Flexible circuit board and display device

Abstract

A flexible circuit board comprises an insulating substrate, wherein the insulating substrate comprises a main body portion and at least one first extension portion connected to an edge of the main body portion; the first extension portion comprises a via region, a bending region and a binding region which are sequentially away from the main body portion; the via region is provided with a plurality of vias, the plurality of vias comprises at least one first via and at least one second via, wherein the center of the orthographic projection of the first via on a reference plane parallel to the via region falls on a first straight line parallel to the bending axis of the bending region, and the center of the orthographic projection of the second via on the reference plane does not fall on the first straight line.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a flexible circuit board and a display device. Background Art

[0002] Flexible Printed Circuit (FPC) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight and thin thickness. It is mainly used in many products such as mobile phones, laptops, PDAs, digital cameras, etc. Summary of the invention

[0003] On the one hand, a flexible circuit board is provided. The flexible circuit board includes an insulating substrate, the insulating substrate includes a main body and at least one first extension portion connected to the edge of the main body; the first extension portion includes a via region, a bending region and a binding region that are sequentially away from the main body; the via region is provided with a plurality of vias, the plurality of vias include at least one first via and at least one second via, wherein the center of the orthographic projection of the first via on a reference plane parallel to the via region falls on a first straight line parallel to the bending axis of the bending region, and the center of the orthographic projection of the second via on the reference plane does not fall on the first straight line.

[0004] In some embodiments, the straight line where the center of the orthographic projection of the first via hole on the reference plane and the center of the orthographic projection of the second via hole on the reference plane are located is a second straight line, and the angle between the second straight line and the first straight line is α, where 15°<α≤90°.

[0005] In some embodiments, the straight line where the center of the orthographic projection of the first via hole on the reference plane and the center of the orthographic projection of the second via hole on the reference plane are located is a second straight line, and the angle between the second straight line and the first straight line is α, where 0°<α≤15°, and the spacing between the first via hole and the second via hole in a direction parallel to the first straight line is greater than or equal to 1 mm.

[0006] In some embodiments, a distance between the first via hole and the second via hole in a direction parallel to the first straight line is 1 mm to 2 mm; and / or a distance between two adjacent first via holes is greater than or equal to 2 mm.

[0007] In some embodiments, the orthographic projection centers of any two vias among the plurality of vias on the reference plane do not fall on the same straight line parallel to the bending axis of the bending region.

[0008] In some embodiments, the multiple vias are divided into at least two parts of vias in sequence along a direction parallel to the first straight line, and among the two adjacent parts of vias, one part of the vias gradually moves away from the bending area along a direction parallel to the first straight line, and the other part of the vias gradually approaches the bending area along a direction parallel to the first straight line.

[0009] In some embodiments, the flexible circuit board also includes: a first conductive layer arranged on the first side surface of the insulating substrate, the first conductive layer including a plurality of first pins and a plurality of first conductive wires, the plurality of first pins being located in the binding area, and the first ends of the plurality of first conductive wires being connected one-to-one with at least some of the plurality of first pins; a second conductive layer arranged on the second side surface of the insulating substrate, the second conductive layer including a plurality of second conductive wires, the first ends of the plurality of second conductive wires being connected one-to-one with the second ends of the plurality of first conductive wires through the plurality of vias.

[0010] In some embodiments, the number of the first extension parts is two; a part of the multiple first pins is located in the binding area of ​​one of the first extension parts, and another part of the multiple first pins is located in the binding area of ​​another first extension part; the first ends of a part of the multiple first conductive wires are connected one-to-one with at least a part of the first pins in the part, and the first ends of another part of the multiple first conductive wires are connected one-to-one with at least a part of the first pins in the other part; the first ends of a part of the multiple second conductive wires are connected one-to-one with the second ends of the part of the first conductive wires through a plurality of vias on one of the first extension parts, and the first ends of another part of the multiple second conductive wires are connected one-to-one with the second ends of the part of the first conductive wires through a plurality of vias on another of the first extension parts.

[0011] In some embodiments, both of the first extension portions are connected to the first side edge of the main body portion.

[0012] In some embodiments, the insulating substrate also includes: a second extension portion connected to the second side edge of the main portion, the first side edge and the second side edge are located on opposite sides of the main portion; and a plug-in structure arranged at one end of the second extension portion away from the main portion.

[0013] In some embodiments, the flexible circuit board also includes: a first insulating layer, located on a side of the first conductive layer away from the insulating substrate; a second insulating layer, located on a side of the second conductive layer away from the insulating substrate; a first shielding layer, located on a side of the first insulating layer away from the insulating substrate, the first shielding layer covering the main body and the via area; a second shielding layer, located on a side of the second insulating layer away from the insulating substrate, the first shielding layer covering the main body and the via area; the first shielding layer and the second shielding layer are used to shield electromagnetic waves.

[0014] In some embodiments, the flexible circuit board further includes: a protective layer disposed on a side of the second shielding layer away from the insulating substrate, wherein the protective layer covers the via region.

[0015] In another aspect, a display device is provided, comprising: a flexible circuit board as described in any one of the above embodiments; and a display panel, wherein a binding area of ​​the flexible circuit board is bound to the display panel.

[0016] In some embodiments, the display device is a foldable display device.

[0017] In some embodiments, the display device further includes: a supporting portion disposed between a main portion of the flexible circuit board and the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0019] Figure 1 is a structural diagram of a flexible circuit board according to some embodiments;

[0020] Figure 2 is a via distribution diagram according to some embodiments;

[0021] Figure 3 is another via distribution diagram according to some embodiments;

[0022] Figure 4 is another via distribution diagram according to some embodiments;

[0023] Figure 5A is another via distribution diagram according to some embodiments;

[0024] Figure 5B is another via distribution diagram according to some embodiments;

[0025] Figure 5C is another via distribution diagram according to some embodiments;

[0026] Figure 6 is another via distribution diagram according to some embodiments;

[0027] Figure 7 for Figure 1 A cross-sectional view of the flexible circuit board shown at X-X';

[0028] Figure 8 is a structural diagram of another flexible circuit board according to some embodiments;

[0029] Fig. 9 is a structural diagram of yet another flexible circuit board according to some embodiments;

[0030] Fig.10 is a structural diagram of a display device according to some embodiments. DETAILED DESCRIPTION

[0031] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0032] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0033] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0034] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0035] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0036] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0037] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0038] As used herein, "about" or "approximately" includes the stated value and the average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0039] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0040] Some embodiments of the present disclosure provide a flexible circuit board 100. Figure 1 As shown, the flexible circuit board 100 includes an insulating substrate 1, and the insulating substrate 1 includes a main body 11 and at least one first extension portion 12 connected to the edge of the main body 11. The first extension portion 12 includes a via region 121, a bending region 122, and a binding region 123 that are sequentially away from the main body 11. The via region 121 is provided with a plurality of vias 2, and the plurality of vias 2 include at least one first via 21 and at least one second via 22, wherein the orthographic projection center of the first via 21 on a reference plane S parallel to the via region 121 falls on a first straight line W parallel to the bending axis L of the bending region 122, and the orthographic projection center of the second via 22 on the reference plane S does not fall on the first straight line W.

[0041] The first straight line W is a virtually set reference straight line. For example, among all straight lines that are parallel to the bending axis L of the bending area 122 and overlap with the center of the orthographic projection of any via hole on the reference surface S, any straight line can be used as the first straight line W. At this time, the via hole 2 whose orthographic projection center falls on the first straight line W is the first via hole 21, and the number of the first via holes 21 can be one or more; and the via hole 2 that does not fall on the first straight line W is the second via hole 22, and the number of the second via holes 22 can also be one or more.

[0042] Since the multiple vias 2 on the via area 121 include both the first via 21 whose orthographic projection center falls on the first straight line W and the second via 22 whose orthographic projection center does not fall on the first straight line W, when the via area 121 is displaced by the tension generated by the bending area 122, the via area 121 is not likely to break, which is beneficial to improving the bending performance of the entire flexible circuit board 100.

[0043] Among them, see Figure 1The main body 11 of the flexible circuit board 100 can be used to place a chip 15 and other electronic components. For example, the chip 15 placed on the main body 11 can be a touch control chip, or the chip 15 placed on the main body 11 can also be a drive control chip.

[0044] It should be noted that the binding area 123 in the first extension part 12 of the flexible circuit board 100 can be provided with pins. In this way, by binding with the display panel through the binding area 123, the chip 15 in the flexible circuit board (for example, a touch control chip or a drive control chip located in the main body 11) can be connected to the circuit in the display panel through the pins located in the binding area 123, so that the circuit in the display panel (for example, a pixel drive circuit, or a touch circuit) can be controlled by the chip 15 in the flexible circuit board 100 to realize the display function and / or touch function of the display device.

[0045] Since the center of the orthographic projection of the first via 21 on the reference plane S is located on the first straight line W, and the center of the orthographic projection of the second via 22 on the reference plane S is not located on the first straight line W, there may be an angle of 0° to 90° between the first straight line W and the straight line where the center of the orthographic projection of any first via 21 on the reference plane S and the center of the orthographic projection of any second via 22 on the reference plane S are located.

[0046] For example, Figure 2 As shown, the straight line where the orthographic projection center of the first via 21 and the orthographic projection center of the second via 22 on the reference plane S are located is the second straight line V, and the angle between the second straight line V and the first straight line W is α, where 15°<α≤90°.

[0047] With this arrangement, compared to α≤15°, the center of the orthographic projection of the first via 21 on the reference plane S is farther away from the center of the orthographic projection of the second via 22 on the reference plane S in a direction perpendicular to the first straight line W, thereby making the via area less likely to break when a misalignment occurs, further improving the bending performance of the flexible circuit board.

[0048] It is worth pointing out that in this example, there is no need to limit the spacing between the first via 21 and the second via 22, that is, it is sufficient to ensure that the first via 21 is not connected to the second via 22. Therefore, the distance between the first via 21 and the second via 22 in the direction parallel to the first straight line W can be set narrower, which helps to set more vias 2 in the via area 121.

[0049] Another example is Figure 3As shown, the straight line where the center of the orthographic projection of the first via 21 on the reference plane S and the center of the orthographic projection of the second via 22 on the reference plane S are located is the second straight line V, and the angle between the second straight line V and the first straight line W is α, wherein 0°<α≤15°, and the spacing d1 between the first via 21 and the second via 22 in a direction parallel to the first straight line W is greater than or equal to 1 mm.

[0050] This arrangement makes the angle between the first straight line W and the second straight line V smaller (for example, 0°<α≤15°), which helps to reduce the width of the via area in the direction perpendicular to the first straight line W. In addition, since the spacing d1 between the first via 21 and the second via 22 in the direction parallel to the first straight line W is greater than or equal to 1 mm, when the angle between the first straight line W and the second straight line V is smaller, the spacing between the first via 21 and the second via 22 in the direction parallel to the first straight line W is larger, so that the via area is not easily broken when it is displaced by the tensile force generated by the bending area.

[0051] The spacing d1 between the first via hole 21 and the second via hole 22 in the direction parallel to the first straight line W may be 1 mm to 2 mm. For example, when the spacing d1 is equal to or close to 1 mm, it is helpful to set more via holes 2 in the area parallel to the via hole. For another example, when the spacing is equal to or close to 2 mm, it is helpful to improve the anti-fracture effect of the via hole area.

[0052] In some embodiments, Figure 2 As shown, the spacing d2 between two adjacent first vias 21 is greater than or equal to 2 mm. By setting in this way, the spacing d2 between two adjacent first vias 21 is larger, that is, the area of ​​the connection portion between two adjacent vias 2 is larger, so that even if the centers of the orthographic projections of the two adjacent first vias 21 on the reference plane S fall on the same straight line, when the via region is subjected to the tension generated by the bending region, the connection portion between the two adjacent vias 2 is not easily broken, so that the via region of the flexible circuit board is not easy to break, and it is not easy to damage the circuit on the flexible circuit board due to the breakage of the via region, which helps to improve the service life of the flexible circuit board.

[0053] It should be noted that the center of the orthographic projection of any first via hole 21 on the reference plane S and the center of the orthographic projection of any second via hole 22 on the reference plane S may fall on a second straight line V. For example, Figure 4As shown, the center of the orthographic projection of the first via 21a on the reference plane S may fall on a second straight line V1 with the center of the orthographic projection of the second via 22a on the reference plane S, or the center of the orthographic projection of the first via 21a on the reference plane may fall on a second straight line V2 with the center of the orthographic projection of the second via 22b on the reference plane S, or the center of the orthographic projection of the second via 22a on the reference plane may fall on a second straight line V3 with the center of the orthographic projection of the first via 21b on the reference plane S.

[0054] In some embodiments, Figure 5A to Figure 5C As shown, the centers of the orthographic projections of any two vias 2 among the plurality of vias 2 on the reference plane S do not fall on the same straight line parallel to the bending axis of the bending region. That is, when the center of the orthographic projection of a via 2 on the reference plane S falls on the first straight line W parallel to the bending axis of the bending region, the orthographic projections of the remaining vias 2 on the reference plane S will not fall on the first straight line W. For example, there is only one first via 21 among the plurality of vias 2, and the first via 21 can be any via 2 among the plurality of vias 2, while the remaining vias 2 are all second vias 22. In this way, when the via area is subjected to the tensile force generated by the bending area, since only one via appears at a certain distance in the direction perpendicular to the first straight line, the bending area is not easy to break, thereby further improving the bending performance of the flexible circuit board.

[0055] It should be noted that Figure 5A to Figure 5C Only three possible situations in the present disclosure that "the centers of the orthographic projections of any two vias 2 among the plurality of vias 2 on the reference plane S do not fall on the same straight line parallel to the bending axis of the bending region" are illustrated, and the present disclosure is not limited to Figures 5A to 5C The scheme shown in .

[0056] In some embodiments, Figure 6 As shown, the plurality of vias 2 are arranged along a direction parallel to the first straight line W (eg Figure 6 The via holes are divided into at least two parts in sequence, and in the two adjacent via holes, one part of the via holes (for example, Figure 6 In the figure, the first four vias from left to right) gradually move away from the bending area in a direction parallel to the first straight line, and another part of the vias (for example, Figure 6 , the fifth to seventh via holes (counted from left to right) gradually approach the bending area along a direction parallel to the first straight line.

[0057] In some embodiments, Figure 1 and Figure 7As shown, the flexible circuit board 100 further includes a first conductive layer 3 disposed on the first side surface of the insulating substrate 1, the first conductive layer 3 includes a plurality of first pins 31 and a plurality of first conductive wires 32, the plurality of first pins 31 are located in the binding area 123, and the first ends of the plurality of first conductive wires 32 are connected one-to-one with at least some of the first pins 31 in the plurality of first pins 31. A second conductive layer 4 is disposed on the second side surface of the insulating substrate 1, the second conductive layer 4 includes a plurality of second conductive wires 41, and the first ends of the plurality of second conductive wires 41 are connected one-to-one with the second ends of the plurality of first conductive wires 32 through a plurality of vias 2.

[0058] The second ends of the plurality of second conductive lines 41 may be directly or indirectly connected to the chip 15 (eg, a touch control chip or a drive control chip). Figure 8 As shown, the first conductive layer 3 may further include a third conductive line 33 connected to the chip 15 located in the main body 11, and the second end of the second conductive line 41 may be connected to the third conductive line 33 through a via located in the main body 11. For another example, the second end of the second conductive line 41 may also be directly connected to the chip 15 through a via located in the main body 11 where the chip 15 is mounted.

[0059] The number of the first extending portion 12 in the flexible circuit board 100 can be one or more.

[0060] In some embodiments, Figure 8 As shown, the number of first extension parts 12 can be two. At this time, a part of the first pins 31 of the plurality of first pins 31 is located in the binding area 123 of one first extension part 12, and another part of the first pins 31 is located in the binding area 123 of another first extension part 12. The first ends of a part of the first conductive wires 32 of the plurality of first conductive wires 32 are connected to at least a part of the first pins 31 of a part of the first pins 31 in a one-to-one correspondence, and the first ends of another part of the first conductive wires 32 of the plurality of first conductive wires 32 are connected to at least a part of the first pins 31 of another part of the first pins 31 in a one-to-one correspondence. The first ends of a part of the second conductive wires 41 of the plurality of second conductive wires 41 are connected to the second ends of a part of the first conductive wires 32 in a one-to-one correspondence through a plurality of vias 2 on a first extension part 12, and the first ends of another part of the second conductive wires 41 of the plurality of second conductive wires 41 are connected to the second ends of another part of the first conductive wires 32 in a one-to-one correspondence through a plurality of vias 2 on another first extension part 12.

[0061] On this basis, for example, Figure 8 As shown, the first conductive layer 3 further includes a plurality of fourth conductive lines 34 and a plurality of fifth conductive lines 35. The plurality of fourth conductive lines 34 may be connected between the chip 15 and the first conductive lines 32.

[0062] The first ends of the plurality of fifth conductive lines 35 can be connected to the second ends of a portion of the plurality of second conductive lines 41 through vias located in the main body 11, and the second ends of the plurality of fifth conductive lines 35 can be connected to the second ends of another portion of the plurality of second conductive lines 41 through vias located in the main body 11.

[0063] This arrangement allows the output end of the chip 15 to be connected to the first pins 31 on the two first extension portions 12 at the same time.

[0064] In some embodiments, see Figure 8 , the two first extension parts 12 are both connected to the first side edge of the main body part 11. In this way, the flexible circuit board 100 includes two first extension parts 12, and the circuit on the flexible circuit board 100 can be electrically connected to the circuit on the display panel through the two first extension parts 12. Exemplarily, a touch control chip (such as chip 15) is provided on the main body part 11. When the flexible circuit board 100 includes two first extension parts 12, the output end of the touch control chip can be simultaneously connected to the touch control electrode in the display panel through the multiple first pins 31 on the two first extension parts 12, that is, in this way, the touch control chip can be connected to the touch control electrode at the same time through two parts of the conductive wire, thereby helping to reduce the resistance between the touch control chip and the touch electrode, and improve the control accuracy of the touch control circuit in the display device.

[0065] In some embodiments, Figure 1 and Figure 8 As shown, the flexible circuit board 100 further includes a second extension portion 13 and a plug-in structure 14, wherein the second extension portion 13 is connected to the second side edge of the main body portion 11, and the first side edge and the second side edge are located at opposite sides of the main body portion 11. The plug-in structure 14 is disposed at one end of the second extension portion 13 away from the main body portion 11. The plug-in structure 14 is plugged into, for example, a main control circuit board of a display device.

[0066] In some embodiments, Figure 7As shown, the flexible circuit board 100 further includes a first insulating layer 5, a second insulating layer 6, a first shielding layer 7 and a second shielding layer 8. The first insulating layer 5 is located on the side of the first conductive layer 3 away from the insulating substrate 1. The second insulating layer 6 is located on the side of the second conductive layer 4 away from the insulating substrate 1. The first shielding layer 7 is located on the side of the first insulating layer 5 away from the insulating substrate 1, and the first shielding layer 7 covers the main body 11 and the via area 121. The second shielding layer 8 is located on the side of the second insulating layer 6 away from the insulating substrate 1, and the second shielding layer 8 covers the main body 11 and the via area 121. The first shielding layer 7 and the second shielding layer 8 can shield electromagnetic waves, thereby preventing the electrical signals transmitted by the conductive lines on the flexible circuit board from being affected.

[0067] In some embodiments, Figure 7 and Fig. 9 As shown, the flexible circuit board 100 further includes a protective layer 9, which is disposed on a side of the second shielding layer 8 away from the insulating substrate 1, and covers the via area 121. The protective layer 9 is used to protect the via area 121 to prevent the via area 121 from breaking when subjected to tension.

[0068] Some embodiments of the present disclosure further provide a display device 300, such as Fig.10 As shown, the display device 300 includes the flexible circuit board 100 and the display panel 200 described in any of the above embodiments of the present disclosure, and the binding area 123 of the flexible circuit board 100 is bound to the display panel 200 .

[0069] The display device 300 may be a foldable display device, and the bending axis of the foldable display device is substantially parallel to the bending axis of the bending region of the flexible circuit board 100. Here, "substantially parallel" means that the two are parallel to each other, or that the two are approximately parallel (for example, the angle between the orthographic projections of the two on the reference plane is less than or equal to 10 degrees).

[0070] It should be noted that when the foldable display device is bent along its bending axis, the display panel is also bent by force, which will cause the flexible circuit board bound to it to shift. When the flexible circuit board shifts, the via area will be affected by the pulling force generated by the bending area. At this time, if the orthographic projection centers of the multiple vias provided in the via area on the reference surface all fall on the same straight line parallel to the bending axis of the bending area, it is easy to cause the via area to break, causing damage to the flexible circuit board, and then causing the display device to be unable to achieve touch and / or display functions.

[0071] In the flexible circuit board 100 of some embodiments of the present disclosure, the multiple vias 2 on the via area 121 include both the first via 21 whose orthographic projection center falls on the first straight line W and the second via 22 whose orthographic projection center does not fall on the first straight line W, so that when the via area 121 is displaced by the tension generated by the bending area 122, the via area 121 is not easy to break, and the bending performance of the entire flexible circuit board 100 is strong. Therefore, the folding display device using the flexible circuit board provided in the above embodiments of the present disclosure has higher reliability and longer service life.

[0072] In some embodiments, Fig.10 As shown, the display device 300 further includes a support portion 301, which is disposed between the main body of the flexible circuit board 100 and the display panel 200. At this time, the support portion 301 can support the main body 11 of the flexible circuit board 100, so that the main body 11 is not prone to shaking even if the chip 15 or other electronic devices are installed, which helps to improve the service life of the flexible circuit board.

[0073] The display device 300 may be, for example, a television, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, or any other component with a display function.

[0074] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A flexible circuit board, characterized in that: include: An insulating substrate, the insulating substrate comprising a main body portion and at least one first extension portion connected to an edge of the main body portion; The first extension portion includes a via region, a bending region and a binding region which are sequentially away from the main body portion; The via region is provided with a plurality of vias, the plurality of vias including at least one first via and at least one second via, wherein the center of the orthographic projection of the first via on a reference plane parallel to the via region falls on a first straight line parallel to the bending axis of the bending region, and the center of the orthographic projection of the second via on the reference plane does not fall on the first straight line; The straight line where the center of the orthographic projection of the first via hole on the reference plane and the center of the orthographic projection of the second via hole on the reference plane are located is a second straight line, and the angle between the second straight line and the first straight line is α, wherein 0°<α≤15°, and the spacing between the first via hole and the second via hole in a direction parallel to the first straight line is greater than or equal to 1 mm.

2. The flexible circuit board according to claim 1, characterized in that: The distance between the first via hole and the second via hole in a direction parallel to the first straight line is 1 mm to 2 mm; and / or, The distance between two adjacent first via holes is greater than or equal to 2 mm.

3. The flexible circuit board according to claim 1 or 2, characterized in that: The orthographic projection centers of any two via holes among the plurality of via holes on the reference plane do not fall on the same straight line parallel to the bending axis of the bending region.

4. The flexible circuit board according to claim 1 or 2, characterized in that: The multiple vias are divided into at least two parts of vias in sequence along a direction parallel to the first straight line, and among two adjacent parts of vias, one part of the vias gradually moves away from the bending area along a direction parallel to the first straight line, and the other part of the vias gradually approaches the bending area along a direction parallel to the first straight line.

5. The flexible circuit board according to claim 1 or 2, characterized in that: Also includes: A first conductive layer disposed on a first side surface of the insulating substrate, the first conductive layer comprising a plurality of first pins and a plurality of first conductive wires, the plurality of first pins being located in the binding area, and first ends of the plurality of first conductive wires being connected to at least some of the plurality of first pins in a one-to-one correspondence; A second conductive layer is disposed on the second side surface of the insulating substrate, wherein the second conductive layer includes a plurality of second conductive lines, and the first ends of the plurality of second conductive lines are connected one-to-one with the second ends of the plurality of first conductive lines through the plurality of via holes.

6. The flexible circuit board according to claim 5, characterized in that: The number of the first extension parts is two; A portion of the plurality of first pins is located in a binding region of one of the first extension portions, and another portion of the plurality of first pins is located in a binding region of another of the first extension portions; The first ends of a portion of the plurality of first conductive lines are connected to at least a portion of the first pins in the portion of the first pins in a one-to-one correspondence, and the first ends of another portion of the plurality of first conductive lines are connected to at least a portion of the first pins in the another portion of the first pins in a one-to-one correspondence; The first ends of a portion of the multiple second conductive lines are connected to the second ends of the portion of the first conductive lines in a one-to-one correspondence through a plurality of vias on one of the first extending portions, and the first ends of another portion of the multiple second conductive lines are connected to the second ends of the portion of the first conductive lines in a one-to-one correspondence through a plurality of vias on another of the first extending portions.

7. The flexible circuit board according to claim 6, characterized in that: The two first extension portions are both connected to the first side edge of the main body portion.

8. The flexible circuit board according to claim 7, characterized in that: The insulating substrate further comprises: a second extension portion connected to a second side edge of the main body portion, wherein the first side edge and the second side edge are located at opposite sides of the main body portion; The plug-in structure is arranged at an end of the second extension portion away from the main body portion.

9. The flexible circuit board according to claim 5, characterized in that: Also includes: A first insulating layer, located on a side of the first conductive layer away from the insulating substrate; a second insulating layer, located on a side of the second conductive layer away from the insulating substrate; A first shielding layer, located on a side of the first insulating layer away from the insulating substrate, the first shielding layer covering the main body and the via area; A second shielding layer is located on a side of the second insulating layer away from the insulating substrate, and the first shielding layer covers the main body and the via area; The first shielding layer and the second shielding layer are used for shielding electromagnetic waves.

10. The flexible circuit board according to claim 9, characterized in that: Also includes: The protective layer is arranged on a side of the second shielding layer away from the insulating substrate, and the protective layer covers the via area.

11. A display device, characterized in that: include: The flexible circuit board according to any one of claims 1 to 10; The flexible circuit board has a display panel on which the binding area is bound.

12. The display device according to claim 11, characterized in that: The display device is a foldable display device.

13. The display device according to claim 11 or 12, characterized in that: Also includes: The supporting portion is arranged between the main body of the flexible circuit board and the display panel.

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