A display panel, a preparation method of the display panel, and a display device

Abstract

Embodiments of the present application disclose a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, a plurality of light emitting elements located on one side of the substrate, and a thin film encapsulation layer located on a side of the light emitting elements away from the substrate, the thin film encapsulation layer covering the light emitting elements, the thin film encapsulation layer comprising a first cover layer and an optical modulation layer, the optical modulation layer being located on a side of the first cover layer away from the light emitting elements, the optical modulation layer covering part of the light emitting elements, and a refractive index of the optical modulation layer being less than or equal to a refractive index of the first cover layer. Embodiments of the present application modulate light emission of part of the light emitting elements through the optical modulation layer, and adjust light emission amounts at different viewing angles. Then, light emission proportions of the light emitting elements at the same viewing angle are balanced. Moreover, the optical modulation layer only covers part of the light emitting elements, so that the optical modulation layer is not laid on the light emitting elements that do not need to be modulated, and the overall thickness of the optical modulation layer is reduced.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to display technology, and in particular, to a display panel, a preparation method of the display panel, and a display device. BACKGROUND

[0002] A display panel using organic light emitting diodes (OLED) as sub-pixels often adopts a top emission microcavity structure. The top emission microcavity structure can effectively improve the efficiency of the device and reduce the power consumption of the display panel.

[0003] However, as the viewing angle of the human eye changes, due to the different structures of the optical interference cavities of different color sub-pixels, the brightness ratio of different color sub-pixels at a large viewing angle will change with the change of the viewing angle, further causing the color coordinates of a white picture at a large viewing angle to deviate from the color coordinates at a normal viewing angle, i.e., the phenomenon of color shift at a large viewing angle. SUMMARY

[0004] Embodiments of the present application provide a display panel, a preparation method of the display panel, and a display device to weaken the phenomenon of color shift with the change of the viewing angle and correct the deviation of the color coordinates at different viewing angles.

[0005] In a first aspect, embodiments of the present application provide a display panel, comprising:

[0006] a substrate;

[0007] a plurality of light emitting elements on one side of the substrate;

[0008] a thin film encapsulation layer on a side of the light emitting elements away from the substrate, the thin film encapsulation layer covering the light emitting elements, the thin film encapsulation layer comprising a first cover layer and an optical modulation layer, the optical modulation layer being on a side of the first cover layer away from the light emitting elements, the optical modulation layer covering part of the light emitting elements, the refractive index of the optical modulation layer being less than or equal to the refractive index of the first cover layer.

[0009] In a second aspect, embodiments of the present application further provide a preparation method of a display panel, comprising:

[0010] providing a substrate;

[0011] forming a plurality of light emitting elements on one side of the substrate;

[0012] forming a thin film encapsulation layer on a side of the light emitting elements away from the substrate;

[0013] The thin film encapsulation layer covers the light emitting element, the thin film encapsulation layer comprises a first cover layer and an optical modulation layer, the optical modulation layer is located on the side of the first cover layer away from the light emitting element, the optical modulation layer covers part of the light emitting element, and the refractive index of the optical modulation layer is less than or equal to the refractive index of the first cover layer.

[0014] In a third aspect, the embodiments of the present application further provide a display device comprising any one of the display panels.

[0015] The display panel in the embodiments of the present application comprises: a substrate; a plurality of light emitting elements located on one side of the substrate; and a thin film encapsulation layer located on the side of the light emitting elements away from the substrate, the thin film encapsulation layer covering the light emitting elements, the thin film encapsulation layer comprising a first cover layer and an optical modulation layer, the optical modulation layer being located on the side of the first cover layer away from the light emitting element, the optical modulation layer covering part of the light emitting element, and the refractive index of the optical modulation layer being less than or equal to the refractive index of the first cover layer. The light emitted by part of the light emitting elements is modulated by the optical modulation layer, and the amount of light emitted at different viewing angles is adjusted. Then, the light emitting ratio of each light emitting element at the same viewing angle is balanced, and the color coordinate deviation at each viewing angle is corrected. Moreover, the optical modulation layer only covers part of the light emitting elements, avoiding laying the optical modulation layer on the light emitting elements that do not need to be modulated, reducing the overall thickness of the optical modulation layer, and being more conducive to the application in the application scenarios sensitive to the thickness of the screen body, such as foldable screens. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 A partial structure schematic diagram of a display panel provided by the prior art;

[0017] Figure 2 A structure schematic diagram of a display panel provided by the embodiments of the present application;

[0018] Figure 3 A structure schematic diagram of another display panel provided by the embodiments of the present application;

[0019] Figure 4 A structure schematic diagram of another display panel provided by the embodiments of the present application;

[0020] Figure 5 A structure schematic diagram of another display panel provided by the embodiments of the present application;

[0021] Figure 6 A structure schematic diagram of another display panel provided by the embodiments of the present application;

[0022] Figure 7 A structure schematic diagram of another display panel provided by the embodiments of the present application;

[0023] Figure 8Another structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2.

[0024] Figure 9 Another structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2.

[0025] Figure 10 Another structural schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2.

[0026] Figure 11 A flow chart of a display panel preparation method provided by an embodiment of the present application is shown in FIG. 6.

[0027] Figure 12 A flow chart of a thin film encapsulation layer formation method provided by an embodiment of the present application is shown in FIG. 7.

[0028] Figure 13 A flow chart of another thin film encapsulation layer formation method provided by an embodiment of the present application is shown in FIG. 8. DETAILED DESCRIPTION

[0029] The present application will be further described below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended for the purpose of interpretation of the present application and are not intended to limit the present application. In addition, it should be noted that only the parts related to the present application are shown in the accompanying drawings for the purpose of description.

[0030] The terms used in the embodiments of the present application are merely for the purpose of describing specific embodiments and are not intended to limit the present application. It should be noted that the orientation terms such as "upper", "lower", "left", "right" and the like described in the embodiments of the present application are described in the angle shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, it should be understood in the context that when referring to one element being formed "on" or "under" another element, it can be directly formed "on" or "under" another element or indirectly formed "on" or "under" another element through an intermediate element. The terms "first", "second" and the like are merely for the purpose of description and do not represent any order, quantity or importance, but are only used to distinguish different components. The above terms in the present application can be understood according to the specific meaning according to the specific circumstances by those skilled in the art.

[0031] For the problem of color shift at a large viewing angle mentioned in the background art, the prior art often uses different thicknesses of light extraction layers corresponding to different light-emitting colors of sub-pixels on the light-emitting side. By changing the thickness of the light extraction layer corresponding to each sub-pixel, the OLED display substrate presents a preset color at a preset viewing angle. This implementation often makes the manufacturing process of the light extraction layer complicated, thereby reducing the production efficiency of the display substrate and increasing the production cost. Figure 1A partial structure schematic diagram of a display panel provided by the prior art is shown in FIG. 1. Figure 1 The prior art also adopts a coupling film 12 attached to the polarizing plate 11 of the display panel to solve the problem in the manner of adding a coupling film 12 on the light-emitting side. The elliptical convex structures corresponding to the sub-pixels on the coupling film 12 increase or decrease the aggregation of light in a certain direction for color deviation of red, green and blue light. The red, green and blue light can be mixed according to the preset proportion to obtain white light without color deviation, so as to eliminate the color deviation of the display screen and improve the optical quality of the screen. However, there are some problems in adjusting a certain specific color of light by using the coupling film 12. The coupling film 12 is attached to the light-emitting side surface of the display substrate by attachment, and the attachment is easy to cause displacement between the elliptical convex structure and the pixel point that needs to be adjusted, thereby affecting the adjustment effect. At the same time, the coupling film 12 is an integral film, which inevitably has a certain thickness, which is not conducive to reducing the thickness of the screen body, and is even more not conducive to the realization of the future folding display screen.

[0032] Figure 2 A structure schematic diagram of a display panel provided by an embodiment of the present application is shown in FIG. 2. Figure 2 Based on the above problems, an embodiment of the present application provides a display panel, which comprises:

[0033] a substrate 21;

[0034] a plurality of light-emitting elements 22 located on one side of the substrate 21;

[0035] a thin film encapsulation layer 23 located on the side of the light-emitting element 22 away from the substrate 21, the thin film encapsulation layer 23 covering the light-emitting element 22, the thin film encapsulation layer 23 comprising a first cover layer 231 and an optical modulation layer 232, the optical modulation layer 232 being located on the side of the first cover layer 231 away from the light-emitting element 22, the optical modulation layer 232 covering part of the light-emitting element 22, and the refractive index of the optical modulation layer 232 being less than or equal to the refractive index of the first cover layer 231.

[0036] The substrate 21 is a component for supporting the light emitting element 22 and providing control lines for the light emitting element 22. The substrate 21 can include scan lines, data lines and other control lines, so that the light emitting element 22 can display according to the scan signals and data signals provided by the display chip. The light emitting element 22 can be any kind of electroluminescent element, such as an organic light emitting diode (OLED), a micro light emitting diode (Micro LED) or a nano light emitting diode (NANO LED). A plurality of light emitting elements 22 can be arranged in an array on the surface of the substrate 21 and in communication with the control lines of the substrate 21. The first cover layer 231 is located on the light emitting side of the substrate 21 and is used to cover the light emitting element 22 on the substrate 21 to block water and oxygen. It avoids the entry of water and oxygen and other components in the control, and protects the light emitting element 22 from corrosion. The material of the first cover layer 231 can be inorganic material or organic material. The first cover layer 231 can also be stacked by an organic material layer and an inorganic material layer. The optical modulation layer 232 is arranged on the side of the first cover layer 231 away from the substrate 21. The projection of the optical modulation layer 232 relative to the substrate 21 can cover part of the light emitting element 22. The covered light emitting element 22 can emit light of the same color. The purpose of arranging the optical modulation layer 232 is that when different colors of light are mixed to form white light, the luminance of different colors of light attenuates differently at different angles, causing the luminance ratio of each light to change at some viewing angles, thereby deviating from the normal viewing angle. After the cathode of the light emitting element 22 emits light, a weak microcavity effect is formed above the cathode, which further improves the device efficiency. The weak microcavity effect is a phenomenon that the light of a wavelength satisfying the resonance condition is strengthened due to constructive interference. In addition to the microcavity length between the cathode and the anode, the weak microcavity is formed by the first cover layer 231 and the optical modulation layer 232 on the light emitting side of the cathode of the light emitting element 22, and the weak microcavity also affects the color deviation. By arranging the optical modulation layer 232 with a certain thickness and a certain refractive index, the light emitted by the light emitting element 22 covered by the optical modulation layer 232 can be modulated by using the weak microcavity effect. That is, by arranging the optical modulation layer 232, the light emission divergence of the part of the light emitting element 22 covered by the optical modulation layer 232 is changed, and the light attenuation with the change of the observation angle is adjusted. The thickness and refractive index of the optical modulation layer 232 can be determined according to actual needs. The optical modulation layer 232 can be made of the same material as the first cover layer 231 to improve the tightness between the first cover layer 231 and the optical modulation layer 232, avoid interface reflection between different materials, and improve the light emission rate. The material for making the optical modulation layer 232 can be organic material or inorganic material. For example, silicon oxynitride material can be used as the material of the optical modulation layer 232. The refractive index of the optical modulation layer 232 can be less than or equal to 1.78@632.8nm. The thickness of the optical modulation layer 232 can be 0.1μm-0.15μm.The material of the first cover layer 231 can also be a silicon oxynitride material, and the thickness can be 1.2 μm. The refractive index of the first cover layer 231 can be 1.78@632.8 nm. The embodiment of the present application adjusts the change of the light attenuation of the partial light emitting elements 22 with the observation angle by arranging the optical modulation layer 232 on the light emitting side of the partial light emitting elements 22, and then balances the light emitting ratio of each light emitting element 22 at the same viewing angle, and corrects the color coordinate deviation at each viewing angle. Moreover, the optical modulation layer 232 only covers part of the light emitting elements 22, which avoids arranging the optical modulation layer 232 on all the light emitting elements 22, reduces the overall thickness of the optical modulation layer 232, and is more conducive to the application in the application scenarios sensitive to the thickness of the screen, such as the folding screen.

[0037] Figure 3 Another structure diagram of a display panel provided by the embodiment of the present application is shown in FIG. 6. Figure 3 Optionally, the light emitting elements 22 can include red light emitting elements 22R, green light emitting elements 22G, and blue light emitting elements 22B, and the optical modulation layer 232 covers at least part of the red light emitting elements 22R.

[0038] The light attenuation of the red light emitted by the partial or all red light emitting elements 22R is more ideal after the red light passes through the optical modulation layer 232 and is emitted. Since the wavelength of the red light is longer, the film thickness of each light transmission film layer has the greatest impact on the red light. Based on this, the optical modulation layer 232 can be added on the light emitting side of the red light emitting elements 22R to offset or reduce the impact of each light transmission film layer on the change of the light attenuation of the red light with the change of the observation angle. The light attenuation of the red light with the increase of the observation angle is reduced, and the light attenuation of the green light emitted by the green light emitting elements 22G and the blue light emitted by the blue light emitting elements 22B is more matched. Therefore, the optical modulation layer 232 can be arranged to cover only part or all of the red light emitting elements 22R.

[0039] Figure 4 Another structure diagram of a display panel provided by the embodiment of the present application is shown in FIG. 6. Figure 5 Another structure diagram of a display panel provided by the embodiment of the present application is shown in FIG. 6. Figure 4 and Figure 5 Optionally, the light emitting elements 22 can include red light emitting elements 22R, green light emitting elements 22G, and blue light emitting elements 22B, and the optical modulation layer 232 covers at least part of the red light emitting elements 22R and the green light emitting elements 22G adjacent to the red light emitting elements 22R, or the optical modulation layer 232 covers at least part of the red light emitting elements 22R and the blue light emitting elements 22B adjacent to the red light emitting elements 22R.

[0040] The optical modulation layer 232 includes a piece of light guide material covering each light emitting element 22. Since the light emitting element 22 is small, it is difficult to make the optical modulation layer 232 covering only the red light emitting element 22R. If a mask plate is arranged on the first cover layer 231 and the optical modulation layer 232 is made by deposition, the size of the mask plate opening on the mask plate determines the difficulty of making the mask plate. In consideration of the yield and the manufacturing cost, the area of each piece of light guide material of the optical modulation layer 232 can be appropriately increased to reduce the difficulty of making, improve the yield and reduce the manufacturing cost. Since the wavelengths of green light and blue light are smaller than that of red light, the optical modulation layer 232 has less effect on the green light and the blue light. The same piece of optical modulation layer 232 can be arranged on the adjacent red light emitting element 22R and green light emitting element 22G, or on the adjacent red light emitting element 22R and blue light emitting element 22B to increase the area of each piece of light guide material and reduce the difficulty of making.

[0041] Optionally, the first cover layer 231 includes an inorganic layer, and the optical modulation layer 232 includes an inorganic layer or an organic layer.

[0042] The first cover layer 231 and the optical modulation layer 232 can be made of inorganic materials. For example, the first cover layer 231 and the optical modulation layer 232 can be made of silicon oxynitride. By setting different contents of nitrogen and oxygen elements, the refractive index of the optical modulation layer 232 is less than or equal to that of the first cover layer 231.

[0043] Figure 6 Another structure of the display panel is provided for the embodiment of the present application, as shown in FIG. 4. Figure 6 Further, the thin film encapsulation layer 23 further includes a second cover layer 233 and a third cover layer 234 located on the side of the first cover layer 231 away from the light emitting element 22.

[0044] The second cover layer 233 can be arranged on the side of the first cover layer 231 with the patterned optical modulation layer 232 protrusion, and then the third cover layer 234 can be arranged on the side of the second cover layer 233 away from the first cover layer 231. In order to better isolate water and oxygen, the second cover layer 233 can be arranged to include an organic layer, and the third cover layer 234 includes an inorganic layer. Through the overlap of the organic film layer and the inorganic film layer, it can better prevent water and oxygen and the like from invading and prevent water and oxygen from corroding and oxidizing the light-emitting element 22 and the circuit. For example, the first cover layer 231 is an inorganic layer, the second cover layer 233 is an organic layer, and the third cover layer 234 is an inorganic layer. The inorganic layer can be made by chemical vapor deposition, and the organic layer can be made by inkjet printing. The thickness of the inorganic layer can be set to nanometers, and the thickness of the organic layer can be set to microns.

[0045] Figure 7 Another structure diagram of a display panel provided by an embodiment of the present application is shown in FIG. 6. Figure 7 Optionally, the display panel further includes a pixel definition layer 24, and the pixel definition layer 24 includes a plurality of openings 241 (only one opening is shown in the figure). Figure 7 The light-emitting element 22 is located in the opening 241.

[0046] The pixel definition layer 24 can be arranged on the side of the substrate 21 close to the light-emitting element 22. The pixel definition layer 24 divides the area where each light-emitting element 22 is located, and each opening 241 of the pixel definition layer 24 is provided with a light-emitting element 22. For the OLED light-emitting element, the organic film layer of the OLED can be evaporated after the pixel definition layer 24 is arranged. Different color light-emitting materials are evaporated into different openings 241 through different masks to form the light-emitting element 22.

[0047] Figure 8 Another structure diagram of a display panel provided by an embodiment of the present application is shown in FIG. 6. Figure 8 Further, the display panel further includes a planarization layer 25, and the planarization layer 25 is located between the pixel definition layer 24 and the first cover layer 231.

[0048] Since the height of the pixel definition layer 24 and the light-emitting element 22 relative to the substrate 21 can be different, the planarization layer 25 can be arranged on the side of the pixel definition layer 24 and the light-emitting element 22 away from the substrate 21, and the planarization layer 25 can be used to fill the surface of the pixel definition layer 24 and the light-emitting element 22 to form a flat surface. This provides a good basis for the manufacture of the first cover layer 231 and other film layers.

[0049] Figure 9 Another structure diagram of a display panel provided by an embodiment of the present application is shown in FIG. 6. Figure 9Optionally, the display panel further comprises a touch layer 26, and the touch layer 26 is located on the side of the thin film encapsulation layer 23 away from the light emitting element 22.

[0050] The touch layer 26 can comprise indium tin oxide material, and can further comprise metal wires. The touch layer 26 can be formed by evaporating patterned indium tin oxide on the side of the thin film encapsulation layer 23 away from the light emitting element 22, and metal wires connected to the indium tin oxide. The pattern of the touch layer 26 can be determined according to actual needs. A cover glass can be further included on the side of the touch layer 26 away from the thin film encapsulation layer 23, so as to protect the display panel from external force.

[0051] Figure 10 Another structural schematic diagram of a display panel provided by the embodiment of the present application is shown in FIG. 3. Figure 10 Optionally, the display panel further comprises a color resistance layer 27, and the color resistance layer 27 is located on the side of the thin film encapsulation layer 23 away from the light emitting element, and the color resistance layer 27 comprises a plurality of color resistances corresponding to the light emitting elements.

[0052] The color resistance layer 27 can comprise one or more than one color of color resistance, and the color of the color resistance can be set to correspond to the light emitting color of the covered light emitting element. For example, the light emitting element can comprise a red light emitting element 22R, a green light emitting element 22G and a blue light emitting element 22B. The color resistance layer 27 can comprise a red color resistance 272R covering the red light emitting element 22R, a green color resistance 272G covering the green light emitting element 22G, and a blue color resistance 272B covering the blue light emitting element 22B. A black matrix 271 can be further included between the color resistances, and the black matrix can separate the color resistances to prevent the occurrence of light leakage and light leakage phenomena. The black matrix can be a light shielding pigment coated between the color resistances, and the embodiment of the present application does not limit the material and structure of the black matrix. The color of the light emitted by the light emitting element is more pure after passing through the color resistance. This is because the color resistance can accurately select a small range of light waves to pass through, and reflect other unwanted waves. By adding the color resistance layer 27, the display effect of the display panel can be improved.

[0053] Figure 11 A flowchart of a preparation method of a display panel provided by the embodiment of the present application is shown in FIG. 4. Figure 11 The embodiment of the present application further provides a preparation method of a display panel, comprising:

[0054] S1: providing a substrate.

[0055] The substrate can be a flexible substrate or a rigid substrate. The embodiment of the present application does not limit the specific type of the substrate.

[0056] S2: forming a plurality of light emitting elements on one side of the substrate.

[0057] The light emitting element can be an OLED light emitting element. If the light emitting element is an OLED light emitting element, the light emitting element can be formed on the substrate by evaporation. The light emitting element can also be a Micro LED light emitting element or a NANO LED light emitting element. If the light emitting element is a Micro LED light emitting element or a NANO LED light emitting element, the light emitting element can be formed on the substrate by mass transfer or the like. The method of forming the light emitting element on one side of the substrate can be determined as needed.

[0058] S3: forming a thin film encapsulation layer on the side of the light emitting element away from the substrate, wherein the thin film encapsulation layer comprises an optical modulation layer.

[0059] The thin film encapsulation layer can be formed by chemical vapor deposition, inkjet printing or the like. The thin film encapsulation layer can be one layer or more than one layer. The material, formation process and number of layers of the thin film encapsulation layer can be determined as needed. The thin film encapsulation layer covers the light emitting element, the thin film encapsulation layer comprises a first cover layer and an optical modulation layer, the optical modulation layer is located on the side of the first cover layer away from the light emitting element, the optical modulation layer covers part of the light emitting element, and the refractive index of the optical modulation layer is less than or equal to the refractive index of the first cover layer. By forming a thin film encapsulation layer with an optical modulation layer on one side of the light emitting element, the problem of the coupling film being stretched and deviating from the corresponding position of the light emitting element caused by attaching the coupling film to the light emitting element in the prior art can be avoided. The optical modulation layer is made on the light emitting side of the light emitting element, so that the alignment accuracy between the optical modulation layer and the light emitting element can be ensured, the yield is improved, and the display effect of the display panel at a specific angle is improved.

[0060] Figure 12 A flowchart of a thin film encapsulation layer forming method provided by an embodiment of the present application is shown in Figure 12 Optionally, the thin film encapsulation layer is formed on the side of the light emitting element away from the substrate, comprising:

[0061] S311: forming a first cover layer on the side of the light emitting element away from the substrate.

[0062] The first cover layer can be formed by chemical vapor deposition or inkjet printing.

[0063] S312: covering the first cover layer with a mask, and exposing the area where part of the light emitting element is located.

[0064] The optical modulation layer can be made by a deposition process. The part that does not need to be made into an optical modulation layer is covered by a mask plate, and the optical modulation layer material is deposited at the opening of the mask plate to form the required optical modulation layer.

[0065] S313: Forming an optical modulation layer in the area exposed by the mask.

[0066] The optical modulation layer is formed by a deposition process, which can ensure the alignment accuracy between the optical modulation layer and the light emitting element, and improve the display effect of the display panel at a specific angle.

[0067] Figure 13 Another flowchart of a method for forming a thin film encapsulation layer is provided for the embodiments of the present application, referring to Figure 13 Optionally, the thin film encapsulation layer is formed on the side of the light emitting element away from the substrate, comprising:

[0068] S321: Forming a first cover layer on the side of the light emitting element away from the substrate;

[0069] The first cover layer can be formed by chemical vapor deposition or inkjet printing.

[0070] S322: Removing the part of the first cover layer outside the area where the optical modulation layer is located by using a photolithography process.

[0071] The first cover layer, the optical modulation layer, and the excess part in the same layer as the optical modulation layer can be made at one time. Then, the excess part is removed by the photolithography process, and the optical modulation layer is formed.

[0072] The embodiments of the present application also provide a display device comprising any of the display panels described above.

[0073] The display device comprises any of the display panels in the above embodiments. Therefore, the display device also has the beneficial effects of the display panels in the above embodiments.

[0074] Note that the above are only the preferred embodiments of the present application and the technical principles applied. Those skilled in the art will understand that the present application is not limited to the specific embodiments described above, and those skilled in the art can make various obvious changes, re-adjustments, mutual combinations and substitutions without departing from the scope of the present application. Therefore, although the present application has been described in more detail through the above embodiments, the present application is not limited to the above embodiments, and can include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: substrate; Multiple light-emitting elements are located on one side of the substrate; A thin-film encapsulation layer is located on the side of the light-emitting element away from the substrate. The thin-film encapsulation layer covers the light-emitting element. The thin-film encapsulation layer includes a first cover layer and an optical modulation layer. The optical modulation layer is located on the side of the first cover layer away from the light-emitting element. The optical modulation layer covers a portion of the light-emitting element. The refractive index of the optical modulation layer is less than or equal to the refractive index of the first cover layer. The light-emitting element includes a red light-emitting element, a green light-emitting element, and a blue light-emitting element. The optical modulation layer covers at least a portion of the red light-emitting element and the green light-emitting element adjacent to the red light-emitting element, or the optical modulation layer covers at least a portion of the red light-emitting element and the blue light-emitting element adjacent to the red light-emitting element.

2. The display panel according to claim 1, characterized in that, The light-emitting elements include red light-emitting elements, green light-emitting elements, and blue light-emitting elements, and the optical modulation layer covers at least a portion of the red light-emitting elements.

3. The display panel according to claim 1, characterized in that, The thickness of the optical modulation layer is 0.1 μm to 0.15 μm.

4. The display panel according to claim 1, characterized in that, The first capping layer includes an inorganic layer, and the optical modulation layer includes an inorganic layer or an organic layer.

5. The display panel according to claim 4, characterized in that, The thin-film encapsulation layer further includes a second cover layer and a third cover layer located on the side of the first cover layer away from the light-emitting element.

6. The display panel according to claim 5, characterized in that, The second capping layer includes an organic layer, and the third capping layer includes an inorganic layer.

7. The display panel according to claim 1, characterized in that, It also includes a pixel definition layer, which includes multiple openings, and the light-emitting element is located within the openings.

8. The display panel according to claim 7, characterized in that, It also includes a flattening layer, which is located between the pixel definition layer and the first overlay layer.

9. The display panel according to claim 1, characterized in that, It also includes a touch layer, which is located on the side of the thin-film encapsulation layer away from the light-emitting element.

10. The display panel according to claim 1, characterized in that, It also includes a color resist layer, which is located on the side of the thin film encapsulation layer away from the light-emitting element, and the color resist layer includes a plurality of color resists corresponding to the light-emitting element.

11. A method for manufacturing a display panel, characterized in that, include: Provide substrate; Multiple light-emitting elements are formed on one side of the substrate; The light-emitting elements include red light-emitting elements, green light-emitting elements, and blue light-emitting elements; A thin film encapsulation layer is formed on the side of the light-emitting element away from the substrate; The thin-film encapsulation layer covers the light-emitting element. The thin-film encapsulation layer includes a first cover layer and an optical modulation layer. The optical modulation layer is located on the side of the first cover layer away from the light-emitting element. The optical modulation layer covers a portion of the light-emitting element. The refractive index of the optical modulation layer is less than or equal to the refractive index of the first cover layer. The optical modulation layer covers at least a portion of the red light-emitting element and a green light-emitting element adjacent to the red light-emitting element, or the optical modulation layer covers at least a portion of the red light-emitting element and a blue light-emitting element adjacent to the red light-emitting element.

12. The preparation method according to claim 11, characterized in that, A thin-film encapsulation layer is formed on the side of the light-emitting element away from the substrate, comprising: The first cover layer is formed on the side of the light-emitting element away from the substrate; The first cover layer is covered with a mask, exposing part of the area where the light-emitting element is located; An optical modulation layer is formed in the area exposed by the photomask.

13. The preparation method according to claim 11, characterized in that, A thin-film encapsulation layer is formed on the side of the light-emitting element away from the substrate, comprising: The first cover layer is formed on the side of the light-emitting element away from the substrate; The portion of the first cover layer outside the area where the optical modulation layer is located is removed using a photolithography process.

14. A display device, characterized in that, Includes the display panel described in any one of claims 1-10.

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