Display panel, manufacturing method thereof, and display device

Abstract

Embodiments of the present application provide a display panel, a preparation method thereof, and a display device. In the display panel provided by the embodiments of the present application, a groove structure is provided at a position corresponding to the conductive structure in the first insulating layer, and the groove structure partially exposes the conductive structure. Thus, in the subsequent process of preparing the organic light-emitting layer, the formed first light-emitting layer and the second light-emitting layer are partitioned, so that the first sub-structure and the second sub-structure are not covered by the organic light-emitting material. Thus, in the subsequent process of depositing the electrode material, one end of the first cathode can extend to cover the groove structure and be connected to the first sub-structure, so that the first cathode is connected to the first auxiliary electrode, and it can be ensured that the first cathode and the second cathode are partitioned. Thus, the length of the third sub-structure protruding from the first sub-structure can be shortened, the probability of breakage of the protruding part of the third sub-structure can be reduced, the probability of damage to the conductive structure can be reduced, and the yield of the display panel can be guaranteed.

Description

Technical Field

[0001] The present application relates to the field of display technologies. Specifically, the present application relates to a display panel, a method for manufacturing the same, and a display device. Background Art

[0002] With the development of display technologies, there are more and more types of OLED (Organic Light-Emitting Diode) display products, which have a wide range of application scenarios.

[0003] For existing OLED display products, especially for top-emitting OLED devices, in order to increase the light transmittance, the cathode located on the light-emitting side often needs to be made of a material with a relatively high light transmittance, and this material often has a relatively large resistivity, resulting in an increase in the cathode resistance. As a result, there will be an obvious voltage drop after the current passes through the cathode, and further, the cathode voltage corresponding to the OLED device farther from the power input end is smaller, leading to the problem of uneven brightness of the display panel.

[0004] Currently, some manufacturers set a first auxiliary electrode and a conductive structure. The conductive structure is used to disconnect the entire cathode layer and connect the disconnected cathode to the first auxiliary electrode, thereby reducing the cathode resistance. However, during the manufacturing process of the OLED display panel, especially during the manufacturing process of the organic light-emitting layer, the conductive structure is easily damaged, thereby affecting the yield of the display panel. Summary of the Invention

[0005] Aiming at the shortcomings of the existing methods, the present application provides a display panel, a method for manufacturing the same, and a display device, so as to solve the technical problem that the conductive structure for connecting the auxiliary electrode and the cathode is easily damaged during the manufacturing process of OLED display products in the prior art.

[0006] In a first aspect, an embodiment of the present application provides a display panel, including: a first region; the first region includes:

[0007] a stacked substrate, a wiring layer, a first auxiliary electrode, and a first insulating layer; a via is formed in the first insulating layer corresponding to the first auxiliary electrode;

[0008] a conductive structure, including a stacked first sub-structure, second sub-structure, and third sub-structure. The first sub-structure is connected to the first auxiliary electrode and one side of the first insulating layer through the via; a groove structure is provided in the first insulating layer between the first sub-structure and the first auxiliary electrode, and a part of the groove structure is exposed outside the conductive structure;

[0009] A first light-emitting layer and a first cathode are sequentially stacked on one side of a first insulating layer away from the substrate. One end of the first cathode extends to cover the groove structure and is connected to the first sub-structure; the resistivity of the first auxiliary electrode is less than that of the first cathode.

[0010] A second light-emitting layer and a second cathode are sequentially stacked on one side of the conductive structure away from the first auxiliary electrode.

[0011] In a second aspect, an embodiment of the present application provides a display device, including: the display panel provided in the first aspect above.

[0012] In a third aspect, an embodiment of the present application provides a method for manufacturing a display panel, including:

[0013] After preparing a wiring layer and a first auxiliary electrode on one side of the substrate in the first region, a first initial insulating layer is prepared.

[0014] The first initial insulating layer is patterned to obtain a second initial insulating layer including vias.

[0015] A conductive structure is prepared on one side of the second initial insulating layer away from the substrate. The conductive structure includes a stacked first sub-structure, a second sub-structure, and a third sub-structure, such that the first sub-structure is connected to the first auxiliary electrode and one side of the second initial insulating layer through a via.

[0016] The second initial insulating layer is patterned such that the second initial insulating layer between the first sub-structure and the first auxiliary electrode forms a groove structure, and the groove structure is partially exposed on the conductive structure to obtain a first insulating layer.

[0017] A light-emitting layer is prepared on one side of the conductive structure and the first insulating layer to obtain a first light-emitting layer on one side of the first insulating layer and a second light-emitting layer on one side of the conductive structure.

[0018] Electrode material is deposited on one side of the first light-emitting layer and the second light-emitting layer to obtain a first cathode on one side of the first light-emitting layer and a second cathode on one side of the second light-emitting layer, such that one end of the first cathode extends to cover the groove structure and is connected to the first sub-structure; the resistivity of the first auxiliary electrode is less than that of the first cathode.

[0019] The beneficial technical effects brought by the technical solutions provided in the embodiments of the present application include:

[0020] In the display panel provided by the embodiment of the present application, a groove structure is provided at a position corresponding to the first sub-structure of the conductive structure. The groove structure partially exposes the conductive structure. Thus, in the subsequent process of preparing the organic light-emitting layer, a first light-emitting layer located on one side of the first insulating layer and a second light-emitting layer located on one side of the conductive structure are formed. The first light-emitting layer and the second light-emitting layer are separated, so that the first sub-structure and the second sub-structure will not be covered by the organic light-emitting material. Thus, in the subsequent process of depositing the electrode material, one end of the first cathode can extend to cover the groove structure and be connected to the first sub-structure, so that the first cathode is connected to the first auxiliary electrode, and it can be ensured that the first cathode is separated from the second cathode. Thus, the length of the third sub-structure of the conductive structure protruding from the first sub-structure can be shortened, and the probability of breakage of the part of the third sub-structure protruding from the first sub-structure can be reduced. Thus, the probability of damage to the conductive structure can be reduced, and the yield of the display panel can be guaranteed.

[0021] Moreover, the first cathode distributed around the conductive structure is electrically connected to the first auxiliary electrode with a smaller resistivity through the conductive structure, which can overall reduce the resistivity of the cathode layer, reduce the voltage drop of the signal transmitted based on the cathode layer, is beneficial to the transmission of the signal, and is beneficial to improving the reliability of the operation of the display panel.

[0022] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present application will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, in which:

[0024] Figure 1 is a schematic top view of the structure of a display panel provided by an embodiment of the present application;

[0025] Figure 2 is provided by an embodiment of the present application Figure 1 is a schematic cross-sectional view of the BB-direction structure in the shown display panel;

[0026] Figure 3 is provided by an embodiment of the present application Figure 2 is a schematic structural view of the first sub-structure in the shown conductive structure;

[0027] Figure 4 is a schematic top view of the structure of another display panel provided by an embodiment of the present application;

[0028] Figure 5 is a schematic flow chart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0029] Figure 6It is a schematic structural diagram after preparing a groove structure in a method for manufacturing a display panel provided by an embodiment of the present application.

[0030] Explanation of reference numerals:

[0031] 101 - First region; 102 - Second region;

[0032] 10 - Substrate; 20 - Wiring layer; 30 - First auxiliary electrode;

[0033] 40 - First insulating layer; 41 - Groove structure;

[0034] 50 - Conductive structure; 51 - First sub - structure; 511 - Via segment; 512 - Connection segment; 52 - Second sub - structure; 53 - Third sub - structure;

[0035] 61 - First light - emitting layer; 62 - Second light - emitting layer;

[0036] 71 - First cathode; 72 - Second cathode; 80 - Light - emitting device; 90 - Second auxiliary electrode. Detailed implementation manners

[0037] The embodiments of the present application will be described below with reference to the accompanying drawings in the present application. It should be understood that the embodiments described below in conjunction with the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not constitute limitations on the technical solutions of the embodiments of the present application.

[0038] Those skilled in the art of the present technology can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the" and "said" used herein may also include the plural forms. It should be further understood that the term "comprising" used in the specification of the present application means the presence of the described features, integers, steps and / or operations, but does not exclude the presence of other features, information, data, steps, operations and / or combinations thereof supported by the art of the present technology. The term "and / or" used herein means at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or implemented as "B", or implemented as "A and B".

[0039] To make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0040] First, the related technologies involved in the present application will be described:

[0041] In current OLED display panels, the cathodes of various light-emitting devices are often connected as an integral film layer. Therefore, if the resistance of the cathode is too large, a large voltage drop will occur after the current passes through, which will lead to uneven brightness of the display panel. For the solution of reducing the cathode resistance by setting an auxiliary electrode, since the auxiliary electrode and the cathode are often located in different film layers, it is necessary to set a conductive structure with a certain height to disconnect the entire cathode film layer and connect the auxiliary electrode and the cathode, thereby reducing the resistance of the cathode.

[0042] Moreover, in the preparation process of the display panel, the preparation process of the organic light-emitting layer is earlier than the preparation process of the cathode. Therefore, in order to avoid the evaporated organic light-emitting layer covering the part of the conductive structure to be connected to the subsequently prepared cathode, it is often necessary to set the conductive structure to a sandwich structure including an upper part, a middle part and a lower part, and the upper part protrudes relative to the middle part and the lower part, that is, the cross-section of the conductive structure is an I-shape, so that in the process of evaporating the organic light-emitting layer, the organic light-emitting layer will not cover the lower part, so that the lower part can be connected to the subsequently prepared cathode.

[0043] However, for the conductive structure, since the upper part protrudes relative to the middle part, the part of the upper part protruding from the middle part is suspended. Since this part has no support, during the preparation of the display panel, especially during the preparation of the organic light-emitting layer, before preparing the organic light-emitting layer, it is necessary to use a Brush (brushing) process and an HPMJ (High Pressure Mega-SonicJet) process to clean the surface of the film layer used to deposit the organic light-emitting layer. In the above cleaning process, the brush and the high-pressure liquid flow will directly act on the upper part of the conductive structure, making the suspended part of the upper part easy to break, causing damage to the conductive structure. The organic light-emitting layer will cover the part of the conductive structure that is to be connected to the cathode prepared later, thereby affecting the connection between the cathode and the conductive structure, resulting in the cathode being unable to be connected to the auxiliary electrode, thereby failing to solve the problem of uneven brightness of the display panel, thereby affecting the yield of the display panel.

[0044] Furthermore, if the broken portion of the conductive structure enters the region corresponding to the light-emitting device, dark spots may appear in the light-emitting device prepared subsequently, resulting in a further reduction in the yield of the display panel.

[0045] The display panel and its preparation method, and the display device provided in the present application are aimed at solving the above technical problems in the prior art.

[0046] The following is a detailed description of the technical solution of the present application and how the technical solution of the present application solves the above technical problems with specific embodiments. It should be noted that the following implementations can refer to, draw on or combine with each other, and the same terms, similar features and similar implementation steps in different implementations will not be described repeatedly.

[0047] An embodiment of the present application provides a display panel. The schematic structural diagram of the display panel is as Figure 1 shown. Figure 1 The schematic cross-sectional structure diagram of the first region in the shown display panel in the BB direction is as Figure 2 shown. The display panel includes: a first region 101. The first region 101 includes: a stacked substrate 10, a wiring layer 20, and a first auxiliary electrode 30, and a first insulating layer 40; a via is formed in the first insulating layer 40 corresponding to the first auxiliary electrode 30.

[0048] The first region 101 further includes: a conductive structure 50, a first light-emitting layer 61, a first cathode 71, a second light-emitting layer 62, and a second cathode 72. The conductive structure 50 includes stacked first sub-structure 51, second sub-structure 52, and third sub-structure 53. The first sub-structure 51 is connected to one side of the first auxiliary electrode 30 and the first insulating layer 40 through a via; a groove structure 41 is provided in the first insulating layer 40 between the first sub-structure 51 and the first auxiliary electrode 30, and the groove structure 41 partially exposes the conductive structure 50. For the setting position and specific structure of the groove structure 41, please refer to Figure 6 .

[0049] The first light-emitting layer 61 and the first cathode 71 are sequentially stacked on one side of the first insulating layer 40 away from the substrate 10. One end of the first cathode 71 extends to cover the groove structure 41 and is connected to the first sub-structure 51; the resistivity of the first auxiliary electrode 30 is less than the resistivity of the first cathode 71. The second light-emitting layer 62 and the second cathode 72 are sequentially stacked on one side of the conductive structure 50 away from the first auxiliary electrode 30.

[0050] In the display panel provided by the embodiment of the present application, a groove structure 41 is provided at a position corresponding to the first sub-structure 51 of the first insulating layer 40 and the conductive structure 50. The groove structure 41 partially exposes the conductive structure 50. Thus, in the subsequent process of preparing the organic light-emitting layer, a first light-emitting layer 61 on one side of the first insulating layer 40 and a second light-emitting layer 62 on one side of the conductive structure 50 are formed. The first light-emitting layer 61 and the second light-emitting layer 62 are separated, that is, the first light-emitting layer 61 and the second light-emitting layer 62 do not contact and connect, so that the first sub-structure 51 and the second sub-structure 52 are not covered by the organic light-emitting material. Thus, in the subsequent process of depositing the electrode material, one end of the first cathode 71 can extend to cover the groove structure 41 and connect with the first sub-structure 51, so that the first cathode 71 is connected to the first auxiliary electrode 30, and it can be ensured that the first cathode 71 is separated from the second cathode 72. Thus, the length of the third sub-structure 53 of the conductive structure 50 protruding from the first sub-structure 51 can be shortened, the probability of breakage of the part of the third sub-structure 53 protruding from the first sub-structure 51 can be reduced, the probability of damage to the conductive structure 50 can be reduced, and the yield of the display panel can be guaranteed.

[0051] Moreover, the first cathode 71 distributed around the conductive structure 50 is electrically connected to the first auxiliary electrode 30 with a smaller resistivity through the conductive structure 50, which can overall reduce the resistivity of the cathode layer, reduce the voltage drop of the signal transmitted based on the cathode layer, is beneficial to the transmission of the signal, and is beneficial to improving the reliability of the display panel operation.

[0052] In the embodiment of the present application, as Figure 2 shown, a wiring layer 20 is provided on one side of the substrate 10. Optionally, the wiring layer 20 is the film layer where the signal wiring in the display panel is located. Optionally, as Figure 2 shown, the wiring layer 20 and the first auxiliary electrode 30 are arranged in the same layer. A first insulating layer 40 is provided on the side of the wiring layer 20 and the first auxiliary electrode 30 away from the substrate 10. A via hole is provided in the first insulating layer 40 corresponding to the first auxiliary electrode 30, so that the conductive structure 50 can be connected to the first auxiliary electrode 30 through the via hole. Optionally, the first insulating layer 40 is a PVX (Passivation) layer. The material of the first insulating layer 40 may include inorganic materials. Optionally, the material of the first insulating layer 40 is SiO 2 (silicon dioxide).

[0053] In the embodiment of the present application, a conductive structure 50 is provided on the side of the first insulating layer 40 away from the substrate 10. Along the direction from the substrate 10 to the first insulating layer 40, the conductive structure 50 includes a first sub-structure 51, a second sub-structure 52, and a third sub-structure 53 that are sequentially stacked, as Figure 2As shown, the first sub-structure 51 is connected to the first auxiliary electrode 30 through a via hole in the first insulating layer 40, and the first sub-structure 51 is connected to the peripheral wall of the via hole in the first insulating layer 40.

[0054] In the embodiment of the present application, as Figure 2 shown, the first insulating layer 40 located between the first sub-structure 51 and the first auxiliary electrode 30 is provided with a groove structure 41, and the groove structure 41 is partially exposed to the conductive structure 50. That is, in the direction perpendicular to the substrate 10, the part of the first sub-structure 51 facing the groove structure 41 is suspended. Thus, in the subsequent process of preparing the organic light-emitting layer, the film layer formed by the organic light-emitting material will be disconnected at the groove structure 41, forming a first light-emitting layer 61 on one side of the first insulating layer 40 and a second light-emitting layer 62 on one side of the third sub-structure 53, so that the first sub-structure 51 will not be covered by the organic light-emitting material, to avoid affecting the connection between the first cathode 71 prepared subsequently and the first sub-structure 51.

[0055] In the embodiment of the present application, due to the provision of the groove structure 41, in the subsequent process of depositing the electrode material, the film layer formed by the electrode material will also be disconnected at the groove structure 41, forming a first cathode 71 on one side of the first light-emitting layer 61 and a second cathode 72 on one side of the second light-emitting layer 62, so as to avoid the connection between the first cathode 71 and the second cathode 72, thereby ensuring that the first cathode 71 is directly connected to the first sub-structure 51. As Figure 2 shown, one end of the first cathode 71 extends to cover the groove structure 41 and is connected to the first sub-structure 51.

[0056] In the embodiment of the present application, by providing the groove structure 41 in the first insulating layer 40 located between the first sub-structure 51 and the first auxiliary electrode 30 and making the groove structure 41 partially exposed to the conductive structure 50, the disconnection of the first light-emitting layer 61 and the second light-emitting layer 62 can be realized, and the disconnection of the first cathode 71 and the second cathode 72 can be realized. Therefore, the length of the third sub-structure 53 of the conductive structure 50 protruding from the first sub-structure 51 can be shortened, thereby reducing the probability of fracture of the part of the third sub-structure 53 protruding from the first sub-structure 51, and thus reducing the probability of damage to the conductive structure 50, and ensuring the yield of the display panel. In the embodiment of the present application, the length of the third sub-structure 53 protruding from the first sub-structure 51 refers to the dimension of the part of the third sub-structure 53 protruding from the first sub-structure 51 in the direction parallel to the substrate 10.

[0057] In the embodiment of the present application, the resistivity of the first auxiliary electrode 30 is less than that of the first cathode 71, so as to ensure that the resistance of the structure formed by connecting the first cathode 71 and the first auxiliary electrode 30 is less than the resistance of the structure formed by connecting the first cathode 71 and the second cathode 71, thereby reducing the probability of uneven brightness in the display panel and ensuring the yield of the display panel.

[0058] It should be noted that in the display panel provided in the embodiment of the present application, although the part of the first sub-structure 51 facing the groove structure 41 is suspended, since the second sub-structure 52 and the third sub-structure 53 are further provided on the side of the first sub-structure 51 away from the substrate 10, this will strengthen the structural strength of the suspended part of the first sub-structure 51. Therefore, in the subsequent manufacturing process, the suspended part of the first sub-structure 51 will not break.

[0059] In an embodiment of the present application, the wiring layer 20 includes a plurality of conductive film layers, and the first auxiliary electrode 30 is provided on the same layer as one of the plurality of conductive film layers.

[0060] In the embodiment of the present application, the first auxiliary electrode 30 can be provided in the wiring layer 20. Specifically, the wiring layer 20 includes a plurality of conductive film layers. Optionally, the wiring layer 20 includes conductive film layers such as gate signal traces, source signal traces, drain signal traces, and LS (Light shield) layers. When preparing any one of the above-mentioned conductive film layers, the first auxiliary electrode 30 can be prepared simultaneously, which can simplify the manufacturing process of the display panel, improve the production efficiency of the display panel, and at the same time, avoid increasing the thickness of the display panel, which is beneficial to the development of the display panel towards thinness and lightness.

[0061] In an embodiment of the present application, one end of the first cathode 71 is connected to the side of the first sub-structure 51 away from the second sub-structure 52.

[0062] In the embodiment of the present application, as Figure 2 shown, one end of the first cathode 71 extends towards the conductive structure 50 relative to the first light-emitting layer 61, covers the side wall and the bottom wall of the groove structure 41, and climbs along the side wall of the groove structure 41 close to the conductive structure 50, so as to be connected to the side of the first sub-structure 51 away from the second sub-structure 52, thereby further reducing the probability of direct connection between the first cathode 71 and the second cathode 72, ensuring that the first cathode 71 is directly connected to the first sub-structure 51, thereby reducing the resistance of the structure formed by connecting the first cathode 71 and the first auxiliary electrode 30, reducing the probability of uneven brightness in the display panel, and ensuring the yield of the display panel.

[0063] In one embodiment of the present application, the first substructure 51 includes a via segment 511 and a connecting segment 512 arranged at both ends of the via segment 511; the via segment 511 is connected to the first auxiliary electrode 30 through the via; the connecting segment 512 is connected to the first cathode 71, and the connecting segment 512 covers a portion of the groove structure 41 in the positive projection of the first insulating layer 40.

[0064] In the present application embodiment, Figure 3 As shown, the first substructure 51 includes a via section 511 and a connecting section 512. Both ends of the via section 511 are connected to a connecting section 512. The shape of the via section 511 matches the shape of the via in the first insulating layer 40, so that the via section 511 is connected to the first auxiliary electrode 30 through the via of the first insulating layer 40.

[0065] Optionally, the first insulating layer 40 may include a plurality of film layers, and each of the plurality of film layers is provided with a through-hole, so that the via section 511 can be connected to the first auxiliary electrode 30. In the embodiment of the present application, by providing the via section 511 connected to the first auxiliary electrode 30 in the first substructure 51, the first auxiliary electrode 30 can be provided in a conductive film layer relatively far away from the conductive structure 50 in the conductive layer 20, so that the number of first auxiliary electrodes 30 that can be provided can be expanded, and it is convenient for those skilled in the art to select the film layer where the first auxiliary electrode 30 is provided according to the actual production process.

[0066] In the embodiment of the present application, the orthographic projection of the connecting segment 512 covers a portion of the groove structure 41 in the first insulating layer 40 , and the first cathode 71 is connected to a side of the connecting segment 512 away from the second substructure 52 .

[0067] In one embodiment of the present application, the orthographic projections of the first substructure 51 and the third substructure 53 on the base substrate 10 overlap, and cover the orthographic projection of the second substructure 52 on the base substrate 10 .

[0068] In the present application embodiment, Figure 2 As shown, the cross-sectional shape of the conductive structure 50 is an I-shape, that is, the orthographic projections of the first substructure 51 and the third substructure 53 on the base substrate 10 both cover the orthographic projection of the second substructure 52 on the base substrate 10. In the embodiment of the present application, the orthographic projections of the first substructure 51 and the third substructure 53 on the base substrate 10 overlap, thereby shortening the length of the third substructure 53 protruding from the second substructure 52, reducing the probability of breakage of the portion, thereby reducing the probability of damage to the conductive structure 50 and ensuring the yield of the display panel.

[0069] In the embodiments of the present application, during the subsequent process of preparing the organic layer (such as the organic light-emitting material) and the electrode material, the I-shaped conductive structure 50 can prevent the organic light-emitting material and the electrode material from climbing along the side wall of the conductive structure 50, so as to further separate the first light-emitting layer 61 and the second light-emitting layer 62, and separate the first cathode 71 and the second cathode 72, thereby ensuring the yield of the display panel.

[0070] In an embodiment of the present application, the materials of the first sub-structure 51 and the third sub-structure 53 are the same as the material of the first cathode 71; the resistivity of the second sub-structure 52 is less than the resistivity of the first cathode 71.

[0071] In the embodiments of the present application, the materials of the first sub-structure 51 and the third sub-structure 53 are the same and different from the material of the second sub-structure 52. Thus, by utilizing the difference in the etching rates of different materials, through etching the first initial structure, the second initial structure, and the third initial structure, the second initial structure is laterally indented relative to the first initial structure and the third initial structure, and the etching rates of the first initial structure and the third initial structure are the same, obtaining the first sub-structure 51, the second sub-structure 52, and the third sub-structure 53, and thus obtaining the I-shaped conductive structure 50.

[0072] Optionally, in the embodiments of the present application, the material of the first sub-structure 51 is the same as the material of the first cathode 71, so as to reduce the contact resistance at the contact between the first cathode 71 and the first sub-structure 51, avoid an increase in the resistance of the structure formed by connecting the first cathode 71 and the first sub-structure 51, ensure that the resistance of the structure formed by connecting the first cathode 71 and the first auxiliary electrode 30 is less than the resistance of the structure formed by connecting the first cathode 71 and the second cathode 71, reduce the probability of brightness non-uniformity in the display panel, and thus ensure the yield of the display panel.

[0073] In the embodiments of the present application, the resistivity of the second sub-structure 52 is less than the resistivity of the first cathode 71, so as to reduce the overall resistance of the conductive structure 50.

[0074] In an embodiment of the present application, in the direction perpendicular to the substrate 10, the size of the second sub-structure 52 is larger than the sizes of the first sub-structure 51 and the third sub-structure 53.

[0075] In the embodiment of the present application, in the direction perpendicular to the substrate 10, the size of the second sub-structure 52 is larger than the sizes of the first sub-structure 51 and the third sub-structure 53, that is, the thickness of the second sub-structure 52 is greater than the thicknesses of the first sub-structure 51 and the third sub-structure 53, so that there is a certain height difference between the conductive structure 50 and the first insulating layer 40. During the subsequent preparation processes of the organic light-emitting layer and the electrode layer, the I-shaped conductive structure 50 can prevent the organic light-emitting material and the electrode material from climbing along the side wall of the conductive structure 50, thereby further enabling the separation of the first light-emitting layer 61 and the second light-emitting layer 62, and enabling the separation of the first cathode 71 and the second cathode 72.

[0076] In an embodiment of the present application, the display panel further includes a second region 102. The first region 101 is a light-transmitting region, and the second region 102 is a light-emitting region. The second region 102 includes: a stacked substrate 10, a thin-film transistor layer, a light-emitting device 80, and a second auxiliary electrode 90. The thin-film transistor layer is disposed on the same layer as the wiring layer 20. The light-emitting device 80 includes a third light-emitting layer and a third cathode. The third light-emitting layer is disposed on the same layer as the first light-emitting layer 61 and the second light-emitting layer 62, and the third cathode is disposed on the same layer as the first cathode 71 and the second cathode 72. The second auxiliary electrode 90 is disposed on the same layer as the first auxiliary electrode 30 and is connected to the first auxiliary electrode 30.

[0077] In the embodiment of the present application, the display panel is a transparent display panel, such as Figure 1 shown, the display panel further includes a second region 102. The first region 101 is a light-transmitting region, and the second region 102 is a light-emitting region. Optionally, as Figure 1 shown, the first region 101 surrounds the second region 102. It should be noted that those skilled in the art can set the arrangement manners of the first region 101 and the second region 102 according to actual requirements, and are not limited to the Figure 1 shown arrangement manner.

[0078] In the embodiment of the present application, as Figure 4 shown, it is a schematic structural diagram of a pixel unit structure in a display panel. The first region 101 semi-surrounds the second region 102. For the convenience of intuitively understanding the position where the conductive structure 50 is located, as Figure 4 shown, the film layers and structures disposed on the side of the conductive structure 50 away from the substrate 10 are subjected to a perspective treatment.

[0079] In the embodiment of the present application, in the second region 102, a thin-film transistor layer is disposed on one side of the substrate 10, and a light-emitting device 80 is disposed on the side of the thin-film transistor layer away from the substrate 10. Optionally, in the embodiment of the present application, a pixel unit structure includes four light-emitting devices 80.

[0080] Specifically, the second auxiliary electrode 90 and the thin film transistor layer are disposed on the same layer, and the thin film transistor layer is disposed on the same layer as the wiring layer 20 in the first region 101. The light emitting device 80 includes a third light emitting layer and a third cathode. The third light emitting layer is disposed on the same layer as the first light emitting layer 61 and the second light emitting layer 62, and the third cathode is disposed on the same layer as the first cathode 71 and the second cathode 72. The light emitting device 80 further includes an anode. The second auxiliary electrode 90 is disposed on the same layer as the first auxiliary electrode 30 and is connected to the first auxiliary electrode 30. Optionally, the second auxiliary electrode 90 may be disposed on the same layer as any one of the conductive film layers in the thin film transistor layer.

[0081] Optionally, in the embodiments of the present application, the light emitting device 80 is a WOLED (White Organic Lighting Emitting Diode).

[0082] Based on the same inventive concept, the embodiments of the present application provide a display device, including: the display panel provided in any one of the foregoing embodiments.

[0083] In the embodiments of the present application, since the display device adopts any one of the display panels provided in the foregoing embodiments, for the principles and technical effects, please refer to the foregoing embodiments and will not be elaborated herein.

[0084] Optionally, the display device is a transparent display device applied to public places such as subways and stations. In order to facilitate clear display of information, the size of the display panel in the transparent display device is often more than 40 inches. Therefore, for the transparent display device, by providing an auxiliary electrode and a conductive structure in the display panel, the probability of uneven brightness of the display panel can be reduced, and the display effect can be ensured.

[0085] Based on the same inventive concept, the embodiments of the present application provide a method for manufacturing a display panel. The schematic flow diagram of the method is as Figure 5 shown, including the following steps S501-S506:

[0086] S501, after preparing a wiring layer and a first auxiliary electrode on one side of the substrate in the first region, prepare a first initial insulating layer.

[0087] In the embodiments of the present application, a wiring layer 20 and a first auxiliary electrode 30 are prepared on one side of the substrate 10 corresponding to the first region 101. Then, SiO is deposited on the side of the wiring layer 20 and the first auxiliary electrode 30 away from the substrate 10 2 , to obtain a first initial insulating layer.

[0088] S502, pattern the first initial insulating layer to obtain a second initial insulating layer including vias.

[0089] Optionally, the first initial insulating layer is processed through processes such as development, exposure, and etching to form vias so that a part of the first auxiliary electrode 30 is exposed, and the second initial insulating layer is obtained.

[0090] S503. A conductive structure is prepared on the side of the second initial insulating layer away from the substrate. The conductive structure includes a stacked first sub-structure, second sub-structure, and third sub-structure, such that the first sub-structure is connected to the first auxiliary electrode and one side of the second initial insulating layer through a via.

[0091] Optionally, a first initial structure, a second initial structure, and a third initial structure are sequentially prepared on the side of the second initial insulating layer away from the substrate 10. The first initial structure is connected to the first auxiliary electrode 30 through a via.

[0092] Then, the first initial structure, the second initial structure, and the third initial structure are etched so that the second initial structure is laterally indented relative to the first initial structure and the third initial structure, and the first sub-structure 51, the second sub-structure 52, and the third sub-structure 53 are obtained, thereby obtaining an I-shaped conductive structure 50. And the first sub-structure 51 of the conductive structure 50 is connected to the first auxiliary electrode 30 and one side of the second initial insulating layer through a via in the second initial insulating layer.

[0093] S504. The second initial insulating layer is patterned so that the second initial insulating layer located between the first sub-structure and the first auxiliary electrode forms a groove structure, and the groove structure is partially exposed on the conductive structure to obtain the first insulating layer.

[0094] Optionally, the second initial insulating layer is processed through an etching process so that the second initial insulating layer located between the first sub-structure 51 and the first auxiliary electrode 30 forms a groove structure 41, thereby obtaining the first insulating layer 40, and the structure as shown in Figure 6 is obtained. Optionally, the etching process is specifically a wet etching process.

[0095] S505. A light-emitting layer is prepared on one side of the conductive structure and the first insulating layer to obtain a first light-emitting layer on one side of the first insulating layer and a second light-emitting layer on one side of the conductive structure.

[0096] Optionally, an organic light-emitting material is evaporated on the side of the conductive structure 50 away from the substrate 10 and the area of the first insulating layer 40 not covered by the conductive structure 50. The light-emitting layer formed by the organic light-emitting material will be disconnected at the groove structure 41, forming a first light-emitting layer 61 on one side of the first insulating layer 40 and a second light-emitting layer 62 on one side of the third sub-structure 53, such that the first sub-structure 51 is not covered by the organic light-emitting material.

[0097] S506. Deposit electrode material on one side of the first light-emitting layer and the second light-emitting layer to obtain a first cathode on one side of the first light-emitting layer and a second cathode on one side of the second light-emitting layer, such that one end of the first cathode extends to cover the groove structure and is connected to the first sub-structure; the resistivity of the first auxiliary electrode is less than that of the first cathode.

[0098] Optionally, deposit electrode material on one side of the first light-emitting layer 61 and the second light-emitting layer 62. The electrode material forms a film layer that will be disconnected at the groove structure 41, forming a first cathode 71 on one side of the first light-emitting layer 61 and a second cathode 72 on one side of the second light-emitting layer 62. The first cathode 71 and the second cathode 72 are disconnected, and the electrode material will cover the groove structure 41 and climb along the side wall of the groove structure 41, such that one end of the first cathode 71 extends to cover the groove structure 41 and is connected to the first sub-structure 51.

[0099] Applying the embodiments of the present application can at least achieve the following beneficial effects:

[0100] In the display panel provided by the embodiments of the present application, by providing a groove structure 41 at a position corresponding to the first sub-structure 51 of the first insulating layer 40 and the conductive structure 50, a part of the groove structure 41 is exposed from the conductive structure 50. Thus, in the subsequent process of preparing the organic light-emitting layer, a first light-emitting layer 61 on one side of the first insulating layer 40 and a second light-emitting layer 62 on one side of the conductive structure 50 are formed. The first light-emitting layer 61 and the second light-emitting layer 62 are separated, that is, the first light-emitting layer 61 and the second light-emitting layer 62 do not contact and connect, such that the first sub-structure 51 and the second sub-structure 52 are not covered by the organic light-emitting material. Thus, in the subsequent process of depositing electrode material, one end of the first cathode 71 can extend to cover the groove structure 41 and be connected to the first sub-structure 51, such that the first cathode 71 is connected to the first auxiliary electrode 30, and it can be ensured that the first cathode 71 and the second cathode 72 are separated. Thus, the length of the third sub-structure 53 of the conductive structure 50 protruding from the first sub-structure 51 can be shortened, and the probability of breakage of the part of the third sub-structure 53 protruding from the first sub-structure 51 can be reduced. Thus, the probability of damage to the conductive structure 50 can be reduced, and the yield of the display panel can be guaranteed.

[0101] Moreover, the first cathode 71 distributed around the conductive structure 50 is electrically connected to the first auxiliary electrode 30 with a smaller resistivity through the conductive structure 50, which can overall reduce the resistivity of the cathode layer, reduce the voltage drop of the signal transmitted based on the cathode layer, be beneficial to the transmission of the signal, and be beneficial to improving the reliability of the operation of the display panel.

[0102] Those skilled in the art of the present application can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present application can be alternated, changed, combined, or deleted. Further, other steps, measures, and solutions in the various operations, methods, and processes discussed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and solutions in the prior art that are the same as those disclosed in the various operations, methods, and processes in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted.

[0103] In the description of the present application, the directions or positional relationships indicated by the words "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are the exemplary directions or positional relationships based on the drawings, which are for the convenience of describing or simplifying the embodiments of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0104] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0105] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0106] In the description of this specification, the specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0107] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown sequentially according to the indications of the arrows, the implementation order of these steps is not limited to the order indicated by the arrows. Unless otherwise clearly stated in this document, in some implementation scenarios of the embodiments of the present application, the steps in each process can be executed in other orders according to requirements. Moreover, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on the actual implementation scenarios. Some or all of these sub-steps or stages can be executed at the same time or at different times. In scenarios where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured according to requirements, and the embodiments of the present application do not limit this.

[0108] The above are only some implementation manners of the present application. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the technical concept of the solution of the present application, adopting other similar implementation means based on the technical idea of the present application also belongs to the protection scope of the embodiments of the present application.

Claims

1. A display panel, characterized in that, it includes: A first region; The first region includes: A stacked substrate substrate, a wiring layer, and a first auxiliary electrode, and a first insulating layer; a via is formed in the first insulating layer corresponding to the first auxiliary electrode; A conductive structure, including a stacked first sub-structure, second sub-structure, and third sub-structure, the first sub-structure is connected to one side of the first auxiliary electrode and the first insulating layer through the via; a groove structure is provided in the first insulating layer between the first sub-structure and the first auxiliary electrode, and the groove structure is partially exposed outside the conductive structure; A first light-emitting layer and a first cathode are sequentially stacked on one side of the first insulating layer away from the substrate substrate, and one end of the first cathode extends to cover the groove structure and is connected to the first sub-structure; the resistivity of the first auxiliary electrode is less than the resistivity of the first cathode; A second light-emitting layer and a second cathode are sequentially stacked on one side of the conductive structure away from the first auxiliary electrode.

2. The display panel according to claim 1, characterized in that, The wiring layer includes a plurality of conductive film layers, and the first auxiliary electrode is provided on the same layer as one of the plurality of conductive film layers.

3. The display panel according to claim 1, characterized in that, One end of the first cathode is connected to the side of the first sub-structure away from the second sub-structure.

4. The display panel according to claim 1, characterized in that, The first sub-structure includes a via segment and connection segments provided at both ends of the via segment; The via segment is connected to the first auxiliary electrode through the via; the connection segment is connected to the first cathode, and the orthographic projection of the connection segment on the first insulating layer covers a part of the groove structure.

5. The display panel according to claim 1, characterized in that, The orthographic projections of the first sub-structure and the third sub-structure on the substrate substrate overlap, and cover the orthographic projection of the second sub-structure on the substrate substrate.

6. The display panel according to claim 1, characterized in that, The materials of the first sub-structure and the third sub-structure are the same as the material of the first cathode; The resistivity of the second sub-structure is less than the resistivity of the first cathode.

7. The display panel according to claim 1, characterized in that, In the direction perpendicular to the substrate substrate, the size of the second sub-structure is larger than the sizes of the first sub-structure and the third sub-structure.

8. The display panel according to claim 1, characterized in that, It further includes a second region, the first region is a light-transmitting region, and the second region is a light-emitting region; The second region includes: a stacked substrate substrate, a thin film transistor layer, a light emitting device, and a second auxiliary electrode; the thin film transistor layer is disposed on the same layer as the wiring layer; the light emitting device includes a third light emitting layer and a third cathode, the third light emitting layer is disposed on the same layer as the first light emitting layer and the second light emitting layer, and the third cathode is disposed on the same layer as the first cathode and the second cathode; the second auxiliary electrode is disposed on the same layer as the first auxiliary electrode and is connected to the first auxiliary electrode.

9. A display device, characterized in that, it includes: a display panel according to any one of the above claims 1-8.

10. A method for manufacturing a display panel, characterized in that, it includes: After preparing a wiring layer and a first auxiliary electrode on one side of the substrate substrate in the first region, a first initial insulating layer is prepared; Patterning the first initial insulating layer to obtain a second initial insulating layer including vias; A conductive structure is prepared on the side of the second initial insulating layer away from the substrate substrate, the conductive structure includes a stacked first sub-structure, second sub-structure and third sub-structure, so that the first sub-structure is connected to the first auxiliary electrode and one side of the second initial insulating layer through the via; Patterning the second initial insulating layer so that the second initial insulating layer located between the first sub-structure and the first auxiliary electrode forms a groove structure, and the groove structure is partially exposed on the conductive structure to obtain a first insulating layer; A light emitting layer is prepared on one side of the conductive structure and the first insulating layer to obtain a first light emitting layer on one side of the first insulating layer and a second light emitting layer on one side of the conductive structure; Electrode material is deposited on one side of the first light emitting layer and the second light emitting layer to obtain a first cathode on one side of the first light emitting layer and a second cathode on one side of the second light emitting layer, so that one end of the first cathode extends to cover the groove structure and is connected to the first sub-structure; the resistivity of the first auxiliary electrode is less than the resistivity of the first cathode.

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