High voltage assembly of a transformer, transformer and power plant

Abstract

The embodiment of the application discloses a high-voltage assembly of a transformer, the transformer and power equipment, the high-voltage assembly comprises a high-voltage coil, an insulator, a grounding structure and a grounding layer, the grounding structure comprises an embedded part and a connecting part which are interconnected, the embedded part is located inside the insulator, part of the surface of the embedded part is exposed and is used for fixing the grounding connecting part, the connecting part is located on the outer surface of the insulator and is connected with the grounding layer, the grounding layer covers the outer surfaces of the insulator and the connecting part, and the grounding layer, the connecting part, the embedded part and the grounding connecting part are sequentially electrically connected to form a grounding path. The high-voltage assembly provided by the embodiment of the application has a stable and reliable grounding path.

Description

Technical Field

[0001] This application relates to the technical field of transformer grounding, and more particularly to a high-voltage component of a transformer, a transformer, and power equipment. Background Technology

[0002] In transformer design, grounding design is a critical and challenging issue. For example, the high-voltage coil in a transformer is covered by an insulation layer. By spraying a grounding layer onto the outer surface of the insulation layer and electrically connecting it to the system ground, the high-voltage coil can be grounded. In this design, the stability and strength of the connection between the grounding layer and the insulation layer determine the reliability of the grounding structure. However, grounding layers sprayed onto the outer surface of the insulation layer only contact the outer surface, resulting in poor bonding stability between the grounding layer and the insulation layer. This can lead to the grounding layer detaching, reducing the reliability of the grounding structure. Summary of the Invention

[0003] This application provides a high-voltage component of a transformer, a transformer, and power equipment, which have a reliable grounding structure.

[0004] In a first aspect, embodiments of this application provide a high-voltage component of a transformer, including a high-voltage coil, an insulator, a grounding structure, and a grounding layer. The insulator covers the high-voltage coil. The grounding structure includes an embedded member and a connector, both of which are conductive. The embedded member and the high-voltage coil are isolated by the insulator. At least a portion of the embedded member is located inside the insulator, and a portion of the surface of the embedded member is exposed and used to fix a grounding connector. The connector is located on the outer surface of the insulator and is directly or indirectly connected to the embedded member. A portion of the grounding layer is connected to the surface of the connector away from the insulator, and a portion of the grounding layer is connected to at least a portion of the outer surface of the insulator. The grounding layer, the connector, the embedded member, and the grounding connector are sequentially electrically connected to form a grounding path.

[0005] The grounding path provided by this solution for high-voltage components establishes a reliable grounding connection, enhancing the safety of the high-voltage components. The specific analysis is as follows: The grounding layer is formed on the surface of the connector through electroplating or spraying to achieve electrical connection between the grounding layer and the connector. During the assembly and use of the high-voltage components, the connection between the grounding layer and the connector remains static; no external force is applied to this location. For example, no screw-like fixing components are used at this location. Therefore, the electrical connection structure between the grounding layer and the connector is not easily damaged, and open circuits are unlikely. The electrical connection between the grounding connector and the embedded component is a direct connection, independent of the grounding layer. Even if the grounding layer between the grounding connector and the embedded component is damaged and breaks, it will not affect the electrical connection between the grounding connector and the embedded component. Therefore, the grounding path of the high-voltage components is stable, and the risk of grounding failure is very low.

[0006] In one possible implementation, the embedding member includes a first end face and a side face facing different directions and adjacent to each other. The first end face is used to fix the grounding connector. The grounding structure also includes an intermediate member located inside the insulator and used to connect the side face and the connector. This solution provides a specific grounding structure architecture where the embedding member and the connector are connected through the intermediate member. This allows for more flexible placement of the connector on the outer surface of the insulator, making it adaptable to high-voltage components in different application scenarios.

[0007] In one possible implementation, the insert includes a first end face and a side face facing different directions and adjacent to each other. The first end face is used to fix the grounding connector. The side face includes a first region and a second region. The first region is connected between the second region and the first end face. The second region is located inside the insulator, and the first region is located outside the insulator and connected to the connector. The connector in the grounding structure provided by this solution is directly connected to the first region of the side face of the insert. For the grounding structure, its structure is simpler, making the manufacturing process of connecting the grounding structure and the insulator less complex and easily achieving lower manufacturing costs.

[0008] In one possible implementation, the surface of the connector facing away from the insulator is flush with and coplanar with the first end face. This can be understood as the outer surface of the connector and the first end face forming a planar structure or an arc-shaped surface, with a smooth transition between them without any steps. This solution, through the coplanar design of the outer surface of the connector and the first end face, makes the surface of the grounding structure exposed outside the insulator a seamless, integrated surface architecture. Placing the grounding layer on such a smooth surface makes the connection between the grounding layer and the grounding structure more reliable.

[0009] In one possible implementation, the insert includes a first end face, the connector includes a first connection area and a second connection area, the first connection area is connected to the first end face, the second connection area is connected to the outer surface of the insulator, and the grounding connector is connected to the first connection area. This solution provides a specific arrangement for the positional relationship between the connector and the insert. By connecting the first connection area of ​​the connector to the first end face of the insert, the insert can be fixed to the insulator first, and then the connector can be connected to the insert. After assembling the insert and the insulator, the first end face is the portion of the insert exposed on the surface of the insulator, making it easier to connect the connector to the first end face.

[0010] In one possible implementation, the first end face and the outer surface of the insulator used to connect the connector are flush and coplanar. This solution, by defining the positional relationship between the first end face and the outer surface of the insulator, allows the connector to have a flat plate structure, and the connection between the connector and the insulator has the advantages of simplicity and stability.

[0011] In one possible implementation, the second connection area is distributed on both sides of the first connection area; or, the second connection area is arranged around the first connection area. This solution provides two specific arrangement schemes for the connectors, offering a high degree of application flexibility. A suitable arrangement scheme can be selected based on the specific structural form of the high-voltage component.

[0012] In one possible implementation, the connector includes a cutout area, with a portion of the grounding layer located within the cutout area and connected to the insulator. This solution improves the stability of the connection between the connector and the grounding layer.

[0013] In one possible implementation, the connector is a mesh structure. The mesh structure of the connector helps to improve the stability of the connection between the connector and the grounding layer.

[0014] In one possible implementation, the insulator includes a main insulating portion and a protrusion. The main insulating portion covers the high-voltage coil and includes a top surface, a bottom surface, and a side surface connecting the top and bottom surfaces. The top surface faces the low-voltage coil of the transformer. The protrusion is projected onto the side surface, and at least a portion of the insert is located inside the protrusion. A portion of the surface of the insert used to connect the grounding connector faces the same direction as the top surface. This solution allows for miniaturization of the main insulating portion of the insulator, and a grounding structure is provided on the protrusion. The grounding structure does not affect the safety distance for isolation of the high-voltage coil, which is beneficial for ensuring the safety of the high-voltage components.

[0015] In one possible implementation, the connector is located on the outer surface and / or side of the protrusion. This solution provides different arrangement schemes for the connector of the grounding structure, allowing for selection of a suitable scheme according to specific application requirements, thus offering good flexibility.

[0016] In one possible implementation, the insulator includes a top surface, a bottom surface, and a side surface connected between the top and bottom surfaces. The top surface and / or the bottom surface faces the low-voltage coil of the transformer. The connector is located on the side surface, and the portion of the embedded member used to connect the grounding connector has the same orientation as the side surface. This solution simplifies the manufacturing process of the insulator. Since the outer surface of the main insulating part of the insulator has no protrusion structure, the process of setting the grounding layer on the outer surface of the main insulating part is also easy to control, which helps to improve the reliability of the connection between the grounding layer and the main insulating part.

[0017] In one possible implementation, the high-voltage coil includes a winding portion and a lead-out portion, which are arranged adjacent to each other in a first direction. The insulator includes a main insulating portion and a lead wire insulating portion, with the main insulating portion wrapping around the winding portion and the lead wire insulating portion wrapping around the lead-out portion. The grounding structure is located on the main insulating portion, and in the first direction, the grounding structure is located on the side of the winding portion away from the lead-out portion. For the transformer where the high-voltage assembly is located, the high-voltage component provided in this embodiment is suitable for application environments with sufficient installation space in the first direction.

[0018] In one possible implementation, the high-voltage coil includes a wound portion and a lead-out portion, which are arranged adjacent to each other in a first direction. The insulator includes a main insulating portion and a lead wire insulating portion, with the main insulating portion wrapping around the wound portion and the lead wire insulating portion wrapping around the lead-out portion. The grounding structure is located on the main insulating portion, and the grounding structure and the wound portion are spaced apart in a second direction, which forms an angle with the first direction. For the transformer where the high-voltage component is located, the high-voltage component provided by this solution is suitable for application environments with sufficient installation space in the second direction, and the size of the high-voltage component in the first direction can be controlled, making it easier to miniaturize the transformer in the first direction.

[0019] In one possible implementation, the portion connecting the grounding layer and the insulator has a perforated section, which is used to increase the resistance of the grounding layer. In other embodiments, the grounding layer is made of a conductive or semiconductor material, and the high-voltage coil is within the radiation range of the transformer's leakage flux. Thus, during operation of the high-voltage assembly, the grounding layer forms a closed grounding loop. The presence of the grounding layer reduces the additional losses generated by the induced electromotive force during transformer operation. The higher the resistivity of the material used in the grounding layer, the worse its potential confinement effect, but the smaller the losses caused by electromagnetic induction; conversely, the lower the resistivity of the material used in the grounding layer, the better its potential confinement effect, but the higher the losses caused by electromagnetic induction. Therefore, this application restricts the grounding layer to a semi-conductive material to balance losses and potential confinement effects.

[0020] In one possible implementation, the grounding layer is formed on the surfaces of the insulator and the connector by spraying or electroplating; alternatively, the grounding layer is a flexible strip with semi-conductive properties. This solution provides multiple grounding layer fabrication methods, offering high flexibility and allowing users to choose the appropriate solution based on specific needs.

[0021] In one possible implementation, the resistivity of the grounding structure is lower than the resistivity of the grounding layer. This approach helps ensure grounding stability.

[0022] Secondly, embodiments of this application provide a transformer, including a magnetic core and a high-voltage component as described in any possible implementation of the first aspect, wherein the high-voltage component is sleeved on a portion of the magnetic core. The transformer provided by this solution, due to having the high-voltage component provided in the first aspect, has a reliable high-voltage grounding path, which can ensure the safety and service life of the transformer.

[0023] In one possible implementation, the transformer includes a low-voltage coil, a shield, and a conductive cover. The low-voltage coil includes a first low-voltage coil and a second low-voltage coil. The shield includes a first shield and a second shield. The conductive cover includes a first conductive cover and a second conductive cover. The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first magnetic cover and the second magnetic cover. The first conductive cover, a portion of the first shield, the first magnetic cover, the first low-voltage coil, the high-voltage component, the second low-voltage coil, the second magnetic cover, a portion of the second shield, and the second conductive cover are sequentially stacked. The low-voltage coil and the high-voltage component surround the magnetic column. A portion of the first shield is located around the first magnetic cover and the first low-voltage coil. A portion of the second shield is located around the second magnetic cover and the second low-voltage coil. The conductive cover is used for grounding. The resistivity of the shield is higher than the resistivity of the conductive cover.

[0024] The transformer provided in this application isolates the high-voltage and low-voltage coils by insulating the high-voltage coil within the high-voltage assembly, facilitating miniaturization. The high-voltage coil grounding layer and structure ensure the outer surface of the high-voltage assembly is at ground potential, while shielding and conductive covers isolate and ground the low-voltage coil, achieving reliable grounding. Controlling the resistivity of the grounding layer and shielding (specifically, the grounding layer is a semi-conductive material, and the shielding is a mesh structure) reduces eddy current losses from the high-frequency magnetic field, improving transformer efficiency. Specifically, during transformer operation, varying magnetic flux is generated, consisting of main flux and leakage flux. The main flux is confined within the core for electromagnetic energy conversion, while leakage flux is scattered throughout the transformer system. The grounding layer and shielding on the high-voltage assembly surface induce voltages under the influence of this changing leakage flux, resulting in losses. Higher resistance values ​​in the grounding layer and shielding reduce eddy current losses; therefore, controlling the resistivity of the grounding layer and shielding reduces eddy current losses.

[0025] In one possible implementation, the transformer further includes a fixing component that is conductive. The fixing component is fixedly connected to the first conductive cover plate and the second conductive cover plate, and fixes the high-voltage component, the low-voltage coil, and the shielding component between the first and second conductive cover plates. This solution, through the use of the fixing component, achieves fixed connection of the various components of the transformer. Furthermore, the fixing component also serves to ground the low-voltage coil, resulting in a compact and simple overall structure for the transformer, which is beneficial for miniaturizing the transformer's size.

[0026] In one possible implementation, the first shielding member includes a first part and a second part. The first part is stacked between the first magnetic cover and the first conductive cover plate. The second part is connected to the edge of the first part and extends from the edge of the first part toward the high-voltage component. The second part is arranged around the periphery of the first magnetic cover and the first low-voltage coil. This solution, through the specific structural design of the second part and the first part of the second shielding member, allows the second shielding member to cover a larger area of ​​the second low-voltage coil, thereby improving the protective isolation effect on the low-voltage coil.

[0027] In one possible implementation, the second part includes a top edge, a bottom edge, a first side edge, and a second side edge. The top edge is connected to the first part, the bottom edge contacts the high-voltage component or forms a gap with the high-voltage component, and an opening is formed between the first side edge and the second side edge. The opening is at least used to accommodate the lead-out component of the first low-voltage coil. This solution, by setting the second part as an open-loop architecture, facilitates the installation of the low-voltage coil lead-out component through the opening, offering the advantage of flexible assembly.

[0028] In one possible implementation, the first shielding element includes a sheet-like body and a plurality of through holes disposed on the body. This solution, by providing through holes on the sheet-like body, can increase the resistance of the shielding element, which is beneficial for mitigating eddy current losses in the transformer.

[0029] In one possible implementation, the transformer includes a low-voltage coil, a shield, and a conductive cover. The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first and second magnetic covers. The high-voltage component and the low-voltage coil surround the magnetic column. The high-voltage component, the low-voltage coil, the first magnetic cover, a portion of the shield, and the conductive cover are stacked sequentially. A portion of the shield is located around the first magnetic cover and the low-voltage coil. The conductive cover is used for grounding, and the resistivity of the shield is higher than that of the conductive cover. This solution provides a specific transformer architecture. By setting an insulator in the high-voltage component and using the insulator to wrap the high-voltage coil, isolation between the high-voltage and low-voltage coils is achieved. The high-voltage coil grounding layer and grounding structure ensure that the potential of the outer surface of the high-voltage component is ground potential. The shield and conductive cover are used to isolate and ground the low-voltage coil, thus achieving reliable grounding of the transformer.

[0030] In one possible implementation, the grounding connector is connected between the insert and the conductive cover. This solution combines the grounding of the high-voltage components and the grounding of the low-voltage coil through the conductive cover. For transformers, the grounding structure design can save space and facilitate the miniaturization of transformer size.

[0031] In one possible implementation, the shielding component contacts the high-voltage assembly. This design, where the shielding component contacts the high-voltage assembly, connects the shielding component to the grounding layer of the high-voltage assembly, thus providing comprehensive isolation and protection for the low-voltage coil and improving transformer performance.

[0032] Thirdly, this application provides an embodiment of a power device including a high-voltage circuit, a low-voltage circuit, and a transformer connected between the high-voltage circuit and the low-voltage circuit. The transformer is the transformer described in any possible embodiment of the second aspect. Because the power device provided by this solution has the aforementioned transformer structure, the voltage conversion of the power device is more stable, and the performance and lifespan of the power device can be guaranteed.

[0033] Fourthly, embodiments of this application provide a transformer, including a magnetic core, a high-voltage assembly, a low-voltage coil, a shield, and a conductive cover. The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first magnetic cover and the second magnetic cover, which are disposed opposite to each other; the high-voltage assembly includes a high-voltage coil, an insulator, and a grounding layer, wherein the insulator covers the high-voltage coil, and the grounding layer covers at least a portion of the outer surface of the insulator; the low-voltage coil and the high-voltage assembly are stacked, and the low-voltage coil and the high-voltage assembly surround the magnetic column; the high-voltage assembly, the low-voltage coil, the first magnetic cover, a portion of the shield, and the conductive cover are stacked sequentially, wherein a portion of the shield is located around the first magnetic cover and the low-voltage coil, and the conductive cover is used for grounding, wherein the resistivity of the shield is higher than the resistivity of the conductive cover; the grounding layer of the high-voltage assembly is electrically connected to the conductive cover.

[0034] The transformer provided in this solution achieves isolation between the high-voltage and low-voltage coils by insulating the high-voltage components and wrapping the high-voltage coil with the insulator, which is beneficial for the miniaturization of the transformer design. The high-voltage coil grounding layer and grounding structure ensure that the outer surface of the high-voltage components is at ground potential, while shielding and conductive covers provide isolation and grounding for the low-voltage coils, thus achieving reliable grounding of the transformer. Attached Figure Description

[0035] Figure 1A This is a schematic diagram of a power equipment provided in one embodiment of this application;

[0036] Figure 1B yes Figure 1A A schematic diagram of a transformer provided in one possible implementation of the power equipment shown;

[0037] Figure 2A This is a perspective view of a high-voltage assembly provided in one embodiment of this application;

[0038] Figure 2B This is an exploded perspective view of a high-voltage component provided in one embodiment of this application;

[0039] Figure 3 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application;

[0040] Figure 4 This is a three-dimensional schematic diagram of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0041] Figure 5 It is a grounding structure for a high-voltage component in the existing technology;

[0042] Figure 6A This is a schematic diagram of an embedded part of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0043] Figure 6B yes Figure 6A A schematic diagram showing the assembly relationship between the insert and the insulator;

[0044] Figure 7A This is a schematic diagram of an embedded part of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0045] Figure 7B yes Figure 7A A schematic diagram showing the assembly relationship between the insert and the insulator;

[0046] Figure 8A This is a schematic diagram of an embedded part of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0047] Figure 8B yes Figure 8A A schematic diagram showing an assembly relationship between the insert and the insulator;

[0048] Figure 8C yes Figure 8A A schematic diagram showing another assembly relationship between the insert and the insulator;

[0049] Figure 9A This is a schematic diagram of the connection member of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0050] Figure 9B This is a schematic diagram of the connection member of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0051] Figure 9C This is a schematic diagram of the connection member of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0052] Figure 10 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application;

[0053] Figure 11 This is an exploded perspective view of a high-voltage component provided in one embodiment of this application;

[0054] Figure 12This is a schematic diagram of a high-voltage component provided in one embodiment of this application;

[0055] Figure 13 This is a three-dimensional schematic diagram of the grounding structure of a high-voltage component provided in one embodiment of this application;

[0056] Figure 14 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application;

[0057] Figure 15 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application;

[0058] Figure 16 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application;

[0059] Figure 17 This is a schematic diagram of the grounding layer of a high-voltage component provided in one embodiment of this application;

[0060] Figure 18 This is a perspective view of a transformer provided in one embodiment of this application;

[0061] Figure 19 This is a side view of a transformer provided in one embodiment of this application;

[0062] Figure 20 This is an exploded perspective view of a transformer provided in one embodiment of this application;

[0063] Figure 21 This is a schematic diagram of the second shielding component of a transformer provided in one embodiment of this application. Detailed Implementation

[0064] The embodiments of this application are described below with reference to the accompanying drawings.

[0065] Figure 1AThis is a schematic diagram of a power equipment provided in one embodiment of this application. The power equipment can be: a power electronic transformer, a DC microgrid, a DC microgrid device, a flexible power supply device, or a converter device. The power equipment includes a high-voltage circuit, a low-voltage circuit, and a transformer. The transformer is connected between the high-voltage circuit and the low-voltage circuit, used to achieve voltage step-up / step-down, impedance matching, and safety isolation. In one embodiment, the transformer provided in this application provides high-low voltage isolation and insulation in the power equipment. Specifically, the transformer includes a low-voltage coil, a high-voltage coil, and a magnetic core. The low-voltage coil is electrically connected to the low-voltage circuit, and the high-voltage coil is electrically connected to the high-voltage circuit. Through the interaction of the low-voltage coil, the high-voltage coil, and the magnetic core, energy conversion between the low-voltage circuit and the high-voltage circuit is achieved using the principle of electromagnetic induction. The high-voltage circuit and the low-voltage circuit described in this embodiment can be understood as two circuits with different voltages. The specific high-voltage range of the high-voltage circuit and the specific low-voltage range of the low-voltage circuit are not limited, as long as the voltage to ground of the high-voltage circuit is higher than that of the low-voltage circuit.

[0066] The power equipment provided in this application embodiment can be a power converter, which can be applied to various application fields such as new energy smart microgrids, power transmission and distribution, or new energy fields (such as photovoltaic grid connection or wind power grid connection), photovoltaic power generation (such as powering household appliances (such as refrigerators and air conditioners) or the power grid), or wind power generation, or high-power converter fields (such as converting DC power into high-power high-voltage AC power). The specific application can be determined according to the actual application scenario, and no restrictions are imposed here.

[0067] Figure 1B yes Figure 1A The diagram illustrates a possible embodiment of a transformer in a power device. The transformer includes a magnetic core 10, a high-voltage assembly 20, and a low-voltage assembly 30. The low-voltage assembly 30 is distributed on opposite sides of the high-voltage assembly 20, and the low-voltage assembly 30 and the high-voltage assembly 20 are stacked. The coil lead structure WH of the high-voltage assembly 20 is used for electrical connection to... Figure 1A In the high-voltage circuit, the coil lead structure WL of the low-voltage component 30 is used for electrical connection. Figure 1A The low-voltage circuit in the middle.

[0068] Figure 2A This is a three-dimensional assembly schematic diagram of the high-voltage component 20 of the transformer provided in one embodiment of this application. Figure 2B yes Figure 2A An exploded perspective view of the high-voltage assembly 20 of the transformer shown. (See attached diagram.) Figure 2B The high-voltage component 20 of the transformer includes a high-voltage coil 21, an insulator 22, a grounding structure 23, and a grounding layer 24.

[0069] In a specific embodiment, the high-voltage coil 21 is electrically connected to the high-voltage circuit and is composed of a multi-turn conductor coil. The high-voltage coil 21 includes a winding portion 211, a lead-out portion 212, a first terminal 213, and a second terminal 214. In one embodiment, the lead-out portion 212 includes a first lead segment 2121 and a second lead segment 2122, which are spaced apart and arranged on the same side of the winding portion 211. The winding portion 211 is connected in series between the first lead segment 2121 and the second lead segment 2122. The end of the first lead segment 2121 away from the winding portion 211 is connected to the second terminal 214, and the end of the second lead segment 2122 away from the winding portion 211 is connected to the first terminal 213. The winding portion 211 surrounds and forms two through holes H1, which are used to accommodate a portion of the magnetic core. In one embodiment, the winding portion 211 is figure-eight shaped, or the winding portion 211 includes two adjacent and side-by-side ring structures.

[0070] An insulator 22 encloses a high-voltage coil 21. Specifically, the winding portion 211 and the lead-out portion 212 of the high-voltage coil 21 are completely enclosed by the insulator 22. A portion of the second terminal 214 and a portion of the first terminal 213 are located within the insulator 22, while the portions of the second terminal 214 and the first terminal 213 extend out of the insulator 22 and are exposed. The exposed portions of the second terminal 214 and the first terminal 213 are used for electrical connection with a high-voltage circuit. In one embodiment, at the location of the through-hole H1 in the winding portion 211, the insulator 22 forms a mounting hole H2, which is used to accommodate a portion of the magnetic core.

[0071] By casting and encasing the high-voltage coil 21, the insulator 22 increases the stability of the connection between the high-voltage coil 21 and the insulator 22, reduces the risk of movement of the high-voltage coil 21 relative to the insulator 22, and thus increases the stability and safety of the transformer operation. The insulator 22, manufactured through casting or die-casting processes, has a lower risk of internal air cavities, ensuring its isolation effect. The material of the insulator 22 can be epoxy resin, insulating rubber, etc., and this application embodiment does not impose any special limitations on the material of the insulator 22.

[0072] Grounding layer 24 is located on the outer surface of insulator 22 to ground the high-voltage component 20, limiting the potential of the outer surface of insulator 22 to a low potential, such as the same potential as the system ground. The potential of grounding layer 24 is the potential of system ground, specifically a low potential, for example, the potential of grounding layer 24 is zero. By providing grounding layer 24 on the outer surface of insulator 22, the risk of air layer breakdown around the high-voltage component can be reduced, improving the safety of transformer operation. In one embodiment, grounding layer 24 is a semi-conductive layer.

[0073] The thickness of insulator 22 can be defined as the minimum distance between the outer surface of the high-voltage coil 21 and the outer surface of insulator 22. For high-voltage components, the voltage of the high-voltage circuit connected to the high-voltage coil 21 is high voltage, and the voltage difference between the high voltage and ground is M kilovolts (kV). When M≥1, the minimum thickness T of insulator 22 needs to satisfy: T≥0.3mm / kV.

[0074] To improve the grounding stability of high-voltage components, this application provides a grounding structure 23, which is made of conductive or semi-conductive material. Part of the grounding structure 23 is embedded inside an insulator 22, and another part is disposed on the outer surface of the insulator 22. A grounding layer 24 is connected to the portion of the grounding structure 23 located on the outer surface of the insulator 22, while the portion of the grounding structure 23 embedded inside the insulator 22 is electrically connected to the system ground via a grounding connector. Thus, the grounding layer 24, the portion of the grounding structure 23 on the outer surface of the insulator 22, the portion of the grounding structure 23 embedded inside the insulator 22, and the grounding connector are sequentially electrically connected to form the grounding path of the high-voltage component 20. During assembly or use, this grounding path is not subject to any loss; therefore, the high-voltage component 20 provided in this embodiment has a reliable grounding path. In summary, this application improves the grounding stability of the high-voltage component 20 by providing the grounding structure 23. The specific structure of the grounding structure 23 is described below.

[0075] Figure 3 This is a partial cross-sectional view of a high-voltage assembly provided in one embodiment of this application. Figure 4 This is a perspective view of the grounding structure of a high-voltage component provided in one embodiment of this application. (See also...) Figure 2A , Figure 2B , Figure 3 and Figure 4 The grounding structure 23 includes an embedded member 231 and a connector 232, both of which are conductive. The embedded member 231 and the high-voltage coil 21 are isolated by the insulator 22. At least a portion of the embedded member 231 is located inside the insulator 22, and a portion of the surface of the embedded member 231 is exposed and used to fix the grounding connector 90. The connector 232 is located on the outer surface of the insulator 22. The connector 232 is directly or indirectly connected to the embedded member 231. A direct connection means that there is no other connecting medium between the connector 232 and the embedded member 231; they are in contact and interconnected. An indirect connection means that there is a gap between the connector 232 and the embedded member 231, and they are connected between them by other connecting structures. Figure 3 and Figure 4In the illustrated embodiment, the connector 232 and the insert 231 are indirectly connected. The grounding structure 23 also includes an intermediate component 233, which is located inside the insulator 22 and connected between the connector 232 and the insert 231. A portion of the grounding layer 24 is connected to the surface of the connector 232 facing away from the insulator 22, and a portion of the grounding layer 24 is connected to at least a portion of the outer surface of the insulator 22. The grounding path of the high-voltage assembly 20 is achieved through the connection between the grounding layer 24 and the connector 232, the connection between the connector 232 and the insert 231, and the connection between the insert 231 and the grounding connector 90. Since the insert 231 of the grounding structure 23 is located inside the insulator 22, reliable grounding connections are formed between the connector 232 and the insert 231, and between the grounding layer 24 and the connector 232, thus improving the safety of the high-voltage assembly 20.

[0076] For the high-voltage assembly 20, a grounding path is formed from the grounding layer 24 to the grounding connector 90. The high-voltage assembly 20 provided in this application includes two grounding paths. The first grounding path is formed by the sequential electrical connection of the grounding layer 24 (the part of the grounding layer 24 covering the surface of the connector 232), the connector 232, the insert 231, and the grounding connector 90. The second grounding path is formed by the electrical connection of the grounding layer 24 (the part of the grounding layer 24 covering the part of the insert 231 exposed on the surface of the insulator 22) between the grounding connector 90 and the insert 231. For the second grounding path, during the process of fixing the grounding connector 90, external force acts on the grounding layer 24, which may damage the part of the grounding layer 24 covering the part of the insert 231 exposed on the surface of the insulator 22, causing the second grounding path to be broken. Even if the second grounding path is damaged, the high-voltage assembly 20 provided in this application still has the first grounding path. The first grounding path is not affected by external force during the assembly of the high-voltage assembly and the transformer, and is not easily damaged or failed.

[0077] Figure 5In a prior art grounding structure for a high-voltage component, an insulator 22' has a grounding layer 24' on its outer surface. The insulator 22' also has a protruding structure 221' for grounding, and its outer surface is covered by the grounding layer 24'. The protruding structure 221' has a grounding hole 222' for engaging with a fastener 25', which connects to a grounding connector. For example, the fastener 25' includes a bolt 251' and a nut 252'. During assembly, the bolt and nut are tightened using tools. After assembly, the grounding layer 24' between the bolt 251' and the insulator 22', the bolt 251', and the grounding connector are sequentially electrically connected to form a grounding path. During assembly, the grounding layer 24' on the outer surface of the grounding hole 222' is prone to breakage under tightening force. This breakage inevitably leads to a break in the grounding path, causing the high-voltage component grounding to fail.

[0078] contrast Figure 5 The grounding structure of the high-voltage component shown in this application embodiment has a significantly lower risk of grounding path failure. Specifically, see [link to relevant documentation]. Figure 2B and Figure 3 The grounding layer 24 is formed on the surface of the connector 232 by electroplating or spraying to achieve electrical connection between the grounding layer 24 and the connector 232. During the assembly and use of the high-voltage component 20, the connection between the grounding layer 24 and the connector 232 remains static; no external force is applied to this location. For example, no screw-like fixing components are used at this location. Therefore, the electrical connection structure between the grounding layer 24 and the connector 232 is not easily damaged, and open circuits are unlikely to occur. The electrical connection between the grounding connector 90 and the embedded part 231 is a direct connection, independent of the grounding layer 24. Even if the grounding layer 24 between the grounding connector 90 and the embedded part 231 is damaged and breaks, it will not affect the electrical connection between the grounding connector 90 and the embedded part 231. Therefore, the grounding path of the high-voltage component 20 is stable, and the risk of grounding failure is very low.

[0079] Figure 6A This is the structure of the insert 231 in one embodiment. Figure 6B for Figure 6A A schematic diagram showing the assembly relationship between the insert 231 and the insulator 22. (See attached diagram.) Figure 6A and Figure 6BIn this embodiment, the insert 231 has a three-segment structure, including a first segment 231A, a second segment 231B, and a third segment 231C. The second segment 231B connects the first segment 231A and the third segment 231C. The diameters of the first segment 231A and the third segment 231C are larger than the diameter of the second segment 231B. The second segment 231B is approximately cylindrical. The insert 231 includes a first end face S1, a second end face S2, and a side face S3. The first end face S1 is the surface of the first segment 231A facing away from the second segment 231B, and the second end face S2 is the surface of the third segment 231C facing away from the second segment 231B. The first end face S1 and the second end face S2 can be parallel to each other. The other surfaces of the first segment 231A except for the first end face S1, the outer surface of the second segment 231B, and the other surfaces of the third segment 231C except for the second end face S2 together constitute the side face S3. Figure 6B As shown, side surface S3 and second end surface S2 are located inside the insulator 22, and first end surface S1 is located on the outer surface of the insulator 22. In this embodiment, by designing the insert 231 as a three-section structure, the side surface S3 forms a concave structure, and the bonding surface between the insulator 22 and the insert 231 forms a bent and extended state, which can improve the bonding force between the insert 231 and the insulator 22.

[0080] In this embodiment, the insert 231 is provided with a mounting hole 2311. The opening of the mounting hole 2311 is located on the first end face S1, that is, the mounting hole 2311 extends from the first end face S1 into the insert 231. The mounting hole 2311 is used to fix the grounding connector 90. Specifically, the mounting hole 2311 can be a threaded hole, and the grounding connector 90 can be fixed by the cooperation of a screw and the mounting hole 2311 (see...). Figure 2A In other embodiments, the grounding connector 90 may have a threaded structure that directly mates with the threaded hole. In other embodiments, the grounding connector 90 may also be fixed to the insert 231 by welding or connected to the insert 231 by a snap-fit ​​mechanism. For example, a slot may be provided on the insert 231 and the grounding connector 90 may have a snap-fit ​​structure that mates with the slot.

[0081] The insert 231 includes a first end face S1 and a side face S3 facing different directions and adjacent to each other. The first end face S1 is used to fix the grounding connector 90. The grounding structure 23 also includes an intermediate member 233, which is connected between the side face S3 and the connector 232. This solution provides a specific architecture for the grounding structure 23. The insert 231 and the connector 232 are connected through the intermediate member 233, which allows for more flexible positioning of the connector 232 on the outer surface of the insulator 22, and can adapt to high-voltage components 20 in different application scenarios.

[0082] Figure 7AThis is the structure of the insert 231 in one embodiment. Figure 7B for Figure 7A A schematic diagram showing the assembly relationship between the insert 231 and the insulator 22. (See attached diagram.) Figure 7A and Figure 7B The insert 231 includes a first end face S1, a second end face S2, and a side face S3. The first end face S1 and the second end face S2 have equal areas. The first end face S1 is located on the outer surface of the insulator 22, and the second end face S2 and the side face S3 are located inside the insulator 22. The insert 231 is provided with a mounting hole 2311, the opening of which is located on the first end face S1. In this embodiment, the insert 231 is cylindrical, and the side face S3 has a cylindrical structure. This type of insert 231 can also be firmly bonded to the insulator 22, and has the advantages of simple structure and low manufacturing cost.

[0083] Figure 8A This is the structure of the insert 231 in one embodiment. Figure 8B for Figure 8A The diagram shows the assembly relationship between the insert 231 and the insulator 22. Figure 8C for Figure 8A This diagram illustrates another assembly relationship between the insert 231 and the insulator 22. The insert 231 is frustum-shaped and includes a first end face S1, a second end face S2, and a side face S3. The area of ​​the first end face S1 is larger than the area of ​​the second end face S2. The insert 231 has a through hole extending from the first end face S1 to the second end face S2. (See reference...) Figure 8A and Figure 8B In one assembly method, the first end face S1 is located on the outer surface of the insulator 22, while the second end face S2 and the side face S3 are located inside the insulator 22. This assembly method allows for the installation of the insert 231 into the insulator 22 after the insulator 22 has been cast onto the surface of the high-voltage coil 21, and the placement of the second end face S2 inside the insulator 22, offering the advantage of convenient assembly. (See reference...) Figure 8A and Figure 8C In another assembly method, the second end face S2 is located on the outer surface of the insulation, while the first end face S1 and the side face S3 are located inside the insulator 22. In this assembly method, the insert 231 can be cast into the interior of the insulator 22 during the insulation casting process, and then the second end face S2 can be exposed by mechanical processing. Since the area of ​​the first end face S1 is larger than that of the second end face S2, and the force of the insulator 22 on the side face S3 helps to fix the insert 231 in the insulator 22, the insert 231 is not easy to detach from the insulator 22. Therefore, this embodiment has the advantage of stable and firm bonding.

[0084] Figure 4In the illustrated embodiment, the connector 232 has a sheet-like structure and no holes or perforations are provided on it. In other embodiments, a perforated area can be provided on the connector 232. When the connector 232 is mounted on the surface of the insulator 22, a portion of the grounding layer 24 can be located within the perforated area and connected to the insulator 22. Alternatively, a portion of the insulator 22 can be located within the perforated area and connected to the connector 232. Therefore, this solution can increase the reliability of the connection between the connector 232 and the insulator 22, and between the grounding layer 24 and the connector 232 and the insulator 22.

[0085] See Figure 9A The connector 232 can be a mesh structure, which can be understood as being obtained by weaving metal wires or metal strips into a mesh. The through holes formed between the metal wires or metal strips are hollow areas.

[0086] See Figure 9B The connector 232 can be a sheet-like structure with multiple through holes forming a hollow area. In this embodiment, the hollow area is a circular through hole structure. In other embodiments, the shape of the through holes is not limited to a circle; it can also be other shapes, such as rectangles or triangles. Figure 9C As shown, the connector 232 has through holes of different shapes.

[0087] In one specific embodiment, the connector 232 is a flexible structure. The flexible connector 232 can form a gapless fit with the surface of the insulator 22, thereby improving the structural strength and stability.

[0088] See Figure 10 In one embodiment, the outer surface of the insulator 22 includes a first surface S5 and a second surface S6, the first surface S5 and the second surface S6 having different orientations (which can be understood as them not being coplanar), and the second surface S6 and the second surface S6 being adjacent to each other. The insert 231 includes a first end face S1 and a side face S3, the first end face S1 and the side face S3 being adjacent and having different orientations, the first end face S1 being located on the first surface S5 of the insulator 22, the side face S3 being located inside the insulator 22, and a connector 232 connecting the side face S3 of the insert 231 and the connector 232, the connector 232 being located on the second surface S6 of the insulator 22.

[0089] Figure 2BIn the illustrated embodiment, the insulator 22 includes a main insulating portion 221, a lead insulating portion 222, and a protrusion 223. The main insulating portion 221 covers the winding portion 211 of the high-voltage coil 21. The main insulating portion 221 includes a top surface S7, a bottom surface S8, and an insulating side surface S9 connecting the top surface S7 and the bottom surface S8. The top surface S7 faces the low-voltage coil of the transformer. The protrusion 223 protrudes from the insulating side surface S9. At least a portion of the insert 231 is located inside the protrusion 223. The surface (first end face S1) of the insert 231 used to connect the grounding connector 90 has the same orientation as the top surface S7. This solution can achieve miniaturization of the main insulating portion of the insulator. A grounding structure is provided on the protrusion. The grounding structure does not affect the safety distance of the high-voltage coil isolation, which is beneficial to ensuring the safety of the high-voltage components.

[0090] The connector 232 can be located on the outer surface of the protrusion 223, or on the insulating side surface S9 of the main insulating part 221. Alternatively, the connector 232 can be arranged on both the outer surface of the protrusion 223 and the insulating side surface S9 of the main insulating part 221. This solution provides different arrangement schemes for the grounding structure connector, allowing for selection of a suitable scheme based on specific application requirements, offering good flexibility. The lead insulation part 222 wraps around the lead-out portion 212 of the high-voltage coil 21. The main insulating part 221 and the lead insulation part 222 are arranged adjacent to each other in the first direction A1, and the protrusion 223 and the main insulating part 221 are arranged adjacent to each other in the second direction A2, forming an angle between the second direction A2 and the first direction A1. In this embodiment, the lead-out portion 212 and the winding portion 211 of the high-voltage coil 21 are arranged adjacent to each other in the first direction A1, and the grounding structure 23 and the winding portion 211 of the high-voltage coil 21 are spaced apart in the second direction A2. For the transformer where the high-voltage component 20 is located, the high-voltage component 20 provided by this solution is suitable for application environments with sufficient installation space in the second direction A2. The size of the high-voltage component 20 in the first direction A1 can be controlled, making it easy to miniaturize the size of the transformer in the first direction.

[0091] See Figure 11 , Figure 11 In the illustrated embodiment, the grounding structure 23 is disposed on the protrusion 223, and the surface of the insert 231 used to connect the grounding connector 90 and the top surface of the main insulating portion 221 have the same orientation. Compared to Figure 2BIn the illustrated embodiment, the specific position of the protrusion 223 is adjusted. In this embodiment, the lead insulation portion 222, the main body insulation portion 221, and the protrusion 223 are arranged sequentially along the first direction. The lead-out portion 212 and the winding portion 211 of the high-voltage coil 21 are arranged adjacent to each other in the first direction, and in the first direction, the grounding structure 23 is located on the side of the winding portion 211 away from the lead-out portion 212. It can be understood that the lead-out portion 212, the winding portion 211, and the grounding structure 23 are arranged sequentially in the first direction. For the transformer where the high-voltage assembly is located, the high-voltage component provided in this embodiment is suitable for application environments with sufficient installation space in the first direction.

[0092] In one embodiment of this application, by providing a protrusion 223 on the insulating side surface S9 of the main insulating part 221 of the insulator 22, and setting the grounding structure 23 at the position of the protrusion 223, the overall size of the insulator 22 can be minimized. The position of the protrusion 223 on the side surface S3 can be set according to the specific usage environment and assembly requirements, and this application does not limit it.

[0093] See Figure 12 , Figure 12 In the illustrated embodiment, the insulator 22 includes only the main insulating portion 221 and the lead insulating portion 222, and the insulating side surface S9 of the main insulating portion 221 does not have any protrusions 223. In this embodiment, the main insulating portion 221 includes a top surface S7, a bottom surface (on the opposite side of the top surface S7, not shown in the figure), and an insulating side surface S9 connecting the top surface S7 and the bottom surface. The grounding structure 23 is disposed on the main insulating portion 221. In a specific embodiment, the insert 231 of the grounding structure 23 includes a first end face S1, which is exposed on the insulating side surface S9 of the main insulating portion 221. The first end face S1 is used to fix the grounding connector 90. The connector 232 of the grounding structure 23 is directly connected to the insert 231, and the connector 232 is located on the insulating side surface S9 of the main insulating portion 221. The orientation of the first end face S1 is the same as the orientation of the insulating side surface S9 of the main insulating portion 221. This solution simplifies the manufacturing process of the insulating component. Since the outer surface of the main insulating part 221 of the insulating component does not have a protrusion 223 structure, the process of setting the grounding layer 24 on the outer surface of the main insulating part 221 is also easy to control, which helps to improve the reliability of the connection between the grounding layer 24 and the main insulating part 221.

[0094] See Figure 13In one embodiment, the insert 231 includes a first end face S1 and a side face S3 facing different directions and adjacent to each other. The first end face S1 is used to fix the grounding connector 90. Specifically, the first end face S1 is provided with a mounting hole 2311 for connecting the grounding connector 90. The side face S3 includes a first region S31 and a second region S32. The first region S31 is connected between the second region S32 and the first end face S1, and the connector 232 is connected to the first region S31. The positional relationship between the grounding structure 23 and the insulator 22 is as follows: the second region S32 is located inside the insulator 22, and the first region S31 is located outside the insulator 22. In one embodiment, the surface of the connector 232 facing away from the insulator 22 can be flush and coplanar with the first end face S1. It can be understood that the outer surface of the connector 232 and the first end face S1 can together form a planar structure or an arc-shaped surface, with a smooth transition between them without any step structure. This solution, through the coplanar design of the outer surface of the connector 232 and the first end face S1, makes the surface of the grounding structure exposed outside the insulator a smooth, integrated surface architecture. Setting the grounding layer on such a smooth surface makes the connection between the grounding layer 24 and the grounding structure 23 more reliable.

[0095] See Figure 14 In one embodiment, the connector 232 and the insert 231 are directly connected. The insert 231 is columnar and includes a first end face S1 and a side face S3. The side face S3 includes a first region S31 and a second region S32. The first region S31 is located between the second region S32 and the first end face S1. The second region S32 is located inside the insulator 22. The first region S31 extends out of the insulator 22, and the first end face S1 is located outside the insulator 22. The connector 232 is connected to the first region S31. The connector 232 includes an outer surface 2321, which is located on the outer surface of the insulator 22 and is not covered by the insulator 22. All surfaces of the connector 232 except its outer surface 2321 are connected to the insulator 22. The outer surface 2321 of the connector 232 is used to connect to the ground layer 24. In this embodiment, the first end face S1 and the outer surface 2321 of the connector 232 are not coplanar, that is, the first end face S1 and the outer surface 2321 of the connector 232 are connected by a portion of the side surface S3. The connector 232 in the grounding structure 23 provided by this solution is directly connected to the first area S31 of the side surface S3 of the embedded member 231. For the grounding structure 23, its structure is simpler, making the manufacturing process of connecting the grounding structure 23 and the insulator 22 less complicated and easier to achieve a lower manufacturing cost.

[0096] See Figure 15In one embodiment, the connector 232 is connected to the first end face S1 of the insert 231. Specifically, the connector 232 includes a first connection area 2322 and a second connection area 2323. The first connection area 2322 is connected to the first end face S1, and the second connection area 2323 is connected to the outer surface of the insulator 22. The grounding connector 90 is connected to the first connection area. The first end face S1 and the outer surface of the insulator 22 for connecting the connector 232 are flush and coplanar. This solution, by defining the positional relationship between the first end face S1 and the outer surface of the insulator 22, allows the connector 232 to be a flat plate structure, and the connection between the connector 232 and the insulator 22 has the advantages of simplicity and stability. Figure 15 In the illustrated embodiment, the second connection region 2323 is distributed on one side of the first connection region 2322. Other embodiments, such as... Figure 16 As shown, the second connection area 2323 can also be distributed on both sides of the first connection area 2322, or the second connection area 2323 can be arranged around the first connection area 2322. This solution provides two specific arrangement schemes for the connectors, offering a high degree of application freedom. A suitable arrangement scheme can be selected based on the specific structural form of the high-voltage component. This solution provides a specific arrangement scheme for the positional relationship between the connector 232 and the insert 231. Since the first connection area 2322 of the connector 232 is connected to the first end face S1 of the insert 231, the insert 231 can be fixed to the insulator 22 first, and then the connector 232 can be connected to the first end face S1. After assembling the insert 231 and the insulator 22, the first end face S1 is exposed on the surface of the insulator 22. In this case, it is easier to connect the connector 232 to the first end face S1, for example, by welding. The insert 231 can be integrally formed with the insulator 22, that is, the insert 231 is placed within the insulator during the casting process of the insulator 22.

[0097] Figure 14 , Figure 15 and Figure 16 In the embodiment shown, the portion of the insulator between the surface of the insert 231 facing away from the first end face S1 and the high-voltage coil 21 is the thinnest part of the insulator 22. It is necessary to ensure that the thickness of this portion of the insulator 22 is within a safe distance range (e.g., greater than or equal to 0.3 mm / KV).

[0098] Figure 14 , Figure 15 and Figure 16In the embodiments shown, the connector 232 can be an integral structure, which can be distributed on one side of the first end face S1 or arranged around the first end face S1; the connector 232 can also be a split structure, which includes multiple independent components, all of which are directly connected to the insert 231 and distributed around the first end face S1.

[0099] Figure 2B In the embodiment shown, the grounding layer 24 covers the entire area of ​​the main insulating portion 221 of the insulator 22, and no hole structure is provided on the grounding layer 24.

[0100] See Figure 17 In one embodiment, the grounding layer 24 is provided with a hollow portion 242. The hollow portion 242 is provided to increase the resistance of the grounding layer 24. In this embodiment, the grounding layer 24 forms a closed grounding loop around the insulator 22, so that the potential of the outer surface of the insulator 22 is the potential of ground, thereby realizing the reliability of the grounding of the high voltage component 20 and effectively reducing the partial discharge on the surface of the high voltage component 20.

[0101] The primary function of the grounding layer 24 is to surround the surface of the insulator 22, limiting the potential of the insulator 22 surface to a low potential. The grounding layer 24 is made of conductive or semiconductor material. The high-voltage coil 21 is within the radiation range of the transformer's leakage flux, thus forming a closed grounding loop during the operation of the high-voltage components. The presence of the grounding layer 24 reduces the additional losses generated by the induced electromotive force during transformer operation. Higher resistivity of the material used in the grounding layer 24 results in poorer potential limiting but lower losses due to electromagnetic induction; conversely, lower resistivity results in better potential limiting but higher losses due to electromagnetic induction. Therefore, this application limits the grounding layer 24 to a semi-conductive material to balance losses and potential limiting effects.

[0102] Specifically, the grounding layer 24 is formed on the surfaces of the insulator 22 and the connector 232 by spraying or electroplating. In other embodiments, the grounding layer 24 may also be a flexible strip with semi-conductive properties, which is wrapped around the outer surface of the insulator 22. The flexible strip may also be fixed to the outer surface of the insulator 22 by means of adhesive or other methods.

[0103] In one embodiment, the resistivity of the grounding structure 23 is lower than that of the grounding layer 24. The grounding layer 24 is a semi-conductive material, and its resistivity can be in the range of 0.01 Ω·cm to 100,000 Ω·cm, for example, 1,000 Ω·cm. For the grounding structure 23, its resistance value satisfies <1 ohm / cm length. The low resistivity of the grounding structure 23 ensures that the grounding resistance is as small as possible, which ensures good grounding protection and reliably pulls the potential of the semi-conductive layer down to the PE(0) potential. Conversely, if the resistance of the grounding structure 23 is too high, it may lead to poor grounding effect, causing the potential of the grounding layer 24 on the surface of the high-voltage component to be unstable and the insulation effect to be poor. In a specific application scenario, safety standards have requirements for grounding resistance, for example, <1 ohm / cm length.

[0104] This application, through the combination of the embedded part 231 of the grounding structure 23 and the insulator 22, and the connection of the connector 232 to the grounding layer 24, not only improves the structural stability of the grounding layer 24, but also realizes the reliability of the high-voltage component grounding, effectively reducing the partial discharge on the surface of the high-voltage component. The grounding layer 24 ensures that the potential of the outer surface of the high-voltage component in contact with air is zero, reducing the electric field strength between the high-voltage component and the low-voltage coil. It also reduces the voltage difference between the high-voltage component and the magnetic core, as well as the electric field strength in the air, thus reducing the risk of air breakdown between the high-voltage component and the low-voltage coil, and between the high-voltage component and the magnetic core, thereby improving the safety of the transformer.

[0105] Figure 18 This is a perspective view of a transformer 100 provided in one embodiment of this application. Figure 19 This is a side view of a transformer 100 provided according to one embodiment of this application. Figure 20 This is an exploded perspective view of a transformer 100 provided in one embodiment of this application.

[0106] See Figure 18 , Figure 19 and Figure 20 The transformer 100 includes a magnetic core 10, a high-voltage component 20, a low-voltage coil 31, a shield 32, a conductive cover plate 40, and a fixing component 50.

[0107] In one embodiment, the high-voltage component 20 may be the high-voltage component described in the foregoing embodiments.

[0108] In another embodiment, the high-voltage component 20 may also be different from the high-voltage component described in the foregoing embodiments. The high-voltage component includes a high-voltage coil, an insulator, and a grounding layer. The insulator covers the high-voltage coil, and the grounding layer covers at least a portion of the outer surface of the insulator so that the potential of the outer surface of the insulator is the potential of ground.

[0109] Both of these specific high-voltage components can be used in the transformers provided in the embodiments of this application, and can be used in combination with other components in the transformer.

[0110] The specific shape of the low-voltage coil 31 can be compared with... Figure 2B In the illustrated embodiments, the high-voltage coil 21 of the high-voltage assembly 20 has the same shape. For example, the low-voltage coil 31 includes a coil body 311 and a lead-out member 312. The coil body 311 forms two through holes H1 for assembling the magnetic core 10. The lead-out member 312 extends from the coil body 311 for connecting to the low-voltage circuit. Specifically, the coil body 311 of the low-voltage coil 31 can be constructed by winding a multi-turn conductor coil on a low-voltage frame. In one embodiment, there are two low-voltage coils 31: a first low-voltage coil 31A and a second low-voltage coil 31B. The first low-voltage coil 31A is located on one side of the top of the high-voltage assembly 20, and the second low-voltage coil 31B is located on one side of the bottom of the high-voltage assembly 20, i.e., the high-voltage assembly 20 is located between the first low-voltage coil 31A and the second low-voltage coil 31B. The first low-voltage coil 31A and the second low-voltage coil 31B can be connected in series or in parallel.

[0111] The magnetic core 10 includes a first magnetic cover 11, a second magnetic cover 12 disposed opposite to each other, and a magnetic post 13 connected between the first magnetic cover 11 and the second magnetic cover 12. The low-voltage coil 31 and the high-voltage assembly 20 are used to surround the magnetic post 13. In one embodiment, the magnetic core 10 has a two-piece structure. The magnetic post 13 includes a first post 131 and a second post 132. The first post 131 is connected to the first magnetic cover 11 to form a first magnetic element 10A, and the second post 132 is connected to the second magnetic cover 12 to form a second magnetic element 10B. The first magnetic element 10A and the second magnetic element 10B are joined together to form the magnetic core 10. Specifically, there are two magnetic posts 13, that is, two first posts 131 are connected to the first magnetic cover 11, and two second posts 132 are connected to the second magnetic cover 12. The first magnetic element 10A and the second magnetic element 10B have the same structure and size.

[0112] During assembly, the winding portion 211 of the high-voltage coil 21 of the high-voltage component 20 and the coil body 311 of the low-voltage coil 31 are stacked to form a coil assembly D. Specifically, the high-voltage component 20 is stacked between the first low-voltage coil 31A and the second low-voltage coil 31B. The mounting hole H2 on the insulator 22 of the high-voltage component 20 and the through hole H1 formed by the coil body 311 of the low-voltage coil 31 are connected and form an assembly through hole H12. The lead-out portion 212 of the high-voltage coil 21 and the lead-out portion 312 of the low-voltage coil 31 are respectively located on opposite sides of the coil assembly D to facilitate the wiring of the transformer with the high-voltage circuit and the low-voltage circuit, as well as the isolation between the high-voltage and low-voltage circuits. The first post 131 of the first magnetic component 10A extends into the assembly through hole H12 from one side of the coil assembly D, and the second post 132 of the second magnetic component 10B extends into the assembly through hole H12 from the other side of the coil assembly D. The first column 131 and the second column 132 can be connected and fixed, and a gap can also be maintained between the first column 131 and the second column 132. The first magnetic cover 11 is stacked on the side of the first low-voltage coil 31A away from the high-voltage component 20, and the second magnetic cover 12 is stacked on the side of the second low-voltage coil 31B away from the high-voltage component 20.

[0113] The shielding component 32 includes a first shielding component 32A and a second shielding component 32B, and the conductive cover plate 40 includes a first conductive cover plate 40A and a second conductive cover plate 40B.

[0114] The first shielding component 32A is assembled on the side of the first magnetic cover 11 away from the first low-voltage coil 31A. The first shielding component 32A covers a portion of the first magnetic cover 11 and the first low-voltage coil 31A. The first shielding component 32A and the second shielding component 32B have the same structure. For ease of description, the structure of the second shielding component 32B is described in detail using the second shielding component 32B as an example. The second shielding component 32B includes a first part 321 and a second part 322. The first part 321 is stacked between the second magnetic cover 12 and the second conductive cover plate 40B. The second part 322 is connected to the edge of the first part 321 and extends from the edge of the first part 321 toward the high-voltage assembly 20. The second part 322 is arranged around the periphery of the second magnetic cover 12 and the second low-voltage coil 31B. Through the specific structural design of the second part and the first part of the second shielding component 32B, this solution allows the second shielding component to cover a larger area of ​​the second low-voltage coil 31B, thereby improving the protective isolation effect on the low-voltage coil.

[0115] In one embodiment, the second portion 322 surrounds the second magnetic cover 12 and the second low-voltage coil 31B to form an open-loop structure. Specifically, the second portion 322 includes a top edge 3221, a bottom edge 3222, a first side edge 3223, and a second side edge 3224. The top edge 3221 is connected to the first portion 321, and the bottom edge 3222 contacts the high-voltage component 20 or forms a gap with the high-voltage component 20. An opening 323 is formed between the first side edge 3223 and the second side edge 3224, and the opening 323 is at least used to accommodate the lead-out of the second low-voltage coil 31B. This solution, by setting the second portion 322 as an open-loop structure and by providing the opening 323, facilitates the installation of the lead-out of the low-voltage coil, offering the advantage of flexible assembly.

[0116] The design of the shielding component in contact with the high-voltage component allows the shielding component and the high-voltage component to be connected to the grounding layer, thus providing comprehensive isolation and protection for the low-voltage coil and improving the performance of the transformer.

[0117] The top edge 3221 and the bottom edge 3222 are U-shaped or C-shaped, and a portion of the second magnetic cover 12 and a portion of the second low-voltage coil 31B are located in the opening 323. In one embodiment, the second portion 322 surrounds the second magnetic cover 12 and the second low-voltage coil 31B in a closed-loop structure, such as... Figure 21 As shown, the top edge 3221 and bottom edge 3222 of the second part 322 are both closed rings (circular, elliptical, oblong or rectangular). The second part 322 is provided with a lead wire protrusion hole 3225 for the lead wire of the low voltage coil to protrude.

[0118] In one specific embodiment, the first shielding member 32A includes a sheet-like body 325 and a plurality of through holes 326 disposed on the body. The shape of the through holes 326 can be circular, square, rhomboid, etc., and the maximum lateral or longitudinal dimension of the through holes 326 does not exceed 10 mm. The second shielding member 32B can have the same structure as the first shielding member 32A. This solution, by providing through holes on the sheet-like body, can increase the resistance of the shielding member, which is beneficial to improving the eddy current loss phenomenon of the transformer.

[0119] The first conductive cover plate 40A is located on the side of the first shielding member 32A away from the first magnetic cover 11, and the second conductive cover plate 40B is located on the side of the second shielding member 32B away from the second magnetic cover 12. The conductive cover plate 40 is used for grounding.

[0120] The resistivity of the shield 32 is higher than that of the conductive cover 40. In one embodiment, the area of ​​the first conductive cover 40A is smaller than the area of ​​the second conductive cover 40B. The second conductive cover 40B is used to install the transformer 100 into the power equipment, and the grounding structure 23 of the high-voltage component 20 is connected to the second conductive cover 40B through the grounding connector 90. Specifically, the grounding connector 90 can be a metal wire structure, one end of which is fixed to the insert 231 of the grounding structure 23 of the high-voltage component by screws, and the other end is fixed to the second conductive cover 40B by screws. The second conductive cover 40B is the element connecting the high-voltage component 20 and the system ground. This solution combines the grounding of the high-voltage component and the grounding of the low-voltage coil through the second conductive cover. For the transformer, the design of the grounding structure can save space in the transformer and is conducive to the miniaturization of the transformer size.

[0121] In summary, the first conductive cover plate 40A, part of the first shielding component 32A, the first magnetic cover 11, the first low-voltage coil 31A, the high-voltage component 20, the second low-voltage coil 31B, the second magnetic cover 12, part of the second shielding component 32B, and the second conductive cover plate 40B are stacked in sequence.

[0122] The fixing member 50 is conductive and can be made of metal. It is used to fix the first conductive cover plate 40A and the second conductive cover plate 40B, and to fix the high-voltage component 20, the low-voltage coil 31, and the shielding member 32 between them. This design, through the fixing member, achieves fixed connection of the various components of the transformer and also grounds the low-voltage coil, resulting in a compact and simple overall transformer structure, which is beneficial for miniaturizing the transformer. In one embodiment, the fixing member 50 is strip-shaped or ring-shaped. The high-voltage component 20, the low-voltage coil 31, the shielding member 32, and the conductive cover plate 40 are assembled to form a transformer module, and the fixing member 50 is wound around the periphery of the transformer module. In other embodiments, the fastener 50 may also be a bolt structure, with the bolt passing through the first conductive cover plate 40A and the second conductive cover plate 40B, and engaging with a nut to fix the high-voltage component 20, the low-voltage coil 31, and the shield 32 between the first conductive cover plate 40A and the second conductive cover plate 40B.

[0123] In other embodiments, the number of low-voltage coils 31 can also be one, so the number of shielding components 32 is also one, and the number of conductive cover plates 40 is two. The high-voltage component 20, the low-voltage coil 31 and the shielding component 32 are stacked sequentially between the two conductive cover plates 40.

[0124] The transformer 100 provided in this embodiment achieves reliable grounding by insulating the high-voltage coil 21 with an insulator 22 in the high-voltage component and wrapping the high-voltage coil 21 with the insulator 22, isolating the high-voltage coil 21 from the low-voltage coil 31, ensuring the potential of the outer surface of the high-voltage component 20 is grounded using the grounding layer 24 and grounding structure 23 of the high-voltage coil 21, and using the shielding component 32 and conductive cover plate 40 to isolate and ground the low-voltage coil 31. By controlling the resistivity of the grounding layer 24 and the shielding component 32 (specifically, the grounding layer 24 is a semi-conductive material and the shielding component is a mesh structure), the eddy current loss caused by the high-frequency magnetic field of the transformer 100 can be reduced, improving the working efficiency of the transformer 100. Specifically, during the operation of the transformer 100, a changing magnetic flux is generated, which is divided into main magnetic flux and leakage magnetic flux. The main magnetic flux is confined within the magnetic core for electromagnetic energy conversion, but the leakage magnetic flux is scattered throughout the transformer system. The structures of the grounding layer 24 and the shielding component 32 on the surface of the high-voltage component 20 will generate induced voltages under the influence of the magnetically changing leakage magnetic flux, thus causing losses. If the resistance of the grounding layer 24 and the shield 32 increases, the eddy current loss will decrease accordingly. Therefore, the eddy current loss can be reduced by controlling the resistivity of the grounding layer 24 and the shield 32.

[0125] The terms "first," "second," "third," "fourth," and various numerical designations used herein are merely for descriptive convenience and are not intended to limit the scope of this application.

[0126] It should be understood that in the various embodiments of this application, the order of the above-mentioned processes does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0127] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A high-voltage component of a transformer, characterized in that, include: High-voltage coil; An insulator is used to cover the high-voltage coil; A grounding structure includes an embedded member and a connector, both of which are conductive. The embedded member and the high-voltage coil are isolated by the insulator. At least a portion of the embedded member is located inside the insulator. A portion of the surface of the embedded member is exposed and used to fix the grounding connector. The connector is located on the outer surface of the insulator and is directly or indirectly connected to the embedded member. and A grounding layer, a portion of which is connected to the surface of the connector opposite to the insulator, and a portion of which is connected to at least a portion of the outer surface of the insulator; The grounding layer, the connector, the embedded part, and the grounding connector are electrically connected in sequence to form a grounding path.

2. The high-voltage component of the transformer as described in claim 1, characterized in that, The insert includes a first end face and a side face that are oriented differently and adjacent to each other. The first end face is used to fix the grounding connector. The grounding structure also includes an intermediate member located inside the insulator and used to connect the side face and the connector.

3. The high-voltage component of the transformer as described in claim 1, characterized in that, The insert includes a first end face and a side face that are oriented differently and adjacent to each other. The first end face is used to fix the grounding connector. The side face includes a first region and a second region. The first region is connected between the second region and the first end face. The second region is located inside the insulator. The first region is located outside the insulator and is connected to the connector.

4. The high-voltage component of the transformer as described in claim 3, characterized in that, The surface of the connector facing away from the insulator is flush with and coplanar with the first end face.

5. The high-voltage component of the transformer as described in claim 1, characterized in that, The insert includes a first end face, the connector includes a first connection area and a second connection area, the first connection area is connected to the first end face, the second connection area is connected to the outer surface of the insulator, and the grounding connector is connected to the first connection area.

6. The high-voltage component of the transformer as described in claim 5, characterized in that, The first end face and the outer surface of the insulator used to connect the connector are flush and coplanar.

7. The high-voltage component of the transformer as described in claim 5, characterized in that, The second connection area is distributed on both sides of the first connection area; or, the second connection area is arranged around the first connection area.

8. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The connector includes a hollow area, and a portion of the grounding layer is located within the hollow area and connected to the insulator.

9. The high-voltage component of the transformer as described in claim 8, characterized in that, The connector has a mesh structure.

10. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The insulator includes a main insulating portion and a protrusion. The main insulating portion covers the high-voltage coil. The main insulating portion includes a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface. The top surface faces the low-voltage coil of the transformer. The protrusion is projected onto the side surface. At least a portion of the insert is located inside the protrusion. A portion of the surface of the insert used to connect the grounding connector has the same orientation as the top surface.

11. The high-voltage component of the transformer as described in claim 10, characterized in that, The connector is located on the outer surface and / or the side of the protrusion.

12. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The insulator includes a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, the top surface and / or the bottom surface being oriented toward the low-voltage coil of the transformer, the connector being located on the side surface, and a portion of the surface of the insert for connecting the grounding connector having the same orientation as the side surface.

13. The high-voltage component of the transformer as described in claim 10, characterized in that, The high-voltage coil includes a winding portion and a lead-out portion, which are arranged adjacent to each other in a first direction. The insulator includes a main insulating portion and a lead wire insulating portion, which wraps around the winding portion and the lead wire insulating portion wraps around the lead-out portion. The grounding structure is located on the main insulating portion, and in the first direction, the grounding structure is located on the side of the winding portion away from the lead-out portion.

14. The high-voltage component of the transformer as described in claim 10, characterized in that, The high-voltage coil includes a winding portion and a lead-out portion, which are arranged adjacent to each other in a first direction. The insulator includes a main insulating portion and a lead wire insulating portion, which wraps around the winding portion and the lead wire insulating portion wraps around the lead-out portion. The grounding structure is located on the main insulating portion, and the grounding structure and the winding portion are spaced apart in a second direction, which is at an angle to the first direction.

15. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The portion where the grounding layer and the insulator are connected has a cutout, which is used to increase the resistance of the grounding layer.

16. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The grounding layer is formed on the surface of the insulator and the connector by spraying or electroplating; or, the grounding layer is a flexible strip with semi-conductive properties.

17. The high-voltage component of the transformer as described in any one of claims 1-7, characterized in that, The resistivity of the grounding structure is lower than that of the grounding layer.

18. A transformer, characterized in that, It includes a magnetic core and a high-voltage assembly as described in any one of claims 1-17, wherein the high-voltage assembly is fitted onto a portion of the magnetic core.

19. The transformer as described in claim 18, characterized in that, The transformer includes a low-voltage coil, a shield, and a conductive cover. The low-voltage coil includes a first low-voltage coil and a second low-voltage coil. The shield includes a first shield and a second shield. The conductive cover includes a first conductive cover and a second conductive cover. The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first magnetic cover and the second magnetic cover. The first conductive cover, a portion of the first shield, the first magnetic cover, the first low-voltage coil, the high-voltage component, the second low-voltage coil, the second magnetic cover, a portion of the second shield, and the second conductive cover are stacked sequentially. The low-voltage coil and the high-voltage component surround the magnetic column. A portion of the first shield is located around the first magnetic cover and the first low-voltage coil. A portion of the second shield is located around the second magnetic cover and the second low-voltage coil. The conductive cover is used for grounding. The resistivity of the shield is higher than that of the conductive cover.

20. The transformer as described in claim 19, characterized in that, The transformer also includes a fixing component that is conductive. The fixing component is fixedly connected to the first conductive cover plate and the second conductive cover plate, and fixes the high-voltage component, the low-voltage coil and the shielding component between the first conductive cover plate and the second conductive cover plate.

21. The transformer as described in claim 19 or 20, characterized in that, The first shielding component includes a first part and a second part. The first part is stacked between the first magnetic cover and the first conductive cover plate. The second part is connected to the edge of the first part and extends from the edge of the first part toward the high voltage component. The second part is arranged around the periphery of the first magnetic cover and the first low voltage coil.

22. The transformer as described in claim 21, characterized in that, The second part includes a top edge, a bottom edge, a first side edge, and a second side edge. The top edge is connected to the first part. The bottom edge contacts the high-voltage component or forms a gap with the high-voltage component. An opening is formed between the first side edge and the second side edge. The opening is at least used to accommodate the lead-out of the first low-voltage coil.

23. The transformer as described in claim 19 or 20, characterized in that, The first shielding component includes a sheet-like body and a plurality of through holes provided on the body.

24. The transformer as described in any one of claims 18-20, characterized in that, The transformer includes a low-voltage coil, a shield, and a conductive cover. The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first magnetic cover and the second magnetic cover. The high-voltage component and the low-voltage coil surround the magnetic column. The high-voltage component, the low-voltage coil, the first magnetic cover, a portion of the shield, and the conductive cover are stacked sequentially. A portion of the shield is located around the first magnetic cover and the low-voltage coil. The conductive cover is used for grounding. The resistivity of the shield is higher than that of the conductive cover.

25. The transformer as described in claim 19 or 20, characterized in that, The grounding connector is connected between the insert and the conductive cover.

26. The transformer as described in claim 19 or 20, characterized in that, The shielding component contacts the high-voltage assembly.

27. An electrical device, characterized in that, It includes a high-voltage circuit, a low-voltage circuit, and a transformer as described in any one of claims 18-26 connected between the high-voltage circuit and the low-voltage circuit.

28. A transformer, characterized in that, include: The magnetic core includes a first magnetic cover, a second magnetic cover, and a magnetic column connected between the first magnetic cover and the second magnetic cover, which are disposed opposite to each other. The high-voltage assembly as claimed in any one of claims 1-17, wherein the grounding layer covers at least a portion of the outer surface of the insulator; A low-voltage coil and the high-voltage component are stacked together, with the low-voltage coil and the high-voltage component surrounding the magnetic column; The shielding component and conductive cover plate are arranged in sequence, including the high-voltage component, the low-voltage coil, the first magnetic cover, a portion of the shielding component and the conductive cover plate, with the portion of the shielding component located around the first magnetic cover and the low-voltage coil. The conductive cover plate is used for grounding, and the resistivity of the shielding component is higher than that of the conductive cover plate. The grounding layer of the high-voltage component is electrically connected to the conductive cover plate.

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