Display panel, manufacturing method thereof and display device

Abstract

The application discloses a display panel and a manufacturing method thereof, and a display device, and belongs to the technical field of display. The display panel comprises a substrate, an anode layer and a pixel definition layer. The anode layer comprises a plurality of anodes. The opening of the pixel definition layer exposes at least part of the anodes. The light-emitting part of the light-emitting layer is located in the opening. At least a first metal layer is arranged between the substrate and the anode layer. The first metal layer comprises a plurality of first metal parts. The orthographic projection of the first metal parts on the substrate at least partially overlaps the orthographic projection of the anodes on the substrate. At least a first organic layer is arranged between the first metal layer and the anode layer. The side surface of the first organic layer away from the substrate is a plane. The side of the first organic layer facing the first metal layer directly contacts the side of the first metal part facing the first organic layer. The manufacturing method of the display panel is used for manufacturing the above-mentioned display panel. The display device comprises the above-mentioned display panel. The application optimizes the film layer structure to improve the color dispersion phenomenon, and is beneficial to improving the display quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, more particularly, to a display panel, a manufacturing method thereof and a display device. BACKGROUND

[0002] OLED (organic light emitting diode) display has many advantages such as self-illumination, low driving voltage, high luminous efficiency, short response time, high contrast, wide viewing angle, wide temperature range of use, flexible display and large-area full-color display, and is considered as the most potential display in the industry.

[0003] With the development of display technology, the requirement for display effect is also higher and higher. OLED display products have many performance specifications such as power consumption, brightness, color coordinates, and color deviation is an important parameter. However, there are many factors affecting product color deviation. From the perspective of substrate design, the flatness of the planarization layer has a great influence on color deviation. Especially the signal lines made of the metal film layer under the organic light emitting material formed by evaporation, since the signal lines have a certain width and thickness, the cathode and anode directly above the signal lines and the evaporated organic light emitting material are prone to be uneven and not flat enough. When the ambient light penetrates the display panel, the uneven anode will cause the light to interfere with each other, causing color separation and dispersion, and the problem of display color deviation occurs.

[0004] Therefore, it is a technical problem to be solved by those skilled in the art to provide a display panel, a manufacturing method thereof and a display device which can improve the color deviation and dispersion phenomenon by optimizing the film layer structure. SUMMARY

[0005] Therefore, the present application provides a display panel, a manufacturing method thereof and a display device to solve the problem of display failure caused by the signal lines having a certain width and thickness under the organic light emitting material, which leads to the cathode and anode directly above the signal lines and the evaporated organic light emitting material being prone to be uneven and not flat enough.

[0006] The application discloses a display panel, comprising: a substrate; an anode layer, the anode layer is located on one side of the substrate, and the anode layer comprises a plurality of anodes; a pixel definition layer, the pixel definition layer is located on a side of the anode layer away from the substrate, the pixel definition layer comprises a plurality of openings, the openings overlap the projections of the anodes on the substrate, and the openings at least expose part of the anodes; a light-emitting layer, the light-emitting layer is located on a side of the pixel definition layer away from the substrate, and the light-emitting layer comprises a plurality of light-emitting parts located in the openings; at least a first metal layer is arranged between the substrate and the anode layer, the first metal layer comprises a plurality of first metal parts, and the projections of the first metal parts on the substrate at least partially overlap the projections of the anodes on the substrate; at least a first organic layer is arranged between the first metal layer and the anode layer, a surface of the first organic layer away from the substrate is a plane; a side of the first organic layer facing the first metal layer directly contacts a side of the first metal part facing the first organic layer.

[0007] Based on the same inventive concept, the application further discloses a manufacturing method of a display panel, which is used for manufacturing the display panel, and comprises the following steps: providing a substrate; manufacturing a first metal layer on one side of the substrate, so that the first metal layer comprises a plurality of first metal parts; manufacturing a first inorganic layer on a side of the first metal layer away from the substrate, so that the first inorganic layer covers the plurality of first metal parts; etching or grinding a surface of the first inorganic layer away from the substrate, so that the first inorganic layer exposes the first metal parts, forms a plurality of first inorganic parts filled between adjacent two first metal parts, and makes a surface of the first inorganic part away from the substrate flush with a surface of the first metal part away from the substrate; manufacturing a first organic layer on a side of the first inorganic layer away from the substrate, so that the first metal parts, the first inorganic parts and the first organic layer directly contact; manufacturing an anode layer on a side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, the projections of the anodes on the substrate at least partially overlap the projections of the first metal parts on the substrate; manufacturing a pixel definition layer on a side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, the openings overlap the projections of the anodes on the substrate, and the openings at least expose part of the anodes; and manufacturing a light-emitting layer on a side of the pixel definition layer away from the substrate, so that the light-emitting layer comprises a plurality of light-emitting parts located in the openings.

[0008] Based on the same inventive concept, the application further discloses a manufacturing method of the display panel, which is used for manufacturing the display panel and comprises the following steps: providing a substrate; manufacturing a third metal layer on one side of the substrate, so that the third metal layer comprises a plurality of third metal parts; manufacturing a third organic layer on the side of the third metal layer away from the substrate, so that the third organic layer covers the plurality of third metal parts; etching a plurality of grooves on the surface of the third organic layer away from the substrate, and manufacturing a first metal layer in the grooves, so that the first metal layer comprises a plurality of first metal parts, and the first metal parts are embedded in the grooves; the side of the third organic layer away from the substrate comprises a first surface outside the grooves, and the first surface is flush with the surface of the first metal parts away from the substrate; manufacturing a first organic layer on the side of the first metal layer away from the substrate, so that the first metal parts, the first surface of the third organic layer and the first organic layer are in direct contact; manufacturing an anode layer on the side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, the orthographic projection of the anodes on the substrate at least partially overlaps the orthographic projection of the first metal parts on the substrate, and the orthographic projection of the anodes on the substrate at least partially overlaps the orthographic projection of the third metal parts on the substrate; manufacturing a pixel definition layer on the side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, the orthographic projection of the openings on the substrate overlaps the orthographic projection of the anodes on the substrate, and the openings at least expose part of the anodes; and manufacturing a light-emitting layer on the side of the pixel definition layer away from the substrate, so that the light-emitting layer comprises a plurality of light-emitting parts, and the light-emitting parts are located in the openings.

[0009] Based on the same inventive concept, the application further discloses a manufacturing method of the display panel, which is used for manufacturing the display panel and comprises the following steps: providing a substrate; manufacturing a third metal layer on one side of the substrate, so that the third metal layer comprises a plurality of third metal parts; manufacturing a first sub-organic layer on the side of the third metal layer away from the substrate, so that the first sub-organic layer covers the plurality of third metal parts, and the surface of the first sub-organic layer away from the substrate is a plane; manufacturing a first metal layer on the side of the first sub-organic layer away from the substrate, so that the first metal layer comprises a plurality of first metal parts; manufacturing a second sub-organic layer on the side of the first metal layer away from the substrate, so that the second sub-organic layer comprises a plurality of second sub-organic parts, the second sub-organic parts are filled between two adjacent first metal parts, and the surface of the second sub-organic part away from the substrate is flush with the surface of the first metal part away from the substrate; manufacturing a first organic layer on the side of the first metal layer away from the substrate, so that the first metal part, the second sub-organic part and the first organic layer are in direct contact; manufacturing an anode layer on the side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, the orthographic projection of the anode on the substrate at least partially overlaps the orthographic projection of the first metal part on the substrate, and the orthographic projection of the anode on the substrate at least partially overlaps the orthographic projection of the third metal part on the substrate; manufacturing a pixel definition layer on the side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, the orthographic projection of the opening on the substrate overlaps the orthographic projection of the anode on the substrate, and the opening at least exposes part of the anode; and manufacturing a light-emitting layer on the side of the pixel definition layer away from the substrate, so that the light-emitting layer comprises a plurality of light-emitting parts, and the light-emitting parts are located in the openings.

[0010] Based on the same inventive concept, the application further discloses a display device comprising the display panel.

[0011] Compared with the prior art, the display panel, the manufacturing method thereof and the display device provided by the application at least have the following beneficial effects:

[0012] The first metal layer can form a plurality of first metal parts through a patterning process, and the orthographic projection of the first metal parts on the substrate at least partially overlaps the orthographic projection of the anode on the substrate. The first organic layer between the first metal layer and the anode layer at least includes a first organic layer made of an organic material. The first organic layer made of the organic material generally has high flatness, and the first organic layer made of the organic material has good dielectric constant, flatness and transmittance, so it can be used as an organic insulating layer for low dielectric. And in the prior art, in order to ensure the flatness of the organic layer, the thickness compensation is often used, that is, the thickness of the organic layer is increased to ensure the flatness, but in the prior art, due to the limitation of the manufacturing process of the organic layer, the thickness of the organic layer is generally limited. In the present application, since the side surface of the first organic layer away from the substrate is a plane, the thickness of the first organic layer can be appropriately reduced, that is, the first organic layer can be made without being too thick, so that the anode is made in a relatively flat environment, which is beneficial to reduce the overall thickness of the display panel and facilitate the design of thin type. In order to make the side surface of the first organic layer away from the substrate a plane, the side of the first organic layer facing the first metal layer can be directly contacted with the side of the first metal part facing the first organic layer, that is, there is no other film layer material between the first organic layer and the first metal part under the anode, which is beneficial to make the first organic layer a film layer with good flatness, that is, to make the side surface of the first organic layer away from the substrate a plane as much as possible, so that the anode has high flatness, and when the ambient light penetrates the display panel, the uneven anode causes the light to interfere with each other and the display color deviation problem, thereby improving the color deviation phenomenon and improving the display quality.

[0013] Of course, any product implementing the present application does not necessarily need to achieve all the technical effects described above at the same time.

[0014] Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0016] Figure 1 is a schematic view of a planar structure of a display panel provided by an embodiment of the present application;

[0017] Figure 2 is Figure 1 is a schematic view of a cross-sectional structure in the direction of A-A' in

[0018] Figure 3 is Figure 1 is a schematic view of a cross-sectional structure in the direction of B-B' in

[0019] Figure 4 is Figure 1 another cross-sectional structure schematic view in the direction of A-A’ in FIG. 4;

[0020] Figure 5 is Figure 1 another cross-sectional structure schematic view in the direction of B-B’ in FIG. 5;

[0021] Figure 6 is Figure 1 another cross-sectional structure schematic view in the direction of A-A’ in FIG. 6;

[0022] Figure 7 is Figure 1 another cross-sectional structure schematic view in the direction of B-B’ in FIG. 7;

[0023] Figure 8 is another planar structure schematic view of the display panel provided by the embodiments of the present application;

[0024] Figure 9 is Figure 8 a cross-sectional structure schematic view in the direction of C-C’ in FIG. 8;

[0025] Figure 10 is a flow chart of a manufacturing method of the display panel provided by the embodiments of the present application;

[0026] Figure 11 is Figure 10 a structure schematic view after manufacturing the first metal layer on one side of the substrate in the manufacturing method provided by the present application;

[0027] Figure 12 is Figure 10 a structure schematic view after manufacturing the first inorganic layer on the side of the first metal layer away from the substrate in the manufacturing method provided by the present application;

[0028] Figure 13 is Figure 10 a structure schematic view after forming the plurality of first inorganic parts in the manufacturing method provided by the present application;

[0029] Figure 14 is Figure 10 a structure schematic view after manufacturing the first organic layer on the side of the first metal part away from the substrate in the manufacturing method provided by the present application;

[0030] Figure 15 is Figure 10 a structure schematic view after manufacturing the plurality of anodes on the side of the first organic layer away from the substrate in the manufacturing method provided by the present application;

[0031] Figure 16 is Figure 10 a structure schematic view after forming the pixel definition layer including the opening in the manufacturing method provided by the present application;

[0032] Figure 17 is Figure 10 A schematic diagram of a film layer structure of a display panel prepared by the provided manufacturing method;

[0033] Figure 18 is a flowchart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0034] Figure 19 is Figure 18 A schematic diagram of a structure after the third metal layer is prepared on one side of the substrate in the provided manufacturing method;

[0035] Figure 20 is Figure 18 A schematic diagram of a structure after the third organic layer is prepared on the side, away from the substrate, of the third metal layer in the provided manufacturing method;

[0036] Figure 21 is Figure 18 A schematic diagram of a structure after the groove is formed on the side, away from the substrate, of the third organic layer in the provided manufacturing method;

[0037] Figure 22 is Figure 18 A schematic diagram of a structure after the first metal part is prepared in the groove of the third organic layer in the provided manufacturing method;

[0038] Figure 23 is Figure 18 A schematic diagram of a structure after the first organic layer is prepared on the side, away from the substrate, of the first metal layer in the provided manufacturing method;

[0039] Figure 24 is Figure 18 A schematic diagram of a structure after the multiple anodes are prepared on the side, away from the substrate, of the first organic layer in the provided manufacturing method;

[0040] Figure 25 is Figure 18 A schematic diagram of a structure after the pixel definition layer including the opening is formed in the provided manufacturing method;

[0041] Figure 26 is Figure 18 A schematic diagram of another film layer structure of a display panel prepared by the provided manufacturing method;

[0042] Figure 27 is a flowchart of another manufacturing method of a display panel provided by an embodiment of the present application;

[0043] Figure 28 is Figure 27 A schematic diagram of a structure after the first sub-organic layer is prepared on the side, away from the substrate, of the third metal layer in the provided manufacturing method;

[0044] Figure 29 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0045] Figure 30 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0046] Figure 31 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0047] Figure 32 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0048] Figure 33 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0049] Figure 34 is Figure 27 A structure schematic diagram of the display panel prepared by the manufacturing method provided in the embodiment of the present application is shown in FIG. 6.

[0050] Figure 35 is a flow chart of another manufacturing method of the display panel provided in the embodiment of the present application.

[0051] Figure 36 is a flow chart of another manufacturing method of the display panel provided in the embodiment of the present application.

[0052] Figure 37 is a plane structure schematic diagram of the display device provided in the embodiment of the present application. DETAILED DESCRIPTION

[0053] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0054] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way limiting to the scope of the application or its applications or uses.

[0055] Techniques, methods, and apparatus known to those of ordinary skill in the relevant art can not be discussed in detail herein, but should be considered as part of the specification, where appropriate.

[0056] In all of the examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not limiting. Thus, other examples of the exemplary embodiments can have different values.

[0057] It should be noted that like numerals and letters refer to like items throughout the drawings, and once an item is defined in one drawing, it need not be discussed further in subsequent drawings.

[0058] Reference should be made to both drawings together with the Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a planar structure of a display panel provided by an embodiment of the present application, Figure 2 is Figure 1 A-A' direction, the display panel 000 provided by the embodiment includes:

[0059] a substrate 10;

[0060] an anode layer 20, the anode layer 20 is located on one side of the substrate 10, and the anode layer 20 includes a plurality of anodes 201;

[0061] a pixel definition layer 30, the pixel definition layer 30 is located on a side of the anode layer 20 away from the substrate 10, and the pixel definition layer 30 includes a plurality of openings 30K, the openings 30K overlap the orthographic projection of the anodes 201 on the substrate 10, and the openings 30K expose at least part of the anodes 201;

[0062] an emitting layer 40, the emitting layer 40 is located on a side of the pixel definition layer 30 away from the substrate 10, and the emitting layer 40 includes a plurality of emitting portions 401, the emitting portions 401 are located within the openings 30K;

[0063] at least a first metal layer 50 is included between the substrate 10 and the anode layer 20, the first metal layer 50 includes a plurality of first metal portions 501, and the orthographic projection of the first metal portions 501 at least partially overlaps the orthographic projection of the anodes 201 on the substrate 10;

[0064] at least a first organic layer 60 is included between the first metal layer 50 and the anode layer 20, and a surface 60A of a side of the first organic layer 60 away from the substrate 10 is a plane;

[0065] a side of the first organic layer 60 facing the first metal layer 50 directly contacts a side of the first metal portions 501 facing the first organic layer 60.

[0066] Specifically, the display panel 000 provided in this embodiment can be an organic light emitting diode (OLED) display panel, and the display panel 000 at least includes a substrate 10 (not filled in the figure), which can be used as a bearing substrate for setting other film layer structures of the display panel 000. Optionally, the substrate 10 can be a hard material such as glass, etc., or can be a flexible material such as polyimide (PI), polycarbonate (PC), etc., or the substrate 10 can be any one of a transparent substrate, a translucent substrate or an opaque substrate, which is not limited in this embodiment. One side of the substrate 10 is provided with an anode layer 20, and the anode layer 20 can form a plurality of anodes 201 through a patterning process. Optionally, one side of the substrate 10 in this embodiment can also be provided with a driving circuit layer composed of a plurality of metal layers and insulating layers, and the plurality of metal layers of the driving circuit layer can be used to set a thin film transistor (which can be electrically connected with the anode 201, and used to transmit a driving signal of a pixel circuit to the anode 201), a signal trace (which can be used to provide a driving voltage signal for the pixel circuit, etc.), a capacitor device, etc., that is, the structure of the plurality of metal layers of the driving circuit layer can be used to form a driving circuit such as a pixel circuit, etc. which provides a driving signal for the display panel 000. In this embodiment, at least a first metal layer 50 is included between the substrate 10 and the anode layer 20, and the first metal layer 50 can be understood as a certain metal film layer in the driving circuit layer. The first metal layer 50 can form a plurality of first metal parts 501 through a patterning process, and the first metal parts 501 can be a gate, a source or a drain of a transistor, or can be a signal trace, etc., which is not specifically limited in this embodiment, and only needs to satisfy that the orthographic projection of the first metal part 501 in the first metal layer 50 at least partially overlaps with the orthographic projection of the anode 201 at the substrate 10, that is, the first metal part 501 in the first metal layer 50 is located below the anode 201. Optionally, the first metal layer 50 can be the metal layer closest to the anode layer 20, or the first metal layer 50 can be the metal layer closest to the anode layer 20 among the plurality of metal layers of the driving circuit layer, which is not specifically limited in this embodiment, and only needs to satisfy that at least one first metal part 501 in the first metal layer 50 at least partially overlaps with the orthographic projection of the anode 201 at the substrate 10. Optionally, the anode layer 20 in this embodiment can be formed of various conductive materials, such as a transparent anode or a reflective anode according to its own purpose. When the anode 201 is formed as a transparent anode, the material of the anode layer 20 can include indium tin oxide (ITO), etc.; when the anode 201 is formed as a reflective anode, the material of the anode layer 20 can include silver, magnesium, aluminum, etc. or other metal mixtures, which is not specifically limited in this embodiment.

[0067] The anode layer 20 of the embodiment is provided with a pixel definition layer 30 and a light-emitting layer 40 on the side away from the substrate 10, the pixel definition layer 30 includes a plurality of openings 30K, and the light-emitting layer 40 includes a plurality of light-emitting portions 401, the opening 30K is in the orthographic projection of the substrate 10 and overlaps the orthographic projection of the anode 201 on the substrate 10, the opening 30K at least exposes part of the anode 201 of the anode layer 20, the light-emitting portion 401 is formed in the opening 30K, and the pixel definition layer 30 is used to prevent color mixing and color mixing between two adjacent light-emitting portions 401, that is, the opening 30K of the pixel definition layer 30 is used to define the light-emitting portion 401 of the adjacent organic light-emitting material, so as to correspondingly separate the light-emitting portions 401 of various colors into relatively independent structures. Optionally, the display panel 000 can include a plurality of sub-pixels 00, one sub-pixel 00 can be provided corresponding to one light-emitting portion 401, and the plurality of sub-pixels 00 can include a plurality of different colors (represented by different fill patterns in the figure), such as at least red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels. Figure 1 The plurality of sub-pixels 00 can be arranged in an array on the display panel 000, or can also be arranged in other manners. The embodiment of the Figure 1 The embodiment of the Figure 1 The shape of the sub-pixel 00 includes but is not limited to the shape, and can be designed according to actual needs.

[0068] In the related art, generally, a signal trace or other metal structure is made directly below the anode, such as the first metal portion of the first metal layer in the embodiment, which is used as a signal trace or part of a transistor structure. The first metal portion generally has a certain width and thickness, resulting in uneven anodes and light-emitting portions directly above the first metal portion. When the display panel is in use, external ambient light penetrates the display panel, and the uneven anode causes interference between the light, resulting in color separation, color dispersion, or color deviation.

[0069] To solve the above problems, the embodiment is provided with at least a first organic layer 60 between the first metal layer 50 and the anode layer 20. The first organic layer 60 made of organic material is generally made by wet film forming method such as inkjet printing process. The first organic layer 60 obtained by the process has high flatness. The first organic layer 60 made of organic material has good dielectric constant, flatness and transmittance, and thus can be used as an organic insulating layer for low dielectric. The side surface 60A of the first organic layer 60 away from the substrate 10 is a plane. By optimizing the film layer structure under the anode 201, the side surface 60A of the first organic layer 60 away from the substrate 10 is relatively flat. After the pixel definition layer 30 is made, the anode layer 20 can be made on the relatively flat surface 60A of the first organic layer 60 in the opening 30K of the pixel definition layer 30, so that the anode 201 structure formed in the opening 30K is relatively flat. In the prior art, in order to ensure the flatness of the organic layer, the thickness of the organic layer is often compensated, that is, the thickness of the organic layer is increased to ensure the flatness. However, in the prior art, due to the limitation of the organic layer manufacturing process, the thickness of the organic layer is generally limited. In the embodiment, the side surface 60A of the first organic layer 60 away from the substrate 10 is a plane, so the thickness of the first organic layer 60 can be appropriately reduced, that is, the first organic layer 60 does not need to be too thick to make the anode 201 in a relatively flat environment, which is beneficial to reduce the overall thickness of the display panel 000 and is beneficial to realize thin design.

[0070] In order to make the side surface 60A of the first organic layer 60 away from the substrate 10 a plane, the side of the first organic layer 60 facing the first metal layer 50 can be directly in contact with the side of the first metal part 501 facing the first organic layer 60, that is, there is no other film layer material between the first organic layer 60 and the first metal part 501 under the anode 201, such as no other inorganic film layer between the first organic layer 60 and the first metal part 501. Optionally, the anode 201 and the first metal part 501 close to it in the general display panel 000 include an inorganic insulating film layer, in order to make the side of the first organic layer 60 facing the first metal layer 50 directly in contact with the side of the first metal part 501 facing the first organic layer 60, the first metal part 501 can be exposed after the inorganic insulating film layer is formed on the first metal layer 50, and the inorganic insulating material above the first metal part 501 is etched away, or other process technology can also be used to expose the first metal part 501, so that the side of the first organic layer 60 facing the first metal layer 50 can be directly in contact with the first metal part 501, and the surface of the film layer before the first organic layer 60 is made can also be relatively flat (because part of the inorganic insulating material above the first metal part 501 has been etched away), which is beneficial to ensure that the first organic layer 60 is a film layer with good flatness, that is, the side surface 60A of the first organic layer 60 away from the substrate 10 is a plane as much as possible, which is beneficial to reduce the overall thickness of the display panel 000, facilitate the realization of thin design, and also make the anode 201 of the present embodiment have high flatness, avoid the problem that when ambient light penetrates the display panel 000, the uneven anode causes light to interfere with each other and display color deviation, thereby facilitating the improvement of color deviation and improving display quality.

[0071] It can be understood that the display panel 000 of the present embodiment includes but is not limited to the above-mentioned film layer structure, and can also include other film layer structures, such as other metal film layers in the driving circuit layer for making thin film transistors T or capacitor devices (not shown in the figure) and the like, or can also include a cathode layer 70 on the light-emitting layer 40 (such as Figure 3 , Figure 3 is Figure 1The cross-sectional structure of the middle B-B' direction (see FIG. 1C) can make the light-emitting part 401 form a stacked arrangement with the anode 201 and the cathode layer 70, and emit visible light by applying a voltage between the anode 201 and the cathode layer 70, so as to realize an image that can be recognized by a user. The cathode layer 70 in the embodiment can further be provided with a thin film encapsulation layer 80 away from the substrate 10. The thin film encapsulation layer 80 can be used to isolate water and oxygen, prevent water vapor and oxygen in the air from entering the light-emitting layer 40 and the metal film layer below, thereby causing damage to the components of the display panel 000, and can further include other film layer structures, which are not described herein in detail and can be understood with reference to the structure of an organic light-emitting display panel in the related art. Optionally, the thin film encapsulation layer 80 in the embodiment can include a multilayer stacked structure of inorganic, organic and inorganic, and the structure of the display panel is not described herein in detail and can be understood with reference to the structure of an organic light-emitting display panel in the related art.

[0072] In some optional embodiments, please continue to refer to Figures 1-3 In the embodiment, the first organic layer 60 and the substrate 10 further include a first inorganic layer 01, the first inorganic layer 01 includes a plurality of first inorganic parts 011, the first inorganic part 011 is not overlapped with the first metal part 501 in the orthographic projection of the substrate 10, the first inorganic part 011 is filled between two adjacent first metal parts 501, and the surface 011A of the first inorganic part 011 away from the substrate 10 is in direct contact with the first organic layer 60.

[0073] The surface of the first inorganic part 011 away from the substrate 10 (i.e., the surface 011A of the first inorganic part 011 away from the substrate 10) is flush with the surface 501A of the first metal part 501 away from the substrate 10.

[0074] The embodiment explains that the display panel 000 further comprises a first inorganic layer 01 between the first organic layer 60 and the substrate 10 in the manufacturing process. The first inorganic layer 01 can play a role of passivation and insulation to avoid short circuit between the first metal layer 50 and the anode layer 20 above it. The first inorganic layer 01 of the embodiment comprises a plurality of first inorganic parts 011. The first inorganic part 011 is not overlapped with the orthographic projection of the first metal part 501 on the substrate 10, that is, the first inorganic part 011 is filled between two adjacent first metal parts 501. Thus, there is no material of the first inorganic layer 01 between the side of the first metal part 501 facing the first organic layer 60 and the side of the first organic layer 60 facing the first metal layer 50. The side of the first organic layer 60 facing the first metal layer 50 can directly contact the side of the first metal part 501 facing the first organic layer 60. The surface 011A of the first inorganic part 011 facing the first organic layer 60 can also directly contact the side of the first organic layer 60 facing the first metal layer 50. That is, the side of the first metal part 501 and the side of the first inorganic part 011 away from the substrate 10 both directly contact the first organic layer 60. The first inorganic part 011 not only fills the gap between the first metal parts 501, but also plays a role of insulation together with the first organic layer 60. The surface 011A of the first inorganic part 011 away from the substrate 10 is flush with the surface 501A of the first metal part 501 away from the substrate 10 (indicated by a dashed line in the figure). The first organic layer 60 is manufactured on a film layer structure with high flatness. Thus, the surface 60A of the first organic layer 60 away from the substrate 10 is a plane. The subsequently manufactured anode 201 has high flatness. When ambient light penetrates the display panel 000, the uneven anode does not cause the problem of display color deviation caused by the interference between light. Thus, the color deviation phenomenon is improved and the display quality is improved.

[0075] It is understood that this embodiment only illustrates a portion of the film structure presented after the display panel 000 manufacturing process is completed. In the specific process implementation, the first inorganic layer 01 can first cover the entire surface of the first metal layer 50, which includes multiple first metal parts 501. Then, the first inorganic layer 01 above the first metal parts 501 is etched away by an etching process, so that the first inorganic layer 01 forms a structure that fills the first inorganic parts 011 between adjacent first metal parts 501, exposing the surface of the first metal parts 501 facing away from the substrate 10. Optionally, in order to avoid the problem of over-etching the first metal parts 501, the first metal layer 50 can be made thicker in advance to avoid over-etching the first metal parts 501 when etching the first inorganic layer 01, and to avoid the thinning of the first metal parts 501 affecting the use effect. Then, the first organic layer 60 is manufactured. Optionally, the manufacturing process of the first inorganic layer 01 can also involve directly filling the spaces between adjacent first metal portions 501 with the first inorganic material after the first metal layer 50 of the plurality of first metal portions 501 has been fabricated, forming a structure of the first inorganic layer 01 including a plurality of first inorganic portions 011, and then fabricating the first organic layer 60. Alternatively, other manufacturing processes may be used. This embodiment does not specifically limit the manufacturing process of the first inorganic layer 01; in specific implementation, the process can be selected and set according to actual needs.

[0076] In some alternative embodiments, please refer to the references. Figure 1 and Figure 4 , Figure 4 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction. In this embodiment, a second metal layer 90 is also included between the substrate 10 and the anode layer 20 of the display panel 000. The second metal layer 90 is located on the side of the first metal layer 50 facing the substrate 10. The second metal layer 90 includes a plurality of second metal portions 901. The orthographic projection of the second metal portion 901 on the substrate 10 at least partially overlaps with the orthographic projection of the anode 201 on the substrate 10.

[0077] At least a second inorganic layer 02, a second organic layer 100, and a third inorganic layer 03 are stacked between the second metal layer 90 and the first metal layer 50.

[0078] The second inorganic layer 02 covers a plurality of second metal parts 901, the second organic layer 100 is located on the side of the second inorganic layer 02 away from the substrate 10, and the third inorganic layer 03 is located on the side of the second organic layer 100 away from the substrate 10.

[0079] This embodiment explains that the anode layer 20 and the substrate 10 of the display panel 000 may also include other metal film layers, such as a second metal layer 90 located on the side of the first metal layer 50 facing the substrate 10, or other metal film layers may also be present. Figure 4 It is not indicated in the text. It is understandable that, as...Figure 5 As shown, Figure 5 is Figure 1 In the embodiment, the first metal layer 50 can be a metal film layer for manufacturing the source and drain of the thin film transistor T in the driving circuit layer. At this time, the second metal layer 90 can be a metal film layer for manufacturing the gate of the thin film transistor T in the driving circuit layer, or the second metal layer 90 can also be a metal film layer for manufacturing the electrode plate of the capacitor C in the driving circuit layer. The embodiment is not specifically limited, and only needs to satisfy that the second metal layer 90 is located on the side of the first metal layer 50 facing the substrate 10, and the second metal part 901 of the second metal layer 90 at least partially overlaps the orthographic projection of the anode 201 on the substrate 10, that is, the second metal part 901 is also located below the anode 201, which can affect the flatness of the anode 201. Therefore, the embodiment sets at least the second inorganic layer 02, the second organic layer 100, and the third inorganic layer 03 stacked between the second metal layer 90 and the first metal layer 50, which are used as an insulating film layer between the first metal layer 50 and the second metal layer 90. The setting of the second organic layer 100 can also make the first metal layer 50 have a higher flatness before being manufactured, and the third inorganic layer 03, wherein the second inorganic layer 02 covers a plurality of second metal parts 901 to protect each second metal part 901 while ensuring insulation effect with other conductive metal film layers. The second organic layer 100 is located on the side of the second inorganic layer 02 away from the substrate 10. The second organic layer 100 can be relatively flat due to its own process and the performance of the organic material. Therefore, when the third inorganic layer 03 and the first metal layer 50 are manufactured on the side of the second organic layer 100 away from the substrate 10, good flatness can be ensured. The third inorganic layer 03 of the embodiment can improve the adhesion between the metal conductive material of the first metal layer 50 and the inorganic material of the third inorganic layer 03, which is beneficial to ensuring the stability of each film layer of the display panel 00 and improving product yield.

[0080] Optionally, in the direction Z perpendicular to the plane in which the substrate 10 is located, the thickness D3 of the third inorganic layer 03 is less than the thickness D2 of the second inorganic layer 02. Since the third inorganic layer 03 only needs to be provided on the second organic layer 100 so that the subsequently manufactured first metal layer 50 is adhered to the inorganic material to ensure the firmness and reliability of the first metal layer 50, the thickness D3 of the third inorganic layer 03 in the direction Z perpendicular to the plane in which the substrate 10 is located can be relatively thin, that is, the thickness of the third inorganic layer 03 can be set to be less than the thickness D2 of the second inorganic layer 02, thereby facilitating the thinning of the overall thickness of the display panel 000 and realizing the thinness of the module.

[0081] In some optional embodiments, please refer to Figure 1 , Figure 6 and Figure 7 , Figure 6 is another cross-sectional structure diagram of the A-A' direction in Figure 1 , Figure 7 is another cross-sectional structure diagram of the B-B' direction in Figure 1 . In this embodiment, the display panel 000 further includes a third metal layer 110 between the substrate 10 and the anode layer 20, the third metal layer 110 is located on the side of the first metal layer 50 facing the substrate 10; the third metal layer 110 includes a plurality of third metal portions 1101, the third metal portions 1101 at least partially overlap the orthographic projection of the anode 201 on the substrate 10;

[0082] The third organic layer 120 is between the first metal layer 50 and the third metal layer 110, and covers the plurality of third metal portions 1101;

[0083] The side of the third organic layer 120 away from the substrate 10 includes a plurality of grooves 120K, and the first metal portion 501 is embedded in the groove 120K;

[0084] The side of the third organic layer 120 away from the substrate 10 includes a first surface 120A outside the groove 120K, and the first surface 120A is in direct contact with the first organic layer 60;

[0085] The first surface 120A is flush with the surface 501A of the side of the first metal portion 501 away from the substrate.

[0086] This embodiment explains that the anode layer 20 and the substrate 10 of the display panel 000 can further include other metal film layers, such as the third metal layer 110 located on the side of the first metal layer 50 facing the substrate 10, or there can be other metal film layers, Figure 6 not shown in Figure 7As shown, the first metal layer 50 in the embodiment can be a film layer for making signal traces in the display panel 000, and at this time, the third metal layer 110 can be a metal film layer for making the source / drain of the thin film transistor T in the driving circuit layer, or the third metal layer 110 can also be other metal film layers, which are not specifically limited in the embodiment, as long as the third metal layer 110 is located on the side of the first metal layer 50 facing the substrate 10, and the third metal part 1101 of the third metal layer 110 at least partially overlaps the orthographic projection of the anode 201 on the substrate 10, i.e., the third metal part 1101 is also located below the anode 201, which can affect the flatness of the anode 201. Therefore, the embodiment sets the third organic layer 120 between the first metal layer 50 and the third metal layer 110, and the third organic layer 120 covers a plurality of third metal parts 1101, i.e., after the third metal layer 110 including a plurality of third metal parts 1101 is made, an original third organic layer covering the third metal layer 110 can be made, and then the third organic layer 120 on the side away from the substrate 10 includes a plurality of grooves 120K through an etching process. Optionally, the depth of the groove 120K can match the thickness of the first metal part 501 to be made subsequently, and the width of the groove 120K can match the width of the first metal part 501 to be made subsequently, so that the first metal part 501 made subsequently can be fitted into the groove 120K, so that the first surface 120A of the third organic layer 120 on the side away from the substrate 10 and located outside the groove 120K can be as level as possible with the surface 501A of the first metal part 501 on the side away from the substrate 10 (represented by a dashed line in the figure), so that the first organic layer 60 can be made on a relatively flat film layer, and the first surface 120A of the third organic layer 120 after being made directly contacts the first organic layer 60, and the surface 501A of the first metal part 501 on the side away from the substrate 10 can also directly contact the first organic layer 60, so that it is also beneficial to ensure that the surface 60A of the first organic layer 60 on the side away from the substrate 10 is a plane, so that the anode 201 made subsequently has a higher flatness, avoids the problem that uneven anodes make light interfere with each other when ambient light penetrates the display panel 000, thereby improving the color cast phenomenon and improving the display quality.

[0087] It can be understood that the third organic layer 120 in the embodiment can be a whole layer structure, that is, the original third organic layer is formed in one process step, and then etching is performed to form the groove 120K accommodating the first metal part 501, which is advantageous to save process steps and improve process efficiency; alternatively, the third organic layer 120 can also be a structure in which multiple thin organic sub-layers are stacked, so as to ensure the process quality of the organic layer, avoid that the thickness of the third organic layer 120 made at one time is limited and the insulation effect between the first metal layer 50 and the third metal layer 110 cannot be guaranteed. The process technology of the third organic layer 120 is not limited in the embodiment, and can be selected and arranged according to actual needs in specific implementation.

[0088] In some optional embodiments, please refer to Figure 8 and Figure 9 , Figure 8 is another planar structure schematic view of the display panel provided by the embodiment of the present application, Figure 9 is Figure 8 a cross-sectional structure schematic view in the direction of C-C', it can be understood that, in order to clearly show the structure of the embodiment, Figure 8 transparency is filled), in the embodiment, the side of the light-emitting layer 40 of the display panel 000 away from the substrate 10 further comprises a cathode layer 70, a thin film encapsulation layer 80, a color filter layer 04 and a black matrix layer 05.

[0089] The cathode layer 70 is located on the side of the light-emitting layer 40 away from the substrate 10, the thin film encapsulation layer 80 is located on the side of the cathode layer 70 away from the substrate 10, and the color filter layer 04 and the black matrix layer 05 are located on the side of the thin film encapsulation layer 80 away from the substrate 10.

[0090] The color filter layer 04 comprises a plurality of color resistances 041, and the color resistances 041 are in the orthographic projection of the substrate 10 and the orthographic projection of the openings 30K of the pixel definition layer 30 on the substrate 10.

[0091] The black matrix layer 05 comprises a plurality of light-shielding strips 051, and the light-shielding strips 051 are located between the adjacent two openings 30K in the direction X parallel to the plane in which the substrate 10 is located.

[0092] This embodiment explains that the display panel 000 may further include a color filter layer 04 and a black matrix layer 05. Optionally, the color filter layer 04 and the black matrix layer 05 may be disposed on the side of the thin film encapsulation layer 80 facing away from the substrate 10. The color filter layer 04 may include multiple color resists 041 of different colors. The orthographic projection of the color resist 041 onto the substrate 10 overlaps with the orthographic projection of the opening 30K onto the substrate 10, that is, one color resist 041 corresponds to one color sub-pixel 00. Optionally, the color resist 041 may be made of materials such as a light filter. The black matrix layer 05 includes multiple light-shielding strips 051. Along the direction X parallel to the plane of the substrate 10, the light-shielding strips 051 are located between two adjacent openings 30K, that is, the multiple light-shielding strips 051 in the black matrix layer 05 may intersect to define the area where the color resist 041 is located. In organic light-emitting display panels, the light-emitting layer 40, made of organic light-emitting materials, is self-emissive, thus eliminating the need for a polarizer. However, because the reflection of ambient light at the cathode layer 70 can easily lead to low contrast, circular polarizers are typically used in organic light-emitting display panels to reduce ambient light reflection. While circular polarizers can reduce ambient light reflection and improve the contrast of organic light-emitting display panels when used outdoors, they also have drawbacks such as low transmittance, thickness, and poor foldability. Therefore, in this embodiment, a color filter layer 04 and a black matrix layer 05 are set on the side of the thin film encapsulation layer 80 away from the substrate 10 using a color filter manufacturing process to replace the circular polarizer in the organic light-emitting display panel. Utilizing the filtering principle of the color filter, the orthographic projection of the color resist 041 on the substrate 10 overlaps with the orthographic projection of the opening 30K on the substrate 10. That is, the color resist 041 covers the sub-pixel 00, which not only plays an anti-reflection role but also filters the spectrum of the sub-pixel 00, resulting in a narrower spectrum and higher color purity, which is beneficial to improving the display effect. The black matrix layer 05 can absorb ambient light, achieving the effect of blocking external light reflection while also helping to reduce costs and providing possibilities for the design of flexible products.

[0093] In some alternative embodiments, please refer to the references. Figures 1-3 , Figures 10-17 , Figure 10 This is a flowchart illustrating a method for manufacturing a display panel according to an embodiment of the present invention. Figure 11 yes Figure 10 The provided fabrication method shows a structural diagram after the first metal layer is fabricated on one side of the substrate. Figure 12 yes Figure 10 The provided fabrication method includes a schematic diagram of the structure after the first inorganic layer is fabricated on the side of the first metal layer facing away from the substrate. Figure 13 yes Figure 10 A schematic diagram of the structure after multiple first inorganic parts are formed in the provided manufacturing method. Figure 14 yes Figure 10 The provided fabrication method shows a schematic diagram of the structure after the first organic layer is fabricated on the side of the first metal portion away from the substrate.Figure 15 is Figure 10 A schematic diagram of a structure after a plurality of anodes are made on the side of the first organic layer away from the substrate in the manufacturing method provided, Figure 16 is Figure 10 A schematic diagram of a structure after a pixel definition layer including an opening is formed in the manufacturing method provided, Figure 17 is Figure 10 A schematic diagram of a film layer structure of a display panel made by the manufacturing method provided, the manufacturing method for making the display panel 000 in the above embodiments; the manufacturing method provided in this embodiment at least includes:

[0094] S10: A substrate 10 (not filled in the figure) is provided, which can be used as a bearing substrate for setting other film layer structures of the display panel 000. Optionally, the substrate 10 can be a hard material such as glass, etc., or a flexible material such as polyimide (PI), polycarbonate (PC), etc., or the substrate 10 can be any one of a transparent substrate, a translucent substrate, or an opaque substrate, which is not limited in this embodiment;

[0095] S11: A first metal layer 50 is made on one side of the substrate 10, so that the first metal layer 50 includes a plurality of first metal parts 501; optionally, a patterning process can be used to pattern the first metal layer 50 to obtain the structure of the plurality of required first metal parts 501; optionally, before making the first metal layer 50, the manufacturing method provided in this embodiment can further include other process steps, such as making various insulating film layers or a plurality of metal layers on the substrate 10 to complete the making of the driving circuit layer of the display panel 000, and the structure of the plurality of metal layers of the driving circuit layer can be used to form a driving circuit, such as a pixel circuit, etc., which provides a driving signal for the display panel 000, which is not described in this embodiment. Optionally, the first metal layer 50 in this embodiment can be used to make part of the structure of a thin film transistor (the thin film transistor can be electrically connected to the anode 201 later, which is used to transmit the driving signal of the pixel circuit to the anode 201) in the driving circuit layer, or can also be used to make a signal trace (which can be used to provide a driving voltage signal for the pixel circuit) or a capacitor, etc., which is not limited in this embodiment; as shown in Figure 11 Figure 11 Taking one metal film layer of the first metal layer 50 above the source and drain of the thin film transistor T as an example, the first metal layer 50 at this position can be used to make a signal trace, etc.;

[0096] S12: A first inorganic layer 01 is made on the side of the first metal layer 50 away from the substrate, so that the first inorganic layer 01 covers the plurality of first metal parts 501, and the first inorganic layer 01 plays a role of insulation and passivation, as shown in Figure 12 ​​

[0097] S13: etching or grinding the surface of the first inorganic layer 01 on the side away from the substrate 10, so that the first inorganic layer 01 exposes the first metal part 501, forms a plurality of first inorganic parts 011 filled between two adjacent first metal parts 501, and the surface 011A of the first inorganic part 011 on the side away from the substrate 10 is flush with the surface 501A of the first metal part 501 on the side away from the substrate 10 (the flush is shown by a dashed line in the figure), as shown in Figure 13 ;

[0098] S14: making the first organic layer 60 on the side of the first inorganic layer 01 away from the substrate 10, so that the first metal part 501, the first inorganic part 011, and the first organic layer 60 are in direct contact, and the surface 60A of the first organic layer 60 on the side away from the substrate 10 is a plane, as shown in Figure 14 ;

[0099] S15: making the anode layer 20 on the side of the first organic layer 60 away from the substrate, so that the anode layer 20 includes a plurality of anodes 201, and the orthographic projection of the anode 201 on the substrate 10 at least partially overlaps the orthographic projection of the first metal part 501 on the substrate 10. Optionally, the anode 201 can be electrically connected to the drain of the thin film transistor T through a via hole to realize the transmission of a driving signal. Since the surface 60A of the first organic layer 60 on the side away from the substrate 10 is a plane, each anode 201 has high flatness, as shown in Figure 15 ;

[0100] S16: making the pixel definition layer 30 (not filled in the figure) on the side of the anode layer 20 away from the substrate 10, so that the pixel definition layer 30 includes a plurality of openings 30K, and the orthographic projection of the opening 30K on the substrate 10 overlaps the orthographic projection of the anode 201 on the substrate 10, and the opening 30K at least exposes part of the anode 201, as shown in Figure 16 ;

[0101] S17: making the light-emitting layer 40 on the side of the pixel definition layer 30 away from the substrate 10, so that the light-emitting layer 40 includes a plurality of light-emitting parts 401, the light-emitting part 401 is located in the opening 30K, and other remaining structures of the display panel 000 are made, and the making of the display panel 000 is continued. Optionally, an organic light-emitting material can be evaporated in the opening 30K by using an evaporation process to form light-emitting parts 401 of different colors of organic materials, as shown in Figure 17 . Optionally, after the light-emitting part 401 is made, other process steps can also be included, which can be understood by referring to the process technology of an organic light-emitting display panel in related technologies, and will not be described herein.

[0102] The manufacturing method of the display panel provided in the embodiment can cover the plurality of first metal parts 501 with the full-surface first inorganic layer 01 by directly manufacturing the full-surface first inorganic layer 01 after the plurality of first metal parts 501 of the first metal layer 50 are manufactured, so that the first inorganic layer 01 plays a role of passivation and insulation, and then the surface of the first inorganic layer 01 away from the substrate 10 is etched or ground by etching or grinding process, so that the first inorganic layer 01 at the positions of the first metal parts 501 is etched away, and the first metal parts 501 are exposed, and finally the plurality of first inorganic parts 011 filled between the adjacent two first metal parts 501 are formed, which is beneficial to make the surface 011A of the first inorganic part 011 away from the substrate 10 flush with the surface 501A of the first metal part 501 away from the substrate 10, so that the flatness of the first organic layer 60 can be better guaranteed when the first organic layer 60 with a flat function is manufactured subsequently, so that the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, and then the anode layer 20 can be manufactured on the surface 60A of the relatively flat first organic layer 60 in the opening 30K of the pixel definition layer 30 after the pixel definition layer 30 is manufactured, so that the anode 201 structure formed in the opening 30K can be relatively flat. And since the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, the thickness of the first organic layer 60 can also be appropriately reduced, that is, the first organic layer 60 can not be too thick to make the anode 201 manufactured in a relatively flat environment, which is beneficial to reduce the overall thickness of the display panel 000 and facilitate the thin design. Since the material of the part of the first inorganic layer 01 above the first metal part 501 is etched or ground to expose the first metal part 501, the side of the subsequently manufactured first organic layer 60 facing the first metal layer 50 can be in direct contact with the first inorganic part 011 and the first metal part 501, which is beneficial to guarantee that the manufactured first organic layer 60 is a film layer with good flatness, that is, the surface 60A of the first organic layer 60 away from the substrate 10 is a plane as much as possible, which is beneficial to reduce the overall thickness of the display panel 000 and facilitate the thin design, and also makes the anode 201 of the embodiment have high flatness, avoids the problem that uneven anodes make light interfere with each other when ambient light penetrates the display panel 000, and further improves the color cast phenomenon and improves the display quality.

[0103] It can be understood that in the manufacturing method provided in the embodiment, the thickness of the first metal layer 50 manufactured can be thicker than the required thickness, for example, the first metal layer 50 can be thickened by about 200 angstroms on the basis of the original design requirement, so that even if over-etching occurs in the process during etching or grinding of the first inorganic layer 01, the first metal part 501 will not be etched too thin, which will affect the signal transmission, and thus the product yield can be guaranteed.

[0104] In some alternative embodiments, please refer to the references. Figure 1 , Figure 6 and Figure 7 , Figures 18-26 , Figure 18 This is a flowchart illustrating another method for manufacturing a display panel according to an embodiment of the present invention. Figure 19 yes Figure 18 The provided fabrication method shows a schematic diagram of the structure after the third metal layer is fabricated on one side of the substrate. Figure 20 yes Figure 18 The provided fabrication method shows a schematic diagram of the structure after the third organic layer is fabricated on the side of the third metal layer facing away from the substrate. Figure 21 yes Figure 18 The provided fabrication method includes a schematic diagram of the structure after a groove is formed on the side of the third organic layer facing away from the substrate. Figure 22 yes Figure 18 The provided manufacturing method includes a structural diagram showing the structure after the first metal part is fabricated within the groove of the third organic layer. Figure 23 yes Figure 18 The provided fabrication method shows a schematic diagram of the structure after the first organic layer is fabricated on the side of the first metal layer facing away from the substrate. Figure 24 yes Figure 18 The provided fabrication method includes a schematic diagram of the structure after multiple anodes are fabricated on the side of the first organic layer away from the substrate. Figure 25 yes Figure 18 The provided fabrication method includes a schematic diagram of the structure after forming a pixel definition layer with openings. Figure 26 yes Figure 18 A schematic diagram of another film layer structure of the display panel obtained by the provided manufacturing method is shown. This embodiment provides a method for manufacturing a display panel, which is used to manufacture the display panel 000 in the above embodiment. The manufacturing method provided in this embodiment includes at least the following:

[0105] S20: A substrate 10 (not filled in the figure) is provided. The substrate 10 can be used as a carrier substrate for setting other film layer structures of the display panel 000. Optionally, the substrate 10 can be a rigid material such as glass, or a flexible material such as polyimide (PI), polycarbonate (PC), etc., or the substrate 10 can be any of a transparent substrate, a semi-transparent substrate, or an opaque substrate. This embodiment does not limit the specific materials used.

[0106] S21: A third metal layer 110 is formed on one side of the substrate 10, such that the third metal layer 110 includes a plurality of third metal portions 1101; optionally, a patterning process can be used to pattern the third metal layer 110 to obtain a structure of a plurality of desired third metal portions 1101; optionally, before forming the third metal layer 110, the manufacturing method provided in this embodiment may also include other process steps, such as forming various insulating film layers or multiple metal layers on the substrate 10 to complete the fabrication of the driving circuit layer of the display panel 000. The structure of the multiple metal layers of the driving circuit layer can be used to form a driving circuit that provides driving signals to the display panel 000, such as a pixel circuit, etc., which will not be elaborated here in this embodiment. Optionally, the third metal layer 110 in this embodiment can be used to fabricate capacitors in the driving circuit layer, etc., which is not limited in this embodiment; such as Figure 19 As shown in this embodiment Figure 19 Taking the third metal layer 110 as an example of a metal film layer used to fabricate the source and drain of a thin film transistor T, the third metal layer 110 at this location can also be used to fabricate an electrode plate of a capacitor in a driving circuit layer, etc.

[0107] S22: A third organic layer 120 is formed on the side of the third metal layer 110 facing away from the substrate 10, such that the third organic layer 120 covers multiple third metal portions 1101. The first organic layer 120 can be used as an insulating or planarizing layer to ensure insulation between the subsequently formed metal film layer and the third metal layer 110, and also to make the subsequently formed metal film layer relatively flat, such as... Figure 20 As shown;

[0108] S23: Multiple grooves 120K are etched on the surface of the third organic layer 120 facing away from the substrate 10, such as Figure 21 As shown; a first metal layer 50 is formed within the groove 120K, such that the first metal layer 50 includes a plurality of first metal portions 501, and the first metal portions 501 are fitted into the groove 120K. Optionally, in this embodiment, the first metal layer 50 can cooperate with the third metal layer 110 to jointly fabricate capacitors, etc., in the driving circuit layer; this embodiment is not limited thereto. The side of the third organic layer 120 away from the substrate 10 includes a first surface 120A located outside the groove 120K. The first surface 120A is flush with the surface 501A of the first metal portions 501 on the side away from the substrate 10 (indicated by dashed lines in the figure). Optionally, the depth of the groove 120K formed on the third organic layer 120 can be matched with the thickness of the metal structure to be deposited subsequently, and the width of the groove 120K formed on the third organic layer 120 can be matched with the width of the metal structure to be deposited subsequently. Then, the first metal portions 501 are deposited within the groove 120K to form the first metal layer 50, such that one third organic layer 120 includes two metal layers, as shown in the figure. Figure 22As shown;

[0109] S24: A first organic layer 60 is made on the side of the first metal layer 50 away from the substrate 10, so that the first metal part 501 and the first surface 120A of the third organic layer 120 are in direct contact with the first organic layer 60, and the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, as shown in Figure 23

[0110] S25: An anode layer 20 is made on the side of the first organic layer 60 away from the substrate 10, so that the anode layer 20 includes a plurality of anodes 201, the orthographic projection of the anode 201 on the substrate 10 at least partially overlaps the orthographic projection of the first metal part 501 on the substrate 10, and the orthographic projection of the anode 201 on the substrate 10 at least partially overlaps the orthographic projection of the third metal part 1101 on the substrate 10. Optionally, the anode 201 can be electrically connected to the drain of the thin film transistor T through a via hole to realize the transmission of a driving signal. Since the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, each anode 201 made has high flatness, as shown in Figure 24

[0111] S26: A pixel definition layer 30 (not filled in the figure) is made on the side of the anode layer 20 away from the substrate 10, so that the pixel definition layer 30 includes a plurality of openings 30K, the orthographic projection of the opening 30K on the substrate 10 overlaps the orthographic projection of the anode 201 on the substrate 10, and the opening 30K at least exposes part of the anode 201, as shown in Figure 25

[0112] S27: A light-emitting layer 40 is made on the side of the pixel definition layer 30 away from the substrate 10, so that the light-emitting layer 40 includes a plurality of light-emitting parts 401, the light-emitting part 401 is located in the opening 30K, and other remaining structures of the display panel 000 are made to continue the making of the display panel 000. Optionally, an organic light-emitting material can be evaporated in the opening 30K by an evaporation process to form light-emitting parts 401 of different colors of organic materials, as shown in Figure 26

[0113] ​​​​The manufacturing method of the display panel provided in the embodiment can cover the plurality of third metal parts 1101 with the third organic layer 120 by directly manufacturing the third organic layer 120 covering the plurality of third metal parts 1101 after the plurality of third metal parts 1101 of the third metal layer 110 are manufactured, and the third organic layer 120 plays a role of passivation and insulation. Then, a plurality of grooves 120K are formed on the surface of the third organic layer 120 away from the substrate 10 by etching, so that the depth of the groove 120K can match the thickness of the metal structure to be deposited subsequently, the width of the groove 120K opened on the third organic layer 120 can match the width of the metal structure to be deposited subsequently, and then the first metal part 501 with the required width and thickness is deposited in the groove 120K. The first metal part 501 is embedded in the groove 120K to form the first metal layer 50, so that one third organic layer 120 includes two metal layers, and further the first surface 120A of the third organic layer 120 away from the substrate 10 and located outside the groove 120K can be flush with the surface 501A of the first metal part 501 away from the substrate 10 as much as possible (the flush state is represented by a dashed line in the figure). Thus, when the first organic layer 60 with a flat function is manufactured subsequently, the flatness of the first organic layer 60 can be better guaranteed, so that the surface 60A of the first organic layer 60 away from the substrate 10 is a plane. Then, after the pixel definition layer 30 is manufactured, the anode layer 20 can be manufactured in the opening 30K of the pixel definition layer 30, that is, on the surface 60A of the relatively flat first organic layer 60, so that the anode 201 structure formed in the opening 30K can be relatively flat. In the embodiment, the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, so the thickness of the first organic layer 60 can be appropriately reduced, that is, the first organic layer 60 can not be too thick to make the anode 201 manufactured in a relatively flat environment, which is beneficial to reducing the overall thickness of the display panel 000 and realizing thin design. In the embodiment, the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, which is beneficial to reducing the overall thickness of the display panel 000 and realizing thin design, and further the anode 201 of the embodiment has a relatively high flatness, which can avoid the problem that uneven anodes make light beams interfere with each other to cause display color deviation when ambient light penetrates the display panel 000, and further is beneficial to improving the color deviation phenomenon and improving the display quality. In the manufacturing method provided in the embodiment, the third organic layer 120 can be directly manufactured in one process flow, which is beneficial to saving process steps and improving process efficiency.

[0114] In some optional embodiments, please refer to Figure 1 , Figure 6 , Figure 7 , Figure 19 , Figures 27-34 , Figure 27is a flow chart of another manufacturing method of the display panel provided in the embodiment of the present application, Figure 28 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the first sub-organic layer is manufactured on the side of the third metal layer away from the substrate, Figure 29 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the first metal layer is manufactured on the side of the first sub-organic layer away from the substrate, Figure 30 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the second sub-organic layer is filled between the adjacent first metal layers, Figure 31 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the first organic layer is manufactured on the side of the first metal layer away from the substrate, Figure 32 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the plurality of anodes are manufactured on the side of the first organic layer away from the substrate, Figure 33 is Figure 27 is a schematic structural diagram of the manufacturing method provided in the embodiment of the present application after the pixel definition layer including the opening is formed, Figure 34 is Figure 27 is another schematic structural diagram of the film layer of the display panel manufactured by the manufacturing method provided in the embodiment of the present application, the manufacturing method of the display panel is used to manufacture the display panel 000 in the above embodiment; the manufacturing method provided in the embodiment includes at least:

[0115] S30: a substrate 10 (not filled in the figure) is provided, the substrate 10 can be used as a bearing substrate, which is used to set other film layer structures of the display panel 000. Optionally, the substrate 10 can be a hard material such as glass, etc., or a flexible material such as polyimide (PI), polycarbonate (PC), etc., or the substrate 10 can be any one of a transparent substrate, a translucent substrate or an opaque substrate, which is not limited in the embodiment;

[0116] S31: a third metal layer 110 is manufactured on one side of the substrate 10, so that the third metal layer 110 includes a plurality of third metal parts 1101; optionally, a patterning process can be used to pattern the third metal layer 110 to obtain the structure of the plurality of required third metal parts 1101; optionally, before the third metal layer 110 is manufactured, the manufacturing method provided in the embodiment can further include other process steps, such as manufacturing various insulating film layers or a plurality of metal layers on the substrate 10 to complete the manufacturing of the driving circuit layer of the display panel 000, the structure of the plurality of metal layers of the driving circuit layer can be used to form a driving circuit such as a pixel circuit, etc., which is not described herein. Optionally, the third metal layer 110 in the embodiment can be used to manufacture a capacitor device in the driving circuit layer, which is not limited in the embodiment; for example,Figure 19 As shown in the figure, the third metal layer 110 in the embodiment can be used to make the source and drain of the thin film transistor T. Figure 19 For example, the third metal layer 110 at this position can also be used to make one electrode plate of a capacitor device in the driving circuit layer, etc.

[0117] S32: A first sub-organic layer 12A0 is made on the side of the third metal layer 110 away from the substrate 10, so that the first sub-organic layer 12A0 covers the plurality of third metal parts 1101, and the surface of the first sub-organic layer 12A0 away from the substrate 10 is a plane, i.e. after the third metal layer 110 is made, a relatively thin first sub-organic layer 12A0 can be made first, so that the first sub-organic layer 12A0 covers the plurality of third metal parts 1101, and the surface of the first sub-organic layer 12A0 away from the substrate 10 is a plane, which forms an insulating structure with the surface of the first sub-organic layer 12A0 away from the substrate 10 being a plane, and lays a foundation for ensuring flatness when making subsequent film layers, such as Figure 28 as shown in the figure;

[0118] S33: A first metal layer 50 is made on the side of the first sub-organic layer 12A0 away from the substrate 10, which can adopt a patterning process, so that the first metal layer 50 includes a plurality of first metal parts 501, and optionally, the first metal layer 50 in the embodiment can be used together with the third metal layer 110 to make a capacitor device in the driving circuit layer, etc., which is not limited in the embodiment, such as Figure 29 as shown in the figure;

[0119] S34: A second sub-organic layer 12B0 is made on the side of the first metal layer 50 away from the substrate 10, so that the second sub-organic layer 12B0 includes a plurality of second sub-organic parts 12B01, and the second sub-organic parts 12B01 are filled between adjacent two first metal parts 501, so that the second sub-organic parts 12B01 can fill the gap space between adjacent first metal parts 501, and it can be understood that the second sub-organic layer 12B0 and the first sub-organic layer 12A0 together form the third organic layer 120 in the above embodiment, so that the surface 12B01A of the second sub-organic part 12B01 away from the substrate 10 is flush with the surface 501A of the first metal part 501 away from the substrate 10 (the flush is represented by a dashed line in the figure), such as Figure 30 as shown in the figure;

[0120] S35: A first organic layer 60 is made on the side of the first metal layer 50 away from the substrate 10, so that the first metal part 501, the second sub-organic part 12B01 and the first organic layer 60 are in direct contact, and the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, such as Figure 31 as shown in the figure;

[0121] S36: fabricate the anode layer 20 on the side of the first organic layer 60 away from the substrate 10, so that the anode layer 20 comprises a plurality of anodes 201, the anode 201 in the orthographic projection of the substrate 10 at least partially overlaps the orthographic projection of the first metal part 501 on the substrate 10, the anode 201 in the orthographic projection of the substrate 10 at least partially overlaps the orthographic projection of the third metal part 1101 on the substrate 10, optionally, the anode 201 can be electrically connected with the drain of the thin film transistor T through a via hole, to realize the transmission of the driving signal, since the surface 60A of the first organic layer 60 away from the substrate 10 is a plane, each anode 201 has high flatness, as shown in Figure 32

[0122] S37: fabricate the pixel definition layer 30 (not filled in the figure) on the side of the anode layer 20 away from the substrate 10, so that the pixel definition layer 30 comprises a plurality of openings 30K, the opening 30K in the orthographic projection of the substrate 10 overlaps the orthographic projection of the anode 201 on the substrate 10, the opening 30K at least exposes part of the anode 201, as shown in Figure 33

[0123] S38: fabricate the light-emitting layer 40 on the side of the pixel definition layer 30 away from the substrate 10, so that the light-emitting layer 40 comprises a plurality of light-emitting parts 401, the light-emitting part 401 is located in the opening 30K, and other remaining structures of the display panel 000 are fabricated, to continue to complete the fabrication of the display panel 000; optionally, the organic light-emitting material can be evaporated in the opening 30K by using an evaporation process, to form the light-emitting part 401 of the organic material of different colors, as shown in Figure 34 . Optionally, after the fabrication of the light-emitting part 401, other process steps can also be included, which can be understood with reference to the process technology of the organic light-emitting display panel in the related art, which will not be described herein.

[0124] ​​In this embodiment, the third metal layer 110 and the first metal layer 50 can be stacked by a plurality of organic sub-layers. After the third metal layer 110 is made, a first thin sub-organic layer 12A0 is first made, so that the first sub-organic layer 12A0 covers a plurality of third metal parts 1101, and forms an insulating structure with a flat surface on the side of the first sub-organic layer 12A0 away from the substrate 10, thereby ensuring the flatness for the subsequent film layer. Then, the first metal layer 50 with a plurality of first metal parts 501 is formed on the flat surface of the first sub-organic layer 12A0 away from the substrate 10. Since there is a gap between the adjacent two first metal parts 501 of the patterned first metal layer 50, the surface of the film layer is not flat enough. Therefore, a second sub-organic layer 12B0 is made on the side of the first metal layer 50 away from the substrate 10, so that the plurality of second sub-organic parts 12B01 of the second sub-organic layer 12B0 fill the gap between the adjacent two first metal parts 501. Thus, the second sub-organic parts 12B01 fill the gap between the adjacent two first metal parts 501, so that the surface 12B01A of the second sub-organic parts 12B01 away from the substrate 10 is flush with the surface 501A of the first metal parts 501 away from the substrate 10. This is conducive to ensuring the flatness of the first organic layer 60 formed subsequently, and also ensures the process quality of the first sub-organic layer 12A0 and the second sub-organic layer 12B0. In this way, the thickness of the organic layer made at one time is limited, and the insulating effect between the first metal layer 50 and the third metal layer 110 cannot be better ensured.

[0125] In some optional embodiments, please refer to Figure 1 , Figure 4 , Figure 5 and Figure 35 , Figure 35 is a flow chart of another manufacturing method of a display panel provided by the embodiments of the present application. The manufacturing method provided by the present embodiment can refer to the manufacturing process in the above-mentioned embodiments. In the manufacturing method of the display panel 000 of the present embodiment, before the first metal layer 50 is made, the manufacturing method further comprises:

[0126] S101: A second metal layer 90 is made on the side of the substrate 10 facing the first metal layer 50, so that the second metal layer 90 comprises a plurality of second metal parts 901;

[0127] S102: A second inorganic layer 02 is made on the side of the second metal layer 90 away from the substrate, so that the second inorganic layer 02 covers the plurality of second metal parts 901;

[0128] S103: A second organic layer 100 is made on the side of the second inorganic layer 02 away from the substrate 10, so that the surface of the second organic layer 100 away from the substrate 10 is a flat surface. ​

[0129] The manufacturing method of the display panel provided in the embodiment can further manufacture other metal film layers before manufacturing the first metal layer 50. The plurality of metal film layers between the substrate 10 and the anode layer 20 can be used to form a driving circuit structure. Before manufacturing the first metal layer 50, a second metal layer 90 is manufactured on the side of the substrate 10 facing the first metal layer 50, so that the second metal layer 90 includes a plurality of second metal portions 901. When the first metal layer 50 is used to manufacture a metal film layer of a source / drain electrode of a thin film transistor T in a driving circuit layer, the second metal layer 90 can be a metal film layer of a gate electrode of the thin film transistor T in the driving circuit layer, or the second metal layer 90 can also be a metal film layer of an electrode plate of a capacitor C in the driving circuit layer, which is not specifically limited in the embodiment. Since the second metal portions 901 of the second metal layer 90 at least partially overlap the orthographic projection of the anode 201 on the substrate 10, that is, the second metal portions 901 are also located below the anode 201, which can affect the flatness of the anode 201. Therefore, the second inorganic layer 02 can be manufactured on the side of the second metal layer 90 away from the substrate, so that the second inorganic layer 02 covers the plurality of second metal portions 901. The second inorganic layer 02 is used as an insulating passivation layer, and the second organic layer 100 manufactured on the side of the second inorganic layer 02 away from the substrate 10 can play a planarization role, so that the surface of the second organic layer 100 away from the substrate 10 is a plane. The second organic layer 100 can be relatively flat by the process technology and the performance of the organic material itself, so that the subsequent manufacturing of other film layers such as the first metal layer 50 on the side of the second organic layer 100 away from the substrate 10 can ensure good flatness, which is beneficial to improve the color cast phenomenon and improve the display quality of the display panel manufactured by the manufacturing method of the embodiment.

[0130] Optionally, please refer to Figure 1 、 Figure 4 、 Figure 5 and Figure 36 , Figure 36 is a flow chart of another manufacturing method of a display panel provided in the embodiment. The manufacturing method provided in the embodiment further includes the following steps before manufacturing the first metal layer 50.

[0131] S104: A third inorganic layer 03 is manufactured on the side of the second organic layer 100 away from the substrate 10, so that the thickness D3 of the third inorganic layer 03 is less than the thickness D2 of the second inorganic layer 02.

[0132] The manufacturing method provided in the embodiment further manufactures a third inorganic layer 03 on the side of the second organic layer 100 away from the substrate 10 after manufacturing the first metal layer 50 and after manufacturing the second organic layer 100, and the third inorganic layer 03 is relatively thin, specifically, the thickness D3 of the third inorganic layer 03 is less than the thickness D2 of the second inorganic layer 02, the third inorganic layer 03 can improve the adhesion of the metal conductive material of the first metal layer 50 and the inorganic material of the third inorganic layer 03 compared with the organic material, which is beneficial to ensure the stability of each film layer of the manufactured display panel 00 and improve the product yield. In the direction Z perpendicular to the plane where the substrate 10 is located, the thickness D3 of the third inorganic layer 03 is less than the thickness D2 of the second inorganic layer 02, because the third inorganic layer 03 only needs to be arranged on the second organic layer 100, so that the subsequently manufactured first metal layer 50 is adhered to the inorganic material, thereby ensuring the firmness and reliability of the first metal layer 50, and therefore the thickness D3 of the third inorganic layer 03 in the direction Z perpendicular to the plane where the substrate 10 is located can be relatively thin, that is, the thickness of the third inorganic layer 03 can be set to be less than the thickness D2 of the second inorganic layer 02, thereby being beneficial to thinning the overall thickness of the display panel 000 and realizing the thinness of the module.

[0133] In some optional embodiments, please refer to Figure 37 , Figure 37 is a schematic diagram of a planar structure of a display device provided in the embodiments of the present application, the display device 111 provided in the embodiments of the present application includes the display panel 000 provided in the above embodiments of the present application. Figure 37 The embodiments only take the mobile phone as an example to describe the display device 111, and it can be understood that the display device 111 provided in the embodiments of the present application can be a computer, a television, a vehicle-mounted display device or other display devices 111 having a display function, and the present application does not specifically limit this. The display device 111 provided in the embodiments of the present application has the beneficial effects of the display panel 000 provided in the embodiments of the present application, and specific descriptions can be referred to the specific descriptions of the display panel 000 in the above embodiments, which will not be described herein again.

[0134] It can be known from the above embodiments that the display panel and the manufacturing method thereof and the display device provided in the present application at least achieve the following beneficial effects:

[0135] The substrate of the display panel and the anode layer comprise at least a first metal layer, the first metal layer can form a plurality of first metal parts through a patterning process, and the orthographic projection of the first metal part on the substrate at least partially overlaps the orthographic projection of the anode on the substrate. The first metal layer and the anode layer comprise at least a first organic layer, the first organic layer made of organic material generally has high flatness, and the first organic layer made of organic material has good dielectric constant, flatness and transmittance, so it can be used as an organic insulating layer for low dielectric. And in the prior art, in order to ensure the flatness of the organic layer, the thickness compensation is often used, that is, the thickness of the organic layer is increased to ensure the flatness, but in the prior art, due to the limitation of the organic layer manufacturing process, the thickness of the organic layer is generally limited. Since the side surface of the first organic layer away from the substrate is a plane, the thickness of the first organic layer can be appropriately reduced, that is, the first organic layer can be made without being too thick, so that the anode is made in a relatively flat environment, which is beneficial to reduce the overall thickness of the display panel and facilitate the realization of thin design. In order to make the side surface of the first organic layer away from the substrate a plane, the side of the first organic layer facing the first metal layer can be directly contacted with the side of the first metal part facing the first organic layer, that is, there is no other film layer material between the first organic layer and the first metal part under the anode, which is beneficial to make the first organic layer a film layer with good flatness, that is, to make the side surface of the first organic layer away from the substrate a plane as much as possible, so that the anode has high flatness, avoids the problem that the uneven anode causes the light to interfere with each other when the ambient light penetrates the display panel, and further improves the color cast phenomenon and improves the display quality.

[0136] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A display panel, characterized by, Comprising: a substrate; an anode layer located on one side of the substrate, the anode layer comprising a plurality of anodes; a pixel definition layer located on a side of the anode layer facing away from the substrate, the pixel definition layer comprising a plurality of openings, the openings overlapping the anodes in orthographic projection on the substrate, the openings exposing at least part of the anodes; a light emitting layer located on a side of the pixel definition layer facing away from the substrate, the light emitting layer comprising a plurality of light emitting portions, the light emitting portions being located within the openings; at least a first metal layer between the substrate and the anode layer, the first metal layer comprising a plurality of first metal portions, the first metal portions at least partially overlapping the anodes in orthographic projection on the substrate; at least a first organic layer between the first metal layer and the anode layer, a side surface of the first organic layer facing away from the substrate being a plane; a side of the first organic layer facing the first metal layer being in direct contact with a side of the first metal portions facing the first organic layer; a first inorganic layer between the first organic layer and the substrate, the first inorganic layer comprising a plurality of first inorganic portions, the first inorganic portions not overlapping the first metal portions in orthographic projection on the substrate, the first inorganic portions being filled between adjacent two of the first metal portions, a side surface of the first inorganic portions facing the first organic layer being in direct contact with the first organic layer; a side surface of the first inorganic portions facing away from the substrate being flush with a side surface of the first metal portions facing away from the substrate; a second metal layer between the substrate and the anode layer, the second metal layer being located on a side of the first metal layer facing the substrate, the second metal layer comprising a plurality of second metal portions, the second metal portions at least partially overlapping the anodes in orthographic projection on the substrate; at least a second inorganic layer, a second organic layer, a third inorganic layer being stacked between the second metal layer and the first metal layer; the second inorganic layer covering a plurality of the second metal portions, the second organic layer being located on a side of the second inorganic layer facing away from the substrate, the third inorganic layer being located on a side of the second organic layer facing away from the substrate.

2. The display panel of claim 1, wherein, In a direction perpendicular to a plane on which the substrate lies, a thickness of the third inorganic layer is less than a thickness of the second inorganic layer.

3. The display panel of claim 1, wherein, a third metal layer between the substrate and the anode layer, the third metal layer being located on a side of the first metal layer facing the substrate, the third metal layer comprising a plurality of third metal portions, the third metal portions at least partially overlapping the anodes in orthographic projection on the substrate; a third organic layer between the first metal layer and the third metal layer, the third organic layer covering a plurality of the third metal portions; a side of the third organic layer facing away from the substrate comprising a plurality of recesses, the first metal portions being fitted into the recesses; The third organic layer comprises a first surface on a side away from the substrate, the first surface being located outside the groove and directly contacting the first organic layer; The first surface is flush with a surface of the first metal portion on a side away from the substrate.

4. The display panel of claim 1, wherein, The display panel further comprises a cathode layer, a thin film encapsulation layer, a color filter layer, and a black matrix layer; The cathode layer is located on a side of the light-emitting layer away from the substrate, the thin film encapsulation layer is located on a side of the cathode layer away from the substrate, and the color filter layer and the black matrix layer are located on a side of the thin film encapsulation layer away from the substrate; The color filter layer comprises a plurality of color resist, and a projection of the color resist on the substrate overlaps a projection of the opening on the substrate; The black matrix layer comprises a plurality of light-shielding strips, and the light-shielding strips are located between adjacent two openings in a direction parallel to a plane on which the substrate is located.

5. A manufacturing method of a display panel, comprising: The manufacturing method is used for manufacturing the display panel of claim 1; the manufacturing method comprises: providing a substrate; manufacturing a first metal layer on a side of the substrate, so that the first metal layer comprises a plurality of first metal portions; manufacturing a first inorganic layer on a side of the first metal layer away from the substrate, so that the first inorganic layer covers the plurality of first metal portions; etching or grinding a surface of the first inorganic layer on a side away from the substrate, so that the first inorganic layer exposes the first metal portions, forms a plurality of first inorganic portions filled between adjacent two first metal portions, and the surface of the first inorganic portion on a side away from the substrate is flush with the surface of the first metal portion on a side away from the substrate; manufacturing a first organic layer on a side of the first inorganic layer away from the substrate, so that the first metal portion, the first inorganic portion, and the first organic layer are directly in contact; manufacturing an anode layer on a side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, and a projection of the anode on the substrate at least partially overlaps a projection of the first metal portion on the substrate; manufacturing a pixel definition layer on a side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, and a projection of the opening on the substrate overlaps a projection of the anode on the substrate, and the opening exposes at least part of the anode; manufacturing a light-emitting layer on a side of the pixel definition layer away from the substrate, so that the light-emitting layer comprises a plurality of light-emitting portions, and the light-emitting portions are located in the openings.

6. A manufacturing method of a display panel, comprising: The manufacturing method is used for manufacturing the display panel of claim 3; the manufacturing method comprises: providing a substrate; manufacturing a third metal layer on a side of the substrate, so that the third metal layer comprises a plurality of third metal portions; manufacturing a third organic layer on a side of the third metal layer away from the substrate, so that the third organic layer covers the plurality of third metal portions; etching a plurality of grooves on a surface of the third organic layer away from the substrate, and forming a first metal layer in the grooves, so that the first metal layer comprises a plurality of first metal portions, and the first metal portions are embedded in the grooves, and the first surface of the third organic layer away from the substrate is located outside the grooves, and the first surface is flush with a surface of the first metal portions away from the substrate; forming a first organic layer on a side of the first metal layer away from the substrate, so that the first metal portions, the first surface of the third organic layer, and the first organic layer are in direct contact; forming an anode layer on a side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, a projection of the anodes on the substrate at least partially overlaps a projection of the first metal portions on the substrate, and a projection of the anodes on the substrate at least partially overlaps a projection of the third metal portions on the substrate; forming a pixel definition layer on a side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, a projection of the openings on the substrate overlaps a projection of the anodes on the substrate, and the openings at least expose part of the anodes; forming a light-emitting layer on a side of the pixel definition layer away from the substrate, so that the light-emitting layer comprises a plurality of light-emitting portions, and the light-emitting portions are located in the openings.

7. A method for manufacturing a display panel, characterized in that, The manufacturing method is used for manufacturing the display panel of claim 3; the manufacturing method comprises: providing a substrate; forming a third metal layer on a side of the substrate, so that the third metal layer comprises a plurality of third metal portions; forming a first sub-organic layer on a side of the third metal layer away from the substrate, so that the first sub-organic layer covers the plurality of third metal portions, and a surface of the first sub-organic layer away from the substrate is a plane; forming a first metal layer on a side of the first sub-organic layer away from the substrate, so that the first metal layer comprises a plurality of first metal portions; forming a second sub-organic layer on a side of the first metal layer away from the substrate, so that the second sub-organic layer comprises a plurality of second sub-organic portions, the second sub-organic portions are filled between adjacent two first metal portions, and a surface of the second sub-organic portions away from the substrate is flush with a surface of the first metal portions away from the substrate; forming a first organic layer on a side of the first metal layer away from the substrate, so that the first metal portions, the second sub-organic portions, and the first organic layer are in direct contact; forming an anode layer on a side of the first organic layer away from the substrate, so that the anode layer comprises a plurality of anodes, a projection of the anodes on the substrate at least partially overlaps a projection of the first metal portions on the substrate, and a projection of the anodes on the substrate at least partially overlaps a projection of the third metal portions on the substrate; forming a pixel definition layer on a side of the anode layer away from the substrate, so that the pixel definition layer comprises a plurality of openings, a projection of the openings on the substrate overlaps a projection of the anodes on the substrate, and the openings at least expose part of the anodes; A light emitting layer is made on a side of the pixel definition layer away from the substrate, such that the light emitting layer comprises a plurality of light emitting portions, the light emitting portions being located in the openings.

8. The manufacturing method of any one of claims 5, 6 or 7, wherein, Before the first metal layer is made, further comprising: A second metal layer is made on a side of the substrate facing the first metal layer, such that the second metal layer comprises a plurality of second metal portions; A second inorganic layer is made on a side of the second metal layer away from the substrate, such that the second inorganic layer covers the plurality of second metal portions; A second organic layer is made on a side of the second inorganic layer away from the substrate, such that a surface of the second organic layer on a side away from the substrate is a plane.

9. The method of manufacturing according to claim 8, wherein, Before the first metal layer is made, further comprising: A third inorganic layer is made on a side of the second organic layer away from the substrate, such that a thickness of the third inorganic layer is less than a thickness of the second inorganic layer.

10. A display device, characterized by comprising: A display panel comprising the display panel of any one of claims 1-4.

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