High Flow Multi-Port Piston / Valve for Deposition Systems

Abstract

A valve assembly for use with a process chamber for depositing a film on a wafer. The valve body surrounds a bore and includes an inlet, a first outlet, and a second outlet, at least one of the outlets leading into the process chamber. The piston includes a first section having a first flow path and a second section having a second flow path. A linear motion actuator is adapted to couple with the piston and control linear motion of the piston through the bore between a first position and a second position. In the first position, the first section of the piston is aligned with the inlet so that fluid flows to the first outlet via the first flow path. In the second position, the second section of the piston is aligned with the inlet so that fluid flows to the second outlet via the second flow path.

Description

[0001] This application is a divisional application of application number 201980042137.4, application date May 16, 2019, and invention name “High flow multi-way piston valve for deposition system”. Background Art

[0002] In semiconductor processing systems including those performing deposition, fluid transport is performed via conduits having valve systems to control fluid flow paths. These valve systems meet certain high purity chemical ratings suitable for fluid transport. However, valve systems meeting the above characteristics typically have very large bodies relative to the inner diameter of the conduit, which precludes the use of these typical valve systems in processing systems with narrow space constraints. In addition, some typical valve systems using diaphragm valves are limited by the poor flow coefficient of the valve, so these valve systems are not suitable for systems that require high flow rates (in a very small space) (for example, for performing deposition). That is, when the space is smaller than the space typically encountered, the performance of traditional high flow diaphragm valves is impaired.

[0003] The background description provided here is for the purpose of generally presenting the context of the present disclosure. Work by the presently designated inventors to the extent described in this background section and in the specification that could not be determined as prior art at the time the application was filed is neither explicitly nor implicitly admitted to be prior art against the present disclosure.

[0004] It is against this background that embodiments of the present disclosure are presented. Summary of the invention

[0005] Embodiments of the present application are directed to solving one or more problems found in the relevant art, and in particular to performing semiconductor processes including switching fluid flow from an inlet to one or more outlet paths with low pressure drop within a constrained form factor. Several inventive embodiments of the present disclosure are described below.

[0006] Embodiments of the present disclosure include a valve assembly suitable for use in a process chamber (e.g., an electroplating tank) for depositing a film on a wafer. The valve assembly includes a valve body configured to surround a bore aligned with a central axis, wherein the valve body includes an inlet, a first outlet, and a second outlet, wherein at least one of the first and second outlets leads to a process chamber or a chemical bath. The valve assembly includes a piston having a first section and a second section, wherein the first section is configured to have a first flow path, and wherein the second section is configured to have a second flow path. The valve assembly includes a linear motion actuator adapted to be coupled to the piston and configured to control the linear movement of the piston through the bore between a first position and a second position. Specifically, in the first position, the first section of the piston is aligned with the inlet so that the fluid flows from the inlet to the first outlet via the first flow path. Moreover, in the second position, the second section of the piston is aligned with the inlet so that the fluid flows from the inlet to the second outlet via the second flow path.

[0007] Other embodiments of the present disclosure include another valve assembly suitable for use with a processing chamber (e.g., an electroplating tank) for depositing a film on a wafer. The valve assembly includes a valve body, the valve body being configured to surround a bore aligned with a central axis, wherein the valve body includes an inlet, a plurality of outlets, wherein at least one outlet leads to the processing chamber. The valve assembly includes a piston having a plurality of flow paths. The valve assembly includes a linear motion actuator, which is suitable for coupling with the piston and is configured to control the linear movement of the piston through the bore between a plurality of positions. In particular, in a corresponding position, the piston is moved so that a fluid flows from an inlet to one or more outlets via one or more corresponding flow paths.

[0008] Another embodiment of the present disclosure includes a method for switching between flow paths suitable for use with a processing chamber (e.g., a plating tank) for depositing a film on a wafer. The method includes providing a valve body, the valve body being configured around a bore aligned with a central axis, wherein the valve body includes an inlet, a plurality of outlets, at least one of the outlets leading into the processing chamber. The method includes positioning a piston having a plurality of flow paths within the bore of the valve body. The method includes controlling the linear movement of the piston between a plurality of positions through the bore along the central axis. In particular, in corresponding positions of the piston within the valve body, a fluid flows from an inlet to one or more outlets via one or more corresponding flow paths.

[0009] Embodiments of the present disclosure include a valve assembly in a processing chamber (e.g., a plating tank) suitable for depositing a film on a wafer. The valve assembly includes a valve body, the valve body being configured to surround a bore aligned with a central axis, wherein the valve body includes an inlet and an outlet. The valve assembly includes a piston having a first section and a second section, wherein the first section is configured to have a first flow path with a high flow rate, and wherein the second section is configured to have a second flow path with a low flow rate. The valve assembly includes a linear motion actuator, which is suitable for coupling with the piston and configured to control the linear movement of the piston through the bore between a first position and a second position. In particular, in the first position, the first section of the piston is aligned with the inlet so that the fluid flows from the inlet to the outlet via the first flow path.

[0010] These and other advantages will be appreciated by those skilled in the art from a reading of the entire specification and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The embodiments are best understood by referring to the following description taken in conjunction with the accompanying drawings.

[0012] Figure 1A An example illustrating a dual chamber (split anode) electroplating cell configuration and components and exemplary flow patterns within the apparatus according to an embodiment of the present disclosure.

[0013] Figure 1B is a perspective view of a plating tank configuration according to one embodiment of the present disclosure.

[0014] Figure 2 is a perspective view of a piston assembly suitable for use in a processing chamber for depositing films on wafers according to an embodiment of the present disclosure.

[0015] Figure 3A is a cross-sectional view of a three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via a flow path at a 90 degree angle, wherein the angled flow path can be a high impedance virtual anode (HRVA) flow orientation.

[0016] Figure 3B is a cross-sectional view of a three-way piston assembly suitable for use in a processing chamber for depositing films on wafers according to an embodiment of the present disclosure, wherein the piston is configured for passing a fluid through the piston assembly from an inlet to an outlet via a cross-flow directional flow path.

[0017] Figure 4A-1 , 4A-2and 4B-1 to 4B-3 are schematic diagrams of a multi-way piston / valve assembly suitable for use in a processing chamber for depositing films on a wafer according to an embodiment of the present disclosure, wherein the piston / valve assembly is adapted to present different sets of flow paths depending on which piston (and corresponding internal flow path) is selected for use with the same valve body.

[0018] Figure 5 is a flow chart illustrating a method of switching between flow paths using a multi-way piston assembly suitable for use in a processing chamber for depositing films on wafers according to an embodiment of the present disclosure.

[0019] Fig. 6A According to one embodiment of the present disclosure Figure 3A-3B A perspective view of the interface between a piston adapter and a three-way or multi-way piston assembly suitable for use in a processing chamber for depositing films on a wafer, wherein the piston adapter is fixedly attached to a linear motion actuator.

[0020] Figure 6B is a perspective view of a diaphragm according to an embodiment of the present disclosure, the diaphragm being configured for use in Fig. 6A The connection between the piston adapter and the three-way or multi-way piston assembly.

[0021] Figure 7 is a cross-sectional view of a three-way piston assembly suitable for use in a processing chamber for depositing films on wafers according to one embodiment of the present disclosure and includes a spring return used with a single-acting linear motion actuator that pushes a piston in the piston assembly when the linear motion actuator is retracted.

[0022] Figures 8A-8B is a cross-sectional view of a two-way piston assembly suitable for use in a processing chamber for depositing films on wafers according to an embodiment of the present disclosure and configured to have low and high flow paths depending on the internal configuration of the piston assembly.

[0023] Fig.9A A three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure is described, wherein the piston assembly includes a positioning sensor and a corresponding magnet for determining a state of the piston assembly, the piston assembly state including a state showing the piston assembly being configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via a flow path at a 90 degree angle, wherein the angled flow path can be a HRVA flow orientation.

[0024] Fig. 9BA three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure is described, wherein the piston assembly includes a positioning sensor and a corresponding magnet for determining a piston assembly sensor state, the piston assembly sensor state including a state indicating a lateral flow directional flow path for causing a fluid to flow from an inlet to an outlet through the piston assembly.

[0025] Fig. 9C A multi-way piston assembly suitable for use in a processing chamber for depositing films on wafers according to an embodiment of the present disclosure is described, wherein the piston assembly includes a position sensor and a corresponding magnet for determining a state of a piston assembly sensor magnet and a corresponding magnetic sensor.

[0026] Fig. 10A A multi-way piston assembly suitable for use in a processing chamber for depositing films on a wafer according to one embodiment of the present disclosure is described, wherein the piston is configured to allow a fluid to flow from an inlet to one or more outlets through the piston assembly, wherein the piston assembly may be configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via a flow path at a 90 degree angle, wherein the angled flow path may be a HRVA flow orientation.

[0027] Fig. 10B A multi-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure is described, wherein the piston is configured to allow a fluid to flow from an inlet to one or more outlets through the piston assembly, wherein the piston may be configured to allow a fluid to flow from an inlet to multiple outlets through the piston assembly via an angled flow path, the angled flow path being divided into two flow paths of reduced diameter.

[0028] Fig. 10C A multi-way piston assembly suitable for use in a processing chamber for depositing films on a wafer according to one embodiment of the present disclosure is described, wherein the piston is configured to allow a fluid to flow from an inlet to one or more outlets through the piston assembly, wherein the piston may be configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via an angled flow path, wherein the angled flow path may be a HRVA flow orientation.

[0029] Fig.11A is a perspective, cut-away, cross-sectional view of a three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow through the piston assembly from an inlet to a selected outlet, wherein the piston assembly may be configured to allow a fluid to flow through the piston assembly from an inlet to an outlet via a flow path at a 90 degree angle, wherein the angled flow path may be a HRVA flow orientation, and wherein the piston assembly is mounted outside the processing chamber.

[0030] Fig. 11Bis a perspective, cut-away, cross-sectional view of a three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow from an inlet to a selected outlet through the piston assembly, wherein the piston is configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via a lateral flow directional flow path, wherein the piston assembly is mounted outside the processing chamber.

[0031] Fig. 11C is a perspective view of a three-way piston assembly suitable for use in a processing chamber for depositing a film on a wafer according to one embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow from an inlet to a selected outlet through the piston assembly, wherein the piston is configured to allow a fluid to flow from an inlet to an outlet through the piston assembly via a lateral flow directional flow path, wherein the piston assembly is mounted outside the processing chamber.

[0032] Fig.12 A control module for controlling the above system is shown. DETAILED DESCRIPTION

[0033] Although the following detailed description contains many specific details for illustrative purposes, it will be appreciated by those skilled in the art that many variations and modifications of the following details are within the scope of the present invention. Therefore, the aspects of the present invention described below are set forth without causing any loss of generality to the subsequent claims and without imposing limitations.

[0034] In general, many embodiments of the present disclosure describe systems and methods for providing novel methods for switching liquid chemical flows to multiple outlet paths using a piston assembly as a valve with a low pressure drop across the piston assembly, wherein the piston assembly is suitable for depositing a film (e.g., wet deposition) in a processing chamber (e.g., a plating tank) on a wafer. The piston assembly includes an internal piston with multiple holes, and the internal piston is actuated back and forth, depending on which hole is aligned with the flow path to change the flow path. The diameter and direction of the hole can be changed, and it is configured to switch the inlet flow between multiple outlet flows, or to limit the flow for a single inlet and outlet. The valve architecture in the piston assembly allows the internal piston to be easily replaced with many designs, so that the same valve body in the piston assembly and the control mechanism can be used in a variety of applications. For example, the same valve body can be used one at a time with multiple piston structures, so that the piston assembly (e.g., valve) can be converted from a three-way piston assembly to a four-way or five-way piston assembly, which has many possible outlets. In one embodiment, the linear motion actuator is a pneumatic cylinder. In other embodiments, a linear actuator or solenoid valve may replace the pneumatic cylinder, thereby enabling the valve to be electrically actuated.

[0035] Advantages of the piston assembly of an embodiment of the present disclosure include the use of a much smaller valve body in the piston assembly than existing solutions, thereby enabling tighter integration with a tank (e.g., a processing chamber). In one embodiment, the piston assembly is embedded in the processing chamber (e.g., together with the electroplating tank itself). Another advantage is that the piston assembly has flow characteristics similar to traditional valve systems, but in a smaller form factor. For example, the piston assembly of an embodiment of the present disclosure uniquely includes the advantages of a ball valve in a package that is much smaller than that currently available on the market. In particular, the embodiments of the disclosure describing the piston assembly as a valve have no obstruction in the normal flow path and only one bend in the turning path. The flow coefficient (e.g., C v ) values ​​can be similar to those of a ball valve, but without the very large actuator housing used for a ball valve. Other advantages include that the piston assembly as a valve can be used in most use cases: for example, switching between a high flow orifice and a low flow orifice, alternating flow paths for rapid duty cycles, or simply as a two-way valve. A linear actuator or solenoid valve can replace the pneumatic cylinder so that the valve can be electrically driven. In yet another embodiment, the piston assembly of the disclosed embodiments includes direct state detection of the piston itself, which is more reliable than using a remote lift valve used with a diaphragm valve, or an encoder, as with a ball valve actuator.

[0036] With the above general understanding of various embodiments, exemplary details of the embodiments will now be described with reference to various drawings. Elements and / or parts with similar numbers in one or more drawings are meant to generally have the same configuration and / or function. In addition, the drawings may not be drawn to scale, but are intended to illustrate and emphasize new concepts. Obviously, embodiments of the present invention can be implemented without some or all of these specific details. On the other hand, well-known processing operations are no longer described in detail herein to avoid unnecessarily making embodiments of the present invention difficult to understand.

[0037] Embodiments of the present disclosure relate to fluid flow within a plasma process module, such as those used in electroplating, electroetching, electropolishing, electrochemical mechanical polishing, deposition, wet deposition, atomic layer deposition (ALD), plasma enhanced chemical vapor deposition (PECVD), and through silicon via (TSV) processes. Embodiments of the present invention may be implemented in various process module configurations. In addition, embodiments of the present invention are not limited to the embodiments provided herein, and may be implemented in different plasma processing systems using different configurations, geometric configurations, and plasma generation technologies (such as inductively coupled systems, capacitively coupled systems, electron cyclotron resonance systems, microwave systems, etc.). Plasma processing systems and plasma processing modules are disclosed in co-owned U.S. Patent Nos. 8,862,855, 8,847,495, and 8,485,128 and U.S. Patent Application Serial No. 15 / 369,110.

[0038] For purposes of illustration only, embodiments of the present disclosure may be used in combination with an electroplating cell design containing: 1) an anolyte chamber (sometimes referred to herein as a "separate anode chamber") having at least one anode: and 2) a catholyte chamber in communication with the anolyte chamber, typically containing a high impedance virtual anode "HRVA" plate (or, a flow diffuser plate). The anolyte chamber and the catholyte chamber are connected to each other and in electrical (cationic) communication across the cathodic membrane. The cathodic chamber has a mechanism for mixing and directing the flow of the catholyte in the cathodic chamber, particularly around and on the surface of the cationic membrane, to improve general material transport to and away from the membrane surface.

[0039] Many "clamshell" electroplating equipment designs (e.g., the Sabre.TM. equipment available from Lam Research Corp. of San Jose Calif.) have two chambers, an anolyte chamber and a catholyte chamber. The anolyte and catholyte chambers are separated from each other by a cationic membrane. The anolyte chamber contains one or more counter electrodes and one or more powered electrodes having the same general polarity as the wafer, and the electrolyte is in direct contact with these electrodes. In some embodiments, these powered electrodes can be auxiliary secondary cathodes, such as described in U.S. Patent Application Serial No. 12 / 481,503, filed on July 9, 2009, and entitled "METHOD AND APPARATUS FOR ELECTROPLATING", the entire contents of which are incorporated herein by reference.

[0040] The cathode electrolyte chamber without a counter electrode typically has a uniquely different electrolyte composition, a separate mechanism for circulating the electrolyte (catholyte) inside, and an electrolyte supply separate from the anolyte chamber, wherein the electrolyte contained therein is capable of direct contact with the workpiece (e.g., wafer). Designs that substantially uniformly direct the flow and / or passing current to the workpiece can be used, such as through microporous diffusers (typically greater than about 20% porosity: see U.S. Pat. No. 6,964,792, issued Nov. 15, 2005, which is incorporated herein by reference) or HRVA plates (see U.S. Pat. No. 7,622,024, issued Nov. 24, 2009, which is incorporated herein by reference). HRVA plates are typically less porous than simpler flow diffusers (HRVA plate porosity is typically less than about 5%) and impart significantly greater resistance to the system (increased resistance improves uniformity / control), but, like diffusers, produce uniform flow of electrolyte at the wafer.

[0041] In certain described embodiments, the catholyte chamber contains peripheral walls, an HRVA plate (or diffuser) facing and in close proximity (typically less than about 5 mm) to the substrate (wafer) to be plated, and a mechanism to direct the electrolyte into the chamber. The main flow loop electrolyte enters the catholyte chamber, passes through the HRVA plate (or diffuser), upward through various holes or holes, and then impinges on the wafer surface. After being generally directed toward and passing near the wafer surface, the fluid flows out of the plating tank and ultimately returns to the main bath.

[0042] The anolyte chamber contains a peripheral wall and has a separate flow of a plating solution (i.e., electrolyte or anolyte) that is (typically) substantially free of organic additives, which circulates in a manner separate from a uniquely distinct "main plating solution flow loop" electrolyte (i.e., catholyte) that contacts the wafer surface.

[0043] Fig. 1 depicts an example of a typical flow pattern in a device containing some (but not all) elements and a dual chamber (separated anode) electroplating tank configuration according to various embodiments. Note that this figure and the following figure are examples for illustrative purposes and should not be construed as limiting the general applicability of the embodiment to any particular tank, for example, or with respect to any particular spatial orientation, required components, size, or design components. Electroplating tank 100A includes chamber 101, and chamber 101 includes cathode electrolyte chamber 102 and anolyte chamber 103. There is a membrane 104 (for example, a cationic membrane) at one end of the anolyte chamber, which completely encloses anode 105 to establish anolyte chamber 103. The membrane can be supported by a membrane frame (not shown). Anode can be an active (soluble) metal or metal alloy (for example, copper, copper / phosphorus, lead, silver / tin) or an inert (fixed size, for example lead-coated titanium) anode to be electroplated. Anode is connected to one pole of a power supply (not shown). The two separate chambers with two separate electrolyte flow circuits generally have electrolytes of different compositions having different electrolyte properties (eg, typically the electrolyte in the anolyte chamber is substantially free of electrochemical organic bath additives).

[0044] The flow of electrolyte enters the anolyte chamber at location 106 and then enters the manifold 107 where the electrolyte enters one or more flow distribution tubes (also known as perfusion "flow troughs" or nozzles) 108. Embodiments of the present disclosure may be used to control the flow of fluid to the anolyte chamber using the piston assembly described below. Note that in FIG. 1 , the anolyte chamber electrolyte flow loop is only shown on the right side of the drawing for clarity. The flow distribution tube "sprays" the electrolyte in the general direction of the anode 105 surface so as to impinge on the anode surface, thereby increasing the convection of dissolved ions from the anode surface or electrolyte reactants to the surface (if necessary). In an example of another embodiment not depicted, the anode is porous and is composed of an assembly or stack of relatively small individual active metal sheets (e.g., individual spheres). The porous metal stack allows for easy anode replenishment and the electrolyte fluid to pass directly through the "porous anode stack" upward or downward. This type of device generally consists of an inlet anolyte flow manifold located at the bottom of the anode chamber, which also contains a mechanism for directing flow upward through a porous anode electrical terminal plate (or anode buss plate), which is designed to allow for uniform flow of electrolyte and supply of current into and through the assembly of individual anode sheets. See U.S. Patents Nos. 6,527,920, 6,890,416, and 6,821,407, which are incorporated herein by reference for all purposes, as further examples of separate anode chamber designs. The flow exits the anode chamber of FIG. 1 at position 109. The anolyte chamber is defined by a peripheral insulating wall made of a non-conductive material (e.g., various plastics, such as polypropylene).

[0045] The electrolyte flow directed to the anode surface reduces concentration polarization (i.e., the voltage increase associated with the accumulation or depletion of dissolved active species, thereby constituting diffusion resistance and polarization) and mitigates any tendency of the anode surface to become passivated. Anode passivation is the phenomenon of the formation of metal salts, oxides, phosphate sulfides, or other forms of surface films, for example, due to exceeding the local solubility limit of the material.

[0046] As described above, the anolyte chamber and the catholyte chamber are separated by an ion-permeable membrane (usually a cationic membrane) that resists diffusion and flow of electrolyte and additives. Under the influence of the electric field, cations pass through the membrane from the anolyte chamber to the catholyte chamber on the way to the substrate (wafer) to be plated. The membrane substantially prevents diffusion or convection of other non-positively charged electrolyte components (e.g., anions and uncharged organic plating additives) out of or into the anolyte chamber. In some cases, the anolyte chamber and its recirculating flow loop (if any) are substantially free of plating additives, while the catholyte chamber may contain a desired target level of plating bath additives (e.g., promoters, inhibitors, homogenizers, etc.) to support the operation of the plating process on the substrate (e.g., low concentrations of chloride ions, such as thiourea, benzotriazole, mercaptopropanesulfonic acid (MPS), dimercaptopropanesulfonic acid (SPS), polyethylene oxide, polypropylene oxide and their many copolymers and the like plating bath organic compounds, etc.).

[0047] Microporous and resistant to direct fluid transport media can be used as membranes. The membrane can be a cation conducting membrane. In some cases, the membrane is supported by a mechanical support frame member (not shown) on its uppermost and / or lowermost surface, which helps to fix and define the membrane into a specific shape (e.g., conical) and maintain relative rigidity despite electrolyte flow or a small pressure difference between the two sides of the membrane and between the two chambers.

[0048] Although the membrane is a dielectric (i.e., an anti-electron conducting material) and there is no free flow of electronic charge transfer at the surface of the membrane or within the membrane, ionic charged species leave the membrane in a manner somewhat similar to an anode source, and the concentration profile near the interface is believed to be similar in nature. While not being bound by any particular theory, it is believed that the membrane functions in some respects similar to a conventional ion source (e.g., an active metal anode electrode interface undergoing an electrochemical oxidation process).

[0049] When charged species pass through any porous barrier under the impetus of the electric field, their maximum rate is roughly proportional to its concentration and ion mobility. Because there is no significant concentration driving force and because of the tortuous nature of the membrane barrier, diffusion is limited to a great extent (at least initially when activated). Smaller ions (e.g., protons) that tend to have high ion mobility tend to migrate faster. In an electrolyte containing two or more cations, ions with higher mobility will tend to be discharged smoothly from the anolyte chamber. Therefore, the concentration of ions (e.g., larger metal ions) with lower ion mobility will tend to accumulate in the anolyte chamber. The concentration of the lower mobility metal ions established at the anode (in the case of an active metal anode configuration) will eventually increase significantly, usually close to the solubility limit of the ion in the anode chamber. In any case, the concentration difference between ions with different mobilities between the two sides of the membrane will increase with charge and time. If held constant, the concentration difference between the two chambers may eventually become large enough that the electric field induced flux of each ionic species (given by the product of the ion concentration times its mobility) will closely balance the time-averaged diffusion of that species in the opposite direction.

[0050] For example, in the case where the chamber contains a copper anode and a mixed electrolyte (e.g., copper sulfate and sulfuric acid), the smaller hydronium ion protons will preferentially migrate out of the membrane and through the membrane, tending to increase the pH of the cathode electrolyte chamber. In contrast, the concentration of copper will increase in the anolyte chamber. In addition, cationic membranes allow very few anions (sulfate and bisulfate in this example) to pass. Within the cationic membrane, mobile charged cationic species are typically paired with anionic end groups tethered to the ends of the polymer backbone (e.g., polymer-bound anionic sulfate groups). Cations move from one fixed / tethered anionic environment to the next under the action of electric field forces (thereby maintaining charge neutrality within the membrane). This article discusses the electrochemistry and concentration distribution of various species in the electroplating tank in more detail.

[0051] Returning to FIG. 1 , similar to the pattern of electrolyte entering the anolyte chamber, the electrolyte enters the catholyte chamber at position 110 and enters a manifold 111 surrounding the catholyte chamber, from which it is directed into a central region of the catholyte chamber below the HRVA plate 113. Embodiments of the present disclosure may be used to control fluid flow to the catholyte chamber using a piston assembly described below. Note that in FIG. 1 , for clarity, the catholyte chamber electrolyte flow loop is shown only on the left side of the drawing. As shown in FIG. 1 , the flow entering from the periphery tends to cause the current to travel at a decreasing velocity at a more central location of the catholyte chamber, primarily because the sum of the cross-sectional areas of the flow passing through the HRVA out of the HRVA is greatest at the periphery of the HRVA, and the overall resistance to flow is minimized. The result is a uniform flow upward through the HRVA and into the wafer / HRVA gap region 114 below the wafer 115. After exiting through the HRVA, the fluid eventually passes over the plating cell weir wall 116 and into the collection chamber 117, from which the fluid is collected and returned to the catholyte circulating bath storage tank.The catholyte chamber also has a non-conductive peripheral wall.

[0052] As the need to establish more uniform flow and plating current to thinner seed wafers increases, a high impedance virtual anode "plate" (HRVA) can be used to beneficially introduce significant terminal effect compensation impedance into the system. An example of an apparatus containing an HRVA is described in U.S. patent application Ser. No. 12 / 291,356, filed Nov. 7, 2008, entitled "METHOD AND APPARATUS FOR ELECTROPLATING," the relevant portions of which are incorporated herein by reference. See also U.S. patent application Ser. No. 11 / 506,054, filed Aug. 16, 2006, entitled "METHOD AND APPARATUS FOR ELECTROPLATING INCLUDING A REMOTELY POSITIONED SECOND CATHODE," the relevant portions of which are incorporated herein by reference. During the electroplating operation, the wafer is brought into close proximity (e.g., 1-5 mm apart) to the surface of the HRVA plate. The HRVA plate introduces impedance to both conductivity and fluid flow, making both more evenly distributed across the plate and across the wafer near its surface.

[0053] However, to ensure uniform flow upward through the HRVA plate, the portion of the catholyte chamber below the HRVA plate (which serves as the fluid distribution manifold area) needs to have a considerable depth and cross-sectional flow area to enable impedance control through the HRVA holes or holes. In a sense, the HRVA plate is similar to a diffuser plate, but with a greater impedance to both fluid and current. Both the HRVA and the diffuser are typically relatively thin plates (about 0.125 to 1 inch thick). The HRVA plate typically has a very low, uniform, continuous porosity, and in some embodiments has a unidirectional porosity. For example, by creating a large number or small precision holes in a non-porous substrate, typically about 1-5% of the plate, to create a unidirectional porosity; see U.S. Patent Application Serial No. 11 / 506,054 (filed on August 16, 2006), U.S. Patent Application Serial No. 12 / 291,356 (filed on November 7, 2008), and U.S. Patent No. 7,622,024, each of which is incorporated herein by reference. HRVA holes are created by drilling, etching, creating a replica structure, or by other appropriate processing to create an insulating surface with a very large number of high precision parallel holes (typically 0.02 to 0.04 inch diameter) in the substrate / plate. The one-way holes / apertures generally prevent any fluid or current from passing in any direction not directly toward the workpiece (e.g., traveling / leaking from directly under the plate at a radial angle through the plate toward the periphery of the wafer). This promotes uniform flow distribution and potential distribution.

[0054] Note that in some cases, the components in the plating tank shown in Figure 1 may be represented by different names. Sometimes, chambers 102 and 103 are collectively referred to as anode chambers. Then, chamber 102 is the upper anode chamber and chamber 103 is the lower anode chamber. In this case, chamber 103 is called a separated anolyte chamber (SAC), wherein the SAC contains an anode and is separated from the upper anode chamber by membrane 104. The area between membrane 104 and the lower surface of HRVA plate 113 (i.e., area 112) and the fluid, plus the area within the HRVA plate itself, constitute the cathode electrolyte chamber. Moreover, the cathode electrolyte chamber is sometimes also referred to as a diffuser or HRVA chamber. HRVA plate 113 is mounted to the anode chamber (102 and 103), and an area 114 is established between the wafer and the top of the HRVA plate, which is called the wafer-HRVA gap area (or diffuser-wafer gap area) in this case.

[0055] Figure 1B An example of an electroplating cell 100B configuration and components is described, along with possible typical flow patterns within the apparatus. Figure 1B The plating tank 100B shown in FIG. 1 is similar to Figure 1A100A, but with several components added. Plating tank 100B includes a flow distributor 133 associated with cathode electrolyte manifold 111. In some embodiments, flow distributor 133 is made of non-conductive materials such as polymers or ceramics. In some embodiments, flow distributor is a hollow tube whose wall is made of small sintered particles. In other embodiments, flow distributor is a solid wall tube with a bore therein. Other designs that can implement good mixing in the cathode electrolyte chamber are also feasible. In a variety of configurations, the flow distributor can be oriented so that its opening (e.g., such as a hole) is configured to guide fluid flow at the membrane interface and / or oriented or configured to guide fluid flow to the cathode electrolyte chamber except the membrane interface. The position and size of flow distributor 133 should minimize the average electric field and current blocking characteristics of the tube so that the most uniform electroplating can be achieved.

[0056] In a further embodiment, the catholyte manifold 111 of the plating cell 300 includes a small port or hole 131 in the catholyte manifold (see Figure 1B ). Holes 131 are configured to deliver catholyte to the catholyte chamber. In some embodiments, the holes are configured to deliver a turbulent flow of catholyte to the catholyte chamber. The holes provide flow restrictions to the catholyte manifold, thereby enabling high-speed fluid to enter the catholyte chamber and mix the fluids therein.

[0057] Figure 2 is a perspective view of a piston / valve assembly 300 suitable for use in a process chamber (e.g., a plating tank) for depositing a film (e.g., wet deposition) on a wafer according to an embodiment of the present disclosure. The piston / valve assembly 300 is configured as a three-way valve and can be configured to switch a liquid chemical flow from an inlet to one or more outlets with a low pressure drop across the valve. In particular, the piston assembly 300 can be described as a trumpet-type three-way piston valve having a compact design or smaller form factor when compared to existing pneumatic and servo motor three-way valves.

[0058] As shown, the piston / valve assembly 300 includes a housing 210 containing a piston, as will be described below with reference to Figure 3A-4B-3 The linear motion actuator 310 is attached to the piston and selectively drives the piston back and forth along the linear axis. In one embodiment, the linear motion actuator 310 is a pneumatic cylinder, which can be manually controlled or machine controlled. In other embodiments, the linear motion actuator 310 can be servo-actuated (e.g., a servomotor), implemented using a solenoid valve or using any other type of actuator.

[0059] In one position, the piston, operating as a valve inside the housing 210, allows fluid to flow in a cross-flow manner from the inlet 371 to the outlet 372, which is the main flow path. Due to the wide open main flow path, the piston / valve assembly 300 has a very high C v . The primary flow path is dominant in the chemical process. In another position, the piston allows fluid to flow from the inlet 371 to the outlet 373 in an angled manner. For example, the flow path makes an angled turn (e.g., 90 degrees) within the piston. In one embodiment, the outlet 373 provides fluid flow to an area of ​​the catholyte chamber of the processing chamber, wherein the area is located below the HRVA plate. The fluid flow is sufficient to enable appropriate interaction with the HRVA (e.g., to allow bubbles to pass through the HRVA plate).

[0060] Figure 2 The piston / valve assembly 300 shown in FIG. 1 is configured as a three-way valve, but can be converted to other valve configurations, such as by converting the reference Figure 4A-1 , 4A-2 And 4B-1 to 4B-3 described. In short, the piston driven by the linear motion actuator in the valve body or bore can be exchanged without changing the valve body. In this way, depending on the piston used and where the piston is configured in the piston / valve assembly, the piston / valve assembly can be configured for different flow paths. In particular, the piston / valve assembly can be configured to have 2 or more internal flow paths, so that the piston / valve assembly 300 can be a two-way valve, a three-way valve, a four-way valve, a five-way valve, etc. For example, the piston / valve assembly can be used in most use cases, such as switching between a high flow orifice and a low flow orifice, alternating flow paths for a fast duty cycle, or simply as a two-way valve.

[0061] Figure 3A yes Figure 2 , a cross-sectional view of a three-way piston / valve assembly 300 suitable for use in a processing chamber for depositing a film (e.g., a wet deposition process) on a wafer according to an embodiment of the present disclosure as described in . Although the piston / valve assembly 300 is configured as a three-way valve in one embodiment, other embodiments are quite suitable for piston / valve assemblies as multi-way valves (e.g., two-way valves, or three-way valves, four-way valves, etc.). In particular, the piston / valve assembly 300 is configured to switch a liquid chemical flow from an inlet orifice (e.g., a port) to one or more outlet orifices (e.g., ports) based on the position of the piston within the piston valve assembly 300, and has a low pressure drop across the internal valve. For example, the pressure of the fluid entering the piston / valve assembly 300 through the inlet is higher than the pressure within the bore cavity to cause the fluid to flow from the inlet to one or more outlets.

[0062] In one embodiment, the piston / valve assembly 300 is designed to perform at a high duty cycle and operate up to hundreds of cycles per minute.

[0063] As shown, the piston / valve assembly 300 includes a linear motion actuator 310. In one embodiment, the linear motion actuator or linear drive is a pneumatic cylinder. As previously described, the piston / valve assembly 300 can be driven by any type of actuator, including mechanically driven actuators (e.g., servomotors, etc.), and electrically driven actuators (e.g., solenoid valves, etc.).

[0064] The linear motion actuator 310 includes a threaded shaft 325 that is driven in a linear manner (e.g., along the linear axis 305). The threaded shaft has threads at one end that are used to couple to a piston, as described below. In particular, the threaded shaft 325 is coupled to a piston adapter 320 (which passes through a threaded bore of the piston adapter). As such, the linear motion of the threaded shaft 325 is converted into the linear motion of the piston adapter 320. In one embodiment, the piston adapter is constructed of a polyethylene terephthalate (PET) material. As will be described below, Fig. 6A As further described in , the piston 350 is attached to the piston adapter 320 via the piston's base 354. In this way, the linear motion of the threaded shaft 325 is transferred to the piston adapter 320 and then to the piston 350.

[0065] The piston / valve assembly 300 includes a valve body 340 configured to surround a bore 345 aligned with the linear axis 305. The valve body 340 includes an inlet orifice 371, a first outlet orifice 372, and a second outlet orifice 373. For example, the outlet orifice 372 provides a flow path for lateral flow ( Figure 3A In addition, outlet orifice 373 provides for an angled flow path (in Figure 3A ), such as a flow path 380 including a 90 degree turn within the piston 350.

[0066] In addition, the piston / valve assembly 300 includes an internal piston 350 positioned within a bore 345 of the valve body 340. The piston 350 includes a plurality of bores that provide an internal flow path through the piston. In particular, in one embodiment, the piston 350 is fixedly attached to the piston adapter 320 to allow movement back and forth as the linear motion actuator 310 moves linearly between one or more states so that the bore or flow path in the piston is aligned with the inlet orifice 371 and one or more outlet orifices 371 and 372. In this manner, the piston 350 can be controllably moved through the bore 345 of the valve body 340 so that a flow path through the piston 350 and the piston valve assembly 300 can be selected. For example, the linear motion actuator 310 is adapted to be coupled to the piston 350 and is further configured to control the linear movement of the piston through the bore 345 between a first position and a second position. Referring below to Figure 6A-6BThe coupling between the piston 350 and the piston adapter 320 is further described. In another embodiment, the piston 350 is not attached to the piston adapter 320, as will be described with reference to FIG. Figure 7 As further described, in one embodiment, piston 350 is constructed from polytetrafluoroethylene (PTFE).

[0067] The piston 350 includes a base 354, a first section 351 adjacent to the base 354, and a second section 352, wherein the first section is configured to have a first internal flow path, and the second section is configured to have a second internal flow path. Figure 3A As shown, when the piston 350 is properly positioned, and more particularly when the piston 350 is in the second position, the second section 352 is configured for an angled flow path orientation, and the second section 352 of the piston 350 is aligned with the inlet orifice 371 so that fluid flows from the inlet orifice to the second outlet (e.g., outlet orifice 373) via the second internal flow path. More specifically, the linear motion actuator 310 is in a retracted state, such as a fully retracted state. In this way, the piston 350 is pulled back within the bore 345 (e.g., translated by the piston adapter 320) to expose an open chamber area 360 of the bore 345 formed with the piston 350. On the other hand, when the piston 350 is in the fully extended state, the chamber area 360 can be closed, such as Figure 3B As shown. The piston 350 is internally configured for angled fluid flow, such as through an elbow in the second section 352. As a result, fluid flowing from the inlet orifice 371 by the interface 390 (e.g., a coupler) follows a 90-degree angled flow path within the piston 350 (e.g., through an elbow), enters the open chamber 360, and exits the piston / valve assembly 300 at the outlet orifice 373 and through the interface 390. The angled directional flow path 380 through the piston / valve assembly 300 is shown as entering at the inlet orifice 371 and exiting at the outlet orifice 373. That is, as shown, the piston / valve assembly 300 is configured for fluid to flow from the inlet orifice 371 through the piston 350 to the outlet orifice 373 via the 90-degree angled flow path 380. For example, the flow path 380 can be a HRVA flow orientation such that the fluid is delivered to a process chamber (e.g., a catholyte chamber including the area below the HRVA plate). Embodiments of the disclosure support any angle for the flow path, and in any direction through the body of the piston 350. In one embodiment, at least one of the first outlet orifice 372 and the second outlet orifice 373 is configured to lead into the process chamber. In one embodiment, the valve body 340 is constructed of polypropylene or natural polypropylene.

[0068] like Figure 3B As shown, when the piston 350 is properly positioned, the first section 351 is configured for lateral flow orientation. Figure 3B 345 , the piston is pushed (e.g., translated by the piston adapter 320) in the bore 345 so that the open chamber region 360 is more or less closed. For example, the piston 350 may rest on the lip 365 of the bore 345, thereby closing the chamber region 360. The piston 350 is internally configured for lateral fluid flow (crossing from one side to the other without significant turns), such as through the first section 351. As a result, fluid flowing from the inlet orifice 371 by the interface 390 follows a cross-flow flow path within the piston 350 and exits the piston / valve assembly 300 at the outlet orifice 372 and through another interface 390. The cross-flow directional flow path 385 through the piston / valve assembly 300 is shown entering at the inlet orifice 371 and exiting at the outlet orifice 372.

[0069] Further showing that Figure 3A-3B 371 is a diaphragm clamp 315 that is fixedly attached to the valve body 340. The diaphragm clamp 315 is configured to secure the diaphragm 330 to the valve body 340 to prevent fluid flowing within the piston 350 from passing through the bore 345 and out to the outside of the piston valve assembly (e.g., toward the linear motion actuator 310). The diaphragm 330 is a seal located between the piston and the surface of the bore, wherein the seal is configured to prevent fluid from passing from the bore through a first end of the bore in the valve body 340, wherein the linear motion actuator 310 is coupled to the piston 350 through the first end of the bore. That is, the flow of fluid is restricted to entering the inlet orifice 371 and exiting only through one of the outlet orifices 372 or 373, as shown in FIG. Figure 3A-3B In one embodiment, the diaphragm clip 315 is made of PET. In one embodiment, the diaphragm 330 is a rolling diaphragm and can be made of synthetic rubber and fluoropolymer elastomer (e.g., In another embodiment, the sealing member is an O-ring, so that the diaphragm is replaced by the O-ring.

[0070] In one embodiment, the piston / valve assembly can be converted to other valve configurations. In particular, by exchanging or switching pistons (e.g., each piston having a different internal bore defining a flow path) and an appropriate valve body, different sets of flow paths through the piston body and through the piston / valve assembly 300 can be achieved, depending on the piston installed in the piston / valve assembly. In particular, Figure 4A-1 , 4A-2 And 4B-1 to 4B-3 include schematic diagrams of a multi-way piston / valve assembly according to an embodiment of the present disclosure, which can be converted to provide different sets of flow paths through the piston / valve assembly depending on which piston (and corresponding internal flow path) is selected for use in the same valve body.

[0071] In particular, Figure 4A-1 and 4A-2 is a cross-sectional view of a three-way piston valve assembly 400A according to an embodiment of the present disclosure, which is suitable for use in a processing chamber (e.g., an electroplating chamber) for depositing a film (e.g., via a wet deposition process) on a wafer and is convertible into a three-way piston valve assembly 400A by switching pistons within the assembly but retaining the same valve body and other components. Figures 4B-1 to 4B-3 In particular, the piston / valve assembly 400A is configured to switch a liquid chemical flow from an inlet orifice (e.g., port) to one or more outlet orifices (e.g., ports) with a low pressure drop across the internal valve depending on the position of the piston within the piston / valve assembly 400A.

[0072] Because of the selected piston 450-1, the piston / valve assembly 400A functions similarly to Figure 3A-3B In particular, the piston / valve assembly 400A includes a linear motion actuator 310, which also includes a threaded shaft 325 that is driven in a linear manner, such as along a linear axis 405. Again, the threaded shaft 325 is coupled to the piston adapter 320 as previously described, such that the linear motion of the threaded shaft 325 is converted into the linear motion of the piston adapter 320.

[0073] In one embodiment, the piston 450-1 is attached to the piston adapter 320 via the base of the piston. In another embodiment, the piston 450-1 engages with the piston adapter for linear movement in one direction and movement in the opposite direction using another force (e.g., provided by a spring), as will be described below with reference to Figure 7 In both cases, the linear motion of the threaded shaft 325 is transferred to the piston adapter 320 and then to the piston 450 - 1 , which moves through the bore 445 of the valve body 440 .

[0074] More specifically, valve body 440 is configured to surround bore 445 aligned with linear axis 405. Valve body 440 includes inlet orifice 371' and multiple outlet orifices. For example, the outlets may include outlet orifice 372', orifice 373', and orifice 470. The selection of outlet orifices for the flow path depends on which piston is engaged with valve body 440. For example, piston 450-1 of piston / valve assembly 400A provides access to a set of outlets including outlet orifices 372' and 373', while Figures 4B-1 to 4B-3 The piston 450 - 2 of the piston / valve assembly 400B provides access to a different set of outlet ports including outlet orifices 372 ′, 373 ′, and 470 .

[0075] like Figure 4A-1 and 4A-2 As shown in the piston / valve assembly 400A of FIG. 4 , the outlet port 470 cannot pass through the bore of the piston 450-1, and in fact, the function of the piston / valve assembly 400A is similar to Figure 3A-3B 4. The piston / valve assembly 300 of FIG. 4 is a piston 450 that is positioned within the bore 445 of the valve body 440 and includes a plurality of bores 351' and 352' that provide an internal flow path through the piston 450-1. The piston 450-1 is controllably movable through the bore 445 of the valve body 440 so that the bore or flow path in the piston 450-1 is aligned with the inlet orifice 371' and one or more outlet orifices 372' and 373'. Note that the piston 450-1 is not aligned with the outlet orifice 470. For example, when the piston 450-1 is in the first position (e.g., Figure 4A-1 ), bore 351' is aligned with inlet orifice 371' and outlet orifice 373' to provide an angled flow path through piston / valve assembly 400A (e.g., through a 90 degree turn at an elbow to provide HRVA flow orientation), similar to Figure 3A The piston / valve assembly 300 is aligned. Moreover, when the piston 450-1 is in the second position (such as Figure 4A-2 ), the bore 352' is aligned with the inlet orifice 371' and the outlet orifice 372' to provide a cross-flow flow path through the piston / valve assembly 400A (e.g., without any substantial angular adjustment in the path through the piston / valve assembly), similar to Figure 3B Alignment of the piston / valve assembly 300.

[0076] The piston / valve assembly 400A can be converted to a multi-way piston / valve assembly 400B by switching to the piston 450-2 for use within the same valve body 440 and other components (e.g., linear motion actuator 310, piston adapter 320, etc.). In particular, the piston / valve assembly 400B includes the same valve body 440, which is configured to surround a bore 445 aligned with the linear axis 405, wherein the valve body 440 includes an inlet orifice 371' and a plurality of outlet orifices (e.g., 372', 373', and 470). In addition, the piston 450-2 can be controllably positioned within the valve body 440 so that the bore or flow path in the piston 450-2 is aligned with the inlet orifice 371' and one or more outlet orifices (full set) 372', 373', and 470, as will be described in detail below. Figures 4B-1 to 4B-3 of each shown.

[0077] In particular, Figure 4B-1 is a cross-sectional view of a multi-way (e.g., four-way) piston / valve assembly 400B suitable for use in a process chamber for depositing films on a wafer, wherein piston 450-2 is positioned to provide an angled flow path, such as in a HRVA flow orientation, according to an embodiment of the present disclosure. Specifically, when piston 450-2 is in a first position, bore 351" is aligned with inlet orifice 371' and outlet orifice 373' to provide an angled flow path through piston / valve assembly 400B (e.g., through a 90 degree turn in an elbow to provide for HRVA flow orientation), similar to Figure 3A Alignment of the piston / valve assembly 300.

[0078] Figure 4B-2 is a cross-sectional view of a multi-way (e.g., four-way) piston / valve assembly 400B suitable for use in a process chamber for depositing films on wafers according to an embodiment of the present disclosure, wherein piston 450-2 is configured to allow fluid to flow from an inlet to an outlet via a transverse flow directional flow path through the piston assembly. Specifically, when piston 450-2 is in the second position, cavity 352" is aligned with inlet orifice 371' and outlet orifice 372' to provide a transverse flow flow path for passing through piston / valve assembly 400B, similar to Figure 3B Alignment of the piston / valve assembly 300.

[0079] Figure 4B-3400B is a cross-sectional view of a multi-way (e.g., four-way) piston assembly suitable for use in a process chamber for depositing films on a wafer according to an embodiment of the present disclosure, wherein piston 450-2 is configured to allow fluid to flow from an inlet to an outlet via an angled flow path through the piston assembly, wherein the angled flow path may be a HRVA flow orientation. Specifically, when piston 450-2 is controllably moved to a third position by movement of a linear motion actuator, bore 453 is aligned with inlet orifice 371' and outlet orifice 470 to provide an angled flow path for passing through piston valve assembly 400B.

[0080] Figures 4B-1 to 4B-3 An example of multiple flow paths is illustrated, where for illustration purposes, the flow paths are shown in the same plane. Of course, in other embodiments, the flow paths may include entering and leaving Figures 4B-1 to 4B-3 That is, the flow paths need not be parallel to the same plane.

[0081] By describing in detail the various modules of the processing system 100A and the piston / valve assemblies 300, 400A and 400B, Figure 5 Flowchart 500 of the present disclosure illustrates a method for switching between flow paths according to an embodiment of the present disclosure, and using a multi-way piston assembly suitable for use with a process chamber (e.g., a plating cell) for depositing a film (e.g., wet deposition) on a wafer. In particular, flow paths are selectable depending on which piston is used, wherein each piston has a corresponding set of internal flow paths that provide access to a corresponding set of outlet orifices. For example, flowchart 500 may be used Figure 4A-1 , 4A-2 and 4B-1 to 4B-3 are implemented by the pivot valve assemblies 400A-400B.

[0082] At 510, the method includes providing a valve body in a piston / valve assembly, wherein the valve body is configured to surround a bore aligned with a central axis, wherein the valve body includes an inlet, a plurality of outlets, at least one of the outlets opening into a process chamber.

[0083] Depending on which piston body is used, different groups of outlets may be used, as described below. For example, a first piston includes a first plurality of internal flow paths that provide access to one or more of the first group of outlets. Additionally, a second piston includes a second plurality of internal flow paths that provide access to one or more of the second group of outlets.

[0084] At 520, a method includes positioning a first piston in a bore of a valve body, wherein the first piston reaches one or more of a first set of outlets. At 530, the method includes controlling the linear motion of the first piston between a first plurality of positions along a central axis to provide a first flow path between an inlet and one or more of the first set of outlets. The linear motion is provided by a linear motion actuator adapted to be coupled to the first piston. For example, in a first position, the first piston is aligned with the inlet so that the fluid flows from the inlet to the first outlet via a first flow path, and in a second position, the first piston is aligned with the inlet so that the fluid flows from the inlet to the second outlet via a second flow path. In addition, in another embodiment, in a third position, the first piston is aligned with the inlet so that the fluid flows from the inlet to the third outlet via a third flow path. In addition, in yet another embodiment, in a fourth position, the piston is aligned with the inlet so that the fluid flows from the inlet to two or more outlets via two or more corresponding outlet paths.

[0085] At 540, the method includes replacing the first piston with a second piston and positioning the second piston within a bore of the valve body, wherein the second piston reaches one or more of the second set of outlets. At 550, the method includes controlling linear motion of the second piston between a second plurality of positions along the central axis to provide a second flow path between the inlet and one or more of the second set of outlets. The linear motion is provided by a linear motion actuator adapted to be coupled to the second piston.

[0086] Fig. 6A yes Figure 3A-3B A perspective view of the interface between a piston adapter and a three-way piston / valve assembly 300 according to an embodiment of the present disclosure, and suitable for use in a process chamber for depositing a film on a wafer. Of course, in other embodiments, Fig. 6A The docking described in FIG. 4 is applicable to the piston / valve assemblies 400A and 400B of FIGS. 4A-1, 4A-2, and 4B-1 to 4B-3.

[0087] In particular, the piston adapter 320 is fixedly attached to the linear motion actuator 310 by any suitable attachment mechanism, such as by a threaded shaft 325. In addition, the piston adapter 320 is fixedly attached to the piston 350 by any suitable attachment mechanism. For example, a screw 610 may be used to fixedly attach the piston adapter to the piston 350. For illustration, the size of the screw 610 may be 10-24×1 / 2" (inch). In this manner, because of the fixed attachment between the piston adapter 320 and the piston 350, when the piston adapter 320 moves, the piston 350 also moves. As shown, the piston 350 is positioned within the bore 345 of the valve body 340. In this way, the linear motion of the linear motion actuator via the threaded shaft 325 is converted into linear motion of the piston adapter 320, and further converted into linear motion of the piston 350.

[0088] in addition, Fig. 6A A close-up view of the diaphragm 330 is provided, which is configured to prevent fluid from flowing to the exterior of the piston / valve assembly 300 (e.g., out of the bore 345 and the internal bore or flow path of the piston 350 toward the linear motion actuator 310). In particular, the outer edge 635 of the diaphragm 330 is positioned between the top surface 341 of the valve body 340 and the diaphragm clamp 315. In addition, to lock the diaphragm in place, the diaphragm clamp 315 is fixedly attached to the valve body 340 by any suitable attachment mechanism (e.g., screws 620) and compresses the outer edge 635 of the diaphragm 330 therebetween. For illustration, the screws 620 may be sized 10-24×1 / 2" (inches).

[0089] Diaphragm 330 is a rolling diaphragm, but other types of diaphragms may be used in other embodiments. In particular, Figure 6B is a perspective view of a rolling diaphragm 330 according to an embodiment of the present disclosure configured for interface between a piston adapter 330, a piston 350, a valve body 340, and a diaphragm clamp 315. Holes 630 allow screws 620 to pass through to reach the piston 350, but are designed so that once the piston adapter 320 is fixedly attached to the piston 350, no leakage will occur through the diaphragm via the holes 630. In one embodiment, the rolling diaphragm is provided with In another embodiment, the diaphragm 330 includes a clocking feature 636 that can be used to ensure that the piston 350 is properly installed. In yet another embodiment, an O-ring can be used to achieve the sealing function achieved by the diaphragm. In one embodiment, the diaphragm 330 is rated for at least thirty thousand cycles of continuous use in a chemical process. For example, a cycle may include fully extending (unrolling) the diaphragm (e.g., to approximately reach a stroke range of 1.125" corresponding to the linear movement of the piston 350) (see Figure 3B ), and then allows the diaphragm to retract (roll up) to its default state (see Figure 3A ).

[0090] Figure 7 is a cross-sectional view of a three-way piston / valve assembly 700 suitable for use in a processing chamber for depositing films on wafers and including a spring return for use with a single-acting linear motion actuator that pushes a piston in the piston assembly when the linear motion actuator is retracted, in accordance with an embodiment of the present disclosure.

[0091] The piston / valve assembly 700 is similar to Figure 3A-3B 6A ). In contrast, the piston adapter 320 of the piston / valve assembly 300 actively engages with the piston 350 to provide linear motion in two directions. That is, when the linear motion actuator 310 is extended, the piston adapter 320 pushes the piston 350 through the bore 345 of the valve body 340 (see FIG. 3A ). Additionally, when the linear motion actuator 310 is retracted, the piston adapter 320 actively pulls the piston 350 back through the bore 345 (see FIG. 3A ). Figure 3B ).

[0092] On the other hand, in Figure 7 In the piston / valve assembly 700 of the embodiment of the present invention, because the piston adapter 320 is not fixedly attached to the piston 350, the piston adapter 320 passively engages with the piston 350 in only one direction. For example, when the linear motion actuator 310 is extended, the piston adapter 320 contacts the piston 350 and pushes the piston through the bore 345 of the valve body 340 (see Figure 3A). However, when the linear motion actuator 310 is retracted, because the piston adapter 320 is not fixedly attached to the piston 350, the piston 350 is not actively pulled back through the bore. That is, the linear motion actuator 310 provides a single-acting actuation. In this case, the spring 710 returns the piston 350 to a default state (e.g., the top surface 359 of the piston 350 contacts the piston adapter 320 via the diaphragm 330). As shown, the spring 710 is located in the recess 360 of the bore 345 and rests on the lip 361.

[0093] Figures 8A-8B 8 is a cross-sectional view of a two-way piston / valve assembly 800 suitable for use in a process chamber (e.g., a plating tank) for depositing films (e.g., wet deposition) on wafers and configured with low and high flow paths according to the internal configuration of the piston / valve assembly, according to one embodiment of the present disclosure. In particular, the piston / valve assembly 800 is shown as a two-way configuration in which the piston 850 switches position between two orifice flow paths, each flow path being lateral flow oriented through the piston 850. In particular, the piston / valve assembly 800 is configured for switching liquid chemical flow from an inlet orifice 871 to a single outlet orifice 872 with a low pressure drop across the internal valve, depending on the position of the piston 850 within the piston / valve assembly 800.

[0094] The piston / valve assembly 800 includes a linear motion actuator 310, as previously described. The linear motion actuator 310 provides motion along a linear axis 805. The linear motion of the actuator 310 (e.g., via a threaded shaft and piston adapter 320) is transferred to the piston 850, as previously described with respect to the piston valve assemblies 300 and 400A-400B.

[0095] The piston / valve assembly 800 includes a valve body 840 configured to surround a bore 845 aligned with the linear shaft 805. The valve body 840 includes an inlet orifice 871 and an outlet orifice 872. The outlet orifice 872 provides a cross-flow flow path through the piston 840 and through the piston / valve assembly 800.

[0096] In addition, the piston / valve assembly 800 includes a piston 850, which is positioned within the bore 845 of the valve body 840 and includes a plurality of bores that provide an internal flow path through the piston 850. In particular, the piston 850 includes a first section 851 and a second section 852. The first section 851 is configured to have a first flow path with a high flow rate, and the second section 852 is configured to have a second flow path with a low flow rate. As previously described, the piston 850 is adaptively coupled to (e.g., fixedly or by contact) a linear motion actuator 310 that is configured to control the linear movement of the piston 850 through the bore 845 between a first position and a second position. In this manner, the piston 850 can be controllably moved through the bore 845 of the valve body 940 to select between two flow paths. For example, when the piston 840 is in the first position, the first section 851 aligns the inlet orifice 871 and the outlet orifice 872 so that the fluid flows through the high flow path (e.g., the main process flow path), such as Fig. 8A As shown. In addition, when the piston 840 is in the second position, the second section 852 aligns the inlet orifice 871 and the outlet orifice 872 so that the fluid flows through a low flow path (e.g., a second process flow path in an HRVA flow orientation). For example, the second section 852 may include a reducer to limit the fluid flow between the inlet orifice 871 and the outlet orifice 872. In one embodiment, various other pistons (e.g., in addition to the piston 850) may be used to provide different reduction pistons for adjusting the flow rate through the piston / valve assembly 800 without having to replace the valve body 840 or install different restrictor hardware. For example, a plurality of pistons may be installed in the valve body 840, each piston having a different size of reduction piston, and the different sizes have different flow rates. In this way, the piston / valve assembly 800 is not limited to Figures 8A-8B Rather than showing two flow rates (eg, full speed and reduced speed) in the flow diagram, the valve body 840 may be configured with one or more selectable flow rates, depending on which piston is installed within the valve body 840.

[0097] Figures 9A-9B A three-way piston assembly 300A according to one embodiment of the present disclosure is described, which is suitable for use in a process chamber (e.g., a plating tank) for depositing a film on a wafer (e.g., wet deposition), wherein various internal states of the assembly 300A can be determined via positioning sensors and corresponding magnets. The piston / valve assembly 300A is similar to Figure 3A-3BThe piston / valve assembly 300A is similar to the piston / valve assembly 300A, but with the addition of a position sensor and corresponding magnet for determining the state. For example, the piston / valve assembly 300A is configured to switch the flow of liquid chemicals from an inlet orifice (e.g., port) to one or more outlet orifices (e.g., ports) with a low pressure drop across the internal valve depending on the position of the piston within the piston valve assembly 300A and the piston used within the piston / valve assembly.

[0098] In particular, the piston / valve assembly 300A includes a multi-factor sensor system that includes a positioning sensor and a corresponding magnet for detecting the state of the piston. In one embodiment, the multi-factor sensor system includes a plurality of magnets 910 at multiple locations in the piston 350. Purely for illustration, the magnet 910 can be a neodymium magnet embedded in the piston 350 (e.g., potted with a plug and epoxy resin). In addition, the multi-factor sensor system includes a plurality of magnetic sensors 920 at multiple locations in the valve body 340, which are configured to pick up or detect corresponding magnets (when properly positioned relative to each other). In one embodiment, the magnet can be a short-range Hall effect sensor that is used to detect the corresponding magnet in multiple states of the piston / valve assembly 300A. For example, the sensor can have multiple characteristics, including a 24V DC, 0.8A stainless steel sensor with a 0.2" detection range. In one embodiment, each sensor is configured to align with the corresponding magnet to determine the state, so that when aligned, the corresponding magnet and sensor pair indicates that the piston is moved to the corresponding position so that the fluid flows from the inlet to the one or more outlets via one or more corresponding outlet paths.

[0099] In a two-factor sensor system, the combination of information from the two sensors will indicate the status of the piston / valve assembly 300A and the corresponding flow path. In particular, Fig.9A As shown, the piston / valve assembly 300A is configured to allow fluid to flow through the second section 352 (including the elbow) through a 90-degree flow path 380 (see also Figure 3A ) flows from an inlet (not shown) to an outlet (not shown). For example, flow path 380 can implement HRVA flow orientation. The sensor can indicate that the fluid is flowing through the angled flow path 380. In particular, as in Fig.9A , in the HRVA flow orientation, the top sensor 920A is not aligned with the corresponding top magnet 910A, and thus does not sense or detect the corresponding top magnet 910A. As such, the top sensor 920A may be in the OFF position. On the other hand, the bottom sensor 920B is aligned with the corresponding bottom magnet 910B, and thus detects the corresponding bottom magnet 910B. As such, the bottom sensor may be in the ON position.

[0100] like Fig. 9BAs shown, the piston / valve assembly 300A is configured to allow fluid to flow from an inlet (not shown) to an outlet (not shown) in a cross-flow flow path 385 (see also Figure 3B ). For example, according to one embodiment of the present disclosure, the cross-flow orientation can be the primary flow path through the piston / valve assembly 300 for causing the fluid flow to flow from the inlet to the outlet. In the cross-flow orientation, the top sensor 920A is aligned with the corresponding top magnet 910A and thus detects the corresponding top magnet 910A. Thus, the top sensor can be in the ON position. On the other hand, the bottom sensor 920B is not aligned with the corresponding bottom magnet 910B and thus does not sense or detect the corresponding bottom magnet 910B. Thus, the bottom sensor can be in the OFF position.

[0101] The two-factor sensor system builds in redundancy for state detection and is therefore more accurate (e.g., fewer erroneous readings). That is, both sensors need to be in a specific position (e.g., state or reading) in order to determine the state of the piston / valve assembly 300A. If not in the sensor's recognized position (e.g., state or reading), an erroneous state of the piston / valve assembly 300A is indicated (e.g., the piston 350 is not properly aligned within the bore). In addition, Figures 9A-9B The configuration of sensors and corresponding magnets shown in is purely for illustration, and the location and number of magnets (paired or unpaired) may be modified so that different configurations of multi-factor sensor systems are possible.

[0102] The following logic table provides status detection for the piston / valve assembly 300A.

[0103]

[0104] Fig. 9C A multi-way piston assembly 400B' suitable for use in a process chamber (e.g., a plating tank) for depositing a film (e.g., wet deposition) on a wafer according to an embodiment of the present disclosure is illustrated, wherein the piston assembly includes a position sensor and a corresponding magnet for determining the state of a piston assembly sensor magnet and a corresponding magnetic sensor. The piston / valve assembly 400B' is similar to Figures 4B-1 to 4B-3 The piston / valve assembly 400B is similar to the piston / valve assembly 400B, but with the addition of a position sensor and corresponding magnet for determining the state. For example, the piston / valve assembly 400B' is configured to switch the flow of liquid chemicals from an inlet orifice (e.g., port) to one or more outlet orifices (e.g., ports) with a low pressure drop across the internal valve depending on the position of the piston within the piston valve assembly 400B' and the piston used within the piston / valve assembly.

[0105] The piston / valve assembly 400B' includes a multi-factor sensor system that includes a positioning sensor and a corresponding magnet for detecting the state of the piston. In one embodiment, the multi-factor sensor system includes a plurality of magnets 910 (e.g., 910C, 910D, and 910E) at multiple locations in the piston 450. In addition, a plurality of magnetic sensors 920 (e.g., 920C, 920D, and 920E) at multiple locations in the valve body 440 are configured to (when properly positioned relative to each other) pick up or detect corresponding magnets. Fig. 9C As shown, three sensor-magnet pairs determine the state of piston / valve assembly 400B', including sensor 920C / magnet 910C, sensor 920D / magnet 910D, and sensor 920E / magnet 910E.

[0106] The sensor system can be configured as a single factor or a multi-factor system. In a multi-factor embodiment, when one sensor / magnet pair is aligned (e.g., the sensor is ON), the remaining sensor / magnet pairs are not aligned, and therefore these sensors can be OFF. For example, Fig. 9C As shown in FIG. 1 , the sensor 920D / magnet 910D pair is aligned, while the sensor 920C / magnet 910C and the sensor 920E / magnet 910E are not aligned. Thus, depending on the multi-factor sensor state, the piston / valve assembly 400B' is in an angled orientation (e.g., a 90 degree flow path), such as a HRVA orientation. In a single factor embodiment, the sensor / magnet pair is aligned to determine the state of the piston / valve assembly 400B' (e.g., for a corresponding flow path).

[0107] Figures 10A-10C A multi-way piston / valve assembly 1000 suitable for use in a process chamber (electroplating tank) for depositing films on wafers (e.g., wet deposition) according to an embodiment of the present disclosure is described, wherein a piston 1050 is configured to flow a fluid from an inlet to one or more outlets through the piston / valve assembly 1000. In particular, the piston / valve assembly 1000 is configured to switch a liquid chemical flow from an inlet orifice 371" (e.g., port) to one or more outlet orifices 372", 373" and 470' (e.g., ports) based on the position of the piston 1050 within the piston / valve assembly 1000, and has a low pressure drop across the internal valve. More particularly, fluid can be caused to flow to multiple outlet orifices, as will be described below.

[0108] The piston / valve assembly 1000 includes a linear motion actuator 310, which also includes a threaded shaft 325 that is driven in a linear manner, such as along a linear axis 1005. In addition, the threaded shaft 325 is coupled to the piston adapter 320, as previously described, so that the linear movement of the threaded shaft 325 is converted into linear movement of the piston adapter 320 and ultimately transferred to the piston 1050.

[0109] More particularly, the valve body 440' of the piston / valve assembly 1000 is identical to the valve bodies of the piston / valve assemblies 400A and 400B. In particular, the valve body 440' is configured to surround a bore 1045 that is aligned with the linear axis 1005. The valve body 440 includes an inlet orifice 371" and a plurality of outlet orifices. For example, the outlet may include an outlet orifice 372", an orifice 373", and an orifice 470'. The piston 1050 is controllably movable through the bore 1045 of the valve body 440' to align the bore or flow path in the piston 1050 with one or more of the outlet orifices 372", 373", and 470' and the inlet orifice 371".

[0110] Fig. 10A is a cross-sectional view of a multi-way piston / valve assembly 1000 in which piston 1050 is positioned to provide an angled flow path, such as in a HRVA flow orientation. Specifically, when piston 1050 is in a first position, bore 1051 is aligned with inlet orifice 371″ and outlet orifice 373″ to provide an angled flow path through piston / valve assembly 1000 (e.g., through a 90 degree turn in an elbow to provide for HRVA flow orientation).

[0111] Fig. 10B is a cross-sectional view of a multi-way piston / valve assembly 1000, wherein a piston 1050 is positioned to access multiple internal flow paths. In particular, the piston 1050 is configured to allow a fluid to flow from an inlet to one or more outlets through the piston assembly, and wherein the piston may be configured to allow a fluid to flow from an inlet to multiple outlets through the piston assembly via an angled flow path that is divided into two flow paths of reduced diameter. Specifically, when the piston is controllably moved to the second position by movement of the linear motion actuator 310, the fluid flows from the inlet orifice 371" to a portion of the outlet orifice 372" and a portion of the outlet orifice 470'. That is, in the second position of the piston 1050, the fluid flows from the inlet 371" through the flow path 1052, and flows out of the outlet orifice 372" through the flow path 1052A, and flows out of the outlet orifice 470' through the flow path 1052B. The flow rate of each outlet orifice may be reduced equally or unequally.

[0112] Fig. 10CA cross-sectional view of a multi-way piston assembly 1000 according to an embodiment of the present disclosure is illustrated, wherein the piston is configured to allow fluid to flow from an inlet to an outlet through the piston / valve assembly 1000 via an angled flow path, wherein the angled flow path can be HRVA flow oriented. Specifically, when the piston 1050 is controllably moved to a third position by movement of a linear motion actuator, the cavity 453 is aligned with the inlet orifice 371″ and the outlet orifice 470′ to provide an angled flow path for passing through the piston valve assembly 1000.

[0113] Fig.11A 1 is a perspective, cut-away, cross-sectional view of a three-way piston assembly suitable for use in a process chamber (e.g., a plating tank) 1150 for depositing a film (e.g., wet deposition) on a wafer, according to an embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow from an inlet to a selected outlet through the piston assembly. As shown, the piston / valve assembly 300 can be configured to allow a fluid to flow from an inlet 371 to an outlet 373A through the piston / valve assembly 300 (e.g., through the second section 352 of the piston 350) via a flow path at a 90 degree angle. For example, the angled flow path can be HRVA flow oriented such that the fluid flowing out of the outlet 373A enters the channel 1110, which is directed to the area of ​​the cathode electrolyte chamber below the HRVA plate. In one embodiment, the piston / valve assembly 300 is mounted on the exterior of the process chamber 1150. In another embodiment, the piston / valve assembly 300 is integrated into the wall of the process chamber 1150.

[0114] Figures 11B-11C 1 is a perspective view and a cut-away cross-sectional view of a three-way piston / valve assembly 300 suitable for use in a process chamber for depositing a film on a wafer (e.g., wet deposition) according to an embodiment of the present disclosure, wherein the piston is configured to allow a fluid to flow from an inlet to a selected outlet through the piston assembly. In the piston / valve assembly 300, the piston may be configured to allow a fluid to flow from an inlet to an outlet through the piston assembly (e.g., through the first section 351 of the piston 350) via a transverse flow directional flow path. As shown, the piston / valve assembly 300 is mounted to the exterior of the process chamber 1150. For example, the fluid flowing in the transverse flow orientation may be the primary process flow (e.g., the inlet and outlet channels 1106 for the purpose of delivering the fluid to the anolyte chamber through the inlet port).

[0115] Fig.12A control module 1200 for controlling the above-mentioned system is shown. For example, the control module 1200 may include a processor, a memory, and one or more interfaces. The control module 1200 may be used to control the equipment in the system based in part on the sensed value. For example only, the control module 1200 may control one or more of the valve 1202, the filter heater 1204, the pump 1206, and other devices 1208 based on the sensed value and other control parameters. For example only, the control module 1200 receives the sensed value from a pressure gauge 1210, a flow meter 1212, a temperature sensor 1214, and / or other sensors 1216. The control module 1200 may also be used to control process conditions during the precursor delivery and deposition of the film. The control module 1200 will typically include one or more memory devices and one or more processors.

[0116] The control module 1200 can control the activities of the precursor delivery system and the deposition device. The control module 1200 executes a computer program, which includes grouped instructions for controlling process timing, delivery system temperature, and pressure differential across filters, valve positions, mixing of gases, chamber pressure, chamber temperature, substrate temperature, RF power level, substrate chuck or pedestal position, and other parameters of a particular process. The control module 1200 can also monitor the pressure differential and automatically switch the gas phase precursor delivery from one or more paths to one or more other paths. In some embodiments, other computer programs stored on a memory device associated with the control module 1200 can be used.

[0117] Typically, there will be a user interface associated with the control module 1200. The user interface may include a display 1218 (e.g., a display screen and / or graphical software display of apparatus and / or process conditions), and a user input device 1220, such as a pointing device, keyboard, touch screen, microphone, etc.

[0118] Computer programs for controlling the delivery of precursors, deposition and other processing in a process sequence may be written in, for example, any of the following conventional computer-readable programming languages: assembly language, C, C++, Pascal, Fortran or others. Compiled object code or scripts are executed by a processor to perform the tasks identified in the program.

[0119] Control module parameters relate to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions (eg, RF power level and low frequency RF frequency), cooling gas pressure, and chamber wall temperature.

[0120] The system software can be designed or configured in many different ways. For example, various chamber component subroutines or control objects can be written to control the operation of the chamber components necessary to perform the deposition process of the present invention. Examples of programs or program segments for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, and plasma control code.

[0121] The substrate positioning program may include program code for controlling chamber components that are used to load the substrate onto a pedestal or chuck and control the spacing between the substrate and other components of the chamber (e.g., a gas inlet and / or a target). The process gas control program may include code for controlling gas composition and flow rate and, optionally, for flowing gas into the chamber to stabilize the pressure in the chamber prior to deposition. The filter monitoring program includes code for comparing one or more measured differences with one or more predetermined values ​​and / or code for switching paths. The pressure control program may include code for controlling the pressure in the chamber by adjusting, for example, a throttle valve in the exhaust system of the chamber. The heater control program may include code for controlling the current to a heating unit that is used to heat components within a precursor delivery system, a substrate, and / or other parts of the system. Alternatively, the heater control program may control the delivery of a heat transfer gas (e.g., helium) to a substrate chuck.

[0122] Examples of sensors that may be monitored during deposition include, but are not limited to, a mass flow control module, a pressure sensor such as a pressure gauge 1210, a Figures 9A-9C Thermocouples in the transport system, pedestal or chuck and status sensor 920 in the embodiment. Appropriately programmed feedback and control algorithms can be used with data from these sensors to maintain desired process conditions. The foregoing describes implementation of embodiments of the present invention in a single chamber or multi-chamber semiconductor processing tool.

[0123] In some implementations, the controller is part of a system, which can be part of the above examples. Such a system can include a semiconductor processing device, which includes one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (substrate pedestals, gas flow systems, etc.). These systems can be integrated with electronic devices for controlling their operation before, during, and after the processing of semiconductor wafers or substrates. The electronic device can be referred to as a "controller", which can control various components or subcomponents of one or more systems. Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including the delivery of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, substrate transfer in and out tools and other transfer tools and / or load locks connected to or connected to a specific system through an interface.

[0124] In general, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), a chip defined as an application specific integrated circuit (ASIC), and / or one or more microprocessors, or a microcontroller that executes program instructions (e.g., software). The program instructions may be instructions sent to the controller in the form of various individual settings (or program files) that define operating parameters for performing a particular process on or for a semiconductor wafer or system. In some embodiments, the operating parameters may be part of a recipe defined by a process engineer that is designed to complete one or more process steps during the manufacture of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0125] In some implementations, the controller can be part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller can be in the "cloud" or all or part of a wafer factory (fab) host system, which can allow remote access to substrate processing. The computer can enable remote access to the system to monitor the current progress of manufacturing operations, check the history of past manufacturing operations, check the trends or performance standards of multiple manufacturing operations, change the parameters of the current processing, set the processing steps to follow the current processing, or start a new processing. In some examples, a remote computer (e.g., a server) can provide a processing recipe to the system through a network (which can include a local network or the Internet). The remote computer can include a user interface that enables input or programming of parameters and / or settings, and then sends the parameters and / or settings from the remote computer to the system.

[0126] In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters can be specific to the type of processing to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller can be distributed, for example, by including one or more discrete controllers that are networked together and work toward a common purpose (e.g., the processing and control described herein). An example of a distributed controller for such a purpose is one or more integrated circuits on a chamber that communicate with one or more integrated circuits remotely (e.g., at a platform level or as part of a remote computer), which combine to control processing on the chamber.

[0127] Example systems may include, but are not limited to, plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, chamfer edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and any other semiconductor processing system that may be associated with or used in the manufacture and / or preparation of semiconductor wafers.

[0128] As described above, depending on one or more processing steps to be performed by the tool, the controller can communicate with one or more other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the factory, a host computer, another controller, or tools used in material transport to transport wafer containers to and from tool locations and / or load ports in a semiconductor manufacturing facility.

[0129] The preceding description of the embodiment is provided for illustration and description purposes. It is not intended to fully describe or limit the present invention. The individual elements or features of a particular embodiment are generally not limited to the particular embodiment, but even if not specifically shown or described, they are interchangeable and can be used in selected embodiments where applicable. This can also be changed in various ways. Such changes are not considered to depart from the present invention, and all such modifications are also included in the scope of the present invention.

[0130] Although the foregoing embodiments have been described in some detail for the purpose of clarity of understanding, it should be understood that certain changes and modifications may be implemented within the scope of the appended claims. Therefore, the present embodiments should be considered illustrative rather than restrictive, and these embodiments should not be limited to the details provided herein, but may be modified within the scope and equivalents of the claims.

Claims

1. A valve assembly suitable for use with a process chamber for depositing a film on a wafer, comprising: a valve body configured to surround a bore coaxial with a central axis of the valve assembly, wherein the valve body includes an inlet, a plurality of outlets, at least one of the plurality of outlets opening into the process chamber; a piston positioned within the bore of the valve body and having a plurality of flow paths; a piston adapter configured to attach to a base of the piston, a linear motion actuator adapted to be coupled to the piston and configured to control linear movement of the piston through the bore between a plurality of positions, wherein the piston adapter is configured to be attached to the linear motion actuator, and linear movement of the linear motion actuator is transferred to the piston via the piston adapter, Wherein, when the piston is moved to a corresponding position, the fluid flows from the inlet to the one or more outlets through one or more corresponding flow paths.

2. The valve assembly according to claim 1, wherein in a first position, the piston is aligned with the inlet such that fluid flows from the inlet to a first outlet via a first flow path, In the second position, the piston is aligned with the inlet such that fluid flows from the inlet to a second outlet via a second flow path. 3 . The valve assembly of claim 2 , wherein in a third position, the piston is aligned with the inlet such that fluid flows from the inlet to a third outlet via a third flow path.

4. The valve assembly of claim 1, wherein in a first position, the piston is aligned with the inlet such that fluid flows from the inlet to two or more outlets via two or more corresponding outlet paths.

5. The valve assembly according to claim 1, further comprising: A seal is located between the piston and a surface of the bore, wherein the seal is configured to prevent fluid from passing through a first end of the bore in the valve body, the linear motion actuator being coupled to the piston via the first end of the bore.

6. The valve assembly of claim 5, wherein the seal comprises a rolling diaphragm.

7. The valve assembly according to claim 1, further comprising: wherein the linear motion actuator comprises a pneumatic cylinder; a piston adapter configured to attach to a base of the piston, The piston adapter is configured to be attached to a shaft of the pneumatic cylinder, and linear movement of the shaft is transferred to the piston through the piston adapter.

8. The valve assembly according to claim 1, further comprising: A spring is mounted within the second end of the bore in the valve body, the spring being adapted to urge the piston toward the first end of the bore when the linear motion actuator is retracted.

9. The valve assembly of claim 2, wherein a fluid entering the valve assembly through the inlet has a pressure higher than a pressure within the bore to cause fluid to flow from the inlet to one of the first outlet and the second outlet.

10. The valve assembly of claim 1, further comprising: A multi-factor sensor system for detecting a piston state, the multi-factor sensor system comprising: a plurality of magnets at a plurality of locations in the piston; and a plurality of magnetic sensors at a plurality of locations in the valve body, each of the plurality of magnetic sensors being alignable with a corresponding magnet, When the corresponding magnet and sensor pairs are aligned, it indicates that the piston is moved to the corresponding position, so that the fluid flows from the inlet to the one or more outlets via one or more corresponding outlet paths.

11. The valve assembly of claim 10, wherein when the first magnet and sensor pair are aligned, indicating that the piston is moved to the first position, fluid flows from the inlet to the first outlet via the first outlet path, When the second magnet and the sensor pair are aligned, it indicates that the piston is moved to the second position, so that the fluid flows from the inlet to the second outlet via the second outlet path.

12. The valve assembly according to claim 10, further comprising: When the first magnet and the sensor pair are aligned, it indicates that the piston is moved to a corresponding position, so that the fluid flows from the inlet to a portion of the first outlet via the first flow path and flows to a portion of the second outlet via the second flow path.

13. The valve assembly of claim 1, further comprising: a second piston having a second plurality of flow paths different from the plurality of flow paths in the piston, wherein the second piston replaces the first piston in the valve assembly, wherein the linear motion actuator is adapted to be coupled to the second piston and is configured to control linear movement of the second piston through the bore between a second plurality of positions, Wherein at a corresponding position to which the second piston is moved, the fluid flows from the inlet to one or more outlets via one or more corresponding outlet paths.

14. A method for switching between flow paths suitable for use with a process chamber for depositing a film on a wafer, the method comprising: providing a valve body configured to surround a bore coaxial with a central axis of the valve assembly, wherein the valve body includes an inlet, a plurality of outlets, at least one of the plurality of outlets opening into the process chamber; positioning a piston within the bore of the valve body, the piston having a plurality of flow paths; providing a piston adapter configured to be attached to a base of the piston, providing a linear motion actuator adapted to couple with the piston, and controlling linear movement of the piston along the central axis through the bore between a plurality of positions by the linear motion actuator, wherein the piston adapter is configured to be attached to the linear motion actuator and the linear movement of the linear motion actuator is transferred to the piston via the piston adapter, Wherein at a corresponding position of the piston within the valve body, fluid flows from the inlet to one or more outlets via one or more corresponding flow paths.

15. The method according to claim 14, wherein in a first position, the piston is aligned with the inlet such that fluid flows from the inlet to a first outlet via a first flow path, In the second position, the piston is aligned with the inlet such that fluid flows from the inlet to a second outlet via a second flow path.

16. The method of claim 15, wherein in a third position, the piston is aligned with the inlet such that fluid flows from the inlet to a third outlet via a third flow path.

17. The method of claim 14, wherein in a first position, the piston is aligned with the inlet such that fluid flows from the inlet to two or more outlets via two or more corresponding outlet paths.

18. The method according to claim 14, further comprising: positioning a plurality of magnets at a plurality of locations in the piston; positioning a plurality of magnetic sensors at a plurality of locations in the valve body, each of the plurality of magnetic sensors being alignable with a corresponding magnet, When the corresponding magnet is aligned with the sensor pair, it indicates that the piston is moved to the corresponding position, so that the fluid flows from the inlet to the one or more outlets via one or more corresponding outlet paths.

19. The method of claim 14, further comprising: exchanging the piston with a second piston having a second plurality of flow paths different from the plurality of flow paths in the piston, wherein the linear motion actuator is adapted to be coupled to the second piston and is configured to control linear movement of the second piston through the bore between a second plurality of positions, Wherein at a corresponding position to which the second piston is moved, the fluid flows from the inlet to one or more outlets via one or more corresponding outlet paths.

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