Display device

Abstract

The display device comprises: a plurality of display modules, each comprising a module substrate and a plurality of light-emitting elements mounted on the module substrate; and a support substrate on which the plurality of display modules are arranged. Each of the module substrates is provided with a through hole penetrating the module substrate and a via provided in the through hole, and the light-emitting element is electrically connected to the wiring on the support substrate through the via.

Description

Technical Field

[0001] The present invention relates to a display device, and in particular to a large-area multi-module display device. Background Art

[0002] Recently, a display device using a light emitting diode (LED) is being developed. The display device using a light emitting diode is obtained by finally forming a structure in which red (R: Red), green (G: Green) and blue (B: Blue) light emitting diodes (LEDs) are grown separately on a substrate.

[0003] However, in addition to the demand for high-resolution full-color display devices, the demand for display devices implemented in various areas (especially, large areas) is also continuously increasing. Summary of the invention

[0004] Technical issues

[0005] The invention provides a high-quality large-area multi-module display device and a manufacturing method thereof.

[0006] Technical Solution

[0007] A display device according to an embodiment of the present invention comprises: a plurality of display modules, each comprising a module substrate and a plurality of light-emitting elements mounted on the module substrate; and a support substrate on which the plurality of display modules are arranged. Each of the module substrates is provided with a through hole penetrating the module substrate and a via provided in the through hole, and the light-emitting element is electrically connected to the wiring on the support substrate through the via.

[0008] In one embodiment of the present invention, each of the via components may include: an upper pad provided on the upper surface of the module substrate; a lower pad provided on the lower surface of the module substrate; and an internal electrode provided in the through hole, wherein the lower pad and the supporting substrate may be connected in a ball grid array (BGA) manner.

[0009] In an embodiment of the present invention, the display device may further include: a connection wiring provided on the lower surface of the module substrate, wherein the connection wiring may be electrically connected to the wiring of the support substrate.

[0010] In an embodiment of the present invention, the module substrate may have a plurality of recessed portions recessed from a lower surface of the module substrate, and the connection wiring may be provided in the recessed portions.

[0011] In one embodiment of the present invention, the module substrate may include: a pixel area provided with the light emitting element to display an image; and a non-pixel area surrounding the pixel area, wherein a part or all of the connection wiring may be provided in the pixel area.

[0012] In an embodiment of the present invention, a portion of the through holes may be provided in the pixel region.

[0013] In an embodiment of the present invention, a portion of the through holes may be provided in a region corresponding to the recessed portion.

[0014] In an embodiment of the present invention, the support substrate may have a protrusion corresponding to the recessed portion on a surface facing the module substrate.

[0015] In an embodiment of the present invention, the protrusion may include a conductive material and may be electrically connected to a wiring of the support substrate.

[0016] In an embodiment of the present invention, the support substrate may have a conductive electrode portion provided on a surface facing the module substrate, and the via member may be in contact with the conductive electrode portion.

[0017] In one embodiment of the present invention, the support substrate may have a hole provided on a surface facing the module substrate and corresponding to the through hole, and the via member may be integrally provided in the through hole and the hole so as to contact the conductive electrode portion.

[0018] In an embodiment of the present invention, the through holes may be arranged along an edge of the module substrate.

[0019] The display device according to an embodiment of the present invention can be manufactured in the following manner: a plurality of display modules are manufactured, and the plurality of display modules are provided on a supporting substrate. The steps of manufacturing each of the plurality of display modules may include the following steps: forming a light-emitting element on a module substrate; forming a through hole on the module substrate; and forming a driving circuit portion on the lower surface of the module substrate, and electrically connecting the light-emitting element and the driving circuit portion through the through hole.

[0020] In one embodiment of the present invention, the through hole may be formed by using a laser.

[0021] In one embodiment of the present invention, when manufacturing the display device, the step of grinding the edge of the module substrate on which the light-emitting element is formed may be further included. Furthermore, the step of forming a plurality of recesses on the lower surface of the module substrate by laser processing may be further included. In addition, the step of forming connection wiring in the recesses may be further included, and the step of forming a protrusion at a position corresponding to the recess on the support substrate may be further included.

[0022] In one embodiment of the present invention, when manufacturing the display substrate, the following steps may be further included: forming a hole at a position corresponding to the through hole on the upper surface of the support substrate; and forming a via member in the through hole and the hole.

[0023] Effects of the Invention

[0024] According to an embodiment of the present invention, a large-area display device is provided that minimizes problems such as image separation or dark lines appearing in images. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a perspective view schematically illustrating a display device according to an embodiment of the present invention.

[0026] Figure 2a The diagram is equivalent to Figure 1 A plan view of a portion of P1, Figure 2b is along Figure 2a A cross-sectional view along the A-A' line.

[0027] Figure 3 FIG. 1 is a cross-sectional view schematically illustrating a light emitting element according to an embodiment of the present invention.

[0028] Figure 4 FIG. 1 is a diagram showing a state in which a driving circuit portion is independently provided on the lower surface of a module substrate in a display device according to an embodiment of the present invention.

[0029] Figure 5a to Figure 5e The following are views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention.

[0030] Figure 6 FIG. 4 is a diagram illustrating a connection structure between a display module and a support substrate in a display device according to an embodiment of the present invention.

[0031] Figure 7 FIG. 4 is a diagram illustrating a connection structure between a display module and a support substrate in a display device according to an embodiment of the present invention.

[0032] Figure 8 is a structural diagram showing a display device according to an embodiment of the present invention.

[0033] Fig. 9 is a plan view showing a state in which light emitting elements are arranged in a different form from the above-mentioned embodiment in one embodiment of the present invention, and shows Figure 1 The part corresponding to P1.

[0034] Fig.10a is a plan view showing a state in which light emitting elements are arranged in a different form from the above-mentioned embodiment in one embodiment of the present invention, and shows Figure 1 The part corresponding to P1, Fig.10b It is a simple diagram Fig.10a Conceptual diagram of the light-emitting element shown.

[0035] Fig.11 FIG. 1 is a schematic plan view showing a state where light emitting elements are arranged in another form in one embodiment of the present invention.

[0036] Explanation of symbols:

[0037] 100: display device 110: display module

[0038] 111: Pixel area 113: Pixel

[0039] 120: Module substrate 121: Through hole

[0040] 123: via 125: wiring part

[0041] 127: Recessed portion 129: Connection wiring

[0042] 130: Light emitting element 140: Conductive adhesive member

[0043] 150: driving circuit unit 155: timing control unit

[0044] 160: Support substrate 163: Conductive electrode portion DETAILED DESCRIPTION

[0045] The present invention is capable of various modifications and may have various forms, and specific embodiments are illustrated in the drawings and described in detail in this specification. However, this is not intended to limit the present invention to the specific disclosed forms, and should be understood to include all modifications, equivalents and even substitutes included in the concept and technical scope of the present invention.

[0046] The present invention relates to a display device including pixels. In the display device of the present invention, when the light emitting element is used as a pixel for displaying an image, the display device can be used. The display device includes a television, a tablet computer, an e-book display device, a computer monitor, an information kiosk, a digital camera, a game console, a mobile phone, a PDA, a large outdoor / indoor electronic display screen, etc.

[0047] A display device according to an embodiment of the present invention includes a micro-light emitting element. The micro-light emitting element may be an element having a width or length of about 1 micron to about 800 microns, or about 1 micron to about 500 microns, or about 10 microns to about 300 microns. However, the micro-light emitting element according to an embodiment of the present invention does not necessarily have a width or length within the above range, and may have a smaller or larger size as required. Hereinafter, micro-light emitting elements are referred to as "light emitting elements".

[0048] Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

[0049] Figure 1 is a perspective view schematically illustrating a display device according to an embodiment of the present invention. Figure 2a The diagram is equivalent to Figure 1 A plan view of a portion of P1, Figure 2b is along Figure 2a A cross-sectional view along the A-A' line.

[0050] Reference Figure 1 , Figure 2a as well as Figure 2b According to an embodiment of the present invention, a display device 100 includes a support substrate 160 and a plurality of display modules 110 arranged on the support substrate 160. Each display module 110 is a display module having a pixel region 111 for displaying an image, and can be arranged along rows and columns on the support substrate 160. At least one pixel can be formed in the pixel region 111 of the display module 110, and preferably, a plurality of pixels can be formed.

[0051] The support substrate 160, as a support substrate formed with a wiring portion and the light emitting element 130, can be provided as a rigid or flexible substrate. The support substrate 160 can be formed to have a larger area than a single display module 110, and accordingly, a plurality of display modules 110 can be mounted on the support substrate 160. In this embodiment, a display device 100 having a larger display screen can be realized by combining a plurality of display modules 110.

[0052] Each display module 110 includes: a module substrate 120 ; and a plurality of light emitting elements 130 mounted on the upper surface of the module substrate 120 .

[0053] The module substrate 120 of each display module 110 can be made of a variety of materials. For example, the module substrate 120 can be formed using a light-transmitting insulating material. The meaning of "light-transmitting" of the module substrate 120 includes not only the transparent case that allows all light to be transmitted, but also the semi-transparent or partially transparent case that only allows light of a predetermined wavelength or a part of light of a predetermined wavelength to be transmitted. Examples of the material of the module substrate 120 include glass, quartz, organic polymers, organic-inorganic composite materials, etc. However, the material of the module substrate 120 is not limited to this, and as a material with light transmittance, it is not particularly limited as long as it has insulating properties.

[0054] The module substrate 120 includes at least one pixel region 111 and a non-pixel region surrounding the pixel region 111. The pixel region 11 is a region provided with pixels, and corresponds to a region where light emitted from a light emitting element 130 described later travels and is recognized by a user. The non-pixel region is a region other than the pixel region 111. The non-pixel region is provided on at least one side of the pixel region 111, and in one embodiment of the present invention, is provided in a form surrounding the pixel region 111.

[0055] At least one light emitting element 130 is provided in the pixel region 111 . In one embodiment of the present invention, a case where a plurality of light emitting elements 130 are provided in the pixel region 111 is taken as an example for description.

[0056] The pixel unit 113 is the smallest unit for displaying an image. Each pixel unit 113 can emit white light and / or colored light. Each pixel unit 113 can include a pixel that emits one color, or can include a plurality of pixels that are different from each other, so that different color combinations can emit white light and / or colored light. For example, each display module 110 can include first to third pixels.

[0057] The pixel is provided in the pixel area 111 on the module substrate 120. At least one pixel may be provided in the pixel unit 113 of each display module 110. For example, each pixel unit 113 may include a first pixel to a third pixel. The first pixel to the third pixel may be implemented by a first light-emitting element to a third light-emitting element 130a, 130b, and 130c. That is, if the light emitted from the first pixel to the third pixel is respectively referred to as the first light to the third light, the first light to the third light may have different bands from each other. In one embodiment of the present invention, the first light to the third light may be equivalent to the blue, red, and green bands. However, the band of the light emitted by the pixels included in each display module 110 is not limited thereto, and may also be equivalent to the cyan, magenta, and yellow bands.

[0058] The light emitting element 130 may be provided for each pixel to provide light of multiple wavelengths. In one embodiment of the present invention, the light emitting element 130 may include first to third light emitting elements 130a, 130b, 130c that emit light of green, red and blue wavelengths, respectively, with first to third lights. At this time, the first to third light emitting elements 130a, 130b, 130c may be implemented by blue light emitting diodes, red light emitting diodes and green light emitting diodes. However, in order to achieve blue, red and green, it is not necessary for the first to third lights to have blue, red and green wavelengths, respectively. This is because, although not shown, even if the first to third lights have the same wavelength, the color of the final emitted light can be controlled by adding a light conversion layer that converts at least a portion of the first to third lights into light of different wavelengths. The light conversion layer may include materials such as phosphors and quantum dots that convert light of a predetermined wavelength into light of different wavelengths. In other words, in order to achieve green, red and / or blue, the first to third pixels do not necessarily have to use green, red and blue light emitting diodes, and diodes other than the above colors may be used. For example, to achieve red, a red light emitting diode may be used, but a blue or ultraviolet light emitting diode may also be used, and a light conversion layer may be used to absorb blue light or ultraviolet light and then emit red light.

[0059] Because the light-emitting element 130 is formed in a tiny size, it can be mounted on a flexible module substrate such as plastic by a method such as transfer. The light-emitting element 130 according to an embodiment of the present invention can be an inorganic light-emitting element. Unlike an organic light-emitting element, an inorganic substance can be grown in a thin film. Accordingly, the manufacturing process is simple and the yield can be improved. In addition, the light-emitting elements 130 separated into individual pieces can be transferred to a large-area substrate at the same time, thereby enabling the manufacture of a large-area display device. In particular, light-emitting elements made of inorganic materials have the advantages of high brightness, long life, and low unit price compared to organic light-emitting elements.

[0060] Although not shown in the drawings, a wiring portion may be arranged on the upper surface of the module substrate 120, and the wiring portion may include a plurality of wirings (data lines and / or scan lines described later). In one embodiment of the present invention, a wiring portion including a plurality of wirings may also be formed on the lower surface of the module substrate 120. The wiring portion may be provided in the pixel area 111 and the non-pixel area.

[0061] The wiring formed on the lower surface of the module substrate 120 can be connected to the separate driving circuit unit 150. The driving circuit unit 150 can be manufactured as a separate printed circuit substrate and arranged on the lower surface of the module substrate 120, and then connected to the wiring formed on the lower surface of the module substrate 120. Each wiring formed on the upper surface of the module substrate 120 can be connected to the wiring formed on the lower surface of the module substrate 120 through a through hole 121 described later, which will be described later.

[0062] In one embodiment of the present invention, although not shown in the figure, the module substrate 120 may be formed with not only a plurality of wirings but also a driving element for driving the light emitting element 130. In this case, the driving element may be a thin film transistor, and each thin film transistor may be connected to each light emitting element 130 according to a driving signal from the outside, so that each light emitting element 130 may be turned on or off.

[0063] As the first to third light emitting elements 130a, 130b, and 130c, various types of light emitting diodes may be used.

[0064] Figure 3 FIG. 1 is a cross-sectional view schematically illustrating a light emitting element 130 according to an embodiment of the present invention. Figure 3 The light emitting element 130 shown may be any one of the first to third light emitting elements 130a, 130b, and 130c.

[0065] Reference Figure 3 The light emitting element includes an element substrate 131, a first semiconductor layer 132, an active layer 133, a second semiconductor layer 134, a first contact electrode 135a, a second contact electrode 135b, an insulating film 136, a first contact pad 137a and a second contact pad 137b.

[0066] In one embodiment, for a light-emitting element emitting green light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include indium gallium nitride (InGaN), gallium nitride (GaN), aluminum indium gallium nitride (AlInGaN), gallium phosphide (GaP), aluminum gallium indium phosphide (AlGaInP), and aluminum gallium phosphide (AlGaP). In one embodiment, for a light-emitting element emitting red light, the first semiconductor layer 132, the active layer 133, and the second semiconductor layer 134 may include aluminum gallium arsenide (AlGaAs), gallium arsenide phosphide (GaAsP), aluminum gallium indium phosphide (AlGaInP), and gallium phosphide (GaP). In one embodiment, for a light emitting element emitting blue light, the first semiconductor layer 132 , the active layer 133 and the second semiconductor layer 134 may include gallium nitride (GaN), indium gallium nitride (InGaN), aluminum indium gallium nitride (AlInGaN) and zinc selenide (ZnSe).

[0067] The first semiconductor layer 132 and the second semiconductor layer 134 may be doped with different types of impurities, respectively, and may be an n-type semiconductor layer or a p-type semiconductor layer according to the type of the impurities. For example, the first semiconductor layer 132 may be an n-type semiconductor layer, and the second semiconductor layer 134 may be a p-type semiconductor layer. Conversely, the first semiconductor layer 132 may be a p-type semiconductor layer, and the second semiconductor layer 134 may be an n-type semiconductor layer.

[0068] In the drawings, the first semiconductor layer 132 and the second semiconductor layer 134 are shown as single layers, but these layers can be multiple layers and can also include a superlattice layer. The active layer 133 can include a single quantum well structure or a multi-quantum well structure, and the composition ratio of the nitride-based semiconductor is adjusted to emit a desired wavelength.

[0069] The second contact electrode 135 b is disposed on the first semiconductor layer 132 where the active layer 133 and the second semiconductor layer 134 are not provided, and the first contact electrode 135 a is disposed on the second semiconductor layer 134 .

[0070] The first contact electrode 135a and / or the second contact electrode 135b may be formed as a single layer or multiple layers. The material of the first contact electrode 135a and / or the second contact electrode 135b may include a variety of metals such as Al, Ti, Cr, Ni, Au, Ag, Cu, and alloys thereof, or may include a transparent conductive oxide layer such as indium tin oxide (ITO) and ZnO.

[0071] An insulating film 136 is provided on the first contact electrode 135a and the second contact electrode 135b, and a first contact pad 137a and a second contact pad 137b are provided on the insulating film 136 and are connected to the first contact electrode 135a and the second contact electrode 135b respectively through contact holes. In the present embodiment, the first contact electrode 135a is connected to the first contact pad 137a and the second contact electrode 135b is connected to the second contact pad 137b, but this is for the sake of convenience of explanation and is not limited thereto. For example, the first contact electrode 135a may also be connected to the second contact pad 137b, and the second contact electrode 135b may also be connected to the first contact pad 137a.

[0072] The first contact pad 137a and / or the second contact pad 137b may be formed of a single layer or multiple layers of metal. The first contact pad 137a and / or the second contact pad 137b may be made of metals such as Al, Ti, Cr, Ni, Au, and alloys thereof.

[0073] In one embodiment of the present invention, simply attach Figure 1 The light emitting element 130 is described above, but the light emitting element 130 may include layers having additional functions in addition to the above layers. For example, it may include a reflective layer for reflecting light, an additional insulating layer for insulating specific components, a solder resist layer for preventing solder from diffusing, and other layers.

[0074] exist Figure 3 In the figure, although the first contact pad and the second contact pad of the light emitting element are shown facing upward, when mounted on the module substrate, it can be turned over so that the first contact pad and the second contact pad are mounted in a direction facing the upper surface of the module substrate. The first contact pad and the second contact pad can be electrically connected to the wiring portion provided on the module substrate directly or by using a conductive adhesive member.

[0075] Re-reference Figure 1 , Figure 2a as well as Figure 2bIn a display device 100 according to an embodiment of the present invention, a common voltage and a data signal are applied to the light emitting element 130 so that the light emitting element is turned on to emit light. The emitted light passes through the lower module substrate 120 and travels toward the lower surface of the module substrate 120.

[0076] In one embodiment of the present invention, the display module 110 has a structure connected to a wiring portion formed on the support substrate 160, and in particular, has a structure connected thereto with a conductive electrode portion 163. Multiple types of wiring portions, circuits (e.g., multiple circuits for driving each pixel), etc. may be provided on the support substrate 160, and a driving signal is provided to the light emitting element 130 arranged on the display module 110 through the conductive electrode portion 163. For this purpose, a structure for connecting the conductive electrode portion 163 of the support substrate 160 and the wiring portion 125 on the upper surface of the module substrate 120 is provided on the module substrate 120 of the display module 110.

[0077] In one embodiment of the present invention, each module substrate 120 is provided with a through hole 121 that penetrates the module substrate 120. The through hole 121 may be provided in a non-pixel region that is not the pixel region 111, and accordingly, may be arranged along the edge of the module substrate 120. However, the position of the through hole 121 is not limited thereto, and although not shown, it may also be arranged in the pixel region 111. The through hole 121 may be provided as the number of the light emitting elements 130 and the number of the wiring portions 125 that can be connected to the light emitting elements 130, and for the sake of convenience of description, an arbitrary number is shown in the drawings.

[0078] Each through hole 121 is formed in a form that penetrates both surfaces of the module substrate 120. A via 123 is formed in each of the through holes 121. Each via 123 is composed of the following parts: an upper pad 123a formed on the upper surface of the module substrate 120; a lower pad 123c formed on the lower surface of the module substrate 120; and an internal electrode 123b, which corresponds to the inside of the through hole 121 and connects the upper pad 123a and the lower pad 123c. The upper pad 123a can be connected to the wiring part 125 formed on the upper surface of the module substrate 120, and the lower pad 123c can be connected to the wiring part 125 formed on the lower surface of the module substrate 120, or can be connected to the conductive electrode part 163 of the support substrate 160.

[0079] In one embodiment of the present invention, when a driving circuit unit 150 for driving the light emitting element 130 is separately provided on the lower surface of the module substrate 120 , the lower pad 123 c is connected to the driving circuit unit 150 via a wiring unit 125 provided on the lower surface of the module substrate 120 .

[0080] Figure 4FIG. 1 is a diagram showing a state in which a driving circuit unit 150 is provided separately on the lower surface of a module substrate 120 in a display device 100 according to an embodiment of the present invention.

[0081] Reference Figures 1 to 4 , the driving circuit unit 150 can be provided as a single number, but as shown in the figure, it can be provided as more than two. For example, the driving circuit unit 150 may include a first driving unit 151 and a second driving unit 153. The first driving unit 151 and the second driving unit 153 are electrically connected to the lower pad 123c of the via 123 through the wiring unit 125 formed on the lower surface of the module substrate 120. For example, the first driving unit 151 and the second driving unit 153 may be a scan driving unit and a data driving unit. The first driving unit 151 and the second driving unit 153 may be provided in an area corresponding to the pixel area 111 and / or the non-pixel area.

[0082] In the case where the driving circuit portion 150 is not provided separately on the lower surface of the module substrate 120, or even if provided, it is necessary to connect to an additional component, the lower pad 123c is connected to the conductive electrode portion 163 on the support substrate 160. When the lower pad 123c is connected to the conductive electrode portion 163 of the support substrate 160, the lower pad 123c and the conductive electrode portion 163 can be connected in a form where a conductive pasting member 140 such as solder paste is provided therebetween. Alternatively, when the lower pad 123c is connected to the conductive electrode portion 163 of the support substrate 160, it can be connected in a ball grid array manner. In this case, a solder ball can be provided between the lower pad 123c and the conductive electrode portion 163 of the support substrate 160.

[0083] The support substrate 160 may include a circuit including a voltage source for driving various elements (e.g., a timing controller, a memory such as an electrically erasable programmable read only memory (EEPROM), and the light emitting element 130) and a wiring portion including various wirings electrically connected to the conductive electrode portion 163. The support substrate 160 may also include a gate driving portion and a data driving portion for applying a scanning signal and an image signal to the scanning line and the data line, respectively.

[0084] In such a structure, driving signals outputted from the driving circuit unit 150 or various elements on the supporting substrate 160 are transmitted to the light emitting element 130 through the via 123 , whereby the light emitting element 130 is turned on or off to display an image.

[0085] As described above, the display device 100 according to an embodiment of the present invention is equivalent to a multi-module display device including a plurality of display modules 110. As an example, in Figure 1 In the embodiment, 4×5 display modules 110 constitute a display device 100 .

[0086] In this embodiment, the multiple display modules 110 can be driven separately or at least partially independently, or at least a part of the display modules 110 can be driven in a subordinate manner in conjunction with the remaining display modules 110. When the multiple display modules 110 are driven in conjunction, one image can be displayed.

[0087] In this embodiment, the multiple display modules 110 are provided in the same size, but the present invention is not limited to this. Obviously, at least one display module can also be provided in a size different from that of the remaining display modules. In addition, at least one display module can have a different number of pixels from the remaining display modules, and the resolution thereof can also have different values. In addition, when the resolution of all regions does not need to be the same, the display device 100 can be manufactured in a manner of arranging display modules with different resolutions.

[0088] In an embodiment of the present invention, each display module 110 may be provided in a shape other than a rectangular shape, and in particular, may be provided in a shape other than a quadrilateral shape according to the shape of the overall display device 100. Furthermore, according to the size of the display device 100 to be manufactured, the number of the support substrate 160 or the display modules 110 arranged on the support substrate 160 may vary.

[0089] In the display device of the above structure, when manufacturing a large-area multi-module display device, the separation of the displayed image or the appearance of dark lines in the image can be minimized by minimizing the separation between the pixel areas of the display modules adjacent to each other. According to one embodiment of the present invention, the vias can be formed in the module substrate itself (especially, in the non-pixel area or pixel area adjacent to the pixel area) on which the light-emitting element is mounted. Accordingly, in one embodiment of the present invention, it is not necessary to provide a separate device for connecting the display module and the support substrate on the side of the module substrate, so that the space for installing the separate device on the side of the module substrate can be omitted, thereby minimizing the spacing between two display modules adjacent to each other.

[0090] Figure 5a to Figure 5e The following are views sequentially illustrating a method of manufacturing a display device according to an embodiment of the present invention.

[0091] Reference Figure 5a to Figure 5eThe display device 100 according to an embodiment of the present invention may be manufactured in the following manner: first, a plurality of display modules 110 are manufactured, and then the plurality of display modules 110 are arranged on a supporting substrate 160 .

[0092] First, the steps of manufacturing a plurality of display modules 110 will be described.

[0093] Reference Figure 5a , first prepare a mother substrate 120m. The mother substrate 120m is provided to be the same size as the display module 110 or larger than the display module 110. The mother substrate 120m may be formed using a light-transmitting insulating material. The mother substrate 120m may include a pixel region 111 where the light-emitting element 130 is to be arranged and a non-pixel region surrounding the pixel region 111. The non-pixel region may extend further toward the outside than a virtual line 120i corresponding to the size of the subsequent display module 110.

[0094] The wiring portion 125 and the light emitting element 130 are formed on the mother substrate 120m. The wiring portion 125 can be formed by various methods such as metal plating, photolithography, etc. The light emitting element 130 can be mounted on the mother substrate 120m individually or in plurality by transfer.

[0095] Reference Figure 5b A through hole 121 is formed in the non-pixel region, penetrating the upper surface and the lower surface of the mother substrate 120m. The through hole 121 can be formed by laser processing. However, the method for forming the through hole 121 is not limited thereto, and it is obvious that it can be formed by a variety of methods. A via is formed on the mother substrate 120m having the through hole 121. The via can be easily formed by metal plating.

[0096] Reference Figure 5c The edge of the mother substrate 120 m may be cut or ground according to the size of the display module 110 to be manufactured, and accordingly, each display module 110 is composed of a module substrate 120 and a light emitting element 130 .

[0097] Reference Figure 5d A driving circuit portion may be disposed on the lower surface of the module substrate 120 , and the light emitting element 130 and the driving circuit portion may be electrically connected through the through hole 121 .

[0098] Then, refer to Figure 5e , the display module 110 completed through the above steps is arranged on the support substrate 160 and then electrically connected. A plurality of display modules 110 can be arranged along rows and columns on the support substrate 160. A conductive paste such as solder paste or solder balls used in a ball array can be arranged between the display module 110 and the support substrate 160, so that the display module 110 and the support substrate 160 can be electrically connected.

[0099] As described above, the display module can be manufactured by simply forming a through hole in the module substrate and simply forming a via member in the through hole, and the display module can be attached to the supporting substrate by simple welding or ball array, thereby realizing the manufacture of a multi-module display device in a simple and low-cost manner.

[0100] In an embodiment of the present invention, the connection structure between the display module and the support substrate can be changed in various ways.

[0101] Figure 6 as well as Figure 7 is a diagram illustrating a connection structure between a display module and a support substrate in a display device according to an embodiment of the present invention, and corresponds to Figure 2b sectional view of .

[0102] Reference Figure 6 According to an embodiment of the present invention, a plurality of recessed portions 127 recessed from the lower surface of the module substrate 120 may be provided on the module substrate 120. The recessed portions 127 may be formed by laser processing.

[0103] A connection wiring 129 as a part of the wiring portion 125 formed on the lower surface of the module substrate 120 may be provided in the recessed portion 127. The recessed portion 127 may be formed in a manner that the recessed cross section has an inclined surface, or may be formed in other shapes. The connection wiring 129 may be formed in the recessed portion 127. The connection wiring 129 may be easily formed in the recessed portion 127 by using metal plating, but even if it is not metal plated, even if it is not arranged in the recessed portion 127 or not arranged completely in the recessed portion 127, it may be arranged in an area corresponding to the recessed portion 127 and the vicinity of the recessed portion 127.

[0104] The connection wiring 129 may be connected to the driving circuit portion 150 provided on the lower surface of the module substrate 120, or may be connected to the support substrate 160 facing the lower surface of the module substrate 120. On the support substrate 160, a conductive electrode portion 163 may be formed in a region facing the portion where the connection wiring 129 is formed. In addition, on the conductive electrode portion 163 of the support substrate 160, a protrusion that contacts and electrically connects with the recessed portion 127 may be formed in a region corresponding to the recessed portion 127 of the connection wiring 129. The protrusion may include a conductive material, and accordingly, when the protrusion contacts the connection wiring 129, the connection wiring 129 may be electrically connected to the wiring of the support substrate 160. The material of the protrusion is not limited as long as it is a conductive material, and for example, it may be formed using solder paste.

[0105] In an embodiment of the present invention, the connection wiring 129 may be formed by a method such as metal plating after forming the recessed portion 127 , and then the protruding portion may be formed before connecting the connection wiring 129 to the support substrate 160 .

[0106] In this embodiment, a portion of the through holes 121 may be provided in the pixel region 111, and vias 123 may be formed in the through holes 121. The vias 123 may be provided in the pixel region 111, and a portion may be arranged at a position overlapping with the light emitting element 130. In one embodiment of the present invention, the vias 123 may also be provided in the region where the first contact pad and the second contact pad of the light emitting element 130 are formed.

[0107] Accordingly, the first contact pad and the second contact pad of the light emitting element 130 can be connected to the connection wiring 129 provided on the lower surface of the module substrate 120 by means of the via 123 arranged in the pixel region 111. As in the above-mentioned embodiment, the through hole 121 and the via 123 can be formed in the non-pixel region instead of the pixel region 111, and a part of the through hole 121 and the via 123 can be formed in the region corresponding to the recessed portion 127 in the pixel region 111.

[0108] Reference Figure 7 The support substrate 160 may have a hole provided on the surface facing the module substrate 120 and corresponding to the through hole 121, and the via 123 may be integrally provided in the through hole 121 and the hole to contact the conductive electrode portion 163. The support substrate 160 may have a side portion 163b and an upper surface portion 163a so as to be easily electrically contacted with the via 123.

[0109] In this embodiment, after forming a hole at a position corresponding to the through hole 121 on the upper surface of the support substrate 160, a via 123 may be formed in the through hole 121 and the hole. The via 123 may be formed by filling the through hole 121 and the hole with a conductive material, or may be formed by forming the via 123 with a separate material and then inserting it into the through hole 121 and the hole.

[0110] Figure 8 is a structural diagram showing a display device according to an embodiment of the present invention.

[0111] Reference Figure 8According to an embodiment of the present invention, the display device includes a timing control unit 155, a first driving unit 151, a second driving unit 153, a wiring unit, and pixels implemented by first to third light-emitting elements 130a, 130b, and 130c. In an embodiment of the present invention, the first driving unit 151 and the second driving unit 153 may be a scan driving unit and a data driving unit, respectively, and are referred to as the scan driving unit and the data driving unit in the following description.

[0112] Each pixel is connected to the scan driving unit 151 and the data driving unit 153 through a separate wiring unit.

[0113] The timing control unit 155 receives various control signals and image data required for driving the display device from the outside (for example, a system that transmits image data). Such a timing control unit 155 reorders the received image data and transmits it to the data driving unit 153. In addition, the timing control unit 155 generates a scanning control signal and a data control signal required to drive the scanning driving unit 151 and the data driving unit 153, and transmits the generated scanning control signal and data control signal to the scanning driving unit 151 and the data driving unit 153, respectively.

[0114] The scan driving unit 151 receives the scan control signal from the timing control unit 155 and generates a scan signal in response thereto.

[0115] The data driving unit 153 receives the data control signal and the image data from the timing control unit 155 , and generates a data signal accordingly.

[0116] The wiring section includes a plurality of signal wirings. Specifically, the wiring section includes a first wiring 103 connecting the scan driver 151 and the pixel and a second wiring 102 connecting the data driver 153 and the pixel. In one embodiment of the present invention, the first wiring 103 may be a scan line, and the second wiring 102 may be a data line. In addition, the wiring section also includes wiring that connects the timing control section 155 and the scan driver 151, the timing control section 155 and the data driver 153, or other components and transmits corresponding signals.

[0117] The scan line 103 provides the scan signal generated by the scan driving part 151 to the pixel. The data signal generated by the data driving part 153 is output to the data line 102. The data signal output to the data line 102 is input to the pixel of the horizontal display module 110 line selected by the scan signal.

[0118] The pixel is connected to the scan line 103 and the data line 102. When a scan signal is provided from the scan line 103, the pixel selectively emits light corresponding to the data signal input from the data line 102. As an example, during each frame period, each pixel emits light at a brightness corresponding to the received data signal. The pixel receiving the data signal corresponding to the black brightness does not emit light during the frame period, thereby displaying black.

[0119] In one embodiment of the present invention, the pixel can be driven in a passive mode or an active mode. When the display device is driven in an active mode, in addition to the scan signal and the data signal, the display device can also receive a first pixel power source and a second pixel power source for driving.

[0120] In one embodiment of the present invention, the light emitting elements may be arranged in various forms within the pixel region to form a pixel unit.

[0121] Fig. 9 is a plan view showing a state in which light emitting elements are arranged in a different form from the above-mentioned embodiment in one embodiment of the present invention, and shows Figure 1 The part corresponding to P1.

[0122] Reference Fig. 9 In the pixel region 111 of the module substrate 120, a plurality of light emitting elements 130 may be provided. The plurality of light emitting elements 130 may be arranged in various forms to form a pixel unit. Figure 2a In the disclosed embodiment, a pixel unit is illustrated in which the first to third light emitting elements 130a, 130b, and 130c are formed and the first to third light emitting elements 130a, 130b, and 130c are arranged in a triangle. According to another embodiment of the present invention, Fig. 9 As shown, the plurality of light emitting elements 130 may also be arranged in rows and columns. For example, in the case where the pixel unit is composed of the first to third light emitting elements 130a, 130b, and 130c, the first to third light emitting elements 130a, 130b, and 130c may be arranged alternately along rows or columns, or may be arranged alternately along rows and columns. For another example, in the case where the pixel unit is composed of the first light source to the third light emitting element, when the first to third light emitting elements are arranged, the first light emitting element, the second light emitting element, and the third light emitting element may be arranged in a repeated manner along rows or columns, or may be arranged in a repeated manner along rows and columns.

[0123] Fig.10a is a plan view showing a state in which light emitting elements are arranged in a different form from the above-mentioned embodiment in one embodiment of the present invention, and shows Figure 1 The part corresponding to P1. Fig.10bIt is a simple diagram Fig.10a Conceptual diagram of the light-emitting element shown.

[0124] Reference Fig.10a , illustrates a situation where a plurality of light emitting elements 230 are provided in the pixel region 111 of the module substrate 120, and one light emitting element constitutes one pixel unit. Each light emitting element 230 may include a plurality of epitaxial stacks that emit light of different colors from each other. For example, Fig.10b As shown, each light emitting element 230 may include first to third epitaxial stacks 231 , 233 , and 235 in which three layers are sequentially stacked.

[0125] Each epitaxial stack can emit light of a color of a visible light band in light of various wavelength bands. The first epitaxial stack 231 can emit a first color light, the second epitaxial stack 233 can emit a second color light, and the third epitaxial stack 235 can emit a third color light. Among them, the first color light to the third color light can be equivalent to light of different colors from each other, and the first color light to the third color light can be color lights of different wavelength bands having short wavelengths in sequence. That is, the first color light to the third color light can have wavelengths different from each other, and the more from the first color light to the third color light, the more high-energy short-wavelength color light. In this embodiment, the first color light can be red light, the second color light can be green light, and the third color light can be blue light. However, the order of the first color light to the third color light is not limited thereto, and can also be provided in a different order from each other according to the stacking order of the first epitaxial stack 231, 233, and 235.

[0126] In this way, when a pixel unit is manufactured as a stacked type, it is sufficient to mount a light-emitting stacked body instead of a plurality of light-emitting elements, thereby enabling a greater number of pixel units to be included in a unit area, and the manufacturing method is significantly simplified.

[0127] Fig.11 FIG. 1 is a schematic plan view showing another arrangement of light emitting elements in one embodiment of the present invention.

[0128] Reference Fig.11 According to the present embodiment, the light emitting elements 130: 130a, 130b, 130c are as shown in FIG. Fig. 9 The light emitting elements 130a, 130b, and 130c are arranged on the display module 110. However, the light emitting elements 130a, 130b, and 130c may be disposed on the auxiliary substrate 141 and arranged on the display module 110. Therefore, the pixel unit 113 includes the auxiliary substrate 141. For example, the auxiliary substrate 141 may be a sapphire substrate, but is not limited thereto.

[0129] Although the above description is made with reference to the preferred embodiments of the present invention, any person skilled in the art or having ordinary knowledge in the technical field will understand that various modifications and changes may be made to the present invention without departing from the scope of the idea and technical field of the present invention as described in the claims.

[0130] Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

Claims

1. A display device, It is characterized in that include: A plurality of display modules, each comprising a module substrate and a plurality of light-emitting elements mounted on the module substrate; A supporting substrate for arranging the plurality of display modules; as well as A connection wiring is provided on the lower surface of the module substrate, Each of the plurality of light emitting elements includes a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer. Each of the module substrates is provided with a through hole penetrating the module substrate and a via provided in the through hole, and the light emitting element is electrically connected to the wiring on the support substrate through the via. wherein the connection wiring is electrically connected to the wiring of the support substrate respectively, The module substrate has a plurality of recessed portions recessed from a lower surface of the module substrate, and the connection wiring is provided in the recessed portions. The support substrate has a protrusion corresponding to the recessed portion on a surface facing the module substrate.

2. The display device according to claim 1, It is characterized in that Each of the vias comprises: an upper pad provided on an upper surface of the module substrate; a lower pad provided on a lower surface of the module substrate; and an internal electrode provided in the through hole, Wherein, the lower pad is connected to the supporting substrate in a ball array manner.

3. The display device according to claim 1, It is characterized in that The module substrate comprises: a pixel region provided with the light emitting element to display an image; and a non-pixel region, surrounding the pixel region, Part or all of the connection wiring is provided in the pixel area.

4. The display device according to claim 3, It is characterized in that A portion of the through holes is provided in the pixel region.

5. The display device according to claim 1, It is characterized in that A portion of the through holes is provided in a region corresponding to the recessed portion.

6. The display device according to claim 1, It is characterized in that The protrusion includes a conductive material and is electrically connected to a wiring of the support substrate.

7. The display device according to claim 6, It is characterized in that The support substrate has a conductive electrode portion provided on a surface facing the module substrate, and the via is in contact with the conductive electrode portion.

8. The display device according to claim 7, It is characterized in that The support substrate has a hole provided on a surface facing the module substrate and corresponding to the through hole, and the via member is integrally provided in the through hole and the hole so as to contact the conductive electrode portion.

9. The display device according to claim 1, It is characterized in that The through holes are arranged along an edge of the module substrate.

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