Chip overcurrent protection structure

Abstract

The application discloses a protection structure for chip overcurrent, which comprises a mounting plate, one side of the top of the mounting plate is fixedly connected with a shell seat, the other side of the top of the mounting plate is provided with a placing groove, the inner surface of the placing groove is provided with a semiconductor chip packaging body, the top of the shell seat is provided with a top cover, two limiting plates are arranged at the bottom of the top cover, the slot in the limiting plate is used for limiting the fuse, the push block in the stroke groove and the second spring on the top cover are used for tightly pressing the fuse by the limiting block, when the current is too large and the fuse is broken, the top cover is removed, the fuse is removed from the inside of the shell seat, the push block is pushed to make the limiting block not tightly press the fuse, and the fuse is removed, so that the fuse is replaced conveniently and the application is easy to popularize.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a chip overcurrent protection structure. Background Technology

[0002] Chip packaging is the casing used to house semiconductor integrated circuit chips. It serves to place, fix, seal, and protect the chip, as well as enhance its electrothermal performance. The contacts on the chip are connected to the pins of the package casing by wires. These pins are then connected to other devices through wires on the printed circuit board. After the chip is packaged, it is used in conjunction with circuit resistors to achieve a specified current value. However, if the resistors are damaged during use, a short circuit may occur, thereby damaging the packaged semiconductor chip.

[0003] Chinese patent discloses a chip overcurrent protection structure (publication number: CN113345867A). The patent includes a substrate, mounting holes, a semiconductor chip packaging body, a housing, an extension plate, a first fixing member, a retaining ring, a removable component, conductive leads, a first pin, a pressure cap, a through hole, a second fixing member, a pressure plate, a pad, and a second pin. It provides an elastic clamping effect by using elastic conductive sheets and voltage-conducting blocks. The locking protrusions at the voltage-conducting blocks are positioned at the locking grooves. The voltage-conducting blocks are clamped by adding a pad at the bottom of the pressure plate to improve the stability of the voltage-conducting blocks' position. However, once the fuse is damaged, it needs to be replaced. The fuse is too small, and it is difficult to remove the fuse from the inside of the housing during replacement, making fuse replacement quite troublesome. Summary of the Invention

[0004] The purpose of this invention is to provide a protection structure for chip overcurrent. By setting two limiting plates at the bottom of the top cover, the grooves in the limiting plates can limit the fuse. In conjunction with the push block in the stroke groove and the second spring on the top cover, the limiting block can press the fuse tightly. When the current is too large and the fuse breaks, the top cover can be removed to remove the fuse from the inside of the housing. Then, by pushing the push block, the limiting block will no longer press the fuse tightly, and the fuse can be removed.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] A chip overcurrent protection structure includes a mounting plate, a housing fixedly connected to one side of the top of the mounting plate, and a placement groove formed on the other side of the top of the mounting plate. A semiconductor chip package body is disposed on the inner surface of the placement groove. A top cover is disposed on the top of the housing. Electrical connection blocks are fixedly connected to both sides of the bottom of the housing cavity. An elastic conductive sheet is fixedly connected to the opposite side of each of the two electrical connection blocks. Limiting plates are fixedly connected to both sides of the bottom of the top cover. A fuse is disposed between the inner surfaces of the two limiting plates.

[0007] As a further aspect of the present invention: a limiting block is slidably connected to the inner surface of the limiting plate, and a second spring is fixedly connected to the top end of the limiting block, and the top end of the second spring is fixedly connected to the bottom end of the top cover.

[0008] As a further aspect of the present invention: the front and back sides of the limiting plate are provided with travel grooves, and a push block is slidably connected to the inner surface of the travel groove, and one side of the push block is fixedly connected to one side of the limiting block.

[0009] As a further aspect of the present invention: top grooves are provided on both sides of the top of the semiconductor chip packaging body, and rotating rods are rotatably connected to both the front and rear sides of the mounting plate and one side of the semiconductor chip packaging body.

[0010] As a further embodiment of the present invention: a support plate is fixedly connected to the top of the rotating rod, a fixed column is rotatably connected to the bottom of the support plate, and an elastic sleeve is slidably connected to the outer surface of the fixed column.

[0011] As a further aspect of the present invention: a first spring is fixedly connected to the bottom of the inner cavity of the elastic sleeve, and the top end of the first spring is fixedly connected to the bottom of the fixed post.

[0012] As a further aspect of the present invention: stepped grooves are provided on both sides of the top of the housing, and stepped blocks are fixedly connected to both sides of the bottom of the top cover, wherein the inner surface of the stepped groove is adapted to the outer surface of the stepped block.

[0013] As a further aspect of the present invention: conductive blocks are fixedly connected to the sides of the two electrically connected blocks that are relatively far apart.

[0014] The beneficial effects of this invention are:

[0015] (1) In this invention, by setting two limiting plates at the bottom of the top cover, the fusible wire can be limited by the groove in the limiting plate. In addition, the push block in the stroke groove and the second spring on the top cover can make the limiting block press against the fusible wire. When the current is too large and the fusible wire breaks, the top cover can be removed and the fusible wire can be removed from the inside of the housing. Then, by pushing the push block, the limiting block will no longer press against the fusible wire. At this time, the fusible wire can be removed. The replacement of the fusible wire is more convenient through this structure and is easy to promote.

[0016] (2) In this invention, by setting a rotating rod that can rotate on the top of the mounting plate, and using an elastic sleeve that can slide on the fixed column, in conjunction with the first spring, the elastic sleeve can be pressed against the top groove on the semiconductor chip package body, which can prevent the semiconductor chip package body from shaking and improve the stability during use. At the same time, a stepped groove is set on the top of the housing, and in conjunction with the stepped block on the top cover, the top cover can be prevented from sliding on the housing, further improving its stability during use. Attached Figure Description

[0017] The invention will now be further described with reference to the accompanying drawings.

[0018] Figure 1 This is a schematic diagram of the overall external structure of the present invention;

[0019] Figure 2 This is a partial structural cross-sectional view of the entire invention;

[0020] Figure 3 This is a side view of the external structure of the limiting plate of the present invention;

[0021] Figure 4 This is a schematic diagram of the internal structure of the elastic sleeve of the present invention.

[0022] In the diagram: 1. Mounting plate; 2. Housing; 3. Placement slot; 4. Semiconductor chip packaging body; 5. Rotating rod; 6. Support plate; 7. Fixing post; 8. Elastic sleeve; 9. First spring; 10. Top cover; 11. Stepped groove; 12. Stepped block; 13. Electrical connection block; 14. Elastic conductive sheet; 15. Fuse wire; 16. Limiting plate; 17. Limiting block; 18. Second spring; 19. Stroke groove; 20. Push block; 21. Top groove. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figure 1-4As shown, this invention is a chip overcurrent protection structure, including a mounting plate 1. A housing 2 is fixedly connected to one side of the top of the mounting plate 1, and a placement groove 3 is formed on the other side of the top of the mounting plate 1. A semiconductor chip packaging body 4 is disposed on the inner surface of the placement groove 3. Top grooves 21 are formed on both sides of the top of the semiconductor chip packaging body 4. Rotating rods 5 are rotatably connected to the front and rear sides of the mounting plate 1 and to one side of the semiconductor chip packaging body 4. A support plate 6 is fixedly connected to the top of the rotating rod 5, and a fixing post 7 is rotatably connected to the bottom of the support plate 6. An elastic sleeve 8 is slidably connected to the outer surface of the fixing post 7. A first spring 9 is fixedly connected to the bottom of the inner cavity of the elastic sleeve 8. The top of the first spring 9 is fixedly connected to the bottom of the fixing post 7. By setting a rotatable rotating rod 5 on the top of the mounting plate 1, and using the slidable elastic sleeve 8 on the fixing post 7 in conjunction with the first spring 9, the elastic sleeve 8 can be pressed tightly against the top grooves 21 on the semiconductor chip packaging body 4, which can prevent the semiconductor chip packaging body 4 from shaking. A top cover 10 is provided on the top of the housing 2. Electrical connection blocks 13 are fixedly connected to both sides. Elastic conductive sheets 14 are fixedly connected to opposite sides of each of the two electrical connection blocks 13. The elastic conductive sheets 14 ensure electrical connection of the fuse 15. Limiting plates 16 are fixedly connected to both sides of the bottom of the top cover 10. A fuse 15 is disposed between the inner surfaces of the two limiting plates 16. Limiting blocks 17 are slidably connected to the inner surfaces of the limiting plates 16. The limiting blocks 17 are used to limit the fuse 15. A second spring 18 is fixedly connected to the top of the limiting blocks 17. The top of the spring 18 is fixedly connected to the bottom of the top cover 10. The front and back of the limiting plate 16 are provided with travel grooves 19. The inner surface of the travel groove 19 is slidably connected to a push block 20. One side of the push block 20 is fixedly connected to one side of the limiting block 17. The travel groove 19 and the push block 20 are used to limit the limiting block 17. The two electrical connecting blocks 13 are fixedly connected to conductive blocks on their relatively far sides. The two conductive blocks are electrically connected to the external wires. The electrical connecting blocks 13 electrically connect the conductive blocks and the elastic conductive sheet 14.

[0025] Both sides of the top of the housing 2 are provided with stepped grooves 11, and both sides of the bottom of the top cover 10 are fixedly connected with stepped blocks 12. The inner surface of the stepped groove 11 is adapted to the outer surface of the stepped block 12. Through the cooperation between the stepped groove 11 and the stepped block 12, the top cover 10 can be prevented from sliding on the housing 2, thereby further improving its stability during use.

[0026] The working principle of this invention is as follows: First, the semiconductor chip package body 4 is placed on the inner surface of the placement groove 3. Then, the two rotating rods 5 on the mounting plate 1 are rotated, and the elastic sleeve 8 is pushed upward. When the elastic sleeve 8 rotates to directly above the top groove 21, the elastic sleeve 8 is released. At this time, the elastic sleeve 8 is inserted into the inner surface of the top groove 21 under the action of the first spring 9, thereby pressing the semiconductor chip package body 4. At this time, the push block 20 in the stroke groove 19 is pushed upward, which in turn pushes the limiting block 17 to move upward. At this time, the second spring 18 is in a compressed state. Then insert the fuse 15 between the two limiting plates 16. At this time, release the push block 20. The limiting block 17 presses the fuse 15 under the action of the second spring 18. Then align the stepped groove 11 on the top cover 10 with the electrical connection block 13 on the housing 2. At this time, the fuse 15 is located between the two electrical connection blocks 13 and is in contact with the elastic conductive sheet 14. When the current is transmitted to the semiconductor chip package body 4 through the wire, when the current is too large, the fuse 15 is melted. Then remove the top cover 10 and push the push block 20 again to replace the fuse 15.

[0027] In the description of this invention, it should be understood that the terms "upper," "lower," "left," and "right," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or a specific orientational structure and operation. Therefore, they should not be construed as limitations on the invention. Furthermore, "first" and "second" are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means two or more.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A protection structure for chip overcurrent, comprising a mounting plate (1), characterized in that, A housing (2) is fixedly connected to one side of the top of the mounting plate (1), and a placement groove (3) is opened on the other side of the top of the mounting plate (1). A semiconductor chip packaging body (4) is provided on the inner surface of the placement groove (3). A top cover (10) is provided on the top of the housing (2). Electrical connection blocks (13) are fixedly connected to both sides of the bottom of the inner cavity of the housing (2). An elastic conductive sheet (14) is fixedly connected to the opposite side of the two electrical connection blocks (13). Limiting plates (16) are fixedly connected to both sides of the bottom of the top cover (10). A fuse (15) is provided between the inner surfaces of the two limiting plates (16). The inner surface of the limiting plate (16) is slidably connected to a limiting block (17), and the top end of the limiting block (17) is fixedly connected to a second spring (18), and the top end of the second spring (18) is fixedly connected to the bottom of the top cover (10). The limiting plate (16) has a travel groove (19) on both the front and back sides. A push block (20) is slidably connected to the inner surface of the travel groove (19). One side of the push block (20) is fixedly connected to one side of the limiting block (17).

2. The protection structure for overcurrent of a chip according to claim 1, wherein, The semiconductor chip packaging body (4) has top grooves (21) on both sides of the top, and the mounting plate (1) has rotating rods (5) rotatably connected to the front and rear sides and one side of the semiconductor chip packaging body (4).

3. The protection structure for overcurrent of a chip according to claim 2, wherein, The top of the rotating rod (5) is fixedly connected to a support plate (6), the bottom of the support plate (6) is rotatably connected to a fixed column (7), and the outer surface of the fixed column (7) is slidably connected to an elastic sleeve (8).

4. The chip overcurrent protection structure according to claim 3, characterized in that, The bottom of the inner cavity of the elastic sleeve (8) is fixedly connected to a first spring (9), and the top of the first spring (9) is fixedly connected to the bottom of the fixed post (7).

5. The protection structure for overcurrent of a chip according to claim 4, wherein, The top of the housing (2) has stepped grooves (11) on both sides, and the bottom of the top cover (10) has stepped blocks (12) fixedly connected to both sides. The inner surface of the stepped groove (11) is adapted to the outer surface of the stepped block (12).

6. The protection structure for overcurrent of a chip according to claim 5, wherein, Each of the two electrical connection blocks (13) has a conductive block fixedly connected to the side that is relatively far apart from the other.

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