A display substrate, a manufacturing method, and a display device

Abstract

The present invention discloses a display substrate, a manufacturing method, and a display device. The display substrate in one embodiment includes a display area and a cathode overlapping area surrounding the display area. The display substrate further includes: a first barrier area surrounding the display area and disposed on the substrate of the display substrate, wherein the projection of the cathode overlapping area on the substrate covers the projection of the first barrier area on the substrate. In this embodiment, by overlapping the first barrier area and the cathode overlapping area, both the cathode overlapping area and the first barrier area are formed in the non-display area of the display substrate. On the basis of ensuring the normal realization of the overlapping function of the cathode overlapping area of the display substrate and effective display, the edge size of the display substrate can also be reduced, thereby achieving a narrow border design and having a wide application prospect.

Description

Technical Field

[0001] The present invention relates to the field of display technologies. More specifically, it relates to a display substrate, a manufacturing method, and a display device. Background Art

[0002] Currently, the applications of OLED displays are becoming increasingly diverse, and the requirements for the form of the display substrate are also getting higher and higher. Especially for the border area without display, with the pursuit of the ultimate screen-to-body ratio, the border is further compressed. However, in order to ensure the normal display function of the display substrate at the same time, it is often necessary to carry out a certain length of protection design at the edge of the display substrate. For display devices pursuing an extremely narrow border, how to reduce the edge size design of the display substrate is an urgent problem to be solved. Summary of the Invention

[0003] An object of the present invention is to provide a display substrate, a manufacturing method, and a display device to solve at least one of the problems existing in the prior art.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] In a first aspect of the present invention, a display substrate is provided, including a display area and a cathode overlapping area surrounding the display area.

[0006] The display substrate further includes: a first barrier area surrounding the display area and disposed on the substrate of the display substrate, wherein the projection of the cathode overlapping area on the substrate covers the projection of the first barrier area on the substrate.

[0007] Further, the cathode overlapping area includes a cathode metal layer provided on the same layer as the cathode layer of the display area and an anode metal layer provided on the same layer as the anode layer of the display area;

[0008] The display substrate further includes:

[0009] An interception area surrounding the first barrier area and disposed on the side of the first barrier area away from the display area, wherein the interception area is disposed between the anode metal layer and the cathode metal layer, and the projection of the cathode overlapping area on the substrate covers the projection of the interception area on the substrate.

[0010] Further, the display substrate further includes a packaging layer, and the packaging layer includes:

[0011] A covering packaging area for covering the display area, covering the cathode overlapping area, and covering the interception area; and

[0012] A barrier packaging area with a tooth-shaped structure surrounding the interception area;

[0013] Among them, the covering encapsulation area and the barrier encapsulation area are arranged on the same layer.

[0014] Furthermore, the display area includes:

[0015] A driving circuit layer disposed on the substrate:

[0016] A planarization layer disposed on the driving circuit layer:

[0017] A light-emitting device layer disposed on the planarization layer, the light-emitting device layer including a pixel definition layer, an anode layer defined by the pixel definition layer, a light-emitting material layer disposed on the anode layer, and a cathode layer covering the light-emitting material layer and the pixel definition layer;

[0018] The cathode overlap area and the intercept area are disposed in the non-display area of the display substrate, and the non-display area includes:

[0019] A planarization material layer disposed on the same layer as the planarization layer:

[0020] An intercept material layer of the intercept area disposed on the same layer as the pixel definition layer.

[0021] Furthermore, the first barrier area is disposed between the anode metal layer and the cathode metal layer, and the first barrier area includes at least one first isolation column having an undercut structure arranged in sequence in the direction from the display area to the cathode overlap area;

[0022] Among them, the first isolation column having an undercut structure includes:

[0023] A first material layer disposed on the anode metal layer in the cathode overlap area;

[0024] A second material layer disposed on the first material layer; and

[0025] A third material layer disposed on the second material layer, and the projection of the third material layer on the substrate covers the projection of the second material layer on the substrate;

[0026] The third material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected to the anode metal layer through the first material layer, the second material layer, and the third material layer.

[0027] Furthermore, the barrier encapsulation area having a tooth-shaped structure includes:

[0028] At least two second isolation columns arranged in sequence in the direction from the display area to the cathode overlap area; and

[0029] An encapsulation material layer disposed on the second isolation pillar, the encapsulation material layer being a toothed structure with an undercut structure;

[0030] Wherein, the second isolation pillar and the first isolation pillar are disposed on the same layer, and the encapsulation material layer disposed on the second isolation pillar is disposed on the same layer as the material layer covering the encapsulation area. Further, the non-display area further includes: an anode metal layer disposed on the same layer as the anode layer;

[0031] The first isolation pillar disposed on the anode metal layer;

[0032] A cathode metal layer covering the anode metal layer and covering the surface of the first isolation pillar away from the substrate side, disposed on the same layer as the cathode layer. Further, the first barrier region is disposed between the cathode metal layer and the substrate, and the first barrier region includes at least one third isolation pillar with an undercut structure arranged in sequence along the direction from the display area to the cathode connection area;

[0033] Wherein, the third isolation pillar with an undercut structure includes:

[0034] A fourth material layer disposed on the substrate, the fourth material layer serving as the anode metal layer of the cathode connection area;

[0035] A fifth material layer disposed on the fourth material layer;

[0036] A sixth material layer disposed on the fifth material layer, the projection of the sixth material layer on the substrate covering the projection of the fifth material layer on the substrate;

[0037] Wherein, the sixth material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected to the fourth material layer serving as the anode metal layer through the sixth material layer and the fifth material layer. Further, the barrier encapsulation area with a toothed structure includes:

[0038] At least two fourth isolation pillars arranged in sequence along the direction from the display area to the non-display area; and

[0039] An encapsulation material layer disposed on the fourth isolation pillar, the encapsulation material layer being a toothed structure with an undercut structure;

[0040] Wherein, the fourth isolation pillar and the third isolation pillar are disposed on the same layer, and the encapsulation material layer disposed on the fourth isolation pillar is disposed on the same layer as the material layer covering the encapsulation area.

[0041] Further, the non-display area further includes:

[0042] The fourth material layer of the third isolation pillar disposed on the planarization material layer;

[0043] The fifth material layer and the sixth material layer of the third isolation pillar sequentially disposed on the fourth material layer;

[0044] A cathode metal layer disposed on the same layer as the cathode layer and covering the surfaces of the fourth material layer and the sixth material layer on the side away from the substrate.

[0045] Further, the first barrier region is disposed between the cathode overlapping region and the substrate of the display substrate,

[0046] The first barrier region at least includes:

[0047] A seventh material layer disposed on the substrate, and

[0048] An eighth material layer disposed on the seventh material layer;

[0049] The first barrier region further includes a first groove structure recessed in the direction from the surface of the seventh material layer away from the substrate toward the eighth material layer, and the first groove structure penetrates the eighth material layer and does not penetrate the seventh material layer;

[0050] The anode metal layer is formed on the eighth material layer leaking out of the first groove structure and the surface of the seventh material layer on the side away from the substrate;

[0051] Or

[0052] The seventh material layer is a planarization material layer disposed on the same layer as the planarization layer;

[0053] The eighth material layer is a passivation layer disposed on the planarization layer.

[0054] Further, the projection of the opening of the first groove structure on the seventh material layer on the substrate covers the projection of the opening of the first groove structure on the eighth material layer on the substrate, so that the cathode metal layer of the cathode overlapping region formed on the first barrier region is cut off;

[0055] The projection of the first barrier region on the substrate is an annular structure with a notch, and is used to form an electrical connection of the cathode metal layer cut off by the first barrier region at the notch.

[0056] Further, the barrier encapsulation region with a tooth-shaped structure includes:

[0057] At least two second groove structures arranged in the direction from the display region to the non-display region, and the second groove structures are disposed on the same layer as the first groove structure; and

[0058] The encapsulation material layer disposed in the second groove structure, and the encapsulation material layer is a toothed structure with an undercut structure;

[0059] Wherein, the second groove structure and the first groove structure are disposed on the same layer, and the encapsulation material layer in the second groove structure and the material layer covering the encapsulation area are disposed on the same layer.

[0060] Furthermore, the display substrate further includes:

[0061] A driving unit disposed between the cathode connection area and the substrate, the projection of the cathode connection area on the substrate covers the projection of the driving unit on the substrate, and the driving unit is disposed on the same layer as the driving circuit layer of the display area;

[0062] Or

[0063] The display substrate further includes:

[0064] A power supply trace electrically connected to the cathode connection area and surrounding the interception area, the projection of the barrier encapsulation area on the substrate covers the projection of the power supply trace on the substrate, and the power supply trace is disposed on the same layer as the driving circuit layer of the display area;

[0065] A crack detection line surrounding the power supply trace, the projection of the barrier encapsulation area on the substrate covers the projection of the crack detection line on the substrate, and the crack detection line is disposed on the same layer as the power supply trace;

[0066] A crack barrier portion surrounding the crack detection line, the projection of the barrier encapsulation area on the substrate covers the projection of the crack barrier portion on the substrate.

[0067] A second aspect of the present invention provides a method for manufacturing the display substrate of the first aspect of the present invention, including:

[0068] Forming a display area and a cathode connection area surrounding the display area on a substrate;

[0069] Forming a first barrier area surrounding the display area on the substrate of the display substrate, wherein the projection of the cathode connection area on the substrate covers the projection of the first barrier area on the substrate.

[0070] Alternatively, the method further includes:

[0071] Forming an interception area surrounding the first barrier area, wherein the interception area is disposed between the anode metal layer and the cathode metal layer, and the projection of the cathode connection area on the substrate covers the projection of the interception area on the substrate;

[0072] Or

[0073] The method further includes forming the encapsulation layer,

[0074] wherein, forming the encapsulation layer includes:

[0075] forming a covering encapsulation area of the encapsulation layer that covers the display area, a cathode connection area covering the non-display area, and an intercept area covering the non-display area;

[0076] forming a barrier encapsulation area of the encapsulation layer with a tooth-shaped structure around the intercept area.

[0077] A third aspect of the present invention provides a display device, including the display substrate of the first aspect of the present invention.

[0078] The beneficial effects of the present invention are as follows:

[0079] In the technical solution of the present invention, by overlapping the first barrier area and the cathode connection area, a cathode connection area and a first barrier area are formed in the non-display area of the display substrate. On the basis of ensuring the normal realization of the connection function of the cathode connection area of the display substrate for effective display, the edge size of the display substrate can also be reduced, thereby realizing a narrow border design, which has a wide application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] The following further describes in detail the specific embodiments of the present invention with reference to the drawings.

[0081] Figure 1 A schematic structural diagram of a display substrate showing the related art;

[0082] Figure 2 A schematic structural diagram of a display substrate showing an embodiment of the present invention;

[0083] Figure 3 A schematic structural diagram of a display substrate showing another embodiment of the present invention;

[0084] Figure 4 A schematic structural diagram of a display substrate showing another embodiment of the present invention;

[0085] Figure 5 A schematic structural diagram of a display area of a display substrate showing an embodiment of the present invention;

[0086] Figure 6 Showing an embodiment of the present invention Figure 4 a schematic structural diagram of the undercut structure of the first groove structure;

[0087] Figure 7 Showing Figure 4 a schematic state diagram of the display substrate shown in a top view structure;

[0088] Figure 8 Schematic diagram showing another process for manufacturing a display substrate according to the present invention;

[0089] Figure 9 Schematic diagram showing the process of manufacturing a display substrate according to another embodiment of the present invention;

[0090] Figure 10 Showing the present invention Figure 2 Schematic diagram showing the process of manufacturing a display substrate according to an embodiment of the present invention;

[0091] Figure 11 Showing the present invention Figure 3 Schematic diagram showing the process of manufacturing a display substrate according to an embodiment of the present invention;

[0092] Figure 12 Showing the present invention Figure 4 Schematic diagram showing the process of manufacturing a display substrate according to an embodiment of the present invention. Detailed implementation manners

[0093] To more clearly illustrate the present invention, the present invention will be further described below in conjunction with embodiments and the accompanying drawings. Similar components in the drawings are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the protection scope of the present invention.

[0094] Figure 1 Schematic diagram showing the layer structure of a display substrate in the related art, as Figure 1 shown, the display substrate includes a display area AA and a non-display area. The non-display area is provided with a GOA driving unit 141, a cathode overlapping area BB, a power line 16, a crack detection line 17, an interception structure, and a packaging layer 15. These necessary structures limit the size of the non-display area. In a specific example, the display substrate generally uses the packaging layer 15 to ensure the water and oxygen barrier performance of the display substrate. The packaging layer 15 is generally a laminated structure of an inorganic material and an organic material. The inorganic layer needs to extend a certain length to ensure the packaging characteristics of the device. Such a structural design also further increases the edge size of the display substrate. Exemplarily, the border size of the display substrate is generally 0.9 - 1.5 mm, resulting in a large black border for the product, affecting the user experience and being unfavorable for the narrow border design.

[0095] In view of this, an embodiment of the present invention provides a display substrate, a manufacturing method, and a display device. By designing the structure of the non-display area of the display substrate, the edge size of the display substrate is reduced, realizing a narrow border design. Exemplarily, the display substrate of this embodiment can be applied to display devices such as OLED display substrates, LCD display substrates, and QLED display substrates, and has a wide application prospect.

[0096] As Figure 2 、Figure 3 , Figure 4 and Figure 5 As shown in Figure 5 , an embodiment of the present invention provides a display substrate, including a display area AA.

[0097] In an optional embodiment, the display area AA includes:

[0098] A driving circuit layer 14 disposed on a substrate 11. The driving circuit layer 14 includes: an active layer 142 disposed on the substrate 11, an interlayer dielectric layer 143 covering the active layer 142, a gate 144 disposed on the interlayer dielectric layer 143, and a gate insulating layer 145 covering the gate 144, and a source-drain metal layer 146 disposed on the gate insulating layer 145.

[0099] A planarization layer 24 disposed on the driving circuit layer 14.

[0100] A light-emitting device layer 50 disposed on the planarization layer 24. The light-emitting device layer 50 includes a pixel defining layer 25, an anode layer 12 defined by the pixel defining layer 25, a light-emitting material layer 51 formed on the anode layer 12, and a cathode layer 13 covering the light-emitting material layer 51 and the pixel defining layer 25.

[0101] Figure 5 The related layer structure of the display area AA shown can be referred to Figure 1 the related art shown, which will not be elaborated here.

[0102] As Figure 2 , Figure 3 and Figure 4 shown, the non-display area includes:

[0103] A planarization material layer 241 disposed on the same layer as the planarization layer 24:

[0104] An interception material layer 251 of the interception area DD disposed on the same layer as the pixel defining layer 25. In the embodiment of the present invention, the display substrate further includes: a cathode overlapping area BB surrounding the display area AA. In this embodiment, the cathode overlapping area BB and the interception area DD are disposed in the non-display area of the display substrate.

[0105] In the embodiment of the present invention, as Figure 2 , Figure 3 and Figure 4 shown, the display substrate further includes: a first barrier area CC surrounding the display area AA disposed on the substrate 11 of the display substrate, wherein the projection of the cathode overlapping area BB on the substrate 11 covers the projection of the first barrier area CC on the substrate 11.

[0106] Compared withFigure 1 The structural design in which the cathode overlap region BB and the interception structure shown are sequentially arranged in the direction from the display region to the non-display region. In the embodiment of the present invention, the first barrier region CC and the cathode overlap region BB are formed to overlap each other, as Figure 2 , Figure 3 and Figure 4 shown. In the same region at the edge of the display substrate, both the cathode overlap region BB and the first barrier region CC are formed, so that on the basis of ensuring the normal display of the display substrate, the edge size of the display substrate can be reduced, and a narrow border design can be achieved.

[0107] Considering that other structures are also arranged in the edge region of the display substrate, in an alternative embodiment, as Figure 2 , Figure 3 and Figure 4 shown, the display substrate further includes:

[0108] An interception region DD surrounding the first barrier region CC and arranged on the side of the first barrier region CC away from the display region AA. Among them, the projection of the cathode overlap region BB on the substrate 11 covers the projection of the interception region DD on the substrate 11.

[0109] Compared with Figure 1 the structure in which each structure such as the cathode overlap region BB, the interception structure, and the crack blocking structure 18 shown are sequentially arranged in the direction from the display region to the non-display region, as Figure 2 , Figure 3 and Figure 4 shown. On the basis that the first barrier region CC and the cathode overlap region BB are formed to overlap each other in this embodiment, the interception region DD and the cathode overlap region BB are further formed in a stacked manner, that is, at the projection position of the cathode overlap region BB, both the first barrier region CC and the interception region DD surrounding the first barrier region CC are formed, so that on the basis of ensuring the normal display of the display substrate, the edge size of the display substrate can be further reduced, and a better narrow border design can be achieved.

[0110] In this embodiment, the cathode overlap region CC includes an anode metal layer 121 provided on the same layer as the anode layer 12 of the display region AA and a cathode metal layer 131 provided on the same layer as the cathode layer 13 of the display region AA. In this embodiment, the cathode metal layer 131 and the anode metal layer 121 in the cathode overlap region BB are electrically connected. Neither the first barrier region CC nor the interception region DD will damage the cathode overlap region BB. Therefore, the normal display of the display substrate can be ensured. In this embodiment, the interception region DD is provided between the anode metal layer 121 and the cathode metal layer 131. Exemplarily, the interception region DD can intercept the inkjet printing material (IJP material) of the organic layer in the encapsulation layer, prevent the material from overflowing, and prevent display defects and encapsulation defects.

[0111] Considering that other structures are also provided in the edge region of the display substrate, in an alternative embodiment, as Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, the display substrate further includes: a driving unit 141 provided between the cathode overlap region BB and the substrate 11. The projection of the cathode overlap region BB on the substrate 11 covers the projection of the driving unit 141 on the substrate 11. The driving unit 141 is provided on the same layer as the driving circuit layer 14 of the display region AA.

[0112] Exemplarily, the driving unit in this embodiment can be a gate circuit driving unit or an enable circuit driving unit. As Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, the driving unit 141 is provided above the substrate 11 of the display substrate. The driving unit 141 is provided on the same layer as each device layer of the driving thin film transistor of the driving circuit layer 14 of the display region AA. For example, it is provided on the same layer as the active layer 142, the interlayer dielectric layer 143, the gate 144, the gate insulating layer 145, and the source-drain metal layer 146 and other film layers. As Figure 2 , Figure 3 and Figure 4 shown, the cathode overlap region BB, the first barrier region CC, and the interception region DD of this embodiment are provided on the driving unit 141 in the non-display region. By optimizing the structure of the necessary edge structures of the display substrate in the stacking direction, a multi-structure stacking design is formed, and the size of the non-display region is compressed to the greatest extent, which is of great significance for improving the screen-to-body ratio of the product and realizing a narrow bezel design.

[0113] In an alternative embodiment, the display substrate further includes an encapsulation layer 15. The encapsulation layer 15 includes:

[0114] A covering encapsulation area 151, for covering the display area AA, covering the cathode connection area BB, and covering the interception area DD; and

[0115] A barrier encapsulation area 152 with a toothed structure surrounding the interception area DD;

[0116] Wherein, the covering encapsulation area and the barrier encapsulation area are arranged on the same layer.

[0117] The encapsulation layer 15 of this embodiment is formed by two encapsulation structures. The first structure is the covering encapsulation area 151 arranged in the display area AA and between the display area AA and the interception area DD, as Figure 2 , Figure 3 , and Figure 4 shown. This covering encapsulation area 151 covers the display area AA, the cathode connection area BB, and the interception area DD. Exemplarily, this covering encapsulation area 151 and Figure 1 shown encapsulation layer 15 can be fabricated using the same process, playing a role in preventing external water and oxygen from invading.

[0118] The second structure of the encapsulation layer 15 of this embodiment is the barrier encapsulation area 152 arranged outside the interception area DD. This barrier encapsulation area 152 is formed on the side of the interception area DD away from the display area AA. On the one hand, this barrier encapsulation area 151 has the original encapsulation performance. Further, this barrier encapsulation area 152 has a toothed structure different from the covering encapsulation area 151 as the outermost edge structure of the non-display area, which can further prevent water and oxygen from entering and improve the overall encapsulation performance of the display substrate. On the other hand, in this embodiment, through the toothed structure of the barrier encapsulation area 151, the encapsulation layer can be anchored, preventing crack propagation when cracks appear at the edge of the display substrate, forming an effective protection for the display area, and enabling the display panel to have good fracture resistance.

[0119] The encapsulation layer 15 of this embodiment adopts a multi-layer encapsulation structure of inorganic materials, organic materials, and inorganic materials stacked, such as Figure 2 shown. The encapsulation material layer of the covering encapsulation area 151 includes a first inorganic material layer 1511, an organic material layer 1512, and a second inorganic material layer 1513 stacked in sequence. Exemplarily, the inorganic material layer can be formed by chemical vapor deposition process, and the organic material layer can be formed by inkjet printing process.

[0120] In this embodiment, as Figure 2 , Figure 3 and Figure 4As shown, the covering encapsulation area 151 and the barrier encapsulation area 152 are provided on the same layer, that is, the covering encapsulation area 151 and the barrier encapsulation area 152 can be formed in the same process. Exemplarily, each encapsulation material layer of the barrier encapsulation area 152 can be formed on the same layer as each material layer of the covering encapsulation area. Exemplarily, the encapsulation material layer 25 of the barrier encapsulation area includes two inorganic material layers arranged in a stack. When forming the first inorganic material layer 1511 and the second inorganic material layer 1513 of the covering encapsulation area 151, the corresponding encapsulation material layer of the barrier encapsulation area 152 can be formed simultaneously, thus saving the process flow.

[0121] Further, considering that there are also other structures provided in the edge area of the display substrate, in another optional embodiment, the display substrate further includes:

[0122] A power trace 16 that surrounds the interception area DD and is electrically connected to the cathode overlap area BB. The projection of the barrier encapsulation area 152 on the substrate 11 covers the projection of the power trace 16 on the substrate 11. The power trace 16 is provided on the same layer as the driving circuit layer 14 of the display area AA, for example, the same layer as Figure 5 the gate 144 shown, or the same layer as Figure 5 the source-drain metal layer 146 shown;

[0123] A crack detection line 17 that surrounds the power trace 16. The projection of the barrier encapsulation area 152 on the substrate covers the projection of the crack detection line 17 on the substrate 11. The crack detection line 17 is provided on the same layer as the power trace 16;

[0124] A crack barrier portion 18 that surrounds the crack detection line 17. The projection of the barrier encapsulation area 152 on the substrate 11 covers the projection of the crack barrier portion 18 on the substrate 11. In a specific example, as Figure 1 shown, the crack barrier portion 18 can be provided on the same layer as the planarization layer 24 of the display area AA. In another specific example, as Figure 5 shown, the crack barrier portion 18 can also be formed on the same layer as the interlayer dielectric layer 142, the gate insulating layer 143, or other insulating layers formed on the substrate 11. Those skilled in the art should design the crack barrier portion 18 according to the actual application, which will not be elaborated here.

[0125] Such as Figure 2 、 Figure 3 and Figure 4As shown in the figure, in this embodiment, on the substrate of the display substrate in the non-display area, a power trace 16 surrounding the outside of the driving unit 141, a crack detection line 17 surrounding the power trace 16, and a crack barrier 18 surrounding the crack detection line 17 are provided. Among them, the power trace 16 is electrically connected to the anode metal layer 121 of the cathode connection area BB to achieve normal display function. The crack detection line 17 is used to form a crack detection circuit to detect whether the display substrate has abnormal fracture. The crack barrier 18 can prevent cracks from extending into the display area when there is edge cutting or edge fracture. Therefore, the above structure in the non-display area still needs to be retained as a necessary structure at the edge. And in this embodiment, by forming a stacked structure in which the barrier encapsulation area 152 is stacked with the above necessary structures (power trace 16, crack detection line 17, and crack barrier 18), on the basis of ensuring the design of the necessary structures at the edge, the design size can be further reduced, which is beneficial to achieving a narrow border design.

[0126] As Figure 2 , Figure 3 , and Figure 4 shown, the stacked structure design of the non-display area of the display substrate according to the embodiment of the present invention is as follows:

[0127] In the direction from the display area AA to the cathode connection area BB, a driving unit 141, a power trace 16, a crack detection line 17, and a crack barrier 18 are sequentially provided on the substrate 11. A stacked structure formed by the cathode connection area BB and the first barrier area CC and an interception area DD surrounding the first barrier area CC are provided on the driving unit 141. A covering encapsulation area 151 is provided on the display area AA, the cathode connection area BB, the first barrier area CC, and the interception area DD; a barrier encapsulation area 152 with a toothed structure is provided above the power trace 16, the crack detection line 17, and the crack barrier 18.

[0128] For the display substrate with the stacked design according to the embodiment of the present invention, its border size can be reduced to less than 0.6 mm, and more preferably, it can be made less than 0.5 mm. Compared with Figure 1 the display substrate with a border size of 0.9 - 1.5 mm in the related technology shown, the border length is reduced by nearly half. The display substrate of this embodiment has broad application prospects.

[0129] As Figure 2 , Figure 3 , and Figure 4 shown, the present invention realizes a narrow border design through the structural design of the non-display area in different embodiments.

[0130] Figure 2The structural schematic diagram of a display substrate according to an embodiment of the present invention is shown. In an alternative embodiment, the first barrier region CC is disposed between the anode metal layer 121 and the cathode metal layer 131. The first barrier region CC includes at least one first isolation pillar 20 having an undercut structure arranged in sequence in the direction from the display region AA to the cathode overlapping region BB. The first isolation pillar 20 is used to cut off the cathode metal layer 131.

[0131] As Figure 2 shown, the first isolation pillar 20 of this embodiment is disposed outside the display region. Exemplarily, the number of the first isolation pillars in this embodiment is 4, which are arranged in sequence in the direction from the display region AA to the cathode overlapping region BB to surround the display region AA. In another example, the size of each first isolation pillar 20 in the direction from the display region AA to the cathode overlapping region BB is 3 - 20 um, preferably 5 - 10 um. The present invention does not limit the number of the first isolation pillars 20, and those skilled in the art can design the number of the first isolation pillars 20 according to the projection of the cathode overlapping region BB, which will not be elaborated herein.

[0132] As Figure 2 shown, when manufacturing the encapsulation covering region 151 above the first isolation pillar 20, the first isolation pillar 20 of this embodiment can block the organic inkjet material of the organic material layer 1512 of the encapsulation covering region 151, prevent the overflow of the organic inkjet material, and ensure the encapsulation effect.

[0133] In an alternative embodiment, as Figure 2 shown, the first isolation pillar 20 having an undercut structure includes:

[0134] A first material layer 21 disposed on the anode metal layer 121 of the cathode overlapping region BB;

[0135] A second material layer 22 disposed on the first material layer 21; and

[0136] A third material layer 23 disposed on the second material layer 21, and the projection of the third material layer 23 on the 11 substrate covers the projection of the second material layer 22 on the substrate 11.

[0137] In this embodiment, the first isolation pillar 20 is designed as a multi-layer structure, so that the projection of the upper third material layer 23 covers the projection of the middle second material layer 22 to form an undercut structure. That is to say, as Figure 2As shown, the outer sidewall of the second material layer 22 of the first isolation pillar 20 is recessed inward compared to the outer sidewall of the third material layer 23, forming a shielding structure similar to an "eaves". In related processes, the cathode metal material of the cathode metal layer 131 is deposited by thermal evaporation. Due to the good verticality of the thermal evaporation process, the first isolation pillar 20 will cut off the cathode metal layer 131. That is to say, the cathode metal layer 131 formed on the third material layer 23 and the cathode metal layer 131 formed on the anode metal layer 121 are designed to be disconnected, thus cutting off the path of water and oxygen intrusion. This design further improves the water and oxygen resistance of the display substrate and improves the encapsulation performance.

[0138] Therefore, the first isolation pillar 20 with an undercut structure in the embodiment of the present invention can not only block the material overflow generated during the production of the organic material layer, but also cut off the cathode to improve the water and oxygen resistance of the display substrate, and can also effectively improve the encapsulation performance of the display substrate.

[0139] In an optional embodiment, the etching rate of the second material layer 22 is greater than that of the first material layer 21 and greater than that of the third material layer 23. In this embodiment, by designing the materials of the second material layer 22 located in the middle layer and the third material layer 23 located above the second material layer 22, when the first isolation pillar 20 is formed by the etching process, the undercut structure of the first isolation pillar 20 is formed simultaneously to save the process flow.

[0140] Exemplarily, by utilizing the characteristic that the etching rates of two materials are different, during the etching process, more areas of the second material layer 22 are etched away, so that the projection of the third material layer 23 covers the projection of the second material layer 22, and the outer sidewall of the second material layer 22 is recessed inward compared to the outer sidewall of the third material layer 23, thereby forming the first isolation pillar 20 with an undercut structure. In a specific example, the side etching amount of the second material layer 22 is 0.1 - 1 um, preferably 0.3 - 0.7 um.

[0141] Considering that when the cathode metal layer 131 is formed on the first isolation pillar 20, the cathode metal layer 131 is disconnected by the first isolation pillar 20. Although the disconnected cathode metal layer 131 can effectively prevent water and oxygen intrusion, since the anode metal layer 121 and the cathode metal layer 131 in the cathode overlap region BB are electrically connected, the cut-off cathode metal layer 131 may cause abnormal overlap in the cathode overlap region BB. To avoid the above problems, further, in an optional embodiment, the third material layer 23 cuts off the cathode metal layer 131, and the cathode metal layer 131 is electrically connected to the anode metal layer through the third material layer 23, the second material layer 22, and the first material layer 21.

[0142] In this embodiment, on the basis of designing the first isolation pillar 20 as a material layer with different etching rates to form an undercut structure, each material layer of the first isolation pillar 20 is further designed as a conductive material, so that the cut-off cathode is re-connected through the conductive performance of the first isolation pillar itself.

[0143] In a specific example, the first material layer 21 is Ti, the second material layer 22 is Al, and the third material layer 23 is Ti, forming a stacked structure of Ti / Al / Ti. Since the etching rates of these two metal materials are different and the etching rate of the Al metal is faster, in the etching process, more regions of the second material layer 22 are etched away, forming the first isolation pillar 20 with an undercut structure. And due to the metal conductive characteristics of Al and Ti, the cathode metal layer 131 formed on the third material layer 23 can form an electrical connection through the third material layer 23, the second material layer 22, the first material layer 21 and the anode metal layer 121, which not only ensures the normal display function of the display substrate, but also realizes the narrow border design of the display substrate and improves the packaging performance of the display substrate.

[0144] In an alternative embodiment, as Figure 2 shown, the barrier packaging area 152 with a tooth-shaped structure includes:

[0145] at least two second isolation pillars 24 arranged in a row along the direction from the display area AA to the cathode overlapping area BB; and

[0146] a packaging material layer 25 formed on the second isolation pillar 24, and the packaging material layer 25 has a tooth-shaped structure with an undercut structure..

[0147] In this embodiment, as Figure 2 shown, the second isolation pillar 24 of the barrier packaging area 152 serves as the base of the packaging structure, so that the packaging material layer 25 formed on the second isolation pillar 24 forms a tooth-shaped structure. The second isolation pillar 24 and the first isolation pillar 20 in this embodiment are arranged on the same layer. That is to say, the second isolation pillar 24 in this embodiment has the same structure as the first isolation pillar 20, that is, as Figure 2 shown, the second isolation pillar 24 also has an undercut structure. In a specific example, the structure of the second isolation pillar 24 can also be a structure in which three material layers are stacked. The outer wall of the material layer in the middle layer is recessed inward compared with the outer wall of the material layer above, further making the packaging material layer 25 formed on the second isolation pillar 24 be an undercut structure formed according to the second isolation pillar 24. The overall barrier packaging area 152 is approximately a tooth-shaped structure. This structural design can prevent the further expansion of cracks when cracks occur at the edge of the display substrate, thereby improving the crack resistance and product reliability of the display substrate.

[0148] In this embodiment, the encapsulation material layer 25 disposed on the second isolation column 24 is disposed on the same layer as the covering encapsulation area 151. As Figure 2 shown, covering encapsulation areas 151 are provided in the display area AA, the cathode connection area BB, and the intercept area DD, and a barrier encapsulation area 152 with a toothed structure is provided outside the intercept area DD.

[0149] The encapsulation material layer 25 of the barrier encapsulation area 152 and the encapsulation material layer 25 of the covering encapsulation area 151 are formed on the same layer. Exemplarily, the encapsulation material layer 25 of the barrier encapsulation area 152 includes two inorganic material layers stacked, and these two inorganic material layers can be formed on the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 of the covering encapsulation area 151. That is to say, the covering encapsulation area 151 and the barrier encapsulation area 152 have different names and functions, but in the actual process, the encapsulation material layers of the encapsulation structure (including the display area and the non-display area) in this embodiment can be formed by the same process.

[0150] In this embodiment, Figure 2 The manufacturing process, manufacturing technology, and material selection of the second isolation column 24 of the shown barrier encapsulation area 152 can be the same as those of the first isolation column 20 of the first barrier area CC. For the specific principle and process, reference can be made to the above-mentioned first isolation column 20, which will not be elaborated here. In this embodiment, the number of the second isolation columns 24 can be designed according to actual applications, which will not be elaborated here. The manufacturing process, manufacturing technology, and material selection of the encapsulation material layer 25 of the barrier encapsulation area 152 can refer to the covering encapsulation layer or related technologies. For the specific principle and process, reference can be made to the above-mentioned covering encapsulation area, which will not be elaborated here.

[0151] As Figure 2 shown, the non-display area of the display substrate in this embodiment further includes:

[0152] A driving unit 141 disposed on the same layer as the driving circuit layer 14. Exemplarily, the driving unit includes a gate circuit driving unit and an enable circuit driving unit. Exemplarily, the driving unit 141 can be formed on the same layer as the active layer 142, the gate 144, the source-drain metal layer 146, etc. of the driving circuit layer 14 shown in Figure 5 . In another specific example, the power supply trace 16 and the crack detection line 17 can also be formed on the same layer as the gate 144, the source-drain metal layer 146, etc. of the driving circuit layer 14 shown in Figure 5 .

[0153] An anode metal layer 121 formed on the planarization material layer 241 and disposed on the same layer as the anode layer 12. Exemplarily, the anode metal layer 121 is electrically connected to the power supply trace 16 through a via of the planarization material layer 241.

[0154] The first isolation column 20 disposed on the anode metal layer 121. Exemplarily, the first isolation column 20 is formed between the pixel defining layer 25 in the display area AA and the interception material layer 251 in the interception area DD. The formation of the first isolation column in this embodiment is as described above and will not be elaborated here.

[0155] The cathode metal layer 131 that is disposed on the same layer as the cathode layer 13 and covers the anode metal layer 121 and the surface of the first isolation column 20 away from the substrate side. As Figure 2 shown, the cathode metal layer 131 in this embodiment is blocked by the first isolation column 20, and is electrically connected to the anode metal layer 121 through the via hole of the planarization material layer 241 by using the conductivity of the first isolation column 20. The cathode metal layer 131 and the anode metal layer 121 that are electrically connected form a cathode overlapping area BB.

[0156] The structure of the display substrate according to the embodiment of the present invention not only ensures the normal display function of the display substrate, but also realizes the narrow border design of the display substrate, and also improves the packaging performance and product reliability of the display substrate, and has a wide application prospect.

[0157] As Figure 3 shown, Figure 3 shows a schematic structural diagram of a display substrate according to another embodiment of the present invention, and its structure will be described now.

[0158] In an optional embodiment, the first barrier area CC is disposed between the cathode metal layer 131 in the cathode overlapping area BB and the substrate 11. Exemplarily, the first barrier area CC is disposed between the cathode metal layer 131 and the planarization material layer 241 formed on the substrate 11. The first barrier area CC includes at least one third isolation column 30 having an undercut structure arranged in sequence along the direction from the display area AA to the cathode overlapping BB area.

[0159] As Figure 3 shown, the third isolation column 30 in this embodiment is disposed outside the display area. Exemplarily, the number of the third isolation columns 30 is 4. In another example, the size of each third isolation column 30 from the display area to the cathode overlapping BB area is 3 - 20 um, preferably 5 - 10 um. The present invention does not limit the number of the third isolation columns, and those skilled in the art can design the number of the third isolation columns according to the projection of the cathode overlapping area, which will not be elaborated here. As Figure 3 shown, when manufacturing the packaging structure covering the packaging area 151 above the third isolation column 30, the third isolation column 30 can block the overflow of the inkjet material of the organic material layer 1512 and ensure the packaging effect.

[0160] In an optional embodiment, as Figure 3As shown, the third isolation column 30 with an undercut structure includes:

[0161] A fourth material layer 31 disposed on the substrate 11, and the fourth material layer 31 serves as the anode metal layer 121 of the cathode overlap region BB. In this embodiment, the anode metal layer 121 of the cathode overlap region BB is cancelled, and the fourth material layer 31 with conductive characteristics is used as the overlap metal layer, which simplifies the layer structure of the cathode overlap region BB in this embodiment.

[0162] In an alternative embodiment, the fourth material layer 31 is disposed on the same layer as the source-drain metal layer 146 of the driving circuit layer 14 in the display area, which can better conform to the original process flow. Exemplarily, as Figure 5 shown, the process for fabricating the driving TFT of the driving circuit layer is: forming the active layer 142 of the driving TFT on the substrate 11, forming the interlayer dielectric layer 143 covering the active layer 142, forming the gate 144 on the interlayer dielectric layer 143, forming the gate insulating layer 145 on the gate 144, and forming the source-drain metal layer 146 on the gate insulating layer 145. Among them, when forming the source-drain metal layer 146, the fourth material layer 31 can be simultaneously formed in the non-display area AA. In subsequent processes, for example, when forming a planarization layer 24 on the source-drain metal layer 146 in the display area AA and opening holes in the planarization layer 24 to achieve electrical connection between the anode layer 12 and the source-drain metal layer 146 on the planarization layer, holes can be formed in the fourth material layer 31 in the non-display area in the same process, so as to form the fifth material layer 32 and the sixth material layer 33 on the fourth material layer 31, thereby forming the third isolation column 30 with conductive performance.

[0163] It should be noted that the above process for forming the fourth material layer 31 is only an example, and those skilled in the art can also form the fourth material layer 31 serving as the anode metal layer 121 through other means. For example, when forming the anode layer 12 in the display area AA, the anode metal layer 121 can be formed in the non-display area in the same process to serve as the fourth material layer 31. Another example is to directly form the fourth material layer 31 on the planarization material layer 241 in the non-display area. The above solutions can all form the fourth material layer 31 serving as the anode metal layer 121, and those skilled in the art can design according to actual applications, which will not be elaborated here.

[0164] In an alternative embodiment, as Figure 3 shown, the third isolation column 30 with an undercut structure further includes:

[0165] A fifth material layer 32 disposed on the fourth material layer 31;

[0166] A sixth material layer 33 disposed on the fifth material layer 32, and a projection of the sixth material layer 33 on the substrate 11 covers a projection of the fifth material layer 32 on the substrate 11.

[0167] The third isolation pillar 30 in this embodiment is also a multi-layer structure. The projection of the sixth material layer 33 located above covers the projection of the fifth material layer 32 located in the middle layer, thereby forming an undercut structure, which cuts off the cathode metal layer 131 formed on the sixth material layer 33 to cut off the path of water and oxygen intrusion, further improving the water and oxygen resistance of the display substrate and improving the encapsulation performance. Therefore, in the embodiment of the present invention Figure 3 The shown third isolation pillar 30 with an undercut structure can not only block the material overflow generated during the production of the organic material layer 1512, but also cut off the cathode metal layer 131 to improve the water and oxygen resistance of the display substrate, and can also effectively improve the encapsulation performance of the display substrate.

[0168] In an optional embodiment, the etching rate of the fifth material layer 32 is greater than the etching rate of the sixth material layer 33. In this embodiment, by designing the materials of the fifth material layer 32 located in the middle layer and the sixth material layer 33 located above the fifth material layer 32, when the third isolation pillar 30 is formed by the etching process, the undercut structure of the third isolation pillar 30 is formed simultaneously to save the process flow. In a specific example, the side etching amount of the fifth material layer is 0.1 - 1 um, preferably 0.3 - 0.7 um.

[0169] In this embodiment, the sixth material layer 33 cuts off the cathode metal layer 131, which may cause abnormal connection in the cathode connection area BB. To avoid the above problems, in an optional embodiment, the cathode metal layer 131 is electrically connected to the fourth material layer 31 serving as the anode metal layer 121 through the sixth material layer 33 and the fifth material layer 32.

[0170] In a specific example, the fourth material layer 31 is a metal material provided on the same layer as the source-drain metal layer 146, the fifth material layer is Al, and the sixth material layer is Ti, forming a stacked structure of Al / Ti from bottom to top. Due to the different etching rates of the two materials, the etching rate of Al is faster. Therefore, in the etching process, more areas of the fifth material layer are etched away, forming the third isolation pillar 30 with an undercut structure. And due to the metal conductivity characteristics of Al and Ti, the cathode metal layer 131 formed on the sixth material layer 33 can be electrically connected to the fourth material layer 31 serving as the anode metal layer 121 through the sixth material layer 33 and the fifth material layer 32, which not only ensures the normal display function of the display substrate, but also realizes the narrow border design of the display substrate, and improves the encapsulation performance of the display substrate.

[0171] In an alternative embodiment, as Figure 3 shown, the barrier encapsulation region 152 with a tooth-shaped structure includes:

[0172] at least two fourth isolation posts 34 arranged in the direction from the display region AA to the cathode connection region BB; and

[0173] an encapsulation material layer 35 formed on the fourth isolation posts 34, the encapsulation material layer 35 being a tooth-shaped structure with an undercut structure;

[0174] wherein, the fourth isolation posts 34 and the third isolation posts 30 are arranged on the same layer.

[0175] In this embodiment, the manufacturing process, manufacturing technology, and material selection of the fourth isolation posts 34 in the barrier encapsulation region 152 can be the same as those of the third isolation posts 30 in the first barrier region CC. For the specific principle and process, reference can be made to the above-mentioned third isolation posts 30, which will not be elaborated here. In this embodiment, the number of the fourth isolation posts 34 can be designed according to actual applications, which will not be elaborated here.

[0176] In this embodiment, the encapsulation material layer 35 provided on the fourth isolation posts 30 is arranged on the same layer as the material layer covering the encapsulation region 151. As Figure 3 shown, the covering encapsulation region 151 is provided in the display region AA, the cathode connection region BB, and the intercept region DD. A barrier encapsulation region 152 with a tooth-shaped structure is provided outside the intercept region DD. Exemplarily, the encapsulation material layer 35 of the barrier encapsulation region 152 includes two inorganic material layers arranged in a stacked manner, and these two inorganic material layers can be formed on the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 of the covering encapsulation region 151.

[0177] It should be noted that the names and functions of the covering encapsulation region 151 and the barrier encapsulation region 152 are different, but in the actual process, the encapsulation material layers of the encapsulation structure (including the display region and the non-display region) in this embodiment can be formed by the same process.

[0178] It should be noted that in this embodiment Figure 3 the barrier encapsulation region 152 with a tooth-shaped structure shown is similar to the Figure 2 barrier encapsulation region 152 shown in terms of structure and principle. For the relevant processes, structures, and principles, reference can be made to the Figure 2 discussion in the embodiment, which will not be elaborated here.

[0179] In an alternative embodiment, the non-display region of the display substrate shown in this embodiment Figure 3 further includes:

[0180] The fourth material layer 31 of the third isolation pillar 30 formed on the planarization material layer 241, and the fourth material layer 31 serves as the anode metal layer 121 of the cathode lap region BB.

[0181] The fifth material layer 32 and the sixth material layer 33 of the third isolation pillar 30 sequentially disposed on the fourth material layer 31. The fifth material layer 32 and the sixth material layer 33 of the third isolation pillar 30 are disposed between the pixel defining layer 25 and the interception material layer 251 in the display area AA. Exemplarily, the projection of the sixth material layer 33 on the substrate 11 covers the projection of the fifth material layer 32 on the substrate 11. The fourth material layer 31, the fifth material layer 32, and the sixth material layer 33 together form the third isolation pillar 30 having an undercut structure.

[0182] The cathode metal layer 131 disposed on the same layer as the cathode layer 13 and covering the surfaces of the fourth material layer 31 and the sixth material layer 33 away from the substrate 11 side. As Figure 3 shown, the cathode metal layer 131 of this embodiment is blocked by the sixth material layer 33, and the sixth material layer 33 and the fifth material layer 32 of the third isolation pillar 30 are used to electrically connect to the fourth material layer 31 serving as the anode metal layer 121 by their conductivity.

[0183] It should be noted that the process, structure, and principle of the display area in this embodiment can be referred to Figure 5 and the process, structure, and principle of the aforementioned display area, which will not be elaborated here.

[0184] The present invention Figure 3 The structure of the encapsulation layer 15 in the shown embodiment can refer to the structure of the encapsulation layer 15 in the present invention Figure 2 shown, for example, Figure 3 the encapsulation material layer 35 formed on the fourth isolation pillar 30, the first inorganic material layer 1511, the organic material layer 1512, and the second inorganic material layer 1513 covering the encapsulation area 151 formed between the display area AA and the interception area DD. The relevant parts can be referred to, which will not be elaborated here.

[0185] It is also worth noting that the display substrate of this embodiment is still applicable to the stacked structure design of the aforementioned non-display area, that is: in the direction from the display area AA to the cathode connection area BB, a driving unit 141, a power supply trace 16, a crack detection line 17, and a crack blocking portion 18 are sequentially arranged on the substrate 11. A stacked structure formed by the cathode connection area BB and the first barrier area CC and an interception area DD surrounding the first barrier area CC are arranged on the driving unit 141. A cover encapsulation area 151 is arranged on the display area AA, the cathode connection area BB, the first barrier area CC, and the interception area DD; a barrier encapsulation area 152 with a toothed structure is arranged above the power supply trace 16, the crack detection line 17, and the crack blocking portion 18.

[0186] The structure of the display substrate according to the embodiment of the present invention not only ensures the normal display function of the display substrate, but also realizes the narrow bezel design of the display substrate, and also improves the encapsulation performance and product reliability of the display substrate, having broad application prospects.

[0187] As Figure 4 shown, Figure 4 FIG. shows a schematic structural diagram of a display substrate according to another embodiment of the present invention, and its structure will be described below.

[0188] In an alternative embodiment, as Figure 4 shown, the first barrier area CC is arranged between the cathode connection area BB and the substrate 11 of the display substrate,

[0189] The first barrier area CC at least includes:

[0190] a seventh material layer 41 arranged on the substrate 11, and

[0191] an eighth material layer 42 arranged on the seventh material layer 41;

[0192] The first barrier area CC further includes a first groove structure 43 recessed from the surface of the seventh material layer 41 away from the substrate 11 towards the eighth material layer 42, and the first groove structure 43 penetrates through the eighth material layer 42 and does not penetrate through the seventh material layer 41; the anode metal layer 121 is arranged on the eighth material layer 42 leaking out of the first groove structure 43 and the surface of the seventh material layer 41 away from the substrate 11.

[0193] As Figure 4As shown in the figure, four first groove structures 43 are arranged outside the display area AA, sequentially arranged in the direction from the display area AA to the cathode connection area BB, and surround the display area AA. Exemplarily, the depth of each first groove structure 43 is 1-3 um, preferably 1.2-2 um. In this embodiment, the depth of the first groove structure 43 is the length of the surface of the eighth material layer 42 away from the substrate 11 recessed towards the substrate 11. Exemplarily, the width dimension of each first groove structure 43 in the direction from the display area AA to the cathode connection area BB is 3-20 um, preferably 5-10 um.

[0194] The present invention does not limit the number and size of the first groove structures 43. Those skilled in the art can design the number and size of the first groove structures 43 according to the projection of the cathode connection area BB, which will not be elaborated here. When manufacturing the cover encapsulation area 151 above the first groove structure 43, by using the recessed opening of the first groove structure 43 in this embodiment, the encapsulation material of the cover encapsulation area 151 can be accommodated, thereby preventing the encapsulation material from overflowing.

[0195] In an alternative embodiment, as Figure 5 shown, the projection of the opening of the first groove structure 43 in the seventh material layer 41 on the substrate 11 covers the projection of the opening of the first groove structure 43 in the eighth material layer 42 on the substrate 11, so that the cathode metal layer 131 of the cathode connection area BB formed on the first barrier area CC is cut off.

[0196] In this embodiment, the opening sizes of the first groove structure 43 in different material layers are designed such that the opening of the upper eighth material layer 42 in the stacked structure is smaller than the opening of the lower seventh material layer 41, thereby forming a first groove structure 43 with an undercut structure. This undercut structure is as Figure 5 shown. For the first groove structure 43, the side wall of the opening of the upper eighth material layer 42 protrudes outward compared to the side wall of the opening of the lower seventh material layer 41, forming an approximate "eaves" shielding structure, which is the undercut structure of this embodiment. By using this setting, the cathode metal layer 131 formed on the first groove structure 43 will be cut off, thereby cutting off the path of water and oxygen intrusion. This design further improves the water and oxygen resistance of the display substrate and the encapsulation performance.

[0197] In an alternative embodiment, the etching rate of the seventh material layer 41 is greater than that of the eighth material layer 42. In this embodiment, by designing the materials of the two material layers of the first groove structure 43 and utilizing the characteristic that the etching rates of the two materials are different, during the etching process, a larger area of the underlying seventh material layer 41 is etched away, and a smaller area of the upper eighth material layer 42 is etched, thereby enabling the formation of the first groove structure 43 with an undercut structure. In a specific example, the side etching amount of the seventh material layer 41 is 0.2 - 2 μm, preferably 0.3 - 0.5 μm.

[0198] In an alternative embodiment, the seventh material layer 41 is a planarization material layer 241 provided on the same layer 24 as the planarization layer of the display area AA. In this embodiment, by using the existing process for forming the planarization layer 24, the seventh material layer 41 of the first groove structure 43 is formed simultaneously during this process flow. That is to say, in this embodiment, the planarization material layer 241 in the non-display area is used as the seventh material layer 41, thereby simplifying the process flow.

[0199] In an alternative embodiment, an eighth material layer 42 is provided on the planarization material layer 241 serving as the seventh material layer 41. The eighth material layer 42 is a passivation layer provided on the planarization material layer 241, and this passivation layer can be used both as the eighth material layer and as a hard mask plate for etching the seventh material layer. Exemplarily, the gas for etching the upper eighth material layer 42 can be a gas such as CHF3, and the gas for etching the lower seventh material layer 41 is mainly O2. When etching the seventh material layer 41, the eighth material layer 42 can be used as a hard mask plate for etching the seventh material layer 41, such that the opening of the first groove structure 43 formed in the seventh material layer 41 is larger than the opening of the first groove structure 43 formed in the eighth material layer 42, thereby forming the undercut structure of the first groove structure 43 and cutting off the cathode metal layer 131 provided above the eighth material layer 42.

[0200] In another alternative embodiment, the first groove structure 43 further includes a dielectric layer located between the seventh material layer 41 and the eighth material layer 42 ( Figure 4(not shown in the figure), that is to say, the first groove structure 43 of this embodiment includes at least two or more layers of film layers. When the first groove structure 43 is composed of two or more layers of film layers, a dielectric layer is further provided between the seventh material layer 41 and the eighth material layer 42. Exemplarily, the dielectric layer of this embodiment can be arranged in the same layer as the insulating layer, inorganic layer, organic layer or metal layer provided on the planarization layer 24 in the display area AA. That is to say, this embodiment does not limit the specific number of layers of the first groove structure 43. Taking the outer convex shape of the undercut structure formed by the upper layer and the inner concave shape of the undercut structure formed by the lower layer to cut off the cathode metal layer 131 to improve the water and oxygen resistance performance as the design criterion, it will not be elaborated here.

[0201] Exemplarily, the material layer on the side far from the substrate in the material layers of the first groove structure is an inorganic layer, or a metal layer, an alloy layer or an organic layer, and the material layer on the side close to the substrate in the material layers of the first groove structure is an organic layer or an inorganic layer, etc. Those skilled in the art can design the layer structure of the first groove structure according to actual applications, taking the first groove structure formed to cut off the cathode metal layer as the design criterion, and it will not be elaborated here.

[0202] It should be noted that the process, structure and principle of the display area of this embodiment can be referred to Figure 5 and the process, structure and principle of the aforementioned display area, which will not be elaborated here.

[0203] Such as Figure 4 As shown, the continuous first groove structure 43 cuts off the cathode metal layer 131. Considering that the cut-off cathode metal layer 131 may cause abnormal connection in the cathode connection area BB, to avoid the above problems, further, in an optional embodiment, the projection of the first barrier area CC on the substrate 11 is an annular structure with a notch, which is used to form an electrical connection of the cathode metal layer 131 cut off by the first barrier area CC at the notch.

[0204] Such as Figure 7 As shown, the first groove structure 43 surrounds the display area AA, the intercept area DD surrounds the first barrier area CC formed by the first groove structure 43, and the second groove structure 44 of the barrier encapsulation area 152 of the encapsulation layer surrounds the intercept area DD. This embodiment designs a notch for the first groove structure 43 surrounding the display area AA. Exemplarily, the notch is provided at the lower border of the display substrate, and at this notch, the disconnected cathode metal layer 131 is connected again. That is to say, although the first groove structure 43 of this embodiment makes Figure 7The cathode metal layer in the direction from the display area AA to the cathode overlap area BB is disconnected as shown, but by forming a notch design for the first groove structure 43, the cathode metal layer 131 is reconnected, ensuring the overlap area and contact resistance of the cathode overlap area BB. On the basis of ensuring normal display and good resistance to water and oxygen erosion, the influence of IR drop can also be reduced, further improving the overall performance of the display substrate.

[0205] In an alternative embodiment, as Figure 4 shown, the barrier encapsulation area 152 with a tooth-shaped structure includes:

[0206] At least two second groove structures 44 arranged in the direction from the display area AA to the cathode overlap area BB, and the second groove structures 44 are arranged on the same layer as the first groove structure 43; and

[0207] An encapsulation material layer 45 covering the second groove structures 44, and the encapsulation material layer 45 has a tooth-shaped structure with an undercut structure.

[0208] In this embodiment, the second groove structures 44 and the first groove structures 43 are arranged on the same layer, that is, in the process of forming the first groove structures 43, the second groove structures 44 are formed simultaneously. Therefore, the second groove structures 44 in this embodiment have the same structure as the first groove structures 43.

[0209] That is to say, the second groove structures 44 also have a seventh material layer 41 and an eighth material layer 42 provided on the seventh material layer 41. Similarly, the projection of the opening of the second groove structures 44 on the seventh material layer 41 on the substrate 11 covers the projection of the opening of the second groove structures 44 on the eighth material layer 42 on the substrate 44, thereby forming the second groove structures 44 with an undercut structure.

[0210] As Figure 4 shown, the second groove structures 44 of the barrier encapsulation area 152 of the encapsulation layer 15 serve as the base of the encapsulation structure, so that the encapsulation material layer 45 provided on the second groove structures 44 has an undercut structure formed according to the second groove structures 44, making the overall barrier encapsulation area 152 approximately a tooth-shaped structure. This structural design can prevent the further expansion of cracks when cracks occur at the edge of the display substrate, thereby improving the crack resistance and product reliability of the display substrate.

[0211] In this embodiment, the manufacturing process, manufacturing technology, and material selection of the second groove structures 44 in the barrier encapsulation area 152 of the encapsulation layer 15 can be the same as those of the first groove structures 43 in the first barrier area CC. The specific principle and process can refer to the above-mentioned first groove structures 43 and will not be elaborated here. In this embodiment, the number of the second groove structures 44 can be designed according to actual applications and will not be elaborated here.

[0212] In this embodiment, the encapsulation material layer 45 of the second groove structure 44 is provided on the same layer as the material layer covering the encapsulation area 151. Exemplarily, the encapsulation material layer 45 of the barrier encapsulation area 152 includes two inorganic material layers arranged in a stacked manner, and these two inorganic material layers can be formed on the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 covering the encapsulation area 151. For related parts, reference can be made to the description of the covering encapsulation area 151 and the barrier encapsulation area 152 in the foregoing embodiment, and details will not be elaborated here.

[0213] Now, taking Figure 4 the shown display substrate as an example, the manufacturing process of the display substrate having the first groove structure 43 and the second groove structure 44 will be described.

[0214] The display area of this embodiment can refer to Figure 2 and Figure 3 as well as Figure 5 the shown display substrate. For related processes and structural associations, reference can be made, and details will not be elaborated here.

[0215] In this embodiment, Figure 4 the non-display area of the shown display substrate further includes:

[0216] a planarization material layer 241 provided on the same layer 24 as the planarization layer. In this embodiment, the planarization material layer 241 can be used as the seventh material layer 41 of the second groove structure, thus saving the process flow.

[0217] An eighth material layer 42 provided on the planarization layer 41 serving as the seventh material layer. A first groove structure 43 is formed in the direction from the surface of the seventh material layer 41 away from the substrate side towards the eighth material layer 42. The first groove structure 43 penetrates through the eighth material layer 42 and does not penetrate through the seventh material layer 41, ensuring an insulating partition from the driving unit 141 provided below the seventh material layer 41. In a specific example, during the process of forming the first groove structure 43, the second groove structure 44 in the barrier encapsulation area 152 is also formed.

[0218] The anode metal layer 131 is provided on the surfaces of the eighth material layer 42 where the second groove structure 44 leaks out and the seventh material layer 41 away from the substrate 11 side;

[0219] A cathode metal layer 131 provided on the anode metal layer 121 and the interception material layer 251. The first groove structure 43 cuts off the cathode metal layer 131.

[0220] The covering encapsulation area 151 is disposed on the cathode metal layer 131, and the encapsulation material layer 45 is disposed on the second groove structure 44 of the barrier encapsulation area 152. Exemplarily, the encapsulation material layer 45 of the covering encapsulation area 151 and the encapsulation material layer 45 formed on the second groove structure 44 are arranged in the same layer. That is to say, although the covering encapsulation area and the barrier encapsulation area have different names and functions, in the actual process, the encapsulation material layers of the encapsulation structures (including the display area and the non-display area) in this embodiment can all be formed by the same process.

[0221] The structure of the display substrate according to the embodiment of the present invention not only ensures the normal display function of the display substrate, but also realizes the narrow border design of the display substrate, and further improves the encapsulation performance and product reliability of the display substrate, having broad application prospects.

[0222] It should be noted that the driving unit, power supply trace, crack detection line, and crack detection part described above in the embodiment of the present invention are equally applicable to the embodiment of the present application. For the relevant parts, reference can be made to the above description and will not be elaborated here.

[0223] As Figures 2 to 4 shown, through the structural design of the display substrate of the above three embodiments in this embodiment, a stacked display substrate is formed. In the direction from the display area AA to the cathode overlapping area BB, a driving unit 141, a power supply trace 16, a crack detection line 17, and a crack blocking part 18 are sequentially arranged on the substrate 11. A stacked structure formed by the cathode overlapping area BB and the first barrier area CC and an intercepting area DD surrounding the first barrier area CC are arranged on the driving unit 141, and a covering encapsulation area 151 is arranged on the display area AA, the cathode overlapping area BB, the first barrier area CC, and the intercepting area DD; a barrier encapsulation area 152 is arranged above the power supply trace 16, the crack detection line 17, and the crack blocking part 18.

[0224] By using the edge design of the stacked structure in this embodiment, the border size of the display substrate can be reduced to less than 0.6 mm, and more preferably, it can be made less than 0.5 mm. Compared with the display substrate with a border size of 0.9 - 1.5 mm in the related technology shown Figure 1 the border length is reduced by nearly half, and the display substrate of this embodiment has broad application prospects.

[0225] Corresponding to the display substrate of the above embodiment, another embodiment of the present invention provides a method for manufacturing the above display substrate. As Figure 8 shown, the method includes:

[0226] S1. Form a display area AA and a cathode overlapping area BB surrounding the display area AA on the substrate 11;

[0227] S2. Form a first barrier region CC around the display region AA on the substrate 11 of the display substrate, wherein the projection of the cathode connection region BB on the substrate 11 covers the projection of the first barrier region CC on the substrate 11.

[0228] The process flow of the display substrate according to the embodiment of the present invention is simple and easy to fabricate. Based on this process flow, the formed display substrate forms both a cathode connection region and a first barrier region in the same region at the edge of the display substrate, so that on the basis of ensuring the normal display of the display substrate, the edge size of the display substrate can be reduced, and a narrow border design can be realized.

[0229] Considering that other structures are also provided in the edge region of the display substrate, in an optional embodiment, as Figure 9 shown, the method further includes:

[0230] S3. Form an interception region DD around the first barrier region CC, wherein the interception region DD is disposed between the anode metal layer 121 and the cathode metal layer 131, and the projection of the cathode connection region BB on the substrate 11 covers the projection of the interception region DD on the substrate 11.

[0231] For the display substrate formed by the method of this embodiment, a first barrier region CC is formed at the projection position of the cathode connection region BB, and an interception region DD surrounding the first barrier region CC is also formed at the projection position of the cathode connection region BB. Therefore, on the basis of ensuring the normal display of the display substrate, the edge size of the display substrate can be further reduced, and a better narrow border design can be realized.

[0232] In an optional embodiment, the method further includes:

[0233] S4. Form the encapsulation layer 15, wherein the encapsulation layer 15 includes: a covering encapsulation region 151 covering the display region AA, covering the cathode connection region BB, and covering the interception region DD, and a barrier encapsulation region 152 having a tooth-shaped structure surrounding the interception region DD.

[0234] The encapsulation layer with a tooth-shaped structure formed by the method of this embodiment can further prevent water and oxygen from entering, improve the overall encapsulation performance of the display substrate, can also anchor the encapsulation layer, prevent crack propagation, and also enable the display panel to have good anti-fracture performance.

[0235] Figure 10 Shows the method corresponding to forming Figure 2 shown in the structure of the display substrate. In an optional embodiment, before forming the encapsulation layer, the method further includes:

[0236] Form a planarization material layer 241 disposed on the same layer as the planarization layer 24:

[0237] Form an anode metal layer 121 disposed on the same layer as the anode layer 12 on the planarization material layer 241;

[0238] Form an interception material layer 254 of the interception region DD disposed on the same layer as the pixel definition layer 25 on the anode metal layer 121;

[0239] Form the first isolation pillar 20 on the anode metal layer 131;

[0240] Form a cathode metal layer 131 disposed on the same layer as the cathode layer 13, covering the anode metal layer 121 and covering the surface of the first isolation pillar 20 on the side away from the substrate 11.

[0241] It should be noted that the principle and working process of the method for manufacturing the display substrate provided in this embodiment are similar to those of the above display substrate. For the relevant parts, reference can be made to the above description and will not be elaborated here.

[0242] Figure 11 Shows corresponding to forming Figure 3 A method for the structure of the display substrate shown. In an optional embodiment, before forming the encapsulation layer 15, the method further includes:

[0243] Form a planarization material layer 241 disposed on the same layer as the planarization layer 24: Form a fourth material layer 31 of the third isolation pillar 30 on the planarization material layer 241, and the fourth material layer 31 serves as the anode metal layer 121 of the cathode overlapping region BB;

[0244] Form an interception material layer 251 of the interception region DD disposed on the same layer as the pixel definition layer 25 on the fourth material layer 31;

[0245] Sequentially form a fifth material layer 32 and a sixth material layer 33 of the third isolation pillar 30 on the fourth material layer 31;

[0246] Form a cathode metal layer 131 disposed on the same layer as the cathode layer 13, covering the fourth material layer 31 and the surface of the sixth material layer 33 on the side away from the substrate 11.

[0247] It should also be noted that the principle and working process of the method for the display substrate provided in this embodiment are similar to those of the above display substrate. For the relevant parts, reference can be made to the above description and will not be elaborated here.

[0248] Figure 12 Shows corresponding to forming Figure 4A method for the structure of the display substrate shown. In an alternative embodiment, before forming the encapsulation layer 15, the method further includes:

[0249] Forming the seventh material layer 41 on the substrate 11, where the seventh material layer 41 is a planarization material layer 241 provided on the same layer as the planarization layer 24 of the display area AA;

[0250] Forming the eighth material layer 42 on the seventh material layer 41; forming a first groove structure 43 in the direction from the surface of the seventh material layer 41 away from the substrate 11 towards the eighth material layer 42, where the first groove structure 43 penetrates through the eighth material layer 42 and does not penetrate through the seventh material layer 41;

[0251] Forming the anode metal layer 131 on the surface of the eighth material layer 42 where the first groove structure 43 leaks out and on the surface of the seventh material layer 41 away from the substrate 11;

[0252] Forming the interception material layer 251 of the interception area DD on the anode metal layer 121;

[0253] Forming the cathode metal layer 131 on the anode metal layer 121 and the interception material layer 251, where the cathode metal layer 131 is cut off by the first groove structure 43.

[0254] It should also be noted that the principle and working process of the method for the display substrate provided in this embodiment are similar to those of the above display substrate. The relevant parts can be referred to the above description and will not be elaborated here.

[0255] For the display substrate with a stacked design formed by the method of the above embodiment of the present invention, its border size can be reduced to less than 0.6 mm. More preferably, it can be made less than 0.5 mm. Compared with Figure 1 the display substrate with a border size of 0.9 - 1.5 mm in the related technology shown, the border length is reduced by nearly half, which is beneficial to realizing a narrow border design.

[0256] Another embodiment of the present invention proposes a display device, including the display substrate of the above embodiment of the present invention as claimed. This display device can be any product or component that requires a backlight, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, a vehicle-mounted central control gear lever, and an e-ink screen, etc. The embodiments of the present invention do not limit this.

[0257] It should also be noted that in the description of the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0258] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limitations on the implementation manners of the present invention. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is impossible to enumerate all the implementation manners here. Any obvious changes or variations derived from the technical solutions of the present invention still fall within the protection scope of the present invention.

Claims

1. A display substrate, characterized in that, It includes a display area and a non-display area; The non-display area includes: A cathode overlap area surrounding the display area, A first barrier area surrounding the display area provided on the substrate of the display substrate, wherein the projection of the cathode overlap area on the substrate covers the projection of the first barrier area on the substrate; the cathode overlap area includes a cathode metal layer provided on the same layer as the cathode layer of the display area and an anode metal layer provided on the same layer as the anode layer of the display area; An interception area surrounding the first barrier area provided on the side of the first barrier area away from the display area, wherein the interception area is provided between the anode metal layer and the cathode metal layer, and the projection of the cathode overlap area on the substrate covers the projection of the interception area on the substrate; The display area includes: A driving circuit layer provided on the substrate: A planarization layer provided on the driving circuit layer: A light-emitting device layer provided on the planarization layer, the light-emitting device layer includes a pixel definition layer, an anode layer defined by the pixel definition layer, a light-emitting material layer provided on the anode layer, and a cathode layer covering the light-emitting material layer and the pixel definition layer; The non-display area includes: A planarization material layer provided on the same layer as the planarization layer: and An interception material layer of the interception area provided on the same layer as the pixel definition layer; Wherein, (A), the first barrier area is provided between the anode metal layer and the cathode metal layer, and the first barrier area includes at least one first isolation pillar having an undercut structure arranged in sequence in the direction from the display area to the cathode overlap area; Or (B), the first barrier area is provided between the cathode metal layer and the substrate, and the first barrier area includes at least one third isolation pillar having an undercut structure arranged in sequence in the direction from the display area to the cathode overlap area.

2. The display substrate according to claim 1, characterized in that, The display substrate further includes a packaging layer, and the packaging layer includes: A covering packaging area for covering the display area, covering the cathode overlap area, and covering the interception area; and A barrier packaging area with a tooth-shaped structure surrounding the interception area; Wherein, the covering packaging area and the barrier packaging area are provided on the same layer.

3. The display substrate according to claim 2, wherein For (A), the first isolation pillar having an undercut structure includes: A first material layer provided on the anode metal layer of the cathode overlap area; A second material layer provided on the first material layer; and A third material layer provided on the second material layer, and the projection of the third material layer on the substrate covers the projection of the second material layer on the substrate; The third material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected to the anode metal layer through the first material layer, the second material layer, and the third material layer.

4. The display substrate according to claim 3, wherein The barrier packaging area with a tooth-shaped structure includes: At least two second isolation pillars arranged in sequence in the direction from the display area to the cathode overlap area; and A packaging material layer provided on the second isolation pillar, and the packaging material layer is a tooth-shaped structure with an undercut structure; Among them, the second isolation pillar and the first isolation pillar are arranged on the same layer, and the encapsulation material layer arranged on the second isolation pillar and the material layer covering the encapsulation area are arranged on the same layer.

5. The display substrate according to claim 4, wherein The non-display area further includes: an anode metal layer arranged on the same layer as the anode layer; The first isolation pillar arranged on the anode metal layer; A cathode metal layer arranged on the same layer as the cathode layer, covering the anode metal layer and covering the surface of the first isolation pillar on the side away from the substrate.

6. The display substrate according to claim 2, wherein For (B), the third isolation pillar with an undercut structure includes: A fourth material layer arranged on the substrate, and the fourth material layer serves as the anode metal layer of the cathode connection area; A fifth material layer arranged on the fourth material layer; A sixth material layer arranged on the fifth material layer, and the projection of the sixth material layer on the substrate covers the projection of the fifth material layer on the substrate; Among them, the sixth material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected to the fourth material layer serving as the anode metal layer through the sixth material layer and the fifth material layer.

7. The display substrate according to claim 6, wherein The barrier encapsulation area with a tooth-shaped structure includes: At least two fourth isolation pillars arranged in sequence along the direction from the display area to the non-display area; and An encapsulation material layer arranged on the fourth isolation pillar, and the encapsulation material layer has a tooth-shaped structure with an undercut structure; Among them, the fourth isolation pillar and the third isolation pillar are arranged on the same layer, and the encapsulation material layer arranged on the fourth isolation pillar and the material layer covering the encapsulation area are arranged on the same layer.

8. The display substrate according to claim 7, wherein The non-display area further includes: The fourth material layer of the third isolation pillar arranged on the planarization material layer; The fifth material layer and the sixth material layer of the third isolation pillar arranged in sequence on the fourth material layer; A cathode metal layer arranged on the same layer as the cathode layer, covering the surface of the fourth material layer and the sixth material layer on the side away from the substrate.

9. The display substrate according to claim 2, wherein The first barrier area is arranged between the cathode connection area and the substrate of the display substrate, The first barrier area at least includes: A seventh material layer arranged on the substrate, and An eighth material layer arranged on the seventh material layer; The first barrier area further includes a first groove structure recessed from the surface of the seventh material layer on the side away from the substrate towards the eighth material layer, and the first groove structure penetrates the eighth material layer and does not penetrate the seventh material layer; The anode metal layer is formed on the surface of the eighth material layer leaking out of the first groove structure and the seventh material layer on the side away from the substrate; Or The seventh material layer is a planarization material layer arranged on the same layer as the planarization layer; The eighth material layer is a passivation layer arranged on the planarization layer.

10. The display substrate according to claim 9, wherein The projection of the opening of the first groove structure on the seventh material layer on the substrate covers the projection of the opening of the first groove structure on the eighth material layer on the substrate, so that the cathode metal layer of the cathode connection area formed on the first barrier area is cut off; The projection of the first barrier region on the substrate is an annular structure with a notch, which is used to form an electrical connection at the notch of the cathode metal layer cut off by the first barrier region.

11. The display substrate according to claim 10, wherein The barrier encapsulation region with a toothed structure includes: At least two second groove structures arranged along the direction from the display region to the non-display region, and the second groove structures are arranged on the same layer as the first groove structures; and An encapsulation material layer arranged in the second groove structures, and the encapsulation material layer is a toothed structure with an undercut structure; Wherein, the second groove structures and the first groove structures are arranged on the same layer, and the encapsulation material layer arranged in the second groove structures and the material layer covering the encapsulation region are arranged on the same layer.

12. The display substrate according to any one of claims 2 to 11, wherein The display substrate further includes: A driving unit arranged between the cathode overlapping region and the substrate, the projection of the cathode overlapping region on the substrate covers the projection of the driving unit on the substrate, and the driving unit is arranged on the same layer as the driving circuit layer of the display region; Or The display substrate further includes: A power supply trace electrically connected to the cathode overlapping region and surrounding the interception region, the projection of the barrier encapsulation region on the substrate covers the projection of the power supply trace on the substrate, and the power supply trace is arranged on the same layer as the driving circuit layer of the display region; A crack detection line surrounding the power supply trace, the projection of the barrier encapsulation region on the substrate covers the projection of the crack detection line on the substrate, and the crack detection line is arranged on the same layer as the power supply trace; A crack barrier portion surrounding the crack detection line, and the projection of the barrier encapsulation region on the substrate covers the projection of the crack barrier portion on the substrate.

13. A method for manufacturing the display substrate according to any one of claims 2 to 12, characterized in that, Including: Forming a display region and a cathode overlapping region surrounding the display region on the substrate; Forming a first barrier region surrounding the display region on the substrate of the display substrate, wherein the projection of the cathode overlapping region on the substrate covers the projection of the first barrier region on the substrate; The method further includes: Forming an interception region surrounding the first barrier region, wherein the interception region is arranged between the anode metal layer and the cathode metal layer, and the projection of the cathode overlapping region on the substrate covers the projection of the interception region on the substrate; Or The method further includes forming the encapsulation layer, and the encapsulation layer includes: a covering encapsulation region covering the display region, covering the cathode overlapping region, and covering the interception region, and a barrier encapsulation region with a toothed structure surrounding the interception region.

14. A display device, characterized in that, Including the display substrate according to any one of claims 1 to 13.

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