Scintillator panel, radiation detector, method for manufacturing scintillator panel, and method for manufacturing radiation detector

Abstract

A scintillator panel of the present application includes: a first flexible support having a first surface and a second surface opposite to the first surface; a scintillator layer formed on the first surface and including a plurality of columnar crystals; a second flexible support provided on the second surface; an inorganic layer provided on the second flexible support in a manner interposed between the second surface and the second flexible support; and a first adhesive layer bonding the second surface and the inorganic layer to each other. A radiation detector of the present application includes: a scintillator panel; and a sensor panel including a photoelectric conversion element, the scintillator panel being provided on the sensor panel in a manner that the first surface is on the side of the sensor panel relative to the second surface.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a scintillator panel, a radiation detector, a manufacturing method of a scintillator panel, and a manufacturing method of a radiation detector. BACKGROUND

[0002] A scintillator panel is described in Patent Literature 1. The scintillator panel is provided with a scintillator panel that converts a radiation into light on a support. In addition, the scintillator panel has a metal thin film layer having a thickness in the range of 1 to 500 nm on a surface of the support opposite to the surface having the phosphor layer. The support cuts the drum-shaped scintillator panel with the support into a predetermined size. Furthermore, the light emitting surface and the side surface of the phosphor layer and the side surface of the support are covered with a moisture resistant protective film.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent No. 5668691 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the above-described scintillator panel, moisture resistance is improved by the metal thin film layer and the moisture resistant protective film. Thus, in the above-described technical field, it is desirable to improve the moisture resistance. On the other hand, in the above-described scintillator panel, the surface of the metal thin film layer opposite to the support is exposed to the outside. Therefore, in the above-described scintillator panel, it is difficult to ensure the operability.

[0008] An object of the present disclosure is to provide a scintillator panel, a radiation detector, a manufacturing method of a scintillator panel, and a manufacturing method of a radiation detector, which can improve the moisture resistance while ensuring the operability.

[0009] MEANS OF SOLVING THE PROBLEMS

[0010] The scintillator panel of the present disclosure includes a first flexible support having a first surface and a second surface opposite to the first surface; a scintillator layer formed on the first surface and including a plurality of columnar crystals; a second flexible support provided on the second surface; an inorganic layer provided on the second flexible support in a manner of interposing between the second surface and the second flexible support; and a first adhesive layer that adheres the second surface and the inorganic layer to each other.

[0011] In the scintillator panel, a scintillator layer is formed on a first surface of a first flexible support. On the other hand, an inorganic layer is provided on a second surface of the first flexible support via a first adhesive layer. Thus, in the scintillator panel, moisture intrusion from the second surface side via the first flexible support to the scintillator layer is suppressed by the inorganic layer. On the other hand, when the inorganic layer is exposed, there is a concern that the inorganic layer deteriorates due to contact at the time of operation. In relation to this, in the scintillator panel, a second flexible support is arranged on the side opposite the second surface of the first flexible support from the inorganic layer. Thus, at the time of operation, the inorganic layer is protected from contact, and deterioration of the inorganic layer is suppressed. In this way, in the scintillator panel, the moisture resistance is improved while ensuring operability. Here, the side opposite the first surface of the first flexible support from the scintillator layer is generally the side on which a sensor panel or the like is provided, and thus the necessity of improving the moisture resistance is relatively low.

[0012] The scintillator panel of the present disclosure can also be provided with a protective layer provided so as to cover the first flexible support, the scintillator layer, the second flexible support, and the inorganic layer. In this case, the overall moisture resistance and operability are further improved.

[0013] The scintillator panel of the present disclosure can also be provided with a second adhesive layer that adheres the inorganic layer and the second flexible support to each other. In this way, the inorganic layer can also be adhered to the second flexible support via the adhesive layer. In this case, for example, compared to a case in which the inorganic layer is formed on the second flexible support by evaporation, the inorganic layer is more firmly joined to the second flexible support.

[0014] In the scintillator panel of the present disclosure, the thickness of the first flexible support and the second flexible support in a first direction intersecting the first surface can be 50 μm or more and 250 μm or less, the thickness of the inorganic layer in the first direction can be 10 μm or more and 100 μm or less, and the thickness of the inorganic layer can be thinner than the thickness of the first flexible support and the second flexible support in the first direction. In this way, the thickness of the inorganic layer is relatively thick in a range in which the first flexible support and the second flexible support are relatively thin, and thus it is possible to further improve the moisture resistance while ensuring the transmissivity of radiation.

[0015] In the scintillator panel of the present disclosure, the difference between the thickness of the first flexible support and the thickness of the second flexible support in the first direction can be 0 μm or more and 90 μm or less. In this case, the difference between the thickness of the first flexible support and the thickness of the second flexible support is small, and thus warping of the entire scintillator panel is suppressed.

[0016] In the scintillator panel of the present disclosure, it can also be that the material of the inorganic layer contains Al, Cu, Ti, Fe, or SUS. In addition, in the scintillator panel of the present disclosure, it can also be that the materials of the first flexible support and the second flexible support contain PET, PEN, PI, PP, PE, or PMMA.

[0017] The radiation detector of the present disclosure is provided with the above-described scintillator panel and a sensor panel containing photoelectric conversion elements, the scintillator panel being disposed on the sensor panel with the first surface on the side of the sensor panel relative to the second surface. The radiation detector is provided with the above-described scintillator panel. Therefore, with this radiation detector, the moisture resistance is improved while the operability is ensured.

[0018] The manufacturing method of the scintillator panel of the present disclosure is provided with a step of forming a scintillator layer containing a plurality of columnar crystals on a first surface of a first flexible support by a vapor deposition method; a step of preparing a second flexible support provided with an inorganic layer; and a step of adhering the inorganic layer to the first flexible support by a first adhesive layer in such a manner that the inorganic layer intervenes between a second surface of the first flexible support on the opposite side of the first surface and the second flexible support.

[0019] In this manufacturing method, the scintillator layer is formed on the first surface of the first flexible support. On the other hand, the inorganic layer is provided on the second surface of the first flexible support via the adhesive layer. Therefore, in this scintillator panel, the moisture intrusion from the second surface side through the first flexible support to the scintillator layer is suppressed by the inorganic layer. On the other hand, when the inorganic layer is exposed, there is a concern that the inorganic layer deteriorates due to contact at the time of operation. In contrast, in this method, the second flexible support is arranged on the opposite side of the inorganic layer from the second surface of the first flexible support. Therefore, at the time of operation, the inorganic layer is protected from contact, and the deterioration of the inorganic layer is suppressed. In this way, in this manufacturing method, a scintillator panel capable of improving the moisture resistance while ensuring the operability is manufactured. Here, the side on the opposite side of the scintillator layer from the first surface of the first flexible support is usually the side on which a sensor panel or the like is provided, and therefore the necessity of improving the moisture resistance is relatively low.

[0020] The manufacturing method of the radiation detector of the present disclosure is provided with a step of preparing the above-described scintillator panel; a step of preparing a sensor panel containing photoelectric conversion elements; and a step of disposing the scintillator panel on the sensor panel with the first surface on the side of the sensor panel relative to the second surface. In this manufacturing method, the above-described scintillator panel is used. Therefore, a radiation detector capable of improving the moisture resistance while ensuring the operability is manufactured.

[0021] Effects of the Invention

[0022] According to the present disclosure, it is possible to provide a scintillator panel capable of improving moisture resistance while ensuring operability, a radiation detector, a manufacturing method of a scintillator panel, and a manufacturing method of a radiation detector. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 is a schematic cross-sectional view showing a radiation detector of the present embodiment.

[0024] Figure 2 is a schematic cross-sectional view showing a manufacturing method of a radiation detector. Figure 1

[0025] Figure 3 is a schematic cross-sectional view showing a manufacturing method of a radiation detector. Figure 1

[0026] Figure 4 is a graph for explaining an effect on moisture resistance.

[0027] Figure 5 is a graph for explaining an effect on moisture resistance. DETAILED DESCRIPTION

[0028] One embodiment will be explained in detail below with reference to the drawings. In the explanation of each drawing, the same symbols are sometimes attached to the same elements or equivalent elements, and repetitive explanation is omitted.

[0029] The scintillator panel (and the radiation detector) of the present embodiment is a scintillator panel that converts (and detects) a radiation such as X-rays into scintillating light such as visible light. In addition, the scintillator panel and the radiation detector (radiation imager) of the present embodiment are usable in, for example, a medical X-ray image diagnostic apparatus such as a mammography device, a chest examination device, a CT device, a dental intraoral radiography device, and a radiographic camera, or a non-destructive inspection device.

[0030] Figure 1 is a schematic cross-sectional view showing a radiation detector of the present embodiment. As shown in Figure 1 The radiation detector 1 has a scintillator panel 10 and a sensor panel 20. The scintillator panel 10 has a first flexible support 11, a scintillator layer 12, a second flexible support 13, an inorganic layer 14, a first adhesive layer 15, a second adhesive layer 16, a protective layer 18, and a protective layer 19.

[0031] ​​The first flexible support 11 is formed in a flat plate shape in this embodiment, and has a first surface 11a and a second surface 11b on the opposite side of the first surface 11a. The first surface 11a and the second surface 11b are parallel to each other. The first flexible support 11 has flexibility. Having flexibility means being able to elastically deform. The material of the first flexible support 11 includes, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polypropylene (PP), polyethylene (PE), or acrylic (PMMA). In one example, the material of the first flexible support 11 is PET, PEN, PI, PP, PE, or PMMA. In this embodiment, the material of the first flexible support 11 is PET. The first flexible support 11 can also have an anchor coat layer composed of a thermoplastic resin (for example, acrylic) on the surface on which the scintillator layer 12 is formed, for the purpose of improving adhesion to the scintillator layer 12. In particular, in the case where the scintillator layer 12 is composed of a plurality of columnar crystals, the crystallinity of the root portions of the columnar crystals is improved by the anchor coat layer.

[0032] The scintillator layer 12 is formed on the first surface 11a. The scintillator layer 12 generates scintillating light in response to the incidence of radiation from the second surface 11b side. The scintillator layer 12 includes a plurality of columnar crystals. In one example, the scintillator layer 12 is composed of a plurality of columnar crystals. The scintillator layer 12 is suitable for high-resolution imaging because each columnar crystal has a light-guiding effect.

[0033] The material of the scintillator layer 12 includes, for example, a material in which CsI (cesium iodide) is the main component such as CsI:Tl or CsI:Na, a material in which NaI (sodium iodide) is the main component such as NaI:Tl, SrI3 (strontium iodide), LuI3 (lutetium iodide), BaF2 (barium fluoride), and GOS. In this embodiment, the material of the scintillator layer 12 is a material in which CsI is the main component. Such a scintillator layer 12 can be formed by, for example, an evaporation method. The thickness of the scintillator layer 12 is, for example, 10 μm or more and 3000 μm or less, and is 600 μm in one example.

[0034] The second flexible support 13 is formed in, for example, a flat plate shape. The second flexible support 13 has flexibility. The material of the second flexible support 13 includes, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyimide (PI), polypropylene (PP), polyethylene (PE), or acrylic (PMMA). In one example, the material of the second flexible support 13 is PET, PEN, PI, PP, PE, or PMMA. In this embodiment, the material of the second flexible support 13 is PET. In addition, the material of the first flexible support 11 and the material of the second flexible support 13 are the same, for example.

[0035] The inorganic layer 14 is interposed between the second surface lib of the first flexible support 11 and the second flexible support 13. The inorganic layer 14 is provided to the second flexible support 13. The second flexible support 13 provided with the inorganic layer 14 is adhered to the second surface lib of the first flexible support 11 by the first adhesive layer 15. That is, the first adhesive layer 15 adheres the second surface lib and the inorganic layer 14 to each other.

[0036] The second adhesive layer 16 is interposed between the inorganic layer 14 and the second flexible support 13, and the inorganic layer 14 is adhered to the second flexible support 13 by the second adhesive layer 16. That is, the second adhesive layer 16 adheres the inorganic layer 14 and the second flexible support 13 to each other. In this way, the scintillator layer 12, the first flexible support 11, the inorganic layer 14, and the second flexible support 13 are sequentially stacked to form a laminate 17, which is integrated by the first adhesive layer 15 and the second adhesive layer 16.

[0037] The inorganic layer 14 is composed of an inorganic material. As an example, the material of the inorganic layer 14 is a metal. More specifically, as the material of the inorganic layer 14, for example, aluminum (Al), copper (Cu), titanium (Ti), iron (Fe), or SUS is included. As an example, the material of the inorganic layer 14 is Al.

[0038] The thickness T11 of the first flexible support 11 in the first direction intersecting the first surface 11a (and the second surface lib) is, for example, 50 μm or more and 250 μm or less. Likewise, the thickness T13 of the second flexible support 13 in the first direction is, for example, 50 μm or more and 250 μm or less. The difference between the thickness T11 of the first flexible support 11 and the thickness T13 of the second flexible support 13 is, for example, 0 or more and 90 μm or less. As an example, the thickness T11 of the first flexible support 11 and the thickness T13 of the second flexible support 13 are the same (the difference in thickness is 0). The thickness T14 of the inorganic layer 14 in the first direction is, for example, 10 μm or more and 100 μm or less, which is thinner than the thickness T11 of the first flexible support 11 and the thickness T13 of the second flexible support 13. The thickness T14 of the inorganic layer 14 is, as an example, 30 μm.

[0039] The protective layer 18 is provided to the side of the scintillator layer 12 opposite to the first flexible support 11. The protective layer 19 is provided in a manner of covering the laminate 17 (i.e., the first flexible support 11, the scintillator layer 12, and the inorganic layer 14) and the protective layer 18. Thus, the protective layers 18, 19 are arranged in multiple layers (two layers in this case) on the side of the scintillator layer 12 opposite to the first flexible support 11. The material of the protective layers 18, 19 is, for example, an organic material such as a resin, and, as an example, Parylene (poly-p-xylylene).

[0040] The sensor panel 20 includes a photoelectric conversion element. The sensor panel 20 detects scintillating light generated at the scintillator panel 10, and outputs a signal corresponding to the scintillating light. The sensor panel 20 has a mounting surface 21. A protective layer 22 is formed on the mounting surface 21. The material of the protective layer 22 is, for example, an oxide film, a nitride film, a fluorine-based resin, an aromatic resin, or the like. In addition, the protective layer 22 can not be formed.

[0041] The scintillator panel 10 is mounted on the mounting surface 21 via the protective layer 22. More specifically, the scintillator panel 10 is mounted on the mounting surface 21 with the first surface 11a of the first flexible support 11 and the scintillator layer 12 facing the mounting surface 21. The third adhesive layer 23 is interposed between the scintillator panel 10 and the mounting surface 21 (the protective layer 22), and the scintillator panel 10 and the sensor panel 20 are adhered to each other by the third adhesive layer 23. Here, the first adhesive layer 15, the second adhesive layer 16, and the third adhesive layer 23 can be composed of any material having adhesiveness / tackiness, such as an adhesive tape (double-sided tape).

[0042] Next, a manufacturing method of the radiation detector of the present embodiment will be described. Figure 2 and Figure 3 is a schematic cross-sectional view of one step of a manufacturing method of the radiation detector 1 shown in Figure 1 As shown in Figure 2 and Figure 3 In the manufacturing method, first, a first process of preparing the scintillator panel 10 and a second process of preparing the sensor panel 20 are performed. The order of the first process and the second process is arbitrary. The first process is a manufacturing method of the scintillator panel of the present embodiment.

[0043] In the first process, first, as shown in (a) and (b) of Figure 2 , a third process of preparing a first structure P1 and a fourth process of preparing a second structure P2 are performed. The order of the third process and the fourth process is arbitrary. In the third process, the inorganic layer 14 is adhered to one surface of the second flexible support 13 by the second adhesive layer 16, thereby constituting the first structure P1. That is, the third process is a process of preparing the second flexible support 13 provided with the inorganic layer 14. In the fourth process, the scintillator layer 12 is formed on the first surface 11a of the first flexible support 11 by, for example, an evaporation method, thereby constituting the second structure P2.

[0044] Next, in the first process, as shown in (c) of Figure 2The fifth process of forming the layered body 17 by stacking the first structure P1 and the second structure P2 on each other is performed as shown in (c) of FIG. 1. In the fifth process, the first structure P1 is adhered to the second structure P2 by the first adhesive layer 15 in such a manner that the inorganic layer 14 is interposed between the second surface 11b of the first flexible support 11 and the second flexible support 13. Here, the inorganic layer 14 is adhered to the second surface 11b.

[0045] Next, in the first process, as shown in (a) of FIG. 2, Figure 3 The sixth process of forming the scintillator panel 10 by providing the layered body 17 with the protective layers 18, 19 is performed as shown in (b) of FIG. 2. In the sixth process, first, the protective layer 18 is formed on the surface of the layered body 17 opposite to the first flexible support 11 (one surface of the layered body 17). In the sixth process, thereafter, the protective layer 19 is formed in such a manner as to cover the entire layered body 17 and the protective layer 18. Thus, the scintillator panel 10 is manufactured.

[0046] On the other hand, in the second process, as shown in (a) of FIG. 3, Figure 3 The sensor panel 20 is prepared in the second process as shown in (b) of FIG. 3. The third adhesive layer 23 is provided on the mounting surface 21 of the sensor panel 20 via the protective layer 22.

[0047] Next, in the manufacturing method, after the first and second processes, the seventh process of providing the sensor panel 20 with the scintillator panel 10 is performed. In the seventh process, the scintillator panel 10 is provided on the sensor panel 20 in such a manner that the first surface 11a is on the sensor panel 20 side with respect to the second surface 11b of the first flexible support 11. More specifically, the surface of the scintillator layer 12 opposite to the first flexible support 11 is adhered to the mounting surface 21 by the third adhesive layer 23 (via the protective layers 18, 19, 22) in a state where the surface is opposed to the mounting surface 21. Thus, the radiation detector shown in (c) of FIG. 4 is manufactured. Figure 1

[0048] Figure 4 and Figure 5 is a graph for explaining the effect on moisture resistance. Figure 4 (a) of FIG. 1 is a schematic cross-sectional view of the scintillator panel 10A of the embodiment, Figure 4 (b) of FIG. 1 is a schematic cross-sectional view of the scintillator panel 10B of the comparative example. The scintillator panel 10A is the same as the scintillator panel 10 except that the scintillator panel 10A does not have the protective layers 18, 19. The scintillator panel 10B is different from the scintillator panel 10A in that the scintillator panel 10B does not have the inorganic layer 14 and the second flexible support 13. Either of the scintillator panels 10A, 10B is mounted on the mounting surface 21A of the glass substrate 20A for testing.

[0049] As​Figure 5 As shown, in the scintillator panel 10A, as time passes, similarly to the scintillator panel 10B of the comparative example, although the resolution decreases due to deliquescence of the scintillator layer 12 based on moisture intrusion from the side surface, the resolution decrease is suppressed compared to the scintillator panel 10B. This is considered to be due to suppression of moisture intrusion from the side opposite to the glass substrate 20A by the inorganic layer 14.

[0050] As explained above, in the scintillator panel 10, the scintillator layer 12 is formed on the first surface 11a of the first flexible support 11. On the other hand, on the second surface 11b of the first flexible support 11, the inorganic layer 14 is provided via the first adhesive layer 15. Therefore, in this scintillator panel 10, moisture intrusion to the scintillator layer 12 from the second surface 11b side via the first flexible support 11 is suppressed by the inorganic layer 14. On the other hand, when the inorganic layer 14 is exposed, there is a concern that the inorganic layer 14 deteriorates due to contact at the time of operation.

[0051] In contrast to this, in the scintillator panel 10, the second flexible support 13 is arranged on the side opposite to the second surface 11b of the first flexible support 11 of the inorganic layer 14. Therefore, at the time of operation, the inorganic layer 14 is protected from contact, and deterioration of the inorganic layer 14 is suppressed. Thus, in the scintillator panel 10, the moisture resistance is improved while ensuring operability. Furthermore, with respect to the side opposite to the first surface 11a of the first flexible support 11 of the scintillator layer 12, it is generally the side on which the sensor panel 20 or the like is provided, and therefore the necessity of improving the moisture resistance is relatively low.

[0052] In addition, the scintillator panel 10 is provided with a protective layer 19 arranged so as to cover the laminate 17 including the first flexible support 11, the scintillator layer 12, the second flexible support 13, and the inorganic layer 14. Therefore, the overall moisture resistance and operability are further improved.

[0053] In addition, the scintillator panel 10 is provided with a second adhesive layer 16 that adheres the inorganic layer 14 and the second flexible support 13 to each other. Therefore, for example, compared to a case where the inorganic layer 14 is formed on the second flexible support 13 by evaporation, the inorganic layer 14 and the second flexible support 13 are more firmly joined.

[0054] Further, in the scintillator panel 10, the thicknesses T11, T13 of the first flexible support 11 and the second flexible support 13 in the first direction intersecting the first surface 11a are 50 μm or more and 250 μm or less. Further, the thickness T14 of the inorganic layer 14 in the first direction is 10 μm or more and 100 μm or less, which is thinner than the thicknesses T11, T13 of the first flexible support 11 and the second flexible support 13 in the first direction. Thus, the thickness T14 of the inorganic layer 14 is relatively thick in a range thinner than the first flexible support 11 and the second flexible support 13, and thus it is possible to further improve the moisture resistance while ensuring the radiation transmissivity. Further, for example, when the thickness T14 of the inorganic layer 14 is several hundred nm or so, a pinhole is likely to occur in the inorganic layer 14, and the moisture resistance is likely to be impaired.

[0055] Further, in the scintillator panel 10, the difference between the thickness T11 of the first flexible support 11 and the thickness T13 of the second flexible support 13 in the first direction is 0 or more and 90 μm or less. Thus, the difference in the thicknesses of the first flexible support 11 and the second flexible support 13 is small, and thus it is possible to suppress warping of the entire scintillator panel 10.

[0056] Further, the radiation detector 1 includes the scintillator panel 10. Thus, according to the radiation detector 1, it is possible to improve the moisture resistance while ensuring the operability.

[0057] Further, in the manufacturing method of the scintillator panel according to the present embodiment, the scintillator layer 12 is formed on the first surface 11a of the first flexible support 11. On the other hand, the inorganic layer 14 is provided on the second surface 11b of the first flexible support 11 via the first adhesive layer 15. Thus, in the scintillator panel 10 obtained by the manufacturing method, the moisture intrusion from the second surface 11b side via the first flexible support 11 to the scintillator layer 12 is suppressed by the inorganic layer 14. On the other hand, when the inorganic layer 14 is exposed, there is a concern that the inorganic layer 14 is deteriorated by contact during the operation.

[0058] In contrast, in the manufacturing method, the second flexible support 13 is disposed on the opposite side of the second surface 11b of the first flexible support 11 in the inorganic layer 14. Thus, during the operation, the inorganic layer 14 is protected from contact, and the deterioration of the inorganic layer 14 is suppressed. Thus, in the manufacturing method, it is possible to manufacture the scintillator panel 10 capable of improving the moisture resistance while ensuring the operability. Further, with respect to the side opposite to the first surface 11a of the first flexible support 11 of the scintillator layer 12, it is generally the side on which the sensor panel 20 or the like is provided, and thus the necessity of improving the moisture resistance is relatively low.

[0059] Further, the manufacturing method of the radiation detector of the present embodiment uses the scintillator panel 10. Therefore, the radiation detector 1 capable of ensuring operability while improving moisture resistance can be manufactured.

[0060] The above-described embodiments illustrate one aspect of the present disclosure. Therefore, the present disclosure can be variously modified, and is not limited to the above-described embodiments.

[0061] Industrial Applicability

[0062] With the present disclosure, a scintillator panel, a radiation detector, a manufacturing method of a scintillator panel, and a manufacturing method of a radiation detector capable of ensuring operability while improving moisture resistance can be provided.

[0063]

Symbol Explanation

[0064] 1 … … radiation detector; 10 … … scintillator panel; 11 … … 1st flexible support; 11a … … 1st surface; 11b … … 2nd surface; 12 … … scintillator layer; 13 … … 2nd flexible support; 14 … … inorganic layer; 15 … … 1st adhesive layer; 16 … … 2nd adhesive layer; 18, 19 … … protective layer; 20 … … sensor panel; 21 … … mounting surface.

Claims

1. A flasher panel, wherein, have: The first flexible support has a first surface and a second surface opposite to the first surface; A scintillator layer, formed on the first surface, comprises a plurality of columnar crystals; A second flexible support is disposed on the second surface; An inorganic layer is disposed in the second flexible support in such a way that it is located between the second surface and the second flexible support; and A first adhesive layer bonds the second surface to the inorganic layer. The thickness of the first flexible support and the second flexible support in the first direction intersecting the first surface is 50 μm or more and 250 μm or less. The thickness of the inorganic layer in the first direction is more than 10 μm and less than 100 μm, and is thinner than the thickness of the first flexible support and the second flexible support in the first direction.

2. The scintillator panel according to claim 1, wherein, It includes a protective layer disposed in a manner that covers the first flexible support, the scintillator layer, the second flexible support, and the inorganic layer.

3. The scintillator panel according to claim 1, wherein, It includes: a second adhesive layer that bonds the inorganic layer to the second flexible support.

4. The scintillator panel according to claim 2, wherein, It includes: a second adhesive layer that bonds the inorganic layer to the second flexible support.

5. The scintillator panel according to claim 1, wherein, The difference between the thickness of the first flexible support and the thickness of the second flexible support in the first direction is greater than 0 and less than 90 μm.

6. The scintillator panel according to any one of claims 1 to 5, wherein, The inorganic layer is made of Al, Cu, Ti, Fe, or SUS.

7. The scintillator panel according to any one of claims 1 to 5, wherein, The materials of the first flexible support and the second flexible support include PET, PEN, PI, PP, PE, or PMMA.

8. The scintillator panel according to claim 6, wherein, The materials of the first flexible support and the second flexible support include PET, PEN, PI, PP, PE, or PMMA.

9. A radiation detector, wherein, have: The scintillator panel according to any one of claims 1 to 8; and A sensor panel containing photoelectric conversion elements. The scintillator panel is disposed on the sensor panel such that the first surface is on the sensor panel side relative to the second surface.

10. A method for manufacturing a flasher panel, wherein, have: The process of forming a scintillator layer containing multiple columnar crystals on the first surface of the first flexible support by vapor deposition. The process of preparing a second flexible support with an inorganic layer; and The process of bonding the inorganic layer to the first flexible support via a first adhesive layer, wherein the inorganic layer is located between the second surface of the first flexible support, which is opposite to the first surface, and the second flexible support. The thickness of the first flexible support and the second flexible support in the first direction intersecting the first surface is 50 μm or more and 250 μm or less. The thickness of the inorganic layer in the first direction is more than 10 μm and less than 100 μm, and is thinner than the thickness of the first flexible support and the second flexible support in the first direction.

11. A method for manufacturing a radiation detector, wherein, have: The process of preparing the scintillator panel according to any one of claims 1 to 8; The process of preparing a sensor panel containing photoelectric conversion elements; and The process of setting the scintillator panel on the sensor panel such that the first surface is on the side of the sensor panel relative to the second surface.

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