Connectors and electronic devices

Abstract

The present disclosure provides a connector and an electronic device, wherein the connector comprises an insulating seat, a terminal at least partially accommodated in the insulating seat, and a connecting pin for fixing the insulating seat to a mainboard, wherein a notch capable of being filled with solder is provided on the connecting pin, and a tin-climbing channel communicating with the notch is provided on the insulating seat, wherein the tin-climbing channel is used for allowing solder to climb when solder is filled into the notch. The present disclosure forms a tin-climbing channel for increasing the gripping force by providing a tin-climbing channel communicating with the notch on the connecting pin on the insulating seat, wherein the solder can quickly climb upward along the tin-climbing channel when solder is filled into the notch, thereby forming a firm locking structure, greatly increasing the gripping force between the connecting pin and the mainboard, and improving the stability of the welding between the connector and the mainboard, without requiring additional parts, and having a simple structure.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic products, and particularly to a connector and an electronic device. Background Art

[0002] In the production process of electronic devices, especially laptop computers, connectors need to be soldered to the main board.

[0003] Currently, the mainstream narrow-edge connectors in the industry have metal solder feet with an "I" structure, and the metal solder feet are fixed to the main board through solder paste. Due to the limited solder volume of the metal solder feet with the "I" structure, the board gripping force is relatively small, and the soldering stability is not good. However, because most current electronic devices have requirements for thin and light designs, the components on the main board are restricted by size designs and must be small and thin. If the connector has insufficient board gripping force, there will be problems such as component dropping and easy damage. Summary of the Invention

[0004] In view of this, according to one aspect of the present disclosure, first, a connector is provided, and the technical solution is as follows.

[0005] A connector includes an insulating housing, terminals at least partially received in the insulating housing, and connection feet for fixing the insulating housing to the main board. The connection feet are provided with notches capable of filling solder, and the insulating housing is provided with a solder climbing channel communicating with the notches. The solder climbing channel is used for the solder to climb when filling the notches with solder.

[0006] Optionally, the solder climbing channel includes a first solder climbing space and a second solder climbing space. The first solder climbing space is connected to the notch through the second solder climbing space. The notch has a first cross-sectional area S1, and the first solder climbing space has a second cross-sectional area S2, where S1 < S2.

[0007] Optionally, the second solder climbing space has a third cross-sectional area S3, where S1 < S3 < S2.

[0008] Optionally, the second solder climbing space has a first end close to the notch and a second end close to the first solder climbing space. From the first end to the second end, the cross-sectional area of the second solder climbing space gradually increases.

[0009] Optionally, the second solder climbing space includes a constant cross-section segment and a variable cross-section segment. The constant cross-section segment has a third cross-sectional area S3, where S1 < S3 < S2. The variable cross-section segment has a first end close to the constant cross-section segment and a second end close to the first solder climbing space. From the first end to the second end, the cross-sectional area of the variable cross-section segment gradually increases.

[0010] Optionally, the insulating seat body includes a bottom wall, a side wall and an end wall, the side wall, the end wall and the bottom wall together form a accommodating cavity, and the bottom of the end wall has a accommodating groove; the connecting foot includes a main body and a foot body, the main body is inserted in the accommodating groove, and the foot body is bent and extended from the main body toward the outside of the accommodating cavity to form a gap with the end wall.

[0011] Optionally, the foot body has a center line, the notch is arranged on the foot body and is symmetrical with respect to the center line, the first tin creeping space forms an axially symmetrical space symmetrical with respect to the center line, and the second tin creeping space forms an axially symmetrical space symmetrical with respect to the center line.

[0012] Optionally, the end wall has an outer side surface located outside the accommodating cavity, and the tin creeping channel extends from the outer side surface toward the accommodating cavity to form a blind hole structure.

[0013] Optionally, the connecting pin is movably arranged on both sides of the insulating base body along a set direction, and the side of the connecting pin close to the insulating base body has a slider or a slide groove, and the side of the insulating base body close to the connecting pin is formed with a slide groove or a slider along the set direction, and the slider is slidably matched with the slide groove so that the connecting pin can slide relative to the insulating base body.

[0014] Optionally, the connecting foot includes a main body and a foot body, the main body is slidably connected to the insulating seat body, the foot body includes a first foot body and a second foot body extending from opposite sides of the main body respectively, an installation opening is formed on the bottom of the insulating seat body, the first foot body extends into the installation opening, and the notch is set on the first foot body.

[0015] According to another aspect of the present disclosure, an electronic device is provided, wherein the connector as described above is disposed in the electronic device.

[0016] The present invention has the following beneficial effects: a tin-climbing channel communicating with the notch on the connecting leg is opened on the insulating seat body, thereby forming a tin-climbing channel for increasing the gripping force; when solder is filled into the notch, the solder can quickly climb upward along the tin-climbing channel, thereby forming a firm locking structure, greatly increasing the gripping force between the connecting leg and the mainboard, and improving the stability of the welding between the connector and the mainboard; and no additional parts are required, and the structure is simple.

[0017] The advantages and features of the present disclosure are described in detail below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following drawings of the present disclosure are hereby used as part of the present disclosure for understanding the present disclosure. The embodiments of the present disclosure and their description are shown in the drawings to explain the principles of the present disclosure. In the drawings,

[0019] Figure 1 is a schematic structural diagram of a connector according to an exemplary embodiment of the present disclosure (seen from one direction);

[0020] Figure 2 is a schematic structural diagram of a connector according to an exemplary embodiment of the present disclosure (seen from another direction and with the solder structure removed);

[0021] Figure 3a is a schematic structural diagram of a connector according to an exemplary embodiment of the present disclosure (seen from another direction);

[0022] Figure 3b for Figure 3a The enlarged view of the D part in FIG.

[0023] Figure 4 is a structural schematic diagram of a connector according to an exemplary embodiment of the present disclosure (seen from another direction);

[0024] Figure 5 for Figure 4 A magnified view of part A in FIG.

[0025] Figure 6 To pass Figure 2 Solder structure diagram formed by creeping tin channel;

[0026] Figure 7 is a structural schematic diagram of a connector according to another exemplary embodiment of the present disclosure (seen from one direction);

[0027] Figure 8 is a structural schematic diagram of a connector according to another exemplary embodiment of the present disclosure (seen from one direction and with the solder structure removed);

[0028] Fig. 9 is a schematic structural diagram of a connector according to another exemplary embodiment of the present disclosure (seen from another direction);

[0029] Fig.10 for Fig. 9 A magnified view of part B in FIG.

[0030] Fig.11 is a schematic structural diagram of a connector according to another exemplary embodiment of the present disclosure (seen from yet another direction);

[0031] Fig.12 for Fig.11 The enlarged view of the C part in FIG.

[0032] Fig.13 To pass Figure 8 Solder structure diagram formed by the tin creeping channel.

[0033] Explanation of the numbers in the figure: 10, insulating seat; 101, installation port; 102, terminal slot; 11, bottom wall; 12, side wall; 13, end wall; 131, accommodating groove; 132, groove; 1301, outer side; 14, accommodating cavity; 20, terminal; 21, contact pin; 22, connecting section; 30, connecting pin; 301, notch; 31, main body; 32, pin body; 321, first pin body; 322, second pin body; 33, gap; 40, tin creeping channel; 41, first tin creeping space; 42, second tin creeping space; 421, equal cross-section section; 422, variable cross-section section; 50, solder; 51, first solder section; 52, second solder section; 53, third solder section. DETAILED DESCRIPTION

[0034] In the following description, a large amount of details are provided so that the present disclosure can be thoroughly understood. However, it will be appreciated by those skilled in the art that the following description only exemplarily illustrates an optional embodiment of the present disclosure, and the present disclosure can be implemented without one or more such details. In addition, in order to avoid confusion with the present disclosure, some technical features well known in the art are not described in detail.

[0035] like Figures 1 to 5 As shown, the connector of one embodiment of the present disclosure is a board-to-board connector (Board To Board, abbreviated as BTB), including an insulating base body 10, a terminal 20 at least partially accommodated in the insulating base body 10, and a connecting pin 30 for fixing the insulating base body 10 to a main board (the main board is not shown in the figure), the connecting pin 30 is provided with a notch 301 that can be filled with solder 50, the insulating base body 10 is provided with a tin creeping channel 40 that communicates with the notch 301, and the tin creeping channel 40 is used for allowing the solder 50 to climb when the solder 50 is filled into the notch 301.

[0036] In order to communicate with the tin crawling channel 40, the notch 301 is a through hole, and the through hole has a set shape. Based on the setting of the through hole type notch, a locking structure will be formed when the solder 50 is filled into the notch 301. The set shape of the notch 301 can be a combination of one or more of a waist shape, a triangle, a polygon, a trapezoid, a rhombus, an ellipse, a circle, and a fan shape. A friction portion (not shown in the figure) can also be provided on the inner wall of the notch 301 to increase the friction between the connecting foot 30 and the solder 50. The friction portion can be a plurality of convex points or friction lines to increase the surface friction coefficient of the inner wall of the notch 301. When the solder 50 fills the notch 301, the friction between the connecting foot 30 and the solder 50 will increase accordingly, thereby further improving the stability of welding.

[0037] The connecting pin 30 may be a metal welding pin, so as to ensure the structural strength of the connecting pin 30 and improve the stability of welding.

[0038] For a board-to-board connector, the insulating housing 10 includes a bottom wall 11, a side wall 12, and an end wall 13. The side wall 12, the end wall 13, and the bottom wall 11 enclose to form a receiving cavity 14. There is a receiving groove 131 on the bottom of the end wall 13. The connecting pin 30 includes a body 31 and a pin body 32. The body 31 is inserted into the receiving groove 131, and a gap 33 is formed between the pin body 32 extending bent away from the receiving cavity 14 from the body 31 and the bottom of the end wall 13. With such a setting, on the one hand, the connecting pin 30 is integrally L-shaped, which is convenient for a firm connection with the main board; on the other hand, based on the setting of the gap 33, it is convenient for the solder 50 during soldering to climb upward along the gap 33 and enter the solder climbing channel 40, thereby increasing the soldering area and improving the soldering bonding force between the connecting pin 30 and the main board. It should be understood that, in order to prevent the pin body 32 from protruding relative to the bottom of the end wall 13, a groove 132 can also be opened on the bottom of the end wall 13, and the pin body 32 is located in the groove 132.

[0039] Referring to Figure 1 to FIG. 3, a plurality of terminal slots 102 are provided on the bottom wall 11 and the side wall 12. The terminals 20 are installed in the terminal slots 102 to facilitate effective electrical connection between the terminals 20 and the terminals on the corresponding plug connector, thereby realizing data transmission. The terminal 20 has a contact pin 21 and a connection section 22. The connection section 22 is located in the terminal slot 102, and the contact pin 21 extends out of the side wall 12 (the "outside" here is relative to the receiving cavity 14). Thus, on the one hand, it is convenient to assemble the terminal 20 with the insulating housing 10, and on the other hand, it is convenient to connect with the main board.

[0040] Referring to Figure 2 、 Figure 4 、 Figure 5 and Figure 6 In an embodiment of the present disclosure, the solder climbing channel 40 includes a first solder climbing space 41 and a second solder climbing space 42. The first solder climbing space 41 is connected to the notch 301 through the second solder climbing space 42. The notch 301 has a first cross-sectional area S1, and the first solder climbing space 41 has a second cross-sectional area S2, and S1 < S2. Based on this setting, the solder 50 defined by the notch 301 and the first solder climbing space 41 can be formed into a shape with a larger upper part and a smaller lower part, that is, similar to an umbrella shape that is opened, so that the connection is more firm.

[0041] In an embodiment not shown, the second solder climbing space 42 has a third cross-sectional area S3, where S1 < S3 < S2. In this way, after the solder 50 climbs through the solder climbing channel 40, from bottom to top, a first solder segment 51, a third solder segment 53, and a second solder segment 52 are sequentially formed. Define the cross-sectional area of the first solder segment 51 as S1', the cross-sectional area of the third solder segment 53 as S3', and the cross-sectional area of the second solder segment 52 as S2'. Correspondingly, the first solder segment 51 is formed at one end of the notch 301 away from the second solder climbing space 42, the third solder segment 53 is formed within the second solder climbing space 42, and the second solder segment 52 is formed in the first solder climbing space 41, where S1' > S3' and S2' > S3'. Thus, the solder 50 forms a structure with larger ends and a smaller middle to further strengthen the board gripping force.

[0042] In an embodiment not shown, in order to achieve smooth climbing of the solder 50 during soldering, the second solder climbing space 42 has a first end close to the notch 301 and a second end close to the first solder climbing space 41. From the first end to the second end, the cross-sectional area of the second solder climbing space 42 gradually increases.

[0043] Refer again to Figure 5 , in an embodiment of the present disclosure, the second solder climbing space 42 includes a constant cross-section segment 421 and a variable cross-section segment 422. The constant cross-section segment 421 has a third cross-sectional area S3, where S1 < S3 < S2. The variable cross-section segment 422 has a first end close to the constant cross-section segment 421 and a second end close to the first solder climbing space 41. From the first end to the second end, the cross-sectional area of the variable cross-section segment 422 gradually increases. Based on the setting of the variable cross-section segment 422, smooth climbing of the solder 50 during soldering can also be achieved.

[0044] Refer again to as Figure 2 and Figure 3b , in an embodiment of the present disclosure, the pin body 32 is an axisymmetric structure with a center line (the center line is not shown in the figure). The notch 301 is provided on the pin body 32 and is symmetric with respect to the center line. The first solder climbing space 41 forms an axisymmetric space symmetric about the center line, and the second solder climbing space 42 forms an axisymmetric space symmetric about the center line. Thus, the solder climbing channel 40 is symmetric about the center line of the notch 301 on the lower pin body 32. With this setting, the reliability of the connection can also be ensured.

[0045] To facilitate the opening of the solder climbing channel 40, the end wall 13 has an outer side surface 1301 located outside the accommodating cavity 14. The solder climbing channel 40 extends from the outer side surface 1301 towards the accommodating cavity 14 to form a blind hole structure. Thus, on the basis of an existing connector, a hole can be opened from the outer side surface of the end wall 13 towards the inside to facilitate the processing of the solder climbing channel 40. It should be noted that the "outer side surface" here is relative to the accommodating cavity 14, and the side of the end wall 13 relatively far from the accommodating cavity 14 is the outer side surface.

[0046] like Figures 6 to 13 As shown, the connector of another embodiment of the present invention is a surface mount connector (Surface Mounted Technology connector, SMT connector for short), including an insulating base body 10, a terminal 20 at least partially accommodated in the insulating base body 10, and a connecting pin 30 for fixing the insulating base body 10 to a mainboard (the mainboard is not shown in the figure), the connecting pin 30 is provided with a notch 301 capable of filling with solder 50, the insulating base body 10 is provided with a tin creeping channel 40 connected to the notch 301, and the tin creeping channel 40 is used for allowing the solder 50 to climb when the solder 50 is filled into the notch 301.

[0047] In this embodiment, the connecting pin 30 is movably arranged on both sides of the insulating seat body 10 along a set direction, and a slider or a slide groove is provided on the side of the connecting pin 30 close to the insulating seat body 10. A slide groove or a slider is formed on the side of the insulating seat body 10 close to the connecting pin 30 along the set direction, and the slider and the slide groove are slidably matched so that the connecting pin 30 can slide relative to the insulating seat body 10. Through the slidable match between the slider and the slide groove, the connecting pin 30 and the insulating seat body 10 can slide relative to each other. In this embodiment, the slide groove or the slider on the insulating seat body 10 is along the height direction of the insulating seat body 10 (such as Figure 8 The connecting pin 30 is arranged in the Z direction of the motherboard, and then the slider or the slide groove on the connecting pin 30 is used to slide with the insulating seat body 10, so that the connecting pin 30 can reciprocate along the height direction of the insulating seat body 10, wherein the specific shapes of the slider and the slide groove are not limited. In this embodiment, the connecting pin 30 can reciprocate along the height direction of the insulating seat body 10 to adjust the position of the connecting pin 30, so as to adjust the specific position of the connecting pin 30 welded on the motherboard to ensure that the connecting pin 30 can be welded at the best welding position. When the welding is completed, the connecting pin 30 can no longer move.

[0048] In this embodiment, the connecting pin 30 includes a body 31 and a pin 32, the body 31 is slidably connected to the insulating base 10, the pin 32 includes a first pin 321 and a second pin 322 extending from opposite sides of the body 31, a mounting opening 101 is formed on the bottom of the insulating base 10, the first pin 321 extends into the mounting opening 101, and the notch 301 is arranged on the first pin 321. Based on the combination of the mounting opening 101 and the first pin 321, the pin 32 can be prevented from protruding outside the bottom of the insulating base 10; and based on the arrangement of the first pin 321 and the second pin 322, the welding area between the connecting pin 30 and the motherboard can be increased, thereby increasing the gripping force, and further improving the stability of welding between the connector and the motherboard.

[0049] like Fig.12As shown, in this embodiment, the solder climbing channel 40 includes a first solder climbing space 41 and a second solder climbing space 42. The first solder climbing space 41 is connected to the notch 301 through the second solder climbing space 42. The notch 301 has a first cross-sectional area S1, that is, the notch 301 has a uniform cross-section in the Z direction. The first solder climbing space 41 has a second cross-sectional area S2, that is, the first solder climbing space 41 also has a uniform cross-section in the Z direction, and S1 < S2. Based on this setting, the solder 50 defined by the notch 301 and the first solder climbing space 41 can be formed into a shape that is larger at the top and smaller at the bottom, similar to an open umbrella shape, so as to make the connection more firm.

[0050] Further, the second solder climbing space 42 has a third cross-sectional area S3, that is, the second solder climbing space 42 also has a uniform cross-section in the Z direction, and S1 < S3 < S2. Combining Fig.13 , after the solder 50 climbs through the solder climbing channel 40, from bottom to top, the first solder segment 51, the third solder segment 53, and the second solder segment 52 are sequentially formed. Define the cross-sectional area of the first solder segment 51 as S1', the cross-sectional area of the third solder segment 53 as S3', and the cross-sectional area of the second solder segment 52 as S2'. Correspondingly, the first solder segment 51 is formed at one end of the notch 301 away from the second solder climbing space 42, the third solder segment 53 is formed in the second solder climbing space 42, and the second solder segment 52 is formed in the first solder climbing space 41, where S1' > S3' and S2' > S3'. Thus, the solder 50 forms a structure that is larger at both ends and smaller in the middle to further strengthen the board gripping force.

[0051] When the connector of the present disclosure is specifically used, first, the insulating base 10 is placed on the main board. Then, the connecting pin 30 and the main board are welded and fixed through the solder 50 (for example, solder paste). The solder 50 will fully fill the notch 301 on the connecting pin 30 and continue to climb upward through the solder climbing channel 40, thereby forming a firm locking structure, greatly increasing the board gripping force between the connecting pin 30 and the main board, and improving the welding stability of the connector and the main board.

[0052] The connector of the present disclosure utilizes the existing position of the connecting pin 30 to form a solder climbing channel 40 for increasing the board gripping force on the insulating base 10 without adding additional parts. The structure is simple, and the overall structure of the connector does not need to be greatly changed. Therefore, it does not involve changes in the connector assembly process, and does not require major adjustments to the existing molds or production processes. The manufacturing equipment of the existing connector can be shared to avoid excessive production costs and ensure the market competitiveness of the product production cost.

[0053] The present disclosure also provides an electronic device, and the above-mentioned connector is provided inside the electronic device. Using the above-mentioned connector can ensure a firm connection between the connector and the main board inside the electronic device, thereby improving the stability of the electronic device during use.

[0054] In the description of the present disclosure, it is necessary to understand that the orientation or positional relationship indicated by the directional words is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present disclosure; the directional words "inside" and "outside" refer to the inside and outside relative to the outline of each component itself.

[0055] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between one or more components or features shown in the figure and other components or features. It should be understood that spatially relative terms include not only the orientation of the components as described in the figure, but also different orientations in use or operation. For example, if the components in the accompanying drawings are inverted as a whole, the components "above other components or features" or "above other components or features" will include the situation where the components are "below other components or structures" or "below other components or structures". Therefore, the exemplary term "above" may include both "above" and "below". In addition, these components or features may also be positioned at other different angles (e.g., rotated 90 degrees or other angles), and this article is intended to include all of these situations.

[0056] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present disclosure. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, parts, components and / or combinations thereof.

[0057] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein.

[0058] The present disclosure has been described through the above-mentioned embodiments, but it should be understood that the above-mentioned embodiments are only for the purpose of example and description, and are not intended to limit the present disclosure to the scope of the described embodiments. In addition, it can be understood by those skilled in the art that the present disclosure is not limited to the above-mentioned embodiments, and more variations and modifications can be made according to the teachings of the present disclosure, and these variations and modifications all fall within the scope of protection claimed by the present disclosure. The scope of protection of the present disclosure is defined by the attached claims and their equivalents.

Claims

1. A connector, comprising an insulating base (10), a terminal (20) at least partially received in the insulating base (10), and a connecting pin (30) for fixing the insulating base (10) to a mainboard, wherein the connecting pin (30) is provided with a notch (301) capable of being filled with solder (50), characterized in that: A solder climbing channel (40) communicating with the notch (301) is formed on the insulating base body (10), and the solder climbing channel (40) is used for allowing solder (50) to climb when filling the solder (50) into the notch (301). The solder climbing channel (40) includes a first solder climbing space (41) and a second solder climbing space (42). The first solder climbing space (41) is connected to the notch (301) through the second solder climbing space (42). The notch (301) has a first cross-sectional area S1, and the first solder climbing space (41) has a second cross-sectional area S2, where S1 < S2.

2. The connector according to claim 1, characterized in that: The second solder climbing space (42) has a third cross-sectional area S3, where S1 < S3 < S2.

3. The connector according to claim 1, characterized in that: The second solder climbing space (42) has a first end close to the notch (301) and a second end close to the first solder climbing space (41). From the first end to the second end, the cross-sectional area of the second solder climbing space (42) gradually increases.

4. The connector according to claim 1, characterized in that: The second solder climbing space (42) includes a constant cross-section section (421) and a variable cross-section section (422). The constant cross-section section (421) has a third cross-sectional area S3, where S1 < S3 < S2. The variable cross-section section (422) has a first end close to the constant cross-section section (421) and a second end close to the first solder climbing space (41). From the first end to the second end, the cross-sectional area of the variable cross-section section (422) gradually increases.

5. The connector according to claim 1, characterized in that: The insulating base body (10) includes a bottom wall (11), a side wall (12) and an end wall (13). The side wall (12) and the end wall (13) enclose a receiving cavity (14) with the bottom wall (11). A receiving groove (131) is formed at the bottom of the end wall (13). The connecting pin (30) includes a body (31) and a pin body (32). The body (31) is inserted into the receiving groove (131), and a gap (33) is formed between the pin body (32) extending bent away from the receiving cavity (14) from the body (31) and the end wall (13).

6. The connector according to claim 5, characterized in that: The pin body (32) has a center line. The notch (301) is formed on the pin body (32) and is symmetric with respect to the center line. The first solder climbing space (41) forms an axially symmetric space symmetric about the center line, and the second solder climbing space (42) forms an axially symmetric space symmetric about the center line.

7. The connector according to claim 5, characterized in that: The end wall (13) has an outer side surface (1301) located outside the receiving cavity (14). The solder climbing channel (40) extends from the outer side surface (1301) towards the receiving cavity (14) to form a blind hole structure.

8. The connector according to claim 1, characterized in that: The connecting pins (30) are movably arranged on both sides of the insulating base body (10) along a set direction. One side of the connecting pins (30) close to the insulating base body (10) has a slider or a chute. On the insulating base body (10), a chute or a slider is formed along the set direction close to the connecting pins (30). The slider is in sliding fit with the chute so that the connecting pins (30) can slide relative to the insulating base body (10).

9. The connector according to claim 8, characterized in that: The connecting foot (30) comprises a main body (31) and a foot body (32); the main body (31) is slidably connected to the insulating base body (10); the foot body (32) comprises a first foot body (321) and a second foot body (322) respectively extending from opposite sides of the main body (31); a mounting opening (101) is formed on the bottom of the insulating base body (10); the first foot body (321) extends into the mounting opening (101); and the notch (301) is arranged on the first foot body (321).

10. An electronic device, characterized in that: The electronic device is provided with a connector as claimed in any one of claims 1 to 9.

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