Foldable electronic device

Abstract

A foldable electronic device is provided. The foldable electronic device includes a hinge structure, a foldable housing, a flexible display disposed inside the foldable housing, a first flexible connection member, a second flexible connection member, an adhesive member attached to the first flexible connection member. The foldable housing includes a first housing structure and a second housing structure. The first housing structure includes a first surface, a second surface, and a first printed circuit board. The second housing structure includes a third surface, a fourth surface, and a second printed circuit board.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to a flexible circuit board disposed in a foldable electronic device. BACKGROUND

[0002] As the degree of integration of electronic devices has increased and ultra-high speed and large capacity radio frequency (RF) communication has become common, recently it has become to provide a plurality of functions in a single electronic device such as a mobile communication terminal. For example, various functions such as an entertainment function (e.g., a game function), a multimedia function (e.g., a music / video reproduction function), a communication and security function for mobile banking, a dispatch management function, an electronic wallet function, and a communication function can be integrated in a single electronic device. In addition, electronic devices are increasingly equipped with wider display panels so that users have less inconvenience in using multimedia services.

[0003] Recently, a foldable electronic device having a flexible display panel has been developed. The foldable electronic device can refer to an electronic device including a plurality of housing structures that rotate with respect to each other.

[0004] A circuit board disposed in an electronic device can be classified into a rigid circuit board and a flexible circuit board according to physical characteristics related to flexibility. A rigid-flexible circuit board (hereinafter referred to as a "flexible circuit board") in which a rigid circuit board and a flexible circuit board are combined can be provided in order to increase reliability of electrical connection of an electronic device and implement three-dimensional wiring.

[0005] Because of the commercialization of a fourth generation (4G) communication system, in order to meet the increasing demand for wireless data traffic, a fifth generation computer (5G) communication system has been actively developed and released. In order to achieve a high data rate, the 5G communication system uses several tens of gigahertz (GHz) or higher ultra-high frequencies (or referred to as "millimeter wave communication"). However, in an electronic device including an ultra-high frequency communication module, the performance exhibited by the communication module can be affected by a path (e.g., a wiring) through which a communication signal is transmitted due to high frequency characteristics.

[0006] Therefore, for a foldable electronic device, it can be necessary to provide a flexible circuit board capable of preventing degradation of RF characteristics of a signal. SUMMARY

[0007] TECHNICAL PROBLEM

[0008] In an electronic device, various electronic elements (or electronic components) and printed circuit boards on which various electronic elements are mounted can be disposed inside a cradle on which the components are mounted. In the case of a foldable electronic device, the electronic elements and the printed circuit boards can be individually disposed in a plurality of housing structures based on various factors such as a space for installation, communication performance, and heat dissipation performance. A flexible circuit board that is easily bendable can be used to connect the electronic elements.

[0009] Because at least a portion of the flexible circuit board is flexibly bendable, the flexible circuit board can be highly utilized in a narrow space and is suitable for use in a configuration in which electronic elements contained inside a housing structure are connected. However, aspects of durability and lifespan can need to be additionally considered.

[0010] According to some embodiments, when the foldable electronic device is repeatedly folded and unfolded, stress caused by frictional force with the housing, the components, or another board is accumulated in the bent portion of the flexible circuit board, which can result in damage.

[0011] In addition, according to some embodiments, when the bent portion of the flexible circuit board moves within a designated area (i.e., when a designated shape of the bent portion is not maintained), the shape (and / or position) of the bent portion can not be able to be invariably maintained. In addition, the designated shape of the bent portion can be deformed during repeated use of the foldable electronic device, and thus the lifespan can be shortened.

[0012] When the foldable electronic device is equipped with an ultra-high frequency communication module (e.g., ultra-high communication in the range of 6 GHz or more and less than 100 GHz), for example, when a flexible circuit board including an RF signal line is included, because the flexible circuit board designed in consideration of RF characteristics is formed to have a narrower width than a board including a general signal line, it can be difficult to maintain the designated shape of the bent portion. In addition, when the designated shape of the bent portion is deformed without being maintained, the impedance of the flexible circuit board including the RF signal line can change, resulting in a decrease in RF characteristics and an increase in signal loss.

[0013] Various embodiments of the disclosure are capable of providing a foldable electronic device that is capable of maintaining the shape of a flexible circuit board even when the foldable electronic device is repeatedly folded and unfolded, so that damage to the flexible circuit board, a decrease in the lifespan of the flexible circuit board, and deterioration of RF characteristics of the flexible circuit board can be prevented.

[0014] Solution to the problem

[0015] In accordance with an aspect of the disclosure, a foldable electronic device is provided. The foldable electronic device includes a hinge structure; a foldable housing including a folding area in which the electronic device is substantially folded with respect to a folding axis, the foldable housing including a first housing structure connected to the hinge structure, the first housing structure including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a first printed circuit board on which a plurality of electronic components are mounted; and a second housing structure connected to the hinge structure, the second housing structure including a third surface facing a third direction, a fourth surface facing a fourth direction opposite to the third direction, and a second printed circuit board on which a plurality of electronic components are mounted, the second housing structure being folded with respect to the first housing structure about the hinge structure; a flexible display disposed inside the foldable housing and extending from the first surface of the first housing structure to the third surface of the second housing structure; a first flexible connection member placed across at least a portion of an inside of the first housing structure and at least a portion of an inside of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends disposed at opposite ends of the first flexible connection member, the first flexible connection member including a wiring configured to transmit a communication signal including an RF signal; a second flexible connection member placed across at least a portion of an inside of the first housing structure and at least a portion of an inside of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends disposed at opposite ends of the second flexible connection member, the second flexible connection member including a power line; and an adhesive member attached to the first flexible connection member so as to maintain the first flexible connection member in a specified area without changing its shape when the foldable housing is folded and unfolded.

[0016] According to another aspect of the disclosure, a foldable electronic device is provided. The foldable electronic device includes a hinge structure; a foldable housing including a folding area in which the electronic device is substantially folded with respect to a folding axis, the foldable housing including a first housing structure connected to the hinge structure, the first housing structure including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and a first printed circuit board on which a plurality of electronic components are mounted; and a second housing structure connected to the hinge structure, the second housing structure including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction, and a second printed circuit board on which a plurality of electronic components are mounted, the second housing structure being configured to be foldable with respect to the first housing structure about the hinge structure, wherein, in a folded state, the first surface faces the third surface, and in an unfolded state, the third direction is the same as the first direction; a flexible display disposed inside the foldable housing and extending from the first surface of the first housing structure to the third surface of the second housing structure; and a multi-layered flexible connection member placed across at least a portion of an interior of the first housing structure and at least a portion of an interior of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends disposed at opposite ends of the multi-layered flexible connection member, wherein one or more slits are formed in a portion of the multi-layered flexible connection member corresponding to the hinge structure.

[0017] Advantages of the Invention

[0018] According to various embodiments of the disclosure, a specified shape of a bent portion of a flexible connection member can be maintained within a specified area by providing an adhesive member.

[0019] According to various embodiments of the disclosure, a specified shape of a bent portion of each of flexible connection members can be maintained within a specified area by providing an adhesive member connecting at least two different flexible connection members.

[0020] According to various embodiments of the disclosure, a bent portion of a flexible connection member can be more uniformly bent by additionally providing one or more slits in an adhesive member.

[0021] According to various embodiments of the disclosure, a bent portion of a flexible connection member can be more uniformly bent by providing one or more slits in the flexible member itself.

[0022] According to various embodiments of the present disclosure, a designated shape of a bending portion of a flexible connection member can be maintained by applying an adhesive member or one or more gaps not only to one surface (e.g., the uppermost layer) of the flexible connection member but also to the other surface (e.g., the lowermost layer) of the flexible connection member.

[0023] Accordingly, the lifespan of the flexible connection member and the foldable electronic device including the same can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above and other aspects, features, and advantages of certain embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0025] Figure 1 is a block diagram of an electronic device according to an embodiment;

[0026] Figure 2 is a view showing a state in which an electronic device according to an embodiment is unfolded;

[0027] Figure 3A is a cross-sectional view showing a state in which a display portion of an electronic device according to an embodiment is completely unfolded;

[0028] Figure 3B is a cross-sectional view showing an intermediate state in which a display portion of an electronic device according to an embodiment is partially unfolded;

[0029] Figure 4 is an exploded perspective view of an electronic device according to an embodiment;

[0030] Figure 5 is a view showing a portion of an inside of an electronic device according to an embodiment;

[0031] Figure 6 is a view showing a state in which a hinge structure is removed in the embodiment shown in Figure 5

[0032] Figure 7 is a cross-sectional view showing a hinge structure and a flexible connection member in a state in which an electronic device is unfolded according to an embodiment;

[0033] Figure 8 is a cross-sectional view showing a hinge structure and a flexible connection member in a state in which an electronic device is folded according to an embodiment;

[0034] Figure 9 is a view showing a designated shape of a flexible connection member in a state in which an electronic device is unfolded according to an embodiment;

[0035] Figure 10 ​is a view showing a flexible connection member according to an embodiment;

[0036] Figure 11 is a view showing a flexible connection member and an adhesive member according to an embodiment;

[0037] Figure 12 is a view showing a flexible connection member and an adhesive member according to an embodiment;

[0038] Figure 13 is a view showing a state in which one or more slits are formed in an adhesive member according to an embodiment;

[0039] Figure 14 is a view showing a state in which a flexible connection member and an adhesive member are coupled to each other according to an embodiment;

[0040] Figure 15A is a view showing a shape of one or more slits according to an embodiment;

[0041] Figure 15B is a view showing a shape of one or more slits according to an embodiment;

[0042] Figure 15C is a view showing a shape of one or more slits according to an embodiment;

[0043] Figure 15D is a view showing a shape of one or more slits according to an embodiment;

[0044] Figure 15E is a view showing a shape of one or more slits according to an embodiment;

[0045] Figure 16 is a view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment;

[0046] Figure 17 is a conceptual view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment;

[0047] Figure 18A is a view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment; Figure 17 is a sectional view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment shown in FIG. 1;

[0048] Figure 18B is a sectional view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment;

[0049] Figure 19is a view showing a flexible connection member and one or more slits formed in the flexible connection member according to an embodiment;

[0050] Figure 20 is a view illustrating a state in which a prescribed shape of a flexible connection member is maintained when a foldable electronic device is unfolded according to an embodiment;

[0051] Figure 21 is a view illustrating a state in which a prescribed shape of a flexible connection member is maintained when a foldable electronic device is unfolded according to an embodiment;

[0052] Figure 22 is a view illustrating a state in which a prescribed shape of a flexible connection member is maintained when a foldable electronic device is unfolded according to an embodiment. DETAILED DESCRIPTION

[0053] Hereinafter, various embodiments of the present disclosure are described with reference to the accompanying drawings. However, the various embodiments of the present disclosure are not limited to specific embodiments, and it should be understood that modifications, equivalents, and / or substitutions of the embodiments described herein can be made variably. With respect to the description of the accompanying drawings, similar components may be marked with similar reference numerals.

[0054] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0055] Reference Figure 1 , the electronic device 101 in the network environment 100 can communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented as embedded in the display device 160 (eg, a display).

[0056] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 and can perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 620 can load a command or data received from another component (e.g., the sensor module 176 or the communication module 190) to a volatile memory 132, process the command or the data stored in the volatile memory 132, and store resulting data in a non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. Additionally, or alternatively, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or to be specific to a specified function. The auxiliary processor 123 can be implemented as separate from, or as part of the main processor 121.

[0057] The auxiliary processor 123, for example, when the main processor 121 is in an inactive (e.g., sleep) state, can control at least some of the functions or states related to the state of at least one component (e.g., the display device 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, not the main processor 121, or together with the main processor 121, when the main processor 121 is in an active (e.g., execution of an application) state. According to an embodiment, the auxiliary processor 123 (e.g., an ISP or a CP) can be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123.

[0058] The memory 130 can store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (e.g., a program 140) and input data or output data for a command related thereto. The memory 130 can include the volatile memory 132 or the non-volatile memory 134.

[0059] The program 140 can be stored in the memory 130 as software, and can include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0060] The input device 150 can receive a command or data to be used by the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input device 150 can include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0061] The sound output device 155 can output sound signals to the outside of the electronic device 101. The sound output device 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record, and the receiver can be used for incoming calls. According to an embodiment, the receiver can be implemented as separate from, or as part of the speaker.

[0062] The display device 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display device 160 can include, for example, a display, a hologram device, or a projector and control circuitry to control a corresponding one of them. According to an embodiment, the display device 160 can include a touch circuitry adapted to detect a touch, or a sensor circuitry (e.g., a pressure sensor) adapted to measure the intensity of force incurred by the touch.

[0063] The audio module 170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain the sound via the input device 150, or output the sound via the sound output device 155 or an external electronic device (e.g., an electronic device 102 (e.g., a speaker or a headphone)) directly or wirelessly coupled with the electronic device 101.

[0064] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] The interface 177 can support one or more specified protocols to be used for the direct wired or wireless connection between the electronic device 101 and the external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0066] The connection terminal 178 can include a connector through which the electronic device 101 can be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0067] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., a vibration or a movement) or electrical stimuli that can be recognized by users through their tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0068] The camera module 180 can capture still images and moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, ISPs, or flashes.

[0069] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0070] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0071] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication between the established communication channel. The communication module 190 can include one or more communication processors that are operable independently from the processor 120 (e.g., an AP) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device, via a first network 198 (e.g., a short-range communication network, such as BluetoothTM, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network, such as a cellular network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip), or can be implemented as separate components (e.g., separate chips) from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0072] The antenna module 197 can transmit or receive a signal or power to or from an external electronic device (e.g., an external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 197 can include a plurality of antennas. In this case, at least one antenna appropriate for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190. Then communication between the communication module 190 and an external electronic device can be supported by using the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element can be additionally formed as part of the antenna module 197.

[0073] At least some of the above-described components can be coupled via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)), and communicate signals (e.g., commands or data) between them.

[0074] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 and 104 can be a device of a same type as or different from the electronic device 101. According to an embodiment, some or all of the operations to be performed by the electronic device 101 can be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 is to automatically perform a function or a service or is to perform a function or a service in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request the one or more external electronic devices to perform at least a part of the function or the service. The one or more external electronic devices receiving the request can execute the at least a part of the requested function or service, or perform another function or service related to the request, and transfer a result of the execution to the electronic device 101. The electronic device 101 can provide the result, with or without further processing of the result, as a part of a reply corresponding to the request. To that end, a cloud computing, distributed computing, or client-server computing technology can be used, for example.

[0075] Figure 2 FIG. 1A is a view illustrating a state in which the electronic device 101 according to an embodiment is unfolded. Figure 2 FIG. 1B illustrates a front surface, a rear surface, and side surfaces of the electronic device 101. Figure 3A FIG. 1C is a cross-sectional view illustrating a state in which a display portion 101 of an electronic device according to an embodiment is completely unfolded. Figure 3B FIG. 1D is a cross-sectional view illustrating an intermediate state in which the display portion 101 of the electronic device according to an embodiment is partially unfolded.

[0076] Referring to FIG. 1A, Figure 2 The electronic device 101 includes a foldable housing 300 and a flexible or foldable display 200 disposed in a space defined by the foldable housing 300.

[0077] The surface on which the display 200 is disposed can be a front surface of the electronic device 101. At least a portion of the front surface of the electronic device 101 can be substantially a transparent front plate (e.g., a glass plate or a polymeric plate including various coating layers). A surface opposite to the front surface can be a rear surface of the electronic device 101. The rear surface of the electronic device 101 can be substantially an opaque rear plate or a rear cover. The rear cover can be formed of, for example, a coated film glass or a colored glass, a ceramic, a polymer, a metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. In addition, a surface surrounding a space between the front surface and the rear surface can be a side surface of the electronic device 101. The side surface can be a side bezel structure or a side member that is coupled to the front plate and the rear cover and includes a metal and / or a polymer. The rear cover and the side bezel structure can be integrally formed and can include the same material (e.g., a metal material such as aluminum).

[0078] The electronic device 101 can include at least one of the display 200, a microphone hole 204, speaker holes 205 and 206, a sensor module 209, camera modules 207 and 208, key input devices 211, 212, and 213, and a connector hole 214. In the electronic device 101, at least one of the components (e.g., the key input devices 211, 212, and 213) can be omitted, or other components (e.g., a light emitting element) can be additionally included.

[0079] A portion of the display 200 can be deformable to a planar surface or a curved surface. The display 200 can include a folding area 203, a first area 201 disposed on one side (e.g., a top side of the folding area 203) of the folding area 203, and a second area 202 disposed on the other side (e.g., a bottom side of the folding area 203) of the folding area 203. However, the display 200 can be divided into a plurality of areas (e.g., two areas or four or more areas) depending on its structure or function. For example, the areas of the display 200 can be divided based on the folding area 203 or a folding axis A-A'. Alternatively, the areas of the display 200 can be divided based on another folding area or another folding axis (e.g., a folding axis perpendicular to the folding axis A-A').

[0080] The microphone hole 204 can include a microphone disposed therein to obtain external sounds, and a plurality of microphones can be disposed therein to enable detection of the direction of sound. The speaker holes 205 and 206 can include an external speaker hole and a telephone call receiver hole. The speaker holes 205 and 206 and the microphone hole 204 can be implemented as a single hole, or can include a speaker (e.g., a piezoelectric speaker) without the speaker holes 205 and 206. The positions and the number of the microphone hole 204 and the speaker holes 205 and 206 can be variable.

[0081] The camera modules 207 and 208 can include a first camera device disposed on the first surface 310a of the first housing 310 of the electronic device 101 and a second camera device 208 disposed on the second surface 310b of the first housing 310 of the electronic device 101. Furthermore, the electronic device 101 can further include a flash. The camera devices 207 and 208 can include one or more lenses, image sensors, and / or ISPs. The flash can include, for example, a light emitting diode or a xenon lamp.

[0082] The sensor module 209 can generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 101. The electronic device 101 can include another sensor module in addition to the sensor module 209 disposed on the second surface 310b of the first housing 310, or can include another sensor module instead of the sensor module 209. The electronic device 101 can include, for example, at least one of a proximity sensor, a fingerprint sensor, a heart rate monitor (HRM) sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, as the sensor module.

[0083] The key input devices 211, 212, and 213 can be disposed on the side surface of the foldable housing 300. The electronic device 101 can not include some or all of the above-mentioned key input devices 211, 212, and 213, and the key input devices not included in the electronic device 101 can be implemented on the display 200 in another form such as a soft key. The key input device can be configured such that key input is implemented through the sensor module.

[0084] The connector hole 214 can be configured to accommodate a connector (for example, a USB connector) configured to transmit and receive power and / or data to and from an external electronic device, and to accommodate a connector configured to transmit and receive an audio signal to and from an external electronic device in addition to or instead of the connector.

[0085] The foldable housing 300 can include a first housing structure 310, a second housing structure 320, a first rear cover 380, a second rear cover 390, and a hinge structure 440. The foldable housing 300 of the electronic device 101 can be implemented by a combination and / or assembly of different shapes or components. For example, the first housing structure 310 and the first rear cover 380 can be integrally formed, and the second housing structure 320 and the second rear cover 390 can be integrally formed. The term "housing structure" can be a combination and / or assembly including various components of a housing.

[0086] The first housing structure 310 can be connected to the hinge structure, and can include a first surface 310a facing in a first direction and a second surface 310b facing in a second direction opposite the first direction. The second housing structure 320 can be connected to the hinge structure 440, and can include a third surface 320a facing in a third direction and a fourth surface 320b facing in a fourth direction opposite the third direction. The second housing structure 320 can be rotatable with respect to the first housing structure 310 about the hinge structure (or the folding axis A-A').

[0087] The first housing structure 310 and the second housing structure 320 can be disposed on opposite sides (or upper and lower sides) with respect to the folding axis A-A', and can have substantially symmetrical shapes with respect to the folding axis A-A'. The first housing 310 and the second housing 320 can form an angle or a distance therebetween, which can be variable depending on whether the electronic device 101 is in the unfolded state, the folded state, or the intermediate state. Unlike the second housing structure 320, the first housing structure 310 can further include various sensors. However, the first housing structure 310 and the second housing structure 320 can have mutually symmetrical shapes in other regions.

[0088] At least a portion of the first housing structure 310 and at least a portion of the second housing structure 320 can be made of a metal material or a non-metal material having a degree of rigidity selected to support the display 200. The portion made of at least a metal material can provide a ground plane of the electronic device 101, and can be electrically connected to a ground line formed on the printed circuit board 430.

[0089] The first rear cover 380 can be disposed on one side of the folding axis A-A' on the rear surface of the electronic device 101, and can have a substantially rectangular periphery that can be surrounded by the first housing structure 310, for example. Similarly, the second rear cover 390 can be disposed on the other side of the folding axis A-A' on the rear surface of the electronic device 101, and a periphery of the second rear cover 390 can be surrounded by the second housing structure 320.

[0090] The first rear cover 380 and the second rear cover 390 can have substantially symmetrical shapes with respect to the folding axis A-A'. However, the first rear cover 380 and the second rear cover 390 are not necessarily necessarily have mutually symmetrical shapes, and the electronic device 101 can include the first rear cover 380 and the second rear cover 390 having various shapes. Additionally, the first rear cover 380 can be integrally formed with the first housing structure 310, and the second rear cover 390 can be integrally formed with the second housing structure 320.

[0091] The first rear cover 380, the second rear cover 390, the first housing structure 310, and the second housing structure 320 can define a space in which various components (e.g., a printed circuit board or a battery) of the electronic device 101 can be disposed. One or more components can be disposed or visually exposed on the rear surface of the electronic device 101. For example, at least a portion of the sub display 210 can be visually exposed through the first rear cover 380. Additionally, one or more components or sensors can be visually exposed through the first rear cover 380. The sensors can include a proximity sensor and / or a rear camera. One or more components or sensors can be visually exposed through the second rear cover 390.

[0092] The front camera 207 exposed to the front surface of the electronic device 101 through one or more openings or the rear camera 208 exposed through the first rear cover 380 can include one or more lenses, image sensors, and / or ISPs. The flash 209 can include a light emitting diode or a xenon lamp. Two or more lenses (e.g., an infrared camera lens, a wide-angle lens, and a telephoto lens) and image sensors can be disposed on one surface of the electronic device 101.

[0093] Figure 3A represents a fully unfolded state of the display portion, Figure 3B represents a partially unfolded state (or a partially folded state) of the display portion.

[0094] The display portion of the electronic device 101 can include a configuration of a display screen and a configuration connected to the display and moving as a whole with the display. Referring to Figure 3A , the display portion can include the display panel 200c and the touch panel 200d disposed adjacent to the display panel 200c.

[0095] The electronic device 101 can be adjusted to a folded state or an unfolded state. The electronic device 101 can be a "inward folding" type in which the front surface of the electronic device 101 is folded to form an acute angle when viewed in the direction of the folding axis (e.g., Figure 2 , and an "outward folding" type in which the front surface of the electronic device 101 is folded to form an obtuse angle when viewed in the direction of the folding axis. For example, in the electronic device 101, in the inward folding type, in a state in which the electronic device 101 is in a folded state, the first surface 310a can face the third surface 320a, and in a fully unfolded state, the third direction can be the same as the first direction. In another example, in the outward folding type, in a state in which the electronic device 101 is folded, the second surface 310b can face the fourth surface 320b.

[0096] The inward folding type can mean a type in which the display 200 is not exposed to the outside in the fully folded state. The outward folding type can mean a type in which the display 200 is exposed to the outside in the fully folded state. Figure 3B An intermediate state in which the electronic device 101 is partially unfolded in a process in which the electronic device 101 is folded in the inward folding type is illustrated. Hereinafter, for convenience, the electronic device 101 will be described focusing on a state in which the electronic device 101 is folded in the inward folding type, but it should be noted that the descriptions can be applied to a state in which the electronic device 101 is folded in the outward folding type with necessary modifications.

[0097] The display 200 can include a display panel 200c, a polarizing layer 200b disposed on the display panel 200c, and a window member 200a forming an appearance of the display. The display panel 200c, the polarizing layer 200b, and the window member 200a form one display 200, and can be formed of a flexible material. Thus, as Figure 3A As shown in FIG. 2B, when an external force is applied in a state in which the display 200 is unfolded, the display 200 can be bent, as Figure 3B As shown in FIG. 2B, when an external force is applied in a state in which the display 200 is unfolded, the display 200 can be bent, as Figure 3B As shown in FIG. 2B, when an external force is applied in a state in which the display 200 is unfolded, the display 200 can be bent, as Figure 3A As shown in FIG. 2B, when an external force is applied in a state in which the display 200 is unfolded, the display 200 can be bent, as

[0098] The electronic device 101 can detect an input (e.g., a user's input or an input via the input device 150) on a surface of the display 200 using the touch panel 200d. Here, the input recognizable by the touch panel 200d can include not only an input by direct contact with the surface of the display 200, but also an input by hovering. The touch panel 200d can have substantially the same area as the display 200. The touch panel 200d can be disposed on a top surface or a rear surface of the display 200. Figure 3A and Figure 3B A state in which the touch panel 200d is attached to the rear surface of the display 200 is illustrated.

[0099] The display device 200 can be at least partially composed of a material that transmits radio waves or a magnetic field. Because the display 200 can be equipped with a display panel 200c and / or a touch panel 200d, the display 200 can serve as an output device that outputs a screen and as an input device that is provided with a touch screen function. The display panel 200c can include a display element layer (which includes one or more pixels) and a thin film transistor (TFT) layer connected to the display element layer. The display panel 200c can correspond to a panel such as a liquid crystal display (LCD), a light emitting diode (LED), or an organic light emitting diode (OLED), and can display various images according to various operation states of the electronic device 101, an application being executed, and content.

[0100] The touch panel 200d can include various types of touch pieces. For example, various touch panels such as a capacitive touch panel that detects a change in capacitance, a pressure touch panel that detects a position by detecting pressure applied to the panel, an optical touch panel that uses infrared rays, and a transparent electrode type touch panel that uses contact of a transparent conductive film can be used. In addition, various types of input position detection panels such as an electromagnetic resonance type touch panel can be used.

[0101] The window member 200a can serve as a protective film for protecting the display panel 200c. As the protective film, the window member 200a can be made of a material that protects the display panel 200c from external influences (i.e., scratch resistance) and causes less wrinkles even in a folding area when the foldable housing is repeatedly folded and unfolded. A pure polyimide (CPI) film or ultra-thin glass (UTG) can be included as a material of the window member 200a.

[0102] Figure 4 FIG. 4 is a disassembled perspective view illustrating an electronic device 400 according to an embodiment.

[0103] Reference Figure 4 The electronic device 400 includes a display 410, a foldable housing 420, a printed circuit board 430, a hinge structure 440, a flexible connection member 450, a hinge cover 460, an antenna module 470, and a back cover 480. Hereinafter, detailed descriptions of components that are repetitive with those described with reference to FIGS. 1 through 3 (e.g., the display 410, the foldable housing 420, and the back cover 480) will be omitted. Figure 2

[0104] The display 410 can be exposed through a substantial portion of the front plate 411. The shape of the display 410 can be substantially the same as that of the periphery of the front plate 411.

[0105] ​The foldable housing 420 can include a first housing 421 and a second housing 422. The first housing 421 can include a first surface 421a and a second surface 421b facing away from the first surface 421a, and the second housing 422 can include a third surface 422a and a fourth surface 422b facing away from the third surface 422a. The foldable housing 420 can additionally or alternatively include a bracket assembly. The bracket assembly can include a first bracket assembly 423 disposed on the first housing structure 421 and a second bracket assembly 424 disposed on the second housing structure 422. At least a portion of the bracket assembly (e.g., a portion 425 including at least a portion of the first bracket assembly 423 and at least a portion of the second bracket assembly 424) can act as a plate for supporting the hinge structure 440.

[0106] Various electrical elements can be disposed on the printed circuit board 430. For example, the processor 120, the memory 130, and / or the interface 177 can be mounted on the printed circuit board 430. The processor can include at least one of a CPU, an AP, a graphic processor, an ISP, a sensor hub processor, or a CP. The memory can include, for example, a volatile memory or a non-volatile memory. The interface may, for example, include an HDMI, a USB interface, an SD card interface, and / or an audio interface. The interface can electrically or physically connect the electronic device 300 to an external electronic device, and can include a USB connector, an SD card / multimedia card (MMC) connector, or an audio connector.

[0107] The printed circuit board 430 can include a first printed circuit board 431 disposed on a side of the first bracket assembly 423 and a second printed circuit board 432 disposed on a side of the second bracket assembly 424. The first printed circuit board 431 and the second printed circuit board 432 can be disposed in a space defined by the foldable housing 420, the bracket assembly, the first rear cover 481, and / or the second rear cover 482. Components for implementing various functions of the electronic device 400 can be mounted on the first printed circuit board 431 and the second printed circuit board 432 so as to be separated from each other. The processor can be disposed on the first printed circuit board 431, and the audio interface can be disposed on the second printed circuit board 432.

[0108] The battery can be disposed adjacent to the printed circuit board 430 so as to supply power to the electronic device 400. At least a portion of the battery can be disposed substantially flush with the printed circuit board 430. The first battery 433 can be disposed adjacent to the first printed circuit board 431, and the second battery 434 can be disposed adjacent to the second printed circuit board 432. The battery is a device for supplying power to at least one component of the electronic device 400, and can include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery can be integrally disposed inside the electronic device 400, or can be detachably disposed on the electronic device 400. The hinge structure 440 can be configured to support the foldable housing 420 and / or the bracket assembly, such that the foldable housing 420 can be rotatable about a folding axis (e.g., Figure 2 The hinge structure 440 can include a first hinge structure 441 disposed on a side of the first printed circuit board 431 and a second hinge structure 442 disposed on a side of the second printed circuit board 432. The hinge structure 440 can be disposed between the first printed circuit board 431 and the second printed circuit board 432. The hinge structure 440 can be integrally formed with the portion 425 including at least a portion of the first bracket assembly 423 and at least a portion of the second bracket assembly 424.

[0109] The "housing structure" can be a structure including the foldable housing 420, and one or more components disposed inside the housing 420 can be assembled and / or combined with each other. The housing structure can include a first housing structure and a second housing structure. An assembled configuration including the first housing 421 and further including at least one of the first bracket assembly 423, the first printed circuit board 431, and the first battery 433 disposed inside the first housing 421 can be referred to as a "first housing structure". An assembled configuration including the second housing 422 and further including at least one of the second bracket assembly 424, the second printed circuit board 432, and the second battery 434 disposed inside the second housing 422 can be referred to as a "second housing structure". However, it should be noted that the "first housing structure" and the "second housing structure" are not limited to the components described above, and can additionally include or omit other components.

[0110] The flexible connection member 450 can be a flexible printed circuit board (FPCB). Various electrical elements disposed on the first printed circuit board 431 and the second printed circuit board 432 can be connected to each other using the flexible connection member 450. Accordingly, the flexible connection member 450 can be disposed to span the "first housing structure" and the "second housing structure". The flexible connection member 450 can be disposed to span at least a portion of the hinge structure 440. The flexible connection member 450 can be configured to be bent along a direction in which the foldable housing 420 is rotatable about the folding axis A-A' (e.g., a direction in which the first housing 421 and the second housing 422 are rotatable about the folding axis A-A'). Figure 4The first printed circuit board 431 and the second printed circuit board 432 are connected to each other across the hinge structure 440 in a direction parallel to the y-axis of the hinge structure 440. The flexible connection member 450 can be fitted and coupled to the openings 441h and 442h in the hinge structure 440. In this case, a portion 450a of the flexible connection member 450 can be arranged to span one side (e.g., the upper portion) of the first hinge structure 441, and another portion 450b of the flexible connection member 450 can be arranged to span one side (e.g., the upper portion) of the hinge structure 442. In addition, another portion 450c of the flexible connection member 450 can be arranged on the other side (e.g., the lower portion) of the first hinge structure 441 and the second hinge structure 442. A space (hereinafter referred to as the "hinge space") surrounded by at least a portion of the first hinge structure 441, at least a portion of the second hinge structure 442, and at least a portion of the hinge cover 460 can be formed adjacent to the first hinge structure 441 and the second hinge structure 442. At least a portion 450c of the flexible connection member 450 may be disposed in the hinge space.

[0111] The hinge cover 460 may be configured to at least partially surround the hinge space. The hinge cover 460 may close the hinge space together with the hinge structure 440 and may protect the structure disposed inside the hinge space (e.g., at least the portion 450c of the flexible connection member 450) from external influences. The hinge cover 460 may be disposed between the first housing 421 and the second housing 422. The hinge cover 460 may be coupled to at least a portion of the first housing (e.g., the hinge structure 440). Figure 7 The first rotating support member 511 described above) and at least a portion of the second housing (eg, reference will be made later) Figure 7 The second rotating support 521 described above).

[0112] The antenna module 470 may be arranged between the back cover 480 and the battery. The antenna module 470 may include multiple antenna modules in one electronic device 400. For example, the antenna module 470 may include a first antenna module 471 arranged on the side of the first shell 421 and a second antenna module 472 arranged on the side of the second shell 422. The antenna module may include at least one radiator. In addition, the antenna module 470 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna and / or a magnetic secure transmission (MST) antenna. The antenna module 470 can perform short-range communication with an external electronic device, or can wirelessly send / receive power required for charging to / from an external device. The antenna structure can be formed by part of the side frame structure of the foldable shell 420, part of the bracket assembly, or a combination thereof.

[0113] The back cover 480 may include a first back cover 481 and a second back cover 482. The back cover 480 may be coupled to the foldable housing 420 to protect the components described above (e.g., the printed circuit board 430, the battery, the flexible connection member 450, and the antenna module 470) disposed inside the foldable housing 420. As described above, the back cover 480 may be substantially configured integrally with the foldable housing 420.

[0114] In the following, reference will be made to Figure 5 to Figure 8 The flexible connection member 550 is described in more detail.

[0115] Figure 5 is a view showing a portion of the interior of the electronic device 101 according to the embodiment. Figure 6 is a diagram showing the Figure 5 FIG. 5 is a diagram showing a state in which the hinge structure 540 is removed in the embodiment shown in FIG. Figure 5 and Figure 6 In the embodiment shown, the interior of the electronic device is magnified to focus on the Figure 4 The flexible connecting member 450 is shown when multiple components (eg, the flexible connecting member 450 and the foldable housing 420) are coupled.

[0116] exist Figure 5 and Figure 6 In FIG, the foldable housing 501 includes a first housing 510 and a second housing 520. Here, the first housing 510 and the second housing 520 may be cover portions surrounding the first housing structure 310 and the second housing structure 320, respectively.

[0117] refer to Figure 5 , the flexible connecting member 550 can be positioned across at least a portion of the interior of the first housing structure 310 and at least a portion of the interior of the second housing structure 320. Here, the phrase "positioning the flexible connecting member 550 across the interior of the housing structure" can mean that the flexible connecting member 550, which has a relatively long, elongated shape, is positioned above or below the housing structure. As described above, the housing structure can include a housing and can be assembled in a configuration that includes at least one of a bracket assembly, a printed circuit board, and a battery disposed within the housing. Therefore, the phrase "positioning the flexible connecting member 550 across at least a portion of the interior of the housing structure" can mean that the flexible connecting member 550 is positioned across at least some of the components included in the housing structure. For example, the flexible connecting member 550 can be positioned across at least a portion of the first bracket assembly 523 and at least a portion of the second bracket assembly 524.

[0118] Reference together Figure 5 and Figure 6When the inside of the foldable housing 501 is viewed from above, at least a portion of the flexible connection member 550 can be covered by the hinge structure 540. The portion H covered by the hinge structure 540 is a portion corresponding to the hinge space, and in which movement (e.g., bending) repeatedly occurs in the flexible connection member 550 during the unfolding operation and the folding operation of the foldable electronic device.

[0119] The flexible connection member 550 included in the foldable electronic device can include a plurality of flexible connection members 551 and 552. At least a portion of the flexible connection member 550 can be placed to span the inside of the first housing structure including the first housing 510, the first bracket assembly 523, and the first printed circuit board 531, and another portion can be placed to span the inside of the second housing structure including the second housing 520 and the second bracket assembly 524. Figure 5 and Figure 6 A state in which the second printed circuit board is shown is illustrated. The flexible connection member 550 can be placed across the hinge structure 540 on the first housing structure and the second housing structure. In this case, a portion of the flexible connection member 550 can be configured to pass through the opening 540h in the hinge structure 540.

[0120] The plurality of flexible connection members 551 and 552 will be described in detail later in the embodiments of Figure 10 .

[0121] Hereinafter, the movement of the flexible connection member 550 in the hinge space will be described with reference to Figure 7 and Figure 8 . Here, the dotted line B-B' represents a virtual surface perpendicular to the folding axis A-A' shown in Figure 5 and Figure 6 .

[0122] Figure 7 is a cross-sectional view illustrating the hinge structure 540 and the flexible connection member 660 in a state in which the electronic device 500 is unfolded, according to an embodiment. Figure 8 is a cross-sectional view illustrating the hinge structure 540 and the flexible connection member 550 in a state in which the electronic device is folded, according to an embodiment.

[0123] The operations of the first housing 510 and the second housing 520 and the operations of the hinge structure 540 and the flexible connection member 550 according to the state (e.g., the unfolded state, the folded state, and the intermediate state) of the electronic device 500 will be described.

[0124] Reference will be made to Figure 7When the electronic device 500 is in the unfolded state, the first surface 421a of the first housing 510 and the third surface 422a of the second housing 520 can be arranged to face the same direction while forming an angle of approximately 180 degrees. The surface of the first area 201 and the surface of the second area 202 of the display can form an angle of approximately 180 degrees therebetween and can face the same direction (e.g., the forward direction of the electronic device). The folding area 203 formed between the first area 201 and the second area 202 can form the same plane as the first area 201 and the second area 202.

[0125] refer to Figure 8 When the electronic device 500 is in the folded state, the first surface 421a of the first shell 510 and the second surface 422a of the second shell 520 are arranged to face each other. The first surface 421a and the second surface 422a can form an acute angle (for example, an angle between approximately 0 degrees and 10 degrees) relative to the virtual plane BB' perpendicular to the folding axis A-A'. The surface of the first area 201 and the surface of the second area 202 of the display can also face each other while forming a narrow angle (for example, an angle between approximately 0 degrees and 10 degrees) with respect to each other. At least a portion of the folding area 203 can have a curved surface having a predetermined curvature.

[0126] refer to Figure 8 , will describe Figure 3B The electronic device 500 is shown in an embodiment in an intermediate state. The first surface 421a of the first housing 510 and the second surface 422a of the second housing 520 can be arranged at a certain angle to each other. The surface of the first area 201 and the surface of the second area 202 of the display 200 can form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. At least a portion of the folding area 203 can have a curved surface (the curved surface has a predetermined curvature), and the curvature in this state can be less than the curvature in the folded state.

[0127] Reference together Figure 7 and Figure 8 The hinge structure 540 includes a first hinge structure 541 and a second hinge structure 542. Each of the first hinge structure 541 and the second hinge structure 542 may include a hinge plate. The first hinge structure 541 may support at least a portion of the flexible connection member 550, and the second hinge structure 542 may also support at least a portion of the flexible connection member 550. In the above structure, the hinge structure 540 may be coupled to the hinge cover 570 to define a hinge space S at least partially surrounded by the hinge structure 540 and the hinge cover 570. At least a portion of the flexible connection member 550 may be disposed in the hinge space S.

[0128] The first housing 510 can include a first rotation support 511 coupled to one side of the hinge cover 570, and the second housing 520 can include a second rotation support 521 coupled to the other side of the hinge cover 570. The first rotation support 511 can include a first rotation support surface 511a, and the second rotation support 521 can include a second rotation support surface 521a. The first rotation support surface 511a and the second rotation support surface 521a face each other and can be symmetrically operated with respect to the virtual surface B-B'. Each of the first rotation support surface 511a and the second rotation support surface 521a can include a curved surface corresponding to a curved surface included in the hinge cover 570.

[0129] When the electronic device 500 is in an unfolded state (e.g., the embodiment illustrated in FIG. 1A), the first rotation support surface 511a and the second rotation support surface 521a can cover the hinge cover 570 so that the hinge cover 570 cannot be exposed to the rear surface of the electronic device 500 or can be minimally exposed to the rear surface of the electronic device 101. When the electronic device 500 is in a folded state (e.g., the embodiment illustrated in FIG. 1B), the first rotation support surface 511a and the second rotation support surface 521a can be rotated along the curved surface included in the hinge cover 570 so that the hinge cover 570 can be exposed to the rear surface of the electronic device 500. Figure 7 Figure 8

[0130] Figure 9 is a view illustrating a disturbed (e.g., appearing irregular) designated shape of the flexible connection member 650 in a state in which the electronic device is unfolded.

[0131] Referring to Figure 9 , the shape of the flexible connection member 650 in the hinge space S can be disturbed due to repeated operations of folding and unfolding the foldable electronic device. The expression "designated shape is disturbed" can include a case in which the designated shape of the flexible connection member 650 is permanently deformed, or a case in which the shape of the flexible connection member 650 is deformed due to the foldable electronic device being repeatedly folded and unfolded.

[0132] According to an example in which the designated shape is disturbed, when a plurality of flexible connection members are disposed in the hinge space S, the designated shape of each flexible connection member 650 can be more easily disturbed, and disturbance to the designated shape of any one flexible connection member can affect signal transmission performance and the service life of other flexible connection members.

[0133] Referring to Figure 9 ​​When the designated shape of the two flexible connection members 651 and 652 is not maintained while the electronic device is in the unfolded state, at one side P1 of the hinge side S, the flexible connection members 651 and 652 can come into excessive close contact with the structure (e.g., the hinge cover 670) side of the foldable electronic device. On the other side P2, at least one of the flexible connection members 651 and 652 can come into excessive close contact with the structure (e.g., the hinge cover 670) side of the foldable electronic device, and can be spaced apart from the other flexible connection member. If the designated shape of the two flexible connection members 651 and 652 is not maintained, the shape of the flexible connection members 651 and 652 at one side P1 and the shape of the flexible connection members 651 and 652 at the other side P2 can be different from each other. Furthermore, in another portion P3, the flexible connection members 651 and 652 can rub against the structure (e.g., the hinge cover 670) of the foldable electronic device while the electronic device is in the unfolded state, which can cause damage due to accumulated stress or rapid reduction in the service life.

[0134] In the following description, various embodiments for preventing the designated shape of the flexible connection member from being disturbed will be described.

[0135] First, various embodiments of the flexible connection member 550 will be described. Figure 10 is a view showing a flexible connection member according to an embodiment.

[0136] Referring to Figure 10 , the flexible connection member 550 can include a plurality of flexible connection members. For example, the flexible connection member 550 can include a first flexible connection member 551 and a second flexible connection member 552. In addition, the flexible connection member 550 can further include three or more flexible connection members.

[0137] In Figure 10 , the first flexible connection member 551 and the second flexible connection member 552 are completely separated from each other and are illustrated as two separate flexible connection members.

[0138] Basically, one flexible connection member can be divided into a first flexible connection member 551 and a second flexible connection member 552. For example, one flexible connection member which is not physically divided basically can be divided into a first flexible connection member 551 and a second flexible connection member 552 according to the type of a signal line, and can be branched into two or more branches in some areas where the flexible connection member is located only. The first flexible connection member 551 and the second flexible connection member 552 can have the form of an integrated flexible connection member inside the first housing structure 310, and can be branched into two different flexible connection members 551 and 552 inside the second housing structure 320. As described above, it should be noted that the shape of the flexible connection member can be variously provided in different embodiments. In the following description, for the convenience of description, the case where two flexible connection members 551 and 552 which are physically spaced apart from each other and have different shapes will be described, but it should be noted that the scope of the present disclosure is not necessarily limited thereto.

[0139] Referring to Figure 10 The first flexible connection member 551 can be placed across at least a portion of the inside of the first housing structure 310 and at least a portion of the second housing structure 320. The second flexible connection member 552 can also be placed across at least a portion of the first housing structure 310 and at least a portion of the second housing structure 320.

[0140] Each of the first and second flexible connection members 551 and 552 can include a means to connect to the first or second printed circuit board 431 or 432. The first flexible connection member 551 can electrically connect the first and second printed circuit boards 431 and 432 via connection ends 551a and 551b disposed at opposite ends thereof. The second flexible connection member 552 can also electrically connect the first and second printed circuit boards 431 and 432 via connection ends 552a and 552b disposed at opposite ends thereof. Here, the connection ends can each include a receptacle or header in which at least one pin is formed. The first and second flexible connection members 551 and 552 can be connected to at least one of the first and second printed circuit boards via various other means as well as the receptacle or header configuration. For example, the flexible connection members 551 and 552 can be connected to at least one of the first and second printed circuit boards 431 and 432 via soldering using a hot-bar process formed by hot-bar soldering. The shape of the connection ends and the method of manufacturing thereof are not limited to any particular configuration. Based on the shape of the connection ends, the first and second flexible connection members 551 and 552 can include, for example, a flexible printed circuit (FPC) or flexible flat cable (FFC) type connector configuration, a board-to-board (B-to-B) type connector configuration, a zigzag type connector configuration, a solder type connector configuration formed by a hot-bar soldering process, a low insertion force (LIF) connector configuration, or a zero insertion force (ZIF) connector configuration.

[0141] Each of the first and second flexible connection members 551 and 552 can include at least one conductive path connecting the first and second printed circuit boards 431 and 432 to each other. Power or control signals provided from the power management module or the processor can be transmitted via the conductive path. The flexible connection members 551 and 552 can each include an RF wire (which is a high frequency signal line) as a conductive path for transmitting a communication signal provided from an RF transceiver or received via a communication device to another RF transceiver. For example, the first flexible connection member 551 can include a wire (or conductive path) for transmitting a communication signal including an RF signal. Also, the second flexible connection member 552 can include a wire for transmitting an electrical signal less sensitive to impedance variation than the wire included in the first flexible connection member 551. The second flexible connection member 552 can include a power line. In addition to or instead of the power line, the second flexible connection member 552 can include a wire for transmitting data and / or a wire (conductive path) for transmitting a control signal. Depending on the RF signal characteristics, the first flexible connection member 551 can be formed thinner and narrower than the second flexible connection member 552. Thus, when the first flexible connection member 551 including a conductive path for transmitting an RF signal is repeatedly used in a state in which its designated shape is disturbed in the hinge space, the durability of the first flexible connection member 551 will be relatively weak compared to the second flexible connection member 552, and it can be difficult to exhibit a smooth communication performance because the first flexible connection member 551 is vulnerable to impedance variation.

[0142] Figure 11 is a view illustrating a flexible connection member and an adhesive member according to an embodiment.

[0143] Referring to Figure 11 The foldable electronic device includes an adhesive member 553 attached to the first flexible connection member 551. The adhesive member 553 can be a component for maintaining the first flexible connection member 551 in a constant shape within a designated area when the foldable housing 300 is folded and unfolded. A tape portion (e.g., an insulating tape portion) can be used as the adhesive member 553. The first and second flexible connection members 551 and 552 can maintain their designated shapes through the adhesive member 553 even when the foldable electronic device is repeatedly folded and unfolded.

[0144] The adhesive member 553 can be disposed to cover at least a partial area of the first flexible connection member 551. Here, the portion 450c (or "flexible portion") of the flexible connection member described with reference to Figure 4 may correspond to the "at least partial area" of the first flexible connection member 551.

[0145] Each portion of the flexible connection member will be described. Reference is made toFigure 10 and Figure 11 The first flexible connection member 551 can include a rigid portion 551c fixed to the first housing structure 310 side, a rigid portion 551d fixed to the second housing structure 320, and a flexible portion 551e between the rigid portion 551c and the rigid portion 551d along the longitudinal direction of the first flexible connection member 551. The second flexible connection member 552 can include a rigid portion 552c fixed to the first housing structure 310 side, a rigid portion 552d fixed to the second housing structure 320, and a flexible portion 552e between the rigid portion 552c and the rigid portion 552d along the longitudinal direction of the flexible connection member 551. Here, the wording "the rigid portion 551c and the rigid portion 551d of the first flexible connection member 551 are fixed to the first housing structure side and the second housing structure side" can include the case where the rigid portion 551c of the first flexible connection member 551 is fixed to the first hinge structure 441, the first printed circuit board 431, or the first cradle assembly 423 arranged inside the first housing structure 310. The rigid portion 551d of the first flexible connection member 551 can be fixed to the second hinge structure 442, the second printed circuit board 432, or the second cradle assembly 424 arranged inside the second housing structure 320. The wording "the rigid portion 552c and the rigid portion 552d of the second flexible connection member 552 are fixed to the first housing structure side and the second housing structure side" can be similarly applied to the embodiment in which the rigid portion 551c and the rigid portion 551d of the first flexible connection member 551 are fixed to the first housing structure side and the second housing structure side.

[0146] The flexible portions 551e and 552e can be portions movable in a space inside the hinge structure (for example, the hinge space S in FIG. 11). The adhesive member 553 can be stacked on the flexible portion 551e of the first flexible connection member 551 and can guide the flexible portion 551e to be movable within a designated area (for example, the hinge space S) while maintaining its shape (and / or position) unchanged. Figure 7

[0147] The first flexible connection member 551 can include a cover layer in order to improve the rigidity of the first flexible connection member 551 and thus maintain the designated shape of the flexible connection member 551. However, when the cover layer is added to the first flexible connection member 551, the flexibility of the flexible portion 551e can decrease. Accordingly, an embodiment can be provided which maintains the designated shape of the first flexible connection member 551 without the cover layer using the adhesive member 553.

[0148] Figure 12 is a view illustrating a flexible connection member and an adhesive member 554 connecting the flexible connection member according to an embodiment. Figure 13 ​is a view showing a state in which one or more slits 555 are formed in the adhesive member 554 according to an embodiment.

[0149] Referring to Figure 12 , the foldable electronic device includes an adhesive member 554 connecting the flexible connection members 551 and 552 to each other. The adhesive member 554 can be a component configured to fix the positions of the two different flexible connection members 551 and 552 together and to maintain the specified shapes (and / or positions) of the first flexible connection member 551 and the second flexible connection member 552 unchangeably within a specified area when the foldable housing 300 is folded and unfolded. The adhesive member 554 can serve to connect the first flexible connection member 551 and the second flexible connection member 552 as if they are a single flexible connection member.

[0150] The first flexible connection member 551 and the second flexible connection member 552 can be connected to each other using a tape portion as the adhesive member 554. The first flexible connection member 551 and the second flexible connection member 552 can maintain their specified shapes through the adhesive member 554 even when the foldable electronic device is repeatedly folded and unfolded.

[0151] Referring to Figure 13 , the adhesive member 554 can be disposed to cover at least a partial area of the first flexible connection members 551 and 552. Here, the portion (or "flexible portion") 450c of the flexible connection member described above with reference to Figure 4 may correspond to the "at least partial area" of the flexible connection members 551 and 552. Hereinafter, with respect to each portion of the adhesive member 554, the description of the portion repeated with respect to Figure 11 will be omitted.

[0152] The flexible portions 551e and 552e can be portions movable in a space inside the hinge structure (e.g., the hinge space S in Figure 7 ). The adhesive member 554 can be stacked on the flexible portions 551e of the first flexible connection member 551 and 552e of the second flexible connection member 552 and can guide the flexible portions 551e and 552e to be movable within a specified area (e.g., the hinge space S) while maintaining their shapes (and / or positions) unchangeable.

[0153] Referring to Figure 13The opposite side of the adhesive member 554 can be connected to the rigid portions 551c and 551d of the first flexible connection member 551 and the rigid portions 552c and 552d of the second flexible connection member 552, respectively. For example, the adhesive member 554 can have a shape that completely covers the flexible portions 551e and 552e. Alternatively, the adhesive member 554 can have a shape that covers only a portion of the flexible portions 551e and 552e.

[0154] The shape of the adhesive member 554 can be variously set. For example, in addition to completely covering the portions of the flexible portions 551e and 552e, the adhesive member 554 can include a handle portion 553a that allows a user to directly attach the adhesive member 554 to the first and second flexible connection members 551 and 552.

[0155] One or more slits can be formed in the adhesive member 554 to maintain a designated shape of the flexible connection members 551 and 552. One or more slits 555 can be used to equalize movement of the flexible portions when the flexible connection members 551 and 552 are bent.

[0156] A longitudinal direction of the one or more slits 555 can be parallel to the folding axis A-A' of the electronic device 101. When a plurality of slits are included, the arrangement direction of the plurality of slits can be formed perpendicular to the folding axis A-A'.

[0157] Figure 14 FIG. 5B is a view illustrating a state in which the flexible connection members 551 and 552 and the adhesive member 554 are coupled to each other according to an embodiment.

[0158] Referring to Figure 14 In the adhesive member 554, a handle part 554a included in the adhesive member 554 can be disposed at different portions of the adhesive member 554 to form different shapes of the adhesive member 554. In contrast to Figure 13 In contrast, only one side of the adhesive member 554 is connected to the rigid portions 551d and 552d of the first and second flexible connection members 551 and 552, and the other side is stacked on the flexible portions 551e and 552e in a state spaced apart from the rigid portions 551c and 552c by a predetermined distance.

[0159] In addition, the shape and / or number of one or more slits 555 provided in the adhesive member 554 can vary. In the following description of Figure 15A to Figure 15E According to various embodiments, one or more slits are disclosed.

[0160] Figure 15A FIG. 5B is a view illustrating a state in which the flexible connection members 551 and 552 and the adhesive member 554 are coupled to each other according to an embodiment. Figure 15Bis a view showing the shape of one or more slits 555 according to an embodiment. Figure 15C is a view showing the shape of one or more slits 556 according to an embodiment. Figure 15D is a view showing the shape of one or more slits 557 according to an embodiment. Figure 15E is a view showing the shape of one or more slits 557 and 558 according to an embodiment.

[0161] The one or more slits formed in the adhesive member 554 can have various forms, numbers, and various widths and lengths. For example, as shown in Figure 15A , a plurality of slits 555 having the same width t and length l can be formed in the adhesive member 553, and the intervals d1 and d2 between the slits can be variously set according to the positions of the slits provided in the adhesive member 554. The slits close to the center of the adhesive member 554 can have a small interval d1 so that the slits are densely arranged, and the slits away from the center can have a relatively large interval d2 so that the density of the slits is relatively sparsely arranged.

[0162] Alternatively, as shown in Figure 15B , a plurality of slits 555 having different widths t1 and t2 or different lengths can be formed in the adhesive member 554. For example, narrow slits 555a can be arranged close to the center of the adhesive member 554, and relatively wide slits 555b can be arranged away from the center of the adhesive member 554.

[0163] Alternatively, as shown in Figure 15C , the one or more slits 556 can have a very narrow width like a thin line shape and a very long length compared to the width. Some of the one or more slits 556 can extend to the handle portion 554a.

[0164] Alternatively, as shown in Figure 15D , a cross-shaped pattern can be repeated in the form of at least one slit 557.

[0165] Alternatively, as shown in Figure 15E , one or more slits 557 and 558 having two or more different shapes can be used in combination. Among the one or more slits 557 shown in Figure 15E , some slits 557 can adopt a cross-shaped pattern, and the other slits 558 can adopt an open shape pattern formed by punching.

[0166] Additionally, the one or more slits can include a reference Figure 15A to Figure 15EVarious embodiments other than the described embodiments. When one or more slits are capable of acting to make the movement of the flexible portion uniform as the flexible connection members 551 and 552 are bent, the slits can include similar patterns such as holes, grooves, notches, and openings.

[0167] In the above-described embodiments, the adhesive member for maintaining a designated shape when two or more flexible connection members are bent and the slit structure formed therein have been described. Hereinafter, the description will focus on the slit structure for maintaining a designated shape when a multi-layer flexible connection member is bent.

[0168] Figure 16 is a view illustrating a flexible connection member 750 and one or more slits 755 formed in the flexible connection member 750 according to an embodiment. Figure 17 is a conceptual view illustrating a flexible connection member 750 and one or more slits 755 formed in the flexible connection member 750 according to an embodiment. Figure 18A is a view illustrating a cross-sectional view of a flexible connection member 750 and one or more slits 755 formed in the flexible connection member according to an embodiment. Figure 17 is a view illustrating a cross-sectional view of a flexible connection member 750 and one or more slits 755 formed in the flexible connection member according to an embodiment. Figure 18B is a view illustrating a cross-sectional view of a flexible connection member 750 and one or more slits 755 and 755' formed in the flexible connection member according to an embodiment. Here, Figure 18A and Figure 18B each illustrate a cross-sectional view of a flexible connection member 750 according to an embodiment taken in the direction of line C-C'. Figure 17 is a view illustrating a cross-sectional view of a flexible connection member 750 according to an embodiment.

[0169] The flexible connection member 750 can be substantially formed of one flexible connection member. Referring to Figure 16 , the flexible connection member 750 can be made as a single flexible connection member, and include a plurality of connection ends 750aa, 750ab, 750ba, and 750bb branched out from at least one of the first and second housing structures 310 and 320. Figure 16 The flexible connection member 750 illustrated in

[0170] Referring to Figure 17The flexible connection member 750 includes rigid portions 750c and 750d fixed to the housing, the bracket assembly, or the printed circuit board along the longitudinal direction thereof. In addition, a flexible portion 750e can be disposed between the rigid portions 750c and 750d. Here, when the flexible connection member 750 is installed inside the foldable housing 420 or the foldable housing structure 330, the flexible portion 750e can be disposed in a hinge space S surrounded at least partially by the hinge structure 440 and / or the hinge cover 470.

[0171] Referring to Figure 18A and Figure 18B The flexible portion 750e of the flexible connection member 750 has a plurality of layered structures. In addition, at least one slit 755 can be formed in the outermost layer of the plurality of layered structures, for example, in the uppermost layer and / or the lowermost layer. Figure 18A A plurality of slits 755 formed in the uppermost layer of the flexible connection member 750 is illustrated. As Figure 18B indicated, a plurality of slits 755 can be formed in the uppermost layer of the flexible connection member 750, and a plurality of slits 755' can also be formed in the lowermost layer.

[0172] The flexible connection member 750 can include a plurality of conductive layers and a plurality of insulating layers as the plurality of layered structures. The plurality of conductive layers and the plurality of insulating layers included in the flexible portion 750e can integrally extend from the rigid portions 750c and 750d. The flexible portion 750e can include a first cover layer 751, a stacked structure 752 of at least one conductive layer and at least one insulating layer, and a second cover layer 753. Here, the stacked structure 752 of at least one conductive layer and at least one insulating layer can be a first conductive layer, a first insulating layer, a second conductive layer, and a second insulating layer sequentially stacked. At least a portion of the flexible connection member 750 (for example, the upper surface of the first conductive layer) can be visible to the outside, and can be covered by the first cover layer 751. Similarly, the lower end of the flexible connection member 750 can also be covered by the second cover layer 752. By forming a slit 755 in at least one of the first cover layer 751 and the second cover layer 753, for example, by forming one or more slits in a portion corresponding to a hinge structure (or a hinge space) in the multi-layered flexible connection member, a designated shape can be maintained when the multi-layered printed circuit board is bent. Accordingly, the service life of the flexible connection member can be improved.

[0173] One or more slits 755 can also be formed in a direction parallel to the folding axis A-A'. In addition, the one or more slits 755 can also have various shapes, numbers, and various widths and lengths similar to the slits formed in the adhesive member 553.

[0174] Figure 19is a view illustrating a flexible connection member 950 according to an embodiment and one or more slits formed in the flexible connection members 951 and 952.

[0175] Referring to Figure 19 , the multi-layer flexible connection member includes a first multi-layer flexible connection member 951 disposed across at least a portion of the first housing structure 310 and at least a portion of the second housing structure 320 and configured to electrically connect the first printed circuit board 431 and the second printed circuit board 432 via connection ends located at opposite ends of the first multi-layer flexible connection member 951, and a second multi-layer flexible connection member 952 disposed across at least a portion of the first housing structure 310 and at least a portion of the second housing structure 320 and configured to electrically connect the first printed circuit board 431 and the second printed circuit board 432 via connection ends arranged at opposite ends of the second multi-layer flexible connection member 952.

[0176] One or more slits 955 and 956 can be formed in each of the first multi-layer flexible connection member 951 and the second multi-layer flexible connection member 952. The one or more slits 955 and 956 can be formed in at least one of the uppermost layer and the lowermost layer of the first multi-layer flexible connection member 951, and can be formed in at least one of the uppermost layer and the lowermost layer of the second multi-layer flexible connection member 951. The one or more slits 955 and 956 can be formed in a portion of at least one of the uppermost layer and the lowermost layer of the first multi-layer flexible connection member 951, for example, between the rigid portions 951c, 952c, 951d, and 952d.

[0177] As Figure 19 indicated in the above, when a plurality of multi-layer flexible connection members are provided, the specified shape of the multi-layer flexible connection members can be maintained by forming one or more slits in each of the multi-layer flexible connection members.

[0178] In the case where a plurality of flexible connection members are provided in the foldable housing, the method of maintaining the specified shape using the adhesive member 553 described above with reference to Figure 10 to Figure 15E may be applied together, and the method of forming the slit directly in the multi-layer flexible connection member described above with reference to Figure 16 to Figure 18B may be applied.

[0179] Figure 20 is a view illustrating a state in which the specified shape of the flexible connection member 1051 is maintained when the foldable electronic device is unfolded according to an embodiment.

[0180] Referring to Figure 20When the adhesive member 1053 is attached to the first flexible connection member 1051, it can be seen that the designated shape of the first flexible connection member 1051 is maintained even when the foldable electronic device is repeatedly folded and unfolded.

[0181] With Figure 20 comparing the embodiment shown in Figure 9 , it can be seen that the uniformity of the designated shape of the first flexible connection member 1051 is significantly improved in the embodiment shown in Figure 9 , for example, in the embodiment shown in Figure 20 , it can be seen that the designated shape of the first flexible connection member 1051 is not disturbed in the portion corresponding to P1 in Figure 20 , in addition, in the embodiment shown in Figure 9 , it is possible to prevent or significantly reduce friction with the structure (e.g., the hinge cover 1070) of the foldable electronic device. Figure 20

[0182] Figure 21 is a view showing a state in which the designated shapes of the flexible connection members 1151 and 1152 are maintained when the foldable electronic device is unfolded according to an embodiment.

[0183] Referring to Figure 21 , when the adhesive member 1154 is attached on two different flexible connection members 1151 and 1152, the designated shapes of the flexible connection members 1151 and 1152 are maintained even when the foldable electronic device is repeatedly folded and unfolded. In addition, by forming a plurality of slits 1155 in the adhesive member 1154, the uniformity of the designated shapes of the flexible connection members 1151 and 1152 can be further improved. When Figure 21 comparing the embodiment shown in Figure 9 , it can be seen that the uniformity of the designated shapes of the first flexible connection member 1151 and the second flexible connection member 1152 is significantly improved in the embodiment shown in Figure 9 , for example, in the embodiment shown in Figure 21 , it can be seen that the designated shapes of the first flexible connection member 1151 and the second flexible connection member 1152 are not disturbed in the portion corresponding to P1 in Figure 21 , in addition, in the embodiment shown in Figure 9 , it is possible to prevent or significantly reduce friction with the structure (e.g., the hinge cover 1170) of the foldable electronic device. Figure 21

[0184] Figure 22 is a view showing a state in which the designated shape of the flexible connection member 1250 is maintained when the foldable electronic device is unfolded according to an embodiment. ​​

[0185] Referring to Figure 22 , the flexible connection member 1250 is a multi-layer flexible connection member 1250. When the foldable electronic device is repeatedly folded and unfolded, the stack portion of the multi-layer flexible connection member 1250 can be separated and the designated shape can be disturbed. To prevent this, by forming one or more slits 1255 in at least one outermost layer of the multi-layer flexible connection member 1250, as described above, it can be seen that the designated shape of the plurality of flexible connection members 1250 is maintained even when the foldable electronic device is repeatedly folded and unfolded. For example, in the embodiment shown in Figure 22 , it can also be seen that the designated shape of the first flexible connection member 1250 is not disturbed. Furthermore, in the embodiment shown in Figure 22 , friction with the structure (e.g., the hinge cover 1270) of the foldable electronic device can be prevented or significantly reduced.

[0186] An electronic device according to various embodiments can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0187] It should be understood that various embodiments disclosed herein and languages used to describe the disclosure herein shall not be limited to specific embodiments set forth herein, but include various changes, modifications, equivalents, or alternatives for corresponding embodiments. For the description of the drawings, like reference numerals can be used to refer to similar or related elements. It will be understood that singular forms of the nouns such as "a," "an," and "the" include one or more of the things referred to, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items enumerated together with all possible combinations of the items in the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" can be used to simply distinguish a corresponding component from another, and do not otherwise limit the component in terms of importance or order. It will be understood that, if an element (for example, a first element) is referred to as being "operatively or communicatively connected" or "connected to" another element (for example, a second element), it means that the element can be directly connected to the other element (for example, directly wiredly connected), wirelessly connected to the other element, or connected to the other element via a third element, even if the term "operatively or communicatively" is not used.

[0188] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms, for example, "logic," "logic block," "part," or "circuitry." The module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0189] Various embodiments as set forth herein can be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with such that the machine is operated to perform at least one function. The one or more instructions can include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Wherein, the term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium versus being temporarily stored.

[0190] The method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed online via an application store (e.g., PlayStore TM ). If the computer program product is distributed online, at least part of the computer program product can be temporarily stored in a server of the management server, an application store, or a relay server, etc. And, the computer program product distributed online can be momentarily stored in the memory of the seller and / or the buyer during the distribution, for example.

[0191] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities. According to various embodiments, one or more of the above-described components or operations can be omitted, or other components or operations can be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) can be integrated into a single component. In such a case, the integrated component can still perform one or more functions of the plurality of components in the same or similar manner as they are performed by the plurality of components before the integration. According to various embodiments, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more operations of the operations can be executed in a different order or omitted, or one or more other operations can be added.

[0192] According to an embodiment, a foldable electronic device includes a hinge structure; a foldable housing including a folding area in which the electronic device is substantially folded with respect to a folding axis, the foldable housing including a first housing structure connected to the hinge structure, the first housing structure including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and a first printed circuit board on which a plurality of electronic components are mounted; and a second housing structure connected to the hinge structure, the second housing structure including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction, and a second printed circuit board on which a plurality of electronic components are mounted, the second housing structure being folded with respect to the first housing structure about the hinge structure; a flexible display disposed inside the foldable housing and extending from the first surface of the first housing structure to the third surface of the second housing structure; a first flexible connection member placed across at least a portion of an inside of the first housing structure and at least a portion of an inside of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends disposed at opposite ends of the first flexible connection member, the first flexible connection member including a wiring configured to transmit a communication signal including an RF signal; a second flexible connection member placed across at least a portion of the inside of the first housing structure and at least a portion of the inside of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends disposed at opposite ends of the second flexible connection member, the second flexible connection member including a power line; and an adhesive member attached to the first flexible connection member so as to maintain the first flexible connection member in a specified area without changing its shape when the foldable housing is folded and unfolded.

[0193] The adhesive member can be provided on each of a top surface and a bottom surface of the first flexible connection member.

[0194] The adhesive member can be attached to at least a portion of the first flexible connection member, and can include a portion extending from a portion attached to at least a portion of the first flexible connection member and attached to the second flexible connection member, thereby connecting the first flexible connection member and the second flexible connection member.

[0195] Each of the first flexible connection member and the second flexible connection member can include, along a longitudinal direction thereof, rigid portions fixed to one side of the first housing structure and one side of the second housing structure, respectively, and a flexible portion disposed between the rigid portions.

[0196] The flexible portion can be configured to be movable in a space inside the hinge structure.

[0197] The adhesive member can be stacked on the flexible portion of the first flexible connection member and the flexible portion of the second flexible connection member.

[0198] At least one of the opposite sides of the adhesive member can be connected to the rigid portions of the first flexible connection member and the second flexible connection member.

[0199] The first flexible connection member and the second flexible connection member can be substantially branched from one flexible connection member.

[0200] The first flexible connection member or the second flexible connection member can include an RF wiring.

[0201] One or more slits can be formed in a direction parallel to the folding axis.

[0202] A plurality of slits can be provided, and the plurality of slits can be arranged to be spaced apart from each other at a greater interval as the distance from the center of the folding axis increases.

[0203] A plurality of slits can be provided, and the width of the slits farther from the center of the folding axis can be greater than the width of the slits closer to the center of the folding axis.

[0204] According to an embodiment, a foldable electronic device includes a hinge structure; a foldable housing including a folding area in which the electronic device is substantially folded with respect to a folding axis, the foldable housing including a first housing structure connected to the hinge structure, the first housing structure including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, and a first printed circuit board on which a plurality of electronic components are mounted; and a second housing structure connected to the hinge structure, the second housing structure including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction, and a second printed circuit board on which a plurality of electronic components are mounted, the second housing structure being configured to be foldable with respect to the first housing structure about the hinge structure, wherein, in a folded state, the first surface faces the third surface, and in an unfolded state, the third direction is the same as the first direction; a flexible display arranged inside the foldable housing and extending from the first surface of the first housing structure to the third surface of the second housing structure; and a multi-layer flexible connection member placed across at least a portion of an inside of the first housing structure and at least a portion of an inside of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection ends arranged at opposite ends of the multi-layer flexible connection member, wherein one or more slits are formed in a portion of the multi-layer flexible connection member corresponding to the hinge structure.

[0205] The one or more slits can be formed in each of an uppermost layer and a lowermost layer of the multi-layer flexible connection member.

[0206] The multi-layer flexible connection member can include, along a longitudinal direction thereof, rigid portions respectively fixed to one side of the first housing structure and one side of the second housing structure, and a flexible portion arranged between the rigid portions and configured to move in a space inside the hinge structure, and the one or more slits can be formed in the flexible portion.

[0207] The one or more slits can be formed in a direction parallel to the folding axis.

[0208] A plurality of slits can be provided, and the plurality of slits can be arranged to be spaced apart from each other at a greater interval as a distance from a center of the folding axis increases.

[0209] A plurality of slits can be provided, and the plurality of slits can be arranged at a smaller density as a distance from a center of the folding axis increases.

[0210] A plurality of slits can be provided, and the width of the slits farther from the center of the folding axis can be greater than the width of the slits closer to the center of the folding axis.

[0211] The multi-layer flexible connection member can include a first multi-layer flexible connection member placed across at least a portion of the interior of the first housing structure and at least a portion of the interior of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection terminals arranged at opposite ends of the first multi-layer flexible connection member, and a second multi-layer flexible connection member placed across at least a portion of the interior of the first housing structure and at least a portion of the interior of the second housing structure and configured to electrically connect the first printed circuit board and the second printed circuit board via connection terminals arranged at opposite ends of the second multi-layer flexible connection member. One or more slits can be formed in at least one of the uppermost layer and the lowermost layer of the first multi-layer flexible connection member, and in at least one of the uppermost layer and the lowermost layer of the second multi-layer flexible connection member.

[0212] While the disclosure has been particularly shown and described with reference to certain embodiments thereof, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope of the disclosure as defined by the following claims and their equivalents.

Claims

1. A foldable electronic device, comprising: a foldable housing comprising a first housing portion, a second housing portion, and a hinge structure connecting the first housing portion and the second housing portion, the foldable housing being configured to fold about a folding axis; a flexible display housed in the first housing portion and the second housing portion; a plurality of printed circuit boards (PCBs), the plurality of PCBs including a first PCB accommodated in the first housing portion and a second PCB accommodated in the second housing portion; a first flexible printed circuit board (FPCB) configured to be electrically connected to the first PCB and the second PCB, the first FPCB including a first flexible portion located at a position passing through a designated area of ​​the hinge structure, the first FPCB including a first fixing portion for being attached to a side surface of the first housing portion and a second fixing portion for being attached to a side surface of the second housing portion; a second FPCB configured to be electrically connected to the first PCB and the second PCB, the second FPCB including a second flexible portion located at a position passing through a designated area of ​​the hinge structure, the second FPCB including a third fixing portion for being attached to a side surface of the first housing portion and a fourth fixing portion for being attached to a side surface of the second housing portion, wherein the second flexible portion of the second FPCB is spaced apart from the first flexible portion of the first FPCB, an adhesive member attached to the first FPCB between the first fixing portion and the second fixing portion and to the second FPCB between the third fixing portion and the fourth fixing portion, thereby maintaining the shape or position of a portion of the first flexible portion and a portion of the second flexible portion when the foldable housing is folded and unfolded.

2. The foldable electronic device according to claim 1, in, The first fixing portion and the third fixing portion are attached to a portion of the hinge structure located in the first housing portion, and The second fixing portion and the fourth fixing portion are attached to a portion of the hinge structure located in the second housing portion.

3. The foldable electronic device according to claim 1, wherein: The adhesive member is disposed on each of the top and bottom surfaces of the first FPCB.

4. The foldable electronic device according to claim 1, wherein: The adhesive member is attached to at least a portion of the first FPCB, and a portion of the adhesive member extends from the at least a portion of the first FPCB and is attached to the second FPCB, thereby connecting the first and second FPCBs.

5. The foldable electronic device according to claim 1, wherein: The first FPCB and the second FPCB are branched from one FPCB.

6. The foldable electronic device according to claim 1, wherein: The bonding member has one or more slits formed therein.

7. The foldable electronic device according to claim 6, wherein: The one or more slits are formed in a direction parallel to the folding axis.

8. The foldable electronic device according to claim 6, wherein: A plurality of slits are provided, and the plurality of slits are arranged to be spaced apart from each other at larger intervals as the distance from the center of the folding axis increases.

9. The foldable electronic device according to claim 6, wherein: A plurality of slits are provided, and the width of the slits located at positions away from the center of the folding axis is greater than the width of the slits located at positions close to the center of the folding axis.

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