Circuit board assembly and display device including the same

Abstract

A circuit board assembly and a display device including the same are provided. The circuit board assembly includes a main board and a connection board attached to the main board. The connection board includes a substrate including a connection pad area and a mounting area, wherein the connection board is attached to the main board in the connection pad area, and wherein the mounting area is spaced apart from the connection pad area in a first direction. The connection board further includes a driving chip mounted on the mounting area, a first connection pad disposed on the connection pad area of the substrate, and a plurality of second connection pads disposed on the connection pad area of the substrate. The main board includes a first main pad connected to the first connection pad in a one-to-one connection, and a second main pad connected to the plurality of second connection pads in a many-to-one connection.

Description

Technical Field

[0001] Embodiments of this disclosure relate to a circuit board assembly and a display device including the circuit board assembly. Background Technology

[0002] A display device may include a display panel and a display driver configured to drive the display panel. The display driver is typically implemented as an integrated circuit and provides an interface between one or more processors and the display panel. The display driver may include a data driver and a gate driver, and both the data driver and the gate driver may be mounted on the display panel as driver chips, or they may be mounted on a connection board attached to the display panel.

[0003] The display device may include a motherboard positioned adjacent to the display panel and configured to supply various signals to a data driver and a gate driver. The motherboard may be electrically connected to the display panel via a connector board. The motherboard and connector board may constitute a circuit board assembly.

[0004] The number of pads provided on the connector board and motherboard can correspond to the size and / or resolution of the display panel. Therefore, as display panels are manufactured with increasing sizes and / or resolutions, the number of pads on the connector board and motherboard of the display panel may increase. Summary of the Invention

[0005] Some embodiments of this disclosure provide a circuit board assembly that reduces or prevents contact failures.

[0006] Some embodiments of this disclosure provide a display device with improved display quality.

[0007] A circuit board assembly according to an embodiment includes a motherboard and a connection board attached to the motherboard. The connection board includes: a substrate including a connection pad region and a mounting region, wherein the connection board is attached to the motherboard in the connection pad region, and wherein the mounting region is spaced apart from the connection pad region in a first direction. The connection board further includes: a driver chip mounted on the mounting region; a first connection pad disposed on the connection pad region of the substrate; and a plurality of second connection pads disposed on the connection pad region of the substrate. The motherboard includes: a first main pad connected to the first connection pad in a one-to-one manner; and a second main pad connected to a plurality of second connection pads in a many-to-one manner.

[0008] According to an embodiment, a plurality of the second connection pads may be configured to be adjacent to each other.

[0009] According to an embodiment, the number of the second connection pads can be two to four.

[0010] According to an embodiment, each of the plurality of second connection pads can receive the same signal from the second main pad.

[0011] According to an embodiment, the signal may be a ground signal.

[0012] According to an embodiment, the second connection pad may include a VSS pad and a test pad.

[0013] According to an embodiment, the signal may be a contact resistance measurement signal.

[0014] According to an embodiment, the signal may be a repair signal.

[0015] According to an embodiment, the signal may be a data signal or a gate signal.

[0016] According to an embodiment, the connection board may further include a plurality of third connection pads disposed on the connection pad area of ​​the substrate. The motherboard may further include a third master pad connected to the plurality of third connection pads in a many-to-one connection manner.

[0017] According to an embodiment, the second main pad and the third main pad may be configured to be adjacent to each other in a second direction perpendicular to the first direction.

[0018] According to an embodiment, at least one of the first main pads may be disposed between the second main pad and the third main pad.

[0019] According to an embodiment, the length of each of the first main pads in the first direction may be the same as the length of the second main pad in the first direction.

[0020] According to an embodiment, the thickness of each of the first main pads in the vertical direction may be the same as the thickness of the second main pad in the vertical direction.

[0021] According to an embodiment, the connection board may further include connection lines disposed on the substrate. The connection lines can electrically connect each of the first connection pad and the second connection pad to the driver chip.

[0022] According to an embodiment, the first connection pad may be arranged in a second direction perpendicular to the first direction to define a pad row.

[0023] According to an embodiment, a plurality of second connection pads may be arranged in the pad row in the first direction.

[0024] A display device according to an embodiment includes a display panel, a motherboard, and a connection board attached to the display panel and the motherboard. The connection board includes: a substrate including a first connection pad region, a second connection pad region, and a mounting region, wherein the connection board is attached to the motherboard in the first connection pad region, wherein the connection board is attached to the display panel in the second connection pad region, and wherein the mounting region is disposed between the first connection pad region and the second connection pad region. The connection board further includes: a driver chip disposed on the mounting region; a first connection pad mounted on the first connection pad region of the substrate; and a plurality of second connection pads disposed on the first connection pad region of the substrate. The motherboard includes: a first main pad connected to the first connection pad in a one-to-one manner; and a second main pad connected to the plurality of second connection pads in a many-to-one manner.

[0025] According to an embodiment, a plurality of the second connection pads may be configured to be adjacent to each other.

[0026] According to an embodiment, the second connection pad can receive the same signal from the second main pad.

[0027] The first connection pad can receive various drive signals. The first main pad can be connected to the first connection pad in a one-to-one manner. The second connection pad can receive the same first signal among various drive signals. The second connection pads can be positioned adjacent to each other. The second main pad can be connected to the second connection pad in a many-to-one manner. Therefore, the possibility of the second main pad contacting the first connection pad can be reduced. Therefore, the display quality of the display device including the connection substrate and the main substrate can be improved.

[0028] The first connection pad can be arranged in a second direction perpendicular to the first direction to define a pad row. The second connection pad can be arranged in the pad row in the first direction. Therefore, the space utilization of the connection substrate can be improved.

[0029] It will be understood that both the foregoing general description and the following detailed description are provided as examples and are intended to offer further illustration of the claimed invention. Attached Figure Description

[0030] The above and other aspects and features of this disclosure will be more clearly understood from the following detailed description of embodiments taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 This is a plan view showing a display device according to an embodiment;

[0032] Figure 2 It is shown Figure 1 A magnified view of part A;

[0033] Figure 3 It is shown Figure 2 Plan view of the connecting plate;

[0034] Figure 4 It is shown Figure 2 A plan view of the motherboard;

[0035] Figure 5 It is shown Figure 2 An enlarged view of an embodiment of the first connection pad region;

[0036] Figure 6 It is shown Figure 2 An enlarged view of an embodiment of the first connection pad region; and

[0037] Figure 7 It is shown Figure 2 An enlarged view of an embodiment of the first connection pad area. Detailed Implementation

[0038] In the following, exemplary embodiments will be described in detail with reference to the accompanying drawings. The same reference numerals may denote the same components, and to the extent that descriptions of elements have been omitted, it can be understood that an element is at least similar to a corresponding element described elsewhere in the specification.

[0039] Figure 1 This is a plan view showing the display device 10 according to an embodiment.

[0040] refer to Figure 1 The display device 10 may include a display panel DP, a motherboard MB, and a connection board CB. The display panel DP may be divided into a display area DA and a non-display area NDA adjacent to the display area DA. The display panel DP may have a rectangular shape on a plane defined by a first direction D1 and a second direction D2 perpendicular to the first direction D1 (this may be referred to as the "D1-D2 plane"). However, the shape of the display panel DP is not necessarily limited to this. The display panel DP may have various shapes. For example, the display panel DP may have a shape with rounded corners.

[0041] Multiple pixels PX can be set in the display area DA. The pixels PX can be arranged completely in the display area DA in a matrix form. However, this is an example arrangement of pixels PX, and pixels PX can be arranged in various forms in the display area DA. The display device 10 can display an image in the display area DA through the pixels PX.

[0042] Display device 10 may be an organic light-emitting display device. However, this is merely an example, and display device 10 may be a quantum dot display device, a liquid crystal display device, an electrophoretic display device, or a plasma display device, etc.

[0043] The driver configured to drive the display panel DP can be located in the non-display area NDA. The driver (multiple drivers) may include a gate driver, a light-emitting driver, a data driver, and / or a timing controller. The non-display area NDA may surround the display area DA on the D1-D2 plane. For example, the non-display area NDA may surround the side of the display area DA. The non-display area NDA may be bent at the boundary between the display area DA and the non-display area NDA.

[0044] The connecting plate CB can be attached to the display panel DP. For example, the connecting plate CB can be attached to the non-display area NDA of the display panel DP. The connecting plate CB may include a flexible film. The connecting plate CB may include a driver chip DIC disposed on the flexible film. In this case, the display device 10 may have a thin-film flip-chip structure. However, this disclosure is not necessarily limited to thin-film flip-chip structures. For example, the driver chip DIC can be directly attached to the non-display area NDA of the display panel DP. When the display panel DP includes a glass substrate, the display device 10 may have a glass flip-chip structure. When the display panel DP includes a plastic substrate, the display device 10 may have a plastic flip-chip structure. The driver chip DIC can transmit various driving signals to the driver.

[0045] although Figure 1 An example of 12 connection boards CB is shown, but the number of connection boards CB is not necessarily limited to this. Furthermore, although the connection boards CB are shown attached to the underside of the display panel DP, their positions are not necessarily limited to this. The connection boards CB can be attached to the top, left, or right side of the display panel DP, and the display device 10 can have various numbers of connection boards CB disposed on the display device 10. For example, a connection board CB can be attached to one side of the display panel DP. In this case, the connection board CB may include a driver chip DIC.

[0046] The connector board CB can also be attached to the motherboard MB. The motherboard MB can convert user-supplied commands to the display device 10 into various drive signals. These drive signals can be transmitted to the driver chip DIC via the connector board CB. Although the motherboard MB... Figure 1 The motherboard is shown as being attached to three connector boards (CB), but the number of connector boards (CB) attached to the motherboard (MB) is not necessarily limited to this. The motherboard (MB) can be attached to a variety of numbers of connector boards (CB). For example, the motherboard (MB) can be attached to one connector board (CB).

[0047] The circuit board assembly 20 may include a motherboard MB and a connector board CB. For example, the motherboard MB and the connector board CB may constitute the circuit board assembly 20.

[0048] Figure 2 It is shown Figure 1 A magnified view of part A.

[0049] refer to Figure 2 The circuit board assembly 20 according to embodiments of the present disclosure may include a motherboard MB and a connection plate CB attached to the motherboard MB. For example, the motherboard MB may be a printed circuit board (PCB), and the connection plate CB may be a flexible film. For example, the circuit board assembly 20 may be a flexible printed circuit board (FPCB). Since the substrate BB included in the connection plate CB comprises a flexible material, the connection plate CB may be flexible. Examples of flexible materials may include polyimide. In some examples, since the substrate BB comprises a flexible material, the connection plate CB may be bendable, foldable, rollable, or stretchable.

[0050] The connector board CB may include a substrate BB. The substrate BB may include a first connection pad area PA1, a second connection pad area PA2, and a mounting area MA. The second connection pad area PA2 may be spaced apart from the first connection pad area PA1 in a first direction D1. The mounting area MA may be located between the first connection pad area PA1 and the second connection pad area PA2. The connector board CB may be attached to the motherboard MB in the first connection pad area PA1. The driver chip DIC may be mounted on the mounting area MA.

[0051] The motherboard MB and the connector board CB can be attached to a first connector pad area PA1. For example, the motherboard MB and the connector board CB can be attached to each other in the first connector pad area PA1 of the connector board CB. Attachment can mean more than just adhesion. For example, attachment can mean electrical connection. To electrically connect the motherboard MB and the connector board CB to each other, the motherboard MB can include a main pad, and the connector board CB can include a connector pad. The main pad and the connector pad can be connected to each other so that the motherboard MB and the connector board CB can be electrically connected. For example, the main pad and the connector pad can be connected by providing an anisotropic conductive film including conductive particles between the main pad and the connector pad.

[0052] Anisotropic conductive film can be a double-sided adhesive tape material comprising an adhesive cured by heat. The adhesive may have conductive particles dispersed throughout the adhesive. When pressure is applied to the anisotropic conductive film, the conductive particles located at the points where the main pads and connection pads contact each other may be broken. The broken conductive particles can electrically connect the main pads and connection pads. For example, the conductive particles may break apart, thus forming an electrical path. The adhesive can be cured by applying high-temperature heat to the anisotropic conductive film, thereby fixing the conductive particles and adhering the main pads and connection pads to each other. Therefore, the anisotropic conductive film can attach the motherboard (MB) and the connection board (CB) to each other. (See reference...) Figure 3 Describe the connection pads in detail, and refer to... Figure 4Describe the main pad.

[0053] Figure 3 It is shown Figure 2 Plan view of the connecting plate CB.

[0054] refer to Figure 3 The connector board CB may further include multiple connector pads. In an embodiment, the connector board CB may include a substrate BB, a first connector pad CPD1, and a second connector pad CPD2. The first connector pad CPD1 and the second connector pad CPD2 may be disposed on the first connector pad area PA1.

[0055] The first connection pad CPD1 can be arranged in the second direction D2 to define the pad row PDR. The second connection pad CPD2 can be arranged in the pad row PDR in the second direction D2. For example, the first connection pad CPD1 and the second connection pad CPD2 can be arranged in the same pad row PDR in the second direction D2.

[0056] In some embodiments, the plurality of connection pads disposed in the first connection pad region PA1 may be arranged in multiple rows. For example, the connection pads may be arranged in the first to third rows spaced apart from each other in the first direction D1. The connection pads may be arranged in the first to third rows in the second direction D2. The first connection pad CPD1 and the second connection pad CPD2 may be arranged in the pad row PDR in the second direction D2, wherein the pad row PDR is any one of the first to third rows.

[0057] The thickness of each of the first connection pads CPD1 can be the same as the thickness of each of the second connection pads CPD2. For example, the thickness of each of the first connection pads CPD1 in the third direction D3 (vertical direction) can be the same as the thickness of each of the second connection pads CPD2 in the third direction D3. The length of each of the first connection pads CPD1 in the first direction D1 can be the same as the length of each of the second connection pads CPD2 in the first direction D1. The width of each of the first connection pads CPD1 in the second direction D2 can be the same as the width of each of the second connection pads CPD2 in the second direction D2. The distance between the first connection pads CPD1 can be the same as the distance between the second connection pads CPD2. For example, the distance between adjacent first connection pads CPD1 can be the same as the distance between adjacent second connection pads CPD2.

[0058] The second connection pads CPD2 can be adjacent to each other. For example, the second connection pads CPD2 can be grouped together without any other pads or components between them. The number of second connection pads CPD2 can be two to four. However, the number of second connection pads CPD2 is not necessarily limited to this.

[0059] The connection board CB may also include connection lines CL. Connection lines CL may be disposed on the substrate BB. Connection lines CL can electrically connect each of the first connection pad CPD1 and the second connection pad CPD2 to the driver chip DIC (see...). Figure 1 The first connection pad CPD1 and the second connection pad CPD2 can transmit various drive signals to the driver chip DIC through the connection line CL.

[0060] The connection board CB may also include a plurality of display pads DPDs disposed on the second connection pad area PA2 of the substrate BB. Each of the display pads DPDs can be electrically connected to the driver chip DIC (see [link to DPD]). Figure 1 ), the first connection pad CPD1 and / or the second connection pad CPD2.

[0061] The display pads DPD on the connector board CB can be electrically connected to the display panel DP (see...). Figure 1 The display panel pads (DP) and the connection board (CB) can be connected to each other by placing an anisotropic conductive film between the display pads (DPD) and the panel pads. The motherboard (MB) can be made from the display device 10 (see...). Figure 1 The commands given to the display device 10 by the user are converted into various drive signals. These drive signals can be transmitted to the display panel DP via the connection board CB. The display device 10 can display the image desired by the user. For example, the display device 10 can display an image in response to a command given to it by the user.

[0062] The first connection pad CPD1 and the second connection pad CPD2 can be connected to the main pads of the motherboard MB to receive various drive signals. In the comparative example, each of the connection pads is connected to each of the main pads. However, as will be further described below, a one-to-one connection between the connection pads and the main pads may be disadvantageous for display panel design.

[0063] As display panel size and resolution increase, the number of connection pads required also increases. However, to accommodate the increased number of connection pads, the size of the connection board may also have to increase. Larger connection boards result in increased weight and production costs. Furthermore, the connection pads are arranged within a limited space.

[0064] Furthermore, during the manufacturing of the display panel, the connector board can be manufactured using a refined process, while the motherboard may not be manufactured using such a process due to factors such as production costs. A "refined" process can refer to a manufacturing process designed to produce smaller components, circuits, or pads with increased precision. Therefore, in the comparative example, when the main pads are connected one-to-one to the connector pads during manufacturing, contact failures may occur between the connector board and the motherboard. For example, a main pad transmitting the first signal of a drive signal might be connected to a first connector pad receiving the first signal, but it could also be simultaneously connected to a second connector pad receiving a second signal different from the first signal. Consequently, the display quality of the display device in the comparative example is degraded.

[0065] Figure 4 It is shown Figure 2 A floor plan of the motherboard MB.

[0066] refer to Figure 4 The motherboard (MB) may include multiple first main pads (MPD1) and second main pads (MPD2). The first main pads (MPD1) may be connected to the first connection pad (CPD1) (see...). Figure 3 A one-to-one connection. The second main pad MPD2 can be connected to multiple second connection pads CPD2 (see...). Figure 3 Many-to-one connection. For example, each of the first connection pads CPD1 can be connected one-to-one to each of the first master pads MPD1. For example, multiple second connection pads CPD2 can be connected to a second master pad MPD2 in a many-to-one connection. As used herein, the phrase "many-to-one connection" describes an arrangement in which, for example, multiple second connection pads are connected to a second master pad. The motherboard MB may include signal lines SL for transmitting various drive signals to the first master pads MPD1 and the second master pads MPD2.

[0067] The thickness of each of the first main pads MPD1 can be the same as the thickness of the second main pad MPD2. For example, the thickness of each of the first main pads MPD1 in a third direction D3 (e.g., the vertical direction) can be the same as the thickness of the second main pad MPD2 in a third direction D3. The length of each of the first main pads MPD1 in a first direction D1 can be the same as the length of the second main pad MPD2 in the first direction D1. The width of each of the first main pads MPD1 in a second direction D2 can be smaller than the width of the second main pad MPD2 in the second direction D2.

[0068] Motherboards (MBs) can include glass substrates, quartz substrates, or plastic substrates.

[0069] refer to Figure 3 and Figure 4Each of the first main pads MPD1 is shown to have the same size as each of the first connecting pads CPD1 on the D1-D2 plane, but is not necessarily limited to this. For example, if each of the first main pads MPD1 overlaps with each of the first connecting pads CPD1 on the D1-D2 plane and is connected one-to-one rather than many-to-one, then the size of each of the first main pads MPD1 may be sufficient. If a second main pad MPD2 overlaps with multiple second connecting pads CPD2 on the D1-D2 plane and is connected many-to-one, and does not overlap with the first connecting pads CPD1 on the D1-D2 plane, then the size of the second main pad MPD2 may be sufficient. The second main pad MPD2 may have a smaller size on the D1-D2 plane than shown. In this case, the distance between each of the first main pads MPD1 and the second main pad MPD2 can be increased. This can reduce the likelihood of contact between the first main pads MPD1 and the second main pads MPD2. Therefore, the display quality of the display device 10 can be improved.

[0070] Each of the first master pads MPD1 can transmit various drive signals to each of the first connection pads CPD1, which are connected one-to-one with each of the first master pads MPD1. The second master pad MPD2 can transmit various drive signals to a plurality of second connection pads CPD2 connected to the second master pad MPD2 in a many-to-one connection. Each of the second connection pads CPD2 can receive the same signal from the second master pad MPD2.

[0071] In this embodiment, the same signal can be a ground signal. When the same signal is a ground signal, the second connection pad CPD2 can include a VSS pad and a test pad. For example, the second connection pad CPD2 can include a VSS pad, a first test pad, a second test pad, and a third test pad.

[0072] In this embodiment, the same signal may be a contact resistance measurement signal. When the same signal is a contact resistance measurement signal, the second connection pad CPD2 may include a contact resistance measurement pad.

[0073] In this embodiment, the same signal may be a repair signal. When the same signal is a repair signal, the second connection pad CPD2 may include a repair pad.

[0074] In this embodiment, the same signal can be either a data signal or a gate signal. When the same signal is either a data signal or a gate signal, the second connection pad CPD2 can include either a data pad or a gate pad.

[0075] However, the same signal transmitted by the second master pad MPD2 is not necessarily limited to the signals mentioned above, and the same signal can be various signals. For example, the same signal can be a scan signal or a clock signal, etc.

[0076] The second connection pads CPD2 can be adjacent to each other. The second main pad MPD2 can have a simple shape. For example, the second main pad MPD2 can have a rectangular shape that overlaps with all the second connection pads CPD2 connected to it.

[0077] The connector board CB may include second connector pads CPD2 that are adjacent to each other and receive the same signals from the motherboard MB. The motherboard MB may include second master pads MPD2 that are connected to multiple second connector pads CPD2 in a many-to-one connection. Therefore, contact failures between the second master pads MPD2 and the first connector pads CPD1 can be reduced or prevented.

[0078] Figure 5 It is shown Figure 2 An enlarged view of an embodiment of the first connection pad region PA1.

[0079] refer to Figure 5 The connector board CB may also include a third connector pad CPD3 disposed on the first connector pad area PA1 of the substrate BB. The motherboard MB may also include a third master pad MPD3 connected to a plurality of third connector pads CPD3 in a many-to-one connection; for example, there may be more than one third connector pad CPD3 connected to a third master pad MPD3.

[0080] Multiple third connection pads (CPD3) can be arranged in a pad row (PDR) in which first connection pads (CPD1) and second connection pads (CPD2) are arranged in a second direction (D2). Each of the first connection pads (CPD1), second connection pads (CPD2), and third connection pads (CPD3) can be arranged in the second direction (D2) with a predetermined width and a predetermined interval. For example, each of the first connection pads (CPD1), second connection pads (CPD2), and third connection pads (CPD3) can be arranged in the second direction (D2) with a predetermined spacing.

[0081] The thickness of each of the third connection pads CPD3 can be the same as the thickness of each of the first connection pads CPD1 and the second connection pads CPD2. For example, the thickness of each of the third connection pads CPD3 in the third direction D3 (e.g., the vertical direction) can be the same as the thickness of each of the first connection pads CPD1 and the second connection pads CPD2 in the third direction D3. The length of each of the third connection pads CPD3 in the first direction D1 can be the same as the length of each of the first connection pads CPD1 and the second connection pads CPD2 in the first direction D1. The width of each of the third connection pads CPD3 in the second direction D2 can be the same as the width of each of the first connection pads CPD1 and the second connection pads CPD2 in the second direction D2. The distance between the third connection pads CPD3 in the second direction D2 can be the same as the distance between the first connection pads CPD1 in the second direction D2 and the distance between the second connection pads CPD2 in the second direction D2. For example, the third connection pad CPD3 can be spaced apart by the same distance as each of the first connection pad CPD1 and the second connection pad CPD2. Each of the first connection pad CPD1, the second connection pad CPD2 and the third connection pad CPD3 can have substantially the same size and shape.

[0082] The first connection pads CPD1 can be positioned adjacent to each other, or they can be spaced apart. For example, other pads can be located between some of the first connection pads CPD1 in the pad row PDR. The second connection pads CPD2 can be adjacent to each other.

[0083] The third connection pad CPD3 can be adjacent to each other.

[0084] The number of second connection pads CPD2 can be two to four, and the number of third connection pads CPD3 can be two to four. However, the number of second connection pads CPD2 and third connection pads CPD3 is not necessarily limited.

[0085] In an embodiment, the second connection pad CPD2 may include (2-1) connection pad CPD21, (2-2) connection pad CPD22, (2-3) connection pad CPD23, and (2-4) connection pad CPD24. The third connection pad CPD3 may include (3-1) connection pad CPD31, (3-2) connection pad CPD32, and (3-3) connection pad CPD33.

[0086] The motherboard (MB) may include a first main pad (MPD1), a second main pad (MPD2), and a third main pad (MPD3). The first main pad (MPD1) can be connected one-to-one to a first connection pad (CPD1). The second main pad (MPD2) can be connected to multiple second connection pads (CPD2) in a many-to-one connection. The third main pad (MPD3) can be connected to multiple third connection pads (CPD3) in a many-to-one connection. The first main pad (MPD1) can receive various drive signals via a first signal line (SL1). The second main pad (MPD2) can receive the first signal among the drive signals via a second signal line (SL2). The third main pad (MPD3) can receive the second signal among the drive signals via a third signal line (SL3).

[0087] The length of each of the first main pads MPD1 in the first direction D1 can be the same as the length of the second main pad MPD2 and the third main pad MPD3 in the first direction D1. The thickness of each of the first main pads MPD1 in the third direction D3 can be the same as the thickness of the second main pad MPD2 and the third main pad MPD3 in the third direction D3. However, the width of each of the first main pads MPD1 in the second direction D2 can be smaller than the width of the second main pad MPD2 and the width of the third main pad MPD3 in the second direction D2.

[0088] For ease of description, the first main pad MPD1 is shown as being larger than the first connection pad CPD1. The second main pad MPD2 is shown as being larger than the second connection pad CPD2. The third main pad MPD3 is shown as being larger than the third connection pad CPD3. However, this disclosure is not necessarily limited thereto.

[0089] In the example embodiment, the first main pad MPD1 may overlap with the first connection pad CPD1, but may not overlap with the second main pad MPD2 and the third main pad MPD3. The second main pad MPD2 may overlap with the second connection pad CPD2, but may not overlap with the first main pad MPD1 and the third main pad MPD3. The third main pad MPD3 may overlap with the third connection pad CPD3, but may not overlap with the first main pad MPD1 and the second main pad MPD2.

[0090] As used herein, the phrase "many-to-one connection" describes an arrangement in which, for example, multiple second connection pads are connected to a second master pad. In example operation of display device 10, each of the second connection pads CPD2 can receive the same first signal from the second master pad MPD2. Each of the third connection pads CPD3 can receive the same second signal from the third master pad MPD3. Since many (e.g., more than one) of the second connection pads CPD2 receive the same first signal from the second master pad MPD2, the second master pad MPD2 can have many-to-one connections with the multiple second connection pads CPD2. Since many (e.g., more than one) of the third connection pads CPD3 receive the same second signal from the third master pad MPD3, the third master pad MPD3 can have many-to-one connections with the multiple third connection pads CPD3. The first signal and the second signal can be different, or the first signal and the second signal can be the same. For example, for multiple second connection pads CPD2, receiving the same signal from the second master pad MPD2 may be sufficient. For multiple third connection pads CPD3, receiving the same signal from the third master pad MPD3 may be sufficient. For example, each of the second connection pads CPD2 or each of the third connection pads CPD3 may not require a different signal at a given time; therefore, receiving the same signal from the second master pad MPD2 for multiple second connection pads CPD2 and / or receiving the same signal from the third master pad MPD3 for multiple third connection pads CPD3 may be sufficient.

[0091] In this embodiment, the first signal and the second signal can be ground signals. When the first signal and the second signal are ground signals, the second connection pad CPD2 and the third connection pad CPD3 can include a VSS pad and a test pad. For example, the second connection pad CPD2 and the third connection pad CPD3 can be a VSS pad, a first test pad, a second test pad, and a third test pad.

[0092] In this embodiment, the first signal and the second signal can be contact resistance measurement signals. When the first signal and the second signal are contact resistance measurement signals, the second connection pad CPD2 and the third connection pad CPD3 can include contact resistance measurement pads.

[0093] In this embodiment, the first signal and the second signal can be repair signals. When the first signal and the second signal are repair signals, the second connection pad CPD2 and the third connection pad CPD3 can include repair pads.

[0094] In this embodiment, the first signal and the second signal can be data signals or gate signals. When the first signal and the second signal are data signals or gate signals, the second connection pad CPD2 and the third connection pad CPD3 can be data pads or gate pads.

[0095] However, the first and second signals are not necessarily limited to the signals mentioned above, and can be various signals. For example, the first and second signals can be scan signals or clock signals, etc.

[0096] Each of the first master pads MPD1 can receive various drive signals via the first signal line SL1. The first connection line CL1 can transmit various drive signals to the display pad DPD (see [link to display pad]) via each of the first connection pads CPD1 connected to the respective first master pads MPD1. Figure 3 ).

[0097] The second master pad MPD2 can receive the first signal via the second signal line SL2. The second master pad MPD2 can transmit the first signal to the second connection pad CPD2. Each of the connection lines CL21 (2-1), CL22 (2-2), CL23 (2-3), and CL24 (2-4) can transmit the first signal to the display pad DPD (see [reference]) via each of the second connection pads CPD2 connected to the second master pad MPD2 (e.g., connection pads CPD21 (2-1), CPD22 (2-2), CPD23 (2-3), and CPD24 (2-4)). Figure 3 ).

[0098] The third master pad MPD3 can receive the second signal via the third signal line SL3. The third master pad MPD3 can transmit the second signal to the third connection pad CPD3. Each of the connection lines CL31 (3-1), CL32 (3-2), and CL33 (3-3) can transmit the second signal to the display pad DPD (see [reference]) via each of the third connection pads CPD3 connected to the third master pad MPD3 (e.g., connection pads CPD31 (3-1), CPD32 (3-2), and CPD33 (3-3)). Figure 3 ).

[0099] At least one of the first main pads MPD1 can be located between the second main pad MPD2 and the third main pad MPD3. For example, the second main pad MPD2 and the third main pad MPD3 may not be located adjacent to each other in the second direction D2.

[0100] First connection pad CPD1, second connection pad CPD2, and third connection pad CPD3 can receive various drive signals. Second connection pad CPD2 can receive the same first signal, and third connection pad CPD3 can receive the same second signal. Second connection pads CPD2 receiving the first signal can be adjacent to each other, and third connection pads CPD3 receiving the second signal can be adjacent to each other. Second main pad MPD2 can be connected in a many-to-one relationship to multiple second connection pads CPD2 receiving the first signal, and third main pad MPD3 can be connected in a many-to-one relationship to multiple third connection pads CPD3 receiving the second signal.

[0101] Therefore, compared to a comparative example where there is a one-to-one connection between the connection pads and the main pads, contact failures between the connection pads and the main pads can be reduced or prevented. For example, a motherboard not manufactured according to a fine process may include main pads corresponding to the connection pads of a connection board that has been manufactured using a fine process. For example, even if the motherboard is not manufactured according to a fine process, the many-to-one connection between the connection pads and the main pads according to embodiments of this disclosure can prevent or reduce contact failures between the motherboard and the connection board. Therefore, the display quality of the display device can be improved.

[0102] Figure 6 It is shown Figure 2 An enlarged view of an embodiment of the first connection pad region PA1. The same reference numerals are used with respect to... Figure 5 The components shown are the same as those described elsewhere in the specification, and to the extent that descriptions of the components have been omitted, it can be understood that the component is at least similar to the corresponding component described elsewhere in the specification.

[0103] refer to Figure 6 The second main pad MPD2 and the third main pad MPD3 can be positioned adjacent to each other in the second direction D2. In this example, the first main pad MPD1 is not positioned between the second main pad MPD2 and the third main pad MPD3.

[0104] The second main pad MPD2 can receive the first signal via the second signal line SL2. The third main pad MPD3 can receive a second signal, different from the first signal, via the third signal line SL3. Even if the second main pad MPD2 and the third main pad MPD3 are set to be adjacent to each other, the second main pad MPD2 and the third main pad MPD3 may not form a single main pad. In the example, when the first signal and the second signal are the same signal, ... Figure 6 It's different; it can form a single master pad that connects to both the second connection pad CPD2 and the third connection pad CPD3.

[0105] Figure 7 It is shown Figure 2An enlarged view of an embodiment of the first connection pad area.

[0106] refer to Figure 7 The first connection pad CPD1 can be arranged in a second direction D2 perpendicular to the first direction D1 to define a pad row PDR. The second connection pad CPD2 and the third connection pad CPD3 can be arranged in the same pad row PDR in the first direction D1. For example, the second connection pad CPD2 and the third connection pad CPD3 may not be arranged in the first to third rows arranged in the first direction D1. Alternatively, the second connection pad CPD2 and the third connection pad CPD3 can be arranged in the pad row PDR in the first direction D1, where the pad row PDR is any one of the first to third rows.

[0107] In an embodiment, the second connection pad CPD2 may include (2-1) connection pad CPD21, (2-2) connection pad CPD22, and (2-3) connection pad CPD23. The third connection pad CPD3 may include (3-1) connection pad CPD31, (3-2) connection pad CPD32, (3-3) connection pad CPD33, and (3-4) connection pad CPD34.

[0108] Since the second connection pad CPD2 can receive the same first signal from the second main pad MPD2, the second main pad MPD2 can be electrically connected to a second signal line SL2. Since the third connection pad CPD3 can receive the same second signal from the third main pad MPD3, the third main pad MPD3 can be electrically connected to a third signal line SL3.

[0109] (2-1) Connecting pad CPD21, (2-2) Connecting pad CPD22, and (2-3) Connecting pad CPD23 can each be electrically connected to other display pads DPD (see...). Figure 3 (2-1) Connecting pad CPD21 can be connected to connecting line CL21 (2-1), connecting pad CPD22 can be connected to connecting line CL22 (2-2), and connecting pad CPD23 can be connected to connecting line CL23 (2-3). (3-1) Connecting pad CPD31, (3-2) Connecting pad CPD32, (3-3) Connecting pad CPD33, and (3-4) Connecting pad CPD34 can each be electrically connected to other display pads DPD. (3-1) Connecting pad CPD31 can be connected to connecting line CL31 (3-1), connecting pad CPD32 can be connected to connecting line CL32 (3-2), connecting pad CPD33 can be connected to connecting line CL33 (3-3), and connecting pad CPD34 can be connected to connecting line CL34 (3-4).

[0110] To prevent the connection lines CL from contacting each other, each of the second connection pads CPD2 can have a different size, and each of the third connection pads CPD3 can have a different size.

[0111] (2-1) The lengths of connection pad CPD21, (2-2) the lengths of connection pad CPD22, and (2-3) the lengths of connection pad CPD23 can each be different. (2-1) The widths of connection pad CPD21, (2-2) the widths of connection pad CPD22, and (2-3) the widths of connection pad CPD23 can each be different. (3-1) The lengths of connection pad CPD31, (3-2) the lengths of connection pad CPD32, (3-3) the lengths of connection pad CPD33, and (3-4) the lengths of connection pad CPD34 can each be different. (3-1) The widths of connection pad CPD31, (3-2) the widths of connection pad CPD32, (3-3) the widths of connection pad CPD33, and (3-4) the widths of connection pad CPD34 can each be different.

[0112] Since the second connection pad CPD2 and the third connection pad CPD3 are arranged in the first direction D1 in the pad row PDR, the connection board CB can be increased (see...). Figures 1 to 4 Space utilization is improved. Since the second connection pad CPD2 and the third connection pad CPD3 are arranged in the first direction D1 in the pad row PDR within a limited space, sufficient distance between the first connection pads CPD1 can be ensured. For example, the distance between each of the first connection pads CPD1 and the second connection pad CPD2, as well as the distance between each of the first connection pads CPD1 and the third connection pad CPD3, can be sufficiently ensured.

[0113] In embodiments of this disclosure, it is sufficient for the second main pad MPD2 and the third main pad MPD3 to be connected to the second connection pad CPD2 and the third connection pad CPD3 with many-to-one connections and not connected to the first connection pad CPD1. The second connection pad CPD2 and the third connection pad CPD3 are arranged in the pad row PDR in the first direction D1, ensuring sufficient distance between the first main pad MPD1, the second main pad MPD2, and the third main pad MPD3. This can reduce or prevent contact failures between the first main pad MPD1, the second main pad MPD2, and the third main pad MPD3.

[0114] Although certain embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not necessarily limited to such embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A circuit board assembly, wherein, The circuit board assembly includes a motherboard and a connection board attached to the motherboard, wherein the connection board includes: A substrate includes a connection pad region and a mounting region, wherein the connection plate is attached to the motherboard in the connection pad region, and wherein the mounting region is spaced apart from the connection pad region in a first direction; The driver chip is mounted on the mounting area; A first connection pad is disposed on the connection pad area of ​​the substrate; and Multiple second connection pads are disposed on the connection pad area of ​​the substrate, and The motherboard includes: The first main pad is connected to the first connection pad in a one-to-one connection manner; and The second primary pad is connected to multiple second connection pads in a many-to-one connection manner.

2. The circuit board assembly according to claim 1, wherein, Multiple second connection pads are configured to be adjacent to each other.

3. The circuit board assembly according to claim 1, wherein, The number of the second connection pads is two to four.

4. The circuit board assembly according to claim 1, wherein, Each of the plurality of second connection pads receives the same signal from the second main pad.

5. The circuit board assembly according to claim 4, wherein, The signal is a ground signal.

6. The circuit board assembly according to claim 5, wherein, The second connection pad includes a VSS pad and a test pad.

7. The circuit board assembly according to claim 4, wherein, The signal is a contact resistance measurement signal.

8. The circuit board assembly according to claim 4, wherein, The signal is a repair signal.

9. The circuit board assembly according to claim 4, wherein, The signal is a data signal or a gate signal.

10. The circuit board assembly according to claim 1, wherein, The connection plate further includes a plurality of third connection pads disposed on the connection pad area of ​​the substrate, and The motherboard also includes a third main pad that is connected to a plurality of the third connection pads in a many-to-one connection manner.

11. The circuit board assembly of claim 10, wherein, The second main pad and the third main pad are configured to be adjacent to each other in a second direction perpendicular to the first direction.

12. The circuit board assembly of claim 10, wherein, At least one of the first main pads is disposed between the second main pad and the third main pad.

13. The circuit board assembly according to claim 1, wherein, The length of each of the first master pads in the first direction is the same as the length of the second master pad in the first direction.

14. The circuit board assembly according to claim 1, wherein, The thickness of each of the first master pads in the vertical direction is the same as the thickness of the second master pad in the vertical direction.

15. The circuit board assembly according to claim 1, wherein, The connection board further includes connection lines disposed on the substrate, wherein the connection lines electrically connect each of the first connection pad and the second connection pad to the driver chip.

16. The circuit board assembly according to claim 1, wherein, The first connection pad is arranged in a second direction perpendicular to the first direction to define the pad row.

17. The circuit board assembly of claim 16, wherein, Multiple second connection pads are arranged in the pad row in the first direction.

18. A display device, wherein, The display device includes a display panel, a motherboard, and a connection board attached to the display panel and the motherboard. The connecting plate includes: The substrate includes a first connection pad area, a second connection pad area, and a mounting area, wherein the connection plate is attached to the motherboard in the first connection pad area, the connection plate is attached to the display panel in the second connection pad area, and the mounting area is disposed between the first connection pad area and the second connection pad area. The driver chip is mounted on the mounting area. A first connection pad is disposed on the first connection pad area of ​​the substrate; and Multiple second connection pads are disposed on the first connection pad area of ​​the substrate, and The motherboard includes: The first main pad is connected to the first connection pad in a one-to-one connection manner; and The second primary pad is connected to multiple second connection pads in a many-to-one connection manner.

19. The display device according to claim 18, wherein, Multiple second connection pads are configured to be adjacent to each other.

20. The display device according to claim 18, wherein, The second connection pad receives the same signal from the second main pad.

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