A perovskite solar cell and its processing method and BIPV component

Abstract

The present invention discloses a perovskite solar cell, a processing method thereof, and a BIPV component, wherein the processing method of the perovskite solar cell comprises the following steps: providing a first perovskite solar cell chip; cutting the first perovskite solar cell chip by non-contact cutting or mechanical cutting to obtain a second perovskite solar cell chip; and grinding the second perovskite solar cell chip at least after cutting by mechanical cutting, cooling the chip by liquid gas or water cooling during the grinding step; wherein, at least during the water cooling step, the second perovskite solar cell chip is covered with a waterproof protective film. The processed cell chip will not have the problem of hydrolysis reaction of the perovskite film layer leading to a decrease in the electrical performance and stability of the product. The processing method can be used to process perovskite solar cells of various sizes and shapes for manufacturing BIPV components, meeting the application requirements of various scenarios such as building curtain walls and roofs.

Description

Technical Field

[0001] The present invention relates to the technical field of solar cells, and in particular to a perovskite solar cell and a processing method thereof, and a BIPV component. Background Art

[0002] Perovskite thin-film solar cells, the fastest-growing third-generation thin-film technology in recent years, are expected to be increasingly widely used in BIPV products in the future. However, due to architectural design requirements, BIPV applications often require non-standard products of various sizes and shapes, requiring further cutting and processing of the perovskite cell chips.

[0003] Existing glass substrate products, such as cadmium telluride thin-film cells, amorphous silicon thin-film cells, and copper indium gallium selenide thin-film cells, all use the cutting, edging, and cleaning processes commonly used in glass deep processing when producing BIPV modules. However, because the perovskite film layer in the perovskite cell chip can absorb water molecules in its surrounding environment and form a hydrate similar to (CH3NH3)4PbI6·2H2O, and according to decomposition theory, contact with water during processing will cause material decomposition and device performance degradation. Taking the currently commonly used CH3NH3PbI3 film layer as an example, as long as the perovskite layer comes into contact with water vapor in a humid environment, the above reaction will automatically occur to the right. The chemical reaction equation is as follows:

[0004]

[0005]

[0006]

[0007]

[0008] Therefore, the cutting, edging and cleaning processes commonly used in glass deep processing require contact with water. For example, water spray cooling is used during edging, and cleaning is also done by water washing. Water molecules pass through the surface of the perovskite cell and react with the perovskite film layer, so this method cannot be used to process perovskite thin-film cells to produce non-standard size BIPV modules. Summary of the Invention

[0009] The main purpose of the present invention is to provide a processing method for perovskite solar cells, aiming to solve the technical problem in the prior art that deep processing of glass requires contact with water and cannot be used to process perovskite thin-film batteries.

[0010] To achieve the above-mentioned object, the present invention provides a method for processing a perovskite solar cell, comprising the following steps:

[0011] Provided the first perovskite solar cell chip;

[0012] Cutting: Cutting the first perovskite solar cell chip by non-contact cutting or mechanical cutting to obtain a second perovskite solar cell chip; and edge grinding the second perovskite solar cell chip at least after cutting by the mechanical cutting, cooling the chip by liquid gas or water cooling during the edge grinding step; wherein, at least during the water cooling step, the second perovskite solar cell chip is covered with a waterproof protective film.

[0013] Optionally, the processing method of the perovskite solar cell further includes the following steps:

[0014] Cleaning the surface: Cleaning the surface of the second perovskite solar cell chip using compressed air at least after the edge grinding step.

[0015] Optionally, the processing method of the perovskite solar cell further includes the following steps:

[0016] Scribing insulation lines: Before the cutting step, the insulation lines are scribed on the first perovskite solar cell chip using a laser.

[0017] Optionally, the first perovskite solar cell chip has a glass substrate and several coating layers located on the surface of the glass substrate, and the first coating layer located on the surface of the glass substrate is a TCO film layer; the insulating line at least removes all coating layers other than the TCO film layer.

[0018] Optionally, the processing method of the perovskite solar cell further includes the following steps:

[0019] Edge sweeping: the first perovskite solar cell chip is edge-sweeped along the insulating line, that is, all the coating layers on the glass substrate are removed to obtain an edge-sweeping portion, and the cutting step is performed along the edge-sweeping portion.

[0020] Optionally, the edge sweeping step includes a laser process, a sandblasting process or a solution etching process.

[0021] Optionally, the processing method of the perovskite solar cell further includes the following steps:

[0022] Encapsulation: The second perovskite solar cell chip forms an effective electrical connection, at least one side of the second perovskite solar cell chip is covered with an encapsulation film, and at least one side of the second perovskite solar cell chip is encapsulated with encapsulation glass.

[0023] Optionally, the liquid gas is selected from at least one of liquid nitrogen, liquid oxygen, liquid argon, liquid air, liquid carbon dioxide or liquid helium.

[0024] Optionally, at least one side of the waterproof protective film is sticky, and the waterproof protective film is adhered to the second perovskite solar cell chip.

[0025] Optionally, the second perovskite solar cell chip is edge-grinded after being cut by the non-contact cutting method.

[0026] Optionally, the first perovskite solar cell chip is a standard perovskite solar cell, and the second perovskite solar cell chip is a non-standard perovskite solar cell.

[0027] Optionally, the mechanical cutting is selected from any one of glass knife cutting, CNC grinding cutting, knife wheel cutting or micro-wire cutting; and the non-contact cutting is laser cutting or plasma cutting.

[0028] The present invention also provides a perovskite solar cell and a processing method of the perovskite solar cell.

[0029] The present invention also provides a BIPV component, comprising a perovskite solar cell obtained by the processing method of the perovskite solar cell.

[0030] Optionally, the BIPV component further includes an encapsulation film and an encapsulation glass; the encapsulation film covers at least one surface of the perovskite solar cell; and the encapsulation glass at least covers at least one surface of the perovskite solar cell.

[0031] Optionally, the packaging film is selected from at least one of ethylene-vinyl acetate copolymer, polyvinyl butyral, ionomer film or ethylene-α-olefin copolymer.

[0032] The technical solution of the present invention uses non-contact cutting or mechanical cutting to cut the first perovskite solar cell chip to obtain a second perovskite solar cell chip. Non-contact cutting can be performed without the need for a subsequent edging process, so there is no need for contact with water. The edging process subsequent to mechanical cutting is cooled by liquid gas to avoid contact with water. If water cooling is used, the second perovskite solar cell chip is covered with a waterproof protective film during the water cooling step. The processed cell chip will not experience the hydrolysis reaction of the perovskite film layer, which will lead to a decrease in the product's electrical performance and stability. This processing method can be used to process perovskite solar cells of various sizes and shapes to manufacture BIPV modules, meeting the application needs of various scenarios such as building curtain walls and roofs. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0034] Figure 1 Schematic diagram of a front view of a first perovskite solar cell chip in an embodiment of a method for processing a perovskite solar cell according to the present invention;

[0035] Figure 2 Schematic cross-sectional view of a first perovskite solar cell chip in an embodiment of a method for processing a perovskite solar cell according to the present invention;

[0036] Figure 3 Schematic front view of a first perovskite solar cell chip after the step of scribing insulating lines in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0037] Figure 4 Schematic cross-sectional view of a first perovskite solar cell chip after the step of scribing insulating lines in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0038] Figure 5 Schematic front view of a first perovskite solar cell chip after the edge sweeping step in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0039] Figure 6 Schematic cross-sectional view of a first perovskite solar cell chip after the edge sweeping step in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0040] Figure 7 Schematic front view of a second perovskite solar cell chip after a cutting step in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0041] Figure 8 Schematic front view of a second perovskite solar cell chip in an edge grinding step in one embodiment of a method for processing a perovskite solar cell according to the present invention;

[0042] Figure 9 Schematic front view of a second perovskite solar cell chip in an edge grinding step in another embodiment of a method for processing a perovskite solar cell according to the present invention;

[0043] Figure 10This is a schematic structural diagram of a BIPV component after the encapsulation step in an embodiment of a method for processing a perovskite solar cell according to the present invention;

[0044] Figure 11 This is a schematic structural diagram of a BIPV assembly after the encapsulation step in another embodiment of a method for processing a perovskite solar cell according to the present invention;

[0045] Figure 12 Flowcharts of Examples 1, 2 and 3 of a method for processing a perovskite solar cell according to the present invention.

[0046] Description of Figure Numbers:

[0047] 1a, first perovskite solar cell chip; 11, insulating wire; 12, edge sweeping part; 13, conductive glass; 131, glass base layer; 132, TCO layer; 14a, first transmission layer; 15, perovskite absorption layer; 14b, second transmission layer; 16, back electrode layer; 1b, second perovskite solar cell chip; 2, grinding wheel; 3, liquid gas output device; 4, water cooling device; 5, waterproof protective film; 6, BIPV module; 61, encapsulation film; 62, encapsulation glass.

[0048] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0050] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0051] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0052] In addition, in the present invention, descriptions such as "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0053] The present invention provides a method for processing a perovskite solar cell.

[0054] In an embodiment of the present invention, the processing method of the perovskite solar cell includes the following steps:

[0055] Providing the first perovskite solar cell chip, such as Figure 1 As shown;

[0056] Cutting: The first perovskite solar cell chip 1a is cut by non-contact cutting or mechanical cutting to obtain the second perovskite solar cell chip 1b, such as Figure 7 As shown. Optionally, the mechanical cutting is selected from any one of glass knife cutting, CNC grinding cutting, wheel cutting, or micro-wire cutting. The non-contact cutting method is laser cutting or plasma cutting. Laser cutting or plasma cutting has good cutting effect, but the equipment cost is high. Mechanical cutting has average cutting effect, but the equipment cost is low.

[0057] like Figure 8 and Figure 9 As shown, at least after mechanical cutting, the second perovskite solar cell chip 1b is edge-grinded. It should be understood that, due to the mechanical cutting, the cut edge of the second perovskite solar cell chip 1b may have cracks, edge collapse, or corner collapse, and therefore, it is necessary to edge-grind it. After non-contact cutting, the cut edge of the second perovskite solar cell chip 1b is not sharp and rarely has cracks, edge collapse, or corner collapse, so it does not need to be edge-grinded. Of course, if cracks, edge collapse, or corner collapse occur on the cut edge after non-contact cutting, it is also necessary to edge-grind it.

[0058] like Figure 8 and Figure 9As shown, during the edge grinding step, the temperature is lowered by liquid gas or by water cooling. At least during the water cooling step, the second perovskite solar cell chip 1b is covered with a waterproof protective film 5. It can be understood here that the waterproof protective film 5 does not need to be covered during liquid gas cooling, but if waterproof protection is required, the waterproof protective film 5 can also be covered. During water cooling, the water cooling device 4 sprays water along with the grinding wheel 2 to cool the water, and the waterproof protective film 5 can prevent moisture from penetrating into the second perovskite solar cell chip 1b. Preferably, the waterproof protective film 5 is a polymer plastic film. Optionally, at least one side of the waterproof protective film 5 is sticky, and the waterproof protective film 5 is adhered to the second perovskite solar cell chip 1b to prevent it from falling off during processing. However, this protection method increases operating costs and cannot fully ensure effectiveness. Therefore, liquid gas cooling is more preferred during the edge grinding step. Liquid gas is continuously introduced through the liquid gas output device 3 for cooling during edge grinding, which avoids dry grinding and edge sweeping and prevents moisture penetration.

[0059] The liquid gas is preferably vaporized to form a low-temperature airflow for cooling, and then sprayed onto the edge grinding area along with the grinding wheel 2. The amount of liquid gas sprayed can be adjusted as needed to ensure that the edge grinding area stabilizes at or near room temperature after cooling, thereby preventing the surface temperature of the second perovskite solar cell chip 1b from being too low due to excessive cooling and the formation of condensation.

[0060] Optionally, the liquid gas is selected from at least one of liquid nitrogen, liquid oxygen, liquid argon, liquid air, liquid carbon dioxide, or liquid helium. These liquid gases all have a cooling effect and do not react, or react slowly, with the compounds on the battery chip. These compounds are not limited to perovskite films. Therefore, the liquid gas is not limited to the gases listed above; any gas with the aforementioned properties can be used in the edge grinding step.

[0061] In an embodiment equivalent to the present invention, cooling media such as cold oil and refrigerated gas can be used instead of liquid gas. These cooling media need to meet the following requirements: no water or low water content, and no reaction with the compound film layer on the battery chip, the above-mentioned compound film layer includes but is not limited to the perovskite film layer.

[0062] The technical solution of the present invention is to cut the first perovskite solar cell chip 1a by non-contact cutting or mechanical cutting to obtain the second perovskite solar cell chip 1b. The non-contact cutting does not require an edging process, so the processing does not need to come into contact with water. The edging process subsequent to mechanical cutting is cooled by liquid gas to avoid contact with water. If water cooling is used, the second perovskite solar cell chip 1b is covered with a waterproof protective film 5 during the water cooling step. The processed battery chip will not experience the hydrolysis reaction of the perovskite film layer, which will lead to a decrease in the electrical performance and stability of the product. This processing method can be used to process perovskite solar cells of various sizes and shapes to manufacture BIPV modules 6, meeting the application needs of various scenarios such as building curtain walls and roofs.

[0063] In an embodiment of the present invention, the processing method of the perovskite solar cell further includes the following steps:

[0064] Cleaning the surface: Cleaning the surface of the second perovskite solar cell chip 1 b using compressed air at least after the edging step.

[0065] For other thin-film battery chips (amorphous silicon, cadmium telluride, and copper indium gallium selenide), after edge grinding, the perovskite battery chip surface can be cleaned using a glass cleaner and then dried using an air knife. Existing glass cleaners typically use water with detergent to clean the surface, making them ineffective for perovskite batteries. Therefore, the present invention uses compressed air to remove surface glass dust particles.

[0066] In an embodiment of the present invention, the processing method of the perovskite solar cell further includes the following steps:

[0067] Scribing insulation wire: Figure 3 and Figure 4 As shown, prior to the cutting step, an insulating line 11 is laser-scribed on the first perovskite solar cell chip 1a. Specifically, the first perovskite solar cell chip 1a comprises a glass substrate 131 and several coating layers disposed on the surface of the glass substrate 131, wherein the first coating layer disposed on the surface of the glass substrate 131 is a TCO film layer. The insulating line 11 is formed by removing at least all coating layers other than the TCO film layer. The insulating line 11 is formed to prevent short circuits caused by electrodes being connected during laser edge scanning.

[0068] Specifically, the perovskite solar cell of the present invention can be either a nip structure or a pin structure. It should be understood that the perovskite solar cell of the present invention is not limited to the above two structures.

[0069] like Figure 2As shown, the perovskite solar cells of the two structures include conductive glass 13, a first transmission layer 14a, a perovskite absorption layer 15, a second transmission layer 14b and a back electrode layer 16 stacked in sequence from bottom to top. The conductive glass 13 includes a glass substrate 131 and a TCO layer 132.

[0070] Specifically, the NIP-structured perovskite solar cell includes a conductive glass 13, an electron transport layer (first transport layer 14a), a perovskite absorption layer 15, a hole transport layer (second transport layer 14b) and a back electrode layer 16 stacked in sequence from bottom to top.

[0071] The pin-structured perovskite solar cell includes a conductive glass 13, a hole transport layer (first transport layer 14a), a perovskite absorption layer 15, an electron transport layer (second transport layer 14b) and a back electrode layer 16 stacked in sequence from bottom to top.

[0072] Optionally, the electron transport layer and the hole transport layer may not be present.

[0073] Optionally, the perovskite layer and the back electrode layer 16 can be removed in a specified proportion by laser scribing to form a battery chip with a certain transmittance.

[0074] The perovskite absorption layer 15 is an organic-inorganic hybrid perovskite semiconductor film, which can be MAPbI3, FAPbI3, FA x MA 1-x Pb(I x Br 1-x )3 or Cs x (FA y MA 1-y ) 1-x Pb(I y Br 1-y )3, etc., wherein MA is formylamine, FA is formamidine, and x, y are numbers between 0-1.

[0075] Optionally, the perovskite layer and the back electrode layer 16 may be removed in a specified proportion by laser scribing to form a battery chip with a certain light transmittance.

[0076] Furthermore, if Figure 4 As shown, the insulating line scribing step requires the removal of the electron transport layer, perovskite absorption layer 15, hole transport layer, and back electrode layer 16, leaving behind the glass substrate 131 and TCO layer 132. If there is no electron transport layer and hole transport layer, only the perovskite absorption layer 15 and back electrode layer 16 are removed.

[0077] In an embodiment of the present invention, the step of scribing the insulation lines needs to be performed in accordance with the cell chip size and shape requirements required by the specified BIPV component 6 .

[0078] In an embodiment of the present invention, the processing method of the perovskite solar cell further includes the following steps:

[0079] Sweep edge: Figure 5 and Figure 6 As shown, the first perovskite solar cell chip 1a is trimmed along the insulating line 11, removing all coating layers on the glass substrate 131 to form a trimmed portion 12. This ensures the insulation performance of the final product and prevents electric shock and personal injury. The cutting step is performed along the trimmed portion 12. The term "trimmed portion 12" should be understood as the area formed after the trimming step.

[0080] Furthermore, if Figure 6 As shown, the edge scanning step requires removing the TCO layer 132 , the electron transport layer, the perovskite absorption layer 15 , the hole transport layer and the back electrode layer 16 , leaving only the glass base layer 131 .

[0081] In an embodiment of the present invention, the edge sweeping step includes a laser process, a sandblasting process, or a solution etching process.

[0082] In an embodiment of the present invention, the processing method of the perovskite solar cell further includes the following steps:

[0083] Packaging: such as Figure 10 and Figure 11 As shown, the second perovskite solar cell chip 1b forms an effective electrical connection, at least one side of the second perovskite solar cell chip 1b is covered with a packaging film 61, and at least one side of the second perovskite solar cell chip 1b is encapsulated with an encapsulation glass 62.

[0084] Alternatively, as Figure 11 As shown, the front and back sides of the second perovskite solar cell chip 1 b may be covered with a packaging film 61 , and then the front and back sides of the second perovskite solar cell chip 1 b may be encapsulated with packaging glass 62 .

[0085] Or, as Figure 10 As shown, one side of the second perovskite solar cell chip 1 b is covered with a packaging film 61 , and then this side is encapsulated with packaging glass 62 .

[0086] In an embodiment of the present invention, the first perovskite solar cell chip 1a is a standard perovskite solar cell, and the second perovskite solar cell chip 1b is a non-standard perovskite solar cell. That is, the processing method of the perovskite solar cell of the present invention is a method for processing a standard perovskite solar cell into a non-standard perovskite solar cell. It should be understood that the present invention is also applicable to various scenarios where perovskite solar cells need to be cut into specific sizes or shapes. Therefore, the first perovskite solar cell chip 1a is not limited to being a standard perovskite solar cell. The second perovskite solar cell chip 1b is also not limited to being a non-standard perovskite solar cell.

[0087] The present invention also provides a perovskite solar cell and a processing method for the perovskite solar cell. The specific steps of the processing method of the perovskite solar cell refer to the above-mentioned embodiment. Since the perovskite solar cell adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

[0088] The present invention also provides a BIPV component 6, comprising a perovskite solar cell obtained by the above-mentioned processing method of the perovskite solar cell.

[0089] Optionally, the BIPV assembly 6 further includes an encapsulation film 61 and an encapsulation glass 62, wherein the encapsulation film 61 covers at least one surface of the perovskite solar cell and the encapsulation glass 62 covers at least one surface of the perovskite solar cell.

[0090] Optionally, the packaging film 61 is selected from at least one of ethylene-vinyl acetate copolymer, polyvinyl butyral, ionomer film or ethylene-α-olefin copolymer.

[0091] In order to further understand the present invention, preferred embodiments of the present invention are described below in conjunction with specific examples. However, it should be understood that these descriptions are only for further illustrating the features and advantages of the present invention, rather than limiting the claims of the present invention.

[0092] Example 1

[0093] like Figure 12 As shown, the main steps of this embodiment are as follows:

[0094] Provide the first perovskite solar cell chip S1: Use the glass-based perovskite cell production line to manufacture perovskite cell chips of production line standard size, namely standard perovskite solar cells.

[0095] Scribing insulation lines S2: Laser scribes insulation lines 11 on standard perovskite solar cells according to the size and shape requirements of the non-standard perovskite solar cells required by the specified BIPV module 6. The insulation lines 11 remove all coating layers on the glass substrate 131 except the TCO layer 132.

[0096] Edge sweeping S3: Use laser to sweep the edge of the standard perovskite solar cell along the insulation line 11, that is, remove all coating layers on the glass substrate 131 to obtain the edge sweeping portion 12, so as to ensure the insulation performance of the final product and avoid leakage and injury incidents.

[0097] Cutting with a cutting knife S4a: Using a glass cutting knife to cut the standard perovskite solar cell into a specified size, a non-standard perovskite solar cell is obtained.

[0098] Liquid nitrogen cooling edge grinding S5a: Use a double-glass edge grinding machine or a single-edge edge grinding machine with liquid nitrogen to grind the edges of non-standard perovskite solar cells.

[0099] Cleaning surface S6: Use compressed air to clean the surface of non-standard perovskite solar cells.

[0100] Packaging S7: Use packaging film 61 and packaging glass 62 to package the non-standard size battery chip. Before packaging, use conductive leads, insulating tape, etc. to form an effective electrical connection on the surface of the battery chip to facilitate the subsequent installation of the photovoltaic junction box.

[0101] The packaging film 61 can be made of a polymer adhesive such as EVA (ethylene-vinyl acetate copolymer), PVB (polyvinyl butyral), SGP (ionotropic film), or POE (ethylene-α-olefin copolymer).

[0102] The glass used for packaging can also be treated with coating, glaze, etc. to give it a variety of colors and pattern effects.

[0103] Install the photovoltaic junction box. The junction box can be an integrated junction box or a split junction box. The junction box can be installed on the side of the BIPV module 6 or on the back of the BIPV module 6.

[0104] Example 2

[0105] like Figure 12 As shown, the main steps of this embodiment are as follows:

[0106] Provide the first perovskite solar cell chip S1: Use the glass-based perovskite cell production line to manufacture perovskite cell chips of production line standard size, namely standard perovskite solar cells.

[0107] Scribing insulation lines S2: In accordance with the non-standard perovskite solar cell size and shape requirements of the specified BIPV module 6, laser scribes insulation lines 11 on the standard perovskite solar cell. The insulation lines 11 remove all coating layers on the glass substrate 131 except the TCO layer 132.

[0108] Edge sweeping S3: Use laser to sweep the edge of the standard perovskite solar cell along the insulation line 11, that is, remove all coating layers on the glass substrate 131 to obtain the edge sweeping portion 12, so as to ensure the insulation performance of the final product and avoid leakage and injury incidents.

[0109] Laser Cutting S4b: Using a laser cutting machine, standard perovskite solar cells are cut to meet specific requirements, resulting in custom perovskite solar cells. Because the cut edges are not sharp, cracks, edge chipping, or corner collapse are rare, and subsequent edge grinding is unnecessary.

[0110] Packaging S7: Use packaging film 61, glass and non-standard perovskite solar cells for packaging. Before packaging, use conductive leads, insulating tape, etc. to form an effective electrical connection on the surface of the battery chip to facilitate the subsequent installation of the photovoltaic junction box.

[0111] The packaging film 61 can be made of a polymer adhesive such as EVA (ethylene-vinyl acetate copolymer), PVB (polyvinyl butyral), SGP (ionotropic film), or POE (ethylene-α-olefin copolymer).

[0112] The glass used for packaging can also be treated with coating, glaze, etc. to give it a variety of colors and pattern effects.

[0113] Install the photovoltaic junction box. The junction box can be an integrated junction box or a split junction box. The junction box can be installed on the side of the BIPV module 6 or on the back of the BIPV module 6.

[0114] Example 3

[0115] like Figure 12 As shown, the main steps of this embodiment are as follows:

[0116] Provide the first perovskite solar cell chip S1: Use the glass-based perovskite cell production line to manufacture perovskite cell chips of production line standard size, namely standard perovskite solar cells.

[0117] Scribing insulation lines S2: In accordance with the non-standard perovskite solar cell size and shape requirements of the specified BIPV module 6, laser scribes insulation lines 11 on the standard perovskite solar cell. The insulation lines 11 remove all coating layers on the glass substrate 131 except the TCO layer 132.

[0118] Edge sweeping S3: Use laser to sweep the edge of the standard perovskite solar cell along the insulation line 11, that is, remove all coating layers on the glass substrate 131 to obtain the edge sweeping portion 12, so as to ensure the insulation performance of the final product and avoid leakage and injury incidents.

[0119] Cutting with a cutting knife S4a: Using a glass cutting knife to cut the standard perovskite solar cell according to the specified size, a non-standard perovskite solar cell is obtained.

[0120] Water-cooled edge grinding after waterproof protective film application S5b: A layer of polymer plastic film with single-sided adhesive is applied to the surface of the non-standard perovskite solar cell to prevent moisture intrusion during subsequent edge grinding and cleaning. Edge grinding and cleaning are performed using edge grinding and cleaning machines used in the glass processing industry; the polymer plastic film is removed.

[0121] Packaging S7: Use packaging film 61, glass and non-standard perovskite solar cells for packaging. Before packaging, use conductive leads, insulating tape, etc. to form an effective electrical connection on the surface of the battery chip to facilitate the subsequent installation of the photovoltaic junction box.

[0122] The packaging film 61 can be made of a polymer adhesive such as EVA (ethylene-vinyl acetate copolymer), PVB (polyvinyl butyral), SGP (ionotropic film), or POE (ethylene-α-olefin copolymer).

[0123] The glass used for packaging can also be treated with coating, glaze, etc. to give it a variety of colors and pattern effects.

[0124] Install the photovoltaic junction box. The junction box can be an integrated junction box or a split junction box. The junction box can be installed on the side of the BIPV module 6 or on the back of the BIPV module 6.

[0125] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for processing a perovskite solar cell, characterized in that: The following steps are involved: A first perovskite solar cell chip is provided; the first perovskite solar cell chip is a standard perovskite solar cell; the first perovskite solar cell chip has a glass substrate and several coating layers located on a surface of the glass substrate, and the first coating layer located on the surface of the glass substrate is a TCO film layer; Scribing insulating lines: Scribing the insulating lines on the first perovskite solar cell chip using a laser; removing at least all coating layers other than the TCO film layer from the insulating lines; Edge sweeping: sweeping the first perovskite solar cell chip along the insulating line, that is, removing all the coating layers on the glass substrate to obtain a swept edge portion; Cutting: The cutting step is performed along the edge sweeping portion; the first perovskite solar cell chip is cut by mechanical cutting to obtain a second perovskite solar cell chip; after cutting by the mechanical cutting, the second perovskite solar cell chip is edge-grinded, and the temperature is cooled by liquid gas during the edge grinding step; the liquid gas is selected from at least one of liquid nitrogen, liquid oxygen, liquid argon, liquid air, liquid carbon dioxide or liquid helium.

2. The method for processing a perovskite solar cell according to claim 1, wherein: The following steps are also included: Cleaning the surface: Cleaning the surface of the second perovskite solar cell chip using compressed air at least after the edge grinding step.

3. The method for processing a perovskite solar cell according to claim 1, wherein: The process steps of the edge sweeping step include a laser process, a sandblasting process or a solution etching process.

4. The method for processing a perovskite solar cell according to claim 1, wherein: The following steps are also included: Encapsulation: The second perovskite solar cell chip forms an effective electrical connection, at least one side of the second perovskite solar cell chip is covered with an encapsulation film, and at least one side of the second perovskite solar cell chip is encapsulated with encapsulation glass.

5. The method for processing a perovskite solar cell according to any one of claims 1 to 4, wherein: The second perovskite solar cell chip is a non-standard perovskite solar cell.

6. The method for processing a perovskite solar cell according to any one of claims 1 to 4, wherein: The mechanical cutting is selected from any one of glass knife cutting, CNC grinding cutting, knife wheel cutting or micro-wire cutting.

7. A perovskite solar cell, characterized in that: The perovskite solar cell is prepared using the processing method of any one of claims 1 to 6.

8. BIPV assembly, characterized in that A perovskite solar cell obtained by the processing method of a perovskite solar cell according to any one of claims 1 to 6.

9. The BIPV assembly according to claim 8, wherein Also includes: An encapsulation film, the encapsulation film covering at least one surface of the perovskite solar cell; as well as Encapsulation glass, where the encapsulation glass covers at least one surface of the perovskite solar cell.

10. The BIPV assembly according to claim 9, wherein The packaging film is selected from at least one of ethylene-vinyl acetate copolymer, polyvinyl butyral, ionotropic film or ethylene-α-olefin copolymer.

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