Semiconductor manufacturing apparatus, position reading method, and attachment method
By using position correction technology with chuck reference keys and connector reference keys in semiconductor manufacturing equipment, the problem of accurate alignment and attachment of semiconductor chips on the carrier has been solved, enabling a more efficient semiconductor manufacturing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SK HYNIX INC
- Filing Date
- 2021-07-19
- Publication Date
- 2026-06-05
AI Technical Summary
In the existing technology, it is difficult to accurately align and attach semiconductor chips to the carrier during the semiconductor manufacturing process, resulting in problems such as positional deviation and inaccurate attachment.
Semiconductor manufacturing equipment, including a chuck, carrier contact device, and connector, is used. The carrier position is determined by the chuck reference key and the contact position identification key. The image data is read by a camera to correct the positional deviation of the connector and ensure that the semiconductor die is accurately attached to the carrier.
This improves the alignment accuracy and attachment reliability of semiconductor chips on the carrier, enhancing the accuracy and efficiency of the semiconductor manufacturing process.
Smart Images
Figure CN114613713B_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to a semiconductor manufacturing apparatus, a method for reading the position of a carrier, and a method for attaching a semiconductor die to a carrier using the semiconductor manufacturing apparatus. Background Technology
[0002] Semiconductor technology can include technologies for manufacturing multiple semiconductor chips on a wafer using integrated circuit processes, technologies for separating multiple semiconductor chips from a wafer and mounting them on a packaging substrate, technologies for ensuring electrical connections between semiconductor chips and external electronic devices through a packaging substrate, and technologies for forming a molding layer that protects semiconductor chips from external environmental influences, etc.
[0003] Among these technologies, semiconductor packaging technology has attracted attention as a means to produce miniaturized, high-speed, multifunctional, and high-performance packaged products, as well as for manufacturing highly reliable packaged products at low cost. Furthermore, research continues on semiconductor manufacturing equipment capable of realizing these technologies. Summary of the Invention
[0004] A semiconductor manufacturing apparatus according to one embodiment of the present disclosure may include: a chuck configured to receive a carrier thereon, the chuck including a chuck reference key located at an edge portion thereon; a carrier contact device including a contact position identification key, the carrier contact device being configured to contact the carrier on the chuck; and a bonding head configured to transfer a semiconductor die onto the carrier and to attach the semiconductor die to the carrier. The semiconductor manufacturing apparatus may include a camera configured to acquire images of the chuck reference key and the contact position identification key.
[0005] This disclosure provides a method for reading the position of a carrier according to one embodiment. In the method for reading the position of the carrier, a chuck including a chuck reference key formed at an edge portion of the chuck can be provided. The carrier can be placed on the chuck. The carrier can be secured to the chuck using a carrier contact device including a contact position identification key. The position of the carrier on the chuck can be determined by reading the chuck reference key and the contact position identification key.
[0006] This disclosure provides a method for attaching a semiconductor die according to yet another embodiment. In the method for attaching a semiconductor die, a carrier may be placed on a chuck including a chuck reference key formed at an edge portion of the chuck. The semiconductor die may be conveyed to a predetermined position above the chuck reference key using a connector including a connector reference key. Images of the chuck reference key and the connector reference key may be acquired using a camera. Based on image data from the images acquired by the camera, the positional deviation between the connector reference key and the chuck reference key at the predetermined position may be read. The read positional deviation may be corrected, and the semiconductor die may be attached to the carrier. Attached Figure Description
[0007] Figure 1 This is a block diagram schematically illustrating a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0008] Figure 2 This is a schematic plan view of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0009] Figure 3A This is a schematic cross-sectional view of the chuck of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0010] Figure 3B , Figure 3C and Figure 3D This is a schematic plan view of the chuck of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0011] Figure 4A This is a diagram showing the arrangement of carrier contact devices in a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0012] Figure 4B This is a plan view of a carrier contact device of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0013] Figure 5 This is a flowchart schematically illustrating a method for positioning a reading carrier according to an embodiment of the present disclosure.
[0014] Figures 6A to 6C This is a diagram illustrating a method for positioning a reading medium according to an embodiment of the present disclosure.
[0015] Figure 7 This is a flowchart schematically illustrating a method for attaching a semiconductor die according to an embodiment of the present disclosure.
[0016] Figure 8 This is a diagram schematically illustrating the process in a method of attaching a semiconductor die according to an embodiment of the present disclosure. Detailed Implementation
[0017] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the drawings, the dimensions of the components (e.g., the width and thickness of the components) are enlarged to clearly illustrate the components of each device. The terminology used herein may correspond to words chosen in consideration of their function in the embodiments, and the meaning of these terms may be interpreted differently by those skilled in the art to which the embodiments pertain. Where specifically defined, these terms may be interpreted in accordance with those definitions. Unless otherwise defined, the terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which the embodiments pertain.
[0018] Furthermore, unless explicitly used otherwise in the context, the singular form of a word should be understood to include the plural form of the word. It will be understood that the terms “comprising,” “including,” or “having” are intended to specify the presence of a feature, quantity, step, operation, component, element, part, or combination thereof, but are not intended to exclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, elements, parts, or combinations thereof.
[0019] Furthermore, when performing a method or manufacturing method, each process constituting the method may be performed in a different order than the prescribed order unless a specific order is explicitly described in the context. In other words, each process may be performed in the same manner as the stated order, and each process may be performed substantially simultaneously. Additionally, at least a portion of each of the above processes may be performed in the reverse order.
[0020] In this specification, the term "predetermined direction" can refer to a direction defined in a coordinate system as well as directions opposite to that direction. For example, in the xyz coordinate system, the x-direction can include directions parallel to the x-direction. That is, the x-direction can represent all directions in which the absolute value of the x-axis increases positively along the x-axis from the origin 0 and in which the absolute value of the x-axis increases negatively along the x-axis from the origin 0. The y-direction and z-direction can each be interpreted in substantially the same way in the xyz coordinate system.
[0021] As one of various semiconductor packaging manufacturing technologies, there exists fan-out wafer-level packaging (FOWLP) technology. FOWLP technology can be implemented as follows: First, a semiconductor chip manufactured using integrated circuit processes is prepared, and the semiconductor chip is picked up and attached to a wafer-shaped carrier. Subsequently, the semiconductor chip is molded on the carrier, and the carrier is removed. A redistribution layer is formed on one surface of each semiconductor chip exposed during carrier removal. Then, a sawing process is performed on each unit package to secure multiple fan-out packages.
[0022] The semiconductor manufacturing equipment according to embodiments of this disclosure can be applied to the process of picking up semiconductor chips and attaching them to a carrier in FOWLP technology. Additionally, the semiconductor manufacturing equipment can be applied to the process of aligning a carrier on a chuck before attaching the semiconductor chip to the carrier. However, the application of the semiconductor manufacturing equipment is not necessarily limited to the field of FOWLP technology, and can be applied to the process of aligning wafers on a chuck or aligning semiconductor dies on a wafer in various other semiconductor manufacturing technology fields.
[0023] Figure 1 This is a block diagram schematically illustrating a semiconductor manufacturing apparatus 1 according to an embodiment of the present disclosure. (Refer to...) Figure 1 The semiconductor manufacturing apparatus 1 may include a chuck 10 configured to receive a carrier thereon, the chuck 10 having a chuck reference key along its edge. The semiconductor manufacturing apparatus 1 may include a carrier contact device 20 and a carrier position calculation device 30, the carrier contact device 20 including a contact position recognition key. The carrier contact device 20 may be configured to contact a carrier located on the chuck 10. The carrier position calculation device 30 may read the chuck reference key and the contact position recognition key while the carrier and the carrier contact device 20 are in contact with each other. Furthermore, the carrier position calculation device 30 may determine the position of the carrier based on the read chuck reference key and contact position recognition key. The carrier position calculation device 30 may send the determined carrier position to a joint control device 60.
[0024] Semiconductor manufacturing equipment 1 may include a bonding head 40 configured to transfer a semiconductor die to a carrier and to attach the semiconductor die to the carrier. Additionally, semiconductor manufacturing equipment 1 may include a camera 50 that acquires images of the chuck reference key of the chuck 10, the contact position identification key of the carrier contact device 20, and the bonding head reference key of the bonding head 40.
[0025] Additionally, the semiconductor manufacturing equipment 1 may include a joint control device 60 connected to the carrier position calculation device 30, the joint head 40, and the camera 50. The joint control device 60 may include a joint head position correction unit 62 and a joint head drive unit 64. The joint head position correction unit 62 can determine whether there is a positional deviation between the joint head reference key and the chuck reference key of the joint head 40 based on image data obtained from the image acquired by the camera 50. Furthermore, when a positional deviation exists, the joint head position correction unit 62 can correct the operating error of the joint head 40 based on the determined positional deviation. The joint head drive unit 64 can reference the corrected operating error value when driving the joint head 40.
[0026] Furthermore, the connector control device 60 can receive position information about the carrier on the chuck 10 from the carrier position calculation device 30. The connector control device 60 can also further adjust the position of the semiconductor die to be attached on the carrier based on the carrier position information. Subsequently, the connector drive unit 64 of the connector control device 60 can drive the connector 40 to move the semiconductor die to the correct position on the carrier and attach the semiconductor die to the carrier.
[0027] Figure 2 This is a schematic plan view of a semiconductor manufacturing apparatus 2 according to an embodiment of the present disclosure. The semiconductor manufacturing apparatus 2 may be... Figure 1 An example of the implementation of semiconductor manufacturing equipment 1 shown in the block diagram. Figure 3A This is a schematic cross-sectional view of the chuck of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure. Figure 3B , Figure 3C and Figure 3D This is a plan view showing the chuck of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure. Figure 4A This is a diagram showing the arrangement of carrier contact devices in a semiconductor manufacturing apparatus according to an embodiment of the present disclosure. Figure 4B This is a plan view of a carrier contact device of a semiconductor manufacturing apparatus according to an embodiment of the present disclosure.
[0028] Reference Figure 2The semiconductor manufacturing equipment 2 may include a chuck 10, a carrier contact device 20, a connector 40, and a camera 50. The semiconductor manufacturing equipment 2 may include a first rail 1001a and a second rail 1001b mounted to extend in a first direction (i.e., the x-direction), and a pair of third rails 1002 mounted to extend in a second direction (i.e., the y-direction).
[0029] Reference Figure 3A The chuck 10 can be configured to receive a carrier W thereon. Additionally, the chuck 10 may include a chuck body 110 having a vacuum flow path 120. The vacuum flow path 120 extends from within the chuck body 110 to the upper surface 110S of the chuck body 110. As the vacuum flow path 120 extends to the upper surface 110S of the chuck body 110, the vacuum flow path 120 can be divided into multiple flow paths. Furthermore, the vacuum flow path 120 can extend to the outside of the chuck body 110 to connect to a vacuum device (not shown) via another side of the chuck body 110. The chuck 10 can be configured to draw air through the vacuum flow path 120 to secure the carrier W to the chuck 10 when the carrier W is positioned. Additionally, the chuck 10 can be configured to blow air through the vacuum flow path 120 to cause the carrier W to float on the chuck 10.
[0030] Combined with reference Figure 2 , Figure 3A and Figure 3B The chuck reference key 130 may be disposed on the upper surface 110S near the edge of the chuck body 110. The chuck reference key 130 may include one or more chuck position identification keys 131a, 131b, 132a, and 132b indicating fixed positions on the upper surface 110S of the chuck body 110. In one embodiment, one or more chuck position identification keys 131a, 131b, 132a, and 132b may be arranged such that at least one pair of chuck position identification keys faces each other from opposite sides relative to the center CP of the chuck 10.
[0031] When the upper surface 110S of the chuck body 110 has a circular shape, the center CP of the chuck 10 can be the center of the circle. Alternatively, when the upper surface 110S of the chuck body 110 has an elliptical or polygonal shape, the center CP of the chuck 10 can be the center of the ellipse or polygon.
[0032] Furthermore, the arrangement of one or more chuck position identification keys 131a, 131b, 132a, and 132b is associated with... Figure 3BDisclosed are two pairs of chuck position identification keys 131a, 131b, 132a, and 132b facing each other relative to the center CP of the chuck 10; however, this disclosure is not limited thereto, and the number and arrangement of the pairs of chuck position identification keys can be modified in many ways. As an example, Figure 3C Another chuck 10a shown may include a pair of chuck position identification keys 131a and 131b positioned opposite each other relative to the center CP of the chuck 10a. As another example, Figure 3D The other chuck 10b shown may include four pairs of chuck position identification keys 131a, 131b, 132a, 132b, 133a, 133b, 134a, and 134b arranged to face each other relative to the center CP of the chuck 10b.
[0033] Figure 3B , Figure 3C and Figure 3D At least one chuck position identification key shown may be formed on the chuck body 110 as an embossed carving pattern or a recessed carving pattern.
[0034] Combined with reference Figure 2 , Figure 4A and Figure 4B The carrier contact device 20 is configured to be adjacent to the chuck 10. The carrier contact device 20 may include a plurality of push rods 210a, 210b, 210c and 210d, and a plurality of contact position identification keys 220a, 220b, 220c and 220d respectively disposed on the plurality of push rods 210a, 210b, 210c and 210d.
[0035] Multiple push rods 210a, 210b, 210c, and 210d can be arranged such that at least one pair of push rods faces each other from opposite sides relative to the center CP of the chuck 10. (See reference...) Figure 2 Two pairs of push rods 210a, 210b, 210c, and 210d can be positioned on opposite sides relative to the center CP of the chuck 10. In this case, the first to fourth push rods 210a, 210b, 210c, and 210d can be positioned along the periphery of the chuck 10 at 90° intervals relative to the center CP of the chuck 10. As described above, although in Figure 2 The figure shows two pairs of push rods 210a, 210b, 210c and 210d. The number and arrangement of the push rod pairs are not limited to this, and the number and arrangement of the push rod pairs can be modified in many ways.
[0036] Reference Figure 2Multiple push rods 210a, 210b, 210c, and 210d can be moved from the outside of the chuck 10 toward the center CP of the chuck 10 via guide rails 230 on a plane parallel to the upper surface 110S of the chuck 10. (Refer to reference...) Figure 2 , Figure 4A and Figure 4B Each of the plurality of push rods 210a, 210b, 210c, and 210d may have a side surface S1 and a top surface S2. (See reference...) Figures 6A to 6C As described, the side surfaces S1 of the plurality of push rods can contact the side surface of the carrier W. Contact position identification keys 220a, 220b, 220c and 220d can be respectively provided on the upper surfaces S2 of the plurality of push rods 210a, 210b, 210c and 210d.
[0037] Despite Figure 2 , Figure 4A and Figure 4B Although not shown, a position detection unit can be provided to determine the positions of multiple contact position identification keys 220a, 220b, 220c, and 220d. The position detection unit can be set in... Figure 1 The carrier position calculation device 30 is located inside the carrier. In one embodiment, the position detection unit can deduce the positions of multiple contact position identification keys 220a, 220b, 220c, and 220d that have moved together with multiple push rods 210a, 210b, 210c, and 210d. In one embodiment, in order to deduce the positions of the multiple contact position identification keys 220a, 220b, 220c, and 220d, the position detection unit can read images of the chuck reference key 130 and the multiple contact position identification keys 220a, 220b, 220c, and 220d obtained by the camera 50.
[0038] Refer again Figure 2 The connector 40 can be positioned above the chuck 10. The connector 40 can be configured to transfer individually disposed semiconductor dies to attach the semiconductor dies to a carrier mounted on the chuck 10. (The last sentence appears to be incomplete and possibly refers to a different context.) Figure 8 As described in detail, each engagement head 40 may include an engagement head reference key located at a position facing the chuck 10. Figure 8(405 in the original text). The connector reference key 405 can provide a reference for correcting the position of the connector 40. As an example, the reference value input to the connector reference key can set information about the start or end of the operation of the connector 40. Furthermore, when the connector 40 repeats the semiconductor die attachment operation, a positional deviation relative to the reference position may occur due to errors that occur during movement. As will be described later, in one embodiment of this disclosure, the connector reference key 405 of the connector 40 can be compared with the chuck reference key 130 provided at a fixed position on the chuck 10 so that it can be determined whether a positional deviation relative to the reference position has occurred and the magnitude of such deviation. In addition, the reference position of the connector 40 can be corrected to correct the positional deviation. Thus, the reliability of the die attachment operation of the connector 40 can be improved.
[0039] Reference Figure 2 The coupling head 40 can move in a third direction (i.e., the z-direction) when connected to the first connecting member 410. Although not shown, the coupling head 40 can move in a third direction (i.e., the z-direction) via a track formed in the first connecting member 410. The first connecting member 410 can be connected to a third connecting member 430 when connected to the second connecting member 420. Although not shown, the coupling head 40 connected to the second connecting member 420 can move in a second direction (i.e., the y-direction) by moving the second connecting member 420 via a track formed in the third connecting member 430. In addition, both ends of each third connecting member 430 are connected to a fourth connecting member 440a and a fifth connecting member 440b, respectively, and the fourth connecting member 440a and the fifth connecting member 440b can move on the first track 1001a and the second track 1001b, respectively, so that the coupling head 40 can move in a first direction (i.e., the x-direction). Figure 2 A pair of coupling heads 40 is shown as an embodiment, but the present disclosure is not limited thereto, and various numbers of coupling heads 40 may be provided.
[0040] Refer again Figure 2 You can set the camera to 50. For example... Figure 8 As shown in detail below, each camera 50 may include a camera body 510 and an imaging device 520. The imaging device 520 may include an image sensor and a lens for capturing images. (As will be discussed later...) Figures 6A to 6C As described, the imaging device 520 can acquire images of the chuck reference key 130 of the chuck 10 and the contact position identification keys 220a, 220b, 220c, and 220d of the carrier contact device 20. Additionally, as will be discussed later... Figure 8As described, the imaging device 520 can acquire images of the joint reference key 405 of the joint 40 and the chuck reference key 130 of the chuck 10.
[0041] Despite Figure 2 Not shown in the image, but refer to... Figure 1 The described carrier position calculation device 30 can determine the position of the carrier on the chuck 10 based on image data obtained from images acquired by the camera 50. Additionally, refer to... Figure 1 The described joint control device 60 includes a joint position correction unit 62 that can determine the positional deviation of the joint reference key 405 of the joint 40 based on the chuck reference key 130, using image data from an image acquired by the camera 50. The joint position correction unit 62 can correct errors related to the operation of the joint 40 by correcting the read positional deviation. (See reference...) Figure 1 The joint drive unit 64 of the described joint control device 60 can reference a corrected error value when driving the joint 40.
[0042] Figure 5 This is a flowchart schematically illustrating a method for reading the location of a carrier according to one embodiment of the present disclosure. Figures 6A to 6C This is a diagram illustrating a method for reading the location of a carrier according to one embodiment of the present disclosure. In one embodiment, it can be achieved by using... Figure 1 Semiconductor manufacturing equipment 1 or more combined Figure 2 , 3A The semiconductor manufacturing equipment 2 described in 3B, 4A and 4B performs the operation according to Figure 5 The method for reading the carrier position in the flowchart.
[0043] Reference Figure 5 Operation S110 provides a chuck with a chuck reference key at the edge portion. (As in combination) Figure 2 , Figure 3A and Figure 3B As described, the chuck reference key can be located at an edge portion of the upper surface of the chuck body constituting the chuck. The chuck reference key may include at least one chuck position identification key indicating a fixed position on the upper surface of the chuck body.
[0044] Reference Figure 5 In operation S120, the carrier W is placed on the chuck. According to one embodiment, as... Figure 6AAs shown, the carrier W can be located on the upper surface 110S of the chuck body 110. The carrier W can be positioned so as not to cover the chuck position identification keys 131a, 131b, 132a, and 132b of the chuck reference key 130 on the upper surface 110S of the chuck body 110. That is, the chuck position identification keys 131a, 131b, 132a, and 132b are exposed on the upper surface 110S of the chuck body 110 on which the carrier W is placed.
[0045] Furthermore, during operation S120, the carrier W may not be fixed to the chuck 10. In one embodiment, the chuck 10 may not perform the pass / fail operation. Figure 3A The vacuum flow path 120 draws air, thus allowing the carrier W to be freed from being fixed to the chuck 10. In another embodiment, the chuck can... Figure 3A The vacuum flow path 120 ejects air so that the carrier W can remain floating on the chuck 10.
[0046] Reference Figure 5 In operation S130, the carrier is secured to the chuck using a carrier contact device including a position recognition key. In one embodiment, reference will be made to... Figures 6A to 6C Detailed description of operation S130. Refer to... Figure 6A The carrier contact device 20 is positioned adjacent to the chuck 10 on which the carrier W is placed on its upper surface 110S. The carrier contact device 20 includes first push rods to fourth push rods 210a, 210b, 210c, and 210d. In addition, the carrier contact device 20 may include first contact position identification keys to fourth contact position identification keys 220a, 220b, 220c, and 220d respectively provided on the first push rods to fourth push rods 210a, 210b, 210c, and 210d.
[0047] The first push rod 210a and the third push rod 210c can be positioned on opposite sides of the center CP of the chuck 10. The second push rod 210b and the fourth push rod 210d can be positioned on opposite sides of the center CP of the chuck 10. The first to fourth push rods 210a, 210b, 210c and 210d can be positioned at 90° intervals along the periphery of the chuck 10 relative to the center CP of the chuck 10.
[0048] Each of the first to fourth push rods 210a, 210b, 210c, and 210d can be mounted on a guide rail 230 facing the center CP of the chuck 10. The guide rail 230 can be mounted on a plane parallel to the upper surface 110S of the chuck 10. Figure 6A As shown, the first push rod to the fourth push rod 210a, 210b, 210c and 210d can be set to be spaced apart from the chuck 10.
[0049] Reference Figure 6B The first to fourth push rods 210a, 210b, 210c, and 210d can move on the guide rail 230 toward the center CP of the chuck 10. Specifically, the first push rod 210a, the second push rod 210b, the third push rod 210c, and the fourth push rod 210d can move along a first direction R1, a second direction R2, a third direction R3, and a fourth direction R4, respectively, on a plane configured to move toward the center CP of the chuck 10 on a plane parallel to the upper surface 110S of the chuck 10.
[0050] Reference Figure 6C The first to fourth push rods 210a, 210b, 210c, and 210d, which move toward the center CP of the chuck 10, can contact the carrier W. Furthermore, during the contact of the carrier W by the first to fourth push rods 210a, 210b, 210c, and 210d, they can apply the same amount of force to the carrier W along the first to fourth directions R1, R2, R3, and R4, respectively. Subsequently, when the forces applied in the first to fourth directions R1, R2, R3, and R4 are balanced, the carrier W can be fixed to the upper surface 110S of the chuck 10.
[0051] Reference Figure 5 In operation S140, the position of the carrier on the chuck can be determined by reading the chuck reference key and the contact position identification key. According to one embodiment, such as… Figure 6C As shown, with the carrier W fixed by the first push rod to the fourth push rods 210a, 210b, 210c, and 210d, multiple chuck position identification keys 131a, 131b, 132a, and 132b of the chuck reference key 130 and the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d of the carrier contact device 20 can be read. In this case, the process of reading the multiple chuck position identification keys 131a, 131b, 132a, and 132b and the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d may include using the reference... Figure 1 and Figure 2 The described process of the camera 50 acquiring an image including multiple chuck position recognition keys 131a, 131b, 132a and 132b and first contact position recognition keys to fourth contact position recognition keys 220a, 220b, 220c and 220d, and the process of using the above references Figure 1The described carrier position calculation device 30's position detection unit identifies images of multiple chuck position recognition keys 131a, 131b, 132a and 132b, as well as first contact position recognition keys to fourth contact position recognition keys 220a, 220b, 220c and 220d.
[0052] In one embodiment, the process of identifying images of a plurality of chuck position identification keys 131a, 131b, 132a, and 132b, and first contact position identification keys to fourth contact position identification keys 220a, 220b, 220c, and 220d may include comparing the shapes of the chuck position identification keys and contact position identification keys in the obtained images with standard shapes of chuck position identification keys and contact position identification keys stored in a position detection unit. When the shapes in the obtained images correspond to the standard shapes, the center points of the shapes of the plurality of chuck position identification keys 131a, 131b, 132a, and 132b in the obtained images can be determined as first points, and the center points of the shapes of the first contact position identification keys to fourth contact position identification keys 220a, 220b, 220c, and 220d in the obtained images can be determined as second points.
[0053] Subsequently, the positions of the first contact position identification keys 131a, 131b, 132a, and 132b, and the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d can be determined using the read multiple chuck position identification keys 131a, 131b, 132a, and 132b, as well as the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d. In one embodiment, since the positions of the multiple chuck position identification keys 131a, 131b, 132a, and 132b are fixed or predetermined positions on the chuck body 110, the positions of the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d can be determined relatively based on the positions of the multiple chuck position identification keys 131a, 131b, 132a, and 132b. In one embodiment, after modifying the first point to a fixed or predetermined position, the second point is modified based on the modified first point. The modified second point can be determined as the positions of the first contact position identification key to the fourth contact position identification keys 220a, 220b, 220c, and 220d. Furthermore, the position of the carrier W on the upper surface 110S of the chuck body 110 can be deduced based on the determined positions of the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d.
[0054] In one embodiment, the method for deriving the position of the carrier W may include representing the determined positions of the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d as corresponding coordinates on the upper surface 110S, and deriving the center coordinates of the carrier W by calculating the coordinates. In one embodiment, the process of determining the positions of the first contact position identification keys to the fourth contact position identification keys 220a, 220b, 220c, and 220d and deriving the position of the carrier W can be achieved by using a combination of Figure 1 The carrier position calculation device 30 described herein performs the calculation.
[0055] As described above, according to one embodiment of this disclosure, the position of a carrier disposed on the chuck can be determined by using a chuck including a chuck reference key and a carrier contact device including a contact position identification key. In this case, regardless of whether the carrier has a separate identification key or identification pattern for position reading, the position of the carrier can be relatively determined based on the position of the chuck reference key disposed at a fixed position on the chuck. Therefore, when performing a semiconductor process on the carrier on the chuck, the position of the carrier on the chuck can be read more reliably, and the carrier position information can be used for the performance of the semiconductor process.
[0056] Figure 7 This is a flowchart schematically illustrating a method for attaching a semiconductor die according to an embodiment of the present disclosure. Figure 8 This is a diagram schematically illustrating a process in a method of attaching a semiconductor die according to an embodiment of the present disclosure. In one embodiment, it can be achieved by using... Figure 1 Semiconductor manufacturing equipment 1 or above (refer to) Figure 2 , Figure 3A , Figure 3B , Figure 3C , Figure 4A and Figure 4B The semiconductor manufacturing equipment 2 is used to perform according to Figure 7 The flowchart describes a method for attaching semiconductor dies.
[0057] Reference Figure 7 In operation S210, the carrier is positioned on a chuck including a chuck reference key at the edge portion. In one embodiment, as... Figure 3B As shown, the chuck reference key 130 may include one or more chuck position identification keys 131a, 131b, 132a and 132b that indicate a fixed portion on the upper surface 110S of the chuck 10.
[0058] In one implementation, operation S210 may include a process of determining the position of the carrier on the chuck. As an example, the process of determining the position of the carrier may include the above-mentioned... Figure 5Operations S110 to S140 are described. Specifically, operation S210 may include the process of placing a carrier on the chuck, the process of securing the carrier on the chuck using a carrier contact device including a contact position identification key, and the process of reading the chuck reference key and the contact position identification key to determine the position of the carrier on the chuck. As a result, the carrier can be positioned on the chuck based on the position read from the chuck reference key. Furthermore, in operation S210, this can be performed by setting the carrier to not cover the chuck reference key. Figure 7 Operation S220. According to one embodiment... Figure 1 In semiconductor manufacturing equipment, the carrier position calculation device 30 can transmit information about the position of the read carrier to... Figure 1 The joint control device 60.
[0059] Reference Figure 7 Operation S220 involves using a connector including a connector reference key to move the semiconductor die to a predetermined position above the chuck reference key. In one embodiment, the reference key is used... Figure 2 and Figure 8 The semiconductor die can be conveyed using the connector 40 to a predetermined position directly above one of the chuck position identification keys 131a, 131b, 132a, and 132b selected from the chuck reference key 130. In one embodiment, the selected chuck position identification key may be the chuck position identification key located closest to the set attachment position on the carrier W where the semiconductor die will be attached.
[0060] Reference Figure 7 In operation S230, images of the chuck reference key and the engagement head reference key are acquired using a camera. In one embodiment, the reference key is used in conjunction with... Figure 2 and Figure 8 The camera 50 is moved so that the imaging device 520 is positioned between the chuck reference key 130 of the chuck 10 and the engagement reference key 405 of the engagement head 40. The imaging device 520 of the camera 50 may include a first imaging unit 520a and a second imaging unit 520b disposed in a different direction from the camera body 510. The first imaging unit 520a and the second imaging unit 520b may sequentially or simultaneously photograph the engagement reference key 405 and the chuck reference key 130 to generate imaging data. As an example, such as Figure 8 As shown, the first imaging unit 520a can capture the joint reference key 405 of the joint 40 located above the camera 50, and the second imaging unit 520b can capture the chuck reference key 130 of the chuck 10 located below the camera 50.
[0061] Reference Figure 7In operation S240, based on image data obtained from an image captured by a camera, the positional deviation between the engagement head reference key and the chuck reference key at a predetermined position is determined. According to one embodiment, as described above... Figure 2 , Figure 3A and Figure 3B The positions of one or more chuck position identification keys 131a, 131b, 132a, and 132b of the chuck reference key 130 can be fixed positions on the chuck 10. If, based on image data obtained from an image acquired by the camera 50, a positional deviation occurs between the engagement head reference key 405 of the engagement head 40 and a selected chuck position identification key in the chuck reference key 130, it can be determined that this positional deviation is caused by positional changes accumulated during operation of the engagement head 40. According to one embodiment... Figure 1 In semiconductor manufacturing equipment, operation S240 can be performed by the joint position correction unit 62 of the joint control device 60.
[0062] Reference Figure 7 In operation S250, the read position deviation is corrected and the semiconductor die is attached to the carrier. In one embodiment, refer to… Figure 8 When a positional deviation of the connector reference key 405 occurs at the selected chuck position identification key position of the chuck reference key 130, the operational error of the connector 40 can be corrected by correcting this positional deviation. Then, the semiconductor die can be transferred to the designated attachment position on the carrier W using the connector 40 whose operational error has been corrected. Subsequently, the connector 40 can attach the semiconductor die to the designated attachment position on the carrier W. According to one embodiment... Figure 1 In semiconductor manufacturing equipment, operation S250 can be performed by the joint position correction unit 62 and the joint drive unit 64 of the joint control device 60.
[0063] By performing the above process, the semiconductor die according to the embodiments of this disclosure can be attached to the carrier.
[0064] In some embodiments, when multiple semiconductor dies are attached to a carrier, the operation error correction process of the connector 40 associated with operations S220 to S250 can be performed each time each of the multiple semiconductor dies is attached to the carrier W. In other embodiments, when multiple semiconductor dies are attached to a carrier, the operation error correction process of the connector 40 associated with operations S220 to S250 can be performed only during the attachment process of some of the multiple semiconductor dies. That is, when multiple semiconductor dies are attached to a carrier, all operations S210 to S250 can be performed for some semiconductor dies, and the operation error correction process of the connector 40 in operations S210 to S250 can be omitted for some semiconductor dies. As an example, when performing the operation of attaching multiple semiconductor dies to a carrier, the operation error correction process of the connector 40 can be performed periodically.
[0065] As described above, according to one embodiment of this disclosure, in the method of attaching a semiconductor die, the operational error of the connector can be corrected by using a chuck including a chuck reference key and a connector including a connector reference key. By correcting the positional deviation of the connector reference key based on the chuck reference key, the semiconductor die can be reliably attached to a more accurate position on the carrier.
[0066] Embodiments of this disclosure have been disclosed for illustrative purposes. Those skilled in the art will understand that various modifications, additions, and substitutions may be made without departing from the scope and spirit of this disclosure and the appended claims.
[0067] Cross-references to related applications
[0068] This application claims priority to Korean Application No. 10-2020-0170699, filed on December 8, 2020, the entire contents of which are incorporated herein by reference.
Claims
1. A semiconductor manufacturing apparatus, the semiconductor manufacturing apparatus comprising: A chuck for receiving a carrier, the chuck including a chuck reference key located at an edge portion of the chuck; A carrier contact device, the carrier contact device including a contact position identification key, the carrier contact device contacting the carrier on the chuck; A connector that transfers a semiconductor die to the carrier and attaches the semiconductor die to the carrier; as well as The camera acquires images of the chuck reference key and the contact position recognition key. The carrier contact device includes: A plurality of push rods, spaced apart from the chuck, are movable toward the center of the chuck in a plane parallel to the upper surface of the chuck; and A contact position identification key is provided on each of the plurality of push rods.
2. The semiconductor manufacturing apparatus according to claim 1, further comprising a connector control device connected to the camera and the connector. in, The joint control device includes: A connector position correction unit, which determines the positional deviation between the connector reference key and the chuck reference key of the connector based on image data obtained through the camera, and corrects the operational error of the connector based on the determined positional deviation; and A joint drive unit that drives the joint based on a corrected operating error.
3. The semiconductor manufacturing equipment according to claim 1, wherein, The chuck reference key includes at least one chuck position identification key that indicates a fixed position on the upper surface of the chuck.
4. The semiconductor manufacturing equipment according to claim 1, wherein, The plurality of push rods are positioned such that at least one pair of push rods are positioned facing each other on opposite sides relative to the center of the chuck.
5. The semiconductor manufacturing equipment according to claim 1, wherein, The plurality of push rods are arranged at 90° intervals along the periphery of the chuck relative to the center of the chuck.
6. The semiconductor manufacturing apparatus according to claim 1, further comprising a carrier position calculation device connected to the carrier contact device. in, The carrier position calculation device performs the operation of reading the chuck reference key and the contact position identification key when the plurality of push rods contact the carrier, and performs the operation of determining the position of the carrier on the chuck based on the position of the read chuck reference key and the contact position identification key.
7. The semiconductor manufacturing apparatus according to claim 6, further comprising: The position detection unit is located within the carrier position calculation device. The process of reading the chuck reference key and the contact position identification key includes the following operations: The images of the chuck reference key and the contact position recognition key are identified by comparing the shapes of the chuck reference key and the contact position recognition key in the obtained image with the standard shapes of the chuck reference key and the contact position recognition key stored in the position detection unit; Adjust the center point of the shape of the chuck reference key in the obtained image to a fixed position; and The center point of the shape of the contact position identification key in the obtained image is adjusted based on the adjusted center point of the shape of the chuck reference key in the obtained image, thereby determining the position of the contact position identification key.
8. The semiconductor manufacturing equipment according to claim 1, wherein, The coupling head includes a coupling head reference key, which is positioned facing the chuck.
9. The semiconductor manufacturing equipment according to claim 8, wherein, The camera acquires images of the chuck reference key and the connector reference key between the chuck and the connector.
10. A method for reading the location of a carrier, the method comprising the following steps: A chuck is provided that includes a chuck reference key, the chuck reference key being formed at an edge portion of the chuck; Place the carrier on the chuck; The carrier is fixed to the chuck by using a carrier contact device including a contact position recognition key; as well as The position of the carrier on the chuck is determined by reading the chuck reference key and the contact position identification key. The step of fixing the carrier to the chuck includes the following steps: At least one pair of push rods are positioned facing each other on opposite sides relative to the center of the chuck, each of the at least one pair of push rods includes the contact position identification key, and the at least one pair of push rods are spaced apart from the chuck; and The at least one pair of push rods are secured to the carrier by moving the at least one pair of push rods toward the center of the chuck.
11. The method according to claim 10, wherein, The step of placing the at least one pair of push rods includes the following steps: arranging two pairs of push rods along the periphery of the chuck, and In this configuration, each of the two pairs of push rods is arranged at a 90° interval relative to the center of the chuck along the periphery of the chuck.
12. The method according to claim 10, wherein, The steps for reading the chuck reference key and the contact position identification key include the following steps: When the carrier is fixed, images of the chuck reference key and the contact position recognition key are obtained using a camera; and Read the chuck reference key and the contact position identification key from the acquired image.
13. The method according to claim 12, wherein, The step of determining the location of the carrier includes the following steps: The position of the contact position identification key is determined relative to the position of the chuck reference key by using the read chuck reference key and the contact position identification key; and The position of the carrier on the chuck is deduced based on the determined position of the contact position identification key.
14. A method for attaching a semiconductor die, the method comprising the steps of: The carrier is placed on a chuck including a chuck reference key, the chuck reference key being formed at the edge portion of the chuck; The semiconductor die is delivered to a predetermined position above the chuck reference key using a connector including a connector reference key; Images of the chuck reference key and the engagement head reference key are obtained using a camera. Based on the image data obtained through the camera, the positional deviation between the engagement head reference key and the chuck reference key at the predetermined position is read; as well as The read position deviation is corrected, and the semiconductor die is attached to the carrier. The step of placing the carrier on the chuck includes the following steps: reading the position of the carrier on the chuck. The step of reading the position of the carrier includes the following steps: Place the carrier on the chuck; The carrier is fixed to the chuck by using a carrier contact device including a contact position identification key; and The position of the carrier on the chuck is determined by reading the chuck reference key and the contact position identification key. The step of fixing the carrier to the chuck includes the following steps: At least one pair of push rods are positioned facing each other on opposite sides relative to the center of the chuck, each of the at least one pair of push rods includes the contact position identification key, and the at least one pair of push rods are spaced apart from the chuck; and The at least one pair of push rods are secured to the carrier by moving the at least one pair of push rods toward the center of the chuck.
15. The method according to claim 14, wherein, The chuck reference key includes at least one chuck position identification key that indicates a fixed position on the upper surface of the chuck.
16. The method according to claim 15, wherein, The step of transferring the semiconductor die to the predetermined position includes the following steps: moving the connector to a position directly above one of the at least one chuck position identification keys, and Among the at least one chuck position identification key, the chuck position identification key is positioned at the designated attachment position on the carrier where the semiconductor die is to be attached.
17. The method of claim 14, wherein, The steps of obtaining images of the chuck reference key and the coupling head reference key include the following steps: Move the camera between the chuck reference key of the chuck and the joint reference key of the joint; The reference key for the connector is positioned above the camera; and The reference key for the chuck is positioned below the camera.
18. The method according to claim 14, wherein, The step of attaching the semiconductor die to the carrier includes the following steps: The read positional deviation is corrected to correct the operational error of the joint; The semiconductor die is transferred to a predetermined attachment position on the carrier using the connector, which has been corrected for the operational error; and The semiconductor die is attached to the designated attachment position on the carrier by using the connector.