Sound insulation structure

Abstract

The objective of this invention is to provide a sound insulation structure that achieves sufficient sound insulation even when an adhesive layer is provided, and the frequency band in which the sound insulation effect is generated is unlikely to deviate. A sound insulation structure includes at least a sound insulation member and an adhesive layer. The sound insulation member has a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion. The adhesive layer is provided on the side of the sheet portion opposite to the side where the protrusions are provided. The sound insulation structure satisfies the following formula (1): E_adhesive / I_adhesive > 0.5 × (E_film / H) (1) E_adhesive (MPa): storage modulus of the adhesive layer; I_adhesive (mm): average film thickness of the adhesive layer; E_film (MPa): storage modulus of the sheet portion and the protrusions; H (mm): average height of the sheet portion and the protrusions.

Description

Technical Field

[0001] This invention relates to sound insulation structures. Background Technology

[0002] In residential buildings, office buildings, hotels, and other buildings, there is a requirement to shield against outdoor noise from vehicles, railways, airplanes, and ships, as well as equipment noise and human voices generated inside the building, demanding a level of quietness suitable for the intended use of the space. Furthermore, vehicles such as cars, railways, airplanes, and ships require shielding against wind noise and engine noise, necessitating the reduction of indoor noise to provide a quiet and comfortable space for passengers. Therefore, research and development are underway on methods to shield against the transmission of noise and vibration from the outside to the inside, or from the outside of vehicles to the inside—in other words, vibration damping and sound insulation methods. In recent years, the increasing height of buildings has led to a demand for lightweight vibration damping and sound insulation components. Additionally, lightweight vibration damping and sound insulation components are needed in transportation vehicles to improve energy efficiency. Furthermore, to increase the design freedom of buildings, transportation vehicles, and these devices, there is a need for vibration damping and sound insulation components capable of handling complex shapes.

[0003] Generally, the characteristics of vibration damping and sound insulation components follow the so-called mass law. That is, the transmission loss, which is an indicator of noise reduction, is determined by the logarithm of the product of the mass of the vibration damping and sound insulation component and the frequency of the elastic wave and the sound wave. Therefore, in order to further increase the reduction of noise at a certain frequency, the mass of the vibration damping and sound insulation component must be increased. However, the methods for increasing the mass of vibration damping and sound insulation components are limited by the mass of buildings, vehicles, etc., thus restricting the amount of noise reduction.

[0004] To address the issue of increased weight in seismic and sound-insulating components, structural improvements have been continuously implemented. Examples include methods such as combining rigid flat materials like gypsum board, concrete, steel plates, glass plates, and resin boards; and methods using gypsum board to create hollow double-walled or triple-walled structures.

[0005] Furthermore, in recent years, in order to achieve sound insulation performance that transcends the laws of quality, sound insulation panels based on plate-shaped acoustic supermaterials have been proposed, which combine high-rigidity flat plates and resonators. Specifically, sound insulation panels made by setting multiple independent stump-shaped protrusions (resonators) made of silicone rubber and tungsten or multiple independent stump-shaped protrusions (resonators) made of rubber on an aluminum substrate have been proposed (see Non-Patent Documents 1 and 2), and sound insulation panels made by setting multiple independent stump-shaped protrusions (resonators) made of silicone rubber or silicone rubber and lead caps on an epoxy board have been proposed (see Non-Patent Document 3).

[0006] In addition, a sound insulation sheet component having a sheet body and a resonant part has been proposed, wherein the sheet body is viscoelastic and the resonant part has a base and a counterweight part (Patent Document 1).

[0007] In addition, a structure is disclosed which is formed by bonding and layering vibration damping and sound insulation materials with an elastic adhesive (Patent Document 2).

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent Document 1: International Publication No. 2017 / 135409

[0011] Patent Document 2: Japanese Patent Application Publication No. 2001-303691

[0012] Non-patent literature

[0013] Non-patent literature 1: MBAssouar, M. Senesi, M. Oudich, M. Ruzzee and Z. Hou, Broadband plate-type acoustic metamaterial for low-frequency sound attenuation, Applied Physics Letters, 2012, volume 101, pp 173505.

[0014] Non-patent literature 2: M. Oudich, B. Djafari-Rouhani, Y. Pennec, MBAssouar, and B. Bonello, Negative effective mass density of acoustic metamaterial plate decorated with low frequency resonant pillars, Journal of Applied Physics, 2014, volume 116, pp184-504.

[0015] Non-patent literature 3: M. Oudich, Y. Li, MBAssouar, and Z. Hou, A sonic band gap based on the locally resonant phononic plates with stubs, New Journal of Physics, 2010, volume 12, pp083049. Summary of the Invention

[0016] The problem that the invention aims to solve

[0017] While the sound insulation sheet described in Patent Document 1 is relatively lightweight and has high sound insulation performance that surpasses the law of mass, and has excellent manufacturability and durability, it only describes the various possible methods for bonding, materials and conditions, without fully studying the details.

[0018] That is, the method of setting is not particularly limited. Examples include methods such as pressing together separately molded parts by heating and pressurizing, bonding with various known adhesives, and joining by heat fusion, ultrasonic welding, laser welding, etc. As adhesives, examples include epoxy resin adhesives, acrylic resin adhesives, polyurethane resin adhesives, silicone resin adhesives, polyolefin resin adhesives, polyvinyl butyral resin adhesives, and mixtures thereof, but none of these have been studied in particular detail.

[0019] However, according to the applicant's research, depending on the morphology (film thickness, properties) of the adhesive layer formed by the adhesive, there may be cases of insufficient sound insulation effect or deviation of the frequency band that produces sound insulation effect.

[0020] This invention was made in view of the prior art. Its object (problem) is to provide a sound insulation structure that can achieve sufficient sound insulation even when an adhesive layer is provided, and the frequency band in which the sound insulation effect is produced is unlikely to deviate.

[0021] It should be noted that, not limited to the purposes stated herein, the effects derived from the various configurations shown in the specific embodiments described later, i.e., effects that cannot be obtained by conventional techniques, can also serve as other purposes of the present invention.

[0022] Methods for solving problems

[0023] The inventors discovered that the above-mentioned problem was solved by using a sound insulation structure, thereby completing the present invention. The sound insulation structure is a sound insulation structure having a sheet-like sheet portion and a plurality of protrusions provided on the aforementioned sheet portion. The sheet portion is provided by an adhesive layer having specific mechanical properties and shape.

[0024] That is, the present invention provides various specific methods as shown below.

[0025] [1] A sound insulation structure having at least: a sound insulation member having a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion; and an adhesive layer provided on the surface of the sheet portion opposite to the side where the protrusions are provided, the sound insulation structure satisfying the following formula (1).

[0026] E_adhesion / I_adhesion > 0.5 × (E_membrane / H)(1)

[0027] E_adhesion (MPa): Storage modulus of the adhesive layer

[0028] I_Adhesion (mm): Average film thickness of the adhesive layer

[0029] E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion

[0030] H (mm): Average height of the sheet body and the protrusion

[0031] [2] A sound insulation structure comprising: a sound insulation member having a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion, and an adhesive layer disposed on a surface of the sheet portion opposite to the side where the protrusions are provided, and,

[0032] The normalized natural frequency offset that satisfies the following formula is 0-30%.

[0033] Standardized natural frequency offset (%) = ((Design natural frequency) - (Natural frequency)) ÷ (Design natural frequency)

[0034] Design natural frequency (Hz): The natural frequency calculated without an adhesive layer.

[0035] Natural frequency (Hz): The natural frequency calculated under conditions with an adhesive layer.

[0036] [3] A sound insulation structure has: a sound insulation member having a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion, and an adhesive layer provided on the surface of the sheet portion opposite to the side where the protrusions are provided, wherein the elastic modulus of the adhesive layer is greater than 10 MPa.

[0037] [4] The sound insulation structure according to any one of [1] to [3] has an adhesive bonded to the sound insulation member by means of the aforementioned adhesive layer.

[0038] [5] The sound insulation structure described in [4] satisfies the following equations (2) and (3).

[0039] 7000≥E_adhesion / E_film≥0.5 (2)

[0040] 50.0≥E_adh / E_adh≥0.00002 (3)

[0041] E_adhesion (MPa): Storage modulus of the adhesive layer

[0042] E_membrane (MPa): Storage modulus of the sheet

[0043] E_adh (MPa): Storage modulus of the adherend

[0044] [6] The sound insulation structure according to any one of [1] to [5] satisfies the following formula (4).

[0045] 1.0≥I_stickiness≥0.005 (4)

[0046] I_Adhesion (mm): Average film thickness of the adhesive layer

[0047] [7] According to any one of [1] to [6], the aforementioned formula (1) satisfies the following formula (1)'.

[0048] E_adhesion / I_adhesion>β×(E_film / H) (1)'

[0049] In the above formula (1)', E_adhesion, I_adhesion, E_film and H are the same as in the previous formula (1), β=5.

[0050] [8] The sound insulation structure according to any one of [1] to [7] has an E_viscosity greater than 10 MPa.

[0051] [9] In any one of [1] to [8], the aforementioned adhesive layer comprises one or more resins selected from the group consisting of silicone resins, epoxy resins and cyanoacrylate resins, and the total content of these resins in the adhesive layer is 10% by weight or more.

[0052]

[10] The sound insulation structure according to any one of [1] to [9], wherein the aforementioned adhesive layer contains an inorganic filler, and the inorganic filler in the adhesive layer contains 1% by weight or more.

[0053]

[11] A method for manufacturing a sound insulation structure, comprising a sound insulation component and an adhesive layer, wherein the sound insulation component has a sheet-like body portion and a plurality of protrusions provided on the sheet-like body portion, and the adhesive layer is provided on the surface of the sheet-like body portion opposite to the side on which the protrusions are provided.

[0054] The method for manufacturing the sound insulation structure includes:

[0055] The process of forming a sound-insulating component with multiple protrusions on one surface of the sheet body, and

[0056] The process of applying an adhesive layer to the aforementioned sound insulation component, and,

[0057] It satisfies the following equation (1).

[0058] E_adhesion / I_adhesion>0.5×(E_film / H) Equation (1)

[0059] E_adhesion (MPa): Storage modulus of the adhesive layer

[0060] I_Adhesion (mm): Average film thickness of the adhesive layer

[0061] E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion

[0062] H (mm): Average height of the sheet body and the protrusion

[0063]

[12] The method for manufacturing a sound insulation structure according to

[11] further includes a tool for setting an adhesive, wherein the adhesive is bonded to the sound insulation member through the adhesive layer.

[0064] Invention Effects

[0065] The present invention provides a sound insulation structure that can achieve sufficient sound insulation even when an adhesive layer is provided, and the frequency band in which the sound insulation effect is generated is unlikely to deviate. Attached Figure Description

[0066] [ Figure 1 This is a schematic perspective view of the sound insulation structure according to this embodiment.

[0067] [ Figure 2 ]for Figure 1 The cross-sectional view of line II-II.

[0068] [ Figure 3 This is a schematic perspective view of the sound insulation structure according to this embodiment.

[0069] [ Figure 4 ]for Figure 3 The cross-sectional view of line III-III.

[0070] [ Figure 5 [A diagram showing a simplified model illustrating the operating principle of the sound insulation structure according to this embodiment.]

[0071] [ Figure 6 [A diagram showing a simplified model illustrating the operating principle of the sound insulation structure according to this embodiment.]

[0072] [ Figure 7 This is a graph showing the load-displacement curves obtained by measurement using an indenter hardness tester.

[0073] [ Figure 8 [This is a cross-sectional view of the sound insulation structure involved in this embodiment.]

[0074] [ Figure 9 This is a schematic perspective view of the sound insulation structure according to this embodiment.

[0075] [ Figure 10 ]for Figure 9 A cross-sectional view of line IV-IV.

[0076] [ Figure 11 (a) is a schematic perspective view of the resonant part including the base and the counterweight part with the through hole, and (b) is a schematic perspective view of the counterweight part with the through hole.

[0077] [ Figure 12 This is a schematic perspective view of the sound insulation structure according to this embodiment.

[0078] [ Figure 13 This is a schematic perspective view of the sound insulation structure according to this embodiment.

[0079] [ Figure 14 This is a diagram illustrating an example of the manufacturing process of a sound insulation component.

[0080] [ Figure 15 This is a diagram illustrating an example of the manufacturing process of a sound insulation component.

[0081] [ Figure 16 This is a diagram illustrating an example of the manufacturing process of a sound insulation component.

[0082] [ Figure 17 This is a diagram illustrating an example of the manufacturing process of a sound insulation component.

[0083] [ Figure 18 [This is a schematic diagram of the unit cells used in the calculation of the natural frequency.]

[0084] [ Figure 19 [This is a schematic diagram of the unit cells used in the calculation of the natural frequency.]

[0085] [ Figure 20 [This is a schematic diagram of the unit cells used in the calculation of the natural frequency.]

[0086] [ Figure 21 [This is a schematic diagram of the unit cells used in the calculation of the natural frequency.]

[0087] [ Figure 22 [A graph is shown to illustrate the relationship between the standardized intrinsic frequency offset and β in the embodiment.] Detailed Implementation

[0088] The embodiments of the present invention are described in detail below, but these descriptions are only examples (representative examples) of the embodiments of the present invention, and the present invention is not limited to these contents as long as it does not depart from its spirit.

[0089] Furthermore, unless otherwise specified, the positional relationships (top, bottom, left, right, etc.) in this specification are based on those shown in the accompanying drawings. Also, the scale of the accompanying drawings is not limited to the scale depicted. It should be noted that in this specification, expressions such as "1 to 100" include both the lower limit "1" and the upper limit "100". The same applies to other numerical range expressions.

[0090] In addition, in this specification, "multiple" means 2 or more.

[0091] <Sound insulation structure>

[0092] As one embodiment of the present invention, the sound insulation structure (hereinafter also referred to as "sound insulation structure") is a sound insulation structure having at least a sound insulation member and an adhesive layer. The sound insulation member has a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion. The adhesive layer is provided on the surface of the sheet portion opposite to the side where the protrusions are provided. The sound insulation structure satisfies the following formula (1).

[0093] E_adhesion / I_adhesion>0.5×(E_membrane / H) (1)

[0094] E_adhesion (MPa): Storage modulus of the adhesive layer

[0095] I_Adhesion (mm): Average film thickness of the adhesive layer

[0096] E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion

[0097] H (mm): Average height of the sheet body and the protrusion

[0098] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the following embodiments are illustrative of the present invention, and the present invention is not limited to these embodiments.

[0099] In addition, unless otherwise specified, the terms "protrusion" or "resonance" in this specification refer to all of the multiple protrusions or all of the resonances, respectively.

[0100] The sound insulation structure preferably further includes, in addition to the above-described configuration, an adhesive layer that is bonded to the sound insulation component. Figure 1 and Figure 2 The figures shown are a schematic perspective view and a cross-sectional view along line II-II, illustrating a first embodiment of the present invention in which the aforementioned adhesive is provided on a sound insulation structure (hereinafter also referred to as "sound insulation structure 1"). The sound insulation structure 1 includes a sound insulation member 12, an adhesive 13, and an adhesive layer 14. The sound insulation member 12 has a sheet-like sheet portion 10 and a plurality of protrusions 11 provided on the sheet portion. The adhesive layer 14 adheres the sound insulation member to the adhesive 13. It should be noted that the protrusions are, in principle, composed of resonant portions, but also include elements described later. Figure 12 and Figure 13 The protrusion shown. In the following description, except for the explanation of the protrusion, the convex part will also be referred to as the resonant part. It should be noted that, Figure 12 and Figure 13 In this text, the convex portion 11 and the protruding portion 31, which serve as the resonant portion, are described separately, but the protruding portion is a concept included within the convex portion.

[0101] In this sound insulation structure 1, for example, when a sound wave is incident from a noise source located on the side of the adherend 13, resonance occurs in the sheet portion 10 and / or the resonant portion 11. At this time, it is possible that the direction of the force acting on the adherend 13 is opposite to the direction of the acceleration generated in the sheet portion 10 and / or the resonant portion 11 in the frequency domain. Part or all of the vibrations at a specific frequency are canceled out, thereby producing a complete acoustic bandgap where vibrations at that specific frequency are almost completely absent. Therefore, near the resonant frequency of the sheet portion 10 and / or the resonant portion 11, some or all of the vibrations will stop, resulting in high sound insulation performance that transcends the law of mass, even with a relatively light weight. Sound insulation components utilizing this principle are called acoustic super-materials.

[0102] Furthermore, the spring constant can be adjusted by changes in the shape, density distribution, or raw materials (storage modulus, mass) of the resonant part 11, as described later. Figure 3 By changing the mass of the counterweight 22 shown, the resonant frequency of the resonant part 11 can be easily controlled. Furthermore, by adjusting the raw materials and thickness of the sheet part 10, the frequency band (sound band gap width, frequency position) can also be controlled. Therefore, compared with conventional sound insulation structures, the sound insulation structure 1 described above offers superior freedom in selecting the sound insulation frequency and in design.

[0103] Furthermore, since the sound insulation member 12 is viscoelastic, even if the adhered object 13 is a non-flat surface such as a curved surface, the stretchable and flexible sheet portion 10 can follow its surface shape. As a result, the sheet portion 10 can be stably mounted on the adhered object 13. Therefore, the sound insulation structure 1 according to this embodiment has superior operability and versatility compared to conventional sound insulation structures.

[0104] Furthermore, when the sheet portion 10 and the resonant portion 11 are integrally formed, multiple resonant portions 11 (resonators) can be provided at the same time, thus significantly improving manufacturability and operability.

[0105] Additionally, as described later. Figure 12 and Figure 13 In the case of the rib-shaped protrusions 31 and cylindrical protrusions 32 shown, since the protrusions with a maximum height higher than the maximum height of the resonant portion 11 are provided, during the manufacturing stage of the sound insulation member 12, even when the sound insulation member 12 is wound into a sheet or multiple sheets are overlapped, the protrusions function as spacers, suppressing contact between the resonant portion 11 and the back of the sheet portion 10. Therefore, manufacturing problems such as deformation, variation, cracking, detachment, and damage of the resonant portion 11 are avoided, and the sound insulation member 12 can be continuously produced and stored in a so-called roll-to-roll manner. Compared with intermittent production piece by piece, the production speed is increased, and the productivity and economy are improved.

[0106] Furthermore, the sheet portion and the resonant portion can be integrally molded. In this case, there is no joint surface, which can reduce the impact of external forces such as vibration and changes in the external environment such as temperature and humidity on the boundary surface of the vulnerable part, thus resulting in excellent durability.

[0107] Furthermore, by satisfying the following equation (1), the sound insulation structure can achieve higher sound insulation performance, specifically, it can achieve the effect that the frequency band that produces the sound insulation effect is unlikely to deviate.

[0108] E_adhesion / I_adhesion>0.5×(E_membrane / H) (1)

[0109] E_adhesion (MPa): Storage modulus of the adhesive layer

[0110] I_Adhesion (mm): Average film thickness of the adhesive layer

[0111] E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion

[0112] H (mm): Average height of the sheet body and the protrusion

[0113] Regarding the sound insulation performance in this invention, as Figure 5 The operating principle shown can be described using a simple model consisting of a resonator with a spring as the unit. Figure 5The arrow indicates the direction of resonance. Additionally, Figure 5 In this design, a circle indicates a weight with a protrusion, a quadrilateral indicates the object to be bonded, a spring on the side of the circle indicates a spring corresponding to the sheet portion and the protrusion, and a spring on the side of the quadrilateral indicates a spring corresponding to the adhesive layer. That is, the spring constant for the sheet portion and the protrusion is set to K. A And set the spring constant of the adhesive section to K. B A series of springs can simulate resonance. The spring constant K of the resin portion, which is the resonant part, is determined by... A The spring constant K of the adhesive B The resultant spring constant K of the series springs ALL It can be written as shown in the following formula (S1). However, the following formula is for the case where the adhesive layer is sufficiently thin and its mass is assumed to be negligible.

[0114] K ALL =1 / (1 / K) A +1 / K B (S1)

[0115] The spring constant of the resin part in the sheet component design is K. A The spring constant of the bonded structure as a whole is K. ALL Therefore |K A -K ALL A smaller value means a smaller deviation of the spring constant from the design. Furthermore, it can be deduced that if this value is divided by the original spring constant, K... A The obtained value (standardized spring constant) is denoted as ΔK = |K A -K ALL | / K A Then we get △K=1 / (1+(K B / K A In order to reduce ΔK, K A / K B A value greater than a certain threshold is a preferred criterion.

[0116] Furthermore, it can be seen that if ΔK becomes smaller, the resonant frequency of the protrusion directly corresponding to the sound insulation zone is denoted as f = (K / m). 1 / 2 (where m is the weight of the convex part), therefore Δf = (ΔK / m) 1 / 2 The deviation from the design frequency also becomes smaller.

[0117] To clarify the correspondence between the above simplified model and the shape and material properties of the protrusion, according to Figure 6 The model shown assumes a rod-shaped spring with a fixed cross-sectional area for the protrusions, such as cylinders or prisms. In this case, the relationship between the weight F and the elongation L in the rod-shaped spring is expressed by the following equation (S2). Figure 6 The arrow indicates the direction of resonance.

[0118] △F=(EA△L / L) (S2)

[0119] E (MPa): Energy storage modulus

[0120] A(mm 2 ): Cross-sectional area of ​​the protrusion

[0121] L (mm): Height of the resin spring section

[0122] △L (mm): Elongation when weight F is applied

[0123] In the above formula, according to the relationship △F / △L=K, the spring constant K of the rod spring is expressed as K=EA / L. Therefore, if K satisfies B / K A If >β (β is a constant), then it can be written as E B A B / L B >βE A A A / L A .

[0124] Here, we can deduce that if the protrusion of the spring part has a fixed cross-sectional area, then A A =A B Therefore, the relationship between the storage modulus of the resin part and the adhesive part and the height or thickness is preferably satisfied by the following formula (S3).

[0125] E B / L B >βE A / L A (S3)

[0126] The relationship in the above equation (S3) can be further calculated and verified using the finite element method. Therefore, the embodiments in this invention use calculations based on the finite element method.

[0127] The inventors have discovered that β ≥ 0.5 is an important condition for suppressing frequency deviations from simulation results based on the finite element method to below 20%. By applying adhesives and structures with materials and shapes that satisfy this relationship, it is possible to provide high-quality products with small deviations from the sound insulation design frequency of the sheet portion.

[0128] When the above formula (1) is expressed as the following formula (1)', the above formula (1) preferably satisfies the formula (1)'. There is no particular limitation as long as β in the formula (1)' is 0.5 or more. From the viewpoint of suppressing the deviation of the frequency band that produces the sound insulation effect, it is preferably 5, more preferably 50, and even more preferably 100. In addition, there is no particular requirement for the upper limit, and it is usually 50,000 or less.

[0129] E_adhesion / I_adhesion>β×(E_film / H) (1)'

[0130] The E_adhesion, I_adhesion, E_film and H in the above formula (1)' are the same as the E_adhesion, I_adhesion, E_film and H in the aforementioned formula (1).

[0131] In this way, by increasing the storage modulus of the adhesive layer relative to its average film thickness by a certain amount compared to the storage modulus of the sheet portion and the protrusion relative to their average height, the vibration of the adhered object is fully transmitted to the sound insulation component, thus achieving a sound insulation effect at the target frequency. When the storage modulus of the adhesive layer is small, when the average film thickness of the adhesive layer is large, i.e., when the left side of equation (1) is small, the movement of the adhesive layer caused by the vibration of the adhered object becomes non-negligible, resulting in difficulty in achieving a sound insulation effect at the target frequency.

[0132] It should be noted that although there are patent documents such as 2 that have consistently used adhesives when installing sound insulation materials, the purpose is usually to buffer impact, and the storage modulus of the adhesive layer is small. If the storage modulus of the adhesive layer is small, the left side becomes smaller, so it is usually difficult to achieve a sound insulation effect at the target frequency. Therefore, although it is also affected by the relationship with other values, when the storage modulus of the adhesive layer is greater than 10 MPa, it is easier to satisfy equation (1).

[0133] The following is a detailed description of each component, including the sound insulation material, the adhered material, and the adhesive layer.

[0134] [Sound insulation components]

[0135] The sound insulation member 12 has a sheet-like sheet portion 10 and a plurality of resonant portions 11 disposed on one surface of the sheet portion.

[0136] The sheet portion 10 and the resonant portion 11 can be made of the same material, or they can be made of different materials. Alternatively, they can be formed as a single piece, or the separately formed components can be combined.

[0137] (Storage modulus E_membrane)

[0138] The energy storage modulus (E_membrane) of the sheet portion 10 and the resonant portion 11 is not particularly limited as long as it satisfies the above formula (1). From the viewpoint of obtaining high sound insulation performance, it is usually 0.5 MPa or more, preferably 1.0 MPa or more, more preferably 2.0 MPa or more, and even more preferably 3.0 MPa or more. In addition, it is usually 500 MPa or less, preferably 300 MPa or less, more preferably 200 MPa or less, and even more preferably 100 MPa or less.

[0139] The so-called storage modulus (E_membrane) of the sheet portion 10 and the resonant portion 11 is the combined storage modulus calculated based on the spring constants of the sheet portion 10 and the resonant portion 11, respectively. The method for calculating the combined storage modulus will be explained below.

[0140] The spring constant (K_film) of the sheet portion 10 and the resonant portion 11 is the combined spring constant of the sheet portion 10 and the resonant portion 11. If the spring constant of the resonant portion is set to K_res and the spring constant of the sheet portion is set to K_sheet, the combined spring constant (K_film) relative to each resonant portion can be obtained according to the following formula (S4).

[0141] K_membrane = 1 / (1 / K_res + 1 / K_sheet) (S4)

[0142] In this case, the individual combined storage moduli (E'_membrane) formed by the sheet portion and the resonant portion can be obtained according to the relationship expressed by the following equation (S5). It should be noted that each parameter can also be measured separately, and finally synthesized and calculated according to the following equation (S5). The calculation methods for K_res and K_sheet are described later.

[0143] K_membrane = E'_membrane × (A / H_membrane) (S5)

[0144] E'_membrane: Storage modulus of each sheet portion and protrusion (the combined storage modulus of the components composed of each sheet portion and resonant portion)

[0145] A: Cross-sectional area of ​​the protrusion (resonance part)

[0146] H_membrane: The height at which the sheet portion and the resonant portion are combined (H_res + H_sheet portion)

[0147] The final synthetic energy storage modulus (E_membrane) is as follows: the synthetic energy storage modulus (E'_membrane) of the above is obtained for multiple protrusions and the value is calculated as their average value.

[0148] In the case that the sheet portion 10 in the sound insulation component is made of a homogeneous single material with uniform thickness, and all resonant portions 11 are made of the same material with the same thickness, it is not necessary to calculate the combined spring constant relative to each resonant portion as described above. Instead, the E'_ membrane calculated based on the combined spring constant relative to any one selected resonant portion can be set as E_ membrane.

[0149] Furthermore, if the sheet portion 10 and the resonant portion 11 are made of the same material, the composite spring constant in any part of either the sheet portion 10 or the resonant portion 11 can be set as K_film.

[0150] It should be noted that the various energy storage moduli mentioned above can be determined by the methods described later. They can be evaluated directly using materials collected from sound insulation components, or indirectly by preparing test pieces manufactured under the same manufacturing conditions.

[0151] When the sound insulation member 12 has the counterweight 22 described later, the storage modulus of the counterweight 22 is not considered in the calculation of the K_ membrane. This is because the counterweight is essentially a rigid body, so only the parts that impart flexibility, namely the sheet portion 10 and the base portion 21 described later, affect the resonance in this invention.

[0152] Storage modulus can be controlled by changing the molecular weight of the resin, the type of bonding, or by adding fillers. Generally, it increases with increasing molecular weight, increasing bonding strength, or adding fillers. Furthermore, for example, when manufacturing a molded article by mixing a resin with a low storage modulus and a resin with a high storage modulus, the storage modulus of the molded article can be controlled by adjusting the mixing ratio of these resins.

[0153] The spring constant K_res of the resonant part and the spring constant K_sheet of the plate part can be obtained based on the energy storage modulus of the resonant part and the plate part, respectively, according to the following equations (S6) and (S7).

[0154] K_res=E_res×A_res / L_res (S6)

[0155] K_sheet body = E_sheet body × A_sheet body / L_sheet body (S7)

[0156] In the above formula, K_res (K_sheet): spring constant of the resonant part (sheet part) (-), E_res (E_sheet): storage modulus of the resonant part (sheet part) (MPa), A_res (A_sheet): cross-sectional area of ​​the resonant part (sheet part) (mm²) 2 L_res (L_sheet): Height (mm) of the resonant part (sheet part).

[0157] The storage moduli E_res and E_sheet modulus of the sheet portion and resonant portion in the above formulas (S6) and (S7) can be determined using an indentation hardness tester according to the following method. The determination of the storage modulus in this application specification is carried out under the conditions of a test atmosphere of 23°C and 50%RH.

[0158] It should be noted that the storage modulus of the adhesive layer can be determined by using an indenter hardness tester. It can be evaluated directly using material collected from the sound insulation structure, or indirectly by preparing test pieces manufactured under the same manufacturing conditions.

[0159] The determination based on the indentation hardness tester is conducted according to the international standard ISO 14577-1. Regarding the indenter used, a Vickers indenter can be used for evaluation.

[0160] The results were obtained through measurements using this indentation hardness tester. Figure 7 The load-displacement curve is shown in the figure. The notation in the figure is as follows.

[0161] F max Maximum test force

[0162] h r The intersection of the tangent to the unloading curve and the indentation depth.

[0163] h f The depth of the permanent indentation after the test force is unloaded.

[0164] h max :F max Maximum indentation depth

[0165] Here, F can be used. max The ratio hmax of the maximum indentation depth to the permanent indentation depth after unloading the test force. f / hmax is one of the indicators of residual strain energy.

[0166] E IT In the analysis, the slope S of the tangent line drawn on the unloading curve is used.

[0167] The combined elastic modulus Er of the indenter and the specimen is expressed by the following formula (L).

[0168] [Number 1]

[0169]

[0170] h c :F max The depth of contact between the indenter and the sample at that time

[0171] A p (h c): Depth h c The contact projected cross-sectional area of ​​the indenter at the point (based on ISO 14577-2).

[0172] Additionally, if the compressive modulus of elasticity (E_res, or E_sheet) of the object being measured is set to E IT Then it is represented by the following formula (M).

[0173] [Number 2]

[0174]

[0175] E i The elastic modulus of the indenter (indenters are typically made of diamond, so a known value is used).

[0176] E r The combined elastic modulus of the indenter and the specimen (the elastic modulus determined experimentally).

[0177] v i Poisson's ratio of the indenter (the indenter is usually made of diamond, and a known value is used).

[0178] v s Poisson's ratio of the sample (using a known value; typically 0.3–0.5 for resins).

[0179] It should be noted that the storage modulus determination based on the above method can also be applied to the determination of the storage modulus of the base, counterweight, protrusion, adhesive, and adhered material described later. When determining the storage modulus of the above materials using this method, it is preferable to use a commercially available instant adhesive or similar material to horizontally adhere and fix the measurement surface onto a flat measurement substrate (quartz glass, glass slide, etc.) that will not deform due to pressing. The pressing amount during measurement is preferably about 1 / 10 or less of the thickness of the object being measured. When the pressing amount is more than 1 / 10 of the thickness of the object being measured, the measured value will be affected by the fixed hardness of the substrate, and therefore it is not suitable as a measurement condition.

[0180] (Height H)

[0181] The height H of the sheet portion 10 and the resonant portion 11 is not particularly limited as long as it satisfies the above formula (1). From the viewpoint of obtaining high sound insulation performance within the audible range, it is generally 0.5 mm or more, preferably 1.0 mm or more, more preferably 2.0 mm or more, and even more preferably 3.0 mm or more. In addition, it is generally 50.0 mm or less, preferably 30.0 mm or less, more preferably 25.0 mm or less, and even more preferably 20.0 mm or less.

[0182] The height H of the sheet portion and the resonant portion refers to the combined height of the sheet portion 10 and the resonant portion 11. Specifically, with the height of each resonant portion set to H_res and the thickness of the sheet portion located directly below it set to H_sheet portion, the total height H' relative to each resonant portion is calculated by the following formula (B), where height H is a value calculated as the average of these total heights.

[0183] H' = H_res + H_sheet body (B)

[0184] It should be noted that in a single resonant section, if there is unevenness in height, the average value is used.

[0185] When the overall thickness of the sheet portion in the sound insulation component 12 is uniform and the height of all resonant portions is the same, it is not necessary to calculate the total height relative to each resonant portion as described above. The total height relative to any one selected resonant portion can be taken as H.

[0186] When the sound insulation member 12 has the counterweight 22 (described later), the height of the front end beyond the counterweight 22 is not considered when calculating H. That is, without the counterweight 22, H is the height from the lower part of the sheet portion 10 to the upper part of the resonant portion 11; with the counterweight 22, H is the height from the lower part of the sheet portion to the lower part of the counterweight 22. This is because, with the counterweight 22, the counterweight is made of a very hard material such as metal or ceramic, and therefore is a rigid body with almost no elongation near the sound insulation frequency. Therefore, the part that produces moderate elongation and strain near the design frequency affects the resonance. That is, only the sheet portion 10 and the base portion 21 (described later) are considered.

[0187] [Piece Body]

[0188] The sheet portion 10 is not particularly limited as long as it is sheet-shaped and has appropriate elongation and strain near the designed sound insulation frequency. In addition, it can be either a plane or a curved surface. When it is used with an object to be bonded, it can be appropriately selected according to the shape of the object to be bonded.

[0189] In this specification, "sheet portion" refers to a sheet-like component that maintains a protrusion on one surface, and as described later, it can consist of one layer or two or more layers. Furthermore, "sheet portion" refers to a whole portion having a sheet shape, such as... Figure 8 As shown, the structure is designed as a sheet body composed of multiple layers, and among these layers are those used to connect two layers ( Figure 8In the case of layer 10(b) made of adhesive bonded to 10(a) and 10(c) in formula (1), the sheet-shaped portion formed by layers 10(a), 10(b) and 10(c) is the sheet body portion, and layer 14 is an adhesive layer adjacent to the side opposite to the protrusion of one of the two sides of layer 10(c), which is the side opposite to the protrusion. Layer 14 becomes the adhesive layer in formula (1). That is to say, Figure 8 In the case that layer 10(a) is not the entire sheet body and layer 10(b) is not the adhesive layer in formula (1).

[0190] Typically, sound insulation design frequencies fall within the audible range, which is 20–20000 Hz. For sheet materials exhibiting suitable elongation and strain within this frequency range, polymeric materials such as resins and rubbers are preferred.

[0191] When sound waves are incident from a noise source, the plate can also function as an oscillator (resonator) that vibrates at a certain frequency.

[0192] The material constituting the sheet portion 10 preferably contains at least one material selected from the group consisting of thermosetting or photocurable elastomers and thermoplastic elastomers.

[0193] When casting is performed using metal molds, the cavity on the mold surface needs to be filled with an elastomer. However, with photocurable elastomers, the cavity can be filled in a liquid state with low viscosity before curing, which can improve the filling rate and is therefore preferred.

[0194] Specifically, the materials constituting the sheet portion 10 may include vulcanized thermosetting resin elastomers such as chemically cross-linked natural rubber or synthetic rubber, urethane thermosetting resin elastomers, silicone thermosetting resin elastomers, fluorinated thermosetting resin elastomers, acrylic thermosetting resin elastomers, and other thermosetting resin elastomers.

[0195] Photocurable elastomers include acrylic-based photocurable elastomers, silicone-based photocurable elastomers, and epoxy-based photocurable elastomers.

[0196] Thermoplastic elastomers include olefin-based thermoplastic elastomers, styrene-based thermoplastic elastomers, polyvinyl chloride-based thermoplastic elastomers, urethane-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, silicone-based thermoplastic elastomers, and acrylic-based thermoplastic elastomers.

[0197] As further specific examples of thermosetting or photocurable elastomers and thermoplastic elastomers, rubber can be cited. Specifically, examples include natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene rubber, ethylene-propylene rubber, chlorosulfonated polyethylene rubber, acrylic rubber, fluororubber, epichlorohydrin rubber, polyester rubber, urethane rubber, silicone rubber, and their modifiers, but are not particularly limited to these. They can be used alone or in combination of two or more.

[0198] Furthermore, among these, natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber, acrylic rubber, fluororubber, epichlorohydrin rubber, polyester rubber, urethane rubber, silicone rubber, and their modifiers are preferred, with silicone rubber, acrylic rubber, and their modifiers being more preferred. Using these materials tends to result in excellent heat resistance and cold resistance.

[0199] The sheet portion 10 may contain various additives such as flame retardants, antioxidants, plasticizers, and colorants.

[0200] Flame retardants are additives used to prevent flammable raw materials from igniting or burning. Specific examples include bromine compounds such as pentabromodiphenyl ether, octabromodiphenyl ether, decabromodiphenyl ether, tetrabromobisphenol A, hexabromocyclododecane, and hexabromobenzene; phosphorus compounds such as triphenyl phosphate; chlorine compounds such as chlorinated paraffin; antimony compounds such as antimony trioxide; metal hydroxides such as aluminum hydroxide; nitrogen compounds such as melamine isocyanurate; and boron compounds such as sodium borate, but they are not specifically limited to these.

[0201] In addition, antioxidants are additives formulated to prevent oxidative degradation. Specific examples include phenolic antioxidants, sulfur-based antioxidants, and phosphorus-based antioxidants, but they are not particularly limited to these.

[0202] Furthermore, plasticizers are additives formulated to improve softness and weather resistance. Specific examples include phthalates, adipates, trimellites, polyesters, phosphate esters, citrates, sebacic acid esters, azelaic acid esters, maleic acid esters, silicone oils, mineral oils, vegetable oils, and their modified forms, but are not particularly limited thereto.

[0203] Furthermore, examples of coloring agents include pigments and dyes.

[0204] They can be used individually or in combination of two or more.

[0205] Figure 1In the above view, the sheet portion 10 is square, but its shape is not particularly limited to this. It can take any shape that appears from a top view, such as a triangle, rectangle, trapezoid, rhombus, pentagon, hexagon, or other polygons; a circle, an ellipse, or any other indeterminate shape not classified here. It should be noted that, as long as the properties of the sheet portion 10 as an acoustic supermaterial are not compromised, it can also have cut-in portions, punched holes, etc., at any position, from the perspective of improving stretchability and weight reduction.

[0206] The thickness (H_sheet) of the sheet portion 10 is not particularly limited as long as the height H of the sheet portion and the protrusion is within the range satisfying the above formula (1). Since the frequency band (acoustic bandgap width, frequency position) exhibiting high sound insulation performance can also be controlled by the thickness of the sheet portion 10, the thickness of the sheet portion 10 can be appropriately set in such a way that the acoustic bandgap is consistent with the desired sound insulation frequency band. If the thickness of the sheet portion 10 is thick, the acoustic bandgap width becomes narrower and tends to shift towards the low frequency side. On the other hand, if the thickness of the sheet portion 10 is thin, the acoustic bandgap width becomes wider and tends to shift towards the high frequency side.

[0207] From the perspectives of sound insulation performance, mechanical strength, flexibility, and processability, the thickness H of the sheet portion 10 is preferably 10 μm or more, more preferably 50 μm or more, and even more preferably 100 μm or more. Furthermore, the thickness of the sheet portion 10 is preferably 2 mm or less, more preferably 1 mm or less, and even more preferably 500 μm or less.

[0208] Furthermore, from the viewpoint of reducing the temperature dependence of sound insulation performance at low temperatures, the sheet portion 10 preferably has a glass transition temperature below 0°C. The lower the glass transition temperature of the sheet portion 10, the higher its cold resistance, and the less the temperature dependence of its storage modulus near 0°C, and the less dependent its sound insulation performance is on ambient temperature. More preferably, it is below -10°C, further preferably below -20°C, and particularly preferably below -30°C. It should be noted that, in this specification, the glass transition temperature of the sheet portion 10 in the dynamic viscoelasticity measurement at the aforementioned frequency of 10Hz, and especially in the temperature dependence measurement, signifies the peak temperature of the loss tangent.

[0209] The sheet portion can be composed of two or more layers, and furthermore, the sheets can be bonded to each other with adhesive layers. In this case, the adhesive layer formed between the sheets can be considered as one layer of the sheet portion. For example, if sheet portion X and sheet portion Y are formed with adhesive layer Z sandwiched between them, the overall composite spring constant of the sheet portion composed of a total of 3 layers can be considered and expressed by the following formula. However, the following formula is based on the assumption that each layer is sufficiently thin relative to the protrusion and its mass is negligible.

[0210] K 片体 =1 / (1 / K) X+1 / (1 / K Z +1 / K Y ))

[0211] L 片体 =L X +L Y +L Z

[0212] The above formula represents K. 片体 (-): The overall composite spring constant of the sheet body, K X K Y (-): Spring constants K of the X and Y axes of the plate body. Z (-): Spring constant of adhesive layer Z, L 片体 (mm): Overall height of the sheet body, L X L Y (mm): Height of sheet body X, height of sheet body Y, and height of sheet body L Z (mm): Height of adhesive layer Z.

[0213] Similar to the discussion of the combined spring constant in the protrusion and sheet portion, the relationship between the parameters can be determined based on the storage modulus and layer thickness of each of the three layers. That is, the overall storage modulus of the sheet portion can be calculated based on the following formula.

[0214] K 片体 =E 片体 ×A / L 片体

[0215] In the above formula, A represents the total cross-sectional area of ​​the sheet portion. Furthermore, using K... 片体 The K-film and E-film of a component consisting of a sheet portion and a resonant portion can be calculated. This is generally the case for four or more layers. Alternatively, for two or more layers, adhesives can be omitted; instead, thermosetting elastomers, photosetting elastomers, etc., can be cured on a separately prepared sheet portion for assembly.

[0216] In this specification, when the sheet has two or more layers, the layer that is furthest from the protrusion among the layers constituting the sheet, that is, the layer on the opposite side of the layer with the protrusion, is sometimes also called the "support".

[0217] The aforementioned support for the supporting protrusions and other sheet-like portions is not particularly limited. Preferably, the material used is polyacrylonitrile, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyvinyl chloride, polyvinylidene chloride, polychlorotrifluoroethylene, polyethylene, polypropylene, polystyrene, cyclic polyolefins, polynorbornene, polyethersulfone, polyetheretherketone, polyphenylene sulfide, polyacrylate, polycarbonate, polyamide, polyimide, triacetyl cellulose, polystyrene, epoxy resin, acrylic resin, oxazine resin, and other organic materials. These organic materials may include metals such as aluminum, stainless steel, iron, copper, zinc, and brass, inorganic glass, inorganic particles, and fiber composite materials. From the perspectives of sound insulation, rigidity, formability, and cost, the support is preferably selected from at least one of the group consisting of photocurable resin sheets, thermosetting resin sheets, thermoplastic resin sheets, metal plates, and alloy plates. Here, the thickness of the support is not particularly limited. Considering factors such as sound insulation performance, rigidity, formability, lightweight, and cost, it is generally preferred to be above 0.1mm and below 50mm.

[0218] [Protruding part (resonance part)]

[0219] There are no particular restrictions on the number of protrusions (resonance parts) 11 provided on one surface of the sheet body 10, and on their appropriate elongation and strain near the designed sound insulation frequency. The resonance part 11 functions as an oscillator (resonator) that vibrates at a certain frequency when a sound wave is incident from a noise source.

[0220] The arrangement, number, and size of the resonant parts 11 can be appropriately set according to the desired performance and are not particularly limited. The resonant parts 11 are grounded to one surface of the sheet body 10. For example... Figure 1 In this embodiment, multiple resonant portions 11 are arranged in a lattice pattern at equal intervals, but the arrangement of the resonant portions 11 is not particularly limited to this. For example, the multiple resonant portions 11 can also be arranged in a houndstooth pattern or randomly. Since the sound insulation mechanism of the sound insulation member involved in this embodiment does not utilize Bragg scattering like a so-called phononic crystal, the spacing of the resonant portions 11 does not need to be arranged in an orderly periodic manner.

[0221] There are no particular restrictions on the material constituting the resonant portion 11, and its conditions are the same as those for the material in the sheet portion 10 described above. From the viewpoint of product cost and ease of manufacturing, it is preferable that the material of the resonant portion 11 is the same as the material of the sheet portion 10.

[0222] The number of resonant parts 11 per unit area is not particularly limited, as long as they can be arranged in a way that does not cause interference, such as by having the resonant parts 11 contact each other.

[0223] The maximum number of resonant parts 11 per unit area also varies depending on the shape of the resonant parts 11, etc. For example, when the resonant part 11 is cylindrical, the height direction of the cylinder is set to be parallel to the normal direction of the sheet, and the diameter of the cylinder cross-section is 1 cm, it is preferable to have 10 cm of resonant parts per unit area. 2 The number is less than 100.

[0224] Regarding the minimum number of resonant portions 11 per unit area, for example, when the resonant portion 11 is cylindrical, the height direction of the cylinder is set to be parallel to the normal direction of the sheet, and the cross-sectional diameter is 1 cm, it is preferable to have 10 cm of resonant portion 11 per unit area. 2 The number of resonant portions 11 is two or more, more preferably ten or more, and even more preferably fifty or more. When the number of resonant portions 11 is at or above the lower limit of the above-mentioned preferences, there is a tendency to obtain higher sound insulation performance. Furthermore, when the number is at or below the upper limit of the above-mentioned preferences, it is easier to achieve overall weight reduction of the sheet body.

[0225] Regarding the height H_res of the resonant portion 11 in the normal direction of the sheet portion 10, there are no particular limitations as long as the height H of the sheet portion and the protrusion is within the range satisfying the above formula (1). From the viewpoint of ease of molding and improved productivity, the height H_res is preferably 10 μm or more, more preferably 100 μm or more, and even more preferably 1 mm or more. In addition, it is preferably 20 mm or less, more preferably 15 mm or less, even more preferably 10 mm or less, even more preferably 8 mm or less, even more preferably 5 mm or less, and particularly preferably 3 mm or less. By setting it within the above-mentioned preferred numerical range, the winding and overlapping of the sheet portion 10 (i.e., the sound insulation member 12) with the resonant portion 11 becomes easier, and the sound insulation member can be manufactured in a so-called roll-to-roll manner and stored in a roll shape, which tends to improve productivity and economy.

[0226] Furthermore, the height of the resonant portion 11 in the normal direction of the sheet portion 10 may not be the same for all resonant portions, or it may vary. By varying the height of the resonant portions, effects such as frequency domain expansion that improves sound insulation performance can sometimes be achieved. In this case, the height H is set as the average value of the heights of the multiple resonant portions, as described above.

[0227] like Figure 3 As shown, the resonant part 11 can be constructed from a composite structure comprising a base 21 and a counterweight 22, the counterweight 22 being supported by the base 21 and having a mass greater than that of the base 21. The resonant part 11 effectively functions as a resonator, which has a resonant frequency determined by the mass of the counterweight 22 acting as a counterweight and the spring constant of the base 21 acting as a spring. The base and the counterweight will be described in detail below.

[0228] (Base)

[0229] Multiple bases 21 are provided on the sheet surface of the sheet portion 10. The shape of the bases 21 is not particularly limited and can be any shape, such as a triangular prism, rectangular prism, frustum prism, pentagonal prism, hexagonal prism, or other polyhedral prisms, cylindrical, elliptical prism, frustum pyramidal, pyramidal, conical, hollow cylindrical, branched, or any other irregular shape not classified into these categories. Furthermore, it can be formed into a columnar shape with different cross-sectional areas and / or cross-sectional shapes depending on the height position of the base 21.

[0230] Furthermore, the shape and height of the multiple bases 21 connected on the surface of the sheet can be the same or different.

[0231] There are no particular restrictions on the material of the base 21 as long as it meets the above-mentioned requirements. For example, resin materials can be listed, and at least one can be selected from the group consisting of thermosetting or photosetting elastomers, thermoplastic elastomers, thermosetting or photosetting resins and thermoplastic resins.

[0232] The conditions for thermosetting or photocurable elastomers and thermoplastic elastomers can be applied as illustrated in the description of sheet portion 10.

[0233] It should be noted that, from the viewpoint of product cost and ease of manufacturing, it is preferable that the material of the base 21 is the same as the material of the sheet portion 10.

[0234] Examples of thermosetting or photosetting resins include acrylic thermosetting resins, urethane thermosetting resins, silicone thermosetting resins, and epoxy thermosetting resins. Examples of thermoplastic resins include polyolefin thermoplastic resins, polyester thermoplastic resins, acrylic thermoplastic resins, urethane thermoplastic resins, and polycarbonate thermoplastic resins.

[0235] Specific examples include chemically cross-linked vulcanized rubbers such as natural or synthetic rubbers, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber, acrylic rubbers, fluororubber, epichlorohydrin rubber, polyester rubber, urethane rubber, silicone rubber, and their modifiers; polymers such as polyacrylonitrile, polyethylene terephthalate, polybutylene terephthalate, polyvinyl chloride, polychlorotrifluoroethylene, polyethylene, polypropylene, polynorbornene, polyetheretherketone, polyphenylene sulfide, polyacrylate, polycarbonate, polystyrene, epoxy resin, and oxazine resin, but are not specifically limited to these. They can be used alone or in combination of two or more.

[0236] Furthermore, the base 21 can be a porous body containing pores (air or other gases) in these resin materials. Additionally, the base 21 can also contain liquid materials such as mineral oil, vegetable oil, or silicone oil. It should be noted that when the base 21 contains liquid materials, from the viewpoint of preventing the liquid material from flowing out, it is preferable to pre-seal it within the resin material.

[0237] Among them, the material of the base 21 is preferably the same as that of the sheet portion 10, and particularly preferably an elastomer. If the sheet portion 10 and the base 21 contain the same type of elastomer, the integral molding of the sheet portion 10 and the base 21 becomes easier, and the productivity is greatly improved. That is, it is particularly preferred that the sheet portion 10 and the resonant portion 11 (base 21) are integrally molded articles containing at least one of the following: thermosetting or photocurable elastomers and thermoplastic elastomers.

[0238] Specific examples of elastomers include chemically cross-linked vulcanized rubbers such as natural or synthetic rubbers, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber, acrylic rubbers, fluororubbers, epichlorohydrin rubber, polyester rubber, urethane rubber, silicone rubber, and their modifiers; polyacrylonitrile, polyethylene terephthalate, polybutylene terephthalate, polyvinyl chloride, polychlorotrifluoroethylene, polyethylene, polypropylene, polynorbornene, polyetheretherketone, polyphenylene sulfide, polyacrylate, polycarbonate, polystyrene, epoxy resin, oxazine resin, etc., but are not particularly limited to these.

[0239] Among them, natural rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene rubber, ethylene propylene rubber, chlorosulfonated polyethylene rubber, acrylic rubber, fluororubber, epichlorohydrin rubber, polyester rubber, urethane rubber, silicone rubber and their modifiers are preferred. From the viewpoint of excellent heat resistance and cold resistance, silicone rubber, acrylic rubber and their modifiers are preferred.

[0240] It should be noted that the base 21 can be a two-color molded body or a multi-color molded body made of two or more resin materials. In this case, by using the same material as the sheet portion 10 in the base 21 on the side that is in contact with the sheet portion 10, it becomes easier to integrally mold the sheet portion 10 and the base 21.

[0241] When the resonant portion 11 (base 21) is provided with a circular cross-section, in the cross-section parallel to the sheet surface of the sheet portion 10 at the height position of the resonant portion 11 (base 21) with the largest sum of cross-sectional areas of the plurality of resonant portions 11 (base 21), the diameter of the largest circle among the circles (circular cross-sections) included in this cross-section is preferably 100 mm or less, more preferably 50 mm or less, and even more preferably 20 mm or less. Furthermore, the diameter of the smallest circle is preferably 10 μm or more, more preferably 100 μm or more, and even more preferably 1 mm or more. By setting these values ​​within the above-mentioned preferred range, it is possible to ensure that a predetermined number or more resonant portions 11 (base 21) are provided on the sheet surface of the sheet portion 10, thereby obtaining further improved sound insulation performance. In addition, there is a tendency to further improve molding ease and productivity.

[0242] (Counterweight)

[0243] There are no particular restrictions as long as the counterweight 22 (also referred to simply as "counterweight") is provided on each base 21 and has a mass greater than that of the base 21. For example... Figure 3 As shown, the counterweight 22 can be disposed above the base 21, or it can be disposed in such a way that a portion thereof is embedded in the base 21. From the viewpoint of preventing the counterweight 22 from falling off during manufacturing, it is preferable that at least a portion of the counterweight 22 is embedded in the base 21, and it is particularly preferable that such a method is used. Figure 9 As shown, the counterweight 22 is embedded in the base 21 as a whole. Figure 4 and Figure 10 They are respectively Figure 3 The cross-sectional view of line III-III and Figure 9 The cross-sectional view along line IV-IV. Furthermore, from the viewpoint of reducing the height, weight, or improving the sound insulation performance of the sound insulation member 12, it is preferable to arrange the base 21 and the counterweight 22 such that the center of gravity (center of mass) of the resonant part 11 is located at least further forward than the center in the height direction of the resonant part 11.

[0244] Furthermore, from the viewpoint of suppressing the falling of the counterweight 22 during the manufacturing process of the sound insulation component, it is preferable to provide a single counterweight 22 (a counterweight 22 composed of a single component) for each base.

[0245] Considering factors such as quality and cost, the materials used to constitute the counterweight 22 can be appropriately selected, and there are no particular limitations on their types. From the perspective of miniaturization of the sound insulation component 12 and improvement of sound insulation performance, materials with a high specific gravity are preferred for the raw materials constituting the counterweight 22.

[0246] Specifically, examples include metals or alloys such as aluminum, stainless steel, iron, tungsten, gold, silver, copper, lead, zinc, and brass; inorganic glasses such as sodium glass, quartz glass, and lead glass; and composite materials containing powders of these metals or alloys in the resin material of the base 21, or these inorganic glasses, but these are not particularly limited to these. The material, mass, and specific gravity of the counterweight 22 can be determined in a manner that the acoustic bandgap of the sound insulation member 12 matches the desired sound insulation range.

[0247] Among these, considering factors such as low cost and high specific gravity, at least one material from the group consisting of free metals, alloys, and inorganic glasses is preferred. It should be noted that specific gravity refers to the ratio of the mass and volume of a material to the mass of pure water at 4°C and a pressure of 1013.25 hPa. In this specification, the value used is determined according to JIS K 0061 "Methods for Determination of Density and Specific Gravity of Chemicals".

[0248] Regarding the energy storage modulus of the counterweight, from the viewpoint of improving sound insulation performance, it is typically 1000 MPa or more, preferably 2000 MPa or more, more preferably 5000 MPa or more, and even more preferably 10000 MPa or more. Furthermore, it is typically 1,000,000 MPa or less, preferably 800,000 MPa or less, more preferably 600,000 MPa or less, and even more preferably 500,000 MPa or less. The energy storage modulus of the counterweight can be measured using the same method as that used for measuring the energy storage modulus of the sheet portion and the protrusion.

[0249] There is no particular limitation on the volume ratio of the counterweight in the resonant part 11. From the viewpoint of improving sound insulation performance, it is usually 1% or more, preferably 5% or more, more preferably 10% or more, and even more preferably 20% or more, relative to 100% volume of the resonant part. In addition, it is usually 90% or less, preferably 80% or less, more preferably 70% or less, and even more preferably 50% or less.

[0250] The counterweight 22 may also have a through hole. The counterweight 22 with a through hole is illustrated in the accompanying drawings. Figure 11 (a) indicates the resonant part including the base 21 and the counterweight 22. Figure 11 (b) indicates the counterweight 22. In this invention, a counterweight with a through hole refers to, for example, a... Figure 11 As shown in (b), components with through holes can be categorized by shape, such as ring shape, washer shape, nut shape, etc.

[0251] The shape of the counterweight 22 is not particularly limited, but from the perspective of adjusting sound insulation performance and thinning, a plate shape is preferred. By making the counterweight 22 plate-shaped, compared to a sphere or similar design, the center of gravity of the counterweight 22 can be positioned away from the plate portion 10, which tends to increase the vibration torque of the resonant portion 11. For example, when the acoustic bandgap width is constant, the plate-shaped counterweight 22 can be made thinner compared to a sphere or similar design. On the other hand, when the height of the counterweight 22 is constant, a plate-shaped counterweight can achieve a wider bandgap width compared to a sphere or similar design.

[0252] Figure 11 In (a), the outer diameter of the counterweight 22 is formed to be approximately circular, smaller than that of the base 21, and the front end of the resonant part 11 is embedded in the base 21. In this way, since the counterweight 22, which acts as a counterweight for the resonator, is supported by the base 21, which determines the spring constant, the spring constant can be easily adjusted, for example, by changing the shape or raw material (storage modulus, mass) of the base 21, and the resonant frequency of the resonant part 11 can be controlled by changing the mass of the counterweight 22. Generally, if the storage modulus of the base 21 decreases, there is a tendency for the acoustic bandgap to shift towards the lower frequency side. Conversely, if the mass of the counterweight 22 increases, there is a tendency for the acoustic bandgap to shift towards the lower frequency side.

[0253] Figure 11 In (b), hx represents the height of the counterweight, r1 represents the outer diameter of the counterweight, and r2 represents the diameter (inner diameter) of the through hole.

[0254] The height (hx) of the counterweight 22 is not particularly limited. When the height of the resonant part 11 is set to 1, it is preferably 0.95 or less, more preferably 0.9 or less. In addition, it is preferably 0.2 or more, more preferably 0.3 or more. By using these ranges, there is a tendency to obtain a wide sound insulation band width while suppressing the height of the sound insulation sheet member.

[0255] The outer diameter (r1) of the counterweight 22 is not particularly limited. When the base 21 has a circular cross-section, a value approximately equal to or less than the diameter of that circular cross-section tends to provide excellent sound insulation performance. While not particularly limited, the maximum value of r1 is preferably 100 mm or less, more preferably 50 mm or less, and even more preferably 20 mm or less. Furthermore, the minimum value of r1 is preferably 10 μm or more, more preferably 100 μm or more, and even more preferably 1 mm or more. By setting these values ​​within the aforementioned preferred ranges, good sound insulation performance can be obtained, and the ease of molding and productivity are also tended to be further improved.

[0256] The counterweight 22 can be embedded in the base 21 or exposed. For the counterweight 22 with a through hole, the through hole portion of the counterweight 22 is also filled with resin material or the like, and this portion also functions as a fixing end on the base 21. Therefore, even if exposed, the counterweight 22 can be prevented from falling off or breaking.

[0257] The inner diameter (r2) of the counterweight 22 is not particularly limited. It is not particularly limited as long as it is smaller than the outer diameter (r1). The maximum value of r2 is preferably 90 mm or less, more preferably 40 mm or less, further preferably 20 mm or less, and particularly preferably 10 mm or less. Furthermore, the minimum value of r2 is preferably 2 μm or more, more preferably 50 μm or more, and further preferably 80 μm or more. By setting these values ​​within the above-mentioned preferred range, it tends to be easier to fill the isotropic through-holes in the resin material.

[0258] In addition, there is no particular limitation on the ratio of the outer diameter to the inner diameter of the counterweight 22.

[0259] To improve processability and component strength, surface treatment can also be performed on the surface of the counterweight 22 (including the through hole).

[0260] Chemical treatment with solvents or the like can be considered to improve the tightness with the base 21, or physical treatment can be implemented to improve the strength of the component by setting unevenness on the surface, but the surface treatment method is not particularly limited.

[0261] [Protrusion]

[0262] The sound insulation member 12 may have protrusions other than the resonant portion 11 on one side of the sheet portion (the side with the protrusion). For example, it may have Figure 12 The rib-shaped protrusion 31 shown may also have, in addition, a... Figure 13 The cylindrical protrusion 32 shown is an example of a cylindrical protrusion. It should be noted that, as mentioned above, a protrusion is a concept encompassed by a convex portion; therefore, to clearly illustrate this point, Figure 12 and Figure 13 In the text, the protrusions are represented by “31(11)” and “32(11)”.

[0263] Regarding the shape and placement of the protrusions, there are no particular restrictions as long as they are positioned in a manner that does not interfere with the resonant portion 11, which functions as a resonator. For example, the external shape of the protrusions is not particularly limited, and they can take any shape, such as triangular prisms, rectangular prisms, frustum prisms, pentagonal prisms, hexagonal prisms, or other polyhedral prisms, cylindrical, elliptical prisms, frustum pyramids, pyramids, cones, hollow cylinders, or any other indeterminate shape not classified into these categories. Furthermore, they can be formed into columns with different cross-sectional areas and / or cross-sectional shapes depending on their height position. Additionally, the maximum length of the protrusions in the longitudinal direction of the sheet portion 10 can be less than or equal to the maximum length of the sheet in the MD direction; there are no particular restrictions.

[0264] The shape of the protrusions is not particularly limited; when functioning as spacers, they only need to be higher than the maximum height H_res of the resonant part 11. Furthermore, when functioning as oscillators, the position, number, and height of the protrusions can be adjusted according to the frequency domain being adjusted.

[0265] It should be noted that the maximum height H_rib of the protrusion only needs to be higher than the maximum height H_res of the resonant part 11, and there is no particular limitation. From the viewpoint of ease of molding and improved productivity, it is preferable to have a diameter of 50 μm or more, more preferably 100 μm or more, and even more preferably 1 mm or more. In addition, it is preferable to have a diameter of 20 mm or less, more preferably 15 mm or less, even more preferably 10 mm or less, even more preferably 5 mm or less, and particularly preferably 3 mm or less.

[0266] The following description focuses on the rib-shaped protrusion 31. Within the scope of applicability, other protrusions such as the cylindrical protrusion 32 can also be designed in the same way.

[0267] The rib-shaped protrusions 31 are formed into a generally plate-like shape, extending along the length direction (sheet flow direction, MD direction) of the sheet portion 10. The rib-shaped protrusions 31 are respectively provided on the sheet surface of the sheet portion 10, and more specifically, they are respectively provided at two positions on the edge of the sheet portion 10 in the width direction (direction perpendicular to the sheet flow direction, TD direction).

[0268] Regarding the rib-shaped protrusion 31, its maximum height H_rib is higher than the maximum height H_res of the resonant portion 11 relative to the normal direction of the sheet portion 10. Therefore, when manufacturing the sound insulation member 12, even if it is wound into a sheet or multiple sheets are overlapped, the rib-shaped protrusion 31 functions as a spacer, thus suppressing contact between the resonant portion 11 and the back surface of the sheet portion 10. Therefore, by providing the rib-shaped protrusion 31, manufacturing problems such as deformation, variation, cracking, detachment, and damage of the resonant portion 11 are avoided, and the sound insulation member 12 can be easily manufactured and stored using a so-called roll-to-roll method. Furthermore, when sound waves are incident from a noise source, the rib-shaped protrusion 31 can also function as an oscillator (resonator) vibrating at a certain frequency.

[0269] It should be noted that, Figure 12 In this design, a pair of rib-shaped protrusions 31 extending along the length of the sheet portion 10 are used. However, multiple rib-shaped protrusions 31 with a maximum length shorter than the pair can also be spaced apart along the length of the sheet portion 10. In this case, the spacing between the individual rib-shaped protrusions 31 can be periodic or random. Thus, when multiple rib-shaped protrusions 31 are spaced apart, the distance between the individual rib-shaped protrusions 31 is not particularly limited, but is preferably 100 mm or less, more preferably 50 mm or less, and even more preferably 20 mm or less.

[0270] The raw material constituting the rib-shaped protrusion 31 is not particularly limited, but preferably the same resin material as the sheet portion 10 and / or the resonant portion 11 (base 21), and more preferably the same elastomer type as the sheet portion 10 and the resonant portion 11 (base 21). If the same resin material as the sheet portion 10 and / or the base 21 is used, integral molding with the sheet portion 10 and / or the resonant portion 11 (base 21) becomes easier, and productivity is increased dramatically.

[0271] The protrusion 31 protrudes in the same way as the resonant part, and therefore functions in the same way as the resonant part. In this case, when calculating the E_membrane in the above equation (1), transformations are performed such as replacing E_res with the energy storage modulus E_rib of the protrusion 31 and replacing H_res with H_rib, etc. The total energy storage modulus (E'_membrane) relative to each protrusion 31 is obtained using the above equations (S4) to (S6), etc., and is combined with the multiple resonant parts 11. For all protrusions in the sheet surface, a weighted average of the energy storage modulus with the number of protrusions as the weight is calculated, and this average value is taken as the E_membrane.

[0272] Furthermore, when calculating the height H of the sheet portion and the protrusions, the protrusions are treated as an assembly of multiple protrusions when calculating the H_membrane, while using... Figure 12In the case of such rib-shaped protrusions, since the areas of the bottom surfaces (the surfaces where the protrusions meet the sheet body) of the resonant parts and the rib-shaped protrusions are different, H_res is first replaced with H_rib, and the total height (H') relative to each protrusion 31 is calculated using the above formula (B). Then, this is combined with the aforementioned multiple resonant parts 11. For all protrusions existing on the sheet body surface, a weighted average of the total height is calculated, using the area of ​​the protrusion's bottom surface as the weight. This weighted average is taken as H_membrane. The height calculation method for two parts with different bottom surface areas is also applicable to cases with multiple resonant parts.

[0273] In addition, when using such Figure 13 In the case of a cylindrical protrusion with the same area as the bottom surface of such a resonant part, H_res is replaced with H_rib, and the total height (H') relative to each protrusion 31 is calculated using the above formula (B). Then, it is combined with multiple resonant parts 11, and the weighted average of the total height is calculated with the area of ​​the bottom surface of each protrusion as the weight. This weighted average is taken as H_membrane.

[0274] [Adhesive layer]

[0275] There are no particular restrictions on the adhesive layer being applied to the surface of the sheet body opposite to the side with the protrusion. It is particularly preferable to adhere the aforementioned sound-insulating member to the substrate (the product, component, etc., that is the object to be sound-insulated) as described later. The method of adhering the sound-insulating member to the substrate using the adhesive layer is not particularly limited; for example, methods such as heating and pressing separately molded components, using various known adhesives, or joining by heat fusion, ultrasonic welding, laser welding, etc. However, in methods where the sheet body is heated and pressed during adhesion, it is difficult to obtain uniform and sufficient adhesive force on the bonding surface because the sound-insulating member has uneven surfaces. Furthermore, in heat fusion and ultrasonic welding methods, the sheet body may melt and deform, and due to this deformation during adhesion, there is a high possibility of deviation from the originally designed sound insulation / vibration damping frequency. Therefore, using an adhesive to adhere and install the sound-insulating member is particularly effective.

[0276] It should be noted that, in addition to the configuration in which an adhesive layer is provided between the adhered object and the sheet portion, the sound insulation structure of this embodiment also includes a configuration in which a portion between the adhered object and the sheet portion is not provided with an adhesive layer.

[0277] In order to achieve sufficient sound insulation performance, it is preferable to make the adhesive layer thin. In addition, it is preferable to control the storage modulus of the adhesive layer in a way that is a ratio of a certain range shown in the following formulas (2) and (3) relative to the storage modulus of the sheet portion and the protrusion portion.

[0278] 7000≥E_adhesion / E_film≥0.5 (2)

[0279] 50.0≥E_adh / E_adh≥0.00002 (3)

[0280] E_adhesion (MPa): Storage modulus of the adhesive layer

[0281] E_membrane (MPa): Storage modulus of the sheet

[0282] E_adh (MPa): Storage modulus of the adherend

[0283] Equation (2) above indicates that the storage modulus of the adjacent layer (i.e., the sheet portion) of the adhesive layer and the storage modulus of the adhesive layer are within a certain ratio. When this value is within the range, it is difficult for elastic waves to be reflected at the boundary surface, and vibration energy is easily transferred to the resonant part, thus tending to improve sound insulation performance. In particular, when E_adhesive / E_film = 1, no elastic wave reflection occurs at the interface, so there is no energy loss. In addition, the possibility of peeling at the boundary surface caused by the difference in storage modulus of the adjacent layers leading to different elongation and strain during vibration is reduced, thus it is also preferred in terms of product durability.

[0284] Similarly, Equation (3) above indicates that the storage modulus of the adjacent layer (i.e., the adhered object) and the storage modulus of the adhesive layer are within a certain ratio. When this value is within the range, it is difficult for elastic waves to be reflected at the boundary surface, and vibration energy is easily transferred to the resonant part, thus tending to improve sound insulation performance. In particular, when E_adh / E_adh=1, no elastic wave reflection occurs at the interface, so there is no energy loss. In addition, the possibility of peeling at the boundary surface caused by the difference in storage modulus of the adjacent layers leading to different elongation and strain during vibration is reduced, thus improving the durability of the product.

[0285] There is no particular limitation on the average film thickness I_adhesive layer, but from the point of view of vibration energy transmission and material cost, a thinner film is preferred, preferably satisfying the following formula (4).

[0286] 1.0≥I_stickiness≥0.005 (4)

[0287] Furthermore, the thickness of I_adhesion is more preferably 0.01 mm or more, more preferably 0.02 mm or more, particularly preferably 0.05 mm or more, and preferably 0.8 mm or less, more preferably 0.5 mm or less, more preferably 0.3 mm or less, and particularly preferably 0.25 mm or less.

[0288] The storage modulus of the adhesive layer is not particularly limited, but is typically 0.1 MPa or more, preferably 1 MPa or more, more preferably 10 MPa or more, and even more preferably 50 MPa or more. It is also typically 10,000 MPa or less, preferably 5,000 MPa or less, more preferably 3,000 MPa or less, and even more preferably 1,000 MPa or less. If it exceeds the above range, the brittleness increases, and cracking and peeling easily occur in the adhesive layer. Conversely, if it is below the above range, the adhesive strength and peel strength themselves decrease. Therefore, it is preferable to set it to a range greater than 10 MPa and less than 10,000 MPa. The storage modulus of the adhesive layer can be determined using the same method as the method used to determine the storage modulus of the sheet portion and the protrusion described above.

[0289] Another embodiment of the sound insulation structure is a sound insulation structure in which the requirement of formula (1) in the above-mentioned sound insulation structure is changed to the requirement of the energy storage modulus of the adhesive layer, in particular, the requirement of being greater than 10 MPa. Specifically, it is a sound insulation structure having a sound insulation member and an adhesive layer, wherein the sound insulation member has a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion, and the elastic modulus of the aforementioned adhesive layer is greater than 10 MPa.

[0290] However, the sound insulation structure preferably satisfies the requirements of the above formula (1). In addition, the conditions other than those in the above formula (1) can be applied to the same conditions as those for the sound insulation structure.

[0291] Controlling the mechanical properties of adhesives, including storage modulus, can be considered similar to controlling the mechanical properties of polymeric materials, since adhesives are also a type of polymer. That is, the mechanical properties of polymeric materials, including adhesives, depend on the chemical structure of the polymer chains, the molecular weight and molecular weight distribution of the polymer chains, the cross-linking structure and density between polymer chains, and the addition of fillers. In particular, the storage modulus of resins can be adjusted by regulating the crystallinity of the polymer. Common methods to increase crystallinity include introducing conjugated structures into the main chain to increase molecular rigidity, controlling the polymerization reaction using reaction conditions and catalysts to reduce polymer chain branching, introducing heteroatoms and hydrogen bond sites into the polymer chains to enhance intermolecular interactions, and slowing down the precipitation rate from the polymer solution. Besides adjusting crystallinity, the introduction of additives is also effective in regulating the storage modulus of resins. For example, the storage modulus can be reduced by introducing plasticizers to weaken intermolecular interactions. Conversely, the storage modulus can be increased by composites with materials possessing high storage moduli, such as glass fibers, carbon fibers, layered clay minerals, metal oxides, and metals. Furthermore, the storage modulus of cross-linked polymers such as elastomers can be adjusted by modifying the cross-linking dosage and reaction rate to control the cross-linking density. Generally, reducing the cross-linking density lengthens the molecular chains between cross-linking points, making them easier to elongate, thus lowering the storage modulus. Conversely, increasing the cross-linking density shortens the molecular chains between cross-linking points, making them less prone to elongation, thus increasing the storage modulus. Additionally, the storage modulus can be adjusted by using microparticles composed of materials with high storage moduli, such as carbon black, silica, and carbon nanotubes, as fillers. This adjustment can be achieved by modifying the filler's size, proportion, and dispersibility.

[0292] There are no particular restrictions on the lost elastic modulus and residual strain under load of the resin portion; however, to utilize the resonance of the resonant portion, a small lost elastic modulus and residual strain are preferred. That is, in this measurement method, the maximum indentation depth h based on an indentation-type microhardness tester for the sound insulation component forming the sheet portion and the resonant portion is... max Displacement h during unloading f Preferably 0.5 ≥ h f / h max ≥0.0.

[0293] There are no particular restrictions on the material of the adhesive layer as long as it is selected within the range that satisfies the above formula (1), and it is preferable to select it within the range that satisfies the above formulas (2) and (3). Examples include silicone resins, epoxy resins, cyanoacrylate resins, vinyl acetate resins, polyvinyl acetal resins, ethylene vinyl acetate resins, vinyl chloride resins, acrylic resins, polyamide resins, cellulose resins, olefin resins, polyvinyl butyral resins, urea resins, melamine resins, phenol resins, resorcinol resins, epoxy resins, polyester resins, polyurethane resins, polycyclic aromatic hydrocarbon resins, chloroprene rubber, nitrile rubber, styrene-butadiene rubber, polysulfide rubber, butyl rubber, silicone rubber, acrylic rubber, modified silicone rubber, urethane rubber, silanized urethane resins, telechelic polyacrylate adhesives, and mixtures thereof. Among these, from the viewpoint of considering adhesion, peel durability, impact resistance, heat resistance, and chemical resistance, it is preferable to select one or more resins from the group consisting of silicone resins, epoxy resins, cyanoacrylate resins, acrylic resins, and urethane resins, and particularly preferably one or more resins from the group consisting of silicone resins, epoxy resins, and cyanoacrylate resins.

[0294] There is no particular limitation on the total content of the above-mentioned materials in the adhesive layer. From the viewpoint of reasonable coating viscosity and reasonable curing speed, it is usually 10% by weight or more, preferably 20% by weight or more, more preferably 25% by weight or more, and even more preferably 30% by weight or more. In addition, there is no particularly preferred upper limit, and it is usually 90% by weight or less.

[0295] Specific examples of adhesives that can be used in the adhesive layer include acrylic resin adhesives such as Denka Co., Ltd.'s OP-1030M, Denka Co., Ltd.'s OP-1505, Denka Co., Ltd.'s OP-3010P, the composition described in WO2011 / 046120 (a known composition), and the composition described in Japanese Patent Application Laid-Open No. 2013-112766 (a known composition). Epoxy resin adhesives may include... Listed are AY-5302 made by Alteco Co., Ltd., AY-5231 made by Alteco Co., Ltd., AY-5274 made by Alteco Co., Ltd., AY-5011 made by Alteco Co., Ltd. AY-5012 made by Alteco Co., Ltd., AY-5158 made by Alteco Co., Ltd., AY-5158 made by Alteco Co., Ltd., AY-5218C made by Alteco Co., Ltd., Alte Co., Ltd. Examples of silicone resin adhesives include AY-5218D manufactured by Shin-Etsu Chemical Industry Co., Ltd., AY-5259 manufactured by Alteco Co., Ltd., AY-5321 manufactured by Alteco Co., Ltd., and compositions described in Japanese Patent Application Laid-Open No. 2006-169446, which are known compositions. Examples of silicone resin adhesives include KER-6020-F manufactured by Shin-Etsu Chemical Industry Co., Ltd., KER-6020-F1 manufactured by Shin-Etsu Chemical Industry Co., Ltd., and KER-6020-F2 manufactured by Shin-Etsu Chemical Industry Co., Ltd. Examples of polyolefin resin adhesives include Tosoh Corporation's MX02D, MX06, MX07, MX11, MX15, MX23, MX28, MX37, MX53C, MZ14A, and JS01, but these are not strictly limited to these. They can be used individually or in combination of two or more, provided that there is no loss due to curing hindrance caused by their combination.

[0296] The adhesive layer may also contain inorganic fillers and fibers, such as silica particles, alumina particles, titanium oxide and other metal oxides; carbon particles, carbon black, graphite and their fibrous compounds.

[0297] The content of the aforementioned inorganic materials (especially inorganic fillers) in the adhesive layer is not particularly limited. From the viewpoint of hardness adjustment and coating solution viscosity, it is generally 1% by weight or more, preferably 10% by weight or more, more preferably 20% by weight or more, and even more preferably 25% by weight or more. In addition, it is generally 80% by weight or less, preferably 70% by weight or less, more preferably 50% by weight or less, and even more preferably 40% by weight or less.

[0298] [Object to be glued]

[0299] The shape and material of the object to be bonded are not particularly limited as long as it can be bonded to the sound insulation component through the aforementioned adhesive layer 14.

[0300] In this specification, the term "adhesive" refers to a component that holds the sheet portion (sound insulation component) in place by an adhesive layer; more specifically, it refers to products, parts, etc., that are the objects to be sound-insulated.

[0301] There is no particular limitation on the energy storage modulus E_adh of the adhered material. Since it is easy to generate sound due to vibration, the energy storage modulus is usually high, typically above 500 MPa, preferably above 1000 MPa, and more preferably above 2000 MPa. In addition, there is no preferred upper limit, and it is usually below 300000 MPa.

[0302] The storage modulus E_adh of the bonded material can be determined using the same method as the method described above for determining the storage modulus of the adhesive layer.

[0303] In this specification, the storage modulus E_adh of the adhered material refers to the storage modulus of the component in contact with the adhesive layer. When the portion of the adhered material in contact with the adhesive layer is composed of two or more components, each of these components is processed separately, and for each component, it is evaluated whether the requirements of this embodiment are met. That is, for one of the multiple components, the conditions such as the above formula (1) apply to the relationship between the sound insulation component and the adhesive layer directly above that component.

[0304] It should be noted that, for the storage modulus E_adh of the adhered object, when the adhered object is divided into two or more components by the part that is not in contact with the adhesive layer, it is not necessary to consider the storage modulus of the non-contacting components.

[0305] There is no particular limitation on the thickness of the adhered material. From the viewpoint of maximizing sound insulation performance, it is generally 0.5 mm or more, preferably 1 mm or more, more preferably 2 mm or more, and even more preferably 3 mm or more. However, there is no preferred upper limit, and it is generally 300 mm or less. In this case, the thickness of the adhered material, for example, means the thickness of the board when the adhered material is plate-shaped, the height of the cube when the adhered material is a compact cube-shaped structure and the sound insulation member is laminated on the upper surface of the cube through an adhesive layer, and the thickness of the board constituting the upper surface of the cube when the adhered material is a cube-shaped structure with internal cavities composed of 6-sided plates and the sound insulation member is laminated on the upper surface of the cube through an adhesive layer.

[0306] There are no particular restrictions on the material to be bonded; examples include engineering plastics, metal sheets, and alloy sheets. Examples of engineering plastics include polyacetal (POM), polyamide (PA), polycarbonate (PC), modified polyphenylene ether (m-PPE), polybutylene terephthalate (PBT), ultra-high molecular weight polyethylene (UHPE), syndiotactic polystyrene (SPS), amorphous polyacrylate (PAR), polysulfone (PSF), polyethersulfone (PES), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyimide (PI), polyetherimide (PEI), fluoropolymers, and liquid crystal polymers (LCP). Additionally, they can contain resin reinforcement materials that enhance hardness, such as glass fiber (GF) reinforced polyethylene terephthalate (GF-PET) and GF reinforced polyamide (GF-PA). Examples of metal substrates include common metals and alloys such as aluminum, iron, and stainless steel. Alternatively, the substrates can be laminated with the aforementioned resins and metals.

[0307] [Natural frequency of soundproofing structure]

[0308] In the sound insulation structure, the standardized natural frequency offset expressed by the following formula is not particularly limited. It is preferable that the deviation of the frequency band that produces the sound insulation effect is small. Therefore, it is preferably 30% or less, more preferably 25% or less, even more preferably 20% or less, particularly preferably 15% or less, especially preferably 10% or less, and most preferably 5% or less. In addition, there is no particularly preferred lower limit. It is usually 0% or more, can be 0.05% or more, or can be 0.1% or more.

[0309] Standardized natural frequency offset (%) = ((Design natural frequency) - (Natural frequency)) ÷ (Design natural frequency)

[0310] Design natural frequency (Hz): The natural frequency calculated without an adhesive layer.

[0311] Natural frequency (Hz): The natural frequency calculated under conditions with an adhesive layer.

[0312] Another embodiment of the sound insulation structure of the present invention is a sound insulation structure in which the element of formula (1) in the above-mentioned sound insulation structure is changed to the element of the above-mentioned inherent frequency. Specifically, it is a sound insulation structure having a sound insulation member and an adhesive layer. The sound insulation member has a sheet-like sheet portion and a plurality of protrusions provided on the sheet portion. The adhesive layer is provided on the surface of the sheet portion opposite to the side where the protrusions are provided.

[0313] The normalized natural frequency offset that satisfies the following formula is 0-30%.

[0314] Standardized natural frequency offset (%) = ((Design natural frequency) - (Natural frequency)) ÷ (Design natural frequency)

[0315] Design natural frequency (Hz): The natural frequency calculated without an adhesive layer.

[0316] Natural frequency (Hz): The natural frequency calculated under conditions with an adhesive layer.

[0317] However, the sound insulation structure preferably satisfies the requirements of the above formula (1). In addition, the conditions other than those in the above formula (1) can be applied to the same conditions as those for the sound insulation structure.

[0318] [Manufacturing method of sound insulation structure]

[0319] The manufacturing method of the sound insulation structure is not particularly limited. For example, it can be a process of having a sound insulation member with multiple protrusions formed on one surface of the sheet portion, and a process of providing an adhesive layer on the aforementioned sound insulation member (the surface of the sheet portion opposite to the side where the protrusions are provided). Furthermore, when there is an object that is bonded to the sound insulation member by the adhesive layer, it can be a process of providing an object that is bonded to the sound insulation member by the adhesive layer.

[0320] In the process of forming a sound insulation component with multiple protrusions, there are no particular limitations on the method of forming the multiple protrusions. Examples include preparing a mold with multiple cavities, and then allowing resin, rubber, or their precursors to flow into the cavities and cure them. As a method of curing, when using thermoplastic materials, a method can be listed where the heated and molten material flows into the cavity and is then cooled to cure it. When using thermosetting or photosetting materials, a method can be listed where the material flows into the cavity and is cured by heating or light. In these cases, the heating and light conditions can be appropriately designed according to the material.

[0321] In the process of setting an adhesive layer on a sound insulation component, there are no particular limitations on the method of setting the adhesive layer. For example, a method of applying an adhesive layer to a sound insulation component manufactured in the process of forming the aforementioned sound insulation component with multiple protrusions can be cited. In the case of coating, known methods can be applied for the conditions, etc.

[0322] In the process of setting up the adherends to the sound insulation component through the adhesive layer, there are no particular restrictions on the method of bonding the adherends. Examples include melting the adhesive by heating, bringing the adherends into contact with the molten adhesive, cooling them, and then curing the adhesive.

[0323] As specific manufacturing methods for cases involving adhered objects, manufacturing methods 1 to 4, as shown below, can be cited as examples. It should be noted that the shape of the cavity used in each manufacturing method is not particularly limited; for example, the shape of the base can be suitable as hemispherical, planar, convex, concave, etc. It should also be noted that manufacturing methods 3, 4, etc., can refer to the manufacturing methods described in International Publication No. 2010 / 3080794, etc.

[0324] (Manufacturing Method 1)

[0325] Manufacturing method 1 may include the following steps (1) to (3).

[0326] (1) The process of preparing a mold with multiple cavities and allowing resin material to flow into the cavities.

[0327] (2) A process for curing the incoming resin material.

[0328] (3) The process of peeling the resulting solidified material from the mold.

[0329] In manufacturing method 1, after step (2) or (3), there is a step of applying an adhesive to the obtained cured material (or the object to be bonded) and bonding the cured material to the object to be bonded.

[0330] (Manufacturing Method 2)

[0331] Manufacturing method 2 may include the following steps (4) to (7).

[0332] (4) The process of preparing a mold with multiple cavities and configuring counterweights in the multiple cavities of the mold.

[0333] (5) The process of allowing resin material to flow into the cavity.

[0334] (6) A process for curing the incoming resin material.

[0335] (7) The process of peeling the resulting solidified material from the mold.

[0336] In manufacturing method 2, after step (6) or (7), there is a step of applying an adhesive to the obtained cured material (or the adhered material) and setting the adhered material on the cured material.

[0337] (Manufacturing Method 3)

[0338] Manufacturing method 3 may include the following steps (8) to (13).

[0339] (8) The process of coating a photocurable elastomer precursor or a photocurable resin precursor onto a mold having multiple cavities.

[0340] (9) The process of stacking a support on a molded elastomer precursor or resin precursor.

[0341] (10) For the laminate of support and mold, the process of filling the cavity from the support side with the aforementioned elastomer precursor or resin precursor using a pressure roller.

[0342] (11) A process of curing the aforementioned elastomer precursor or resin precursor with a cavity shape formed by transferring the mold by irradiating light from the support side, and polymerizing and bonding the cured elastomer precursor or resin precursor with the aforementioned support.

[0343] (12) The process of peeling the structure formed by bonding the cured elastomer precursor or resin precursor to the support body from the mold.

[0344] (13) The process of using an adhesive to bond the support to the object to be bonded.

[0345] (Manufacturing Method 4)

[0346] Manufacturing method 4 may include the following steps (14) to (17).

[0347] (14) A process in which a roller having an outer peripheral surface with multiple cavities is rotated, and while a support coated with adhesive moves along the outer peripheral surface of the roller in the rotation direction of the roller, a photocurable elastomer precursor or a photocurable resin precursor is coated on the outer peripheral surface of the roller, and the cavities are filled with the elastomer precursor or resin precursor. It should be noted that in this process, since the resin and the support are bonded by the curing of the photocurable resin, an adhesive can be omitted. From the viewpoint of improving productivity, it is preferable not to use an adhesive.

[0348] (15) A process of irradiating the area between the outer peripheral surface of the roller mold and the support body with the aforementioned elastomer precursor or resin precursor sandwiched between the outer peripheral surface of the roller mold and the aforementioned support body.

[0349] (16) The process of peeling the structure formed by bonding the cured elastomer precursor or resin precursor obtained in the aforementioned process (15) to the aforementioned support from the aforementioned roller mold.

[0350] (17) The process of bonding the support to the object by means of an adhesive.

[0351] Regarding the method of providing the resonant portion 11 and the protrusion 31 on the sheet portion 10, as described above, not only can there be a method of integral molding using a mold, but also a method of pressing together separately molded parts by heating and pressing, or bonding using various known adhesives, such as by heat fusion, ultrasonic welding, laser welding, etc. Examples of adhesives include epoxy resin adhesives, acrylic resin adhesives, polyurethane resin adhesives, silicone resin adhesives, polyolefin resin adhesives, polyvinyl butyral resin adhesives, and mixtures thereof, but they are not particularly limited to these. It should be noted that a portion or all of the resonant portion 11 and the protrusion 31 can be formed by stamping a rubber sheet obtained by the above molding method. Furthermore, if a portion of the resonant portion 11 is metal or alloy, it can be formed by machining the metal or alloy.

[0352] In addition, methods such as 3D printing can be cited as examples of manufacturing methods.

[0353] From the perspective of improving productivity and economy, it is preferable to integrally mold the sound insulation component 12 using methods such as die molding or casting. As an example, a method can be described using a mold or injection mold with cavities having shapes corresponding to the integrally molded sheet portion 10 and the resonant portion 11 to mold the integrally molded sheet portion 10 and the resonant portion 11. Various known methods such as pressure molding, compression molding, casting, extrusion molding, and injection molding are known as such integral molding methods, and there is no particular limitation on the type. It should be noted that the raw materials for each component, such as viscoelastic resin materials, can flow into the cavity in the form of a liquid precursor or a heated melt. Alternatively, if the raw materials are metals, alloys, or inorganic glass, they can be pre-positioned (inserted) at predetermined positions within the cavity.

[0354] As a resin material, there are no particular limitations. For example, the materials and their raw materials and intermediates exemplified in the above-mentioned sound insulation components can be listed.

[0355] Figures 14-17 This figure illustrates an example of the manufacturing process of the sound insulation component 12. Here, a mold 61 (see Figure 61) with a cavity 61a having a shape corresponding to the resonant portion 11 described above is used. Figure 14 A counterweight 22 is disposed within the cavity 61a of the mold 61 (see reference). Figure 15Then, a viscoelastic resin material is allowed to flow into cavity 61a, and heated or pressurized as needed (see reference). Figure 16 The integrally molded sheet portion 10 and resonant portion 11 are demolded to obtain the sound insulation component 12. This integral molding method not only improves productivity and economy, but also allows for easy molding of even complex shapes. Furthermore, it tends to easily obtain a sound insulation component 12 that exhibits improved adhesion between components and excellent mechanical strength. From these perspectives, the sheet portion 10 and resonant portion 11 are preferably integrally molded components containing thermosetting elastomers or thermoplastic elastomers.

[0356] The aforementioned sound insulation structure comprises multiple resonant portions 11 disposed in series on the surface of the sheet portion 10. Therefore, when sound waves are incident from a noise source, high sound insulation performance that transcends the law of mass can be achieved. Furthermore, by adjusting the spring constant and changing the mass of the counterweight portion 22 based on changes in the shape, density distribution, or raw materials (storage modulus, mass) of the resonant portions 11 and the base portion 21, the resonant frequency of the resonant portions 11 can be easily controlled. Furthermore, the frequency band (acoustic bandgap width, frequency position) can be controlled by adjusting the raw materials and thickness of the sheet portion 10. Therefore, the sound insulation structure 1 according to this embodiment offers superior freedom in selecting the sound insulation frequency and in design compared to conventional sound insulation structures.

[0357] It should be noted that the above-mentioned sound insulation structure can be used not only as a structure for the purpose of sound insulation, but also as a structure for the purpose of vibration damping.

[0358] [Simulation of Resonance Frequency]

[0359] In the embodiments described later, COMSOL Multiphysics (COMSOL Corporation), a physical simulation software employing the finite element method, is used to calculate the resonant frequency of the structure. The conditions for this physical simulation are described in detail.

[0360] The above method is a numerical analytical method for solving differential equations that cannot be analytically solved by the finite element method with high-precision approximation. It involves dividing the complex object to be analyzed into simpler small parts (elements) and performing approximate calculations on the overall variation. The protruding resonant frequency in the embodiments described later is calculated through the following steps.

[0361] for Figures 18-21 The sound insulation structure in the middle, for each part i to v, has the physical properties (specific gravity, storage modulus (Young's modulus), Poisson's ratio) recorded in Tables 1 to 7 and Tables 1 to 7 respectively. Figures 18-21 The material dimensions (r1, r2, h) recorded in the document i ~h vSubstitute equations from COMSOL Multiphysics (COMSOL Corporation) solid mechanics model (a, b) into the equations to calculate the natural vibration modes under the condition that the bottom surface of the sheet v is completely fixed, and calculate the resonant frequencies under various conditions.

[0362] It should be noted that, Figure 18 The diagram shows the form using a perforated circular plate. Figure 19 The diagram shows a configuration using a perforated nut (hexagonal plate) as a counterweight. Figure 20 The shape without counterweight is shown. Figure 21 The sheet body is shown to have a laminated structure of rubber and PET layers without a counterweight.

[0363] Next, in the ideal state of no adhesive, the resonant frequency when completely fixed to the adhered object was set as f0, and the resonant frequencies f when using adhesives with various physical properties were compared.

[0364] In the embodiments described later, a small dF = (f - f0) / f0 × 100 [%) is considered a good setting and bonding condition. That is, a small dF, representing the deviation from the design frequency of the sheet, is considered a good bonding condition. dF is preferably as small as possible, preferably 20% or less, more preferably 10% or less, and even more preferably 5% or less.

[0365] Example

[0366] The following examples illustrate the present invention in more detail, but the present invention is not limited to these examples. Various conditions may be employed to achieve the present invention's purpose without departing from its spirit and intent.

[0367] [Calculation of natural frequency]

[0368] For each part i to v of the sound insulation component, refer to Tables 1 to 7 respectively. Figures 18-21 The material properties (specific gravity, Young's modulus, Poisson's ratio) and material dimensions r1, r2, h are recorded in the text. i ~h v Substituting a and b into the equations of the solid mechanics model in the COMSOL Multiphysics software (COMSOL Corporation), the natural frequencies of the protrusion during expansion and contraction vibration are calculated using the finite element method. It should be noted that H in the following table is calculated using H = h ii +h iii -h i The calculated value.

[0369] In addition, to compare the magnitude of the natural frequency offset, a standardized natural frequency offset is determined as follows. The natural frequencies described below are the natural frequencies of the same sheet body, protrusion shape, and without an adhesive layer.

[0370] Standardized natural frequency offset (%) = ((Design natural frequency) - (Natural frequency)) ÷ (Design natural frequency)

[0371] in addition, Figure 22 The graph shown illustrates the relationship between the normalized natural frequency offset obtained through the above calculations and β. β is the ratio of (E_viscosity / I_viscosity) / (E_film / H).

[0372] <Form using a perforated circular plate as a counterweight>

[0373] [Example 1]

[0374] Example 1 includes Figure 18 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 1. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0375] The calculation results show that in Example 1, the natural frequency is 4353Hz and the normalized natural frequency offset is 13.4%, confirming that the frequency deviation is sufficiently small and conforms to the design.

[0376] [Comparative Example 1]

[0377] Comparative Example 1 also includes Figure 18 The sound insulation panel component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 1. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0378] The calculation results show that in Comparative Example 1, the natural frequency is 3626 Hz and the normalized natural frequency offset is 27.8%, confirming that the frequency deviation is large and there is a huge difference from the design frequency due to the influence of the adhesive layer.

[0379] [Reference Example 1]

[0380] Reference example 1 also includes Figure 18 The sound insulation panel component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 1. The natural frequencies of the expansion and contraction vibrations of the protrusions in this unit cell are calculated based on the methods described above. This reference example uses a method without the use of adhesives.

[0381] The calculation results show that, in Reference Example 1, the natural frequency is 5025 Hz and the normalized natural frequency offset is 0%.

[0382] [Table 1]

[0383]

[0384] <Using a perforated nut (hexagonal prism) as a counterweight>

[0385] [Examples 2-7]

[0386] Examples 2-7 include Figure 19 The sound insulation panel component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 2. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0387] The calculation results show that in Examples 2 to 7, the natural frequency is 3545 to 5024 Hz, and the normalized natural frequency offset is 0.0 to 13.4%, confirming that the frequency deviation is sufficiently small and conforms to the design.

[0388] [Comparative Examples 2-5]

[0389] Comparative examples 2-5 also include Figure 19 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 3. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0390] The calculation results show that in Comparative Examples 2 to 5, the natural frequencies are 1962 to 3626 Hz, and the normalized natural frequency offsets are 27.8% to 61.0%. It is confirmed that the frequency deviation is large, and there is a huge difference from the design frequency due to the influence of the adhesive layer.

[0391] [Table 2]

[0392]

[0393] [Table 3]

[0394]

[0395] <Form without counterweight>

[0396] [Examples 8-14]

[0397] Examples 8-14 include Figure 20 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 4. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0398] The calculation results show that in Examples 8 to 14, the natural frequency is 3759 to 5319 Hz, and the normalized natural frequency offset is 0.0 to 11.4%, confirming that the frequency deviation is sufficiently small and conforms to the design.

[0399] [Comparative Examples 6-8]

[0400] Comparative examples 6-8 also include Figure 20 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 5. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0401] The calculation results show that in Comparative Examples 6 to 8, the natural frequency is 3155 to 3156 Hz, and the normalized natural frequency offset is 40.7%. It is confirmed that the frequency deviation is large, which is due to the influence of the adhesive layer and is a huge difference from the design frequency.

[0402] [Table 4]

[0403]

[0404] [Table 5]

[0405]

[0406] <The sheet body has no counterweight and uses a laminated structure of rubber and PET layers.>

[0407] [Examples 15-21]

[0408] Examples 15-21 include Figure 21 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 6. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0409] The calculation results show that in Examples 15 to 21, the natural frequency is 3942 to 5577 Hz, and the normalized natural frequency offset is 0.0 to 3.4%. It is confirmed that the frequency deviation is small enough to be consistent with the design.

[0410] [Comparative Examples 9-11]

[0411] Comparative examples 9-11 also include Figure 21 The sound insulation sheet component shown is a unit cell. The dimensions, materials, and properties of the constituent components of this unit cell are shown in Table 7. The natural frequency of the expansion and contraction vibration of the protrusions in this unit cell is calculated based on the above calculation method.

[0412] The calculation results show that in Comparative Examples 9 to 11, the natural frequency is 3822 to 3824 Hz, and the normalized natural frequency offset is 31.4% to 31.5%. It is confirmed that the frequency deviation is large, and there is a huge difference from the design frequency due to the influence of the adhesive layer.

[0413] [Table 6]

[0414]

[0415] [Table 7]

[0416]

[0417] From Table 1 above Figure 7 and Figure 22 It can be seen that when β is above 0.5, deviation from the frequency band where sound insulation occurs is difficult to occur; specifically, the normalized inherent frequency offset becomes below 20%. Furthermore, it can be seen that when β is above 100, the frequency offset disappears.

[0418] Symbol Explanation

[0419] 1. Sound insulation structure

[0420] 10 pieces of body

[0421] 10(a) (Layer constituting the sheet body)

[0422] 10(b) (Layer constituting the sheet body)

[0423] 10(c) (Layer constituting the sheet body)

[0424] 11 Resonance section

[0425] 12 Sound insulation components

[0426] 13 Adhesive

[0427] 14 Adhesive layer

[0428] 21 Base

[0429] 22. Counterweight section

[0430] 31 Rib-like protrusions

[0431] 32 Cylindrical protrusions

[0432] 61 Mold

[0433] 61a Cavity

[0434] The height of the H-plate body and the resonant part (convex part)

[0435] H_Height of the sheet body

[0436] H_res Height of the resonant region

[0437] I_ Average film thickness of adhesive layer

[0438] r1 Radius of the counterweight

[0439] r2 The opening radius of the counterweight

[0440] h height

[0441] h_body height

[0442] h_res height

[0443] h_mucosal thickness

[0444] a. Length of sheet

[0445] i Counterweight

[0446] ii Base

[0447] iii. Sheet body

[0448] iii-1 Plate body 1

[0449] iii-2 Plate body part 2

[0450] iv Adhesive layer

[0451] v. The object to be adhered to.

Claims

1. A sound insulation structure comprising at least: a sound insulation member having a sheet-like body portion and a plurality of protrusions disposed on one surface of the sheet-like body portion, and an adhesive layer disposed on the surface of the sheet-like body portion opposite to the side where the protrusions are disposed, wherein the sound insulation structure satisfies the following formula (1). E_adhesion / I_adhesion > 0.5 × (E_membrane / H)(1) E_adhesion (MPa): Storage modulus of the adhesive layer I_Adhesion (mm): Average film thickness of the adhesive layer E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion H (mm): The average height of the sheet body and the protrusion.

2. The sound insulation structure according to claim 1, having an adhesive bonded to the sound insulation member by means of the adhesive layer.

3. The sound insulation structure according to claim 2, satisfying the following equations (2) and (3), 7000≥E_adhesion / E_film≥0.5 (2) 50.0≥E_adh / E_adh≥0.00002 (3) E_adhesion (MPa): Storage modulus of the adhesive layer E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion E_adh(MPa): Storage modulus of the adhered material.

4. The sound insulation structure according to claim 1 or 2, satisfying the following formula (4), 1.0≥I_stickiness≥0.005 (4) I_adhesion (mm): Average film thickness of the adhesive layer.

5. The sound insulation structure according to claim 1 or 2, wherein formula (1) satisfies the following formula (1)'. E_adhesion / I_adhesion>β×(E_film / H)(1)' In the above formula (1)', E_adhesion, I_adhesion, E_film and H are the same as in the formula (1), and β = 5.

6. The sound insulation structure according to claim 1 or 2, wherein the E_viscosity is greater than 10 MPa.

7. The sound insulation structure according to claim 1 or 2, wherein the adhesive layer comprises one or more resins selected from the group consisting of silicone resins, epoxy resins and cyanoacrylate resins, and the total content of these resins in the adhesive layer is 10% by weight or more.

8. The sound insulation structure according to claim 1 or 2, wherein the adhesive layer comprises an inorganic filler, and the inorganic filler in the adhesive layer contains more than 1% by weight.

9. A method for manufacturing a sound-insulating structure, comprising a sound-insulating component and an adhesive layer, wherein the sound-insulating component has a sheet-like body portion and a plurality of protrusions disposed on the sheet-like body portion, and the adhesive layer is disposed on the surface of the sheet-like body portion opposite to the side where the protrusions are disposed. The method for manufacturing the sound insulation structure includes: The process of forming a sound-insulating component with multiple protrusions on one surface of the sheet body, and The process of applying an adhesive layer to the sound insulation component, and Satisfy the following equation (1), E_adhesion / I_adhesion>0.5×(E_film / H) Equation (1) E_adhesion (MPa): Storage modulus of the adhesive layer I_Adhesion (mm): Average film thickness of the adhesive layer E_membrane (MPa): Storage modulus of the sheet portion and the protrusion portion H (mm): The average height of the sheet body and the protrusion.

10. The method for manufacturing a sound insulation structure according to claim 9 further comprises a step of setting an adhesive, wherein the adhesive is bonded to the sound insulation component through the adhesive layer.

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