A sensitivity-enhanced thermocouple power sensing chip and sensor

Abstract

The present invention provides a sensitivity-enhanced thermocouple power sensor chip and sensor, comprising: a substrate, a thermopile provided above the substrate, a coplanar waveguide provided above the thermopile, a quartz dielectric sheet provided above the coplanar waveguide, and the coplanar waveguide connected to a load terminal; by providing the quartz dielectric sheet above the coplanar waveguide, a heat flow path is increased, thereby improving the sensitivity of the sensor.

Description

Technical Field

[0001] The present invention belongs to the field of sensors, and in particular relates to a sensitivity-enhanced thermocouple power sensor chip and a sensor. Background Art

[0002] The statements in this section merely provide background information related to the present invention and do not necessarily constitute prior art.

[0003] Power measurement plays a crucial role in microwave and millimeter-wave measurement, being one of the most fundamental and important parameters of microwave signals. Thermocouple power meters offer the advantage of high accuracy, capable of measuring the average power of both continuous-wave and modulated signals. Because thermocouple elements can be manufactured into extremely thin sheets and offer high energy conversion efficiency, thermocouple power sensors, with their simple structure, excellent performance, and low manufacturing cost, are widely used in fields such as communications and scientific research.

[0004] Thermocouple power sensor chip is the core component of thermocouple power meter. Figure 1 As shown, it mainly consists of three parts: a coplanar waveguide, a load terminal, and a thermopile. The coplanar waveguide is used to transmit the microwave signal to the load terminal, converting the microwave signal power into heat. Through the Seebeck effect, a thermopile placed near the load terminal converts the heat into a DC voltage. Currently, there is relatively little research on thermocouple microwave power sensor chips. The Chinese Academy of Sciences has designed a semiconductor thermocouple microwave power sensor structure that increases the sensitivity of the thermocouple power sensor from 300μV / mV to approximately 1000μV / mV. Southeast University has developed a DC-25GHz thermocouple power sensor with a sensitivity of 81.68uV / mW at a 10GHz operating frequency. Existing thermocouple power sensor chips still cannot meet the application requirements of high-sensitivity power measurement and metrological calibration, placing high demands on the design of the detection circuit, making the design of the detection circuit and amplifier circuit complex.

[0005] In traditional thermocouple power sensor chip designs, heat is transferred between the load terminal and the thermocouple mainly through a heat transfer path between the air and the substrate. The heat conduction loss is large, and the heat generated by the load terminal cannot be effectively transferred to the hot end of the thermopile, resulting in low sensitivity. Summary of the Invention

[0006] In order to solve the above problems, the present invention proposes a sensitivity-enhanced thermocouple power sensor chip and sensor. The present invention can improve the sensitivity of the thermocouple power sensor and meet the application requirements of high-sensitivity power measurement and metrological calibration in the development of microwave technology.

[0007] According to some embodiments, the present invention adopts the following technical solutions:

[0008] In a first aspect, the present invention provides a sensitivity-enhanced thermocouple power sensor chip.

[0009] A sensitivity-enhanced thermocouple power sensor chip comprises: a substrate, a thermopile disposed above the substrate, a coplanar waveguide disposed above the thermopile, a quartz dielectric sheet disposed above the coplanar waveguide, and the coplanar waveguide connected to a load terminal;

[0010] A quartz dielectric plate is arranged above the coplanar waveguide to increase the heat flow path, thereby improving the sensitivity of the sensor.

[0011] In a second aspect, the present invention provides a sensitivity-enhanced thermocouple power sensor.

[0012] A sensitivity-enhanced thermocouple power sensor comprises the sensitivity-enhanced thermocouple power sensor chip described in the first aspect.

[0013] The present invention uses a coplanar waveguide as the input transmission line for the microwave and millimeter wave signals to be measured. Four thin-film resistors are arranged in series at the end of the coplanar waveguide's central conductor to form a load terminal. The coplanar waveguide and the load terminal are connected and impedance-matched. The thermopiles formed by thermocouples are symmetrically distributed around the load terminal, greatly increasing the effective contact area. At the same time, a layer of quartz glass is also covered on the load terminal to reduce heat loss, thereby improving the sensitivity of the thermocouple power sensor.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] In traditional thermocouple power sensor chip designs, heat is transferred between the load terminal and the thermocouple primarily through a heat transfer path between the air and the substrate. To effectively transfer the heat generated by the load terminal to the hot end of the thermopile, the present invention proposes adding a dielectric layer, such as quartz, above the load terminal and the hot end of the thermopile. This additional heat flow path effectively reduces the thermal conductivity of the thermocouple area, allowing the heat generated by the load terminal to be distributed in the hot end area of the thermopile. This increases the temperature difference of the thermocouple power sensor chip. According to the Seebeck effect, as the temperature difference increases, the DC voltage signal output increases under the same conditions, significantly improving the sensitivity of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0017] Figure 1 Schematic diagram of the structure of the sensitivity-enhanced thermocouple power sensor chip shown in the present invention;

[0018] Among them, 1. Quartz dielectric sheet, 2. Substrate, 3. Ground plate metal hole, 4. Thermocouple, 5. Load terminal, 6. Coplanar waveguide. DETAILED DESCRIPTION

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs.

[0021] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the term "comprising" is used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0022] In the present invention, the directions or positional relationships indicated by terms such as "upper", "lower", "end", etc. are based on the directions or positional relationships shown in the accompanying drawings. They are relational words determined only for the convenience of describing the structural relationships of the various parts or elements of the present invention. They do not specifically refer to any part or element in the present invention and cannot be understood as limitations on the present invention.

[0023] In the present invention, terms such as "connection" should be interpreted broadly to mean a fixed connection, an integral connection, or a detachable connection; a direct connection or an indirect connection through an intermediary. Relevant researchers or technicians in this field may determine the specific meaning of these terms in the present invention based on specific circumstances, and they should not be construed as limiting the present invention.

[0024] Example 1

[0025] This embodiment provides a sensitivity-enhanced thermocouple power sensor chip.

[0026] like Figure 1 As shown, a sensitivity-enhanced thermocouple power sensor chip includes: a substrate 2, a thermopile is provided above the substrate 2, a coplanar waveguide 6 is provided above the thermopile, a quartz dielectric plate 1 is provided above the coplanar waveguide 6, and the coplanar waveguide 6 is connected to a load terminal 5;

[0027] The quartz dielectric plate 1 is arranged above the coplanar waveguide 6 to increase the heat flow path, thereby improving the sensitivity of the sensor.

[0028] As one or more implementation modes, the coplanar waveguide 6 is used as an input transmission line for the microwave and millimeter wave signals to be tested.

[0029] As one or more implementation modes, the coplanar waveguide 6 includes a central stripline and a ground plane, and an end of the central stripline is connected to a load terminal 5 .

[0030] Specifically, the coplanar waveguide 6 is composed of a central guide strip line and a ground plate. Four thin-film resistors distributed in series are provided at the end of the central guide strip line to absorb microwave signal power and convert it into heat. By adding an opening design to the ground plate, the resistance in the thermocouple area is equivalently increased, the temperature difference of the thermocouple power sensor chip is increased, and the chip sensitivity is improved.

[0031] As one or more implementation modes, a plurality of ground plate metal holes 3 are provided on the ground plate.

[0032] As one or more implementation methods, the load terminal 5 is a plurality of thin film resistors arranged in series.

[0033] In one or more embodiments, the thermopile includes a plurality of serially connected thermocouples 4. The hot ends of the thermocouples 4 are placed near the thin film resistor and do not exceed the inner edge of the ground plate, while the cold ends thereof exceed the outer edge of the ground plate.

[0034] As one or more implementation modes, the quartz dielectric plate 1 is placed above the central guide strip line and is symmetrically arranged in the vertical direction along the axial direction of the central guide strip line of the coplanar waveguide 6 .

[0035] Specifically, the edge of the quartz dielectric sheet 1 covers the hot end of the thermocouple 4. By adding the quartz dielectric sheet 1, the hot junction of the thermopile and the load terminal 5 can be effectively covered. In addition to the solid heat transfer of the substrate 2, an additional heat flow path is added, thereby improving the sensitivity and effectively increasing the anti-burning power of the chip.

[0036] In one or more implementation manners, the edge of the quartz dielectric sheet 1 covers the hot end of the thermocouple 4 .

[0037] As one or more implementation modes, a thermopile is provided around the load terminal 5 .

[0038] Example 2

[0039] This embodiment provides a sensitivity-enhanced thermocouple power sensor.

[0040] A sensitivity-enhanced thermocouple power sensor includes the sensitivity-enhanced thermocouple power sensor chip described in the first embodiment.

[0041] The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention are intended to be within the scope of protection of the present invention.

Claims

1. A sensitivity-enhanced thermocouple power sensor chip, characterized in that: The invention comprises: a substrate, a thermopile is provided above the substrate, a coplanar waveguide is provided above the thermopile, a quartz dielectric sheet is provided above the coplanar waveguide, and the coplanar waveguide is connected to a load terminal; The thermopile comprises a plurality of thermocouples connected in series, and the thermopiles are symmetrically distributed around the load terminal; the hot ends of the thermocouples are placed near the thin film resistor and do not exceed the inner contour edge of the ground plate, and the cold ends of the thermocouples exceed the outer contour edge of the ground plate; A quartz dielectric sheet is provided above the coplanar waveguide to increase the heat flow path and thereby improve the sensitivity of the sensor; the edge of the quartz dielectric sheet covers the hot end of the thermocouple; The coplanar waveguide includes a central guide strip line and a ground plate, wherein the end of the central guide strip line is connected to a load terminal, and the coplanar waveguide and the load terminal are connected and impedance matched; the load terminal is a plurality of thin film resistors arranged in series; The grounding plate is provided with a plurality of grounding plate metal holes, which effectively increase the internal resistance of the thermocouple area and increase the temperature difference of the thermocouple power sensor chip.

2. The sensitivity-enhanced thermocouple power sensor chip according to claim 1, characterized in that: The coplanar waveguide is used as an input transmission line for the microwave and millimeter wave signals to be tested.

3. The sensitivity-enhanced thermocouple power sensor chip according to claim 1, characterized in that: The quartz dielectric plate is placed above the central guide strip line and is symmetrically arranged in the vertical direction along the axial direction of the central guide strip line of the coplanar waveguide.

4. A sensitivity-enhanced thermocouple power sensor, characterized in that: The invention comprises the sensitivity-enhanced thermocouple power sensor chip according to any one of claims 1 to 3.

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