A light source assembly and a detection device having the light source assembly.

Abstract

This invention discloses a light source assembly and a detection device incorporating the light source assembly. The light source assembly includes a light-emitting element, a light-transmitting window, and a semi-reflective lens. The light-transmitting window has a first light-emitting port and a second light-emitting port on the same axis. The semi-reflective lens is positioned at a 45-degree angle to the axes of the first and second light-emitting ports. The main illumination ray formed by the light-emitting element is perpendicular to the axes of the first and second light-emitting ports and forms a 45-degree angle with the semi-reflective lens. The light source assembly also includes a light-absorbing element and an adjusting element. The semi-reflective lens is located between the light-emitting element and the light-absorbing element. The adjusting element is used to adjust the distance between the light-absorbing element and the semi-reflective lens. This structure of the light source assembly, when applied to the detection device, can improve the contrast of the image and increase the detection accuracy.

Description

Technical Field

[0001] This invention relates to the field of detection technology, and in particular to a light source assembly and a detection device having the light source assembly. Background Technology

[0002] To improve inspection accuracy, existing wafer inspection equipment generally features both bright-field and dark-field light sources, and can also meet the inspection needs of different types of wafer defects. However, due to the influence of stray light and other ineffective light sources, existing wafer inspection equipment suffers from low image contrast, which affects inspection accuracy. Summary of the Invention

[0003] The purpose of this invention is to provide a light source assembly and a detection device having the light source assembly. The structure of the light source assembly, when applied to the detection device, can reduce the influence of stray light and other invalid light, improve image contrast, and thus improve detection accuracy.

[0004] To address the aforementioned technical problems, the present invention provides a light source assembly, comprising a light-emitting element, a light-transmitting window, and a semi-reflective lens. The light-transmitting window has a first light-emitting port and a second light-emitting port on the same axis. The semi-reflective lens is positioned at a 45-degree angle to the axes of the first and second light-emitting ports. The main illumination ray formed by the light-emitting element is perpendicular to the axes of the first and second light-emitting ports and forms a 45-degree angle with the semi-reflective lens. The light source assembly further comprises a light-absorbing element and an adjusting element. The semi-reflective lens is located between the light-emitting element and the light-absorbing element, and the adjusting element is used to adjust the distance between the light-absorbing element and the semi-reflective lens.

[0005] The light source assembly described above further includes a condenser cylindrical lens disposed between the light-emitting element and the semi-reflective lens.

[0006] This invention provides a detection device, which includes an illumination component and an information acquisition component. The illumination component includes the aforementioned light source component and light source assembly, and is used to illuminate the object under test. The information acquisition component is used to collect and process the reflected light from the object under test. The information acquisition component is located on the same straight line as the first light outlet and the second light outlet, with the second light outlet being closer to the information acquisition component than the first light outlet. The light emitted by the illumination component is reflected by the object under test and then passes through the first light outlet and the second light outlet sequentially to reach the information acquisition component.

[0007] The detection device described above further includes a driving component for driving the object under test to rotate around its center; the information acquisition component has at least one imaging optical path, each imaging optical path corresponding to a field of view; the information acquisition component scans the object under test during its rotation; the object under test rotates at most once; and the detection device completes the scanning and detection of the entire object under test.

[0008] As described above, the test object is a wafer. The detection device further includes a suction cup for adsorbing the wafer. The suction cup has at least two adsorption portions, and each adsorption portion adsorbs a wafer of a different size. There is a set distance between two adjacent adsorption portions. The adsorption portion for adsorbing the smaller wafer is relatively far away from the information acquisition component, and the adsorption portion for adsorbing the larger wafer is relatively close to the information acquisition component.

[0009] In the detection device described above, the imaging optical path is perpendicular to the wafer.

[0010] In the detection device described above, the light source component is a bright field light source, the light source component is located between the wafer and the information acquisition component, and the position of the light transmission window corresponds to the position of the imaging optical path.

[0011] In the detection device described above, the light source component is a dark field light source, and the light source assembly can switch between a first position and a second position;

[0012] Illumination is provided by the light source assembly, which is in a first position, and the imaging main ray formed by reflection from the wafer passes through the semi-reflective lens.

[0013] When illumination is provided by the light source component, the light source assembly is in the second position. The imaging main ray formed by the reflection of the wafer does not pass through the semi-reflective lens, but only through the dark field portion formed between the semi-reflective lens and the light-absorbing component.

[0014] In the detection device described above, at least one light source component is provided, and the light source component is rotatable to adjust the angle of the dark field illumination light relative to the wafer.

[0015] In the detection device described above, at least two light source components are provided, and the distance between each light source component and the wafer is different.

[0016] As described above, in the detection device, the information acquisition component has at least two imaging optical paths, and the field of view corresponding to the imaging optical path is a line field of view, which extends radially along the object under test.

[0017] As described above, in the detection device, the information acquisition component has two imaging optical paths, and the two line fields of view corresponding to the two imaging optical paths at least cover the radius of the wafer.

[0018] When the light source assembly provided by this invention is applied to a detection device, the main illumination light emitted by the light-emitting element is partially reflected and partially transmitted by the semi-reflective lens. The reflected light can illuminate the object under test through one of the light outlets of the light transmission window (e.g., the first light outlet). The light reflected by the object under test can then pass through the first and second light outlets of the light transmission window in sequence before being collected and processed by the information acquisition assembly. Since the light source assembly has a light-absorbing element on the side of the semi-reflective lens away from the light-emitting element, and the distance between the light-absorbing element and the semi-reflective lens is adjustable, this is equivalent to adding a dark layer between the semi-reflective lens and the light-absorbing element. In the field section, during the detection process, some of the light transmitted through the semi-reflective lens is invalid light. Most of this invalid light is absorbed by the light-absorbing element, and the remaining light is reflected back to the semi-reflective lens in a scattered state. The large-angle light in the scattered light can be emitted from the dark field section. This part of the light will not enter the imaging optical path. By adjusting the distance between the light-absorbing element and the semi-reflective lens, the distance between the scattering surface and the semi-reflective lens can be lengthened, and the intensity of the small-angle light in the scattered light will be significantly reduced. In this way, using this light source component for detection can reduce the influence of stray light and other invalid light, obtain a detection image with higher contrast, and improve detection accuracy. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a specific embodiment of the detection device provided by the present invention;

[0020] Figure 2 for Figure 1 The front view of the detection device shown;

[0021] Figure 3 for Figure 2 A perspective view of the detection device shown from a top viewpoint;

[0022] Figure 4 for Figure 1 A schematic diagram of the light source assembly of the detection device;

[0023] Figure 5 This is a schematic diagram showing the relative positional relationship between the light source component and the imaging main ray when the detection device is illuminated by the light source component in a specific embodiment;

[0024] Figure 6 This is a schematic diagram showing the relative positional relationship between the light source component and the imaging main ray when the detection device uses a light source component for illumination in a specific embodiment.

[0025] Explanation of reference numerals in the attached figures:

[0026] Wafer 1, first wafer 1a, second wafer 1b;

[0027] Information acquisition component 10, first imaging device 10A, first lens 11A, first camera 12A, first field of view 13A, second imaging device 10B, second lens 11B, second camera 12B, second field of view 13B;

[0028] Light source assembly 20, light-emitting component 21, condenser cylindrical lens 22, beam splitter prism 23, semi-reflective semi-transparent lens 231, bright field portion 232, dark field portion 233, light-absorbing component 2331, light transmission window 24;

[0029] Light source component 30;

[0030] The imaging principal ray is S1, the illumination principal ray is Z1, and the dark field illumination ray is Z2. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] For ease of understanding and concise description, the following description will be combined with the light source component and the detection device with the light source component. At the same time, without loss of generality, the description will be based on a wafer as the object under test. It can be understood that when the object under test is other components, the detection principle and process are similar and will not be repeated.

[0033] Please refer to Figures 1 to 3 , Figure 1 This is a schematic diagram of a specific embodiment of the detection device provided by the present invention; Figure 2 for Figure 1 The front view of the detection device shown; Figure 3 for Figure 2 A perspective view of the detection device shown from a top angle.

[0034] In this embodiment, the detection device includes an information acquisition component 10 and a driving component (not shown in the figure). The driving component drives the wafer 1 to rotate around its center. The information acquisition component has at least one imaging optical path, and each imaging optical path corresponds to a field of view. The information acquisition component 10 scans the wafer 1 during its rotation and is configured such that the detection device completes the scanning and detection of the entire wafer 1 after the wafer 1 rotates at most one revolution. That is, the driving component drives the wafer 1 to rotate at most one revolution, and all positions of the wafer 1 are scanned by all fields of view.

[0035] As shown above, when inspecting wafer 1, the wafer inspection device uses a method of driving wafer 1 to rotate. During the scanning process, wafer 1 only needs to rotate around its center, without having to move its position within a large range. Compared with the existing translational scanning, this can significantly reduce the volume occupied by the inspection device during scanning, effectively saving space.

[0036] Typically, wafer 1 is positioned by a chuck (not shown in the figure). Therefore, in actual operation, the driving component drives the chuck to rotate around the center of wafer 1, thereby causing wafer 1 to rotate as well. In specific settings, the driving component can be any component capable of rotation, such as a drive motor.

[0037] Figures 1 to 3 In the scheme shown, the information acquisition component 10 of the wafer inspection device has two imaging optical paths. Specifically, the information acquisition component 10 includes a first imaging device 10A and a second imaging device 10B. The first imaging device 10A includes a first lens 11A and a first camera 12A, corresponding to the first imaging optical path. The second imaging device 10B includes a second lens 11B and a second camera 12B, corresponding to the second imaging optical path.

[0038] To improve the inspection effect on wafer 1, in actual setup, the field of view corresponding to each imaging optical path is specifically a linear field of view, extending radially along wafer 1. Of course, it is understandable that, depending on the actual application requirements, the field of view corresponding to the imaging optical path can also be other forms, not limited to a linear field of view, as long as the inspection requirements can be met.

[0039] In the illustrated scheme, the first imaging optical path corresponds to the first field of view 13A, and the second imaging optical path corresponds to the second field of view 13B. Specifically, the first field of view 13A corresponds to the inner circle of wafer 1, and the second field of view 13B corresponds to the outer circle of wafer 1. Both of them at least cover the radius of wafer 1. In this way, when wafer 1 rotates one revolution, the scanning area of ​​the first field of view 13A and the second field of view 13B at least covers wafer 1, that is, it is possible to scan and detect all parts of wafer 1.

[0040] It should be noted that the figure only illustrates, exemplarily, the information acquisition component 10 having two imaging optical paths and the corresponding line fields of view covering the radius of wafer 1. It can be understood that in actual settings, the information acquisition component 10 may also have only one imaging optical path, the corresponding line field of view of which at least covers the radius of wafer 1. Alternatively, the information acquisition component 10 may have three or more imaging optical paths, each corresponding to a line field of view, which can at least cover the diameter or radius of wafer 1, or other conditions, as long as scanning and detection of wafer 1 can be achieved based on wafer 1 rotating at most one revolution.

[0041] In this embodiment, to improve detection efficiency, the chuck used to adsorb wafer 1 has at least two adsorption sections, each adsorbing wafer 1 of a different size, and there is a set distance between adjacent adsorption sections. With this configuration, to achieve separate detection of different wafers 1, the imaging optical path of the information acquisition component 10 is set perpendicular to the wafer 1, such as... Figure 2 As shown, the information acquisition component 10 is located on the back side of the wafer 1, and images are taken of the back side of the wafer 1 during imaging.

[0042] Figures 1 to 3 The diagram exemplifies a scenario where the suction cup can hold two wafers 1. It should be noted that the diagram only illustrates the positions of the two wafers 1; in actual testing, the suction cup holds only one wafer 1 at a time, and only one wafer 1 is tested. This suction cup configuration allows for the testing of at least two different sizes of wafers 1 without changing the suction cup, improving compatibility and testing efficiency.

[0043] In the specific design, the smaller first wafer 1a is located above the larger second wafer 1b. That is, the suction part of the chuck used to adsorb the smaller first wafer 1a is relatively far away from the information acquisition component 10, while the suction part used to adsorb the larger second wafer 1b is relatively close to the information acquisition component 10.

[0044] In this way, when inspecting the larger second wafer 1b, its position is relatively low, and the imaging optical path is shifted downwards, enabling clear imaging of its back side. When inspecting the smaller first wafer 1a, its position is relatively high, and the imaging optical path is shifted upwards, enabling clear imaging of its back side. By setting these parameters, adjustments to the information acquisition component 10 can be reduced or avoided. By adjusting the detection position of wafers of different sizes, the imaging effect can be adjusted.

[0045] Of course, in actual setups, the information acquisition component 10 itself can achieve focusing through autofocus or by using a lifting platform that works in conjunction with the information acquisition component 10, thereby ensuring imaging quality. It is understood that the above methods do not interfere with each other and can be combined to broaden the application range and improve the detection effect of the detection device.

[0046] Obviously, the testing device should be designed to meet the testing requirements for any size wafer 1 while being compatible with wafers 1 of different sizes.

[0047] Please refer to this as well. Figure 4 , Figure 4 for Figure 1 A schematic diagram of the light source assembly of the detection device.

[0048] In this embodiment, the detection device further includes an illumination component, specifically a light source assembly 20, which serves as a bright-field light source. The light source assembly 20 is located between the wafer 1 and the information acquisition assembly 10. The light source assembly 20 has a light-transmitting window 24 corresponding to the imaging optical path, and the light-transmitting window 24 has a first light-exit port and a second light-exit port on the same axis. In the illustrated scheme, the light source assembly 20 specifically has two light-transmitting windows 24, corresponding to two imaging optical paths respectively.

[0049] It should be noted that the number of light-transmitting windows 24 does not necessarily have to match the imaging optical path, as long as the imaging light can pass through the light-transmitting windows 24 and enter the corresponding imaging device. In other words, depending on the needs, the number of light-transmitting windows 24 can be the same as the imaging optical path, with a one-to-one match, or they can be different. For example, the number of light-transmitting windows 24 can be... Figure 4 The two light-transmitting windows 24 shown are connected to form a longer light-transmitting window 24.

[0050] In this embodiment, the light source assembly 20 also includes a light-emitting element 21 and a beam splitter 23. Based on the two imaging optical paths shown in the figure, the light source assembly 20 is specifically provided with two sets of mutually matched light-emitting elements 21 and beam splitters 23.

[0051] It should be noted that, in practice, the light source assembly 20 could also have only one relatively long beam-splitting prism 23, the length of which could cover the light-transmitting windows 24 corresponding to the two imaging optical paths. However, due to the high cost of currently integrally manufactured long prisms, considering cost issues, this embodiment chooses to use two relatively short, separate beam-splitting prisms 23, each corresponding to one of the two light-transmitting windows 24. Since the principle and setup are the same, the structure of the light source assembly 20 will be described below using the structure and cooperation of a set of light-emitting elements 21 and beam-splitting prisms 23.

[0052] Please refer to this as well. Figure 5 and Figure 6 , Figure 5 This is a schematic diagram showing the relative positional relationship between the light source component and the imaging main ray when the detection device is illuminated by the light source component in a specific embodiment; Figure 6 This is a schematic diagram showing the relative positional relationship between the light source component and the imaging main ray when the detection device uses a light source component for illumination in a specific embodiment.

[0053] In this embodiment, the beam splitter 23 of the light source assembly 20 has a semi-reflective lens 231. Specifically, the semi-reflective lens 231 can be disposed inside the beam splitter 23 in the form of a film. The semi-reflective lens 231 divides the beam splitter 23 into a bright field portion 232 and a dark field portion 233. It can also be understood that the semi-reflective lens 231 is located at the junction of the bright field portion 232 and the dark field portion 233 of the beam splitter 23.

[0054] It should be noted that in actual setup, the prism form can be omitted, and only the semi-reflective mirror 231 part can be set.

[0055] The light emitted by the light-emitting element 21 is reflected at the semi-reflective lens 231 of the beam splitter 23 and shines on the back side of the wafer 1, where it converges to form a light spot.

[0056] Specifically, a condenser cylindrical mirror 22 is provided between the light-emitting element 21 and the beam splitter 23. The condenser cylindrical mirror 22 is used to converge the light emitted by the light-emitting element 21, so that the light with the convergence tendency is reflected by the semi-reflective mirror 231 and shines on the wafer 1, thereby improving the lighting efficiency.

[0057] The condenser cylindrical lens 22 can also be replaced by other optical elements with the function of converging light.

[0058] In this embodiment, the light-emitting element 21 can specifically be an LED light or the like.

[0059] Obviously, the bright field portion 232 of the beam splitter 23, which is separated by the semi-reflective mirror 231, is closer to the light-emitting element 21 than the dark field portion 233, while the dark field portion 233 is relatively far away from the light-emitting element 21. The end face of the dark field portion 233 that is far away from the light-emitting element 21 is provided with a light-absorbing element 2331, which can be a black material plated on the end face of the dark field portion 233.

[0060] The main illumination ray Z1 formed by the light-emitting element 21 is perpendicular to the axis of the light-transmitting window 24, that is, perpendicular to the axis of the first light-emitting port and the second light-emitting port.

[0061] The semi-reflective mirror 231 is set at a 45-degree angle to the main illumination ray Z1 of the light source 21, so that the main illumination ray Z1 from the light source 21 can be reflected by the semi-reflective mirror 231 and illuminate the wafer 1 through a light outlet. Here, we take the first light outlet being close to the wafer 1 as an example. After the above setting, the light ray Z1 reflected by the semi-reflective mirror 231 can illuminate the wafer 1 through the first light outlet. The light reflected by the wafer 1 can enter the information acquisition component 10 through the first light outlet and the second light outlet in sequence.

[0062] Among them, the semi-reflective lens 231 can transmit a portion of the received light and reflect the rest of the received light.

[0063] As mentioned earlier, to ensure compatibility with the detection of at least two types of wafers 1, the imaging optical path is set perpendicular to wafer 1, so as to... Figure 5 From the perspective shown, the imaging principal ray S1 is vertical and is set at a 45-degree angle to the semi-reflective lens 231.

[0064] As described above, a dark field portion 233 is added to the side of the semi-reflective lens 231 of the beam splitter 23 away from the light-emitting element 21. This is equivalent to lengthening the distance between the light-absorbing element 2331 and the semi-reflective lens 231. A portion of the light emitted by the light-emitting element 21 passes through the semi-reflective lens 231, and this portion of light is ineffective. After adding the dark field portion 233, most of this ineffective light is absorbed by the light-absorbing element 2331, and the remaining light is reflected back to the semi-reflective lens 231 in a scattered state. The large-angle light in the scattered light can be emitted from the upper and lower surfaces of the dark field portion 233, and this portion of light will not enter the imaging optical path. Because the distance between the scattering surface and the semi-reflective lens 231 is lengthened, the intensity of the small-angle light in the scattered light will be significantly reduced. Compared with not setting the dark field portion 233, a bright field image with higher contrast can be obtained.

[0065] It should be noted that when using the light source assembly 20 for illumination, the position of the light source assembly 20 should be set so that the imaging principal ray S1 passes through the semi-reflective lens 231.

[0066] The main illumination ray Z1 of the light-emitting element 21 is arranged parallel to the plane where the wafer 1 is located, so as to... Figure 5 The view shown indicates that the principal ray of illumination Z1 is parallel to the horizontal plane and perpendicular to the principal ray of imaging S1.

[0067] The semi-reflective mirror 231 forms a 45-degree angle with the principal illumination ray Z1 and also forms a 45-degree angle with the principal imaging ray S1. In other words, the principal illumination ray Z1 and the principal imaging ray S1 are mirror images of the semi-reflective mirror 231.

[0068] Thus, the reflected light from the main illumination ray Z1, after being reflected by the semi-reflective lens 231, illuminates the wafer 1 and is coaxial with the main imaging ray S1. This can significantly improve the illumination efficiency of the light source assembly 20, obtain a bright field image with higher contrast, and improve the accuracy of the detection results.

[0069] In specific settings, the semi-reflective mirror 231 is configured to meet the following requirements: 50% transmittance and 50% reflectance of light. This allocation can produce a bright-field image with relatively high contrast.

[0070] Of course, in practice, the transmission and reflection ratio of light by the semi-reflective mirror 231 can be adjusted according to the actual application requirements.

[0071] In specific settings, the light-absorbing element 2331 of the light source assembly 20 can also be set in other forms, and an adjustment element can be set. This adjustment element can adjust the distance between the light-absorbing element 2331 and the semi-reflective mirror 231, so as to change the distance between the light-absorbing element 2331 and the semi-reflective mirror 231 according to the actual detection needs, so as to obtain a bright field image with better contrast.

[0072] In this embodiment, the lighting component also includes a light source component 30 as a dark field light source, and the aforementioned light source component 20 can switch between a first position and a second position.

[0073] Specifically, when illumination is provided by the light source assembly 20, the light source assembly 20 is in the first position, and the imaging principal ray S1 passes through the semi-reflective lens 231, such as... Figure 5 As shown;

[0074] When illumination is provided by light source component 30, light source assembly 20 is in the second position, and the imaging principal ray S1 does not pass through the semi-reflective lens 231, but only through the dark field portion 233, such as... Figure 6 As shown.

[0075] With the above configuration, when the light source component 30 is used for illumination, the light emitted after the wafer 1 is illuminated no longer passes through the semi-reflective mirror 231, but passes entirely through the dark field portion 233. There will be no partial reflection caused by passing through the semi-reflective mirror 231. In this way, the light emitted after the wafer 1 is illuminated passes through the dark field portion 233 of the beam splitter 23 with almost no attenuation and enters the information acquisition component 10, which can greatly improve the contrast of the dark field image.

[0076] It is understandable that, in actual setup, depending on the selection of the light source, the light source component 20 moves along the direction of its main illuminating ray Z1 to switch between a first position and a second position.

[0077] In this embodiment, the light source component 30 can also be rotated to adjust the angle of its dark field illumination light relative to the wafer 1, so as to adapt to the focusing during different wafer 1 inspections.

[0078] Specifically, the lighting component may include at least two light source components 30, each light source component 30 being at a different distance from the wafer 1. Figures 1 to 3 As shown in the example, each light source component 30 is at a different height.

[0079] The present invention has provided a detailed description of a light source assembly and a detection device having the light source assembly. Specific examples have been used to illustrate the principles and implementation methods of the invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A detection device, characterized in that, The detection device includes an illumination component and an information acquisition component. The illumination component includes a light source component and a light source assembly. The illumination component is used to illuminate the object under test. The information acquisition component is used to collect and process the reflected light from the object under test. The light source assembly includes a light-emitting element, a light-transmitting window, a light-absorbing element, and a semi-reflective lens. The semi-reflective lens is set at a 45-degree angle to the axis of the light-transmitting window. The main illumination ray formed by the light-emitting element is perpendicular to the axis of the light-transmitting window and forms a 45-degree angle with the semi-reflective lens. The semi-reflective lens is located between the light-emitting element and the light-absorbing element. The information acquisition component and the light transmission window are located on the same straight line. The light emitted by the lighting component is reflected by the object under test and then passes through the light transmission window to reach the information acquisition component. The light source component is a bright field light source, and the light source component is located between the object under test and the information acquisition component. The position of the light transmission window corresponds to the imaging optical path of the information acquisition component. The light source component is a dark field light source, and the light source assembly moves along the direction of its main illuminating ray to switch between a first position and a second position; The light source assembly is used for illumination, and the light source assembly is in a first position. The imaging main ray formed by the reflection of the object under test passes through the semi-reflective lens. Illumination is provided by the light source component, which is in the second position. The imaging main ray formed by the reflection of the object under test does not pass through the semi-reflective lens, but only through the dark field portion formed between the semi-reflective lens and the light-absorbing component.

2. The detection device according to claim 1, characterized in that, The detection device further includes a driving component for driving the object under test to rotate around its center; the information acquisition component has at least one imaging optical path, each imaging optical path corresponding to a field of view, the information acquisition component scans the object under test during the rotation of the object under test, the object under test rotates at most one revolution, and the detection device completes the scanning and detection of the entire object under test.

3. The detection device according to claim 2, characterized in that, The test object is a wafer, and the detection device further includes a suction cup for adsorbing the wafer. The suction cup has at least two adsorption parts, and the wafers adsorbed by each adsorption part are of different sizes. There is a set distance between two adjacent adsorption parts. The adsorption portion for adsorbing smaller wafers is relatively far from the information acquisition component, while the adsorption portion for adsorbing larger wafers is relatively close to the information acquisition component.

4. The detection device according to claim 3, characterized in that, The imaging optical path is perpendicular to the wafer.

5. The detection device according to any one of claims 1-4, characterized in that, The light source component is provided with at least one, and the light source component is rotatable to adjust the angle of the dark field illumination light relative to the object under test.

6. The detection device according to claim 5, characterized in that, The light source component is provided in at least two parts, and the distance between each light source component and the object to be tested is different.

7. The detection device according to any one of claims 2-4, characterized in that, The information acquisition component has at least two imaging optical paths, and the field of view corresponding to the imaging optical path is a line field of view, which extends radially along the object under test.

8. The detection device according to claim 7, characterized in that, The information acquisition component has two imaging optical paths, and the two line fields of view corresponding to the two imaging optical paths at least cover the radius of the object under test.

9. The detection device according to any one of claims 1-4, characterized in that, The light-transmitting window has a first light-emitting port and a second light-emitting port on the same axis. The second light-emitting port is closer to the information acquisition component than the first light-emitting port. The light emitted by the illumination component is reflected by the object under test and then passes through the first light-emitting port and the second light-emitting port in sequence to reach the information acquisition component.

10. The detection device according to any one of claims 1-4, characterized in that, The light source assembly also includes an adjustment element for adjusting the distance between the light-absorbing element and the semi-reflective lens.

11. The detection device according to any one of claims 1-4, characterized in that, The light source assembly also includes a condenser cylindrical lens, which is disposed between the light-emitting element and the semi-reflective lens.

Images