surface 70a of the carrier 70 can be as described above, which will not be repeated here. Then, as Figures 7G to 7H As shown, the carrier 70 and the electronic component 50' thereon are bonded to the area A2 of the bonding surface 110 of the substrate 60 using the bonding head 120. At this point, the bonding operation of the area A2 of the bonding surface 110 of the substrate 110 is completed. Similarly, the bonding operations of more areas of the bonding surface 110 of the substrate 110 can be completed in sequence.

[0062] In summary, in the transfer device and transfer method of the present invention, before performing the bonding operation of each area of ​​the bonding surface of the substrate, the sensor can be used to directly sense the substrate and the carrier and compensate and adjust the tilt angle of the carrier's carrying surface accordingly. Therefore, compared with the existing calibration method that only indirectly measures the stage and bonding head of the device itself before the actual operation, the sensing method of the present invention is more real-time, and the error value obtained is more accurate, and can be used to accurately adjust the tilt angle of the carrier's carrying surface relative to the bonding surface of the substrate in each axial direction, thereby improving the bonding quality of the electronic component.

Claims

1. A transfer device comprising: A carrier, a substrate is suitable for being placed on the carrier and has a bonding surface; a bonding head adapted to connect to a carrier, wherein a carrying surface of the carrier carries at least one electronic component; A sensor, adapted to measure the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor to obtain an error value; a control unit, adapted to control the bonding head to adjust the angle of the carrying surface according to the error value, and adapted to control the bonding head to bond the at least one electronic component to the bonding surface; and A heat insulation structure covers the sensor.

2. The transfer device as claimed in claim 1, wherein the sensor is an optical sensor.

3. The transfer device as described in claim 1, wherein the thermal insulation structure comprises a main body and a thermal insulation layer, the main body has a hollow portion, the hollow portion accommodates the sensor, and the thermal insulation layer is disposed on an inner wall of the hollow portion.

4. The transfer device as described in claim 1, wherein the bonding head comprises a main body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the main body and is suitable for connecting to the carrier, and the at least one adjustment unit is configured on the main body and is suitable for being controlled by the control unit to adjust the angle of the connecting portion relative to the main body. 5 . The transfer device as claimed in claim 1 , comprising a calculation unit, wherein the calculation unit calculates the error value based on at least a distance between the bonding surface and the sensor and a distance between the supporting surface and the sensor. 6 . The transfer device as claimed in claim 5 , wherein the calculation unit further calculates the error value according to an operating temperature of at least one of the carrier and the substrate.

7. A transfer method comprising: Placing a substrate on a carrier, wherein the substrate has a bonding surface; Connecting a carrier to a bonding head, wherein a carrying surface of the carrier carries at least one electronic component; A sensor is covered by a heat-insulating structure, and an error value is obtained by measuring the distance between an area of ​​the joint surface and the sensor and the distance between the bearing surface and the sensor by the sensor; Controlling the bonding head to adjust the angle of the bearing surface according to the error value by a control unit; and The control unit controls the bonding head to bond the at least one electronic component to the area of ​​the bonding surface.

8. The transfer method as claimed in claim 7, wherein the step of measuring the distance between the bonding surface and the sensor and the distance between the supporting surface and the sensor comprises: The substrate and the carrier are optically sensed by the sensor.

9. The transfer method as claimed in claim 7, wherein the bonding head comprises a body, a connecting portion and at least one adjustment unit, the connecting portion is movably connected to the body and is suitable for connecting the carrier, the at least one adjustment unit is disposed on the body, and the step of adjusting the angle of the carrying surface comprises: The control unit controls the at least one adjustment unit to adjust the angle of the connection portion relative to the body.

10. The transfer method according to claim 7, further comprising: After the bonding head bonds the at least one electronic component to the region of the bonding surface, the bearing surface carries at least another electronic component; another error value is obtained by sensing, by the sensor, a distance between another area of ​​the joint surface and the sensor and a distance between the bearing surface and the sensor; Controlling the bonding head to adjust the angle of the bearing surface according to the other error value by the control unit; and The control unit controls the bonding head to bond the at least another electronic component to the another region of the bonding surface.

11. The transfer method as claimed in claim 7, wherein the step of obtaining the error value comprises: The error value is calculated by a calculation unit according to the distance between the joint surface and the sensor and the distance between the bearing surface and the sensor. 12 . The transfer method according to claim 11 , wherein the calculation unit further calculates the error value according to an operating temperature of at least one of the carrier and the substrate.

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