Electronic packaging and method of manufacturing the same

Abstract

The present invention relates to an electronic package and a manufacturing method thereof, comprising forming at least two heat dissipation materials on an electronic component, and then combining a heat dissipation element with the electronic component via the at least two heat dissipation materials, and one of the at least two heat dissipation materials is liquid metal, so as to improve the heat dissipation effect of the hot spot area of ​​the electronic component.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to an electronic packaging component with a heat dissipation component and a manufacturing method thereof. Background Art

[0002] As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat energy during operation. In addition, since the conventional packaging colloid that covers the semiconductor chip has a thermal conductivity of only 0.8 (unit: Wm -1 .k -1 ) has poor heat transfer materials (i.e., poor heat dissipation efficiency). Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability problems.

[0003] Therefore, in order to quickly dissipate the heat to the outside, the industry usually configures a heat sink (heat spreader) in the semiconductor package. The heat sink is usually combined with the back of the semiconductor chip through a heat dissipation adhesive, such as a thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated by the heat dissipation adhesive and the heat sink. In addition, the top surface of the heat sink is usually exposed to the packaging adhesive or directly exposed to the atmosphere to achieve a better heat dissipation effect.

[0004] like Figure 1 As shown, the manufacturing method of the conventional semiconductor package 1 is to first place a semiconductor chip 11 on a package substrate 10 with its active surface 11a by flip chip bonding (i.e., through conductive bumps 110 and bottom glue 111), and then place a heat sink 13 on the inactive surface 11b of the semiconductor chip 11 with its top sheet 130 through a TIM layer 12, and the support legs 131 of the heat sink 13 are mounted on the package substrate 10 through an adhesive layer 14. Next, a package molding operation is performed to allow a packaging gel (not shown) to cover the semiconductor chip 11 and the heat sink 13, and to expose the top sheet 130 of the heat sink 13 to the outside of the packaging gel.

[0005] During operation, heat energy generated by the semiconductor chip 11 is conducted to the top plate 130 of the heat sink 13 through the inactive surface 11 b and the TIM layer 12 to be dissipated to the outside of the semiconductor package 1 .

[0006] However, in the conventional semiconductor package 1, only a single type of heat dissipation adhesive is used as the TIM layer 12, and its thermal conductivity is poor, resulting in limited heat dissipation effect, especially the hot spot area of ​​the semiconductor chip 11 (such as the middle or corner of the non-active surface 11b) has poor heat dissipation, so it is difficult to meet the high heat dissipation requirements of the semiconductor package 1.

[0007] In addition, when the thickness of the semiconductor package 1 is reduced and the area is increased, the deformation (i.e., the degree of warping) caused by the difference in thermal expansion coefficient (CTE Mismatch) between the heat sink 13 and the TIM layer 12 is more obvious. When the deformation is too large, delamination is likely to occur between the top sheet 130 of the heat sink 13 and the TIM layer 12 (or the semiconductor chip 11), which not only causes the thermal conductivity to decrease, but also causes the semiconductor chip 11 or the bottom glue 111 to break, resulting in problems such as poor reliability and low process yield of the semiconductor package 1.

[0008] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0009] In view of the above-mentioned defects of the prior art, the present invention provides an electronic package and a manufacturing method thereof, so as to improve the heat dissipation effect of the hot spot area of ​​the electronic component.

[0010] The electronic package of the present invention comprises: an electronic component; at least two heat dissipating materials disposed on the electronic component, wherein one of the at least two heat dissipating materials is liquid metal; and a heat dissipating element combined with the electronic component via the at least two heat dissipating materials.

[0011] The present invention also provides a method for manufacturing an electronic package, comprising: forming at least two heat dissipating materials on an electronic component, wherein one of the at least two heat dissipating materials is liquid metal; and combining a heat dissipating element with the electronic component via the at least two heat dissipating materials.

[0012] In the aforementioned electronic package and its manufacturing method, a heat-conducting layer is formed between the electronic component and the at least two heat-dissipating materials, and the heat-conducting layer includes a metal part disposed on the electronic component and a concave-convex part formed on the metal part. For example, the concave-convex part is in a grid shape, and the at least two heat-dissipating materials are connected to the concave-convex part.

[0013] In the aforementioned electronic package and its manufacturing method, the thermal conductivity of the liquid metal is greater than the thermal conductivity of the other of the at least two heat dissipating materials.

[0014] In the aforementioned electronic package and its manufacturing method, the heat sink comprises a heat sink and a support leg provided on the heat sink, and the at least two heat sinks are located between the heat sink and the electronic component. For example, a heat conductive layer is formed between the heat sink and the at least two heat sinks, and the heat conductive layer comprises a metal part provided on the heat sink and a concave-convex part formed on the metal part. Furthermore, the concave-convex part is in a grid shape, and the at least two heat sinks are combined with the concave-convex part.

[0015] In the aforementioned electronic package and its manufacturing method, the heat sink is formed with a groove on the side facing the at least two heat sinks. For example, a portion of the groove is filled with the liquid metal, while another portion of the groove is a vacuum area.

[0016] The aforementioned electronic package and its manufacturing method further include a supporting structure for supporting and electrically connecting the electronic component.

[0017] The aforementioned electronic package and its manufacturing method further include covering the electronic element with a packaging layer, and the electronic element is exposed from the packaging layer, so that the at least two heat dissipating materials are also disposed on the packaging layer.

[0018] As can be seen from the above, the electronic package and the manufacturing method of the present invention are mainly achieved by disposing at least two heat dissipating materials on the electronic component, so that the first heat dissipating material reduces or disperses the stress, and the second heat dissipating material (liquid metal) enhances the heat dissipation effect of the hot spot area of ​​the electronic component. Therefore, compared with the prior art, the electronic package of the present invention can avoid the concentration of structural stress on the electronic component, so as to avoid the electronic component from being broken in the subsequent process, resulting in poor reliability and low process yield.

[0019] In addition, by designing the concave and convex parts of the heat-conducting layer, the surface area of ​​the heat-conducting layer is increased and the bonding strength of the heat dissipating material is enhanced. Therefore, the present invention can not only improve the heat conduction effect, but also will not cause the electronic component to break, thereby improving the reliability and process yield of the electronic package. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0021] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention.

[0022] Figure 2B-1 for Figure 2B A partial enlarged schematic diagram of .

[0023] Figure 2D-1 for Figure 2D A partial top view schematic diagram of .

[0024] FIG. 3A to FIG. 3D for Figure 2EA partial top view schematic diagram of the heat conductive layer.

[0025] Description of Reference Numerals

[0026] 1: Semiconductor packaging

[0027] 10: Package substrate

[0028] 11: Semiconductor Chips

[0029] 11a, 21a: Action surface

[0030] 11b, 21b: non-active surface

[0031] 110,210: Conductive bumps

[0032] 111,211: Primer

[0033] 12,3a: TIM layer

[0034] 13,23: Heat sink

[0035] 130: Top sheet

[0036] 131,231:Supporting feet

[0037] 14,24: Adhesive layer

[0038] 2: Electronic packaging

[0039] 2a: Encapsulation module

[0040] 20: Bearing structure

[0041] 200: Conductor

[0042] 201,202: Carrier board

[0043] 21,21':Electronic components

[0044] 22: Encapsulation layer

[0045] 22a: First surface

[0046] 22b: Second surface

[0047] 230: Radiator

[0048] 232: Groove

[0049] 25: Conductive element

[0050] 30: Liquid Metal

[0051] 31: The first heat dissipation material

[0052] 310: Opening

[0053] 32: First thermal conductive layer

[0054] 32': Second heat conducting layer

[0055] 320:Metal Department

[0056] 321: Concavoconvex part

[0057] 321a: Grid

[0058] A: Vertical projection area

[0059] P: Vacuum area

[0060] S: hollow area. DETAILED DESCRIPTION

[0061] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0062] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any modification of the structure, change in the proportion relationship, or adjustment of the size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0063] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention.

[0064] like Figure 2A As shown, a packaging module 2a is provided, which includes a supporting structure 20, a plurality of electronic components 21, 21' and a packaging layer 22, and the electronic components 21, 21' are separately arranged on the upper side of the supporting structure 20, so that the packaging layer 22 is formed on the supporting structure 20 to cover the electronic components 21, 21'.

[0065] In the present embodiment, the supporting structure 20 is in the form of multiple carriers 201, 202 electrically stacked with multiple conductors 200 (which may be covered by a primer 211), and the carrier is, for example, a package substrate with a core layer and a circuit structure, a package substrate with a coreless circuit structure, a silicon interposer (TSI) with conductive through-silicon vias (TSV), or other board types, which include at least one insulating layer and at least one circuit layer combined with the insulating layer, such as at least one fan-out redistribution layer (RDL). It should be understood that the supporting structure 20 can also be in the form of a single carrier (not shown) or other board materials for carrying chips, such as a lead frame, a wafer, or other boards with metal routing, etc., and are not limited to the above.

[0066] In addition, a plurality of conductive elements 25 may be disposed on the lower side of the supporting structure 20, so that an electronic device such as a circuit board (not shown) may be connected via the conductive elements 25 in subsequent processes. The conductive elements 25 may be metal pillars such as copper pillars, metal bumps coated with insulating blocks, solder balls, solder balls with core copper balls, or other conductive structures.

[0067] In addition, the electronic components 21, 21' are active components, passive components or a combination thereof, wherein the active components are, for example, semiconductor chips, and the passive components are, for example, resistors, capacitors and inductors. In the present embodiment, the electronic components 21, 21' are semiconductor chips, which have an active surface 21a and an inactive surface 21b opposite to each other, and the active surface 21a is disposed on the circuit layer of the supporting structure 20 in a flip chip manner through a plurality of conductive bumps 210 such as solder materials, metal pillars or others and electrically connected to the circuit layer, and the conductive bumps 210 are coated with a primer 211; or, the electronic components 21, 21' can be electrically connected to the circuit layer of the supporting structure 20 in a wire bonding manner through a plurality of welding wires (not shown); or, the electronic components 21, 21' can directly contact the circuit layer of the supporting structure 20. Therefore, the required type and quantity of electronic components can be placed on the supporting structure 20 to enhance its electrical function. There are many ways to electrically connect the electronic components 21 , 21 ′ to the supporting structure 20 , which are not limited to the above.

[0068] In addition, the packaging layer 22 has a first surface 22a and a second surface 22b opposite to each other, and the first surface 22a is combined with the supporting structure 20, and the inactive surface 21b of the electronic component 21 is flush with the second surface 22b of the packaging layer 22, so that the inactive surface 21b of the electronic component 21 is exposed on the second surface 22b of the packaging layer 22. For example, the material forming the packaging layer 22 is an insulating material, such as polyimide (PI), epoxy resin packaging colloid or packaging material, which can be formed by molding, lamination or coating.

[0069] like Figure 2B As shown, a first heat-conducting layer 32 is formed on the inactive surface 21 b of the electronic component 21 and the second surface 22 b of the packaging layer 22 .

[0070] In this embodiment, the first heat-conducting layer 32 includes a metal portion 320 disposed on the electronic element 21 and the packaging layer 22 and a concave-convex portion 321 formed on the metal portion 320. Figure 2B-1 For example, the concave-convex portion 321 is in a mesh shape, as shown in FIG. FIG. 3A to FIG. 3D The high-density sub-micron honeycomb microstructure shown in FIG. 1 and the concave-convex portion 321 has a plurality of grids 321a of different specifications (such as Figure 3A ) or a grid 321a of the same specification (such as FIG. 3B to FIG. 3D triangle, square or polygon as shown).

[0071] In addition, the concave-convex portion 321 can be made by oxidizing a metal material, so that the metal portion 320 and the concave-convex portion 321 can be made of the same metal layer (such as gallium, indium, nickel, gold, silver, copper or others).

[0072] like Figure 2C As shown, a first heat dissipation material 31 is formed on the first heat conductive layer 32 , so that the first heat dissipation material 31 is combined with the concave-convex portion 321 , and the first heat dissipation material 31 is formed with at least one opening 310 corresponding to the electronic element 21 to expose a portion of the first heat conductive layer 32 .

[0073] In this embodiment, the first heat dissipation material 31 is regarded as a thermal interface material (TIM), which has a low thermal conductivity of about 2 to 20 W / (meter.Kelvin) (Wm -1 K -1). For example, the first heat dissipation material 31 is a silicone material or an ultraviolet (UV) glue such as an acrylic material, which contains metal particles, graphite or other appropriate fillers. Specifically, the silicone material not only has high ductility, but also has a higher thermal conductivity than UV glue. Therefore, compared with UV glue, the first heat dissipation material 31 is preferably a silicone material.

[0074] In addition, the first heat dissipation material 31 is filled into the grid 321a of the concave-convex portion 321, as shown in FIG. Figure 2B-1 As shown, the first heat dissipation material 31 can be filled or not filled according to the requirements (such as Figure 2B-1 For example, the hollow area S can generate a vacuum pulling force to facilitate controlling the deformation amount of the first heat dissipation material 31.

[0075] In addition, the opening 310 is configured corresponding to the hot spot area of ​​the electronic component 21. For example, the middle (or corner) of the electronic component 21 is the hot spot area.

[0076] like Figure 2D As shown, liquid metal 30 serving as the second heat dissipation material is formed in the opening 310 so that the liquid metal 30 contacts the first heat conducting layer 32 and is located correspondingly on the hot spot area of ​​the electronic component 21 to increase the heat dissipation efficiency of the hot spot area of ​​the electronic component 21 .

[0077] In this embodiment, the liquid metal 30 is also regarded as a thermal interface material (TIM), which has a high thermal conductivity of about 30 to 80 Wm -1 K -1 , that is, the thermal conductivity of the liquid metal 30 is greater than the thermal conductivity of the first heat dissipation material 31. For example, the liquid metal 30 is pure and does not contain glue.

[0078] In addition, the upper surface of the liquid metal 30 is flush with the upper surface of the first heat dissipation material 31, so that the liquid metal 30 fills the grid 321a of the concave-convex portion 321 (i.e., the hollow area S is not formed), and the first heat dissipation material 31 is used to limit the flow range of the liquid metal 30 to prevent the liquid metal 30 from overflowing.

[0079] In addition, the design of the opening 310 facilitates the setting of the liquid metal 30 at the hot spot area of ​​the electronic component 21, so there is no need to form the liquid metal 30 on the entire surface of the non-active surface 21b, thereby reducing the usage of the liquid metal 30 and saving process material costs.

[0080] like Figure 2E As shown, a heat dissipation element 23 is disposed on the supporting structure 20 to cover the first heat dissipation material 31 and the liquid metal 30 .

[0081] In this embodiment, the heat sink 23 has a heat sink 230 and a plurality of support legs 231 extending downward from the edge of the heat sink 230, and the heat sink 230 is a heat sink type, and the first heat sink material 31 and the second heat sink material (i.e., liquid metal 30) are pressed on its lower side so that the first heat sink material 31 and the liquid metal 30 are located between the heat sink 230 and the electronic component 21, and the support legs 231 are combined with the supporting structure 20 via the adhesive layer 24. For example, a second heat conductive layer 32' is formed between the heat sink 230 and the first heat conductive material 31 (and / or the liquid metal 30), and the structure of the second heat conductive layer 32' is the same as that of the first heat conductive layer 32, such as Figure 2B-1 As shown, the metal portion 320 of the second heat-conducting layer 32' is disposed on the heat sink 230, and the concave-convex portion 321 thereof can be made by oxidizing the metal material, so that the heat sink 230, the metal portion 320 and the concave-convex portion 321 can be made of the same metal layer (such as gallium, indium, nickel, gold, silver, copper or others).

[0082] In addition, the end of the supporting foot 231 may also be designed with a concave-convex portion to enhance the bonding property of the adhesive layer 24 .

[0083] In addition, the heat dissipation element 23 (such as the heat dissipation body 230) may form a groove 232 for accommodating the liquid metal 30 on the side facing the first heat dissipation material 31 to prevent the liquid metal 30 from overflowing. For example, a portion of the groove 232 is filled with the liquid metal 30, while another portion (such as the remaining region) is a vacuum region P.

[0084] Therefore, the manufacturing method of the present invention mainly arranges at least two heat dissipating materials (such as Figure 2D-1 The first heat dissipation material 31 and the liquid metal 30 shown in the figure reduce or disperse the stress of the first heat dissipation material 31, and the liquid metal 30 enhances the heat dissipation effect of the hot spot area of ​​the electronic component 21. Therefore, compared with the prior art, the electronic package 2 of the present invention can avoid the concentration of structural stress at the corners of the electronic components 21, 21' when the overall planar packaging area of ​​the supporting structure 20 is larger, thereby avoiding the electronic components 21, 21' or the bottom glue 211 from being broken in the subsequent process, resulting in poor reliability and low process yield.

[0085] Furthermore, the first heat dissipation material 31 is a flexible material, which can effectively disperse thermal stress through deformation, so as to effectively control the deformation (warping) of the electronic component 21 and / or the heat dissipation body 230 and prevent the delamination problem between the electronic component 21 (and / or the heat dissipation body 230) and the first heat dissipation material 31, and the high thermal conductivity of the liquid metal 30 can improve the overall heat transfer efficiency of the TIM layer 3a (composed of at least two heat dissipation materials, such as the first heat dissipation material 31 and the liquid metal 30), and through the The large surface tension of the liquid metal 30 enables the first heat dissipation material 31 to restrain the flow of the liquid metal 30 on the surface of the electronic component 21 (such as the non-active surface 21b), so that the liquid metal 30 adheres to the electronic component 21 (or the first thermal conductive layer 32). Therefore, compared with the prior art, the TIM layer 3a of the electronic package 2 of the present invention not only has a better heat dissipation effect, but also can prevent the electronic component 21, 21' or the heat dissipation member 23 from excessive warping due to stress concentration.

[0086] In addition, through the design of the hollow area S (or the groove 232), when the temperature rises, the volume of the liquid metal 30 will expand and flow into the hollow area S (or the groove 232), thereby buffering the flow of the liquid metal 30, thereby preventing the liquid metal 30 from being compressed and leaking from the interface between the first heat dissipation material 31 and the electronic component 21 (or the heat dissipation member 23).

[0087] In addition, the surface area of ​​the first heat-conducting layer 32 and / or the second heat-conducting layer 32' is increased by designing the concave-convex portion 321. Therefore, compared with the prior art, the heat dissipation area of ​​the TIM layer 3a of the present invention is increased, so that the electronic component 21 and / or the heat sink 230 has a better heat dissipation effect due to the increased heat dissipation area, thereby meeting the high heat dissipation requirements of the electronic package 2.

[0088] In addition, the design of the concave-convex portion 321 can enhance the bonding strength of the first heat dissipation material 31 and effectively disperse the thermal stress, so as to avoid the thermal stress from being concentrated on the TIM layer 3a, so as to further control the deformation (warping) of the electronic component 21 (and / or the heat sink 230), thereby further avoiding the problem of delamination between the electronic component 21 and / or the heat sink 230 and the TIM layer 3a. Therefore, compared with the prior art, the manufacturing method of the present invention can not only improve the thermal conductivity effect, but also will not cause the electronic component 21 or the base glue 211 to break, thereby improving the reliability and process yield of the electronic package 2.

[0089] The present invention further provides an electronic package 2, comprising: an electronic component 21, at least two heat dissipation materials (such as a first heat dissipation material 31 and a second heat dissipation material) disposed on the electronic component 21, and a heat dissipation element 23 disposed on the at least two heat dissipation materials, wherein one of the heat dissipation materials (such as the second heat dissipation material) is liquid metal 30.

[0090] The heat sink 23 is combined with the electronic component 21 via the first heat sink material 31 and the second heat sink material (liquid metal 30 ).

[0091] In one embodiment, a first heat-conducting layer 32 is formed between the electronic component 21, the first heat-dissipating material 31, and the liquid metal 30. For example, the first heat-conducting layer 32 includes a metal portion 320 disposed on the electronic component 21 and a concave-convex portion 321 formed on the metal portion 320. Preferably, the concave-convex portion 321 is in a grid shape, and the concave-convex portion 321 is an oxidized metal material, so that the first heat-dissipating material 31 and the liquid metal 30 are combined with the concave-convex portion 321.

[0092] In one embodiment, the thermal conductivity of the liquid metal 30 is greater than the thermal conductivity of the first heat dissipation material 31 .

[0093] In one embodiment, the heat sink 23 includes a heat sink 230 and a support leg 231 disposed on the heat sink 230, and the heat sink 230 is combined with the electronic component 21 via the first heat sink 31 and the liquid metal 30. For example, the heat sink 230 is combined with the first heat sink 31 and the liquid metal 30 via a second heat conductive layer 32', and the second heat conductive layer 32' includes a metal portion 320 disposed on the heat sink 230 and a concave-convex portion 321 formed on the metal portion 320. Preferably, the concave-convex portion 321 is in a grid shape, and the concave-convex portion 321 is an oxidized metal material, so that the first heat sink 31 and the liquid metal 30 are combined with the concave-convex portion 321.

[0094] In one embodiment, the electronic package 2 further includes a supporting structure 20 for supporting and electrically connecting the electronic component 21 .

[0095] In one embodiment, the electronic package 2 further includes a packaging layer 22 covering the electronic element 21 and exposing the electronic element 21 , so that the first heat dissipation material 31 is also disposed on the packaging layer 22 .

[0096] In summary, the electronic package and the method for manufacturing the same of the present invention are such that at least two heat dissipating materials are arranged on the electronic component, so that the first heat dissipating material reduces or disperses stress, and the second heat dissipating material (liquid metal) enhances the heat dissipation effect of the hot spot area of ​​the electronic component. Therefore, the electronic package of the present invention can avoid the concentration of structural stress on the electronic component, so as to avoid the electronic component from being broken in the subsequent process, resulting in poor reliability and low process yield.

[0097] In addition, by designing the concave and convex parts of the heat-conducting layer, the surface area of ​​the heat-conducting layer is increased and the bonding strength of the heat dissipating material is enhanced. Therefore, the present invention can not only improve the heat conduction effect, but also will not cause the electronic component to break, thereby improving the reliability and process yield of the electronic package.

[0098] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, characterized in that: include: Electronic components; At least two heat dissipating materials are disposed on the electronic component, wherein one of the at least two heat dissipating materials is liquid metal, the thermal conductivity of the liquid metal is greater than the thermal conductivity of the other heat dissipating materials, the other heat dissipating material is formed with at least one opening at a position corresponding to the electronic component, and the liquid metal is formed in the opening of the other heat dissipating material; as well as The heat dissipation element is combined with the electronic component via the at least two heat dissipation materials.

2. The electronic package according to claim 1, wherein: A heat-conducting layer is formed between the electronic element and the at least two heat-dissipating materials, and the heat-conducting layer includes a metal portion disposed on the electronic element and a concave-convex portion formed on the metal portion.

3. The electronic package as claimed in claim 2, characterized in that The concavoconvex part is in a grid shape.

4. The electronic package as claimed in claim 2, characterized in that: The at least two heat dissipating materials are combined with the concave-convex portion.

5. The electronic package according to claim 1, wherein: The heat dissipation component includes a heat dissipation body and supporting legs arranged on the heat dissipation body, and the at least two heat dissipation materials are located between the heat dissipation body and the electronic element.

6. The electronic package according to claim 5, characterized in that A heat-conducting layer is formed between the heat-dissipating body and the at least two heat-dissipating materials, and the heat-conducting layer includes a metal portion disposed on the heat-dissipating body and a concave-convex portion formed on the metal portion.

7. The electronic package according to claim 6, wherein: The concavoconvex part is in a grid shape.

8. The electronic package according to claim 6, wherein: The at least two heat dissipating materials are combined with the concave-convex portion.

9. The electronic package according to claim 1, wherein: A groove is formed on a side of the heat dissipation element facing the at least two heat dissipation materials.

10. The electronic package according to claim 9, wherein: A part of the groove is filled with the liquid metal, and another part of the groove is a vacuum area.

11. The electronic package according to claim 1, wherein: The electronic package also includes a supporting structure for supporting and electrically connecting the electronic element.

12. The electronic package according to claim 1, wherein: The electronic package also includes a packaging layer covering the electronic element and exposing a portion of the electronic element, so that the at least two heat dissipating materials are also arranged on the packaging layer.

13. A method for manufacturing an electronic package, characterized in that: include: Forming at least two heat dissipation materials on an electronic component, wherein one of the at least two heat dissipation materials is liquid metal, the thermal conductivity of the liquid metal is greater than the thermal conductivity of the other heat dissipation materials, the other heat dissipation material is formed with at least one opening at a position corresponding to the electronic component, and the liquid metal is formed in the opening of the other heat dissipation material; and The heat sink is combined with the electronic component via the at least two heat sink materials.

14. The method for manufacturing an electronic package according to claim 13, wherein: A heat-conducting layer is formed between the electronic element and the at least two heat-dissipating materials, and the heat-conducting layer includes a metal portion disposed on the electronic element and a concave-convex portion formed on the metal portion.

15. The method for manufacturing an electronic package as claimed in claim 14, wherein: The concavoconvex part is in a grid shape.

16. The method for manufacturing an electronic package as claimed in claim 14, wherein: The at least two heat dissipating materials are combined with the concave-convex portion.

17. The method for manufacturing an electronic package as claimed in claim 13, wherein: The heat dissipation component includes a heat dissipation body and supporting legs arranged on the heat dissipation body, and the at least two heat dissipation materials are located between the heat dissipation body and the electronic element.

18. The method for manufacturing an electronic package as claimed in claim 17, wherein: A heat-conducting layer is formed between the heat-dissipating body and the at least two heat-dissipating materials, and the heat-conducting layer includes a metal portion disposed on the heat-dissipating body and a concave-convex portion formed on the metal portion.

19. The method for manufacturing an electronic package as claimed in claim 18, wherein: The concavoconvex part is in a grid shape.

20. The method for manufacturing an electronic package as claimed in claim 18, wherein: The at least two heat dissipating materials are combined with the concave-convex portion.

21. The method for manufacturing an electronic package as claimed in claim 13, wherein: A groove is formed on the side of the heat dissipation element facing the at least two heat dissipation materials.

22. The method for manufacturing an electronic package as claimed in claim 21, wherein: A part of the groove is filled with the liquid metal, and another part of the groove is a vacuum area.

23. The method for manufacturing an electronic package as claimed in claim 13, wherein: The manufacturing method also includes using a supporting structure to support and electrically connect the electronic component.

24. The method for manufacturing an electronic package as claimed in claim 13, wherein: The manufacturing method further comprises covering the electronic element with a packaging layer, and partially exposing the electronic element from the packaging layer, so that the at least two heat dissipating materials are also arranged on the packaging layer.

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