A display panel and a display device

Abstract

An embodiment of the present invention discloses a display panel and a display device. The display panel includes: a substrate including a bonding area; an insulating layer located in the bonding area on one side of the substrate; a plurality of first bonding connection terminals and a plurality of second bonding connection terminals, the plurality of first bonding connection terminals are arranged in at least one row, the plurality of second bonding connection terminals are arranged in at least one row, and both are arranged in the bonding area; the first bonding connection terminals are input terminals, and the second bonding connection terminals are output terminals; a plurality of metal traces located between the insulating layer and the substrate; the metal traces extend to the bonding area; wherein, a plurality of openings are provided on the insulating layer in the area between the first bonding connection terminals and the second bonding connection terminals, and the openings are provided on the insulating layer in the area between adjacent metal traces. Accordingly, the stress accumulated in the insulating layer of the bonding area is released, thereby preventing the inorganic insulating layers in the bonding area from peeling off from each other after bonding, and improving the bonding reliability of the display panel.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of display technologies, and in particular, to a display panel and a display device. Background Art

[0002] With the continuous popularization of portable intelligent terminal devices, the bezels of display panels in intelligent terminal devices are getting narrower and narrower, and even a nearly borderless full-screen can be achieved.

[0003] Currently, general display panels adopt LCD (Liquid Crystal Display) display panels, LED (Light-Emitting Diode) display panels, or OLED (Organic Light-Emitting Diode) display panels. Currently, IC (Integrated Circuit) bonding mainly adopts COG (Chip On Glass), COF (Chip On Film), or COP (Chip On plastic) processes for bonding.

[0004] However, no matter which of the above bonding processes, after bonding is completed, when the display panel is in a high-temperature or high-humidity environment, the inorganic insulating layers in the bonding area of the display panel will peel off from each other, showing low bonding reliability. Summary of the Invention

[0005] Embodiments of the present invention provide a display panel and a display device to release the stress accumulated in the inorganic insulating layers in the bonding area of the display panel, thereby avoiding peeling between the inorganic insulating layers in the bonding area of the display panel after bonding and improving the bonding reliability of the display panel.

[0006] In a first aspect, embodiments of the present invention provide a display panel, the display panel including: a substrate including a bonding area;

[0007] an insulating layer located in the bonding area on one side of the substrate;

[0008] a plurality of first bonding connection terminals and a plurality of second bonding connection terminals, the plurality of first bonding connection terminals being arranged in at least one row, the plurality of second bonding connection terminals being arranged in at least one row, both being arranged in the bonding area; the first bonding connection terminals are input terminals, and the second bonding connection terminals are output terminals;

[0009] a plurality of metal traces located between the insulating layer and the substrate; the metal traces extend to the bonding area;

[0010] Wherein, a plurality of openings are provided on the insulating layer in the region between the first bonding connection terminal and the second bonding connection terminal, and the openings are provided on the insulating layer in the region between adjacent metal traces.

[0011] Optionally, the opening includes a first opening; the first opening is provided adjacent to the first bonding connection terminal, the first opening is arranged in at least one row, and the arrangement direction of the first opening is the same as the arrangement direction of the first bonding connection terminal.

[0012] Optionally, the opening includes a second opening; the second opening is provided adjacent to the second bonding connection terminal, the second opening is arranged in at least one row, and the arrangement direction of the second opening is the same as the arrangement direction of the second bonding connection terminal.

[0013] Optionally, the substrate further includes a display area;

[0014] Relative to the first bonding connection terminal, the second bonding connection terminal is closer to the display area; the metal trace connected to the first bonding connection terminal is a first metal trace, and the first metal trace extends from the first bonding connection terminal, passes through the second bonding connection terminal and extends to the display area;

[0015] The first opening and / or the second opening are provided on the insulating layer in the region between adjacent first metal traces.

[0016] Optionally, the metal trace connected to the second bonding connection terminal is a second metal trace, and the second metal trace extends from the second bonding connection terminal to the display area;

[0017] The second opening is provided on the insulating layer in the region between adjacent second metal traces.

[0018] Optionally, at least two of the openings are provided on the insulating layer in the region between two adjacent metal traces.

[0019] Optionally, the insulating layer includes a first inorganic insulating layer, and the opening penetrates through the first inorganic insulating layer.

[0020] Optionally, the insulating layer further includes a second inorganic insulating layer, and the second inorganic insulating layer is located on the side of the first inorganic insulating layer away from the substrate; the opening penetrates through the second inorganic insulating layer, or the opening penetrates through the second inorganic insulating layer and the first inorganic insulating layer.

[0021] Optionally, both the first opening and the metal trace are in the shape of a cuboid;

[0022] Preferably, the shape of the second opening is rectangular parallelepiped.

[0023] In a second aspect, an embodiment of the present invention further provides a display device. The display device includes the display panel as described in the first aspect above. The display device further includes a connecting member; the connecting member includes a plurality of input pins and a plurality of output pins. The input pins are connected to the corresponding first bonding connection terminals, and the output pins are connected to the corresponding second bonding connection terminals.

[0024] The technical solution of the embodiment of the present invention is that the display panel includes a substrate, an insulating layer, a plurality of first bonding connection terminals, a plurality of second bonding connection terminals, and a plurality of metal traces; wherein, the substrate includes a bonding area, the insulating layer is located in the bonding area on one side of the substrate, the plurality of first bonding connection terminals are arranged in at least one row, the plurality of second bonding connection terminals are arranged in at least one row, the plurality of first bonding connection terminals and the plurality of second bonding connection terminals are both arranged in the bonding area, and the plurality of metal traces are located between the insulating layer and the substrate.

[0025] By providing a plurality of openings in the insulating layer in the area between the first bonding connection terminals and the second bonding connection terminals, the stress accumulated in the insulating layer of the bonding area can be released. Based on this, when the insulating layer in the bonding area is formed by stacking multiple inorganic insulating layers, only by setting the depth of the openings so that the openings penetrate through each inorganic insulating layer, the stress accumulated in each inorganic insulating layer can be released. According to the embodiment of the present invention, after bonding is completed, since the stress accumulated in each inorganic insulating layer has been released through the provided openings, there is no longer any accumulated stress in each inorganic insulating layer. Therefore, when the display panel is in a high-temperature or high-humidity environment, each inorganic insulating layer will not peel off from each other due to the release of stress in the high-temperature or high-humidity environment, thereby improving the bonding reliability of the display panel. And, in the embodiment of the present invention, by providing the openings in the insulating layer in the area between adjacent metal traces, the metal traces located between the insulating layer and the substrate will not be exposed by the provided openings, but will still be covered and protected by the insulating layer, thereby avoiding bright lines of the metal traces in the bonding area and ensuring that the metal traces in the bonding area will not be damaged and the metal traces can maintain their good performance. Description of the Drawings

[0026] Figure 1 is a partial top view structural schematic diagram of a display panel in the related art;

[0027] Figure 2 is Figure 1 a cross-sectional structural schematic diagram of the shown display panel taken along the section line CC';

[0028] Figure 3 is a partial top view structural schematic diagram of another display panel in the related art;

[0029] Figure 4 is a partial top - down structural schematic diagram of another display panel in the related art;

[0030] Figure 5 is a partial top - down structural schematic diagram of a display panel provided by an embodiment of the present invention;

[0031] Figure 6 is Figure 5 a schematic cross - sectional structure diagram of the display panel shown along the section line DD';

[0032] Figure 7 is a partial top - down structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0033] Figure 8 is a partial top - down structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0034] Figure 9 is a partial top - down structural schematic diagram of another display panel provided by an embodiment of the present invention;

[0035] Figure 10 is a schematic cross - sectional structure diagram of another display panel provided by an embodiment of the present invention along the section line DD';

[0036] Figure 11 is a schematic cross - sectional structure diagram of another display panel provided by an embodiment of the present invention along the section line DD';

[0037] Figure 12 is a schematic cross - sectional structure diagram of another display panel provided by an embodiment of the present invention along the section line DD'. Detailed implementation manners

[0038] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that for the convenience of description, only parts related to the present invention rather than all structures are shown in the drawings.

[0039] As mentioned in the background art, after IC bonding is completed, when the display panel is in a high - temperature or high - humidity environment, the inorganic insulating layers in the bonding area of the display panel will peel off from each other, showing low bonding reliability. After research by the inventor, it is found that the reason for this technical problem is:

[0040] Figure 1 is a partial top - down structural schematic diagram of a display panel in the related art, Figure 2 is Figure 1Schematic cross-sectional structure diagram of the shown display panel taken along the section line CC'. Figure 2 It also schematically shows the accompanying drawings involved in the process of bonding an IC to a display panel in the related art. In combination with Figure 2 and Figure 1 , the IC has a plurality of bonding pins (bumps), and the bumps can include Input bumps (bonding input pins) and Output bumps (bonding output pins). The Input bumps and Output bumps are respectively distributed on both sides of the IC. The display panel includes a substrate 100, a plurality of metal traces 300, an insulating layer 200, and a plurality of bonding connection terminals (Pads) located in the bonding area BB of the substrate 100. The metal traces 300 are located between the substrate 100 and the insulating layer 200. The metal traces 300 can extend from the display area AA of the display panel to the bonding area BB and are electrically connected to the Pads. The insulating layer 200 is formed by stacking a first inorganic insulating layer 210 and a second inorganic insulating layer 220. Corresponding to the IC bumps, the Pads can include Input Pads (bonding input connection terminals) and Output bumps (bonding output connection terminals), and the Input Pads and Output bumps are respectively distributed on both sides of the insulating layer 200.

[0041] Based on this, continuing to refer to Figure 2 , during the process of bonding the IC bumps to the Pads corresponding to the bonding area of the substrate 100, due to the pressure F exerted on the IC towards the substrate 100, the position where the Pads in the bonding area are located is subjected to a relatively large pressure, thereby causing the insulating layer 200 to deform. After the bonding is completed, the stress caused by the deformation accumulates in the first inorganic insulating layer 210 and the second inorganic insulating layer 220. Thus, when the display panel is in a high-temperature or high-humidity environment, based on environmental factors and its own material factors, the first inorganic insulating layer 210 and the second inorganic insulating layer 220 respectively release stress. And during the process of releasing this stress, since the stress accumulated in the first inorganic insulating layer 210 and the stress accumulated in the second inorganic insulating layer 220 usually do not match, the first inorganic insulating layer 210 and the second inorganic insulating layer 220 are peeled off from each other, and the display panel exhibits low bonding reliability.

[0042] Regarding this,[[]] Figure 3 is a partial top-view structure schematic diagram of another display panel in the related art. Referring to Figure 3 , in order to release the stress accumulated in the insulating layer 200 in the bonding area, in the related art, a groove 410 is provided at a position adjacent to the Pad in the insulating layer 200. The groove 410 extends along the arrangement direction x of the Pads, that is, the stress accumulated in the insulating layer 200 is released through the long-strip-shaped groove 410 on the insulating layer 200. However, as Figure 3As shown, this method exposes all the multiple metal traces 300 under the insulating layer 200 through the grooves. The positions of the metal traces 300 exposed by the grooves are no longer covered and protected by the insulating layer 200, resulting in bright lines of the metal traces 300 in the bonding area BB, and the metal traces 300 are easily damaged.

[0043] In addition, Figure 4 is a partial top view structural schematic diagram of another display panel in the related art. Refer to Figure 4 , another way to release the stress in the insulating layer 200 of the bonding area in the related art is to set multiple slits 420 at positions adjacent to the Pad in the insulating layer 200, and the slits 420 extend along the arrangement direction x of the Pad. The defect of this method is that in the patterning process of the multiple slits 420, a thin layer of photoresist needs to be retained at the positions where the slits 420 are to be set on the insulating layer 200. Since the photoresist has a leveling property, the photoresist retained at the positions where the slits 420 are to be set on the insulating layer 200 will flow, for example, flow along the arrangement direction x of the Pad. This results in different thicknesses of the photoresist within the spacing between two adjacent metal traces 300, and ultimately leads to uneven depths at various positions of the entire slit 420. The poor uniformity of the slit 420 itself is not conducive to releasing stress well, and it also exposes the underlying metal traces 300 to a certain extent.

[0044] In view of this, an embodiment of the present invention provides a display panel to release the stress accumulated in each inorganic insulating layer of the bonding area of the display panel well on the premise of ensuring that the metal traces are not exposed, avoid peeling between the inorganic insulating layers in the bonding area of the display panel after bonding, and improve the bonding reliability of the display panel. Figure 5 is a partial top view structural schematic diagram of a display panel provided by an embodiment of the present invention. Figure 6 is Figure 5 a cross-sectional structural schematic diagram of the display panel shown along the section line DD'.

[0045] Combined with Figure 6 and Figure 5, the display panel includes: a substrate 100 including a bonding region BB; an insulating layer 200 located in the bonding region BB on one side of the substrate 100; a plurality of first bonding connection terminals 510 and a plurality of second bonding connection terminals 520, the plurality of first bonding connection terminals 510 are arranged in at least one row, the plurality of second bonding connection terminals 520 are arranged in at least one row, and both are arranged in the bonding region BB; the first bonding connection terminal 510 is an input terminal, and the second bonding connection terminal 520 is an output terminal; a plurality of metal traces 300 located between the insulating layer 200 and the substrate 100; the metal traces 300 extend to the bonding region BB; wherein, a plurality of openings 600 are provided on the insulating layer 200 in the region between the first bonding connection terminal 510 and the second bonding connection terminal 520, and the openings 600 are provided on the insulating layer 200 in the region between adjacent metal traces 300.

[0046] Specifically, the display panel includes a display area AA and a non-display area NAA, and the bonding region BB is located in the non-display area NAA. The display panel can be an LCD display panel, an LED display panel or an OLED display panel. The display panel can be a flexible display panel that can be bent, or a rigid display panel that cannot be bent; correspondingly, the substrate 100 can be a flexible substrate that can be bent, or a rigid substrate that cannot be bent. The flexible substrate can be made of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compound (PAR) and / or fiberglass reinforced plastic (FRP). The rigid substrate can be made of materials such as glass.

[0047] The insulating layer 200 can be formed by resin, silicon oxide, silicon nitride, silicon oxynitride and / or other suitable materials. The insulating layer 200 can be made separately in the bonding region BB, or can be formed in the same process as some film layers in the display area AA of the display panel, that is, formed simultaneously with the existing film layers of the display panel itself. Taking the OLED display panel as an example, the display area of the OLED display panel may include a driving circuit layer, an OLED device layer and a packaging layer stacked on the substrate 100. The packaging layer packages the OLED device layer to prevent external moisture, oxygen, etc. from entering the OLED device layer. The packaging layer is formed by stacking at least one organic layer and at least one inorganic layer. Thus, when forming the organic layer or inorganic layer in the packaging layer on the substrate 100, the organic layer and / or inorganic layer can be formed not only in the display area AA of the substrate 100, but also in the bonding region BB of the substrate 100, and the organic layer and / or inorganic layer located in the bonding region BB can be used as the insulating layer 200 of the bonding region BB. Of course, the insulating layer 200 can also be formed by extending other organic or inorganic film layers in the display area of the display panel except the packaging layer to the bonding region BB. This embodiment does not make specific limitations on this.

[0048] Both the first bonding connection terminal 510 and the second bonding connection terminal 520 are located in the bonding area BB and are both above the insulating layer 200. The first bonding connection terminal 510 is an input terminal and can bond to the input pins of the connecting member, such as the Input bump of the bonded IC. The second bonding connection terminal 520 is an output terminal and can bond to the output pins of the connecting member, such as the Output bump of the bonded IC. According to the size of the bonding area BB, the specific number of bonding connection terminals, and the pin distribution of the connecting member, etc., it can be determined that the multiple first bonding connection terminals 510 are arranged in one row or multiple rows, the multiple second bonding connection terminals 520 are arranged in one row or multiple rows, and the spacing between the first bonding connection terminal 510 and the second bonding connection terminal 520 is determined, etc. Figure 5 The figure exemplarily shows the case where multiple first bonding connection terminals 510 are arranged in one row and multiple second bonding connection terminals 520 are arranged in one row.

[0049] The metal trace 300 can extend from the display area AA of the display panel to the bonding area BB and is electrically connected to the first bonding connection terminal 510 or the second bonding connection terminal 520. The metal trace 300 is located between the insulating layer 200 and the substrate 100, and the insulating layer 200 covers the metal trace 300, so that the insulating layer 200 can protect the metal trace 300. Vias can be provided in the insulating layer 200, and the metal trace 300 can be electrically connected to the first bonding connection terminal 510 or the second bonding connection terminal 520 through the vias. The metal trace 300 is, for example, a metal connecting line, a touch trace, a power signal line, a data line, a scanning line, or a light emission control line, etc. In addition, the multiple metal traces 300 located between the insulating layer 200 and the substrate 100 can be on the same layer or on different layers with each other. The organic layer or the like can be filled between the metal traces 300 on different layers for isolation, and this embodiment does not make specific limitations on this.

[0050] On this basis, in the embodiment of the present invention, a plurality of openings 600 are provided on the insulating layer 200 in the region between the first bonding connection terminal 510 and the second bonding connection terminal 520, and the openings 600 are provided on the insulating layer 200 in the region between adjacent metal traces 300, so as to better release the stress accumulated in the insulating layer 200 in the bonding area on the premise of ensuring that the metal traces 300 are not exposed. That is, during the process of bonding the input or output pins of the connector to the corresponding first bonding connection terminal 510 or second bonding connection terminal 520, the connector is located above the bonding area of the substrate 100, and usually a crimping method is used for bonding. Therefore, the connector will be subjected to a pressure towards the substrate 100, resulting in a relatively large pressure on the positions of the insulating layer 200 where the first bonding connection terminal 510 and / or the second bonding connection terminal 520 are provided, thereby causing the insulating layer 200 to deform. In the embodiment of the present invention, the stress caused by this deformation will not continuously accumulate in the insulating layer 200, but will be released through the provided openings 600.

[0051] Based on this, when the insulating layer 200 in the bonding area BB is formed by stacking multiple inorganic insulating layers, only by setting the depth of the openings 600 so that the openings 600 penetrate through each inorganic insulating layer, the stress accumulated in each inorganic insulating layer can be released. According to this, in the embodiment of the present invention, after the bonding of the connector is completed, since the stress accumulated in each inorganic insulating layer has been released through the provided openings 600, there is no longer any accumulated stress in each inorganic insulating layer. Therefore, when the display panel is in a high-temperature or high-humidity environment, each inorganic insulating layer will not release stress due to environmental factors and its own material factors, and thus will not peel off from each other due to stress mismatch, thereby improving the bonding reliability of the display panel. At the same time, different from the prior art, the technical solution of the embodiment of the present invention sets the openings 600 on the insulating layer 200 in the region between adjacent metal traces 300, so that the metal traces 300 are not exposed by the openings, but are still covered and protected by the insulating layer 200, thereby avoiding bright lines of the metal traces 300 in the bonding area, ensuring that the metal traces 300 in the bonding area are not damaged, and the metal traces 300 can maintain their good performance.

[0052] Based on the above embodiment, continue to refer to Figure 5 , in an embodiment of the present invention, optionally, the opening 600 includes a first opening 610; the first opening 610 is provided adjacent to the first bonding connection terminal 510, the first opening 610 is arranged in at least one row, and the arrangement direction of the first opening 610 is the same as the arrangement direction of the first bonding connection terminal 510.

[0053] Specifically, during the bonding process, since the input or output pins of the connector are crimped and bonded to the corresponding first bonding connection terminal 510 or second bonding connection terminal 520, the pressure on the position of the insulating layer 200 where the first bonding connection terminal 510 and / or second bonding connection terminal 520 are arranged is relatively large, and the deformation of the position of the insulating layer 200 where the first bonding connection terminal 510 and / or second bonding connection terminal 520 are arranged is relatively large. Accordingly, a first opening 610 is provided in the vicinity of the first bonding connection terminal 510, and the arrangement direction of the first opening 610 is the same as the arrangement direction of the first bonding connection terminal 510, both being the x direction, so that a mesh structure is formed at one end of the insulating layer 200 where the first bonding connection terminal 510 is arranged, thereby better and more specifically releasing the stress at the position of the insulating layer 200 where the first bonding connection terminal 510 is arranged.

[0054] In still another embodiment of the present invention, referring to Figure 7 , Figure 7 is a partial top view structural schematic diagram of another display panel provided by an embodiment of the present invention. Optionally, the opening 600 includes a second opening 620, that is, the opening 600 includes the first opening 610 and / or the second opening 620. The second opening 620 is arranged adjacent to the second bonding connection terminal 520, and the second opening 620 is arranged in at least one row. The arrangement direction of the second opening 620 is the same as the arrangement direction of the second bonding connection terminal 520. In the embodiment of the present invention, the second opening 620 is provided in the vicinity of the second bonding connection terminal 520, and the arrangement direction of the second opening 620 is the same as the arrangement direction of the second bonding connection terminal 520, both being the x direction, so that a mesh structure is formed at one end of the insulating layer 200 where the second bonding connection terminal 520 is arranged, thereby better and more specifically releasing the stress at the position of the insulating layer 200 where the second bonding connection terminal 520 is arranged.

[0055] On the basis of the above embodiments, continue to refer to Figure 7, in an embodiment of the present invention, optionally, relative to the first bonding connection terminal 510, the second bonding connection terminal 520 is closer to the display area AA, that is, the second bonding connection terminal 520 is located between the first bonding connection terminal 510 and the display area AA; the metal trace 300 connected to the first bonding connection terminal 510 is the first metal trace 310, and the first metal trace 310 extends from the first bonding connection terminal 510, passes through the second bonding connection terminal 520 and extends to the display area AA, that is, a part of the first metal trace 310 is located under the insulating layer 200 in the area between the first bonding connection terminal 510 and the second bonding connection terminal 520. In this regard, in this embodiment, the first opening 610 and / or the second opening 620 are arranged on the insulating layer 200 in the area between adjacent first metal traces 310, so as to release the stress accumulated in the bonding area insulating layer 200, and ensure that the first opening 610 and the second opening 620 do not expose the first metal trace 310. The first metal trace 310 is still covered and protected by the insulating layer 200, thereby avoiding bright lines of the first metal trace 310 in the bonding area, ensuring that the first metal trace 310 in the bonding area is not damaged, and the first metal trace 310 can maintain its good performance.

[0056] In still another embodiment of the present invention, referring to Figure 8 , Figure 8 is a partial top view structural schematic diagram of another display panel provided by an embodiment of the present invention. Optionally, the metal trace 300 connected to the second bonding connection terminal 520 is the second metal trace 320, and the second metal trace 320 extends from the second bonding connection terminal 520 to the display area AA, that is, there is also a situation where a part of the second metal trace 320 is located under the insulating layer 200 in the area between the first bonding connection terminal 510 and the second bonding connection terminal 520. In this regard, in this embodiment, the second opening 620 is arranged on the insulating layer 200 in the area between adjacent second metal traces 320, so as to release the stress accumulated in the bonding area insulating layer 200, and ensure that the second opening 620 does not expose the second metal trace 320. The second metal trace 320 is still covered and protected by the insulating layer 200, and the second metal trace 320 can maintain its good performance. In addition, when the second metal trace 320 and the first metal trace 310 are alternately arranged between the second bonding connection terminal 520 and the first bonding connection terminal 510, the first opening 610 and the second opening 620 can also be arranged between adjacent first metal traces 310 and second metal traces 320, as long as it is ensured that the first opening 610 and the second opening 620 do not expose the first metal trace 310 and the second metal trace 320.

[0057] Based on the above embodiments, referring to Figure 9 , Figure 9It is a partial top view structural schematic diagram of another display panel provided by an embodiment of the present invention. Optionally, at least two openings 600 are provided on the insulating layer 200 in the region between two adjacent metal traces 300.

[0058] In this embodiment, openings may be provided on the insulating layer 200 in the region between some adjacent metal traces 300, or openings may be provided on the insulating layer 200 in the region between any two adjacent metal traces 300. The specific number of openings provided on the insulating layer 200 is not specifically limited in this embodiment. One opening 600 or multiple openings 600 may also be provided between two adjacent metal traces 300. Compared with providing one opening 600 between two adjacent metal traces 300, providing at least two openings 600 between two adjacent metal traces 300 can make the number of openings 600 on the insulating layer 200 relatively large on the premise of ensuring that the metal traces 300 are not exposed, so as to achieve a higher efficiency and better effect in stress release, and release the stress in the insulating layer 200 more quickly and thoroughly. Exemplarily, as Figure 9 shown, two first openings 610 are provided on the insulating layer 200 in the region between two adjacent first metal traces 310, and two second openings 620 are provided on the insulating layer 200 in the region between two adjacent first metal traces 310, so as to release the stress on the side of the insulating layer 200 corresponding to the first bonding connection terminal 510 and the side corresponding to the second bonding connection terminal 520 more quickly and thoroughly on the premise of ensuring that the first metal traces 310 are not exposed.

[0059] Based on the above embodiments, optionally, the shapes of the first opening 610 and the metal trace 300 are both rectangular parallelepiped; optionally, the shape of the second opening 620 is rectangular parallelepiped. Specifically, setting the shapes of the first opening 610 and the second opening 620 as rectangular parallelepiped can achieve the effect of reasonably utilizing the area of the insulating layer 200, which is beneficial to setting a larger number of openings under the same area, so as to achieve a higher efficiency and better effect in stress release. The shape of the opening 600 may also be other arbitrary shapes such as trapezoid, circle, rhombus, etc., and the embodiments of the present invention do not specifically limit this.

[0060] In addition, along the extension direction of the metal trace 300 (i.e., the y direction), theoretically, the length of the opening 600 can be substantially equal to the spacing between the first bonding connection terminal 510 and the second bonding connection terminal 520. However, such a setting is likely to affect the performance of the bonding area insulating layer 200. For example, the supporting performance of the bonding area insulating layer 200 and the protection performance of the metal wire will both decrease. Accordingly, the length of the opening 600 should neither be too large nor too small. If it is too small, the stress cannot be released well. The length of the opening 600 is set to be 14 μm to 16 μm, for example, 15 μm, so as to ensure good stress release while not adversely affecting the performance of the insulating layer 200.

[0061] Based on the above embodiments, referring to Figure 10 , Figure 10 FIG. [FIG. number not provided in the original] is a schematic cross-sectional structure diagram of another display panel sectioned along the section line DD'. In an embodiment of the present invention, optionally, the insulating layer 200 includes a first inorganic insulating layer 210, and the opening 600 penetrates the first inorganic insulating layer 210. In still another embodiment of the present invention, in combination with Figure 11 and Figure 12 , Figure 11 FIG. [FIG. number not provided in the original] is a schematic cross-sectional structure diagram of another display panel sectioned along the section line DD'. Figure 12 FIG. [FIG. number not provided in the original] is a schematic cross-sectional structure diagram of another display panel sectioned along the section line DD'. Optionally, the insulating layer 200 further includes a second inorganic insulating layer 220, and the second inorganic insulating layer 220 is located on the side of the first inorganic insulating layer 210 away from the substrate 100; as Figure 11 shown, the opening 600 penetrates the second inorganic insulating layer 220, or as Figure 12 shown, the opening 600 penetrates the second inorganic insulating layer 220 and the first inorganic insulating layer 210.

[0062] Specifically, when the display panel is a touch display panel, the display area AA of the display panel includes a display driving layer and a touch layer located above the display driving layer. The first inorganic insulating layer 210 can be an inorganic insulating layer extended from a film layer originally existing in the display driving layer to the bonding area, and the second inorganic insulating layer 210 can be an inorganic insulating layer extended from a film layer originally existing in the touch layer to the bonding area. Exemplarily, the first inorganic insulating layer 210 is formed by extending the inorganic layer of the encapsulation layer in the display driving layer to the bonding area BB, and the second inorganic insulating layer 220 is formed by extending the inorganic layer for isolating at least two touch electrode blocks in the touch layer to the bonding area BB. Among them, both the first inorganic insulating layer 210 and the second inorganic insulating layer 220 can be formed by stacking at least one film layer. In this embodiment, the number of film layers included in the first inorganic insulating layer 210 and the second inorganic insulating layer 220 is not specifically limited.

[0063] In the embodiment of the present invention, the opening 600 is provided to penetrate through the first inorganic insulating layer 210 and the second inorganic insulating layer 220, so as to ensure that the stress accumulated in each inorganic insulating layer is released, and better avoid the peeling between the inorganic insulating layers. Considering the accuracy of the actual process, when the bonding area BB includes the first inorganic insulating layer 210 and the second inorganic insulating layer 220, the opening 600 may also be provided only in the second inorganic insulating layer 220, or the opening 600 only penetrates through the second inorganic insulating layer 220 and a part of the first inorganic insulating layer 210. In this way, it is also possible to better avoid the peeling between the inorganic insulating layers, because the closer the inorganic insulating layer is to the substrate 100, the smaller the deformation thereof and thus the smaller the stress accumulated therein, and further the smaller the influence on the peeling between the inorganic insulating layers.

[0064] The embodiment of the present invention also provides a display device. The display device may be an LCD display device, an LED display device or an OLED display device. The IC package in the display device may be a COG, COF or COP package, that is, the display device may be a flexible display device or a non-flexible display device. The display device includes the display panel in any of the above embodiments, and the display device further includes a connector; the connector includes a plurality of input pins and a plurality of output pins. The input pins are connected to the corresponding first bonding connection terminals, and the output pins are connected to the corresponding second bonding connection terminals; wherein, the connector is, for example, a driving chip, a touch control chip, a chip integrating both driving and touch control functions, or a flexible printed circuit board (FPC). The display device provided by the embodiment of the present invention and the display panel in any of the above embodiments belong to the same inventive concept, and the two can achieve the same technical effects. The repeated content will not be described here again.

[0065] Note that the above is only the preferred embodiment of the present invention and the applied technical principle. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein. Various obvious changes, re-adjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments only. Without departing from the inventive concept of the present invention, more other equivalent embodiments can be included, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, Comprising: A substrate including a bonding region; An insulating layer located in the bonding region on one side of the substrate; A plurality of first bonding connection terminals and a plurality of second bonding connection terminals, the plurality of first bonding connection terminals are arranged in at least one row, the plurality of second bonding connection terminals are arranged in at least one row, and both are arranged in the bonding region; the first bonding connection terminals are input terminals, and the second bonding connection terminals are output terminals; A plurality of metal traces located between the insulating layer and the substrate; the metal traces extend to the bonding region; Wherein, a plurality of openings are provided on the insulating layer in the region between the first bonding connection terminals and the second bonding connection terminals, and the openings are provided on the insulating layer in the region between adjacent metal traces; The metal trace connected to the first bonding connection terminal is a first metal trace, the first metal trace extends from the first bonding connection terminal, passes through the second bonding connection terminal and extends to the display region, the metal trace connected to the second bonding connection terminal is a second metal trace, and the second metal trace extends from the second bonding connection terminal to the display region; The opening is provided adjacent to the first bonding connection terminal and / or the second bonding connection terminal.

2. The display panel according to claim 1, wherein The opening includes a first opening; the first opening is provided adjacent to the first bonding connection terminal, the first opening is arranged in at least one row, and the arrangement direction of the first opening is the same as the arrangement direction of the first bonding connection terminal.

3. The display panel according to claim 2, wherein, The opening includes a second opening; the second opening is provided adjacent to the second bonding connection terminal, the second opening is arranged in at least one row, and the arrangement direction of the second opening is the same as the arrangement direction of the second bonding connection terminal.

4. The display panel according to claim 3, wherein The substrate further includes a display region; Relative to the first bonding connection terminal, the second bonding connection terminal is closer to the display region; the metal trace connected to the first bonding connection terminal is a first metal trace, and the first metal trace extends from the first bonding connection terminal, passes through the second bonding connection terminal and extends to the display region; The first opening and / or the second opening are provided on the insulating layer in the region between adjacent first metal traces.

5. The display panel according to claim 4, wherein The metal trace connected to the second bonding connection terminal is a second metal trace, and the second metal trace extends from the second bonding connection terminal to the display region; The second opening is provided on the insulating layer in the region between adjacent second metal traces.

6. The display panel according to claim 1, wherein, At least two openings are provided on the insulating layer in the region between two adjacent metal traces.

7. The display panel according to claim 1, wherein The insulating layer includes a first inorganic insulating layer, and the opening penetrates the first inorganic insulating layer.

8. The display panel according to claim 7, wherein The insulating layer further includes a second inorganic insulating layer, and the second inorganic insulating layer is located on the side of the first inorganic insulating layer away from the substrate; the opening penetrates the second inorganic insulating layer, or the opening penetrates the second inorganic insulating layer and the first inorganic insulating layer.

9. The display panel according to claim 3, characterized in that, The shapes of the first opening and the metal trace are both rectangular parallelepiped.

10. The display panel according to claim 3, characterized in that, The shape of the second opening is rectangular parallelepiped.

11. A display device, characterized in that, Including a display panel as described in any one of claims 1-10; the display device further includes a connecting member; the connecting member includes a plurality of input pins and a plurality of output pins, the input pins are connected to the corresponding first bonding connection terminals, and the output pins are connected to the corresponding second bonding connection terminals.

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