Chip on film and display device

Abstract

The present disclosure provides a kind of chip on film and display device.The chip on film includes: substrate;Chip, is located on the substrate;Multiple leads, are located on the substrate, and are spaced distribution, one end of each lead is connected to the chip, and the other end is used to be connected with the multiple data signal lines of a display panel one by one;Wherein, at least two lengths of the lead in multiple leads are different, and the length of the data signal line connected to the lead with greater length is less than the length of the data signal line connected to the lead with smaller length.The present disclosure can improve display quality.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a flip-chip film and a display device. Background Technology

[0002] Flat panel displays have become the mainstream product in the market, and the types of flat panel displays are also increasing, such as liquid crystal displays (LCDs), organic light-emitting diode (OLED) displays, plasma display panels (PDPs), and field emission displays (FEDs). Current flat panel display technology is developing towards higher resolution and higher refresh rates. However, these displays suffer from the problem of poor image quality. Summary of the Invention

[0003] The purpose of this disclosure is to provide a flip-chip film and a display device that can improve display image quality.

[0004] According to one aspect of this disclosure, a flip-chip thin film is provided, comprising:

[0005] Base;

[0006] The chip is disposed on the substrate;

[0007] Multiple leads are disposed on the substrate and spaced apart. One end of each lead is connected to the chip, and the other end is used to connect to multiple data signal lines of a display panel one by one.

[0008] Among the plurality of leads, at least two leads have different lengths, and the data signal line connected to the lead with the larger length is shorter than the data signal line connected to the lead with the smaller length.

[0009] Furthermore, the boundary of the chip includes a first boundary segment, at least a portion of the leads are distributed sequentially along the extension trajectory of the first boundary segment, and the length of the leads distributed sequentially along the first boundary segment increases or decreases.

[0010] Furthermore, multiple leads are distributed sequentially along the boundary of the chip; the boundary of the chip also includes a second boundary segment, the starting point of the first boundary segment coincides with the starting point of the second boundary segment;

[0011] The lengths of the leads distributed sequentially from the start point to the end point of the first boundary segment decrease.

[0012] The lengths of the leads distributed sequentially from the start point to the end point of the second boundary segment decrease.

[0013] Furthermore, the boundary of the chip includes two straight edges that are positioned opposite each other;

[0014] The starting point and the ending point of the first boundary segment are located on the same straight edge; or

[0015] The starting point and the ending point of the first boundary segment are located on different straight edges; or

[0016] The starting point and the ending point of the second boundary segment are located on the same straight edge; or

[0017] The start point and the end point of the second boundary segment are located on different straight edges.

[0018] Furthermore, the endpoint of the first boundary segment coincides with the endpoint of the second boundary segment.

[0019] Furthermore, the boundary of the chip includes two straight edges arranged opposite each other, the start point and the end point of the first boundary segment are located on different straight edges, and a straight line passing through the start point and the end point of the first boundary segment is perpendicular to the straight edge.

[0020] Furthermore, among the leads of different lengths, at least one lead includes at least two trace segments with different extension directions.

[0021] Furthermore, the length difference between the two leads is proportional to the capacitance difference between the two leads.

[0022] Furthermore, the absolute value of the capacitance difference between the two leads is greater than or equal to the absolute value of the capacitance difference between the two data signal lines corresponding to the two leads.

[0023] According to one aspect of this disclosure, a display device is provided, comprising:

[0024] The aforementioned flip-chip film;

[0025] The display panel includes multiple data signal lines, and the multiple data signal lines are connected to the multiple leads one by one.

[0026] In the flip-chip film and display device disclosed herein, the length of the data signal line connected by the longer lead is less than the length of the data signal line connected by the shorter lead. Since the capacitance of the longer lead is greater than the capacitance of the shorter lead, and the capacitance of the longer data signal line is greater than the capacitance of the shorter data signal line, the capacitance of the data signal line of the display panel is compensated by the leads on the flip-chip film, thereby improving the display quality of the display panel. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a flip-chip thin film according to an embodiment of the present disclosure.

[0028] Figure 2 This is a schematic diagram of a chip according to an embodiment of this disclosure.

[0029] Explanation of reference numerals in the attached diagram: 1. Chip; 101. First straight edge; 102. Second straight edge; 103. Third straight edge; 104. Fourth straight edge; 2. Lead; 201. First lead; 202. Second lead; 3. Pad; 4. First boundary segment; 5. Second boundary segment. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0031] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the disclosure. Unless otherwise defined, the technical or scientific terms used in this disclosure should be understood in their ordinary sense by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “a” or “one,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. “A plurality” or “several” indicates two or more. Unless otherwise stated, the terms “front,” “rear,” “lower,” and / or “upper,” and similar terms are for ease of description only and are not limited to a location or spatial orientation. The terms “comprising,” “including,” and similar terms mean that the elements or objects preceding “comprising,” encompass the elements or objects listed following “comprising,” and their equivalents, and do not exclude other elements or objects. The terms “connected,” “linked,” and similar terms are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this disclosure and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0032] In related technologies, a display panel includes multiple sub-pixels arranged in an array, and these sub-pixels can form multiple pixel columns. The display panel also includes multiple display data signal lines. The pixel circuits of multiple sub-pixels in the same pixel column can be connected to the same display data signal line. Display data signals are written to the pixel circuits of the sub-pixels by charging the display data signal line. As the size of display panels continues to increase, their refresh rates also increase, even reaching 500 / 1000Hz. This poses a significant challenge to the charging rate of the display panel. Insufficient charging of the display data signal lines can cause poor display quality (e.g., uneven light emission), and some of these defects need to be improved by adding compensation capacitors to the display data signal lines.

[0033] This disclosure uses simulation to examine the capacitance of wiring and finds that the capacitance of wiring satisfies the following disclosure:

[0034] y = mx + n;

[0035] y represents the capacitance of the wiring, x represents the wiring length, and m is greater than 0. It can be seen that the capacitance of the wiring is linearly related to the wiring length; the longer the wiring length, the greater the capacitance of the wiring.

[0036] This disclosure provides a flip-chip thin film. For example... Figure 1 As shown, the flip-chip film may include a substrate, a chip 1, and multiple leads 2, wherein:

[0037] The chip 1 is disposed on a substrate. Multiple leads 2 are disposed on the substrate and spaced apart. One end of each lead 2 is connected to the chip 1, and the other end of each lead 2 is used to connect one-to-one with multiple data signal lines of the display panel. At least two of the multiple leads 2 have different lengths, and the data signal line connected to the longer lead 2 is shorter than the data signal line connected to the shorter lead 2.

[0038] In the flip-chip film of this embodiment, the length of the data signal line connected by the longer lead 2 is less than the length of the data signal line connected by the shorter lead 2. Since the capacitance of the longer lead 2 is greater than the capacitance of the shorter lead 2, the capacitance of the longer data signal line is greater than the capacitance of the shorter data signal line. Thus, the capacitance of the data signal line of the display panel is compensated by the lead 2 on the flip-chip film, thereby improving the display quality of the display panel.

[0039] The following is a detailed description of each part of the flip-chip film according to the present disclosure:

[0040] The substrate can be a flexible substrate. The material of the flexible substrate can be PI (Polyimide), PA (Polyamide), or PBO (Poly-p-phenylene benzobisoxazole).

[0041] The chip 1 is disposed on a substrate. The chip 1 includes multiple pins, each connected to a corresponding lead 2, to write data signals to the lead 2, and subsequently to data signal lines connected to the lead 2. The boundary of the chip 1 can be annular, such as rectangular, square, circular, or trapezoidal. The boundary of the chip 1 refers to the boundary of the chip 1's orthographic projection onto the substrate. The boundary of the chip 1 may include two opposing straight edges. Taking a rectangular boundary as an example, the boundary of the chip 1 has a first straight edge 101, a second straight edge 102, a third straight edge 103, and a fourth straight edge 104 connected in sequence. The first straight edge 101 and the third straight edge 103 are opposite each other, and the second straight edge 102 and the fourth straight edge 104 are opposite each other. The length of the first straight edge 101 can be greater than the length of the second straight edge 102.

[0042] like Figure 2 As shown, the boundary of chip 1 includes a first boundary segment 4 ( Figure 2(The portion to the left of the straight line L). Taking a rectangular or square boundary of chip 1 as an example, the starting point and the ending point of the first boundary segment 4 can be located on the same straight edge of chip 1. Of course, as... Figure 2 As shown, the starting point O and the ending point Q of the first boundary segment 4 can be located on two opposite straight edges, for example, the starting point O of the first boundary segment 4 is located on the first straight edge 101, and the ending point Q of the first boundary segment 4 is located on the third straight edge 103. In other embodiments of this disclosure, the starting point and the ending point of the first boundary segment 4 can be located on two adjacent straight edges, for example, the starting point of the first boundary segment 4 is located on the first straight edge 101, and the ending point of the first boundary segment 4 is located on the second straight edge 102. The straight line L passing through the starting point and the ending point of the first boundary segment 4 (see...) Figure 2 It can be perpendicular to the first straight side 101, and the starting point O of the first boundary segment 4 can be the midpoint of the first straight side 101.

[0043] like Figure 2 As shown, the boundary of chip 1 may further include a second boundary segment 5. Figure 2 (The portion to the right of the straight line L). Taking a rectangular or square boundary of chip 1 as an example, the starting point and the ending point of the second boundary segment 5 can be located on the same straight edge of chip 1. Of course, the starting point and the ending point of the second boundary segment 5 can be located on two opposite straight edges, for example, as shown in the example. Figure 2 As shown, the starting point O1 of the second boundary segment 5 is located on the first straight edge 101, and the ending point Q1 of the second boundary segment 5 is located on the third straight edge 103. In other embodiments of this disclosure, the starting point and the ending point of the second boundary segment 5 may be located on two adjacent straight edges, for example, the starting point of the second boundary segment 5 may be located on the first straight edge 101, and the ending point of the second boundary segment 5 may be located on the fourth straight edge 104. The starting point O of the first boundary segment 4 may coincide with the starting point O1 of the second boundary segment 5, but this disclosure does not impose any special limitation on this. The ending point Q of the first boundary segment 4 may coincide with the ending point O1 of the second boundary segment 5, but this disclosure does not impose any special limitation on this. The length of the first boundary segment 4 may be equal to the length of the second boundary segment 5; of course, the length of the first boundary segment 4 may be greater than or less than the length of the second boundary segment 5.

[0044] like Figure 1As shown, multiple leads 2 are disposed on the substrate and spaced apart. The multiple leads 2 can be disposed in the same layer, meaning they can be fabricated in a single photolithography process. The material of the leads 2 can be silver, but it can also be copper, etc. In other embodiments of this disclosure, the leads 2 have a stacked structure in the thickness direction of the substrate. Embodiments of this disclosure may also include a protective layer covering the leads 2 and the substrate. The protective layer can be an insulating material. The protective layer may have a first bonding opening and a second bonding opening. The first bonding opening and the second bonding opening can be spaced apart. The first bonding opening can expose one end of each lead 2, and the second bonding opening can expose the other end of each lead 2. The first bonding opening can be circular, but it can also be rectangular or square, but this disclosure is not limited to these. The second bonding opening can be rectangular, but it can also be strip-shaped, but this disclosure is not limited to these. The chip 1 described above can be disposed at the first bonding opening so that the chip 1 is connected to one end of each lead 2. Taking the boundary of chip 1 as rectangular or square as an example, the first straight edge 101 mentioned above can be located between the third straight edge 103 and the second binding opening, and the strip-shaped second binding opening can be parallel or approximately parallel to the first straight edge 101.

[0045] At least two of the plurality of leads 2 have different lengths, and the data signal line connected to the longer lead 2 is shorter than the data signal line connected to the shorter lead 2. This data signal line can be a display data signal line to write display data signals to the pixel circuit. Alternatively, it can be a gate scan data signal line to write gate scan data signals to the pixel circuit. In other embodiments of this disclosure, the data signal line can also be a touch data signal line to write touch drive signals to the touch electrode. Further, at least a portion of the plurality of leads 2 are sequentially distributed along the extension trajectory of the first boundary segment 4, and the length of the leads 2 sequentially distributed along the first boundary segment 4 increases or decreases. At least a portion of the plurality of leads 2 are sequentially distributed along the extension trajectory of the second boundary segment 5, and the length of the leads 2 sequentially distributed along the second boundary segment 5 increases or decreases. The number of "at least a portion of leads 2" can be greater than or equal to 2. "Increasing" refers to the length of the lead 2 gradually increasing, and "decreasing" refers to the length of the lead 2 gradually decreasing. Furthermore, in the aforementioned sequentially distributed leads 2, the distance between any two adjacent leads 2 can be equal, or unequal. Taking the starting point of the first boundary segment 4 coinciding with the starting point of the second boundary segment 5, and the starting point of the first boundary segment 4 located on the first straight side 101 as an example, the lengths of the sequentially distributed leads 2 decrease from the starting point to the ending point of the first boundary segment 4; similarly, the lengths of the sequentially distributed leads 2 decrease from the starting point to the ending point of the second boundary segment 5. It should also be noted that the cross-sectional areas of the multiple leads 2 can be the same, or different, but this embodiment is not limited to this. The length difference between two leads 2 with different lengths is proportional to the capacitance difference between the two leads 2. For example, the length difference between the first lead 201 and the second lead 202 is proportional to the capacitance difference between the first lead 201 and the second lead 202. Furthermore, (the capacitance of the first lead 201 - the capacitance of the second lead 202) can be greater than or equal to (the capacitance of the data signal line connected to the second lead 202 - the capacitance of the data signal line connected to the first lead 201), that is, the absolute value of the capacitance difference between the two leads 2 is greater than or equal to the absolute value of the capacitance difference between the two data signal lines.

[0046] At least one of the aforementioned leads 2 of different lengths includes at least two trace segments with different extension directions. This disclosure adjusts the length of the lead 2 by controlling the lengths of the trace segments with different extension directions. Furthermore, each lead 2 includes at least two trace segments with different extension directions. In addition, the number of trace segments included in different leads 2 may be different, but this disclosure does not limit this. Figure 1As shown, the first lead 201 includes a trace segment of length a, two trace segments of length b, a trace segment of length c, and a trace segment of length d. Therefore, the length of the first lead 201 is (a+2b+c+d). The second lead 202 includes a trace segment of length e, a trace segment of length f, a trace segment of length g, and a trace segment of length h. Therefore, the length of the second lead 202 is (e+f+g+h). To make the length of the first lead 201 greater than the length of the second lead 202, this disclosure can increase the length of the trace segment of length b in the first lead 201 so that the length of the first lead 201 is greater than the length of the second lead 202.

[0047] This disclosure also provides a display device. The display device may include a display panel and the flip-chip thin film described in any of the above embodiments. The display panel may include a plurality of data signal lines, each of which is connected to a plurality of leads in a one-to-one correspondence. Specifically, as... Figure 1 As shown, lead 2 is connected to the data signal line via pad 3 on the display panel. This display device can be a mobile phone, or of course, a tablet computer, a television, etc. Since the touch panel in the display device of this embodiment is the same as the touch panel in the above-described embodiments, it has the same beneficial effects, and will not be described again here.

[0048] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure in any way. Although this disclosure has been disclosed above with reference to a preferred embodiment, it is not intended to limit this disclosure. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this disclosure. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this disclosure without departing from the content of the technical solution of this disclosure shall still fall within the scope of the technical solution of this disclosure.

Claims

1. A flip-chip thin film, characterized in that, include: Base; The chip is disposed on the substrate; Multiple leads are disposed on the substrate and spaced apart. One end of each lead is connected to the chip, and the other end is used to connect one-to-one with multiple data signal lines of a display panel. The leads and the data signal lines are connected through pads on the display panel. Among the plurality of leads, at least two leads have different lengths, and the data signal line connected to the longer lead is shorter than the data signal line connected to the shorter lead; the chip boundary includes a first straight edge and a third straight edge disposed opposite to each other, the first straight edge being located between the pad and the third straight edge; the plurality of leads include a first lead connected to the first straight edge and a second lead connected to the third straight edge; the length of the first lead is greater than the length of the second lead; the first lead includes at least partially disposed first and second trace segments disposed opposite to each other, and the extension directions of the first and second trace segments are the same as the extension direction of the first straight edge; the second lead includes at least partially disposed third and fourth trace segments disposed opposite to each other, and the extension directions of the third and fourth trace segments intersect the extension direction of the first straight edge; the sum of the lengths of the first and second trace segments is greater than the sum of the lengths of the third and fourth trace segments.

2. The flip-chip thin film according to claim 1, characterized in that, The chip's boundary includes a first boundary segment, and at least a portion of the leads are sequentially distributed along the extension trajectory of the first boundary segment, with the length of the leads sequentially distributed along the first boundary segment increasing or decreasing.

3. The flip-chip thin film according to claim 2, characterized in that, Multiple leads are distributed sequentially along the boundary of the chip; the boundary of the chip further includes a second boundary segment, the starting point of the first boundary segment coincides with the starting point of the second boundary segment; The lengths of the leads distributed sequentially from the start point to the end point of the first boundary segment decrease. The lengths of the leads distributed sequentially from the start point to the end point of the second boundary segment decrease.

4. The flip-chip thin film according to claim 3, characterized in that, The chip's boundary includes two straight edges that are positioned opposite each other; The starting point and the ending point of the first boundary segment are located on the same straight edge; or The starting point and the ending point of the first boundary segment are located on different straight edges; or The starting point and the ending point of the second boundary segment are located on the same straight edge; or The start point and the end point of the second boundary segment are located on different straight edges.

5. The flip-chip thin film according to claim 3, characterized in that, The endpoint of the first boundary segment coincides with the endpoint of the second boundary segment.

6. The flip-chip thin film according to claim 5, characterized in that, The chip's boundary includes two straight edges positioned opposite each other. The start point and the end point of the first boundary segment are located on different straight edges, and a straight line passing through the start point and the end point of the first boundary segment is perpendicular to the straight edges.

7. The flip-chip thin film according to claim 1, characterized in that, At least one of the leads of different lengths includes at least two trace segments with different extension directions.

8. The flip-chip thin film according to claim 1, characterized in that, The difference in length between the two leads is proportional to the difference in capacitance between the two leads.

9. The flip-chip thin film according to claim 1, characterized in that, The absolute value of the capacitance difference between the two leads is greater than or equal to the absolute value of the capacitance difference between the two data signal lines connected to the corresponding leads.

10. A display device, characterized in that, include: The flip-chip thin film according to any one of claims 1-9; The display panel includes multiple data signal lines, and the multiple data signal lines are connected to the multiple leads one by one.

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