Display panel and display device

Abstract

An embodiment of the present application provides a display panel and a display device. The display panel includes a substrate, a packaging layer, and a barrier structure; the packaging layer includes an inorganic packaging layer which is disposed on one side of the substrate and is a continuous film layer; the barrier structure includes a stress relief structure which is disposed on the side of the inorganic packaging layer close to or away from the substrate, and the elastic modulus of the stress relief structure is less than that of the inorganic packaging layer. The stress relief structure is used to release the cutting stress of the inorganic packaging layer. By providing a barrier structure in the peripheral region in the present application, and the elastic modulus of the stress relief structure in the barrier structure is less than that of the inorganic packaging layer, when the inorganic packaging layer is cut, the cutting stress is released by the stress relief structure, which is beneficial to reducing or eliminating cracks in the inorganic packaging layer, thereby ensuring the packaging effect of the display area and being conducive to improving the packaging reliability and cutting yield of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technologies. Specifically, the present application relates to a display panel and a display device. Background Art

[0002] Organic light-emitting diodes (OLEDs) have received great attention and development due to their flexibility, fast response time, wide color gamut, low energy consumption, etc. Currently, the encapsulation of OLEDs mostly adopts Dam&Filler encapsulation. After encapsulation, it is necessary to cut the OLED device to remove the redundant parts.

[0003] However, currently, the encapsulation layer of a special-shaped OLED is prone to cracks during cutting, resulting in encapsulation failure and affecting the display performance and service life of the OLED. Summary of the Invention

[0004] In view of the shortcomings of the existing methods, the present application provides a display panel and a display device to solve the technical problem that the encapsulation layer of the existing display panel is prone to cracks during cutting.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including a display area and a peripheral area located outside the display area. The peripheral area includes:

[0006] a substrate;

[0007] an encapsulation layer including an inorganic encapsulation layer, the inorganic encapsulation layer is disposed on one side of the substrate, and the inorganic encapsulation layer is a continuous film layer;

[0008] a barrier structure including a stress release structure, the stress release structure is disposed on the side of the inorganic encapsulation layer close to or away from the substrate, the elastic modulus of the stress release structure is less than that of the inorganic encapsulation layer, and the stress release structure is used to release the cutting stress of the inorganic encapsulation layer.

[0009] Optionally, the barrier structure includes at least one first barrier structure and / or at least one second barrier structure. Both the first barrier structure and the second barrier structure include a stress release structure, and the stress release structure is disposed on the side of the inorganic encapsulation layer close to the substrate.

[0010] Optionally, the inorganic encapsulation layer includes a first inorganic encapsulation structure on the side of the stress release structure away from the substrate. The stress release structure includes a groove. The first inorganic encapsulation structure includes a first sub-structure located in the groove and a second sub-structure located outside the groove, and the first sub-structure and the second sub-structure are connected.

[0011] Optionally, the second barrier structure further includes an isolation structure disposed on a side of the stress relief structure close to the substrate.

[0012] Optionally, the barrier structure includes a first barrier structure and two second barrier structures. Along a direction parallel to the substrate, the first barrier structure is located between the two barrier structures.

[0013] Optionally, the display panel further includes a light-emitting functional layer disposed on a side of the inorganic encapsulation layer close to the substrate.

[0014] Optionally, the elastic modulus of the stress relief structure is less than that of the light-emitting functional layer.

[0015] Optionally, the diameter of the groove is not greater than 5 microns.

[0016] Optionally, the display panel further includes at least one of the following:

[0017] The elastic modulus of the stress relief structure is not less than 0.1 MPa and not greater than 10 MPa;

[0018] The material of the stress relief structure includes at least one of an elastic resin, an organic substance, or a reticular fiber;

[0019] The shape of the display panel includes an irregular shape;

[0020] The encapsulation layer further includes an organic encapsulation layer disposed on a side of the inorganic encapsulation layer close to or away from the substrate;

[0021] The substrate includes a stacked substrate, a gate insulating layer, a first gate layer, a second gate layer, an interlayer dielectric layer, a source-drain metal layer, and a passivation layer.

[0022] In a second aspect, an embodiment of the present application provides a display device including the display panel of the first aspect.

[0023] The beneficial technical effects brought by the technical solution provided by the embodiment of the present application include:

[0024] By providing a barrier structure in the peripheral region and the elastic modulus of the stress relief structure in the barrier structure being less than that of the inorganic encapsulation layer, when the stress relief structure is disposed on a side of the inorganic encapsulation layer close to or away from the substrate, the inorganic encapsulation layer is cut, so that the cutting stress is released by the stress relief structure, which can help reduce or eliminate cracks in the inorganic encapsulation layer, thereby ensuring the encapsulation effect of the display area and being beneficial to improving the encapsulation reliability and cutting yield of the display panel.

[0025] Moreover, when moisture invades the peripheral region, that is, after the encapsulation fails, since the stress release structure in the peripheral region can play a certain role in blocking the diffusion of moisture, it is beneficial to reduce the speed of moisture diffusion from the peripheral region to the display region, which is conducive to extending the service life of the display panel.

[0026] In addition, due to the provision of a barrier structure in the peripheral region of the display panel, the cutting region where the cutting line is located between two adjacent display panels can be expanded towards the direction close to the display panel, that is, it is beneficial to expand the cutting region where the cutting line is located, which can facilitate increasing the cutting selection window and reduce the requirements for the cutting region and the cutting process.

[0027] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or can be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above-mentioned and / or additional aspects and advantages of the present application will become apparent and easy to understand from the following description of the embodiments in conjunction with the drawings, wherein:

[0029] Figure 1 is a schematic diagram of the film layer structure of the first display panel provided by the embodiment of the present application;

[0030] Figure 2 is a schematic diagram of the film layer structure of the second display panel provided by the embodiment of the present application;

[0031] Figure 3 is a schematic diagram of the film layer structure of the third display panel provided by the embodiment of the present application;

[0032] Figure 4 is a schematic diagram of the film layer structure of the fourth display panel provided by the embodiment of the present application;

[0033] Figure 5 is a schematic diagram of the film layer structure of the fifth display panel provided by the embodiment of the present application;

[0034] Figure 6 is a schematic diagram of the film layer structure of the sixth display panel provided by the embodiment of the present application;

[0035] Figure 7 is a schematic diagram of the film layer structure of the seventh display panel provided by the embodiment of the present application;

[0036] Figure 8 is a schematic diagram of the film layer structure of a substrate and a display panel provided by the embodiment of the present application. BRIEF DESCRIPTION OF THE DRAWINGS:

[0038] 1 - Substrate; 11 - Substrate; 12 - First gate insulating layer; 13 - First gate layer; 14 - Second insulating layer; 15 - Second gate layer; 16 - Interlayer dielectric layer; 17 - Source-drain metal layer; 18 - Passivation layer;

[0039] 2 - Inorganic encapsulation layer; 21 - First inorganic encapsulation structure; 211 - First sub-structure; 212 - Second sub-structure; 22 - Second inorganic encapsulation structure;

[0040] 3 - Barrier structure; 31 - First barrier structure; 32 - Second barrier structure; 321 - Isolation structure; 322 - Anode structure; 33 - Stress release structure; 331 - Groove;

[0041] 4 - Light-emitting functional layer;

[0042] 100 - Display panel; 101 - Peripheral area; 102 - Display area. Detailed implementation manners

[0043] The embodiments of the present application will be described below with reference to the accompanying drawings in the present application. It should be understood that the implementation manners described below with reference to the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0044] Those skilled in the art of the present technology can understand that, unless specifically stated otherwise, the singular forms "a", "an", "the", and "said" used herein may also include the plural forms. It should be further understood that the term "comprising" used in the specification of the present application means the presence of the described features, integers, steps, operations, elements, and / or components, but does not exclude the presence of other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by the art of the present technology. The term "and / or" used herein means at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or implemented as "B", or implemented as "A and B".

[0045] To make the objectives, technical solutions, and advantages of the present application clearer, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

[0046] The R & D idea of this application includes: Currently, for the encapsulation of large-sized OLEDs, Dam&Filler encapsulation is mostly used. After encapsulation, a dicing wheel is used to cut the OLED device to remove the redundant parts. Due to the irregular shape of the OLED, there is a situation where the encapsulation layer cannot completely coincide with the display area and the surrounding area. Generally, the encapsulation layer is larger than the area that needs to be encapsulated. Therefore, during the cutting process of the dicing wheel, the cutting stress will extend along the inorganic encapsulation layer towards the display area, resulting in cracks in the inorganic encapsulation layer, which affects the encapsulation reliability of the irregular substrate, as well as the display performance and service life of the display panel.

[0047] The following will specifically describe the technical solutions of this application and how the technical solutions of this application solve the above technical problems with specific embodiments. It should be noted that the following embodiments can be mutually referenced, borrowed, or combined. For the same terms, similar features, and similar implementation steps in different embodiments, they will not be repeatedly described.

[0048] An embodiment of this application provides a display panel 100, including a display area 102 and a peripheral area 101 located outside the display area 102. The structural schematic diagram of this display panel is as Figure 1 and Figure 2 shown, including: a substrate 1, an encapsulation layer, and a barrier structure 3.

[0049] The encapsulation layer includes an inorganic encapsulation layer 2. The inorganic encapsulation layer 2 is disposed on one side of the substrate 1, and the inorganic encapsulation layer 2 is a continuous film layer.

[0050] The barrier structure 3 includes a stress release structure 33. The stress release structure 33 is disposed on the side of the inorganic encapsulation layer 2 close to or away from the substrate 1. The elastic modulus of the stress release structure 33 is less than the elastic modulus of the inorganic encapsulation layer 2. The stress release structure 33 is used to release the cutting stress of the inorganic encapsulation layer 2.

[0051] In this embodiment, by disposing the barrier structure 3 in the peripheral area 101, and the elastic modulus of the stress release structure 33 in the barrier structure 3 is less than the elastic modulus of the inorganic encapsulation layer 2. When the stress release structure 33 is disposed on the side of the inorganic encapsulation layer 2 close to or away from the substrate 1, the inorganic encapsulation layer 2 is cut, so that the cutting stress is released by the stress release structure 33, which can help reduce or eliminate the cracks in the inorganic encapsulation layer 2, thereby ensuring the encapsulation effect of the display area 102 and being beneficial to improving the encapsulation reliability and dicing yield of the display panel 100.

[0052] Moreover, when water vapor invades the peripheral area 101, that is, after the encapsulation fails, since the stress release structure 33 in the peripheral area 101 can play a certain role in blocking the diffusion of water vapor, it is beneficial to reduce the speed of water vapor diffusion from the peripheral area 101 to the display area 102, which is beneficial to extending the service life of the display panel 100.

[0053] Moreover, since the barrier structure 3 is provided in the peripheral area 101 of the display panel 100, the cutting area where the cutting line is located between two adjacent display panels 100 can be expanded towards the direction close to the display panel 100, that is, it is beneficial to expand the cutting area where the cutting line is located, which can facilitate increasing the cutting selection window and reduce the requirements for the cutting area and the cutting process.

[0054] Optionally, as Figure 3 shown, the barrier structure 3 includes at least one first barrier structure 31 and / or at least one second barrier structure 32. Both the first barrier structure 31 and the second barrier structure 32 include a stress relief structure 33, and the stress relief structure 33 is provided on the side of the inorganic encapsulation layer 2 close to the substrate 1.

[0055] In this embodiment, the barrier structure 3 may include at least one first barrier structure 31, or the barrier structure 3 may include at least one second barrier structure 32, or the barrier structure 3 may include at least one first barrier structure 31 and at least one second barrier structure 32. The number of the first barrier structure 31 and the second barrier structure 32 is not limited in any way and can be set according to actual situations. As Figure 3 shown, in this embodiment, two second barrier structures 32 and one first barrier structure 31 are provided.

[0056] Optionally, as Figure 4 shown, the inorganic encapsulation layer 2 includes a first inorganic encapsulation structure 21 on the side of the stress relief structure 33 away from the substrate 1. The stress relief structure 33 includes a groove 331. The first inorganic encapsulation structure 21 includes a first sub-structure 211 located in the groove 331 and a second sub-structure 212 located outside the groove 331, and the first sub-structure 211 and the second sub-structure 212 are connected.

[0057] In this embodiment, the stress relief structure 33 includes a groove 331. By designing the groove 331, the contact area between the inorganic encapsulation layer 2 and the stress relief structure 33 is increased, which is beneficial to the cutting stress of the inorganic encapsulation layer 2 being fully released by the stress relief structure 33, and can reduce or completely eliminate the cracks of the inorganic encapsulation layer 2 more effectively, so as to ensure the encapsulation effect of the display area 102 and is beneficial to improving the encapsulation reliability and cutting yield of the display panel 100.

[0058] Furthermore, the inorganic encapsulation layer 2 includes a first inorganic encapsulation structure 21 located on a side of the stress release structure 33 away from the substrate 1 and a second inorganic encapsulation structure 22 located on a side of the substrate 1, and the first inorganic encapsulation structure 21 and the second inorganic encapsulation structure 22 are connected to form a continuous film layer. The first inorganic encapsulation structure 21 is prepared along with the groove 331 of the stress release structure 33, and the first substructure 211 of the first inorganic encapsulation structure 21 located in the groove 331 also forms a groove, and the second substructure 212 of the first inorganic encapsulation structure 21 located outside the groove 331 is connected to the first substructure 211 to form a continuous film layer.

[0059] It should be noted that the outside of the groove refers to the film layer in the stress release structure 33 except the groove.

[0060] Optionally, continue as Figure 3 and Figure 4 As shown, the second barrier structure 32 further includes an isolation structure 321 , and the isolation structure 321 is disposed on a side of the stress release structure 33 close to the substrate 1 .

[0061] In this embodiment, the isolation structure 321 is in an H-shape with a deflection of 90°. The isolation structure 321 can isolate the organic encapsulation layer in the encapsulation layer, so that the cutting stress cannot be extended to the display area 102 through the organic encapsulation layer, and the cracks generated during the cutting process can be limited to the peripheral area 101, thereby improving the encapsulation reliability and cutting yield of the special-shaped display panel.

[0062] It should be noted that the isolation structure 321 cannot separate the inorganic encapsulation layer 2 .

[0063] Optionally, the positional relationship between the first barrier structure 31 and the second barrier structure 32 can be set arbitrarily according to actual needs, and is not limited here.

[0064] Optionally, continue as Figure 3 and Figure 4 As shown, the second barrier structure 32 further includes an anode structure 322 , and the anode structure 322 is disposed on a side of the isolation structure 321 close to the stress release structure 33 .

[0065] Alternatively, if Figure 4 As shown, the barrier structure includes a first barrier structure and two second barrier structures. Along the direction parallel to the substrate 1 , the first barrier structure 31 is located between the two second barrier structures 32 .

[0066] In this embodiment, the first barrier structure 31 is located between two second barrier structures 32. The second barrier structure 32 can block the organic encapsulation layer in the encapsulation layer and release the cutting stress of the inorganic encapsulation layer 2. The first barrier structure 31 can release the cutting stress of the encapsulation layer, which is beneficial to reducing or eliminating cracks in the inorganic encapsulation layer 2, thereby ensuring the encapsulation effect of the display area 102 and improving the encapsulation reliability and cutting yield of the display panel 100.

[0067] Optionally, as Figure 5 shown, along the direction parallel to the substrate 1, the first barrier structure 31 is located on the side of the second barrier structure 32 close to the display area 102 and close to the display area 102.

[0068] Optionally, along the direction parallel to the substrate 1, the first barrier structure 31 can also be located on the side of the second barrier structure 32 far from the display area 102 and far from the display area 102.

[0069] Optionally, as Figure 6 and Figure 7 shown, the display panel 100 further includes a light-emitting functional layer 4, and the light-emitting functional layer 4 is disposed on the side of the inorganic encapsulation layer 2 close to the substrate 1.

[0070] In this embodiment, since moisture and the like are likely to invade the light-emitting functional layer 4 and affect the display performance of the display panel 100, an encapsulation layer is provided on the side of the light-emitting functional layer 4 far from the substrate 1. The light-emitting functional layer 4 may include a cathode structure, and the light-emitting functional layer 4 is disposed on the side of the inorganic encapsulation layer 2 close to the substrate 1.

[0071] Optionally, the elastic modulus of the stress release structure 33 is less than the elastic modulus of the light-emitting functional layer 4, that is, the elastic modulus of the stress release structure 33 is less than the elastic modulus of the cathode structure and the inorganic encapsulation layer 2.

[0072] Optionally, the light-emitting functional layer 4 can be disposed on the side of the stress release structure 33 close to or far from the inorganic encapsulation layer 2.

[0073] In one possible embodiment, the light-emitting functional layer 4 can be disposed on the side of the stress release structure 33 close to the inorganic encapsulation layer 2, that is, the stress release structure 33 is disposed on the same side of the light-emitting functional layer 4 and the inorganic encapsulation layer 2. Then, the stress release structure 33 can release the cutting stress acting on the light-emitting functional layer 4 and the inorganic encapsulation layer 2, reduce or eliminate the generation of cracks, and improve the cutting yield.

[0074] In another feasible embodiment, the light-emitting functional layer 4 may be disposed on the side of the stress relief structure 33 away from the inorganic encapsulation layer 2, that is, the stress relief structure 33 is disposed between the light-emitting functional layer 4 and the inorganic encapsulation layer 2. Then, the stress relief structure 33 can release the cutting stress acting on the inorganic encapsulation layer 2 downward and release the cutting stress acting on the light-emitting functional layer 4 upward, reducing or eliminating the generation of cracks and improving the cutting yield.

[0075] Optionally, when the depth of the groove 331 of the stress relief structure 33 in the direction perpendicular to the substrate 1 exceeds a first value, the light-emitting functional layer 4 is exactly blocked by the stress relief structure 33. Then, the stress relief structure 33 will block the diffusion of water and oxygen from the light-emitting functional layer 4 in the peripheral region 101 to the light-emitting functional layer 4 in the display region 102, which is beneficial to ensuring the display performance of the display panel 100. When the depth of the groove 331 of the stress relief structure 33 in the direction perpendicular to the substrate 1 is less than the first value, the light-emitting functional layer 4 is not blocked by the stress relief structure 33, and then the light-emitting functional layer 4 is prepared according to the shape of the groove 331.

[0076] Optionally, the diameter of the groove 331 is not greater than 5 microns.

[0077] In this embodiment, the diameter of the groove 331 is not greater than 5 microns, which is beneficial to arranging more grooves 331 on the stress relief structure 33 with the same area, increasing the contact area between the stress relief structure 33 and the inorganic encapsulation layer 2, enabling the cutting stress of the inorganic encapsulation layer 2 to be released more fully, improving the cutting yield, and increasing the packaging reliability of the display panel.

[0078] Optionally, the elastic modulus of the stress relief structure 33 is not less than 0.1 MPa and not greater than 10 MPa.

[0079] In this embodiment, the elastic modulus of the stress relief structure 33 is not less than 0.1 MPa and not greater than 10 MPa. Within this range, it is beneficial to more applicable materials, and it can avoid the stress relief structure 33 being too soft to be prepared, and avoid the stress relief structure 33 being too hard to release the cutting stress of the inorganic encapsulation layer 2, thereby causing cracks to transfer to the display region 102 and resulting in the packaging failure of the display panel. Therefore, setting the elastic modulus of the stress relief structure 33 within this range is beneficial to the preparation of the stress relief structure 33 and can release the cutting stress of the inorganic encapsulation layer 2.

[0080] Optionally, the material of the stress relief structure 33 includes at least one of elastic resin, organic matter or reticular fiber.

[0081] In this embodiment, the organic matter can be an organic matter with loose film quality, as long as its elastic modulus is less than that of the inorganic encapsulation film layer 2.

[0082] Optionally, the shape of the display panel includes an irregular shape.

[0083] In this embodiment, for an irregularly shaped display panel, the area of ​​its packaging layer will be larger than the areas of the display area 102 and the peripheral area 101, that is, the packaging layer cannot overlap with the display area 102 and the peripheral area 101. When cutting the excess packaging layer, the cutting stress will be released by the stress release structure 33 of the peripheral area 101, which is beneficial to improving the cutting yield and packaging reliability of the irregularly shaped display panel.

[0084] Optionally, the encapsulation layer further includes an organic encapsulation layer, and the organic encapsulation layer is arranged on a side of the inorganic encapsulation layer 2 close to or away from the substrate 1 .

[0085] In this embodiment, the organic encapsulation layer can be arranged on the side of the inorganic encapsulation layer 2 close to the substrate 1, or the organic encapsulation layer can be arranged on the side of the inorganic encapsulation layer 2 away from the substrate 1, or there are two organic encapsulation layers, and the inorganic encapsulation layer 2 is arranged in the middle of the two organic encapsulation layers. Specifically, the number and positional relationship of the organic encapsulation layer and the inorganic encapsulation layer 2 can be set according to actual needs.

[0086] In one feasible embodiment, the organic encapsulation layer is arranged on the side of the stress release structure 33 away from the inorganic encapsulation layer 2, that is, the stress release structure 33 is arranged on the same side of the organic encapsulation layer and the inorganic encapsulation layer 2. The stress release structure 33 releases the cutting stress acting on the organic encapsulation layer and the inorganic encapsulation layer 2, which is beneficial to ensuring the cutting yield of the display panel 100.

[0087] In another feasible embodiment, the organic encapsulation layer is arranged on the side of the stress release structure 33 close to the inorganic encapsulation layer 2, that is, the stress release structure 33 is arranged between the organic encapsulation layer and the inorganic encapsulation layer 2, and the second barrier structure 32 can isolate the organic encapsulation layer, thereby preventing water and oxygen from entering the display area 102 through the organic encapsulation layer, and the stress release structure 33 can release the cutting stress of the inorganic encapsulation layer 2, which is beneficial to ensure the cutting yield of the display panel 100.

[0088] Alternatively, if Figure 8 As shown, the substrate 1 includes a stacked substrate 11 , a first gate insulating layer 12 , a first gate layer 13 , a second gate insulating layer 14 , a second gate layer 15 , an interlayer dielectric layer 16 , a source-drain metal layer 17 and a passivation layer 18 .

[0089] In this embodiment, the substrate 1 may include any one of the substrate 11, the first gate insulating layer 12, the first gate layer 13, the second gate insulating layer 14, the second gate layer 15, the interlayer dielectric layer 16, the source-drain metal layer 17 and the passivation layer 18, or a combination of any two layers, or a combination of any two or more layers, or the substrate 1 may also include other film layers, which are not limited here.

[0090] It should be noted that the passivation layer 18 is disposed on a side of the barrier structure 3 close to the substrate 1 .

[0091] Based on the same inventive concept, an embodiment of the present application provides a display device, which includes the display panel 100 provided in the above embodiment. :

[0092] In this embodiment, the display device includes the display panel 100 provided in the above embodiment, and the beneficial effects of the display device also include the beneficial effects of the display panel 100 , and the beneficial effects of the display device are not repeated here.

[0093] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0094] 1. In the embodiment of the present application, a barrier structure is provided in the peripheral area, and the elastic modulus of the stress release structure in the barrier structure is smaller than the elastic modulus of the inorganic encapsulation layer. When the stress release structure is provided on the side of the inorganic encapsulation layer close to or away from the substrate, the inorganic encapsulation layer is cut so that the cutting stress is released by the stress release structure. This can help reduce or eliminate cracks in the inorganic encapsulation layer, thereby ensuring the encapsulation effect of the display area, and is beneficial to improving the encapsulation reliability and cutting yield of the display panel.

[0095] 2. In the embodiment of the present application, when water vapor invades the peripheral area, that is, the package fails, the stress release structure in the peripheral area can block the diffusion of water vapor to a certain extent, which is beneficial to reduce the diffusion speed of water vapor in the peripheral area to the display area, thereby extending the service life of the display panel.

[0096] 3. In the embodiment of the present application, since a barrier structure is provided in the peripheral area of ​​the display panel, the cutting area where the cutting line between two adjacent display panels is located can be expanded toward the display panel, which is beneficial to expanding the cutting area where the cutting line is located, and can be beneficial to increasing the cutting selection window, thereby reducing the requirements for the cutting area and the cutting process.

[0097] 4. In the embodiment of the present application, the stress release structure includes a groove. The contact area between the inorganic packaging layer and the stress release structure is increased through the design of the groove, which is beneficial for the cutting stress of the inorganic packaging layer to be fully released by the stress release structure, and can further reduce or completely eliminate the cracks in the inorganic packaging layer, thereby ensuring the packaging effect of the display area, which is beneficial to improving the packaging reliability and cutting yield of the display panel.

[0098] 5. In the embodiment of the present application, the isolation structure can isolate the organic encapsulation layer in the encapsulation layer, so that the cutting stress cannot extend to the display area through the organic encapsulation layer, and the cracks generated during the cutting process can be limited to the surrounding area, thereby improving the packaging reliability and cutting yield of the special-shaped display panel.

[0099] 6. In the embodiments of the present application, the light-emitting functional layer may be disposed on the side of the stress relief structure close to the inorganic encapsulation layer 2, that is, the stress relief structure is disposed on the same side of the light-emitting functional layer and the inorganic encapsulation layer. Then, the stress relief structure can release the cutting stress acting on the light-emitting functional layer and the inorganic encapsulation layer, reduce or eliminate the generation of cracks, and improve the cutting yield.

[0100] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present application can be alternated, changed, combined, or deleted. Further, other steps, measures, and solutions in the various operations, methods, and processes discussed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, those in the prior art having steps, measures, and solutions in the various operations, methods, and processes disclosed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted.

[0101] In the description of the present application, the directions or positional relationships indicated by the words "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are the exemplary directions or positional relationships based on the drawings, which are for the convenience of describing or simplifying the embodiments of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present application.

[0102] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0103] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0104] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0105] It should be understood that although the steps in the flowcharts of the accompanying drawings are sequentially shown as indicated by the arrows, the execution order of these steps is not limited to the order indicated by the arrows. Unless otherwise clearly stated in this document, in some implementation scenarios of the embodiments of the present application, the steps in each process can be executed in other orders according to requirements. Moreover, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on the actual implementation scenarios. Some or all of these sub-steps or stages can be executed at the same time or at different times. In scenarios where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured according to requirements, and the embodiments of the present application do not limit this.

[0106] The above are only some implementation manners of the present application. It should be noted that for those of ordinary skill in the art, without departing from the technical concept of the solution of the present application, other similar implementation means based on the technical idea of the present application also belong to the protection scope of the embodiments of the present application.

Claims

1. A display panel, comprising a display area and a peripheral area located around the display area, characterized in that, The peripheral region includes: a substrate; a packaging layer including an inorganic packaging layer disposed on one side of the substrate, the inorganic packaging layer being a continuous film layer; a barrier structure including a stress release structure disposed on one side of the inorganic packaging layer close to or away from the substrate, the elastic modulus of the stress release structure being less than that of the inorganic packaging layer, the stress release structure being configured to release the cutting stress of the inorganic packaging layer, and the elastic modulus of the stress release structure being not less than 0.1 MPa and not greater than 10 MPa.

2. The display panel according to claim 1, wherein The barrier structure includes at least one first barrier structure and / or at least one second barrier structure, both the first barrier structure and the second barrier structure including a stress release structure disposed on the side of the inorganic packaging layer close to the substrate.

3. The display panel according to claim 2, characterized in that, The inorganic packaging layer includes a first inorganic packaging structure on the side of the stress release structure away from the substrate, the stress release structure includes a groove, and the first inorganic packaging structure includes a first sub-structure within the groove and a second sub-structure outside the groove.

4. The display panel according to claim 2 or 3, characterized in that, The second barrier structure further includes an isolation structure disposed on the side of the stress release structure close to the substrate.

5. The display panel according to claim 4, wherein The barrier structure includes one first barrier structure and two second barrier structures, and in a direction parallel to the substrate, the first barrier structure is located between the two second barrier structures.

6. The display panel according to any one of claims 1-3, characterized in that, It further includes a light-emitting functional layer disposed on the side of the inorganic packaging layer close to the substrate.

7. The display panel according to claim 6, wherein The elastic modulus of the stress release structure is less than that of the light-emitting functional layer.

8. The display panel according to claim 3, wherein The diameter of the groove is not greater than 5 microns.

9. The display panel according to claim 1, wherein It further includes at least one of the following: The material of the stress release structure includes at least one of an elastic resin, an organic substance, or a reticular fiber; The shape of the display panel includes an irregular shape; The packaging layer further includes an organic packaging layer disposed on the side of the inorganic packaging layer close to or away from the substrate; The substrate includes a stacked substrate, a gate insulating layer, a first gate layer, a second gate layer, an interlayer dielectric layer, a source-drain metal layer, and a passivation layer.

10. A display device, characterized in that, A display panel according to any one of claims 1-9.

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