Display panel and display device

Abstract

An embodiment of the present application provides a display panel and a display device, wherein the display panel has a display area and a non-display area surrounding the display area, wherein the non-display area includes a frame area, and the display panel includes a display substrate, wherein the display substrate includes a substrate layer, a driving layer, a display layer, and a packaging layer stacked in sequence; a touch layer located on one side of the packaging layer, wherein the touch layer is provided with touch electrodes and touch traces connected to the touch electrodes, wherein the touch electrodes are located in the display area; a driving circuit arranged in the non-display area; and a wire-through hole, wherein the wire-through hole is located in the frame area, and the display substrate further includes a first metal layer, wherein the first metal layer is provided with metal leads, wherein the touch traces are connected to the metal leads through the wire-through holes, and wherein the metal leads are used to be connected to the driving circuit.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] At present, with the rapid development of the OLED (Organic Light-Emitting Diode) display industry, a large number of new display devices are gradually pouring into the market. In order to obtain a larger screen-to-body ratio and provide customers with a good visual experience, narrowing the frame has become an important development direction of display panels.

[0003] The display panel generally includes a display substrate and a touch layer, and the touch layer is located above the packaging layer of the display substrate. The touch layer includes touch electrodes and touch traces, and the touch traces are used to connect the touch electrodes and the driving circuit to realize the touch function of the display panel. However, the touch traces are usually laid out in the border area of ​​the touch layer, which greatly limits the further development of the narrow border of the display panel and does not conform to the development trend of narrow borders of display devices. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a display panel and a display device to achieve a narrow frame of the display panel and the display device. The specific technical solution is as follows:

[0005] An embodiment of the first aspect of the present application provides a display panel, wherein the display panel has a display area and a non-display area surrounding the display area, wherein the non-display area includes a frame area, and the display panel includes: a display substrate, wherein the display substrate includes a substrate layer, a drive layer, a display layer, and a packaging layer stacked in sequence; a touch layer, located on a side of the packaging layer away from the substrate layer, wherein the touch layer is provided with touch electrodes and touch traces connected to the touch electrodes, wherein the touch electrodes are located in the display area; a drive circuit, which is arranged in the non-display area; and a wire hole, wherein the wire hole is located in the frame area, wherein the display substrate also includes a first metal layer, wherein the first metal layer is provided with metal leads, wherein the touch traces are connected to the metal leads through the wire holes, and wherein the metal leads are used to be connected to the drive circuit.

[0006] The display panel of the embodiment of the present application is provided with a wire hole in the frame area, so that the touch line connected to the touch electrode is connected to the metal lead of the first metal layer through the wire hole, and the metal lead is connected to the driving circuit, so that the touch signal between the touch electrode and the driving circuit is transmitted through the touch line and the metal lead. In the related art, the encapsulation layer generally includes an organic encapsulation layer. The thickness consistency of the organic encapsulation layer in the frame area is poor, and there is a leveling slope. The touch line will extend in a direction parallel to the leveling slope and in a direction perpendicular to the leveling slope during the process of connecting to the driving circuit. However, the touch line extending in a direction perpendicular to the leveling slope is prone to short circuit or open circuit. Therefore, in the related art, the flatness of the organic encapsulation layer in the frame area is required to be high. Accordingly, in order to ensure the flatness of the organic encapsulation layer and the safe wiring space of the touch line, the design size of the frame area is relatively large. Compared with the related art, the embodiment of the present application sets a wire hole so that the touch line enters the wire hole in a direction parallel to the leveling slope and then connects with the metal lead, thereby preventing the touch line from extending in a direction perpendicular to the leveling slope on the packaging layer, reducing the impact of the leveling slope on the touch line, thereby reducing the flatness requirements of the packaging layer in the frame area and reducing the size of the frame area. In addition, since the first metal layer is located on the display substrate, the metal lead can be located not only in the frame area but also in the display area, thereby further reducing the frame size and reducing the wiring difficulty of the touch line and the metal lead.

[0007] In some embodiments of the present application, the display panel also includes a first isolation dam, a second isolation dam and a crack dam arranged around the display area, the first isolation dam, the second isolation dam and the crack dam are located in the non-display area, the second isolation dam is located on a side of the first isolation dam away from the display area, the crack dam is located on a side of the second isolation dam away from the display area, and the wire hole is located between the second isolation dam and the crack dam.

[0008] In some embodiments of the present application, the substrate layer includes a first liner and a second liner, and the first metal layer is located between the first liner and the second liner.

[0009] In some embodiments of the present application, the display panel also includes a second metal layer, the second metal layer is located at the driving layer, the via hole includes a first via hole and a second via hole, the touch line is overlapped with the second metal layer through the first via hole, and the second metal layer is overlapped with the first metal layer through the second via hole.

[0010] In some embodiments of the present application, the driving layer includes a first insulating layer, a second insulating layer, an interlayer dielectric layer and a planarizing layer that are stacked together, and the second metal layer is located between the first insulating layer and the second insulating layer, or the second metal layer is located between the second insulating layer and the interlayer dielectric layer.

[0011] In some embodiments of the present application, the display panel includes a second metal layer and a third metal layer, the second metal layer and the third metal layer are located in the driving layer, the via holes include a first via hole, a second via hole and a third via hole, the touch line is overlapped with the third metal layer through the first via hole, the third metal layer is overlapped with the second metal layer through the second via hole, and the second metal layer is overlapped with the first metal layer through the third via hole.

[0012] In some embodiments of the present application, the driving layer includes a first insulating layer, a second insulating layer, an interlayer dielectric layer and a planarizing layer that are stacked together, the second metal layer is located between the first insulating layer and the second insulating layer, and the third metal layer is located between the second insulating layer and the interlayer dielectric layer.

[0013] In some embodiments of the present application, the driving layer is provided with a thin film transistor in the display area, and the thin film transistor includes a gate, an active area, a source and a drain, and the source and the drain are connected to the active area through vias provided in the first insulating layer, the second insulating layer and the interlayer dielectric layer.

[0014] In some embodiments of the present application, the non-display area also includes a bending area and a binding area adjacent to the bending area, the bending area is located on a side of the frame area away from the display area, the binding area is located on a side of the bending area away from the frame area, the driving circuit is located in the binding area, the bending area is provided with a signal lead, the signal lead is connected to the driving circuit, the signal lead is used to transmit signals, and the signal lead is arranged on the same layer as the metal lead.

[0015] An embodiment of a second aspect of the present application provides a display device, comprising a display panel according to any of the above embodiments.

[0016] The display device of the embodiment of the present application includes a display panel, and the display panel is provided with a wire hole in the frame area, so that the touch line connected to the touch electrode is connected to the metal lead of the first metal layer through the wire hole, and the metal lead is connected to the driving circuit, so that the touch signal between the touch electrode and the driving circuit is transmitted through the touch line and the metal lead. In the related art, the encapsulation layer generally includes an organic encapsulation layer, and the thickness consistency of the organic encapsulation layer in the frame area is poor, and there is a leveling slope. The touch line will extend in a direction parallel to the leveling slope and in a direction perpendicular to the leveling slope during the process of connecting to the driving circuit, but the touch line extending in a direction perpendicular to the leveling slope is prone to short circuit or open circuit. Therefore, in the related art, the flatness of the organic encapsulation layer in the frame area is required to be high. Accordingly, in order to ensure the flatness of the organic encapsulation layer and the safe wiring space of the touch line, the design size of the frame area is relatively large. Compared with the related art, the embodiment of the present application sets a wire hole so that the touch line enters the wire hole in a direction parallel to the leveling slope and then connects with the metal lead, thereby preventing the touch line from extending in a direction perpendicular to the leveling slope on the packaging layer, reducing the impact of the leveling slope on the touch line, thereby reducing the flatness requirements of the packaging layer in the frame area and reducing the size of the frame area. In addition, since the first metal layer is located on the display substrate, the metal lead can be located not only in the frame area but also in the display area, thereby further reducing the frame size and reducing the wiring difficulty of the touch line and the metal lead. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0018] Figure 1 A schematic diagram of a display panel according to an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the wiring of a display panel according to an embodiment of the present application;

[0020] Figure 3 A cross-sectional view of a display panel at a point BB of the first embodiment of the present application;

[0021] Figure 4 is a cross-sectional view of a display panel at a position DD of the first embodiment of the present application;

[0022] Figure 5 A cross-sectional view of a display panel at a point BB of a second embodiment of the present application;

[0023] Figure 6 A cross-sectional view of a display panel at a point BB according to a third embodiment of the present application;

[0024] Figure 7 A cross-sectional view of a display panel at a point BB according to a fourth embodiment of the present application;

[0025] Figure 8 It is a cross-sectional view of the display panel at CC according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0027] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of the present application provides a display panel 10. The display panel 10 has a display area AA and a non-display area surrounding the display area AA, and the non-display area includes a frame area BA. The display panel 10 includes a display substrate, a touch layer 500, a drive circuit 900, and a through hole 700. The display substrate includes a substrate layer 100, a drive layer 200, a display layer 300, and a packaging layer 400 stacked in sequence. The touch layer 500 is located on a side of the packaging layer 400 away from the display layer 300, and the touch layer 500 is provided with a touch electrode 510 and a touch line 520 connected to the touch electrode 510. The touch electrode 510 is located in the display area AA. The drive circuit 900 is arranged in the non-display area. The through hole 700 is located in the frame area BA, and the display substrate also includes a first metal layer 600, and the first metal layer 600 is provided with a metal lead, and the touch line 520 is connected to the metal lead through the through hole 700, and the metal lead is used to connect to the drive circuit 900.

[0028] The display panel 10 of the embodiment of the present application is provided with a wire hole 700 in the frame area BA, so that the touch wiring 520 connected to the touch electrode 510 is connected to the metal lead of the first metal layer 600 through the wire hole 700, and the metal lead is connected to the driving circuit 900, so that the touch signal between the touch electrode 510 and the driving circuit 900 is transmitted via the touch wiring 520 and the metal lead. In the related art, the encapsulation layer 400 generally includes an organic encapsulation layer 402. The thickness consistency of the organic encapsulation layer 402 in the border area BA is poor, and there is a leveling slope. The touch line 520 will extend in a direction parallel to the leveling slope and in a direction perpendicular to the leveling slope during the connection to the drive circuit 900. However, the touch line 520 extending in a direction perpendicular to the leveling slope is prone to short circuit or open circuit. Therefore, in the related art, the flatness of the organic encapsulation layer 402 in the border area BA is required to be high. Accordingly, in order to ensure the flatness of the organic encapsulation layer 402 and the safe wiring space of the touch line 520, the design size of the border area BA is larger. Compared with the related art, the embodiment of the present application sets the wire hole 700 so that the touch line 520 enters the wire hole 700 in a direction parallel to the leveling slope and then connects with the metal lead, thereby preventing the touch line 520 from extending in a direction perpendicular to the leveling slope on the packaging layer 400, reducing the impact of the leveling slope on the touch line 520, thereby reducing the flatness requirements of the packaging layer 400 in the frame area BA, and reducing the size of the frame area BA. In addition, since the first metal layer 600 is located on the display substrate, the metal lead can be located not only in the frame area BA, but also in the display area AA, thereby further reducing the size of the frame area BA and reducing the wiring difficulty of the touch line 520 and the metal lead.

[0029] In some embodiments of the present application, the touch layer 500 is directly formed on the display substrate using the Flexible Multilayer OnCell (FMLOC) technology. The touch layer 500 may include a touch metal layer, a touch insulating layer 503, a barrier layer 501, and a protective film layer 505, etc. These film layers are directly made on the encapsulation layer 400 of the display substrate through processes such as deposition, exposure, development, and etching, thereby achieving integration with the display substrate, which is conducive to the thinning of the display device. Among them, the touch metal layer is used to form a touch electrode 510 in the display area AA and a touch trace 520 in the frame area BA.

[0030] In other embodiments of the present application, the touch layer 500 may also have more film layers or fewer film layers, as long as it includes the necessary touch metal layer for forming the touch electrodes 510 and the touch traces 520 .

[0031] like Figure 1 and Figure 2As shown, in some embodiments of the present application, the touch electrode 510 includes a touch transmitting electrode 511 and a touch receiving electrode 512, and the touch transmitting electrode 511 and the touch receiving electrode 512 are insulated and cross-arranged. The touch trace 520 includes a first touch trace 521 and a second touch trace 522, and the metal lead includes a first metal lead 601 and a second metal lead 602. One end of the first touch trace 521 is connected to the touch transmitting electrode 511, and the other end of the first touch trace 521 is connected to the first metal lead 601. The first touch trace 521 extends to the wire hole 700 in the vertical direction. One end of the second touch trace 522 is connected to the touch receiving electrode 512, and the other end of the second touch trace 522 is connected to the second metal lead 602. The second touch trace 522 extends to the wire hole 700 in the horizontal direction. In the embodiment of the present application, the touch function is realized by the mutual capacitance touch principle. Specifically, when the user touches the touch layer 500, the capacitance between the touch transmitting electrode 511 and the touch receiving electrode 512 at the touch position will change, and the driving circuit 900 transmits a transmitting signal to the touch transmitting electrode 511 through the first metal lead 601 and the first touch wiring 521, and receives a signal from the touch receiving electrode 512 through the second touch wiring 522 and the second metal lead 602, thereby obtaining the capacitance value of the intersection of the touch transmitting electrode 511 and the touch receiving electrode 512, that is, the capacitance value of the two-dimensional plane of the entire display panel 10, and calculates the coordinates of the touch point according to the change in the capacitance value, thereby realizing the touch function.

[0032] Specifically, Figure 8 As shown, in the display area AA, the touch layer 500 includes a buffer layer 501, a first touch metal layer 502, a touch insulating layer 503, a second touch metal layer 504 and a protective film layer 505. The touch transmitting electrode 511 and the touch receiving electrode 512 are located on the second touch metal layer 504, and the touch transmitting electrode 511 and the touch receiving electrode 512 are insulated and cross-arranged on the second touch metal layer 504. The touch receiving electrode 512 is directly connected on the second touch metal layer 504, and the touch transmitting electrode 511 is connected through the first touch metal layer 502. The first touch metal layer 502 is used to form a bridge layer. The first touch wiring 521 is formed by the first touch metal layer 502 and the second touch metal layer 504 in the non-display area, and the second touch wiring 522 is formed by the first touch metal layer 502 and the second touch metal layer 504 in the non-display area, so that the diameter of the touch wiring 520 is larger and the impedance is reduced.

[0033] like Figures 3 to 7As shown, in some embodiments of the present application, the display panel 10 also includes a first isolation dam 800, a second isolation dam 801 and a crack dam 802 arranged around the display area AA, the first isolation dam 800, the second isolation dam 801 and the crack dam 802 are located in the non-display area, the second isolation dam 801 is located on the side of the first isolation dam 800 away from the display area AA, the crack dam 802 is located on the side of the second isolation dam 801 away from the display area AA, and the wire hole 700 is located between the second isolation dam 801 and the crack dam 802. In the embodiment of the present application, the organic encapsulation layer 402 is blocked by setting a first isolation dam 800, and the organic encapsulation layer 402 is further blocked by setting a second isolation dam 801 to prevent the organic encapsulation layer 402 from crossing the first isolation dam 800. The crack dam 802 is set to prevent the crack in the non-display area from extending to the display area AA. The line hole 700 is set between the second isolation dam 801 and the crack dam 802, so that the line hole 700 does not need to pass through the encapsulation layer 400 during processing, and there are fewer film layers at the location of the line hole 700, which is convenient for processing.

[0034] Specifically, the first isolation dam 800 and the second isolation dam 801 are protrusions with a certain height. In a specific embodiment, the driving layer 200 includes a flat layer 204, the display layer 300 includes a pixel definition layer 301 and a spacer 302, and the encapsulation layer 400 includes a first inorganic encapsulation layer 401, an organic encapsulation layer 402 and a second inorganic encapsulation layer 403 arranged in a stacked manner. The first isolation dam 800 is formed by superimposing the pixel definition layer 301 and the spacer 302 of the display layer 300. Since the organic encapsulation layer 402 usually has a certain fluidity, the main function of the first isolation dam 800 is to block the organic matter in the encapsulation layer 400. The second isolation dam 801 is formed by superimposing the flat layer 204 of the driving layer 200, the pixel definition layer 301 of the display layer 300 and the spacer 302. The second isolation dam 801 is used to further block the organic encapsulation layer 402 to prevent the organic encapsulation layer 402 from crossing the first isolation dam 800. The crack dam 802 includes a plurality of cutting channels, and the crack dam 802 is provided to prevent the cracks in the non-display area from extending to the display area AA.

[0035] In some embodiments of the present application, the substrate layer 100 includes a first liner 101 and a second liner 102, and the first metal layer 600 is located between the first liner 101 and the second liner 102. In the embodiment of the present application, by disposing the first metal layer 600 between the first liner 101 and the second liner 102, the arrangement of the metal lead is facilitated.

[0036] The first liner 101 and the second liner 102 may be formed of a flexible insulating material, for example, a polymer material such as polyimide, polycarbonate, polyethersulfone, polyethylene terephthalate, polyethylene naphthalate, polyarylate, or glass fiber reinforced plastic.

[0037] Furthermore, the substrate layer 100 may further include a buffer layer 103 , and the buffer layer 103 is used to block water oxygen and alkaline ions.

[0038] like Figure 5 and Figure 6 As shown, in some embodiments of the present application, the display panel 10 further includes a second metal layer 610, the second metal layer 610 is located in the driving layer 200, the wire-through hole 700 includes a first wire-through hole and a second wire-through hole, the touch wiring 520 overlaps with the second metal layer 610 through the first wire-through hole, and the second metal layer 610 overlaps with the first metal layer 600 through the second wire-through hole. In the embodiment of the present application, by providing the second metal layer 610, the first wire-through hole and the second wire-through hole are shorter in the direction perpendicular to the display panel 10, which is conducive to improving the processing accuracy of the wire-through hole 700.

[0039] like Figure 6 and Figure 8 As shown, in some embodiments of the present application, the driving layer 200 includes a first insulating layer 201, a second insulating layer 202, an interlayer dielectric layer 203, and a planar layer 204 which are stacked in sequence, and the second metal layer 610 is located between the first insulating layer 201 and the second insulating layer 202. Considering that in the display area AA, the driving layer 200 generally includes a thin film transistor 210, and the gate 211 of the thin film transistor 210 is generally arranged between the first insulating layer 201 and the second insulating layer 202, the second metal layer 610 is arranged between the first insulating layer 201 and the second insulating layer 202, so that the second metal layer 610 and the gate 211 are arranged in the same layer, thereby facilitating the processing of the second metal layer 610.

[0040] like Figure 5 and Figure 8 As shown, in some embodiments of the present application, the driving layer 200 includes a first insulating layer 201, a second insulating layer 202, an interlayer dielectric layer 203, and a planar layer 204 which are stacked in sequence, and the second metal layer 610 is located between the second insulating layer 202 and the interlayer dielectric layer 203. Considering that in the display area AA, the driving layer 200 generally includes a capacitor electrode 220 for storing charges, and the capacitor electrode 220 is generally arranged between the second insulating layer 202 and the interlayer dielectric layer 203, the second metal layer 610 is arranged between the second insulating layer 202 and the interlayer dielectric layer 203, so that the second metal layer 610 and the capacitor electrode 220 are arranged in the same layer, thereby facilitating the processing of the second metal layer 610.

[0041] Specifically, the first insulating layer 201, the second insulating layer 202 and the interlayer dielectric layer 203 may be made of materials such as silicon nitride or silicon oxide, and may be a single layer or a multilayer structure of silicon nitride or silicon oxide. The planar layer 204 may be made of organic materials such as polyimide, acrylic or polyethylene terephthalate.

[0042] like Figure 7 As shown, in some embodiments of the present application, the display panel 10 includes a second metal layer 610 and a third metal layer 620, the second metal layer 610 and the third metal layer 620 are located in the display layer 200, the wire hole 700 includes a first wire hole, a second wire hole and a third wire hole, the touch line 520 overlaps with the third metal layer 620 through the first wire hole, the third metal layer 620 overlaps with the second metal layer 610 through the second wire hole, and the second metal layer 610 overlaps with the first metal layer 600 through the third wire hole. In the embodiment of the present application, by providing the second metal layer 610 and the third metal layer 620, the first wire hole, the second wire hole and the third wire hole are shorter in the direction perpendicular to the display panel 10, which is conducive to improving the processing accuracy of the wire hole 700.

[0043] In some embodiments of the present application, the driving layer 200 includes a first insulating layer 201, a second insulating layer 202, an interlayer dielectric layer 203, and a planar layer 204, which are sequentially stacked, the second metal layer 610 is located between the first gate insulating layer and the second gate insulating layer, and the third metal layer 620 is located between the second gate insulating layer and the interlayer dielectric layer 203. Thus, the second metal layer 610 and the third metal layer 620 are conveniently arranged.

[0044] like Figure 8 As shown, in some embodiments of the present application, the driving layer 200 is provided with a thin film transistor 210 in the display area AA, and the thin film transistor 210 includes a gate 211, an active area 212, a source 213 and a drain 214, and the source 213 and the drain 214 are connected to the active area 212 through vias provided in the first insulating layer 201, the second insulating layer 202 and the interlayer dielectric layer 203. In the embodiment of the present application, the organic light-emitting device 310 is controlled by providing the thin film transistor 210.

[0045] Specifically, the thin film transistor 210 may adopt a top gate structure, the active region 212 is arranged above the substrate layer 100, the first insulating layer 201 covers the active region 212, the gate 211 is arranged above the first insulating layer 201, the second insulating layer 202 covers the gate 211, the source 213 and the drain 214 are arranged above the interlayer dielectric layer 203, and the planar layer 204 covers the source 213 and the drain 214. The source 213 and the drain 214 are connected to the active region 212 through vias arranged in the first insulating layer 201, the second insulating layer 202 and the interlayer dielectric layer 203. The display layer 300 is provided with an organic light emitting device 310 in the display area AA, and the organic light emitting device 310 includes an anode 311, a light emitting layer 312 and a cathode 313. The anode 311 of the organic light emitting device 310 is connected to the drain 214 of the thin film transistor 210 through a via arranged in the planar layer 204.

[0046] In some embodiments of the present application, the thin film transistor 210 further includes a capacitor electrode 220 , and the capacitor electrode 220 and the gate 211 constitute a storage capacitor, and the storage capacitor is used to store charge, and the storage capacitor is used to keep the voltage unchanged when the display screen is refreshed.

[0047] Furthermore, the second metal layer 610 is disposed in the same layer as the gate electrode 211, and the third metal layer 620 is disposed in the same layer as the capacitor electrode 220. Thus, the second metal layer 610 and the gate electrode 211 can be formed through a single patterning process, and the second metal layer 610 and the capacitor electrode 220 can be formed through a single patterning process, thereby reducing the preparation process, saving costs, and also facilitating the thinning of the display device.

[0048] like Figure 1 and Figure 3 As shown, in some embodiments of the present application, the non-display area also includes a bending area BB and a binding area BC adjacent to the bending area BB, the bending area BB is located on the side of the frame area BA away from the display area AA, the binding area BC is located on the side of the bending area BB away from the frame area BA, the driving circuit 900 is located in the binding area BC, the bending area BB is provided with a signal lead, the signal lead is connected to the driving circuit 900, the signal lead is used to transmit the signal, and the signal lead is arranged in the same layer as the metal lead. In the related art, the signal lead is usually arranged in the same layer as the source 213 and the drain 214 of the display area AA, and the film layer of the bending area BB includes a substrate layer 100, a source and drain layer, a flat layer 204 and a pixel definition layer 301. Compared with the related art, in the embodiment of the present application, by arranging the signal lead and the metal lead in the same layer, the touch signal can be transmitted in the same layer between the metal lead and the signal lead, reducing the number of film layer jumps, which is conducive to reducing the lap resistance, improving the touch sensitivity and the process yield.

[0049] An embodiment of the second aspect of the present application provides a display device, which includes the display panel 10 of any one of the above embodiments.

[0050] The display device of the embodiment of the present application includes a display panel 10. The display panel 10 sets a wire hole 700 in the frame area BA, so that the touch wiring 520 connected to the touch electrode 510 is connected to the metal lead of the first metal layer 600 through the wire hole 700, and the metal lead is connected to the driving circuit 900, so that the touch signal between the touch electrode 510 and the driving circuit 900 is transmitted via the touch wiring 520 and the metal lead. In the related art, the encapsulation layer 400 generally includes an organic encapsulation layer 402. The thickness consistency of the organic encapsulation layer 402 in the border area BA is poor, and there is a leveling slope. The touch line 520 will extend in a direction parallel to the leveling slope and in a direction perpendicular to the leveling slope during the connection to the drive circuit 900. However, the touch line 520 extending in a direction perpendicular to the leveling slope is prone to short circuit or open circuit. Therefore, in the related art, the flatness of the organic encapsulation layer 402 in the border area BA is required to be high. Accordingly, in order to ensure the flatness of the organic encapsulation layer 402 and the safe wiring space of the touch line 520, the design size of the border area BA is larger. Compared with the related art, the embodiment of the present application sets the wire hole 700 so that the touch line 520 enters the wire hole 700 in a direction parallel to the leveling slope and then connects with the metal lead, thereby preventing the touch line 520 from extending in a direction perpendicular to the leveling slope on the packaging layer 400, reducing the impact of the leveling slope on the touch line 520, thereby reducing the flatness requirements of the packaging layer 400 in the frame area BA, and reducing the size of the frame area BA. In addition, since the first metal layer 600 is located on the display substrate, the metal lead can be located in the display area AA when routing, thereby further reducing the frame size and reducing the wiring difficulty of the touch line 520 and the metal lead.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0052] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0053] The above are only preferred embodiments of the present application and are not intended to limit the protection scope of the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application are included in the protection scope of the present application.

Claims

1. A display panel, comprising a display area and a non-display area surrounding the display area, wherein the non-display area includes a frame area, wherein: The display panel comprises: A display substrate, the display substrate comprising a substrate layer, a driving layer, a display layer and a packaging layer stacked in sequence; A touch layer, located on a side of the encapsulation layer away from the substrate layer, the touch layer being provided with touch electrodes and touch traces connected to the touch electrodes, the touch electrodes being located in the display area; A driving circuit, arranged in the non-display area; A wire-through hole, wherein the wire-through hole is located in the frame region, the display substrate further comprises a first metal layer, the first metal layer is provided with a metal lead, the touch control line is connected to the metal lead through the wire-through hole, and the metal lead is used to connect to the drive circuit; The display panel also includes a first isolation dam, a second isolation dam and a crack dam arranged around the display area, the first isolation dam, the second isolation dam and the crack dam are located in the non-display area, the second isolation dam is located on a side of the first isolation dam away from the display area, the crack dam is located on a side of the second isolation dam away from the display area, and the line hole is located between the second isolation dam and the crack dam.

2. The display panel according to claim 1, characterized in that: The substrate layer includes a first liner and a second liner, and the first metal layer is located between the first liner and the second liner.

3. The display panel according to claim 2, characterized in that: The display panel also includes a second metal layer, which is located on the drive layer. The via holes include a first via hole and a second via hole. The touch line is overlapped with the second metal layer through the first via hole, and the second metal layer is overlapped with the first metal layer through the second via hole.

4. The display panel according to claim 3, characterized in that: The driving layer includes a first insulating layer, a second insulating layer, an interlayer dielectric layer and a planar layer which are stacked, and the second metal layer is located between the first insulating layer and the second insulating layer, or the second metal layer is located between the second insulating layer and the interlayer dielectric layer.

5. The display panel according to claim 2, characterized in that: The display panel includes a second metal layer and a third metal layer, the second metal layer and the third metal layer are located in the driving layer, the via holes include a first via hole, a second via hole and a third via hole, the touch line is overlapped with the third metal layer through the first via hole, the third metal layer is overlapped with the second metal layer through the second via hole, and the second metal layer is overlapped with the first metal layer through the third via hole.

6. The display panel according to claim 5, characterized in that: The driving layer includes a first insulating layer, a second insulating layer, an interlayer dielectric layer and a planar layer which are stacked, the second metal layer is located between the first insulating layer and the second insulating layer, and the third metal layer is located between the second insulating layer and the interlayer dielectric layer.

7. The display panel according to claim 4 or 6, characterized in that: The driving layer is provided with a thin film transistor in the display area, and the thin film transistor includes a gate, an active area, a source and a drain. The source and the drain are connected to the active area through vias provided in the first insulating layer, the second insulating layer and the interlayer dielectric layer.

8. The display panel according to claim 1, characterized in that: The non-display area also includes a bending area and a binding area adjacent to the bending area, the bending area is located on a side of the frame area away from the display area, the binding area is located on a side of the bending area away from the frame area, the driving circuit is located in the binding area, the bending area is provided with a signal lead, the signal lead is connected to the driving circuit, the signal lead is used to transmit signals, and the signal lead is provided on the same layer as the metal lead.

9. A display device, characterized in that: The invention comprises a display panel according to any one of claims 1 to 8.

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