A method for mass transfer of mini-led and micro-led

Abstract

The application belongs to the technical field of display, and particularly relates to a mass transfer method of MiniLED and MicroLED, and the following scheme is provided, which comprises the following steps: S1, substrate film layer preparation: preparing a plate material of a substrate film layer, manufacturing a metal circuit on the plate material, and hollowing out the plate material; S2, substrate film layer unit preparation: preparing the plate material prepared in the step S1 and an LED and a bearing carrier plate; respectively manufacturing a top layer substrate film layer unit, a middle layer substrate film layer unit and a bottom layer substrate film layer unit; S3, top layer substrate film layer unit transfer: bonding a transfer carrier plate on the top of the top layer substrate film layer unit; and S4, substrate film layer unit transfer.The application realizes batch transfer of same-color LEDs, greatly improves the transfer efficiency, facilitates subsequent group operation on the completed single-color LED module, simplifies circuit design, improves production efficiency, and simultaneously realizes a flexible MiniLED / Micro LED display screen and a Mini LED transparent display.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a mass transfer method of MiniLED and MicroLED. BACKGROUND

[0002] The current market LED transfer technology is one by one or local one by one. This method is slow and cannot be repeated. In addition, the LED display is made on a substrate, which leads to complex wiring. Moreover, MicroLED display is three RGB colors, which increases the difficulty of transfer. The industry has at least three kinds of fine pick and place technologies: electrostatic force, van der Waals force and magnetic force, selective release, self-assembly and roll printing. However, the substrate is basically one kind, and the wiring is realized on one substrate. As a result, the three RGB color LED chips need to be selectively implanted. Moreover, the wiring of the substrate is multi-layered, and the production and repair efficiency is very low. Therefore, a mass transfer method of MiniLED and MicroLED is needed. SUMMARY

[0003] The mass transfer method of MiniLED and MicroLED solves the problems in the prior art.

[0004] In order to achieve the above purpose, the present application adopts the following technical scheme:

[0005] A mass transfer method of MiniLED and MicroLED, comprising the following steps:

[0006] S1 substrate film layer preparation:

[0007] Prepare the plate material of the substrate film layer, make metal lines on the plate material, and hollow out the plate material;

[0008] S2 substrate film layer unit preparation:

[0009] Prepare the plate material prepared in S1 step, LED and bearing carrier plate;

[0010] Respectively make top layer substrate film layer unit, middle layer substrate film layer unit and bottom layer substrate film layer unit;

[0011] S3 top layer substrate film layer unit transfer:

[0012] Bond the transfer carrier plate on the top of the top layer substrate film layer unit;

[0013] S4 substrate film layer unit transfer:

[0014] aligning and transferring the substrate film layer units in sequence from top substrate film layer unit to middle substrate film layer unit to bottom substrate film layer unit to obtain the LED display screen;

[0015] S5 encapsulating the LED display screen obtained in S4, and peeling off the bottom carrier plate after encapsulation to realize flexible Mini / Micro LED display.

[0016] Preferably, in the S4 step:

[0017] aligning and connecting the top substrate film layer unit with the middle substrate film layer unit, and peeling off the bottommost carrier plate to form a combination 1;

[0018] aligning and connecting the combination 1 with the middle substrate film layer unit layer by layer in the above manner to form a combination N;

[0019] aligning and connecting the combination N with the bottom substrate film layer unit, and peeling off the topmost transfer carrier plate to obtain the product.

[0020] Preferably, in the S2 step:

[0021] fixing the plate of the top substrate film layer unit on the carrier plate, and then transferring the LED to the plate to form the top substrate film layer unit.

[0022] Preferably, in the S2 step:

[0023] fixing the plate of the middle substrate film layer unit on the carrier plate, and then transferring the LED to the plate to form the middle substrate film layer unit.

[0024] Preferably, in the S2 step:

[0025] fixing the plate of the bottom substrate film layer unit on the carrier plate, and then transferring the LED to the plate to form the bottom substrate film layer unit.

[0026] Preferably, in the S1 step:

[0027] determining the hollow sites on the plate of the substrate film layer, and taking the hollow sites on the plate of the upper substrate film layer as the alignment sites of the LED on the plate of the lower substrate film layer;

[0028] determining the mounting sites of the plate of the substrate film layer for carrying the LED.

[0029] Preferably, the metal lines on the plate are 1-2 layers.

[0030] Preferably, the same color LEDs are transferred to the plate during the transferring of the LED, and the color type is not limited.

[0031] Preferably, the plate material of the substrate film layer is hollowed out by laser, photoetching and or cutting, and the hollowing is free shape.

[0032] In the present application,

[0033] By hollowing out the upper substrate film layer, the hollowed position is aligned with the LED of the lower substrate film layer for installation, and the same color LED is transferred on the current substrate film layer during the transfer process, realizing batch transfer of the same color LED. In this process, the metal circuit on the substrate film layer can be reduced from multiple layers to one or two layers. During the transfer process, only one color chip is transferred each time, greatly improving the transfer efficiency. Because the installation space of the LED of other layers is hollowed out in the upper layer, it is convenient to perform grouping operation on the completed monochromatic LED module subsequently, simplifying the circuit design and improving the production efficiency.

[0034] Meanwhile, the top substrate film layer unit, the intermediate substrate film layer unit and the bottom substrate film layer unit are sequentially aligned and transferred to realize modular design, and the substrate film layer units are combined after batch production, and the transfer efficiency and quality of the LED are improved by positioning the bearing carrier plate and the transfer carrier plate. Meanwhile, flexible MiniLED / Micro LED display screen and Mini LED transparent display can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 The structure diagram of the single-layer substrate film layer provided for the first embodiment of the present application is shown in the figure.

[0036] Figure 2 The structure diagram of the top substrate film layer unit when the transfer carrier plate is loaded on the top of the top substrate film layer unit provided for the first embodiment of the present application is shown in the figure.

[0037] Figure 3 The structure diagram of the top substrate film layer unit when the bearing carrier plate is peeled off from the bottom of the top substrate film layer unit provided for the first embodiment of the present application is shown in the figure.

[0038] Figure 4 The structure diagram of the top substrate film layer unit and the intermediate substrate film layer unit provided for the second embodiment of the present application is shown in the figure.

[0039] Figure 5 The structure diagram of the top substrate film layer unit and the intermediate substrate film layer unit after being peeled off from the bottom provided for the second embodiment of the present application is shown in the figure.

[0040] Figure 6 The structure diagram of the intermediate substrate film layer unit provided for the second embodiment of the present application is shown in the figure.

[0041] Figure 7The structure schematic diagram of the top substrate film layer unit provided by the embodiment three of the application after being docked with the middle substrate film layer unit and being docked with the bottom substrate film layer unit;

[0042] Figure 8 The structure schematic diagram of the top substrate film layer unit provided by the embodiment three of the application after being docked with the middle substrate film layer unit and being docked with the bottom substrate film layer unit, and after the top substrate film layer unit is peeled off from the top;

[0043] Figure 9 The top view of the top substrate film layer unit provided by the embodiment three of the application after being docked with the middle substrate film layer unit and being docked with the bottom substrate film layer unit;

[0044] Figure 10 The structure schematic diagram of the top substrate film layer unit provided by the embodiment four of the application after being docked with the multi-layer middle substrate film layer unit and being docked with the bottom substrate film layer unit. DETAILED DESCRIPTION

[0045] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only some of the embodiments of the application, but not all the embodiments of the application.

[0046] Embodiment one:

[0047] Referring to Figures 1-3 , Figure 1 The structure schematic diagram of the top substrate film layer unit provided by the embodiment of the application, Figure 2 The structure schematic diagram of the top substrate film layer unit provided by the embodiment of the application when the transfer carrier plate is loaded on the top, Figure 3 The structure schematic diagram of the top substrate film layer unit provided by the embodiment of the application when the bearing carrier plate is peeled off from the bottom,

[0048] In the figure, C1 is the bearing carrier plate of the top substrate film layer unit;

[0049] J1 is the plate material of the top substrate film layer unit;

[0050] L1 is the LED of the top substrate film layer unit;

[0051] Y1 is the transfer carrier plate of the top substrate film layer unit.

[0052] Embodiment two:

[0053] Referring to Figures 4-6 , Figure 4 The structure schematic diagram of the top substrate film layer unit provided by the embodiment of the application after being docked with the middle substrate film layer unit, Figure 5 The structure schematic diagram of the top substrate film layer unit provided by the embodiment of the application after being docked with the middle substrate film layer unit and being docked with the bottom substrate film layer unit, and after the top substrate film layer unit is peeled off from the top,Figure 6 A structure schematic diagram of the intermediate substrate film layer unit provided by the embodiment of the present application is shown in the figure;

[0054] In the figure, C2 is the bearing carrier plate of the intermediate substrate film layer unit;

[0055] J2 is the plate material of the intermediate substrate film layer unit;

[0056] L2 is the LED of the intermediate substrate film layer unit;

[0057] Y2 is the transfer carrier plate of the intermediate substrate film layer unit.

[0058] Embodiment three:

[0059] Referring to Figures 7-9 , Figure 7 A structure schematic diagram of the top substrate film layer unit after being docked with the intermediate substrate film layer unit and being docked with the bottom substrate film layer unit is shown in the figure, Figure 8 A structure schematic diagram of the top substrate film layer unit after being docked with the intermediate substrate film layer unit and being docked with the bottom substrate film layer unit is shown in the figure, Figure 9 A top view of the top substrate film layer unit after being docked with the intermediate substrate film layer unit and being docked with the bottom substrate film layer unit is shown in the figure;

[0060] In the figure, C3 is the bearing carrier plate of the bottom substrate film layer unit;

[0061] J3 is the plate material of the bottom substrate film layer unit;

[0062] L3 is the LED of the bottom substrate film layer unit;

[0063] Y3 is the transfer carrier plate of the bottom substrate film layer unit.

[0064] Embodiment four:

[0065] Referring to Figure 10 , Figure 10 A structure schematic diagram of the top substrate film layer unit after being docked with the intermediate substrate film layer unit and being docked with the bottom substrate film layer unit is shown in the figure;

[0066] In the figure, C3 is the bearing carrier plate of the bottom substrate film layer unit;

[0067] JN is the plate material of the Nth intermediate substrate film layer unit;

[0068] LN is the LED of the Nth intermediate substrate film layer unit.

[0069] Embodiment five:

[0070] Confirming the mounting sites and the hollow sites on the top substrate film layer unit, the middle substrate film layer unit and the bottom substrate film layer unit;

[0071] When determining the mounting sites on the top substrate film layer unit, the middle substrate film layer unit and the bottom substrate film layer unit:

[0072] First, the mounting sites on the top substrate film layer unit and the bottom substrate film layer unit are determined separately, then the mounting sites on the bottom substrate film layer unit are determined according to the hollow sites on the lowermost middle substrate film layer unit, then the mounting sites on the lowermost middle substrate film layer unit are determined according to the newly added hollow sites on the adjacent middle substrate film layer unit, and then the mounting sites on the middle substrate film layer unit are determined in the above manner step by step.

[0073] When determining the hollow sites on the top substrate film layer unit, the middle substrate film layer unit and the bottom substrate film layer unit:

[0074] The hollow sites on the bottom substrate film layer unit are determined according to the total LED mounting sites on the middle substrate film layer unit and the top substrate film layer unit, and then the hollow sites on the top substrate film layer unit and the middle substrate film layer unit are determined in the above manner step by step.

[0075] Embodiment six:

[0076] A method for mass transfer of MiniLED and MicroLED, comprising the following steps:

[0077] S1 substrate film layer preparation:

[0078] Prepare a plate material for the substrate film layer, make metal lines on the plate material, and hollow the plate material;

[0079] S2 substrate film layer unit preparation:

[0080] Prepare the plate material prepared in S1 step, and the LED and the carrier carrier plate;

[0081] Prepare the plate material prepared in S1 step, and the LED and the carrier carrier plate;

[0082] S3 top substrate film layer unit transfer:

[0083] Bond the transfer carrier plate on the top of the top substrate film layer unit;

[0084] S4 substrate film layer unit transfer:

[0085] According to the order of the top substrate film layer unit to the middle substrate film layer unit to the bottom substrate film layer unit, the substrate film layer unit is transferred in sequence to obtain the LED display screen;

[0086] S5 encapsulates the LED display screen prepared in the S4 step, and after encapsulation, the carrier plate at the bottom is peeled off to realize the flexible Mini-Micro LED display.

[0087] Further, in the S4 step:

[0088] The top substrate film layer unit is connected to the middle substrate film layer unit in alignment, and the bottom carrier plate is peeled off to form a combination 1.

[0089] The combination 1 is connected to the middle substrate film layer unit in alignment in the above manner to form a combination N.

[0090] The combination N is connected to the bottom substrate film layer unit in alignment, and the top transfer carrier plate is peeled off to prepare the product.

[0091] Specifically, in the S2 step:

[0092] The plate material of the top substrate film layer unit is fixed on the carrier plate, and then the LED is transferred to the plate material to form the top substrate film layer unit.

[0093] In particular, in the S2 step:

[0094] The plate material of the middle substrate film layer unit is fixed on the carrier plate, and then the LED is transferred to the plate material to form the middle substrate film layer unit.

[0095] Remarkably, in the S2 step:

[0096] The plate material of the bottom substrate film layer unit is fixed on the carrier plate, and then the LED is transferred to the plate material to form the bottom substrate film layer unit.

[0097] In addition, in the S1 step:

[0098] The hollow sites on the plate material of the substrate film layer are determined, and the hollow sites on the plate material of the previous substrate film layer are used as the alignment sites of the LED on the plate material of the lower substrate film layer.

[0099] The mounting sites on the plate material of the substrate film layer are determined for carrying the LED.

[0100] In addition, the metal lines on the plate material are 1-2 layers.

[0101] Further, when the LED is transferred, the same color LED is transferred to the plate material, and the color type is not limited.

[0102] Preferably, the plate material of the substrate film layer is hollowed out by laser, photoetching, etching and / or cutting, and the hollowing is free shape.

[0103] The design is hollowed out by using the substrate film layer of the last layer, the hollowed-out position is used for aligning and installing the LED of the substrate film layer of the lower layer, the same color LED is transferred on the current substrate film layer in the transfer process, the batch transfer of the same color LED is realized, the metal circuit on the substrate film layer can be reduced from multiple layers to one layer or two layers in the process, the transfer efficiency is greatly improved because only the chip of one color is transferred each time in the transfer process, the installation space of the LED of other layers is hollowed out in the upper layer, the subsequent group operation of the completed monochromatic LED module is facilitated, the circuit design is simplified, and the production efficiency is improved.

[0104] Meanwhile, the substrate film layer units are sequentially aligned and transferred from the top layer substrate film layer unit to the middle layer substrate film layer unit to the bottom layer substrate film layer unit to realize the modular design, the substrate film layer units are made in batches and then combined, the positioning is realized by using the bearing carrier plate and the transfer carrier plate, the LED transfer efficiency and quality are improved, and the flexible MiniLED / Micro LED display screen and the Mini LED transparent display can be realized.

[0105] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0106] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0107] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A mass transfer method for MiniLEDs and MicroLEDs, characterized in that, Includes the following steps: Preparation of film layer on S1 substrate: Prepare a substrate film layer, fabricate metal lines on the substrate, and cut out the substrate. Determine the cutout points on the substrate film layer and use the cutout points of the upper substrate film layer as the alignment points of the LEDs on the lower substrate film layer. Determine the mounting points of the substrate film layer for supporting the LED; S2 substrate film layer unit fabrication: Prepare the substrate, LED, and carrier board prepared in step S1; The top substrate film layer unit, the middle substrate film layer unit, and the bottom substrate film layer unit are fabricated separately. S3 Top Substrate Film Layer Unit Transfer: A transfer carrier plate is bonded to the top of the top substrate film layer unit; S4 substrate film layer unit transfer: The LED display screen is fabricated by sequentially aligning and transferring the substrate film units in the order of top substrate film unit to middle substrate film unit to bottom substrate film unit. The top substrate film layer unit is aligned and connected with the middle substrate film layer unit, and the bottom support plate is peeled off to form assembly 1; Assembly 1 is aligned and connected to the intermediate substrate film layer unit layer by layer in the manner described above to form assembly N; The assembly N is aligned and connected with the bottom substrate film layer unit, and the top transfer carrier is peeled off to prepare the product. S5 encapsulates the LED display screen produced in step S4. After encapsulation, the bottom carrier board can be peeled off to realize a flexible Mini-Micro LED display.

2. The mass transfer method for MiniLEDs and MicroLEDs according to claim 1, characterized in that, In step S2: The top substrate film layer unit is fixed on the carrier plate, and then the LED is transferred onto the plate to form the top substrate film layer unit.

3. The mass transfer method for MiniLEDs and MicroLEDs according to claim 1, characterized in that, In step S2: The intermediate substrate film layer unit is fixed on the carrier plate, and then the LED is transferred onto the substrate to form the intermediate substrate film layer unit.

4. The mass transfer method for MiniLEDs and MicroLEDs according to claim 1, characterized in that, In step S2: The substrate of the bottom substrate film layer unit is fixed on the carrier plate, and then the LED is transferred onto the substrate to form the bottom substrate film layer unit.

5. The mass transfer method for MiniLEDs and MicroLEDs according to claim 1, characterized in that, The metal wiring on the plate has 1-2 layers.

6. The mass transfer method for MiniLEDs and MicroLEDs according to claim 2, characterized in that, During the LED transfer, LEDs of the same color are transferred to the substrate, and the color type is not limited.

7. The mass transfer method for MiniLEDs and MicroLEDs according to claim 1, characterized in that, The substrate film layer is formed by laser, photolithography, or cutting, and the cutout is free-form.

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