A display panel, a manufacturing method of the display panel, and a display device

Abstract

The application provides a display panel, which is divided into a display area and a non-display area surrounding the display area; comprises a substrate; an array layer located on the substrate, the array layer comprising a first inorganic insulating layer, the first inorganic insulating layer comprising at least one first groove located in the non-display area; a light-emitting functional layer located on the array layer; and a thin film encapsulation layer located on the light-emitting functional layer, wherein the display panel further comprises an organic auxiliary layer, the organic auxiliary layer filling the first groove; the thin film encapsulation layer comprises at least one inorganic encapsulation layer, the inorganic encapsulation layer covering the display area and extending to and contacting the organic auxiliary layer in the first groove; and the inorganic encapsulation layer comprises a first opening penetrating through the inorganic encapsulation layer, the first opening being located on the organic auxiliary layer in the first groove. The application provides a manufacturing method of the display panel and a display device comprising the display panel. According to the application, the influence of cracks generated at the edge of the display panel on the display area can be reduced, and the reliability of the display panel is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of display, in particular to a display panel, a manufacturing method of the display panel and a display device comprising the display panel. BACKGROUND

[0002] With the continuous development of display technology, display panel manufacturing technology also tends to be mature. On the one hand, since the edge of the display panel is relatively fragile, the frequency of edge collision is relatively large, and stress concentration is easy to occur, so cracks will occur at the edge; on the other hand, some display panels are simultaneously manufactured on a mother board during the process, and after the process is completed, the mother board is cut to form a plurality of independent display panels. At the time of cutting, the commonly used technologies are mechanical cutting and laser cutting. Mechanical cutting will cause the thin film packaging layer to crack from the edge due to the pressure of the cutter head on the panel, and the laser cutting method will also cause cracks due to thermal effects. The generation of cracks provides a path for the penetration of water vapor and oxygen from the side. At the same time, the cutting stress will cause damage to the display layer device and the thin film packaging layer. SUMMARY

[0003] Therefore, the present application provides a display panel, which is characterized in that it is divided into a display area and a non-display area surrounding the display area.

[0004] The display panel comprises:

[0005] a substrate;

[0006] an array layer on the substrate, the array layer comprising a first inorganic insulating layer, the first inorganic insulating layer comprising at least one first groove in the non-display area;

[0007] a light-emitting functional layer on the array layer;

[0008] a thin film packaging layer on the light-emitting functional layer,

[0009] wherein the display panel further comprises an organic auxiliary layer, and the organic auxiliary layer fills the first groove.

[0010] The thin film packaging layer comprises at least one inorganic packaging layer, and the inorganic packaging layer covers the display area and extends to and contacts the organic auxiliary layer in the first groove.

[0011] The inorganic packaging layer comprises a first opening penetrating the inorganic packaging layer, and the first opening is located on the organic auxiliary layer in the first groove.

[0012] The present application provides a manufacturing method of the above-mentioned display panel.

[0013] The present application also provides a display device comprising the above-mentioned display panel.

[0014] The application can reduce the influence of the crack generated at the edge of the display panel on the display area, and improve the reliability of the display panel. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a top view of a display panel provided by an embodiment of the application;

[0016] Figure 2 is a sectional view along the direction of A-A in Figure 1

[0017] Figure 3 Figure 1 is an enlarged schematic view in the point-line frame;

[0018] Figure 4 is a schematic view of another display panel provided by an embodiment of the application;

[0019] Figure 5 is a sectional view along the direction of A-A in Figure 4

[0020] Figure 6 is a sectional view along the direction of A-A in another display panel provided by an embodiment of the application; Figure 4

[0021] Figure 7 is a schematic view of another display panel provided by an embodiment of the application;

[0022] Figure 8 is a schematic view of another display panel provided by an embodiment of the application;

[0023] Figure 9 is a schematic view of another display panel provided by an embodiment of the application;

[0024] Figure 10 is a schematic view of another display panel provided by an embodiment of the application;

[0025] Figure 11 is a partial enlarged view in the point-line frame; Figure 10

[0026] Figure 12 is a schematic view of a manufacturing method of a display panel provided by an embodiment of the application;

[0027] Figure 13 is a schematic view of another manufacturing method of a display panel provided by an embodiment of the application;

[0028] Figure 14 is a schematic view of another manufacturing method of a display panel provided by an embodiment of the application;

[0029] ​​​​​Figure 15 is a structural schematic diagram of a display device provided by an embodiment of the present application; DETAILED DESCRIPTION

[0030] In order to make the above objectives, characteristics and advantages of the present application more apparent, comprehensible and easier to understand, the present application will be further described below with reference to the accompanying drawings and embodiments.

[0031] It should be noted that specific details are set forth in the following description in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond those specifically described in this description. Furthermore, the present application can be practiced with other embodiments than those described in this description. Accordingly, the present application is not limited to the specific embodiments described in this description, but only by the claims.

[0032] The terminology used in the present application is merely for the purpose of describing specific embodiments, and is not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0033] It should be noted that the terms "upper", "lower", "left", "right", and the like described in the embodiments of the present application are described from the angle shown in the drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when referring to an element being formed "on" or "under" another element, it can be directly formed "on" or "under" another element, or indirectly formed "on" or "under" another element through an intermediate element.

[0034] In order to make the above objectives, characteristics and advantages of the present application more apparent, comprehensible and easier to understand, the present application will be further described below with reference to the accompanying drawings and embodiments. However, the example embodiments can be implemented in various forms, and should not be understood as being limited to the embodiments described herein; on the contrary, these embodiments are provided to make the present application more comprehensive and complete, and to fully convey the ideas of the example embodiments to those skilled in the art. The same reference numerals in the drawings represent the same or similar structures, and thus repeated description thereof will be omitted. The expressions of position and direction described in the present application are described with reference to the drawings, but changes can also be made as needed, and the changes are all included in the protection scope of the present application. The drawings of the present application are only used to illustrate the relative positional relationship, and the layer thickness of some parts is exaggerated in the drawing for better understanding, and the layer thickness in the drawings does not represent the proportional relationship of the actual layer thickness. The embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The drawings of the embodiments in the present application use the same reference numerals. In addition, the same parts of the embodiments are not described again.

[0035] AsFigures 1 to 3 As shown, Figure 1 This is a top view of a display panel provided in an embodiment of the present invention. Figure 2 For along Figure 1 A cross-sectional view along direction AA, wherein the cross-section is perpendicular to the plane containing the display panel and parallel to the direction from the display area to the non-display area (or the cross-section is perpendicular to the plane containing the display panel and perpendicular to the extension direction of the edge of the display panel at that point in the top view). Figure 3 for Figure 1 Enlarged view of the midpoint-line frame.

[0036] Optionally, the display panel 100 is divided into a display area AA and a non-display area NA surrounding the display area AA. This is understandable. Figure 1 The dashed box in the middle is used to indicate the boundary between the display area AA and the non-display area NA. The display area AA is the area of ​​the display panel used to display the image, and it usually includes multiple pixel units arranged in an array. Each pixel unit includes a corresponding light-emitting device (e.g., an organic light-emitting diode) and control elements (e.g., thin-film transistors that constitute the pixel driving circuit). The non-display area NA surrounds the display area AA and usually includes peripheral driving elements, peripheral traces, and a fan-out area.

[0037] Optionally, the display panel 100 includes a substrate 110, an array layer 120, a light-emitting functional layer 130, and a thin-film encapsulation layer 140 arranged sequentially.

[0038] Specifically, the substrate 110 can be formed from polymeric materials such as glass, polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PAR), or glass fiber reinforced plastic (FRP). The substrate 110 can be transparent, translucent, or opaque.

[0039] An array layer 120 is located on a substrate 110.

[0040] Specifically, the array layer 120 includes multiple thin film transistors 210 and pixel circuits composed of thin film transistors for controlling light-emitting devices.

[0041] This invention describes the structure of a top-gate type thin-film transistor as an example. The thin-film transistor layer 210 includes:

[0042] An active layer 211 is located on the substrate 110. The active layer 211 can be made of amorphous silicon, polycrystalline silicon, or metal oxide, etc. The active layer 211 also includes a source region and a drain region formed by doping with N-type or P-type impurity ions, and a channel region is formed between the source region and the drain region.

[0043] A gate insulating layer 212 is located on the active layer 211. The gate insulating layer 212 includes an inorganic layer such as silicon oxide, silicon nitride, and can include a single layer or multiple layers.

[0044] A gate 213 is located on the gate insulating layer 212. The gate 213 can include a single layer or multiple layers of gold (Au), silver (Ag), copper (Cu), nickel (Ni), platinum (Pt), palladium (Pd), aluminum (Al), molybdenum (Mo), or chromium (Cr), or an alloy such as an aluminum (Al): neodymium (Nd) alloy and a molybdenum (Mo): tungsten (W) alloy.

[0045] An interlayer insulating layer 214 is located on the gate 213. The interlayer insulating layer 214 can be formed of an inorganic layer such as silicon oxide or silicon nitride. Of course, in other alternative embodiments of the present application, the interlayer insulating layer can be formed of an organic insulating material.

[0046] A source electrode 2151 and a drain electrode 2152 are located on the interlayer insulating layer 214. The source electrode 2151 and the drain electrode 2152 are electrically connected (or bonded) to the source region and the drain region, respectively, through contact holes formed by selectively removing the gate insulating layer 212 and the interlayer insulating layer 214.

[0047] It can be understood that the phrase "on" a certain film layer in the present embodiment can be understood as "on the side away from the substrate".

[0048] Optionally, the array layer 120 can further include a buffer layer 111 located on the side of the array layer 120 in contact with the substrate 110. Of course, in some embodiments, the buffer layer 111 can be divided as part of the substrate 110.

[0049] Optionally, the buffer layer 111 can include a multi-layer inorganic, organic layer stack structure to block oxygen and moisture, prevent moisture or impurities from diffusing through the substrate, and provide a flat surface on the upper surface of the substrate 110, and the specific structure will not be described herein.

[0050] Optionally, the array layer 120 further includes a passivation layer 220 located on the thin film transistor 210. The passivation layer 220 can be formed of an inorganic layer such as silicon oxide or silicon nitride or an organic layer.

[0051] Optionally, the array layer 120 includes a first inorganic insulating layer 121. Optionally, the first inorganic insulating layer 121 covers at least the non-display area NA; the first inorganic insulating layer 121 includes at least one first recess 122 located in the non-display area NA. Specifically, at least one opening of the first recess 122 is located on the surface of the array layer 120 away from the substrate 110.

[0052] Optionally, the buffer layer, the gate insulating layer, the interlayer insulating layer, and the passivation layer can extend from the display area to the non-display area, and even to the cutting edge of the display panel. The first inorganic insulating layer can be a combination of one or more of the buffer layer, the gate insulating layer, the interlayer insulating layer, and the passivation layer.

[0053] Specifically, the first inorganic insulating layer 121 in the embodiment at least includes the interlayer insulating layer 214 and the passivation layer 220; the first recess 122 is located in the non-display area NA and penetrates the interlayer insulating layer 214 and the passivation layer 220.

[0054] Optionally, the display panel 100 further includes a planarization layer 230 located on the array layer 120. The anode 310 can include an organic layer of acrylic, polyimide (PI), or benzocyclobutene (BCB), etc., and the planarization layer 230 has a planarization effect.

[0055] The light-emitting functional layer 130 located on the side of the array layer 120 away from the substrate 110,

[0056] Optionally, the light-emitting functional layer 130 in the embodiment includes an organic light-emitting device. Specifically, the organic light-emitting device includes, in the direction away from the substrate 110, an anode 310, an organic light-emitting material 320, and a cathode 330 in sequence. Among them, the anode 310 includes an anode pattern corresponding to the pixel unit one by one, and the anode pattern in the anode 310 is connected with the source electrode 2151 or the drain electrode 2152 of the thin film transistor 210 through the via hole on the anode 310.

[0057] The light-emitting functional layer 130 further includes a pixel definition layer 340 located on the side of the anode layer 310 away from the array layer 200. The pixel definition layer 340 can be formed of an organic material such as polyimide (PI), polyamide, benzocyclobutene (BCB), acrylic resin, or phenolic resin, etc., or formed of an inorganic material such as SiNx.

[0058] Optionally, the organic light-emitting device defined by the opening of the pixel definition layer 340 is located in the display area AA. Specifically, the pixel definition layer 340 includes a plurality of openings exposing the anode 310, and the pixel definition layer 340 covers the edges of the anode 310 pattern. The organic light-emitting material 320 at least partially fills in the opening of the pixel definition layer 340 and is in contact with the anode 310. The organic light-emitting material 320 in the opening of the pixel definition layer 340 forms a smallest light-emitting unit. Each light-emitting unit can emit light of different colors according to different organic light-emitting materials 320, each light-emitting unit and the pixel circuit communicate to constitute a pixel, and a plurality of pixels jointly display a picture.

[0059] Of course, in other optional embodiments of the present application, the organic light emitting device can be an LED or other self-luminous device, or the organic light emitting device can be a device displaying images by other principles.

[0060] The display panel 100 further comprises an organic auxiliary layer 600, which is located on the side of the array layer 120 away from the substrate 110. At least part of the organic auxiliary layer 600 fills the first recess 122.

[0061] Optionally, the organic auxiliary layer 600 can be the same layer and material as one or more of the planarization layer 230 and the pixel definition layer 340 located between the array layer 120 and the light emitting functional layer 130. In this way, the manufacturing process can be simplified and new film layer materials can be avoided.

[0062] Of course, the planarization layer 230 and the pixel definition layer 340 are encapsulated by the thin film encapsulation layer 140, so the planarization layer 230 is not continuous with the organic auxiliary layer 600, and the pixel definition layer 340 is not continuous with the organic auxiliary layer 600.

[0063] Optionally, the display panel 100 can further comprise a thin film encapsulation layer 140 (TFE) located on the light emitting functional layer 130, i.e. on the side of the light emitting functional layer 130 away from the array layer 120, and completely covering the light emitting functional layer 130, for sealing the light emitting functional layer 130.

[0064] Optionally, the thin film encapsulation layer 140 comprises at least one inorganic encapsulation layer. Specifically, the thin film encapsulation layer 140 is located on the cathode layer 330 and comprises a first inorganic encapsulation layer 410, a first organic encapsulation layer 420 and a second inorganic encapsulation layer 430 arranged in sequence in the direction away from the substrate 110.

[0065] Of course, in other optional embodiments of the present application, the thin film encapsulation layer 140 can comprise any number of layers of organic and inorganic materials as needed, but at least one layer of organic material and at least one layer of inorganic material are deposited alternately, and the lowermost layer and the uppermost layer are composed of inorganic materials.

[0066] Optionally, the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 cover the display area AA from the display area AA to the non-display area NA, and even to the cutting edge of the display panel 100; the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 cover the first groove 122, and the first inorganic encapsulation layer 410 is in contact with the organic auxiliary layer 600 in the first groove 122. And the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 include a first opening 401 penetrating the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 in the non-display area. Optionally, the first opening 401 overlaps the organic auxiliary layer 600 located in the first groove 122. That is, the first opening 401 is located on the organic auxiliary layer 600 in the first groove 122. In other words, for the projection along the direction perpendicular to the display panel 100, the projection of the first opening 401 on the substrate 110 is located within the projection of the first groove 122 on the substrate 110, and the projection of the first opening 401 on the substrate 110 is within the projection of the organic auxiliary layer 600 on the substrate 110.

[0067] Optionally, the inorganic encapsulation layer in the non-display area NA is in direct contact with the first inorganic insulating layer 121 at least on both sides of the first groove 122 in the first direction X, wherein the first direction X is parallel to the cross-sectional direction of the first groove 122 (or parallel to the direction where the display area AA points to the non-display area NA) and parallel to the plane where the display panel 100 is located. Figure 2

[0068] The present embodiment takes an example of the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 both extending to the non-display area, of course, in other optional embodiments of the present application, more layers of inorganic encapsulation layers can extend to the non-display area and set the first opening, or only one layer of inorganic encapsulation layer can extend and contact and cover the organic auxiliary layer in the first groove.

[0069] ​By setting the first groove and filling the first groove with the organic material, on one hand, the cracks introduced from the cutting edge can be intercepted from spreading to the display area through the first groove, and the cracks can be blocked by the organic auxiliary layer while stress is relieved; on the other hand, by the above design in combination with the thin film encapsulation layer, the film layers on the lower side of the thin film encapsulation layer in the direction in which the cracks can invade (i.e., the direction in which the edge of the display panel points to the display area) can be changed from inorganic material to organic material and then to inorganic material. Since the CTE values of the first inorganic insulating layer and the inorganic encapsulation layer are different from that of the organic auxiliary layer, the expansion rates of the inorganic encapsulation layer and the first inorganic insulating layer are different from that of the organic auxiliary layer, and the degrees of thermal expansion and contraction are different under the same temperature change, the inorganic encapsulation layer can form an opening, i.e., a first opening, along the organic auxiliary layer in the first groove. It can be understood that, since the temperature will change in subsequent manufacturing, such as curing, laser removal and other processes, the first opening can be formed through the above structure without the need for additional manufacturing.

[0070] Further, the cracks introduced from the edge of the display panel can be blocked from invading the display area through the first opening, and at the same time, since the opening edge of the inorganic encapsulation layer is located on the organic auxiliary layer, the stress of the edge can be relieved by the organic material, which not only avoids the invasion of cracks from the edge of the display panel but also reduces the risk of cracks in the non-edge area of the display panel. In addition, since the first groove accommodates the organic auxiliary layer, the thickness of the film layers can be avoided from increasing.

[0071] With reference back to FIGS. 1, 2 and 3, Figure 1 and 2 As shown in FIG. 6, optionally, the organic auxiliary layer 600 completely fills the first groove 122 and is in contact with the bottom and sidewall of the first groove 122, and covers the opening edge of the first groove 122. That is, the organic auxiliary layer 600 also covers the junction between the first groove 122 and the non-groove area of the first inorganic insulating layer 121. In this way, the degree of change of the first inorganic insulating layer and the organic auxiliary layer can be avoided from being different to cause the two to peel off when thermal expansion and contraction or bending, stretching and compression occur.

[0072] Optionally, the display panel 100 further includes a barrier wall 500 arranged in the non-display area NA. Optionally, the barrier wall 500 is arranged on the passivation layer 220, for example, between the passivation layer 220 and the thin film encapsulation layer 140. The orthographic projection (or vertical projection, vertical means that the projection direction is perpendicular to the substrate) of the barrier wall 500 on the substrate 110 surrounds the planarization layer 230, that is, the edge of the orthographic projection of the planarization layer 230 on the substrate 110 is located on the side of the barrier wall 500 close to the display area AA. The first inorganic encapsulation layer 410 is located in the area surrounded by the barrier wall 500, and the overflow of the organic material in the thin film encapsulation layer 140 is prevented by the barrier wall 500.

[0073] Further, the orthographic projection (or vertical projection, vertical means the projection direction is perpendicular to the substrate) of the first groove 122 on the substrate 110 surrounds the barrier wall 500. The first opening 401 surrounds the display area AA, and further, the first opening 401 surrounds the barrier wall 500. That is, the inorganic encapsulation layer (i.e. continuous inorganic encapsulation layer) actually playing a packaging role actually stops at the side edge of the first opening 401 close to the display area AA. And the orthographic projection of the side edge on the substrate 110 is located within the orthographic projection of the organic auxiliary layer 600 on the substrate 110.

[0074] In this way, through the design of the organic auxiliary layer and the first groove in the embodiment, the first opening can be formed, and through the first opening, the crack of the display edge can be intercepted, and in the embodiment, there is no need to additionally set more barrier walls to intercept the inorganic encapsulation layer, which is beneficial to narrow the frame; and there is no need to additionally manufacture the edge of the patterned inorganic encapsulation layer.

[0075] Optionally, the width of the first groove 122 ranges from 3 μm to 10 μm. Since the organic light emitting device is sensitive to temperature, the change degree of the environmental temperature in the manufacturing process of the display panel is limited; the inventor finds through research that when the width of the first groove 122 ranges from 3 μm to 10 μm, the thermal expansion and contraction difference between the inorganic encapsulation layer and the organic auxiliary layer within the temperature change range that the display panel can withstand is sufficient to make the inorganic encapsulation layer generate the first opening 122.

[0076] It can be understood that the width of the first groove at a certain place in the embodiment refers to the size in the direction from the adjacent display area to the adjacent display panel edge.

[0077] As Figure 4 and Figure 5 stated, Figure 4 is a schematic view of another display panel provided by the embodiment of the present application, Figure 5 is a sectional view along the direction of A-A in Figure 4 . Wherein, the same parts of the embodiment and the previous embodiment will not be described again.

[0078] Differently, the first inorganic insulating layer 121 further comprises a plurality of first protrusions 123 located in the first groove 122, the first protrusions 123 are of the same layer and the same material as the first inorganic insulating layer 121, and the organic auxiliary layer covers the first protrusions.

[0079] In this way, the first protrusions can enhance the bonding ability between the organic auxiliary layer and the first inorganic insulating layer, and avoid film separation in the process of forming the first opening. At the same time, the first protrusions can further block the crack.

[0080] It can be understood that the embodiment is described by taking two first protrusions as an example, but the number of the first protrusions is not limited to two in other optional embodiments of the application.

[0081] Further, the organic auxiliary layer 600 covers and contacts the first protrusions 123. There is a gap 700 between the first protrusions 123 or between the first protrusions 123 and the sidewalls of the first grooves 122, and the organic auxiliary layer 600 fills the gap 700.

[0082] The gap 700 includes at least one first gap 710 and at least one second gap 720. The first gap 710 is larger than the second gap 720, and the first opening 401 is located on the organic auxiliary layer 600 in the first gap 710.

[0083] It should be noted that the above embodiment compares the size or width of the gap, which is the length of the gap in the first direction X or the size of the gap in the direction from the adjacent display area to the adjacent display panel edge.

[0084] In this way, the effect of preventing the crack from invading the array layer is improved, and the bonding capacity between the organic auxiliary layer and the first inorganic insulating layer is also improved. In addition, by arranging different gaps, the first opening can be formed at the accurate position, and the second gap can assist the first gap.

[0085] Optionally, the size of the first gap 710 is 2 μm to 8 μm larger than the size of the second gap 720. The inventor has found through experiments that when the sizes of the first gap and the second gap meet the above requirements, the first opening can be accurately formed on the organic auxiliary layer in the first gap, that is, the auxiliary function of the first gap is met, and at the same time, the inorganic encapsulation layer is prevented from generating cracks or cracks at the second gap, the integrity of the edge of the first opening is ensured, and serious burrs or jagged edges are avoided.

[0086] Optionally, the size of the first gap ranges from 3 μm to 10 μm. Since the organic light-emitting device is sensitive to temperature, the change degree of the environmental temperature in the manufacturing process of the display panel is limited. The inventor has found through research that when the width of the first groove ranges from 3 μm to 10 μm, the thermal expansion and contraction difference between the inorganic encapsulation layer and the organic auxiliary layer within the temperature change range that the display panel can withstand is sufficient to make the inorganic encapsulation layer generate the first opening.

[0087] Preferably, the size of the first interval ranges from 5 μm. At this size, both narrow frame and yield can be considered, that is, the first interval does not occupy too much frame area of the display panel, and the first opening can be formed on the organic auxiliary layer in the first interval. Moreover, at this range, the integrity of the edge of the first opening can be ensured, and serious burr or jagged edge can be avoided.

[0088] Optionally, in the first direction X, at least two second intervals 720 are respectively located on both sides of the first interval 710. In this way, on the one hand, the position of the first opening can be accurately located on the organic auxiliary layer, and the second interval can play a buffering role. It can be understood that, in the process of forming the first opening, the position with the largest degree of deformation is the organic auxiliary layer in the first interval, and the second interval arranged between the first interval and the side wall of the first groove can play a certain buffering role, further improving the stability of the structure.

[0089] Optionally, in the embodiment, the barrier wall 500 includes a first dam 510 and a second dam 520. The first dam 510 is arranged around the display area AA, and the second dam 520 is separated from the first dam 510 and arranged around the first dam 510. The thin film encapsulation layer 140 covers the first dam 510 and is located in the area surrounded by the second dam 520. The first organic encapsulation layer 420 is located in the area surrounded by the first dam 510, and the overflow of the organic material in the thin film encapsulation layer 140 is prevented by the first dam 510.

[0090] Optionally, the first groove 122 surrounds the display area AA, and the first protrusion 123 is consistent with the extension route of the first groove 122, also surrounds the display area AA, and a plurality of first protrusions 123 are arranged in sequence along the direction from the display area AA to the non-display area NA. That is, the first groove and the first protrusion, and the interval are all closed annular shapes surrounding the display area in the orthographic projection on the substrate; and the first protrusion close to the display panel edge surrounds the first protrusion close to the display area. In this way, the structures of the display panel on each side can be consistent, and the position of stress concentration can be avoided, and cracks from various directions can be avoided.

[0091] Continuing to refer to Figure 5 Optionally, the substrate 110 is an organic material, the first groove 122 exposes the substrate 110, and the organic auxiliary layer 600 is in contact with the substrate 110.

[0092] By the above embodiment, since the organic auxiliary layer and the substrate are both organic materials, the degree of thermal expansion or the degree of contraction upon cooling tends to be consistent, and the first protrusions arranged in the first groove are independent in the lateral direction and directly contact the substrate. The first protrusions can directly follow the contraction or expansion of the substrate and move relatively. Therefore, when the ambient temperature of the display panel changes, the side of the organic auxiliary layer facing the substrate is not only constrained by other film layers, making it difficult for the degree of thermal expansion and contraction to differ from the degree of change of the inorganic encapsulation layer; the organic auxiliary layer also receives assistance from the substrate. The first protrusions and the first groove on both sides of the first groove can move together to assist the thermal expansion and contraction of the organic auxiliary layer, and the inorganic encapsulation layer on the first inorganic insulating layer on both sides of the first groove can receive assistance from the relative motion transmitted from the substrate. This helps to form the first opening more quickly under a smaller temperature difference and avoids the impact of a large temperature difference on the display panel. At the same time, due to the above design, the thermal expansion and contraction of the organic auxiliary layer will not affect other film layers, such as the first inorganic insulating layer, and will not affect the devices in the array layer of the display panel.

[0093] Further, the organic auxiliary layer can directly contact the substrate formed of the same organic material, that is, the first groove completely penetrates the first inorganic insulating layer. This can completely block the propagation of cracks in the thickness direction of the display panel, and the contact performance of the organic auxiliary layer and the substrate formed of the same organic material is better, which can improve the adhesion of the film layer in the edge region and prevent the film layer from cracking at the edge.

[0094] As shown in FIG. 1, Figure 6 As shown in FIG. 1, Figure 6 FIG. 1 is a cross-sectional view of a display panel along direction A-A according to another embodiment of the present application. Figure 4

[0095] In this embodiment, the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 430 extend from the display area AA to the non-display area NA. The first inorganic encapsulation layer 410 stops at the second dam 520, and the second inorganic encapsulation layer 430 covers the second dam 520 and extends to the cutting edge of the display panel 100. The second inorganic encapsulation layer 430 covers the first groove 122, and the second inorganic encapsulation layer 430 contacts the organic auxiliary layer 600 in the first groove 122. The second inorganic encapsulation layer 430 includes a first opening 401 penetrating the second inorganic encapsulation layer 430 in the non-display area. The first opening 401 is located on the organic auxiliary layer 600 in the first groove 122.

[0096] ​Optionally, the organic auxiliary layer 600 can be formed in the same layer and of the same material as one or more of the planarization layer 230 and the pixel definition layer 340 between the array layer 120 and the light-emitting functional layer 130. In this way, the manufacturing process can be simplified and the introduction of new film layer materials can be avoided.

[0097] Optionally, the organic auxiliary layer 600 in the present embodiment can also be formed in the same layer and of the same material as the first organic encapsulation layer 420.

[0098] As shown in Figure 7 , Figure 7 is a schematic view of another display panel according to an embodiment of the present application.

[0099] The size of the first protrusion 123 gradually increases along the direction from the first interval 710 to the two sides of the first groove 122. The first opening 401 formed by the inorganic encapsulation layer 141 is located on the organic auxiliary layer 600 filled between two adjacent first protrusions 123 with the smallest width.

[0100] It should be noted that, in the present embodiment, the two sides of the first groove are the two opposite sides in the first direction X, and the first direction X is the direction from the display area AA to the non-display area NA, i.e., the direction perpendicular to the extension of the first groove 122. The above-mentioned size is the width in the first direction X.

[0101] Through the present embodiment, the first protrusions with different widths can play an over-acting role, avoiding the influence of thermal expansion and contraction of the organic auxiliary layer on the first inorganic insulating layer, such as avoiding the extrusion of the first groove sidewall after the expansion of the organic auxiliary layer to avoid the extrusion of the device in the first inorganic insulating layer.

[0102] As shown in Figure 8 , Figure 8 is a schematic view of another display panel according to an embodiment of the present application.

[0103] Optionally, the distance from at least one first interval 710 to the sidewall of the first groove 122 close to the display area AA is smaller than the distance from the first interval 710 to the sidewall of the first groove 122 close to the non-display area NA.

[0104] Further, the first interval 710 is the interval between the first protrusion 123 and the sidewall of the first groove 122 close to the display area AA. The second interval 720 is located on the side of the first interval 710 away from the display area AA, that is, the first interval 710 surrounds the display area AA, and the second interval 720 surrounds the first interval 710 and the display area AA.

[0105] Optionally, the first opening is located on the side of the first groove center deviated from the display area.

[0106] Through the embodiment, the first protrusion can form a barrier to block the crack multiple times, so that the crack consumes energy in the process of penetrating the film layer of different materials, and is finally intercepted by the film layer; and the side edge of the first opening facing the display area is the cut-off edge of the film layer which needs to play an actual packaging role, so that the cut-off edge of the film layer which plays an actual packaging role can be as far away from the edge of the display panel as possible to reduce the influence of stress, and the crack can be basically intercepted before the crack reaches the first opening in the crack invasion direction (i.e. the first direction X).

[0107] As shown in Figure 9 , Figure 9 is another schematic view of a display panel provided by an embodiment of the present application.

[0108] Optionally, the first interval 710 is an interval between the first protrusion 123 and the side wall of the first groove 122 close to the display area AA. The second interval 720 is located on the side of the first interval 710 away from the display area AA; and the size of the first protrusion 123 gradually increases along the direction from the first interval 710 to the two sides of the first groove 122. That is, the width of the plurality of first protrusions 123 arranged in the direction from the display area AA to the edge of the display panel 100 gradually increases. The width of the first protrusion 123 close to the display area AA in the first direction X is less than the width of the first protrusion 123 close to the edge of the display panel 100 in the first direction X.

[0109] As shown in Figure 10 and Figure 11 , Figure 10 is another schematic view of a display panel provided by an embodiment of the present application. Figure 11 is Figure 10 a partial enlarged view in the dot-dash line.

[0110] Optionally, the first groove 122 is a strip extending in the direction of the edge of the display panel 100 adjacent to the first groove 122, and the first protrusion 123 extends along the first groove 122.

[0111] Optionally, at least one end of the first groove 122 extends to the cutting edge of the display panel 100.

[0112] Through the embodiment, at least one end of the first groove extends to the cutting edge of the display panel, and the cutting edge will generate some jagged edges (or called burrs) or small cracks. The jagged edges or cracks will generate stress concentration after bending or being stressed, so that a guide path can be provided for the formation of the first opening in the process of thermal expansion and contraction or bending, so as to avoid that the degree of thermal expansion and contraction or bending is not enough to reach the starting force of the crack of the first opening, and at the same time, the process difficulty is not increased, but the existing cutting defects are converted into an auxiliary structure for the formation of the first opening.

[0113] Continuing to refer to 10 and 11, optionally, the substrate 110 can be a flexible substrate formed of a polymer with a relatively thin thickness, such as polyimide.

[0114] Optionally, the display panel 100 includes at least a first bending area BA, and a bending axis Z of the first bending area BA extends along the first groove 122. That is, the first bending area BA extends along the first groove 122. That is, the first groove can be bent along a folding line in a direction parallel to the edge of the display panel.

[0115] Optionally, the hardness of the inorganic encapsulation layer is greater than that of the organic auxiliary layer. Optionally, the first opening extends along the folding line. One end of the first opening is located at the cutting edge.

[0116] Optionally, the organic auxiliary layer covers the junction of the first bending area and the non-bending area; and optionally, the orthographic projection of the first bending area on the substrate is located in the orthographic projection of the first groove on the substrate. In this way, film layer separation caused by the bending operation in the process of forming the first opening can be avoided.

[0117] According to the present embodiment, due to the different flexibility and different bending resistance of the inorganic encapsulation layer and the organic auxiliary layer, the first opening can be formed by bending, and crack invasion into the display panel can be prevented; and the bending axis direction and position are easy to control, the direction of the bending stress can be accurately controlled, and the extension direction of the first opening can be ensured.

[0118] As shown in FIG. 13, a schematic diagram of a manufacturing method of a display panel is provided in the present embodiment. The manufacturing method can be used to manufacture the display panel described above. The display panel manufactured in the process or after the manufacturing process is completed includes a display area and a non-display area which are pre-divided. Figure 12 Figure 12 Specifically, the manufacturing method includes:

[0119] providing a substrate 110;

[0120] manufacturing an array layer 120 on one side of the substrate 110. Wherein, manufacturing the array layer 120 includes manufacturing a first inorganic insulating layer 121, and the first inorganic insulating layer 121 includes at least one first groove 122 located in a non-display area NA. Optionally, the first groove 122 can be formed by etching.

[0121] manufacturing a light-emitting functional layer 130 on a side of the array layer 120 away from the substrate 110.

[0122] Wherein, after manufacturing the first inorganic insulating layer 121, an organic auxiliary layer 600 is manufactured, and the organic auxiliary layer 600 fills the first groove 122.

[0123]

[0124] ​​Optionally, the organic auxiliary layer 600 is prepared before the thin film encapsulation layer 140 is prepared, and the organic auxiliary layer 600 is prepared in the same layer and of the same material as the film layer formed by the organic material in the light-emitting functional layer 130.

[0125] The thin film encapsulation layer 140 is prepared on the side of the light-emitting functional layer 130 away from the substrate 110;

[0126] The preparation of the thin film encapsulation layer 140 includes preparation of at least one inorganic encapsulation layer 141 formed by inorganic material, wherein the organic auxiliary layer 600 is at least prepared before the inorganic encapsulation layer 141 is prepared, and the inorganic encapsulation layer 141 covers the display area AA and extends to and contacts the organic auxiliary layer 600 in the first groove 122.

[0127] Optionally, after the inorganic encapsulation layer 141 is formed, a first opening 401 is formed in the inorganic encapsulation layer 141, and the first opening 401 is located on the organic auxiliary layer 600 in the first groove 122.

[0128] Through the embodiment, the first groove is provided and filled with the organic material, which can intercept the crack introduced from the cutting edge and spread to the display area on the one hand, and can block the crack and relieve stress at the same time through the organic auxiliary layer; on the other hand, through the above design combined with the thin film encapsulation layer, the film layer on the lower side of the thin film encapsulation layer can be changed from inorganic material to organic material and then to inorganic material in the direction in which the crack may invade (i.e. the direction in which the edge of the display panel points to the display area), and because the CTE values of the first inorganic insulating layer and the inorganic encapsulation layer are different from that of the organic auxiliary layer, the expansion rates of the inorganic encapsulation layer and the first inorganic insulating layer are different from that of the organic auxiliary layer, and the degree of thermal expansion and contraction is different under the same temperature change, so the inorganic encapsulation layer forms an opening, i.e. the first opening, along the organic auxiliary layer in the first groove. It can be understood that because the temperature will change in the subsequent manufacturing process, such as curing, laser removal, etc., it is not necessary to additionally manufacture the first opening which can be formed through the above structure.

[0129] In addition, the crack can be blocked through the first opening from invading the display area from the edge of the display panel, and because the opening edge of the inorganic encapsulation layer is located on the organic auxiliary layer, the stress of the edge can be relieved through the organic material, which not only avoids the crack from the edge of the display panel invading but also reduces the risk of crack in the non-edge area of the display panel. In addition, because the first groove accommodates the organic auxiliary layer, the thickness of the film layer can be avoided from increasing.

[0130] As shown in FIG. 6, FIG. 7 and FIG. 8 are schematic diagrams of another method for manufacturing a display panel provided by the embodiments of the present application. Figure 13 Figure 13 As shown in FIG. 6, FIG. 7 and FIG. 8 are schematic diagrams of another method for manufacturing a display panel provided by the embodiments of the present application.

[0131] ​Unlike the embodiments described above, the organic auxiliary layer 600 has a lower hardness than the inorganic encapsulation layer 141; or the organic auxiliary layer 600 has a higher elasticity than the inorganic encapsulation layer 141. The organic auxiliary layer 600 can be made of a flexible material or a material with high flowability that has been cured.

[0132] Optionally, the display panel 100 includes at least one first bending region BA, the bending axis Z of which extends along the first groove 122. That is, the first bending region BA extends along the first groove 122. Specifically, the first groove can be bent along a direction parallel to the edge of the display panel as a fold line. The extension direction of the first groove is generally consistent with or parallel to the edge of the adjacent display panel.

[0133] Optionally, forming a first opening 401 penetrating the inorganic encapsulation layer 141 includes:

[0134] The display panel 100 is bent along the first groove 122 (it should be noted that the display panel here can be the display panel in the process or the final product), so that the inorganic encapsulation layer 141 forms the first opening 401.

[0135] Optionally, the bending direction of the bent display panel is such that the substrate bends away from the inorganic encapsulation layer.

[0136] It should be noted that the bending can refer to repeatedly bending back and forth between two states. The two states can be two states with different bending curvatures, or they can be a flat state and a bent state.

[0137] In this embodiment, due to the different flexibility and bending resistance of the inorganic encapsulation layer and the organic auxiliary layer, a first opening can be created by bending to prevent cracks from entering the display panel; and the bending axis direction and position are easy to control, so the direction of bending stress can be accurately controlled to ensure the extension direction of the first opening.

[0138] Optionally, the first bending area can reuse the display panel's folded-back edge to achieve a narrow bezel bending area. This reduces the space occupied by the first groove and the first opening, provides a bending path for bending, and allows the first opening to be formed through existing bending steps in the process, thus standardizing the formation of the first opening and preventing irregular or parallel cracks from forming in the inorganic encapsulation layer during bending.

[0139] like Figure 14 As shown, Figure 14 This is a schematic diagram illustrating another method for manufacturing a display panel according to an embodiment of this application.

[0140] Optionally, the CTE of the inorganic encapsulation layer is different from that of the organic auxiliary layer, and the thermal expansion rates of the inorganic encapsulation layer and the first inorganic insulation layer are different from that of the organic auxiliary layer.

[0141] Optionally, forming the first opening 401 through the inorganic encapsulation layer 141 includes:

[0142] The temperature of the display panel 100 is changed, so that the inorganic encapsulation layer 141 and the organic auxiliary layer 600 are thermally expanded or contracted, and the inorganic encapsulation layer 141 forms the first opening 401.

[0143] Optionally, the temperature of the display panel 100 is first set to a second temperature, so that the inorganic encapsulation layer 141 and the organic auxiliary layer 600 are contracted due to cold, and then the temperature of the display panel 100 is set to the first temperature. The second temperature is less than the first temperature. The inorganic encapsulation layer 141 and the organic auxiliary layer 600 are thermally expanded. Because the thermal expansion degrees of the inorganic encapsulation layer 141 and the organic auxiliary layer 600 are different, the expansion degree of the organic auxiliary layer 600 is large, and the organic layer has good elasticity and ductility. Therefore, the organic auxiliary layer 600 will pull the inorganic encapsulation layer 141, but the inorganic encapsulation layer 141 has poor elasticity and large hardness. Therefore, the pulling of the organic auxiliary layer 600 causes the inorganic encapsulation layer 141 to form the first opening 401.

[0144] Of course, the order of use of the first temperature and the second temperature can be exchanged. For example, the temperature of the display panel 100 is first set to the first temperature, so that the inorganic encapsulation layer 141 and the organic auxiliary layer 600 are thermally expanded, and then the temperature of the display panel 100 is set to the second temperature. The second temperature is less than the first temperature. Because the cold contraction degrees of the inorganic encapsulation layer 141 and the organic auxiliary layer 600 are different, the contraction degree of the organic auxiliary layer 600 is large, so that the inorganic encapsulation layer 141 is also contracted. However, the inorganic encapsulation layer 141 has large hardness, so that it is pulled by the organic auxiliary layer 600 to form the first opening 401.

[0145] Optionally, because the existing process itself needs different temperatures for each step to meet the needs of different process steps, the operation of changing the temperature of the display panel 100 can reuse the existing process switching after the inorganic encapsulation layer is formed to change the temperature. Therefore, through this embodiment, the first opening for preventing cracks can be effectively formed without affecting other structures and without increasing process steps.

[0146] It can be understood that the present application only illustrates one first opening and the manufacturing of the first opening, but the present application is not limited thereto. The number of first openings can be set to multiple according to needs. Furthermore, the multiple first openings can be arranged in a similar spaced manner as described above, and are arranged in a nested manner.

[0147] The application further provides a display device comprising the display panel provided by the application. Figure 15 As shown in the figure, Figure 15 FIG. 1 is a structural schematic diagram of a display device provided by an embodiment of the application. The display device 1000 comprises the display panel 100 provided by any of the above embodiments of the application. Figure 15 The embodiment only takes a mobile phone as an example to describe the display device 1000. It can be understood that the display device provided by the embodiment of the application can be a computer, a television, a vehicle-mounted display device or other display devices having a display function, and the application does not specifically limit this. The display device provided by the embodiment of the application has the beneficial effects of the display panel provided by the embodiment of the application, and specific descriptions can be referred to the specific descriptions of the display panel in the above embodiments. The embodiment will not be described here again.

[0148] The above is a further detailed description of the application in combination with specific preferred embodiments, and the specific implementation of the application cannot be limited to these descriptions. For ordinary skilled persons in the technical field of the application, some simple deductions or replacements can be made without departing from the concept of the application, and all of them should be regarded as falling within the protection scope of the application.

Claims

1. A display panel, characterized by, The display panel is divided into a display area and a non-display area surrounding the display area; The display panel comprises: a substrate; an array layer on the substrate, the array layer comprising a first inorganic insulating layer, the first inorganic insulating layer comprising at least one first recess in the non-display area; a light-emitting functional layer on the array layer; a thin-film encapsulation layer on the light-emitting functional layer, wherein the display panel further comprises an organic auxiliary layer, at least part of the organic auxiliary layer filling the first recess; the thin-film encapsulation layer comprising at least one inorganic encapsulation layer, the inorganic encapsulation layer covering the display area and extending to, contacting the organic auxiliary layer in the first recess; the inorganic encapsulation layer comprising a first opening penetrating the inorganic encapsulation layer, the first opening overlapping the organic auxiliary layer in the first recess.

2. The display panel of claim 1, wherein, The substrate is of an organic material, the first recess exposes the substrate, and the organic auxiliary layer is in contact with the substrate.

3. The display panel of claim 1, wherein, The first inorganic insulating layer further comprises a plurality of first protrusions in the first recess, the first protrusions being of the same layer and material as the first inorganic insulating layer, and the organic auxiliary layer covering the first protrusions.

4. The display panel of claim 3, wherein, The first protrusions have a spacing therebetween, and the organic auxiliary layer fills the spacing; The spacing comprises a first spacing and a second spacing, the first spacing being larger than the second spacing, and the first opening being on the organic auxiliary layer in the first spacing.

5. The display panel of claim 4, wherein, The size of the first spacing is 2-8 μm larger than the size of the second spacing.

6. The display panel of claim 4, wherein, The size of the first spacing ranges from 3 μm to 10 μm.

7. The display panel of claim 4, wherein, Along a direction from the first spacing to both sides of the first recess, the size of the first protrusions gradually increases.

8. The display panel of claim 4, wherein, The distance from at least one of the first spacings to a side wall of the first recess near the display area is smaller than the distance from the first spacing to a side wall of the first recess near the non-display area.

9. The display panel of claim 3, wherein, The first recess surrounds the display area, the first protrusions surround the display area, and the first protrusions are arranged in sequence along a direction from the display area to the non-display area.

10. The display panel of claim 3, wherein, The first recess is strip-shaped extending along a direction of an edge of the display panel adjacent to the first recess, and the first protrusions extend along the first recess.

11. The display panel of claim 10, wherein, At least one end of the first recess extends to a cutting edge of the display panel.

12. The display panel of claim 1, wherein, The array layer comprises a buffer layer, an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, and a source-drain metal layer arranged in layers; The first inorganic insulating layer is a combination of one or more of the buffer layer, the gate insulating layer, and the interlayer insulating layer.

13. The display panel of claim 12, wherein, Further comprising a planarization layer between the array layer and the light-emitting functional layer; The light-emitting functional layer further comprises a pixel definition layer; The organic auxiliary layer is of the same layer and material as the planarization layer and / or the pixel definition layer.

14. The display panel of claim 1, wherein, The display panel comprises at least one first bending area, and a bending axis of the first bending area extends along the first recess.

15. A display device comprising: The display panel of any one of claims 1-14. The display panel of any one of claims 1-14.

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