Circuit board detection method, detection system and device with storage function
By setting up an image acquisition device on the transmission line to capture local images of the circuit board in real time and perform identification or matching, the problem of missed triggering when multiple circuit boards on the transmission line contact each other is solved, and high-precision circuit board detection is achieved.
Patent Information
- Application Number
- CN202011484022.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-12-15
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2040-12-15
AI Technical Summary
Existing circuit board detection methods cannot accurately trigger multiple circuit boards that are in contact with each other on the transmission line, resulting in missed identification problems.
By setting an image acquisition device on the transmission line, a local image of the circuit board is collected. By setting an image acquisition device on the transmission line, a local image of the circuit board is collected in real time, and identification or matching is performed. In response to success, a preset operation is performed.
The invention realizes accurate triggering of multiple circuit boards on the transmission line, avoids the situation of missed triggering, improves the triggering accuracy, and has a simple structure and low hardware cost.
Smart Images

Figure CN114636669B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of circuit boards, and particularly relates to a circuit board detection method, a detection system and a device with a storage function. BACKGROUND
[0002] In order to detect each circuit board transmitted on a transmission line, a trigger signal needs to be given when the circuit board passes through a specific position, so as to start the relevant detection process. At present, the commonly used triggering methods include infrared sensor triggering or photoelectric sensor triggering. The principle is that the infrared sensor or photoelectric sensor outputs opposite signals when the specific position passes through with or without a circuit board.
[0003] However, referring to Figure 1 , Figure 1 The structural schematic diagram of an embodiment of the plurality of circuit boards on the transmission line. When the adjacent circuit boards 20 on the transmission line contact each other, the existing triggering method will miss the identification. For example, Figure 1 three adjacent and contacting circuit boards 20 in the figure, the existing triggering method will only give one trigger signal. Obviously, the number of trigger signals given is less than the number of circuit boards 20 passing through the specific position. SUMMARY
[0004] The application provides a circuit board detection method, a detection system and a device with a storage function to solve the technical problem of accurately triggering the plurality of circuit boards contacting each other on the transmission line by the existing triggering method.
[0005] To solve the above technical problem, one technical solution of the application is to provide a circuit board detection method, comprising: obtaining a local image of a circuit board on a transmission line; identifying or matching the local image; and performing a preset operation on the circuit board in response to successful identification or matching.
[0006] The step of obtaining the local image of the circuit board on the transmission line comprises: obtaining a local image collected in real time by a first image collection device from the back side of the circuit board, wherein the circuit board comprises a front side and a back side arranged oppositely, and the front side is plugged with at least one component.
[0007] The step of matching the local image comprises: obtaining a comparison image corresponding to a template image from the local image, wherein the template image contains imaging of a specific area on a standard circuit board; obtaining a similarity between the comparison image and the template image; and the step of responding to successful matching comprises: responding to the similarity exceeding a threshold value, and then the matching is successful.
[0008] The step of obtaining the comparison image corresponding to the template image from the local image comprises: obtaining the comparison image from the local image according to the position information of the specific area on the standard circuit board.
[0009] The step of performing a preset operation on the circuit board in response to the successful identification or matching comprises: in response to the successful identification or matching, sending a trigger instruction to a second image acquisition device to enable the second image acquisition device to acquire an original image of the back of the circuit board corresponding to the trigger instruction; and determining whether the component on the circuit board is correctly inserted according to the original image.
[0010] The original image is a depth image.
[0011] The step of determining whether the component on the circuit board is correctly inserted according to the original image comprises: dividing the depth image into a plurality of sub-depth images; determining the actual position of the pin of the component according to the depth information in each sub-depth image; and determining whether the component on the current circuit board is correctly inserted according to the actual position of the pin and a standard image of a standard circuit board.
[0012] The step of dividing the depth image into a plurality of sub-depth images comprises: dividing the depth image into a plurality of sub-depth images according to the positions of the components arranged on the standard circuit board, and the position of each sub-depth image corresponds to at most one component on the standard circuit board.
[0013] The method further comprises: in response to the pin on the circuit board being incorrectly inserted, obtaining the component corresponding to the incorrectly inserted pin, and / or issuing an alarm instruction.
[0014] The step of identifying the local image comprises: inputting the local image into a pre-trained network model to identify the comparison image.
[0015] To solve the above technical problems, another technical solution adopted by the present application is to provide a circuit board detection system, comprising: a transmission line comprising a hollow area, for carrying and conveying a plurality of circuit boards; at least one image acquisition device corresponding to the hollow area, for acquiring the local image; a processor coupled to the at least one image acquisition device, for executing the detection method described in any of the above embodiments.
[0016] The detection system comprises: a first image acquisition device, configured to acquire the partial image from the back side of the circuit board in real time and transmit the partial image to the processor; wherein the circuit board comprises a front side and a back side arranged oppositely, and the front side is plugged with at least one component; and a second image acquisition device, configured to acquire an original image of the back side of the circuit board corresponding to the trigger instruction after receiving the trigger instruction sent by the processor, and transmit the original image to the processor.
[0017] The second image acquisition device comprises any one of a laser line scanning camera, a 3D structured light camera and a TOF camera.
[0018] To solve the above technical problems, another technical solution adopted by the present application is to provide a device with storage function, which stores program data capable of being executed by a processor to realize the steps in the detection method described in any of the above embodiments.
[0019] Different from the prior art, the beneficial effects of the present application are: in the circuit board detection method provided by the present application, a partial image of the circuit board on the transmission line is first acquired, then the partial image is recognized or matched, and then a preset operation is performed on the circuit board when the recognition or matching is successful. That is, the present application provides an image trigger mode, which can solve the trigger problem of multiple circuit boards on the transmission line contacting each other, and does not cause missed triggering, and has high trigger accuracy. Correspondingly, only an image acquisition device needs to be introduced on the transmission line, and the mechanical structure is relatively simple, without the need to make large changes to the original transmission line, and the hardware cost is relatively low. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0021] Figure 1 Structure schematic diagram of one embodiment of the plurality of circuit boards on the transmission line;
[0022] Figure 2 Flowchart of one embodiment of the circuit board detection method of the present application;
[0023] Figure 3 Structure schematic diagram of one embodiment of the back side of the circuit board;
[0024] Figure 4 Figure 1 A schematic flow chart of an embodiment corresponding to step S103;
[0025] Figure 5 for Figure 4 A flowchart of an embodiment corresponding to step S202;
[0026] Figure 6 This is a structural diagram of an embodiment of a circuit board detection system of the present application;
[0027] Figure 7 This is a schematic diagram of a framework of an embodiment of a device with a storage function according to the present application. DETAILED DESCRIPTION
[0028] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0029] See also Figure 2 , Figure 2 This is a flow chart of an embodiment of a circuit board detection method of the present application, which includes:
[0030] S101: Obtain a local image of a circuit board on a transmission line.
[0031] Specifically, if Figure 1 As shown in , a plurality of circuit boards 20 can generally be provided on the transmission line, and the plurality of circuit boards 20 can move along the same travel direction X under the action of the transmission line; when the circuit board 20 is a regular rectangular plate, the travel direction X can be parallel to the length direction or width direction of the circuit board 20. The circuit board 20 generally includes a front side and a back side arranged opposite to each other, and at least one component (for example, a resistor, a capacitor, etc.) can be plugged into the front side of the circuit board 20. When the component is correctly plugged in, the pins on the component can extend from the front side of the circuit board 20 to the back side. The multiple components installed on the same circuit board 20 can be components of the same type or components of different types, and the installation directions of the multiple components can be different.
[0032] In the embodiment, the back of the circuit board 20 has a specific area, which is a unique area on the back of the circuit board 20, and when it is detected that the specific area is included in the current local image, it indicates that the circuit board 20 has reached the preset position, and the subsequent predetermined operation can be performed on the circuit board 20. The specific area can be determined by observing the back of the standard circuit board corresponding to the circuit board 20 or the back schematic diagram, which does not need to change the original design of the circuit board 20. Of course, in other embodiments, the specific area can also be artificially added when designing the circuit board 20.
[0033] Considering the real-time performance index, the size of the specific area can be small. For example, as shown in Figure 3 Figure 3 is a structural schematic diagram of an embodiment of the back of the standard circuit board. By observation, it is found that there is a specific circle on the back of the standard circuit board, as shown in the solid square in Figure 3 , and in the direction marked as Y in Figure 3 , there is only one specific circle at this position, and at this time the specific circle can be used as the specific area. In the above embodiment, the specific area is selected by the specificity of the position. In other embodiments, the specific area can also be selected by the specificity of the shape, which is not limited in the present application.
[0034] The specific implementation process of the above step S101 can be: obtaining a local image obtained by the first image acquisition device in real time from the back side of the circuit board. The local image can be a gray image. Generally speaking, if the entire back of the circuit board is taken as the input of the subsequent recognition or matching process, the calculation process will have a large time consumption. Therefore, the effective collection area of the first image acquisition device can be smaller than the size of the back of the circuit board, and the first image acquisition device only collects a local image on the circuit board to reduce the time consumption and improve the real-time performance. As shown in Figure 3 , the area of the local image can be the area shown by the dashed square in Figure 3 , which has a first size in the direction X of the circuit board in the direction X of the circuit board, and a second size in the second direction Y perpendicular to the direction X of the circuit board. The second size can be equal to the size of the circuit board in the second direction Y, and the specific first size can be set according to the actual situation.
[0035] Of course, in other embodiments, if the front of the circuit board also has a specific area, the first image acquisition device can also collect a local image in real time from the front side of the circuit board.
[0036] S102: Recognizing or matching the local image.
[0037] Specifically, in one embodiment, the step of matching the local image includes: obtaining a template image containing the specific region on a standard circuit board, which can be a detected passed circuit board with the same structure type as the current transmission line or a principle circuit board with the same structure type as the current transmission line. The template image can be a rectangle, and the template image contains the specific region and part of the adjacent region outside the periphery of the specific region. For example, as shown in FIG. 8, the region corresponding to the solid block in FIG. 8 can be taken as the template image. The step of matching the local image includes: obtaining a comparison image corresponding to the template image from the local image; and obtaining a similarity between the comparison image and the template image, which can be a structural similarity index SSIM or a cosine similarity, and the similarity can be greater than or equal to 0 and less than or equal to 1. Figure 3 Figure 3 The step of matching the local image includes: obtaining a comparison image corresponding to the template image from the local image; and obtaining a similarity between the comparison image and the template image, which can be a structural similarity index SSIM or a cosine similarity, and the similarity can be greater than or equal to 0 and less than or equal to 1.
[0038] The above-mentioned way of determining whether the specific region is contained by using template matching has a small amount of calculation and high real-time performance. In addition, the template matching algorithm mainly includes a pixel-based template matching algorithm and a feature-based template matching algorithm. The pixel-based template matching algorithm has high accuracy and good performance in some complex scenes, but has the disadvantage of high actual complexity and is sensitive to image size. Since the image feature points in the image are much less than the pixel points, the amount of calculation in the template matching process is greatly reduced. Considering that the back image structure of the circuit board is relatively simple and the real-time performance of the scheme is very high, the feature-based template matching algorithm is preferred, such as a grayscale template matching algorithm, a Sift scale-invariant feature transform algorithm, etc.
[0039] In addition, in order to further improve the real-time performance, the step of matching the local image further includes: obtaining position information of the specific region on the standard circuit board; and the step of obtaining the comparison image corresponding to the template image from the local image includes: obtaining the comparison image from the local image according to the position information. For example, as shown in FIG. 8, a first distance between some feature points (for example, the center of the circle) on the specific circle on the standard circuit board and the upper or lower edge of the standard circuit board in the second direction Y can be obtained first. Then, the comparison image is obtained by searching at a position with the first distance from the upper or lower edge of the local image. Figure 4
[0040] In yet another embodiment, the local image can also be recognized. For example, the local image can be input into a pre-trained network model to output a comparison image; and then a similarity between the comparison image and the template image is obtained. For another example, the local image can be input into a pre-trained network model to directly output a result of recognizing the specific region or not recognizing the specific region.
[0041] S103: performing a preset operation on the circuit board in response to the successful identification or matching.
[0042] Specifically, when the matching mode is adopted in step S102, the step of responding to the successful matching includes: in response to the similarity exceeding a threshold value, the matching is successful. The threshold value can be set artificially, for example, the threshold value can be between 0.7-0.8 (for example, 0.75, etc.). When the identification mode is adopted in step S102, the step of responding to the successful identification includes: in response to identifying the specific area.
[0043] Further, in the present embodiment, please refer to Figure 4 , Figure 1 for Figure 5 a flowchart of an embodiment corresponding to step S103 in the above embodiment. The step S103 specifically includes:
[0044] S201: in response to the successful identification or matching, sending a trigger instruction to the second image acquisition device to make the second image acquisition device acquire an original image of the back of the circuit board corresponding to the trigger instruction.
[0045] Specifically, the original image can be a complete image of the back of the circuit board, the original image is a depth image, and the second image acquisition device can be a depth image acquisition device, such as a laser line scanning camera or a 3D structured light camera or a TOF camera, etc. The subsequent component insertion detection mode using the depth image has a lower calculation amount and is more convenient.
[0046] S202: determining whether the components on the circuit board are correctly inserted according to the original image.
[0047] Specifically, please refer to Figure 5 , Figure 4 for Figure 6 a flowchart of an embodiment corresponding to step S202 in the above embodiment. The step S202 includes:
[0048] S301: dividing the depth image into a plurality of sub-depth images.
[0049] Specifically, the division mode in step S301 can be: obtaining the arrangement positions of each component on a standard circuit board, and then dividing the depth image into a plurality of sub-depth images according to the arrangement positions, and the position of each sub-depth image corresponds to at most one component on the standard circuit board, that is, each sub-depth image can contain 0 or 1 components. The division mode by the arrangement mode of each component on the standard circuit board can make it possible to quickly determine the name and position of the incorrectly inserted component in the subsequent step. Of course, in other embodiments, other division modes can also be adopted, which are not limited in the present application.
[0050] S302: Determine the actual position of the pins of the component according to the depth information in each sub-depth image.
[0051] Specifically, if the pins of the component are correctly inserted, the pins have a part extending from the back of the circuit board, which is represented as a higher depth value in the sub-depth image. That is, the actual position of the pins on the current circuit board can be quickly determined through the depth information.
[0052] S303: Determine whether the component on the current circuit board is correctly inserted according to the actual position of the pins and the standard image of the standard circuit board.
[0053] Specifically, in this embodiment, the actual position of each pin can be marked in the depth image, and the theoretical position of each pin can be marked in the standard image of the standard circuit board. Whether the component on the current circuit board is correctly inserted can be determined by comparing the two.
[0054] In addition, when there is an insertion error of the component, the name and / or position of the component corresponding to the insertion error pin can be obtained. Here, the insertion error includes that there is no pin in the position where there should be a pin (i.e., there is no component in the position where there should be a component), and there is a pin in the position where there should be no pin (i.e., there is a component in the position where there should be no component).
[0055] In addition, when there is an insertion error of the pins on the circuit board, i.e., an insertion error of the component, an alarm instruction can be sent to the alarm. The alarm can perform sound and light alarms after receiving the alarm instruction. This design can enable the detection personnel to immediately know the detection situation of the circuit board on the transmission line, which is highly time-efficient.
[0056] In the above embodiment, the preset operation on the circuit board is to determine whether there is an insertion error of the component through the depth image of the back of the circuit board. In other embodiments, other preset operations can be performed on the circuit board.
[0057] For example, in response to successful recognition or matching, a trigger instruction is sent to the second image acquisition device to enable the second image acquisition device to acquire an original image of the front of the circuit board corresponding to the trigger instruction; the original image is input into a pre-trained recognition model to obtain a prediction result of the installation direction of each component on the circuit board; and the installation direction predicted by the recognition model and the preset standard installation direction are compared to determine whether the component on the circuit board is correctly installed.
[0058] The circuit board detection system for implementing the above detection method will be further described from the structural point of view. Please refer to Figure 6 , Figure 6 FIG. 1 is a structural schematic diagram of an embodiment of the circuit board detection system of the present application. The detection system specifically includes a transmission line 10, at least one image acquisition device 12, and a processor 14.
[0059] Specifically, the transmission line 10 is used to carry and convey a plurality of circuit boards; at least one image acquisition device 12 is used to acquire a partial image of the circuit board; optionally, one of the image acquisition devices 12 can be located on the back side of the circuit board, and used to acquire a partial image of the back of the circuit board. The processor 14 is coupled with the at least one image acquisition device 12, and used to receive the partial image, and identify or match the partial image; when the identification or matching is successful, the processor 14 can send a trigger instruction to other devices, so as to perform a preset operation on the circuit board. In the embodiment, the processor 14 can also be referred to as a CPU (Central Processing Unit). The processor 14 can be an integrated circuit chip, and has a signal processing capability. The processor 14 can also be a general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor or the like. In addition, the processor 14 can be implemented by a plurality of integrated circuit chips. In the above design manner, only the image acquisition device 12 needs to be introduced on the transmission line 10, and the mechanical structure is relatively simple, and a large change does not need to be made to the original transmission line, and the hardware cost is relatively low.
[0060] In the embodiment, the transmission line 10 provided by the application specifically includes a conveying belt 100 and a driving mechanism. The driving mechanism can drive the conveying belt 100 to run at a constant speed. The conveying belt 100 can include a hollow area, and the back of the circuit board can be exposed from the hollow area.
[0061] The detection system mentioned above can further include a memory, which is coupled with the processor 14, and used to store a front standard image of a standard circuit board, a back standard image of the standard circuit board, a template image containing a specific area obtained from the back standard image, position information of the specific area on the standard circuit board, arrangement position information of each component on the standard circuit board and the like, which are of the same structure type as the current transmission line and pass the detection. In the subsequent processing process, the processor 14 can directly call and obtain the required information from the memory, so as to reduce the processing time and improve the real-time performance.
[0062] The at least one image acquisition device mentioned above can include a first image acquisition device 12a and a second image acquisition device 12b.
[0063] The first image acquisition device 12a is arranged corresponding to the hollow region of the conveying belt 100, and is configured to acquire a local image from the back side of the circuit board in real time and transmit the local image to the processor 14. At this time, the processor 14 is specifically configured to obtain a template image from the memory, and obtain a comparison image corresponding to the template image from the local image. The similarity between the comparison image and the template image is obtained by using a correlation similarity algorithm, and a trigger instruction is given when the similarity exceeds a threshold value. The local image acquired by the first image acquisition device 12a can be a gray image, and the corresponding first image acquisition device 12a is a gray camera with high real-time performance. Generally, the back side of the circuit board is arranged to face the conveying belt 100, and the front side of the circuit board is arranged to face away from the conveying belt 100. Correspondingly, the first image acquisition device 12a can be located below the conveying belt 100, and the optical axis of the first image acquisition device 12a can be perpendicular to the plane on which the conveying belt 100 is located, so as to reduce the perspective difference when the first image acquisition device 12a acquires the image.
[0064] The second image acquisition device 12b is arranged corresponding to the hollow region of the conveying belt 100, and is located downstream of the circuit board running direction relative to the first image acquisition device 12a. After receiving the trigger instruction sent by the processor 14, the second image acquisition device 12b is configured to acquire an original image of the back side of the circuit board corresponding to the trigger instruction and transmit the original image to the processor 14. The original image acquired by the second image acquisition device 12b is a depth image, and the corresponding second image acquisition device 12b includes any one of a laser line scanning camera, a 3D structured light camera and a TOF camera. Generally, the back side of the circuit board is arranged to face the conveying belt 100, and the front side of the circuit board is arranged to face away from the conveying belt 100. Correspondingly, the second image acquisition device 12b can be located below the conveying belt 100, and the optical axis of the second image acquisition device 12b can be perpendicular to the plane on which the conveying belt 100 is located, so as to reduce the perspective difference when the second image acquisition device 12b acquires the image. At this time, the processor 14 is specifically configured to obtain arrangement position information of each component on a standard circuit board from the memory, divide the depth image into a plurality of sub-depth images by using the arrangement position information, and then determine the actual position of the pin for each sub-depth image according to the corresponding depth information of the sub-depth image. Finally, whether the components on the current circuit board are correctly plugged is determined according to the actual position of the pin and the back standard image of the standard circuit board.
[0065] In the above embodiment, the image acquisition device 12 for obtaining the local image and the original image is two different devices. In other embodiments, if the hardware cost is not considered, the first image acquisition device 12a and the second image acquisition device 12b can be combined into one image acquisition device 12. At this time, the image acquisition device 12 can first acquire the local image, and then acquire the original image after receiving the trigger instruction of the processor 14. Both the local image and the original image are depth images.
[0066] In addition, in order to make the partial image acquired by the first image acquisition device 12a clearer, the detection system provided by the application can further comprise a light source 16, which is arranged on the same side of the first image acquisition device 12a and close to the first image acquisition device 12a. Optionally, as shown in the figure, the light source 16 is a ring-shaped light source, and the first image acquisition device 12a is located at the central position of the ring-shaped light source. Figure 7
[0067] In addition, the detection system provided by the application can further comprise an alarm coupled with the processor 14, which can be a sound alarm, a light alarm, an audible and light alarm, etc. When the processor 14 determines that there is a plugging error of the component on the current circuit board, an alarm instruction is sent to the alarm, and the alarm gives an alarm.
[0068] Of course, in other embodiments, the alarm mode can also be other, for example, the processor 14 and the above-mentioned memory can be integrated into a terminal (for example, a computer, etc.), and the terminal is also provided with a display screen. When the processor 14 determines that there is a plugging error of the component on the current circuit board, a pop-up display instruction is sent to the display screen, and the display screen displays a pop-up box.
[0069] Please refer to Figure 7 , is a schematic diagram of an embodiment of the storage device of the application. The storage device 30 stores program instructions 300 capable of being executed by the processor, and the program instructions 300 are used to realize the detection method mentioned in any of the above-mentioned embodiments. Among them, the program instructions 300 can be stored in the above-mentioned storage device in the form of a software product, including a plurality of instructions for making a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor execute all or part of the steps of the method described in various embodiments of the application. The above-mentioned storage device includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, etc. Various media that can store program codes, or a computer, a server, a mobile phone, a tablet terminal device, etc.
[0070] In summary, in the circuit board detection method provided in the application, a local image of the circuit board on the transmission line is first obtained, then the local image is recognized or matched, and then when the recognition or matching is successful, the circuit board is subjected to a preset operation. That is, the application provides an image triggering mode, which can solve the triggering problem of the mutual contact of multiple circuit boards on the transmission line, and does not have the problem of missed triggering, and has high triggering accuracy. And in the corresponding structure aspect, only an image acquisition device needs to be introduced on the transmission line, the mechanical structure is relatively simple, and the original transmission line does not need to be greatly changed, and the hardware cost is low.
[0071] The above only describes the embodiments of the application, and does not limit the patent scope of the application, and any equivalent structure or equivalent flow transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the application.
Claims
1. A circuit board detection method, characterized in that: include: Obtain a local image of the circuit board on the transmission line; Identifying or matching the partial image; In response to the identification or matching being successful, performing a preset operation on the circuit board; Wherein, the step of obtaining a partial image of the circuit board on the transmission line includes: Obtaining a partial image captured in real time by a first image acquisition device from a back side of a circuit board, wherein the circuit board includes a front side and a back side disposed opposite to each other, and at least one component is plugged into the front side; The step of performing a preset operation on the circuit board in response to the successful identification or matching includes: In response to the identification or matching being successful, sending a trigger instruction to a second image acquisition device, so that the second image acquisition device acquires an original image of the back side of the circuit board corresponding to the trigger instruction; determining whether the components on the circuit board are correctly plugged in based on the original image; The response to the successful identification or matching refers to detecting that a specific area is included in the local image, indicating that the circuit board has moved to a preset position.
2. The detection method according to claim 1, wherein The step of matching the partial image includes: obtaining a comparison image corresponding to a template image from the partial image, wherein the template image includes an image of a specific area on a standard circuit board; obtaining a similarity between the comparison image and the template image; The step of responding to the successful matching includes: responding to the similarity exceeding a threshold value, indicating that the matching is successful.
3. The detection method according to claim 2, characterized in that The step of obtaining a comparison image corresponding to the template image from the partial image includes: obtaining the comparison image from the partial image according to position information of the specific area on the standard circuit board.
4. The detection method according to claim 1, wherein The original image is a depth image.
5. The detection method according to claim 4, characterized in that The step of determining whether the components on the circuit board are correctly inserted according to the original image includes: Dividing the depth image into a plurality of sub-depth images; Determining the actual position of the pin of the component according to the depth information in each sub-depth image; It is determined whether the components on the current circuit board are correctly plugged in based on the actual positions of the pins and the standard image of the standard circuit board.
6. The detection method according to claim 5, characterized in that The step of dividing the depth image into a plurality of sub-depth images comprises: The depth image is divided into a plurality of sub-depth images according to the arrangement positions of the components on the standard circuit board, and the position of each sub-depth image corresponds to at most one component on the standard circuit board.
7. The detection method according to claim 5, characterized in that Also includes: In response to a pin on the circuit board being incorrectly plugged in, a component corresponding to the incorrectly plugged in pin is obtained, and / or an alarm instruction is issued.
8. The detection method according to claim 1, wherein The step of identifying the partial image includes: The local image is input into a pre-trained network model to identify a comparison image.
9. A circuit board detection system, characterized in that: include: Transmission lines, used to carry and transport multiple circuit boards; At least one image acquisition device, configured to acquire a local image of the circuit board; A processor, coupled to the at least one image acquisition device, is configured to execute the detection method according to any one of claims 1 to 8.
10. The detection system according to claim 9, characterized in that: The transmission line includes a conveyor belt, the conveyor belt includes a hollow area, and the at least one image acquisition device includes: a first image acquisition device, disposed corresponding to the hollowed-out area, for acquiring the partial image obtained from the back side of the circuit board in real time and transmitting the partial image to the processor; wherein the circuit board includes a front side and a back side disposed opposite to each other, and at least one component is plugged into the front side; The second image acquisition device is set corresponding to the hollow area, and is used to acquire the original image of the back of the circuit board corresponding to the trigger instruction after receiving the trigger instruction sent by the processor, and transmit the original image to the processor.
11. A device with a storage function, characterized in that: Program data is stored, and the program data can be executed by a processor to implement the steps of the detection method according to any one of claims 1 to 8.
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